Joining machine

Abstract

This joining work machine comprises: a work head that has a component mounting tool for, by being lifted and lowered along a lifting / lowering shaft, collecting a component and mounting the component to a workpiece, and that is horizontally driven by a horizontally driving mechanism; and a laser beam emitting part that is provided to the work head or to the horizontally driving mechanism so as to emit a laser beam for heating a joining material in which a predetermined joining force is generated when being provided to a contact surface of the component and / or a contact surface of the workpiece where contact is formed therebetween and when being heated, toward the joining material, the component, or the workpiece from a direction inclined to the lifting / lowering shaft.

Description

Technical Field

[0001] This specification relates to a joining machine for joining parts to a workpiece.

Background Art

[0002] Techniques for mass-producing substrate products equipped with electronic circuits by joining components that are circuit components to a substrate on which a circuit pattern is formed have become widespread. In a substrate production line applied to this type of production use, a line configuration is adopted that includes a solder printer that prints solder as a joining material on the substrate, a component mounter that mounts components on the substrate, and a reflow machine that heats the solder to ensure a predetermined joining force. Furthermore, there are also line configurations in which solder is not printed on the substrate but is applied to the side of the electrodes of the components, and line configurations that use a conductive paste instead of solder. Also, when the joining contact surface is other than the conductive part, a resin material or an adhesive is used as the joining material, and heating is often required to ensure a predetermined joining force. Technical examples related to such joining of components are disclosed in Patent Documents 1 to 5.

[0003] Patent Document 1 discloses a component mounter that heats the connection end of an electronic component adsorbed by an adsorption nozzle with infrared laser light, lowers the adsorption nozzle toward a mounting substrate on which solder has been previously applied, and fixes the solder while bringing the electronic component into contact with the substrate. Patent Document 2 discloses a laser soldering device in which a conveying means for conveying a component to a soldering position and a laser heating means for performing preliminary heating of the component and main heating of melting the solder are integrally configured. The laser light emitted by the laser heating means reaches the electrical component via an optical fiber and a lens in the conveying means. Patent Document 3 discloses a component mounter that heats an adsorption nozzle with laser light irradiated through a half mirror and indirectly heats the component.

[0004] Patent Document 4 discloses an automatic mounting device comprising a transport and mounting device for transporting electronic components and placing them on a printed circuit board, and a pressing and heating device for soldering electronic components while pressing them after the transport and mounting device has separated. Patent Document 5 discloses a component mounting machine comprising a YAG laser device provided on a tape feeder for heating components stored in the pockets of the tape feeder, and a component placement means for placing the heated components on a substrate. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2000-13098 [Patent Document 2] Japanese Patent Application Publication No. 162574 / 1983 [Patent Document 3] Japanese Patent Publication No. 2000-59098 [Patent Document 4] Japanese Patent Application Publication No. 61-224395 [Patent Document 5] Japanese Patent Publication No. 2014-22383 [Overview of the project] [Problems that the invention aims to solve]

[0006] By the way, the technical examples in Patent Documents 1 to 5 have the following problems. Specifically, Patent Document 1 does not disclose a specific configuration for heating with infrared laser light. Furthermore, in Patent Documents 2, 3, and 5, there are concerns about reduced heating efficiency due to attenuation of the laser light, loss of heat due to heating areas other than the required range, and time lag from heating to bonding. In addition, in Patent Documents 2 to 4, the equipment configuration for heating tends to be complex, raising concerns about increased equipment costs.

[0007] While the technical examples in Patent Documents 1 to 5 all involve techniques for heating solder, as mentioned above, the bonding material is not limited to solder. Furthermore, the bonding machine is not limited to configurations that bond electrical components to a substrate on which a circuit pattern is formed, but also includes configurations that bond mechanical components to various workpieces.

[0008] Therefore, this specification aims to provide a joining machine that can efficiently heat joining materials with a simple configuration while suppressing increases in equipment costs. [Means for solving the problem]

[0009] This specification discloses a joining machine comprising: a part holder that picks up a part and attaches it to a workpiece by moving up and down along a lifting axis; a work head that is driven horizontally by a horizontal drive mechanism; and a laser beam irradiation unit provided on the work head or the horizontal drive mechanism that irradiates a laser beam from a direction inclined with respect to the lifting axis toward either the joining material, the part, or the workpiece, for heating a joining material that is applied to one of the contact surfaces of the part and the workpiece that come into contact with each other and generates a predetermined joining force when heated. [Effects of the Invention]

[0010] In the joining machine disclosed herein, a laser beam irradiation unit is provided on the work head or horizontal drive mechanism that irradiates laser light from a direction inclined with respect to the lifting axis toward the joining material, component, or workpiece. This allows for efficient heating of the joining material by irradiating the joining material, component, or workpiece toward the joining material, thereby suppressing heat loss due to heating of areas other than the required area, and also reducing the attenuation of the laser light. Furthermore, since the laser beam irradiation unit can be added to a work head or horizontal drive mechanism with a general configuration, an increase in equipment costs can be suppressed with a simple configuration. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic plan view showing the overall configuration of a component mounting machine, which is the first embodiment of a joining machine. [Figure 2] This is a perspective view of the nozzle tool attached to the mounting head (working head). [Figure 3] This is a perspective view of a mounting head (working head) equipped with a laser beam irradiation unit. [Figure 4] This is a view of the mounting head and laser beam irradiation section from below. [Figure 5] This is a side view illustrating the operation of the laser light irradiation unit when the laser light source and suction nozzle are in the raised position. [Figure 6] This is a side view illustrating the operation of the laser beam irradiation unit when the laser light source and suction nozzle are in the lowered position. [Figure 7] This is a side view illustrating the operation of the laser light irradiation unit when the laser light source is in a lowered position and the suction nozzle is in an elevated position. [Figure 8] This is a schematic side view showing the configuration of the laser light irradiation unit of the third embodiment. [Figure 9] This is a view of the mounting head and laser beam irradiation unit from below, in the fourth embodiment. [Modes for carrying out the invention]

