Perceptor

Abstract

To provide a sensor capable of improving a thermal responsiveness.SOLUTION: A sensor 1 comprises a substrate 10, a heat sensing element 11, a housing 12, and a heat collecting unit 16. The heat sensing element 11 is mounted on the substrate 10 to sense heat. The housing 12 houses the substrate 10. The housing 12 has a flow path 13 and an opening unit 14. The flow path 13 is provided in an internal space SP1 of the housing 12, through which gas flows. The opening unit 14 communicates the flow path 13 and an external space SP2 of the housing 12 with each other. The heat collecting unit 16 is configured to collect hot air toward the heat sensing element 11.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure generally relates to sensors, and more particularly to sensors that detect fires by heat.

Background Art

[0002] Patent Document 1 discloses a heat and smoke composite sensor. This heat and smoke composite sensor includes heat sensing means for sensing heat and a smoke sensing unit for managing smoke flowing into the dark box. The heat and smoke composite sensor has a circuit board mounted on the upper surface of the main body base, a heat sensing means, and a smoke sensing unit housed inside a housing composed of a main body base and a main body case covering the upper side of the main body base. The heat sensing means is provided in plurality on the side of the dark box.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in a sensor that detects a fire by heat, a sensor with further improved heat responsiveness is required.

[0005] The present disclosure has been made in view of the above problems, and an object thereof is to provide a sensor capable of improving heat responsiveness.

Means for Solving the Problems

[0006] The sensor according to one aspect of the present disclosure includes a substrate, a heat detection element, a housing, and a heat collecting portion. The heat detection element is mounted on the substrate and detects heat. The housing houses the substrate. The housing has , open a mouth portion and a bottom member . before The opening is the The internal space of the enclosure andThe bottom member communicates with the external space of the housing. The bottom member faces the substrate. The heat collecting section is configured to collect hot air toward the heat sensing element. The heat collecting section is provided between the substrate and the bottom member. The heat collecting section has a circumferentially inclined surface that slopes upward toward the substrate side in the circumferential direction of the housing as it approaches the heat sensing element. A sensor according to one aspect of the present disclosure comprises a substrate, a thermal sensing element, a housing, and a heat collecting unit. The thermal sensing element is mounted on the substrate and detects heat. The housing houses the substrate. is, open Having an opening and a bottom member . before The opening is in front The internal space of the enclosure and The bottom member communicates with the external space of the housing. The bottom member faces the substrate. The heat collecting section is configured to collect hot air toward the heat sensing element. The heat collecting section is provided between the substrate and the bottom member. When viewed along the thickness direction of the substrate, the outer edge of the bottom member and the outer edge of the heat collecting section are at the same position. A sensor according to one aspect of the present disclosure comprises a substrate, a heat sensing element, a housing, a heat collecting unit, and a terminal block. The heat sensing element is mounted on the substrate and detects heat. The housing houses the substrate. , open Mouth and , bottom member and Having a conductor . before The opening is in front The internal space of the enclosure and Connecting to the external space of the aforementioned enclosure The bottom member faces the substrate. The induction unit guides the hot air flowing in from the opening to the heat sensing element. The heat collecting unit is , provided between the substrate and the bottom member. The heat collecting section is front Towards a thermal sensing element and the aforementioned heat It is configured to collect heat from air. The terminal block is front It is fixed to the circuit board. The induction portion is formed in the terminal block. The induction portion is tilted toward the heat sensing element from the opening. down the slope To possess. A sensor according to one aspect of the present disclosure comprises a substrate, a thermal sensing element, a housing, and a heat collecting unit. The thermal sensing element is mounted on the substrate and detects heat. The housing houses the substrate. , open It has an opening, an upper member, a bottom member, a crossbar, and a guide section. . before The opening is in front The internal space of the enclosure and The upper member communicates with the external space of the housing. The upper member forms the side surface of the housing. The bottom member is front The enclosure The bottom is formed and faces the substrate. The crossbar connects the upper member and the bottom member. The induction part guides the hot air flowing in from the opening to the heat sensing element. The heat collecting part is , provided between the substrate and the bottom member. The heat collecting section is front Towards a thermal sensing element and the aforementioned heat It is configured to collect heat from air. The induction part is ,before It has a wing shape with an inclination toward the heat sensing element from the opening. A detector relating to one aspect of this disclosure is The device comprises a substrate, a heat sensing element, a housing, and a heat collecting section. The heat sensing element is mounted on the substrate and detects heat. The housing houses the substrate. The housing has an opening, an upper member, a bottom member, a plurality of struts, and a guide section. The opening connects the internal space of the housing to the external space of the housing. The upper member forms the side surface of the housing. The bottom member forms the bottom of the housing and faces the substrate. The plurality of struts connect the upper member and the bottom member. The guide section guides the hot air flowing in from the opening to the heat sensing element. The heat collecting section is provided between the substrate and the bottom member. The heat collecting section is configured to collect the hot air toward the heat sensing element. The induction unit is the plurality The lattice It is positioned between each of the following. The bottom member has a wall surface. The wall surface is the plurality The lattice It has a curve or straight line connecting two adjacent slats. [Effects of the Invention]

[0007] According to this disclosure, it is possible to provide a sensor that can improve thermal responsiveness. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is an external view of the sensor and heating tester according to Embodiment 1. [Figure 2] Figure 2A is a cross-sectional view of the same sensor. Figure 2B is a front view of the main part of Figure 2A as seen from the Y direction. [Figure 3] Figure 3 is an exploded perspective view of the same sensor. [Figure 4] Figure 4 is a perspective view of the same sensor with the lower cover removed. [Figure 5] Figure 5 is a schematic block diagram of the above-mentioned sensor. [Figure 6] Figure 6 is an external view showing the triangular heat collecting section of the sensor described above. [Figure 7]FIG. 7A is a top view of the same sensor and heating tester with the upper cover removed, showing the state with the upper cover removed from the same sensor. FIG. 7B is a cross-sectional view showing the X-X cross-section of FIG. 7A. [Figure 8] FIG. 8 is an external view showing the heat collection part of the sensor according to Modification 4. [Figure 9] FIG. 9 is an external view showing the heat collection part of the sensor according to Modification 5. [Figure 10] FIG. 10 is a diagram for explaining the heat collection part of the sensor according to Modification 6. [Figure 11] FIG. 11 is a diagram for explaining the guiding part of the sensor according to Modification 7. [Figure 12] FIG. 12 is a diagram for explaining the guiding part of the sensor according to Modification 8. [Figure 13] FIG. 13 is a diagram for explaining the guiding part of the sensor according to Modification 9. [Figure 14] FIG. 14 is a diagram for explaining the guiding part of the sensor according to Modification 10. [Figure 15] FIG. 15 is an external view of the sensor according to Embodiment 2. [Figure 16] FIG. 16 is a diagram showing a cross-sectional view of the same sensor. [Figure 17] FIG. 17 is a perspective view of the same sensor with the lower cover removed.

Mode for Carrying Out the Invention

[0009] Each of the embodiments and modifications described below is merely an example of the present disclosure, and the present disclosure is not limited to each embodiment and modification. Even outside of these embodiments and modifications, various changes can be made according to the design and the like as long as it does not depart from the technical idea related to the present disclosure.

