Parts transfer device

Abstract

To provide a component transfer device that can efficiently control a load acting on a component, suppress damage to the component, and properly suction-hold the component with a suction head.SOLUTION: A control unit 100 performs thrust movement processing S4 as processing related to control of a head lift motor 4M which raises or lowers a suction head 4H, and a pin lift motor 40M which raises or lowers a thrust pin 47. In this thrust movement processing S4, the control unit 100 sets a speed of upward movement of the thrust pin 47 to a speed greater than a speed of upward movement of the suction head 4H, and sets a load control current upper limit value ILL indicating an upper limit value when the target load is applied to a component for the drive current of the pin lift motor 40M and the head lift motor 4M. The control unit 100 controls the drive of each motor so that the drive current of the pin lift motor 40M and the head lift motor 4M maintains the load control current upper limit value ILL.SELECTED DRAWING: Figure 7

Description

Technical Field

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[0001] The present invention relates to a component transfer device including a head unit having a suction head for sucking and holding a component arranged in a component arrangement area from above, and a lifting unit having a lifting pin for pushing up the component to be sucked by the suction head from below.

Background Art

[0002] There is known a component transfer device that picks up a component attached to a sheet in a component arrangement area and transfers it to a substrate or the like. This type of component transfer device includes a head unit having a suction head for sucking and holding a component from above, and a lifting unit having a lifting pin for pushing up the component to be sucked by the suction head from below. In the component transfer device, the suction head presses the component attached to the sheet from above and the lifting pin pushes it up from below. In the component transfer device, when the component is pushed up by the lifting pin while being sucked by the suction head, if the load acting on the component is too large, the component may be damaged, while if the load acting on the component is too small, there is a risk that the component cannot be properly sucked and held by the suction head. Therefore, in the component transfer device, a technique for controlling the load acting on the component is required.

[0003] Patent Document 1 discloses a technique for controlling the load acting on a component. In the technique disclosed in Patent Document 1, the lifting load acting on the component is measured by a load measuring device as the lifting pin of the lifting unit performs a lifting operation, and based on the measurement result, the pressing force acting on the component as the suction head of the suction head unit performs a suction operation is controlled.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The technology disclosed in Patent Document 1 has the problem of being an inefficient control method because the control of the load acting on the component is performed after waiting for the measurement result of the load measuring device.

[0006] The objective of the present invention is to provide a component transfer device that can efficiently control the load acting on a component, suppress damage to the component, and appropriately hold the component by suction head. [Means for solving the problem]

[0007] A component transfer device according to one aspect of the present invention comprises: a component supply unit having a component placement area on which a plurality of components are arranged while attached to an elastically deformable sheet; a head unit having a suction head that is vertically movable above the component placement area and which holds the components on the sheet from above by suction; and a head lifting motor that moves the suction head vertically; a push-up unit having a push-up pin that is vertically movable below the component placement area and which pushes up the components to be suctioned by the suction head through the sheet from below; and a pin lifting motor that moves the push-up pin vertically; and a control unit that controls the head lifting motor and the pin lifting motor. The control unit controls the pin lifting motor so that the tip of the push-up pin moves upward until it reaches a push-up position above the sheet contact position, with the tip of the push-up pin positioned at the sheet contact position where it contacts the sheet, and the tip of the suction head positioned at the component contact position where it contacts the component on the sheet, and also controls the head lifting motor so that the suction head moves upward in accordance with the upward movement of the push-up pin, and performs a push-up movement process. In the push-up movement process, the control unit sets the speed of the upward movement of the push-up pin to be higher than the speed of the upward movement of the suction head, sets a load control current upper limit value for the drive current of the pin lifting motor and the head lifting motor, which indicates the upper limit value when a target load is applied to the component, and continues driving the pin lifting motor and the head lifting motor until the tip of the push-up pin reaches the push-up position, so that the drive current of the pin lifting motor and the head lifting motor maintains the load control current upper limit value.

[0008] In this component transfer device, the control unit performs an upward movement process as part of the control processing for the head lifting motor that raises and lowers the suction head and the pin lifting motor that raises and lowers the push-up pin. In this upward movement process, the control unit sets the upward movement speed of the push-up pin to a speed that is greater than the upward movement speed of the suction head, and continues to drive each lifting motor until the tip of the push-up pin reaches the push-up position, so that the drive current of the pin lifting motor and the head lifting motor maintains the upper limit of the load control current. In this case, when the push-up pin and the suction head move upward with the component attached to the sheet held between the push-up pin and the suction head, the speed setting causes the push-up pin to move in a way that pushes the suction head upward, but excessive upward movement of the push-up pin relative to the suction head is restricted by the control based on the upper limit of the load control current of the drive current of each lifting motor. As a result, the distance between the push-up pin and the suction head can be kept constant until the tip of the push-up pin reaches the push-up position.

[0009] Furthermore, the upper limit of the load control current supplied to the pin lifting motor and the head lifting motor is set to the upper limit of the drive current when a target load is applied to the component attached to the sheet. Therefore, by controlling the drive current of each lifting motor to maintain the upper limit of the load control current, the target load continues to act on the component held between the lifting pin and the suction head as the lifting pin and suction head move upward until the tip of the lifting pin reaches the lifting position. As a result, the load acting on the component can be efficiently controlled to the target load based on the setting of the upper limit of the load control current for the drive current of each lifting motor, without using a load measuring instrument as in conventional technology. Therefore, damage to the component held between the lifting pin and the suction head is suppressed as the lifting pin and suction head move upward, and the component can be properly held by the suction head.

[0010] In the above-described component transfer device, the control unit may control the pin lifting motor and the head lifting motor so that, in the upward movement process, the upward movement of the upward-moving pin begins to move upward earlier than the suction head.

[0011] In this embodiment, with the component held between the push-up pin and the suction head, the push-up pin begins to move upward earlier than the suction head, thus preventing the distance between the push-up pin and the suction head from increasing. This makes it possible to more reliably maintain a constant distance between the push-up pin and the suction head when the target load is applied to the component.

[0012] In the above-described component transfer device, the push-up unit may have a rotary encoder provided on the pin lifting motor. In this case, the control unit detects that the tip of the push-up pin has reached the push-up position based on the signal output from the rotary encoder during the push-up movement process.

[0013] In this embodiment, when the push-up pin and the suction head move upward based on the control of the pin lifting motor and the head lifting motor, it is possible to detect when the tip of the push-up pin has reached the push-up position based on the output signal of a rotary encoder provided on the pin lifting motor.

