Information processing device, information analysis system, and measurement method

Abstract

To solve the problem that a sensing device needs to be connected in addition to an information processing device to detect a state amount.SOLUTION: An information processing device comprises at least a first chip and a second chip. The first chip includes a first transmission control section that generates a transmission signal and a first transmission coil that is connected to the first transmission control section and transmits the transmission signal. The second chip includes a second reception coil that can receive the transmission signal by performing inductive coupling with the first transmission coil and a second detection section that detects a voltage or a current applied to the second reception coil. The first chip and the second chip are positioned in proximity to be capable of wirelessly communicating with each other through inductive coupling, and the second detection section detects a change in relative positions of the first chip and the second chip, vibrations applied to the first and second chips, a pressure change, a temperature change, or an electromagnetic wave when a change in the voltage or the current generated in the second reception coil satisfies a predetermined condition.SELECTED DRAWING: Figure 1

Description

【Technical Field】 【0001】 The present invention relates to an information processing apparatus, an information analysis system, and a measurement method. 【Background Art】 【0002】 An information processing apparatus has been proposed that horizontally integrates a plurality of chips having coils and performs wireless communication between the chips using the inductive coupling generated between the coils, enabling flexible adaptation to changes in the mounting shape and form (see, for example, Patent Document 1). 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2021-87044 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 In order to detect a state quantity, a sensing device and an information processing apparatus that acquires a detection signal from the sensing device as digital data are required. 【0005】 In Patent Document 1, although an information processing apparatus that can flexibly respond to changes in the mounting shape and form by performing wireless communication between chips using the inductive coupling generated between the coils is disclosed, the information processing apparatus does not have a sensing function, and in order to detect a state quantity, it was necessary to connect a sensing device in addition to the information processing apparatus. 【0006】 The present invention has been made in view of such a background, and an object thereof is to provide an information processing apparatus having a sensing function and an information processing function. 【Means for Solving the Problems】 【0007】 To achieve the above objective, the present invention provides an information processing apparatus comprising at least a first chip and a second chip, wherein the first chip includes a first transmission control unit that generates a transmission signal and a first transmission coil connected to the first transmission control unit that transmits the transmission signal, and the second chip includes a second receiving coil capable of receiving the transmission signal by inductive coupling with the first transmitting coil and a second detection unit that detects a voltage or current applied to the second receiving coil, wherein the first chip and the second chip are arranged in close proximity to each other so as to enable wireless communication by inductive coupling, and the second detection unit detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips when a change in voltage or current occurring in the second receiving coil satisfies predetermined conditions. 【0008】 Further issues and solutions disclosed in this application will be made clear in the section on embodiments of the invention and in the drawings. [Effects of the Invention] 【0009】 According to the present invention, it is possible to provide an information processing device having sensing and information processing functions. [Brief explanation of the drawing] 【0010】 [Figure 1] This diagram shows the functional configuration of the information processing device 100 of this embodiment. [Figure 2] This diagram shows a hardware configuration diagram illustrating the principle of wireless communication between chips in the information processing device 100 of this embodiment. [Figure 3-1] This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are arranged on the two chips of this embodiment. [Figure 3-2] This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are arranged on the two chips of this embodiment. [Figure 3-3]This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are arranged on the two chips of this embodiment. [Figure 3-4] This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are arranged on the two chips of this embodiment. [Figure 4] This figure shows an example of a detailed implementation circuit of the information processing device 100 of this embodiment. [Figure 5] This figure shows the time variation of the transmitted signal from the transmitting chip, the induced voltage V of the receiving coil, and the received signal from the receiving chip in this embodiment. [Figure 6] This figure shows an example of the time variation of the induced voltage V generated in the receiving coil when the relative position of the chips in this embodiment changes. [Figure 7] This diagram shows an operation flowchart in which the information processing device detects state variables such as vibration according to this embodiment. [Figure 8] This figure shows an example of the functional configuration of the information processing device 100 in Example 2. [Figure 9] This figure shows a hardware configuration diagram illustrating the principle by which chips 110, 120, and 130 perform wireless communication in Example 2. [Figure 10] This example shows a configuration in which multiple chips from Example 2 are arranged to communicate with each other. [Figure 11] This diagram shows a hardware configuration illustrating the principle by which chips 110 and 120 perform wireless communication in Example 3. [Figure 12-1] This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are located on the two chips in Example 3. [Figure 12-2] This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are located on the two chips in Example 3. [Figure 12-3] This figure shows the change in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are located on the two chips in Example 3. [Figure 12-4]It is a diagram showing the change in the positional relationship between the transmission coil 122 and the reception coil 111 arranged on two chips in Example 3. [Figure 13] It is a diagram showing the functions of the chip 500 in Example 4. [Figure 14] It is a diagram showing the state of wireless communication between multiple chips when the chip in Example 4 is mixed into the material. [Figure 15] It is a diagram showing the configuration diagram of an information analysis system using multiple information processing devices 100. 