[0010] (Embodiment 1) Hereinafter, the sensor 1 according to the present embodiment will be described using FIGS. 1 to 7.

[0011] (1) Overview The detector 1 according to this embodiment is, for example, a fire detector. In this embodiment, for example, it is a combined fire detector having a function to detect heat generated by a fire, etc., and a function to detect smoke generated by a fire, etc. However, the detector 1 is not limited to being a combined fire detector and does not have to have a smoke detection function. As shown in Figure 2, the detector 1 is installed, for example, on a construction surface 100 such as the ceiling or wall surface of a building (the ceiling surface in the illustrated example).

[0012] As shown in Figure 1, the sensor 1 according to this embodiment comprises a substrate 10, a heat detection element 11, a housing 12, and a heat collection unit 16.

[0013] The thermal sensing element 11 is mounted on the substrate 10 to detect heat. In this embodiment, a chip thermistor is used as an example. The thermal sensing element 11 is located on the underside of the substrate 10.

[0014] The housing 12 houses the circuit board 10. The housing 12 has a flow path 13 (see Figure 7) through which gas flows, and an opening 14 that connects the flow path 13 to the external space SP2 (see Figure 2) of the housing 12.

[0015] The heat collecting unit 16 is configured to collect hot air toward the heat sensing element 11. In this embodiment, as an example, the heat collecting unit 16 is formed integrally with the lower cover 120 of the housing 12.

[0016] This configuration offers the following advantages due to the presence of the heat collection unit 16. Specifically, the hot air flowing into the internal space SP1 of the sensor 1 from the opening 14 flows along the channel 13 and reaches the heat detection element 11, causing the sensor 1 to detect heat. In this case, the heat-containing airflow (hereinafter referred to as "hot air") is enveloped by the heat collection unit 16, surrounding the heat detection element 11 mounted on the substrate 10 and its surroundings, making it easier to heat up rapidly. As a result, the heat collection unit 16 improves the speed at which heat is detected. Consequently, the sensor 1 has the advantage of improved thermal responsiveness.

[0017] Incidentally, in tests using a heater-type heating tester 2 (see Figure 1), the heat source is localized compared to a fire, making it susceptible to the influence of the height difference between the heat source H10 of the heating tester 2 and the substrate of the detector. In particular, if the height difference between the heat source of the heating tester 2 and the substrate of the detector does not match, the hot airflow has difficulty entering the detector, resulting in low thermal responsiveness and a time-consuming test using the heating tester 2. In contrast, the detector 1 of this embodiment, by providing a heat collection unit 16, not only is the thermal responsiveness improved when an actual fire occurs, but the thermal responsiveness to the heating tester 2 is also improved, thus offering the advantage of shortening the test time using the heating tester 2.

[0018] (2) Composition (2.1) Overall structure The overall configuration of the detector 1 according to this embodiment will be described in detail below. As mentioned above, the detector 1 is, for example, a combined fire detector that detects heat and smoke.

[0019] In the following, the up and down directions of sensor 1 will be defined and explained using the up and down arrows shown in Figure 1, which illustrates the state in which sensor 1 is installed on the installation surface 100 (ceiling surface). These arrows are included merely to aid in the explanation and do not represent any actual physical direction. Furthermore, this direction is not intended to limit the way in which sensor 1 is used.

[0020] As shown in Figures 1 and 2, the sensor 1 comprises a substrate 10, a heat detection unit 3 having one or more heat detection elements 11, a smoke detection unit 4, a flow path forming member 7, a heat collection unit 16, and a housing 12. Furthermore, as shown in Figure 5, the sensor 1 also comprises a control unit 5 and a display unit 6.

[0021] The detector 1 further includes a disc-shaped mounting base that is fixed to the construction surface 100 by screws or the like. The detector 1 can be installed on the construction surface 100 by detachably attaching a mounting portion provided on the upper side of the housing 12 to the mounting base.

[0022] Furthermore, the detector 1 is equipped with a communication unit 9 (see Figure 5) that, when it detects a fire, transmits a signal to an external alarm or the like to indicate the occurrence of a fire, and also receives signals from the alarm or the like.

[0023] The sensor 1 may be powered by a commercial power supply, or by a battery located inside the housing 12.

[0024] (2.2) Enclosure The housing 12 houses the circuit board 10, the heat detection unit 3, the smoke detection unit 4, the control unit 5, the display unit 6, the communication unit 9, and other circuit modules inside.

[0025] The housing 12 is made of synthetic resin, for example, flame-retardant ABS resin. The housing 12 is formed as a whole in a cylindrical shape that is flattened in the vertical direction. As shown in Figure 3, the housing 12 has a cylindrical lower cover 120 (front cover) with one side (the top in the illustrated example) open, and a roughly disc-shaped upper cover 121 (back cover). The housing 12 is constructed by assembling the upper cover 121 to the lower cover 120 from its open side. The upper cover 121 is positioned to cover the smoke detection unit 4 from above. The lower cover 120 is positioned below the substrate 10.

[0026] The housing 12 has a flow path 13 (see Figure 7) through which gas flows, provided in its internal space SP1, and one or more (12 in this embodiment) openings 14 (lateral holes) that connect the flow path 13 to the external space SP2 of the sensor 1. Here, multiple openings 14 are provided in the lower cover 120. In other words, the lower cover 120 has openings 14 that connect the external space SP2 and the internal space SP1.

[0027] Specifically, the lower cover 120 has a bottom member 18 that forms the bottom of the opening 14 and a cylindrical upper member 24 that forms the side surface of the housing 12. The lower cover 120 also has a plurality of (12 in this embodiment) crossbars 25 that connect the bottom member 18 and the upper member 24. The bottom member 18, the upper member 24, and the six crossbars 25 are formed as a single unit. The twelve crossbars 25 are arranged at approximately equal intervals along the circumferential direction A3 on the outer peripheral edge 21 of the bottom member 18 and protrude from the outer peripheral edge 21 toward the open lower edge of the upper member 24. The twelve crossbars 25 maintain a specified distance between the upper member 24 and the bottom member 18. The six openings 14 are arranged at approximately equal intervals along the circumferential direction (corresponding to the circumferential direction A3 of the sensor 1) on the circumferential wall configured in this way.

[0028] Each opening 14 is a roughly rectangular through-hole that penetrates the peripheral wall of the lower cover 120 in the radial direction, connecting the flow path 13 to the external space SP2.

[0029] The bottom member 18 has a positioning structure on its upper surface for positioning the substrate 10. Here, a cylindrical portion 180 is provided as the positioning structure (see Figure 2A). In other words, the sensor 1 of this embodiment further includes a cylindrical portion 180 that is positioned to cover the lower surface of the substrate 10. The cylindrical portion 180 protrudes cylindrically from the upper surface of the bottom member 18. The upper end surface of the cylindrical portion 180 is in contact with the lower surface of the substrate 10.