[0014] In the above-described component transfer device, the control unit may perform a contact movement process as a preprocessing step before the upward movement process, controlling the pin lifting motor so that the upward movement of

[0015] In this embodiment, the control unit performs a contact movement process as a pre-processing step before the upward movement process, causing the upward-moving pin to move upward until its tip reaches the sheet contact position, and the suction head to move downward until its tip reaches the component contact position. The upward movement of the upward-moving pin and the downward movement of the suction head grip the component attached to the sheet between the upward-moving pin and the suction head. When the upward movement of the upward-moving pin and the downward movement of the suction head are restricted by the gripping of the component between the upward-moving pin and the suction head, the drive current of the pin lifting motor and the head lifting motor increases. At this time, since the upper limit of the load control current is set as the upper limit of the drive current of each lifting motor, the drive current of each lifting motor is kept within a range of the upper limit of the load control current. As a result, when the tip of the upward-moving pin reaches the sheet contact position and the tip of the suction head reaches the component contact position, the load acting on the component can be controlled to the target load. Therefore, it is possible to suppress damage to the component when the component attached to the sheet is gripped by the upward movement of the upward-moving pin and the downward movement of the suction head.

[0016] In the above-described component transfer device, the control unit may, during the contact movement process, detect when the drive current of the pin lifting motor and the head lifting motor reaches the upper limit of the load control current, that the tip of the push-up pin has reached the sheet contact position and the tip of the suction head has reached the component contact position.

[0017] In this embodiment, when the upward movement of the push-up pin and the downward movement of the suction head are restricted because the tip of the push-up pin reaches the sheet contact position and the tip of the suction head reaches the component contact position, the drive current of the pin lifting motor and the head lifting motor increases until it reaches the upper limit of the load control current. Therefore, when the drive current of the pin lifting motor and the head lifting motor reaches the upper limit of the load control current, it becomes possible to detect that the tip of the push-up pin has reached the sheet contact position and the tip of the suction head has reached the component contact position. [Effects of the Invention]

[0018] As described above, according to the present invention, it is possible to provide a component transfer device that can efficiently control the load acting on a component, suppress damage to the component, and appropriately adsorb and hold the component by an adsorption head.

Brief Description of the Drawings

[0019] [Figure 1] It is a plan view showing the overall configuration of a component mounting device as a component transfer device according to an embodiment of the present invention. [Figure 2] It is a perspective view and a side view of a head unit and a pushing-up unit provided in the component mounting device. [Figure 3] It is a block diagram showing the control configuration of the component mounting device. [Figure 4] It is a diagram for explaining the processing performed by the processing unit of the control unit provided in the component mounting device. [Figure 5] It is a diagram for explaining the upper limit value of the current for load control referred to when the processing unit performs contact movement processing and pushing-up movement processing. [Figure 6] It is a flowchart showing the flow of the contact movement processing performed by the processing unit. [Figure 7] It is a flowchart showing the flow of the pushing-up movement processing performed by the processing unit. [Figure 8] It is a flowchart showing the flow of the pushing-up movement processing performed by the processing unit.

Embodiments for Carrying Out the Invention

[0020] Embodiments of the present invention will be described below with reference to the drawings. In the following description, directional relationships will be explained using the XYZ Cartesian coordinate axes. The X and Y directions are orthogonal to each other on the horizontal plane, and the Z direction is the vertical direction (up and down direction) that is orthogonal to both the X and Y directions. Furthermore, one side of the X direction will be referred to as the "+X side," and the other side opposite to the one side of the X direction will be referred to as the "-X side." Similarly, one side of the Y direction will be referred to as the "+Y side," and the other side opposite to the one side of the Y direction will be referred to as the "-Y side."

[0021] The component transfer apparatus according to the present invention can be applied to various devices, such as a taping device that stores dies diced from a wafer onto a tape, a die bonder that wire-bonds the die to a substrate, or a component mounting device that mounts the die to a substrate. Here, we will describe an example in which the component transfer apparatus of the present invention is applied to a component mounting device.

[0022] [Overall configuration of the component mounting equipment] As shown in Figure 1, the component mounting apparatus 1 according to this embodiment is a device that mounts (mounts) dies 7a (components) diced from a wafer 7 onto a substrate P. As shown in Figures 1 and 2, the component mounting apparatus 1 comprises a base 2, a conveyor 3, a head unit 4, a component supply unit 5, a wafer supply device 6, a camera unit 32U, and a push-up unit 40.

[0023] Base 2 is the mounting base for various devices provided by the component mounting device 1. Conveyor 3 is a transport line for substrates P, installed on base 2 so as to extend in the X direction. Conveyor 3 transports substrates P from outside the machine to a predetermined mounting position and, after the mounting work is completed, transports substrates P from the mounting position to outside the machine. Conveyor 3 has a clamping mechanism (not shown) that holds the substrates P at the mounting position. The position where the substrates P are shown in Figure 1 is the mounting position.

[0024] The component supply unit 5 supplies multiple dies 7a in a diced state from the wafer 7. The component supply unit 5 includes a wafer supply device 6 that supplies the wafer 7, divided into multiple dies 7a, to the wafer stage 10 (component placement area) while it is held on a pallet 8. The wafer 7 is a disc-shaped semiconductor wafer with circuit patterns already formed on it. The pallet 8 holds a wafer sheet 8a. The wafer sheet 8a is an elastically deformable sheet. A collection of numerous dies 7a, formed by dicing the wafer 7 in a grid pattern, is attached to the wafer sheet 8a. In other words, the wafer supply device 6 supplies the wafer 7, with multiple dies 7a attached to the wafer sheet 8a, to the wafer stage 10 while it is held on the pallet 8.

[0025] The wafer supply device 6 includes a wafer storage elevator 9, a wafer stage 10, and a wafer conveyor 11. The wafer storage elevator 9 stores wafers 7, each with multiple dies 7a attached to a wafer sheet 8a, in multiple layers vertically, with the wafers held on a pallet 8. The wafer stage 10 is installed on the base 2 at the -Y side position of the wafer storage elevator 9. The wafer stage 10 is positioned on the +Y side with respect to the mounting work position, which is the stopping position of the substrate P. In this embodiment, the wafer stage 10, which is the area on the base 2 where the diced wafers 7 are placed, becomes the component placement area. The wafer conveyor 11 pulls the pallet 8 from the wafer storage elevator 9 onto the wafer stage 10.

[0026] The head unit 4 includes multiple suction heads 4H, a head lifting motor 4M, a ball screw shaft 4J, a ball nut 4N, and a spring 4S.

[0027] The suction head 4H is positioned to be movable vertically (Z-direction) relative to the head unit 4 while being pulled upward by a spring 4S. Above the wafer stage 10, the suction head 4H moves downward to pick up the die 7a attached to the wafer sheet 8a by adsorption. While holding the die 7a, it moves upward to pick up the die 7a from the wafer sheet 8a. Furthermore, above the substrate P positioned on the conveyor 3, the suction head 4H releases the die 7a it is holding, thereby mounting the die 7a onto the substrate P.

