Photosensitive resin composition, photosensitive resin film utilizing the same, display device, and method for manufacturing a photosensitive resin film

Abstract

To provide a photosensitive resin composition that is sufficiently curable even at low temperatures, effectively forms high-resolution patterns, and can ensure high color reproducibility and a wide viewing angle.SOLUTION: The present invention provides: an antioxidant-free photosensitive resin composition including (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator and (E) a solvent, wherein the colorant is included in an amount of 80 wt.% to 95 wt.% based on the total weight of the photosensitive resin composition, the polymerization initiator is included in an amount of 0.65 wt.% to 1.3 wt.% based on the total weight of the photosensitive resin composition, the colorant comprises a green pigment and a yellow pigment, and the green pigment is included in an amount of greater than or equal to 50 wt.%, based on the total weight of the colorant; a photosensitive resin layer made using the same; a display device including the photosensitive resin layer; and a method of manufacturing a photosensitive resin layer.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin film using the same, a display device, and a method for manufacturing the photosensitive resin film.

Background Art

[0002] In recent years, as a display panel applied to VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) devices, there has been an increasing interest in a self-emitting (Emissive) micro OLED display panel that emits light by itself. Note that OLED refers to an organic light-emitting diode, and micro OLED refers to an OLED that is about 10 times smaller than a general OLED as described below.

[0003] In the case of a micro OLED display panel in which the pixel size is about 10 times smaller than that of a general OLED display panel, it is difficult to precisely form red (R) / green (G) / blue (B) light-emitting layers using a conventional fine metal mask (FMM: Fine Metal Mask) technology. That is, when applying a conventional liquid crystal display to devices such as VR and AR, the size of the color filter pattern is large, and it is impossible to increase the resolution.

[0004] In recent years, OLEDos (OLED on Silicon) technology has been introduced to achieve high resolutions of 4000 ppi or more. This technology uses an OLED deposited on a silicon wafer as a backlight, and a color filter is patterned on top of it. The color filters used in conventional liquid crystal displays have patterns of about 100 μm formed on glass, and are cured through exposure and a post-bake process at high temperatures of 230°C or higher. On the other hand, the color filters formed on OLEDos cannot undergo high-temperature processes because they are OLEDs, so they must be able to be cured at low temperatures, and fine patterning is also important to increase resolution. Due to the small size of VR, AR, and MR devices, fine patterning is essential to achieve the desired resolution within those constraints.

[0005] However, because curing only occurs at low temperatures (below 100°C), conventional color filters made from these materials have problems in that it is difficult to form high-resolution patterns and ensure color reproduction accuracy and viewing angle. [Overview of the project] [Problems that the invention aims to solve]

[0006] One embodiment of the present invention provides a photosensitive resin composition that cures sufficiently even at low temperatures, exhibits excellent high-resolution pattern formation properties, and further enables high color reproduction and wide viewing angles.

[0007] Another embodiment is to provide a photosensitive resin film manufactured using the above-mentioned photosensitive resin composition.

[0008] Another embodiment is to provide a display device including the above-mentioned photosensitive resin film.

[0009] Another embodiment provides a method for manufacturing the above-mentioned photosensitive resin film. [Means for solving the problem]

[0010] One embodiment of the present invention provides an antioxidant-free photosensitive resin composition comprising (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent, wherein the colorant and polymerization initiator are present in amounts of 80% to 95% by weight and 0.65% to 1.3% by weight, respectively, relative to the total amount of the photosensitive resin composition, and the colorant comprises a green pigment and a yellow pigment, wherein the green pigment is present in amounts of 50% by weight or more relative to the total amount of the colorant.

[0011] The green pigment and the yellow pigment may each be included independently in the form of a pigment dispersion.

[0012] The binder resin may be an acrylic binder resin.

[0013] The acrylic binder resin may have an acid value of 50 KOH mg / g or higher and a weight-average molecular weight of 7000 g / mol or lower.

[0014] Acrylic binder resins can have a double bond equivalent of 360 g / mol or more.

[0015] A polymerizable monomer may contain one or more compounds that have three or more functional groups.

[0016] A polymerizable monomer is a mixture of two compounds, each of which may independently contain three or more functional groups.

[0017] The two compounds may be mixed in a 1:1 weight ratio.

[0018] The polymerizable monomer may be included in a higher concentration than the binder resin.

[0019] The photosensitive resin composition may have a full width at half maximum of less than 105 nm.

[0020] The photosensitive resin composition may have a transmittance of less than 8% at 630 nm.

[0021] The photosensitive resin composition may contain, based on the total amount of the photosensitive resin composition, 1% to 5% by weight of the (A) binder resin, 80% to 95% by weight of the (B) colorant, 1% to 10% by weight of the (C) polymerizable monomer, 0.65% to 1.3% by weight of the (D) polymerization initiator, and the balance amount of the (E) solvent.

[0022] The photosensitive resin composition may further contain an additive such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, or a combination thereof.

[0023] The photosensitive resin composition may be a composition for a micro OLED display device.

[0024] Another embodiment provides a photosensitive resin film manufactured using the above photosensitive resin composition.

[0025] Still another embodiment provides a display device including the above photosensitive resin film.

[0026] The display device may be a micro OLED display device including an OLED substrate deposited on a silicon wafer and a color filter layer laminated on the OLED substrate for converting white light generated by the OLED substrate into a plurality of color lights, and the color filter layer includes a red color filter, a green color filter, and a blue color filter.

