Pickup device and method for controlling the pickup device
The pickup device addresses the issue of excessive bending moments and structural complexity by using an angled push-up pin mechanism, reducing chip component breakage and simplifying the peeling process with a single push-up plate.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NEC CORP
- Filing Date
- 2022-08-08
- Publication Date
- 2026-05-26
AI Technical Summary
Existing pickup devices for chip components on dicing tapes apply excessive bending moments due to the increasing size of the components, leading to a higher risk of breakage, and their complex structures complicate the peeling process.
A pickup device with a push-up pin supported at an angle and guided by a slidable mechanism, allowing the contact point to move from the edge to the center of the chip component, reducing bending moments and simplifying the structure by using a single push-up plate for upward motion.
The device effectively reduces bending moments on chip components during peeling, minimizing breakage risk while achieving a simpler structural configuration compared to previous methods.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a pickup device and the like.
Background Art
[0002] In the manufacture of chip components such as semiconductors, generally, a plurality of chip components are formed on a single wafer. Then, the wafer is divided into individual chip components using a dividing method such as dicing. In general dicing, a dicing tape is used. The dicing tape is a film having adhesiveness on one side. The dicing tape is also called a dicing sheet, a wafer sheet, an adhesive sheet, and the like.
[0003] When dicing is performed, first, the back surface of the wafer is attached to the dicing tape. Next, the wafer is divided into individual chip components by dicing. After dicing is completed, next, an expand process, which is a process of stretching the dicing tape, is performed to form a gap between the chip components. Next, the adhesiveness of the dicing tape is reduced by ultraviolet irradiation or the like. Next, the surface of the chip component is adsorbed by a pickup device provided with an adsorption means called a collet, and the chip component is picked up. At this time, in a general method, the back surface of the dicing tape is pushed up by a push-up pin. By this pushing up, the peeling of the chip component from the dicing tape is promoted.
[0004] In the pickup device described above, the simplest configuration involves using a single push-up pin to push up the center of the chip component. When this configuration is used, peeling begins from the edge of the chip component. At this time, a bending moment is generated where the point where the tip of the push-up pin strikes acts as a fulcrum, the edge of the chip component acts as the point of application, and the adhesive force (peeling force) of the dicing tape acts at the point of application. As the size of the chip component increases, the distance from the fulcrum to the point of application (the edge of the chip component) increases. Consequently, the bending moment applied to the chip component increases. If the stress applied to the chip component by this bending moment exceeds the fracture stress of the chip component, the chip component will break. Therefore, as the size of the chip component increases, the risk of chip component breakage increases.
[0005] Therefore, a method for reducing the bending moment applied to the chip component is proposed in Patent Document 1. For example, Patent Document 1 describes an invention of a pickup method and apparatus for peeling off the outer circumference of a chip component (chip). The pickup apparatus of Patent Document 1 comprises a plurality of cylindrical bodies of different diameters (first suction cylinder, second suction cylinder, first push-up cylinder, second push-up cylinder) and a plurality of push-up pins.
[0006] In the pickup process, the dicing tape (adhesive sheet, dicing sheet) is first sucked in through the suction hole of the outermost cylindrical body (first suction cylinder), causing the dicing tape to be attracted to the upper end of the first suction cylinder (Figure 3(a) in Reference 1).
[0007] Next, the first push-up cylinder, second suction cylinder, second push-up cylinder, and push-up pin, which are positioned inside the first suction cylinder, are raised to the same height, pushing the chip component upward through the dicing tape (Figure 3(b) in Reference 1). As a result, the dicing tape to which the chip component is attached is slightly peeled away from the outer edge of the lower surface of the chip component toward the inside of the chip component on the outer circumference side of the first push-up cylinder. In this operation, the abutment point of the first push-up cylinder acts as a fulcrum, and the end of the chip component above the first suction cylinder becomes the peeling point (point of action).
[0008] Next, while maintaining the height of the first suction cylinder and the first push-up cylinder, the second push-up cylinder, the second suction cylinder, and the push-up pin, which are located inside the first push-up cylinder, are raised by the same height, pushing the chip component further upward via the dicing tape (Figure 3(c) in Reference 1). As a result, the dicing tape is further peeled off from the outer edge of the previously attached surface toward the inside of the chip component on the outer circumference side of the second push-up cylinder. In this operation, the abutment point of the second push-up cylinder acts as a fulcrum, and the end of the chip component above the first push-up cylinder becomes the peeling point (point of action).