【Embodiments for Carrying Out the Invention】 【0011】 The contents of the embodiments of the present invention will be listed and described. The present invention has, for example, the following configuration. 【0012】 [Item 1] An information processing device, having at least a first chip and a second chip, the first chip includes a first transmission control unit that generates a transmission signal and a first transmission coil that is connected to the first transmission control unit and transmits the transmission signal, the second chip includes a second reception coil that can receive the transmission signal by performing inductive coupling with the first transmission coil, and a second detection unit that detects a voltage or current applied to the second reception coil, the first chip and the second chip are arranged at a proximity position where wireless communication by inductive coupling is possible, and when a change in the voltage or current generated in the second reception coil satisfies a predetermined condition, a change in the relative position of the first chip and the second chip, or vibration, or pressure change, or temperature change, or electromagnetic wave applied to the first and second chips is detected by the second detection unit. An information processing device characterized by this. [Item 2] The information control device according to item 1, wherein the second detection unit detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips, when the amplitude of the voltage or current generated when the second receiving coil receives the transmission signal increases or decreases from a predetermined value. [Item 3] The information processing apparatus according to item 1 or 2, characterized in that the second chip further comprises a second transmitting coil and a memory for recording detection information of voltage or current detected by the second detection unit. [Item 4] In addition to the first and second chips, the system includes a third chip comprising a third transmitting antenna, a third receiving antenna, and an external communication control unit that communicates with an external communication device. The information processing apparatus according to item 3, characterized in that the third chip receives the detection information via the third receiving antenna and outputs the detection information to the external communication device via the external communication control unit. [Item 5] The detection unit is an information processing device as described in item 1, comprising a CPU. [Item 6] The information processing apparatus according to item 1, wherein the first chip and the aforementioned chip are arranged adjacent to each other on a base material, and the first transmitting coil and the second receiving coil are arranged side by side in a substantially horizontal direction. [Item 7] The information processing apparatus according to item 1, characterized in that the first chip and the aforementioned chip are arranged adjacent to each other in a position facing each other across the base material, and the first transmitting coil and the second receiving coil are arranged in a position facing each other. [Item 8] One of the first tip and the second tip is provided on the rotor side of the rotating body. The other of the first tip and the second tip is provided on the stator side of the rotating body. The information processing apparatus according to item 7, characterized in that the rotor rotates relative to the stator, thereby repeatedly switching between a state in which the first transmitting coil and the second receiving coil are in a relative position facing each other and a state in which they are in a relative position not facing each other. [Item 9] An information processing device comprising multiple chips capable of wireless communication with one another, The aforementioned chip is A transmission control unit that generates a transmission signal, A transmitting coil connected to the transmission control unit for transmitting the transmission signal, A receiving coil that receives the transmission signal from another chip, The system includes a detection unit that detects the voltage or current of the receiving coil, The detection unit is positioned in close proximity to other chips, enabling wireless communication via inductive coupling between the chip itself and other chips. When a change in voltage or current occurring in the receiving coil satisfies predetermined conditions, the detection unit detects a change in the relative position between the chip itself and other chips, or vibrations, temperature changes, pressure changes, or electromagnetic waves applied to the chip itself. [Item 10] The information control device according to item 9, wherein the detection unit detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips, when the amplitude of the voltage or current generated when the receiving coil receives the transmission signal increases or decreases from a predetermined value. [Item 11] An information analysis system comprising an information processing device having first and second chips arranged in close proximity to each other and capable of wireless communication via inductive coupling, and an analysis device for analyzing information acquired from the information processing device, The first chip comprises a first transmission control unit that generates a transmission signal and a first transmission coil connected to the first transmission control unit that transmits the transmission signal. The second chip includes a second receiving coil capable of receiving the transmission signal by inductive coupling with the first transmitting coil, and a second detection unit that detects the voltage or current applied to the second receiving coil. The analysis device is characterized by acquiring voltage or current information detected by the detection unit, and detecting a change in the relative position of the first chip and the second chip, or vibration, pressure change, temperature change, or electromagnetic wave applied to the first and second chips, when the change in voltage or current contained in the information satisfies predetermined conditions. [Item 12] The information analysis