Method for manufacturing glass articles, method for manufacturing electronic devices, and jig for stripping substrates

Abstract

To positively insert a knife into an interface between a lower-layered base plate and an upper-layered base plate in a laminated body.SOLUTION: A method of manufacturing a glass article includes a removal process of inserting a knife 5 into an interface X between both base plates 3, 4 to generate a removal-start point 6 when removing the upper-layered base plate 4 from a laminated body 1 having the upper-layered base plate 4 bonded on the lower-layered base plate 3, wherein a jig 2 having a guide face 2f for guiding the movement of the knife 5 is used, so that the knife 5 is inserted into the interface X by moving the knife 5 toward the laminated body 1 in a state of being contacted with the guide face 2f of the jig 2.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0001] The present invention relates to a technique such as a method for peeling an upper-layer substrate from a laminate of substrates made of glass or the like.

Background Art

[0002] In recent years, the thinning and weight reduction of electronic devices such as liquid crystal displays, solar cells, smartphones, and tablet-type PCs have been promoted. Along with this, there has been an increasing demand for thinning of substrates made of glass or the like used in these electronic devices.

[0003] When the substrate is thinned in this way, it becomes difficult to smoothly perform various processes on the substrate. Therefore, it has been proposed or put into practical use to produce a laminate by attaching the substrate to another substrate for reinforcement and performing various processes on the substrate in the state of the laminate.

[0004] After performing various processes on the substrate, the glass substrate or the like as a product can be obtained by peeling the substrate from the laminate. As a peeling method in this case, for example, according to Patent Document 1 and Patent Document 2, it is disclosed to peel the upper-layer substrate from the laminate using a knife.

[0005] Specifically, these publications disclose inserting a knife into the interface between the lower-layer substrate and the upper-layer substrate in the laminate to generate a peeling start point, and advancing the peeling starting from this peeling start point.

[0006] Furthermore, Patent Document 2 discloses adjusting the position of the knife in the height direction by a height adjusting device.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

[0008] Incidentally, the height adjustment device disclosed in Patent Document 2 adjusts the height position of the knife when the knife is in an initial state separated from the laminate (see paragraph

[0064] of the same document). Therefore, as the knife moves toward the laminate, there is a risk that the height position of the knife may shift or the knife may wobble up and down. As a result, it becomes difficult to reliably insert the knife into the interface between the lower substrate and the upper substrate. In this case, if at least one of the substrates is a glass substrate, it can cause chipping or cracking.

[0009] From the above perspective, the object of the present invention is to reliably insert a knife into the interface between the lower substrate and the upper substrate in a laminate. [Means for solving the problem]

[0010] (1) The first aspect of the present invention, which was devised to solve the above problems, is a method for manufacturing a glass article comprising a peeling step to create a peeling starting point by inserting a knife into the interface between the two substrates when peeling the upper substrate from a laminate in which an upper substrate is attached to a lower substrate and at least one of the two substrates is made of glass, wherein the peeling step is characterized by using a jig having a guide surface for guiding the movement of the knife, and moving the knife toward the interface while in contact with the guide surface. Here, the upper substrate means not only a single substrate but also a laminate in which multiple substrates are attached to each other, and similarly the lower substrate means not only a single substrate but also a laminate in which multiple substrates are attached to each other (the same applies hereinafter).

[0011] This method involves moving the knife towards the interface between the two substrates of the laminate while keeping it in contact with the guide surface of the jig, thereby inserting the knife into the interface. Therefore, problems such as the knife shifting in height or wobbling vertically during movement are eliminated. Consequently, by simply setting the height of the jig's guide surface to correspond to the height of the interface, the knife can be reliably inserted into the interface. This prevents chipping or cracking of the glass substrate.

[0012] (2) In the configuration of (1) above, it is preferable to arrange the laminate and the jig such that when the cutting edge of the knife reaches the interface, the knife is in contact with the guide surface.

