Wiring components for electrical equipment and power converters
The wiring member design with stacked conductors and an electromagnetic shield addresses inductance and power loss issues in high-frequency currents, improving power conversion efficiency by leveraging eddy currents.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- HITACHI IND PROD LTD
- Filing Date
- 2022-07-12
- Publication Date
- 2026-06-08
AI Technical Summary
Conventional technologies face difficulties in reducing inductance and power loss in wiring members carrying high-frequency currents, particularly due to the skin and proximity effects, which hinder efficient power conversion.
A wiring member design comprising multiple conductors stacked with an electromagnetic shield and insulating material between them, allowing eddy currents to counteract magnetic flux and facilitate high-frequency current flow without obstruction.
The design effectively reduces inductance and power loss in high-frequency currents by utilizing eddy currents generated by the electromagnetic shield, enhancing the efficiency of power conversion devices.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a wiring member for an electric device and a power conversion device, and particularly to a wiring member for flowing a high-frequency current and a power conversion device including this wiring member.
Background Art
[0002] There are cases where inductance reduction is required for a wiring member through which a high-frequency current flows. For example, in a power conversion device, power is converted between direct current and alternating current by the on and off operations of a switching element. However, at the turn-off of the switching element, a surge voltage is applied to the switching element due to the change in current and the inductance of the wiring member connected to the switching element, and the switching element may be destroyed. Therefore, inductance reduction is necessary for the wiring member. Further, for the wiring member, reduction of power loss is required in order to conduct electricity efficiently.
[0003] An example of a technique for reducing inductance of a conductor as a wiring member is described in Patent Document 1. Patent Document 1 describes a power conversion device including a laminated bus bar in which a conductor (bus bar) connected to the positive electrode of a direct current power source and a conductor connected to the negative electrode are overlapped with an insulator interposed therebetween, and the inductance is reduced by the laminated bus bar in which the conductors are adjacent to each other with an insulating material interposed therebetween.
[0004] Further, an example of a technique for reducing power loss with respect to a high-frequency current for a wiring member is described in Patent Document 2. Patent Document 2 describes a wiring member for a high-frequency current in which a plurality of metal thin plates and an insulating material for insulating adjacent metal thin plates are laminated to reduce the influence of the skin effect and reduce power loss.
Prior Art Documents
Patent Documents
[0005]
Patent Document 1
Patent Document 2
[0006] With conventional technology, it is difficult to reduce the inductance and power loss of wiring materials to a degree that fully satisfies the user.
[0007] For example, in the technology described in Patent Document 1, as the frequency of the current increases, the skin effect causes current to flow only on the surface of the conductor, and no current flows inside the conductor, making it difficult to reduce inductance and power loss. Also, in the technology described in Patent Document 2, although the skin effect can be reduced, the proximity effect that occurs between multiple thin metal plates, that is, the magnetic flux generated from the current flowing through one thin metal plate, affects other thin metal plates and makes it difficult for current to flow, which may prevent a sufficient reduction in inductance and power loss.
[0008] The objective of the present invention is to provide a wiring component for electrical equipment that can reduce inductance and power loss with respect to high-frequency currents, and a power conversion device using this wiring component. [Means for solving the problem]
[0009] The wiring member for electrical equipment according to the present invention comprises a plurality of first conductors that are electrically connected to each other and stacked, a second conductor provided between the plurality of first conductors and not electrically connected to the other conductors, and an insulating material provided between each of the first conductors and the second conductors.
