Resin encapsulation device

Abstract

To achieve a resin sealing apparatus that can prevent deterioration of flatness of a mold fixing face at the time of mold closing and that can perform weight reduction, in a stationary platen of a pressing apparatus.SOLUTION: A resin sealing apparatus 1 according to the present invention is provided with a pressing apparatus 250 for performing mold closing and mold opening of an upper mold 204 and a lower mold 206. The pressing apparatus 250 has: a stationary platen 252 to which one of the upper mold 204 and the lower mold 206 is fixed and a movable platen 254 to which another one is fixed; tie bars 256 for fixing the stationary platen 252 and liftably / lowerably holding the movable platen 254; and a drive apparatus lifting / lowering the movable platen 254. The stationary platen 252 is provided with fixing portions 272 to which the tie bars 256 are fixed, on a first face 270a side of a main body part 270, and a bell-shaped part 280 is provided on a second face 270b side opposite to the first face 270a. One of the upper mold 204 and the lower mold 206 is configured to be fixed to the bell-shaped part 280.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a resin sealing device.

Background Art

[0002] As an example of a resin sealing device for sealing a work in which an electronic component is mounted on a base material with a sealing resin (hereinafter, may be simply referred to as "resin") and processing it into a molded product, those using a transfer molding method or a compression molding method are known.

[0003] The transfer molding method is a technique in which a pot for supplying a predetermined amount of resin is provided in two upper and lower sealing regions (cavities) provided in a sealing mold including an upper mold and a lower mold, and workpieces are respectively arranged at positions corresponding to the respective sealing regions, and then clamped by the upper mold and the lower mold and the resin is poured from the pot into the cavity for resin sealing. Further, the compression molding method is a technique in which a predetermined amount of resin is supplied to a sealing region (cavity) provided in a sealing mold including an upper mold and a lower mold, and a workpiece is arranged in the sealing region, and then clamped by the upper mold and the lower mold for resin sealing. As an example, when using a sealing mold provided with a cavity in the upper mold, a technique of supplying resin collectively to the central position on the workpiece and molding is known. On the other hand, when using a sealing mold provided with a cavity in the lower mold, a technique of supplying a film covering the mold surface including the cavity and resin for molding is known.

[0004] In any method, a press device exemplified in Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2008-093987), that is, a mechanism for performing mold closing (mold clamping) of a sealing mold (upper mold and lower mold) to perform resin sealing of a workpiece is provided.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

[0006] In this configuration, the sealing die is typically fixed to a pair of movable and fixed platens, and a mold closing force (pressure) is applied to the sealing die by a drive device that drives (pushes) the movable platen toward the fixed platen. However, because an extremely large force is applied as the pressure, deformation occurs in the fixed platen, and in particular, the flatness of the mold fixing surface to which the sealing die (upper or lower die) is fixed decreases (deteriorates), which has been a problem. That is, when the flatness of the mold fixing surface decreases (deteriorates), deformation (bending) occurs in the sealing die to which it is fixed, causing molding defects (specifically, a state in which the dimensions and shape of the molded product do not match the design), and a solution to this problem has been requested (see Patent Document 2: Japanese Patent Application Publication No. 2004-042356, Patent Document 3: Japanese Patent Application Publication No. 2009-148933, etc.).

[0007] In order to solve the above problems, the inventors of this invention have diligently conducted research and first devised a configuration (comparative example) for the fixed platen of a press device that ensures rigidity by increasing the wall thickness, particularly at the radial center position (i.e., the thickness dimension in the mold closing direction (vertical direction)), in proportion to the improvement of the mold closing force (clamping force), i.e., the pressing force applied to the sealing die, thereby suppressing deformation of the mold fixing surface (not shown). However, with the recent increase in the size of products (molded products by resin encapsulation) and the increase in devices (products incorporating molded products) that require improved fillability, there is a growing demand for devices that can apply even greater mold closing force (clamping force). As a result, another problem has arisen: the fixed platen has become extremely thick and heavy. Thus, preventing deformation of the mold fixing surface of the fixed platen and reducing the weight of the fixed platen itself were conflicting challenges. [Means for solving the problem]

[0008] The present invention has been made in view of the above circumstances, and aims to realize a resin sealing device that can prevent a decrease in the flatness of the mold fixing surface when the mold is closed, and can also reduce the weight of the press device's fixed platen.