[0013] This method allows for more secure insertion of the knife into the interface.

[0014] (3) In the configuration of (1) or (2) above, a film with a thickness of less than 1 μm may be interposed between the two substrates. Here, the film may be an organic film or an inorganic film.

[0015] In this way, a proper delamination starting point can be created not only when the two substrates are directly bonded together with an adhesive force acting between them, but also when an extremely thin film with a thickness of less than 1 μm is interposed between the two substrates. In this case, when the two substrates are directly bonded together, the interface is between the upper surface of the lower substrate and the lower surface of the upper substrate, and the knife is inserted into this interface. On the other hand, when a film is interposed between the two substrates, the interface is at any point between the lower surface of the upper substrate and the upper surface of the lower substrate, and the knife is inserted into this interface.

[0016] (4) In any of the configurations (1) to (3) above, the laminate does not need to have both substrates protruding from each other around its entire circumference.

[0017] When neither of the two substrates protrudes beyond each other over the entire circumference in this way, it becomes particularly difficult to insert a knife into the interface. However, if a jig is used as described above, such problems can be avoided.

[0018] (5) In any of the configurations of (1) to (4) above, the height position of the guide surface of the jig is preferably substantially the same as or lower than the height position of the interface, and the height difference between the two is preferably smaller than the thickness of the knife.

[0019] In this way, the knife can be inserted into the interface while being in a state of reliably contacting the guide surface of the jig.

[0020] (6) In any of the configurations of (1) to (5) above, the length of the gap in the horizontal direction between the jig and the laminate is preferably shorter than the length along the moving direction of the knife.

[0021] Also in such a case, the knife can be inserted into the interface while being in a state of reliably contacting the guide surface of the jig.

[0022] (7) In any of the configurations of (1) to (6) above, the jig is preferably held so that vertical position adjustment is possible.

[0023] In this way, since vertical position adjustment of the jig is possible, it is possible to cope with differences in the thickness of the substrate on the lower layer side and the like.

[0024] (8) In any of the configurations of (1) to (7) above, the jig is preferably held so that horizontal position adjustment is possible.

[0025] In this way, since horizontal position adjustment of the jig is possible, it is possible to adjust the gap in the horizontal direction between the jig and the laminate.

[0026] (9) In any of the configurations of (1) to (8) above, it is preferable that the jig is held so that the angle can be adjusted within the horizontal plane.

[0027] In this way, since the angle of the jig within the horizontal plane can be adjusted, it is possible to cope with differences in the angles of the corner portions of the laminate when viewed from above to below.

[0028] (10) In any of the configurations of (1) to (9) above, it is preferable that the jig is formed along two intersecting sides of the substrate on the lower layer side.

[0029] In this way, the knife can be surely inserted into the interface of the corner portion of the laminate when viewed from above to below.

[0030] (11) In any of the configurations of (1) to (10) above, before performing the peeling step, a preparation step of obtaining an original laminate is performed by attaching the upper-layer original substrate onto the lower-layer original substrate and performing a process on the upper-layer original substrate, and by cutting the original laminate into a plurality of pieces, a laminate in which the lower-layer original substrate becomes the lower-layer substrate and the upper-layer original substrate becomes the upper-layer substrate may be obtained.

[0031] In this way, among the obtained plurality of laminates, there may be a laminate in which neither substrate protrudes from each other over the entire circumference as described above, but the knife can be inserted between both substrates without any problem even for such a laminate.

[0032] (12) A second aspect of the present invention, which was devised to solve the above problems, is a method for manufacturing an electronic device, comprising: a preparation step of obtaining a base laminate by attaching an upper base glass substrate to a lower base substrate and then manufacturing a base electronic device material including the base glass substrate; a cutting step of obtaining a plurality of laminates in which the base substrate becomes a substrate and the base electronic device material becomes an electronic device material by cutting the base laminate into a plurality of pieces; and a peeling step of inserting a knife into the interface between the substrate and the electronic device material to create a peeling starting point when peeling the electronic device material from the laminate, wherein the peeling step is characterized by using a jig having a guide surface for guiding the movement of the knife, and moving the knife toward the interface while in contact with the guide surface.