[0012] 1. Overall configuration of the component mounting machine 1 of the first embodiment First, the overall configuration of the component mounting machine 1, which is the first embodiment of the joining work machine, will be described with reference to FIG. 1. The component mounting machine 1 repeatedly performs joining operations of mounting and joining components to a workpiece. In the first embodiment, the component is a circuit component of an electronic circuit, and the workpiece is a substrate K on which a circuit pattern of an electronic circuit is formed. The component mounting machine 1 uses, for example, a non-conductive resin material as a bonding material that generates a predetermined bonding force when heated. The direction from the left side to the right side of the paper surface of FIG. 1 is the X-axis direction in which the substrate K is conveyed, and the direction from the lower side (front side) to the upper side (rear side) of the paper surface is the Y-axis direction. The component mounting machine 1 includes a substrate conveying device 2, a component supply device 3, a component transfer and joining device 4, and a laser light irradiation unit 5.

[0013] The substrate conveying device 2 is composed of a pair of guide rails 21, a pair of conveying belts (not shown), a clamp mechanism 23, etc. The pair of guide rails 21 extends in the X-axis direction across the center of the upper surface of the base 10 and is assembled to the base 10 in parallel with each other. The pair of conveying belts rotate along the guide rails 21 with two parallel sides of the substrate K placed thereon, and convey the substrate K to the work execution position near the center of the base 10. The clamp mechanism 23 pushes up the conveyed substrate K and clamps it between the guide rails 21 for positioning.

[0014] The component supply device 3 is arranged at the front part of the base 10. The component supply device 3 has a plurality of tape feeders 31 and a resin material supply unit 35. The tape feeder 31 has a long and thin flat shape in the front-rear direction (Y-axis direction) and thin in the left-right direction (X-axis direction), and is arranged side by side in the X-axis direction. Each tape feeder 31 feeds out a carrier tape in which a large number of components are stored in a row toward the supply position 32 near the rear end. The carrier tape supplies the components so that they can be collected at the supply position 32.

[0015] The resin material supply unit 35 is arranged on the left side of the tape feeder 31 and supplies a resin material as a bonding material. The resin material supply unit 35 has a supply dish, a replenishment mechanism, and a heat preservation unit (not shown in the figure). The supply dish is formed in a flat-bottomed dish shape that opens upward, and holds a liquid resin material inside. The supply dish preferably has a mechanism for flattening the liquid level of the resin material as needed. The replenishment mechanism replenishes the resin material inside the supply dish when the resin material is consumed and decreased. The heat preservation unit is arranged below the supply dish, applies heat to the resin material inside the supply dish, and prevents solidification due to temperature drop.

[0016] The resin material is heated to a predetermined temperature or higher and then cooled and solidified to generate a predetermined bonding force. The resin material is applied to at least one of the contact surfaces of the component and the substrate K that contact each other. In the first embodiment, the resin material is applied to the lower surface (contact surface) of the component by the resin material supply unit 35. Without being limited to this, the resin material may be applied to the contact surface where the component on the substrate K side is joined. As the predetermined temperature for heating the resin material, about 100°C can be exemplified. Also, as the coating thickness of the resin material, about 10 μm can be exemplified.

[0017] The material of the resin material is selected in consideration of the materials of the component and the substrate K. Also, the predetermined temperature and coating thickness of the resin material are appropriately set according to the material and properties of the resin material. Note that instead of the resin material, an adhesive of a type that generates a predetermined bonding force by heating to a predetermined temperature or higher may be used. Also, the resin material supply unit 35 may be configured to apply the resin material to the component using a brush, or to spray the resin material toward the component from an injection nozzle. Also, a configuration in which the resin material is pre-applied to the components supplied from the tape feeder 31 or other types of component supply units, and the resin material supply unit 35 is omitted may be adopted.

[0018] The component transfer and joining device 4 performs component suction, mounting, and joining operations. The component transfer and joining device 4 consists of a Y-axis moving body 41, an X-axis moving body 42, a mounting head 43, a nozzle tool 44, a plurality of suction nozzles 45 corresponding to component mounting devices, a substrate recognition camera 46, a component recognition camera 47, and a nozzle station 48. The mounting head 43 is provided with a laser light irradiation unit 5 for performing joining operations (details will be described later).

[0019] The Y-axis moving body 41 is formed from a member that is long in the X-axis direction and moves in the Y-axis direction when driven by a Y-direction drive mechanism (not shown). The X-axis moving body 42 is mounted on the Y-axis moving body 41 and moves in the X-axis direction when driven by an X-direction drive mechanism (not shown). The mounting head 43 is attached to a clamp mechanism (not shown) provided on the front of the X-axis moving body 42 and moves horizontally in two directions together with the X-axis moving body 42. The Y-axis moving body 41, the Y-direction drive mechanism, the X-axis moving body 42, and the X-direction drive mechanism constitute a horizontal drive mechanism 40 that drives the mounting head 43 in the horizontal direction. The mounting head 43 is one embodiment of a work head having a component mounting device.

[0020] A nozzle tool 44 having a roughly cylindrical outer shape is provided on the lower side of the mounting head 43. The nozzle tool 44 is formed as a rotating body that rotates around a vertical central axis AV (see Figure 2). The nozzle tool 44 has a plurality of suction nozzles 45 (12 in the example of Figure 1) that revolve around the vertical central axis AV. Negative pressure air and positive pressure air are selectively supplied to the suction nozzles 45 from an air supply system (not shown). As a result, the suction nozzles 45 perform a suction operation to pick up components from the tape feeder 31 and a mounting operation to mount the components onto the substrate K.

[0021] Here, "mounting" means placing the component on the substrate K, and "bonding" means ensuring a predetermined bonding force between the component and the substrate K. In other words, bonding force is not ensured simply by mounting the component. The suction nozzle 45 is one embodiment of a component mounting device that picks up a component and mounts it to a workpiece by moving up and down along the lifting axis. As a component mounting device, a type of mounting device having a chuck for gripping the component, or other types of mounting devices may be used. The detailed configuration of the nozzle tool 44 will be described later.