[0028] The head lifting motor 4M is a motor that generates the driving force to move the suction head 4H in the vertical direction (Z direction). The ball screw shaft 4J and ball nut 4N transmit the driving force of the head lifting motor 4M to the suction head 4H. The ball screw shaft 4J extends in the vertical direction (Z direction) while connected to the head lifting motor 4M and is rotationally driven by the head lifting motor 4M. The ball nut 4N is screwed onto the ball screw shaft 4J while fixed to the suction head 4H. When the head lifting motor 4M operates and the ball screw shaft 4J is rotationally driven, the suction head 4H, to which the ball nut 4N is fixed, moves in the vertical direction (Z direction).

[0029] The head unit 4 is equipped with a head camera 31 that captures images of the circuit board P. From the images captured by the head camera 31, the feducial marks attached to the circuit board P are recognized. This allows the misalignment of the circuit board P to be recognized, and the misalignment is corrected when components are mounted on the circuit board P.

[0030] A component recognition camera 30 is mounted on the base 2. The component recognition camera 30 captures an image of the die 7a, which is held by the suction head 4H, from below before it is mounted on the substrate P. Based on this captured image, any abnormalities or suction errors in the die 7a by the suction head 4H are determined.

[0031] The component mounting apparatus 1 includes a head horizontal drive mechanism D1 that moves the head unit 4 horizontally (in the X and Y directions) in the space above the substrate P and wafer stage 10, which are positioned at the mounting work location on the conveyor 3. The head horizontal drive mechanism D1 includes a pair of Y-axis fixed rails 13 on the +X side and -X side, a head Y-axis servo motor 14, and a head Y-movement axis 15 as the Y-direction movement mechanism for the head unit 4. The pair of Y-axis fixed rails 13 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The head Y-movement axis 15 is a ball screw shaft that is positioned close to the Y-axis fixed rails 13 and extends in the Y direction. The head Y-axis servo motor 14 rotates the head Y-movement axis 15. A support frame 16 that supports the head unit 4 is installed between the pair of Y-axis fixed rails 13. Nuts 17 are attached to the +X side end and -X side end of the support frame 16, and these nuts are screwed onto the Y-movement axis 15 of each head.

[0032] The head horizontal drive mechanism D1, as a mechanism for moving the head unit 4 in the X direction, includes a guide member (not shown), a head X-axis servo motor 18, and a head X-movement axis 19 mounted on a support frame 16. The guide member is a member that guides the movement of the head unit 4 in the X direction and is fixed to the support frame 16 on the +Y side surface so as to extend in the X direction. The head X-movement axis 19 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The head X-axis servo motor 18 rotationally drives the head X-movement axis 19. The head unit 4 is fitted with a nut (not shown), which is screwed onto the head X-movement axis 19.

[0033] With the head horizontal drive mechanism D1 having the above configuration, the head Y-axis servo motor 14 is activated and the head Y-movement axis 15 is rotationally driven, causing the head unit 4 to move in the Y direction together with the support frame 16. In addition, the head X-axis servo motor 18 is activated and the head X-movement axis 19 is rotationally driven, causing the head unit 4 to move in the X direction relative to the support frame 16.

[0034] The camera unit 32U is a unit that can move in the X and Y directions and includes a wafer camera 32. The wafer camera 32 images a portion of the wafer 7 positioned on the wafer stage 10, that is, the die 7a within the camera's field of view. Based on this image, the position of the die 7a to be picked up by the suction head 4H is recognized.

[0035] The component mounting apparatus 1 includes a camera horizontal drive mechanism D2 that moves the camera unit 32U horizontally (in the X and Y directions) in the space above the wafer stage 10 and a predetermined standby position. This camera horizontal drive mechanism D2 is a separate and independent drive system from the head horizontal drive mechanism D1 that drives the head unit 4. In this embodiment, the standby position is a position spaced apart from the wafer stage 10 on the +Y side.

[0036] The camera horizontal drive mechanism D2, as a mechanism for moving the camera unit 32U in the Y direction, comprises a pair of Y-axis fixed rails 33 on the +X side and -X side, and a camera Y-axis servo motor 34 and camera Y-movement axis 35 located on the +X side. The pair of Y-axis fixed rails 33 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The camera Y-movement axis 35 is a ball screw shaft positioned to extend in the Y direction at a location close to the Y-axis fixed rail 33 on the +X side. The camera Y-axis servo motor 34 rotates the camera Y-movement axis 35. A support frame 36 supporting the camera unit 32U is installed between the pair of Y-axis fixed rails 33. A nut 37, which is screwed onto the camera Y-movement axis 35, is assembled to the +X side end of the support frame 36.

[0037] The camera horizontal drive mechanism D2, as a mechanism for moving the camera unit 32U in the X direction, includes a guide member (not shown), a camera X-axis servo motor 38, and a camera X-axis movement shaft 39 mounted on a support frame 36. The guide member is a member that guides the movement of the camera unit 32U in the X direction and is fixed to the -Y side of the support frame 36 so as to extend in the X direction. The camera X-axis movement shaft 39 is a ball screw shaft disposed close to the guide member so as to extend in the X direction. The camera X-axis servo motor 38 rotates the camera X-axis movement shaft 39. The camera unit 32U is fitted with a nut (not shown), which is screwed onto the camera X-axis movement shaft 39.

[0038] With the camera horizontal drive mechanism D2 having the above configuration, the camera Y-axis servo motor 34 is activated and the camera Y-movement axis 35 is rotated, causing the camera unit 32U to move in the Y direction together with the support frame 36. In addition, the camera X-axis servo motor 38 is activated and the camera X-movement axis 39 is rotated, causing the camera unit 32U to move in the X direction relative to the support frame 36.

[0039] The push-up unit 40 is positioned below the wafer stage 10. The push-up unit 40 includes a push-up pin 47, a pin lifting motor 40M, a ball screw shaft 40J, and a ball nut 40N.

[0040] The push-up pin 47 is provided below the wafer stage 10 so as to be movable in the vertical direction (Z direction) relative to the push-up unit 40. By moving upward below the wafer stage 10, the push-up pin 47 pushes up the die 7a, which is to be adsorbed by the suction head 4H, from below via the wafer sheet 8a. The push-up unit 40 performs a process of sucking the wafer sheet 8a around the die 7a when the push-up pin 47 pushes up the die 7a.