[0027] Still another embodiment provides a method for manufacturing a photosensitive resin film including steps of applying the photosensitive resin composition, pre-baking at a temperature of 100 °C or lower after application, exposing with i-line after pre-baking, and developing.

[0028] In addition, specific matters of an embodiment of the present invention are included in the following detailed description. [Effects of the Invention]

[0029] The photosensitive resin composition according to one embodiment of the present invention can be cured at low temperatures of 100°C or below, enables the realization of fine patterns to ensure high resolution, has excellent spectral characteristics, and can secure a wide color gamut. In particular, it has excellent color characteristics even with only temperature and photocuring (i-line exposure) during pre-baking at 100°C or below, and enables the realization of fine patterns, making it suitable for application to micro OLED display devices. [Brief explanation of the drawing]

[0030] [Figure 1] This graph shows the spectral spectra of the photosensitive resin compositions according to Example 1 and Comparative Example 3. [Modes for carrying out the invention]

[0031] The embodiments of the present invention will be described in detail below. However, these are presented as examples only and do not limit the present invention, and one embodiment of the present invention is not limited to those defined by the claims described later.

[0032] In this specification, unless otherwise specified, "alkyl group" means a C1-C20 alkyl group, "alkenyl group" means a C2-C20 alkenyl group, "cycloalkenyl group" means a C3-C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3-C20 heterocycloalkenyl group, "aryl group" means a C6-C20 aryl group, "arylalkyl group" means a C6-C20 arylalkyl group, "alkylene group" means a C1-C20 alkylene group, "arylene group" means a C6-C20 arylene group, "alkylarylene group" means a C6-C20 alkylarylene group, "heteroarylene group" means a C3-C20 heteroarylene group, and "alkoxylene group" means a C1-C20 alkoxylene group.

[0033] In this specification, unless otherwise specified, “substituted” means a substituent in which at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxyl group, a C1-C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or its salt, a sulfonic acid group or its salt, phosphoric acid or its salt, a C1-C20 alkyl group, a C2-C20 alkenyl group, a C2-C20 alkynyl group, a C6-C20 aryl group, a C3-C20 cycloalkyl group, a C3-C20 cycloalkenyl group, a C3-C20 cycloalkynyl group, a C2-C20 heterocycloalkyl group, a C2-C20 heterocycloalkenyl group, a C2-C20 heterocycloalkynyl group, a C3-C20 heteroaryl group, or a substituent of any combination thereof.

[0034] Furthermore, unless otherwise specified in this specification, "hetero" means that the chemical formula contains at least one heteroatom from at least one of N, O, S, and P.

[0035] Furthermore, unless otherwise specified herein, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible.

[0036] In this specification, unless otherwise defined, “combination” means mixing or copolymerization. “Copolymerization” means block copolymerization or random copolymerization, and “copolymer” means block copolymerization or random copolymerization.

[0037] In the chemical formulas shown herein, unless otherwise defined, if a chemical bond is not depicted in a position where a chemical bond should be shown, it means that a hydrogen atom is bonded to that position.

[0038] In this specification, unless otherwise defined, "*" means a portion that is linked to the same or different atoms or chemical formulas.

[0039] A photosensitive resin composition according to one embodiment is an antioxidant-free composition, comprising (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent, wherein the colorant and polymerization initiator are present in amounts of 80% to 95% by weight and 0.65% to 1.3% by weight, respectively, based on the total amount of the photosensitive resin composition, and the colorant comprises a green pigment and a yellow pigment, with the green pigment present in amounts of 50% by weight or more based on the total amount of the colorant.

[0040] Conventional color photoresists are negative-type photosensitive liquid materials realized in red, green, and blue color patterns, and technological development has focused on gradually altering the composition of the liquid material. For example, efforts have been made to improve color purity by changing the type and content of pigment dispersions, which are the colorants that realize the color patterns; to improve patternability by changing the composition of binder resins and photopolymerization initiators; and to improve coating properties and color uniformity by using other additives such as leveling agents.

[0041] One embodiment of the present invention relates to a photosensitive resin composition applied to a color filter process used in a microOLED display device, and more specifically, to a green photosensitive resin composition applied to a green color filter process, unlike conventional color photoresists.

[0042] Micro-OLED refers to a WOLED (White OLED) deposited onto a silicon wafer. Among inventors, it is sometimes called OLEDoS (Organic-Light Emitting Diode on Silicon). A micro-OLED display device refers to a display device that utilizes micro-OLED technology.

[0043] With the advent of the Fourth Industrial Revolution, the metaverse market is growing rapidly, and there is a growing need to develop display devices that enhance the realism and visibility of AR, VR, and MR equipment, while minimizing the induction of dizziness. For this purpose, various candidate technologies exist, such as LCoS (Liquid Crystal on Silicon), LEDoS (Light Emitting Diode on Silicon), and OLEDoS (Organic-Light Emitting Diode on Silicon). Among these, OLEDoS technology development is rapidly progressing in various places due to its advantages such as a high brightness ratio, fast response speed, and self-emissive nature, which allows for a relatively simple optical system and reduces the volume and weight of the device.

[0044] In the case of OLEDoS, high-resolution microdisplays must be realized, which requires the formation of pixels that are extremely small, on the order of a few micrometers, compared to conventional displays. Furthermore, the color filters must be formed through a low-temperature process to avoid damaging the underlying OLED, which presents many development challenges.