[0033] This method also allows for the reliable insertion of a knife into the interface between the substrate and the electronic device material (glass substrate).

[0034] (13) A third aspect of the present invention, which was devised to solve the above problems, is a substrate peeling jig, which is used when inserting a knife into the interface between two substrates in a laminate in which an upper substrate is attached to a lower substrate to create a peeling starting point, and is characterized by having a guide surface that contacts the knife and guides the movement of the knife toward the interface.

[0035] Using a substrate peeling jig with this configuration, the knife can be reliably inserted into the interface, as described above. [Effects of the Invention]

[0036] According to the present invention, a knife can be reliably inserted into the interface between the lower substrate and the upper substrate in the laminate. [Brief explanation of the drawing]

[0037] [Figure 1] This is a perspective view showing a laminate and a substrate peeling jig used in a method for manufacturing a glass article according to an embodiment of the present invention. [Figure 2] A perspective view showing the initial state when performing the peeling step in the method for manufacturing a glass article according to an embodiment of the present invention. [Figure 3] This figure shows the state during the peeling process in the manufacturing method of a glass article according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching omitted). [Figure 4] This figure shows the state during the peeling process in the manufacturing method of a glass article according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching omitted). [Figure 5] This figure shows the state during the peeling process in the manufacturing method of a glass article according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching omitted). [Figure 6] This is a plan view showing the state during the peeling process in a method for manufacturing a glass article according to an embodiment of the present invention. [Figure 7] This figure shows a state in which a first modified example of the peeling step in the method for manufacturing a glass article according to an embodiment of the present invention is being carried out, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching is omitted). [Figure 8] This figure shows a second modified example of the peeling process in the method for manufacturing a glass article according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching omitted). [Figure 9] This is a perspective view showing a first modified example of a substrate peeling jig used in the peeling step in a method for manufacturing a glass article according to an embodiment of the present invention. [Figure 10] This is a cross-sectional view taken along line BB in Figure 9. [Figure 11] This is a plan view showing a second modified example of a substrate peeling jig used in the peeling step in a method for manufacturing a glass article according to an embodiment of the present invention. [Figure 12] This is a cross-sectional view taken along the CC line in Figure 11. [Figure 13]This is a plan view showing a third modified example of a substrate peeling jig used in the peeling step in a method for manufacturing a glass article according to an embodiment of the present invention. [Figure 14] A perspective view illustrating the preparation and cutting steps in a method for manufacturing a glass article according to an embodiment of the present invention. [Figure 15] A perspective view illustrating the preparation and cutting steps in a method for manufacturing an electronic device according to an embodiment of the present invention. [Figure 16] This figure shows the state in which the peeling step is being carried out in the manufacturing method of an electronic device according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view of line AA in Figure 2 (hatching is omitted). [Figure 17] This figure shows a state in which a first modified example of the peeling step in the method for manufacturing an electronic device according to an embodiment of the present invention is being carried out, and is a cross-sectional view corresponding to the cross-sectional view of line AA in Figure 2 (hatching omitted). [Figure 18] This figure shows a third modified example of the peeling process in the method for manufacturing a glass article according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching omitted). [Figure 19] This figure shows a second modified example of the peeling step in the method for manufacturing an electronic device according to an embodiment of the present invention, and is a cross-sectional view corresponding to the cross-sectional view along line AA in Figure 2 (hatching omitted). [Figure 20] This is a perspective view showing a fourth modified example of a substrate peeling jig used in the peeling step in a method for manufacturing a glass article according to an embodiment of the present invention. [Modes for carrying out the invention]

[0038] Hereinafter, a method for manufacturing a glass article, a method for manufacturing an electronic device, and a jig for peeling off a substrate, as embodied in the present invention, will be described with reference to the attached drawings.