[0009] The present invention solves the above problem by a solution described below as one embodiment.

[0010] The resin sealing apparatus according to the present invention is a resin sealing apparatus that processes a workpiece into a molded product by sealing it with resin using a sealing mold comprising an upper mold and a lower mold, and comprises a press device for closing and opening the upper mold and the lower mold, the press device comprising a fixed platen to which one of the upper mold and the lower mold is fixed and a movable platen to which the other is fixed, a tie bar that fixes the fixed platen and holds the movable platen so that it can be raised and lowered, and a drive device for raising and lowering the movable platen, the fixed platen has a fixing portion on the first surface side of the main body that is fixed to the tie bar, and a bell-shaped portion on the second surface side opposite to the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion. Furthermore, the main body and the bell-shaped portion are integrally formed by casting, and a central hole is provided at the radial center position, drilled in the direction from the first surface toward the second surface, the central hole is formed so as not to penetrate to the mold fixing surface of the bell-shaped portion, and there is one opening corresponding to the central hole. This is a requirement.

[0011] According to this, with respect to the fixed platen that constitutes the press device, it is possible to prevent a decrease in the flatness of the mold fixing surface when a mold closing force is applied, and to simultaneously achieve miniaturization and weight reduction. For example, compared to the comparative example mentioned above, it is possible to reduce the amount of deformation (amount of deflection relative to the flat surface) to less than half, reduce the vertical dimension by about 50%, and reduce the weight by about 30%.

[0012] Furthermore, it is preferable that a circumferential recess is provided between the main body and the bell-shaped portion, drilled toward the radial center. This provides the effect of maintaining a balance between the amount of deformation near the radial center of the bell-shaped portion and the amount of deformation near the radial outer circumference, that is, preventing a difference in the amount of deformation. Therefore, it is possible to obtain the effect of keeping the mold fixing surface flat (i.e., the effect of not reducing (deteriorating) the flatness of the mold fixing surface).

[0013] Furthermore, it is preferable that the recessed portion is formed such that, in both the left-right and front-back directions, the innermost part in the radial direction is located closer to the radial center than the outer circumference of either the upper or lower mold. This further enhances the effect of keeping the mold fixing surface flat (i.e., the effect of not reducing (deteriorating) the flatness of the mold fixing surface).

[0014] Furthermore, the fixing portion is provided at the tip of the arm portion that extends radially from the four corners of the main body portion, and it is preferable that the arm portion is configured as a deflection generating portion that generates a relatively larger deflection than other parts by concentrating stress when the mold is closed. With this configuration, when the mold closing force is applied, the arm portion is actively deformed (bent), thereby preventing deformation of the bell-shaped portion, in particular the mold fixing surface. This makes it possible to suppress deformation of the mold fixing surface without using the conventional rigidity improvement method of increasing the wall thickness at the radial center position of the fixed platen.

[0015] Also ,before Preferably, the central hole is formed such that its inner diameter decreases in a stepped or tapered manner in the direction from the first surface to the second surface. This allows the mold closing force acting on the bell-shaped portion through one of the fixed molds to be directed toward the arm portion, that is, stress to be concentrated toward the arm portion. Furthermore, the weight of the fixed platen can be reduced. In addition, integral formation by casting becomes possible, which can improve production efficiency and reduce production costs.

[0016] Also ,child According to this, the effect of keeping the mold fixing surface flat, that is, the effect of not reducing (deteriorating) the flatness of the mold fixing surface can be further enhanced.