[0045] Against this background, the inventors have developed a photosensitive resin composition that not only cures at low temperatures below 100°C, but also achieves fine patterns and excellent color uniformity. This is achieved by controlling the content of colorants and polymerization initiators, further controlling the content of green pigment in the colorants, and developing a composition that does not contain antioxidants. Due to these properties, the photosensitive resin composition according to one embodiment can be applied to next-generation displays such as VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality), such as micro-OLED displays.

[0046] The following provides a detailed explanation of each component.

[0047] (A) Binder resin The binder resin may include acrylic binder resins. For example, the binder resin may be an acrylic binder resin.

[0048] The acrylic binder resin is a resin comprising one or more acrylic repeating units in a copolymer of a primary ethylenically unsaturated monomer and a secondary ethylenically unsaturated monomer copolymerizable therewith.

[0049] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or combinations thereof.

[0050] The first ethylenically unsaturated monomer may be present in an amount of 5% to 50% by weight, for example, 10% to 40% by weight, relative to the total amount of the acrylic binder resin.

[0051] Examples of secondary ethylenically unsaturated monomers include aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzyl methyl ether; unsaturated carboxylate ester compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylate aminoalkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; vinyl carboxylate ester compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylate glycidyl ester compounds such as glycidyl (meth)acrylate; vinyl cyanide compounds such as (meth)acrylonitrile; and unsaturated amide compounds such as (meth)acrylamide. These can be used individually or in combination of two or more.

[0052] Specific examples of acrylic binder resins include (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, and (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, but are not limited to these, and can be used individually or in combination of two or more types.

[0053] The acrylic binder resin can have a weight-average molecular weight of 7,000 g / mol or less, for example, a weight-average molecular weight of 3,000 g / mol to 7,000 g / mol, an acid value of 50 KOH mg / g or more, for example, an acid value of 50 KOH mg / g to 90 KOH mg / g, for example, an acid value of 60 KOH mg / g to 80 KOH mg / g, and a double bond equivalent of 360 g / mol or more. When the weight-average molecular weight, acid value, and double bond equivalent of the acrylic binder resin are within the above ranges, it will have excellent pattern-forming properties, and the resulting thin film will have excellent mechanical and thermal properties.

[0054] The binder resin may further contain epoxy-based binder resin.

[0055] The heat resistance of the binder resin can be improved by further including an epoxy binder resin. Examples of epoxy binder resins include, but are not limited to, phenol novolac epoxy resins, tetramethylbiphenyl epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, alicyclic epoxy resins, or combinations thereof.

[0056] Furthermore, binder resins containing epoxy-based binder resins ensure the dispersion stability of colorants such as pigments, as described later, while simultaneously enabling the formation of pixels with the desired resolution during the development process.

[0057] The epoxy binder resin may be included in an amount of 1% to 10% by weight, for example, 5% to 10% by weight, relative to the total amount of binder resin. When the epoxy binder resin is included within the above range, the residual film rate and chemical resistance are greatly improved.

[0058] The epoxy equivalent weight of the epoxy binder resin may be between 150 g / eq and 200 g / eq. When an epoxy binder resin having an epoxy equivalent weight within the above range is included in the binder resin, it has a favorable effect on improving the degree of curing of the formed pattern and on the adhesion of the colorant within the structure in which the pattern is formed.

[0059] The binder resin may be included in an amount of 1% to 5% by weight, for example, 1% to 4% by weight, or for example, 2% to 4% by weight, relative to the total amount of the photosensitive resin composition. When the binder resin is included within the above range, excellent sensitivity, developability, resolution, and pattern straightness can be obtained.

[0060] (B) Colorants The photosensitive resin composition according to one embodiment may be a green photosensitive resin composition, in which case the colorants in the composition may include a green pigment and a yellow pigment. The green pigment can be CI green pigment 7, CI green pigment 36, CI green pigment 58, CI green pigment 59, etc., within the Color Index, and these can be used individually or in combination of two or more, but are not necessarily limited thereto.

[0061] Yellow pigments within the Color Index may include isoindoline pigments such as CI Yellow Pigment 185 and CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, and nickel complex pigments such as CI Yellow Pigment 150. These may be used individually or in combination of two or more, and are not necessarily limited to these.

[0062] In this case, the green pigment may be included in a larger weight than the yellow pigment. Specifically, the green pigment may be included in an amount of 50% by weight or more relative to the total amount of colorant. Furthermore, the colorant containing the green pigment and the yellow pigment may be included in an amount of 80% to 95% by weight, for example 80% to 90% by weight, or for example 80% to 85% by weight, relative to the total amount of the photosensitive resin composition according to one embodiment. When the content of the colorant is controlled as described above, and the content of the green pigment in the colorant is further controlled as described above, the full width at half maximum becomes narrower, the color reproduction rate increases, and the transmittance at 630 nm decreases, making it very easy to achieve the effect of improving the viewing angle.

[0063] For example, a photosensitive resin composition according to one embodiment can have a full width at half maximum of less than 105 nm, which is advantageous for increasing color reproduction accuracy.

[0064] For example, the photosensitive resin composition according to one embodiment may have a transmittance of less than 8% at 630 nm, and therefore exhibits excellent viewing angle improvement effects.

[0065] In addition to green and yellow pigments, the colorants may also include purple pigments and other pigments.

