LED bracket, light-emitting unit, and light-emitting assembly

Abstract

To provide an LED bracket, a light-emitting unit, and a light-emitting assembly to solve the problem that an LED bracket has low strength and is easily broken when subjected to external force.SOLUTION: The present invention relates to an LED bracket, a light-emitting unit, and a light-emitting assembly, and the substrate of an LED bracket includes a substrate body and a support portion 14 extending from the substrate body to within a side wall of a bowl-shaped cup of the LED bracket, and the support portion extends within the side wall of the bowl-shaped cup from one conductive region of the LED bracket to the other conductive region, and also extends to a side wall region corresponding to the side wall of an insulating region 13 that insulates and isolates at least the two conductive regions.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] This application relates to the field of LEDs (Light Emitting Diodes, LED chips), and particularly to LED brackets, light emitting units, and light emitting assemblies.

Background Art

[0002] Chip LEDs are widely applied in fields such as lighting, decoration, backlighting, displays, etc. A chip LED includes an LED bracket and an LED chip provided on the LED bracket. Conventional LED brackets of chip LEDs usually include a substrate and a package provided on the substrate, and a bowl-shaped cup for accommodating the LED chip is formed in the package. However, since the side wall of the bowl-shaped cup of the conventional LED bracket has low strength, it is easily broken under the influence of external forces such as deformation of the plate material.

[0003] Therefore, how to improve the strength of the LED bracket is a technical problem that needs to be solved urgently at present.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of the deficiencies of the above prior art, an object of this application is to provide an LED bracket, a light emitting unit, and a light emitting assembly in order to solve the problem in the related art that the strength of the LED bracket is low and it is easily broken under external forces.

Means for Solving the Problems

[0005] This application provides an LED bracket including a package and a substrate partially covered by the package, wherein a bowl-shaped cup is formed in the package, a part of the substrate is inside the bowl-shaped cup as the bottom of the bowl-shaped cup, the substrate includes two conductive regions inside the bowl-shaped cup, and an insulating region for insulating and isolating the two conductive regions is provided between the two conductive regions. The above-mentioned substrate includes a substrate body and a support portion extending from the substrate body to the side wall of the bowl-shaped cup, wherein the support portion extends from one conductive region to the other conductive region within the side wall and extends to at least the side wall region corresponding to the side wall of the insulating region, in an LED bracket.

[0006] Based on the same inventive concept, the present application relates to a light-emitting unit including an LED chip and an LED bracket as described above, wherein the LED chip is provided at the bottom of the bowl-shaped cup, and the positive and negative electrodes of the LED chip are electrically connected to the two conductive regions, respectively. The present invention provides a light-emitting unit that further includes a package layer provided within the bowl-shaped cup described above.

[0007] Based on the same inventive concept, the present application further provides a light-emitting assembly comprising a circuit board and a light-emitting unit as described above, wherein the light-emitting unit is provided on the circuit board and is electrically connected to the circuit board. [Effects of the Invention]

[0008] This application provides an LED bracket, a light-emitting unit, and a light-emitting assembly, wherein the LED bracket's substrate includes a substrate body and a support portion extending from the substrate body to the side wall of the bowl-shaped cup of the LED bracket. By improving the strength of the side wall of the bowl-shaped cup with the support portion, the overall strength of the LED bracket can be improved. Furthermore, the support portion extends from one conductive region of the LED bracket to the other conductive region within the side wall of the bowl-shaped cup, and extends to a side wall region corresponding to the side wall of the insulating region that insulates and isolates at least these two conductive regions. That is, the support portion extends to the region between the two regions projected onto the side wall of the bowl-shaped cup of the two conductive regions. This region is the weakest region of the LED bracket, and by extending the support portion to this region, the strength of the LED bracket is further improved, and in particular the weakest part of the LED bracket is effectively reinforced, thus minimizing the occurrence of situations in which the LED bracket breaks when subjected to external force. The light-emitting unit and light-emitting assembly provided in this application employ a stronger LED bracket, thereby improving the overall strength and reliability of the light-emitting unit and light-emitting assembly. [Brief explanation of the drawing]

[0009] [Figure 1] This is a top view 1 of the LED bracket provided by Embodiment 1 of the present application. [Figure 2] This is a top view 2 of the LED bracket provided by Embodiment 1 of the present application. [Figure 3] This is a top view 3 of the LED bracket provided by Embodiment 1 of the present application. [Figure 4] This is a top view 4 of the LED bracket provided by Embodiment 1 of the present application. [Figure 5] Figure 4 is a cross-sectional view of the LED bracket (AA). [Figure 6] This is a top view 5 of the LED bracket provided by Embodiment 1 of the present application. [Figure 7]This is a diagram 1 showing the configuration of the LED bracket provided by Embodiment 2 of the present invention. [Figure 8] This is a diagram 2 showing the configuration of the LED bracket provided by Embodiment 2 of the present invention. [Figure 9] This is diagram 3 of the configuration of the LED bracket provided by Embodiment 2 of the present invention. [Figure 10] This is diagram 1 showing the configuration of the first groove provided by Embodiment 2 of the present application. [Figure 11] This is diagram 2 of the configuration of the first groove provided by Embodiment 2 of the present application. [Figure 12] Figure 3 shows the configuration of the first groove provided by Embodiment 2 of the present application. [Figure 13] This is diagram 4 of the configuration of the LED bracket provided by Embodiment 2 of the present application. [Figure 14] This is diagram 5 of the configuration of the LED bracket provided by Embodiment 2 of the present application. [Figure 15] This is a diagram showing the configuration of the light-emitting assembly provided by Embodiment 2 of the present application. [Figure 16] This is a diagram 1 showing the configuration of the LED bracket provided by Embodiment 3 of the present invention. [Figure 17] This is a diagram 2 showing the configuration of the LED bracket provided by Embodiment 3 of the present invention. [Figure 18] This is diagram 3 of the configuration of the LED bracket provided by Embodiment 3 of the present application. [Figure 19] This is diagram 4 of the configuration of the LED bracket provided by Embodiment 3 of the present application. [Figure 20] This is diagram 5 of the configuration of the LED bracket provided by Embodiment 3 of the present application. [Figure 21] This is a diagram showing the configuration of the light-emitting unit provided by Embodiment 3 of the present application. [Figure 22] This is diagram 1 showing the configuration of the circuit board of the LED bracket provided by Embodiment 4 of the present application. [Figure 23] This is diagram 2 of the circuit board configuration of the LED bracket provided by Embodiment 4 of the present invention. [Figure 24]It is the configuration diagram 3 of the substrate of the LED bracket provided by Example 4 of the present application. [Figure 25] It is the configuration diagram of the light-emitting unit provided by Example 4 of the present application. [Figure 26] It is the configuration diagram 1 of the LED bracket provided by Example 5 of the present application. [Figure 27] It is the configuration diagram 2 of the LED bracket provided by Example 5 of the present application. [Figure 28] It is the configuration diagram 3 of the LED bracket provided by Example 5 of the present application. [Figure 29] It is the top view 1 of the LED bracket provided by Example 5 of the present application. [Figure 30] It is the top view 2 of the LED bracket provided by Example 5 of the present application. [Figure 31] It is the top view 3 of the LED bracket provided by Example 5 of the present application. [Figure 32] It is the configuration diagram 4 of the LED bracket provided by Example 5 of the present application. [Figure 33] It is the configuration diagram of the light-emitting unit provided by Example 5 of the present application. [Figure 34] It is the schematic diagram 1 of the conventional normalized spectrogram provided by Example 6 of the present application. [Figure 35] It is the schematic diagram 2 of the conventional normalized spectrogram provided by Example 6 of the present application. [Figure 36] It is the configuration diagram 1 of the light-emitting unit provided by Example 6 of the present application. [Figure 37] It is the top view of the light-emitting unit in FIG. 36. [Figure 38] It is the schematic diagram 1 of the improved normalized spectrogram provided by Example 6 of the present application. [Figure 39] It is the configuration diagram 2 of the light-emitting unit provided by Example 6 of the present application. [Figure 40] It is the top view of the light-emitting unit in FIG. 39. [Figure 41]This is the improved normalized spectrogram 2 provided by Example 6 of the present application. [Figure 42] This is a diagram 1 showing the configuration of the light-emitting unit provided by Embodiment 7 of the present application. [Figure 43] This is diagram 2 of the configuration of the light-emitting unit provided by Embodiment 7 of the present application. [Figure 44] This is diagram 3 of the configuration of the light-emitting unit provided by Embodiment 7 of the present application. [Figure 45] This is diagram 4 of the configuration of the light-emitting unit provided by Embodiment 7 of the present application. [Figure 46] This is diagram 5 showing the configuration of the light-emitting unit provided by Embodiment 7 of the present application. [Figure 47] This is a diagram showing the configuration of the zigzag structure on the upper surface of the LED bracket provided by Embodiment 7 of the present application. [Figure 48] This is a diagram 6 showing the configuration of the light-emitting unit provided by Embodiment 7 of the present application. [Figure 49] This is a diagram 1 showing the configuration of a circuit board provided by Embodiment 8 of the present application. [Figure 50] This is a top view of the circuit board provided by Embodiment 8 of the present application. [Figure 51] This is a diagram showing the configuration of the light-emitting assembly provided by Embodiment 8 of the present application. [Figure 52] This is a schematic diagram of the bent state of the electronic device provided by Embodiment 8 of the present application. [Figure 53] This is a diagram showing the configuration of the electronic device provided by Embodiment 8 of the present application. [Figure 54] This is diagram 2 of the circuit board configuration provided by Embodiment 9 of the present application. [Figure 55] This is diagram 1 of the configuration of the light-emitting assembly provided by Embodiment 9 of the present application. [Figure 56] This is diagram 2 of the configuration of the light-emitting assembly provided by Embodiment 9 of the present application. [Figure 57] This is diagram 3 of the configuration of the light-emitting assembly provided by Embodiment 9 of the present application. [Figure 58] This is diagram 4 of the configuration of the light-emitting assembly provided by Embodiment 9 of the present application. [Figure 59] This is diagram 5 of the configuration of the light-emitting assembly provided by Embodiment 9 of the present application. [Figure 60] This is a diagram showing the configuration of the heat dissipation rib provided by Embodiment 9 of the present application. [Modes for carrying out the invention]

[0010] The present application will be described more comprehensively below, with reference to the relevant drawings, in order to facilitate understanding of the present application. The drawings illustrate preferred embodiments of the present application. However, the present application is not limited to the embodiments described herein and can be realized in various forms. Conversely, the purpose of providing these embodiments is to allow for a more comprehensive understanding of what is disclosed herein.

[0011] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art. The terms used in this specification are solely for the purpose of describing specific embodiments and are not intended to limit this application.

[0012] Furthermore, terms such as “First,” “Second,” etc., in the specification, claims, and drawings of this application are used to distinguish similar subjects and are not necessarily used to indicate a specific order or priority. It should be understood that the numbers used in this manner are interchangeable where appropriate to facilitate the description of the embodiments of this application. Also, the terms “includes” and “has” and any variations thereof are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to the steps or units explicitly mentioned, and may include other steps or units that are not explicitly mentioned or are specific to these processes, methods, products, or apparatus.

[0013] In this application, directions or positional relationships indicated by terms such as “up,” “down,” “inside,” “middle,” “outside,” “front,” and “back” are based on the directions or positional relationships shown in the drawings. These terms are primarily for the purpose of more preferably describing this application and its embodiments, and are not intended to limit the devices, elements, or components shown to necessarily have a particular direction, or to be constructed and operated in a particular direction. In addition, some of the above terms may be used to indicate meanings other than directions or positional relationships; for example, the term “up” may be used in a particular case to indicate a particular dependency or connection relationship. A person skilled in the art may understand the specific meaning of these terms in this application depending on the specific situation. Furthermore, the terms “set,” “connected,” and “fixed” should be understood in a broad sense. For example, “connected” may be a fixed connection, a removable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium; or it may be internal communication between two devices, elements, or components. A person skilled in the art may understand the specific meaning of the above terms in this application depending on the specific circumstances.

[0014] Furthermore, the embodiments and features of the present application can be combined with each other, as long as there is no contradiction. The present application will be described in detail below in accordance with the embodiments, with reference to the drawings. [Examples]

[0015] This embodiment provides an LED bracket that has a simple structure, low cost, a high yield rate, and excellent overall strength. This LED bracket may be used in fields such as lighting, decoration, backlighting, and displays, but is not limited to these. The LED bracket includes a package and a substrate, part of which is covered by the package. A bowl-shaped cup is formed in the package, and part of the substrate is located inside the bowl-shaped cup as the bottom of the cup. The substrate includes two conductive regions inside the bowl-shaped cup, and an insulating region is provided between the two conductive regions to insulate and isolate them. The substrate includes a substrate body and a support portion extending from the substrate body to the side wall of the bowl-shaped cup. By improving the strength of the side wall of the bowl-shaped cup with the support portion, the overall strength of the LED bracket can be improved. In this embodiment, the support portion extends from one conductive region to the other within the side wall, and extends to at least the side wall region corresponding to the side wall of the insulating region. Typically, this side wall region is the weakest region of the LED bracket, and by extending the support portion to this region, the weakest part of the LED bracket is effectively reinforced, and the occurrence of a situation in which the LED bracket breaks due to external force can be avoided to the greatest extent possible.

[0016] In one example, the package is formed on a substrate using various materials such as resins (not limited to these) by methods such as injection molding, casting, or die pressing (not limited to these). The bowl-shaped cup formed in the package is used to house the LED chip. In this example, the cross-sectional shape of the bowl-shaped cup can be freely set, for example, to a regular shape such as a rectangle, circle, ground shape, ellipse, or trapezoid (not limited to these), or to an irregular shape as needed, but this will not be explained in detail here.

[0017] In one example, the material of the substrate body may be an insulating material such as resin or ceramics, but is not limited to these. The substrate may consist of only one substrate, and the two conductive regions in this example may be provided on the same substrate body. The substrate in this example may also consist of two sub-substrates, in which case the two conductive regions may be provided on the substrate bodies of the two sub-substrates. The conductive regions in this example may be formed by providing a conductive layer corresponding to the substrate body, but is not limited to these, and the conductive layers are insulated and isolated from each other by insulating regions.

[0018] In another example, the material of the main substrate may be a conductive material such as a conductive metal, and the substrate may include two sub-substrates, in which case the two sub-substrates are insulated and isolated by insulating regions, and the regions in which the two sub-substrates are located within the bowl-shaped cup each constitute two conductive regions. Of course, in some application scenarios, the substrate may include two sub-substrates, and one sub-substrate may be made of a conductive material and the other sub-substrate may be made of an insulating material.

[0019] In this example, the insulating region may include, but is not limited to, a gap provided between two conductive regions to insulate and isolate them, and may also include an insulating material provided between the two conductive regions, such as, but is not limited to, various insulating adhesives or insulating resins. Furthermore, the surface of the insulating region approaching the bowl-shaped cup opening in this example is provided to be higher than the surface of at least one conductive region approaching the bowl-shaped cup opening, lower than the surface of at least one conductive region approaching the bowl-shaped cup opening, or at the same height as the surface of at least one conductive region approaching the bowl-shaped cup opening, and can be freely provided according to various needs in order to specifically improve its versatility.

[0020] In this example, the structure of the LED bracket is simplified and its integration density and strength are improved by setting the support part and the main substrate body as an integrally molded structure. Of course, both may be set as a non-integrated molded structure. Furthermore, the number and specific position of the support part can be freely set according to the needs of the application. For ease of understanding, this embodiment will be explained as an example in which the substrate includes two sub-substrates that are insulated and isolated by insulating regions, and the regions in which the two sub-substrates are located within the bowl-shaped cup each constitute two conductive regions.

[0021] In this example, the support portion may include a support portion extending from the substrate body of one of the sub-sub

[0022] An example application is shown in the top view of the LED bracket in Figure 1. Furthermore, in order to more favorably illustrate the structure of the LED bracket in the present invention, the package is depicted in perspective in the drawings, and in the drawings showing the top view, the shaded areas are the tops of the side walls, of which the area of ​​the first sub-sub In this embodiment, the first sub-substrate 11 includes a support portion 14 extending from the main substrate body. The support portion 14 extends from the main substrate body of the first sub-substrate 11 to the side wall of the bowl-shaped cup, and within the side wall, it extends from the second region T2 corresponding to the side wall of the first conductive region D1 to the third region T3 corresponding to the side wall of the second conductive region D2, and also extends to at least the side wall region corresponding to the side wall of the insulating region 13, i.e., the first region T1 in Figure 1. This effectively reinforces the weakest part of the LED bracket, minimizing the chance of the LED bracket breaking under external force. In this example, for example, as shown in Figure 4, the support portion 14 may pass through the first region T1 and extend into the second region T2, or, for example, as shown in Figures 1 to 3, the support portion 14 may not extend into the second region T2. It should be understood that in this example, the support portion 14 is entirely covered by the package 10, meaning that its entirety may extend into the side wall, or only a portion of it may be covered by the package 10 (as shown in Figure 2, for example).

[0023] In this example, the surface of the support portion 14 approaching the bowl-shaped cup opening is at the same height as the surface of the substrate body approaching the bowl-shaped cup opening, meaning they may be on the same plane, or the surface of the support portion 14 approaching the bowl-shaped cup opening may not be on the same plane as the surface of the substrate body approaching the bowl-shaped cup opening. For example, the surface of the support portion 14 approaching the bowl-shaped cup opening may be set higher than the surface of the substrate body approaching the bowl-shaped cup opening, meaning the support portion 14 may be provided to protrude in the height direction of the substrate body (i.e., the direction approaching the bowl-shaped cup opening). In other words, the support portion 14 extends within the side wall towards the cup rim of the bowl-shaped cup, further improving the overall strength of the side wall. In particular, if the LED bracket is subjected to an external force from below upward due to, for example, distortion of the plate material, the possibility of the side wall breaking can be further reduced. Also, in this example, the first region T1 corresponding to the side wall of the insulating region 13 refers to the region corresponding to the side wall of the region where the insulating region 13 and the side wall are in contact. In other words, in a top view, the extension direction of the insulating region 13 has a portion that intersects with the support portion 14, and the support portion 14 in that portion is not on the same plane as the substrate body, forming a three-dimensional reinforcing structure to ensure the strength of the side wall. In some application scenarios, the plate material of the insulating region 13 is more easily deformed, and the support portion 14 enters the first region T1, so that the relatively weaker parts of the side wall of the LED bracket are more preferably reinforced. However, in some specific application scenarios, the support portion 14 may also include a portion that extends away from the second conductive region D2, and the side walls of the other parts are similarly reinforced.

[0024] In this example, the support portion 14 may extend directly upward from the side edge of the substrate body, or it may extend horizontally for a certain distance from the side edge of the substrate body before extending upward. If it extends upward, the support portion 14 may include vertical projections or diagonally upward projections. For example, in the example shown in Figure 2, the rectangular cross-section support portion 14 extends directly from a position close to the top of the side edge of the substrate body, and the thickness of the support portion 14 may be smaller than the thickness of the substrate body. The support portion 14 is provided to extend along the substrate body of the first sub-substrate 11 toward the second sub-substrate 12 and enter the first region T1. In this example, the shape of the support portion 14 can be set as needed, and includes, but is not limited to, shapes such as a half-C shape (shown in Figure 3), an inverted L shape, or other shapes or combinations thereof. For example, it is a combination of a half-ground shape and a rectangle as shown in Figure 1.