[0030] The upper cover 121 has a plurality of connecting pieces 123 (see Figure 3) that protrude downward from its lower surface. The plurality of connecting pieces 123 are each inserted into a plurality of insertion holes 77 (described later) provided in the flow path forming member 7, and further fitted into a plurality of insertion holes 32 provided in the substrate 10. By inserting the plurality of connecting pieces 123 into the plurality of insertion holes 77 of the flow path forming member 7, they are electrically connected to the terminals of the terminal block 22 which is located adjacent to the insertion holes 77. The terminals of the terminal block 22 are electrically connected to the circuit module provided on the substrate 10. The upper cover 121 is mechanically connected to the contact portion of the mounting base fixed to the installation surface 100, thereby enabling the plurality of connecting pieces 123 to be electrically connected to the contact portion. As a result, the circuit module provided on the substrate 10 is electrically connected to the electric wires (power supply lines and signal lines) on the ceiling side via the terminal block 22, connecting pieces 123, and the contact portion.

[0031] Furthermore, the upper cover 121 has a recessed area 122 (see Figure 3) on one side (the bottom surface) facing the substrate 10 for accommodating the upper part of the smoke detection unit 4 mounted on the substrate 10. The recessed area 122 is formed by the entire central part of the upper cover 121 protruding upward. The smoke detection unit 4 is stably positioned by the recessed area 122.

[0032] Here, the sensor 1 further includes an airflow control wall 8, as shown in Figure 3. In this example, the airflow control wall 8 is formed as part of the upper cover 121. The three airflow control walls 8 are provided on one side (bottom surface) of the upper cover 121 facing the substrate 10, outside the receiving recess 122. In this embodiment, the three airflow control walls 8 are arranged around the smoke detection unit 4 to reduce variations in smoke inflow into the smoke detection unit 4 in the circumferential direction A3 of the smoke detection unit 4.

[0033] (2.3) Substrate The substrate 10 is configured such that the smoke detection unit 4 is mounted on top of it. Here, as an example, the substrate 10 is a circuit board. The substrate 10 is, for example, a single printed circuit board with conductive pattern wiring. As shown in Figures 3 and 4, the substrate 10 has a pair of engagement holes that penetrate in the thickness direction. The smoke detection unit 4 is attached to the upper surface of the substrate 10. Also, as will be described later, the flow path forming member 7 is held by the substrate 10.

[0034] In addition to the smoke detection unit 4, the circuit board 10 is equipped with a heat detection unit 3, a control unit 5, a display unit 6, a communication unit 9, and other circuit modules. The other circuit modules include a lighting circuit that illuminates the light source of the display unit 6 and the optical element 401 (see Figure 5) of the smoke detection unit 4, as well as a power supply circuit that generates operating power for various circuits using power supplied from a commercial power source or the like.

[0035] As shown in Figures 3 and 4, the substrate 10 is formed in a substantially circular shape overall. In this embodiment, the heat sensing unit 3 has one or more (six in this embodiment) heat sensing elements 11, and the six heat sensing elements 11 are arranged on the outer periphery 101 of the substrate 10. The six heat sensing elements 11 are surface-mounted on the lower surface 103 of the substrate 10. Here, as an example, the smoke detection unit 4 is arranged on the upper surface 102 of the substrate 10.

[0036] The control unit 5 and the multiple electronic components constituting the circuit module are mounted on the upper surface 102 or lower surface 103 of the substrate 10. The control unit 5 and the multiple electronic components constituting the circuit module do not have to be mounted only on the substrate 10; for example, another mounting substrate may be placed around the substrate 10, and some or all of them may be mounted on that mounting substrate.

[0037] The structure of the substrate 10 will now be described in detail. As shown in Figure 3, the substrate 10 has a circular main body portion 104 and a plurality of (six in this embodiment) extending portions at the edge of the main body portion 104 in a direction away from the center of the main body portion 104. The smoke detection unit 4 is located in the center of the upper surface of the main body portion 104.

[0038] The six protruding portions consist of six tongue portions 31. Each tongue portion 31 is the portion on which the corresponding thermal sensing element 11 is mounted. Each tongue portion 31 has an upper surface and a lower surface that are flush with and continuous with the upper and lower surfaces of the main body portion 104, respectively. When viewed in the vertical direction, each tongue portion 31 protrudes from the main body portion 104 in an elongated strip shape, and its tip is formed in a semicircular shape. The six tongue portions 31 are arranged at equal intervals along the circumferential direction A3 of the main body portion 104 so as to divide the outer peripheral portion 101 of the substrate 10 into approximately six equal parts. Each thermal sensing element 11 is mounted near the tip on the lower surface of the corresponding tongue portion 31. Each tongue portion 31 has a through hole 310 with a rectangular opening in the region inside the thermal sensing element 11. By providing the through hole 310 next to each thermal sensing element 11, the area occupied by the substrate 10 around the thermal sensing element 11 can be reduced. As a result, the possibility of heat from the thermal sensing element 11 being transferred through the substrate 10 and becoming less intense, or of heat generated by other circuit components mounted on the main body 104 affecting the thermal sensing element 11, can be reduced. In other words, the through-hole 310 improves thermal insulation. It is desirable that the opening area of ​​the through-hole 310 be larger than the surface area of ​​the thermal sensing element 11 (for example, the surface area of ​​the substrate 10 as viewed from above).

[0039] (2.4) Heat detection unit and smoke detection unit As described above, the thermal sensing unit 3 has six thermal sensing elements 11 mounted on the lower surface 103 of the substrate 10 (only one is shown in Figure 5). The number of thermal sensing elements 11 is not particularly limited and may be one, but it is preferable to have at least two or more. The thermal sensing elements 11 detect the heat of the gas flowing in through the opening 14 and are surface-mounted on the substrate 10. In this embodiment, the thermal sensing elements 11 are, for example, chip thermistors. Each thermal sensing element 11 is arranged to face a different opening 14.

[0040] The thermal sensing unit 3 is electrically connected to the control unit 5 via pattern wiring formed on the substrate 10. Each thermal sensing element 11 outputs an electrical signal (detection signal) to the control unit 5. In other words, the control unit 5 monitors the resistance value of each thermal sensing element 11, which may change depending on the temperature rise, through the electrical signals output from each thermal sensing element 11.

[0041] The thermal detection unit 3 may further include, in addition to the thermal detection element 11, an amplification circuit for amplifying the electrical signal from the thermal detection element 11, and a conversion circuit for analog-to-digital conversion, or the amplification and conversion may be performed on the circuit module side.

[0042] The smoke detection unit 4 is located in the center of the internal space of the housing 12 and is configured to detect smoke. Specifically, the smoke detection unit 4 is located on the upper surface of the main body 104 of the circuit board 10, and its upper part is housed in the recess 122 of the upper cover 121. The smoke detection unit 4 is, for example, a photoelectric sensor that detects smoke, and more particularly, a scattered light sensor.

[0043] As shown in Figure 5, the smoke detection unit 4 includes an optical element 401 that emits light, a light-receiving element 402 that receives light emitted from the optical element 401, and a labyrinth unit 403. The optical element 401 is, for example, an LED (Light Emitting Diode). The light-receiving element 402 is, for example, a photodiode. The labyrinth unit 403 is formed inside a housing that has a flattened, substantially cylindrical outer shell.