[0039] The manufacturing method for a glass article according to this embodiment includes a peeling step for peeling the upper layer substrate from the glass laminate. A jig (substrate peeling jig) is used when carrying out the peeling step.

[0040] Figure 1 is a perspective view illustrating a glass laminate 1 and a jig 2. As shown in the figure, the glass laminate 1 is constructed by attaching a glass film 4, which is the upper substrate, to a support glass substrate 3, which is the lower substrate. In this case, the support glass substrate 3 and the glass film 4 are directly bonded together, and an adhesive force acts at the interface X between the two, 3 and 4.

[0041] Both the support glass substrate 3 and the glass film 4 have a rectangular shape when viewed from top to bottom (hereinafter referred to as a plan view), and neither 3 nor 4 protrudes from the other around its entire circumference. The thickness of the glass film 4 is, for example, 300 μm or less, preferably 200 μm or less. The thickness of the support glass substrate 3 is, for example, 1500 μm or less, preferably 700 μm or less, and even more preferably 500 μm or less. Both 3 and 4 are flexible.

[0042] The jig 2 shown in the figure is used when peeling the glass film 4 from the glass laminate 1 and is placed on the same work surface F as the glass laminate 1. The jig 2 has a corner portion 2a corresponding to the corner portion 1a in a plan view of the glass laminate 1, and one side (one end face) 2b and another side (other end) 2c corresponding to one side (one end face) 1b and another side (other end face) 1c connected thereto of the glass laminate 1. The lengths of the one side 1b and the other side 2c of the glass laminate 1 in a plan view are, for example, 10 to 900 mm, preferably 100 to 500 mm.

[0043] One side 2b and the other side 2c of the jig 2, separated by corner 1a, are substantially perpendicular (or nearly perpendicular). Similarly, the two sides 2d and 2e of the jig 2 that are separated from the glass laminate 1 are also substantially perpendicular. The overall shape of the jig 2 is such that each side extends with the same width in a direction perpendicular to the corner 2a. The jig 2 can be made of glass, ceramic, resin, etc., but in this embodiment, it is made of glass.

[0044] Figure 2 illustrates the initial state when performing the peeling process. As shown in the figure, the two sides 2b and 2c of the jig 2, separated by the corner portion 2a, are positioned to align with the two sides 1b and 1c of the glass laminate 1, separated by the corner portion 1a (more precisely, the two sides of the support glass substrate 3, separated by the corner portion 1a). Furthermore, the corner portion 2a of the jig 2 is in substantial contact (contact or near contact) with the corner portion 1a of the glass laminate 1.

[0045] In this peeling process, a knife 5 is used. The upper surface 2f of the jig 2 is a guide surface that guides the movement of the knife 5 toward the glass laminate 1 (its corner portion 1a) (movement in the direction of arrow a). In this embodiment, the height position of the guide surface 2f of the jig 2 and the height position of the interface X of the glass laminate 1 are substantially the same (identical or nearly identical).

[0046] When the knife 5 moves in the direction of arrow a while in contact with the guide surface 2f of the jig 2 from this initial state, first, as shown by the solid line in Figure 3, the cutting edge 5a of the knife 5 reaches the interface X of the glass laminate 1. More specifically, as shown in Figure 4, the knife 5 has a cutting edge portion 5b whose thickness gradually decreases from the base to the cutting edge 5a, and a base portion 5c whose thickness does not change. Then, as the knife 5 moves while only the cutting edge portion 5b (its lower surface) is in contact with the guide surface 2f of the jig 2, the cutting edge 5a of the knife 5 accurately reaches the interface X of the glass laminate 1. The thickness of the knife 5 (more precisely, the thickness of the base portion 5c) is 50 to 150 μm, preferably 80 to 120 μm.