[0009] Next, while maintaining the heights of the first suction cylinder, the first push-up cylinder, and the second push-up cylinder, the second suction cylinder and the push-up pin, which are located inside the second push-up cylinder, are raised by the same height to further push up the chip component (Figure 3(d) in Reference 1). As a result, the dicing tape is further peeled off from the outer edge of the previously attached surface toward the inside of the chip 1 on the outer circumference side of the second suction cylinder. In this operation, the abutment point of the second push-up cylinder acts as a fulcrum, and the tip of the chip component above the first push-up cylinder becomes the peeling point (point of action).
[0010] Next, the heights of the first suction cylinder, the first push-up cylinder, the second push-up cylinder, and the second suction cylinder are maintained. Then, while maintaining this state, the push-up pin is raised further. This pushes the chip component further up. As a result, the chip component is supported on the tip of the push-up pin (Figure 3(e) in Reference 1). At this time, the dicing tape in contact with the second suction cylinder is attracted to and fixed by the suction from the suction groove of the second suction cylinder. In this way, the chip component is more effectively detached from the dicing tape by the push-up pin. In this operation, the abutment point of the push-up pin acts as a fulcrum, and the end of the chip component above the second push-up cylinder becomes the detachment point (point of action).
[0011] In each of the above steps, the distance from the fulcrum to the point of application is shorter compared to a configuration in which the center of the chip component is pushed up by a single push-up pin. As a result, the bending moment acting on the chip component is significantly reduced compared to a configuration in which the center of the chip component is pushed up by a single push-up pin. Furthermore, in the technology described in Patent Document 1, the inner cylindrical body and push-up pin are pushed up sequentially as the peeling progresses. In this way, the dicing tape is peeled off sequentially from the outer edge of the chip, and the adhesive area between the dicing tape and the chip component is gradually reduced. [Prior art documents] [Patent Documents]
[0012] [Patent Document 1] Japanese Patent Publication No. 2006-005030 [Overview of the project] [Problems that the invention aims to solve]
[0013] In the pickup device described in Patent Document 1, multiple actuators were provided for each of the multiple cylindrical bodies and push-up pins in order to move each of them independently. This resulted in a problem of structural complexity.
[0014] This invention has been made in view of the above-mentioned problems, and aims to provide a pickup device and the like that has a simpler structure and reduces the bending moment applied to the chip component when peeling it off the dicing tape. [Means for solving the problem]
[0015] To solve the above problems, the present invention provides a pickup device for picking up a chip component attached to a dicing tape from the dicing tape, comprising: a push-up pin having a tip portion for pressing the chip component through the lower surface of the dicing tape at one end on the dicing tape side; a guide that supports the push-up pin so as to be slidable in the longitudinal direction of the push-up pin at a first angle with respect to the normal to the main surface of the chip component; and a push-up plate that pushes the push-up pin toward the chip component so that the contact portion between the tip portion and the dicing tape moves from the edge of the chip component to the center of the chip component.
