Optical module

Abstract

To obtain an improved and novel optical module in which, for example, the size can be configured smaller as an optical module with a circuit board housed within a housing.SOLUTION: An optical module comprises, for example, a housing, an active optical component as an optical component housed in the housing and outputting light or inputting light and operating electrically, a circuit board assembly, which is housed in the housing and fixed to the housing, having electrical components and a circuit board fixed to the housing and intersecting the first direction and on which the electrical components are mounted, and a support member housed within the housing and fixed to the housing without the circuit board, intersecting the first direction, separating from the circuit board in the first direction and at least partially overlapping the circuit board in the first direction, and supporting the optical component.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an optical module.

Background Art

[0002] Conventionally, an optical module including a light-emitting element and optical components in a housing has been known (for example, Patent Document 1). In the optical module of Patent Document 1, the circuit board is provided outside the housing.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In this type of optical module, even when a circuit board is housed in the housing, it is preferable that the size of the optical module does not increase as much as possible.

[0005] Therefore, one of the problems of the present invention is to obtain a new and improved optical module that can be configured to have a smaller size, for example, as an optical module in which a circuit board is housed in a housing.

Means for Solving the Problems

[0006] The optical module of the present invention comprises, for example, a housing; an active optical component housed within the housing, which outputs light or is electrically operated when light is input to it; a circuit board assembly housed within the housing and fixed to the housing, which includes an electrical component and a circuit board fixed to the housing, intersecting a first direction, on which the electrical component is mounted; and a support member housed within the housing and fixed to the housing without going through the circuit board, which intersects the first direction, moves away from the circuit board in the first direction, and at least partially overlaps the circuit board in the first direction, and supports the optical component.

[0007] The optical module may include a first optical component as the active optical component that is not mounted on the circuit board, and the support member may have a first conductor that constitutes part of a first wiring that electrically connects the first electrode of the first optical component and the first terminal provided on the housing without going through the circuit board.

[0008] In the optical module, the circuit board may have a second conductor that constitutes part of a second wiring that electrically connects the second electrode of the first optical component and the second terminal provided on the housing.

[0009] In the optical module, an electrical signal may be input to the first optical component or power may be supplied to it via the second wiring.

[0010] In the optical module, an electrical signal may be output from the first optical component via the first wiring.

[0011] In the optical module, a filter circuit may be formed in the circuit board assembly by the second conductor and the electrical component.

[0012] In the optical module, the first optical component includes a light-emitting element, and the circuit board assembly may include a filter circuit for the power supplied to the light-emitting element as the filter circuit.

[0013] In the optical module, the first optical component includes a semiconductor optical amplifier, and the circuit board assembly may include a filter circuit for the power supplied to the semiconductor optical amplifier as the filter circuit.

[0014] In the optical module, the second terminal may be provided on the side wall of the housing, and the circuit board may be provided between the first optical component and the side wall.

[0015] The optical module may include a second optical component as the active optical component, which is not mounted on the circuit board, and the circuit board may have a third conductor that constitutes part of a third wiring that electrically connects the third electrode of the second optical component and the third terminal provided on the housing.

[0016] In the optical module, the light passing through the optical component supported by the support member may pass through a position away from the circuit board assembly in the first direction.

[0017] In the optical module, the electrical components may be arranged on the circuit board such that they avoid light traveling in a second direction that intersects the first direction and passes through a position away from the circuit board in the first direction, in a third direction that intersects the first and second directions, or in the opposite direction to the third direction.

[0018] The optical module includes a first optical component as the active optical component, which is not mounted on the circuit board, and the light passing through the optical component supported by the support member may be light output from the first optical component or light input to the first optical component.

[0019] The optical module may include a temperature control device attached to the housing, and the support member may be supported by the temperature control device.

[0020] In the optical module, the support member may be supported solely by the temperature control device.

[0021] In the optical module, as the active optical component, a first optical component not mounted on the circuit board is provided, and the temperature control device may support the support member and the first optical component.