[0047] From this state, as the knife 5 moves further in the direction of arrow a while in contact with the guide surface 2f of the jig 2, the knife 5 is inserted into the interface X, as shown by the solid line in Figure 5. As a result, a peeling initiation point 6 is created at the interface X. This peeling initiation point 6 is created in the manner shown by the dotted parallel diagonal lines in Figure 6. The movement of the knife 5 in the direction of arrow a is performed by an operator or a robotic arm, etc.

[0048] After the peeling starting point 6 is formed, a sheet material (not shown) such as a Teflon sheet (registered trademark) is inserted into the peeling starting point 6 to prevent re-adhesion, and the knife 5 is withdrawn. After this, the peeling of the interface X is advanced using a method (known method) such as an adhesive pad. When this peeling is completed, the peeling process is finished, and a glass film 4 (glass article) as a product is obtained.

[0049] In the peeling process described above, the height position of the guide surface 2f of the jig 2 and the height position of the interface X of the glass laminate 1 were made substantially the same. In this case, the thickness of the knife 5 is extremely thin, as already illustrated. Therefore, even if the height position of the guide surface 2f is lower than the height position of the interface X, as long as the height difference between 2f and X is smaller than the thickness of the knife 5, it does not pose a problem in accurately reaching the interface X with the cutting edge 5a of the knife 5. Thus, it is preferable that the height position of the guide surface 2f is substantially the same as the height position of the interface X, but even if the height position of the guide surface 2f is lower than the height position of the interface X, it is sufficient as long as the height difference between 2f and X is smaller than the thickness of the knife 5.

[0050] In the peeling process described above, the knife 5 was moved in the direction of arrow a while only the blade portion 5b of the knife 5 was in contact with the guide surface 2f of the jig 2. However, as shown in Figure 7, the knife 5 may also be moved while only the base portion 5c (its lower surface) of the knife 5 is in contact with the guide surface 2f. In this case, it is preferable that the height of the guide surface 2f be lower than the height of the interface X by half the thickness of the knife 5. The shape of the knife 5 is not particularly limited and may be, for example, as shown in Figure 8, a shape in which the thickness gradually decreases from the base to the tip 5a along the entire length in the direction of movement.

[0051] The jig 2 according to this embodiment has the following configuration to accommodate cases where the support glass substrate 3 is changed to one of different thicknesses. Specifically, as shown in Figure 9, the jig 2 has through holes 2g that run vertically in multiple locations (four locations in the illustrated example), excluding the area around the corner portion 2a. Rod-shaped guide members 7 that extend vertically are inserted through these through holes 2g. As a result, the jig 2 can move up and down guided by the guide members 7. In this case, as shown in Figure 10, a base plate 8 may be placed below the jig 2 with a gap S between them, and the lower end of the guide member 7 may be fixed onto this base plate 8. In this way, the vertical position of the jig 2 can be adjusted by inserting spacers of different thicknesses into the gap S below the jig 2 as appropriate. Alternatively, the vertical position of the jig 2 can be adjusted using manual drive mechanisms such as LM guides or air cylinders. Alternatively, instead of using the guide member 7, the vertical position of the jig 2 can be adjusted by screwing bolts into threaded holes formed in multiple locations on the jig 2 from above and rotating the bolts. In this case, the base plate 8 may or may not be provided.