[0016] Furthermore, the control method for the pickup device of the present invention is a control method for a pickup device for picking up a chip component attached to a dicing tape from the dicing tape, the pickup device comprising: a push-up pin having a tip portion for pressing the chip component through the lower surface of the dicing tape at one end on the dicing tape side; and a guide that supports the push-up pin so as to be slidable in the longitudinal direction of the push-up pin at a first angle with respect to the normal to the main surface of the chip component, the method for pushing up the push-up pin toward the chip component such that the contact portion between the tip portion and the dicing tape moves from the edge of the chip component to the center of the chip component. [Effects of the Invention]
[0017] The advantage of the present invention is that it can provide a pickup device and the like that has a simpler structure and reduces the bending moment applied to the chip component when peeling it off the dicing tape. [Brief explanation of the drawing]
[0018] [Figure 1] This is a side view showing the pickup device of the first embodiment. [Figure 2] This is a side view showing a specific example of the pickup device of the first embodiment. [Figure 3] A side view showing the force relationship in the pickup device of the first embodiment. [Figure 4] A side view showing the first operating state of the pickup device of the first embodiment. [Figure 5] A side view showing the second operating state of the pickup device of the first embodiment. [Figure 6] A side view showing the third operating state of the pickup device of the first embodiment. [Figure 7] A side view showing the fourth operating state of the pickup device of the first embodiment. [Figure 8] A side view showing a modified example of the pickup device of the first embodiment. [Figure 9] A side view showing the pickup device of the second embodiment. [Figure 10] A top view showing a part of the pickup device of the second embodiment. [Figure 11] A side view showing the first operating state of the pickup device of the second embodiment. [Figure 12] A side view showing the second operating state of the pickup device of the second embodiment. [Figure 13] A side view showing the third operating state of the pickup device of the second embodiment. [Figure 14] A side view showing the fourth operating state of the pickup device of the second embodiment. [Figure 15] A top view showing a modified example 1 of the pickup device of the second embodiment. [Figure 16] A top view showing a modified example 2 of the pickup device of the second embodiment.
Mode for Carrying Out the Invention
[0019] Embodiments of the present invention will be described in detail below with reference to the drawings. However, the embodiments described below include technically preferred limitations for carrying out the present invention, but do not limit the scope of the invention. Similar components in each drawing are given the same number and their descriptions may be omitted.
[0020] (First Embodiment) Figure 1 is a side view showing a pickup device according to the first embodiment. The pickup device 100 is a device for picking up chip components 300 that are attached to a dicing tape 200. The pickup device 100 includes a push-up pin 10, a guide 20, and a push-up plate 30.
[0021] The push-up pin 10 has a tip portion 10a for pressing the chip component 300 through the lower surface of the dicing tape 200.
[0022] The guide 20 supports the push-up pin 10. In this case, the push-up pin 10 is supported at an angle θ with respect to the normal n of the main surface of the chip component 300. The push-up pin 10 is also supported by the guide 20 so that it can slide in the longitudinal direction of the push-up pin 10. The guide 20 is, for example, a block with a through hole. The direction of the through hole (the direction of the center line of the through hole) is fixed at the first angle θ. The push-up pin 10 is inserted through the through hole. The push-up plate 30 pushes the rear end 10b of the push-up pin 10, causing the push-up pin 10 to rise. In this case, since the orientation of the guide 20 is fixed, the longitudinal direction of the push-up pin 10 is maintained at the first angle θ. The guide 20 is fixed to a guide holder 21 (not shown in Figure 1; see Figure 2) with screws, bolts and nuts, etc., so as not to move. Furthermore, for example, washers may be used between the screws or bolts and the guide holder 21 as an anti-slip measure. For example, in a configuration where the guide 20 is screwed to the guide holder 21, the magnitude of the first angle θ can be adjusted when attaching the guide 20 to the guide holder 21. Also, for example, if a linear bearing such as a ball bush is installed in the through hole, the push-up pin 10 will slide smoothly.
[0023] The guide holder 21 is fixed to the suction block 40 with screws, bolts and nuts, etc. The suction block 40 picks up the dicing tape 200 under the chip component 300 adjacent to the chip component 300 to be picked up. Note that the mechanism by which the suction block 40 performs suction is omitted in Figure 1. The suction mechanism is formed using general technology.
[0024] The push-up plate 30 pushes the push-up pin 10 upwards toward the chip component 300. At this time, the push-up pin 10 is always inclined by a first angle θ with respect to the normal n of the main surface of the chip component 300. As a result, with the push-up, the contact point between the tip portion 10a and the dicing tape 200 moves from the edge of the chip component 300 to the center.
[0025] In the above configuration, first, the push-up pin 10 pushes up the lower surface of the end of the chip component 300. This causes the end of the chip component 300 to separate from the dicing tape 200. Subsequently, as the push-up pin 10 rises, the tip portion 10a moves from the end of the chip component 300 towards the center. This causes the peeling to proceed continuously from the end of the chip component 300 towards the center. This action reduces the bending moment that bends the chip component 300 during peeling.
