Wafer processing tools and methods
The wafer processing apparatus with a rotatable blade and movable load cup system addresses transfer delays in CMP systems, enabling faster processing and parallel operations, thereby improving system efficiency.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2024-12-19
- Publication Date
- 2026-05-27
AI Technical Summary
Delays occur in wafer processing due to the transfer of wafers between different processing stations, causing inefficiencies in systems like chemical mechanical polishing (CMP) as robots wait to access wafers before and after various processes.
A wafer processing apparatus with a wafer exchanger featuring rotatable blades and a vertically movable load cup, allowing for efficient transfer and processing of wafers without vertical movement of the changer, enabling simultaneous rinsing of blades and heads, and parallel processing of wafers.
Reduces wafer processing time by allowing robots to operate more efficiently, facilitating faster cycle times and parallel processing, thus enhancing overall system throughput.
Smart Images
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Abstract
Description
Technical Field
[0001]
[0001] This application relates to wafer processing, more specifically, wafer processing tools and methods thereof.
Background Art
[0002]
[0002] In wafer processing tools such as chemical mechanical polishing (CMP) systems, delays can occur due to the transfer of wafers between different processing stations. For example, the processing can be delayed because a robot waits to access the wafer before and / or after various processes.
Summary of the Invention
[0003]
[0003] In a first aspect, a wafer processing apparatus is provided. The wafer processing apparatus includes a wafer exchanger including two or more blades, each of the two or more blades being configured to receive a wafer, the two or more blades being rotatable about an axis on a single horizontal plane, and the two or more blades may include a wafer exchanger movable at least between a load cup and a robot access position. The load cup is a wafer station vertically movable relative to the blade located in the load cup, and includes a wafer station configured to remove a wafer from and place a wafer on the blade located in the load cup.
[0004]
[0004] In a second aspect, a load cup is provided. The load cup is a wafer station configured to receive a wafer, the wafer station being vertically movable between a first position spaced apart from the wafer and a second position where the wafer is received by the wafer station, and a notch of the wafer station sized to receive a portion of a blade configured to support the wafer when the wafer station moves between the first position and the second position.
[0005]
[0005] In a third embodiment, a method for moving a substrate is provided. The method provides a wafer changer comprising two or more blades, each of which is configured to receive a wafer, the two or more blades being rotatable about an axis in a single horizontal plane, and the two or more blades being movable at least between a load cup and a robot access position, and may include: placing a first wafer on a blade of the wafer changer located at the robot access position; placing a second wafer on a blade of the wafer changer located from the head to the load cup; rotating the wafer changer to a position where the second wafer is located at the robot access position; removing the second wafer from the wafer changer; rotating the wafer changer to a position where the first wafer is located at the load cup; placing the first wafer on the head; and placing a third wafer on a blade of the wafer changer from the robot access position.
[0006]
[0006] Many other embodiments are provided according to these and other embodiments of the present disclosure. Other features and embodiments of the embodiments of the present disclosure will become more fully apparent from the following detailed description, the appended claims and the appended drawings.
[0007]
[0007] The drawings described below are for illustrative purposes only and are not necessarily drawn to a specific scale. The drawings are not intended to limit the scope of this disclosure in any way. Wherever possible, the same or similar reference numerals are used throughout the drawings to refer to the same or similar parts. [Brief explanation of the drawing]
[0008] [Figure 1] This is a top view showing a chemical mechanical polishing (CMP) system according to an embodiment disclosed herein. [Figure 2] This is an enlarged top view showing a wafer changer used in a CMP system according to an embodiment disclosed herein. [Figure 3]This is a top view showing a load cup and a blade of a wafer changer located within the load cup according to an embodiment disclosed herein. [Figure 4A] This figure shows the load cup in a storage position according to an embodiment disclosed herein. [Figure 4B] This figure shows the load cup in the extended position according to an embodiment disclosed herein. [Figure 5] Figures A to D show the operation of the wafer changer in combination with other components of the CMP system according to the embodiments described herein. [Figure 6] This is a top view showing a CMP system including one or more rinse stations according to an embodiment disclosed herein. [Figure 7] This is a top view showing a nebulizer that may be located in the rinse station of the CMP system of Figure 6 according to an embodiment disclosed herein. [Modes for carrying out the invention]
[0009]
[0016] In wafer processing systems such as chemical mechanical polishing (CMP) systems, delays can occur due to the transfer of wafers between different processing stations. For example, a robot may have to wait to gain access to a wafer before and / or after various processes, which can be time-consuming. The wafer processing systems disclosed herein, shown in Figures 1 to 7, reduce wafer processing time compared to conventional wafer processing systems.
