Multilayer ceramic electronic components

Abstract

The present invention provides a multilayer ceramic electronic component which has been improved in terms of the mechanical strength and reliability. The present invention provides a multilayer ceramic electronic component which is provided with: a ceramic element in which a first internal electrode and a second internal electrode are stacked, and which has a first main surface and a second main surface that are opposite to each other in the stacking direction, a first lateral surface and a second lateral surface that are opposite to each other in a width direction which is orthogonal to the stacking direction, and a first end surface and a second end surface that are opposite to each other in a length direction which is orthogonal to both of the width direction and the stacking direction; a first external electrode which is formed on the first end surface in such a manner that the edge thereof extends from the first end surface over the first main surface, the second main surface, the first lateral surface and the second lateral surface; and a second external electrode which is formed on the second end surface in such a manner that the edge thereof extends from the second end surface over the first main surface, the second main surface, the first lateral surface and the second lateral surface. With respect to this multilayer ceramic electronic component, the first internal electrode is led out from the first end surface so as to be connected to the first external electrode; and the second internal electrode is led out from the second end surface so as to be connected to the second external electrode. The first external electrode and the second external electrode each comprise a base external electrode, a resin layer that is formed on the outer side of the base external electrode, and at least one plating external electrode layer that is formed on the outer side of the resin layer; the base external electrode is formed on the ceramic element in a discontinuous manner; the ceramic element has exposed regions which are partially exposed from the discontinuous base external electrode; the resin layer covers the discontinuous base external electrode and the exposed regions; the resin layer of the first external electrode and the resin layer of the second external electrode completely cover the discontinuous base external electrode and the exposed regions, respectively on the first end surface and the second end surface; and the first external electrode and the second external electrode each comprise regions where the resin layer covers the discontinuous base external electrode and the exposed regions, and resin layer unformed regions where the resin layer does not cover the discontinuous base external electrode and the exposed regions, on the first main surface, the second main surface, the first lateral surface and the second lateral surface.

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component, and more particularly to a multilayer ceramic electronic component with improved mechanical strength and reliability.

Background Art

[0002] Multilayer ceramic electronic components such as multilayer ceramic capacitors, multilayer ceramic thermistors, multilayer ceramic varistors, and multilayer ceramic composite components are widely used in electronic devices. Patent Document 1 (Japanese Patent Application Laid-Open No. 2003-243249) discloses a multilayer ceramic capacitor. FIG. 7 shows the multilayer ceramic capacitor 1100 disclosed in Patent Document 1.

[0003] The multilayer ceramic capacitor 1100 includes a ceramic body 101. An internal electrode 102 is formed inside the ceramic body 101. External electrodes 105 are formed at both ends of the ceramic body 101, respectively. The external electrode 105 includes a base external electrode 103 formed by baking a conductive paste and a plating layer 104 formed on the base external electrode 103.

[0004] In such a multilayer ceramic electronic component, improving the mechanical strength between the ceramic body and the external electrode has become an important issue. That is, even when stress is applied by an external force, a thermal cycle, or the like after mounting on a circuit board or the like, a multilayer ceramic electronic component is required in which the external electrode does not peel off from the ceramic body and cracks do not occur in the ceramic body.

[0005] In multilayer ceramic electronic components, various methods have been studied as methods for improving the mechanical strength between the ceramic body and the external electrode.

[0006] Patent document 2 (Japanese Patent Application Publication No. 2020-161734) discloses a multilayer ceramic capacitor in which the mechanical strength between the ceramic body and the external electrode is improved by forming the external electrode in a discontinuous manner. Figure 8 shows the multilayer ceramic capacitor 1200 disclosed in Patent document 2.

[0007] The multilayer ceramic capacitor 1200 comprises a ceramic body 201 in which ceramic layers are stacked. Internal electrodes 202 are formed between the ceramic layers of the ceramic body 201. External electrodes 203 are formed at both ends of the ceramic body 201. The internal electrodes 202 and the external electrodes 203 are connected at both end faces of the ceramic body 201, respectively.

[0008] The external electrode 203 comprises a base external electrode 204 formed by baking a conductive paste, a resin layer 205, and a plating layer 206.

[0009] The base external electrode 204 is formed discontinuously on the ceramic body 201. Discontinuous formation means that the coverage is not 100%. As a result, the ceramic body 201 has exposed regions EA that are partially exposed from the discontinuously formed base external electrode 204. The exposed regions EA of the ceramic body 201 are filled with a resin layer 205. A plating layer 206 is formed on the base external electrode 204 and on the resin layer 205.

[0010] In the multilayer ceramic capacitor 1200, the exposed region EA of the ceramic body 201 where the underlying external electrode 204 is not formed is filled with a resin layer 205 in order to improve moisture resistance and thus improve reliability. Specifically, the end face of the ceramic body 201 has an internal electrode 202 leading out to connect to the external electrode 203, and moisture can easily penetrate into the interior from this part. In the multilayer ceramic capacitor 1200, the underlying external electrode 204 is formed discontinuously, so if the plating layer 206 were formed on the underlying external electrode 204 without the resin layer 205, sufficient moisture resistance would not be obtained. Therefore, in the multilayer ceramic capacitor 1200, the exposed region EA is filled with a resin layer 205, and then the plating layer 206 is formed on the underlying external electrode 204 and the resin layer 205 to improve moisture resistance.

[0011] In the multilayer ceramic capacitor 1200 disclosed in Patent Document 2, the underlying external electrode 204 is formed discontinuously on the ceramic body 201. As a result, the residual stress of the underlying external electrode 204 formed on the ceramic body 201 is relieved, and the mechanical strength between the ceramic body 201 and the external electrode 203 is increased. Therefore, even if the multilayer ceramic capacitor 1200 is subjected to stress from external forces or thermal cycles after being mounted on a circuit board or the like, the external electrode 203 (underlying external electrode 204) is less likely to peel off from the ceramic body 201, and cracks are less likely to occur in the ceramic body 201. [Prior art documents] [Patent Documents]

[0012] [Patent Document 1] Japanese Patent Publication No. 2003-243249 [Patent Document 2] Japanese Patent Publication No. 2020-161734 [Overview of the project] [Problems that the invention aims to solve]

[0013] However, the multilayer ceramic capacitor 1200 still had a problem: its moisture resistance was not sufficiently improved.