[0010] The power conversion device according to the present invention comprises a capacitor, a switching element for switching a DC current on and off, and wiring connecting the capacitor and the switching element. The wiring is a wiring member according to the present invention, comprising two members each having a first conductor, a second conductor, and an insulating material. The two members face each other in the stacking direction of the first conductor, and an insulating material is provided between the members. The positive terminal of a DC power supply is connected to the first conductor of one of the members. The negative terminal of a DC power supply is connected to the first conductor of the other member. [Effects of the Invention]
[0011] According to the present invention, it is possible to provide a wiring member for electrical equipment that can reduce inductance and power loss with respect to high-frequency current, and a power conversion device using this wiring member. [Brief explanation of the drawing]
[0012] [Figure 1] A cross-sectional view of a wiring member showing an example of the configuration of a wiring member according to Embodiment 1 of the present invention. [Figure 2A] A front view of a laminated busbar, showing an example of a laminated busbar, which is a wiring member according to Embodiment 2 of the present invention. [Figure 2B] Cross-sectional view along line AA in Figure 2A. [Figure 3A] A front view of a laminate busbar, showing an example of a configuration in which the end of the laminate busbar is connected to an external device in Example 2. [Figure 3B] Cross-sectional view along line BB in Figure 3A. [Figure 4A] A front view of a laminated busbar, showing an example of the structure of the end of the laminated busbar in Example 2. [Figure 4B] Cross-sectional view along line CC in Figure 4A. [Figure 5A] A front view of a laminated busbar, showing another example of the structure of the end of the laminated busbar in Example 2. [Figure 5B] Cross-sectional view along line DD in Figure 5A. [Figure 6A] Front view of a multilayer printed circuit board showing an example of the wiring member according to Embodiment 3 of the present invention. [Figure 6B] Cross-sectional view taken along line E-E of FIG. 6A. [Figure 7A] Front view of a bus bar showing an example of the wiring member according to Embodiment 4 of the present invention. [Figure 7B] Cross-sectional view taken along line F-F of FIG. 7A. [Figure 8] Diagram showing the circuit configuration of the power conversion device according to Embodiment 5 of the present invention.
MODE FOR CARRYING OUT THE INVENTION
[0013] The wiring member of an electric device according to the present invention includes at least one of a positive electrode side conductor and a negative electrode side conductor formed by laminating a plurality of conductors, and an electromagnetic shield is provided between the laminated conductors. The wiring member according to the present invention can reduce the inductance and power loss with respect to high-frequency current due to the effect of the electromagnetic shield which is a conductor.
[0014] The power conversion device according to the present invention includes the wiring member according to the present invention and can reduce the inductance and power loss with respect to high-frequency current.
[0015] Hereinafter, the wiring member of an electric device and the power conversion device according to embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below are examples for explaining the present invention, and the present invention is not limited to these embodiments. Therefore, the present invention can be implemented in various forms without departing from the gist thereof, not limited to the following embodiments. In the drawings used in this specification, the same or corresponding components are denoted by the same reference numerals, and repeated description of these components may be omitted.
EXAMPLE
[0016] This section describes a wiring component for electrical equipment according to Embodiment 1 of the present invention. In this embodiment, the basic configuration of the wiring component for reducing inductance and power loss with respect to high-frequency current is described.
[0017] Figure 1 is a diagram showing an example of the configuration of the wiring member 50 according to this embodiment, and is a cross-sectional view of the wiring member 50. The wiring member 50 according to this embodiment comprises a positive electrode wiring member 5, a negative electrode wiring member 16, and an insulating material 1 located between the positive electrode wiring member 5 and the negative electrode wiring member 16.
[0018] The positive electrode wiring member 5 comprises a positive electrode conductor 2, an electromagnetic shield 8, and an insulating material 1. The negative electrode wiring member 16 comprises a negative electrode conductor 13, an electromagnetic shield 8, and an insulating material 1.
[0019] The positive electrode conductor 2 is constructed by stacking multiple flat conductors that are electrically connected to each other. The number of stacked and electrically connected conductors can be arbitrarily determined. In the following explanation, we will use the case where there are two such conductors as an example. That is, the positive electrode conductor 2 is constructed by stacking two flat positive electrode conductors 2a and 2b that are electrically connected to each other.
[0020] The negative electrode conductor 13, like the positive electrode conductor 2, is constructed by stacking multiple flat conductors that are electrically connected to each other. The number of these conductors can be arbitrarily determined. In the following explanation, we will use the case where there are two conductors as an example. That is, the negative electrode conductor 13 is constructed by stacking two flat negative electrode conductors 13a and 13b that are electrically connected to each other.
[0021] The electromagnetic shield 8 is provided between each of the multiple conductors that make up the positive electrode conductor 2 and between each of the multiple conductors that make up the negative electrode conductor 13. In the example shown in Figure 1, the electromagnetic shield 8 is provided between the positive electrode conductor 2a and the positive electrode conductor 2b, and between the negative electrode conductor 13a and the negative electrode conductor 13b. If the positive electrode conductor 2 and the negative electrode conductor 13 are made up of three or more conductors stacked on top of each other, the electromagnetic shield 8 is provided between each of these three or more conductors. The electromagnetic shield 8 is made up of a flat conductor and is not electrically connected to other conductors such as the positive electrode conductors 2a and 2b and the negative electrode conductors 13a and 13b.
[0022] The positive electrode conductor 2, the negative electrode conductor 13, and the electromagnetic shield 8 can be made of materials such as copper or aluminum.
