Multilayer boards and wiring boards

Abstract

In the present invention, a stack has a structure in which a plurality of insulator layers are stacked along a Z-axis. A first radiating conductor layer receives or radiates a first high frequency signal, and also receives or radiates a second high frequency signal. The oscillating direction of an electromagnetic field due to the second high frequency signal propagating in air differs from the oscillating direction of an electromagnetic field due to the first high frequency signal propagating in air. The second radiating conductor layer is positioned on the negative side of the Z-axis with respect to the first radiating conductor layer, and overlaps the first radiating conductor layer when viewed in the negative direction of the Z-axis. A first signal path and a second signal path are connected to the first radiating conductor layer. The first high frequency signal is transmitted on the first signal path. The second high frequency signal is transmitted on the second signal path. A first connection conductor is connected to the first signal path and the second signal path, and is positioned on the negative side of the Z-axis with respect to the second radiating conductor layer.

Description

Technical Field

[0001] The present invention relates to a multilayer substrate including a plurality of radiation conductor layers.

Background Art

[0002] As an invention related to a conventional multilayer substrate, a multilayer patch antenna described in Patent Document 1 is known. This multilayer patch antenna includes a parasitic patch radiator that radiates high-frequency signals of two orthogonal polarizations.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the multilayer patch antenna described in Patent Document 1, there is a desire to improve the isolation between high-frequency signals of two orthogonal polarizations.

[0005] Therefore, an object of the present invention is to improve the isolation between a first high-frequency signal and a second high-frequency signal.

Means for Solving the Problems

[0006] A multilayer substrate according to one embodiment of the present invention The multilayer substrate includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor. The laminate has a structure in which a plurality of insulator layers are laminated along the Z-axis. The first radiation conductor layer is provided on the laminate and receives or radiates a first high-frequency signal and also receives or radiates a second high-frequency signal. The direction of vibration of the electromagnetic field caused by the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the first high-frequency signal propagating through the air. The second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative Z-axis direction. The first signal path and the second signal path are connected to the first radiating conductor layer. The first high-frequency signal is transmitted through the first signal path, The second high-frequency signal is transmitted through the second signal path. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and located on the negative side of the Z-axis relative to the second radiating conductor layer.

[0007] A multilayer substrate according to one embodiment of the present invention comprises a laminate, a first radiating conductor layer, a second radiating conductor layer, a first signal path, a second signal path, and a first connecting conductor. The laminate has a structure in which multiple insulating layers are stacked along the Z-axis. The first radiating conductor layer is provided in the laminate, The first radiating conductor layer is provided with a first feeding point and a second feeding point. Viewed in the negative direction of the Z-axis, the second power supply point is not point-symmetric to the first power supply point with respect to the centroid of the figure determined by the outer edge of the first radiating conductor layer. The second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative Z-axis direction. The first signal path and the second signal path are connected to the first radiating conductor layer. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and located on the negative side of the Z-axis relative to the second radiating conductor layer.

[0008] A wiring board according to one embodiment of the present invention comprises a first laminate, a first signal path section, a second signal path section, and a first connecting conductor. Antenna components are mounted on the first laminate, The antenna component is located on the positive side of the Z-axis relative to the first laminate. The aforementioned antenna component comprises a second laminate, a first radiating conductor layer, and a second radiating conductor layer. The first laminate has a structure in which a plurality of insulating layers are stacked along the Z axis, The second laminate has a structure in which multiple insulating layers are stacked along the Z-axis, The first radiating conductor layer is provided in the second laminate and receives or radiates a first high-frequency signal and also receives or radiates a second high-frequency signal. The direction of vibration of the electromagnetic field caused by the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the first high-frequency signal propagating through the air. The second radiating conductor layer is provided in the second laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative Z-axis direction. The first signal path and the second signal path are provided in the first laminate and are electrically connected to the first radiating conductor layer. The first high-frequency signal is transmitted through the first signal path, The second high-frequency signal is transmitted through the second signal path. The first connecting conductor is provided in the second laminate and is connected to the first signal path and the second signal path, and is located on the negative side of the Z-axis relative to the second radiating conductor layer. [Effects of the Invention]

[0009] According to the present invention, the isolation between the first high-frequency signal and the second high-frequency signal can be improved. [Brief explanation of the drawing]

[0010] [Figure 1]FIG. 1 is an exploded perspective view of a multilayer substrate 10. [Figure 2] FIG. 2 is a rear view of the multilayer substrate 10 during use. [Figure 3] FIG. 3 is an exploded perspective view of a multilayer substrate 10a. [Figure 4] FIG. 4 is an exploded perspective view of a multilayer substrate 10b.

Embodiments for Carrying Out the Invention

[0011] (Embodiment) [Structure of Multilayer Substrate 10] The structure of the multilayer substrate 10 according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of the multilayer substrate 10. FIG. 2 is a rear view of the multilayer substrate 10 during use.

[0012] Hereinafter, the stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction. The vertical axis coincides with the Z axis. The upward direction is the positive direction of the Z axis. The downward direction is the negative direction of the Z axis. Looking at the stacked body 12 in the downward direction, each of the two axes along which the sides of the stacked body 12 extend is defined as the left - right axis and the front - rear axis. The left - right axis is perpendicular to the vertical axis. The front - rear axis is perpendicular to the vertical axis and the left - right axis. Note that the definition of directions in this specification is an example. Therefore, the directions during actual use of the multilayer substrate 10 do not necessarily have to match the directions in this specification.

[0013] Hereinafter, X is a component or material of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows: The front part of X means the front half of X. The rear part of X means the rear half of X. The left part of X means the left half of X. The right part of X means the right half of X. The top part of X means the upper half of X. The bottom part of X means the lower half of X. The front end of X means the front end of X. The rear end of X means the rear end of X. The left end of X means the left end of X. The right end of X means the right end of X. The top end of X means the top end of X. The bottom end of X means the bottom end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The top end of X means the top end of X and its vicinity. The lower end of X refers to the lower end of X and its vicinity.