[0014] In multilayer ceramic electronic components such as multilayer ceramic capacitors, the surfaces of the ceramic body where the interlayers of the ceramic layers are exposed to the outside, and where the ends of the internal electrodes are led out from these interlayers (exposed), are the surfaces most susceptible to moisture penetration. For example, in the multilayer ceramic capacitor 1200, both end faces of the ceramic body 201, where the interlayers of the ceramic layers are exposed to the outside and the ends of the internal electrodes 202 are led out from these interlayers, are the surfaces most susceptible to moisture penetration. In other words, the two opposing main faces of the ceramic body 201 in the stacking direction do not have the interlayers of the ceramic layers exposed to the outside, making them less likely to become pathways for moisture penetration. Also, although the interlayers of the ceramic layers are exposed to the outside on both sides of the ceramic body 201, the ends of the internal electrodes are not exposed from these interlayers, making them less likely to become pathways for moisture penetration. In contrast, both ends of the ceramic body 201 have the interlayers of the ceramic layers exposed to the outside, and the ends of the internal electrodes are led out from these interlayers, making it easy for moisture to penetrate the interior.

[0015] Against this backdrop, there is still room to improve the moisture resistance of the multilayer ceramic capacitor 1200. Specifically, when viewing the cross-section of the multilayer ceramic capacitor 1200 shown in Figure 8, the interface between the base external electrode 204 and the resin layer 205 is in contact with the plating layer 206. Generally, the interface between the base external electrode 204 and the resin layer 205 is more permeable to moisture than the base external electrode 204 or the resin layer 205. Therefore, in the multilayer ceramic capacitor 1200, there was a problem in that moisture could easily penetrate into the interior of the ceramic body 201 from the end face of the ceramic body 201 via the plating layer 206 and further via the interface between the base external electrode 204 and the resin layer 205.

[0016] Furthermore, the multilayer ceramic capacitor 1200 had another problem: the resin layer 205 did not contribute to improving the mechanical strength (bonding strength) between the ceramic body 201 and the underlying external electrode 204, resulting in insufficient improvement in mechanical strength. In other words, when viewing the cross-section of the multilayer ceramic capacitor 1200 shown in Figure 8, the underlying external electrode 204 and the resin layer 205 are formed alternately and fragmentarily on the ceramic body 201, and the resin layer 205 does not contribute to improving the mechanical strength between the ceramic body 201 and the underlying external electrode 204. [Means for solving the problem]

[0017] The present invention has been made to solve the above-mentioned conventional problems, and as a means, a multilayer ceramic electronic component according to one embodiment of the present invention comprises: a ceramic body having a first internal electrode and a second internal electrode laminated inside, a first main surface and a second main surface that are opposite in the lamination direction, a first side surface and a second side surface that are opposite in the width direction perpendicular to the lamination direction, and a first end surface and a second end surface that are opposite in the length direction perpendicular to both the lamination direction and the width direction; a first external electrode formed on the first end surface, with its edge extending from the first end surface to the first main surface, the second main surface, the first side surface, and the second side surface, respectively; a second external electrode formed on the second end surface, with its edge extending from the second end surface to the first main surface, the second main surface, the first side surface, and the second side surface, respectively; the first internal electrode being led out to the first end surface and connected to the first external electrode, and the second internal electrode being led out to the second end surface and connected to the second external electrode, wherein the multilayer ceramic electronic component comprises: a ceramic body having a first internal electrode and a second internal electrode laminated inside, a first main surface and a second main surface that are opposite in the lamination direction, a first external electrode being formed on the first end surface, with its edge extending from the second end surface to the first main surface, the second main surface, the first side surface, and the second side surface, respectively; A ceramic electronic component, wherein the first external electrode and the second external electrode each comprise a base external electrode, a resin layer formed on the outside of the base external electrode, and at least one plated external electrode layer formed on the outside of the resin layer, the base external electrode being discontinuously formed on a ceramic body, the ceramic body having an exposed region partially exposed from the discontinuously formed base external electrode, the resin layer covering the discontinuously formed base external electrode and the exposed region, the first external electrode having a first end face and the second external electrode having a second end face, respectively, the resin layer completely covering the discontinuously formed base external electrode and the exposed region, and the first external electrode and the second external electrode each comprise a region on the first main surface, second main surface, first side surface, and second side surface where the resin layer covers the discontinuously formed base external electrode and the exposed region, and a region where the resin layer does not cover the discontinuously formed base external electrode and the exposed region. [Effects of the Invention]

[0018] In one embodiment of the present invention, the multilayer ceramic electronic component has high moisture resistance and high reliability because, at least at the first and second end faces of the ceramic body, the underlying external electrode and the exposed area of ​​the ceramic body are completely covered by a resin layer. In other words, moisture is less likely to penetrate the interior, and it is less likely to become defective or malfunction due to moisture intrusion.

[0019] Furthermore, in the multilayer ceramic electronic component according to one embodiment of the present invention, since the underlying external electrode is formed discontinuously on the ceramic body, the residual stress of the underlying external electrode formed on the ceramic body is relieved, resulting in high mechanical strength between the ceramic body and the external electrode. In other words, even if stress is applied due to external forces or thermal cycles after mounting on a circuit board or the like, the external electrode is less likely to peel off from the ceramic body, and cracks are less likely to occur in the ceramic body.

[0020] Furthermore, in the multilayer ceramic electronic component according to one embodiment of the present invention, the resin layer covers the underlying external electrode from the outside, contributing to improved bonding strength between the underlying external electrode and the ceramic body, resulting in high mechanical strength between the ceramic body and the external electrode. In other words, even when stress is applied due to external forces or thermal cycles after mounting on a circuit board or the like, the external electrode is less likely to peel off from the ceramic body, and cracks are less likely to occur in the ceramic body.

[0021] Furthermore, in the multilayer ceramic electronic component according to one embodiment of the present invention, the first external electrode and the second external electrode are each formed in a cap shape on the end of the ceramic body, thereby improving the mechanical strength between the ceramic body and the first external electrode and the second external electrode.