[0023] The insulating material 1 is provided between the positive electrode conductor 2a and the electromagnetic shield 8, and between the electromagnetic shield 8 and the positive electrode conductor 2b. Furthermore, the insulating material 1 is provided between the negative electrode conductor 13a and the electromagnetic shield 8, and between the electromagnetic shield 8 and the negative electrode conductor 13b. The electromagnetic shield 8 is insulated from the positive electrode conductor 2 and the negative electrode conductor 13 by these insulating materials 1. Also, as described above, the insulating material 1 is provided between the positive electrode wiring member 5 and the negative electrode wiring member 16. The insulating material 1 can be a solid, gas, or liquid, and is, for example, glass epoxy resin, air, or insulating oil.
[0024] The wiring member 50 according to this embodiment may comprise only one of the positive electrode wiring member 5 and the negative electrode wiring member 16, or, as shown in Figure 1, may comprise both the positive electrode wiring member 5 and the negative electrode wiring member 16. In other words, the wiring member 50 according to this embodiment may comprise either or both of the positive electrode conductor 2 and the negative electrode conductor 13.
[0025] In a configuration where the wiring member 50 includes both a positive electrode wiring member 5 and a negative electrode wiring member 16, the positive electrode wiring member 5 and the negative electrode wiring member 16 are arranged such that the stacking directions of the positive electrode conductors 2a and 2b and the stacking directions of the negative electrode conductors 13a and 13b coincide, and they face each other in these stacking directions to constitute the wiring member 50. The insulating material 1 located between the positive electrode wiring member 5 and the negative electrode wiring member 16 is provided between the positive electrode conductor 2b and the negative electrode conductor 13a in the example shown in Figure 1.
[0026] The positive electrode conductors 2 (2a, 2b) of the positive electrode wiring member 5 can be connected to the electrodes of a DC power supply, such as the positive electrode. The negative electrode conductors 13 (13a, 13b) of the negative electrode wiring member 16 can be connected to the electrodes of a DC power supply, such as the negative electrode. Current flows through the positive electrode conductor 2 and the negative electrode conductor 13 when the electrodes of a DC power supply are connected.
[0027] The wiring member 50 according to this embodiment can reduce inductance and power loss with respect to the high-frequency components contained in the DC current when a DC current is passed through it. In this specification, not only high-frequency AC current but also high-frequency components contained in DC current are referred to as high-frequency current.
[0028] As shown in Figure 1, let's assume that current is passed through the positive electrode side conductor 2 of the positive electrode wiring member 5 in a direction perpendicular to the stacking direction of the positive electrode side conductors 2a and 2b (left-right direction in Figure 1) (for example, from the front side to the back side of the surface in Figure 1). When current 3 is passed through positive electrode side conductor 2a, a magnetic flux 4 is generated by current 3. When current 6 is passed through positive electrode side conductor 2b, a magnetic flux 7 is generated by current 6.
[0029] When magnetic fluxes 4 and 7 link with the electromagnetic shield 8, eddy currents 9 are generated in the electromagnetic shield 8 in the opposite direction to currents 3 and 6. These eddy currents 9 generate magnetic flux 10 around the electromagnetic shield 8. When this magnetic flux 10 links with the positive-side conductors 2a and 2b, eddy currents 11 are generated in the positive-side conductors 2a and 2b on the surfaces facing the electromagnetic shield 8. These eddy currents 11 are in the same direction as currents 3 and 6 and do not obstruct the flow of currents 3 and 6.
[0030] Therefore, high-frequency currents can easily flow through the positive electrode conductor 2a and positive electrode conductor 2b on the surface facing the electromagnetic shield 8. Consequently, the positive electrode wiring member 5 of the wiring member 50 according to this embodiment can reduce inductance and power loss with respect to high-frequency currents.