[0044] The optical element 401 and the light-receiving element 402 are arranged within the labyrinth section 403 so as not to face each other. In other words, the light-receiving surface of the light-receiving element 402 is positioned so as to be off-axis from the optical axis of the light emitted by the optical element 401.

[0045] In the event of a fire or other incident, fire smoke can enter the housing 12 through the opening 14 and then be introduced into the labyrinth section 403 through the inlet 40. If there is no smoke in the labyrinth section 403, the light emitted from the optical element 401 hardly reaches the light-receiving surface of the light-receiving element 402. On the other hand, if there is smoke in the labyrinth section 403, the light emitted from the optical element 401 is scattered by the smoke, and some of the scattered light reaches the light-receiving surface of the light-receiving element 402. In other words, the smoke detection unit 4 receives the light emitted from the optical element 401 that has been scattered by the smoke using the light-receiving element 402.

[0046] The light-receiving element 402 of the smoke detection unit 4 is electrically connected to the control unit 5. The smoke detection unit 4 transmits an electrical signal (detection signal) to the control unit 5 that indicates a voltage level corresponding to the amount of light received by the light-receiving element 402. The control unit 5 converts the amount of light in the detection signal received from the smoke detection unit 4 into smoke concentration and makes a fire determination. The control unit 5 may use the amount of light directly for threshold determination. Alternatively, the smoke detection unit 4 may convert the amount of light received by the light-receiving element 402 into smoke concentration and then transmit a detection signal to the control unit 5 that indicates a voltage level corresponding to the smoke concentration.

[0047] The smoke detection unit 4 may further include an amplification circuit for amplifying the electrical signal from the light-receiving element 402, and a conversion circuit for analog-to-digital conversion, or the amplification and conversion may be performed on the circuit module side. Also, the number of optical elements 401 for smoke detection is not limited to one, but may be multiple.

[0048] (2.5) Display section The display unit 6 is an indicator light that notifies the outside of the operating status of the detector 1. Under normal conditions (when monitoring for fire), the lighting circuit of the circuit module turns off the light source under the control of the control unit 5. When it is determined that a fire has occurred, the lighting circuit of the circuit module starts flashing or lighting the light source under the control of the control unit 5. In Figure 5, the diagram of the lighting circuit between the control unit 5 and the display unit 6 is omitted.

[0049] (2.6) Control Unit The control unit 5 can be implemented, for example, by a computer system including one or more processors (microprocessors) and one or more memories. In other words, the control unit 5 functions by one or more processors executing one or more programs (applications) stored in one or more memories. In this case, the programs are pre-recorded in the memory of the control unit 5, but they may also be provided via telecommunication lines such as the Internet, or recorded on non-temporary recording media such as memory cards.

[0050] The control unit 5 is configured to control the communication unit 9 and the circuit modules (lighting circuit, power supply circuit, etc.).

[0051] Furthermore, the control unit 5 is configured to receive detection signals from the heat detection unit 3 and the smoke detection unit 4 and determine whether or not a fire has occurred. Specifically, the control unit 5 individually monitors the detection signals from the six heat detection elements 11 of the heat detection unit 3, and if it finds even one heat detection element 11 whose signal level (corresponding to resistance value) included in the detection signal exceeds (or falls below) a threshold, it determines that a fire has occurred. The control unit 5 also monitors the detection signal from the smoke detection unit 4, and if smoke reaches the smoke detection unit 4 and the signal level included in the detection signal exceeds (or falls below) a threshold, it determines that a fire has occurred.

[0052] When the control unit 5 determines that a fire has occurred based on heat detection or smoke detection, it transmits a signal to the receiver and fire alarm of the automatic fire alarm system via the communication unit 9 to indicate the occurrence of a fire. The communication unit 9 is a communication interface for communicating with the receiver and fire alarm, for example, via a wired connection. The communication unit 9 is connected to the receiver and fire alarm, for communication purposes via a connecting piece on the mounting part, a connector on the mounting base, and signal wires routed in the ceiling. Furthermore, when the control unit 5 determines that a fire has occurred, it outputs a control signal to the lighting circuit of the circuit module to cause the light source of the indicator unit (indicator light) to blink or light up.

[0053] (2.7) Flow channel forming member The flow path forming member 7 in this embodiment is made of synthetic resin, for example, flame-retardant ABS resin. The flow path forming member 7 has a flat, substantially cylindrical outer shell with an open top surface. Specifically, as shown in Figure 3, the flow path forming member 7 has a ring-shaped main body portion 70 and one or more (four in this example) terminal blocks 22. The main body portion 70 has an inner wall 71 and an outer wall 76 that covers the periphery of the inner wall 71. The outer wall 76 is provided with a plurality of (four in this example) extension portions 73 that extend outward. Each extension portion 73 has a claw portion 74 that protrudes downward at its tip. The outer wall 76 has an inclined surface 72 as its outer circumferential surface. The inclined surface 72 is a surface that is inclined in a direction that approaches the center of the outer wall 76 as it goes upward. Here, a part of each extension portion 73 is configured to function as a terminal block 22. The flow path forming member 7 has a hole 75 that penetrates vertically in its central portion. The flow path forming member 7 is fixed to the substrate 10 by each claw portion 74 catching on the corresponding projection 33 of the substrate 10. The outer wall 76 also has the aforementioned multiple insertion holes 77, through which the connecting piece 123 of the upper cover 121 is inserted.

[0054] Each terminal block 22 has terminals for electrically connecting to the circuit board 10 and also serves as a structure for screwing the circuit board 10 in place. The terminals are electrically connected to conductive patterns on the circuit board 10. The sensor 1 receives power from commercial power sources, for example from the installation surface 100 (ceiling surface in this embodiment), and receives and transmits various communication signals via terminals, connecting pieces 123, and mounting bases, etc.

[0055] The smoke detection unit 4 is installed on the substrate 10. The inner wall 71 is configured to cover the area around the smoke detection unit 4, leaving a gap between it and the inner wall 71.

[0056] The inclined surface 72 is sloped such that its height increases upward in the vertical direction A1 as it moves toward the smoke detection unit 4, in one direction from the opening 14 toward the smoke detection unit 4. The inclined surface 72 forms the outer circumferential surface of the outer wall 76, and the height of the inclined surface 72 corresponds to the height of the outer wall 76. Therefore, a flow path 13 is formed so that the gas flowing into the internal space SP1 of the smoke detection unit 4 from the opening 14 moves toward the upward of the smoke detection unit 4 along the inclined surface 72. Specifically, the internal space SP1 is surrounded by the upper cover 121, the flow path forming member 7, and the smoke detection unit 4.

[0057] (2.8) Heat collecting section The heat collecting unit 16 is configured to collect hot airflow toward the heat sensing element 11. The number of heat collecting units 16 is the same as the number of heat sensing elements 11 (chip thermistors in this embodiment) (six in this embodiment). In other words, the sensor 1 has six heat collecting units 16. In this embodiment, each heat collecting unit 16 is located on the bottom member 18 of the lower cover 120 and is formed integrally with the bottom member 18. Specifically, the six heat collecting units 16 are arranged on the outside by a cylindrical portion 180 (see Figure 2A). Each heat collecting unit 16 is made of, for example, flame-retardant ABS resin.