[0022] The substrate recognition camera 46 is located in front of the mounting head 43, and may also be located below the X-axis moving body 42. The substrate recognition camera 46 is positioned so that its optical axis is facing downwards, and it captures images of the position reference marks attached to the substrate K from above. The acquired image data is processed to accurately determine the work position on the substrate K. As an example of the substrate recognition camera 46, a digital imaging device having an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) can be used.

[0023] The component recognition camera 47 is mounted on a base 10 between the substrate transport device 2 and the component supply device 3. The component recognition camera 47 is positioned so that its optical axis is facing upward. The component recognition camera 47 images and recognizes the component held by the suction nozzle 45 from below as the mounting head 43 moves onto the substrate K. This allows for the determination of the quality of the resin coating applied to the component, and also detects the position and orientation of the component relative to the suction nozzle 45, which is then reflected in the mounting operation. As the component recognition camera 47, a digital imaging device having an image sensor such as a CCD or CMOS can be exemplified.

[0024] A nozzle station 48 is provided to the left of the part recognition camera 47. The nozzle station 48 holds a plurality of interchangeable suction nozzles 45. The plurality of suction nozzles 45 are, for example, of multiple types with different nozzle diameters, and are replaced as appropriate according to various parts of different sizes. In addition, if the error rate of the suction and mounting operations of a particular suction nozzle 45 increases, it may be replaced with another suction nozzle 45 of the same type. The mounting head 43 has a function to move to the nozzle station 48 and automatically replace the suction nozzles 45. However, it is not limited to this, and the suction nozzles 45 may be replaced manually. Furthermore, the mounting head 43 may have a function to automatically replace the nozzle tool 44, or the nozzle tool 44 may be replaced manually.

[0025] The component transfer and bonding apparatus 4 can repeat multiple bonding cycles on the positioned substrate K. In a bonding cycle, first, the mounting head 43 moves above the tape feeder 31, and the suction nozzles 45 move downward and upward in sequence to pick up the components. Next, the mounting head 43 moves above the resin material supply unit 35, and the suction nozzles 45 move downward and upward in sequence, immersing and coating the lower surface of the component they are holding with the resin material. Then, the mounting head 43 moves above the component recognition camera 47, and the component recognition camera 47 takes an image. Then, the mounting head 43 moves above the substrate K, and the suction nozzles 45 move downward and upward in sequence to mount the components.

[0026] The laser beam irradiation unit 5 operates during at least a portion of the time while the mounting head 43 is moving from the resin material supply unit 35 to above the substrate K, and while the suction nozzle 45 is descending and rising above the substrate K. This heats the resin material to a predetermined temperature or higher, and then cools and solidifies, thereby performing the bonding operation. After completing the component mounting operation, the mounting head 43 moves back towards the tape feeder 31. The bonding cycle is a general term for the series of operations described above.

[0027] 2. Nozzle tool 44 Next, the detailed configuration of the nozzle tool 44 having 12 suction nozzles 45 will be described with reference to Figure 2. The nozzle tool 44 has a tool body 441 and a cylindrical gear 442. Furthermore, the nozzle tool 44 has 12 sets of nozzle holders 443 arranged at equal angular intervals around a vertical central axis AV, an elastic body 444, a θ-axis gear 445, a locking piece 446, and a valve operating piece 447.

[0028] The tool body 441 is supported on the underside of the mounting head 43, and a portion of its outer shape is omitted in Figure 2. The tool body 441 is driven by an R-axis drive mechanism (not shown) provided on the mounting head 43, and rotates around the vertical central axis AV. This causes the entire nozzle tool 44 to rotate. Twelve sets of nozzle holders 443 are arranged at equidistant positions from the vertical central axis AV of the tool body 441 at equal angular intervals.

[0029] The nozzle holder 443 extends vertically and is supported by the tool body 441 so as to be able to move up and down. A suction nozzle 45 is attached to the lower side of the nozzle holder 443 via an elastic body 444 (one is illustrated in a partial cross-section in Figure 2). Therefore, when the nozzle tool 44 rotates, the 12 suction nozzles revolve around the vertical central axis AV. A coil spring can be exemplified as the elastic body 444. On the other hand, a θ-axis gear 445 is provided on the upper side of the nozzle holder 443, and a locking piece 446 is provided radially outward of the θ-axis gear 445. Furthermore, a valve operating piece 447 is provided corresponding to each nozzle holder 443.

[0030] A cylindrical gear 442 is positioned inside the twelve θ-axis gears 445. The cylindrical gear 442 has a large-diameter gear (not shown) on its outer circumference that meshes with the twelve θ-axis gears 445. The cylindrical gear 442 is driven by a θ-axis drive mechanism (not shown) provided on the mounting head 43 and rotates around the vertical central axis AV. This causes the cylindrical gear 442 to rotate the twelve sets of nozzle holders 443 and suction nozzles 45 together. The valve operating piece 447 opens and closes an air passage (not shown) and selectively switches between negative pressure air and positive pressure air supplied to the suction nozzles 45.

[0031] The locking piece 446 is driven up and down by a Z-axis drive mechanism 431 provided on the mounting head 43 (see arrow MV in Figure 2). The up and down movement of the locking piece 446 causes the nozzle holder 443 to move up and down along a vertically extending lifting axis, from an up position to a down position. Furthermore, the suction nozzle 45 moves up and down via the elastic body 444. However, the Z-axis drive mechanism 431 is provided at one or more limited positions along the orbital path of the suction nozzle 45, and the lifting axis is set at these positions. Hereafter, the position where the lifting axis is set will be referred to as the liftable position AP.

[0032] The movable up / down position AP is determined by the arrangement of the Z-axis drive mechanism 431 on the mounting head 43. Therefore, even if the nozzle tool 44 rotates, the movable up / down position AP does not move, and only the suction nozzle 45 that enters the movable up / down position AP can move up and down. The lowered position at which the Z-axis drive mechanism 431 lowers the nozzle holder 443 via the locking piece 446, and the residence time for the nozzle holder 443 to remain in the lowered position are set by the setting unit 432. The setting unit 432 is implemented, for example, by software that controls the operation of the Z-axis drive mechanism 431.