[0041] The pin lifting motor 40M is a motor that generates the driving force to move the push-up pin 47 in the vertical direction (Z direction). The ball screw shaft 40J and ball nut 40N transmit the driving force of the pin lifting motor 40M to the push-up pin 47. The ball screw shaft 40J extends in the vertical direction (Z direction) while connected to the pin lifting motor 40M and is rotationally driven by the pin lifting motor 40M. The ball nut 40N is screwed onto the ball screw shaft 40J while fixed to the push-up pin 47. When the pin lifting motor 40M operates and the ball screw shaft 40J is rotationally driven, the push-up pin 47, which is fixed to the ball nut 40N, moves in the vertical direction (Z direction).

[0042] The component mounting apparatus 1 includes a horizontal push-up drive mechanism D3 that moves the push-up unit 40 horizontally (in the X and Y directions) in the space below the wafer stage 10. The horizontal push-up drive mechanism D3 includes a pair of guide rails 41, a push-up Y-movement axis 43, and a push-up Y-axis servo motor 44 as a mechanism for moving the push-up unit 40 in the Y direction. The pair of guide rails 41 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The push-up Y-movement axis 43 is a ball screw shaft arranged to extend in the Y direction at a position close to the guide rails 41. The push-up Y-axis servo motor 44 rotates the push-up Y-movement axis 43. A support frame 42 that supports the push-up unit 40 is installed between the pair of guide rails 41. A nut (not shown) that is screwed onto the push-up Y-movement axis 43 is assembled to the support frame 42.

[0043] The upward horizontal drive mechanism D3 includes a guide member (not shown), an upward X-axis movement shaft 45, and an upward X-axis servo motor 46 mounted on a support frame 42 as a mechanism for moving the upward unit 40 in the X direction. The guide member is a member that guides the movement of the upward unit 40 in the X direction and is fixed to the -Y side surface of the support frame 42 so as to extend in the X direction. The upward X-axis movement shaft 45 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The upward X-axis servo motor 46 rotationally drives the upward X-axis movement shaft 45. The upward unit 40 is fitted with a nut (not shown), which is screwed onto the upward X-axis movement shaft 45.

[0044] With the above configuration, the upward horizontal drive mechanism D3 causes the upward Y-axis servo motor 44 to actuate and rotate the upward Y-movement axis 43, causing the upward unit 40 to move in the Y direction together with the support frame 42. Additionally, the upward X-axis servo motor 46 actsuate and rotates the upward X-movement axis 45, causing the upward unit 40 to move in the X direction relative to the support frame 42.

[0045] [Control configuration of component mounting equipment] As shown in the block diagram of Figure 3, the component mounting device 1 includes a control unit 100. The control unit 100 is composed of a microcomputer comprising a processing unit 101 consisting of a CPU (Central Processing Unit) that performs various calculations, and a storage unit 102 that stores various information.

[0046] The processing unit 101 performs various processes by controlling the drive of the following motors: the head Y-axis servo motor 14 and head X-axis servo motor 18 of the head horizontal drive mechanism D1, the camera Y-axis servo motor 34 and camera X-axis servo motor 38 of the camera horizontal drive mechanism D2, the thrust Y-axis servo motor 44 and thrust X-axis servo motor 46 of the thrust horizontal drive mechanism D3, the head lifting motor 4M of the head unit 4, and the pin lifting motor 40M of the thrusting unit 40. As shown in Figure 4, the processing unit 101 performs imaging position movement processing S1, standby position movement processing S2, contact movement processing S3, thrust movement processing S4, removal movement processing S5, and mounting movement processing S6. Details of each process performed by the processing unit 101 will be described later.

[0047] The memory unit 102 stores various types of information used by the processing unit 101 when it performs the contact movement process S3 and the push-up movement process S4. As shown in Figure 3, the memory unit 102 stores the sheet contact position P21, the first push-up position P22, the second push-up position P23, and the component contact position P31 as positional information relating to the positions of the suction head 4H and the push-up pin 47.

[0048] The sheet contact position P21 and the component contact position P31 are position information used when the processing unit 101 performs the contact movement process S3. The sheet contact position P21 indicates the vertical position when the tip of the push-up pin 47 contacts the wafer sheet 8a placed on the wafer stage 10 from below. The component contact position P31 indicates the vertical position when the tip of the suction head 4H contacts the die 7a attached to the wafer sheet 8a from above.

[0049] The first push-up position P22 and the second push-up position P23 are position information used when the processing unit 101 performs the push-up movement process S4. The first push-up position P22 and the second push-up position P23 indicate the vertical target positions of the tip of the push-up pin 47 when the die 7a is pushed up by the push-up pin 47, and are located above the sheet contact position P21. The number of push-up positions set as position information used when the processing unit 101 performs the push-up movement process S4 may be one or two or more. In this embodiment, two positions, the first push-up position P22 and the second push-up position P23, are set as push-up positions used when the processing unit 101 performs the push-up movement process S4. The second push-up position P23 is located above the first push-up position P22.

[0050] Furthermore, the memory unit 102 stores pin reference speed SSP, pin push-up speed SPP, and head speed SH as speed information relating to the vertical movement speed of the suction head 4H and the push-up pin 47.

[0051] The pin reference speed SSP is speed information used when the processing unit 101 performs the contact movement process S3 and the removal movement process S5. The pin reference speed SSP indicates the speed when the thrusting pin 47 moves upward toward the sheet contact position P21 in the contact movement process S3, and when the thrusting pin 47 moves downward in the removal movement process S5. The pin reference speed SSP includes the speed during acceleration drive from a stopped state to a predetermined maximum speed, the speed during constant speed drive to maintain the maximum speed, and the speed during deceleration drive from the maximum speed to a stopped state.

[0052] The head speed SH is speed information used when the processing unit 101 performs the contact movement process S3, the upward movement process S4, and the pick-up movement process S5. The head speed SH indicates the speed when the suction head 4H moves downward toward the part contact position P31 in the contact movement process S3, when the suction head 4H moves upward from the part contact position P31 in the upward movement process S4, and when the suction head 4H moves upward in the pick-up movement process S5. The head speed SH includes the speed during acceleration drive from a stopped state to a predetermined maximum speed, the speed during constant speed drive to maintain the maximum speed, and the speed during deceleration drive from the maximum speed to a stopped state.

[0053] The pin thrusting speed SPP is speed information used when the processing unit 101 performs the thrusting movement process S4. The pin thrusting speed SPP indicates the speed when the thrusting pin 47 moves upward from the seat contact position P21 towards the first thrusting position P22, and when it moves upward from the first thrusting position P22 towards the second thrusting position P23 during the thrusting movement process S4. The pin thrusting speed SPP includes the speed during acceleration drive from a stopped state to a predetermined maximum speed, the speed during constant speed drive to maintain the maximum speed, and the speed during deceleration drive from the maximum speed to a stopped state.