[0058] In this embodiment, each heat collecting unit 16 is positioned below each heat sensing element 11. As shown in Figure 7A, the heat sensing elements 11 and the heat collecting units 16 are positioned so as to overlap each other when viewed along the thickness direction of the substrate 10. Each heat collecting unit 16 is formed to protrude upward in the vertical direction A1 from the bottom member 18. Each heat collecting unit 16 is provided between the substrate 10 and the bottom member 18 facing the substrate 10. Figure 2A shows a cross-sectional view of a line passing through the center of the sensor 1 shown in Figure 1 and through the diagonally opposite heat sensing elements 11. Figure 2B also shows a front view of the sensor 1 shown in Figure 2A, as seen from the Y direction. In Figure 2B, the heat sensing elements 11 are positioned so as to be horizontally opposite the slat 25 that guards against fingers touching the heat sensing elements 11. Furthermore, the heat collecting unit 16 is provided below the heat sensing elements 11.

[0059] Each heat collecting unit 16 has a circumferentially inclined surface 19 in the circumferential direction A3 of the housing 12, as shown in Figures 1, 2A, 2B, and 6, which is inclined to become higher vertically in the direction A1 as it approaches the heat sensing element 11. Furthermore, since the heat collecting units 16 and the heat sensing elements 11 overlap each other when viewed from the thickness direction of the substrate 10, in this embodiment, the number of heat collecting units 16 is the same as the number of heat sensing elements 11 (six in this embodiment). In this embodiment, as shown in Figure 7A, the projection of the heat collecting unit 16 onto the substrate 10 in the vertical direction A1 when viewed from the thickness direction of the substrate 10 is approximately trapezoidal. Also, as shown in Figures 2B and 6, in this embodiment, each heat collecting unit 16 is approximately triangular in shape when viewed from the external space SP2 to the opening 14. Therefore, for example, when hot air flows into the heat collecting section 16 from both sides in the circumferential direction A3, the hot air rises along the two circumferential inclined surfaces 19 of the heat collecting section 16, making it easier to reach the heat sensing element 11. Thus, compared to a situation without the heat collecting section 16, the presence of the heat collecting section 16 allows heat to be collected by the heat sensing element 11. Therefore, in the event of a fire, heat can be collected, improving thermal responsiveness, and also in the case of testing using the heating tester 2, for example, heat can be collected, improving thermal responsiveness.

[0060] (3) Operation Here, we will explain the operation of the sensor 1 of this embodiment regarding the detection of hot air during a heating test using the heating tester 2.

[0061] Figure 7A shows the heating tester 2 mounted so as to cover the sensor 1. The heating tester 2 is mounted on the sensor 1 so that the heat source H10 of the heating tester 2 is positioned exactly between the heat detection elements 11. Here, as an example, we assume that the heat source H10 is installed at a position offset by approximately 30° from the heat detection elements 11. In other words, here we explain the case where the heat source H10 and the heat detection elements 11 are mounted in the worst possible positional relationship, that is, in a position where it is difficult to detect heat, but of course, they may be mounted in positions other than this.

[0062] When the heat source H10 is installed at a position offset by approximately 30° from the heat sensing element 11, the hot air H30 from the heat source H10 separates into hot air H30L that flows to the left when viewed from the rail 25 and hot air H30R that flows to the right when viewed from the rail, upon contact with the rail 25 and the substrate 10, etc.

[0063] When the hot air H30R and hot air H30L reach the rib 25, the hot air H30R and H30L flow towards the nearby heat sensing element 11. When they reach the periphery of the tongue portion 31 region, the hot air H30R and H30L rise up the circumferential inclined surface 19, which is the slope of the heat collecting portion 16, due to the heat hitting the heat collecting portion 16. If there is no heat collecting portion 16, the hot air will pass over or under the substrate 10, making it difficult to collect the hot air, and it may take time for the hot air to be collected. On the other hand, in the sensor 1 of this embodiment, the presence of the heat collecting portion 16 allows the hot air to be captured (collected). Figure 7B shows the distribution of the hot air. Figure 7B is a cross-sectional view XX near the heat sensing element 11 in Figure 7A. A heat sensing element 11 is located at the tip of the tongue portion 31, and the heat collecting portion 16 surrounds the tongue portion 31 containing the heat sensing element 11 with hot air H20. As a result, the rate of heat collection is improved, and a sensor 1 can be provided that can improve thermal responsiveness. Furthermore, even when the heat source H10 is localized, such as in a heating tester 2, a sensor 1 can be provided that can improve thermal responsiveness.

[0064] (4) Advantages As described above, the sensor 1 of this embodiment comprises a substrate 10, a heat sensing element 11 mounted on the substrate 10 for detecting heat, a housing 12 housing the substrate 10, and a heat collecting unit 16. The housing 12 has a flow path 13 and an opening 14. The flow path 13 is provided in the internal space SP1 of the housing 12 through which gas flows. The opening 14 connects the flow path 13 to the external space SP2 of the housing 12. The heat sensing element 11 is positioned so that it fits within the opening 14 when viewed from the external space SP2. The heat collecting unit 16 is configured to collect hot air toward the heat sensing element 11.

[0065] This configuration offers the advantage of improved thermal responsiveness for sensor 1. In particular, even in heating tester 2 where the heat source H10 is localized, the improved thermal responsiveness allows for a reduction in the heating test time.

[0066] (5) Variant The above embodiments are merely one of many embodiments of this disclosure. The above embodiments can be modified in various ways depending on the design, etc., as long as they achieve the objectives of this disclosure.

[0067] The following lists modifications of the above embodiment. The modifications described below can be combined and applied as appropriate. Hereafter, the above embodiment may also be referred to as the "basic example".

[0068] (5.1) Variation 1 In the basic example, the sensor 1 includes an airflow control wall 8. However, the airflow control wall 8 is not an essential component of the sensor 1 of this disclosure and may be omitted as appropriate.

[0069] (5.2) Variation 2 In the basic example, the number of airflow control walls 8 is three, but this is not limited to one, two, or four or more.

[0070] (5.3) Modification 3 In the basic example, the circuit board 10 on which the smoke detection unit 4 is mounted is a circuit board on which the control unit 5 and other components are also mounted. However, the circuit board 10 may be provided separately from the circuit board on which the control unit 5 and other components are mounted. However, the basic example allows for a reduction in the number of components.

[0071] (5.4) Modification 4 In the basic example, the heat collecting section 16 is configured to be triangular in a front view, but it is not limited to this configuration. As shown in Figure 8, it may also be trapezoidal in a front view. The trapezoidal heat collecting section 16A has two circumferentially inclined surfaces 19A, and the top surface 19B of the trapezoid is flat. With this shape, the hot airflow arriving from around the heat collecting section 16A rises up the circumferentially inclined surfaces 19A and reaches the heat sensing element 11, so that, similar to the triangular heat collecting section 16, the thermal responsiveness can be improved.