Advantages of the Invention

[0017] According to the present invention, it becomes possible to solve the conflicting problems of preventing deformation of the mold fixing surface of the fixed platen and reducing the unit weight of the fixed platen.

Brief Description of the Drawings

[0018] [Figure 1] It is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. [Figure 2] It is a front sectional view showing an example of a press device of the resin sealing device of FIG. 1. [Figure 3] It is a front sectional view showing an example of a sealing mold of the resin sealing device of FIG. 1. [Figure 4] It is a perspective view showing an example of a fixed platen of the resin sealing device of FIG. 1. [Figure 5] It is a plan view showing an example of the fixed platen of FIG. 4. [Figure 6] It is a front view showing an example of the fixed platen of FIG. 4. [Figure 7] It is a sectional view taken along line VII-VII in FIG. 4.

Modes for Carrying Out the Invention

[0019] <00​​​​​​The resin sealing apparatus 1 according to this embodiment is a device that resin-seals a workpiece (molded product) W using a sealing mold 202 comprising an upper mold 204 and a lower mold 206. Hereinafter, as the resin sealing apparatus 1, a compression molding apparatus will be described as an example in which the workpiece W is held by the lower mold 206, the cavity 208 (including a part of the mold surface) provided in the upper mold 204 is covered with a release film (hereinafter sometimes simply referred to as "film") F, and a clamping operation is performed between the upper mold 204 and the lower mold 206 to resin-seal the workpiece W with resin. However, it is not limited to this.

[0021] First, the workpiece W to be molded has a configuration in which multiple electronic components Wb are mounted in a matrix on a base material Wa. More specifically, examples of the base material Wa include plate-shaped members such as rectangular or circular resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, and spacers. However, it is not limited to these.

[0022] Examples of methods for mounting electronic components Wb onto a substrate Wa include wire bonding and flip-chip mounting. Alternatively, in configurations where the substrate (glass or metal carrier plate) Wa is peeled off the molded product Wp after resin encapsulation, the electronic components Wb can be attached using heat-release adhesive tape or UV-curable resin that hardens upon UV irradiation.

[0023] On the other hand, an example of a resin is a liquid thermosetting resin (for example, an epoxy resin containing a filler). However, the resin is not limited to the above state, and may be in other states (shapes) such as granular (used as a general term for granular, crushed, powdered, etc.), plate-like, or sheet-like, and may be a resin other than an epoxy thermosetting resin.

[0024] Furthermore, suitable examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride. In this embodiment, a roll-shaped film is used as film F. As another example, a configuration using strip-shaped film may also be used (not shown).

[0025] Next, an overview of the resin encapsulation apparatus 1 according to this embodiment will be described. As shown in Figure 1, the resin encapsulation apparatus 1 mainly comprises a transport unit 100A that primarily transports the workpiece W and the molded product Wp, a workpiece supply unit 100B that primarily supplies the workpiece W, a resin supply unit 100C that primarily supplies the resin, a press unit 100D that primarily processes the workpiece W into a molded product Wp by resin encapsulation, a post-cure unit 100E that primarily performs post-curing of the molded product Wp after resin encapsulation, a molded product storage unit 100F that primarily stores the molded product Wp after post-curing, and a control unit 100G that primarily controls each mechanism and each process.

[0026] In this embodiment, the transport unit 100A is positioned in the center of the apparatus, and each unit is arranged to surround the transport unit 100A. Specifically, the work supply unit 100B, resin supply unit 100C, and molded product storage unit 100F are positioned in front of the transport unit 100A. The press unit 100D is positioned behind the transport unit 100A. The post-cure unit 100E is positioned to the right and front right of the transport unit 100A. The control unit 100G is positioned to the rear right of the transport unit 100A. However, the configuration is not limited to this.