[0014] The multilayer substrate 10 is used as an antenna and a transmission line. The multilayer substrate 10 is electrically connected to a circuit board, for example. As shown in Figure 1, the multilayer substrate 10 comprises a laminate 12, a first ground conductor layer 16, a second ground conductor layer 18, a first radiating conductor layer 20, a second radiating conductor layer 21, a first connecting conductor 22, a first signal path R1, and a second signal path R2.

[0015] The laminate 12 has a plate shape. As shown in Figures 1 and 2, the laminate 12 has a strip shape that extends along the left-right axis when viewed downwards. The laminate 12 has a structure in which insulating layers 14a to 14g are stacked along the vertical axis (Z-axis). The insulating layers 14a to 14g are arranged in this order from top to bottom.

[0016] The insulating layers 14e to 14g have a strip shape extending along the left-right axis when viewed downwards. The insulating layers 14a to 14d have a rectangular shape when viewed downwards. Therefore, the length of the insulating layers 14e to 14g along the left-right axis is longer than the length of the insulating layers 14a to 14d along the left-right axis. When viewed downwards, the insulating layers 14a to 14d overlap with the left end of the insulating layers 14e to 14g. The material of the insulating layers 14a to 14g is a thermoplastic resin such as polyimide or liquid crystal polymer. Therefore, the laminate 12 is flexible. In addition, the insulating layers 14a to 14g are fused together with adjacent layers vertically.

[0017] The first radiating conductor layer 20 radiates a first high-frequency signal and a second high-frequency signal. The first radiating conductor layer 20 is provided in the laminate 12. In this embodiment, the first radiating conductor layer 20 is located on the upper main surface of the insulating layer 14a. As shown in Figure 1, the first radiating conductor layer 20 has a square shape when viewed downwards, with sides extending along the front-to-back axis and the left-to-right axis. The length of one side of the first radiating conductor layer 20 is half the wavelength within the resonant frequency band of the first radiating conductor layer 20. The wavelength of the first high-frequency signal and the second high-frequency signal belong to the resonant frequency band of the first radiating conductor layer 20. The resonant mode of the first radiating conductor layer 20 is the ground mode.

[0018] The second radiating conductor layer 21 radiates a third high-frequency signal and a fourth high-frequency signal. The second radiating conductor layer 21 is provided in the laminate 12. In this embodiment, the second radiating conductor layer 21 is located on the upper main surface of the insulating layer 14b. As a result, the second radiating conductor layer 21 is located below the first radiating conductor layer 20 (on the negative side of the Z-axis).

[0019] Furthermore, as shown in Figure 3, the second radiating conductor layer 21 overlaps with the first radiating conductor layer 20 when viewed downward (negative Z-axis direction). The second radiating conductor layer 21 has a square shape with sides extending along the front-to-back axis and the left-to-right axis when viewed downward. However, the area of ​​the second radiating conductor layer 21 is larger than the area of ​​the first radiating conductor layer 20. Therefore, when viewed downward, the four sides of the second radiating conductor layer 21 do not overlap with the first radiating conductor layer 20. The first radiating conductor layer 20 is contained within the outer edge of the second radiating conductor layer 21 when viewed downward. And, when viewed downward, the intersection of the diagonals of the second radiating conductor layer 21 coincides with the intersection of the diagonals of the first radiating conductor layer 20. That is, when viewed downward (negative Z-axis direction), the centroid of the figure determined by the outer edge of the second radiating conductor layer 21 coincides with the centroid of the figure determined by the outer edge of the first radiating conductor layer 20.

[0020] The resonant frequency bandwidth of the second radiating conductor layer 21 is lower than that of the first radiating conductor layer 20. In this embodiment, the difference between the resonant frequency bandwidth of the first radiating conductor layer 20 and the resonant frequency bandwidth of the second radiating conductor layer 21 is 10% or more of the frequencies of the first high-frequency signal and the second high-frequency signal. However, the difference between the resonant frequency bandwidth of the first radiating conductor layer 20 and the resonant frequency bandwidth of the second radiating conductor layer 21 may be less than 10% of the frequencies of the first high-frequency signal and the second high-frequency signal.

[0021] The first signal path R1 is connected to the first radiating conductor layer 20. The first signal path R1 includes the first signal conductor layer 24 and the interlayer connecting conductor v1. The first signal conductor layer 24 is located on the upper main surface of the insulator layer 14f. When viewed downwards, the first signal conductor layer 24 has a linear shape extending along the left-right axis. The left end of the first signal conductor layer 24 overlaps with the first radiating conductor layer 20 when viewed downwards. The interlayer connecting conductor v1 penetrates the insulator layers 14a to 14e along the vertical axis. The upper end of the interlayer connecting conductor v1 is connected after the intersection of the diagonals of the first radiating conductor layer 20. The lower end of the interlayer connecting conductor v1 is connected to the left end of the first signal conductor layer 24.

[0022] The first high-frequency signal is transmitted through the first signal path R1. Therefore, the first high-frequency signal is supplied to the first radiating conductor layer 20 via the interlayer conductor v1. The interlayer conductor v1 is connected after the intersection of the diagonals of the first radiating conductor layer 20. Hereafter, the point where the interlayer conductor v1 is connected to the first radiating conductor layer 20 will be referred to as the first feed point P1. The first high-frequency signal resonates in the first radiating conductor layer 20 such that current flows in the direction along the front-to-back axis.

[0023] The second signal path R2 is connected to the first radiating conductor layer 20. The second signal path R2 includes the second signal conductor layer 26 and the interlayer connecting conductor v2. The second signal conductor layer 26 is located on the upper main surface of the insulator layer 14f. When viewed downwards, the second signal conductor layer 26 has a linear shape extending along the left-right axis. The left end of the second signal conductor layer 26 overlaps with the first radiating conductor layer 20 when viewed downwards. The interlayer connecting conductor v2 penetrates the insulator layers 14a to 14e along the vertical axis. The upper end of the interlayer connecting conductor v2 is connected to the right of the intersection of the diagonals of the first radiating conductor layer 20. Hereafter, the point where the interlayer connecting conductor v2 is connected to the first radiating conductor layer 20 will be referred to as the second feed point P2. Thus, the first radiating conductor layer 20 is provided with a first feed point P1 and a second feed point P2. Furthermore, when viewed in the downward direction (negative Z-axis direction), the second power supply point P2 is not point-symmetric with respect to the centroid of the figure determined by the outer edge of the first radiating conductor layer 20. In this embodiment, the second power supply point P2 is point-symmetric with respect to the intersection of the diagonals of the first radiating conductor layer 20. Symmetry They are not in a direct relationship. The lower end of the interlayer connecting conductor v2 is connected to the left end of the second signal conductor layer 26.

