Semiconductor device, power converter, inverter board, and heat sink fin

The semiconductor device design addresses thermal resistance issues by incorporating an inclined portion in the sealing material to securely attach heat dissipation fins, enhancing heat dissipation and reliability while minimizing material and processing costs.

JP7870882B2Active Publication Date: 2026-06-05MITSUBISHI ELECTRIC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
MITSUBISHI ELECTRIC CORP
Filing Date
2024-03-27
Publication Date
2026-06-05

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Abstract

The purpose of the present invention is to provide a technology which makes it possible to reduce the thermal resistance from a semiconductor device to a heat dissipation fin. A sealing material (11) is provided with a first inclined part (23b) to which a heat dissipation fin (22) is attached by sandwiching a surface (11r) of the sealing material (11) of a semiconductor device (100), the surface (11r) being on the side where a heat sink (10) is disposed, and a surface (20r) of a circuit board (20), the surface (20r) being on the reverse side of a surface (20s) on which the semiconductor device (100) is mounted. The first inclined part (23b) is provided from a region of the sealing material (11), the region extending along a surface (10r) on the reverse side of the heat sink (10) from a surface (10s), to the surface (11r) of the sealing material (11), the surface (11r) being on the side where the heat sink (10) is disposed.
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