Substrate processing method and substrate processing apparatus

Abstract

To surely uniform a cleaning level in a radial direction of a substrate by previously measuring an inclination of the substrate.SOLUTION: A substrate processing method includes a step (S17) of adjusting a parameter of a depression pressure and a movement speed in accordance with an inclination on the basis of an inclination of a peripheral edge part against a center part of the substrate previously acquired. Therefore, since the parameter is adjusted in accordance with the inclination in each substrate, a cleaning level in the radial direction of the substrate can be surely uniformed. Since a movement speed of a cleaning arm is adjusted in additional to the depression pressure of a brush, an adjustment that cannot be adjusted only by the depression pressure of the brush is assisted at the movement speed of the cleaning arm.SELECTED DRAWING: Figure 13

Description

Technical Field

[0001] The present invention relates to a substrate processing method and a substrate processing apparatus for performing a cleaning process by applying a brush to substrates such as semiconductor substrates, substrates for flat panel displays (FPD) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs.

Background Art

[0002] Conventionally, as this type of apparatus, there is one including a rotary support portion, a brush, a cleaning arm, and a control unit (see, for example, Patent Document 1). The rotary support portion rotates the substrate while supporting the end face of the substrate. The cleaning arm has a rotating brush at its tip side. The cleaning arm swings the brush from the central portion to the peripheral portion of the substrate. The control unit controls the pressing force to be smaller when the brush is located at the peripheral portion of the substrate than when the brush is located at the central portion of the substrate.

[0003] Generally, when a substrate is supported by the rotary support portion at its end face, the substrate sinks due to its own weight and becomes a downwardly convex curved state. In addition, the peripheral portion of a substrate that has undergone various processes may warp more than the central portion. That is, the peripheral portion of the substrate is in an inclined posture with respect to the central portion of the substrate that is in a substantially horizontal posture. When processing this substrate, if the brush is applied with a constant pressing force over the entire surface of the substrate, the area where the brush acts at the peripheral portion becomes smaller than that at the central portion. Then, the pressing force per unit area becomes higher at the peripheral portion than at the central portion. As a result, a difference occurs in the degree to which the brush acts on the substrate in the radial direction of the substrate, and the cleaning degree in the radial direction of the substrate becomes non-uniform.

[0004] Therefore, the control unit adjusts the pressing force according to the position of the brush as described above. Thereby, the pressing force per unit area in the radial direction of the substrate can be made constant. That is, the degree to which the brush acts in the radial direction of the substrate can be made constant. Therefore, the cleaning degree in the radial direction of the substrate can be made uniform.

Prior Art Documents

[0005] [Patent Document 1] Patent No. 6178019 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, conventional examples with such a configuration have the following problems. In other words, the curvature and warping of the substrate generally differ from one substrate to another. Therefore, even if the control unit uniformly reduces the pressing pressure according to the brush position, it may not be possible to keep the pressing pressure per unit area constant in the radial direction of the substrate. As a result, it may not be possible to achieve a uniform degree of cleaning in the radial direction of the substrate.

[0007] The present invention has been made in view of these circumstances, and aims to provide a substrate processing method and a substrate processing apparatus that can reliably ensure uniform cleaning in the radial direction of a substrate by pre-measuring the inclination of the substrate. [Means for solving the problem]

[0008] To achieve this objective, the present invention has the following configuration. In other words, the invention described in claim 1 is a substrate processing method for performing a cleaning process by applying a brush to a substrate, wherein the method is performed in the order of: an inclination measurement process for measuring the inclination of the peripheral edge with respect to the central part of the substrate; and a cleaning process for applying pressure to a brush provided on the tip side of a cleaning arm, moving the cleaning arm at a moving speed, and applying the brush to the substrate while moving it from the central part to the peripheral edge of the substrate, and during the cleaning process, at least one of the parameters of the pressure and the moving speed is adjusted according to the inclination.

[0009] [Function / Effect] According to the invention described in claim 1, the inclination measurement process measures the inclination of the peripheral edge relative to the center of the substrate. During the cleaning process, at least one of the parameters, the brush pressure and the cleaning arm's movement speed, is adjusted according to the measured inclination. Therefore, since the parameters are adjusted according to the inclination of each substrate, the degree of cleaning in the radial direction of the substrate can be made uniform. Furthermore, even if the brush pressure cannot be adjusted, this can be compensated for by adjusting the cleaning arm's movement speed. In addition, by adjusting the cleaning arm's movement speed in addition to the brush pressure, the portion that cannot be adjusted by the brush pressure alone can be compensated for by the cleaning arm's movement speed.

[0010] Furthermore, in the present invention, it is preferable to reduce the parameter at the peripheral edge of the substrate compared to the central part (Claim 2).

[0011] If the peripheral edge of the substrate is inclined relative to the center, the area over which the brush acts decreases at the peripheral edge. As a result, the force per unit area of ​​the brush increases at the peripheral edge, and the area over which the brush acts per unit time decreases. Therefore, parameters are reduced at the peripheral edge. When the pressing force is reduced, the pressure per unit area acting on the upper surface of the substrate at the peripheral edge is reduced. This allows for uniform pressure per unit area in the radial direction of the substrate. When the moving speed is reduced, the time over which the brush acts on the upper surface of the substrate at the peripheral edge increases, and the area over which the brush acts per unit time increases. This allows for uniform area over which the brush acts per unit time in the radial direction of the substrate.

[0012] Furthermore, in the present invention, it is preferable that the inclination measurement process is carried out by moving the cleaning arm while a measuring instrument is attached to the cleaning arm at a position adjacent to the brush, and at a distance from the base end of the cleaning arm equal to the distance between the base end of the cleaning arm and the brush (Claim 3).

[0013] The inclination of the substrate at the same position as the brush's movement trajectory can be measured using a measuring instrument. Therefore, the inclination at the position necessary for parameter adjustment can be accurately measured.

[0014] Furthermore, in the present invention, it is preferable that the inclination measurement process is performed immediately before the cleaning process while the substrate is held in the rotating holding unit (Claim 4).

[0015] Since the inclination is measured while the substrate is held in the rotating holder, the inclination of the substrate, which affects parameter adjustment during the cleaning process, can be accurately measured. Furthermore, although the inclination may change due to some processing of the substrate, the measurement is taken immediately before the cleaning process, ensuring accurate measurement of the substrate's inclination. Therefore, parameters can be accurately adjusted to the inclination of the substrate being processed during the cleaning process.

[0016] Furthermore, the invention described in claim 5 is a substrate processing apparatus that performs cleaning processing by applying a brush to a substrate, comprising: a rotating holding unit that holds the substrate in a horizontal position and rotates the substrate; a brush that acts on the upper surface of the substrate held by the rotating holding unit; a cleaning arm having the brush at its tip; an arm driving unit that drives the cleaning arm so that the brush moves radially across the substrate between the rotation center and the periphery of the substrate held by the rotating holding unit; a pressing mechanism that biases the brush toward the substrate with pressing pressure; and when performing cleaning processing on the substrate while applying pressing pressure to the brush and moving the brush from the center to the periphery of the substrate, the pressing mechanism and the arm driving unit are controlled based on the inclination of the periphery relative to the center of the substrate which has been acquired in advance, thereby controlling the pressing pressure and the Washing arm The system is characterized by comprising a control unit that adjusts at least one of the parameters, such as the movement speed, according to the inclination.