[0026] Figure 2 is a side view showing an example of use of the pickup device 100 according to the first embodiment. The pickup device 100 includes a push-up pin 10, a guide 20, a push-up plate 30, a guide holder 21, and a suction block 40.
[0027] The push-up pin 10 has a tip portion 10a for pressing the chip component 300 through the lower surface of the dicing tape 200.
[0028] As described above, the guide 20 is attached to the guide holder 21. The guide holder 21 is fixed to the suction block 40. In addition, the push-up pin 10 is always supported by the guide 20 at an angle θ with respect to the normal. The push-up pin 10 is supported by the guide 20 so that it can slide in the longitudinal direction of the push-up pin 10.
[0029] The first angle θ can be adjusted by adjusting how the guide 20 is attached to the guide holder 21. When attaching the guide 20 to the guide holder 21, the first angle θ is adjusted, for example, within the range of 10° to 80°. The reason for this is as follows: If the first angle θ is too small, the speed at which the tip portion 10a moves toward the center of the chip component 300 becomes small, resulting in poor efficiency. Also, if the first angle θ is too large, the force that peels the chip component 300 from the dicing tape 200 becomes small, resulting in poor efficiency. Considering these reasons, the first angle θ may be set, for example, within the range of 30° to 60°. The size of the first angle θ is adjusted while considering the size of the chip component 300, the length and size of the push-up pin 10, and the frictional force between the dicing tape 200 and the tip portion 10a of the push-up pin 10.
[0030] The push-up plate 30 pushes the push-up pin 10 upward toward the chip component 300. At this time, the push-up pin 10 is inclined by a first angle θ with respect to the normal n of the main surface of the chip component 300. As a result, as it is pushed up, the contact point between the tip portion 10a and the dicing tape 200 moves from the edge to the center of the chip component 300. The push-up plate 30 is provided so as to be movable up and down in a direction parallel to the normal n, for example, by an electric motor.
[0031] The suction block 40 adheres to the back surface of the dicing tape 200. In the suction block 40, the portion corresponding to the chip component 300 to be picked up is an opening. In other words, the dicing tape 200 is not adhered to in the area where pickup is performed.
[0032] Here, the force acting on the chip component 300 during pickup will be described. FIG. 3 is a side view showing the force relationship in the pickup device 100 of the first embodiment. At point P, which is at a distance L1 from point Q at one end of the chip component 300, the push-up pin 10 is in contact with the back surface of the dicing tape 200. Here, the distance from point P to point R at the other end of the chip component 300 is L2. For reasons described later, L1 << L2. That is, L1 is small and can be set to a value close to 0.
[0033] As shown in FIG. 3, a force F1 acts on point P due to the push-up of the push-up pin 10. F1 is always inclined by a first angle θ with respect to the normal line n. A peeling force F2 acts on one end of the chip component 300 where peeling starts. The peeling force F2 is the force with which the dicing tape 200 pulls the chip component 300. That is, it is the adhesive force of the dicing tape 200.
[0034] A bending moment M1 having point P as a fulcrum and point Q as a point of application acts on the chip component 300 between point P and point Q. M1 is expressed by the following equation. M1 = F2 × L1 (Equation 1)
[0035] As described above, L1 << L2. In a general device for comparison, when the push-up pin 10 pushes up the center of the chip component 300, L1 = L2 = (L1 + L2) / 2. Compared with L1 of the present embodiment, the following relationship holds. Therefore, the bending moment M1 is significantly smaller than that in the comparative example. L1 << (L1 + L2) / 2 (Equation 2)
[0036] On the other hand, the force F1 also acts on the chip component 300 between point P and point R. Here, the dicing tape 200 is flexible. Therefore, the dicing tape 200 does not prevent the rotation of the chip component 300 around point R. As a result, the force F1 acts as a moment M2 of rotation around point R. M2 is expressed by the following equation. M2 = (F1·cosθ - F2) × L2 (Equation 3)
[0037] As previously stated, the dicing tape 200 does not hinder the rotation of the chip component 300 around point R. Therefore, it is considered that no bending moment acts on the region of the chip component 300 between point P and point R.