[0027] Furthermore, the resin encapsulation device 1 can be modified by changing the configuration of its units. For example, the configuration shown in Figure 1 is an example where two press units 100D are arranged, but it is also possible to arrange only one press unit 100D, or three or more press units 100D, etc. It is also possible to arrange other units in addition (none of which are shown).

[0028] (Transport unit) First, let's describe the transport unit 100A provided by the resin encapsulation device 1.

[0029] The transport unit 100A is equipped with a transport device 102 for transporting workpieces W and molded products Wp. For example, the transport device 102 is configured to include a guide rail 104, a base portion 106 that reciprocates along the guide rail 104 in a predetermined direction (for example, left and right), and a holding and moving mechanism 108 (for example, a multi-joint robot) fixed to the base portion 106 for holding and moving workpieces W and molded products Wp. This allows for the holding of workpieces W and molded products Wp, transport between units, and loading and unloading into and from each mechanism.

[0030] (Work supply unit) Next, we will describe the workpiece supply unit 100B provided by the resin encapsulation device 1.

[0031] The work supply unit 100B is equipped with a work stocker 110 used for storing workpieces W. For example, the work stocker 110 may be a known stack magazine, slit magazine, etc., and is capable of storing multiple workpieces W at once. These multiple workpieces W are then dispensed one by one by a holding and moving mechanism 108.

[0032] (Resin supply unit) Next, the resin supply unit 100C provided in the resin encapsulation device 1 will be described. In this resin supply unit 100C, resin is supplied (placed) onto the workpiece W that has been transported from the workpiece supply unit 100B by the transport device 102.

[0033] The resin supply unit 100C comprises a pair of dispensers 312 that dispense and supply resin (in this case, liquid resin) from a syringe 314 onto a workpiece W, and a revolver-type syringe supply unit 316 that rotatably holds a plurality of replacement syringes 314 between the pair of dispensers 312. Each dispenser 312 is configured to dispense resin while receiving replacement syringes 314 sequentially from the shared syringe supply unit 316.

[0034] (Press Unit) Next, the press unit 100D of the resin sealing device 1 will be described. In this press unit 100D, resin sealing is performed on the workpiece W (with resin placed on it) that has been transported from the resin supply unit 100C by the transport device 102.

[0035] The press unit 100D includes a sealing die 202 having a pair of dies that open and close (for example, a set of multiple die blocks, die plates, die pillars, and other components made of alloy tool steel). It also includes a press device 250 that drives the sealing die 202 to open and close to seal the workpiece W with resin. Furthermore, it includes a transport loader 210 for loading and unloading the workpiece W and molded product Wp to and from the sealing die 202 (however, the transport loader 210 may be omitted, and loading and unloading may be performed directly by the aforementioned holding and moving mechanism 108).

[0036] Here, as shown in Figure 2, the press device 250 is configured to include a pair of platens 252 and 254, a plurality of tie bars 256 on which the pair of platens 252 and 254 are mounted, and a drive device for moving (raising and lowering) the platen 254. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, it is not limited to this). In this embodiment, the upper platen 252 in the vertical direction is set as a fixed platen (a platen fixed to the tie bar 256), and the lower platen 254 is set as a movable platen (a platen that is slidably held by the tie bar 256 and moves up and down). However, it is not limited to this, and the top and bottom may be reversed, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (none of which are shown).

[0037] On the other hand, the sealing die 202 is a pair of dies disposed between the pair of platens 252 and 254 in the press device 250, and comprises one die on the upper side in the vertical direction (upper die 204) and the other die on the lower side (lower die 206). The upper die 204 and lower die 206 move closer to and further apart from each other to close and open the dies (i.e., the vertical direction (up and down direction) is the direction of die opening and closing). In this embodiment, the upper die 204 is assembled to the upper platen (in this case, the fixed platen 252), and the lower die 206 is assembled to the lower platen (in this case, the movable platen 254).