[0017] [Operation and Effect] According to the invention described in claim 5, the control unit controls at least one of the pressing mechanism and the arm driving unit to adjust at least one of the parameters of the pressing force and the moving speed according to the inclination of the peripheral portion with respect to the central portion of the substrate acquired in advance. Therefore, since the parameters are adjusted according to the inclination of each substrate, the cleaning degree in the radial direction of the substrate can be surely made uniform. Further, even when the pressing force of the brush cannot be adjusted, it can be dealt with by adjusting the moving speed of the cleaning arm. Furthermore, by adjusting the moving speed of the cleaning arm in addition to the pressing force of the brush, the portion that cannot be adjusted only by the pressing force of the brush can be compensated by the moving speed of the cleaning arm.

Effect of the Invention

[0018] According to the substrate processing method according to the present invention, in the inclination measurement process, the inclination of the peripheral portion with respect to the central portion of the substrate is measured. In the cleaning process, at least one of the parameters of the pressing force of the brush and the moving speed of the cleaning arm is adjusted according to the measured inclination. Therefore, since the parameters are adjusted according to the inclination of each substrate, the cleaning degree in the radial direction of the substrate can be surely made uniform. Further, even when the pressing force of the brush cannot be adjusted, it can be dealt with by adjusting the moving speed of the cleaning arm. Furthermore, by adjusting the moving speed of the cleaning arm in addition to the pressing force of the brush, the portion that cannot be adjusted only by the pressing force of the brush can be compensated by the moving speed of the cleaning arm.

Brief Description of the Drawings

[0019] [Figure 1] It is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment. [Figure 2] It is a view of the substrate processing apparatus in FIG. 1 seen from the rear X. [Figure 3] It is a plan view showing the schematic configuration of the back surface cleaning unit according to the embodiment. [Figure 4] [[ID=2​​​​​It is a block diagram showing a control system of a back surface cleaning unit. [Figure 7] It is a schematic diagram explaining the operating states of brushes at the central part and the peripheral part of a warped substrate. [Figure 8] It is a graph showing the relationship between the position in the radial direction of a substrate and its inclination. [Figure 9] It is a graph showing the relationship between the position in the radial direction of a substrate and its moving speed. [Figure 10] It is a graph showing the relationship between the position in the radial direction of a substrate and the pressing force. [Figure 11] It is a flowchart showing preprocessing to be performed in advance. [Figure 12] (a) shows the relationship between the opening degree of a pneumatic regulator and the load of an electronic balance, (b) shows the relationship between the secondary-side pressure of the pneumatic regulator and the opening degree, and (c) is a graph showing the relationship between the load of a pressing actuator and the secondary-side pressure of the pneumatic regulator. [Figure 13] It is a flowchart showing the cleaning process.

Embodiments for Carrying Out the Invention

[0020] <000011​​​​​​​​​​​​​​​​​​In this specification, for convenience, the direction in which the loading / unloading block 3, indexer block 5, and processing block 7 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from the processing block 7 toward the loading / unloading block 3 is called the "front". The direction opposite to the front is called the "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called the "right". The direction opposite to the right is called the "left". The direction perpendicular to the horizontal is called the "vertical direction Z". In each figure, front, rear, right, left, up, and down are shown as appropriate for reference.

[0025] <2. Loading / Unloading Block>

[0026] The loading / unloading block 3 includes an input section 9 and an output section 11. The input section 9 and the output section 11 are arranged in the width direction Y. Multiple substrates W (for example, 25) are stacked horizontally at regular intervals within a single carrier C. The carrier C containing the unprocessed substrates W is placed on the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has multiple grooves (not shown) formed therein, which accommodate each substrate W with the surfaces of the substrates W spaced apart. The carrier C accommodates the substrates W in a orientation with the surface facing upwards. An example of a carrier C is a FOUP (Front Opening Unify Pod). A FOUP is a sealed container. The carrier C may be an open container, and is of any type.

[0027] The dispensing unit 11 is located on the opposite side of the input unit 9, across the center of the width Y in the substrate processing apparatus 1. The dispensing unit 11 is positioned to the left Y of the input unit 9. The dispensing unit 11 stores the processed substrates W in a carrier C and dispenses the carrier C together. The dispensing unit 11, which functions in this way, is equipped with, for example, two mounting tables 13 for placing the carrier C, similar to the input unit 9. The input unit 9 and the dispensing unit 11 are also called load ports.

[0028] <3. Indexer Block>

[0029] The indexer block 5 is located adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.

[0030] The indexer robot IR is configured to rotate around the vertical Z direction. The indexer robot IR is configured to move in the width direction Y. The indexer robot IR comprises a first hand 19 and a second hand 21. In Figure 1, only one hand is shown for illustrative purposes. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to move independently in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical Z direction, moving the first hand 19 and the second hand 21 forward and backward to transfer the substrate W between each cassette C. Similarly, the indexer robot IR transfers the substrate W between itself and the transfer unit 15.

[0031] The transfer section 15 is located at the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is located, for example, in the center in the width direction Y. As shown in Figure 2, the transfer section 15 is formed to be elongated in the vertical direction Z.

[0032] The transfer unit 15 comprises a first reversal unit 23, a pass unit 25, a pass unit 27, and a second reversal unit 29, extending from below to above in the vertical direction Z.

[0033] The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexer block 5. The first inversion unit 23 also inverts the horizontal orientation of the substrate W. Specifically, the first inversion unit 23 changes the orientation of the substrate W from having the top surface facing upwards to having the top surface facing downwards. In other words, it changes the orientation of the substrate W so that the back surface faces upwards.

[0034] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the orientation of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W, which is facing downwards, to an orientation where the front surface is facing upwards. In other words, it converts the orientation of the substrate W so that the back surface is facing downwards.

[0035] The inversion directions of the first inversion unit 23 and the second inversion unit 29 described above may be opposite to each other. That is, the first inversion unit 23 changes the orientation of the substrate W so that the front surface is facing upwards. The second inversion unit 29 changes the orientation of the substrate W so that the back surface is facing upwards.

[0036] The path sections 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. Path section 25 is used, for example, to transport the substrate W from the processing block 7 to the indexer block 5. Path section 27 is used, for example, to transport the substrate W from the indexer block 5 to the processing block 7. Note that the transport directions of the substrate W in path sections 25 and 27 may be opposite to each other.

[0037] <4. Processing Block>

[0038] Processing block 7 performs a cleaning process on the substrate W, for example. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in Figure 1, processing block 7 is divided into, for example, a first column R1, a second column R2, and a third column R3 in the width direction Y. In detail, the first column R1 is located to the left in Y. The second column R2 is located in the center of the width direction Y. In other words, the second column R2 is located to the right of the first column R1 in Y. The third column R3 is located to the right of the second column R2 in Y.

[0039] <4-1. 1st column>

[0040] The first column R1 of the processing block 7 comprises multiple processing units 31. For example, the first column R1 comprises four processing units 31. The first column R1 consists of four processing units 31 stacked in the vertical direction Z. Each processing unit 31 will be described in detail later. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. Cleaning units include a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR will be used as an example of a processing unit 31.

[0041] <4-2. 2nd column>

[0042] The second column R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable about the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to move independently in the front-rear direction X and the width direction Y.

[0043] <4-3. 3rd column>

[0044] The third column R3 of processing block 7 has the same configuration as the first column R1. That is, the third column R3 has multiple processing units 31. For example, the third column R3 has four processing units 31. The four processing units 31 in the third column R3 are stacked in the vertical direction Z. Each processing unit 31 in the first column R1 and each processing unit 31 in the third column R3 are positioned opposite each other in the width direction Y. This allows the center robot CR to access each opposing processing unit 31 in the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0045] Processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly explained. The center robot CR receives the substrate W from the first inversion unit 23, for example. The center robot CR transports the substrate W to either the first row R1 or the third row R3 back surface cleaning unit SSR to perform cleaning on the back surface of the substrate W. The center robot CR receives the substrate W that has been cleaned by either the first row R1 or the third row R3 back surface cleaning unit SSR. The center robot CR transports the substrate W to the second inversion unit 29.