[0072] (5.5) Variation 5 In the basic example, the heat collecting section 16 may have an inclined surface in the radial direction. As shown in Figure 9, the heat collecting section 16C may have a radially inclined surface 20 that slopes upward in the vertical direction A1 as it approaches the heat sensing element 11 in the radial direction A2 of the housing 12, from the inside to the outside. Having a radially inclined surface 20 makes it easier for the hot airflow to rise up the heat collecting section 16C, and the thermal responsiveness is further improved, similar to the triangular heat collecting section 16.

[0073] (5.6) Variation 6 In the basic example, the heat collecting section 16 is configured in a triangular shape, but it is not limited to this configuration. As shown in Figure 10, the triangular heat collecting section 16 may be extended horizontally in the radial direction A2 of the sensor 1 to the outer peripheral edge 21 of the bottom member 18 of the lower cover 120. In this case, the heat collecting section 16 is provided between the substrate 10 and the bottom member 18 that forms the bottom of the opening 14 and faces the substrate 10, and when viewed along the thickness direction of the substrate 10, the outer peripheral edge 21 of the bottom member 18 and the outer edge of the heat collecting section 16D are in the same position. The heat collecting section 16D not only performs the heat collecting effect but also acts as a finger guard to prevent a human finger from entering through the opening 14 and touching the heat sensing element 11, thus reducing the number of components that previously served as finger guards.

[0074] (5.7) Variation 7 The opening 14 of the sensor 1 in the basic example may further include a guide section 17 (17A) that guides the hot air flowing in from the opening 14 to the heat detection element 11. As shown in Figure 11, the guide section 17A is formed on the terminal block 22 and has an inclination toward the heat detection element 11 from the opening 14. Specifically, the guide section 17A is configured to serve as both a rail 25 and a terminal block 22. The terminal block 22A, which serves as both a rail 25 and a terminal block 22, has an inclined surface connecting the rail 25 and the terminal block 22 in a top view, as shown in Figure 11. In a front view, the inclined surface is inclined to face left to right, that is, toward the heat detection element 11. Therefore, the terminal block 22A (guide section 17A) functions as a guide section 17 and guides the hot air toward the heat detection element 11. Since the terminal block 22A is positioned so as not to overlap with the tongue portion 31 of the circuit board 10, the terminal block 22A also serves as the induction portion 17A, thereby reducing the number of components.

[0075] (5.8) Variation 8 The opening 14 of the sensor 1 in the basic example may further include a guide section 17 (17B) that guides the hot air flowing in from the opening 14 to the heat detection element 11. For example, as shown in Figure 12, the guide section 17B is formed on a crossbar 25 (25A, 25B). The crossbar 25A (guide section 17B) located on the substrate 10 opposite the heat detection element 11 has, for example, a regular triangular prism shape, with one corner facing the heat detection element 11. On the other hand, the crossbar 25B (guide section 17B) located not facing the heat detection element 11 is positioned between the heat detection element 11 and an adjacent heat detection element 11, and has a trapezoidal prism shape. The cross-sectional shape of the trapezoidal prism crossbar 25B is provided to be convex toward the external space SP2. The combination of the battens 25A and 25B makes it easier for the hot air flowing in from the opening 14 to be separated laterally by the battens 25B, and directed toward the heat sensing element 11 by the battens 25A. This improves the thermal responsiveness of the sensor 1. In this modified example, the combination of battens 25A and 25B is described, but either battens 25A or battens 25B may be used.

[0076] (5.9) Modification 9 The opening 14 of the basic example sensor 1 may further include a guide section 17 (17C) that guides the hot air flowing in from the opening 14 to the heat detection element 11. As shown in Figure 13, the sensor 1 has a guide section 17C, and the guide section 17C may have a wing shape 26. The guide section 17C is formed on the strut 25 and has a wing shape 26 that is inclined from the opening 14 toward the heat detection element 11. Each of the multiple (six in Figure 13) wing shapes 26 (guide section 17C) is provided with a gap between adjacent wing shapes 26, and the wing shapes 26 are formed such that the imaginary lines connecting adjacent wing shapes 26 pass near the heat detection element 11. In this case, for example, the hot airflow flowing in from the heat source H10 of the heating tester 2 is guided toward the heat detection element 11. Therefore, the guide section 17C is configured to easily guide hot air toward the heat detection element 11, thereby improving thermal responsiveness.

[0077] (5.10) Variation 10 The opening 14 of the sensor 1 in the basic example may further include a guide section 17 (17D) that guides the hot air flowing in from the opening 14 to the heat detection element 11. The opening 14 includes an upper member 24 and a plurality of rails 25. The guide section 17D is positioned between the plurality of rails 25. The bottom member 18B may have a wall surface 28 (guide section 17D) having a curve or straight line that connects adjacent rails 25 to adjacent rails 25. In this case, the wall surface 28 is formed on the bottom member 18B. The wall surface 28 having a curve or straight line that connects adjacent rails 25 is formed to pass near the heat detection element 11. For example, the hot airflow flowing in from the heat source H10 of the heating tester 2 is guided along the wall surface 28 to the heat detection element 11. For this reason, the guide section 17D is configured to easily guide hot air toward the heat detection element 11, thereby improving thermal responsiveness.

[0078] (5.11) Variation 11 In the basic example, the positions of the heat sensing element 11 and the heat collecting unit 16 are assumed to overlap when viewed from the thickness direction of the substrate 10, but the configuration is not limited to this. The vertices of the heat sensing element 11 and the triangular heat collecting unit 16 do not overlap and may be positioned offset from each other. Also, a gap is provided between the heat sensing element 11 and the heat collecting unit 16, as shown in Figure 2B. It is desirable that there is a gap between the heat sensing element 11 and the heat collecting unit 16 in order to ensure the flow of hot air. For example, even if the vertex of the heat collecting unit 16 is above the heat sensing element 11 in the vertical direction A1, a gap can be formed if the positions of the vertex of the heat collecting unit 16 and the heat sensing element 11 are offset.

[0079] (Embodiment 2) This embodiment differs from Embodiment 1 in that the thermal sensing element 11 is changed from a chip thermistor to a lead thermistor 30 (thermal sensing element 11). The differences from Embodiment 1 will be explained below with reference to Figures 15 to 17. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions will be omitted as appropriate. Furthermore, the figures described in the following embodiments are schematic diagrams, and the ratios of size and thickness of each component in each figure do not necessarily reflect the actual dimensional ratios.

[0080] The sensor 1A of this embodiment comprises a substrate 10A, a heat sensing element 11 mounted on the substrate 10A for detecting heat, a housing 12 housing the substrate 10A, and a heat collecting unit 16. The housing 12 has a flow path 13 through which gas flows, provided in the internal space SP1 of the housing 12, and an opening 14 that connects the flow path 13 to the external space SP2 of the housing 12. The heat sensing element 11 is positioned so as to fit within the opening region 15 of the opening 14 when viewed from the external space SP2. The heat collecting unit 16 is configured to collect hot airflow toward the heat sensing element 11.

[0081] The thermal sensing element 11 used in this embodiment is a reed thermistor 30. In this embodiment, the reed thermistor 30 is a negative thermal coefficient thermistor. In other words, it is a thermal sensing element 11 whose resistance decreases as the temperature rises.