[0038] As described above, in the pickup device 100 of this embodiment, the bending moment acting on the chip component 300 during pickup is reduced compared to the method of pushing up the center of the chip component 300.
[0039] Next, the operation of the pickup device 100 will be described. Figure 4 is a side view showing the first operating state of the pickup device 100 according to the first embodiment. The tip 10a of the push-up pin 10 is in contact with the back surface of the dicing tape 200. This location is one end of the chip component 300.
[0040] Figure 5 is a side view showing the second operating state of the pickup device 100 of the first embodiment. The push-up plate 30 is pushing up the push-up pin 10. Then, the tip portion 10a pushes up one end of the chip component 300 to the second position. As a result, the chip component 300 is separated from the dicing tape 200 at one end. At this time, since the push-up pin 10 is always tilted by a first angle θ with respect to the normal n, the tip portion 10a moves toward the center of the chip component 300.
[0041] Figure 6 is a side view showing the third operating state of the pickup device 100 of the first embodiment. The push-up plate 30 is pushing up the push-up pin 10. Then, the tip portion 10a pushes up one end of the chip component 300 to the third position. As a result, the peeling of the chip component 300 from the dicing tape 200 progresses. At this time, since the push-up pin 10 is always tilted by a first angle θ with respect to the normal n, the tip portion 10a moves further toward the center of the chip component 300.
[0042] Figure 7 is a side view showing the fourth operating state of the pickup device 100 of the first embodiment. The push-up plate 30 is pushing up the push-up pin 10. Then, the tip portion 10a pushes up one end of the chip component 300 to the fourth position. This further detaches the chip component 300 from the dicing tape 200. At this time, since the push-up pin 10 is always tilted by a first angle θ with respect to the normal n, the tip portion 10a moves further toward the center of the chip component 300. Through the above operation, a state is created in which the pickup of the chip component 300 is easily made possible.
[0043] In the pickup device 100 described above, similar to the pickup device in Patent Document 1, the bending moment applied to the chip component 300 during peeling from the dicing tape 200 is reduced. Furthermore, since the push-up pin 10 is moved up and down using only the push-up plate 30, the same operation is achieved with a simpler configuration than the pickup device 100 in Patent Document 1, which used multiple actuators.
[0044] Figure 8 is a side view showing a modified version of the pickup device 100 of the first embodiment. In this modified version, the pickup device 100 is equipped with a biasing means 11 that biases the push-up pin 10 toward the push-up plate 30. For example, when the push-up is completed in the state shown in Figure 7, the push-up plate 30 returns to the position shown in Figure 4 in preparation for the next operation. In this configuration, the push-up pin 10 returns to its original position due to its own weight. The original position is the position where the other end of the push-up pin 10 contacts the push-up plate 30.
[0045] On the other hand, in this modified example, the pushing pin 10 is pressed against the pushing plate 30 by the biasing means 11. As a result, the position of the pushing pin 10 is reliably returned to its initial position.
[0046] The pickup device 100 and other components of this embodiment have been described above.
[0047] The pickup device 100 of this embodiment picks up chip components attached to a dicing tape from the dicing tape. The pickup device 100 includes a push-up pin 10, a guide 20, and a push-up plate 30. The push-up pin 10 has a tip portion 10a at one end on the dicing tape side (200 side). The tip portion 10a presses against the chip component 300 via the lower surface of the dicing tape 200. The guide 20 supports the push-up pin 10. At this time, the push-up pin 10 is supported at an angle θ with respect to the normal n of the main surface of the chip component 300. The push-up pin 10 is also supported by the guide so that it can slide in the longitudinal direction of the push-up pin 10. The push-up plate 30 pushes up the push-up pin 10. During the upward thrust, the contact point between the tip portion 10a and the dicing tape 200 moves from the edge of the chip component 300 to the center of the chip component 300.
[0048] In the above configuration, first, the push-up pin 10 pushes up the lower surface of the end of the chip component 300. This causes the end of the chip component 300 to separate from the dicing tape 200. Subsequently, as the push-up pin 10 rises, the tip portion 10a moves from the end of the chip component 300 towards the center. This causes the peeling to proceed continuously from the end of the chip component 300 towards the center. This action reduces the bending moment that bends the chip component 300 during peeling.