[0046] <4-4. Processing Unit>

[0047] Here, the back surface cleaning unit SSR (processing unit 31) will be described with reference to Figures 3 to 5. Figure 3 is a plan view showing the schematic configuration of the back surface cleaning unit according to the embodiment. Figure 4 is a side view showing the schematic configuration of the back surface cleaning unit. Figure 5 is a longitudinal cross-sectional view of the cleaning arm.

[0048] Here, we will explain using the back surface cleaning unit SSR provided in the first row R1 as an example. The back surface cleaning unit SSR in the third row R3 has a configuration where the arrangement in the width direction Y is reversed.

[0049] The back surface cleaning unit SSR comprises a rotating holding section 37, a guard 39, a first processing liquid arm 41, a second processing liquid arm 43, a cleaning arm 45, and a standby pot 47.

[0050] The rotating holding unit 37 is positioned approximately in the center of the back surface cleaning unit SSR in a plan view. The rotating holding unit 37 rotates the substrate W in the horizontal plane while holding the substrate W in a horizontal position. The rotating holding unit 37 comprises an electric motor 49, a rotating shaft 51, a spin chuck 53, and a support pin 55.

[0051] The electric motor 49 is positioned with its rotating shaft 51 oriented in the vertical direction Z. A spin chuck 53 is attached to the upper end of the rotating shaft 51. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate-like member. The spin chuck 53 is equipped with a plurality of support pins 55. In this embodiment, for example, there are six support pins 55. The six support pins 55 contact the outer edge of the substrate W and support the substrate W in a horizontal position. The number of support pins 55 is not limited to six, as long as the substrate W can be stably supported in a horizontal position. The six support pins 55 are erected near the outer edge of the substrate W in the spin chuck 53. The six support pins 55 release the holding of the periphery of the substrate W when the substrate W is loaded into the spin chuck 53 and when the substrate W is unloaded from the spin chuck 53. Therefore, each support pin 55 is configured to be rotatable about the vertical direction Z. A detailed explanation of the specific configuration for performing this operation will be omitted. When the electric motor 49 rotates, the rotation holding unit 37 rotates the spin chuck 53 about the rotation center P1. The rotation center P1 is in the vertical direction Z.

[0052] <4-4-2. Guard>

[0053] The guard 39 is positioned to surround the rotating holding part 37 in a plan view. More specifically, the guard 39 comprises a cylindrical body 57 and an inclined part 59. The guard 39 is configured to be able to move up and down in the vertical direction Z. The guard 39 can move between a lowered standby position and a processing position above the standby position. A detailed explanation of the specific configuration for moving the guard 39 up and down is omitted.

[0054] The body 57 of the guard 39 is cylindrical. The inner circumferential surface of the body 57 is positioned outward from the outer circumferential side of the rotating holding part 37. The inclined part 59 is narrowed from the top of the body 57 toward the rotating shaft 51 side. The inclined part 59 has an opening 61 at its top. The opening 61 is formed in the center of the inclined part 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When loading or unloading the substrate W, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. When cleaning the substrate W, the inclined part 59 of the guard 39 is positioned at approximately the height of the substrate W held by the spin chuck 53. The inclined part 59 guides the processing liquid and other substances scattered from the substrate W to the lower part of the guard 39 with its inclined inner circumferential surface.

[0055] <4-4-3. First Processing Liquid Arm>

[0056] The first processing liquid arm 41 is positioned rear X of the rotation holding unit 37 in a plan view. The first processing liquid arm 41 is equipped with an electric motor 42 at its base end. The first processing liquid arm 41 is oscillated around a rotation center P2 at its base end by the electric motor 42. The rotation center P2 is in the vertical direction Z. The first processing liquid arm 41 is equipped with one nozzle 63. The nozzle 63 has a discharge port at its bottom. The nozzle 63 discharges processing liquid. The tip of the nozzle 63 of the first processing liquid arm 41 is configured to swing between a standby position shown in Figure 3 and a supply position near the rotation center P1. When the first processing liquid arm 41 supplies processing liquid to the substrate W, the tip of the nozzle 63 is moved to the supply position. When the first processing liquid arm 41 does not supply processing liquid to the substrate W, the tip of the nozzle 63 is moved to the standby position. The first processing liquid arm 41 may be configured to swing its nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the processing liquid to the substrate W.

[0057] Examples of the processing liquid discharged from the nozzle 63 include a rinsing solution. Examples of rinsing solutions include pure water, carbonated water, electrolyzed ionized water, hydrogen water, and ozonated water.

[0058] <4-4-4. Second processing fluid arm>

[0059] The second processing liquid arm 41 is positioned to the left Y of the rotation holding unit 37 in a plan view. The second processing liquid arm 41 is equipped with an electric motor 44 at its base end. The second processing liquid arm is oscillated by the electric motor 44 around a rotation center P3 at its base end. The rotation center P3 is in the vertical direction Z. The second processing liquid arm 43 is equipped with three nozzles 65, 67, and 69. Each nozzle 65, 67, and 69 has a discharge port at its bottom. The nozzles 65, 67, and 69 discharge processing liquid. The second processing liquid arm 43 is configured so that the tips of the nozzles 65, 67, and 69 can oscillate between a standby position shown in Figure 3 and a supply position near the rotation center P1. When the second processing liquid arm 43 supplies processing liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to the supply position. When the second processing liquid arm 43 is not supplying processing liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to a standby position. When supplying processing liquid to the substrate W, the second processing liquid arm 43 may also be configured to swing the nozzles 65, 67, and 69 above the substrate W to avoid interference with the cleaning arm 45.

[0060] Examples of the processing liquid discharged from nozzles 65, 67, and 69 include chemical solutions. Examples of chemical solutions include those containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide. More specifically, a mixture of ammonia water and hydrogen peroxide, such as SC-1, can be used.

[0061] <4-4-5. Washing Arm>

[0062] The cleaning arm 45 is configured as follows:

[0063] The cleaning arm 45 comprises a rotating and lifting mechanism 71, a support column 73, a housing 75, and a cleaning section 77.

[0064] The rotary lifting mechanism 71 is configured to allow the support column 73, the housing 75, and the cleaning unit 77 to move up and down in the vertical direction Z. The rotary lifting mechanism 71 is configured to allow the support column 73, the housing 75, and the cleaning unit 77 to swing around the rotation center P4. Specifically, the rotary lifting mechanism 71 is configured, for example, by combining an electric motor and an air cylinder. In the standby position, the rotary lifting mechanism 71 raises the cleaning unit 77 from the standby pot 47 in the vertical direction Z. The rotary lifting mechanism 71 swings (moves) the cleaning unit 77 in a horizontal plane so that the cleaning unit 77 passes near the rotation center P1.

[0065] The support column 73 is cylindrical in shape. The lower part of the support column 73 is connected to the rotational lifting mechanism 71. The upper part of the support column 73 is connected to one of the lower parts of the housing 75. The housing 75 has a long axis in the horizontal plane. The housing 75 is equipped with a cleaning unit 77 at the other lower part. The cleaning unit 77 rotates around a rotation center P5. The rotation center P5 is in the vertical direction Z.