[0038] Furthermore, in this embodiment, as an example, a film supply mechanism 214 is provided for transporting (supplying) a roll-shaped film F into the sealing mold 202.

[0039] Next, the upper mold 204 of the sealing mold 202 will be described. As shown in Figure 3, the upper mold 204 is composed of an upper plate 222, a cavity piece 226, a clamper 228, etc., which are assembled together. In this embodiment, a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).

[0040] More specifically, the cavity piece 226 is fixedly assembled to the lower surface of the upper plate 222. On the other hand, the clamper 228 is configured in an annular shape to surround the cavity piece 226 and is assembled via a biasing member 232 so as to be able to move up and down while floating apart from the lower surface of the upper plate 222. The cavity piece 226 constitutes the back (bottom) of the cavity 208, and the clamper 228 constitutes the side of the cavity 208. In this embodiment, one cavity 208 is provided in one upper mold 204. However, the configuration is not limited to this, and multiple cavities may be arranged side by side in the left-right direction (or front-back direction).

[0041] Furthermore, in this embodiment, an upper mold heating mechanism (for example, an electric heating element heater) is provided to heat the upper mold 204 to a predetermined temperature (for example, 100°C to 200°C).

[0042] Next, the lower mold 206 of the sealing mold 202 will be described. As shown in Figure 3, the lower mold 206 is composed of a lower plate 224, a retaining plate 236, etc., which are assembled together. Here, the retaining plate 236 is fixedly assembled to the upper surface of the lower plate 224 (the surface on the upper mold 204 side).

[0043] Furthermore, in this embodiment, a workpiece holding portion 205 is provided to hold the workpiece W at a predetermined position on the lower surface of the holding plate 236. This workpiece holding portion 205 is, for example, connected to a suction device (not shown) via a suction passage 240a that penetrates the holding plate 236 and the lower plate 224. Alternatively, in addition to the configuration with the suction passage 240a, a configuration may be provided with holding claws that grip the outer circumference of the workpiece W (not shown).

[0044] In this embodiment, corresponding to the configuration of the upper mold 204 described above (a configuration in which one cavity 208 is provided), one workpiece holding section 205 is provided in one lower mold 206, and the workpieces W are resin-sealed one by one. However, the embodiment is not limited to this.

[0045] Furthermore, in this embodiment, a lower mold heating mechanism (for example, an electric heating element) is provided to heat the lower mold 206 to a predetermined temperature (for example, 100°C to 200°C).

[0046] Next, the fixed platen 252 of the press device 250, which is characteristic of this embodiment, will be described in detail. Here, Figure 2 shows a front cross-sectional view (schematic diagram) of the press device 250 of the resin sealing device 1. Also, Figure 3 shows a front cross-sectional view (schematic diagram) of the sealing mold 202 of the resin sealing device 1. Here, a perspective view (schematic diagram) of the fixed platen 252 is shown in Figure 4, a plan view is shown in Figure 5, and a front view is shown in Figure 6. Figure 7 is a cross-sectional view taken along line VII-VII in Figure 4.

[0047] The fixed platen 252 according to this embodiment is composed of a main body portion 270 and a bell-shaped portion 280 (as described later, in this embodiment they are formed integrally). As an example, a fixing portion 272 is provided on the first surface 270a side of the main body portion 270, which is fixed to the tie bar 256. In addition, the bell-shaped portion 280 is provided on the second surface 270b side, which is opposite to the first surface 270a in the vertical direction, and one of the molds of the upper mold 204 and the lower mold 206 (in this embodiment, the upper mold 204) is fixed to the bell-shaped portion 280.

[0048] Here, the bell-shaped portion 280 is formed in a shape that widens towards the end as it moves away from the main body portion 270 (i.e., along the direction from the first surface 270a to the second surface 270b) (a shape in which the outer diameter gradually increases), and the surface of the main body portion 270 that is facing the opposite direction in the vertical direction to the first surface 270a becomes the mold fixing surface 280a. This configuration with the bell-shaped portion 280 has the effect of preventing a decrease in the flatness of the mold fixing surface 280a when the mold is closed (i.e., when pressure is applied).