[0022] Furthermore, in the multilayer ceramic electronic component according to one embodiment of the present invention, the underlying external electrode and the plated external electrode layer are mechanically and electrically connected in the region where the resin layer is not formed, thereby improving the mechanical strength of the first external electrode and the second external electrode, as well as improving electrical reliability. [Brief explanation of the drawing]

[0023] [Figure 1] FIG. 1(A) is a perspective view of a multilayer ceramic capacitor 100 according to the first embodiment. FIG. 1(B) is a partial exploded perspective view of the multilayer ceramic capacitor 100. [Figure 2] It is a cross-sectional view of the multilayer ceramic capacitor 100. [Figure 3] FIGS. 3(A) and (B) are cross-sectional views showing the steps carried out in an example of the manufacturing method of the multilayer ceramic capacitor 100, respectively. [Figure 4] FIGS. 4(C) and (D) are continuations of FIG. 3(B), and are cross-sectional views showing the steps carried out in an example of the manufacturing method of the multilayer ceramic capacitor 100, respectively. [Figure 5] FIGS. 5(E) and (F) are continuations of FIG. 4(D), and are cross-sectional views showing the steps carried out in an example of the manufacturing method of the multilayer ceramic capacitor 100, respectively. [Figure 6] It is a cross-sectional view of a multilayer ceramic capacitor 200 according to the second embodiment. [Figure 7] It is a cross-sectional view showing a multilayer ceramic capacitor 1100 disclosed in Patent Document 1. [Figure 8] It is a cross-sectional view showing a multilayer ceramic capacitor 1200 disclosed in Patent Document 2.

MODE FOR CARRYING OUT THE INVENTION

[0024] The following describes embodiments for carrying out the present invention, along with the drawings. Note that each embodiment is illustrative and does not limit the present invention to the contents of the embodiments. Furthermore, it is possible to combine the contents described in different embodiments, and such implementations are also included in the present invention. Also, the drawings are intended to aid in understanding the specification and may be schematic representations; the proportions of the dimensions of the depicted components or between components may not match the proportions of those dimensions described in the specification. Additionally, components described in the specification may be omitted in the drawings, or their quantities may be omitted.

[0025] [First Embodiment] In this embodiment, a multilayer ceramic capacitor will be used as an example of a multilayer ceramic electronic component. However, the type of multilayer ceramic electronic component in the present invention is arbitrary and is not limited to a multilayer ceramic capacitor.

[0026] Figures 1(A), 1(B), and 2 show a multilayer ceramic capacitor 100 according to the first embodiment. However, Figure 1(A) is a perspective view of the multilayer ceramic capacitor 100. Figure 1(B) is an exploded perspective view of the main part of the multilayer ceramic capacitor 100, showing two of the multiple ceramic layers 1a described later. Figure 2 is a cross-sectional view of the multilayer ceramic capacitor 100, showing the XX portion indicated by the dashed-dotted arrow in Figures 1(A) and 1(B), respectively. Note that the height direction T, length direction L, and width direction W are indicated in the figures, and these directions may be referred to in the following description. In this embodiment, the stacking direction of the ceramic layer 1a, the first internal electrode 2, and the second internal electrode 3, described later, is the height direction T.

[0027] The multilayer ceramic capacitor 100 comprises a ceramic body 1, which is made up of multiple ceramic layers 1a, multiple first internal electrodes 2, and multiple second internal electrodes 3 stacked together. The ceramic body 1 has a rectangular parallelepiped shape and has a first main surface 1A and a second main surface 1B that are opposite each other in the height direction T (stacking direction), a first side surface 1C and a second side surface 1D that are opposite each other in the width direction W which is perpendicular to the height direction T, and a first end surface 1E and a second end surface 1F that are opposite each other in the length direction L which is perpendicular to both the height direction T and the width direction W.

[0028] The height T, width W, and length L dimensions of the ceramic body 1 are arbitrary. Parts or all of the first main surface 1A, second main surface 1B, first side surface 1C, second side surface 1D, first end surface 1E, and second end surface 1F may have irregularities formed on them.

[0029] In the rectangular prism-shaped ceramic body 1, it is also preferable to round the edges where two faces meet and the corners where three faces meet. Rounding can be applied to the edges and corners of the ceramic body 1 by, for example, barrel polishing the unfired ceramic body during the manufacturing process.

[0030] The material of the ceramic element 1 (ceramic layer 1a) is arbitrary; for example, a dielectric ceramic mainly composed of BaTiO3 can be used. However, instead of BaTiO3, dielectric ceramics mainly composed of other materials such as CaTiO3, SrTiO3, or CaZrO3 may be used. The dielectric ceramic may also have minor components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, or Ni compounds added to it.

[0031] In the ceramic body 1, the number of stacked ceramic layers 1a is arbitrary, but it is preferable to have, for example, 10 to 2000 layers, including protective layers on the first main surface 1A side and the second main surface 1B side where the first internal electrodes 2 and second internal electrodes 3 are not stacked. The thickness of the ceramic layer 1a is preferably, for example, 0.1 μm to 10.0 μm.

[0032] The materials of the first internal electrode 2 and the second internal electrode 3 are arbitrary, but for example, Ni, Cu, Ag, Pd, Au, or alloys thereof can be used. Examples of alloys include Ag-Pd alloy. Furthermore, these metals and alloys are not limited to one type, but may include multiple types.

[0033] The planar shapes of the first internal electrode 2 and the second internal electrode 3 are arbitrary, but for example, they can be rectangular. Furthermore, the planar shapes of the first internal electrode 2 and the second internal electrode 3 may have rounded corners or tapered edges.

[0034] The number of layers of the first internal electrode 2 and the second internal electrode 3 is arbitrary, but it is preferable that the total number of layers is, for example, 10 to 2000. The thickness of the first internal electrode 2 and the second internal electrode 3 is arbitrary, but it is preferable that each is, for example, 0.1 μm to 10.0 μm.

[0035] Preferably, the first internal electrode 2 and the second internal electrode 3 are stacked alternately within the ceramic body 1. When the ceramic body 1 is viewed through to the height T, the first internal electrode 2 and the second internal electrode 3 overlap. A capacitance is formed between the first internal electrode 2 and the second internal electrode 3, which overlap with the ceramic layer 1a in between, and the characteristics of a capacitor are exhibited.

[0036] The first internal electrode 2 is led out to the first end face 1E of the ceramic body 1. The second internal electrode 3 is led out to the second end face 1F of the ceramic body 1. Neither the first internal electrode 2 nor the second internal electrode 3 is exposed to the first side surface 1C or the second side surface 1D of the ceramic body 1. In other words, a gap is provided between the first internal electrode 2 and the second internal electrode 3 and the first side surface 1C and the second side surface 1D, respectively.