[0025] In the examples shown in Figures 1 to 3, the support portion extends from one side of the main body of one of the sub-sub

[0026] In this embodiment, the LED bracket may include two support portions that extend from one side of the substrate body of the two sub-sub

[0027] In some examples of this embodiment, as shown in Figure 4, the support portion 14 includes a first support 141 connected to the substrate body and a second support 142 extending from the first support 141, wherein the second support 142 extends from the first support 141, then extends a certain distance to the second sub-substrate, and enters the corresponding first region T1 of the insulating region. In some applications, the first support 141 and the second support 142 may be integrally molded. The first support 141 may extend only horizontally along the side edge of the substrate body in a direction perpendicular or not perpendicular to it, and the second support 142 may extend from the first support 141 and then protrude in the height direction to extend to the second sub-substrate, the first support 141 may protrude at a certain height, and the second support 142 may extend from the first support 141 and then extend horizontally to the second sub-substrate, or both the first support 141 and the second support 142 may protrude in the height direction, and at least a portion of the second support 142 that enters the first region T1 may be higher than the substrate body. The two-tiered support structure, having a first support 141 and a second support 142, reinforces the strength of the side walls and ensures the bonding force between the bracket and the package. In one application example, the slope of the projection of the first support 141 can be made gentler than that of the second support 142. By increasing the bonding force between the bracket and the package with the gentler first support 141, the bond between the bracket and the package becomes more stable and less susceptible to separation under external force.

[0028] It should be understood that any portion of the support portion 14 that extends into the side wall can, to some extent, reinforce the strength of the side wall. In some embodiments, as shown in Figure 5, which is a schematic diagram of the AA cross section of the LED bracket shown in Figure 4, the first support 141 of the support portion 14 further includes an arc-shaped connection region, that is, the portion of the support portion 14 that approaches the substrate body may be an arc-shaped portion 143. In this example, the arc-shaped portion 143 refers to an arc-shaped corner portion that exists when the support portion 14 protrudes in the height direction. This arc-shaped portion 143 makes the space between the support portion 14 and the substrate body smoother, further increases the contact surface with the package, leads to improved airtightness, and guides any invading moisture towards the support portion, reducing the risk of the inside of the LED bracket becoming damp.

[0029] In some cases, as shown in Figure 5, in a cross-section perpendicular to the side edge where the support portion 14 is provided, the support portion 14 extends horizontally away from the substrate body, and the angle θ between the tip extension direction of the support portion 14 and the substrate body is 90° or more and less than 180°. That is, the angle between the tip extension direction of the support portion 14 within the wall and the substrate body is 90° or more and less than 180°, thus reducing the difficulty of molding the LED bracket. However, it should be understood that in order to increase the strength of the side wall, it is desirable for the support portion 14 to be enclosed in the side wall of the package, regardless of the angle between the support portion 14 and the substrate body. When the LED bracket includes two or more support portions 14, the angle between the tip extension direction of these two support portions 14 and the substrate body can be set to be the same, thereby matching the strength on both sides of the LED bracket.

[0030] In this embodiment, the support portion 14 may be made of a material harder than the package. For example, the package may be made of a material such as plastic, and the hardness of the support portion is higher than that of the plastic used. The support portion 14 may be made of a metal material, a ceramic material, a high-strength resin material, or other material. In some embodiments, the first sub-substrate 11 is a conductive substrate, and the substrate body and the support portion 14 are made of a conductive metal material. For example, the first sub-substrate includes, but is not limited to, a copper substrate, an aluminum substrate, an iron substrate, a silver substrate, etc. The support portion is made of the same material as the substrate body, for example, a metal material, and structural integrity is ensured by integrally molding the first sub-substrate. In the process of forming the support portion 14, the support portion 14 may be an extension region from the first sub-substrate and is formed into the required shape by processes such as pressing and etching. After forming the support portion 14, it is packaged with a material such as plastic to form a package structure such as a side wall.

[0031] In the LED brackets provided by the above-described examples of this embodiment, at least one support portion 14 is formed on at least one of the first sub-sub [Examples]

[0032] In conventional LED device packages, the LED chip is placed within the conductive area of ​​the substrate of the LED bracket, and the LED chip is packaged with a encapsulant to obtain an LED device, which is a light-emitting unit. However, because LED devices may operate in high-temperature, high-humidity, and salty environments, looseness and even delamination can occur between the encapsulant and the substrate, rendering the protection for the LED device ineffective.

[0033] This embodiment provides an LED bracket that, in order to solve the above problems, has a larger contact area between the substrate and the encapsulant, stronger bonding strength, and minimizes the occurrence of looseness and peeling between the encapsulant and the substrate.

[0034] The LED bracket in this embodiment may be the LED bracket shown in the above embodiment, or an LED bracket of other structures may be used, and it should be understood that this embodiment is not limited. In this embodiment, the LED bracket includes a substrate, and as shown in Figure 7, the substrate includes a substrate body 21 and a first conductive layer 22 and a second conductive layer 23 provided on the first surface of the substrate body 21, the first conductive layer 22 and the second conductive layer 23 being separated by an insulating region and forming two conductive regions. The LED bracket in this embodiment may also include a package provided on the substrate body 21, and the package may use various sealing materials, but is not limited to these.

[0035] In this embodiment, by providing a plurality of first grooves 25 on at least one edge of the first conductive layer 22 and the second conductive layer 23, the conductive layer in contact with the encapsulant on the substrate body has a larger lateral surface area. Furthermore, by providing a plurality of first grooves 25 on the edge (i.e., side wall) of the conductive layer, the bonding area between the substrate body and the encapsulant is increased, meaning that the encapsulant and the substrate body of this embodiment are bonded more firmly, thereby improving bonding strength and reducing the occurrence of looseness or peeling between the encapsulant and the substrate body.

[0036] As shown in Figure 7, in this example, multiple first grooves 25 are provided on the edges of both the first conductive layer 22 and the second conductive layer 23. However, the first grooves 25 may be provided on one edge (i.e., one side) of the first conductive layer 22 or the second conductive layer 23, or multiple first grooves 25 may be provided on each of those edges. It should be understood that this further improves the bonding area and bonding strength with the sealing material.

[0037] In this example, the substrate body 21 is provided with at least two conductive through-holes 24, and the first conductive layer 22 and the second conductive layer 23 are electrically connected to different conductive through-holes 24, and as shown in Figure 9, in this example the substrate further includes a third conductive layer 26 and a fourth conductive layer 27 covering the second surface of the substrate body, the third conductive layer 26 is electrically connected to the first conductive layer 22 via a corresponding conductive through-hole 24, and the fourth conductive layer 27 is electrically connected to the second conductive layer 23 via another corresponding conductive through-hole 24, and in this example the first surface and the second surface of the substrate body are two opposing surfaces, which may be, for example, the front and back surfaces of the substrate body, but are not limited to these.

[0038] In this case, the thickness of the multiple first grooves 25 at the edges of the first conductive layer 22 and / or the second conductive layer 23 in the height direction of the conductive layer may be equal to the height of the conductive layer, or it may be less than the height of the conductive layer. For example, in the situation shown in Figure 7, the thickness of the conductive layer in the first grooves 25 in the height direction is equal to the height of the conductive layer. Another example is shown in Figure 8, where the thickness of the conductive layer in the first grooves 25 in the height direction is less than the height of the conductive layer.

[0039] Multiple first grooves are additionally formed on the edges of the first conductive layer 22 and / or the second conductive layer 23, resulting in a larger lateral surface area compared to conventional rectangular or other shaped conductive layers. Furthermore, the roughness of the sidewalls of the first conductive layer 22 and / or the second conductive layer 23 is higher than usual. Therefore, when a sealant is provided on one side of where the first conductive layer 22 and the second conductive layer 23 are located, the bond with the sealant is stronger. In some embodiments, the airtightness of the final formed LED light-emitting device is also improved for this reason. Each conductive layer in this embodiment includes, but is not limited to, bonding pads and pins. For example, in some embodiments, the first conductive layer 22 and the second conductive layer 23 may be bonding pads for mounting LED chips, and the third conductive layer 26 and the fourth conductive layer 27 may be pins. Furthermore, in some conventional substrates, for example, a first groove or similar shape is formed in a conductive layer that serves as a positive or negative bonding pad. However, in practice, such a structure is only for distinguishing the positive and negative electrodes of the bonding pad, and is not intended to intentionally enhance the adhesion of the encapsulant. Moreover, in some substrates, the positive and negative electrodes are distinguished by printing marks. In the substrate of this embodiment, there are a plurality of first grooves 25 in the first conductive layer 22 and / or the second conductive layer 23. The positions of these first grooves 25 may be arranged continuously and regularly along the edge of the conductive layer at a constant period, and may be provided according to the actual substrate shape and / or the arrangement of electronic devices such as LED chips that are subsequently incorporated.

[0040] As shown in Figure 9, in this embodiment, the conductive through-holes 24 penetrate from the first surface to the second surface of the substrate body 21. The position and number of conductive through-holes 24 may be selected according to the actual situation, and the corresponding conductive through-holes 24 of the first conductive layer 22 and the second conductive layer 23 are separated by a certain distance so that the first conductive layer 22 and the second conductive layer 23 do not get too close together. Optionally, a conductive metal layer may be provided in the conductive through-holes 24 to achieve connection between both sides of the substrate body, and the conductive metal layer is in contact with the conductive layers corresponding to the first and second surfaces of the substrate body so that the corresponding conductive layers are electrically connected to each other. The material of the conductive metal layer may be any conductive metal, including but not limited to gold, silver, copper, and platinum. The conductive metal layer may be provided in the conductive through-holes by a film forming process such as vacuum sputtering, or it may be manufactured by other film forming processes. In this example, the conductive metal layer does not necessarily have to fill the conductive through-holes 24. For example, the conductive through-holes 24 may be provided with a diameter of 50 μm to 200 μm, and the conductive metal layer may be formed on the inner wall of the conductive through-holes with a thickness of less than 15 μm. In another example, the conductive through-holes 24 may be filled with a conductive metal material, or filled with a conductive metal rod, thereby achieving the same effect of electrically connecting the corresponding conductive layers on both sides of the substrate.

[0041] In some examples, the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 include copper layers, and the method of forming them may be similar to the method of forming the conductive metal layer in the conductive through-hole 24, but is not limited to these and will not be described in detail here. In this example, the thickness of the copper layer can be set according to the actual size or specifications of the device, for example, the thickness of the copper layer is about 20 μm to 100 μm, and the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 may be the same thickness or may be different thicknesses. Also, the first conductive layer 22 and the second conductive layer 23 may be the same thickness, and the third conductive layer 26 and the fourth conductive layer 27 may be the same thickness, but the first conductive layer 22 and the third conductive layer 26 may be provided so that they are not the same thickness.

[0042] In some examples, at least one of the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 further includes a metal plating layer, wherein the metal plating layer may include any conductive metal with chemical properties more stable than copper, such as gold plating, silver plating, platinum plating, or some alloys. The conductive layer has the surface properties of the corresponding metal due to the metal plating layer and is more stable than when bare copper is used as the conductive layer.

[0043] In this embodiment, the first groove 25 in the substrate may be manufactured by a method including (but not limited to) etching and cutting. For example, a copper layer may be formed over the entire surface of the substrate body 21 by a method such as vacuum sputtering, and then the copper layer may be manufactured into the required shape by a method such as etching and cutting, and the first groove 25 may also be manufactured in this process. The metal plating layer may be formed after the manufacturing of the first groove 25 is completed, thereby coating the sidewalls of the first conductive layer 22 and / or the second conductive layer 23 with the required metal. In the manufacturing process of the substrate in this embodiment, the conductive layer may be polished to make the surface smooth before coating the conductive layer with metal.

[0044] The substrate body in this embodiment may include a ceramic plate material; that is, the substrate in this embodiment may be a ceramic substrate such as ALN or AL203. In other embodiments, the substrate body may be made of other insulating materials.

[0045] In the substrate body of this embodiment, it should be understood that the first grooves 25 of the first conductive layer 22 and the second conductive layer 23 may have various shapes, and in some embodiments, the shape of the first grooves 25 may include at least one of arc-shaped, rectangular, or zigzag shapes. For example, the periodic arrangement of the edges of the first conductive layer 22 and the second conductive layer 23 shown in Figure 7 (i.e., the spacing between each first groove 25 is constant) has rectangular first grooves 25, the periodic arrangement of the edges of the conductive layer shown in Figure 10 has arc-shaped first grooves 25, the periodic arrangement of the edges of the conductive layer shown in Figure 11 has zigzag first grooves 25, and Figure 12 shows another form of zigzag first groove 25. It should be understood that the first groove may have any other shape, and its size and arrangement can be freely set. If multiple first grooves can be secured, the lateral surface area of ​​the first and second conductive layers in contact with the encapsulant will increase, resulting in an effect of increasing the adhesion of the encapsulant.

[0046] It should be understood that in some embodiments, one or more LED chips are provided in corresponding regions of a first conductive layer 22, a second conductive layer 23, a third conductive layer 26, and a fourth conductive layer 27. Furthermore, multiple such regions may be provided on the substrate.

[0047] In this embodiment, by forming a plurality of first grooves on the edges of the first conductive layer and / or the second conductive layer, the surface area of ​​the relatively rough side surfaces of the first conductive layer and / or the second conductive layer is increased. After packaging with the encapsulant, the encapsulant contacts the side walls of the first conductive layer and / or the second conductive layer over a larger area, resulting in a more robust bond between the substrate and the encapsulant. This reduces the degree of encapsulant delamination in the finally manufactured LED light-emitting device, thereby improving the quality of the finally manufactured LED light-emitting device.

[0048] This embodiment, also known as an LED light-emitting device, further provides a light-emitting unit including a substrate body 21, an LED chip 28, and a package layer 29, as shown in Figure 13. The LED chip 28 is provided on a first surface of the substrate body 21, the positive electrode of the LED chip 28 is welded to a first conductive layer 22, and the negative electrode of the LED chip 28 is welded to a second conductive layer 23. The package layer 29 is provided on the first surface of the substrate body 21 and covers the first conductive layer 22, the second conductive layer 23, and the LED chip 28, and the package layer 29 enters into a first groove 25 at the edge of the first conductive layer 22 and / or the second conductive layer 23.

[0049] In the above-described light-emitting unit, the package layer 29 may be a sealing material layer, but is not limited to this. The package layer 29 enters the first groove 25 at the edge of the first conductive layer 22 and / or the second conductive layer 23, thereby increasing the contact area with the relatively rough side walls of the first conductive layer 22 and / or the second conductive layer 23 on the substrate, and effectively improving the bonding strength with the substrate.

[0050] In one example of this embodiment, the light-emitting unit may further include a Zener diode as needed, the Zener diode being provided on the first surface of the substrate body 21, i.e., on the same surface as the LED chip 28, the positive electrode of the Zener diode being welded to the second conductive layer 23 and the negative electrode being welded to the first conductive layer 22, and the Zener diode is also covered by the package layer. The reverse-connected Zener diode can protect the LED chip. By providing the Zener diode on the same surface as the LED chip, the Zener diode is also covered and protected by the encapsulant layer. Other elements may further be included in the LED light-emitting device and may also be provided on the same surface as the LED chip if permitted by the circuit structure.

[0051] In one example of this embodiment, the multiple first grooves 25 at the edges of the first conductive layer 22 and the second conductive layer 23 are located outside the area covered by the LED chip 28, and if the light-emitting unit further includes a Zener diode, the multiple first grooves 25 are located outside the area covered by the Zener diode. After the element is assembled onto the substrate, a portion of it can come into contact with the first conductive layer 22 or the second conductive layer 23, and heat dissipation can be achieved by the first conductive layer 22 or the second conductive layer 23, which has a larger area. By providing the first grooves 25 outside the element, heat dissipation from the element by the first conductive layer 22 or the second conductive layer 23 is ensured.

[0052] Figure 14 shows a substrate used in the light-emitting unit shown in Figure 13, where the first grooves 25 in the first conductive layer 22 and the second conductive layer 23 are provided along the edges of the first conductive layer 22 and the second conductive layer 23, respectively. Relatively many first grooves 25 are provided on one side of the first conductive layer 22 and the second conductive layer 23 that is away from the center of the substrate in the longitudinal direction. In fact, the first grooves 25 in this portion may be provided periodically. First grooves 25 are also formed in some corners of the first conductive layer 22 and the second conductive layer 23, and a small number of first grooves 25 are also provided on one side of the first or second conductive layer that is closer to the center of the substrate in the longitudinal direction. In this example, the first grooves in the first conductive layer 22 and the second conductive layer 23 are not located in positions covered by the LED chip 28 and the Zener diode. It can be seen that by providing as many first grooves 25 as possible in positions where the first conductive layer 22 and the second conductive layer 23 are covered by the above elements, good adhesion between the substrate and the encapsulant layer (not shown) is achieved. In actual applications, the first grooves 25 in the substrate may be selected according to the final element arrangement. By avoiding areas covered by the elements while ensuring a certain surface area for the first conductive layer 22 and the second conductive layer 23, and by forming the first grooves 25 as close as possible to the edges of the first conductive layer 22 and the second conductive layer 23, the bonding strength between the substrate and the encapsulant layer is enhanced, and in several implementation processes, airtightness is also improved, leading to the assurance of the final quality of the LED light-emitting device.

[0053] In this embodiment, the manufacturing process of the substrate and the LED light-emitting chip of this embodiment will be further described. The manufacturing process of the LED light-emitting chip includes the following steps.

[0054] S101: Select an appropriate substrate body and drill holes in it. For example, drill one hole each in the lower left and upper right regions of the substrate body 21, with a hole diameter of 50 μm to 200 μm. In this step, the drilled holes are the holes that will subsequently be formed as conductive through-holes.

[0055] S102: A metal layer is formed on the front, back, and holes of the substrate body by sputtering. For example, a relatively thin metal layer may be formed on the substrate body 21 by sputtering, with a thickness of less than 15 μm. The metal layer may be made of a conductive metal, such as copper.

[0056] S103: The circuit is transferred to the surface of the substrate, and a thick copper layer is coated onto the metal layer by electroplating.

[0057] S104: A thick copper layer is manufactured into the required conductive layer shape, and etching or cutting is performed to obtain the outer shape of the substrate shown in Figure 14.

[0058] S105: Polish the surface of the conductive layer until it is smooth.

[0059] S106: The surface of the conductive layer is treated by electroplating to obtain a finished substrate, and a metal plating layer is formed on the surface of the copper layer by, for example, electroplating.

[0060] S107: Components are mounted on the substrate and packaged with a sealing material.

[0061] Illustratively, elements are attached to a substrate by methods including (but not limited to) welding with eutectic solder, and the elements include Zener diodes, LED chips, etc. After fixing these elements to the substrate, a encapsulant layer is manufactured by methods such as compression. In some specific examples, the thickness of the encapsulant layer may be 200 μm to 400 μm, and the encapsulant layer may be an insulating rubber material such as silica gel. In some examples, it should be understood that the encapsulant layer can be made higher than the highest surface of the elements on the substrate to ensure that each element is covered and protected. After the compression of the encapsulant layer is complete, it is hardened by baking in an oven, and illustratively, the silica gel package layer is hardened by baking at a temperature of 120°C to 170°C. If the substrate includes multiple areas for providing LED chips, it should be understood that the hardened LED light-emitting device can be cut to obtain individual LED light-emitting devices.