[0010]
[0017] Refer to Figure 1, which shows a top view of a chemical mechanical polishing (CMP) system 100. While a CMP system is shown in Figure 1 and described herein, the concepts disclosed herein are applicable to other wafer processing equipment. The CMP system 100 may include a polishing section 102 and a cleaning and drying section 104 that process (e.g., clean and / or polish) a wafer 108 (as shown). The CMP system 100 may include other sections that perform other processes on the wafer. The wafers used herein may include articles used to manufacture electronic devices or circuit components. Wafers may also include semiconductor wafers, silicon-containing wafers, patterned or unpatterned wafers, glass plates, masks, etc. A pass-through 110 may be located between the polishing section 102 and the cleaning and drying section 104. The pass-through 110 may be an opening between the polishing section 102 and the cleaning and drying section 104 that accommodates the transfer of the wafer 108.
[0011]
[0018] The polishing section 102 may include one or more polishing stations 114. In the embodiment shown in Figure 1, the polishing section 102 includes four polishing stations 114, each individually referred to as polishing stations 114A to 114D. The polishing section 102 may include fewer or more polishing stations 114 than four. Each of the polishing stations 114 may include a polishing pad. The polishing pads are individually referred to as polishing pads 116A to 116D. The polishing pads 116A to 116D may be rotated relative to the surface of the wafer 108 to perform various polishing processes. One or more slurries (not shown) may be applied between the substrate and the polishing pads to process the substrate. For example, the slurry may remove a specific thickness or layer of the substrate. In some embodiments, the slurry may include corrosion inhibitors and other chemicals that can process the wafer 108.
[0012]
[0019] The polishing section 102 may include multiple heads that hold the wafer 108 against polishing pads 116A to 116D during polishing. For example, each of the polishing stations 114 may include a head. In the embodiment of Figure 1, the polishing station 114 includes four heads, each individually referred to as heads 120A to 120D, and each of the individual polishing stations 114 may include a single head or be associated with a single head.
[0013]
[0020] Heads 120A to 120D can hold wafers 108 in place when they are transported between polishing stations 114. For example, heads 120A to 120D can hold wafers 108 in place when they are transported between load cups 124 and polishing stations 114. The polishing section 102 shown in Figure 1 includes two load cups 124, respectively referred to as the first load cup 124A and the second load cup 124B. The load cups 124 can transport wafers 108 between heads 120A to 120D and wafer changer 130. In some embodiments, the polishing section 102 may include a single load cup or three or more load cups.
[0014]
[0021] The CMP system 100 shown in Figure 1 includes two wafer changers 130, respectively referred to as a first wafer changer 130A and a second wafer changer 130B. In some embodiments, the CMP system 100 may include one or more wafer changers 130. The first wafer changer 130A may rotate in a first direction 132A, and the second wafer changer 130B may rotate in a second direction 132B, which may be opposite to the first direction 132A. In some embodiments, the first wafer changer 130A and the second wafer changer 130B may rotate in the same direction.
[0015]
[0022] The cleaning and drying section 104 may include a robot 136, such as a wet robot, capable of transporting wafers 108 through the pass-through 110. For example, robot 136 may load and remove wafers 108 from a first wafer changer 130A and / or a second wafer changer 130B at a first robot access position 172A and a second robot access position 172B. Robot 136 may also transport wafers 108 between various stations (not shown) of the cleaning and drying section 104 and wafer changers 130. Robot 136 may access wafers 108 from wafer changers 130 at other robot access positions.