[0022] In the optical module, the support member may be provided avoiding the electrical components.

[0023] In the optical module, when viewed in the direction opposite to the first direction, the support member may have a bent shape avoiding the electrical components.

[0024] In the optical module, when viewed in the direction opposite to the first direction, the support member may have an opening avoiding the electrical components.

[0025] In the optical module, an optical absorption material may be applied to the circuit board assembly or the support member.

[0026] In the optical module, an optical component provided on the circuit board may be included.

Advantages of the Invention

[0027] According to the present invention, a novel and improved optical module can be obtained.

Brief Description of the Drawings

[0028] [Figure 1] FIG. 1 is an exemplary and schematic plan view of an optical module according to the first embodiment. [Figure 2] FIG. 2 is an exemplary and schematic plan view showing a part of the internal configuration of the optical module according to the first embodiment. [Figure 3] FIG. 3 is an exemplary and schematic rear view showing a part of the internal configuration of the optical module according to the first embodiment. [Figure 4] FIG. 4 is an exemplary and schematic rear view showing a part of the internal configuration of the optical module according to the second embodiment. [Figure 5]Figure 5 is an illustrative and schematic plan view showing part of the internal configuration of the optical module of the third embodiment. [Figure 6] Figure 6 is an illustrative and schematic plan view showing part of the internal configuration of the optical module of the fourth embodiment. [Figure 7] Figure 7 is an illustrative and schematic plan view showing part of the internal configuration of the optical module of the fifth embodiment. [Figure 8] Figure 8 is an illustrative and schematic rear view showing part of the internal configuration of the optical module of the sixth embodiment. [Modes for carrying out the invention]

[0029] Illustrative embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by such configurations, are examples only. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derived effects) that can be obtained by the configuration.

[0030] The multiple embodiments shown below have similar configurations. Therefore, the configuration of each embodiment yields similar functions and effects based on the same configuration. In addition, the same reference numerals are used for these similar configurations below, and redundant explanations may be omitted.

[0031] In this specification, ordinal numbers are assigned for convenience to distinguish directions, components, parts, etc., and do not indicate priority or order, nor do they limit the number of items.

[0032] In each figure, the X direction is represented by arrow X, the Y direction by arrow Y, and the Z direction by arrow Z. The X, Y, and Z directions intersect and are also orthogonal to each other. The X direction may also be called the longitudinal direction or extension direction, the Y direction may be called the short direction or width direction, and the Z direction may be called the thickness direction or height direction.

[0033] [First Embodiment] Figure 1 is a plan view of the optical module 100A(100) of the first embodiment. As shown in Figure 1, the optical module 100 comprises a relatively thin, flat rectangular parallelepiped housing 10 in the Z direction. The housing 10 has a bottom wall 11, a side wall 12, a top wall 13, a port 14 for inputting and outputting optical signals, and a through member 20.

[0034] The lower wall 11 and the upper wall 13 each have a rectangular and plate-like shape, extending in the Z direction with a substantially constant thickness, intersecting and perpendicular to the Z direction. A gap is provided between the lower wall 11 and the upper wall 13 in the Z direction. The side walls 12 extend in the Z direction with a substantially constant thickness between each side of the lower wall 11 and each side of the upper wall 13. Inside the housing 10, a storage chamber R (see Figure 2) is formed, enclosed by the lower wall 11, the upper wall 13, and the four side walls 12, and various parts are housed in this storage chamber R.

[0035] The lower wall 11 is made of a material with relatively high thermal conductivity, such as copper tungsten (CuW), copper molybdenum (CuMo), or aluminum oxide (Al2O3). The side walls 12 and upper wall 13 are made of materials with relatively low coefficients of thermal expansion, such as Fe-Ni-Co alloy or aluminum oxide (Al2O3).

[0036] The through member 20 has a substantially constant thickness in the Z direction and penetrates the three side walls 12, excluding the side wall 12 on which the port 14 is provided. It can be said that the through member 20 constitutes a part of the side walls 12 of the housing 10. The through member 20 has a substantially U-shape along the three side walls 12.