[0024] The second high-frequency signal is transmitted through the second signal path R2. Therefore, the second high-frequency signal is supplied to the first radiating conductor layer 20 via the interlayer connecting conductor v2. The interlayer connecting conductor v2 is connected to the right of the intersection of the diagonals of the first radiating conductor layer 20. The second high-frequency signal resonates in the first radiating conductor layer 20 such that current flows in the direction along the left-right axis. Therefore, the direction of vibration of the electromagnetic field due to the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field due to the first high-frequency signal propagating through the air. In this embodiment, the direction of vibration of the electromagnetic field due to the second high-frequency signal propagating through the air is perpendicular to the direction of vibration of the electromagnetic field due to the first high-frequency signal propagating through the air.

[0025] The third signal path R3 is connected to the second radiating conductor layer 21. The third signal path R3 includes the third signal conductor layer 28 and the interlayer connecting conductor v3. The third signal conductor layer 28 is located on the upper main surface of the insulator layer 14f. When viewed downwards, the third signal conductor layer 28 has a linear shape extending along the left-right axis. The left end of the third signal conductor layer 28 overlaps with the second radiating conductor layer 21 when viewed downwards. The interlayer connecting conductor v3 penetrates the insulator layers 14a to 14e along the vertical axis. The upper end of the interlayer connecting conductor v3 is connected to the left of the intersection of the diagonals of the second radiating conductor layer 21. Hereafter, the point where the interlayer connecting conductor v3 is connected to the second radiating conductor layer 21 will be referred to as the third power supply point P3. The lower end of the interlayer connecting conductor v3 is connected to the left end of the third signal conductor layer 28.

[0026] The third high-frequency signal is transmitted through the third signal path R3. Therefore, the third high-frequency signal is supplied to the second radiating conductor layer 21 via the interlayer junction conductor v3. The interlayer junction conductor v3 is connected to the left of the intersection of the diagonals of the second radiating conductor layer 21. Therefore, the third high-frequency signal resonates in the second radiating conductor layer 21 such that current flows in the direction along the left-right axis.

[0027] The fourth signal path R4 is connected to the second radiating conductor layer 21. The fourth signal path R4 includes the fourth signal conductor layer 30 and the interlayer connecting conductor v4. The fourth signal conductor layer 30 is located on the upper main surface of the insulator layer 14f. When viewed downwards, the fourth signal conductor layer 30 has a linear shape extending along the left-right axis. The left end of the fourth signal conductor layer 30 overlaps with the second radiating conductor layer 21 when viewed downwards. The interlayer connecting conductor v4 penetrates the insulator layers 14a to 14e along the up-down axis. The upper end of the interlayer connecting conductor v4 is connected in front of the intersection of the diagonals of the second radiating conductor layer 21. Hereafter, the point where the interlayer connecting conductor v4 is connected to the second radiating conductor layer 21 will be referred to as the fourth feed point P4. The fourth feed point P4 is point-symmetric to the third feed point P3 with respect to the intersection of the diagonals of the second radiating conductor layer 21. The lower end of the interlayer connecting conductor v4 is connected to the left end of the fourth signal conductor layer 30.

[0028] The fourth high-frequency signal is transmitted through the fourth signal path R4. Therefore, the fourth high-frequency signal is supplied to the second radiating conductor layer 21 via the interlayer connecting conductor v4. The interlayer connecting conductor v4 is connected in front of the diagonal intersection of the second radiating conductor layer 21. The fourth high-frequency signal resonates in the second radiating conductor layer 21 such that current flows in the direction along the front-to-back axis. Therefore, the direction of vibration of the electromagnetic field due to the fourth high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field due to the third high-frequency signal propagating through the air. In this embodiment, the direction of vibration of the electromagnetic field due to the fourth high-frequency signal propagating through the air is perpendicular to the direction of vibration of the electromagnetic field due to the third high-frequency signal propagating through the air.

[0029] The first ground conductor layer 16 is provided in the laminate 12. In this embodiment, the first ground conductor layer 16 is located on the upper main surface of the insulator layer 14e. As a result, the first ground conductor layer 16 is located below the second radiating conductor layer 21 (on the negative side of the Z-axis). The first ground conductor layer 16 is located above the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0030] The first ground conductor layer 16 covers almost the entire upper main surface of the insulator layer 14e. As a result, the first ground conductor layer 16 overlaps with the first radiating conductor layer 20 and the second radiating conductor layer 21 when viewed in the downward direction (negative direction of the Z axis). Therefore, the first radiating conductor layer 20, the second radiating conductor layer 21, and the first ground conductor layer 16 function as a patch antenna. Furthermore, the first ground conductor layer 16 overlaps with the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30 when viewed in the downward direction.

[0031] The second ground conductor layer 18 is provided in the laminate 12. In this embodiment, the second ground conductor layer 18 is located on the upper main surface of the insulator layer 14g. As a result, the second ground conductor layer 18 is located below the first ground conductor layer 16 (on the negative side of the Z-axis). The second ground conductor layer 18 is located below the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0032] The second ground conductor layer 18 covers almost the entire upper main surface of the insulator layer 14g. As a result, the second ground conductor layer 18 overlaps with the first ground conductor layer 16 when viewed in the downward direction (negative Z-axis direction). Also, the second ground conductor layer 18 overlaps with the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30 when viewed in the downward direction (negative Z-axis direction). The first ground conductor layer 16 and the second ground conductor layer 18 are connected to the ground potential. As a result, the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, the fourth signal conductor layer 30, the first ground conductor layer 16, and the second ground conductor layer 18 have a stripline structure.