[0037] A first external electrode 4 is formed on one end of the ceramic body 1. A second external electrode 5 is formed on the other end of the ceramic body 1. The first external electrode 4 and the second external electrode 5 are each formed in a cap shape. Specifically, the first external electrode 4 is formed on the first end face 1E of the ceramic body 1, and its edge extends from the first end face 1E to the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D, respectively. The second external electrode 5 is formed on the second end face 1F of the ceramic body 1, and its edge extends from the second end face 1F to the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D, respectively.

[0038] However, the first external electrode 4 only needs to be formed on the first end face 1E of the ceramic body 1, and the portions formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D may be omitted. Similarly, the second external electrode 5 only needs to be formed on the first end face 1E of the ceramic body 1, and the portions formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D may be omitted.

[0039] The thicknesses of the first external electrode 4 and the second external electrode 5 are arbitrary, but are preferably, for example, 0.1 μm to 20.0 μm.

[0040] Multiple first internal electrodes 2 are electrically connected to the first external electrode 4. Multiple second internal electrodes 3 are electrically connected to the second external electrode 5.

[0041] As shown in Figure 2, the first external electrode 4 and the second external electrode 5 each comprise a base external electrode 6 formed on the outer surface of the ceramic body 1, a resin layer 7 formed on the base external electrode 6, and at least one plated external electrode layer formed on the resin layer 7.

[0042] The resin layer 7 in this embodiment contains metal. The material of the resin layer 7 is sometimes called a conductive resin. However, if the structure allows for electrical connection between the substrate external electrode 6 and the plated external electrode layer, a resin layer 7 that does not contain metal can also be used.

[0043] In this embodiment, the first external electrode 4 and the second external electrode 5 each comprise a first Ni-plated electrode layer 8 and a second Sn-plated electrode layer 9 as their respective plated external electrode layers.

[0044] Furthermore, in this embodiment, the first external electrode 4 and the second external electrode 5 each have a resin layer non-formation region NR in which the resin layer 7 does not cover the underlying external electrode 6. In the resin layer non-formation region NR, the plated external electrode layer (the first Ni plated electrode layer 8) covers the underlying external electrode 6, and the two are mechanically and electrically connected.

[0045] The material of the base external electrode 6 is arbitrary, but may include, for example, metal and glass components. The base external electrode 6 may be formed by co-firing with the ceramic body 1, or it may be formed by applying a conductive paste after the ceramic body 1 has been fabricated and then firing it.

[0046] The type of metal included in the substrate external electrode 6 is arbitrary, but for example, Cu, Ni, Ag, Pd, Au, or alloys thereof can be used. Examples of alloys include Ag-Pd alloys. Furthermore, these metals and alloys are not limited to one type, but may include multiple types.

[0047] The type of glass component included in the substrate external electrode 6 is arbitrary, but for example, one containing at least one selected from B, Si, Ba, Mg, Al, Li, etc. can be used.

[0048] The base external electrode 6 is not limited to a single layer, but may consist of multiple layers. The thickness of the base external electrode 6 is arbitrary, but for example, the dimensions near the center of the first end face 1E of the first external electrode 4 and the dimensions near the center of the first end face 1E of the second external electrode 5 are preferably 20 μm or less.

[0049] As can be seen from Figure 2, the substrate external electrode 6 is formed discontinuously on the ceramic substrate 1. Discontinuous formation means that the coverage is not 100%. As a result, the ceramic substrate 1 has exposed regions EA that are partially exposed from the discontinuously formed substrate external electrode 6. When the coverage of the substrate external electrode 6 is high, the exposed regions EA tend to appear as islands within the substrate external electrode 6. Conversely, when the coverage of the substrate external electrode 6 is low, the substrate external electrode 6 tends to appear as islands within the exposed regions EA. The exposed regions EA may be formed uniformly over the entire substrate external electrode 6, or they may be concentrated in a part of the substrate external electrode 6.

[0050] When the exposed area EA is formed uniformly across the entire substrate external electrode 6, the thickness of the substrate external electrode 6 can be made uniform across the entire substrate external electrode 6, and no protrudingly large thickness portion is formed. Therefore, it is possible to suppress an increase in the external dimensions of the multilayer ceramic capacitor 100, including the first external electrode 4 and the second external electrode 5.

[0051] In the first external electrode 4 and the second external electrode 5, if the exposed area EA is concentrated in the peripheral areas of the first end face 1E and the second end face 1F compared to the central areas of the first end face 1E and the second end face 1F, the thickness of the base external electrode 6 in the central areas of the first end face 1E and the second end face 1F can be made larger than the thickness of the base external electrode 6 in the peripheral areas of the first end face 1E and the second end face 1F, thereby improving the adhesion strength between the ceramic body 1 and the base external electrode 6.

[0052] For example, the average dimension of the exposed area EA (the average dimension between adjacent substrate external electrodes 6) appearing in the cross-section of the multilayer ceramic capacitor 100 parallel to the first side surface 1C and the second side surface 1D is preferably 0.1 μm or more and 10.0 μm or less. If it is less than 0.1 μm, the substrate external electrodes 6 may neck together, increasing the residual stress of the substrate external electrodes 6 and potentially reducing the mechanical strength (bonding strength) between the ceramic body 1 and the substrate external electrodes 6. If it exceeds 10.0 μm, the electrical connectivity between the first internal electrode 2 and the first external electrode 4, and between the second internal electrode 3 and the second external electrode 5 may decrease, potentially leading to a decrease in the capacitance of the multilayer ceramic capacitor 100 and an increase in the equivalent series resistance (ESR).

[0053] The thickness of the substrate external electrode 6 is arbitrary, but it is preferable that the maximum thickness at the first end face 1E and the second end face 1F is 20 μm or less.

[0054] In the multilayer ceramic capacitor 100, the resin layer 7 covers the underlying external electrodes 6 and the exposed region EA. The resin layer 7 completely covers the underlying external electrodes 6 and the exposed region EA at least on the first end face 1E of the ceramic body 1. Furthermore, the resin layer 7 completely covers the underlying external electrodes 6 and the exposed region EA at least on the second end face 1F of the ceramic body 1. Complete coverage means that the underlying external electrodes 6 and the exposed region EA are completely hidden by the resin layer 7, and the underlying external electrodes 6 and the exposed region EA (ceramic body 1) are not exposed to the outside.