[0037] Port 14 has an optical fiber and an optical connector.

[0038] Figure 2 is a plan view showing part of the internal configuration of the optical module 100. Figure 2 mainly shows the part of the internal configuration that processes the input optical signal.

[0039] The housing chamber R contains a chip-on submount 30, a circuit board 40, a support member 50A (50), a temperature control device 60, a wavelength rocker 71, a coherent mixer 81, a transimpedance amplifier 82, optical components 91, and the like.

[0040] The through member 20 penetrates the side wall 12 located at the Y-direction end within the range shown in Figure 2. The through member 20 has a body 21, a plurality of pins 22, a surface 20a, and a plurality of electrodes 20b. The body 21 is made of an insulator. Each pin 22 is made of a conductive material such as a copper-based material and is exposed to the outside of the housing 10. The surface 20a is exposed to the inside of the housing 10, i.e., to the housing chamber R. Each electrode 20b is provided on the surface 20a, is made of a conductive material, and is electrically connected to the pins 22 via an internal conductor. The pins 22, electrodes 20b, and internal conductor constitute wiring that supplies power and transmits electrical signals between the inside and outside of the housing 10. The through member 20 may also be called a feedthrough.

[0041] The chip-on submount 30 includes a laser element 31 and a submount 32 on which the laser element 31 is mounted. The laser element 31 is, for example, a tunable laser element. The submount 32 is made of a material with high thermal conductivity, and more efficiently conducts the heat generated by the laser element 31 to the side opposite the laser element 31. The chip-on submount 30 is an example of an active optical component, which is an optical component that outputs light and operates electrically, and is an example of a first optical component.

[0042] The laser element 31 is operated by power supplied, for example, via terminal 30b of the chip-on submount 30, and outputs a continuous wave (CW) and linearly polarized laser beam L from the end face opposite the X direction. The laser element 31 also outputs a laser beam for wavelength locking from the end face in the X direction.

[0043] The laser beam L output from the end face of the laser element 31 opposite to the X direction is input to the coherent mixer 81 via optical components 91 such as a lens, mirror, or beam splitter. In addition to the laser beam from the laser element 31, the coherent mixer 81 also receives external laser beam L. The coherent mixer 81 outputs a current signal corresponding to the processed light obtained by the interference of the two input laser beams L. This current signal is input to the transimpedance amplifier 82. The transimpedance amplifier 82 outputs a voltage signal corresponding to the input current signal. This voltage signal is transmitted to a control device outside the housing 10 via the conductor of the through member 20.

[0044] On the other hand, the laser light output from the X-direction end face of the laser element 31 is input to the wavelength rocker 71, for example, via the optical component 91. The wavelength rocker 71 splits the input laser light into multiple outputs. The split laser light is input to the photodiode array 72. The photodiode array 72 has multiple photodetectors. Each of these photodetectors outputs an electrical signal corresponding to the light detection intensity of the laser light split by the wavelength rocker 71. These electrical signals are transmitted to a control device outside the housing 10 via the conductor of the through member 20. The control device detects the wavelength of the laser light output from the laser element 31 based on these electrical signals and controls the operation of the laser element 31. The photodiode array 72 and the photodetectors included in the photodiode array 72 are examples of active optical components, which are optical components that are electrically operated when light is input to them, and are examples of second optical components.

[0045] The circuit board 40 has an insulator 41 and conductors such as electrodes 42a and wiring 42b. The circuit board 40 has a rectangular and plate-like shape, and extends both perpendicularly and intersecting the Z direction. Multiple electrical components 43 are mounted on the circuit board 40. Specifically, the electrical components 43 are, for example, capacitors or ferrite beads. The circuit board 40 and the multiple electrical components 43 constitute a circuit board assembly. Note that electronic components may be mounted on the circuit board 40 as electrical components 43.