system according to item 11, wherein the analysis device detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips, when the amplitude of the voltage or current included in the information increases or decreases from a predetermined value. [Item 13] A measurement method utilizing a first chip and a second chip positioned in close proximity to each other and capable of wireless communication via inductive coupling, The first chip generates a transmission signal, The steps include transmitting the transmission signal from a transmission coil provided on the first chip, The steps include receiving the transmission signal with a receiving coil provided on the second chip, A measurement method characterized by comprising the step of detecting a change in the relative position of the first chip and the second chip, or vibration, pressure change, temperature change, or electromagnetic wave applied to the first and second chips, when a change in voltage or current generated in the receiving coil satisfies predetermined conditions. [Item 14] The measurement method described in item 13, wherein the predetermined condition is that the amplitude of the voltage or current generated when the receiving coil receives the transmission signal increases or decreases from a predetermined value. 【0013】 <Details of the embodiment> A specific example of an information processing device 100 according to one embodiment of the present invention will be described below with reference to the drawings. However, the present invention is not limited to these examples, and is intended to include all modifications within the meaning and scope of the claims, as indicated by the claims. In the following description, identical or similar elements in the accompanying drawings are given identical or similar reference numerals and names, and redundant descriptions of identical or similar elements in the description of each embodiment may be omitted. Furthermore, features shown in each embodiment are applicable to other embodiments insofar as they do not contradict each other. 【0014】 <Example 1> Figure 1 shows an example of the functional configuration of the information processing device 100 of this embodiment. As shown in Figure 1, the information processing device 100 of this embodiment has at least two chips 110 and 120. Chip 120 includes a transmitting coil 122, a transmitting control unit 128 that supplies a transmission signal to the transmitting coil, and a power supply unit 126 that supplies power to the transmitting control unit. Chip 110 includes a receiving coil 111 that generates a voltage (or current) by inductive coupling with the transmitting coil 122, a detection unit 117 that detects the voltage or current (analog signal) generated in the receiving coil as a digital signal, and a power supply unit 116 that supplies power to the detection unit 117. The detection unit detects the voltage or current generated in the receiving coil and, based on the detected value, detects the change in voltage or current caused by a change in the positional relationship between chip 110 and chip 120, along with the signal transmitted from the transmitting coil. Here, the power supply units 116 and 126 are composed of at least one of the following: a power receiving function that receives power from outside the chip, a power storage function that stores power inside the chip, or a power generation function that generates power inside the chip. In addition, the transmission control unit 128 of chip 120 can be composed of a CPU, and the detection unit 117 of chip 110 can similarly be composed of a CPU. 【0015】 Figure 2 is a hardware configuration diagram illustrating the principle of wireless communication between chips. Chip 120 has a transmitting coil 122 connected to the power supply unit located on its outer circumference, while chip 110 has a receiving coil 111 located on its outer circumference. As shown in Figure 2, by arranging chips 110 and 120 in close proximity to each other, wireless communication using inductive coupling becomes possible between the coils. Furthermore, the coil diameter of each chip can be reduced to approximately 300 μm, and the distance between coils of adjacent chips can be reduced to approximately 40 μm. 【0016】 In the example shown in Figure 2, chips 110 and 120 are fixed on the same base material 200, so that both chips are positioned at a distance that allows for inductive coupling. Here, the base material can be made of a soft cloth used in clothing, or a deformable elastic material. In such cases, the positional relationship between chips 110 and 120 changes as the base material deforms, so the receiving coil experiences not only a change in the current flowing through the transmitting coil, but also a change in voltage or current due to the change in the positional relationship between chips 110 and 120. Therefore, the detection unit can detect the change in the positional relationship of the chips by detecting the change in voltage or current generated in the receiving coil due to the change in the positional relationship of the chips as described above. 【0017】 <Detection principle of changes in positional relationship> Figures 3-1 to 3-4 show the changes in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are arranged on two chips. Figure 3-1 shows the positional relationship of each coil when chips 110 and 120 move relative to each other in a direction away from each other on the laying plane (away from each other in the X-axis direction). In this case, the distance between the receiving coil 111 and the transmitting coil 122 increases, so the inductive coupling that occurs between the two coils decreases, and the amplitude of the voltage or current generated in the receiving coil due to the change in current in the transmitting coil 122 (the maximum absolute value of the detected voltage or current) decreases. As an example of sensing, as the base material 200 expands due to thermal expansion, the distance between chips 110 and 120 increases gradually as described above, so when the amplitude of the voltage or current of the receiving coil detected by the detection unit changes at a rate (period) lower than a predetermined value, a change in ambient temperature can be detected. Furthermore, changes in the pressure applied to the base material in the X-axis direction also cause the base material to deform and change the distance between coils. As described above, when the detection unit detects a change in the amplitude of voltage or current at a speed (period) lower than a predetermined value, it is possible to detect a change in the pressure applied to the base material in the X-axis direction. 