[0031] The negative electrode wiring member 16 has the same configuration as the positive electrode wiring member 5. Therefore, the negative electrode conductors 13a and 13b allow high-frequency currents to flow more easily on the surface facing the electromagnetic shield 8, based on the same principle as in the positive electrode wiring member 5. Accordingly, the negative electrode wiring member 16 of the wiring member 50 according to this embodiment can reduce inductance and power loss with respect to high-frequency currents. However, since the direction of the currents 14 and 17 flowing through the negative electrode conductors 13a and 13b is opposite to the direction of the currents 3 and 6 flowing through the positive electrode conductors 2a and 2b, the direction of the magnetic fluxes 15 and 18 generated by the currents 14 and 17 is opposite to the direction of the magnetic fluxes 4 and 7 generated in the positive electrode wiring member 5. Furthermore, the direction of the eddy currents 9 generated in the electromagnetic shield 8 by the magnetic fluxes 15 and 18, and the direction of the magnetic flux 10 generated around the electromagnetic shield 8, are opposite to the direction in the positive electrode wiring member 5. Similarly, the direction of the eddy currents 11 generated on the surfaces of the negative electrode conductors 13a and 13b facing the electromagnetic shield 8 is also opposite to the direction in the positive electrode wiring member 5.
[0032] In the wiring member 50 according to this embodiment, the positive electrode wiring member 5 and the negative electrode wiring member 16 face each other with the insulating material 1 in between. Therefore, the magnetic flux generated in the positive electrode conductor 2b and the negative electrode conductor 13a generates eddy currents 19 and 12, respectively, on the surfaces of the positive electrode wiring member 5 and the negative electrode wiring member 16 that face the insulating material 1 (i.e., the surfaces of the positive electrode conductor 2b and the negative electrode conductor 13a that face the insulating material 1). These eddy currents 19 and 12 are in the same direction as currents 6 and 14, respectively, and do not obstruct the flow of currents 6 and 14.
[0033] Therefore, high-frequency current can easily flow through the positive electrode conductor 2b and the negative electrode conductor 13a on the surface facing the insulating material 1 between the positive electrode wiring member 5 and the negative electrode wiring member 16. Accordingly, the positive electrode wiring member 5 and the negative electrode wiring member 16 of the wiring member 50 according to this embodiment can reduce inductance and power loss with respect to high-frequency current.
[0034] The wiring member 50 in this embodiment includes an electromagnetic shield 8 that is not electrically connected to other conductors, and generates eddy currents 9 in the electromagnetic shield 8 and eddy currents 11 in the positive electrode conductor 2 and the negative electrode conductor 13, thereby reducing inductance and power loss with respect to high-frequency currents.
[0035] Note that the configuration and current directions shown in Figure 1 represent an example of the wiring member 50 according to this embodiment. For example, the same effect as in this embodiment can be obtained even if the directions of currents 3 and 6 and currents 14 and 17 are reversed in the wiring member 50. [Examples]
[0036] An electrical equipment wiring member 50 according to Embodiment 2 of the present invention will be described. In this embodiment, a laminate busbar constructed by laminating an insulating material and a conductor will be used as an example of the wiring member 50.
[0037] Figures 2A and 2B show an example of a laminated busbar, which is the wiring member 50 according to this embodiment. Figure 2A is a front view of the laminated busbar, and Figure 2B is a cross-sectional view along line AA in Figure 2A.
[0038] The laminate busbar shown in Figures 2A and 2B comprises a positive electrode wiring member 5, a negative electrode wiring member 16, and an insulating material 1 provided between the positive electrode wiring member 5 and the negative electrode wiring member 16. The positive electrode wiring member 5 comprises a positive electrode side conductor 2 (2a, 2b), an electromagnetic shield 8, and an insulating material 1 between them. The negative electrode wiring member 16 comprises a negative electrode side conductor 13 (13a, 13b), an electromagnetic shield 8, and an insulating material 1 between them.
[0039] This section describes the electrode configuration of a laminate busbar.
[0040] On the positive side of the laminate busbar, the positive conductor 2a and the positive conductor 2b are electrically connected to each other by a spacer 20. The spacer 20 is a conductor, for example, a ring-shaped metal member. The positive conductor 2a, the positive conductor 2b, and the spacer 20 are mechanically connected, for example, by spot welding.
[0041] The laminated busbar includes a positive electrode 21. The positive electrode 21 is electrically connected to the positive conductor 2a and the positive conductor 2b. The positive electrode 21 can be made of, for example, a metal cylinder and can be installed on the laminated busbar by, for example, press-fitting. An insulating material 1 is placed between the positive electrode 21 and the negative conductor 13 to insulate them from each other.
[0042] The negative electrode side of the laminated busbar has the same configuration as the positive electrode side. The negative electrode conductor 13a and the negative electrode conductor 13b are electrically connected to each other by a spacer 20. The laminated busbar includes a negative electrode 22 that is electrically connected to the negative electrode conductors 13a and 13b. An insulating material 1 is placed between the negative electrode 22 and the positive electrode conductor 2 to insulate them from each other.
