Wafer generation method

JP7863467B2Active Publication Date: 2026-05-21DISCO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DISCO CORP
Filing Date
2022-07-11
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing methods for producing semiconductor wafers on which a cylindrical ingot is thinly cut with a wire saw and the front and back surfaces are polished. However, the method is uneconomical because most of the ingot is discarded, and thorns-like peeling chips remain as contaminants, leading to processing defects and grindstone deterioration.

Method used

A method involving the formation of a delamination layer using a laser beam with a wavelength transparent to the ingot, followed by ultrasonic cleaning to remove peeling debris, and grinding to produce wafers with reduced defects.

Benefits of technology

The method effectively removes peeling debris, reducing processing defects and improving grindstone quality by eliminating thorns-like contaminants, thereby enhancing the processing quality and efficiency of wafer production.

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Patent Text Reader

Abstract

To provide a generation method of a wafer capable of reducing a processing failure by removing a peeling dust generated when peeling the wafer from an ingot.SOLUTION: A generation method of a wafer includes: a peeling layer formation step 1 of forming a peeling layer containing a modified part and a crack by relatively moving an ingot and a focal point in a state where the focal point of a laser beam with a wavelength having penetrability to the ingot is positioned at a depth corresponding to a thickness of the wafer to be generated; a wafer generation step 3 of separating the wafer from the ingot as a boundary surface of the peeling layer; an ultrasonic cleaning step 4 of removing a peeling dust generated on a peeling surface by performing an ultrasonic cleaning of at least one of the peeling surface of the wafer and the peeling surface of the ingot; and a grinding step 5 of grinding the peeling surface where the peeling dust is removed.SELECTED DRAWING: Figure 3
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