[0016]
[0023] Here, we refer to Figure 2, an enlarged top view showing the first wafer changer 130A. The first wafer changer 130A may be substantially similar to or identical to the second wafer changer 130B. The first wafer changer 130A may include a plurality of blades 234. For example, the first wafer changer 130A may include three or more blades 234. Fewer blades, such as two or more blades, may also be used. In the embodiments of Figures 1 and 2, the first wafer changer 130A includes three blades 234, which are individually referred to as the first blade 234A, the second blade 234B, and the third blade 234C. In Figure 2, the third blade 234C is partially obscured by the wafer 208 received on it. The blades 234 may be oriented to obtain uniform spacing between them. For example, the three blades 234 in Figure 2 may be oriented 120° apart with respect to the rotation point 236. The first wafer changer 130A may rotate around an axis (for example, a vertically extending axis) centered on the rotation point 236. Other embodiments of the first wafer changer 130A may include a different number of blades 234 that can be spaced apart at different angles.
[0017]
[0024] The blade 234 may be coupled to a support member 238 which may include a rotation point 236. The blades 234 may be substantially similar or identical to each other, but do not have to be. The following description refers to a first blade 234A which may represent all blades 234 in the wafer changer 130 (Figure 1). The first blade 234A may include an arm 240 which can be attached to the support member 238. As will be described in more detail below, the arm 240 may be sized to be received by a portion of the first load cup 124A (e.g., a notch 352A - Figure 3). The arm 240 may be connected to a first frame member 242A and a second frame member 242B, both of which may be connected to a third frame member 242C. In some embodiments, the frame members 242A-242C and the arm 240 may be formed integrally. The frame members 242A-242C may define the boundary of the opening 244 of the first blade 234A. As will be described in more detail below, the opening 244 may be sized and / or configured so that the nebulizer released from the nebulizer (e.g., nebulizer 356 - Figure 3) can pass through the opening 244. The blade 234 may have other configurations.
[0018]
[0025] Blade 234 may include a support 246 (several shown) that supports a substrate located on blade 234. Refer to a third blade 234C shown in the figure where wafer 208 is supported by the support 246. The support 246 may prevent the surface of wafer 208 from coming into contact with frame members 242A-242C of the third blade 234C, which could damage wafer 208.
[0019]
[0026] Refer to FIG. 3, which is a top view showing the first load cup 124A and the third blade 234C located therein. The first load cup 124A may be substantially similar or identical to the second load cup 124B (FIG. 1), but it is not necessary to be so. The first load cup 124A may include a wafer station 350 having an annular shape. In some embodiments, the wafer station 350 may have other shapes. The wafer station 350 can move vertically to place a wafer on the third blade 234C and remove the wafer from the third blade 234C. For example, the third blade 234C may remain fixed in the vertical direction when the wafer station 350 moves vertically with respect to the third blade 234C.
[0020]
[0027] The wafer station 350 may include a notch 352A, and when the wafer station 350 moves vertically, the arm 240 of the third blade 234C is received in the notch 352A. The wafer station 350 may also include notches 352B and 352C that can receive the third frame member 242C of the third blade 234C when the wafer station 350 moves vertically. The wafer may be placed on the raised feature of the wafer station. When the wafer station 350 moves upward to remove the wafer from the third blade 234C, the wafer is positioned within a plurality of pins 354 (for example, pockets for centering the wafer may occur).
[0021]
[0028] The first load cup 124A may also include a nebulizer 356 that can spray a fluid (e.g., deionized water) onto the third blade 234C, a substrate (not shown in FIG. 3A) disposed on the third blade 234C, and / or a head located on the first load cup 124A. The nebulizer 356 may include a first nozzle 358A (shown by a horizontal line) that can rinse the wafer received by the third blade 234C. The nebulizer 356 may include from 10 to 18 first nozzles 358A. In some embodiments, the nebulizer 356 may include 13 to 15 first nozzles 358A that can provide a rinse solution at a rate of 1.5 liters per minute (lpm) to 2.1 lpm. In some embodiments, the nebulizer 356 may include a second nozzle 358B (shown by a vertical line) that can rinse the film. The nebulizer 356 may include from 5 to 9 second nozzles 358B that can provide a rinse solution at a rate of 4.0 lpm to 6.0 lpm. The nebulizer 356 may include a third nozzle 358C (shown by a diagonal line) that can rinse a part of the head, such as the gap between the head (e.g., head 120D - FIG. 4A) and the wafer (e.g., wafer 208 - FIG. 4A). The nebulizer may include from 2 to 4 third nozzles 358C that can provide a rinse solution at a rate of about 2.0 lpm to 4.0 lpm. In some embodiments, the nebulizer 356 may include a fourth nozzle 358D (shown by an intersecting line) that can rinse the holding ring of the head (not shown). The nebulizer may include from 2 to 4 fourth nozzles 358D that provide a rinse solution at a rate of 1.0 lpm to 4.0 lpm. The nebulizer 356 may include nozzles of other numbers and configurations and / or rinse solutions of other flow rates.