[0033] When the suction nozzle 45, which has picked up the component P, enters the vertically movable position AP and descends toward the substrate K, the nozzle holder 443 and the suction nozzle 45 initially descend in conjunction. Then, when the component P comes into contact with the substrate K, the suction nozzle 45 stops descending, and only the nozzle holder 443 continues to descend to the lower position. At this point, compression of the elastic body 444 begins, and the amount of compression increases further, gradually increasing the compressive force. This compressive force acts on the component P via the elastic body 444 and the suction nozzle 45, becoming a downward pressing force.

[0034] In other words, the suction nozzle 45 is attached to the work head 43 via an elastic body 444, and the pressing force generated by the compression of the elastic body 444 presses the component P against the substrate K. By performing the bonding work with the component P pressed against the substrate K in this way, the bonding state is stabilized. After this, when the nozzle holder 443 rises from the lowered position, the amount of compression of the elastic body 444 decreases, and the compressive force gradually decreases. Then, when the suction nozzle 45 separates from the component P attached to the substrate K, the compressive force disappears.

[0035] Here, the setting unit 432 sets the lowering position at which the Z-axis drive mechanism 431 lowers the nozzle holder 443 to be changeable. If the lowering position of the nozzle holder 443 is set to a lower position, the amount of compression of the elastic body 44 increases, and the pressing force when pressing the component P against the substrate K increases. Conversely, if the lowering position of the nozzle holder 443 is set to a higher position, the amount of compression of the elastic body 44 decreases, and the pressing force when pressing the component P against the substrate K decreases. In other words, the setting unit 432 can set the pressing force of the suction nozzle 45 when the suction nozzle 45 is pressing the component P against the substrate K to be variable. The setting unit 432 may change the pressing force according to at least one of the type of component P and the type of bonding material. For example, a recommended value for the pressing force during bonding may be determined depending on the type of bonding material S, and the setting unit 432 sets the pressing force to correspond to the recommended value.

[0036] Furthermore, the setting unit 432 can change the residence time during which the nozzle holder 443 remains in the lowered position. In other words, the setting unit 432 can set an appropriate residence time based on the method of performing the joining work and the expected heating time. In addition, the setting unit 432 may change the residence time depending on at least one of the type of part P and the type of joining material.

[0037] 3. Laser light irradiation section 5 Next, the detailed configuration and function of the laser beam irradiation unit 5 will be described with reference to Figures 3 to 7. As shown in Figure 3, the laser beam irradiation units 5 are provided on the right and left sides of the mounting head 43, respectively. The two laser beam irradiation units 5 are positioned within the left-right length dimension of the X-axis moving body 42 and do not restrict the movement of the X-axis moving body 42 and the mounting head 43 in the X-axis direction. The laser beam irradiation unit 5 may also be provided on the X-axis moving body 42, which is a component of the horizontal drive mechanism 40 and moves integrally with the mounting head 43. The laser beam irradiation unit 5 irradiates the bonding material S, component P, and substrate K with laser light LL for heating the bonding material S from a direction inclined with respect to the lifting axis. The laser beam irradiation unit 5 includes an optical switching mechanism 52, a laser light source 53, and a reflective mirror 54.

[0038] The optical switching mechanism 52 is provided in contact with the top surface and side surface (right side or left side) of the mounting head 43. The optical switching mechanism 52 is the part that switches the irradiation position to which the laser beam LL is emitted. The optical switching mechanism 52 switches the irradiation position by changing the position of the laser light source 53 that emits the laser beam LL and the reflective mirror 54 that reflects the laser beam LL relative to the mounting head 43.

[0039] Specifically, the optical switching mechanism 52 drives the laser light source 53 and the reflective mirror 54 up and down, switching their height positions between the raised position HP and the lowered position LP (see Figures 5 to 7). In the first embodiment, a servo motor is used as the optical switching mechanism 52. In the configuration for fine adjustment described later, the optical switching mechanism 52 using a servo motor not only switches the height positions of the laser light source 53 and the reflective mirror 54 between the raised position HP and the lowered position LP, but also has the function of fine adjustment. Alternatively, the height position of the laser light source 53 may be fixed, and the optical switching mechanism 52 may only drive the reflective mirror 54 up and down. Furthermore, a mechanism other than a servo motor, such as a linear motor or an air-operated mechanism, may be used as the optical switching mechanism 52.

[0040] The laser light source 53 is formed in a vertically elongated rectangular parallelepiped shape and is supported by the optical switching mechanism 52 so as to be able to move up and down. The laser light source 53 emits laser light LL downward parallel to the vertical axis. The type of laser light LL is suitable for heating the bonding material, and the intensity of the laser light LL is set to, for example, the highest class 4 as specified in the JIS standard. According to this, the bonding material S together with the component P can be heated to a predetermined temperature or higher with irradiation of the laser light LL for a short time on the order of tens of milliseconds.

[0041] The reflective mirror 54 is positioned below the laser light source 53 using a support material 55 and moves up and down integrally with the laser light source 53. The reflective mirror 54 reflects the laser light LL emitted downward from the laser light source 53 in an oblique downward direction inclined with respect to the vertical axis. As a result, the laser light LL reaches the component P held by the suction nozzle 45. The laser light LL may irradiate the entire component P, or it may irradiate only a part of the component P. For example, in the case of a component P on which bonding material S is applied to the entire bottom surface, the laser light LL may irradiate the entire component P, heating the entire bonding material S. On the other hand, in the case of a component P on which solder or conductive paste as bonding material S is applied to the electrodes, the laser light LL may irradiate a part of the component P that is close to the electrodes, efficiently heating the electrodes and bonding material S. Furthermore, when the mounting angle of the component P is rotated by 90° when the component P is mounted on the substrate K, the optical switching mechanism 52 may operate to irradiate the position of the electrodes of the component P with laser light LL, efficiently heating the electrodes.