[0049] More specifically, the fixing portion 272 is provided at the tip of the arm portions 274 that extend radially from the four corners of the main body portion 270. The arm portions 274 are configured as "flexure generating portions" that generate a relatively larger deflection than other parts by concentrating stress when the mold is closed. As a result, when the mold closing force is applied, the arm portions 274 are actively deformed (bent), making it possible to prevent deformation of the bell-shaped portion 280, in particular the mold fixing surface 280a. Therefore, it is possible to suppress deformation of the mold fixing surface 280a without using the conventional rigidity improvement method of increasing the wall thickness at the radial center position of the fixed platen 252.

[0050] Furthermore, the fixed platen 252 is provided with a circumferential recess 276 (specifically, formed in an annular shape following the outer circumference of the upper mold 204 fixed to the fixed platen 252) drilled toward the radial center between the main body 270 and the bell-shaped portion 280. This provides the effect of keeping the mold fixing surface 280a flat (i.e., preventing the flatness of the mold fixing surface 280a from decreasing (deteriorating)). According to the inventor's research and verification, the reason for this is that by providing the recess 276, a balance is maintained between the amount of deformation closer to the radial center of the bell-shaped portion 280 and the amount of deformation closer to the radial outer circumference, that is, the effect of preventing a difference in the amount of deformation occurs.

[0051] Here, the recessed portion 276 is formed such that, in both the left-right and front-back directions, the innermost radial portion 276a is located closer to the radial center than the outer circumference 204a of one of the molds (upper mold 204 in this embodiment) fixed to the fixed platen 252. Experiments and simulations by the inventors of the present invention confirmed that this shape further enhances the effect of keeping the mold fixing surface 280a flat (i.e., the effect of not reducing (deteriorating) the flatness of the mold fixing surface 280a).

[0052] Furthermore, in this embodiment, the main body portion 270 and the bell-shaped portion 280 are integrally formed by casting, and a central hole 278 is provided at the radial center position, drilled in the direction from the first surface 270a toward the second surface 270b. Here, the central hole 278 is formed so that its inner diameter decreases in a stepped or tapered manner in the direction from the first surface 270a toward the second surface 270b. This makes it possible to direct the mold closing force acting on the bell-shaped portion 280 via the sealing mold (upper mold 204) toward the arm portion 274, that is, to concentrate stress on the arm portion 274. In addition, it is possible to reduce the weight of the fixed platen 252 (it has been confirmed that a weight reduction of about 30% is possible compared to the comparative example). Furthermore, integral formation by casting is possible, which makes it possible to improve production efficiency and reduce production costs.

[0053] Here, the depth of the central hole 278 is set as appropriate, and as an example, it is shaped to extend to the bell-shaped portion 280 in the vertical direction. However, it is not limited to this, and it may be shaped to extend to the recessed portion 276, or to be shaped to be formed only in the main body portion 270, etc. (none of which are shown). In this embodiment, it is formed so as not to penetrate to the mold fixing surface 280a in the bell-shaped portion 280. This makes it possible to further enhance the effect of keeping the mold fixing surface 280a a flat surface, that is, the effect of not reducing (deteriorating) the flatness of the mold fixing surface 280a.

[0054] As described above, the press apparatus 250 according to this embodiment was described using as an example a case in which a sealing die 202 for a resin sealing apparatus using a compression molding method (with a cavity in the upper die 204) is attached. However, it is not limited to this, and the same can be applied to sealing dies for resin sealing apparatuses using a compression molding method (with a cavity in the lower die 206), sealing dies for resin sealing using a transfer molding method, etc. (none of which are shown).

[0055] (Post-cure unit) Next, the post-cure unit 100E provided in the resin encapsulation device 1 will be described. In this post-cure unit 100E, post-curing is performed on the molded product Wp that has been transported from the press unit 100D by the transport device 102.