[0066] The enclosure 75 comprises a lower enclosure 75a and an upper enclosure 75b. The lower enclosure 75a constitutes the lower part of the enclosure 75. The upper enclosure 75b constitutes the upper part of the enclosure 75. The upper enclosure 75b and the lower enclosure 75a are connected to each other.

[0067] The housing 75 is equipped with a pressing mechanism 81 and a rotating mechanism 83. Specifically, the lower housing 75a is equipped with the pressing mechanism 81 and the rotating mechanism 83.

[0068] The pressing mechanism 81 comprises a pivot member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.

[0069] The pivot member 85 is attached to the upper surface of the lower housing 75a. The pivot member 85 is erected approximately in the center of the lower housing 75a in the front-rear direction X. The pivot member 85 has a pivot shaft 85a at its upper part. The pivot shaft 85a is rotatable about the width direction Y. The seesaw member 87 has its central part 87c pivotably attached to the pivot member 85 via the pivot shaft 85a. The seesaw member 87 has both ends, one side 87l (point of application) and the other side 87r (point of force application), which can alternately move up and down in the vertical direction Z. The pivot shaft 85a is the pivot point of the seesaw member 87.

[0070] The pressing actuator 89 has an operating piece 89a positioned vertically in the Z direction. The pressing actuator 89 raises one side 87l of the seesaw member 87 by extending the operating shaft 89a. The pressing actuator 89 is preferably an air bearing actuator, for example.

[0071] In an air bearing actuator, the operating shaft 89a is supported by air, allowing it to move back and forth with a small gap. Therefore, theoretically, the sliding resistance of the operating shaft 89a is zero, and no friction occurs. As a result, an air bearing actuator can move the operating shaft 89a back and forth even with a small amount of air pressure, compared to a conventional air cylinder. Consequently, it is possible to move it back and forth linearly in response to the air pressure. However, a conventional air cylinder can also be used as the pressing actuator 89.

[0072] In the front-rear direction X, a support mechanism 91 is provided on the opposite side of the pressing actuator 89, which is flanked by the pivot member 85. The support mechanism 91 supports the cleaning unit 77. The support mechanism 91 suspends the cleaning unit 77 below the housing 75.

[0073] The support mechanism 91 includes a holding member 93, a biasing part 95, and a guide part 97.

[0074] The support mechanism 91 suspends and supports the cleaning unit 77. The cleaning unit 77 includes a brush 99 and a brush holder 101. The brush 99 acts on the substrate W to perform cleaning. The brush holder 101 holds the brush 99. The brush holder 101 detachably holds the brush 99. A rotating shaft 103 is attached to the center of the brush holder 101 in a plan view. The rotating shaft 103 extends vertically in the Z direction from the brush holder 101. The brush 99 is held by the cleaning arm 45 and moves in the horizontal plane so as to pass near the rotation center P1 of the substrate W.

[0075] The retaining member 93 rotatably holds the rotating shaft 103. The rotating shaft 103 is, for example, a spline shaft. The rotating shaft 103 is attached to the retaining member 93 via a spline nut 103a. The rotating shaft 103 is movable vertically in the Z direction relative to the spline nut 103a. The retaining member 93 holds the spline nut 103a in a state that allows it to rotate around the vertical Z direction. The spline nut 103a is attached to the retaining member 93 via a bearing (not shown). The rotating shaft 103 is rotatable around the rotation center P5. A pulley 105 is attached to the spline nut 103a protruding from the upper part of the retaining member 93. The pulley 105 is fixed to the outer circumferential surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and the rotating shaft 103 rotates in the same direction along with it.

[0076] A biasing part 95 is positioned on the upper part of the pulley 105. The biasing part 95 comprises an upper holding part 107, a lower holding part 109, and a coil spring 111. The upper holding part 107 is attached to the upper side of the rotating shaft 103 via a bearing (not shown). In other words, the upper holding part 107 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is positioned spaced apart from the upper holding part 107. The lower holding part 109 is located below the upper holding part 107 and on the upper part of the pulley 105. The inner circumferential surface of the lower holding part 109 is positioned spaced apart from the outer circumferential surface of the rotating shaft 103. Therefore, the lower holding part 109 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is also attached to the upper surface of the pulley 105 via a bearing. Therefore, the lower holding portion 109 is not affected by the rotation of the pulley 105.

[0077] The coil spring 111 is attached to the upper holding portion 107 and the lower holding portion 109. The upper end of the coil spring 111 is fixed to the upper holding portion 107. The lower end of the coil spring 111 is fixed to the lower holding portion 109. The coil spring 111 has, for example, a cylindrical shape. The coil spring 111 is a compression coil spring. Therefore, the upper holding portion 107 is biased upward from the upper surface of the pulley 105 and the lower holding portion 109. As a result, the rotating shaft 103 is biased upward in the vertical direction Z. Therefore, in the normal state when the pressing actuator 89 is not operating, the brush 99 is maintained at a constant height from the lower surface of the lower housing 75a. In other words, in the normal state, the load on the brush 99 is zero.

[0078] The support mechanism 91 supports a rotating shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 comprises a linear guide 113 and a shaft holding part 115. The linear guide 113 is positioned adjacent to the holding member 93. The linear guide 113 is erected in the vertical direction Z. The linear guide 113 comprises a rail 113a and a carriage 113b. The rail 113a has its longitudinal direction oriented in the vertical direction Z. The carriage 113b is attached to the rail 113a so as to be movable in the vertical direction Z. The carriage 113b is positioned below the other side 87r of the seesaw member 87. The carriage 113b is positioned to contact the other side 87r of the seesaw member 87 when it is lowered.

[0079] The shaft holder 115 holds the upper part of the rotating shaft 103. The shaft holder 115 holds the rotating shaft 103 in a state that allows it to rotate. The shaft holder 115 holds the rotating shaft 103 via, for example, a bearing (not shown). The carriage 113b is connected to the shaft holder 115. When the pressing actuator 89 raises the operating shaft 89a with a driving force stronger than the biasing force of the coil spring 111, one side 87l (point of application) rises. When one side 87l rises, the other side 87r (point of force application) descends. At this time, the other side 87r lowers the carriage 113b together with the shaft holder 115. As a result, the rotating shaft 103 descends, and the brush 99 moves downward from its predetermined position. When the pressing actuator 89 is driven in this manner, a pressing force corresponding to the driving force of the pressing actuator 89 is applied to the brush 99.

[0080] A rotating mechanism 83 is positioned adjacent to the support mechanism 91. The rotating mechanism 83 is positioned on the pivot member 85 side. The rotating mechanism 83 comprises a mounting member 117 and an electric motor 119. The mounting member 117 is positioned above the bottom surface of the lower housing 75a, spaced apart from the electric motor 119. The rotating shaft of the electric motor 119 is positioned downward in the vertical direction Z. The electric motor 119 rotates its rotating shaft around a rotation center P6. The rotation center P6 is approximately parallel to the rotation center P5 in the vertical direction Z. A pulley 121 is attached to the rotating shaft of the electric motor 119. A timing belt 123 is stretched between pulley 121 and pulley 105. Therefore, when the electric motor 119 rotates, the rotating shaft 103 rotates around the rotation center P5 via the timing belt 123, pulleys 105 and 121, and spline nut 103a. Even when the rotation axis 103 is rotated in this manner, the rotation axis 103 can still move up and down in the vertical direction Z.

[0081] As described above, the cleaning arm 45 is configured as follows. In other words, the operation of the pressing actuator 89 is applied to the other side 87r (point of application) of the seesaw member 87 via one side 87l (point of force application). Therefore, by providing the seesaw member 87, the degree of freedom in the placement of the pressing actuator 89 is increased. Consequently, the height of the substrate processing apparatus 1 can be suppressed. As a result, a multi-stage stacking arrangement of the substrate processing apparatus 1 can be easily realized.