[0022]
[0029] The nozzles 358A to 358D can be controlled independently. For example, the first nozzle 358A can be controlled independently of the second nozzle 358B. As shown in Figure 3, the configuration of the third blade 234C and the nozzles 358A to 358D is such that the third blade 234C does not block any of the nozzles 358A to 358D. For example, the configuration of the frame members 242A to 242C and the opening 244 does not block any of the nozzles 358A to 358D. This configuration of the frame members 242A to 242C and the nozzles 358A to 358C can enable rinsing of one or more heads 120A to 120D (Figure 1) without interference from a blade (e.g., the third blade 234C). In some embodiments, the nebulizer 356 remains stationary in the first load cup 124A. Therefore, the nebulizer 356 can be connected to the rinse solution (not shown) supply via a fixed pipe rather than a flexible tube. A fixed pipe may require less maintenance compared to a flexible tube.
[0023]
[0030] The wafer station 350 may include other features for accommodating the first blade 234A and / or the nebulizer 356. For example, the nebulizer 356 may have tabs supporting a fourth nozzle 358D. The wafer station 350 may have corresponding notches 359A-359C for accommodating the tabs. Thus, the wafer station 350 can move relative to the nebulizer 356 without being obstructed by the tabs.
[0024]
[0031] Here, we refer to Figure 4A, which shows an example of a head 120D located near the first load cup 124A. The first load cup 124A may include or be attached to a support plate 460. The first wafer changer 130A may be coupled to the support plate 460 via a shaft 462. A motor 464, such as a servo motor, can rotate the shaft 462 in a first direction 132A (Figure 1) or a second direction 132B (Figure 1). The rotation of the shaft 462 rotates the first wafer changer 130A around an axis extending through the shaft 462 and / or the point of rotation 236.
[0025]
[0032] The nebulizer 356 may be coupled to a support plate 460 via one or more support members 466. In some embodiments, the support members 466 can maintain the nebulizer 356 in a fixed position relative to the support plate 460. Fluid lines (not shown) may be coupled to the nebulizer 356. For example, four fluid lines, one for each of the different types of nozzles 358A to 358D, may be coupled to the nebulizer 356.
[0026]
[0033] The wafer station 350 may be movable perpendicular to the support plate 460. For example, the wafer station 350 may be movable downward or in the Z-direction and upward in the Z+direction relative to the support plate 460. The wafer station 350 may be in a first position when it is spaced away from the wafer 208 supported on the third blade 234C. The wafer station 350 may be in a second position when it is located near the head 120D. The wafer station 350 may be coupled by a support member 468 to an actuator 470 that provides vertical movement of the wafer station 350 relative to the support plate 460.
[0027]
[0034] In the illustrated Figure 4A, the first load cup 124A is in a storage position where the wafer station 350 moves in the Z-direction, so that the third blade 234C of the first wafer changer 130A can move in and out of the first load cup 124A without obstruction. For example, the wafer 208 is supported on the support 246 of the third blade 234C, and the wafer station 350 is located below the third blade 234C and spaced away from the third blade 234C.
[0028]
[0035] Here, refer to Figure 4B showing the first load cup 124A in the extended position. For example, the wafer support 350 is moved upward in the Z+ direction to a second position in order to remove the wafer 208 from the third blade 234C or to move the wafer 208 closer to the head 120D. At the position of the wafer station 350 shown in Figure 4B, the wafer 208 rests on a raised feature of the wafer station 350. Other processes may be performed to transfer the wafer 208 to the head 120D.