[0043] The positive electrode 21 and the negative electrode 22 are provided with through holes for screws to secure external devices such as capacitors and switching elements. In the laminated busbar shown in Figures 2A and 2B, the external devices are connected to the positive electrode 21 and the negative electrode 22 at the inner circumference of the laminated busbar. The laminated busbar can also be configured such that the external devices are connected to the positive electrode 21 and the negative electrode 22 at its ends.
[0044] Figures 3A and 3B show an example of a configuration in which the laminated busbar, which is the wiring member 50 according to this embodiment, is connected to an external device at the end of the laminated busbar. Figure 3A is a front view of the laminated busbar, and Figure 3B is a cross-sectional view along line BB in Figure 3A.
[0045] As shown in Figure 3B, the positive electrode conductor 2a has a stepped bend 23 at the end of the laminated busbar, and bends at the stepped bend 23 to contact the positive electrode conductor 2b. The positive electrode conductor 2a and the positive electrode conductor 2b are mechanically connected, for example, by spot welding. The connection between the positive electrode conductor 2a and the positive electrode conductor 2b is configured as the positive electrode 21 and has a through hole for passing a screw that secures an external device.
[0046] The negative electrode conductor 13b has the same configuration as the positive electrode conductor 2a, and is bent at the stepped bend portion 23 to connect to the negative electrode conductor 13a. The connection portion between the negative electrode conductor 13a and the negative electrode conductor 13b is configured as the negative electrode 22 and has a through hole for passing a screw that secures an external device.
[0047] As shown in Figure 3A, it is preferable that the positive electrode 21 and the negative electrode 22 are positioned apart from each other so that external devices can be easily connected to them.
[0048] As shown in Figures 2A, 2B and 3A, 3B, the laminate busbar, which is the wiring member 50 in this embodiment, has through holes in the positive electrode 21 and the negative electrode 22, and external devices such as capacitors and switching elements can be connected to these through holes by screw fastening.
[0049] An example of the structure of the end of the laminate busbar, which is the wiring member 50 according to this embodiment, will be explained using Figures 4A, 4B and 5A, 5B.
[0050] Figures 4A and 4B show an example of the end structure of a laminated busbar, which is a wiring member 50 according to this embodiment. Figure 4A is a front view of the laminated busbar, and Figure 4B is a cross-sectional view along line CC in Figure 4A.
[0051] As shown in FIG. 4B, in the positive electrode wiring member 5, an electromagnetic shield insulating plate 25, which is an insulating material 1, is installed between the positive electrode side conductor 2a and the electromagnetic shield 8 and between the electromagnetic shield 8 and the positive electrode side conductor 2b. The electromagnetic shield insulating plate 25 is adhered to the positive electrode side conductors 2a, 2b and the electromagnetic shield 8. The negative electrode wiring member 16 also has the same configuration as the positive electrode wiring member 5. A positive-negative electrode insulating plate 24, which is an insulating material 1, is installed between the positive electrode wiring member 5 and the negative electrode wiring member 16.
[0052] Let the length by which the electromagnetic shield insulating plate 25 protrudes from the positive electrode side conductors 2a, 2b and the negative electrode side conductors 13a, 13b be d2. Let the length by which the positive-negative electrode insulating plate 24 protrudes from the positive electrode side conductors 2a, 2b and the negative electrode side conductors 13a, 13b be d1.
[0053] It is preferable that the length d2 is less than or equal to the length d1 (d2 ≦ d1). In the laminated bus bar, the potential difference between the positive electrode side conductor 2 and the negative electrode side conductor 13 is large. Therefore, the length d1 needs to be a certain length such that the creepage distance between the positive electrode side conductor 2 and the negative electrode side conductor 13 becomes large. On the other hand, the potential difference between the positive electrode side conductors 2a, 2b and the electromagnetic shield 8 and the potential difference between the negative electrode side conductors 13a, 13b and the electromagnetic shield 8 are smaller than the potential difference between the positive electrode side conductor 2 and the negative electrode side conductor 13. Therefore, the length d2 can be made smaller than the length d1 (d2 < d1). The length d2 may be equal to the length d1 (d2 = d1), but if it is smaller than the length d1, there is an advantage that the amount of insulating material used can be made less.