[0056] The post-cure unit 100E includes one or more ovens (post-cure ovens) 400, each having multiple heating chambers 402 that hold the molded product Wp, which is transported by the conveying device 102, inside and perform post-curing by heating it to a set temperature. Alternatively, the system may be configured without the post-cure unit 100E (not shown).

[0057] (Molded product storage unit) Next, the molded product storage unit 100F of the resin encapsulation device 1 will be described. In this molded product storage unit 100F, the molded product Wp that has been transported from the post-cure unit 100E by the transport device 102 is stored.

[0058] The molded product storage unit 100F is equipped with a molded product stocker 112 used for storing molded products Wp. For example, a known stack magazine, slit magazine, etc., can be used for the molded product stocker 112, and it is capable of storing multiple molded products Wp at once. These multiple molded products Wp are loaded one by one by a holding and moving mechanism 108.

[0059] (Control unit) Next, the control unit 100G provided in the resin encapsulation device 1 will be described. This control unit 100G is configured to include an operation unit 152 in which an operator inputs the operating conditions of the resin encapsulation device 1, and a control unit 150 that controls the operation of each mechanism in the resin encapsulation device 1 in accordance with the operating conditions input by the operator and pre-stored operating conditions. Note that the operation unit 152 is not limited to being located within the control unit 100G, but may be located in another unit or in an adjacent location.

[0060] (Resin encapsulation process) Next, an overview of the operation (i.e., the resin sealing method) of performing resin sealing using the resin sealing apparatus 1 according to this embodiment will be described. Here, we will take as an example a configuration in which a set of cavities 208 are provided in one upper mold 204, and one workpiece W is placed in one lower mold 206, and resin sealing is performed to obtain one molded product Wp. However, this is not the only configuration, and a configuration in which multiple workpieces W are resin sealed at once is also possible.

[0061] As a preparation step, a heating step (upper mold heating step) is performed in which the upper mold 204 is heated to a predetermined temperature (for example, 100°C to 200°C) using the upper mold heating mechanism. In addition, a heating step (lower mold heating step) is performed in which the lower mold 206 is heated to a predetermined temperature (for example, 100°C to 200°C) using the lower mold heating mechanism. Furthermore, a film supply step (film supply step) is performed in which the film F is transported (fed out) by the film supply mechanism 214 and supplied to a predetermined position (a position between the upper mold 204 and the lower mold 206) in the sealing mold 202.

[0062] Next, the conveying device 102 unloads the workpieces W one by one from the workpiece stocker 110 and transports them to the resin supply unit 100C.

[0063] Next, the conveying device 102 conveys the workpiece W so that it is directly below the syringe 314 of the dispenser 312, and a specified amount of resin is supplied (discharged) from the syringe 314 to the upper surface of the workpiece W and placed thereon. Alternatively, the resin may be supplied (conveyed) directly into the sealing mold 202 (specifically, into the cavity 208, etc.).

[0064] Next, the conveying device 102 transports the workpiece W (with resin placed on its upper surface) to the press unit 100D and then hands it over to the conveying loader 210.

[0065] Next, the workpiece W is transported into the sealing mold 202 by the transport loader 210. Alternatively, a preheating process for the workpiece W may be performed before transporting (loading) it into the sealing mold 202.

[0066] Next, the sealing mold 202 is closed (clamped), and the workpiece W is clamped between the upper mold 204 and the lower mold 206 to perform a resin sealing process (resin sealing process). Specifically, the drive device (drive source 260, drive transmission mechanism 262, etc.) of the press device 250 is driven to move (push) the movable platen 254 toward the fixed platen 252, thereby applying a closing force (pressure) to the sealing mold 202. As a result, the cavity piece 226 in the cavity 208 of the upper mold 204 descends relatively, heating and pressurizing the resin against the workpiece W held in the lower mold 206. In this way, the resin is heat-cured and resin sealing (compression molding) is performed, forming the molded product Wp.