[0066] Purple pigments within the Color Index may include CI Violet Pigment 23 (V.23), CI Violet Pigment 29, Dioxazine Violet, First Violet B, Methyl Violet Lake, Indantrene Brilliant Violet, etc., and may be used individually or in mixtures of two or more, but are not necessarily limited to these.

[0067] These pigments can be used individually or in combination of two or more.

[0068] Pigments can also be used after pretreatment with water-soluble inorganic salts and wetting agents. Pretreatment of pigments can reduce their average particle size.

[0069] The pretreatment can be carried out by kneading the pigment with a water-soluble inorganic salt and a wetting agent, and then filtering and washing the pigment obtained in the kneading step.

[0070] Kneading is performed at a temperature of 40°C to 100°C, and filtration and washing can be carried out by washing the inorganic salts with water and then filtering.

[0071] Examples of water-soluble inorganic salts include, but are not limited to, sodium chloride and potassium chloride. The wetting agent acts as a medium that allows the pigment and water-soluble inorganic salt to mix uniformly and the pigment to be easily pulverized. Examples of wetting agents include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether, and alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol. These can be used individually or in combination of two or more.

[0072] Pigments that have undergone the kneading step can have an average particle size of 5 nm to 200 nm, for example, 5 nm to 150 nm. When the average particle size of the pigment is within the above range, it exhibits excellent stability in the pigment mill base (pigment dispersion) and there is no risk of a decrease in pixel resolution.

[0073] Pigments, such as green pigments and yellow pigments, can each be used independently with a dispersant and a solvent in the form of a pigment dispersion, for example, in a mill base.

[0074] The dispersant can ensure that the pigment is uniformly dispersed in the dispersion, and nonionic, anionic, or cationic dispersants can be used, respectively. Specifically, polyalkylene glycol or its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylate esters, carboxyates, alkylamide alkylene oxide adducts, alkylamines, etc., can be used individually or in combination of two or more.

[0075] Examples of commercially available dispersants include BYK's DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc., and EFKA Chemistry. Examples include CAL's EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc.; Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; and Ajinomoto's PB711, PB821, etc.

[0076] The dispersant may be included in an amount of 0.1% to 15% by weight relative to the total amount of the photosensitive resin composition. When the dispersant is included within the above range, the composition has excellent dispersibility, resulting in excellent stability, developability, and patternability during the production of the photosensitive resin film.

[0077] The pigment dispersion may further contain, in addition to the pigment, dispersant, and (dispersion) solvent, dispersion aids, dispersion resins, etc. The solid pigment is present in an amount of 5% to 20% by weight, for example, 8% to 15% by weight, relative to the total amount of the pigment dispersion.

[0078] As the (dispersion) solvent for the pigment dispersion, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc., can be used, and among these, propylene glycol methyl ether acetate can be used.

[0079] The dispersion resin can be an acrylic resin containing carboxyl groups, which can not only improve the stability of the pigment dispersion but also improve the patternability of the pixels.

[0080] The colorant may contain a pigment and further a dye, in which case the photosensitive resin composition of one embodiment can become a hybrid composition. The dye is not particularly limited, but may include metal complex dyes.

[0081] Metal complex dyes can use compounds that have maximum absorbance in the wavelength range of 200 nm to 650 nm. To match the color coordinates of the dye combination, any metal complex dye of any color that dissolves in organic solvents can be used, as long as it has absorbance within the above range.

[0082] Specifically, metal complex dyes can be a green dye having maximum absorbance in the 530nm-680nm wavelength range, a yellow dye having maximum absorbance in the 200nm-400nm wavelength range, an orange dye having maximum absorbance in the 300nm-500nm wavelength range, a red dye having maximum absorbance in the 500nm-650nm wavelength range, or a combination thereof.

[0083] Metal complex dyes can be direct dyes, acid dyes, basic dyes, acid mordant dyes, sulfur dyes, reductive dyes, azoic dyes, disperse dyes, reactive dyes, oxidation dyes, utility dyes, azo dyes, anthraquinone dyes, indigoid dyes, carbonium ion dyes, phthalocyanine dyes, nitro dyes, quinoline dyes, cyanine dyes, polymethine dyes, or combinations thereof.

[0084] Metal complex dyes may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

[0085] Metal complex dyes include CI solvent dyes such as CI Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35, and CI Acid Green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109. Dyes, CI Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82 and other CI Direct dyes, CI Basic Green 1 and other CI Basic dyes, CI Mordant Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41 A complex of metal ions can be used with at least one selected from the group consisting of CI mordant dyes such as 43 and 53, green pigments such as CI pigment greens 7, 36 and 58, solvent yellow 19, solvent yellow 21, solvent yellow 25, solvent yellow 79, solvent yellow 82, solvent yellow 88, solvent orange 45, solvent orange 54, solvent orange 62, solvent orange 99, solvent red 8, solvent red 32, solvent red 109, solvent red 112, solvent red 119, solvent red 124, solvent red 160, solvent red 132 and solvent red 218.

[0086] The dye containing the metal complex has a solubility of 5 or higher in the solvent used in the photosensitive resin composition according to one embodiment, i.e., the solvent described later, and specifically may be 5 to 10. Solubility can be obtained by the amount (g) of dye dissolved in 100g of solvent. When the solubility of the dye containing the metal complex is within the above range, compatibility with other components forming the photosensitive resin composition according to one embodiment and coloring ability can be ensured, and precipitation of the dye can be prevented.