[0062] This embodiment further provides a light-emitting assembly, as shown in Figure 15, which includes a circuit board 210 and a light-emitting unit, wherein the light-emitting unit is an LED light-emitting device as shown in the above examples of this embodiment, the circuit board 210 includes a wiring layer 211, and a third conductive layer 26 and a fourth conductive layer 27 are welded to the wiring layer 211. It should be understood that the circuit board 210 of the light-emitting assembly may have a corresponding circuit pattern and an element that drives the LED light-emitting device to emit light. The bonding force between the encapsulant layer of the LED light-emitting device and the substrate in the light-emitting device of this embodiment is stronger, making it less likely to peel off from the substrate, resulting in a higher quality light-emitting device. [Examples]

[0063] In conventional LED package structures, poor coupling between the package and the substrate, poor airtightness, and problems such as light attenuation are prone to occur. To address these problems, this embodiment provides a novel LED bracket in which a second groove is added to the area where the substrate and package of the LED bracket come into contact, i.e., the area where the substrate is covered by the package. The package forms a stepped structure in the second groove, and a portion of the package covered by the substrate is filled into the second groove. The second groove increases the contact area between the package and the substrate, thereby enhancing the coupling strength and airtightness between the substrate and the package. Furthermore, when this bracket is applied to an LED package to obtain a light-emitting unit, the presence of the second groove increases the inclination of the inner wall of the package compared to conventional designs, and the required coupling strength is still ensured, thus increasing the light emission angle of the light-emitting unit. The LED bracket in this embodiment may be the LED bracket shown in the above embodiment (for example, Embodiment 1), or an LED bracket with a different structure may be used, and it should be understood that this embodiment is not limited to this.

[0064] The following explanation will refer to several examples shown in the diagrams for easier understanding.

[0065] In the LED bracket shown in Figure 16, the bracket includes a substrate 3 and a package 32 provided on the substrate 3. A second groove 31 is formed on one side of the substrate 3 that connects to the package 32, and the package 32 covers a portion of the surface of the substrate 3 and fills the second groove 31. In some examples of this embodiment, the substrate 3 may be used as a conductive heat transfer layer, and the material may be, but is not limited to, a copper alloy, aluminum, gold, silver, copper, etc. The protective structure formed by the package 32 surrounding the periphery of the substrate and filling it with a filler material may be, but is not limited to, a thermosetting resin or a thermoplastic resin, etc.

[0066] In one example of this embodiment, the second groove 31 formed in the LED bracket may have a depth of 0.05 mm to 0.3 mm, but is not limited to these dimensions, and may have a width of 0.05 mm to 0.5 mm, but is not limited to these dimensions. Specifically, taking into account the particle size of the filler material to be used for the package 32, the width and depth should normally be at least twice the maximum particle size to ensure sufficient filling.

[0067] In some examples of this embodiment, the substrate 3 has two conductive regions separated by an insulating region 34, and in this example, the insulating region 34 is a strip-shaped groove structure, and electrical isolation between the two conductive regions is achieved by filling the insulating region 34 with an insulating material.

[0068] In one example of this embodiment, as shown in Figure 16, the inner wall of the package 32 is hopper-shaped, and the opening dimensions gradually increase in the direction away from the substrate 3. That is, the opening dimensions of the bowl-shaped cup formed by the package 32 gradually increase in the direction away from the bottom of the bowl-shaped cup. The inner wall of the package 32 is connected to one side of the groove opening of the second recess 31 that approaches the center of the bowl-shaped cup (i.e., the one side of the groove opening of the second recess 31 that moves away from the edge of the substrate 3), and the shape projected onto the cross-section of the substrate 3 by the inner wall of the package 32 is a straight line L1. That is, the shape of the inner wall of the package 32 is the side surface of a round or square base structure, and in this example, the cross-section of the substrate 3 is perpendicular to the surface of the substrate 3. In this structure, a second groove 31 is provided at the joint between the substrate 3 and the package 32, making the inside of the package 32 more angled, while still ensuring the required bonding strength. When applied to an LED package structure, the angle between the emitted light and the LED central axis is larger, resulting in a larger light emission angle θ1 of the LED package.

[0069] In some embodiments, as shown in Figure 17, the inner wall of the package 32 is hopper-shaped, the opening dimensions gradually increase toward the direction away from the substrate 3, the inner wall of the package 32 is connected to one side approaching the center of the bowl-shaped cup of the groove opening of the second groove 31, and the shape of the inner wall of the package 32 in the cross-section of the substrate 3 is a curve L2, the specific shape of the curve includes, but is not limited to, a circular arc, an elliptical arc, and a parabola. Similarly, in this structure, the second groove 31 is provided at the joint between the substrate 3 and the inner wall of the package 32, the inside of the package 32 becomes more slanted, the required joint strength can still be ensured, and when applied to an LED package structure, the angle between the emitted light and the LED central axis is larger, resulting in a larger light emission angle of the LED package.

[0070] In some embodiments, as shown in Figure 18, the inner wall of the package 32 is hopper-shaped, and the opening dimensions gradually increase toward the direction away from the substrate 3, so that the package 32 covers the surface of the substrate 3 on both sides of the second groove 31. The shape of the inner wall of the package 32 in cross-section of the substrate 3 includes a first step 35 connected perpendicularly to the surface of the substrate 3 and a second step 36 provided at an angle to the surface of the substrate 3. By the package 32 covering the surface of the substrate 3 on both sides of the second groove 31, the package 32 forms a stepped structure on both sides of the second groove 31, further increasing the bonding strength between the substrate 3 and the package 32 and further improving airtightness. The first step 35 of the inner wall of the package 32 is used to ensure the thickness of the package 32, and the second step 36 is used to form a gradually expanding open opening and increase the angle of light emission.

[0071] In some embodiments, as shown in Figures 16 to 18, a third groove 33 for fixing a chip (including, but not limited to, an LED chip) is further formed on one side of the substrate 3 where the second groove 31 is provided, and the third groove 33 may be formed within any conductive area of ​​the substrate 3. In one example, the third groove 33 exists in the form of a countersunk hole on the surface of the substrate 3, and its depth may be 0.05 mm to 0.3 mm, but is not limited to this, and its width may be larger than the side of the chip to which it is fixed, thereby allowing the chip to fit inside the third groove 33. The third groove 33 also serves to increase the cup depth of the package 32, and as is known to those skilled in the art, in an LED package, having a certain thickness of the package layer on top of the chip ensures the airtightness of the packaged product, making it less susceptible to external environmental influences that would impair the reliability of the chip. In this embodiment, the function of the third groove 33 is to ensure the package thickness by the depth of the third groove 33 even when the height of the LED package is insufficient, thereby minimizing the size of the LED package as much as possible, assuming that the height of the package layer is ensured. This structure reduces the possibility of light attenuation and dead light by preventing the bonding wire 310 between the chip and the substrate 3 from being exposed on the surface of the encapsulant.

[0072] Furthermore, other configurations and operations of the LED package bracket provided in this embodiment are well known to those skilled in the art, and since they can all be described in detail here by referring to the structure of related devices in the prior art, they will not be described in detail here.

[0073] This embodiment further provides a light-emitting unit including an LED bracket provided in this embodiment, as shown in Figures 19 to 21. The light-emitting unit in this embodiment includes an LED chip 38, which is fixed to the surface of the substrate 3 inside the package 32 (i.e., inside the bowl-shaped cup) by a chip fixing gel 37, the LED chip 38 is electrically connected to the substrate 3 by bonding wires 310 (not limited to these), and the package layer 39 is provided inside the bowl-shaped cup formed by the package 32 and seals the LED chip 38. When a third groove 33 is formed in the substrate 3, the third groove 33 is the chip fixing area of ​​the LED package, the third groove 33 is inside the bowl-shaped package 32, the LED chip 38 is fixed inside the third groove 33 by the chip fixing gel 37, and the LED chip 38 is electrically connected to the substrate 3 by bonding wires 310.

[0074] For ease of understanding, this embodiment will describe an example of the manufacturing process of an LED bracket. The manufacturing process of the LED bracket includes, but is not limited to, the following steps.

[0075] Manufacturing of substrate 3: A third groove 33 is made in the center of substrate 3, and a second groove 31 is made around the third groove 33. The second groove 31 has a depth of 0.05 mm to 0.3 mm and a width of 0.05 mm to 0.5 mm, while the third groove 33 has a depth of 0.05 mm to 0.3 mm and a width greater than the side of the LED chip 38.

[0076] Bracket formation: The package 32 formed by the filler extends into the second groove 31 by the second groove 31 and the mold, and the substrate 3 and the package 32 form a bracket structure.

[0077] Using chip fixing equipment and a jig, chip fixing gel 37 is placed in the chip fixing area within the third groove 33. Then, using chip fixing equipment and a jig, the LED chip 38 is placed on the chip fixing gel 37, and the LED chip 38 is fixed in the third groove 33 by a curing process.

[0078] Bonding wires are applied to the material after chip fixation and baking using bonding wire equipment and jigs, and the LED chip 38 is electrically connected to the substrate 3 by the bonding wire 310. The bonding wire 310 used includes, but is not limited to, gold wire, silver wire, or alloy wire.

[0079] A fluorescent gel or encapsulant is applied to the material bonded with bonding wires using a gel facility, and the material with the fluorescent gel or encapsulant is cured by baking to form a package layer 39. The resulting light-emitting unit product has good airtightness, high product reliability, a wide light emission angle, and high brightness, making it applicable to products requiring high reliability both indoors and outdoors. It should be understood that the LED chip in this example is a standard LED chip, and it may be replaced with a flip LED chip or a vertical LED chip as needed.

[0080] Since the light-emitting unit disclosed in this embodiment includes the bracket provided in the above embodiment, a light-emitting unit having said bracket has all the above technical effects and will not be described in detail here. Other configurations and operations of the light-emitting unit are well known to those skilled in the art and will not be described in detail here. Some embodiments of this specification are described in an incremental or parallel manner, and each embodiment focuses on the differences from the other embodiments, while homologous or similar parts of each embodiment can be referenced to one another and will not be described in detail here. [Examples]

[0081] In conventional LED brackets, the overall performance of the LED bracket is usually improved by sequentially applying a copper plating layer and a silver plating layer to the surface of the substrate. However, when LED chips are connected to the substrate surface by soldering, a large amount of copper ions in the copper plating layer migrate to the silver plating layer, where they combine with tin on the surface of the silver plating layer to form a copper-tin compound, which creates holes and results in a relatively low yield rate.

[0082] In response to the above problem, this embodiment provides a novel LED bracket including a substrate, wherein the substrate includes a substrate body (i.e., a substrate body), and two conductive regions are provided on the first surface of the substrate body, which are insulated and isolated by an insulating region, and at least one of these conductive regions includes a first copper plating layer, a nickel plating layer, a second copper plating layer, and a silver plating layer which are sequentially laminated on the first surface of the substrate body, the thickness of the first copper plating layer is provided to be greater than the thickness of the second copper plating layer, and the nickel plating layer is used to inhibit the transition of copper ions in the first copper plating layer to the second copper plating layer. By sequentially laminating a first copper plating layer, a nickel plating layer, a second copper plating layer, and a silver plating layer on the surface of the substrate, the overall performance of the LED bracket is effectively improved. The second copper plating layer is relatively thin, and only a small amount of copper ions from the second layer migrate to the silver plating layer. This effectively prevents the formation of large amounts of copper-tin compounds and holes due to the interaction of copper ions and tin solder on the surface of the silver plating layer. Furthermore, the presence of the nickel plating layer inhibits the migration of copper ions from the first copper plating layer to the second copper plating layer, effectively suppressing an increase in the content of transition copper ions in the second copper plating layer. This prevents the formation of large amounts of copper-tin compounds and improves the yield rate. Other structures of the LED bracket in this embodiment may be those shown in the above embodiments, or other structures applicable to the LED bracket in this embodiment; it should be understood that this embodiment is not limited. For ease of understanding, this embodiment will be described below with reference to the examples shown in the drawings.

[0083] The substrate of the LED bracket shown in Figure 22 includes a substrate body 40 and a first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and a silver plating layer 44 which are sequentially laminated on the surface of the substrate body 40. Of these, the substrate body 40 has a certain structural strength in order to perform its supporting function. Furthermore, if the substrate body 40 is manufactured from a material with high thermal conductivity, when the LED chip operates and generates heat, the generated heat is conducted by the LED bracket, achieving effective heat dissipation. In one specific embodiment, the manufacturing material of the substrate body 40 may be a conductive material such as a metallic material. The material of the substrate body 40 includes, but is not limited to, conductive materials, and may be manufactured from any other high thermal conductivity material with a certain structural strength. It should be understood that the material of the substrate body 40 is not specifically limited here.

[0084] In one example of this embodiment, the substrate body 40 includes a first surface 401 and a second surface 402 facing each other, and a first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and a silver plating layer 44 are laminated on both the first surface 401 and the second surface 402. Of these, the metal plating layer on the first surface 401 is connected to an LED chip, and the metal plating layer on the second surface 402 is connected to a circuit board. It should be understood that the above metal plating layers are formed on the surface of the substrate body 40 by electroplating methods (not limited to these), and in the electroplating process, it is relatively difficult and the operation is more complex to form the metal plating layer on only one surface of the substrate body 40. Therefore, the metal plating layers are formed on both the first surface 401 and the second surface 402 to reduce the difficulty of the process and improve processing efficiency. The method for forming the first copper plating layer 41, the nickel plating layer 42, the second copper plating layer 43, and the silver plating layer 44 on the surface of the substrate body 40 includes, but is not limited to, electroplating. It may also be processed by metal deposition, chemical plating, or any other method that meets the requirements for the corresponding function, and the method for forming the metal plating layers is not specifically limited here.

[0085] The first copper plating layer 41 is provided on the surface of the substrate body 40. In the normal manufacturing process, there is a problem with the flatness of the surface of the substrate body 40, and it should be understood that if the substrate body 40 is mounted directly to the circuit board, there will be gaps or holes between the substrate body 40 and the circuit board, resulting in a low yield rate. Similarly, if an LED chip is mounted directly to the uneven surface of the substrate body 40, it will have a certain effect on the operational performance of the LED chip. By providing the first copper plating layer 41 on the first surface 401 and the second surface 402 of the substrate body 40, the flatness of the surface of the LED bracket is improved, gaps or holes between the LED bracket and the circuit board are effectively avoided, and the operational performance of the LED chip is similarly effectively improved by mounting it on the relatively flat first copper plating layer 41.

[0086] In one example of this embodiment, the thickness range of the first copper plating layer 41 is 0.5 μm to 5 μm. If the thickness of the first copper plating layer 41 is less than 0.5 μm, the thickness of the first copper plating layer 41 is too thin, making it difficult to correct the surface depressions of the substrate body 40, resulting in no flattening effect, and gaps or holes still exist between the corresponding LED bracket and the circuit board. Furthermore, when attaching the LED chip to the corresponding LED bracket, its operational effect is still affected to some extent. However, if the thickness of the first copper plating layer 41 exceeds 5 μm, the manufacturing cost increases to some extent due to the thickness of the first copper plating layer 41. Thus, when the thickness of the first copper plating layer 41 is between 0.5 μm and 5 μm, the flatness of the surface of the LED bracket is ensured, and the manufacturing cost is effectively reduced.

[0087] The nickel plating layer 42 is provided between the first copper plating layer 41 and the second copper plating layer 43. In a normal process, the LED bracket and the circuit board, and the LED chip and the LED bracket are fixed and connected by soldering, and there is a solder layer on the surface of the silver plating layer 44. After a certain period of operation, copper ions in the first copper plating layer 41 easily migrate to the second copper plating layer 43, resulting in an increase in copper ions in the second copper plating layer 43. A large amount of copper ions migrate from the second copper plating layer 43 to the silver plating layer 44, where they combine with tin on the surface of the silver plating layer 44 to form a copper-tin compound. This large amount of copper-tin compound makes it easy for holes to form between the LED bracket and the circuit board, and between the LED bracket and the LED chip, thus reducing the yield rate. The presence of the nickel plating layer 42 effectively inhibits the migration of copper ions from the first copper plating layer 41 to the second copper plating layer 43, and further effectively prevents a large amount of copper ions from migrating to the silver plating layer 44 and forming a large amount of copper-tin compound with the solder on the surface of the silver plating layer.

[0088] It should be further understood that the silver-plated layer 44 connected to the LED chip reflects the light emitted from the LED chip in order to improve brightness. The presence of the nickel-plated layer 42 effectively prevents a large amount of copper ions from migrating to the silver-plated layer 44 and reducing its reflectivity, and further ensures the corresponding reflective function of the silver-plated layer 44.

[0089] In one example of this embodiment, the thickness range of the nickel plating layer 42 is 0.125 μm to 2.5 μm. If the thickness of the nickel plating layer 42 is less than 0.125 μm, the nickel plating layer 42 is too thin, making it difficult for the transition of copper ions to be effectively inhibited. As a result, the formation of a large amount of copper-tin compounds is not suppressed, and the reflectivity of the silver plating layer 44 cannot be ensured to meet the corresponding requirements. However, if the thickness of the nickel plating layer 42 exceeds 2.5 μm, it should be understood that the manufacturing cost will increase to some extent due to the thickness of the nickel plating layer 42. Thus, when the thickness of the nickel plating layer 42 is between 0.125 μm and 2.5 μm, the transition of copper ions is inhibited, and the manufacturing cost is effectively reduced.

[0090] The second copper plating layer 43 is provided between the nickel plating layer 42 and the silver plating layer 44, and the thickness of the second copper plating layer 43 is smaller than the thickness of the first copper plating layer 41. When the silver plating layer 44 is directly provided on the surface of the nickel plating layer 42, the degree of bonding between the silver plating layer 44 and the nickel plating layer 42 is poor, and the silver plating layer 44 is easily peeled off from the surface of the nickel plating layer 42, resulting in poor stability of the LED bracket. However, by providing the second copper plating layer 43 between the nickel plating layer 42 and the silver plating layer 44, the degree of bonding between the second copper plating layer 43 and the silver plating layer 44 is relatively good, and it should be understood that the structural stability of the LED bracket is effectively improved. The thickness of the second copper plating layer 43 should be smaller than the thickness of the first copper plating layer 41, that is, the thickness of the second copper plating layer 43 should be relatively thin. This reduces the copper ion content in the second copper plating layer 43, effectively suppressing the transfer of a large amount of copper ions from the second copper plating layer 43 to the silver plating layer 44. This reduces the number of holes formed by the copper-tin compound to a certain extent, effectively improving the yield of good products, while also ensuring that the reflectivity of the silver plating layer 44 meets the appropriate requirements.

[0091] In one example of this embodiment, the thickness range of the second copper plating layer 43 is 0.0625 μm to 1 μm. If the thickness of the second copper plating layer 43 is less than 0.0625 μm, the second copper plating layer 43 is too thin and cannot perform its bonding function, the silver plating layer 44 is still prone to peeling, and the structural stability of the LED bracket cannot be effectively ensured. If the thickness of the second copper plating layer 43 exceeds 1 μm, the second copper plating layer 43 is too thick, resulting in a relatively high copper ion content in the second copper plating layer 43. These copper ions easily migrate in large quantities from the second copper plating layer 43 to the silver plating layer 44 connected to the circuit board. Furthermore, a large amount of copper-tin compounds are formed with tin on the surface of the silver plating layer 44, creating holes and reducing the yield rate. At the same time, because a large amount of copper ions easily migrate to the silver plating layer 44 connected to the LED chip, the reflectivity of the silver plating layer 44 is reduced, and it cannot meet the requirements for the corresponding functions. As a result, when the thickness of the second copper plating layer 43 is 0.0625 μm or more and 1 μm or less, it can effectively bond with the silver plating layer 44, and the transfer of a large amount of copper ions to the silver plating layer 44 can be avoided.