[0055] The reason why the resin layer 7 completely covers the underlying external electrode 6 and the exposed area EA at least on the first end face 1E and the second end face 1F of the ceramic body 1 is as follows: If the resin layer 7 were not to completely cover the underlying external electrode 6 and the exposed area EA, then when looking at a cross-section parallel to the first side surface 1C and the second side surface 1D, the underlying external electrode 6 and the resin layer 7 would be formed alternately and fragmentarily on the first end face 1E and the second end face 1F of the ceramic body 1 in the height direction T. However, in this structure, the resin layer 7 would not contribute to improving the bonding strength, the compressive stress in the height direction T of the first external electrode 4 and the second external electrode 5 would be weakened, and the bonding strength of the first external electrode 4 and the second external electrode 5 to the ceramic body 1 would be insufficient. In other words, the first external electrode 4 and the second external electrode 5 would be more likely to peel off from the ceramic body 1. In contrast, in the multilayer ceramic capacitor 100, the resin layer 7 completely covers the underlying external electrode 6 and the exposed area EA at least on the first end face 1E and the second end face 1F of the ceramic body 1, resulting in strong compressive stress in the height direction T of the first external electrode 4 and the second external electrode 5, improving the bonding strength of the first external electrode 4 and the second external electrode 5 to the ceramic body 1, and making it difficult for the first external electrode 4 and the second external electrode 5 to peel off from the ceramic body 1.

[0056] Furthermore, when the resin layer 7 completely covers the underlying external electrode 6 and the exposed area EA at least the first end face 1E and the second end face 1F of the ceramic body 1, the resin layer 7 protects the underlying external electrode 6 formed on the ceramic body 1, making it difficult for the underlying external electrode 6 to peel off from the ceramic body 1. Thus, the bonding strength of the first external electrode 4 and the second external electrode 5 to the ceramic body 1 is also improved.

[0057] Furthermore, the multilayer ceramic capacitor 100 has improved moisture resistance because the resin layer 7 completely covers the underlying external electrode 6 and the exposed area EA at the first end face 1E and the second end face 1F of the ceramic body 1. In other words, as described above, the first end face 1E and the second end face 1F of the ceramic body 1 are the areas most likely to be penetrated into the interior of the ceramic body 1, but since these areas are completely covered by the resin layer 7, moisture resistance is improved. Therefore, the multilayer ceramic capacitor 100 is highly reliable.

[0058] The surface of the resin layer 7 formed on the first end face 1E and the second end face 1F of the ceramic body 1 may be flat or may have an uneven surface.

[0059] On the other hand, the portions formed on the first main surface 1A, second main surface 1B, first side surface 1C, and second side surface 1D of the ceramic body 1 of the first external electrode 4 have a region where the resin layer 7 covers the underlying external electrode 6 and the exposed region EA, and a region NR where the resin layer 7 does not cover the underlying external electrode 6 and the exposed region EA at all. Similarly, the portions formed on the first main surface 1A, second main surface 1B, first side surface 1C, and second side surface 1D of the ceramic body 1 of the second external electrode 5 have a region where the resin layer 7 covers the underlying external electrode 6 and the exposed region EA, and a region NR where the resin layer 7 does not cover the underlying external electrode 6 and the exposed region EA at all.

[0060] The resin layer non-formed region NR of the first external electrode 4 is formed on the side away from the first end face 1E of the ceramic body 1. The resin layer non-formed region NR of the second external electrode 5 is formed on the side away from the second end face 1F of the ceramic body 1. In the resin layer non-formed region NR, the end of the base external electrode 6 and the plated external electrode layer (Ni plated electrode layer 8, Sn plated electrode layer 9) are directly joined, so the first external electrode 4 and the second external electrode 5 become stronger and their mechanical strength is improved. In addition, the base external electrode 6 and the plated external electrode layer are electrically connected in the resin layer non-formed region NR.

[0061] In the portions formed on the first main surface 1A, second main surface 1B, first side surface 1C, and second side surface 1D of the ceramic body 1 of the first external electrode 4 and the second external electrode 5, the length L of the region where the resin layer 7 covers the underlying external electrode 6 and the exposed region EA is preferably 75% or less when the length L of the first external electrode 4 is taken as 100%. In this case, the length L of the region NR where the resin layer is not formed can be sufficiently large, the bonding strength between the end of the underlying external electrode 6 and the plated external electrode layer can be increased, and the mechanical strength of the first external electrode 4 and the second external electrode 5 is improved.

[0062] As described above, in this embodiment, the resin layer 7 contains metal. Therefore, the first external electrode 4 and the second external electrode 5 are electrically connected to the base external electrode 6 and the plated external electrode layers (Ni plated electrode layer 8 and Sn plated electrode layer 9) via the resin layer 7.

[0063] The thickness of the resin layer 7 is preferably, for example, 0.1 μm or more and 100 μm or less in the portion of the ceramic body 1 near the center of the first end face 1E and the second end face 1F where the underlying external electrode 6 is not formed. Furthermore, the thickness of the resin layer 7 is preferably, for example, 0.1 μm or more and 100 μm or less in the portion of the ceramic body 1 near the center of the first external electrode 4 and the second external electrode 5 in the longitudinal direction L on the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D.

[0064] The resin layer 7 includes, for example, a thermosetting resin and a metal. Because the resin layer 7 contains a thermosetting resin, it is generally more flexible than the underlying external electrode 6 or the plated external electrode layers (Ni plated electrode layer 8, Sn plated electrode layer 9). Therefore, even if the multilayer ceramic capacitor 100 is subjected to physical shock or shock caused by thermal cycling, the resin layer 7 functions as a buffer layer, suppressing the occurrence of cracks in the ceramic body 1.

[0065] As the resin included in the resin layer 7, various known thermosetting resins such as epoxy resin, phenolic resin, urethane resin, silicone resin, and polyimide resin can be used. Among these, epoxy resin is one of the most suitable resins because it has excellent heat resistance, moisture resistance, and adhesion.

[0066] The resin contained in the resin layer 7 is preferably 25% by volume or more and 65% by volume or less of the total volume of the material of the resin layer 7.