[0082] The lead thermistors 30 are connected to the substrate 10 as shown in Figures 15 to 17. The lead thermistors 30 are positioned downward in the vertical direction A1 from below the substrate 10. One or more (four in this embodiment) lead thermistors 30 are provided on the lower surface of the substrate 10, with one lead thermistor 30 provided at equal intervals, approximately every 90°. The substrate 10A is approximately disc-shaped and does not have a tongue portion 31.

[0083] A heat collecting section 16 is provided between the lead thermistor 30 and the bottom member 18 of the lower cover 120. A gap is provided between the heat collecting section 16 and the lead thermistor 30. As an example, the shape of the heat collecting section 16 is triangular, as shown in Figure 6.

[0084] (operation) The operation of the sensor 1A in this embodiment regarding the detection of hot air during a heating test using the heating tester 2 will be described.

[0085] The heating tester 2 is attached to the sensor 1A, and hot air flows from the heat source H10 of the heating tester 2 into the internal space SP1 of the sensor 1A through the opening 14 of the sensor 1A. When the hot air flows into the internal space SP1 of the sensor 1A through the opening 14, the rectangular parallelepiped rib 25 and the substrate 10A, etc., that connect the upper member 24 and the bottom member 18 of the lower cover 120 become obstacles. As a result, the hot air that hits the rib 25 and the substrate 10A, etc., separates in the left-right direction. The hot air that has separated in the left-right direction flows into the internal space SP1 of the sensor 1A and reaches the heat collecting section 16 provided on the bottom member 18. The hot air that reaches the heat collecting section 16 rises up the circumferential inclined surface 19 of the heat collecting section 16. In this way, the hot air reaches the lead thermistor 30 which is located above the vertical direction A1 of the heat collecting section 16 with a gap. In the absence of the heat collection unit 16, the hot airflow flows between the substrate 10A and the bottom member 18 and exits through the outlet H40 of the heating tester 2. However, with the presence of the heat collection unit 16, the hot airflow tends to concentrate around the lead thermistor 30. As a result, the sensor 1A can achieve improved thermal responsiveness.

[0086] (modified version) The following are examples of modifications. These modifications can be applied in appropriate combinations with the embodiments described above.

[0087] The lead thermistor 30 is configured as a negative temperature characteristic thermistor, but the configuration is not limited to this. A positive temperature characteristic (Positive Thermal Coefficient) thermistor may also be used.

[0088] In Embodiment 2, the configuration includes a rectangular parallelepiped-shaped crossbar 25, but the configuration is not limited to this. The crossbar 25 may also have a guide section 17 (see Figure 12) which includes a triangular prism-shaped crossbar 25A or a trapezoidal prism-shaped crossbar 25B. By having a guide section 17, the hot airflow can flow more easily toward the heat collection section 16, and as a result, the thermal responsiveness can be improved.

[0089] In Embodiment 2, a configuration having a rectangular parallelepiped-shaped crossbar 25 was used, but the configuration is not limited to this. A terminal block 22A may be provided as an induction section 17, and the crossbar 25 and the terminal block 22 may be used interchangeably. In this case as well, the hot airflow will flow more easily toward the heat collection section 16, and as a result, the thermal responsiveness can be improved.

[0090] In Embodiment 2, the configuration includes a heat collecting section 16 having a triangular shape (see Figure 6), but the configuration is not limited to this. The heat collecting section 16A may have a trapezoidal shape. Alternatively, the heat collecting section 16C may also be used (see Figure 9). The heat collecting section 16C has a radially inclined surface 20 that slopes upward in the vertical direction as it approaches the heat sensing element 11 in the radial direction A2 of the housing 12, from the inside to the outside of the housing 12.

[0091] (summary) As described above, the sensor (1,1A) according to the first embodiment comprises a substrate (10,10A), a heat sensing element (11,30), a housing (12), and a heat collecting unit (16). The heat sensing element (11,30) is mounted on the substrate (10,10A) and detects heat. The housing (12) houses the substrate (10,10A). The housing (12) has a flow path (13) and an opening (14). The flow path (13) is provided in the internal space (SP1) of the housing (12) through which gas flows. The opening (14) connects the flow path (13) to the external space (SP2) of the housing (12). The heat collecting unit (16,16A,16B,16C,16D) is configured to collect hot air toward the heat sensing element (11,30).

[0092] This configuration allows for an improvement in the thermal response of the sensor (1,1A).

[0093] In the second embodiment of the sensor (1,1A), the heat detection elements (11,30) are arranged on the underside of the substrate (10,10A), as in the first embodiment.

[0094] This configuration, when combined with the heat collection units (16, 16A, 16B, 16C, 16D), can improve the thermal responsiveness of the sensors (1, 1A).

[0095] In the third embodiment of the sensor (1,1A), the heat detection elements (11,30) and the heat collecting units (16,16A,16B,16C,16D) are arranged to overlap each other when viewed along the thickness direction of the substrate (10,10A) in the first or second embodiment.

[0096] With this configuration, the heat sensing elements (11, 30) can efficiently detect the hot air collected by the heat collecting units (16, 16A, 16B, 16C, 16D). This improves the thermal responsiveness of the sensors (1, 1A).

[0097] In the fourth embodiment of the sensor (1,1A), in any of the first to third embodiments, the sensor further comprises a substrate (10,10A) and bottom members (18,18A,18B) that form the bottom of the opening (14) and face the substrate (10,10A). The heat collecting section (16,16A,16B,16C,16D) is provided between the substrate (10,10A) and the bottom members (18,18A,18B) and has a circumferentially inclined surface (19) that is inclined so as it approaches the heat sensing elements (11,30) in the circumferential direction (A3) of the housing (12) in the vertical direction (A1) upward.

[0098] With this configuration, as hot air rises on the circumferentially inclined surface (19), the heat sensing elements (11, 30) can more easily detect the hot air, and as a result, the thermal responsiveness of the detectors (1, 1A) can be improved.

[0099] In the sensor (1,1A) according to the fifth embodiment, the heat collecting section (16,16A,16B,16C,16D) is trapezoidal or triangular in shape when viewed from the external space (SP2) through the opening (14).

[0100] With this configuration, the heat collection section (16, 16A, 16B, 16C, 16D) utilizes a trapezoidal or triangular slope as a circumferential inclined surface (19), making it easier for the heat sensing element (11, 30) to detect hot air, and as a result, the thermal responsiveness of the sensor (1, 1A) can be improved.

[0101] In the sixth embodiment of the sensor (1,1A), in any of the first to fifth embodiments, the heat collecting section (16,16A,16B,16C,16D) is provided between the substrate (10,10A) and the bottom members (18,18A,18B) that form the bottom of the opening (14) and face the substrate (10,10A), and has a radially inclined surface (20) that is inclined in the radial direction (A2) of the housing (12) so as it moves from the opening (14) toward the heat sensing element (11,30), it becomes higher vertically (A1) upward.

[0102] With this configuration, the heat collection section (16, 16A, 16B, 16C, 16D) allows the hot air to climb the slope using the radially inclined surface (20), making it easier for the heat sensing elements (11, 30) to detect the hot air. As a result, the thermal responsiveness of the sensor (1, 1A) can be improved.