【0018】 Furthermore, when vibration is applied to the base material 200 in the X-axis direction as shown in the figure, the distance between the coils described above changes at a high frequency. Therefore, when the detection unit detects a change in voltage or current with a frequency higher than a predetermined value, it is possible to detect vibrations applied to the base material (such as pulse, sound, or other vibrations). 【0019】 Figure 3-2 shows the relative positions of the coils when chips 110 and 120 move in opposite directions along the winding axis direction (Y-axis direction) of each coil. In this case, as a result of the above-mentioned movement, the distance between the receiving coil 111 and the transmitting coil 122 increases, so the inductive coupling between the two coils decreases, and the amount of change in voltage or current generated on the receiving coil side due to the change in current generated in the transmitting coil 122 decreases. Therefore, when vibration is applied to the base material 200 in the Y-axis direction in the figure, the above-mentioned distance between the coils changes at a high frequency, and when the detection unit detects a change in voltage or current with a frequency higher than a predetermined value, it is possible to detect vibrations applied to the base material (pulse, sound, other vibrations, etc.). 【0020】 Figure 3-3 shows the relative positional relationship of each coil when chip 110 and chip 120 move relative to each other by sliding in the front-to-back direction (Z-axis direction) on the laying plane. In this case, as a result of the above-mentioned movement, the overlap distance of the coils on the opposing surfaces of the receiving coil 111 and the transmitting coil 122 decreases, so the inductive coupling that occurs between the two coils decreases, and the amplitude of the voltage or current generated in the receiving coil due to the change in current generated in the transmitting coil 122 decreases. Therefore, when vibration is applied to the base material 200 in the Z-axis direction in the figure, the distance between the coils changes at a high period, so when the detection unit detects a change in voltage or current at a speed (period) higher than a predetermined value, it is possible to detect vibrations applied to the base material (pulse, sound, other vibrations, etc.). 【0021】 Figure 3-4 shows the relative positions of the coils when the relative positions of the chips 110 and 120 change so that the relative angle between the chips becomes a predetermined angle θ less than 180 degrees, by rotating in a direction that reduces the relative angle between the chips, with the direction of the opposing edges between the chips (Z-axis) as the axis of rotation. In this case, as disclosed in Reference 1, it is known that as the relative angle θ of the coils decreases, the coupling coefficient of the receiving coil 111 and the transmitting coil 122 increases monotonically, and the amplitude of the voltage or current generated in the receiving coil due to the change in current in the transmitting coil 122 increases. Therefore, when vibration is applied to the base material 200 around the Z-axis in the figure, the relative angle between the coils changes at a high period, and when the detection unit detects a change in voltage or current at a speed (period) higher than a predetermined value, vibrations applied to the base material (pulse, sound, other vibrations, etc.) can be detected. 【0022】 Figure 4 shows an example of a detailed implementation circuit of the information processing device 100 shown in Figures 1 and 2. As shown in the figure, the chip 120 is equipped with a transmitting coil 122 located on the periphery of the chip, a transmitting circuit 123 that outputs a current signal to the transmitting coil, a core circuit 125 (transmission control unit 128) that generates a current signal, and a power supply unit 126 that supplies power to the core circuit. The chip 110 is equipped with a receiving coil 111 located on the periphery of the chip, a receiving circuit 113 that receives voltage or current applied to the receiving coil, a core circuit 115 (detection unit 117) that detects the voltage or current received by the receiving circuit 113, and a power supply unit 116 that supplies power to the core circuit 115. The core circuits 115 and 125 are composed of, for example, CPUs. The transmitting core circuit 125 has the function of the transmission control unit 128 and generates the transmission signal shown in Figure 5, which will be described later, and the transmitting circuit 123 outputs a current corresponding to the transmission signal to the transmitting coil. 【0023】 Figure 5 shows the time evolution of the transmission signal generated by the core circuit 125 of the transmitting chip, the voltage V generated in the receiving coil 111 of the receiving chip, and the received signal generated by the core circuit 115 (detection unit) of the receiving chip, respectively. The transmission signal is a binary signal (pulse signal) of High or Low, and a positive voltage V is generated in the receiving coil after a delay time has elapsed from the timing when the pulse of the transmission signal rises from Low to High. In the detection unit (core circuit 115), if this voltage exceeds a predetermined positive threshold, the received signal is raised from Low to High. Similarly, when the transmission signal changes from High to Low, a negative voltage V is generated in the receiving coil after a delay time has elapsed, and in the detection unit (core circuit 115), if this voltage V falls below a predetermined negative threshold, the received signal is changed from High to Low. 【0024】 Figure 6 shows an example of the time variation of the voltage V generated in the receiving coil when the relative positions of the chips change. Compared to the voltage V in the steady state before the relative positions of the chips change (dotted line), as shown in Figures 3-1 to 3-3, when the relative positions of the coils of each chip change and the coupling coefficient of inductive coupling decreases, the amplitude of the voltage V generated in the receiving coil when the received signal changes (from High to Low, or from Low to High) becomes smaller than a predetermined amplitude value in the steady state when the relative positions of the chips do not change. (Conversely, when the relative positions of the coils of the chips change and the coupling coefficient of inductive coupling increases, the amplitude of the voltage V generated in the receiving coil when the received signal changes (from High to Low, or from Low to High) becomes larger than in the steady state.) Also, the pulse period of the transmitted signal is, for example, 0.2 ns, which is sufficiently shorter than the period during which the relative positions of the coils of the chips change. Therefore, it is possible to detect the change in the coupling coefficient of inductive coupling based on the change in the amplitude of the voltage V, and the change in the relative positions of the chips can be estimated based on this change in the coupling coefficient. In other words, it becomes possible to detect state variables such as vibration, pressure changes, or temperature changes that cause changes in the relative positions of the chips. The amplitude of voltage V in a steady state and the amplitude of voltage V when the state variable changes are determined according to the relative positions of the communicating chips, so they can be appropriately set in the information processing device after the relative positions of the chips have been determined, for example, when using the sensors. 