[0046] The circuit board assembly can, for example, constitute a filter circuit that removes noise from the power supplied to the chip-on-submount 30 and from the electrical signals input to the chip-on-submount 30. In this case, the filter circuit is composed of conductors such as electrodes 42a and wiring on the circuit board 40 and a plurality of electrical components 43. The power supplied to the chip-on-submount 30 may include, for example, the power supplied to the laser element 31 and the power supplied to a semiconductor optical amplifier, for example, provided integrally with the laser element 31. The circuit board assembly can have a filter circuit for at least one of these powers.

[0047] The electrode 30b of the chip-on submount 30 is electrically connected to the electrode 20b of the through member 20, which forms part of the side wall of the housing 10, via a bonding wire 95, an electrode 42a of the circuit board 40, wiring within the circuit board 40, another electrode 42a of the circuit board 40, and another bonding wire 95. That is, the bonding wire 95, electrode 42a, wiring within the circuit board 40, another electrode 42a, and another bonding wire 95 constitute wiring that electrically connects electrode 30b and electrode 20b via the circuit board 40. This wiring constitutes part of the filter circuit. This wiring is an example of a second wiring, electrode 30b is an example of a second electrode, and electrode 20b is an example of a second terminal. Also, electrode 42a and the wiring within the circuit board 40 are examples of a second conductor.

[0048] In this case, it is preferable that the circuit board 40 is provided between the through member 20, which is part of the side wall, and the chip-on submount 30. This allows for a shorter wiring length between the electrodes 30b and 20b, and, if the circuit board assembly is configured as a filter circuit, it has the advantage of more reliably suppressing the influence of noise on the chip-on submount 30.

[0049] Furthermore, in this embodiment, the electrode 72a of the photodiode array 72 is electrically connected to the electrode 20b of the through member 20 which constitutes part of the side wall of the housing 10, via a bonding wire 95, an electrode 42a of the circuit board 40, wiring 42b within the circuit board 40, another electrode 42a of the circuit board 40, and another bonding wire 95. That is, the bonding wire 95, electrode 42a, wiring within the circuit board 40, another electrode 42a, and another bonding wire 95 constitute wiring that electrically connects electrode 72a and electrode 20b via the circuit board 40. This wiring functions as relay wiring that does not constitute part of the filter circuit. This wiring is an example of a third wiring, electrode 72a is an example of a third electrode, and electrode 20b is an example of a third terminal. Also, electrode 42a and wiring 42b within the circuit board 40 are examples of a third conductor.

[0050] The support member 50A(50) includes a base 51, an electrode 52a, and wiring 52b. The base 51 has a rectangular and plate-like shape, with a substantially constant thickness in the Z direction, and extends both perpendicularly and intersecting the Z direction. The base 51 is made of an insulator, specifically, a ceramic such as aluminum nitride. The base 51 may also be made of the same material as the lower wall 11 of the housing 10.

[0051] Furthermore, the base 51 has a surface 51a that intersects and is perpendicular to the Z direction and faces the Z direction, and the optical component 91 is fixed to this surface 51a via adhesive. In other words, the base 51 supports the optical component 91.

[0052] Figure 3 is a rear view showing part of the internal configuration of the optical module 100. As shown in Figure 3, the support member 50A (50) is supported by the temperature control device 60. The temperature control device 60 is fixed to the lower wall 11. The temperature control device 60 is, for example, a known TEC (thermoelectric cooler) having a Peltier element. The temperature control device 60 may also be referred to as a cooling mechanism.

[0053] The circuit board 40 is fixed to the lower wall 11 in a position away from the temperature control device 60. The circuit board 40 has a plate-like shape and extends both perpendicularly and intersecting the Z direction. The circuit board 40 has a surface 40a facing the opposite direction of the Z direction and a surface 40b facing the Z direction on the opposite side of surface 40a. Surfaces 40a and 40b extend both perpendicularly and intersecting the Z direction. Surface 40a is in contact with the lower wall 11. The circuit board 40 and the lower wall 11 are thermally connected. Heat generated in the circuit board assembly, including the circuit board 40, is conducted through the lower wall 11 and discharged to the outside of the housing 10.