[0092] A silver plating layer 44 is provided on one side of the second copper plating layer 43 that is separated from the nickel plating layer 42. On one side of the substrate body 40 that is closer to the first surface 401, the LED chip is provided on the surface of the silver plating layer 44. Because the reflectivity of the silver plating layer 44 is relatively high, the light emitted from the LED chip is reflected by the silver plating layer 44, effectively improving its brightness effect. On one side of the substrate body 40 that is closer to the second surface 402, the circuit board is connected to the surface of the silver plating layer 44. Typically, the circuit board and the LED bracket are fixed and connected by soldering. Since the degree of bonding between the silver plating layer 44 and the solder layer is superior to the degree of bonding between the nickel plating layer 42 and the solder layer, it should be understood that the presence of the silver plating layer 44 effectively fixes the circuit board and the LED bracket, making them less prone to peeling and improving structural stability. The connection method between the LED bracket and the circuit board includes, but is not limited to, soldering. Other connection methods that meet the requirements of the corresponding function may also be used, and the connection method between the LED bracket and the circuit board is not specifically limited here.

[0093] In one example of this embodiment, the thickness range of the silver plating layer 44 is 0.25 μm to 5 μm. If the thickness of the silver plating layer 44 is less than 0.25 μm, the silver plating layer 44 is too thin, making it difficult for the silver plating layer 44 approaching the first surface 401 of the substrate body 40 to reflect light, and difficult for the silver plating layer 44 approaching the second surface 402 of the substrate body 40 to bond with the solder layer. However, if the thickness of the silver plating layer 44 exceeds 5 μm, it is too thick, and it should be understood that the price of silver is high, significantly increasing manufacturing costs. Therefore, when the thickness of the silver plating layer 44 is 0.25 μm or more and 5 μm or less, the requirements for light reflection and bonding with the solder layer can be met simultaneously, effectively reducing manufacturing costs.

[0094] The LED bracket provided by this embodiment effectively improves the overall performance of the LED bracket by sequentially laminating a first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and a silver plating layer 44 on the surface of the substrate body 40. Among these, the thickness of the second copper plating layer 43 is relatively thin, and only a small amount of copper ions in the second copper plating layer 43 migrate to the silver plating layer 44. This effectively prevents the formation of a large amount of copper-tin compounds and holes due to the interaction of copper ions and tin solder on the surface of the silver plating layer 44. Furthermore, the presence of the nickel plating layer 42 inhibits the migration of copper ions from the first copper plating layer 41 to the second copper plating layer 43. This effectively suppresses the increase in the content of migrated copper ions in the second copper plating layer 43, preventing the formation of large amounts of copper-tin compounds and improving the yield rate.

[0095] Referring together to Figures 23 and 24, Figure 23 is a configuration diagram of an LED bracket in another example of this embodiment, and Figure 24 is a configuration diagram of an LED bracket in another example of this embodiment. In this example, the LED bracket further includes a palladium plating layer 45, which is provided on one side of the silver plating layer 44 away from the second copper plating layer 43, and the palladium plating layer 45 is used to protect the silver plating layer 44. It should be understood that the structure of the palladium plating layer 45 is relatively stable, and by covering the surface of the silver plating layer 44, the palladium plating layer 45 improves the antioxidant capacity, anti-sulfidation capacity and corrosion resistance capacity of the silver plating layer 44, thereby improving the performance of the LED bracket to some extent. In this example, the thickness range of the palladium plating layer 45 is 0.0025 μm to 0.25 μm. If the thickness of the palladium plating layer 45 is less than 0.0025 μm, the palladium plating layer 45 is too thin, and therefore does not adequately protect the silver plating layer 44, causing the silver plating layer 44 to easily oxidize, sulfide, and corrode. However, if the thickness of the palladium plating layer 45 exceeds 0.25 μm, it is too thick, and it should be understood that the price of palladium is high, significantly increasing manufacturing costs. Therefore, when the thickness of the palladium plating layer 45 is between 0.0025 μm and 0.25 μm, the silver plating layer 44 is effectively protected, and manufacturing costs are reduced.

[0096] In one example of this embodiment, after a metal plating layer is formed on the surface of the substrate body 40, it is immersed in an antioxidant, then washed and dried to further improve the antioxidant capacity of the LED bracket.

[0097] As shown in Figure 24, in another example of this embodiment, in order to further reduce manufacturing costs, a palladium plating layer 45 may be provided only on the surface of the silver plating layer 44 connected to the LED chip. Normally, the silver plating layer 44 connected to the circuit board is covered by a solder layer, and the solder layer can provide a certain protective effect to the silver plating layer 44. Since most of the silver plating layer 44 connected to the LED chip is exposed to air, the palladium plating layer 45 is provided only on the surface of the silver plating layer 44 connected to the LED chip to protect the silver plating layer 44.

[0098] Refer to the configuration diagram of the light-emitting unit (i.e., LED module) shown in Figure 25. The light-emitting unit includes an LED chip 404, a package layer 405, and an LED bracket provided in this embodiment, both of which are provided on the surface of a substrate 403, with the LED chip 404 located at the bottom of a bowl-shaped cup. A solder layer may be further provided between the LED bracket and the package layer 405, meaning that the LED bracket and the package layer 405 may be fixed by soldering, or of course, by conductive gel. The light-emitting unit provided in this embodiment ensures good overall performance of the light-emitting unit and effectively improves the yield rate of the light-emitting unit when an LED bracket provided in any embodiment of the present application is attached. This embodiment further provides an LED package device which includes a package and the light-emitting unit, the package housing the light-emitting unit and providing protection by the package. The LED package device provided by this embodiment, when fitted with the light-emitting unit provided by this embodiment, ensures good overall performance of the LED package device and effectively improves the yield rate of the display device.

[0099] This embodiment further provides a light-emitting assembly, which includes a light-emitting unit or LED package device provided in this embodiment. When the light-emitting unit or LED package device provided in this embodiment is attached to the light-emitting assembly provided in this embodiment, good overall performance of the light-emitting assembly is ensured, and the yield rate of the display device is effectively improved. [Examples]

[0100] With the advancement of device technology applications, there is an increasing demand for ultra-thin and miniaturized LED packages for industrial equipment indicator lights, backlights, miniature equipment, smart wearable equipment backlight indicator lights, and dimensionally constrained Nixie tube backlight indicator lights, such as those for instrument panels, switches, symbols, telephones, and fax machines. Products such as Nixie tubes and smart wearable equipment are also trending towards lighter and thinner designs. In conventional LED chip packages, the mounted chip is typically fixed to the substrate with insulating adhesive, then the positive and negative electrodes of the chip are connected to the positive and negative electrodes of the substrate with bonding wire, and finally, fluorescent gel is injected into the substrate by compression. This structure does not allow for a thin product and cannot satisfy the application requirements for ultra-thin LED products.

[0101] Regarding the above problem, this embodiment provides a fourth recessed groove in a region within the bowl-shaped cup of the substrate body, which is recessed from the first surface to the second surface but does not penetrate the second surface, with the second surface being separated from the bowl-shaped cup. The substrate includes a first bonding pad and a second bonding pad, which are provided within the fourth recessed groove and insulated and isolated by an insulating region. The first and second bonding pads extend from the bottom wall of the fourth recessed groove to the second surface of the substrate body, and the portions of the first and second bonding pads within the fourth recessed groove each constitute two conductive regions. By creating a recessed groove in the substrate and packaging the chip by housing at least a portion of it within the groove, the height of the chip exposed to the first surface is reduced, the overall thickness of the LED product is reduced, and the application requirements for ultra-thin LED products are satisfied. For ease of understanding, this embodiment will be described below with reference to the example shown in the drawings.

[0102] As shown in Figures 26 to 28, this embodiment provides an LED bracket, which may be the LED bracket shown in each of the above embodiments, or an LED bracket of other structures, and this embodiment is not limited to the LED bracket. The LED bracket provided by this embodiment includes a substrate, a first bonding pad 51, a second bonding pad 52, and an LED chip 53. The substrate 1 includes a substrate body 5, which includes a first surface 501 and a second surface 502 facing each other, and a fourth groove 54 is formed in the first surface 501 of the substrate body 5, and the fourth groove 54 does not penetrate the second surface 502. The first bonding pad 51 and the second bonding pad 52 are separated by an insulating region and provided on the substrate body 5 at intervals, and the first bonding pad 51 and the second bonding pad 52 extend from the bottom wall of the fourth groove 54 to the second surface 502. At least a portion of the LED chip 53 is housed in the fourth groove 54, the first electrode of the LED chip 53 is connected to the first bonding pad 51, and the second electrode of the LED chip 53 is connected to the second bonding pad 52.

[0103] In this embodiment, the substrate body 5 may be a PCB board, but is not limited to this. The PCB board is provided with a fourth groove 54, which is recessed from the first surface 501 to the second surface 502 and does not penetrate the second surface 502. The fourth groove 54 accommodates an LED chip 53, and wiring corresponding to the LED chip 53 is printed on the bottom wall of the fourth groove 54. One or more LED chips 53 can be installed as needed, and their mounting positions are determined as needed. This embodiment is not limited to this. If the thickness of the substrate body 5 is less than that of the LED chip 53, or if the light-emitting surface of the LED chip 53 is higher than the first surface 501 of the substrate body 5, the depth of the fourth groove 54 is less than that of the LED chip 53, and a portion of the LED chip 53 is housed within the fourth groove 54. As shown in Figures 27 and 28, if the thickness of the substrate body 5 is greater than that of the LED chip 53, and the LED chip 53 does not protrude from the first surface 501, the depth of the fourth groove 54 is greater than or equal to the thickness of the LED chip 53, and the LED chip 53 is completely housed inside the fourth groove 54. With this structure, the LED chip 53 is better protected and is prevented from being exposed to the outside of the fourth groove 54 and damaged by collisions, etc. Optionally, the LED chip 53 may be a flip LED chip to make the structure of the LED module more compact. In other embodiments, structures such as a standard-mounted LED chip or a vertical LED chip may be selected.

[0104] The first bonding pad 51 and the second bonding pad 52 are made of a metal material having conductive properties, or have a conductive metal layer on their outer surface, and a gap is provided between the first bonding pad 51 and the second bonding pad 52. Optionally, the first bonding pad 51 includes a first end 511 and a second end 512, and extends from the first end 511 to the second end 512. Of these, the first end 511 is housed in a fourth groove 54, and the second end 512 is connected to the second surface 502 of the substrate body 5. Similarly, the second bonding pad 52 includes a third end 521 and a fourth end 522, and extends from the third end 521 to the fourth end 522, with the third end 521 housed in a fourth groove 54, and the fourth end 522 being connected to the second surface 502. The positive terminal of the LED chip 53 is connected to the first end 511 of the first bonding pad 51, and the negative terminal of the LED chip 53 is connected to the third end 521 of the second bonding pad 52. The positions of the first bonding pad 51 and the second bonding pad 52 are interchangeable; that is, if any one bonding pad is the first bonding pad 51, the other bonding pad is the second bonding pad 52.

[0105] By creating a fourth groove 54 in the substrate body 5 and packaging the LED chip 53 by housing at least a portion of it within the fourth groove 54, the height of the LED chip 53 exposed on the first surface 501 is reduced, the overall thickness of the LED product is reduced, and the application requirements for ultra-thin LED products are met.

[0106] In one embodiment, as shown in Figures 29 to 31, the shape of the fourth groove 54 corresponds to the shape of the LED chip 53. Optionally, as shown in Figure 29, if there is one rectangular LED chip 53, a rectangular fourth groove 54 may be provided; as shown in Figure 30, if there is one circular LED chip 53, a circular fourth groove 54 may be provided; and as shown in Figure 31, if there are multiple LED chips 53 in an irregular arrangement, the shape of the fourth groove 54 corresponds to the irregular shape. It should be understood that the bottom wall area of ​​the fourth groove 54 is always larger than the orthographic projection area of ​​the first surface 501 of the LED chip 53, so that the fourth groove 54 can accommodate the LED chip 53. By providing the shape of the fourth groove 54 to correspond to the LED chip 53, the shape and size of the fourth groove 54 can be freely adjusted, which is advantageous for processing the fourth groove 54, and is also advantageous for adjusting the shape and size of the fourth groove 54 in real time according to the area of ​​the substrate body 5 and the shape and arrangement of the LED chip 53, thus being suitable for various requirements.

[0107] In one embodiment, as shown in Figures 26, 29, and 31, there is one or more fourth grooves 54, and there is one or more LED chips 53 in each fourth groove 54. Optionally, as shown in Figure 29, one fourth groove 54 is formed in the substrate body 5, and there is one LED chip 53 in the fourth groove 54, and as shown in Figure 31, one fourth groove 54 is formed in the substrate body 5, and multiple LED chips 53 are provided inside the fourth groove 54. By freely adjusting the number of fourth grooves 54, multiple LED chips 53 can be provided in a single groove as needed, avoiding multiple processing steps for the fourth groove 54, and the structural strength can be improved by increasing the number of fourth grooves 54 to reduce the cutting area of ​​the substrate body 5.

[0108] In one embodiment, as shown in Figure 26, the substrate body 5 includes a first side surface 55 and a second side surface 56 facing each other, the first end 511 of the first bonding pad 51 extends from the bottom wall of the fourth groove 54 to the second surface 502 via the first surface 501 and the first side surface 55, forming the second end 512, the third end 521 of the second bonding pad 52 extends from the bottom wall of the fourth groove 54 to the second surface 502 via the first surface 501 and the second side surface 56, forming the fourth end 522, the first end 511 of the first bonding pad 51 and the third end 521 of the second bonding pad 52 are provided symmetrically within the fourth groove 54 with respect to the perpendicular bisector B of the bottom wall of the fourth groove 54, and the first end 511 and the third end 521 are provided with a gap between them. Optionally, an insulating material is provided between the first end 511 and the third end 521, and the insulating material is in contact with the first end 511 and the third end 521, respectively. The first bonding pad 51 and the second bonding pad 52 are electrically isolated by the insulating material, and at the same time, the insulating material is in contact with the first bonding pad 51 and the second bonding pad 52, respectively, thereby enabling more uniform heat transfer.

[0109] In one embodiment, as shown in Figures 26 and 27, the LED chip package structure further includes a reinforcing member 57. For example, as shown in Figure 27, the bottom wall of the fourth groove 54 has a first gap L1 between the first bonding pad 51 and the second bonding pad 52, the first gap L1 is used to separate the first bonding pad 51 and the second bonding pad 52 and to form positive and negative electrode bonding pads, the size of which is set according to the distance between the positive and negative electrodes of the LED chip 53, the first gap L1 is large when the distance between the positive and negative electrodes of the LED chip 53 is large, and the first gap L1 is small when the distance between the positive and negative electrodes of the LED chip 53 is small. The reinforcing member 57 is provided on the second surface 502, and the orthographic projection of the reinforcing member 57 on the second surface 502 completely covers the orthographic projection of the first gap L1 on the second surface 502. By providing the reinforcing material 57, the drawback of the substrate body 5 being prone to bending due to its excessively thin thickness between the first bonding pad 51 and the second bonding pad 52 is compensated for, increasing the thickness of the first gap L1 of the LED package structure and improving the structural strength.

[0110] In one embodiment, as shown in Figures 26 and 27, a second gap L2 is provided between the first bonding pad 51 and the second bonding pad 52 on the second surface 502. Optionally, the second gap L2 is provided between the second end 512 of the first bonding pad 51 and the fourth end 522 of the second bonding pad 52, isolating the first bonding pad 51 and the second bonding pad 52. By electrically isolating the first bonding pad 51 and the second bonding pad 52, positive and negative bonding pads are formed on the first bonding pad 51 and the second bonding pad 52, respectively. Optionally, an insulating material is provided between the second gap L2. The insulating material electrically isolates the first bonding pad 51 and the second bonding pad 52, while simultaneously connecting the first bonding pad 51 and the second bonding pad 52 as a single unit, thereby ensuring uniform heat transfer.

[0111] In one embodiment, as shown in Figures 26 to 28, the reinforcing material 57 and the first bonding pad 51 or the second bonding pad 52 are integrated into a single structure. Optionally, as shown in Figure 27, the reinforcing member 57 and the first bonding pad 51 form an integrated structure, with the reinforcing member 57 extending from one side with the first side surface 55 to the other side with the second side surface 56 at the second end 512 of the first bonding pad 51, and the orthographic projection of the second surface 502 of the reinforcing member 57 completely covers the orthographic projection of the second surface 502 of the first gap L1. Alternatively, as shown in Figure 28, the reinforcing member 57 and the second bonding pad 52 form an integrated structure, with the reinforcing member 57 extending from one side with the second side surface 56 to the other side with the first side surface 55 at the fourth end 522 of the second bonding pad 52, and the area of ​​the orthographic projection of the second surface 502 of the reinforcing member 57 is larger than the area of ​​the orthographic projection of the first surface 501 of the first gap L1. By integrating the reinforcing material 57 with the first bonding pad 51 or the second bonding pad 52, the strength of the LED package structure is improved, and at the same time, the contact area between the first bonding pad 51 or the second bonding pad 52 and the substrate body 5 is increased, making it easier to dissipate heat and install.

[0112] In one embodiment, as shown in Figure 32, the reinforcing member 57 is provided in the second gap L2, and the width of the reinforcing member 57 is smaller than the second gap L2, and it is provided at a distance from both the first bonding pad 51 and the second bonding pad 52. The reinforcing member 57 is in close contact with the second surface 502, and the orthographic area of ​​the reinforcing member 57 on the second surface 502 is larger than the orthographic area of ​​the first surface 501 of the first gap L1. The reinforcing member 57 is made of metal or a non-metallic material having a certain structural strength; for example, the metallic material is copper, and for example, the non-metallic material is ceramics. Optionally, the reinforcing member 57 is removably connected to the second surface 502. By providing the reinforcing member 57 in the second gap L2, the problem of the substrate body 5 being prone to breakage due to its thinness in the first gap L1 is avoided, and since the reinforcing member 57 is independent of the first bonding pad 51 and the second bonding pad 52, it can be freely attached as needed.

[0113] In one embodiment, as shown in Figure 26, a solder resist layer 58 is provided on the surface of the reinforcing material 57 facing away from the substrate body 5. The reinforcing material 58 and the first bonding pad 51 or the second bonding pad 52 form an integrated structure, the surface of the reinforcing material 57 facing away from the substrate body 5 is made of a conductive metal material, and the solder resist layer 58 is made of a material that has acid resistance, dissolution resistance, and insulating properties, such as an ink layer. Therefore, by applying the solder resist layer 58 to the surface of the reinforcing material 57 facing away from the substrate body 5 to form a protective layer, corrosion of the reinforcing material 57 due to external factors such as moisture is prevented, and short-circuit problems caused by the element tilting to the intended position during chip mounting are prevented due to its high insulating properties.

[0114] This embodiment provides a light-emitting assembly that includes a light-emitting unit manufactured by an LED bracket as described in any of the embodiments above. The light-emitting assembly may be a general-purpose lighting device, such as an LED light-emitting diode or a high-power ceramic LED light source, and is used in high-end markets such as road lighting, building lighting, landscape lighting, and interior lighting. It may also be a backlight light source for display devices such as LED backlit LCD TVs and smart wearable devices. The LED chip package structure provided by this embodiment reduces the thickness of the light source, leading to thinner display devices and satisfying the application requirements for ultra-thin display devices.