【0025】 In the example shown in Figure 6, an example was described in which changes in the positional relationship between chips, vibration, pressure changes, or temperature changes are detected based on a state in which the amplitude of the induced voltage generated in the receiving coil has increased or decreased compared to a predetermined value in the steady state. However, the present invention is not limited to this, and it is also possible to detect changes in the positional relationship between chips, vibration, pressure changes, or temperature changes based on the amplitude of the current value generated in the receiving coil. Furthermore, it is also possible to detect each of the above-mentioned state quantities based on the amplitude of waveform distortion of the received signal (shown in Figure 5) detected by the detection unit, rather than the voltage or current generated in the receiving coil. 【0026】 Figure 7 is a flowchart illustrating the operation of the information processing device in this embodiment for detecting state quantities such as vibration. First, the core circuit 125 of the transmitting chip sends a transmission signal (current) transmitted to the receiving chip via wireless communication to the transmitting coil (step 101). Next, the core circuit 115 of the receiving chip detects the voltage generated in the receiving coil (step 102). Next, it is determined whether the amplitude of the voltage detected in step 102 has changed from a predetermined amplitude value. If it has changed, the process proceeds to step 104; if it has not changed, the process proceeds to step 106 (step 103). Next, in the determination in step 103, if it is determined that the amplitude of the detected voltage has changed from a predetermined amplitude value, it is determined that vibration, pressure change, or temperature change is occurring (step 104). Here, it is also possible to detect vibration, pressure change, and temperature change separately based on the period of change in the detected voltage amplitude. For example, if the period of change in voltage amplitude is approximately 1 second, it can be determined that vibration has occurred; if the period of change in voltage amplitude is approximately 1 to 10 seconds, it can be determined that pressure has changed; and if the period of change in voltage amplitude is 10 seconds or longer, it can be determined that temperature has changed. Next, in the determination in step 103, if it is determined that the amplitude of the detected voltage has not changed from a predetermined amplitude value, it is determined that no vibration, voltage change, or temperature change has occurred (step 105). 【0027】 In Example 1, an embodiment was described in which the chip 120 that transmits the transmission signal has a transmission control unit 128 which is composed of a CPU or the like. However, the present invention is not limited to this, and the transmission control unit 128 may also be composed of a circuit that transmits a predetermined transmission signal instead of a CPU. 【0028】 <Example 2> In the above-described Example 1, an example was shown in which a change in the relative positional relationship between two coils performing wireless communication by inductive coupling is detected. In this example, an embodiment is described in which wireless communication is performed between three or more chips and a change in the relative positional relationship is detected. Note that parts with the same reference numerals as those described in Example 1 have the same function as in Example 1 and their description is omitted. 【0029】 Figure 8 shows an example of the functional configuration of the information processing device 100 in Embodiment 2. As shown in Figure 2, the information processing device 100 in this embodiment has at least three or more chips 110, 120, and 130. Chip 110 includes a receiving coil 111, a detection unit 117, a power supply unit 116, a transmitting coil 112, a transmission control unit 118 that generates a transmission signal to be transmitted from the transmitting coil 112, and a memory 119 that records detection information of state quantities detected by the detection unit 117. Here, the detection unit 117, the transmission control unit 118, and the memory 119 are composed of, for example, a CPU. 【0030】 The chip 130 also includes a receiving coil 131, a transmitting coil 132, an external communication control unit 138, and a power supply unit 136, and communicates with the external communication device 300 via the external communication control unit. The external communication control unit is, for example, composed of a CPU, and when it receives a request to output detection information from the external communication device, it transmits a signal requesting the output of detection information via the transmitting coil 132. This output request signal is received by the receiving coil 111 of the chip 110. Based on this output request signal, the transmitting control unit 118 reads the detection information recorded in the memory 119 and outputs the read detection information via the transmitting coil 112. The external communication control unit receives the detection signal via the receiving coil 131 and outputs the detection signal to the external communication device 300. 【0031】 Furthermore, the transmission signals sent from the transmitting coils on each chip are received by the receiving coils on all adjacent chips. In other words, the transmitting and receiving coils on adjacent chips function similarly to a communication bus. 【0032】 Figure 9 is a hardware configuration diagram illustrating the principle by which chips 110, 120, and 130 perform wireless communication in Example 2. As shown in Figure 9, since chip 120 is adjacent to chips 110 and 130, the transmission signal sent from the transmission coil 122 is received by both the receiving coils 111 and 131. 