[0054] In the upward movement process S4, the upward movement speed SPP of the upward movement of the upward movement pin 47 is set to a speed higher than the upward movement speed SH of the suction head 4H. For example, the upward movement speed SPP is set to a speed 10% higher than the head speed SH.

[0055] Furthermore, the memory unit 102 stores current upper limit information related to the upper limits of the drive current of the pin lifting motor 40M and the head lifting motor 4M, namely the reference current upper limit ILS and the load control current upper limit ILL.

[0056] The reference current limit value ILS is current limit value information used when the processing unit 101 performs the contact movement process S3 and the extraction movement process S5. The reference current limit value ILS indicates the reference upper limit of the drive current supplied to the pin lifting motor 40M and the head lifting motor 4M when moving the push-up pin 47 and the suction head 4H in the vertical direction.

[0057] The load control current upper limit value ILL is current upper limit value information used when the processing unit 101 performs the contact movement process S3 and the push-up movement process S4. As shown in Figure 5, the pin lifting motor 40M generates a driving force to move the push-up pin 47 in the vertical direction, and the head lifting motor 4M generates a driving force to move the suction head 4H in the vertical direction. When the push-up pin 47 contacts the wafer sheet 8a from below and the suction head 4H contacts the die 7a from above, the load acting on the die 7a, which is sandwiched between the push-up pin 47 and the suction head 4H, is the value obtained by subtracting the loss amount from the driving force by the pin lifting motor 40M and the head lifting motor 4M. The losses include the force due to cogging of the pin lifting motor 40M and the head lifting motor 4M (cogging force), gravity, the force of the spring 4S, the frictional force between the ball screw shaft 4J and the ball nut 4N in the head unit 4, and the frictional force between the ball screw shaft 40J and the ball nut 40N in the push-up unit 40.

[0058] The load control current upper limit value ILL indicates the upper limit of the drive current supplied to the pin lifting motor 40M and the head lifting motor 4M when a target load is applied to the die 7a, which is held between the push-up pin 47 and the suction head 4H. The load control current upper limit value ILL is set based on the loss current corresponding to the amount of drive force loss of the pin lifting motor 40M and the head lifting motor 4M. Specifically, the load control current upper limit value ILL is set to the sum of the load current and the loss current. Note that the load control current upper limit value ILL is set to a value lower than the reference current upper limit value ILS.

[0059] The processing unit 101 uses the information stored in the storage unit 102 to perform the imaging position movement process S1, standby position movement process S2, contact movement process S3, upward movement process S4, removal movement process S5, and mounting movement process S6 shown in Figure 4.

[0060] In the imaging position movement process S1, the processing unit 101 controls the driving of the camera Y-axis servo motor 34 and the camera X-axis servo motor 38 so that the camera unit 32U moves to the imaging position P10 above the die 7a to be picked up by the suction head 4H. When the camera unit 32U is positioned at the imaging position P10, the wafer camera 32 mounted on the camera unit 32U takes an image of the die 7a. Based on the image data acquired by the wafer camera 32 taking an image of the die 7a, the processing unit 101 recognizes the position of the die 7a to be picked up by the suction head 4H.

[0061] In the standby position movement process S2 following the imaging position movement process S1, the processing unit 101 controls the drive of the head Y-axis servo motor 14 and the head X-axis servo motor 18 so that the head unit 4 moves horizontally until the tip of the suction head 4H reaches the head standby position P30 above the die 7a to be suctioned. As a result, the head unit 4 is positioned so that the tip of the suction head 4H is located at the head standby position P30. Also in the standby position movement process S2, the processing unit 101 controls the drive of the push-up Y-axis servo motor 44 and the push-up X-axis servo motor 46 so that the push-up unit 40 moves horizontally until the tip of the push-up pin 47 reaches the push-up standby position P20 below the die 7a to be suctioned. As a result, the push-up unit 40 is positioned so that the tip of the push-up pin 47 is located at the push-up standby position P20.

[0062] With the tip of the push-up pin 47 positioned at the push-up standby position P20 and the tip of the suction head 4H positioned at the head standby position P30, the processing unit 101 performs the contact movement process S3. In the contact movement process S3, the processing unit 101 controls the drive of the pin lifting motor 40M so that the push-up pin 47 moves upward until the tip of the push-up pin 47 reaches the sheet contact position P21. As a result, the push-up pin 47 contacts the wafer sheet 8a from below. Also in the contact movement process S3, the processing unit 101 controls the drive of the head lifting motor 4M so that the suction head 4H moves downward until the tip of the suction head 4H reaches the component contact position P31. As a result, the suction head 4H contacts the die 7a to be suctioned from above. Details of the contact movement process S3 of the processing unit 101 will be described later.

[0063] The push-up pin 47 contacts the wafer sheet 8a from below, and the suction head 4H contacts the die 7a from above, so that the die 7a to be adsorbed is held between the push-up pin 47 and the suction head 4H. With the die 7a held between the push-up pin 47 and the suction head 4H, the push-up unit 40 performs a process of sucking the wafer sheet 8a around the die 7a, and the suction head 4H adsorbs and holds the die 7a.

[0064] With the tip of the push-up pin 47 positioned at the sheet contact position P21 and the tip of the suction head 4H positioned at the component contact position P31, the processing unit 101 performs the push-up movement process S4 as a post-processing step of the contact movement process S3. In the push-up movement process S4, the processing unit 101 controls the drive of the pin lifting motor 40M so that the push-up pin 47 moves upward until its tip reaches the first push-up position P22 and the second push-up position P23, respectively, which are above the sheet contact position P21. It also controls the drive of the head lifting motor 4M so that the suction head 4H moves upward in accordance with the upward movement of the push-up pin 47. As a result, the push-up pin 47 pushes up the die 7a, which is held by the suction head 4H, from below. Details of the push-up movement process S4 of the processing unit 101 will be described later.

[0065] When the tip of the push-up pin 47 is positioned at the second push-up position P23 with the die 7a held between the push-up pin 47 and the suction head 4H, the processing unit 101 performs the pick-up movement process S5 as a post-processing step of the push-up movement process S4. In the pick-up movement process S5, the processing unit 101 controls the drive of the head lifting motor 4M so that the suction head 4H moves upward until its tip reaches the head standby position P30. As a result, the suction head 4H picks up the die 7a it has picked up from the wafer sheet 8a. Also in the pick-up movement process S5, the processing unit 101 controls the drive of the pin lifting motor 40M so that the push-up pin 47 moves downward until its tip reaches the push-up standby position P20.