[0042] Alternatively, instead of the reflective mirror 54, a prism or a glass refracting plate may be used to refract the downward-facing laser beam LL in a diagonally downward direction inclined with respect to the vertical axis. The reflective mirror 54, prism, and glass refracting plate are embodiments of optical members that reflect or refract the downward-facing laser beam LL in a direction inclined with respect to the vertical axis. The laser beam irradiation unit 5 may also have an optical path restricting member that restricts the laser beam LL from reaching the substrate K. The optical path restricting member is formed, for example, from a metal plate through which the laser beam LL does not pass, and is positioned diagonally below the component P held by the suction nozzle 45 at the vertically movable position AP. By using an optical path restricting member, the substrate K, which is vulnerable to the laser beam LL, can be protected.

[0043] In the first embodiment, as shown in Figure 4, a vertically movable position AP is set at a position corresponding to the front of the nozzle tool 44. As shown in the figure, two sets of laser beam irradiation units 5 irradiate laser beam LL toward the part P held by the suction nozzle 45 at the vertically movable position AP. In other words, the two sets of laser beam irradiation units 5 are commonly provided for multiple suction nozzles 45 that selectively enter the vertically movable position AP. Note that the target of the laser beam LL irradiation is not limited to the suction nozzle 45 at the vertically movable position AP, but may be set, for example, to the suction nozzle 45 located one position before the vertically movable position AP.

[0044] Furthermore, multiple laser beam irradiation units 5 are provided for a single lifting axis (lifting / lowering position AP). This allows two laser beams LL to be irradiated onto a single component P at the lifting / lowering position AP from different directions, making it easy to ensure high heating efficiency and sufficient heat. In addition, the lifting and lowering of the two laser light sources 53 in the two sets of laser beam irradiation units 5 are controlled synchronously, and the irradiation time periods of the two laser light sources 53 are also controlled synchronously.

[0045] As shown in Figure 5, when the laser light source 53 is in the raised position HP, the laser beam LL is irradiated onto the component P held by the suction nozzle 45 in the raised position. Also, as shown in Figure 6, when the laser light source 53 is in the lowered position LP, which is lower than the raised position HP by a lowering distance DL, the laser beam LL is irradiated onto the component P being pressed against the substrate K by the suction nozzle 45, which has descended to the lowered position. The lowering distance DL is set to be approximately equal to the difference in height between the raised position and the lowered position of the suction nozzle 45.

[0046] Furthermore, as shown in Figure 7, when the laser light source 53 is in the lowered position LP and the suction nozzle 45 is in the raised position, the laser beam LL is irradiated onto the contact surface KF of the substrate K to which the component P is to be bonded. If a bonding material S is applied to the contact surface KF of the substrate K, the laser beam LL is irradiated onto this bonding material S. In this way, the optical switching mechanism 52 can switch the irradiation position of the laser beam LL by changing the vertical position of the laser light source 53 and the reflective mirror 54 relative to the mounting head 43.

[0047] The vertically movable position AP of the nozzle tool (not shown) having four medium-sized suction nozzles is set to the same position as the nozzle tool 44 having twelve suction nozzles 45. Therefore, the laser beam irradiation unit 5 can operate in the same way as the nozzle tool 44 when the nozzle tool with four medium-sized suction nozzles is mounted on the mounting head 43. On the other hand, the vertically movable position AP of the nozzle tool (not shown) having one large suction nozzle is set to overlap with the vertical central axis AV, which differs from the nozzle tool 44. To accommodate this, the optical switching mechanism 52 can be configured to have a function to change the position of the laser light source 53 and the reflective mirror 54 relative to the mounting head 43 in the front-rear direction.

[0048] Furthermore, the optical switching mechanism 52 can be configured to also have a function for fine-tuning the irradiation position of the laser beam LL. For example, if the size or shape of component P changes due to differences in the type of component P, the irradiation position that can be heated efficiently changes, so the optical switching mechanism 52 fine-tunes the irradiation position of the laser beam LL. For example, with respect to two types of components that have the same shape on the bottom surface but different heights, the optical switching mechanism 52 fine-tunes the irradiation position to be higher for the component with the relatively larger height and to be lower for the component with the relatively smaller height. Also, if there are shape errors such as warping in the substrate K, the height position of the component P mounted on the substrate K will fluctuate, so the optical switching mechanism 52 fine-tunes the irradiation position to match the actual height position of the component P.

[0049] 4. Operation of parts mounting machine 1 Next, the operation of the component mounting machine 1 will be explained, mainly focusing on the bonding operation of components P by the laser beam irradiation unit 5. The operation of the component mounting machine 1 allows for the selection of multiple irradiation patterns of the laser beam irradiation unit 5 depending on the irradiation position and duration of the laser beam LL, and whether the bonding material S is applied to component P or substrate K. The following irradiation patterns (1) to (4) will be explained in detail.

[0050] (1) Basic irradiation pattern The laser irradiation unit 5 sets the laser light source 53 to the lowered position LP and irradiates the laser beam LL at a timing that includes the time when the suction nozzle 45 is in contact with the component P and the substrate K (see Figure 6). Specifically, the laser irradiation unit 5 irradiates the laser beam LL while the suction nozzle 45 is pressing the component P against the substrate K with the pressing force set by the setting unit 432. In this case, since the component P, bonding material S, and substrate K are stacked vertically, the irradiation position of the laser beam LL is limited to the component P. Also, the bonding material S may be applied to either the component P or the substrate K.

[0051] In the basic irradiation pattern, the laser irradiation unit 5 irradiates the laser beam LL each time the rotating nozzle tool 44 rotates and the 12 suction nozzles 45 sequentially perform the attachment operation. By irradiating the laser beam LL toward the part P, the laser irradiation unit 5 indirectly heats the bonding material S to a predetermined temperature or higher via the part P. After that, the temperature of the bonding material S decreases and solidifies, and the bonding operation is completed.