【0033】 Figure 10 shows an example where seven more chips are arranged to communicate with each other. In the arrangement shown in Figure 10, the transmission signal sent from chip 130 can be received by the other adjacent chips (140, 150, 160, 170, 180, 190). 【0034】 <Example 3> While Examples 1 and 2 described above show examples where multiple chips are arranged adjacently on a plane, this embodiment describes an embodiment in which multiple chips are stacked in a direction where their chip surfaces face each other, and a change in the relative positional relationship is detected when wireless communication is performed between the chips. Note that parts with the same reference numerals as those described in Examples 1 and 2 have the same function as in Example 1, and their description is omitted. 【0035】 Figure 11 is a hardware configuration diagram illustrating the principle by which chips 110 and 120 perform wireless communication. By positioning the receiving coil 111 of chip 110 and the transmitting coil 122 of chip 120 so that they face each other directly, wireless communication using inductive coupling is possible between the two coils. 【0036】 Furthermore, the example shown in Figure 11 illustrates a case where chips 110 and 120 are fixed in close proximity with the base material 210 in between, thereby positioning the two chips at a distance where inductive coupling is possible. Here, the base material can be made of a deformable elastic material, and in such a case, the positional relationship between chips 110 and 120 changes, so that the receiving coil experiences not only the electrical signal transmitted from the transmitting coil, but also a change in voltage or current due to the change in the positional relationship between chips 110 and 120. Therefore, the detection unit 117 of chip 110 can detect the change in voltage or current generated in the receiving coil due to the change in the positional relationship of the chips as described above, and more specifically, it can detect vibration, pressure changes, or temperature changes based on the amplitude of the voltage or current value generated in the receiving coil. 【0037】 Figures 12-1 to 12-4 show the changes in the positional relationship between the transmitting coil 122 and the receiving coil 111, which are arranged on two chips. Figure 12-1 shows the positional relationship of each coil when chip 110 and chip 120 move relative to each other in the direction away from each other (away in the Y-axis direction). In this case, the distance between the receiving coil 111 and the transmitting coil 122 increases, so the inductive coupling that occurs between the two coils decreases, and the amount of change in voltage or current generated on the receiving coil side due to the current change generated by the transmitting coil 122 decreases. As an example of sensing, as the base material 210 expands due to thermal expansion, the distance between chips 110 and 120 increases gradually as described above, so when the detection unit detects a change in voltage or current with a period lower than a predetermined value, it is possible to detect a change in ambient temperature. Furthermore, changes in the Y-axis pressure applied to the base material also cause the base material to deform and change the distance between coils. As described above, when the detection unit detects a change in voltage or current with a period lower than a predetermined value, it is possible to detect a change in the Y-axis pressure applied to the base material. 【0038】 Furthermore, when vibration is applied to the base material 210 in the Y-axis direction in the figure, the distance between the coils described above changes at a high frequency. Therefore, when the detection unit detects a change in voltage or current with a frequency higher than a predetermined value, it is possible to detect vibrations applied to the base material (such as pulse, sound, or other vibrations). 【0039】 Figure 12-2 shows the relative positions of the coils when the coils of chip 110 and chip 120 slide relative to each other in the X-axis direction. In this case, as a result of the above-mentioned movement, the overlap distance between the opposing surfaces of the receiving coil 111 and the transmitting coil 122 decreases, so the inductive coupling between the two coils decreases, and the amount of change in voltage or current generated on the receiving coil side due to the current change generated by the transmitting coil 122 decreases. Therefore, when vibration is applied to the base material 210 in the X-axis direction in the figure, the distance between the coils changes at a high frequency, and when the detection unit detects a change in voltage or current with a frequency higher than a predetermined value, it is possible to detect vibrations applied to the base material (pulse, sound, other vibrations, etc.). 【0040】 Figure 12-3 shows the relative positions of the coils when the coils of chip 110 and chip 120 slide relative to each other in the Z-axis direction. In this case, as a result of the above-mentioned movement, the overlap distance between the opposing surfaces of the receiving coil 111 and the transmitting coil 122 decreases, so the inductive coupling between the two coils decreases, and the amount of change in voltage or current generated on the receiving coil side due to the current change generated by the transmitting coil 122 decreases. Therefore, when vibration is applied to the base material 210 in the Z-axis direction in the figure, the distance between the coils changes at a high frequency, so when the detection unit detects a change in voltage or current with a frequency higher than a predetermined value, it is possible to detect vibrations applied to the base material (pulse, sound, other vibrations, etc.). 【0041】 Figure 12-4 shows the relative positions of the coils when tip 110 is positioned on the rotor side of the rotating body and tip 120 is positioned on the stator side of the rotating body, and the rotor rotates relative to the stator. In this case, as the rotor rotates relative to the stator, the transmitting coil 111 and the receiving coil 122 repeatedly switch between a relative position where they face each other directly (as shown in Figure 12-4) and a relative position where they do not face each other directly (for example, a state where the rotor has rotated 180 degrees from the state shown in Figure 12-4). Therefore, as a result of the rotational movement described above, when the receiving coil 111 and the transmitting coil 122 are in a position where they face each other directly, the inductive coupling between the coils increases, and when the receiving coil 111 and the transmitting coil 122 are no longer in a position where they face each other directly, the inductive coupling between the coils decreases. Therefore, as the rotor rotates, the distance between the coils described above changes with the rotational speed period, making it possible to detect the rotational speed (rotational velocity) of a rotating body such as a motor. 