[0066] After the removal and movement process S5, the processing unit 101 performs the mounting and movement process S6. In the mounting and movement process S6, the processing unit 101 controls the drive of the head Y-axis servo motor 14 and the head X-axis servo motor 18 so that the head unit 4 moves horizontally until the tip of the suction head 4H reaches the mounting position P40, in order to mount the die 7a, which is held by the suction head 4H, onto the substrate P. As a result, the head unit 4 is positioned so that the tip of the suction head 4H is located at the mounting position P40 above the substrate P. The suction head 4H releases the die 7a it is holding, thereby mounting the die 7a onto the substrate P.

[0067] Next, the contact movement process S3, which the processing unit 101 performs as a preprocessing step for the upward movement process S4, will be explained in detail with reference to the flowchart in Figure 6.

[0068] In the contact movement process S3, the processing unit 101 reads the sheet contact position P21 and the component contact position P31 from the storage unit 102. As a result, the processing unit 101 sets the sheet contact position P21 and the component contact position P31 corresponding to the die 7a to be picked up by the suction head 4H (step S31). Furthermore, the processing unit 101 reads the pin reference speed SSP and the head speed SH from the storage unit 102. As a result, the processing unit 101 sets the pin reference speed SSP as the speed at which the push-up pin 47 is moved upward until its tip reaches the sheet contact position P21, and sets the head speed SH as the speed at which the suction head 4H is moved downward until its tip reaches the component contact position P31 (step S32).

[0069] Once the sheet contact position P21 and the component contact position P31 are set, and the pin reference speed SSP and head speed SH are set, the processing unit 101 sets the sheet contact PTP (Point to Point) time and the component contact PTP time (step S33). The sheet contact PTP time indicates the time required for the upward movement of the push-up pin 47 from the push-up standby position P20 to the sheet contact position P21. The processing unit 101 sets the sheet contact PTP time by calculating it based on the sheet contact position P21 and the pin reference speed SSP. The component contact PTP time indicates the time required for the downward movement of the suction head 4H from the head standby position P30 to the component contact position P31. The processing unit 101 sets the component contact PTP time by calculating it based on the component contact position P31 and the head speed SH.

[0070] Furthermore, the processing unit 101 reads the reference current limit value ILS from the storage unit 102. As a result, the processing unit 101 sets the reference current limit value ILS as the upper limit value for the drive current of the pin lifting motor 40M and the head lifting motor 4M (step S34).

[0071] Once the setting of the reference current upper limit ILS is complete, the processing unit 101 starts supplying drive current to the pin lifting motor 40M to start the upward movement of the push-up pin 47, and starts supplying drive current to the head lifting motor 4M to start the downward movement of the suction head 4H (step S35).

[0072] When the supply of drive current to the pin lifting motor 40M is started, the push-up pin 47 moves upward toward the sheet contact position P21 at the speed during accelerated driving included in the pin reference speed SSP. On the other hand, when the supply of drive current to the head lifting motor 4M is started, the suction head 4H moves downward toward the component contact position P31 at the speed during accelerated driving included in the head speed SH. During accelerated driving of the push-up pin 47 and the suction head 4H, the processing unit 101 controls the driving of the pin lifting motor 40M and the head lifting motor 4M so that the drive current of the pin lifting motor 40M and the head lifting motor 4M stays within a range of less than or equal to the reference current upper limit value ILS.

[0073] During the acceleration drive of the push-up pin 47 and the suction head 4H, the processing unit 101 determines whether the acceleration drive has ended (step S36). If the acceleration drive of the push-up pin 47 and the suction head 4H has ended (YES in step S36), the processing unit 101 reads the load control current upper limit value ILL from the storage unit 102. As a result, the processing unit 101 switches the upper limit of the drive current of the pin lifting motor 40M and the head lifting motor 4M from the reference current upper limit value ILS to the load control current upper limit value ILL (step S37).

[0074] When the acceleration drive of the thrust-up pin 47 and the suction head 4H is completed, the processing unit 101 controls the drive of the pin lifting motor 40M so that the thrust-up pin 47 continues to move upward at the constant speed drive and deceleration drive speed included in the pin reference speed SSP, and controls the drive of the head lifting motor 4M so that the suction head 4H continues to move downward at the constant speed drive and deceleration drive speed included in the head speed SH (step S38). During constant speed drive and deceleration drive of the thrust-up pin 47 and the suction head 4H, the processing unit 101 controls the drive of the pin lifting motor 40M and the head lifting motor 4M so that the drive current of the pin lifting motor 40M and the head lifting motor 4M stays within the range of the upper limit value ILL for load control current.

[0075] The processing unit 101 determines whether the sheet contact PTP time has elapsed during the deceleration drive of the push-up pin 47, and whether the component contact PTP time has elapsed during the deceleration drive of the suction head 4H (step S39). If the sheet contact PTP time and the component contact PTP time have not elapsed (NO in step S39), the processing unit 101 returns to step S38. On the other hand, if the sheet contact PTP time and the component contact PTP time have elapsed (YES in step S39), the processing unit 101 proceeds to step S40. In step S40, the processing unit 101 detects that when the drive current of the pin lifting motor 40M and the head lifting motor 4M reaches the upper limit value ILL for load control current, the tip of the push-up pin 47 has reached the sheet contact position P21 and the tip of the suction head 4H has reached the component contact position P31. When the tip of the push-up pin 47 reaches the sheet contact position P21 and the tip of the suction head 4H reaches the component contact position P31, the processing unit 101 stops driving the pin lifting motor 40M and the head lifting motor 4M (step S41).

[0076] As described above, when the processing unit 101 performs the contact movement process S3, the push-up pin 47 moves upward until its tip reaches the sheet contact position P21, and the suction head 4H moves downward until its tip reaches the component contact position P31. Due to the upward movement of the push-up pin 47 and the downward movement of the suction head 4H, the die 7a attached to the wafer sheet 8a is held between the push-up pin 47 and the suction head 4H. When the upward movement of the push-up pin 47 and the downward movement of the suction head 4H are restricted by the die 7a being held between the push-up pin 47 and the suction head 4H, the drive current of the pin lifting motor 40M and the head lifting motor 4M increases. At this time, since the load control current upper limit value ILL is set as the upper limit value of the drive current of the pin lifting motor 40M and the head lifting motor 4M, the drive current of the pin lifting motor 40M and the head lifting motor 4M is kept within the range of the load control current upper limit value ILL. This allows the load acting on the die 7a to be controlled to a target load when the tip of the push-up pin 47 reaches the sheet contact position P21 and the tip of the suction head 4H reaches the component contact position P31. Therefore, damage to the die 7a can be suppressed when the die 7a attached to the wafer sheet 8a is gripped by the upward movement of the push-up pin 47 and the downward movement of the suction head 4H.