[0049] In the invention described in Patent Document 1, as mentioned above, multiple actuators were provided for each of the multiple cylindrical bodies and push-up pins in order to move each of the multiple cylindrical bodies and push-up pins independently. This resulted in a problem of a complex structure.
[0050] In contrast, the pickup device 100 of this embodiment uses only the push-up plate 30 to move the push-up pin 10 up and down, thus achieving similar operation with a simpler configuration than the pickup device 100 of Patent Document 1, which used multiple actuators.
[0051] Therefore, the pickup device 100 of this embodiment has a simpler structure, and the bending moment applied to the chip component during peeling from the dicing tape is reduced.
[0052] In another embodiment, the pickup device 100 has a biasing means 11. The biasing means 11 biases the push-up pin 10 toward the push-up plate 30.
[0053] The biasing means 11 ensures that the push-up pin 10 is reliably returned to its initial position after the push-up is complete.
[0054] In another embodiment, the first angle θ of the guide 20 of the pickup device 100 is adjustable. This allows for optimization of the pushing angle according to the dimensions of the chip component 300 and the adhesive strength of the dicing tape 200.
[0055] In another embodiment, the first angle in the pickup device 100 is within the range of 10° to 80°. Within this range, an efficient selection of the combination of the peeling force and the speed at which the peeling progresses is possible.
[0056] Furthermore, the control method for the pickup device of this embodiment controls the pickup device 100. The pickup device 100 is a device for picking up chip components attached to a dicing tape from the dicing tape. The pickup device has a push-up pin 10, a guide 20, and a push-up plate 30. The push-up pin 10 has a tip portion 10a at one end on the dicing tape side (200 side). The tip portion 10a presses against the chip component 300 via the lower surface of the dicing tape 200. The guide 20 supports the push-up pin 10. At this time, the push-up pin 10 is supported at an angle θ of a first angle with respect to the normal n of the main surface of the chip component 300. The push-up pin 10 is also supported by the guide so that it can slide in the longitudinal direction of the push-up pin 10. In the control method for the pickup device 100, the push-up pin 10 is pushed up by the pickup device 100. During this upward thrust, the contact point between the tip portion 10a and the dicing tape 200 moves from the edge of the chip component 300 to the center of the chip component 300.
[0057] The control method for the pickup device of this embodiment can also achieve the same effects as the pickup device 100 of this embodiment described above. (Second Embodiment) In the first embodiment, a pickup device 100 with one push-up pin 10 was described. In this embodiment, a pickup device having multiple push-up pins 10 will be described.
[0058] Figure 9 is a side view showing the pickup device 101 of the second embodiment. Figure 10 is a top view showing a part of the pickup device of the second embodiment. The pickup device 101 is equipped with two push-up pins 10. The tip 10a of the left push-up pin 10 in Figure 9 is tilted to the right by a first angle θ with respect to the normal n. The tip 10a of the right push-up pin 10 in Figure 9 is tilted to the left by a first angle θ with respect to the normal n. Also, the height of the tip 10a of the left push-up pin 10 and the tip 10a of the right push-up pin 10 are the same.
[0059] The inclination of each push-up pin 10 can be adjusted by adjusting how it is attached to the guide holder 21. Furthermore, the distance between the two push-up pins 10 can also be adjusted by adjusting how they are attached to the guide holder 21. For example, the distance between the two push-up pins 10 can be adjusted according to the size of the chip component 300 to be picked up. The specific method for attaching them to the guide holder 21 is the same as described in the first embodiment.
[0060] Next, the specific configuration and operation of the pickup device 101 will be described. Figure 11 is a side view showing the first operating state of the pickup device 101 of the second embodiment. Although omitted in Figure 9, the pickup device 101 includes a collet 90 and a collet driving means 91.
[0061] The collet 90 is positioned opposite the upper surface of the chip component 300. The collet 90 then attracts the chip component 300.
[0062] The collet driving means 91 moves the collet 90 in at least the direction of the normal n. The collet driving means 91 is designed to adjust the force applied to the collet. Although not shown in the figures, the position of the collet 90 is detected by the collet position detection means.