【0042】 <Example 4> In the embodiments described above, examples were explained in which multiple chips are arranged in close proximity to each other via a base material to constitute a sensor. However, instead of fixing multiple chips at predetermined positions on the base material, an example of manufacturing a sensor more simply using multiple chips will be described. Note that parts with the same reference numerals as those described in Embodiments 1 and 2 have the same function as in Embodiment 1, and their explanation will be omitted. 【0043】 Figure 13 shows the functions of the chip 500 in this embodiment. The chip 500 comprises a receiving coil 501, a transmitting coil 502, a power supply unit 506, a detection unit 507, a transmission control unit 508, and a memory 509. The functions of each of these functional blocks are the same as those of the embodiment described above. Therefore, when multiple chips 500 are placed in close proximity to each other so that they can communicate with each other, wireless communication can be performed between the chips, and changes in the relative positions of the chips can be detected. Here, the detection unit 507, the transmission control unit 508, and the memory 509 can be configured as a CPU. 【0044】 Therefore, for example, when using two or more chips 500 mixed into a construction material such as cement or rubber, although the position of each chip cannot be controlled, it becomes possible to communicate wirelessly between chips fixed in close proximity. Figure 14 shows the state of wireless communication between multiple chips when the chips are mixed into a material. As shown in Figure 14, wireless communication can be performed between chips located in close proximity, making it possible to detect changes in the relative position of the chips. For example, when a rubber sheet mixed with chips 500 is used as flooring, it is possible to detect changes in pressure at any point on the flooring. Similarly, vibrations and temperature changes applied to the material in which the chips 500 are mixed can also be detected. 【0045】 Figure 15 is a diagram showing the configuration of an information analysis system using multiple information processing devices 100. In each of the embodiments described above, detection information such as vibration, pressure change, or temperature change detected by the multiple information processing devices 100 is collected by an external communication device 300 and transmitted to a cloud server 400 via a communication line. The cloud server can analyze a large amount of detection information and generate statistical information. In the embodiments described above, examples were explained in which the detection unit within the chip implements a function to detect changes in the relative position between chips, or vibrations, pressure changes, or temperature changes applied to the chip. However, instead, the detection unit within the chip may implement a function to detect voltage or current, and the external communication device 300 or cloud server 400 that has acquired voltage or current detection information from the chip may have a function to detect changes in the relative position between chips, or vibrations, pressure changes, or temperature changes applied to the chip, based on a predetermined condition that the amplitude of the voltage or current value of the detection information increases or decreases from a predetermined value. 【0046】 As described above, the computing chip itself, which is an essential element for configuring the sensor system, becomes the sensing device. Therefore, there is no need to provide a separate computing chip and sensing device, and a chip-sized sensor system can be constructed. Furthermore, since changes in the relative positional relationship between chips can be measured, it becomes possible to measure any physical quantity by linking it to these changes in relative positional relationship. In addition, by changing the software implemented on the computing chip, it is possible to operate it as a different type of sensor, thereby reducing the design cost of the sensor system and making it possible to measure multiple physical quantities with a single sensor device. 【0047】 In the embodiments described above, state quantities such as vibration, pressure changes, or temperature changes were estimated by detecting changes in voltage or current generated in the receiving coil due to changes in the relative position of the chip. However, it is known that the voltage or current generated in the receiving coil changes when electromagnetic waves strike it. Therefore, it is also possible to measure the electromagnetic waves striking the information processing device by detecting changes in voltage or current generated in the receiving coil. 【0048】 Although these embodiments have been described above, they are intended to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention can be modified and improved without departing from its spirit, and equivalents thereof are also included. [Explanation of symbols] 【0049】 100 Information control device 110, 120, 130, 500 chips 111, 121, 131, 501 Receiving coils 112, 122, 132, 502 Transmitting coils 113, 123, 133, 503 Receiving Circuit 114, 124, 134, 504 Transmitter Circuits 115, 125, 135, 505 core circuits 126, 116, 136, 506 Power supply section 117, 127, 137, 507 Detection unit 118, 128, 508 Transmitting Control Unit 139,509 memory 200, 210 Base material 300 External communication devices 400 cloud servers

Claims