[0033] The first connecting conductor 22 is provided in the laminate 12. In this embodiment, the first connecting conductor 22 is a conductor layer located on the upper main surface of the insulator layer 14d. Therefore, the first connecting conductor 22 is located below the second radiating conductor layer 21 (negative side of the Z-axis) and above the first ground conductor layer 16 (positive side of the Z-axis). Furthermore, the distance from the first connecting conductor 22 to the first ground conductor layer 16 along the vertical axis (Z-axis) is shorter than the distance from the first connecting conductor 22 to the second radiating conductor layer 21 along the vertical axis (Z-axis). Also, when viewed from below, the first connecting conductor 22 overlaps with the second radiating conductor layer 21.

[0034] Such a first connecting conductor 22 is connected to a first signal path R1 and a second signal path R2. In this embodiment, the first connecting conductor 22 has a linear shape with a first end t1 and a second end t2 when viewed downwards. The first end t1 of the first connecting conductor 22 is connected to the interlayer connecting conductor v1. The second end t2 of the first connecting conductor 22 is connected to the interlayer connecting conductor v2.

[0035] The multilayer substrate 10 is designed to satisfy the following conditions: The phase difference between the first high-frequency signal input to the interlayer conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer conductor v2 via the first connecting conductor 22 is an odd multiple of 180°. Within the operating band, it is sufficient that the phase state is such that the first high-frequency signal input to the interlayer conductor v2 without going through the first connecting conductor 22 is attenuated by the first high-frequency signal input to the interlayer conductor v2 via the first connecting conductor 22. Furthermore, the phase difference between the second high-frequency signal input to the interlayer conductor v1 in the first radiating conductor layer 20 and the second high-frequency signal input to the interlayer conductor v1 via the first connecting conductor 22 is an odd multiple of 180°. Within the operating band, it is sufficient that the phase state is such that the second high-frequency signal input to the interlayer conductor v1 without going through the first connecting conductor 22 is attenuated by the second high-frequency signal input to the interlayer conductor v1 via the first connecting conductor 22.

[0036] The first ground conductor layer 16, the second ground conductor layer 18, the first radiating conductor layer 20, the second radiating conductor layer 21, the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30 are formed, for example, by patterning a metal foil attached to the upper main surface of the insulating layers 14a to 14g. The metal is, for example, copper. The interlayer connecting conductors v1 to v4 are, for example, via-hole conductors. The via-hole conductors are formed by creating through-holes in the insulating layers 14a to 14e, filling the through-holes with conductive paste, and sintering the conductive paste.

[0037] Next, an example of the use of the multilayer substrate 10 will be described. As shown in Figure 1, the multilayer substrate 10 has a first section A1 and a second section A2. The first section A1 includes a first radiating conductor layer 20 and a second radiating conductor layer 21. The second section A2 does not include the first radiating conductor layer 20 and the second radiating conductor layer 21. The upper and lower thicknesses of the first section A1 are greater than the upper and lower thicknesses of the second section A2. Therefore, the second section A2 is more easily bent upwards or downwards than the first section A1.

[0038] Therefore, in the multilayer substrate 10, the second section A2 is bent as shown in Figure 2. A connector 100 is mounted at the end of the second section A2. The connector 100 is connected to a connector provided on a circuit board (not shown). The multilayer substrate 10 may be connected to other circuit boards without going through the connector 100.

[0039] [effect] The multilayer substrate 10 can improve the isolation between the first high-frequency signal and the second high-frequency signal. More specifically, at the first feeding point P1 and the second feeding point P2 of the first connecting conductor 22, when the first high-frequency signal penetrates the interlayer connecting conductor v2 from the first feeding point P1 through the second feeding point P2, the first high-frequency signal becomes noise.

[0040] Therefore, the first connecting conductor 22 is connected to the first signal path R1 and the second signal path R2. A phase difference is generated between the first high-frequency signal input to the interlayer connecting conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer connecting conductor v2 via the first connecting conductor 22. As a result, the first high-frequency signal input to the interlayer connecting conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer connecting conductor v2 via the first connecting conductor 22 cancel each other out. Consequently, the first high-frequency signal is suppressed from becoming noise. For the same reason, the second high-frequency signal is suppressed from becoming noise.

[0041] Here, the first connecting conductor 22 is designed to suppress the noise caused by the first high-frequency signal entering the interlayer connecting conductor v2 from the second feed point P2. Similarly, the first connecting conductor 22 is designed to suppress the noise caused by the second high-frequency signal entering the interlayer connecting conductor v1 from the first feed point P1. Specifically, the phase difference between the first high-frequency signal input to the interlayer connecting conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer connecting conductor v2 via the first connecting conductor 22 is an odd multiple of 180°. Within the operating bandwidth, it is sufficient that the phase state is such that the first high-frequency signal input to the interlayer connecting conductor v2 without going through the first connecting conductor 22 is attenuated by the first high-frequency signal input to the interlayer connecting conductor v2 via the first connecting conductor 22. Furthermore, the phase difference between the second high-frequency signal input to the interlayer connecting conductor v1 in the first radiating conductor layer 20 and the second high-frequency signal input to the interlayer connecting conductor v1 via the first connecting conductor 22 is an odd multiple of 180°. It is sufficient that within the operating bandwidth, the second high-frequency signal input to the interlayer connecting conductor v1 without going through the first connecting conductor 22 is attenuated by the second high-frequency signal input to the interlayer connecting conductor v1 via the first connecting conductor 22.

[0042] In the multilayer substrate 10, the first connecting conductor 22 is located below the second radiating conductor layer 21 (on the negative side of the Z-axis). As a result, the second radiating conductor layer 21 is located between the first radiating conductor layer 20 and the first connecting conductor 22. Therefore, the electromagnetic field generated from the first radiating conductor layer 20 reaching the first connecting conductor 22 and becoming noise is suppressed.

[0043] In the multilayer substrate 10, the first ground conductor layer 16 is located between the first connecting conductor 22 and the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30. This suppresses noise from entering the first connecting conductor 22 and the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0044] (First variation) Next, the multilayer substrate 10a according to the first modified example will be described with reference to the drawings. Figure 3 is an exploded perspective view of the multilayer substrate 10a.