[0063] In the first operating state shown in Figure 11, the tip 10a of the left-side push-up pin 10 is in contact with the back surface of the dicing tape 200. This is the left end of the chip component 300. Similarly, the tip 10a of the right-side push-up pin 10 is in contact with the back surface of the dicing tape 200. This is the right end of the chip component 300. The collet 90 is then adhering to the upper surface of the chip component 300. Furthermore, the load of the collet driving means 91 is adjusted so that no downward load is applied to the collet 90.
[0064] Figure 12 is a side view showing the second operating state of the pickup device 101 of the second embodiment. The push-up plate 30 is pushing up the push-up pin 10. The two tip portions 10a are pushing up both ends of the chip component 300 to the second position. As a result, the chip component 300 is separated from the dicing tape 200 at both ends of the chip component 300. At this time, because the push-up pin 10 is tilted by a first angle θ with respect to the normal n, the two tip portions 10a each move toward the center of the chip component 300. Note that the load of the collet driving means 91 is adjusted so that no downward load is applied to the collet 90.
[0065] As is clear from the above operation, in the pickup device 101 of the second embodiment, the bending moment applied to the chip component 300 is reduced, similar to the pickup device 100 of the first embodiment.
[0066] Figure 13 is a side view showing the third operating state of the pickup device 101 of the second embodiment. The push-up plate 30 is pushing up the push-up pin 10. The two tip portions 10a are pushing up both ends of the chip component 300 to the third position. This causes the chip component 300 to peel off from the dicing tape 200. At this time, the two tip portions 10a each move further toward the center of the chip component 300.
[0067] Here, a predetermined pickup position is set for the collet 90. When the collet 90 rises to the pickup position, the upward movement of the push-up plate 30 stops. As a result, the upward movement of the tip 10a also stops. In this example, the third position described above is the pickup position.
[0068] Figure 14 is a side view showing the fourth operating state of the pickup device 101 of the second embodiment. As described above, the two tip portions 10a are stopped at the third position. At this point, the chip component 300 is peeling off from the dicing tape 200. Therefore, the chip component 300 is in a state where it can be easily picked up. With the collet 90 holding the chip component 300, the collet driving means 91 raises the collet 90 in the normal direction. As a result, the chip component 300 is removed from the dicing tape 200, and the pickup is completed.
[0069] As described above, with the pickup device 101, similar to the pickup device in Patent Document 1, the bending moment applied to the chip component 300 during peeling from the dicing tape 200 is reduced. The two push-up pins 10 begin pushing up from both ends of the chip component 300, and peeling begins from both ends. Then, peeling progresses from both sides toward the center of the chip component 300. As a result, the chip component 300 is not tilted, and a state is formed that makes it easy to pick up. This is the same operation as the pickup device in Patent Document 1. However, the same operation is achieved with a simpler configuration than the pickup device 100 in Patent Document 1.
[0070] (Variation 1) Next, a modified example of the pickup device 101 of the second embodiment will be described. In the above description, an example with two push-up pins 10 was described. However, the number of push-up pins 10 may be any number of three or more. Figure 15 is a top view showing Modification 1 of the pickup device 101 of the second embodiment.
[0071] Modification 1 is an example with four push-up pins 10. In Figure 15, the tips 10a of the two push-up pins 10 on the left are tilted to the right. Also, the tips 10a of the two push-up pins 10 on the right are tilted to the left. When the push-up plate 30 rises, each tip 10a moves in the direction of the arrows in Figure 15. In other words, in Modification 1, in the left-right direction of Figure 15, each tip 10a moves towards the center of the chip component 300.
[0072] In the above configuration, there are four points of force application, so the force applied to each point is smaller compared to the case where there are two points of application.
[0073] (Modification 2) Figure 16 is a top view showing a modified example 2 of the pickup device 101 of the second embodiment.
[0074] Modification 1 is an example with four push-up pins 10. In Figure 16, the tip 10a of the push-up pin 10 in the upper left is tilted downward to the right. Also, the tip 10a of the push-up pin 10 in the lower left is tilted upward to the right. Similarly, the tip 10a of the push-up pin 10 in the upper right of Figure 16 is tilted downward to the left. Also, the tip 10a of the push-up pin 10 in the lower right is tilted upward to the left.