[0087] The solvent can be, for example, propylene glycol mono methyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

[0088] The dye containing the metal complex is included in the photosensitive resin composition in an amount of 0.01% to 1% by weight, for example, 0.01% to 0.5% by weight, relative to the total amount of the photosensitive resin composition. When the dye containing the metal complex is used within the above range, high brightness and light-dark ratio can be achieved in the desired color coordinates.

[0089] When mixing dyes and pigments, they can be used in a weight ratio of 0.1:99.9 to 99.9:0.1, specifically 1:9 to 9:1. Mixing within this weight ratio range allows for appropriate control of chemical resistance and maximum absorption wavelength, resulting in high brightness and contrast ratio at the desired color coordinates.

[0090] As mentioned above, the colorant is included in the total amount of the photosensitive resin composition at a concentration of 80% to 95% by weight, for example, 80% to 90% by weight, or for example, 80% to 85% by weight. When the colorant is included at such a high concentration as described above, it becomes easier to achieve excellent coloring effect and developability in the micro OLED display device, and to ensure high color reproduction and viewing angle characteristics.

[0091] (C) Polymerizable monomer In one embodiment, the polymerizable monomer in the photosensitive resin composition may contain one or more compounds having three or more functional groups. In this case, the functional groups are, but are not limited to, (meth)acrylate groups, epoxy groups, etc.

[0092] One embodiment of the photosensitive resin composition was developed for use in micro-OLED display devices, where a low-temperature curing process is essential. In the case of a low-temperature curing pattern process, the contribution of thermal curing decreases, and the influence of photocuring becomes greater. Therefore, maximizing photocuring efficiency is advantageous for ensuring excellent patternability under low-temperature curing. According to one embodiment, photocuring efficiency can be maximized by using a compound having at least three functional groups in the monomer as the polymerizable monomer. Specifically, photocuring efficiency is greatly influenced by the weight-average molecular weight and the number of functional groups of the polymerizable monomer. Generally, the smaller the weight-average molecular weight and the greater the number of functional groups in the polymerizable monomer, the higher the photocuring efficiency. For example, a compound with at least three functional groups in the monomer has a small weight-average molecular weight and a large number of functional groups, making it advantageous for maximizing photocuring efficiency.

[0093] For example, the polymerizable monomer may be a mixture of two compounds, each of which may independently contain three or more functional groups. For example, the polymerizable monomer may be a mixture of a polymerizable compound containing three functional groups and a polymerizable compound containing four to six functional groups. When the polymerizable monomer has such a mixed composition, it is possible to maximize the photocuring efficiency while maintaining the aforementioned color characteristics, thereby facilitating the formation of low-temperature cured patterns.

[0094] For example, the two compounds described above are mixed in a 1:1 weight ratio. When the two compounds are mixed in the same weight ratio, the low-temperature curing patternability is best.

[0095] For example, a polymerizable compound containing three functional groups is represented by the following chemical formula 1, but is not necessarily limited to this.

[0096] [ka]

[0097] In chemical formula 1, L 1 ~L 4 These are, independently, substituted or unsubstituted C1-C20 alkylene groups, substituted or unsubstituted C1-C20 oxyalkylene groups, or combinations thereof. R 1 ~R 4 Each is independently a hydrogen atom, a hydroxyl group, an epoxy group, or a substituted or unsubstituted (meth)acrylate group, except R 1 ~R 4 Three of these are necessarily epoxy groups or substituted or unsubstituted (meth)acrylate groups.

[0098] For example, compounds containing 4 to 6 functional groups include, but are not limited to, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, or combinations thereof.

[0099] For example, polymerizable monomers are included in a higher content than the binder resin. In conventional photosensitive resin compositions for color filters, it was common for the binder resin to be included in a higher content than the polymerizable monomers. However, the photosensitive resin composition according to one embodiment is applied to a microOLED display device that includes a WOLED deposited on a silicon wafer other than a glass substrate or polyimide as a light source. Since low-temperature curing is essential, it is advantageous in improving patternability when the polymerizable monomer content is higher than that of the binder resin. Specifically, when the polymerizable monomer content is higher than that of the binder resin, sufficient polymerization is induced during exposure in the low-temperature pattern formation process, together with the photopolymerization initiator described later, and patterns with excellent heat resistance, light resistance, and chemical resistance can be formed even in low-temperature processes below 100°C. Conventional color filters for liquid crystal displays (LCDs) formed patterns of about 100 μm using resist, but these patterns were too large for use in micro OLED display devices. Therefore, the inventors controlled the content of polymerizable monomers and binder resins as described above, and further controlled the content of the photopolymerization initiator described later, thereby achieving fine patterns and enabling low-temperature curing.

[0100] Polymerizable monomers can also be treated with acid anhydrides before use to impart better developability.

[0101] The polymerizable monomer is included in an amount of 1% to 10% by weight, for example, 1% to 5% by weight, relative to the total amount of the photosensitive resin composition. When the polymerizable monomer is included within the above range, sufficient curing occurs during exposure in the low-temperature pattern formation process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, as well as excellent resolution and adhesion.

[0102] (D) Polymerization initiator A photosensitive resin composition according to one embodiment contains a polymerization initiator. In this case, the polymerization initiator is controlled to be 0.65% to 1.3% by weight, for example, 0.65% to 1.0% by weight, relative to the total amount of the photosensitive resin composition. When the content of the polymerization initiator is controlled as described above, it is possible to form an optimal pattern in the low-temperature curing process together with the composition of the polymerizable monomer, binder resin, and colorant described above. When a polymerization initiator that deviates from the above content range is used together with the composition of the polymerizable monomer, binder resin, and colorant described above, the patternability in the low-temperature curing process is greatly reduced, which is undesirable.