[0052] In the peeling process described above, the corner portion 2a of the jig 2 was brought into substantial contact with the corner portion 1a of the glass laminate 1. However, there are cases where the two corner portions 1a and 2a cannot be brought into substantial contact due to reasons such as the shapes of the jig 2 and the glass laminate 1 not matching each other in plan view. There is also a need to increase the degree of freedom in the layout of the jig 2 and the glass laminate 1. To address these issues, the jig 2 according to this embodiment has the following configuration. That is, as shown in Figure 11, the jig 2 is held by a plurality of rails 9 (two in the illustrated example) positioned below it so as to be slidable in the direction of movement of the knife 5 and the opposite direction. In this case, as shown in Figure 12, a base plate 10 is placed below the jig 2 with a gap T between them, and the rails 9 are fixed on this base plate 10. Then, by fitting a groove 2h formed in the lower part of the jig 2 into the rails 9, the jig 2 may be guided to move by the rails 9. In this case as well, a driving means such as an LM guide or an air cylinder can be used. In this way, the horizontal position of the jig 2 can be adjusted. More specifically, the length of the horizontal gap between the jig 2 and the glass laminate 1 can be adjusted. Preferably, the length of the gap adjusted at this time is within a range shorter than the length along the direction of movement of the knife 5. Here, the length of the gap refers to the length of the gap between the corner portions 1a and 2a of both 1 and 2 along the direction of movement of the knife 5. In this way, the knife 5 can be brought to the interface X of the glass laminate 1 with its cutting edge 5a in secure contact with the guide surface 2f of the jig 2.

[0053] In the peeling process described above, the corner portion 2a of the jig 2 was set to a substantially right angle, but the angle of the corner portion 1a of the glass laminate 1 may not be substantially right angle due to errors, etc. To address this, the jig 2 according to this embodiment has the following configuration. That is, as shown in Figure 13, the jig 2 is divided into two parts with the corner portion 2a as the boundary. Each divided jig piece 2i is held in a slidable position along the arc by an arc-shaped rail 11 positioned below them. Specifically, these rails 11 are curved to follow the arc centered on the corner portion 2a of the jig 2. In this case as well, as in the case described above, a base plate may be placed below the jig piece 2i, the rails may be fixed on the base plate, and a groove 2j formed in the lower part of the jig piece 2i may be fitted into the rail. Alternatively, a driving means such as an LM guide or an air cylinder may be used. Then, by moving one or both jig pieces 2i along the rail 11 with the corner portion 2a as the center, the angle of the jig 2 in the horizontal plane can be adjusted.

[0054] The method for manufacturing a glass article according to this embodiment includes a preparation step and a cutting step as steps prior to performing the peeling step described above.

[0055] In the preparation process, first, as shown in Figure 14, the upper layer of the original glass film 4A is directly bonded to the lower layer of the original support glass substrate 3A. In this case, the four sides 3Aa of the original support glass substrate 3A protrude outward from the four sides 4Aa of the original glass film 4A. Subsequently, a transparent conductive film (for example, an ITO film) is deposited on the original glass film 4A, and this film is then subjected to a patterning process such as etching. This yields the original glass laminate 1A.

[0056] In the cutting process, the original glass laminate 1A described above is cut into multiple pieces (nine in the example shown) along the dotted line L shown in the figure using a laser or the like. From these multiple cut pieces, the one that was in the center is removed to obtain the glass laminate 1 (the glass laminate 1 shown in Figures 1 and 2). The peeling process described above is then performed on this glass laminate 1.

[0057] Furthermore, the glass film 4 that is peeled off from this glass laminate 1 in the peeling process described above is a glass article for use as an electronic device material. Therefore, the method for manufacturing the glass article described above is synonymous with the method for manufacturing an electronic device.

[0058] Next, other examples of methods for manufacturing the electronic device according to this embodiment will be described.

[0059] In the preparation step of this manufacturing method, first, the original glass film 4A is directly bonded onto the original support glass substrate 3A to obtain an original glass laminate 1A as shown in Figure 14. Next, another original glass film 4A is bonded onto the original glass film 4A of the original glass laminate 1A. After this, a liquid crystal is sealed between the original glass film 4A and the other original glass film 4A above it, and other necessary processes are performed to produce an original liquid crystal panel 12A on the original support glass substrate 3A. This results in an original glass laminate 1A as shown in Figure 15.

[0060] In the cutting process, the original glass laminate 1A is cut into multiple pieces (nine in the example shown) along the dotted line M shown in the figure using a laser or the like. By removing the one piece that was in the center from these multiple pieces, a glass laminate 1 is obtained in which a liquid crystal panel 12 having two glass films 4 is attached to a support glass substrate 3.