[0067] Furthermore, it is preferable that the resin layer 7 also contains a curing agent along with the thermosetting resin. When epoxy resin is used as the base resin, various known compounds such as phenolic, amine, acid anhydride, and imidazole compounds can be used as curing agents.

[0068] As the metal contained in the resin layer 7, for example, metal fillers of Ag, Cu, Ni, or alloys thereof can be used. Furthermore, the surface of these metal fillers may be coated with Ag or the like. When coating the surface of the metal filler with Ag, it is preferable to use Cu or Ni for the main body of the metal filler. Alternatively, a Cu metal filler that has undergone an anti-oxidation treatment may be used.

[0069] When Ag is used as the metal filler contained in the resin layer 7, Ag has an extremely low resistivity among metals and does not oxidize, and has high resistance, so a good resin layer 7 can be formed. Alternatively, if a metal other than Ag is used as the metal contained in the resin layer 7 and Ag is coated on the surface, the good properties of Ag can be enjoyed while forming the resin layer 7 at a low cost.

[0070] The amount of metal contained in the resin layer 7 is preferably 35% or more and 75% or less by volume relative to the total volume of the material of the resin layer 7.

[0071] The shape of the metal contained in the resin layer 7 is not particularly limited. For example, it may be spherical, flattened, or otherwise. It is also preferable to use a mixture of spherical and flattened metals. The average particle size of the metal contained in the resin layer 7 is not particularly limited. For example, the average particle size of the metal contained in the resin layer 7 can be 0.3 μm or more and 10 μm or less.

[0072] The metal contained in the resin layer 7 is responsible for ensuring conductivity within the resin layer 7. In other words, the contact between the metal fillers forms an electrical pathway inside the resin layer 7.

[0073] In this embodiment, the first external electrode 4 and the second external electrode 5 are formed as the plated external electrode layers, with a first Ni plated electrode layer 8 and a second Sn plated electrode layer 9. However, the number of plated electrode layers and their materials are arbitrary and can be changed. In addition to Ni and Sn, materials such as Cu, Ag, Pd, Au, and Ag-Pd alloys can be used as the material for the plated electrode layers. For example, instead of a two-layer structure with a first Ni plated electrode layer 8 and a second Sn plated electrode layer 9, a three-layer structure may be used with the first layer being a Sn plated electrode layer, the second layer a Ni plated electrode layer, and the third layer a Sn plated electrode layer.

[0074] The thickness of each layer of the plated external electrode is preferably 0.1 μm or more and 20.0 μm or less.

[0075] The first layer of Ni-plated electrode layer 8 covers the resin layer 7 in the region where the resin layer 7 is formed, and covers the underlying external electrode 6 and the ceramic body 1 in the region NR where the resin layer 7 is not formed. When the Ni-plated electrode layer 8 covers the resin layer 7, it is preferable that the Ni-plated electrode layer 8 completely covers the resin layer 7. The Ni-plated electrode layer 8 plays a role in preventing the underlying external electrode 6 from being eroded by the solder when mounting the multilayer ceramic capacitor 100.

[0076] The second layer, the Sn-plated electrode layer 9, covers the Ni-plated electrode layer 8. The Sn-plated electrode layer 9 plays a role in improving the wettability of the solder when mounting the multilayer ceramic capacitor 100.

[0077] In the multilayer ceramic capacitor 100 according to the first embodiment, which has the above structure, the underlying external electrodes 6 are formed discontinuously on the ceramic body 1, so the residual stress of the underlying external electrodes 6 formed on the ceramic body 1 is relieved, and the mechanical strength between the ceramic body 1 and the first external electrode 4 and the second external electrode 5 is high.

[0078] Furthermore, in one embodiment of the present invention, the multilayer ceramic capacitor 100 has high moisture resistance and, consequently, high reliability because at least the first end face 1E and the second end face 1F of the ceramic body 1 have the underlying external electrode 6 and the exposed region EA of the ceramic body 1 completely covered by the resin layer 7.

[0079] (An example of a manufacturing method for a multilayer ceramic capacitor 100) An example of a manufacturing method for the multilayer ceramic capacitor 100 will be explained with reference to Figures 3(A) to 5(F).

[0080] First, the ceramic body 1 shown in Figure 3(A) is fabricated.

[0081] Although not shown in the diagram, first, dielectric ceramic powder, binder resin, solvent, etc. are prepared, and these are wet-mixed to create a ceramic slurry.

[0082] Next, the ceramic slurry is applied to the carrier film in a sheet-like manner using a die coater, gravure coater, microgravure coater, etc., and dried to produce a ceramic green sheet.

[0083] Next, a pre-prepared conductive paste is printed in a desired pattern shape onto the main surface of a predetermined ceramic green sheet in order to form the first internal electrode 2 and the second internal electrode 3. Note that the conductive paste is not printed on the ceramic green sheet that will serve as the protective layer.

[0084] Next, ceramic green sheets are stacked in a predetermined order and integrated using means such as hydrostatic pressing to produce an unfired ceramic base block.

[0085] Next, the unfired ceramic block is cut to a predetermined size to obtain individual unfired ceramic bodies.

[0086] Next, if necessary, the unfired ceramic body is barrel polished to round off edges and corners.

[0087] Next, the unfired ceramic body is fired according to a predetermined profile to complete the ceramic body 1. For example, the firing temperature is set to approximately 900°C to 1400°C. At this time, the conductive paste printed on the main surface of the ceramic green sheet is also fired simultaneously, and the first internal electrode 2 and the second internal electrode 3 are formed inside the ceramic body 1.

[0088] Next, in order to form the base external electrode 6 on the ceramic body 1, conductive paste 16 is applied to both ends of the ceramic body 1, as shown in Figure 3(B). Specifically, for example, the ends of the ceramic body 1 are dipped into a bath containing the conductive paste 16. By adjusting the number and depth of dipping, the formation position, amount, and shape of the applied conductive paste 16 can be adjusted.

[0089] In this embodiment, the thickness of the conductive paste 16 applied to the edges of the ceramic body 1 is kept smaller than that used when manufacturing a typical multilayer ceramic capacitor. This is to create discontinuous formation of the underlying external electrode 6 on the ceramic body 1.