[0103] Polymerization initiators can include acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, oxine compounds, or combinations thereof.

[0104] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

[0105] Examples of benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylic benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0106] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0107] Examples of benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyldimethyl ketal.

[0108] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine. Examples include din, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, and 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine.

[0109] Examples of oxine compounds include O-acyloxine compounds, 2-(O-benzoyloxine)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxine)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropane-1-one. Specific examples of O-acyloxine compounds include, but are not limited to, 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine-4-ylphenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butan-1,2-dione-2-oxin-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxin-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-oneoxin-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-oneoxin-O-acetate.

[0110] Polymerization initiators can be used not only with compounds but also with other compounds such as carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, and non-imidazole compounds.

[0111] (E) Solvent The solvent can be a substance that is compatible with but does not react with pigment dispersions containing colorants, binder resins, polymerizable monomers, and polymerization initiators.

[0112] Examples of solvents include alcohols such as methanol and ethanol, ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran, glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether, cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate, carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether, propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate, aromatic hydrocarbons such as toluene and xylene, methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, and methyl Ketones such as -n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, 2-heptanone, saturated aliphatic monocarboxylate alkyl esters such as ethyl acetate, -n-butyl acetate, isobutyl acetate, lactic acid esters such as methyl lactate, ethyl lactate, alkyl oxyacetates such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, alkyl alkoxyacetates such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxypropionic acid 3-hydroxypropionate alkyl esters such as ethyl 3-hydroxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, propyl 2-hydroxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate,Alkyl 2-alkoxypropionates such as methyl 2-ethoxypropionate, 2-oxy-2-methylpropionates such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate, alkyl monooxymonocarboxylates of alkyl 2-alkoxy-2-methylpropionates such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate, esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate, Examples include ketonic acid esters such as ethyl pyruvate, as well as high-boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0113] Of these, preferably, considering compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether, ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate, esters such as ethyl 2-hydroxypropionate, carbitols such as diethylene glycol monomethyl ether, and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate are used.

[0114] The solvent may be included in the remainder of the total amount of the photosensitive resin composition, for example, 0.1% to 10% by weight, for example, 0.1% to 5% by weight, or for example, 0.1% to 3% by weight. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, resulting in excellent processability during the production of the photosensitive resin film.

[0115] (F) Other additives On the other hand, the photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, silane coupling agents, leveling agents, surfactants, or combinations thereof, but will not contain antioxidants.

[0116] The photosensitive resin composition according to one embodiment contains the aforementioned binder resin, colorant, polymerizable compound, polymerization initiator, and solvent. If an antioxidant is further included, the photocuring reaction may not proceed correctly, resulting in incomplete pattern formation during the low-temperature curing process and the inability to form high-resolution patterns. Therefore, the photosensitive resin composition according to one embodiment has an antioxidant-free composition, i.e., it does not contain an antioxidant.

[0117] Silane coupling agents may have reactive substituents such as vinyl groups, carboxyl groups, methacrylate groups, isocyanate groups, and epoxy groups to improve adhesion to the substrate.

[0118] Examples of silane coupling agents include trimethoxysilylbenzoic acid, γ-methacrylateoxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatetopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, which can be used individually or in combination of two or more.

[0119] The silane coupling agent is included in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, excellent adhesion and storage properties are obtained.

[0120] Furthermore, the photosensitive resin composition may further contain surfactants, such as fluorinated surfactants and / or silicone surfactants, as needed to improve coating properties and prevent the formation of defects.

[0121] As fluorine-based surfactants, commercially available products such as BM-1000 (registered trademark) and BM-1100 (registered trademark) from BM Chemie, Megapack F 142D (registered trademark), F 172 (registered trademark), F 173 (registered trademark), F 183 (registered trademark), F 554 (registered trademark), and F 556 (registered trademark) from Dainippon Ink and Chemicals, Inc., Fluodad FC-135, FC-170C, FC-430, and FC-431 from Sumitomo Lime Co., Ltd., Surflon S-112, S-113, S-131, S-141, and S-145 from Asahi Glass Co., Ltd., and SH-28PA, -190, -193, SZ-6032, and SF-8428 from Toray Silicon Co., Ltd. can be used.

[0122] For silicone-based surfactants, you can use those commercially available from BYK Chem, such as BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, and BYK-325.

[0123] The surfactant is used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the surfactant is within the above range, coating uniformity is ensured, staining does not occur, and excellent wetting properties are obtained for IZO substrates or glass substrates.

[0124] Furthermore, the photosensitive resin composition may contain a certain amount of other additives, such as stabilizers, as long as they do not impair its physical properties.

[0125] The photosensitive resin composition according to one embodiment may be positive or negative, but it is more preferable to be negative in order to more completely remove residues in the region where the pattern is exposed after exposure and development of the light-shielding composition.

[0126] Another embodiment provides a photosensitive resin film manufactured by low-temperature curing, exposure, and development of the aforementioned photosensitive resin composition. This differs from the conventional LCD process in that it eliminates the need for a post-curing (post-baking) step.