[0054] In the example shown in FIGS. 4A and 4B, as the insulating material 1 for insulating the electromagnetic shield 8, an electromagnetic shield insulating plate 25, that is, a plate-shaped insulating material, is used. As described above, the potential difference between the electromagnetic shield 8 and the positive electrode side conductor 2 and the potential difference between the electromagnetic shield 8 and the negative electrode side conductor 13 are small. Therefore, as the insulating material 1 for insulating the electromagnetic shield 8, a thin-film insulating material, such as a thin sheet or a thin film, can be used. Hereinafter, the structure of the end portion of the laminated bus bar using an insulating sheet as the insulating material 1 for insulating the electromagnetic shield 8 will be described.
[0055] Figures 5A and 5B show other examples of the end structure of the laminated busbar, which is the wiring member 50 according to this embodiment. Figure 5A is a front view of the laminated busbar, and Figure 5B is a cross-sectional view along line DD in Figure 5A.
[0056] As shown in Figure 5B, in the positive electrode wiring member 5, an electromagnetic shield insulating sheet 26, which is an insulating material 1, is installed between the positive electrode conductor 2a and the electromagnetic shield 8, and between the electromagnetic shield 8 and the positive electrode conductor 2b. The electromagnetic shield insulating sheet 26 is bonded to the positive electrode conductors 2a and 2b and the electromagnetic shield 8. The negative electrode wiring member 16 has the same configuration as the positive electrode wiring member 5. A positive-negative electrode insulating plate 24, which is an insulating material 1, is installed between the positive electrode wiring member 5 and the negative electrode wiring member 16.
[0057] Side insulating sheets 27 are attached to the sides of the positive electrode wiring member 5 and the negative electrode wiring member 16 (i.e., the sides of the positive electrode conductor 2a and the negative electrode conductor 13b).
[0058] At the end of the laminate busbar, the electromagnetic shielding insulating sheet 26 is superimposed with the side insulating sheet 27 and bonded to the positive electrode-negative electrode insulating plate 24.
[0059] The laminated busbar, which is the wiring member 50 according to this embodiment, can reduce inductance and power loss with respect to high-frequency currents, similar to the wiring member 50 according to Embodiment 1. Furthermore, the wiring member 50 according to this embodiment has the configuration shown in Figures 4A, 4B and 5A, 5B, which allows the electromagnetic shield 8 to be effectively insulated from the positive conductor 2 and the negative conductor 13 at the end of the laminated busbar. [Examples]
[0060] The wiring member 50 for electrical equipment according to Embodiment 3 of the present invention will be described. In this embodiment, a multilayer printed circuit board will be used as an example of the wiring member 50.
[0061] Figures 6A and 6B show an example of a multilayer printed circuit board, which is the wiring member 50 according to this embodiment. Figure 6A is a front view of the multilayer printed circuit board, and Figure 6B is a cross-sectional view along line EE in Figure 6A.
[0062] The multilayer printed circuit board shown in Figures 6A and 6B comprises a positive electrode wiring member 5, a negative electrode wiring member 16, and an insulating material 1 provided between the positive electrode wiring member 5 and the negative electrode wiring member 16. The positive electrode wiring member 5 comprises a positive electrode side conductor 2 (2a, 2b), an electromagnetic shield 8, and the insulating material 1 between them. The negative electrode wiring member 16 comprises a negative electrode side conductor 13 (13a, 13b), an electromagnetic shield 8, and the insulating material 1 between them. The positive electrode side conductor 2, the negative electrode side conductor 13, and the electromagnetic shield 8 can be composed of conductors from each layer of the printed circuit board. The insulating material 1 is an insulating member between the layers of the printed circuit board and can be composed of the substrate of the printed circuit board.
[0063] In the multilayer printed circuit board, which is the wiring member 50 according to this embodiment, it is preferable to determine the layout of the conductor patterns of each layer such that an insulating material 1 is present at the edge, and the positive electrode conductor 2, the negative electrode conductor 13, and the electromagnetic shield 8 are located slightly inward from the edge. With such a layout, the electromagnetic shield 8 can be effectively insulated from the positive electrode conductor 2 and the negative electrode conductor 13 at the edge of the multilayer printed circuit board.
[0064] The configuration of electrodes on a printed circuit board will be described. The printed circuit board is equipped with a positive electrode 21 and a negative electrode 22 as electrodes.