[0082] Now, let's explain the height to which brush 99 moves up and down.

[0083] The seesaw member 87 described above is oscillated by the pressing actuator 89. For example, the pressing actuator 89 is operated according to the target load, as will be described later. This operation moves the brush 99 vertically in the Z direction. Specifically, the brush 99 is raised and lowered to the following heights.

[0084] (1) No-load height H1: This is the height in the vertical direction Z at which the brush 99 does not act on the substrate W. This no-load height H1 is higher than the other heights listed below. Under normal conditions, except during cleaning, the brush 99 is positioned at this no-load height H1.

[0085] (2) Working height H2: This is the vertical Z height required to apply a predetermined load to the substrate W with the brush 99. This height is lower than the unloaded height H1. When performing a cleaning treatment on the substrate W, the brush 99 is lowered to this working height H2. However, this position is the height at which a predetermined load is applied to the brush 99 and the reaction force from the substrate W balances the load.

[0086] (3) Maximum indentation height H3: This is a height lower than the working height H2. This is the lowest position the brush 99 moves to in the vertical direction Z. This maximum indentation height H3 is determined by the structure of the pressing mechanism 81. The brush 99 cannot move below this maximum indentation height H3.

[0087] <4-4-6. Displacement Gauge>

[0088] Here, the displacement meter 401 will be described with reference to Figure 3. This displacement meter 401 does not need to be permanently installed on the back surface cleaning unit SSR. In other words, it may be a device that is attached only when necessary. However, this does not preclude permanently installing it on the cleaning arm 45 of each back surface cleaning unit SSR. When the displacement meter 401 is permanently installed, it is preferable to automatically measure the radial inclination of the substrate W that has been brought in prior to the cleaning process. This allows for improved throughput while measuring the radial inclination of the substrate W. In this embodiment, the displacement meter 401 will be described as being installed on the cleaning arm 45.

[0089] The displacement meter 401 measures the degree to which the surface of the substrate W is warped in the radial direction. The displacement meter 401 measures the inclination of the surface of the substrate W. The displacement meter 401 measures the radial inclination of the peripheral edge from the center of the substrate W to the edge face. The displacement meter 401 measures the distance from the center of the substrate W to the edge face relative to the reference point.

[0090] The displacement meter 401 is preferably, for example, a laser displacement meter. A laser displacement meter allows for non-contact, precise measurements in the micrometer range. A laser displacement meter is small and lightweight. Therefore, it is suitable for being attached to the cleaning arm 45 to measure the inclination of the substrate W.

[0091] The displacement meter 401 has a measurement point 401a, which is a location for measurement in a plan view. The displacement meter 401 measures the distance from the measurement point 401a to the position where the substrate W overlaps in a plan view. The brush 99 is located at a distance d1 in the width direction Y from the rotation center P4. The displacement meter 401 is attached to the cleaning arm 45 such that the measurement point 401a is located at a distance d2 in the width direction Y from the rotation center P4. The displacement meter 405 is attached, for example, to the rear X side of the cleaning arm 45. It is preferable that the displacement meter 401 is equipped with a data output terminal. The displacement meter 401 outputs the distance to the top surface of the measured substrate W from the data output terminal.

[0092] Since the displacement meter 401 is attached to the cleaning arm 45 as described above, it can follow the same trajectory as the brush 99 during the cleaning process. Therefore, the displacement meter 401 can measure the distance to the same position as the surface of the substrate W on which the brush 99 acts. As a result, the inclination necessary for adjusting the parameters described later can be accurately measured.

[0093] The displacement gauge 401 mentioned above corresponds to the "measuring instrument" in this invention.

[0094] <4-5. Control System>

[0095] Now refer to Figure 6. Figure 6 is a block diagram showing the control system of the back surface cleaning unit.

[0096] One end of the pipe 125 is connected to the nozzle 63 described above. The other end of the pipe 125 is connected to a rinse liquid supply source 127. The rinse liquid supply source 127 supplies the rinse liquid described above. The pipe 125 is equipped with a flow control valve 129. The flow control valve 129 controls the flow rate of the rinse liquid in the pipe 125.

[0097] One end of the piping 131 is connected to the nozzle 65 described above. The other end of the piping 131 is connected to a processing liquid supply source 133. The processing liquid supply source 133 supplies one of the various chemical solutions described above. The piping 131 is equipped with a flow control valve 135. The flow control valve 135 controls the flow rate of the chemical solution in the piping 131.

[0098] One end of the piping 137 is connected to the nozzle 67 mentioned above. The other end of the piping 137 is connected to a processing liquid supply source 139. The processing liquid supply source 139 supplies one of the various chemical solutions mentioned above. The piping 137 is equipped with a flow control valve 141. The flow control valve 141 controls the flow rate of the chemical solution in the piping 139.

[0099] One end of the piping 143 is connected to the nozzle 69 mentioned above. The other end of the piping 143 is connected to a processing liquid supply source 145. The processing liquid supply source 145 supplies one of the various chemical solutions mentioned above. The piping 143 is equipped with a flow control valve 147. The flow control valve 147 controls the flow rate of the chemical solution in the piping 143.

[0100] One end of the air supply pipe 149 is connected to the aforementioned pressing actuator 89. Although the pressing actuator 89 is supplied with air to support the operating shaft 89a with a small gap, this piping and other related details are omitted. An air supply source 151 is connected to the other end of the air supply pipe 149. The air supply source 151 supplies, for example, air. The air is preferably dry air. The air supply source 151 is also connected to other devices. The supply pressure of the air supply source 151 is affected by the operating status of the other devices. In other words, the supply pressure may decrease when the operating rate of the other devices increases. The air supply pipe 149 is equipped with, in order from the air supply source 151 side, an on-off valve 153, a primary side pressure gauge 155, an electro-pneumatic regulator 157, and a secondary side pressure gauge 159.

[0101] The on / off valve 153 allows or blocks the flow of air in the air supply pipe 149. The primary pressure gauge 155 measures the air pressure upstream of the electro-pneumatic regulator 157. The electro-pneumatic regulator 157 adjusts the opening of its built-in valve in response to an input signal. This allows the electro-pneumatic regulator 157 to adjust the air pressure in the air supply pipe 149. Specifically, the electro-pneumatic regulator 157 reduces the primary pressure by adjusting the valve opening in response to a given input signal, which becomes the secondary pressure in the air supply pipe 149. The electro-pneumatic regulator 157 cannot adjust the secondary pressure to a level higher than the primary pressure in the air supply pipe 149. The electro-pneumatic regulator 157 adjusts the secondary pressure to be less than or equal to the primary pressure in the air supply pipe 149. If the primary pressure exceeds a predetermined value, the electro-pneumatic regulator 157 can adjust the secondary pressure to a range below that predetermined value. In other words, if the primary pressure of the electro-pneumatic regulator 157 is below a predetermined value, it may not be able to accurately adjust the secondary pressure to a certain value or higher.

[0102] The control unit 161 comprehensively controls each of the above-mentioned parts. Specifically, the control unit 161 controls the transport operations in the input unit 9 and the discharge unit 11, the transport operations of the indexer robot IR, the reversal operations of the first reversal unit 23 and the second reversal unit 29, and the transport operations of the center robot CR. The control unit 161 controls the rotation of the electric motor 49 in the back surface cleaning unit SSR (processing unit 31), the lifting and lowering operations of the guard 39, the opening and closing operations of the support pin 55 in the spin chuck 53, the oscillating operations of the electric motors 42 and 44, the opening and closing operations of the flow control valves 129, 135, 141, and 147, the oscillating and lifting operations of the rotary lifting mechanism 71, the rotation operation of the electric motor 119, the opening and closing operations of the on / off valve 153, and the opening degree operation of the electro-pneumatic regulator 157.