[0029]
[0036] During use, actuator 470 may lower the wafer station 350 by moving it in the Z-direction to a first position where the blades can enter the first load cup 124A without obstruction. Next, motor 464 may rotate shaft 462 which rotates the first wafer changer 130A. The rotation of the first wafer changer 130A may be stopped when a blade, such as a third blade 234C, positioned on top of the wafer 208, is received by the first load cup 124A. The head 120D may move to a position above the first load cup 124A. Next, actuator 470 may move the wafer station 350 upward in the Z+ direction to a second position where the wafer 208 is close to the head 120D. The head 120D grips the wafer 208 and moves the wafer 208 to one or more polishing stations 114 (Figure 1), where a polishing process may be applied to the wafer 208.
[0030]
[0037] Once wafer processing is complete, the head 120D may return to its position above the first load cup 124A along with the wafer 208. The actuator 470 may move the wafer station 350 in the Z+ direction to a first position where the wafer station 350 can receive the wafer 208 onto the raised features of the wafer station 350. Next, the actuator 470 may lower the wafer station 350 in the Z- direction to a position where the wafer 208 is transferred to the support 246 of the third blade 234C. The actuator 470 may continue lowering the wafer station 350 in the Z- direction to a position where the third blade 234C can move away from the first load cup 124A without obstruction.
[0031]
[0038] In some embodiments, a sensor (not shown) may be located on the first load cup 124A and may sense the presence of the wafer 208. The sensor may also detect the presence of the wafer 208 on the head 120D. While the wafer 208 is being loaded onto the head 124D, the sensor may determine that there is no wafer on the wafer station 350. The wafer station 350 may then rise in the Z+ direction toward the wafer 208. Once the wafer 208 is transferred to the wafer station 350, the sensor may detect the presence of the wafer 208 on the wafer station 350. The wafer station 350 may then continue rising in the Z+ direction toward the head 120D until the sensor on the head 120D detects the presence of the wafer 208. The wafer 208 may then be loaded onto the head 120D. During unloading from the head 120D, the sensor may detect that the wafer 208 has been unloaded from the head 120D and is present on the wafer station 350. Sensors on the wafer station 350 may also detect the absence of wafer 208 when it is transferred to the third blade 234C. The chemical mechanical polishing (CMP) system 100 may include other sensors.
[0032]
[0039] During the above process, the nebulizer 356 may rinse the first blade 234A, the head 120D, the wafer station 350, and / or parts of the wafer 208. For example, the first nozzle 358A may rinse the wafer 208 after it has been polished. In some embodiments, the wafer 208 may be rinsed while it is in the head 120D and before it is transferred to the wafer station 350. In some embodiments, the wafer 208 may be rinsed when it is positioned in the first load cup 124A. In some embodiments, the first wafer changer 130A may rotate an empty blade into the first load cup 124A. The absence of a substrate in the first load cup 124A may allow the nebulizer 356 to rinse various parts of the head.
[0033]
[0040] Here, we refer to Figures 5A to 5D illustrating the operation of the first wafer changer 130A and the second wafer changer 130B in conjunction with other components of the CMP system 100. Wafers with cross-hatching are polished or processed by the polishing station 114 or other components and are to be transported to the robot 136. Wafers with diagonal hatching are received from the robot 136 and are to be transported to the polishing station 114. Empty circles represent the blades of the first wafer changer 130A and the second wafer changer 130B on which no wafer is positioned.
[0034]
[0041] The process shown in Figures 5A to 5D begins in Figure 5A, where the first blade (indicated by reference numeral 1) is empty. The second blade (indicated by reference numeral 2) contains substrates that are processed by individual polishing stations 114 and returned to the first load cup 124A and the second load cup 124B. The third blade (indicated by reference numeral 3) contains substrates received from robot 136. During the stage shown in Figure 5A, the head (not shown in Figure 5A) unloads the substrates onto the first load cup 124A and the second load cup 124B, as well as onto the second blade. Furthermore, a new wafer is loaded onto the third blade from robot 136.