[0115] This embodiment further provides an LED chip packaging method that includes manufacturing an LED chip package structure as described in the above embodiment and packaging the LED chip using the said package structure. This method includes, but is not limited to, the following:

[0116] A fourth groove 54 is formed in the substrate body 5. Optionally, the substrate body 5 includes a first surface 501 and a second surface 502 facing each other. Optionally, the fourth groove 54 is formed in the first surface 501 of the substrate body 5 by laser cutting, and the fourth groove 54 recesses from the first surface 501 to the second surface 502, but does not penetrate the second surface 502, so that the substrate body 5 is divided into two regions, a positive electrode and a negative electrode, by the fourth groove 54. Optionally, the fourth groove 54 may be processed in the substrate body 5 by methods such as depth-controlled router processing or double-sided core board lamination.

[0117] A first bonding pad 51 and a second bonding pad 52 are provided on the substrate body 5 at intervals. Optionally, the first bonding pad 51 and the second bonding pad 52 are made of a metal material having conductive properties, or a metal plating layer having conductive properties is applied to their outer surface. The first bonding pad 51 includes a first end 511 and a second end 512, the first end 511 being housed in and connected to the bottom wall of the fourth groove 54, and the second end 512 being connected to the second surface 502 of the substrate body 5, with the first bonding pad 51 extending from the first end 511 to the second end 512. Similarly, the second bonding pad 52 includes a third end 521 and a fourth end 522, the third end 521 being housed in a fourth groove 54 and the fourth end 522 being connected to the second surface 502, and the second bonding pad 52 extends from the third end 521 to the fourth end 522. There are gaps between the first end 511 and the third end 521, and between the second end 512 and the fourth end 522.

[0118] The LED chip 53 is connected to the first bonding pad 51 and the second bonding pad 52. Optionally, solder 59 is printed in the fourth groove 54 of the substrate body 5 using a 3D steel mesh. Commonly used solders 59 include silver paste, tin paste, flux, etc. The opening pattern of the 3D steel mesh is designed according to the electrodes of the LED chip 53, and then the LED chip 53 is placed in the solder 59. If the selected solder 59 is silver paste, baking is performed at a constant temperature of 170°C for 1 hour. If the selected solder 59 is tin paste or flux, reflow soldering is performed at a maximum furnace temperature of 290°C for 30 seconds in a nitrogen gas atmosphere to prevent oxidation of the metal particles in the solder 59. In this step, the first electrode of the LED chip 53 is connected to the first bonding pad 51 and the second electrode of the LED chip 53 is connected to the second bonding pad 52 using the solder 59.

[0119] By creating the fourth groove 54 in the substrate body 5 using a laser cutting method, higher processing accuracy and efficiency are achieved, and the yield rate of finished products is improved. One end of the first bonding pad 51 and the second bonding pad 52 are housed in the bottom wall of the fourth groove 54, and the first and second electrodes of the LED chip 53 are connected to the first bonding pad 51 and the second bonding pad 52, respectively, within the fourth groove 54. This reduces the height of the LED chip protruding from the substrate body 5, and further reduces the thickness of the LED product.

[0120] Furthermore, as shown in Figures 32 and 33, a first bonding pad 51 and a second bonding pad 52 are provided on the substrate body 5 at intervals, and specifically include the following:

[0121] The first bonding pad 51 and the second bonding pad 52 are provided symmetrically with respect to the perpendicular bisector B of the bottom wall of the fourth groove 54. Optionally, the first end 511 of the first bonding pad 51 and the third end 521 of the second bonding pad 52 are provided on either side of the perpendicular bisector B within the fourth groove 54, and the distances from the first end 511 and the third end 521 to the perpendicular bisector B are the same, thereby creating a symmetrical structure and avoiding deflection and damage due to uneven thickness of the LED package structure.

[0122] A reinforcing member 57 is provided on the second surface 502. Optionally, two independent metal blocks or metal plates are used as the first bonding pad 51 and the second bonding pad 52, with one end of the first bonding pad 51 and the second bonding pad 52 housed in the bottom wall of the fourth groove 54, and a first gap L1 between the first bonding pad 51 and the second bonding pad 52, the other ends of the first bonding pad 51 and the second bonding pad 52 extending to the second surface 502. The reinforcing member 57 is similarly a metal structure and is provided on the second surface 502, with the orthographic projection on the second surface 502 completely covering the orthographic projection on the second surface 502 of the first gap L1. By providing the reinforcing material 57, the drawbacks of the substrate body 5 being prone to bending and damage due to its excessively thin thickness between the first bonding pad 51 and the second bonding pad 52 are compensated for, increasing the thickness of the first gap L1 of the LED package structure and improving the structural strength.

[0123] Furthermore, as shown in Figures 26 to 28, a reinforcing member 57 is provided on the second surface 502, and includes the following, namely, the reinforcing member 57 and the first bonding pad 51 or the second bonding pad 52 are integrated into one structure. Optionally, the substrate body 5 includes opposing first side surfaces 55 and second side surfaces 56, and when the reinforcing member 57 and the first bonding pad 51 are integrated into one structure, the reinforcing member 57 extends from the second end 512 of the first bonding pad 51 to the fourth end 522 of the second bonding pad 52 such that the distance from the second end 512 to the first side surface 55 is greater than the distance from the third end 521 to the first side surface 55. When the reinforcing material 57 and the second bonding pad 52 form an integrated structure, the reinforcing material 57 extends from the fourth end 522 of the second bonding pad 52 to the second end 512 of the first bonding pad 51 such that the distance from the fourth end 522 to the second side surface 56 is greater than the distance from the first end 511 to the second side surface 56.

[0124] Optionally, in another embodiment, the reinforcing member 57 is a structure made of a single metal block or other material having a certain structural strength, and the reinforcing member 57 is bonded or welded to the first bonding pad 51 or the second bonding pad 52.

[0125] Optionally, the reinforcing material 57 is spaced apart from the first bonding pad 51 or the second bonding pad 52, and the orthographic projection of the second surface 502 of the reinforcing material 57 completely covers the orthographic projection of the second surface 502 of the first gap L1.

[0126] By providing the reinforcing material 57 on the second surface 502, the problem of the substrate body 5 being easily damaged due to being too thin in the first gap L1 can be avoided.

[0127] In some examples, as shown in Figures 26 and 33, a reinforcing material 57 is provided on the second surface 502, and further including the following, a solder resist layer 58 is provided on the surface of the reinforcing material 57 facing away from the substrate body 5. Optionally, when the reinforcing material 57 and the bonding pad of the negative electrode of the LED package structure are integrated, a liquid photoimageable solder mask is applied to the surface of the reinforcing material 57 facing away from the substrate body 5. The liquid photoimageable solder mask may be a solder resist ink of any color, such as green, red, or white. The solder resist ink is tacky before use, and after printing, pre-baking, alignment, exposure, development, and curing, the solder resist layer 58 is formed, completely covering the surface of the reinforcing material 57 facing away from the substrate body 5. The solder resist layer 58 has advantages such as corrosion resistance, high temperature resistance, and high insulation, providing good protection for the LED package structure, and its high insulation avoids the problem of short circuits in the elements.

[0128] In some examples, as shown in Figure 33, the package may be further cut after a solder resist layer 58 is provided on the surface of the reinforcing material 57 facing away from the substrate body 5. Optionally, first, the placed epoxy resin fluorescent gel 510 is placed in a compressor, the corresponding parameters are adjusted, and the package is processed on the preheated and cleaned semi-finished product. After completing the packaging and baking, a blade of the appropriate thickness is attached to a cutting machine, and the entire substrate body 5 is cut to obtain the required product. [Examples]

[0129] Fresh food lighting is a new type of special lighting designed specifically for illuminating fresh food, highlighting its color characteristics and stimulating purchasing desire. The spectra of existing fresh food lighting used in the market are mainly ordinary white light or a mixture of monochromatic light, and individual and rational adjustment of color refinement control and color restoration ability according to the illuminated object is not considered. Fresh food lighting commonly found in the market is usually a white bead lamp + red bead lamp setup, and its mixed light effect is relatively poor. Although a blue light chip + green fluorescent powder + red fluorescent powder setup is sometimes adopted, the normalized spectrogram of the excited fresh food white light is shown in Figure 34 or Figure 35, and the wavelength corresponding to the peak in the red light wavelength band in the two normalized spectrograms is less than 600 nm, indicating insufficient red light transmission, resulting in cross-color illumination of fresh food and poor color restoration of fresh meats. Furthermore, the relative light power (i.e., relative light intensity) of the peak in the red light wavelength band in the two normalized spectrograms is less than 0.75, indicating a relatively poor red color rendering effect for fresh foods. Additionally, because the red and green light wavelength bands are connected, yellow light is easily generated, and this yellow light affects the red saturation of fresh meats, resulting in a brown color that easily misleads consumers. This is a common problem with conventional fresh food lighting.

[0130] Regarding the above-mentioned problems, this embodiment provides two types of light-emitting units that can be applied to (but are not limited to) fresh food lighting. The advantages of these light-emitting units are that they can effectively restore the color of fresh food, suppress the generation of yellow light to some extent, avoid the effect of yellow light on the red saturation of fresh meat, further improve the degree of color restoration in fresh food lighting, suppress brown tones that affect purchasing intent, and display a red color that is relatively appropriate for fresh meat. The light-emitting units provided in this embodiment can be applied to various fresh food lighting devices, for example, to the lighting of fresh meat such as fresh pork and fresh beef, but are not limited to these. The fresh food lighting device may be a fresh food lighting lamp or an electronic device such as a refrigerator or freezer with a fresh food lighting function. Below, for ease of understanding, this embodiment will describe two types of light-emitting units illustratively.

[0131] An example light-emitting unit, as shown in Figures 36 and 37, includes an LED bracket 60 (the LED brackets shown in each of the above embodiments may be selected, or a bracket of other structure may be selected; this embodiment is not limited to the LED bracket), a red light LED chip 61, a blue light LED chip 62, and a package layer, the package layer of which includes a green medium 63. The LED bracket 60 has a substrate, both the red light LED chip 61 and the blue light LED chip 62 are provided on the substrate, and the green medium 63 covers the red light LED chip 61 and the blue light LED chip 62. The red light LED chip 61 and the blue light LED chip 62 excite the green medium 63 and emit white light. Furthermore, the normalized spectrogram of the emitted white light satisfies the following conditions. The normalized spectrogram includes the first red light wavelength band and the green light wavelength band. The full width at half maximum of the first red light wavelength band is 15 nm to 30 nm, the peak in the first red light wavelength band is the first peak, the relative optical power corresponding to the first peak is 0.9 to 1, and the wavelength corresponding to the first peak is 645 nm to 665 nm.

[0132] Optionally, the red light LED chip 61 may have a vertical or horizontal structure, and similarly, the blue light LED chip 62 may also have a vertical or horizontal structure. The red light LED chip 61 and the blue light LED chip 62 are fixed to the bottom of the LED bracket 60 with a chip fixing gel, and the chip fixing gel is completely cured by baking at 150°C for 1 to 2 hours. In the case of horizontally structured chips, a transparent silicone resin chip fixing gel is used, while in the case of vertically structured chips, a silver-doped silicone resin chip fixing gel is used. A bonding wire is required between the red light LED chip 61 and the blue light LED chip 62 and the LED bracket 60. Typically, the bonding wire is 0.9mil 80%Au, and optionally, an M or S wire arc process is used. The arrangement and connection method of the bonding wire is determined by the combination of the structure of the LED bracket 60 and the structures of the red light LED chip 61 and the blue light LED chip 62, and it is sufficient that circuit conductivity is achieved. A vertically structured red LED chip 61 and a horizontally structured blue LED chip 62 are preferred, and the bracket, the blue LED chip 62, and the red LED chip 61 are connected in order by bonding wires.

[0133] As shown in Figure 38, the normalized spectrogram of white light satisfies the following conditions.

[0134] The normalized spectrogram includes a first red light wavelength band, and the full width at half maximum (FMAX) of the first red light wavelength band is 15 nm to 30 nm. Specifically, the FMAX of the first red light wavelength band may be selected from 15 nm, 18 nm, 24 nm, 27 nm, 30 nm, etc., of which 30 nm is preferred, and the half-wavelength range is 640 nm to 670 nm.

[0135] The peak in the first red light wavelength band is the first peak, the relative light power corresponding to the first peak is 0.9 to 1, and the wavelength corresponding to the first peak is 645 nm to 665 nm. Specifically, the relative light power (i.e., relative light intensity) corresponding to the first peak is 0.9, 0.92, 0.95, 0.99, 1, etc., of which 1 is preferred. The wavelength corresponding to the first peak may be selected from 645 nm, 651 nm, 654 nm, 659 nm, 665 nm, etc., of which 660 nm is preferred.

[0136] In the configuration where a red light LED chip 61 and a blue light LED chip 62 are used to excite a green medium 63, the full width at half maximum of the excited first red light wavelength band is 15 nm to 30 nm, the energy is relatively concentrated, the red light saturation is high, and the wavelength of the first peak in the first red light wavelength band is 650 nm to 670 nm, resulting in strong red light transmission and good restoration of the color of fresh meat. At the same time, the relative light power corresponding to the first peak in the first red light wavelength band is 0.9 to 1, resulting in good red color development for fresh food. Furthermore, the first red light wavelength band with the above parameters suppresses the generation of yellow light to some extent, avoiding the influence of yellow light on the red saturation of fresh meat, further improving the degree of color restoration of fresh food illumination, suppressing brown tones that affect purchasing intent, and showing a red color that is relatively appropriate for fresh meat.

[0137] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes the green light wavelength band. The full width at half maximum (FMAX) of the green light wavelength band is 35 nm to 60 nm. Specifically, the FMAX of the green light wavelength band may be selected from 35 nm, 41 nm, 48 nm, 53 nm, 57 nm, 60 nm, etc., of which 60 nm is preferred, and the half-wavelength range is 510 nm to 570 nm. By setting the FMAX of the green light wavelength band to 35 nm to 60 nm, the green light wavelength band does not affect the color development effect of white fresh food, nor does it affect the color development effect of red fresh food. When the full width at half maximum (FMAX) of the green light wavelength band is 35 nm or less, the process cost is relatively high, the colors tend to be disharmony, white is prone to cross-coloring, and it is unfavorable for restoring the color of white parts of fresh meat. However, when the full width at half maximum (FMAX) of the green light wavelength band is 60 nm or more, the proportion of the green light wavelength band in the white light is too large, red light is easily affected, red is prone to cross-coloring, and it is unfavorable for developing the color of red parts of fresh meat.

[0138] The peak in the green light wavelength band is the second peak, the relative light power corresponding to the second peak is 0.2 to 0.4, and the wavelength corresponding to the second peak is 530 nm to 550 nm. Specifically, the relative light power corresponding to the second peak may be selected from 0.2, 0.24, 0.29, 0.34, 0.38, 0.4, etc. The wavelength corresponding to the second peak may be selected from 530 nm, 532 nm, 538 nm, 544 nm, 550 nm, etc., of which 540 nm is preferred. By setting the relative light power of the second peak to 0.2 to 0.4, it is possible to achieve good red coloration without affecting white coloration, which is advantageous in avoiding cross-coloration in fresh food lighting. The wavelength corresponding to the second peak is 530 nm to 550 nm, and the distance from the first peak in the first red light wavelength band is large, so the red light coloration is less affected.

[0139] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes a yellow light wavelength band, with the wavelength range corresponding to the yellow light wavelength band being 585 nm to 630 nm, and the relative light power at the bottom of the yellow light band being less than 0.15. Specifically, the left side of the yellow light wavelength band connects to the green light wavelength band, and the right side connects to the red light wavelength band. The yellow light wavelength band is concave, meaning that the relative light power corresponding to the left and right sides of the yellow light wavelength band is higher than the relative light power corresponding to the central part. By setting the relative light power at the bottom of the yellow light band to less than 0.15, the generation of yellow light is further suppressed, the influence of yellow light on the red saturation of fresh meat is avoided, brown is also suppressed, and it is advantageous for the development of a red color relatively appropriate for fresh meat.

[0140] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes a blue light wavelength band, and the full width at half maximum (FMAX) of the blue light wavelength band is 15 nm to 30 nm. Specifically, the FMAX of the blue light wavelength band may be selected from 15 nm, 17 nm, 19 nm, 22 nm, 26 nm, 29 nm, 30 nm, etc., of which 15 nm is preferred, and the half-wavelength range is 435 nm to 465 nm. By setting the FMAX of the blue light wavelength band to 15 nm to 30 nm, the blue light wavelength band can produce white that meets the requirements of fresh food without affecting the red coloration of fresh food. It should be understood that if the FMAX of the blue light wavelength band is 15 nm or less, the manufacturing process is difficult and the wafer substrate is subject to strict requirements. When the full width at half maximum in the blue light wavelength band is 30 nm or more, the overall brightness of the wafer is significantly reduced, the white light becomes dissonant and appears bluish-white, which is detrimental to the appearance of freshness in white areas.

[0141] The peak in the blue light wavelength band is the third peak, with a relative light power of 0.3 to 0.5 corresponding to the third peak, and a wavelength of 445 nm to 455 nm corresponding to the third peak. Specifically, the relative light power of the third peak may be selected to be 0.3, 0.34, 0.39, 0.44, 0.5, etc. The wavelength corresponding to the third peak may be selected to be 445 nm, 447 nm, 449 nm, 451 nm, 452 nm, 454 nm, 455 nm, etc., of which 450 nm is preferred. Setting the relative light power of the third peak to 0.3 to 0.5 allows for good red color development without affecting white color development, which is advantageous in avoiding cross-coloring in fresh food lighting. The wavelength corresponding to the second peak is 445 nm to 455 nm, which allows for good white color development that meets the requirements of white parts of fresh food.

[0142] To accurately define the spectral radiation distribution, it should be understood that the relative light power corresponding to the first peak in the red light wavelength band is 0.9-1, the relative light power corresponding to the green light wavelength band is 0.2-0.4, and the relative light power corresponding to the third peak in the cyan light wavelength band is 0.3-5.

[0143] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes the blue light wavelength band, with the wavelength range corresponding to the blue light wavelength band being 465 nm to 515 nm, and the relative light power at the bottom of the blue light band being less than 0.1. Specifically, the left side of the blue light wavelength band is connected to the indigo light wavelength band, and the right side is connected to the green light wavelength band. The blue light wavelength band is concave, meaning that the relative light power corresponding to the left and right sides of the blue light wavelength band is higher than the relative light power corresponding to the central part. By making the relative light power at the bottom of the blue light band less than 0.1, the generation of blue light is suppressed, the effect of blue light on the red color of fresh food is avoided, and the effect of blue light on the white color of fresh food is avoided, which is advantageous for improving the freshness appearance of fresh meat.

[0144] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes a violet wavelength band, with the corresponding wavelength range being 350 nm to 420 nm, and the relative light power of the violet wavelength band being less than 0.1. Specifically, the violet wavelength band is connected to the left of the cyan wavelength band. The violet wavelength band decreases as the corresponding wavelength decreases (and then hardly changes after decreasing to a certain extent). By making the relative light power of the violet wavelength band less than 0.1, the probability of it appearing bluish-white is reduced, and the freshness appearance effect of white parts is further improved.