[0054] Furthermore, as shown in Figure 2, the temperature control device 60 supports the chip-on submount 30, the wavelength rocker 71, and the photodiode array 72 in a position separate from the support member 50. The chip-on submount 30, the wavelength rocker 71, the photodiode array 72, and the support member 50 are fixed to the lower wall 11 of the housing 10 via the temperature control device 60, without going through the circuit board 40.

[0055] Here, if the optical component 91 is supported by the circuit board 40 instead of the support member 50, and the chip-on submount 30 is supported by the temperature control device 60, then when the temperature around the optical component 91 rises in response to the operation of the laser element 31 and the circuit board 40, the relative position and orientation of the optical component 91 with respect to the chip-on submount 30 may change due to the difference between the thermal expansion coefficient of the circuit board 40 and the thermal expansion coefficient of the temperature control device 60 or the chip-on submount 30. In this case, the optical path of the laser beam L passing through the optical component 91 may change, and the coupling efficiency of the laser beam L to the coherent mixer 81 may decrease. In this embodiment, however, since the optical component 91 is supported by a support member 50 separate from the circuit board 40, by appropriately setting the material of the base 51 of the support member 50, it is possible to suppress or avoid such changes in the optical path of the laser beam L and, consequently, a decrease in the coupling efficiency of the laser beam L.

[0056] Furthermore, as shown in Figure 3, the support member 50 is cantilevered by the temperature control device 60 alone. If the support member 50 were supported at multiple points by the temperature control device 60 and other members, heat conduction between the support member 50 and the other members would increase the temperature difference between the support position by the temperature control device 60 and the support position by the other members. This could cause a greater change in the relative position and orientation of the optical component 91 with respect to the chip-on submount 30, especially for components further away from the temperature control device 60. In this case, the optical path of the laser beam L passing through the optical component 91 would change, potentially reducing the coupling efficiency of the laser beam L to the coherent mixer 81. In this embodiment, however, since the support member 50 is cantilevered by the temperature control device 60 alone, it is possible to suppress large temperature differences in the support member 50, thereby suppressing or avoiding changes in the optical path of the laser beam L caused by these temperature differences, and consequently, a decrease in the coupling efficiency of the laser beam L.

[0057] Furthermore, as shown in Figure 3, the support member 50 and the circuit board 40 are separated in the Z direction, and as shown in Figure 2, the support member 50 and the circuit board 40 overlap at least partially in the Z direction in region Ao. With this configuration, it is possible to suppress the increase in size of the optical module 100 in the direction intersecting the Z direction compared to a configuration in which the support member 50 and the circuit board 40 do not overlap in the Z direction.

[0058] Furthermore, as shown in Figure 2, in this embodiment, the electrode 30a of the chip-on-submount 30 is electrically connected to the electrode 20b of the through member 20 which constitutes part of the side wall of the housing 10, via a bonding wire 95, the electrode 52a of the support member 50, the wiring 52b, another electrode 52a of the support member 50, and another bonding wire 95. In other words, the bonding wire 95, electrode 52a, the wiring 52b, another electrode 52a, and another bonding wire 95 constitute wiring that electrically connects electrode 30b and electrode 20b without going through the circuit board 40. In this embodiment, if the circuit board assembly is a filter circuit that removes noise from the power supplied to the chip-on-submount 30 and the electrical signals input to the chip-on-submount 30, then wiring for electrical signals output from the chip-on-submount 30 that do not need to pass through the filter circuit, such as a detection signal from a temperature sensor provided on the chip-on-submount 30, does not need to be provided on the circuit board 40. Here, if the wiring that does not pass through the circuit board 40 were to be constructed separately from the support member 50, for example by bonding wire, problems such as an increase in the number of components, or an increase in manufacturing effort and cost due to the need for configurations and manufacturing procedures to avoid interference with the laser beam L, could arise. In this respect, according to this embodiment, since a portion of the wiring that does not pass through the circuit board 40 is provided on the support member 50, the above-mentioned inconveniences can be avoided. The wiring is an example of first wiring, electrode 30a is an example of first electrode, and electrode 20b is an example of first terminal. Also, electrode 52a and wiring 52b are examples of first conductors.