[0103] In the sensor (1,1A) according to the seventh embodiment, in any of the first to sixth embodiments, the heat collecting section (16,16A,16B,16C,16D) is provided between the substrate (10,10A) and the bottom members (18,18A,18B) that form the bottom of the opening (14) and face the substrate (10,10A), and when viewed along the thickness direction of the substrate (10), the outer peripheral edge (21) of the bottom members (18,18A,18B) and the outer edge of the heat collecting section (16,16A,16B,16C,16D) are in the same position.

[0104] With this configuration, for example, the heat collection section (16, 16A, 16B, 16C, 16D) can also be used as a finger guard to prevent fingers from entering the sensor (1, 1A), thereby reducing the number of components that would otherwise be used as a finger guard.

[0105] In the sensor (1,1A) according to the eighth embodiment, in any of the first to seventh embodiments, the opening (14) further comprises a guide section (17,17A,17B,17C,17D) that guides the hot air flowing in from the opening (14) to the heat detection element (11,30).

[0106] With this configuration, the induction section (17, 17A, 17B, 17C, 17D) controls the gas flow path (13) so that the hot air is directed toward the heat sensing element (11, 30). In combination with the heat collection section (16, 16A, 16B, 16C, 16D), this makes it easier for the heat sensing element (11, 30) to detect the hot air, and as a result, the thermal responsiveness of the sensor (1, 1A) can be improved.

[0107] In the sensor (1,1A) according to the ninth embodiment, as in the eighth embodiment, the substrate (10,10A) further comprises electrically connected terminals, and the flow path forming member (7) has a terminal block (22) that holds the base of the terminals. The induction portion (17,17A) is formed on the terminal block (22) and has an inclination from the opening (14) toward the heat sensing element (11,30).

[0108] With this configuration, the guide section (17, 17A) can reduce the number of components in the crossbar (25) by integrating the terminal block (22) and the crossbar (25).

[0109] The sensor (1,1A) according to the tenth embodiment further comprises a crossbar (25) connecting an upper member (24) that covers the substrate (10,10A) from above and bottom members (18,18A,18B) that form the bottom of the opening (14) and face the substrate (10,10A). The guide portion (17) is formed on the crossbar (25). The crossbar (25) has a wing shape (26) that is inclined toward the heat sensing element (11) from the opening (14).

[0110] With this configuration, when combined with the heat collection units (16, 16A, 16B, 16C, 16D), the heat sensing elements (11, 30) become more capable of detecting hot air, and as a result, the thermal responsiveness of the sensors (1, 1A) can be improved.

[0111] In the sensor (1,1A) according to the 11th embodiment, the opening (14) comprises an upper member (24) and a plurality of rails (25). The guide parts (17,17D) are positioned between each of the plurality of rails (25). The bottom member (18B) has a wall surface (28) having a curve or straight line that connects two adjacent rails (25) among the plurality of rails (25).

[0112] This configuration makes it easier for the heat sensing elements (11, 30) to detect hot air, and as a result, the thermal responsiveness of the detector (1, 1A) can be improved. [Explanation of Symbols]

[0113] 1,1A sensor 10,10A circuit board 11. Heat detection elements 12 cabinets 13 Flow channels 14 Opening 16,16A,16B,16C,16D Heat collection part 17,17A,17B,17C,17D Guide part 18,18A,18B Bottom member 19 Circumferential slope 20 Radial slope 21 (Outer edge of the base member) 22 Terminal block 24 Upper member 25 slats 26 Feather Shape 28 Wall surface A1 Vertical direction A2 radial direction A3 circumferential direction SP1 interior space SP2 External space

Claims

1. circuit board and A thermal sensing element mounted on the aforementioned substrate for detecting heat, A housing for the aforementioned circuit board, It includes a heat collector, The aforementioned enclosure is An opening that connects the internal space of the housing with the external space of the housing, It has a bottom member facing the substrate, The heat collecting unit is It is configured to collect hot air toward the aforementioned heat sensing element, The substrate and the bottom member are provided and have a circumferentially inclined surface that slopes upward toward the substrate side in the circumferential direction of the housing as it approaches the heat sensing element, sensor.

2. circuit board and A thermal sensing element mounted on the aforementioned substrate for detecting heat, A housing for the aforementioned circuit board, It includes a heat collector, The aforementioned enclosure is An opening that connects the internal space of the housing with the external space of the housing, It has a bottom member facing the substrate, The heat collecting unit is It is configured to collect hot air toward the aforementioned heat sensing element, A heat collection portion is provided between the substrate and the bottom member, such that when viewed along the thickness direction of the substrate, the outer edge of the bottom member and the outer edge of the heat collection portion are in the same position. sensor.

3. circuit board and A thermal sensing element mounted on the aforementioned substrate for detecting heat, A housing for the aforementioned circuit board, The heat collection unit, Equipped with a terminal block, The aforementioned enclosure is An opening that connects the internal space of the housing with the external space of the housing, A bottom member facing the aforementioned substrate, It has a guide unit that guides the hot air flowing in from the opening to the heat sensing element, The heat collecting unit is Provided between the substrate and the bottom member, The system is configured to collect the hot air toward the heat sensing element, The terminal block is fixed to the circuit board, The induction portion is formed on the terminal block and has an inclined surface directed from the opening toward the heat sensing element. sensor.

4. circuit board and A thermal sensing element mounted on the aforementioned substrate for detecting heat, A housing for the aforementioned circuit board, It includes a heat collector, The aforementioned enclosure is An opening that connects the internal space of the housing with the external space of the housing, The upper member forming the side surface of the housing, The bottom of the housing is formed by a bottom member facing the substrate, A crossbar connecting the upper member and the bottom member, It has a guide unit that guides the hot air flowing in from the opening to the heat sensing element, The heat collecting unit is Provided between the substrate and the bottom member, The system is configured to collect the hot air toward the heat sensing element, The induction portion has a wing shape with an inclination toward the heat sensing element from the opening, sensor.

5. A substrate and A thermal sensing element mounted on the aforementioned substrate for detecting heat, A housing for the aforementioned circuit board, It includes a heat collector, The aforementioned enclosure is An opening that connects the internal space of the housing with the external space of the housing, The upper member forming the side surface of the housing, The bottom of the housing is formed by a bottom member facing the substrate, Multiple crossbars connecting the upper member and the bottom member, It has a guide unit that guides the hot air flowing in from the opening to the heat sensing element, The heat collecting unit is Provided between the substrate and the bottom member, The system is configured to collect the hot air toward the heat sensing element, The guide section is positioned between each of the plurality of struts, The bottom member has a wall surface having a curve or straight line connecting two adjacent ribs in the plurality of ribs. sensor.

6. The heat sensing element is located on the underside of the substrate. A detector according to any one of claims 1 to 5.

7. The heat sensing element and the heat collecting unit are arranged so as to overlap each other when viewed along the thickness direction of the substrate. A detector according to any one of claims 1 to 6.

8. The heat collecting section, when viewed from the external space through the opening, is trapezoidal or triangular in shape. A detector according to any one of claims 1 to 7.

9. The heat collecting section has a radially inclined surface that slopes upward toward the substrate side as it moves from the opening toward the heat sensing element in the radial direction of the housing. A detector according to any one of claims 1 to 8.

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