[0145] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes a second red light wavelength band adjacent to the first red light wavelength band, with the wavelength range corresponding to the second red light wavelength band being 680 nm to 780 nm, and the relative light power of the second red light wavelength band being less than 0.1. Specifically, the left side of the second red light wavelength band is connected to the first red light wavelength band. By making the relative light power of the second red light wavelength band less than 0.1, the saturation of red light is improved, and the freshness appearance effect of the red parts is enhanced.

[0146] In one embodiment, as shown in Figures 36 and 37, the material of the green medium 63 includes β-Sialon, the material of the blue light LED chip 62 includes gallium nitride (GaN), and the material of the red light LED chip 61 includes aluminum indium gallium phosphide (AlGaInP). It should be understood that the wavelength positions corresponding to the full width at half maximum and peaks in the red light wavelength band, blue light wavelength band, and green light wavelength band are determined by the above materials, which leads to the acquisition of white light that matches the normalized spectrogram provided by the embodiments of the present invention.

[0147] In one embodiment, the light-emitting unit further includes a sealing material 64 filled into a bowl-shaped cup 65, and the mixing ratio range of the green medium 63 and the sealing material 64 is 1:12 to 1:2. Specifically, the mixing ratio of the green medium 63 and the sealing material 64 may be selected as 1:12, 1:11, 1:10.5, 1:8, 1:6.5, 1:4.5, 1:3, 1:2, etc. The sealing material 64 and the green medium 63 are uniformly mixed by a stirrer, and the stirring conditions may be selected as 200s to 400s and a speed of 1000n / min to 2000n / min, which is advantageous for uniform mixing of the sealing material 64 and the green medium 63. After the mixture of sealing material 64 and green medium 63 is poured into the bowl-shaped cup 65 of the LED bracket 60, the mixture is cured by baking at 150°C for 3 to 4 hours to complete the package. It should be understood that by setting the mixing ratio of the green medium 63 and the encapsulant 64 to 1:12 to 1:2, it is advantageous for adjusting the heights (relative light power) of the first, second, and third peaks, and the spectral radiation distribution is more accurately defined.

[0148] In one embodiment, in the CIE1931 (also called the CIE1931 color space) chromaticity diagram, the distribution range of white light on the X axis is 0.31 to 0.39, the distribution range on the Y axis is 0.3 to 0.4, and the color temperature range of white light is 4000K to 7000K, specifically, the color temperatures are 4000K, 4300K, 4500K, 4900K, 5120K, 5870K, 6370K, and 700K. By setting the color temperature of white light to 4000K to 7000K, the freshness appearance effect of the light-emitting unit provided by the embodiment of the present invention is sufficiently demonstrated, and the light is easily adapted to the human eye without problems such as being too bright or too dark. Furthermore, the CIE1931 distribution of white light is relatively reasonable, leading to an improvement in the freshness appearance effect.

[0149] Another example of a light-emitting unit, as shown in Figures 39 and 40, includes an LED bracket 70, a blue light LED chip 71, a red medium 72, and a green medium 73. The LED bracket 70 has a bowl-shaped cup 75, the blue light LED chip 71 is placed in the bowl-shaped cup 75, and the red medium 72 and green medium 73 are mixed and filled into the bowl-shaped cup 75, covering the blue light LED chip 71. The blue light LED chip 71 excites the red medium 72 and green medium 73 and emits white light.

[0150] Optionally, the blue light LED chip 71 in this example may be in a fixed-mount or flip-up structure. For example, in the fixed-mount structure, the blue light LED chip 71 is fixed to the LED bracket 70 with chip fixing gel, and the chip fixing gel is completely cured by baking at 150°C for 1-2 hours. In the flip-up structure, the blue light LED chip 71 is fixed to the LED bracket 70 with high-temperature tin paste, and reflow soldering is performed. The maximum furnace temperature for reflow soldering is 290°C, the time is approximately 30 seconds, and it is necessary to perform the process in a nitrogen gas atmosphere to completely melt the solder and ensure complete adhesion between the blue light LED chip 71 and the LED bracket 70. In the case of the blue light LED chip 71 in the fixed-mount structure, a bonding wire process is required. Typically, the bonding wire is 0.9mil 80%Au, and an S or M wire arc process is employed. The arrangement and connection method of the bonding wires are determined by the combination of the structure of the LED bracket 70 and the structure of the blue light LED chip 71, and it is sufficient as long as circuit conductivity is achieved.

[0151] As shown in Figure 41, the normalized spectrogram of white light in this example satisfies the following conditions.

[0152] The spectrogram includes the red and green light wavelength bands. The full width at half maximum (FMAX) of the red light wavelength band is 80 nm to 100 nm, the peak in the red light wavelength band is the first peak, the relative optical power corresponding to the first peak is 0.75 to 0.95, and the wavelength corresponding to the first peak is 645 nm to 665 nm. The full width at half maximum (FMAX) of the green light wavelength band is 45 nm to 70 nm, the peak in the green light wavelength band is the second peak, and the wavelength corresponding to the second peak is 500 nm to 520 nm. Specifically, the full width at half maximum of the red light wavelength band may be selected from 80 nm, 84 nm, 86 nm, 89 nm, 94 nm, 96 nm, 100 nm, etc., preferably 100 nm, and the half-wavelength range is 610 nm to 710 nm. The relative optical power corresponding to the first peak may be selected from 0.75, 0.79, 0.84, 0.89, 0.93, 0.95, etc. The wavelength corresponding to the first peak may be 645nm, 646nm, 649nm, 653nm, 659nm, 663nm, 665nm, etc., and preferably 660nm. The full width at half maximum in the green light wavelength band may be 45nm, 46nm, 49nm, 53nm, 55nm, 61nm, 67nm, 69nm, 70nm, etc., and preferably 70nm, and the half-wavelength range is 480nm to 550nm. The wavelength corresponding to the second peak may be 500nm, 503nm, 509nm, 511nm, 516nm, 519nm, 520nm, etc.

[0153] When the full width at half maximum of the green light wavelength band is 45 nm or less, the process cost is relatively high, the colors tend to be disharmony, white tends to become a cross color, and it is unfavorable for restoring the color of the white parts of fresh meat. However, when the full width at half maximum of the green light wavelength band is 70 nm or more, the proportion of the green light wavelength band in the white light is too large, it interferes with the red light, red tends to become a cross color, and it is unfavorable for coloring the red parts of fresh meat. In the plan to use a blue light LED chip 71 to excite the red medium 72 and the green medium 73, the wavelength corresponding to the first peak of the excited red light wavelength band is 645 nm to 665 nm, the transmittance of red light is strong, the color of fresh food can be restored well, and the relative light power corresponding to the first peak is 0.75 to 0.95, resulting in a good red coloring effect. At the same time, the wavelength corresponding to the second peak in the green light wavelength band is 500nm to 520nm, and the full width at half maximum of the green light wavelength band is 45nm to 70nm. The green light wavelength band does not interfere easily with the red light wavelength band, and the generation of yellow light is minimal. This avoids the influence of yellow light on the red saturation of fresh meat, further improving the color restoration of fresh food lighting, suppressing brown tones that affect purchasing intent, and displaying a red color that is relatively appropriate for fresh meat.

[0154] In one embodiment, as shown in Figure 41, the relative light power corresponding to the second peak is 0.4 to 0.7. Specifically, the relative light power corresponding to the second peak may be selected to be 0.4, 0.5, 0.6, 0.7, etc. By setting the relative light power of the second peak to 0.4 to 0.7, red cross-coloring due to excessively high saturation of green light and white cross-coloring due to excessively low saturation can be avoided.

[0155] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes a yellow light wavelength band, with the wavelength range corresponding to the yellow light wavelength band being 560 nm to 590 nm, and the relative light power at the bottom of the yellow light band being 0.05 to 0.25. Specifically, the left side of the yellow light wavelength band is connected to the green light wavelength band, and the right side is connected to the red light wavelength band. The yellow light wavelength band is concave, meaning that the relative light power corresponding to the left and right sides of the yellow light wavelength band is higher than the relative light power corresponding to the central part. By setting the relative light power at the bottom of the yellow light band to 0.05 to 0.25, the generation of yellow light is further suppressed, the influence of yellow light on the red saturation of fresh meat is avoided, brown is also suppressed, and it is advantageous for the development of a red color relatively appropriate for fresh meat.

[0156] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes a blue light wavelength band, and the full width at half maximum (FMAX) of the blue light wavelength band is 15 nm to 30 nm. Specifically, the FMAX of the blue light wavelength band may be selected from 15 nm, 17 nm, 19 nm, 22 nm, 26 nm, 29 nm, 30 nm, etc., of which 15 nm is preferred, and the half-wavelength range is 435 nm to 465 nm. By setting the FMAX of the blue light wavelength band to 15 nm to 30 nm, the blue light wavelength band can produce white that meets the requirements of fresh food without affecting the red coloration of fresh food. It should be understood that if the FMAX of the blue light wavelength band is 15 nm or less, the manufacturing process is difficult and the wafer substrate is subject to strict requirements. When the full width at half maximum in the blue light wavelength band is 30 nm or more, the overall brightness of the wafer is significantly reduced, the white light becomes dissonant and appears bluish-white, which is detrimental to the appearance of freshness in white areas.

[0157] The peak in the blue light wavelength band is the third peak, the relative light power corresponding to the third peak is 0.9 to 1, and the wavelength corresponding to the third peak is 445 nm to 455 nm. Specifically, the relative light power of the third peak may be selected from 0.9, 0.91, 0.93, 0.96, 0.98, and 1, with 1 being preferred. The wavelength corresponding to the third peak may be selected from 445 nm, 447 nm, 449 nm, 451 nm, 452 nm, 454 nm, and 455 nm, with 450 nm being preferred. Setting the relative light power of the third peak to 0.9 to 1 allows for good red color development without affecting white color development, which is advantageous in avoiding cross-coloring in fresh food lighting. The wavelength corresponding to the third peak is 445 nm to 455 nm, which allows for good white color development that meets the requirements of white parts of fresh food.

[0158] To accurately define the spectral radiation distribution, it should be understood that the relative light power corresponding to the first peak in the red light wavelength band is 0.75-0.95, the relative light power corresponding to the green light wavelength band is 0.4-0.7, and the relative light power corresponding to the third peak in the cyan light wavelength band is 0.9-1.

[0159] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes the blue light wavelength band, with the wavelength range corresponding to the blue light wavelength band being 460 nm to 490 nm, and the relative light power at the bottom of the blue light band being 0.15 to 0.35. Specifically, the left side of the blue light wavelength band is connected to the indigo light wavelength band, and the right side is connected to the green light wavelength band. The blue light wavelength band is concave, meaning that the relative light power corresponding to the left and right sides of the blue light wavelength band is higher than the relative light power corresponding to the central part. By setting the relative light power at the bottom of the blue light band to 0.15 to 0.35, the generation of blue light is suppressed, the effect of blue light on the red color of fresh food is avoided, and the effect of blue light on the white color of fresh food is avoided, which is advantageous for improving the freshness appearance of fresh meat.

[0160] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes a violet wavelength band, with the corresponding wavelength range being 350 nm to 420 nm, and the relative light power of the violet wavelength band being less than 0.1. Specifically, the violet wavelength band is connected to the left of the cyan wavelength band. The violet wavelength band decreases as the corresponding wavelength decreases (and then hardly changes after decreasing to a certain extent). By making the relative light power of the violet wavelength band less than 0.1, the probability of it appearing bluish-white is reduced, and the freshness appearance effect of white parts is further improved.

[0161] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes the infrared wavelength band adjacent to the red light wavelength band, with wavelengths corresponding to the infrared wavelength band exceeding 780 nm, and the relative light power of the infrared wavelength band being less than 0.1. Specifically, the left side of the infrared wavelength band is connected to the red light wavelength band. By making the relative light power of the infrared wavelength band less than 0.1, the saturation of the red light is improved, which enhances the freshness appearance of the red parts.

[0162] In one embodiment, as shown in Figure 41, the material of the red medium 72 includes a nitride, the material of the green medium 73 includes β-Sialon and / or a silicate, and the material of the blue light LED chip 71 includes gallium nitride (GaN). Specifically, the green medium 73 may contain only one of β-Sialon and a silicate, or it may contain both β-Sialon and a silicate. It should be understood that the wavelength positions corresponding to the full width at half maximum and peaks in the red light wavelength band, blue light wavelength band, and green light wavelength band are determined by the above materials, which leads to the acquisition of white light that matches the normalized spectrogram provided by the embodiments of the present invention.

[0163] In one embodiment, as shown in Figure 41, the ratio range of the red medium 72 to the green medium 73 is 1:13 to 1:4. Specifically, the ratio of the red medium 72 to the green medium 73 may be selected from 1:13, 1:12, 1:9, 1:7, 1:6, 1:5, 1:4.5, 1:4, etc. By appropriately adjusting the mixing ratio of the red medium 72 to the green medium 73, it is advantageous to adjust the heights (relative light power) of the first, second, and third peaks, and the emission distribution of the spectrum is accurately defined.

[0164] In one embodiment, as shown in Figure 41, the light-emitting unit further includes a sealant 50 filled in a bowl-shaped cup 75. The mixing ratio range of the mixture of the red medium 72 and the green medium 73 to the sealant 50 is 1:8 to 1:1.8. Specifically, the ratio of the mixture of the red medium 72 and the green medium 73 to the sealant 50 may be selected as 1:8, 1:7, 1:6, 1:5.5, 1:5, 1:4.5, 1:3, 1:2, and 1:1.8. The mixture of the red medium 72 and the green medium 73 and the sealant 50 are uniformly mixed by a stirrer, and the stirring conditions may be selected as 200s to 400s and a speed of 1000n / min to 2000n / min, which is advantageous for uniform mixing of the sealant 50 and the green medium 73. Furthermore, after the mixture of the encapsulant 50 and the green medium 73 is poured into the bowl-shaped cup 75 of the LED bracket 70, the mixture is cured by baking at 150°C for 3-4 hours, completing the package. It should be understood that a mixing ratio of 1:12 to 1:2 between the green medium 73 and the encapsulant 50 is advantageous for adjusting the heights of the first, second, and third peaks, and that the spectral radiation distribution is more accurately defined.

[0165] In one embodiment, in the CIE1931 chromaticity diagram, the distribution range of white light on the X-axis is 0.32 to 0.38, the distribution range on the Y-axis is 0.275 to 0.34, and the color temperature range of white light is 4000K to 6200K. Specifically, the color temperature may be selected from 4000K, 4230K, 4500K, 4900K, 5120K, 5530K, 5870K, 6200K, etc. By setting the color temperature of white light to 4500K to 8000K, the freshness appearance effect of the light-emitting unit provided by the embodiment of the present invention is sufficiently demonstrated, and the light is easily adapted to the human eye without problems such as being too bright or too dark. Furthermore, the CIE1931 chromaticity range of white light is relatively reasonable, ensuring the freshness appearance effect. [Examples]

[0166] Currently, backlight modules are used to provide a light source to display units as one of the key components. With the development trends in display units being weight reduction, thinning, power saving, and HDR (High-Dynamic Range), these needs require LED light-emitting units in backlight modules to have performance characteristics such as small dimensions, high brightness, and a large emission angle. In conventional LED light-emitting units, the emission angle of the LED chip is limited by the LED bracket, which affects the overall luminous brightness and emission angle of the LED light-emitting unit. If brightness and emission angle are increased by increasing the light mixing distance from the light-emitting surface of the LED chip to the emission surface of the backlight module or by adding LEDs, the requirements for weight reduction, thinning, and power saving of the display device cannot be met. Therefore, how to increase the emission angle of the LED light-emitting unit is an urgent problem that needs to be solved.

[0167] To address the above-mentioned problems, this embodiment provides a light-emitting unit with an improved emission angle, which includes an LED chip and an LED bracket. The LED bracket in this embodiment may be the LED bracket shown in each of the above embodiments, or it may be an LED bracket having another bowl-shaped cup structure, and this embodiment is not limited to the LED bracket. In this embodiment, the LED chip is provided at the bottom of the bowl-shaped cup of the LED bracket, and the positive and negative electrodes of the LED chip are electrically connected to two conductive regions, respectively. The light-emitting unit further includes a package layer provided in a bowl-shaped cup, which includes a first encapsulating layer and a second encapsulating layer that are filled in sequence. The first encapsulating layer covers the LED chip, and the surface of the second encapsulating layer away from the LED chip has a spherical projection. Light emitted from the surface of the LED chip is refracted out of the LED device through the first encapsulating layer and the spherical projection of the second encapsulating layer. Because the surface of the second encapsulating layer away from the LED chip has a spherical projection, the emission angle of the LED device is increased, and the overall emission angle is further increased. Simultaneously with the increase in emission angle, the luminescence brightness of the LED device is improved. For ease of understanding, this embodiment will be described below with reference to several examples shown in the drawings.

[0168] As shown in Figure 42, the light-emitting unit provided by this embodiment includes an LED bracket 8, which includes a positive electrode substrate 81 (i.e., one conductive region), a negative electrode substrate 82 (i.e., the other conductive region), and an isolation region 83 that insulates and isolates the positive electrode substrate 81 and the negative electrode substrate 82, and further includes an LED chip 84, the package of the LED bracket 8 is provided on the surfaces of the positive electrode substrate 81 and the negative electrode substrate 82 and surrounds them to form a bowl-shaped cup, the LED chip 84 is provided on at least one of the substrates of the positive electrode substrate 81 and the negative electrode substrate 82, and the LED bracket 8 and the positive electrode substrate A first sealing layer 85 and a second sealing layer 86 are sequentially filled into a bowl-shaped structure formed by the plate 81 and the negative electrode substrate 82. The first sealing layer 85 covers the LED chip 84, and the surface of the second sealing layer 86 away from the LED chip 84 has a spherical protruding shape. Moisture is isolated by the first sealing layer 85 and the second sealing layer 86, protecting the LED chip 84. At the same time, the light emitted from the LED chip 84 is refracted, reflected, and diffusely reflected by the first sealing layer 85 and the second sealing layer 86, causing the light emitted from the surface of the LED chip 84 to be refracted toward the periphery, thereby increasing the emission angle of the light-emitting unit.

[0169] In this example, as shown in Figure 42, the second sealing layer 86 completely covers the first sealing layer 85. The first sealing layer 85 and / or the second sealing layer 86 may be transparent gel layers formed by the curing of a transparent gel. This transparent gel includes, but is not limited to, epoxy resin, silica gel, silicone resin, etc. Of course, the first sealing layer 85 and / or the second sealing layer 86 may also be fluorescent gel layers formed by mixing and curing a transparent gel with fluorescent powder.

[0170] In this example, the positive electrode substrate 81 and the negative electrode substrate 82 are conductive substrates. The conductive substrate in this embodiment may be a substrate made of various conductive materials, for example, various metal conductive substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, and silver substrates. The conductive substrate may also be a mixed material conductive substrate containing conductive materials, for example, conductive rubber. It should be understood that the LED chip 84 is fixed to at least one conductive substrate by a chip fixing gel such as silver paste or insulating adhesive. The LED chip 84 may be a standard LED chip, in which case it is electrically connected to the substrate by bonding wires, or it may be a flip LED chip, in which case it is electrically connected to the substrate by a eutectic process. The light-emitting surface of the LED chip 84 is covered with a reflective layer of various thicknesses, and by employing reflective layers of various materials and thicknesses as needed, the ejection half-width angle of the chip is increased, and the ejection angle of the light-emitting unit is further increased.