[0065] The positive electrode 21 is formed by a through-hole 28 with metal plating inside, and is located on the side of the printed circuit board where the negative electrode conductor 13b exists. This through-hole 28 is connected to the positive electrode conductor 2a and the positive electrode conductor 2b. Including vias 29 connecting the positive electrode conductor 2a and the positive electrode conductor 2b in the printed circuit board is effective in reducing the conduction loss between the positive electrode conductor 2a and the positive electrode conductor 2b. Also, as shown in Figure 6A, since the negative electrode conductor 13b is located around the positive electrode 21, an insulating material 1 is placed around the positive electrode 21 to insulate the positive electrode 21 from the negative electrode conductor 13b.
[0066] The negative electrode 22 is formed by a through-hole 28 connecting the negative conductor 13a and the negative conductor 13b, and is located on the side of the printed circuit board where the negative conductor 13b exists. The negative conductor 13a and the negative conductor 13b are connected to each other by vias 29.
[0067] By utilizing the through-hole 28, external devices such as capacitors and switching elements can be connected to the positive electrode 21 and the negative electrode 22. For example, if the diameter of the through-hole 28 is slightly larger than the lead diameter of the device connected to the positive electrode 21 and the negative electrode 22, the device can be fixed to the printed circuit board by soldering through the through-hole 28 to the device's leads. Also, for example, in the case of a device whose electrodes are fixed to the printed circuit board with screws, if the diameter of the through-hole 28 is slightly larger than the diameter of these screws, the device can be fixed to the printed circuit board by passing the screws through the through-hole 28.
[0068] Note that the positions of the positive electrode 21 and the negative electrode 22 are not limited to the examples shown in Figures 6A and 6B. For example, the positive electrode 21 and the negative electrode 22 may be located on the surface of the printed circuit board where the positive conductor 2a exists. In this arrangement, the positive conductor 2a is located around the negative electrode 22, so an insulating material 1 is placed around the negative electrode 22 to insulate the negative electrode 22 from the positive conductor 2a.
[0069] The multilayer printed circuit board, which is the wiring member 50 according to this embodiment, can reduce inductance and power loss with respect to high-frequency currents, similar to the wiring member 50 according to Embodiment 1. Furthermore, the wiring member 50 according to this embodiment can effectively insulate the electromagnetic shield 8 from the positive electrode conductor 2 and the negative electrode conductor 13 at the edges of the multilayer printed circuit board. [Examples]
[0070] This section describes a wiring member 50 for electrical equipment according to Embodiment 4 of the present invention. In this embodiment, a busbar is used as an example of the wiring member 50. Embodiments 2 and 3 described examples in which the insulating material 1 is solid. The insulating material 1 does not have to be solid; it may be a gas such as air or a liquid such as insulating oil. In this embodiment, a wiring member 50 (busbar) in which the insulating material 1 is air is described.
[0071] Figures 7A and 7B show an example of a busbar, which is a wiring member 50 according to this embodiment. Figure 7A is a front view of the busbar, and Figure 7B is a cross-sectional view along line FF in Figure 7A.
[0072] The busbar shown in Figures 7A and 7B does not have a negative electrode wiring member 16, but does have a positive electrode wiring member 5, and comprises a positive electrode side conductor 2 (2a, 2b), an electromagnetic shield 8, and an insulating material 1 between them. The insulating material 1 is air.
[0073] The positive electrode conductors 2a and 2b are electrically connected to each other by a conductive spacer 20. Furthermore, the positive electrode conductors 2a and 2b can be fixed to the insulator 31 by bolts 32. The insulator 31 is fixed to the housing 30 to which the busbar is attached.
[0074] The electromagnetic shield 8 is installed between the positive electrode conductor 2a and the positive electrode conductor 2b. The electromagnetic shield 8 can be installed, for example, by the following method: by installing insulating spacers 35 between the electromagnetic shield 8 and the positive electrode conductor 2a and between the electromagnetic shield 8 and the positive electrode conductor 2b, and then fixing the positive electrode conductor 2a, the electromagnetic shield 8, the positive electrode conductor 2b, and the insulating spacers 35 with bolts 33 and nuts 34.
[0075] The electromagnetic shield 8 has a hole through which a bolt 33 passes. If the bolt 33 is made of a conductive material such as metal, the insulating spacer 35 is configured to cover the side of the hole in the electromagnetic shield 8. This configuration insulates the electromagnetic shield 8 from the bolt 33.
[0076] The busbar, which is the wiring member 50 in this embodiment, can reduce inductance and power loss with respect to high-frequency currents, similar to the wiring member 50 in Embodiment 1. Furthermore, the wiring member 50 in this embodiment can insulate the electromagnetic shield 8 from conductors such as the positive electrode conductor 2. [Examples]
[0077] Example 5 describes a power conversion device according to an embodiment of the present invention. The power conversion device according to this embodiment can be any power conversion device equipped with a wiring member 50 according to an embodiment of the present invention. In this embodiment, a power conversion device that converts direct current to three-phase alternating current is described as an example.
