Suck-back method and substrate processing apparatus

The siphon-type suck-back method with controlled suction speed increases addresses dripping and dust issues in substrate processing, ensuring efficient and clean removal of low surface tension liquids like IPA.

JP7870675B2Active Publication Date: 2026-06-05SCREEN HOLDINGS CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SCREEN HOLDINGS CO LTD
Filing Date
2022-07-28
Publication Date
2026-06-05

Smart Images

  • Figure 0007870675000001
    Figure 0007870675000001
  • Figure 0007870675000002
    Figure 0007870675000002
  • Figure 0007870675000003
    Figure 0007870675000003
Patent Text Reader

Abstract

To provide a suck-back method which enables adoption of siphon-type suck-back in suck-back of a treatment liquid having small surface tension.SOLUTION: There is provided a suck-back method in a substrate processing apparatus (100) including a discharge nozzle (5), a processing liquid supply pipe (121), and a siphon-type suck-back mechanism (92). The discharge nozzle (5) discharges a processing liquid toward a substrate (W). The processing liquid supply pipe (121) circulates the processing liquid to the discharge nozzle (5). The suck-back mechanism (92) performs suck-back processing of performing suck-back of a residual processing liquid that is a processing liquid remaining in the discharge nozzle (5) to a reference position (RS) by a siphon principle. The suck-back method includes the steps of: starting suck-back processing; and increasing suctions speed (X) that is speed at which the residual processing liquid moves during the suck-back processing.SELECTED DRAWING: Figure 7
Need to check novelty before this filing date? Find Prior Art