[0061] In the peeling process, the liquid crystal panel 12 is peeled off the glass laminate 1 described above. More specifically, in this case, as shown in Figure 16, the interface X is formed between the support glass substrate 3 and the liquid crystal panel 12, and by inserting the knife 5 into this interface X, a peeling starting point 6 is created. In this case, the peeling starting point 6 may also be created by inverting the top and bottom of the support glass substrate 3 and the liquid crystal panel 12. Once the peeling process is complete, a liquid crystal panel 12 used in the manufacture of electronic devices such as liquid crystal displays is obtained.

[0062] In this manufacturing method, after producing the original glass laminate 1A shown in Figure 15, another original support glass substrate 3A may be directly bonded to the original glass film 4A on the upper side of the original liquid crystal panel 12A. In this case, in the peeling process, the support glass substrate 3 is first peeled off from the glass laminate 1 obtained through the same cutting process as described above. More specifically, in this case, as shown in Figure 17, the space between the upper support glass substrate 3 and the liquid crystal panel 12 becomes an interface X, and by inserting the knife 5 into this interface X, a peeling starting point 6 is created. After this peeling work is completed, the liquid crystal panel 12 is further peeled off in the manner shown in Figure 16 (or in the inverted manner). In this case, the height position of the guide surface 2f of the jig 2 is changed.

[0063] In the above embodiment, the glass film 4 is directly bonded to the support glass substrate 3, but a film 13, as shown in Figure 18, may be interposed between the support glass substrate 3 and the glass film 4. This film 13 is an organic or inorganic film with a thickness of less than 1 μm. In the peeling process in this case, as shown in the figure, the interface X is formed between the upper surface of the film 13 and the lower surface of the glass film 4, and the peeling starting point 6 is generated by the knife 5. The interface X may be between the lower surface of the film 13 and the upper surface of the support glass substrate 3, or at any position between the lower surface of the glass film 4 and the upper surface of the support glass substrate 3.

[0064] Furthermore, in the above embodiment, the liquid crystal panel 12 and the support glass substrate 3 are directly bonded together as illustrated in Figure 17, but a film 13 similar to the above may be interposed between the liquid crystal panel 12 and the support glass substrate 3, as shown in Figure 19. In the peeling process in this case, as shown in the figure, the space between the lower surface of the upper film 13 and the upper surface of the liquid crystal panel 12 becomes the first interface X1, and the space between the upper surface of the lower film 13 and the lower surface of the liquid crystal panel 12 becomes the second interface X2. The figure illustrates a method of generating a peeling start point 6 with a knife 5 on the first interface X1, but a peeling start point is generated on the second interface X2 in a similar manner (or an inverted manner). Also, even if the upper support glass substrate 3 is not present in the glass laminate 1, a peeling start point is generated in a similar manner (or an inverted manner).

[0065] The jig 2 according to the above embodiment has two sides 2b and 2c separated by a corner portion 2a, but as shown in Figure 20, it may also be a straight line without a corner portion. In other words, the jig 2 shown in the figure follows only one side 1b of the glass laminate 1 (more precisely, only one side of the supporting glass substrate 3). In this case, as shown in the figure, it is preferable that one side 2b of the jig 2 protrudes from the corner portion 1a of the glass laminate 1.

[0066] In the glass laminate 1 according to the above embodiment, the support glass substrate 3 and the glass film 4 do not protrude from each other around the entire circumference. However, even if one of the support glass substrate 3 or the glass film 4 protrudes from the other, the present invention can be applied in the same manner if the protrusion is short. Therefore, for example, in the original glass laminate 1A shown in Figure 14, if the protrusion of the original support glass substrate 3A from the original glass film 4A is short, the present invention can be applied to all of the multiple glass laminates 1 obtained by cutting this original glass laminate 1A (the same applies to the original glass laminate 1A shown in Figure 15).