[0077] Furthermore, when the tip of the push-up pin 47 reaches the sheet contact position P21 and the tip of the suction head 4H reaches the component contact position P31, thereby restricting the upward movement of the push-up pin 47 and the downward movement of the suction head 4H, the drive current of the pin lifting motor 40M and the head lifting motor 4M increases until it reaches the upper limit value ILL for load control current. Therefore, when the drive current of the pin lifting motor 40M and the head lifting motor 4M reaches the upper limit value ILL for load control current, it becomes possible to detect that the tip of the push-up pin 47 has reached the sheet contact position P21 and the tip of the suction head 4H has reached the component contact position P31.

[0078] Next, the upward movement process S4, which the processing unit 101 performs as a post-processing step after the contact movement process S3, will be explained in detail with reference to the flowcharts in Figures 7 and 8.

[0079] In the upward movement process S4, the processing unit 101 reads the first upward position P22 and the second upward position P23 from the storage unit 102. As a result, the processing unit 101 sets the first upward position P22 and the second upward position P23, which are the target positions that the tip of the upward pin 47 will reach when the die 7a is held between the upward pin 47 and the suction head 4H (step S401). Furthermore, the processing unit 101 reads the pin upward speed SPP and the head speed SH from the storage unit 102. As a result, the processing unit 101 sets the pin upward speed SPP as the speed at which the upward pin 47 is moved upward until the tip of the upward pin 47 reaches the first upward position P22 and the second upward position P23, respectively, and sets the head speed SH as the speed at which the suction head 4H is moved upward (step S402).

[0080] Once the first thrust position P22 and the second thrust position P23 are set, and the pin thrust speed SPP and head speed SH are set, the processing unit 101 sets the first thrust PTP time and the second thrust PTP time (step S403). The first thrust PTP time indicates the time required for the thrust pin 47 to move upward from the seat contact position P21 to the first thrust position P22. The second thrust PTP time indicates the time required for the thrust pin 47 to move upward from the first thrust position P22 to the second thrust position P23.

[0081] As will be described in detail later, in the upward movement process S4, the processing unit 101 sets the upward movement speed SPP of the upward movement of the upward movement pin 47 to be higher than the upward movement speed SH of the upward movement of the suction head 4H, and continues to drive the pin lifting motor 40M and the head lifting motor 4M until the tip of the upward movement pin 47 reaches the first upward movement position P22 and the second upward movement position P23, respectively, so that the drive current of the pin lifting motor 40M and the head lifting motor 4M maintains the upper limit value ILL for load control current. In this case, although the setting for speed causes the upward movement pin 47 to move in a way that pushes the suction head 4H upward, the upward movement of the upward movement pin 47 relative to the suction head 4H is restricted by control based on the upper limit value ILL for load control current of the drive current of the pin lifting motor 40M and the head lifting motor 4M. Therefore, although the pin push-up speed SPP of the push-up pin 47 is set to a speed higher than the head speed SH of the suction head 4H, during the actual upward movement of the push-up pin 47 and the suction head 4H in the push-up movement process S4, the upward movement speed of the push-up pin 47 will follow the head speed SH, which is set as the upward movement speed of the suction head 4H. Accordingly, the processing unit 101 calculates the distance between the sheet contact position P21 and the first push-up position P22 as the upward movement distance of the push-up pin 47, and sets the first push-up PTP time by calculating the first push-up PTP time based on the said movement distance and the head speed SH. Similarly, the processing unit 101 calculates the distance between the first push-up position P22 and the second push-up position P23 as the upward movement distance of the push-up pin 47, and sets the second push-up PTP time by calculating the second push-up PTP time based on the said movement distance and the head speed SH.

[0082] Furthermore, the processing unit 101 reads the load control current upper limit value ILL from the storage unit 102. As a result, the processing unit 101 sets the load control current upper limit value ILL as the upper limit value for the drive current of the pin lifting motor 40M and the head lifting motor 4M (step S404).

[0083] Once the setting of the load control current upper limit value ILL is complete, the processing unit 101 starts supplying drive current to the pin lifting motor 40M, thereby starting the upward movement of the push-up pin 47 (step S405). After starting the upward movement of the push-up pin 47, the processing unit 101 starts supplying drive current to the head lifting motor 4M, thereby starting the upward movement of the suction head 4H (step S406). In other words, in the push-up movement process S4, the processing unit 101 controls the driving of the pin lifting motor 40M and the head lifting motor 4M so that the push-up pin 47 starts moving upward earlier than the suction head 4H.

[0084] When the supply of drive current to the pin lifting motor 40M is started, and then when the supply of drive current to the head lifting motor 4M is started, the processing unit 101 controls the drive of the pin lifting motor 40M so that the push-up pin 47 continues to move upward at the speeds included in the pin push-up speed SPP (accelerated drive, constant speed drive, and deceleration drive), and controls the drive of the head lifting motor 4M so that the suction head 4H continues to move upward at the speeds included in the head speed SH (accelerated drive, constant speed drive, and deceleration drive) (step S407). At this time, the processing unit 101 continues to drive the pin lifting motor 40M and the head lifting motor 4M until the tip of the push-up pin 47 reaches the first push-up position P22, so that the drive current of the pin lifting motor 40M and the head lifting motor 4M maintains the upper limit value ILL for load control current.

[0085] The processing unit 101 determines whether the first push-up PTP time has elapsed during the deceleration drive of the push-up pin 47 and the suction head 4H (step S408). If the first push-up PTP time has not elapsed (NO in step S408), the processing unit 101 returns to step S407. On the other hand, if the first push-up PTP time has elapsed (YES in step S408), the processing unit 101 proceeds to step S409. In step S409, the processing unit 101 detects that the tip of the push-up pin 47 has reached the first push-up position P22 based on the signal output from the rotary encoder 40E (Figure 3) provided on the pin lifting motor 40M. When the tip of the push-up pin 47 reaches the first push-up position P22, the processing unit 101 stops the drive of the pin lifting motor 40M and the head lifting motor 4M (step S410).

[0086] After the processing in step S410, the processing unit 101 starts supplying drive current to the pin lifting motor 40M, thereby starting the upward movement of the push-up pin 47 (step S411). After starting the upward movement of the push-up pin 47, the processing unit 101 starts supplying drive current to the head lifting motor 4M, thereby starting the upward movement of the suction head 4H (step S412). In other words, in the push-up movement process S4, the processing unit 101 controls the drive of the pin lifting motor 40M and the head lifting motor 4M so that the push-up pin 47 starts moving upward earlier than the suction head 4H.