[0035]
[0042] The first wafer changer 130A can rotate in a first direction 132A, and the second wafer changer 130B can rotate in a second direction 132B to reach the configuration shown in Figure 5B. A first blade, which may be empty, can be received in the first load cup 124A and the second load cup 124B. The nebulizer 356 (Figure 3) can rinse the heads located above the first load cup 124A and the second load cup 124B without being obstructed by the wafers located between the head and the nebulizer. Empty blades can also be rinsed. In the configuration shown in Figure 5B, the robot 136 can unload the processed wafers from the second blade.
[0036]
[0043] The first wafer changer 130A can rotate in a first direction 132A, and the second wafer changer 130B can rotate in a second direction 132B to reach the configuration shown in Figure 5C. The robot 136 can load the wafer onto the first blade. Furthermore, the wafer changer 130 can unload the wafer from the third blade to the head, which can transport the wafer to the polishing station 114. Figure 5D shows the return of the wafer from the polishing station 114 to the load cup 124. The first wafer changer 130A can rotate in a first direction 132A, and the second wafer changer 130B can rotate in a second direction 132B to reach the configuration shown in Figure 5A, in which the process is repeated.
[0037]
[0044] The processes shown in Figures 5A to 5D enable faster processing times compared to conventional CMP systems and methods. For example, since the wafer changer 130 moves the wafer and blade to the robot access positions of the robot 136 (e.g., robot access positions 172A and 172B - Figure 1), the robot 136 can have more time to unload and load the wafers 108. The wafer changer 130 enables faster cycle times by allowing parallel processing of wafers 108. For example, a wafer 108 that has finished polishing can be unloaded, and in parallel, a new wafer 108 can be loaded into the wafer changer 130. Therefore, this process does not hinder the robot 136 from moving wafers.
[0038]
[0045] The movement of the wafer station 350 (Figure 3) allows the wafer changer 130 to move only on a single horizontal plane. Therefore, vertical movement of the wafer changer 130, which can be time-consuming, is not performed. As shown in Figures 5A to 5D, the wafer changer 130 can operate with empty blades, and the heads can be rinsed by the nebulizer 356 when empty blades are positioned in the load cup 124. The blades of the wafer changer 130 can be rinsed simultaneously. In the embodiments shown in Figures 5A to 5D, every third blade entering the load cup 124 is empty, which allows the heads to be rinsed after two wafers have been processed.
[0039]
[0046] Referring to Figure 6, which shows a top view of another embodiment of the CMP system, several embodiments of the CMP system 100 may include one or more rinse stations accessible by the wafer changer 130. The embodiment of the CMP system 100 in Figure 6 includes a first rinse station 670A accessible by a first wafer changer 130A and a second rinse station 670B accessible by a second wafer changer 130B. In the embodiment of Figure 6, the wafer 108 located in the wafer changer 130 may be in a position that includes the rinse station 670A or 670B and the load cup 124. In the embodiment of Figure 6, the rinse stations 670A, 670B may be in the same positions as robot access positions 172A, 172B from which the robot 136 can access the wafer 108.
[0040]
[0047] Refer now to Figure 7, which shows a top view of a first rinse station 670A, which may be (but not necessarily) be identical to, or substantially similar to, the second rinse station 670B. The first rinse station 670A may include a basin 772 from which cleaning fluid can accumulate, otherwise it would be excessively sprayed onto the polishing section 102 (Figure 1). The first rinse station 670A may include a nebulizer 774 located in the basin 772. The nebulizer 774 may be similar to the nebulizer 356 (Figure 3), but may include only a nozzle 776 configured to rinse a substrate (not shown in Figure 7) located in the first rinse station 670A. The nozzle 776 may be configured not to be obstructed by the blades of the first wafer changer 130A located in the first rinse station 670A. In some embodiments, the layout and / or configuration of nozzle 776 may be identical or substantially similar to the layout and / or configuration of the first nozzle 358A (Figure 3) of nebulizer 356. For example, nebulizer 774 may include 10 to 18 nozzles 776 that provide 1.0 lpm to 4.0 lpm of rinse solution. Referring to Figure 6, wafer 108 may be rinsed by a first rinse station 670A and a second rinse station 670B. The first rinse station 670A and the second rinse station 670B may include other features (not shown) for cleaning the wafer. The first rinse station 670A and the second rinse station 670B may help keep the wafer moist, in particular after polishing.