[0067] In the glass laminate 1 according to the above embodiment, both the lower substrate and the upper substrate are made of glass, but either one may be made of another material such as ceramic or resin, or both may be made of other materials such as ceramic or resin.

[0068] The glass laminate 1 according to the above embodiment has one interface X or two interfaces X1, X2, but it may have three or more interfaces. [Explanation of Symbols]

[0069] 1. Glass laminate (laminated structure) 1A Original glass laminate 1a Corner section of the laminate 1b. Edge of the laminate (edge ​​of the lower substrate) 1c. Edge of the laminate (edge ​​of the lower substrate) 2. Jig (Jig for stripping substrates) 2a Corner section of the jig 2b Side of the jig 2c Side of the jig 2f Guide surface of the jig 3. Support glass substrate (lower layer substrate) 3A Original support glass substrate (original substrate on the lower layer side) 4. Glass film (upper substrate) 4A Original glass film (original substrate on the upper layer) 5 knives 5a Knife blade 6. Starting point of peeling 12 LCD panels 12A Original LCD Panel 13 membrane X interface X1 interface X2 interface

Claims

1. A method for manufacturing a glass article, comprising a peeling step in which a knife is inserted into the interface between the two substrates to create a peeling starting point when peeling the upper substrate from a laminate in which an upper substrate is attached to a lower substrate and at least one of the two substrates is made of glass, A method for manufacturing a glass article, characterized in that, in the peeling step, a jig having a guide surface for guiding the movement of the knife is used, and the knife is moved toward the interface while in contact with the guide surface.

2. The method for manufacturing a glass article according to claim 1, characterized in that the laminate and the jig are arranged such that when the cutting edge of the knife reaches the interface, the knife is in contact with the guide surface.

3. The method for manufacturing a glass article according to claim 1 or 2, characterized in that a film with a thickness of less than 1 μm is interposed between the two substrates.

4. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the laminate is such that neither substrate protrudes from the other over its entire circumference.

5. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the height position of the guide surface of the jig is substantially the same as or lower than the height position of the interface, and the height difference between the two is less than the thickness of the knife.

6. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the length of the horizontal gap between the jig and the laminate is shorter than the length along the direction of movement of the knife.

7. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the jig is held in such a way that its position can be adjusted in the vertical direction.

8. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the jig is held in such a way that its horizontal position can be adjusted.

9. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the jig is held in such a way that angle adjustment can be made in a horizontal plane.

10. The method for manufacturing a glass article according to claim 1 or 2, characterized in that the jig is formed to follow two intersecting sides of the lower substrate.

11. The method for manufacturing a glass article according to claim 1 or 2, characterized in that, before performing the peeling step, a preparation step is performed to obtain a base laminate by attaching the upper base substrate to the lower base substrate and applying a process to the upper base substrate, and the base laminate is cut into multiple pieces to obtain a laminate in which the lower base substrate becomes the lower substrate and the upper base substrate becomes the upper substrate.

12. A preparation step to obtain a laminate is performed by attaching the upper layer original glass substrate to the lower layer original substrate, and then fabricating the original electronic device material including the original glass substrate. A cutting step to obtain multiple laminates in which the original laminate becomes a substrate and the original electronic device material becomes an electronic device material, by cutting the original laminate into multiple pieces, The peeling step includes, when peeling the electronic device material from the laminate, inserting a knife into the interface between the substrate and the electronic device material to create a peeling starting point, A method for manufacturing an electronic device, characterized in that, in the peeling step, a jig having a guide surface for guiding the movement of the knife is used, and the knife is moved toward the interface while in contact with the guide surface.

13. This method is used when inserting a knife into the interface between two substrates in a laminate in which an upper substrate is attached to a lower substrate to create a peeling starting point. A substrate peeling jig characterized by having a guide surface that contacts the knife and guides the movement of the knife toward the interface.

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