[0103] The control unit 161 includes a CPU and memory (not shown). An instruction unit 163 is connected to the control unit 161. The instruction unit 163 is operated by the operator of the substrate processing device 1. The instruction unit 163 is used by the operator to provide instructions such as recipes that define the processing content of the substrate W, and to start and stop processing. An alert unit 165 is connected to the control unit 161. The alert unit 165 generates an alarm when a problem occurs in the substrate processing device 1 to notify the operator of the problem. The alert unit 165 may be, for example, a display device, lamp, buzzer, or speaker. Preferably, the alert unit 165 can confirm the type of problem that has occurred. The control unit 161 includes an input port IP. Data from various electronic devices is input to the input port IP. The data input from the input port IP is processed or stored in the control unit 161.

[0104] A tilt memory 403 is connected to the control unit 161. During tilt measurement, which will be described later, the control unit 161 moves the cleaning arm 45 from the center to the periphery of the substrate W, in the same manner as the cleaning process. The control unit 161 receives signals related to the distance of each position in the radial direction of the substrate W, output from the displacement meter 401, from the input port IP. The control unit 161 stores the radial position and distance of the substrate W in the tilt memory 403, associating them. By associating the radial position and distance of the substrate W, the distribution of distance in the radial direction of the substrate W, that is, the radial tilt of the substrate W, can be obtained.

[0105] During the cleaning process, the control unit 161 refers to the inclination memory 403 and adjusts at least one of the movement speed of the cleaning arm 45 and the pressing pressure applied to the brush 99 according to the inclination corresponding to the radial position of the brush 99. In other words, during the cleaning process, the control unit 161 operates at least one of the rotational lifting mechanism 71 and the pressing pressure mechanism 81 according to the radial position of the brush 99.

[0106] Furthermore, this rotational lifting mechanism 71 corresponds to the "arm drive unit" of the present invention. Also, this pressing mechanism 81 corresponds to the "pressing mechanism" of the present invention.

[0107] Now, refer to Figure 7. Figure 7 is a schematic diagram illustrating the action of the brush on the central and peripheral parts of a warped substrate.

[0108] If the substrate W is warped, a difference in the action of the brush 99 will occur between the central part CP and the peripheral part PP. Here, for example, as shown in Figure 7, the peripheral part PP of the substrate W is sagging downwards relative to the central part CP of the substrate W, which is radially separated from the substrate W. In other words, the peripheral part PP of the substrate W is warped downwards relative to the central part CP.

[0109] When cleaning a substrate W with such warping, the tip 99a of the brush 99 acts on the upper surface of the substrate W with almost the entire lower surface at the central part CP. In other words, when a target load is applied to the brush 99, the tip 99a receives a reaction force corresponding to the target load across almost its entire surface. To put it another way, almost the entire surface of the tip 99a receives roughly the same amount of pressure.

[0110] In Figure 7, the area of ​​the lower surface of the tip 99a of the brush 99 acting on the substrate W is represented by the symbol CA as the pressure-equal area (hatched region). The case of the central part CP is denoted as pressure-equal area CA1. On the other hand, at the peripheral part PP, only a portion of the tip 99a of the brush 99 closer to the central part CP acts on the upper surface of the substrate W. In other words, when a target load is applied to the brush 99, only a portion of the tip 99a receives a reaction force corresponding to the target load. In other words, only a portion of the tip 99a receives the same pressure. In this case, the area acting on the upper surface of the substrate W is denoted as pressure-equal area CA2. In this example, pressure-equal area CA1 > pressure-equal area CA2.

[0111] When the same target load is applied to the central part CP and the peripheral part PP of the brush 99, the area of ​​equal pressure acting on the upper surface of the substrate W is different, so the load per unit area acting on the upper surface of the substrate W will be different between the central part CP and the peripheral part PP. In other words, the force that the brush 99 acts on the upper surface of the substrate W is different in the radial direction of the substrate W.

[0112] Therefore, the control unit 161 adjusts at least one of the movement speed of the cleaning arm 45 and the pressing pressure applied to the brush 99, according to the inclination corresponding to the radial position of the brush 99, so that the force exerted by the brush 99 on the upper surface of the substrate W is the same in the radial direction of the substrate W. The movement speed and pressing pressure are parameters for adjusting the degree of cleaning.

[0113] Now, refer to Figures 8 to 10. Figure 8 is a graph showing the relationship between the radial position of the substrate and its tilt. Figure 9 is a graph showing the relationship between the radial position of the substrate and its movement speed. Figure 10 is a graph showing the relationship between the radial position of the substrate and the pressing force.

[0114] Here, we assume that the substrate W has a curvature, and as an example, has a slope as shown in Figure 8. In other words, the peripheral edge of the substrate W is curved downward relative to the center. The radial slope of this substrate W is the distribution of the radial distance of the substrate W measured by the displacement meter 401. Specifically, when the radial distance of the substrate W is 0, i.e., at the center r1, it is taken as distance L1. Distance L1 is the reference for the radial distance of the substrate W. This distance L1 is set to 0. At the radial distance r2 of the substrate W, for example, it is taken as distance L2 which is further downward than distance L1. At the radial distance r3 of the substrate W, for example, it is taken as distance L3 which is further downward than distance L2. Thus, the slope of the substrate W is the distribution of distances L2 and L3 at radial positions r2 and r3 of the substrate W, with distance L1 at the center r1 of the substrate W as the reference.

[0115] If the substrate W is tilted as shown in Figure 8, the control unit 161 adjusts the movement speed of the cleaning arm 45, which is one of the parameters, as shown in Figure 9.

[0116] The control unit 161 moves from the central part r1 towards the periphery at a moving speed V1. This moving speed V1 remains constant until the periphery if the substrate W is not warped. The control unit 161 reduces the moving speed towards the periphery r3, using the moving speed V1 at the central part r1 as a reference, according to the inclination of the substrate W as shown in Figure 8. Specifically, at a radial distance r2 of the substrate W, the moving speed V2 is set to be lower than the moving speed V1, according to the radial inclination of the substrate W. At a radial distance r3 of the substrate W, the moving speed V3 is set to be lower than the moving speed V2, according to the radial inclination of the substrate W. These moving speeds V1 to V3 are set so that the degree of cleaning in the radial direction of the substrate W is constant. The specific adjustment of the moving speed is performed by the control unit 161 operating the rotation speed of the rotary lifting mechanism 71 around the rotation center P4.

[0117] As described above, the area of ​​equal pressure CA1 in the center of the substrate W is larger than the area of ​​equal pressure CA2 in the peripheral area. In other words, the area acting on the substrate W is larger in the center and smaller in the peripheral area. Therefore, the area acted on by the brush 99 is smaller in the peripheral area compared to the center. Thus, by reducing the movement speed, which is a parameter of the cleaning arm 45, as described above, the time that the brush 99 acts on the upper surface of the substrate W in the peripheral area is increased, and the area acted on by the brush 99 per unit time is increased. As a result, the area acted on by the brush 99 per unit time can be made uniform in the radial direction of the substrate W.

[0118] Furthermore, the control unit 161 adjusts the pressing pressure of the brush 99, which is one of the parameters, as shown in Figure 10.