[0059] Furthermore, as shown in Figure 2, the optical path output from the laser element 31 and passing through multiple optical components 91 to the coherent mixer 81 passes over the circuit board 40, that is, at a position away from the circuit board 40 in the Z direction. In this embodiment, as shown in Figure 3, the optical module 100 is configured such that the laser beam L passes at a position away from the circuit board assembly in the Z direction, that is, at a position away from the Z-direction end 43a of the electrical component 43 mounted on the surface 40b of the circuit board 40, so that the laser beam L and the electrical component 43 do not interfere with each other. Specifically, the end Le in the opposite direction to the Z direction of the laser beam L's passage region should be away in the Z direction from the Z-direction end 43a of the electrical component 43, which is the Z-direction end of the circuit board assembly. Note that the cross section (passage region) perpendicular to the optical axis of the laser beam L along the X direction is, for example, 1 / e of the peak intensity near the optical axis. 2 This can be defined as the region of intensity above. In this case, the end Le is away from the optical axis of the laser beam L in the opposite direction in the Z direction, and its intensity is 1 / e of the peak intensity near the optical axis. 2 This is the position.

[0060] Furthermore, a light-absorbing agent may be applied to the surface of the circuit board assembly and the support member 50 as appropriate.

[0061] As described above, according to this embodiment, since the support member 50 and the circuit board 40 overlap at least partially in the Z direction in region Ao, an improved novel optical module 100 can be obtained that can be configured in a smaller size.

[0062] [Second Embodiment] Figure 4 is a rear view showing part of the internal configuration of the optical module 100B(100) of the second embodiment. As shown in Figure 4, in this embodiment, the electrical components 43B are arranged so as to avoid the passage region of the laser beam L traveling in the X direction in the Y direction or the opposite direction of the Y direction. In this case, the height of the electrical components 43B in the Z direction can be increased, in other words, taller electrical components 43B can be mounted on the circuit board 40.

[0063] In this embodiment as well, the support member 50 is separated from the circuit board 40 in the Z direction, and the circuit board 40 and the support member 50 partially overlap in the Z direction. Therefore, the same effects as in the first embodiment can be obtained with this embodiment as well.

[0064] [Third Embodiment] Figure 5 is a plan view showing part of the internal configuration of the optical module 100C(100) of the third embodiment. As shown in Figure 5, in this embodiment, the support member 50C(50) is provided to avoid the electrical components 43 mounted on the circuit board 40. Specifically, the support member 50C has a plate-like shape extending in the Y direction and straddles the circuit board 40 in that Y direction. In addition, in this embodiment, both ends of the support member 50C in the Y direction are supported by a member 61 other than the temperature control device 60, which is fixed to, for example, the lower wall 11 of the housing 10. Note that the shape, width, length, position, size, and other specifications of the support member 50C are not limited to the example in Figure 5.

[0065] In this embodiment as well, the support member 50C is separated from the circuit board 40 in the Z direction, and the circuit board 40 and the support member 50C partially overlap in the Z direction. Therefore, the same effects as in the first embodiment can be obtained with this embodiment as well.

[0066] Furthermore, in this embodiment, some of the optical components 91 are fixed to the surface 40b of the circuit board 40 via adhesive. In areas of the circuit board 40 where temperature changes are relatively small, the optical components 91 may be fixed as in this embodiment. That is, the optical module 100 may include optical components 91 supported by a support member 50 and optical components 91 supported by the circuit board 40.

[0067] [Fourth Embodiment] Figure 6 is a plan view showing part of the internal configuration of the optical module 100D(100) of the fourth embodiment. As shown in Figure 6, in this embodiment, the support member 50D(50) has a bent shape that avoids the electrical components 43 mounted on the circuit board 40 when viewed in the opposite direction to the Z direction. Specifically, the support member 50D has a plate-like shape that extends in an L-shape intersecting the Z direction. In this embodiment as well, both ends of the support member 50D in the Y direction are supported by member 61. Note that the shape, width, length, position, size, and other specifications of the support member 50D are not limited to the example in Figure 6.