[0075] As the push-up plate 30 rises, each of the tip portions 10a moves in the direction of the arrows in Figure 15, that is, toward the center of the chip component 300.
[0076] In the above configuration, there are four points of application of force, so, as in the case of Modification 1, the force applied to each point is smaller compared to the case where there are two points of application.
[0077] In modifications 1 and 2, examples with four push-up pins 10 were described, but the number of push-up pins 10 may be three or five or more.
[0078] The pickup device 101 and other components of this embodiment have been described above.
[0079] The pickup device 101 of this embodiment is equipped with multiple push-up pins 10. Each push-up pin 10 is pushed up toward the chip component by the push-up plate 30. Furthermore, the push-up pins 10 are positioned such that when the push-up plate 30 is pushed up, their respective tips 10a face toward the center of the chip component 300. In the above configuration, the upward force is distributed across multiple upward-pushing pins, thus reducing the force applied to a single point during the upward push. Furthermore, the upward push is performed without tilting the chip component 300.
[0080] In another embodiment, the pickup device 101 includes a collet 90 and a collet driving means 91. The collet 90 is positioned opposite the upper surface of the chip component 300. The collet 90 then attracts the chip component. The collet driving means 91 moves the collet 90 in at least the direction of the normal n.
[0081] The collet 90 attracts the chip component 300, and the collet driving means 91 moves the collet 90, causing the pickup device 101 to pick up the chip component 300 from the dicing tape 200.
[0082] The present invention also includes programs that cause a computer to execute the processing of the first and second embodiments described above, and recording media storing said programs. Examples of recording media include magnetic disks, magnetic tapes, optical disks, magneto-optical disks, semiconductor memory, and the like.
[0083] The present invention has been described above using the embodiments described above as exemplary examples. However, the present invention is not limited to the above embodiments. That is, the present invention can be applied in various forms that can be understood by those skilled in the art within the scope of the present invention. [Explanation of Symbols]
[0084] 10 Push-up pin 10a Tip 11. Biasing means 20 Guides 30 Push-up plate 90 Colette 91 Collet driving means 100, 101 Pickup device 200 dicing tapes 300 chip components
Claims
1. A pickup device for picking up chip components attached to a dicing tape from the dicing tape, A push-up pin is provided at one end of the dicing tape side, with a tip for pressing the chip component through the lower surface of the dicing tape, A guide that supports the push-up pin so that it can slide in the longitudinal direction of the push-up pin while being tilted at a first angle with respect to the normal of the main surface of the chip component, A push-up plate that pushes the push-up pin toward the chip component so that the contact portion between the tip and the dicing tape moves from the edge of the chip component to the center of the chip component, A pickup device characterized by having the following features.
2. The system has a biasing means for biasing the push-up pin toward the push-up plate, The pickup device according to feature 1.
3. The system includes multiple of the aforementioned push-up pins, Each of the aforementioned push-up pins is When the push-up plate is pushed up in the direction of the chip component, each of the aforementioned tips is positioned to face the center of the chip component. The pickup device according to claim 1 or 2.
4. The first angle of the guide is adjustable. The pickup device according to claim 1 or 2.
5. The first angle is within the range of 10° to 80°. The pickup device according to claim 1 or 2.
6. A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet at least in the direction of the normal, The pickup device according to claim 1 or 2, characterized by having the following features.
7. The first angle of the guide is adjustable. The pickup device according to feature 3.
8. The first angle is within the range of 10° to 80°. The pickup device according to feature 3.
9. A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet at least in the direction of the normal, The pickup device according to claim 3, characterized by having the following features.
10. A control method for a pickup device for picking up chip components attached to a dicing tape from the dicing tape, The pickup device is A push-up pin is provided at one end of the dicing tape side, with a tip for pressing the chip component through the lower surface of the dicing tape, A guide that supports the push-up pin so that it can slide in the longitudinal direction of the push-up pin while being tilted at a first angle with respect to the normal of the main surface of the chip component, Equipped with, The push-up pin is pushed upward towards the chip component so that the contact portion between the tip and the dicing tape moves from the edge of the chip component to the center of the chip component. A control method for a pickup device, characterized by the following features.