[0052] Furthermore, if there is a concern that the irradiation time will be insufficient, the setting unit 432 can set the residence time of the nozzle holder 443 in the lowered position to be longer than usual to ensure sufficient irradiation time. In addition, the laser beam irradiation unit 5 may irradiate the laser beam LL during the period from just before the suction nozzle 45 starts to descend to partway through the descending operation (see Figure 7). With this, the irradiation position of the laser beam LL can be set as the contact surface KF of the substrate K, and the contact surface KF can be preheated. However, since the substrate K has a large heat capacity and is difficult to heat to a predetermined temperature, it is not possible to heat only the substrate K without heating the component P.

[0053] (2) Pre-contact heating irradiation pattern The laser beam irradiation unit 5 irradiates the laser beam LL with the laser light source 53 in the raised position HP during the time period before the suction nozzle 45 makes contact with the component P on the substrate K (see Figure 5). The irradiation position of the laser beam LL is limited to the component P held by the suction nozzle 45 in the raised position. The bonding material S is assumed to be attached to the component P. The time period before the suction nozzle 45 makes contact with the component P on the substrate K means at least a portion of the time period from when the suction nozzle 45 picks up the component P from the tape feeder 31 until it moves to the substrate K and begins to descend.

[0054] In the pre-contact heating irradiation pattern, the rotating nozzle tool 44 rotates, causing the laser irradiation unit 5 to sequentially irradiate all the parts P held by the 12 suction nozzles 45 with laser light LL. As a result, the bonding material S applied to the underside of the parts P is heated to a predetermined temperature or higher before contact with the substrate K. Subsequently, the parts P are mounted on the substrate K, the temperature of the bonding material S decreases and solidifies, and the bonding process is completed.

[0055] (3) Heat accumulation irradiation pattern The laser irradiation unit 5 irradiates the component P with laser light LL at the time before the suction nozzle 45 makes contact with the substrate K, with the laser light source 53 in the raised position HP (see Figure 5). The irradiation position of the laser light LL is limited to the component P held by the suction nozzle 45 in the raised position. Also, unlike (2), the bonding material S is assumed to be applied to the contact surface KF of the substrate K. Therefore, even if the laser irradiation unit 5 irradiates the component P with laser light LL, it cannot heat the bonding material S, but it can accumulate heat in the component P.

[0056] In the heat accumulation irradiation pattern, the rotating nozzle tool 44 rotates, causing the laser irradiation unit 5 to sequentially irradiate all the parts P held by the 12 suction nozzles 45 with laser light LL. As a result, each part P accumulates heat and reaches a temperature above a predetermined level. After the suction nozzles 45 bring the parts P into contact with the substrate K, the heat accumulated in the parts P heats the bonding material S applied to the contact surface KF of the substrate K to a temperature above a predetermined level. Subsequently, the temperature of the bonding material S decreases and it solidifies, completing the bonding process.

[0057] (4) Combined irradiation patterns The above (1) and (2) can be used in combination. However, when used in combination, the laser light irradiation unit 5 raises and lowers the laser light source 53 using the optical switching mechanism 52. With this, even if the heating of the bonding material S in the pre-contact heating irradiation pattern of (2) is insufficient, additional heating can be performed by the basic irradiation pattern of (1) to stabilize the bonding work.

[0058] Furthermore, (1) and (3) above can be used in combination. However, when used in combination, the laser irradiation unit 5 raises and lowers the laser light source 53 using the optical switching mechanism 52. With this, even if the amount of heat accumulated in the component P in the heat accumulation irradiation pattern of (3) is insufficient, additional heating can be performed by the basic irradiation pattern of (1) to stabilize the joining process.

[0059] Furthermore, in the combined use of the two cases described above, the optical switching mechanism 52 may synchronize the descent of the laser light source 53 and the reflective mirror 54 so as to coincide with the descent of the suction nozzle 45 that has attracted the component P. In this operating mode, the suction nozzle 45, the laser light source 53, and the reflective mirror 54 descend in conjunction, and the laser light LL is irradiated onto the component P throughout the time they are descending. This increases the effective irradiation time of the laser light LL on the component P, thereby stabilizing the joining process.

[0060] As can be seen from the above explanation, the combined irradiation pattern in (4) is effective for large parts P with a large heat capacity. Also, since the heat capacity of a part P is generally determined by its size, the irradiation pattern may be changed depending on the type of part P. Furthermore, since the predetermined temperature to be heated for a bonding material S is determined by its material and properties, the irradiation pattern may be changed depending on the type of bonding material S.

[0061] In the component mounting machine 1 of the first embodiment, a laser beam irradiation unit 5 is provided on the mounting head 43 that irradiates laser light LL from a direction inclined with respect to the lifting axis toward either the bonding material S, the component P, or the substrate K. With this configuration, by irradiating the laser light LL toward either the bonding material S, the component P, or the substrate K, heat loss due to heating of areas other than the required area is suppressed, and the attenuation of the laser light LL is also reduced, allowing for efficient heating of the bonding material. Furthermore, since the laser beam irradiation unit 5 can be added to a mounting head 43 or horizontal drive mechanism 40 with a general configuration, an increase in equipment costs can be suppressed with a simple configuration.

[0062] Furthermore, the laser beam irradiation unit 5 employs a configuration that combines a laser light source 53 that emits laser beam LL in a direction parallel to the lifting axis, and a reflective mirror 54 that reflects the emitted laser beam LL in a direction inclined with respect to the lifting axis. This allows the mounting head 43 to be made compact, and the horizontal movement range of the mounting head 43 is not restricted. In addition, since the laser beam irradiation unit 5 has an optical switching mechanism 52, multiple irradiation patterns can be selected and implemented to heat the bonding material S, or multiple irradiation patterns can be used in combination. It is also possible to implement a configuration in which the reflective mirror 54 is omitted and the laser light source 53 is installed at an angle. However, in this configuration, the laser light source 53 protrudes to the left and right of the X-axis moving body 42, making the mounting head 43 larger, and thus the movement range of the mounting head 43 in the left-right direction (X-axis direction) tends to be restricted.