[0067] Next, the sealing mold 202 is opened, and the molded product Wp is removed from the sealing mold 202 by the transport loader 210.

[0068] Next, the conveying device 102 receives the molded product Wp from the conveying loader 210 and carries it to the post-cure unit 100E.

[0069] In parallel with (or afterward), the film supply mechanism 214 transports (feeds out) the film F, thereby carrying out the process of removing the used film F from the sealing mold 202.

[0070] Next, the molded product Wp is transported to the designated oven 400 by the conveying device 102, and a post-curing process (post-molding heating) is performed. However, the post-curing process may be omitted.

[0071] After the post-curing process is completed, the conveying device 102 removes the molded product Wp from the heating chamber 402 of the oven 400 and transports it to the molded product storage unit 100F. Next, the conveying device 102 transports the molded product Wp one by one into the molded product stocker 112.

[0072] The above outlines the main steps of the resin encapsulation method performed using the resin encapsulation apparatus 1. However, the above sequence of steps is merely an example, and the order can be changed or the steps performed in parallel as long as there are no obstacles. For example, in this embodiment, since the configuration includes two press units 100D, efficient molded product formation is possible by performing the above operations in parallel.

[0073] As explained above, the resin sealing device according to the present invention makes it possible to solve the conflicting problems of preventing deformation of the mold fixing surface of the fixed platen in a press device and reducing the weight of the fixed platen itself.

[0074] Furthermore, the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the present invention. In particular, although the above-mentioned configuration has been given as an example, the invention is not limited to this, and can also be applied to a configuration in which the lower-side platen in the vertical direction is fixed.

[0075] Furthermore, although the above embodiment was described using a compression molding apparatus with a cavity in the upper mold as an example, it is also applicable to a compression molding apparatus with a cavity in the lower mold. It is also applicable to a transfer molding type resin encapsulation apparatus. [Explanation of Symbols]

[0076] 1. Resin encapsulation device 204 Upper mold 206 Lower mold 250 Pressing device 252 Fixed platen 254 Movable platen 256 Tie Bar 274 Arm section (part where bending occurs) 280 Bell-shaped section

Claims

1. A resin sealing apparatus that uses a sealing die comprising an upper mold and a lower mold to process a workpiece into a molded product by sealing it with resin, The system includes a press device for closing and opening the upper and lower molds, The press apparatus comprises a fixed platen to which one of the upper and lower dies is fixed, a movable platen to which the other is fixed, a tie bar that fixes the fixed platen and holds the movable platen so that it can be raised and lowered, and a drive device for raising and lowering the movable platen. The fixed platen has a fixing portion on the first surface side of the main body that is fixed to the tie bar, and a bell-shaped portion on the second surface side facing the opposite direction from the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion. The main body and the bell-shaped portion are integrally formed by casting, and a central hole is provided at the radial center, drilled in the direction from the first surface toward the second surface. The central hole is formed so as not to penetrate to the mold fixing surface in the bell-shaped portion. There is one opening corresponding to the aforementioned central hole. A resin encapsulation device characterized by the following.

2. A circumferential recess is provided between the main body and the bell-shaped portion, with the recess being drilled toward the radial center. The resin encapsulation apparatus according to claim 1, characterized by the following:

3. The recess is formed such that, in both the left-right and front-back directions, its innermost radial portion is located closer to the center in the radial direction than the outer circumference of either the upper or lower mold. The resin sealing apparatus according to claim 2, characterized in that

4. The aforementioned fixing part is provided at the tip of the arm portion that extends radially from the four corners of the main body. The aforementioned arm portion is configured as a deflection generating portion that generates a relatively larger deflection than other parts by concentrating stress when the mold is closed. The resin encapsulation apparatus according to claim 1, characterized by the following:

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