[0171] In this example, as shown in Figure 42, the height h of the bowl-shaped structure formed by the LED bracket 8, positive electrode substrate 81, and negative electrode substrate 82 of the first encapsulating layer 85 does not exceed the package height H. Since the first encapsulating layer 85 covers the LED chip 84, it should be understood that the minimum height h of the bowl-shaped structure of the first encapsulating layer 85 exceeds the height h1 of the LED chip 84. In some application scenarios, the minimum height h of the bowl-shaped structure of the first encapsulating layer 85 covers the bonding wires, and when the bonding wires are covered, the LED chip 84 is also covered. In this case, the first encapsulating layer 85 completely covers the LED chip 84, refracting and diffusely reflecting the light emitted from the surface of the LED chip 84 to the second encapsulating layer 86 and the LED bracket 8, respectively, thereby increasing the light emission angle of the LED chip 84.

[0172] In another example of this embodiment, as shown in Figure 43, the upper surface of the first sealing material layer 85 and the upper surface of the LED bracket are at the same height.

[0173] In some examples of this embodiment, the surface of the first encapsulant layer 85 away from the LED chip 84 may be an arc-shaped surface that recesses into the LED chip 84. The recessed arc-shaped surface of the first encapsulant layer 85 changes the angle of reflection and refraction of light, allowing light to be easily emitted to the LED bracket 8 and the second encapsulant layer 86. This makes the emission of light from the light-emitting unit more uniform, and as shown in Figures 43 and 44, the emission angle of light from the light-emitting unit is further increased. In the case of recessing into the first encapsulant layer 85, the minimum height is the same as the height of the LED chip 84. It should be understood that the first encapsulant layer 85 may recess directly from the position where it contacts the LED bracket 8, or it may be held horizontally at a certain distance from the transparent bracket before recessing. In some examples, the first encapsulant layer 85 has a horizontal structure and does not recess.

[0174] In some examples of this embodiment, as shown in Figure 45, the width E of the second sealing layer 86 is less than or equal to the width e of the upper surface of the bowl-shaped structure, so the second sealing layer 86 is limited to the bowl-shaped structure of the light-emitting unit, improving its bonding strength, and since the width E of the second sealing layer 86 is at least the width E1 of the surface of the first sealing layer 85 that is away from the LED chip 84, the first sealing layer 85 is completely covered, and the LED chip 84 is completely covered by the first sealing layer 85, so that the light emitted from the surface of the LED chip 84 is separated from the second sealing layer 86 and It should be understood that the emission angle of the light from the LED chip 84 increases as the light is refracted and diffusely reflected by the LED bracket 8, refracted by the first sealing layer 85 to the second sealing layer 86, and further refracted and diffusely reflected by the second sealing layer 86. As shown in Figures 43 and 44, when the first sealing layer 85 is recessed, one side of the second sealing layer 86 that approaches the first sealing layer 85 protrudes toward the first sealing layer 85, and the position of the protrusion coincides with the position of the recess in the first sealing layer 85.

[0175] The surface of the second encapsulating layer 86 away from the LED chip 84 has a spherical protruding shape, forming a convex lens shape and diverging light, which increases the light emission angle of the light-emitting unit. It should be understood that the height of the second encapsulating layer 86 is not limited, that is, the radian of the protruding second encapsulating layer 86 is not limited, and preferably, as shown in Figure 44, the height k of the second encapsulating layer 86 itself does not exceed the height K of the LED bracket 8, thereby keeping the protruding radian of the second package within a reasonable range. In some examples of this embodiment, the refractive index of the first sealing layer 85 is greater than that of the second sealing layer 86, and the refractive index of the second sealing layer 86 is greater than that of air. As a result, the light emitted from the LED chip 84 is refracted by the first sealing layer 85 to reach the second sealing layer 86, and then refracted outwards by the second sealing layer 86. Consequently, much of the light emitted directly in front of the LED chip 84 is refracted to the periphery, increasing the emission angle of the light-emitting unit, which can reach a maximum emission angle of 180°.

[0176] In some examples of this embodiment, the package formed in the bowl-shaped cup of the LED bracket 8 may be a transparent bracket, but is not limited thereto. That is, the LED bracket 8 may be made of a transparent material, such as a transparent resin, a transparent thermoplastic such as PPA (Polyphthalamide), or a transparent thermosetting plastic such as EMC (Epoxy Molding Compound). The emission angle of the light-emitting unit is further increased by allowing the light emitted from the LED chip 84 to directly pass through the LED bracket 8 and reach the outside. In some cases, it should be understood that the LED bracket 8 may use materials used for opaque brackets, such as epoxy resins (EP, Epoxideresin), high-temperature resistant nylon (PPA plastic), polyphthalamide (PPA, Polyphthalamide), poly-1,4-cyclohexylenedimethyleneterephthalate (PCT, Poly1,4-cyclohexylenedimethyleneterephthalate), liquid crystal polymer (LCP, Liquid Crystal Polymer), sheet molding compound (SMC, Sheetmolding compound), epoxy molding compound (EMC, Epoxy molding compound), unsaturated polyester (UP) resin, polyethylene terephthalate (PET, Polyethylene terephthalate), polycarbonate (PC, Polycarbonate), polyhexamethylene adipoamide (nylon66), and glass fiber.

[0177] In some examples of this embodiment, a DBR (distributed Bragg reflector) is provided on the LED chip 84. For example, the DBR is applied to the front of the LED chip 84, reducing the light emission from the front and increasing the light emission area from the side walls, thereby further increasing the emission angle. Furthermore, by combining this with a transparent LED bracket 8, the light emission efficiency of the side walls of the light-emitting unit is further improved, resulting in an overall improvement in light emission efficiency.

[0178] In some examples of this embodiment, the upper surface of the LED bracket 8 is zigzag C, and as shown in Figures 46 and 47, the zigzag shape of the upper surface of the LED bracket 8 enhances the bonding ability between the second sealing material layer 86 and the LED bracket 8 when they are bonded together. At the same time, the zigzag shape of the upper surface of the LED bracket 8 suppresses the fluidity of the second sealing material layer 86, thereby achieving the objective of controlling the molding of the second sealing material layer 86.

[0179] In some examples of this embodiment, the LED chip 84 includes at least one of the following: a red light LED chip, a green light LED chip, a blue light LED chip, and a yellow light LED chip. The specific chip can be freely configured according to the application requirements and will not be described in detail here.

[0180] In some examples of this embodiment, an insulating region 83 is further included, and the insulating region 83 is provided in an insulating isolation zone, but it is not limited to these, and it should be understood that the insulating isolation zone is located between the positive electrode substrate 81 and the negative electrode substrate 82, insulating and isolating the two, and the material of the insulating isolation zone may be homologous to or different from the material of the LED bracket 8.

[0181] To better understand, this embodiment provides a more specific example to describe the light-emitting unit. As shown in Figure 48, the first encapsulating layer 85 covers the LED chip 84, the upper surface of the first encapsulating layer 85 is at the same height as the upper surface of the LED bracket, and the surface of the first encapsulating layer 85 away from the LED chip 84 is an arc-shaped surface that recesses into the LED chip 84. The width of the second encapsulating layer 86 is the same as the width of the upper surface of the bowl-shaped structure, completely covering the first encapsulating layer 85, and one side of the surface of the second encapsulating layer 86 that approaches the first encapsulating layer 85 protrudes into the first encapsulating layer 85, with the protruding position and the recessed position coinciding. The surface of the second encapsulating layer 86 away from the LED chip 84 has a spherical protruding shape, forming a convex lens shape and diverging light, further increasing the light emission angle of the light-emitting unit.

[0182] This embodiment further provides a light-emitting assembly, which may be a backlight module, but is not limited to this, and includes a drive circuit and the light-emitting unit, the drive circuit being connected to the light-emitting unit, and the backlight module having a larger light emission angle, thereby improving its color rendering effect, and by providing fewer light-emitting units under the assumption of the same circuit board area, the same or even better color rendering effect can be obtained, and the cost is lower. This embodiment further provides a display unit that includes the backlight module and a back plate, the drive circuit and light-emitting unit of the backlight module being provided on the back plate. [Examples]

[0183] This embodiment provides a light-emitting assembly, which may be a backlight module, a lighting module, or the like, but is not limited thereto, and includes a circuit board and a light-emitting unit provided on the circuit board and electrically connected to a circuit corresponding to the circuit board. The light-emitting unit in this embodiment may be the light-emitting unit shown in each of the above embodiments, or a light-emitting unit of other structures (for example, a bracketless LED), and this embodiment does not limit the light-emitting unit.

[0184] When the light-emitting assembly is a backlight module, the backlight module has a wide range of applications in foldable displays. In conventional backlight modules, during the repeated folding and recovery processes of foldable displays, a relative offset of the flexible printed circuit board used in the backlight module with respect to the back support plate is likely to occur, resulting in a portion of the backlight module remaining unprotected by the support plate. To address this problem, one example of this embodiment provides a backlight module that can solve this problem, wherein the circuit board of the backlight module in this example is a flexible printed circuit board, the backlight module further includes a support plate and a magnetic sheet, the flexible printed circuit board includes a reinforcing plate and a base plate, the reinforcing plate is fixed to the base plate, a support groove is provided in the support plate, and at least a portion of the reinforcing plate is housed in the support groove, that is, the entire reinforcing plate may be located within the support groove, or only a portion of it may be located within the support groove and the rest outside the support groove. An open end facing the base plate is provided in the support groove, the open end of the support groove is covered by the base plate, and a groove bottom surface is further provided in the support groove, the magnetic sheet is fixed to the groove bottom surface, the magnetic sheet and the reinforcing plate are provided facing each other in parallel, and the magnetic sheet and the reinforcing plate are fitted together by magnetism, so that in the process of repeated bending and recovery from bending, the flexible printed circuit board and the support plate are restored to the state before bending by the two magnets that are attracted to each other by magnetism, and the structural stability of the backlight module is improved. For ease of understanding, this embodiment will be described below with reference to the example shown in the drawings.

[0185] In one example, the thickness of the support plate is set to be greater than the height of the support groove, the support plate is placed in the support groove, and the top surface of the support plate protrudes from the support groove and is located outside the support groove, thereby creating a certain gap between the flexible printed circuit board and the support plate. This gap can provide a certain amount of space for the flexible printed circuit board and the support plate to recover from bending and strain during the bending process, or it can reduce the frictional force when the two come into contact during the bending process.

[0186] In another example, as shown in Figures 49 and 50, the flexible printed circuit board 90 includes a base plate 901, a bonding pad 903, a light-emitting unit 904, and a reinforcing plate 905. The base plate 901 includes a welded portion 902, which has a first surface 9021 and a second surface 9022 facing away from the first surface 9021. The bonding pad 903 is fixed to the first surface 9021, the light-emitting unit 904 is fixed to the first surface 9021, the pin pairs of the light-emitting unit 904 are stack-welded to the corresponding bonding pad 903, and the reinforcing plate 905 is in close contact with the second surface 9022 of the welded portion 902, with the reinforcing plate 905 and the bonding pad 903 being provided in correspondence.

[0187] The flexible printed circuit board 90 can be bent and conduct electricity. In conventional technology, the method of fixing the light-emitting unit 904 to the flexible printed circuit board 90 is generally to fix the pins at both ends of the device to the flexible printed circuit board 90. However, during the bending process of the flexible printed circuit board 90, the bending strength of the light-emitting unit 904 is weaker than the bending force required to bend the flexible printed circuit board 90. Since the flexible printed circuit board 90 does not protect the light-emitting unit 904 from bending, the light-emitting unit 904 is prone to breaking under repeated bending. In this embodiment, the reinforcing plate 905 is attached to one side of the flexible printed circuit board 90 away from the light-emitting unit 904. The reinforcing plate 905 is made of a rigid material, and as the reinforcing plate 905 is attached to the welded portion 902, the bending force required to bend the flexible printed circuit board 90 is transmitted to the reinforcing plate 905. The internal stress of the reinforcing plate 905 is used to counteract the bending force required to bend the flexible printed circuit board 90, preventing bending of the welded portion 902. The light-emitting unit 904 is fixed to the first surface 9021, and the light-emitting unit 904 and the reinforcing plate 905 are provided in correspondence, so that the light-emitting unit 904 on the first surface 9021 does not break. Because the hardness of the welded portion 902 is increased by the reinforcing plate 905, the light-emitting unit 904 fixed to the welded portion 902 is not subjected to bending force, and the light-emitting unit 904 does not break due to bending of the flexible printed circuit board 90.

[0188] The flexible printed circuit board 90 includes a conductive layer 906, which is provided on the first surface 9021, and the light-emitting units 904 arranged in an array are electrically connected by the conductive layer 906. The function of the conductive layer 906 is to enable the leads of the electrodes of the light-emitting units 904. In this embodiment, the material of the conductive layer 906 may be tin, which performs the conductive function well and allows the bonding pad 903 and the base plate 901 to be easily welded and fixed. Of course, it may be replaced with other conductive materials such as silver, copper, aluminum, or gold.

[0189] In some examples of this embodiment, the reinforcing plate 905 may be made of a magnetic material. The advantage of this is that a metal material corresponding to the external equipment is provided, so when the flexible printed circuit board 90 is attached to the external equipment, conventional screw or adhesive mounting methods are not used. Because the reinforcing plate 905 has magnetic attraction, the flexible printed circuit board 90 is directly attached to the support plate 912. Compared to conventional mounting methods, the reinforcing plate 905 is easier to install, the process is simpler, materials are saved, and there is no need to add other fixing parts, thus reducing production costs.

[0190] In this embodiment, when the flexible printed circuit board 90 is applied to a foldable screen, certain stretching characteristics are required due to the characteristics of the foldable screen, and it is also necessary that the flexible printed circuit board 90 is not damaged. When the flexible printed circuit board 90 is bent or folded after being fixed to the support plate by a conventional adhesive fixing method, the welded parts 902 are subjected to relatively large tensile forces, and there is a possibility that the circuits of the flexible printed circuit board 90 may be cut. In this embodiment, the reinforcing plate 905 is made of a magnetic material, and the reinforcing plate 905 is fixed to the support plate 912 by magnetic adsorption, and the multiple welded parts 902 are fixed to the support plate 912 by magnetic adsorption. When the screen is bent or folded, the reinforcing plate 905 fixed by magnetic adsorption has a better cushioning effect compared to adhesive fixing, and can also provide a protective effect to the flexible printed circuit board 90.

[0191] As shown in Figure 51, the present invention further provides a light-emitting assembly which may be a backlight module 91, the backlight module 91 comprising a flexible printed circuit board 90, a support plate 912, and a magnetic sheet 913, the flexible printed circuit board 90 comprising a reinforcing plate 905 and a base plate 901, the reinforcing plate 905 being fixed to the base plate 901, the support plate 912 being provided with a support groove 9121, at least a portion of the reinforcing plate 905 being housed in the support groove 9121, the support groove 9121 being provided with an open end facing the base plate 901, the open end of the support groove 9121 being covered by the base plate 901, the support groove 9121 being further provided with a groove bottom surface 9124, the magnetic sheet 913 being fixed to the groove bottom surface 9124, the magnetic sheet 913 and the reinforcing plate 905 being arranged parallel to each other facing each other in the front, and the magnetic sheet 913 and the reinforcing plate 905 being magnetically fitted together. The support plate 912 is for fixing the flexible printed circuit board 90. In the prior art, the support plate 912 is directly in close contact with the flexible printed circuit board 90 for fixing. Therefore, when applied to a folding screen or a curved screen, the support plate 912 can easily cause the flexible printed circuit board 90 to crack, which is a major potential defect for product quality. In this embodiment, the support plate 912 is provided with a plurality of support grooves 9121, which correspond to a plurality of welded portions 902 of the flexible printed circuit board 90, and the groove bottom surface 9124 of the support grooves 9121 is parallel to the second surface 9022. The flexible printed circuit board 90 is mounted in correspondence with the support plate 912, and the magnetic sheet 913 is made of a magnetic material. In this embodiment, the magnetic sheet 913 may be made of magnets. The magnetic poles of the surface of the magnetic sheet 913 facing the reinforcing plate 905 are opposite to the magnetic poles of the reinforcing plate 905. That is, the north pole surface of the magnetic sheet 913 faces the south pole of the reinforcing plate 905, or the south pole surface of the magnetic sheet 913 faces the north pole of the reinforcing plate 905. The surface of the magnetic sheet 913 facing away from the reinforcing plate 905 is fixed in close contact with the groove bottom surface 9124. Because there is a magnetic force between the magnetic sheet 913 and the reinforcing plate 905 that attracts each other, the flexible printed circuit board 90 is fixed to the support plate 912.In one embodiment, the magnetic sheet 913 is fixed to the support plate 912, and the reinforcing plate 905 is fixed to the light-emitting unit 904. The reinforcing plate 905 and the magnetic sheet 913 are fixed by magnetic attraction, and the reinforcing plate 905 and the magnetic sheet 913 are in close contact with each other. The fixing of the reinforcing plate 905 and the magnetic sheet 913 fixes the relative position of the light-emitting unit 904 and the support plate 912, thereby improving the structural stability of the product.

[0192] As shown in Figure 51, the magnetic sheet 913 and the reinforcing plate 905 are spaced apart. The support groove 9121 has a groove side surface 9122 on its side wall that approaches the groove opening, and further has a plate contact surface 9123 that is connected to the groove side surface 9122 and located between the groove opening and the groove bottom surface of the support groove 9121. As shown in the figure, in this example, the plate contact surface 9123 is formed as a stepped surface, there is a gap between the plate contact surface 9123 and the groove bottom surface 9124, there is a gap between the reinforcing plate 905 and the groove side surface 9122, and the reinforcing plate 905 is in close contact with the plate contact surface 9123. There is an attractive force between the support plate 912, the reinforcing plate 905, and the magnetic sheet 913. When the support plate 912 is bent, the flexible printed circuit board 90 is subjected to a deflection force, causing a tendency for the flexible printed circuit board 90 to move relative to the support plate 912. In this case, a deflection magnetic attraction force is generated by the magnetic attraction force to counteract the deflection force. As the support plate 912 is bent, the deflection force received by the flexible printed circuit board 90 increases, and if the deflection force received by the flexible printed circuit board 90 becomes greater than the deflection magnetic attraction force between the flexible printed circuit board 90 and the magnetic sheet 913, the flexible printed circuit board 90 and the support plate 912 are displaced.

[0193] As the bending operation of the backlight module 91 is completed and the backlight module 91 returns to a flat position, there is a deflection magnetic attraction force between the magnetic sheet 913 and the reinforcing plate 905, guiding the light-emitting unit 904 and the support plate 912 to return to their relative positions when facing each other from the front. The magnetic attraction force between the magnetic sheet 913 and the reinforcing plate 905 acts as a guide for the light-emitting unit 904 and the support plate 912. Compared to the prior art, in this embodiment, a support groove 9121 is provided on the support plate 912 corresponding to the welded portion 902, and a magnetic sheet 913 is added to accommodate the support groove 9121. This embodiment is more eco-friendly, does not require an encapsulation process, reduces production costs, and the flexible printed circuit board 90 is fixed to the support plate 912 by magnetic attraction. If the flexible printed circuit board 90 and the support plate 912 are directly aligned, assembly is completed and the installation process is simplified.

[0194] The purpose of providing the groove side surface 9122 and the plate contact surface 9123 is that when the flexible printed circuit board 90 and the support plate 912 are shifted, the flexible printed circuit board 90 moves along a plane parallel to the magnetic sheet 913, and the plate contact surface 9123 is in close contact with the reinforcing plate 905, that is, the reinforcing plate 905 is positioned between the flexible printed circuit board 90 and the plate contact surface 9123 and groove side surface 9122. When the reinforcing plate 905 moves relative to the support plate 912, the flexible printed circuit board 90 moves along a direction parallel to the second surface 9022 while following the reinforcing plate 905, ensuring close contact between the flexible printed circuit board 90 and the support plate 912, and avoiding situations such as uneven display or light spots on the folding screen or curved screen during this process.