[0078] Figure 8 shows the circuit configuration of the power converter 40 according to this embodiment. The power converter 40 is a device (for example, an inverter) that converts DC current to three-phase AC current and can be connected to a DC power supply 36 and a three-phase AC load 42.
[0079] The power converter 40 comprises a capacitor 37 and a switching element 41 as its main components. The switching element 41 switches the DC current on and off. Furthermore, the power converter 40 includes a wiring member 50 according to an embodiment of the present invention (for example, the wiring member 50 according to Embodiment 2) as a wiring (pathway for the DC power supply 36) connecting the capacitor 37 and the switching element 41. In Figure 8, the wiring member 50 is shown with a thick line.
[0080] Generally, the wiring connecting the capacitor 37 and the switching element 41 has parasitic inductances, specifically a positive-side parasitic inductance 38 and a negative-side parasitic inductance 39. When the switching element 41 turns off from the ON state, the current flowing through this wiring changes rapidly, and the current contains high-frequency components. Therefore, if the positive-side parasitic inductance 38 and the negative-side parasitic inductance 39 are large, an excessive surge voltage may be applied to the switching element 41, potentially damaging it.
[0081] The power converter 40 according to this embodiment includes a wiring member 50 according to an embodiment of the present invention as the wiring connecting the capacitor 37 and the switching element 41, thereby reducing inductance and power loss with respect to high-frequency current (DC current containing high-frequency components). In other words, because the inductance of the wiring connecting the capacitor 37 and the switching element 41 is small in the power converter 40 according to this embodiment, surge voltage can be reduced, and damage to the switching element 41 can be prevented.
[0082] It should be noted that the present invention is not limited to the embodiments described above, and various modifications are possible. For example, the embodiments described above are explained in detail to make the present invention easier to understand, and the present invention is not necessarily limited to embodiments having all the configurations described. Furthermore, it is possible to replace parts of the configuration of one embodiment with the configuration of another embodiment. It is also possible to add configurations from other embodiments to the configuration of one embodiment. Furthermore, it is possible to delete parts of the configuration of each embodiment, or to add or replace other configurations. [Explanation of Symbols]
[0083] 1...Insulating material, 2, 2a, 2b...Positive electrode conductor, 3...Current, 4...Magnetic flux, 5...Positive electrode wiring component, 6...Current, 7...Magnetic flux, 8...Electromagnetic shield, 9...Eddy current, 10...Magnetic flux, 11...Eddy current, 12...Eddy current, 13, 13a, 13b...Negative electrode conductor, 14...Current, 15...Magnetic flux, 16...Negative electrode wiring component, 17...Current, 18...Magnetic flux, 19...Eddy current, 20...Spacer, 21...Positive electrode, 22...Negative electrode, 23...Stepped bend section, 24...Insulating plate between positive and negative electrodes 25...Electromagnetic shielding insulating plate, 26...Electromagnetic shielding insulating sheet, 27...Side insulating sheet, 28...Through hole, 29...Via, 30...Enclosure, 31...Insulator, 32...Bolt, 33...Bolt, 34...Nut, 35...Insulating spacer, 36...DC power supply, 37...Capacitor, 38...Positive side parasitic inductance, 39...Negative side parasitic inductance, 40...Power converter, 41...Switching element, 42...Three-phase AC load, 50...Wiring material.
Claims
1. Multiple first conductors that are electrically connected to each other and stacked, A second conductor is provided between a plurality of the aforementioned first conductors and is not electrically connected to the other conductors, An insulating material provided between the first conductor and the second conductor, A wiring component for electrical equipment, characterized by comprising the following features.
2. The device comprises two members each having the first conductor, the second conductor, and the insulating material. The two members face each other in the stacking direction of the first conductor, and an insulating material is provided between the members. Wiring member for electrical equipment as described in claim 1.
3. The positive terminal of a DC power supply is connected to the first conductor of the other member. The negative terminal of a DC power supply is connected to the first conductor of the other member. Wiring member for electrical equipment according to claim 2.
4. Capacitors and, A switching element that switches DC current on and off, The wiring connects the capacitor and the switching element, The aforementioned wiring is the wiring member described in claim 3. A power conversion device characterized by the following features.