[0063] Furthermore, while conventional technology typically requires a dedicated heating device for heating the bonding material to be placed either before or after the component mounting machine, the component mounting machine 1 of the first embodiment eliminates the need for such a device. This enables line shortening, space saving, and reduced line construction costs for the bonding work line.

[0064] 5. Parts mounting machine 1 of the second embodiment Next, a second embodiment in which paste-like solder is used as the bonding material will be described. In the second embodiment, the configuration of the component mounting machine 1 is the same as described in the first embodiment. However, the solder used as the bonding material is printed on the substrate K by the solder printing machine in the preceding process. Also, the tape feeder 31 of the component supply device 3 supplies components with electrodes on their lower surface, and the resin material supply unit 35 is shut down.

[0065] In the bonding cycle of the second embodiment, first, the mounting head 43 moves above the tape feeder 31, and the suction nozzles 45 sequentially descend and rise to perform the component suction operation. Next, the mounting head 43 moves above the component recognition camera 47, and the component recognition camera 47 takes an image. Then, the mounting head 43 moves above the substrate K, and the suction nozzles 45 sequentially descend and rise to mount the component onto the solder on the substrate K. The laser light irradiation unit 5 operates during the time when the mounting head 43 is moving above the substrate K, and during the time when the suction nozzles 45 are descending and rising above the substrate K. As a result, the solder is melted by irradiation with laser light LL, and then solidified by the subsequent temperature decrease, resulting in a good soldering state (bonding state) with a predetermined bonding strength.

[0066] In the second embodiment, the component mounting machine 1 can select and implement any of the previously described (1) basic irradiation pattern, (3) heat accumulation irradiation pattern, or a combined irradiation pattern of (1) and (3), even if the bonding material is different. In the second embodiment, as in the first embodiment, the solder can be heated efficiently, and furthermore, the increase in equipment costs can be suppressed with a simple configuration.

[0067] Furthermore, in the conventional technology, a reflow machine was required to melt the solder in the process after the component mounting machine that attaches the components, but in the second embodiment, a reflow machine is not required. In addition, the component mounting machine 1 of the second embodiment completes the bonding process, resulting in a good soldered state, thus eliminating the unstable state in which the position of components on the solder may shift or their orientation may tilt while the substrate K is being transported to the reflow machine.

[0068] 6. Third Embodiment Next, a third embodiment, in which the configuration of the laser light irradiation unit 5A differs from that of the first embodiment, will be described with reference to Figure 8. In the third embodiment, the optical switching mechanism 52 is omitted from the laser light irradiation unit 5A, and the height position of the laser light source 53 is fixed. Instead, an angle adjustment mechanism (not shown) is provided to adjust the tilt angle of the reflective mirror 54A.

[0069] At the first tilt angle of the reflective mirror 54A shown in Figure 8, the laser light LL reflected by the reflective mirror 54A is irradiated onto the component P held by the suction nozzle 45 in the raised position. When the tilt angle of the reflective mirror 54A is adjusted by the angle adjustment mechanism to a second tilt angle that is closer to the vertical than the first tilt angle, the reflection direction of the laser light LL changes as shown by the dashed line and is irradiated onto the contact surface KF of the substrate K or the bonding material S attached to the contact surface. At this time, when the suction nozzle 45 is lowered to the lowered position, the laser light LL shown by the dashed line is irradiated onto the component P pressed against the substrate K. In the third embodiment, the angle adjustment mechanism switches the irradiation position of the laser light LL instead of the optical switching mechanism 52, so the same operation, action, and effect as in the first embodiment are produced.

[0070] 7. Fourth Embodiment Next, a fourth embodiment will be described with reference to Figure 9, in which two vertically adjustable positions AP are set and the arrangement of the laser beam irradiation unit 5 differs from that of the first embodiment. In the fourth embodiment, as shown in Figure 9, two vertically adjustable positions AP are set at positions corresponding to the front and rear of the nozzle tool 44, allowing the suction nozzle 45 to move up and down.

[0071] A first laser beam irradiation unit 5, which irradiates laser beam LL toward the front vertically movable position AP, is provided on the right side of the mounting head 43. A second laser beam irradiation unit 5, which irradiates laser beam LL toward the rear vertically movable position AP, is provided on the left side of the mounting head 43. In other words, a laser beam irradiation unit 5 is provided for each of the multiple vertical axes (vertically movable positions AP).

[0072] The operation, function, and effect in the fourth embodiment are the same as in the first embodiment, except that the number of laser beam irradiation units 5 for one vertically movable position AP is different. Alternatively, as in the first embodiment, two laser beam irradiation units 5 can be provided for one vertical axis (vertically movable position AP), and a total of four laser beam irradiation units 5 can be provided for two vertical axes.

[0073] 8. Applications and Variations of Embodiments In the first embodiment, it is not essential that the suction nozzle 45 press the component P against the substrate K; a different type of component mounter may simply place the component P on the contact surface KF of the substrate K. In this case, in the basic irradiation pattern of (1), the laser light irradiation unit 5 will irradiate the laser light LL at a timing that includes the period when the suction nozzle 45 is in contact with the component P against the substrate K. Alternatively, the optical switching mechanism 52 of the laser light irradiation unit 5 may be omitted, and the laser light source 53 may be fixed to the mounting head 43, and the laser light LL may be irradiated onto the component P being pressed against the substrate K by the suction nozzle 45 in the lowered position, performing only the basic irradiation pattern of (1). On the other hand, the laser light source 53 may be fixed, and the laser light LL may be irradiated onto the component P being held by the suction nozzle 45 in the raised position, selectively performing the pre-contact heating irradiation pattern of (2) and the heat accumulation irradiation pattern of (3).