[0127] The method for manufacturing a photosensitive resin film is as follows:

[0128] (1) Application and coating film formation step (low-temperature curing) A photosensitive resin composition is applied to a substrate such as a glass substrate or ITO substrate that has undergone a predetermined pretreatment, to a desired thickness using methods such as spin coating, slit coating, roll coating, screen printing, or applicator coating. The photosensitive resin film is then formed by heating at a temperature of 100°C or lower, for example 85°C, for 1 to 10 minutes to remove the solvent. This step enables improvements in image quality, such as reducing staining.

[0129] (2) Exposure step To form the necessary pattern on the resulting photosensitive resin film, an i-line active ray is irradiated after a mask has been placed over it. Light sources that can be used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.

[0130] The exposure dose varies depending on the type and amount of each component in the composition and the thickness of the dried film, but when using a high-pressure mercury lamp, 500 mJ / cm² is used. 2(Based on a 365nm sensor) The exposure is less than or equal to 500 mJ / cm². However, in some cases, the exposure may be 500 mJ / cm². 2 This may exceed (the value obtained from a 365nm sensor). This step allows for fine adjustment of the pixel size, enabling high resolution.

[0131] (3) Development step In the development method, following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unwanted parts, leaving only the exposed areas to form a pattern. This step allows for the formation of a profile, achieving high resolution, ensuring color uniformity, and improving sharpness.

[0132] Another embodiment provides a display device including a photosensitive resin film.

[0133] The display device may be a microorganic light-emitting diode (OLED) display device.

[0134] A microorganic light-emitting diode (OLED) display device includes an OLED substrate deposited on a silicon wafer and a color filter layer stacked on the OLED substrate, which converts the white light generated by the OLED substrate into multiple color lights. The color filter layer may include a red color filter, a green color filter, and a blue color filter.

[0135] For example, a microorganic light-emitting diode (OLED) display device includes an OLED substrate deposited on a silicon wafer, an inorganic layer laminated on the OLED substrate, a protective adhesive layer laminated on the inorganic layer, and a color filter layer laminated on the protective adhesive layer that converts the white light generated by the OLED substrate into multiple color lights. The color filter layer may include a red color filter, a green color filter, and a blue color filter.

[0136] For example, the photosensitive resin composition according to one embodiment is a green photosensitive resin composition, and the green color filter in the microOLED display device may be a low-temperature cured film of the green photosensitive resin composition.

[0137] Conventionally, OLED substrates in which OLEDs were deposited on glass or polyimide substrates were used, but in one embodiment of the microOLED display device, the OLED is deposited on a silicon wafer, which is more advantageous for realizing microdisplays. Such microdisplays are attracting attention as next-generation displays, and microdisplays are planned to be applied to devices such as MR (Mixed Reality). In fact, Apple, Meta, LG Display, and others have all already entered the next-generation MR device market or have announced their entry.

[0138] For example, a microOLED display device may further include a microlens array. The microlens array may be located on a protective adhesive layer and may surround a color filter layer.

[0139] A microOLED display device with the structure described above is advantageous for ensuring high color reproduction and high resolution because WOLEDs are deposited on a highly integrated silicon wafer, driven on a pixel-by-pixel basis, and the transmitted wavelength can be easily controlled via a color filter layer patterned with a resolution of 3 μm or less.

[0140] For example, the thickness of the protective adhesive layer may be 1 μm or less. In this case, the above effect can be further maximized.

[0141] For example, the thickness of the color filter layer may be 1.1 μm to 1.6 μm.

[0142] When the thickness of the color filter layer is controlled as described above, it is more advantageous for realizing a micro OLED display device.

[0143] For example, the thickness of the inorganic layer may be 2 μm or less. Even with WOLEDs, light does not always diffuse only in a direction perpendicular to the OLED substrate, so mixing of red, green, and blue colors inevitably occurs. Conventionally, an inorganic layer has been deposited on the OLED substrate to prevent such mixing. However, even with the deposition of an inorganic layer, mixing is not completely prevented. Therefore, in one embodiment, by thinning the inorganic layer, for example, by controlling the thickness of the inorganic layer to 2 μm or less, minute light leakage during development can be prevented.

[0144] As described above, the photosensitive resin composition according to one embodiment allows for the production of a cured film by low-temperature (100°C) curing during pre-baking and i-line photocuring alone, resulting in a significant difference in achievable resolution compared to conventional display devices.

[0145] Preferred embodiments of the present invention are disclosed below. However, the following embodiments are merely preferred embodiments of the present invention, and the present invention is not limited to these embodiments. [Examples]

[0146] (Manufacturing of photosensitive resin composition) Examples 1 to 23 and Comparative Examples 1 to 14

[0147] The polymerization initiator was dissolved in a solvent with the compositions shown in Tables 1 to 5 below, and the mixture was stirred at room temperature for 2 hours. A binder resin and polymerizable monomer were added, and the mixture was stirred at room temperature for 1 hour. Other additives and colorants were then added, and the mixture was stirred at room temperature for 1 hour, after which the entire solution was stirred for 2 hours. The above solution was filtered three times to remove impurities and produce a photosensitive resin composition.