[0045] The multilayer substrate 10a differs from the multilayer substrate 10 in the following respects. The first connecting conductor 22 is located below the first ground conductor layer 16 (negative side of the Z-axis) and above the second ground conductor layer 18 (positive side of the Z-axis). The multilayer substrate 10a further comprises a second connecting conductor 23. The first signal path R1 is provided with a first branch conductor layer 40. • The second signal path R2 is provided with a second branch conductor layer 42. • The third signal path R3 is provided with a third branch conductor layer 44. • The fourth signal path R4 is provided with a fourth branch conductor layer 46.

[0046] The first connecting conductor 22 is located below the first ground conductor layer 16 (negative side of the Z-axis) and above the second ground conductor layer 18 (positive side of the Z-axis). In this embodiment, the first connecting conductor 22 is a conductor layer located on the upper main surface of the insulator layer 14f. The first connecting conductor 22 is connected to the first signal conductor layer 24 and the second signal conductor layer 26.

[0047] The second connecting conductor 23 is provided in the laminate 12. The second connecting conductor 23 is located below the first ground conductor layer 16 (negative side of the Z-axis) and above the second ground conductor layer 18. In this embodiment, the second connecting conductor 23 is a conductor layer located on the upper main surface of the insulator layer 14f. The second connecting conductor 23 is connected to the third signal path R3 and the fourth signal path R4. In this embodiment, the second connecting conductor 23 is connected to the third signal conductor layer 28 and the fourth signal conductor layer 30.

[0048] A first branch conductor layer 40 is provided in the first signal path R1. In this embodiment, the first branch conductor layer 40 is connected to the first signal conductor layer 24. The first branch conductor layer 40 traps the third high-frequency signal and the fourth high-frequency signal. The first branch conductor layer 40 is, for example, an open stub. Therefore, the length of the first branch conductor layer 40 is, for example, 1 / 4 times the wavelength within the resonant frequency band of the second radiating conductor layer 21.

[0049] A second branch conductor layer 42 is provided in the second signal path R2. In this embodiment, the second branch conductor layer 42 is connected to the second signal conductor layer 26. The second branch conductor layer 42 traps the third high-frequency signal and the fourth high-frequency signal. The second branch conductor layer 42 is, for example, an open stub. Therefore, the length of the second branch conductor layer 42 is, for example, 1 / 4 the wavelength within the resonant frequency band of the second radiating conductor layer 21.

[0050] A third branch conductor layer 44 is provided in the third signal path R3. In this embodiment, the third branch conductor layer 44 is connected to the third signal conductor layer 28. The third branch conductor layer 44 traps the first high-frequency signal and the second high-frequency signal. The third branch conductor layer 44 is, for example, an open stub. Therefore, the length of the third branch conductor layer 44 is, for example, 1 / 4 times the wavelength of the resonant frequency band of the first radiating conductor layer 20.

[0051] A fourth branch conductor layer 46 is provided in the fourth signal path R4. In this embodiment, the fourth branch conductor layer 46 is connected to the fourth signal conductor layer 30. The fourth branch conductor layer 46 traps the first high-frequency signal and the second high-frequency signal. The fourth branch conductor layer 46 is, for example, an open stub. Therefore, the length of the fourth branch conductor layer 46 is, for example, 1 / 4 times the wavelength within the resonant frequency band of the first radiating conductor layer 20. The other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, so their description is omitted. The multilayer substrate 10a can achieve the same effects as the multilayer substrate 10.

[0052] With the multilayer substrate 10a, the isolation between the third high-frequency signal and the fourth high-frequency signal can be improved for the same reason that the isolation between the first high-frequency signal and the second high-frequency signal can be improved by providing the first connecting conductor 22. The second connecting conductor 23 is designed to suppress the noise caused by the third high-frequency signal entering the interlayer connecting conductor v4 from the fourth power supply point P4. Similarly, the second connecting conductor 23 is designed to suppress the noise caused by the fourth high-frequency signal entering the interlayer connecting conductor v3 from the third power supply point P3. The design method for the second connecting conductor 23 is the same as that for the first connecting conductor 22, so a detailed explanation is omitted.

[0053] In the multilayer substrate 10a, the first connecting conductor 22 is located below the first ground conductor layer 16 (on the negative side of the Z-axis). As a result, the first ground conductor layer 16 is located between the first radiating conductor layer 20 and the second radiating conductor layer 21 and the first connecting conductor 22. Therefore, electromagnetic fields generated from the first radiating conductor layer 20 and the second radiating conductor layer 21 reaching the first connecting conductor 22 and becoming noise are suppressed.

[0054] In the multilayer substrate 10a, the second connecting conductor 23 is located below the first ground conductor layer 16 (on the negative side of the Z-axis). As a result, the first ground conductor layer 16 is located between the first radiating conductor layer 20 and the second radiating conductor layer 21 and the second connecting conductor 23. Therefore, electromagnetic fields generated from the first radiating conductor layer 20 and the second radiating conductor layer 21 reaching the second connecting conductor 23 and becoming noise are suppressed.

[0055] In the multilayer substrate 10a, a first branch conductor layer 40 is provided in the first signal path R1. The first branch conductor layer 40 traps the third high-frequency signal and the fourth high-frequency signal. As a result, even if the third high-frequency signal and the fourth high-frequency signal radiated by the second radiating conductor layer 21 enter the first signal path R1, they are trapped by the first branch conductor layer 40. Consequently, the third high-frequency signal and the fourth high-frequency signal are suppressed from becoming noise in the first signal path R1.

[0056] In the multilayer substrate 10a, a second branch conductor layer 42 is provided in the second signal path R2. The second branch conductor layer 42 traps the third high-frequency signal and the fourth high-frequency signal. As a result, even if the third high-frequency signal and the fourth high-frequency signal radiated by the second radiating conductor layer 21 enter the second signal path R2, they are trapped by the second branch conductor layer 42. Consequently, the third high-frequency signal and the fourth high-frequency signal are suppressed from becoming noise in the second signal path R2.

[0057] In the multilayer substrate 10a, a third branch conductor layer 44 is provided in the third signal path R3. The third branch conductor layer 44 traps the first high-frequency signal and the second high-frequency signal. As a result, even if the first high-frequency signal and the second high-frequency signal radiated by the first radiating conductor layer 20 enter the third signal path R3, they are trapped by the third branch conductor layer 44. Consequently, the first high-frequency signal and the second high-frequency signal are suppressed from becoming noise in the third signal path R3.