[0087] When the supply of drive current to the pin lifting motor 40M is started, and then when the supply of drive current to the head lifting motor 4M is started, the processing unit 101 controls the drive of the pin lifting motor 40M so that the push-up pin 47 continues to move upward at the speeds included in the pin push-up speed SPP (accelerated drive, constant speed drive, and deceleration drive), and controls the drive of the head lifting motor 4M so that the suction head 4H continues to move upward at the speeds included in the head speed SH (accelerated drive, constant speed drive, and deceleration drive) (step S413). At this time, the processing unit 101 continues to drive the pin lifting motor 40M and the head lifting motor 4M until the tip of the push-up pin 47 reaches the second push-up position P23, so that the drive current of the pin lifting motor 40M and the head lifting motor 4M maintains the upper limit value ILL for load control current.

[0088] The processing unit 101 determines whether the second push-up PTP time has elapsed while the push-up pin 47 and the suction head 4H are being driven at a reduced speed (step S414). If the second push-up PTP time has not elapsed (NO in step S414), the processing unit 101 returns to step S413. On the other hand, if the second push-up PTP time has elapsed (YES in step S414), the processing unit 101 proceeds to step S415. In step S415, the processing unit 101 detects that the tip of the push-up pin 47 has reached the second push-up position P23 based on the signal output from the rotary encoder 40E provided on the pin lifting motor 40M. When the tip of the push-up pin 47 reaches the second push-up position P23, the processing unit 101 stops driving the pin lifting motor 40M and the head lifting motor 4M (step S416).

[0089] As described above, in the upward movement process S4, the processing unit 101 sets the pin upward movement speed SPP as the speed of upward movement of the This allows the distance between the push-up pin 47 and the suction head 4H to be kept constant until the tip of the push-up pin 47 reaches the first push-up position P22 and the second push-up position P23, respectively.

[0090] Furthermore, the upper limit value ILL of the load control current supplied to the pin lifting motor 40M and the head lifting motor 4M is set to the upper limit value of the drive current when a target load is applied to the die 7a attached to the wafer sheet 8a. Therefore, by controlling the drive current of the pin lifting motor 40M and the head lifting motor 4M to maintain the upper limit value ILL of the load control current, the target load continues to act on the die 7a, which is held between the push-up pin 47 and the suction head 4H, as the push-up pin 47 and the suction head 4H move upward until the tip of the push-up pin 47 reaches the first push-up position P22 and the second push-up position P23, respectively. As a result, the load acting on the die 7a can be efficiently controlled to the target load based on the setting of the upper limit value ILL of the load control current related to the drive current of the pin lifting motor 40M and the head lifting motor 4M, without using a load measuring instrument as in the conventional technology. Therefore, when the push-up pin 47 and the suction head 4H move upward, damage to the die 7a, which is held between the push-up pin 47 and the suction head 4H, is suppressed, and the die 7a can be properly held by the suction head 4H.

[0091] Furthermore, with the die 7a sandwiched between the push-up pin 47 and the suction head 4H, the push-up pin 47 begins to move upward earlier than the suction head 4H, thus preventing the distance between the push-up pin 47 and the suction head 4H from increasing. This makes it possible to more reliably maintain a constant distance between the push-up pin 47 and the suction head 4H when the target load is applied to the die 7a.

[0092] Furthermore, when the push-up pin 47 and the suction head 4H move upward based on the control of the pin lifting motor 40M and the head lifting motor 4M, it is possible to detect when the tip of the push-up pin 47 has reached the first push-up position P22 and the second push-up position P23, respectively, based on the output signal of the rotary encoder 40E provided on the pin lifting motor 40M. [Explanation of Symbols]

[0093] 1. Component mounting equipment (component transfer equipment) 4 Head Units 4H suction head 4M Head Lifting Motor 40 Push-up unit 40E Rotary Encoder 40M Pin Lifting Motor 47 Push-up pin 5. Parts supply unit 7a Die (part) 8a Wafer sheet (sheet) 100 control units

Claims

1. A parts supply unit having a parts placement area on which multiple parts are arranged while attached to an elastically deformable sheet, A head unit comprising: a suction head provided above the component placement area so as to be movable in the vertical direction and for adsorbing and holding the component on the sheet from above; and a head lifting motor for moving the suction head in the vertical direction; A push-up unit comprising: a push-up pin provided below the component placement area so as to be movable in the vertical direction, which pushes up the component to be picked up by the suction head from below through the sheet; and a pin lifting motor for moving the push-up pin in the vertical direction; The system comprises a control unit that controls the head lifting motor and the pin lifting motor, The control unit is With the tip of the push-up pin positioned at a sheet contact position where it contacts the sheet, and the tip of the suction head positioned at a component contact position where it contacts the component on the sheet, the pin lifting motor is controlled to move upward until the tip of the push-up pin reaches a push-up position above the sheet contact position, and the head lifting motor is controlled to move upward in accordance with the upward movement of the push-up pin, thereby performing a push-up movement process. In the aforementioned upward movement process, the speed of upward movement of the upward-moving pin is set to be greater than the speed of upward movement of the suction head, and a load control current upper limit value is set for the drive current of the pin lifting motor and the head lifting motor, indicating the upper limit value when a target load is applied to the component. The drive current of the pin lifting motor and the head lifting motor is maintained at the load control current upper limit value, and the drive of the pin lifting motor and the head lifting motor is continued until the tip of the upward-moving pin reaches the upward-moving position, thereby maintaining a constant distance between the upward-moving pin and the suction head in the component transfer device.

2. The component transfer device according to claim 1, wherein the control unit controls the pin lifting motor and the head lifting motor so that the push-up pin starts moving upward earlier than the suction head during the push-up movement process.

3. The aforementioned lifting unit has a rotary encoder provided on the pin lifting motor, The component transfer device according to claim 1 or 2, wherein the control unit detects, in the upward movement process, that the tip of the upward pin has reached the upward position based on a signal output from the rotary encoder.

4. The control unit is As a preprocessing step before the aforementioned upward movement process, a contact movement process is performed in which the pin lifting motor is controlled to move upward until the tip of the upward-moving pin reaches the sheet contact position, and the head lifting motor is controlled to move downward until the tip of the suction head reaches the component contact position. The component transfer device according to claim 1, wherein in the contact movement process, the pin lifting motor and the head lifting motor are controlled so that the drive current of the pin lifting motor and the head lifting motor remain within a range less than or equal to the upper limit of the load control current.

5. The component transfer device according to claim 4, wherein the control unit detects that, in the contact movement process, when the drive current of the pin lifting motor and the head lifting motor reaches the upper limit of the load control current, the tip of the push-up pin reaches the sheet contact position and the tip of the suction head reaches the component contact position.

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