[0119] The control unit 161 moves from the central part r1 towards the periphery with a pressing force F1. This pressing force F1 remains constant up to the periphery if there is no warping in the substrate W. Using the pressing force F1 at the central part r1 as a reference, the control unit 161 decreases the pressing force towards the periphery r3 according to the inclination of the substrate W shown in Figure 8. Specifically, at a radial distance r2 of the substrate W, the pressing force F2 is set to be lower than the pressing force F1 according to the radial inclination of the substrate W. At a radial distance r3 of the substrate W, the pressing force F3 is set to be lower than the pressing force F2 according to the radial inclination of the substrate W. These pressing forces F1 to F3 are set so that the degree of cleaning in the radial direction of the substrate W is constant. The specific adjustment of the pressing force is performed by the control unit 161 adjusting the secondary side by operating the opening of the electro-pneumatic regulator 157.

[0120] As described above, the area of ​​uniform pressure CA1 in the center of the substrate W is larger than the area of ​​uniform pressure CA2 in the peripheral area. In other words, the area over which the brush 99 acts on the substrate W is larger in the center and smaller in the peripheral area. Therefore, by reducing the pressing pressure, which is a parameter of the brush 99, the force per unit area applied to the upper surface of the substrate W at the peripheral area is reduced. As a result, the pressure per unit area can be made uniform in the radial direction of the substrate W.

[0121] In this embodiment, the control unit 161 adjusts the two parameters described above, the moving speed and the pressing pressure, according to the inclination of the substrate W.

[0122] The aforementioned back surface cleaning unit SSR (processing unit 31) corresponds to the "substrate processing apparatus" in this invention.

[0123] <5. Pre-processing in the processing unit>

[0124] The pretreatment in the SSR back surface cleaning device described above will be explained with reference to Figures 11 and 12. Figure 11 is a flowchart showing the pretreatment to be performed in advance. Figure 12(a) shows the relationship between the opening degree of the electro-pneumatic regulator and the load of the electronic balance, Figure 12(b) shows the relationship between the secondary pressure of the electro-pneumatic regulator and the opening degree, and Figure 12(c) is a graph showing the relationship between the load of the pressing actuator and the secondary pressure of the electro-pneumatic regulator.

[0125] The operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct a pre-treatment for one back surface cleaning unit SSR.

[0126] Step S1 An electronic balance is placed. Specifically, an electronic balance (not shown) is placed in the rotating holding unit 37. The electronic balance is a device for measuring load. Preferably, the electronic balance is equipped with a data output terminal. The data output terminal of the electronic balance is connected to the input port IP. The electronic balance outputs a measured value from the data output terminal. The measured value is, for example, load (g).

[0127] Step S2 The load is measured. Specifically, for example, the control unit 161 varies the input signal to the electro-pneumatic regulator 157 with the on-off valve 153 open, and measures the load X(g) on ​​the electronic balance for each input signal. Alternatively, the operator may specify several loads (target loads X(g)) that they want to apply with the brush 99 during processing from the instruction unit 163, and vary the input signal to the electro-pneumatic regulator 157 so that the measured value of the electronic balance becomes each target load X(g), thereby obtaining the input signal corresponding to each target load X(g). At this time, the control unit 161 receives the secondary pressure, which is the measured value of the secondary pressure gauge 159 for each load.

[0128] Step S3 The control unit 161 stores the correspondence between the measured loads. Based on the measurement in step S2, the control unit 161 obtains the relationship between the opening degree (input signal) of the electro-pneumatic regulator 157 and the load of the electronic balance (target load X(g)) as shown in Figure 10(a), and the relationship between the secondary pressure of the electro-pneumatic regulator 157 and the opening degree as shown in Figure 10(b). Along with the above relationships, the control unit 161 stores in memory the relationship between the load of the pressing actuator 89 and the secondary pressure of the electro-pneumatic regulator 157 as shown in Figure 10(c).

[0129] Step S4 The operator of the substrate processing apparatus 1 operates the instruction unit 163 to signal the completion of pre-treatment for one back surface cleaning unit SSR. The operator of the substrate processing apparatus 1 removes the electronic balance from the rotating holding unit 37. If necessary, the same pre-treatment is performed on the other back surface cleaning units SSR.

[0130] <6. Cleaning process in the processing unit>

[0131] Next, the cleaning process will be described with reference to Figure 13. Figure 13 is a flowchart of the cleaning process. Note that the explanation of the liquid supply operation by the first liquid supply arm 41 and the second liquid supply arm 43 will be omitted below.

[0132] Step S11 The operator gives the command to start processing. Specifically, they also give the command, which includes the target load X(g). Then the substrate W is transported from the indexer block 5 to the transfer unit 15, and its orientation is changed in the first inversion unit 23 so that the back side faces upwards.

[0133] Step S12 The substrate W, with its reverse side facing upwards, is transported by the central robot CR to a single reverse side cleaning unit SSR.

[0134] Step S13 The tilt measurement process is performed. Specifically, with the substrate W held by the rotation holding unit 37, the displacement meter 401 is scanned as described above. At this time, the control unit 161 stores the radial tilt of the substrate W in the tilt memory 403.

[0135] Step S14 The SSR (Surface Cleaning Unit) begins the cleaning process.

[0136] Step S15 The brush 99 is moved to the center of the substrate W. Specifically, the control unit 161 moves the cleaning arm 45 to position the brush 99 at the rotation center P1.

[0137] Step S16 The cleaning arm 45 is moved. The control unit 161 starts moving the cleaning arm 45, causing it to move from the center of the substrate W towards the edge surface beyond the peripheral edge.

[0138] Step S17 The parameters are adjusted according to the radial position of the substrate W. Specifically, the control unit 161 adjusts the movement speed of the cleaning arm 45 and the pressing pressure of the brush 99. The specific adjustment involves decreasing the parameters according to the inclination, as described above.

[0139] Step S18 The process branches depending on whether a predetermined number of scans have been completed, with the brush 99 moving from the center to the edge of the substrate W due to the movement of the cleaning arm 45 as described above. If the predetermined number of scans has not been reached, the process returns to step S15, and the cleaning arm 45 is moved so that the brush 99 acts on the substrate W while returning from the edge to the center of the substrate W. At this time, as in step S17, the parameters are adjusted according to the radial position of the substrate W. If the predetermined number of scans has been reached, the process proceeds to step S19.

[0140] Step S19 The process moves on to the next substrate W. The control unit 161 has the center robot CR remove the processed substrate W. Next, the cleaning process is performed on the next substrate W that has been brought in by the center robot CR. In other words, the process returns to step S12 above.

[0141] Step S13 described above corresponds to the "inclination measurement process" in the present invention. Steps SS14 to S18 described above correspond to the "cleaning process" in the present invention.

[0142] In this embodiment, the control unit 161 adjusts the parameters of pressing pressure and moving speed according to the inclination of the peripheral edge relative to the center of the substrate W, which has been acquired in advance. Therefore, since the parameters are adjusted according to the inclination of each substrate W, the degree of cleaning in the radial direction of the substrate W can be made uniform. Since the moving speed of the cleaning arm 45 is adjusted in addition to the pressing pressure of the brush 99, the amount that cannot be adjusted by the pressing pressure of the brush 99 alone can be compensated for by the moving speed of the cleaning arm 45.

[0143] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0144] (1) In the embodiments described above, a back surface cleaning unit SSR was used as an example of a substrate processing apparatus. However, the present invention is not limited to a back surface cleaning unit SSR. For example, a surface cleaning unit that cleans the surface of a substrate with a brush 99 can also be applied.