[0074] Furthermore, the mounting head 43 may have only one suction nozzle 45 without a rotating nozzle tool 44. Alternatively, the mounting head 43 may have multiple suction nozzles 45 arranged in a row or grid pattern without a nozzle tool 44, and the laser beam irradiation unit 5 may be commonly provided so as to be relatively movable relative to the multiple suction nozzles 45. In addition, the multiple embodiments of the laser beam irradiation unit 5 described above and the multiple embodiments of the component mounting device of the mounting head 43 can be freely combined and implemented.

[0075] Furthermore, as a first modification of the second embodiment, a conductive paste can be used as the bonding material, and a conductive paste supply unit can be provided at the location of the resin material supply unit 35. Also, as a second modification of the second embodiment, a conductive paste can be used as the bonding material, and an inkjet printing unit provided in the preceding inkjet printing machine or component mounting machine 1 can print the conductive paste onto the substrate K using a spray nozzle. The first to fourth embodiments can be applied and modified in various other ways. [Industrial applicability]

[0076] The configuration of the component mounting machine 1 described in the first to fourth embodiments is not limited to a model that bonds components P to a substrate K on which a circuit pattern has been formed, but can be used as a bonding machine or assembly machine that bonds components of various materials and shapes to various workpieces. [Explanation of Symbols]

[0077] 1: Component mounting machine 2: Substrate transport device 3: Component supply device 31: Tape feeder 35: Resin material supply unit 4: Component transfer and bonding device 40: Horizontal drive mechanism 43: Mounting head 431: Z-axis drive mechanism 432: Setting unit 44: Nozzle tool 443: Nozzle holder 444: Elastic body 45: Suction nozzle 5, 5A: Laser beam irradiation unit 52: Optical switching mechanism 53: Laser light source 54, 54A: Reflective mirror AP: Adjustable height AV: Vertical central axis LL: Laser beam K: Substrate KF: Contact surface P: Component S: Bonding material

Claims

1. It has a parts holder that picks up parts and attaches them to a workpiece by moving up and down along a lifting axis, and a work head that is driven horizontally by a horizontal drive mechanism, The work head or the horizontal drive mechanism includes a laser beam irradiation unit that irradiates a laser beam from a direction inclined with respect to the lifting axis toward any of the joining material, the part, or the workpiece, for heating a joining material that is applied to at least one of the contact surfaces of the part and the workpiece that come into contact with each other and generates a predetermined bonding force when heated, The laser light irradiation unit is The work head is provided with, The system includes a laser light source that emits the laser light in a direction parallel to the lifting axis, and an optical member that reflects or refracts the emitted laser light in a direction inclined with respect to the lifting axis. Joining machine.

2. The laser beam irradiation unit has an optical switching mechanism that switches the irradiation position to which the laser beam is irradiated. The joining machine according to claim 1, wherein the optical switching mechanism switches the irradiation position by changing the position of at least one of the laser light source and the optical member with respect to the work head.

3. It has a parts holder that picks up parts and attaches them to a workpiece by moving up and down along a lifting axis, and a work head that is driven horizontally by a horizontal drive mechanism, The work head or the horizontal drive mechanism includes a laser beam irradiation unit that irradiates a laser beam from a direction inclined with respect to the lifting axis toward any of the joining material, the part, or the workpiece, for heating a joining material that is applied to at least one of the contact surfaces of the part and the workpiece that come into contact with each other and generates a predetermined bonding force when heated, The laser beam irradiation unit has an optical switching mechanism that switches the irradiation position to which the laser beam is irradiated. The optical switching mechanism also has a function to fine-tune the irradiation position in response to differences in the type of component or workpiece, or in response to shape errors of the component or workpiece. Joining machine.

4. It has a parts holder that picks up parts and attaches them to a workpiece by moving up and down along a lifting axis, and a work head that is driven horizontally by a horizontal drive mechanism, The work head or the horizontal drive mechanism includes a laser beam irradiation unit that irradiates a laser beam from a direction inclined with respect to the lifting axis toward any of the joining material, the part, or the workpiece, for heating a joining material that is applied to at least one of the contact surfaces of the part and the workpiece that come into contact with each other and generates a predetermined bonding force when heated, The laser beam irradiation unit, when performing a joining operation to join the component to the workpiece, A basic irradiation pattern in which the laser light is irradiated at a timing that includes the period during which the component holder is in contact with the component, or A pre-contact heating irradiation pattern is selected in which the laser light is irradiated during the time period before the component mounting device brings the component into contact with the workpiece. Joining machine.

5. When the basic irradiation pattern is selected, the laser beam irradiation unit irradiates the laser beam while the component holder is pressing the component against the workpiece. The joining machine according to claim 4.

6. The joining machine according to claim 5, wherein the component holder is attached to the work head via an elastic body, and the pressing force generated by the compression of the elastic body presses the component against the workpiece.

7. The joining machine according to claim 4, wherein the laser light irradiation unit, when the basic irradiation pattern is selected, irradiates the component with the laser light, thereby indirectly heating the joining material through the component.

8. When the pre-contact heating irradiation pattern is selected, the laser light irradiation unit irradiates the component with the laser light to accumulate heat in the component. After the component mounting device brings the component into contact with the workpiece, the heat accumulated in the component heats the bonding material applied to the contact surface of the workpiece. The joining machine according to claim 4.

9. The joining machine according to claim 4, wherein the laser light irradiation unit is selected from the basic irradiation pattern, the pre-contact heating irradiation pattern, and a combined irradiation pattern that uses both the basic irradiation pattern and the pre-contact heating irradiation pattern.

10. The joining machine according to any one of claims 4-9, wherein the laser light irradiation unit selects one or more irradiation patterns based on the irradiation position and irradiation time of the laser light, whether the joining material is applied to the component or the workpiece, the type and heat capacity of the component, and the material of the joining material and a predetermined temperature to be heated.

11. The aforementioned component constitutes an electronic circuit, The workpiece is a substrate on which the circuit pattern of the electronic circuit is formed, The bonding material is either a non-conductive resin material or adhesive, or a conductive solder or conductive paste. A joining machine according to any one of claims 1 to 9.

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