[0195] In this embodiment, the reinforcing plate 905 is provided with a third surface 9051 and a fourth surface 9052. The third surface 9051 is in close contact with the second surface 9022 of the flexible printed circuit board 90, and the fourth surface 9052 faces the magnetic sheet 913 directly. The magnetic sheet 913 is provided with a fifth surface 9131 and a sixth surface 9132. The fifth surface 9131 faces the reinforcing plate 905, and the sixth surface 9132 is in close contact with the groove bottom surface 9124. In this embodiment, the area of ​​the fifth surface 9131 is smaller than the area of ​​the fourth surface 9052. Its function is to increase the magnetic range between the reinforcing plate 905 and the magnetic sheet 913, and to increase the range over which the reinforcing plate 905 receives the attractive force of the magnetic sheet 913. The relative range of movement between the flexible printed circuit board 90 and the support plate 912 is increased, and the degree to which the folding screen or curved screen bends is also increased.

[0196] In this embodiment, the contact area between the reinforcing plate 905 and the flexible printed circuit board 90 is the third surface 9051, meaning that the area of ​​the third surface 9051 is the protective area of ​​the reinforcing plate 905 over the flexible printed circuit board 90. Therefore, increasing the area of ​​the third surface 9051 enhances protection over the flexible printed circuit board 90, but is disadvantageous for folding the backlight module 91. In this embodiment, the protective area of ​​the reinforcing plate 905 faces the light-emitting unit 904 directly, meaning that the area of ​​the third surface 9051 corresponds to the area of ​​the bonding pad 903. During the use of the backlight module 91, a good folding effect is achieved, and the protection of the reinforcing plate 905 over the light-emitting unit 904 is not affected.

[0197] This embodiment further provides an electronic device, as shown in Figures 52 and 53, wherein the electronic device 92 further includes a control circuit board 95 and a case 93, the control circuit board 95 is housed in the case 93, both control circuit boards 95 are electrically connected to the backlight module 91, the control circuit board 95 is electrically connected to the flexible printed circuit board 90, the case 93 is provided with a first edge side 935, the support plate 912 is provided with a second edge side 9126 facing the first edge side 935 in the front, and the second edge side 9126 is fixed to the first edge side 935.

[0198] The electronic device 92 further includes an actuator 94 located on one side of the control circuit board 95 that is separated from the flexible printed circuit board 90, and the actuator 94 adjusts the voltage received by the electronic device 92.

[0199] In this embodiment, the electronic device 92 may be a television, tablet, or mobile phone. The backlight module 91 is mainly applied to electronic devices 92 having a foldable screen or a curved screen. For example, if the electronic device 92 is a mobile phone, the case 93 is provided corresponding to the foldable area of ​​the backlight module 91, and during the user's use, the backlight module 91 is folded together with the case 93, enabling the opening and closing of the electronic device 92. Compared to the prior art, the reinforcing plate 905 in the backlight module 91 allows the backlight module 20 to be repeatedly folded, the light-emitting unit 904 on the flexible printed circuit board 90 is not damaged, the lifespan of the backlight module 91 is increased, and the quality of the electronic device 92 is improved. [Examples]

[0200] During the use of a light-emitting assembly, the light-emitting unit generates a large amount of heat, making heat dissipation a crucial consideration in the design process. For example, in conventional technology, a heat conductor is provided on the surface of the LED chip, and heat is dissipated from the heat conductor by forced convection using a fan, or heat exchange is performed by water cooling using a pump. However, additional energy is required during the heat dissipation process. To address this problem, another example of this embodiment further provides an energy-saving light-emitting assembly with good heat dissipation performance. The circuit board of this light-emitting assembly may be a flexible printed circuit board as in the above example, or a rigid circuit board. The circuit board is not limited in this example.

[0201] The light-emitting assembly in this example further includes a drive chip and a self-oscillating heat pipe. The circuit board includes a bead lamp region and a drive chip region. The light-emitting unit and the drive chip are provided in the bead lamp region and the drive chip region, respectively. The evaporation section of the self-oscillating heat pipe is provided in the drive chip region. A working medium is provided inside the self-oscillating heat pipe, and the working medium in the evaporation section moves away from the drive chip, approaching the condensation section of the self-oscillating heat pipe. Heat from the drive chip region is conducted by the self-oscillating heat pipe to the condensation section away from the drive chip, dissipating heat. Furthermore, the heat exchange mode of the self-oscillating heat pipe is passive heat exchange, and it does not need to be driven externally. It can operate using only the heat from the drive chip region, saving energy and providing excellent heat conduction. For ease of understanding, this embodiment will be described below with reference to the example shown in the drawings.

[0202] The light-emitting assembly provided in this embodiment includes a circuit board 101 and a self-oscillating heat pipe 104, as shown in Figures 54 to 60.

[0203] The circuit board 101 includes a bead lamp area and a drive chip area, and a plurality of light-emitting units 102 are provided in the bead lamp area. The light-emitting units 102 may be the light-emitting units 102 shown in each of the above embodiments, or other light-emitting units 102 may be used. For example, LED chips or LED bead lamps of other structures may be directly used. These light-emitting units 102 include, but are not limited to, light-emitting units of various colors, and the light-emitting units 102 may be arranged in an LED array, or other arrangement methods may be used, which will not be described in detail here. The drive chip area includes a drive chip 103 for driving the light-emitting units 102 to emit light, but is not limited to these, and other chips may be provided in the drive chip area, or it may include one or more drive chips 103.

[0204] In some application examples, as shown in Figure 54, the circuit board 101 is a double-sided circuit board and includes a bead lamp area on which arrayed light-emitting units 102 are provided, and a drive chip area on which a drive chip is provided in the center of one side of the circuit board 101, with the drive chip and light-emitting units 102 each arranged on both sides of the circuit board 101. Multiple drive chips 103 are provided on the circuit board 101, and the drive chips 103 are connected to the light-emitting units 102 by the circuit pattern on the circuit board 101 and drive the light-emitting units 102.

[0205] As shown in Figure 55, the light-emitting assembly of this embodiment further includes a self-oscillating heat pipe 104, the evaporation section of which is located in the drive chip region, and the working medium in the evaporation section within the self-oscillating heat pipe 104 moves away from the drive chip 103 and approaches the condensation section of the self-oscillating heat pipe 104. The evaporation section of the self-oscillating heat pipe is located in the drive chip region and is used to dissipate heat emitted from devices such as the drive chip 103 in the drive chip region. It should be understood that the drive chip 103 typically emits a large amount of heat, and the region of the light-emitting assembly where devices such as the drive chip 103 are located is also a relatively high-temperature region in the light-emitting assembly. Since the condensation section of the self-oscillating heat pipe 104 is located away from the drive chip 103, the condensation section is in a relatively low-temperature region, and the heat conducted by the self-oscillating heat pipe 104 is effectively released. As shown in Figure 56, inside the self-excited vibrating heat pipe 104, a working medium composed of liquid plugs 1041 and gas plugs 1042 is randomly and alternately filled. When no heat conduction occurs, these working mediums are in a balanced, stationary state, and in this stationary state, they are mainly subjected to pressure from the gas plugs 1042, capillary force on the liquid plugs 1041, and gravity. When heated externally, the capillary force, gravity, and pressure due to the thermal expansion of the bubbles in the gas plugs 1042 become the driving force for the flow of the working medium. In this example, the working medium, which is the fluid inside the self-excited vibrating heat pipe, absorbs excess heat from the drive chip region in the evaporation section, then flows to the condensation section, where the heat is released into the air, thereby achieving the heat dissipation effect for the drive chip region. By applying a self-excited vibration heat pipe, heat from the drive chip area is quickly dissipated. Furthermore, the self-excited vibration heat pipe does not require external drive and can operate solely on the heat emitted from the drive chip area, resulting in energy savings and excellent heat conduction.

[0206] In some applications, the light-emitting unit 102 and the drive chip 103 are not arranged together on the same plane of the circuit board 101; that is, the light-emitting unit 102 and the drive chip 103 may be at different positions on the same plane of the circuit board 101, or at corresponding or non-corresponding positions on different planes of the circuit board 101, and the self-excited vibrating heat pipe 104 may be directly provided on the drive chip 103, and by adjusting its size and position, the light emission of the light-emitting unit 102 will not be obstructed. In some other implementations, a circuit board 101 with excellent thermal conductivity may be used, and the light-emitting unit 102 and the drive chip 103 may be arranged together on the same plane of the circuit board, and the self-excited vibrating heat pipe may be provided on a different plane of the circuit board, and the heat conducted from the drive chip to the circuit board by the self-excited vibrating heat pipe will be quickly dissipated.

[0207] In some applications, as shown in Figure 57, the light-emitting assembly further includes a thermal conductive sheet 105, which is placed between the self-oscillating heat pipe 104 and the drive chip 103. The thermal conductive sheet 105 uniformly conducts heat from the drive chip 103 to the self-oscillating heat pipe 104, improving the actual heat dissipation efficiency of the self-oscillating heat pipe 104. The thermal conductive sheet may be made of a copper sheet or another material with good thermal conductivity.

[0208] In some applications, silicone grease is provided between the thermal conductive sheet 105 and the self-oscillating heat pipe 104 and / or the drive chip 103. For example, silicone grease is provided on both sides of the thermal conductive sheet 105, with one side of the thermal conductive sheet 105 in close contact with the drive chip region and in contact with the drive chip 103 in the drive chip region, and the self-oscillating heat pipe 104 in close contact with the other side of the thermal conductive sheet 105. In actual applications, silicone grease may be provided only in the area of ​​the thermal conductive sheet 105 that is in contact with the drive chip 103 or the self-oscillating heat pipe 104, or silicone grease may be provided on both sides of the thermal conductive sheet 105 entirely. Providing silicone grease not only ensures connection between the thermal conductive sheet 105 and the self-oscillating heat pipe 104 and / or the drive chip 103, but also increases the contact area for heat conduction, thereby ensuring the efficiency of heat conduction.

[0209] In several applications, the self-oscillating heat pipe 104 includes heat dissipation ribs, which are in contact with the pipe of the self-oscillating heat pipe 104. Heat from the pipe of the self-oscillating heat pipe 104 is conducted to the heat dissipation ribs and dissipated by the ribs. The additional heat dissipation ribs increase the effective heat dissipation area of ​​the self-oscillating heat pipe, allowing heat to be released to the air with high efficiency. Specifically, the heat dissipation ribs are provided in the condensation section and are in contact with the pipe of the condensation section, allowing heat from the condensation section to be released quickly. Of course, this embodiment does not exclude the possibility that the heat dissipation ribs may be provided at other locations on the self-oscillating heat pipe. For example, the heat dissipation ribs may be provided from the condensation section to the insulating section between the evaporation section and the condensation section of the self-oscillating heat pipe.

[0210] In some application examples, for example, as shown in Figures 58 and 59, the condensation portion of the self-oscillating heat pipe may be exposed from the circuit board. Figure 58 shows the side of the circuit board 101 on which the light-emitting unit 102 is provided, and Figure 59 shows the side of the circuit board 101 on which the drive chip 103 is provided (the light-emitting unit and drive chip are not shown). The condensation portion of the self-oscillating heat pipe 104 is provided in an area other than the circuit board 101. After the heat from the drive chip area of ​​the circuit board 101 is dissipated by the self-oscillating heat pipe 104, it is conducted to an area other than the circuit board 101 for heat dissipation, further ensuring the heat dissipation effect and preventing a large amount of heat from accumulating on the circuit board 101. In actual applications, although the condensation portion of the self-oscillating heat pipe 104 is exposed from the circuit board, the light-emitting assembly is located inside the light-emitting device in which it is used. Since the condensation area is located in a region other than the circuit board 101, there is a large space around it. In these embodiments, the heat dissipation ribs may be provided in such a way that they are inserted into the condensation area. For example, in the specific structure of the heat dissipation rib 106 shown in Figure 60, the heat dissipation rib 106 is generally rectangular in shape, and a plurality of through holes 1061 are provided in the heat dissipation rib 106. The diameter of each through hole 1061 matches the outer diameter of the pipe of the self-excited vibrating heat pipe 104. As the pipe of the self-excited vibrating heat pipe 104 passes through these through holes 1061, the heat dissipation rib 106 is provided on the pipe of the self-excited vibrating heat pipe 104 and is brought into contact with the pipe. By providing a plurality of heat dissipation ribs 106 on the self-excited vibrating heat pipe 104, the heat dissipation efficiency is improved.

[0211] In some applications, multiple drive chips 103 are provided in the drive chip area, and at least a portion of each drive chip 103 is covered by the projection of the evaporation portion of the self-excited vibrating heat pipe 104 onto the circuit board 101. That is, the self-excited vibrating heat pipe 104 completely covers all the drive chips 103 in the drive chip area, ensuring that the heat from each drive chip 103 is effectively dissipated. In some examples, a thermal conductive sheet 105 is provided between the self-excited vibrating heat pipe 104 and the drive chips 130, and the size of the thermal conductive sheet 105 may be larger than the size of the drive chip area, and the thermal conductive sheet 105 similarly covers all the drive chips 103, with the self-excited vibrating heat pipe 104 provided on another side of the thermal conductive sheet 105. Furthermore, as shown in Figure 59, the self-oscillating heat pipe 104 of this embodiment includes a plurality of U-shaped pipes, which are connected to each other by U-shaped bend pipes, and the inside of the self-oscillating heat pipe 104 is circulated and electrically connected, with both ends of the U-shaped pipe in the longitudinal direction being an evaporation section and a condensation section, respectively. That is, if the working medium, which is the fluid inside the self-oscillating heat pipe, continues to flow in the same direction, it can return to its original position. These U-shaped pipes are arranged in order, and the gaps between the U-shaped pipes are narrow, that is, the U-shaped pipes are closely arranged, so that more U-shaped pipes can be provided within the same area, and the heat dissipation capacity is guaranteed. In other embodiments, the self-oscillating heat pipe may be replaced with other shapes, which will not be described in detail here.

[0212] The light-emitting assembly of this embodiment includes a circuit board and a self-oscillating heat pipe. The evaporation section of the self-oscillating heat pipe is located in the drive chip region of the circuit board, while the condensation section is located away from the drive chip region. The heat from the drive chip region is drawn out by the self-oscillating heat pipe and dissipated by the condensation section, eliminating the need for separate energy drive and resulting in energy savings. Furthermore, the self-oscillating heat pipe is advantageous for manufacturing in a miniaturized structure, allowing for uniform heat conduction and enabling good performance even with limited space in the light-emitting assembly.

[0213] According to the descriptions of the embodiments of this application, the LED brackets, light-emitting units, and light-emitting assemblies provided by the embodiments can be applied to various light-emitting fields. For example, they can be manufactured into backlight modules and applied to display backlights (which may be backlight modules for terminals such as televisions, displays, and mobile phones), button backlights, photography, home lighting, medical lighting, decoration, automotive, and transportation. When applied to the button backlight field, it may be used as a button backlight light source for buttons on mobile phones, calculators, keyboards, etc. When applied to the photography field, it may be manufactured as a camera flash lamp. When applied to the household lighting field, it may be manufactured as a floor lamp, stand, lamp, ceiling light, downlight, floodlight, etc. When applied to the medical lighting field, it may be manufactured as a shadowless lamp, low-electromagnetic lamp. When applied to the decorative field, it may be manufactured as various decorative lights such as various illuminations, landscape lighting, and advertising lights. When applied to the automotive field, it may be manufactured as an automobile lamp, automobile indicator light, etc. When applied to the traffic field, it may be manufactured as various traffic signal lights and various streetlights. The above applications are only a few of the applications shown in this embodiment, and it should be understood that the applications of the light-emitting device in this embodiment are not limited to the fields shown above.

[0214] The applications of this application are not limited to the examples given above, and those skilled in the art may improve or modify the above description, and it should be understood that all such improvements and modifications fall within the scope of protection of the claims attached to this application.

Claims

1. A light-emitting unit comprising an LED chip and an LED bracket, wherein the LED bracket has a bowl-shaped cup, and the LED chip includes a red light LED chip and a blue light LED chip provided at the bottom of the bowl-shaped cup. The light-emitting unit further includes a package layer provided inside the bowl-shaped cup, the package layer contains a green medium, the green medium fills the bowl-shaped cup and covers the red light LED chip and the blue light LED chip, the red light LED chip and the blue light LED chip have a vertical or horizontal structure, the red light LED chip and the blue light LED chip excite the green medium and emit white light, The normalized spectrogram of the white light satisfies the following conditions: it includes a first red light wavelength band and a green light wavelength band, the full width at half maximum of the first red light wavelength band is 15 nm to 30 nm, the peak of the first red light wavelength band is the first peak, the relative optical power corresponding to the first peak is 0.9 to 1, and the wavelength corresponding to the first peak is 645 nm to 665 nm. A light-emitting unit in which the package layer further comprises a sealing material that is filled into the bowl-shaped cup, and the mixing ratio range of the green medium and the sealing material is 1:12 to 1:

2.

2. The light-emitting unit according to claim 1, wherein the normalized spectrogram has a full width at half maximum in the green light wavelength band of 35 nm to 60 nm, the peak in the green light wavelength band is a second peak, the relative light power corresponding to the second peak is 0.2 to 0.4, and the wavelength corresponding to the second peak is 530 nm to 550 nm.

3. The light-emitting unit according to claim 1, wherein the normalized spectrogram further includes a blue light wavelength band, the full width at half maximum of the blue light wavelength band is 15 nm to 30 nm, the peak of the blue light wavelength band is a third peak, the relative light power corresponding to the third peak is 0.3 to 0.5, and the wavelength corresponding to the third peak is 445 nm to 455 nm.

4. The light-emitting unit according to claim 1, wherein the normalized spectrogram further includes a yellow light wavelength band, the wavelength range corresponding to the yellow light wavelength band is 585 nm to 630 nm, and the relative light power of the yellow light wavelength band is less than 0.

15.

5. The light-emitting unit according to claim 1, wherein the normalized spectrogram further includes a blue light wavelength band, the wavelength range corresponding to the blue light wavelength band is 465 nm to 515 nm, and the relative light power of the blue light wavelength band is less than 0.

1.

6. The light-emitting unit according to claim 1, wherein the normalized spectrogram further includes a violet light wavelength band, the wavelength range corresponding to the violet light wavelength band is 350 nm to 420 nm, and the relative light power of the violet light wavelength band is less than 0.

1.

7. The light-emitting unit according to claim 1, wherein the normalized spectrogram further includes a second red light wavelength band adjacent to the first red light wavelength band, the wavelength range corresponding to the second red light wavelength band is 680 nm to 780 nm, and the relative light power of the second red light wavelength band is less than 0.

1.

8. The light-emitting unit according to claim 1, wherein the material of the green medium contains β-Sialon, the material of the blue light LED chip contains gallium nitride, and the material of the red light LED chip contains aluminum indium gallium phosphide.

9. The light-emitting unit according to claim 1, wherein the white light has a distribution range of 0.31 to 0.39 on the X-axis and 0.3 to 0.4 on the Y-axis in the CIE 1931 chromaticity diagram, and the color temperature range of the white light is 4000K to 7000K.

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