[0058] In the multilayer substrate 10a, a fourth branch conductor layer 46 is provided in the fourth signal path R4. The fourth branch conductor layer 46 traps the first high-frequency signal and the second high-frequency signal. As a result, even if the first high-frequency signal and the second high-frequency signal radiated by the first radiating conductor layer 20 enter the fourth signal path R4, they are trapped by the fourth branch conductor layer 46. Consequently, the first high-frequency signal and the second high-frequency signal are suppressed from becoming noise in the fourth signal path R4.

[0059] (Second variation) Next, the multilayer substrate 10b relating to the second modified example will be described with reference to the drawings. Figure 4 is an exploded perspective view of the multilayer substrate 10b.

[0060] The multilayer substrate 10b differs from the multilayer substrate 10 in the following respects. The first ground conductor layer 16 is located on the lower main surface of the insulator layer 14e. The multilayer substrate 10b is equipped with external electrodes 124, 126, 128, and 130 instead of the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30. • Electronic components 200 are mounted on the lower main surface of the laminate 12 of the multilayer substrate 10b.

[0061] The external electrodes 124, 126, 128, and 130 are located on the lower main surface of the insulator layer 14e. The lower ends of each of the interlayer connecting conductors v1 to v4 are connected to the external electrodes 124, 126, 128, and 130, respectively.

[0062] The electronic component 200 is, for example, a semiconductor integrated circuit. The electronic component 200 is mounted on the external electrodes 124, 126, 128, and 130 by solder. The other structures of the multilayer substrate 10b are the same as those of the multilayer substrate 10, so a description is omitted. The multilayer substrate 10b can achieve the same effects as the multilayer substrate 10.

[0063] (Other embodiments) The multilayer substrate according to the present invention is not limited to multilayer substrates 10, 10a, and 10b, but can be modified within the scope of its gist. The configurations of multilayer substrates 10, 10a, and 10b may be arbitrarily combined.

[0064] The first radiating conductor layer 20 may receive the first high-frequency signal and the second high-frequency signal. The second radiating conductor layer 21 may receive the third high-frequency signal and the fourth high-frequency signal.

[0065] In the multilayer substrate 10a, the first branch conductor layer 40, the second branch conductor layer 42, the third branch conductor layer 44, and the fourth branch conductor layer 46 are not essential components. The multilayer substrate 10a may include one, two, or three of the first branch conductor layer 40, the second branch conductor layer 42, the third branch conductor layer 44, and the fourth branch conductor layer 46.

[0066] Note that the second connecting conductor 23 is not a mandatory component.

[0067] The first branch conductor layer 40, the second branch conductor layer 42, the third branch conductor layer 44, and the fourth branch conductor layer 46 may also be short branch conductor layers.

[0068] Furthermore, the first branch conductor layer 40, the second branch conductor layer 42, the third branch conductor layer 44, and the fourth branch conductor layer 46 may be provided for impedance matching purposes rather than for the purpose of trapping high-frequency signals.

[0069] Note that the first connecting conductor 22 and the second connecting conductor 23 are not limited to conductor layers. Therefore, the first connecting conductor 22 and the second connecting conductor 23 may be interlayer connecting conductors.

[0070] The multilayer substrate 10a comprises one laminate 12. However, the multilayer substrate 10a may comprise multiple laminates. Specifically, the multilayer substrate 10a in Figure 3 may comprise a first laminate and a second laminate. In this case, the first laminate includes insulating layers 14a to 14d. The material of the insulating layers 14a to 14d is, for example, ceramic. The second laminate includes insulating layers 14e to 14g. The material of the insulating layers 14e to 14g is thermoplastic resin.

[0071] The antenna component comprises insulating layers 14a to 14d, a first radiating conductor layer 20, and a second radiating conductor layer 21. The wiring board comprises insulating layers 14e to 14g, a first ground conductor layer 16, a second ground conductor layer 18, a first signal conductor layer 24, a second signal conductor layer 26, a third signal conductor layer 28, a fourth signal conductor layer 30, and parts of interlayer connecting conductors v1 to v4. The antenna component is mounted on the first laminate by solder. At this time, the antenna component is located above the first laminate (on the positive side of the Z axis).

[0072] A portion of the interlayer connecting conductor v1 and the first signal conductor layer 24 constitute the first signal path. The first signal path is electrically connected to the first radiating conductor layer 20. A portion of the interlayer connecting conductor v2 and the second signal conductor layer 26 constitute the second signal path. The second signal path is electrically connected to the first radiating conductor layer 20. A portion of the interlayer connecting conductor v3 and the third signal conductor layer 28 constitute the third signal path. The third signal path is electrically connected to the second radiating conductor layer 21. A portion of the interlayer connecting conductor v4 and the fourth signal conductor layer 30 constitute the fourth signal path. The fourth signal path is electrically connected to the second radiating conductor layer 21.

[0073] The multilayer substrate 10 comprises one laminate 12. However, the multilayer substrate 10 may also comprise a first laminate and a second laminate, similar to the multilayer substrate 10a. That is, the first radiating conductor layer 20 may be provided in the first laminate. The first connecting conductor 22 may be provided in the second laminate. The second laminate is mounted on the first laminate by solder. Therefore, if the first connecting conductor 22 is provided in the first laminate, variations in the length of the current path from the first radiating conductor layer 20 to the first connecting conductor 22 are likely to occur. For this reason, the first connecting conductor 22 is provided in the second laminate. This suppresses variations in the length of the current path from the first radiating conductor layer 20 to the first connecting conductor 22.

[0074] The multilayer substrate 10 does not necessarily have to include a portion below the insulating layer 14d. In this case, the materials of the insulating layers 14a to 14d may be ceramic.

[0075] The present invention has the following structure.