[0148] [Table 1] [Table 2] [Table 3] [Table 4] [Table 5]

[0149] (A) Binder resin (A-1) Acrylic binder resin (SP-RY38, Showa Denko Co., Ltd.) (69 KOH mg / g, 6000 g / mol, 370 g / mol) (A-2) Acrylic binder resin (SP-RY92, Showa Denko Co., Ltd.) (35KOH mg / g, 6000 g / mol, 350 g / mol) (A-3) Acrylic binder resin (SP-RY92-M10, Showa Denko Co., Ltd.) (34KOH mg / g, 9000 g / mol, 340 g / mol)

[0150] (B) Colorants (B-1) Green pigment dispersion (Sanyo, G58) (B-2) Yellow pigment dispersion (Sanyo, Y139)

[0151] (C) Polymerizable monomer (C-1) pentaerythritol triacrylate (PE-3A, Kyoeisha) (C-2) Dipentaerythritol hexa(meth)acrylate (DPHA, Nippon Kayaku Co., Ltd.) (C-3) Compound represented by the following chemical formula A (M200, Ajimoto Chemical Co., Ltd.)

[0152] [ka]

[0153] (D) Polymerization initiator Oxine-based initiator (SPI-03, Sanyo Co., Ltd.)

[0154] (E) Solvent Propylene glycol monomethyl ether acetate (PGMEA, Daicel)

[0155] (F) Other additives (F-1) Leveling agent (F-556, DIC Corporation) (F-2) Silane coupling agent (KBM503, ShinEtsu Co., Ltd.) (F-3) Antioxidant (2-Methylhydroquinone, JHChem Co., Ltd.)

[0156] Rating 1 Using a K-spin8 (Track) system, the photosensitive compositions according to Examples 1 to 23 and Comparative Examples 1 to 14 were coated onto 8-inch silicon wafers at an RPM that allowed each sample to reach a consistent thickness (1.5 μm). The wafers were then baked in the Track system's Hot Plate at 100°C for 3 minutes or 85°C for 6 minutes, and pattern exposure was performed by adjusting the exposure level with a Nikon i-line stepper. Development was then performed to form the patterns. The patterns were measured using a Hitachi CD-SEM to obtain a 1.6 μm pattern CD.

[0157] For color characteristic evaluation, the pattern (substrate) fabrication process was carried out in the same manner as described above, but differed in that glass wafers were used and, because it was not possible to precisely match the thickness to the target (1.5um), two substrates were fabricated for each sample. For color measurement, a fine pattern chromaticity analyzer (LCF) was used.

[0158] The experimental results are shown in Tables 6 and 7 below.

[0159] [Table 6] [Table 7]

[0160] Tables 6 and 7 confirm that the photosensitive resin composition according to one embodiment enables the realization of fine patterns, exhibits excellent color characteristics, and ensures a wide color range, even after low-temperature curing.

[0161] The present invention is not limited to the embodiments described above and can be manufactured in a variety of different forms. Those with ordinary skill in the art to which the present invention pertains will understand that the invention can be implemented in other specific forms without altering the technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects.

Claims

1. Binder resin, Coloring agents, Polymerizable monomers, Polymerization initiator, and Containing a solvent, The colorant and polymerization initiator are included in amounts of 80% to 95% by weight and 0.65% to 1.3% by weight, respectively, based on the total amount of the photosensitive resin composition. The coloring agent comprises a green pigment and a yellow pigment, wherein the green pigment is present in an amount of 50% by weight or more relative to the total amount of the coloring agent. The green pigment and the yellow pigment are each included independently in the form of a pigment dispersion. The photosensitive resin composition has a transmission spectrum with a full width at half maximum of less than 105 nm. Antioxidant-free photosensitive resin composition.

2. The photosensitive resin composition according to claim 1, wherein the binder resin is an acrylic binder resin.

3. The photosensitive resin composition according to claim 2, wherein the acrylic binder resin has an acid value of 50 KOH mg / g or more and a weight-average molecular weight of 7000 g / mol or less.

4. The photosensitive resin composition according to claim 3, wherein the acrylic binder resin has a double bond equivalent of 360 g / mol or more.

5. The photosensitive resin composition according to claim 1, wherein the polymerizable monomer comprises one or more compounds having three or more functional groups.

6. The polymerizable monomer is a mixture of two compounds, The photosensitive resin composition according to claim 5, wherein each of the two compounds independently contains three or more functional groups.

7. The photosensitive resin composition according to claim 6, wherein the two compounds are mixed with each other in a 1:1 weight ratio.

8. The photosensitive resin composition according to claim 1, wherein the polymerizable monomer is present in a higher content than the binder resin.

9. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition has a transmittance of less than 8% at 630 nm.

10. The photosensitive resin composition is, in relation to the total amount of the photosensitive resin composition, The binder resin is 1% to 5% by weight, The aforementioned coloring agent is 80% to 95% by weight, The polymerizable monomer is present in an amount of 1% to 10% by weight. The polymerization initiator is 0.65% to 1.3% by weight, and The remaining amount of the solvent A photosensitive resin composition according to claim 1, comprising:

11. The photosensitive resin composition according to claim 1, further comprising an additive of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, or a combination thereof.

12. A photosensitive resin film manufactured using the photosensitive resin composition described in any one of claims 1 to 11.

13. A display device comprising the photosensitive resin film according to claim 12.

14. The display device includes an OLED substrate deposited on a silicon wafer, and a color filter layer laminated on the OLED substrate, which converts the white light generated by the OLED substrate into multiple color lights. The display device according to claim 13, wherein the color filter layer includes a red color filter, a green color filter, and a blue color filter, and the display device is a micro-OLED display device.

15. A step of applying the photosensitive resin composition according to any one of claims 1 to 11, After coating, the step is to pre-bake at a temperature of 100°C or lower. After the pre-baking, the steps are to expose with i-line and develop. A method for producing a photosensitive resin film containing [a specific substance].

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