[0090] Next, the ceramic body 1 is heated according to a predetermined profile, and the conductive paste 16 applied to the ends of the ceramic body 1 is baked onto the ceramic body 1. The baking temperature is, for example, around 700°C to 900°C. As a result, as shown in Figure 4(C), discontinuous substrate external electrodes 6 are formed at both ends of the ceramic body 1. The ceramic body 1 has exposed regions EA that are partially exposed from the substrate external electrodes 6.

[0091] Next, as shown in Figure 4(D), a resin layer 7 is formed on the ceramic substrate 1 on which the base external electrode 6 is formed.

[0092] Specifically, first, a resin paste containing a thermosetting resin and a metal component is applied to the baking layer. This application is performed, for example, by dipping the end of the ceramic body 1 into a bath filled with the resin paste.

[0093] Next, the thermosetting resin is heat-treated at a desired temperature to cure it and form a resin layer. The heat treatment temperature is, for example, between 250°C and 550°C, but it may be higher. The atmosphere during heat treatment is preferably an N2 atmosphere. In addition, to prevent resin scattering and oxidation of various metal components, it is preferable to keep the oxygen concentration below 100 ppm.

[0094] The dimensions and shape of the longitudinal L of the substrate external electrode 6 formed on the first main surface 1A, second main surface 1B, first side surface 1C, second side surface 1D, first end surface 1E, and second end surface 1F of the ceramic body 1 can be adjusted by changing the clearance of the amount of pressure applied when applying the resin paste by dipping, and by changing the amount of paste.

[0095] Next, as shown in Figure 5(E), a Ni-plated electrode layer 8 is formed on the surface of the resin layer 7 in the region where the resin layer 7 is formed, and on the surface of the substrate external electrode 6 and the ceramic body 1 in the resin layer non-formed region NR where the resin layer 7 is not formed. The method for forming the Ni-plated electrode layer 8 is arbitrary, but for example, it can be formed by electrolytic barrel plating.

[0096] Next, as shown in Figure 5(F), the multilayer ceramic capacitor 100 is completed by forming a Sn-plated electrode layer 9 on the surface of the Ni-plated electrode layer 8. The method for forming the Sn-plated electrode layer 9 is arbitrary, but for example, it can be formed by electrolytic barrel plating.

[0097] [Modified version of the first embodiment] A modified example of a multilayer ceramic capacitor was fabricated by changing a part of the configuration of the multilayer ceramic capacitor 100 according to the first embodiment.

[0098] The basic structure of the modified multilayer ceramic capacitor is the same as that of the multilayer ceramic capacitor 100 according to the first embodiment shown in Figure 2. Therefore, Figure 2 will be used in the following explanation. However, when using Figure 2, the resin layer 7 of the multilayer ceramic capacitor in Figure 2 should be read as resin layer 7'.

[0099] As described above, in the multilayer ceramic capacitor 100 according to the first embodiment, the resin layer 7 contained metal. In the modified multilayer ceramic capacitor, this was changed so that the resin layer 7' does not contain metal.

[0100] In the modified multilayer ceramic capacitor, the resin layer 7' is not conductive. Therefore, in the modified multilayer ceramic capacitor, electrical connection is made between the base external electrode 6 and the plated external electrode layer in the resin layer-less region NR where the plated external electrode layer (Ni plated electrode layer 8, Sn plated electrode layer) is formed on the base external electrode 6. The other configurations of the modified multilayer ceramic capacitor are the same as those of the multilayer ceramic capacitor 100.

[0101] [Second Embodiment] Figure 6 shows a multilayer ceramic capacitor 200 according to the second embodiment. However, Figure 6 is a cross-sectional view of the multilayer ceramic capacitor 200 parallel to the first side surface 1C and the second side surface 1D.

[0102] In the multilayer ceramic capacitor 200 according to the second embodiment, the portion where the height T dimension of the ceramic body 1 is largest is determined in a cross section parallel to the first side surface 1C and the second side surface 1D shown in Figure 6. A first point Y on the first main surface 1A, which is one of the starting points of this dimension, and a second point Z on the second main surface 1B, which is the other starting point of this dimension, are determined. When a first virtual line LY extending in the length direction L and passing through the first point Y is drawn, and a second virtual line LZ extending in the length direction L and passing through the second point Z is drawn, neither the first virtual line LY nor the second virtual line LZ overlaps with the resin layer 7 of the first external electrode 4 and the resin layer 7 of the second external electrode 5. (Note that the first point Y and the second point Z may each exist in multiple locations.) In other words, the maximum dimension HC in the height T direction of the ceramic body 1 is larger than the maximum dimension HR in the height T direction of the resin layer 7 of the first external electrode 4 and the second external electrode 5.

[0103] The multilayer ceramic capacitor 200 according to the second embodiment has the above structure, so when mounted on a substrate by reflow soldering or the like, the opposing surface facing the mounting surface (upper main surface) of the substrate, which connects the multiple protrusions appearing on the surface of the Ni-plated electrode layer 8, becomes more parallel to the mounting surface of the substrate. Therefore, the multilayer ceramic capacitor 200 can be stably mounted on a substrate, and mounting defects such as the so-called tombstone phenomenon are less likely to occur. The Sn-plated electrode layer 9 generally disappears when reflow soldering is performed.

[0104] The above-described structure of the first external electrode 4 and second external electrode 5 of the multilayer ceramic capacitor 200 can be formed in the manufacturing process by barrel polishing an unfired ceramic body and by methods such as giving the edges and corners of the ceramic body 1 a slightly larger rounded shape.

[0105] Embodiments of the present invention have been described above. However, the present invention is not limited to the above-described content, and various modifications can be made in accordance with the spirit of the invention.

[0106] For example, although the above embodiment uses a multilayer ceramic capacitor 100 as an example, the type of multilayer ceramic electronic component of the present invention is arbitrary and is not limited to multilayer ceramic capacitors. The present invention can be applied to all kinds of multilayer ceramic electronic components, such as multilayer ceramic thermistors, multilayer ceramic varistors, multilayer ceramic inductors, and multilayer ceramic composite components.

[0107] Furthermore, in the above embodiment, the first external electrode 4 and the second external electrode 5 were each provided with a resin layer non-formation region NR, but the resin layer non-formation region NR can be omitted.

[0108] Furthermore, in the above embodiment, the first external electrode 4 and the second external electrode 5 were also formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, the second side surface 1D, the first end surface 1E, and the second end surface 1F of the ceramic body 1, respectively, but these parts can be omitted. That is, the first external electrode 4 only needs to be formed on the first end surface 1E, and the second external electrode 5 only needs to be formed on the first end surface 1E.