[0068] In this embodiment as well, the support member 50D is separated from the circuit board 40 in the Z direction, and the circuit board 40 and the support member 50D partially overlap in the Z direction. Therefore, the same effects as in the first embodiment can be obtained with this embodiment as well.

[0069] [Fifth Embodiment] Figure 7 is a plan view showing part of the internal configuration of the optical module 100E(100) of the fifth embodiment. As shown in Figure 7, in this embodiment, the support member 50E(50) has a rectangular and plate-like shape. The support member 50E is also provided with a rectangular opening 50a that avoids the electrical components 43 mounted on the circuit board 40 when viewed in the opposite direction to the Z direction. The electrical components 43 are provided on the circuit board 40 at positions inside the opening 50a and outside the support member 50E. In this embodiment as well, both ends of the support member 50E in the Y direction are supported by members 61. However, in this embodiment, the four corners of the support member 50E are supported by members 61. Note that the shape, width, length, position, and other specifications of the support member 50E are not limited to the example in Figure 7.

[0070] In this embodiment as well, the support member 50E is separated from the circuit board 40 in the Z direction, and the circuit board 40 and the support member 50E partially overlap in the Z direction. Therefore, the same effects as in the first embodiment can be obtained with this embodiment as well.

[0071] [Sixth Embodiment] Figure 8 is a rear view of the optical module 100F(100) of the sixth embodiment. In this embodiment, the circuit board 40F(40) is a flexible printed circuit board and is housed in a bent state within the housing 10, as shown in Figure 8. As a result, multiple electrical components 43 can be arranged more efficiently within the housing chamber R, and the optical module 100F can be made more compact.

[0072] Furthermore, in this embodiment, the support member 50F(50) is supported on the side wall 12 of the housing 10, while being separated from the circuit board 40F.

[0073] Furthermore, in this embodiment, among the multiple electrical components 43, the electrical component 43 that generates more heat may be placed closer to the lower wall 11. That is, the circuit board assembly may include, as multiple electrical components 43, a first component which is an electrical component 43 located at a position away from the lower wall 11, and a second component which is an electrical component 43 located closer to the lower wall 11 than the first component and which generates more heat than the first component.

[0074] In this embodiment as well, the support member 50F is separated from the circuit board 40F in the Z direction, and the circuit board 40F and the support member 50F partially overlap in the Z direction. Therefore, the same effects as in the first embodiment can be obtained with this embodiment as well.

[0075] Although embodiments of the present invention have been illustrated above, these embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, each configuration, shape, and other specifications (structure, type, orientation, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be modified as appropriate.

[0076] For example, the circuit board assembly is not limited to filter circuits, but may also include termination circuits, control circuits such as MCUs and DACs, driver circuits, etc.

[0077] For example, the light passing through the optical component supported by the support member is not limited to the light output from the first optical component, but may also be the light input to the first optical component. [Explanation of symbols]

[0078] 10…Cabinet 11... Lower wall 12…Side wall 13… Upper wall 14…Port 20… Through member 20a...side 20b...Electrode (first terminal, second terminal, third terminal) 21...Body 22... pin 30…Chip-on-submount (first optical component, active optical component) 30a...Electrode (first electrode, first wiring) 30b...Electrode (second electrode, second wiring) 31… Laser element 32…Submount 40, 40F… Circuit board (circuit board assembly) 40a...side 40b...side 41…Insulator 42a... Electrodes (second conductor, second wiring, third conductor, third wiring) 42b...Wiring (third conductor, third wiring) 43, 43B… Electrical components (circuit board assemblies) 43a...end 50, 50A~50F...Support members 50a…Aperture 51... Bass 51a...side 52a... Electrode (first conductor, first wiring) 52b...Wiring (first conductor, first wiring) 60…Temperature control device 61... Components 71... Wavelength Rocker 72…Photodiode array (second optical component, active optical component) 72a...electrode (third electrode) 81... Coherent Mixer 82…Transimpedance amplifier 91…Optical components 95...Bonding wire 100, 100A~100F… Optical Module Ao…area L... Laser light (light) Le...end R... Containment room X…direction (second direction) Y…direction (third direction) Z…direction (first direction)