[0041]
[0048] In some embodiments, the wafer 108 may be placed on and / or between the supports 246, so that the wafer 108 can be moved without being gripped. In some embodiments, different spray patterns may be emitted by nozzles 358A, 358B, 358C, and / or 358D. In some embodiments, one or more hard stops (not shown) may be used to restrict the vertical movement of the wafer station 350 (e.g., limiting the low or high to which the wafer station 350 can move during the wafer exchange process). Using any suitable mechanism, the heads 120A-120D may be moved between the polishing station 114 and the load cup 124.
[0042]
[0049] The foregoing description discloses only exemplary embodiments. Those skilled in the art will readily see modifications of the apparatus and methods disclosed above that fall within the scope of this disclosure.
Claims
1. Polishing station and At least one Road Cup, A wafer changer that transports wafers to the load cup, A carrier head that holds the substrate and is movable between the polishing station and the load cup, A chemical mechanical polishing system having, A chemical mechanical polishing system comprising a load cup including a wafer station configured to receive the substrate from the wafer changer, wherein the wafer station is movable between a first position where the wafer station is beneath the substrate by the wafer changer and a second position where the substrate is supported by the wafer station for mounting on the carrier head, and the wafer station includes a notch sized to receive a portion of the wafer changer when moving between the first and second positions.
2. The system according to claim 1, wherein the wafer station has an annular body.
3. The system according to claim 2, wherein the wafer changer includes a blade, and the annular body has a notch sized to receive a portion of the blade as it moves between a first position and a second position.
4. The system according to claim 3, wherein the notch includes a channel extending from the inner surface to the outer surface of the annular body.
5. The system according to claim 4, wherein the notch includes a recess that extends from the inner surface of the annular body into the annular body and partially penetrates the annular body horizontally without completely penetrating it.
6. The system according to claim 4, further comprising at least one second notch sized to receive another portion of the blade, each of the second notches including a recess extending from the inner surface of the annular body into the annular body and partially penetrating the annular body horizontally without completely penetrating it.
7. The system according to claim 6, wherein the at least one second notch consists of exactly two notches.
8. The system according to claim 6, wherein the at least one second notch protrudes from the top of the annular body and extends radially outward beyond the inner edges of a plurality of pins that are the same radial distance from the center of the annular body.
9. The annular body has at least one third notch, Each of the third notches includes a recess extending from the inner surface of the annular body into the annular body, The system according to claim 6, wherein the annular body further comprises a nebulizer body having at least one tab extending outward, the at least one tab fitting into the at least one third notch.
10. The system according to claim 9, further comprising a plurality of third notches and a plurality of tabs that fit into the plurality of third notches.
11. Polishing station and At least one Road Cup and Wafer changer, A carrier head that holds a wafer and is movable between the polishing station and the load cup, A chemical mechanical polishing system having, The aforementioned road cup is A nebulizer body positioned in a fixed location within the load cup, the nebulizer body supporting a plurality of upward-facing nozzles for spraying onto the wafer held by the carrier head above the load cup, An annular body that engages with the edge of the wafer, surrounding the nebulizer body, and movable perpendicularly to the nebulizer body between a first position for receiving the wafer from the wafer exchanger and a second lifted position where the wafer is supported by the wafer station for mounting on the carrier head, A chemical mechanical polishing system, including
12. The system according to claim 11, wherein the nebulizer includes two or more sets of nozzles, each set of nozzles being coupled to a different fluid source.
13. The system according to claim 11, further comprising a plurality of pins that protrude from the upper part of the annular body and position the wafer centrally when the wafer station rises to the second position.
14. The system according to claim 11, wherein the nebulizer body has outwardly extending tabs that fit into corresponding notches on the inner surface of the annular body of the wafer station.
15. The system according to claim 11, wherein the annular body has a notch sized to receive a portion of the blade of the wafer changer as it moves between the first position and the second position, and at least one second notch sized to receive another portion of the blade, each of the second notches having at least one recess extending from the inner surface of the annular body into the annular body and partially penetrating the annular body horizontally without completely penetrating it.