[0109] A multilayer ceramic electronic component according to one embodiment of the present invention is as described in the "Means for Solving the Problem" section.

[0110] In this multilayer ceramic electronic component, it is also preferable that the resin layer-free region of the first external electrode is formed on the first main surface, second main surface, first side surface, and second side surface of the ceramic body, on the side away from the first end surface, and the resin layer-free region of the second external electrode is formed on the first main surface, second main surface, first side surface, and second side surface of the ceramic body, on the side away from the second end surface. In this case, the resin layer is encased in the underlayer external electrode and the plated external electrode layer, improving the integrity of the first and second external electrodes and increasing their mechanical strength.

[0111] Preferably, when the lengthwise dimensions of the portions formed on the first main surface, second main surface, first side surface, and second side surface of the first and second external electrodes are taken as 100%, the ratio of the lengthwise dimensions of the area covering the discontinuously formed resin layer on the base external electrode and the exposed area is 75% or less. In this case, sufficient lengthwise dimensions of the area without a resin layer can be secured, and the bonding strength between the base external electrode and the plated external electrode layer can be increased, thereby improving the mechanical strength of the first and second external electrodes. Furthermore, sufficient lengthwise dimensions of the area without a resin layer can be secured, and the electrical connection between the base external electrode and the plated external electrode layer becomes reliable, thus improving the electrical reliability of the first and second external electrodes.

[0112] It is also preferable that the resin layer contains metal. In this case, the base external electrode 6 and the plated external electrode layer are electrically connected via the resin layer 7, thereby improving the electrical reliability of the first external electrode and the second external electrode, respectively.

[0113] In any cross-section parallel to the first and second sides, the portion where the height dimension of the ceramic body is largest is determined. A first point on the first main surface, which is the starting point of one of these dimensions, and a second point on the second main surface, which is the starting point of the other dimension, are determined. When a first imaginary line extending in the length direction passes through the first point and a second imaginary line extending in the length direction passes through the second point, it is preferable that neither the first nor the second imaginary line overlaps with the resin layer of the first external electrode or the resin layer of the second external electrode. In this case, when mounted on a substrate by reflow soldering or the like, the opposing surface facing the mounting surface (upper main surface) of the substrate, which connects the multiple protrusions that appear on the surface of the plated external electrode layer, becomes more parallel to the mounting surface of the substrate. Therefore, stable mounting on the substrate is possible, and mounting defects such as the so-called tombstone phenomenon become less likely. [Explanation of symbols]

[0114] 1. Ceramic base 1a. Ceramic layer 1A...First main surface 1B...Second main surface 1C...1st side 1D...Second side 1E...1st end surface 1F...2nd end surface 2...1st internal electrode 3...Second internal electrode 4...1st external electrode 5...Second external electrode 6. Substrate external electrode 7. Resin layer 8. Ni-plated electrode layer 9. Sn plated electrode layer

Claims

1. A ceramic body having a first internal electrode and a second internal electrode stacked inside, a first main surface and a second main surface facing each other in the stacking direction, a first side surface and a second side surface facing each other in the width direction perpendicular to the stacking direction, and a first end surface and a second end surface facing each other in the length direction perpendicular to both the stacking direction and the width direction, A first external electrode is formed on the first end face, and its edges extend from the first end face to the first main surface, the second main surface, the first side surface, and the second side surface, respectively. The device comprises a second external electrode formed on the second end face, the edge of which extends from the second end face to the first main face, the second main face, the first side surface, and the second side surface, respectively. A multilayer ceramic electronic component in which the first internal electrode is led out to the first end face and connected to the first external electrode, and the second internal electrode is led out to the second end face and connected to the second external electrode, The first external electrode and the second external electrode each comprise a base external electrode, a resin layer formed on the outside of the base external electrode, and at least one plated external electrode layer formed on the outside of the resin layer. The aforementioned external substrate electrode is formed discontinuously on the ceramic substrate, The ceramic substrate has an exposed region that is partially exposed from the discontinuously formed external electrode of the substrate, The resin layer covers the discontinuously formed external electrode of the substrate and the exposed area. The resin layer completely covers the discontinuously formed base external electrode and the exposed area on the first end face of the first external electrode and the second end face of the second external electrode, respectively. The first external electrode and the second external electrode each include, on the first main surface, the second main surface, the first side surface, and the second side surface, a region where the resin layer is discontinuously formed and covers the underlying external electrode and the exposed region, and a region where the resin layer is not formed and does not cover the underlying external electrode and the exposed region. In the region where the resin layer is not formed, the plated external electrode layer covers the discontinuously formed base external electrode and the exposed region of the ceramic body partially exposed from the discontinuously formed base external electrode. In any one cross-section parallel to the first and second surfaces, Find the part of the ceramic body where the height dimension is largest. The first point on the first main surface, which is one of the starting points of the dimension, and the second point, which is the other starting point of the dimension. Find the second point on the principal plane, When a first imaginary line extending in the longitudinal direction and passing through the first point is drawn, and a second imaginary line extending in the longitudinal direction and passing through the second point is drawn, The first virtual line and the second virtual line do not overlap with the resin layer of the first external electrode and the resin layer of the second external electrode. Multilayer ceramic electronic components.

2. The resin layer non-formed region of the first external electrode is formed on the first main surface, second main surface, first side surface, and second side surface of the ceramic body, on the side away from the first end surface. The resin layer non-formed region of the second external electrode is formed on the first main surface, second main surface, first side surface, and second side surface of the ceramic body, on the side away from the second end surface. A multilayer ceramic electronic component as described in claim 1.

3. The first external electrode and the second external electrode are, respectively, When the lengthwise dimension of the portion formed on the first main surface, the second main surface, the first side surface, and the second side surface is set to 100%, The ratio of the lengthwise dimension of the area covering the external electrode and the exposed region, where the resin layer is formed discontinuously, is 75% or less. A multilayer ceramic electronic component as described in claim 1.

4. In the region where the resin layer is not formed, the underlayment external electrode and the plated external electrode layer are mechanically and electrically connected. A multilayer ceramic electronic component as described in claim 1.

5. The aforementioned resin layer contains a metal, A multilayer ceramic electronic component as described in claim 1.

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