[0076] (1) A multilayer substrate comprises a laminate, a first radiating conductor layer, a second radiating conductor layer, a first signal path, a second signal path, and a first connecting conductor. The laminate has a structure in which multiple insulating layers are stacked along the Z-axis. The first radiating conductor layer is provided in the laminate and receives or radiates a first high-frequency signal and also receives or radiates a second high-frequency signal. The direction of vibration of the electromagnetic field caused by the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the first high-frequency signal propagating through the air. The second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative Z-axis direction. The first signal path and the second signal path are connected to the first radiating conductor layer. The first high-frequency signal is transmitted through the first signal path, The second high-frequency signal is transmitted through the second signal path. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and located on the negative side of the Z-axis from the second radiating conductor layer. Multilayer board.

[0077] (2) The multilayer substrate further comprises a first ground conductor layer, The first ground conductor layer is provided in the laminate and is located on the negative side of the Z-axis compared to the second radiating conductor layer, and overlaps with the first radiating conductor layer and the second radiating conductor layer when viewed in the negative Z-axis direction. (1) The multilayer substrate described above.

[0078] (3) The first connecting conductor is located on the negative side of the Z-axis relative to the second radiating conductor layer, and on the positive side of the Z-axis relative to the first ground conductor layer. (2) The multilayer substrate described above.

[0079] (4) The distance in the Z-axis from the first connecting conductor to the first ground conductor layer is shorter than the distance in the Z-axis from the first connecting conductor to the second radiating conductor layer. (3) The multilayer substrate described above.

[0080] (5) The aforementioned multilayer substrate further comprises a second ground conductor layer, The second ground conductor layer is provided in the laminate and is located on the negative side of the Z-axis compared to the first ground conductor layer, and overlaps with the first ground conductor layer when viewed in the negative Z-axis direction. The first connecting conductor is located on the negative side of the Z-axis relative to the first ground conductor layer, and on the positive side of the Z-axis relative to the second ground conductor layer. (2) The multilayer substrate described above.

[0081] (6) The multilayer substrate further comprises a third signal path and a fourth signal path. The second radiating conductor layer receives or emits a third high-frequency signal and also receives or emits a fourth high-frequency signal. The direction of vibration of the electromagnetic field caused by the fourth high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the third high-frequency signal propagating through the air. The third signal path and the fourth signal path are connected to the second radiating conductor layer, The third high-frequency signal is transmitted through the third signal path, The fourth high-frequency signal is transmitted through the fourth signal path. A multilayer substrate as described in any of (1) to (5).

[0082] (7) The aforementioned multilayer substrate further comprises a second connecting conductor, The second connecting conductor is provided in the laminate and is connected to the third signal path and the fourth signal path. (6) The multilayer substrate described above.

[0083] (8) The multilayer substrate further comprises a first ground conductor layer, The first ground conductor layer is provided in the laminate and is located on the negative side of the Z-axis compared to the second radiating conductor layer, and overlaps with the first radiating conductor layer and the second radiating conductor layer when viewed in the negative Z-axis direction. The second connecting conductor is located on the negative side of the Z-axis relative to the first ground conductor layer. (7) The multilayer substrate described above.

[0084] (9) The resonant frequency of the second radiating conductor layer is lower than the resonant frequency of the first radiating conductor layer. A multilayer substrate as described in any of (6) to (8).

[0085] (10) The difference between the resonant frequency bandwidth of the first radiating conductor layer and the resonant frequency bandwidth of the second radiating conductor layer is 10% or more of the frequencies of the first high-frequency signal and the second high-frequency signal. (9) The multilayer substrate described above.

[0086] (11) The first signal path is provided with a first branch conductor layer, The second signal path is provided with a second branch conductor layer. A multilayer substrate as described in any of (6) to (10).

[0087] (12) The third signal path is provided with a third branch conductor layer, The fourth signal path is provided with a fourth branch conductor layer. A multilayer substrate as described in any of (6) to (11).

[0088] (13) A multilayer substrate comprises a laminate, a first radiating conductor layer, a second radiating conductor layer, a first signal path, a second signal path, and a first connecting conductor. The laminate has a structure in which multiple insulating layers are stacked along the Z-axis. The first radiating conductor layer is provided in the laminate, The first radiating conductor layer is provided with a first feeding point and a second feeding point. Viewed in the negative direction of the Z-axis, the second power supply point is not point-symmetric to the first power supply point with respect to the centroid of the figure determined by the outer edge of the first radiating conductor layer. The second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative Z-axis direction. The first signal path and the second signal path are connected to the first radiating conductor layer. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and located on the negative side of the Z-axis from the second radiating conductor layer. Multilayer board.

[0089] (14) The wiring board comprises a first laminate, a first signal path section, a second signal path section, and a first connecting conductor. Antenna components are mounted on the first laminate, The antenna component is located on the positive side of the Z-axis relative to the first laminate. The aforementioned antenna component comprises a second laminate, a first radiating conductor layer, and a second radiating conductor layer. The first laminate has a structure in which a plurality of insulating layers are stacked along the Z axis, The second laminate has a structure in which multiple insulating layers are stacked along the Z-axis, The first radiating conductor layer is provided in the second laminate and receives or radiates a first high-frequency signal and also receives or radiates a second high-frequency signal. The direction of vibration of the electromagnetic field caused by the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the first high-frequency signal propagating through the air. The second radiating conductor layer is provided in the second laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative Z-axis direction. The first signal path and the second signal path are provided in the first laminate and are electrically connected to the first radiating conductor layer. The first high-frequency signal is transmitted through the first signal path, The second high-frequency signal is transmitted through the second signal path. The first connecting conductor is provided in the second laminate, connected to the first signal path and the second signal path, and located on the negative side of the Z-axis from the second radiating conductor layer. Wiring board. [Explanation of symbols]

[0090] 10,10a,10b: Multilayer board 12: Laminate 14a~14g: Insulating layer 16: First ground conductor layer 18: Second ground conductor layer 20: First radiating conductor layer 21: Second radiating conductor layer 22: First connecting conductor 23: Second connecting conductor 24: First signal conductor layer 26: Second signal conductor layer 28: Third signal conductor layer 30: Fourth signal conductor layer 40: First branch conductor layer 42: Second branch conductor layer 44: Third branch conductor layer 46: Fourth branch conductor layer 100: Connector 124,126,128,130: External electrode 200: Electronic components A1: Section 1 A2: Section 2 P1: First power supply point P2: Second power supply point P3: Third power supply point P4: Fourth power supply point R1: First signal path R2: Second signal path R3: Third signal path R4: Fourth signal path t1: First end t2: 2nd end v1~v4: Interlayer connecting conductors

Claims

1. A multilayer substrate comprises a laminate, a first radiating conductor layer, a second radiating conductor layer, a first signal path, a second signal path, and a first connecting conductor. The laminate has a structure in which multiple insulating layers are stacked along the Z-axis. The first radiating conductor layer is provided in the laminate and receives or radiates a first high-frequency signal and also receives or radiates a second high-frequency signal. The direction of vibration of the electromagnetic field caused by the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the first high-frequency signal propagating through the air. The second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z-axis. The first signal path and the second signal path are connected to the first radiating conductor layer. The first high-frequency signal is transmitted through the first signal path, The second high-frequency signal is transmitted through the second signal path. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and located on the negative side of the Z-axis relative to the second radiating conductor layer. Multilayer board.