[0145] (2) In the above-described embodiment, the substrate processing apparatus was described using as an example a configuration in which the back surface cleaning unit SSR (processing unit 31) as a substrate processing apparatus is provided in a substrate processing apparatus 1 equipped with an input / output block 3, an indexer block 5, and the like. However, the present invention is not limited to such a configuration. For example, it may consist only of the back surface cleaning unit SSR (processing unit 31).

[0146] (3) In the embodiments described above, the cleaning arm 45 does not have a mechanism for detecting the load applied to the brush 99. However, the present invention is not limited to such a configuration. For example, the force applied to the carriage 113b may be detected by a load cell, and the degree of agreement with the target load may be detected.

[0147] (4) In the embodiments described above, the case in which both the pressing pressure and the moving speed parameters are adjusted was explained as an example. However, the present invention is not limited to such examples. That is, at least one of the parameters of pressing pressure and moving speed may be adjusted according to the incline. This makes it possible to adjust the moving speed of the cleaning arm 45 even if the pressing pressure of the brush 99 cannot be adjusted. Furthermore, even in a configuration in which the moving speed of the cleaning arm 45 cannot be adjusted, it is possible to adjust the pressing pressure of the brush 99.

[0148] (5) In the above-described embodiment, the movement speed of the cleaning arm 45 is adjusted to decrease. However, depending on the non-uniformity of the degree of cleaning of the substrate W, the movement speed of the cleaning arm 45 may be adjusted to increase. In other words, although the area on which the brush 99 acts is almost smaller at the periphery, the pressure per unit area is higher. Therefore, depending on the condition of the cleaning surface of the substrate W, shortening the time on which the brush 99 acts may make the degree of cleaning more uniform.

[0149] (6) In the above-described embodiment, a convex upward curvature was described as an example in which the peripheral edge of the substrate W droops downward relative to the central part. However, the present invention is not limited to such a substrate W. That is, a substrate W having a convex downward curvature can also be processed.

[0150] (7) In the above-described embodiment, the inclination of the substrate W is measured immediately before the substrate W is subjected to cleaning. However, the present invention is not limited to this form. For example, the inclination of multiple substrates W may be measured in another measurement unit having the same configuration as the rotating holding unit 37 of the back surface cleaning unit SSR, and the inclination may be stored for each substrate W. Then, when processing each substrate W with the back surface cleaning unit SSR, the inclination corresponding to the substrate W may be transferred to the inclination memory 403, and the control unit 161 may refer to the inclination memory 403 to adjust the parameters. This makes it possible to measure the inclination efficiently.

[0151] (8) In the embodiments described above, a configuration in which the displacement sensor 401 is attached to the cleaning arm 45 was used as an example. However, the present invention is not limited to such a configuration. For example, a configuration may be adopted that includes a dedicated arm to which the displacement sensor 401 is attached. In this case, the dedicated arm is configured so that the displacement sensor 401 can move along the same movement trajectory as the brush 99.

[0152] (9) In the embodiments described above, a displacement gauge was used as an example of a measuring instrument. However, the measuring instrument in the present invention is not limited to a displacement gauge. In other words, any measuring instrument that can measure the radial inclination of the substrate at each position may be used.

[0153] (10) In the above-described embodiment, the movement of the brush 99 was performed by rotational driving by a rotary lifting mechanism 71 mounted on the cleaning arm 45. However, the configuration is not limited to this, and the cleaning arm 45 may be linearly driven by a linear motion mechanism using a ball screw, a linear guide, and a motor that rotates the ball screw, and the movement of the brush 99 held on the cleaning arm 45 may be linear. [Explanation of Symbols]

[0154] 1 ... Substrate processing equipment 3… Loading / unloading block 5… Indexerblock 7 ... Processing block W… Circuit board C... Career IR… Indexer Robot 15 … Delivery department 23 … First Inversion Unit 25, 27 ... Pass section 29… Second Inversion Unit 31… Processing Unit SSR… Backside cleaning unit CR... Center Robot 37 ... Rotation holding part 39… Guard 41 ... First processing fluid arm 42… Electric motor 43... Second processing fluid arm 45... Washing arm 47... Standby Pod 53… Spin Chuck 71… Rotary lifting mechanism 75… Cabinet 77 ... Cleaning section 81... Pressing mechanism 83… Rotation mechanism 85 ... Pivot member 87... Seesaw component 87c … central part 87l ... one side 87r ... Other side 89… Pressing actuator 91…Support mechanism 93 ... Retaining member 95 ... biasing part 97… Guide Section 99… Brush 99a … Tip 101… Brush holder 103 ... Rotation axis 111... Coil spring 113… Linear guide H1 ... Unloaded height H2 ... Actual height H3… Maximum indentation height 149 ... Air supply pipe 151 ... Air supply source 155… Primary pressure gauge 157... Electro-pneumatic regulator 159… Secondary pressure gauge 161 ... Control Unit 163 … Instruction section 165... Hochi Department 401 ... Displacement meter 401a ... Measurement point 403... Inclination Memory CP…Central part PP ... Peripheral area CA, CA1, CA2 … Same pressure area

Claims

1. In a substrate processing method that involves applying a brush to a substrate to perform a cleaning process, The inclination measurement process for measuring the inclination of the peripheral edge relative to the center of the substrate, A cleaning process in which pressure is applied to a brush provided at the tip of a cleaning arm, and the cleaning arm is moved at a moving speed, causing the brush to move from the center to the periphery of the substrate and act on the substrate; In that order, A substrate processing method characterized in that, during the cleaning process, at least one of the parameters of pressing pressure and moving speed is adjusted according to the inclination.

2. In the substrate processing method described in claim 1, The aforementioned adjustment is characterized by reducing the parameter at the peripheral edge of the substrate compared to the central part.

3. In the substrate processing method according to claim 1 or 2, The substrate processing method is characterized in that the inclination measurement process is carried out by moving the cleaning arm while a measuring instrument is attached to the cleaning arm at a position adjacent to the brush, and at a distance from the base end of the cleaning arm equal to the distance between the base end of the cleaning arm and the brush.

4. In the substrate processing method according to claim 1 or 2, A substrate processing method characterized in that the inclination measurement process is performed immediately before the cleaning process while the substrate is held in the rotating holding unit.

5. In a substrate processing apparatus that performs cleaning on a substrate by applying a brush, A rotating holding unit that holds the substrate in a horizontal position and rotates the substrate, A brush that acts on the upper surface of the substrate held by the rotating holding part, A cleaning arm equipped with the aforementioned brush at its tip, An arm drive unit drives the cleaning arm so that the brush moves radially across the substrate between the center of rotation and the peripheral edge of the substrate held by the rotating holding unit, A pressing mechanism that biases the brush toward the substrate with pressing force, When performing a cleaning process on a substrate while applying pressure to the brush and moving the brush from the center to the periphery of the substrate, a control unit controls at least one of the parameters of the pressure and the movement speed of the cleaning arm, based on the previously acquired inclination of the periphery relative to the center of the substrate, thereby adjusting at least one of the parameters of the pressure and the movement speed of the cleaning arm according to the inclination. A substrate processing apparatus characterized by comprising the following features.

6. In the substrate processing apparatus according to claim 5, The substrate processing apparatus is characterized in that the control unit reduces the parameter at the peripheral edge of the substrate compared to the central part.

7. In the substrate processing apparatus according to claim 5 or 6, The substrate processing apparatus is characterized in that the inclination is measured by moving the cleaning arm while the substrate is held in the rotating holding part, with a measuring instrument attached to a position adjacent to the brush of the cleaning arm, and at a distance from the base end of the cleaning arm equal to the distance between the base end of the cleaning arm and the brush.

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