Claims

1. The casing and An active optical component housed within the aforementioned housing, which either outputs light or is electrically operated when light is input, A circuit board assembly is housed within the aforementioned housing and fixed to the housing, and comprises an electrical component and a circuit board fixed to the housing, intersecting in a first direction, on which the electrical component is mounted. A support member that is housed within the housing and fixed to the housing without the circuit board, intersects the first direction, moves away from the circuit board in the first direction, and at least partially overlaps with the circuit board in the first direction, and supports the optical component, Equipped with an optical module.

2. The active optical component includes a first optical component that is not mounted on the circuit board. The optical module according to claim 1, wherein the support member has a first conductor that constitutes part of a first wiring that electrically connects the first electrode of the first optical component and the first terminal provided on the housing without going through the circuit board.

3. The optical module according to claim 2, wherein the circuit board has a second conductor that constitutes part of a second wiring that electrically connects the second electrode of the first optical component and the second terminal provided on the housing.

4. The optical module according to claim 3, wherein an electrical signal is input to the first optical component or power is supplied to the first optical component via the second wiring.

5. The optical module according to claim 4, wherein an electrical signal is output from the first optical component via the first wiring.

6. The optical module according to claim 4 or 5, wherein a filter circuit is formed by the second conductor and the electrical component in the circuit board assembly.

7. The first optical component includes a light-emitting element, The optical module according to claim 6, wherein the circuit board assembly includes a filter circuit for power supplied to the light-emitting element as the filter circuit.

8. The first optical component includes a semiconductor optical amplifier, The optical module according to claim 6, wherein the circuit board assembly includes a filter circuit for the power supplied to the semiconductor optical amplifier as the filter circuit.

9. The second terminal is provided on the side wall of the housing, The optical module according to claim 6, wherein the circuit board is provided between the first optical component and the side wall.

10. The active optical component includes a second optical component that is not mounted on the circuit board. The optical module according to claim 2 or 3, wherein the circuit board has a third conductor that constitutes part of a third wiring that electrically connects the third electrode of the second optical component and the third terminal provided on the housing.

11. The optical module according to claim 1, wherein light passing through the optical component supported by the support member passes at a position away from the circuit board assembly in the first direction.

12. The optical module according to claim 11, wherein the electrical component is arranged on the circuit board such that it avoids light that passes through a position away from the circuit board in the first direction and travels in a second direction that intersects the first direction, in a third direction that intersects the first and second directions, or in the opposite direction to the third direction.

13. The active optical component includes a first optical component that is not mounted on the circuit board. The optical module according to claim 11 or 12, wherein the light passing through the optical component supported by the support member is either light output from the first optical component or light input to the first optical component.

14. The housing is equipped with a temperature control device, The optical module according to claim 1, wherein the support member is supported by the temperature control device.

15. The optical module according to claim 14, wherein the support member is supported solely by the temperature control device.

16. The active optical component includes a first optical component that is not mounted on the circuit board. The optical module according to claim 14 or 15, wherein the temperature control device supports the support member and the first optical component.

17. The optical module according to claim 1, wherein the support member is provided to avoid the electrical components.

18. The optical module according to claim 17, wherein the support member has a shape that is bent to avoid the electrical components when viewed in the opposite direction to the first direction.

19. The optical module according to claim 17, wherein the support member has an opening that avoids the electrical components when viewed in the direction opposite to the first direction.

20. The optical module according to claim 1, wherein a light-absorbing material is coated on the circuit board assembly or support member.

21. The optical module according to claim 1, comprising an optical component provided on the circuit board.

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