2. The multilayer substrate further comprises a first ground conductor layer, The first ground conductor layer is provided in the laminate and is located on the negative side of the Z-axis compared to the second radiating conductor layer, and overlaps with the first radiating conductor layer and the second radiating conductor layer when viewed in the negative direction of the Z-axis. The multilayer substrate according to claim 1.

3. The first connecting conductor is located on the negative side of the Z-axis relative to the second radiating conductor layer, and on the positive side of the Z-axis relative to the first ground conductor layer. The multilayer substrate according to claim 2.

4. The distance in the Z-axis from the first connecting conductor to the first ground conductor layer is shorter than the distance in the Z-axis from the first connecting conductor to the second radiating conductor layer. The multilayer substrate according to claim 3.

5. The multilayer substrate further comprises a second ground conductor layer. The second ground conductor layer is provided in the laminate and is located on the negative side of the Z-axis compared to the first ground conductor layer, and overlaps with the first ground conductor layer when viewed in the negative direction of the Z-axis. The first connecting conductor is located on the negative side of the Z-axis relative to the first ground conductor layer, and on the positive side of the Z-axis relative to the second ground conductor layer. The multilayer substrate according to claim 2.

6. The multilayer substrate further comprises a third signal path and a fourth signal path. The second radiating conductor layer receives or emits a third high-frequency signal and also receives or emits a fourth high-frequency signal. The direction of vibration of the electromagnetic field caused by the fourth high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the third high-frequency signal propagating through the air. The third signal path and the fourth signal path are connected to the second radiating conductor layer. The third high-frequency signal is transmitted through the third signal path, The fourth high-frequency signal is transmitted through the fourth signal path. A multilayer substrate according to any one of claims 1 to 5.

7. The aforementioned multilayer substrate further comprises a second connecting conductor, The second connecting conductor is provided in the laminate and is connected to the third signal path and the fourth signal path. The multilayer substrate according to claim 6.

8. The multilayer substrate further comprises a second connecting conductor and a first ground conductor layer. The first ground conductor layer is provided in the laminate and is located on the negative side of the Z-axis relative to the second radiating conductor layer, and overlaps with the first radiating conductor layer and the second radiating conductor layer when viewed in the negative direction of the Z-axis. The second connecting conductor is located on the negative side of the Z-axis relative to the first ground conductor layer. The multilayer substrate according to claim 1.

9. The resonant frequency of the second radiating conductor layer is lower than the resonant frequency of the first radiating conductor layer. A multilayer substrate according to any one of claims 1 to 5 and claim 8.

10. The difference between the resonant frequency bandwidth of the first radiating conductor layer and the resonant frequency bandwidth of the second radiating conductor layer is 10% or more of the frequencies of the first high-frequency signal and the second high-frequency signal. The multilayer substrate according to claim 9.

11. The first signal path is provided with a first branch conductor layer, The second signal path is provided with a second branch conductor layer. The multilayer substrate according to claim 6.

12. The third signal path is provided with a third branch conductor layer. The fourth signal path is provided with a fourth branch conductor layer. The multilayer substrate according to claim 6.

13. A multilayer substrate comprises a laminate, a first radiating conductor layer, a second radiating conductor layer, a first signal path, a second signal path, and a first connecting conductor. The laminate has a structure in which multiple insulating layers are stacked along the Z-axis. The first radiating conductor layer is provided in the laminate, The first radiating conductor layer is provided with a first feeding point and a second feeding point. Viewed in the negative direction of the Z-axis, the second power supply point is not point-symmetric with the first power supply point with respect to the centroid of the figure determined by the outer edge of the first radiating conductor layer. The second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z-axis. The first signal path and the second signal path are connected to the first radiating conductor layer. The first connecting conductor is provided in the laminate and is connected to the first signal path and the second signal path at only one point each, and is located on the negative side of the Z-axis relative to the second radiating conductor layer. Multilayer board.

14. The wiring board comprises a first laminate, a first signal path section, a second signal path section, and a first connecting conductor. Antenna components are mounted on the first laminate. The antenna component is located on the positive side of the Z-axis relative to the first laminate. The aforementioned antenna component comprises a second laminate, a first radiating conductor layer, and a second radiating conductor layer. The first laminate has a structure in which a plurality of insulating layers are stacked along the Z-axis, The second laminate has a structure in which a plurality of insulating layers are stacked along the Z-axis, The first radiating conductor layer is provided on the second laminate and receives or radiates a first high-frequency signal and also receives or radiates a second high-frequency signal. The direction of vibration of the electromagnetic field caused by the second high-frequency signal propagating through the air is different from the direction of vibration of the electromagnetic field caused by the first high-frequency signal propagating through the air. The second radiating conductor layer is provided on the second laminate, is located on the negative side of the Z-axis compared to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z-axis. The first signal path and the second signal path are provided in the first laminate, and the first signal path is electrically connected to the first radiating conductor layer by a signal path provided in the second laminate, and the second signal path is electrically connected to the first radiating conductor layer by another signal path provided in the second laminate. The first high-frequency signal is transmitted through the first signal path, The second high-frequency signal is transmitted through the second signal path. The first connecting conductor is provided in the second laminate and is connected to a signal path portion provided in the second laminate and another signal path portion provided in the second laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer. Wiring board.

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