[Claim 1] An information processing device, Having at least a first chip and a second chip, The first chip comprises a first transmission control unit that generates a transmission signal and a first transmission coil connected to the first transmission control unit that transmits the transmission signal. The second chip comprises a second receiving coil capable of receiving the transmission signal by inductive coupling with the first transmitting coil, a second detection unit for detecting a voltage or current applied to the second receiving coil, a second transmitting coil, and a memory for recording detection information of the voltage or current detected by the second detection unit. The first chip and the second chip are arranged in close proximity to each other so that they can communicate wirelessly by inductive coupling, and the second detection unit detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips, when a change in voltage or current generated in the second receiving coil satisfies predetermined conditions. [Claim 2] The information processing apparatus according to claim 1, wherein the second detection unit detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips, when the amplitude of the voltage or current generated when the second receiving coil receives the transmission signal increases or decreases from a predetermined value. [Claim 3] In addition to the first and second chips described above, the system includes a third chip comprising a third transmitting antenna, a third receiving antenna, and an external communication control unit that communicates with an external communication device. The information processing apparatus according to claim 1, characterized in that the third chip receives the detection information via the third receiving antenna and outputs the detection information to the external communication device via the external communication control unit. [Claim 4] The information processing apparatus according to claim 1, wherein the detection unit is composed of a CPU. [Claim 5] The information processing apparatus according to claim 1, wherein the first chip and the second chip are arranged adjacent to each other on a base material, and the first transmitting coil and the second receiving coil are arranged side by side in a substantially horizontal direction. [Claim 6] The information processing apparatus according to claim 1, characterized in that the first chip and the second chip are arranged adjacent to each other in a position facing each other across the base material, and the first transmitting coil and the second receiving coil are arranged in a position facing each other. [Claim 7] One of the first tip and the second tip is provided on the rotor side of the rotating body. The other of the first tip and the second tip is provided on the stator side of the rotating body. The information processing apparatus according to claim 1, characterized in that the rotor rotates relative to the stator, thereby repeatedly switching between a state in which the first transmitting coil and the second receiving coil are in a relative position facing each other and a state in which they are in a relative position not facing each other. [Claim 8] An information processing device comprising multiple chips capable of wireless communication with one another, The aforementioned chip is A transmission control unit that generates a transmission signal, A transmitting coil connected to the transmission control unit for transmitting the transmission signal, A receiving coil that receives the transmission signal from another chip, The system includes a detection unit that detects the voltage or current of the receiving coil, The detection unit is positioned in close proximity to other chips, enabling wireless communication via inductive coupling between the chip itself and other chips. When a change in voltage or current occurring in the receiving coil satisfies predetermined conditions, the detection unit detects a change in the relative position between the chip itself and other chips, or vibrations, temperature changes, pressure changes, or electromagnetic waves applied to the chip itself. [Claim 9] The information processing apparatus according to claim 8, wherein the detection unit detects a change in the relative position between its own chip and the other chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to its own chip and the other chip, when the amplitude of the voltage or current generated when the receiving coil receives the transmission signal increases or decreases from a predetermined value. [Claim 10] An information analysis system comprising an information processing device having first and second chips arranged in close proximity to each other and capable of wireless communication via inductive coupling, and an analysis device for analyzing information acquired from the information processing device, The first chip comprises a first transmission control unit that generates a transmission signal and a first transmission coil connected to the first transmission control unit that transmits the transmission signal. The second chip comprises a second receiving coil capable of receiving the transmission signal by inductive coupling with the first transmitting coil, a second detection unit for detecting a voltage or current applied to the second receiving coil, a second transmitting coil, and a memory for recording detection information of the voltage or current detected by the second detection unit. The analysis device is characterized by acquiring voltage or current information detected by the second detection unit, and detecting a change in the relative position of the first chip and the second chip, or vibration, pressure change, temperature change, or electromagnetic wave applied to the first and second chips, when the change in voltage or current contained in the information satisfies predetermined conditions. [Claim 11] The information analysis system according to claim 10, wherein the analysis device detects a change in the relative position of the first chip and the second chip, or vibrations, pressure changes, temperature changes, or electromagnetic waves applied to the first and second chips, when the amplitude of the voltage or current included in the information increases or decreases from a predetermined value. [Claim 12] An information analysis system comprising an information processing device having first and second chips arranged in close proximity to each other and capable of wireless communication via inductive coupling, and an analysis device for analyzing information acquired from the information processing device, Each of the first and second chips comprises a transmission control unit that generates a transmission signal, a transmission coil connected to the transmission control unit that transmits the transmission signal, a receiving coil capable of receiving the transmission signal from another chip, and a detection unit that detects the voltage or current applied to the receiving coil. The analysis device is characterized by acquiring voltage or current information detected by the detection unit, and detecting a change in the relative position between the first chip and the second chip, or vibration, pressure change, temperature change, or electromagnetic wave applied to the first and second chips, when the change in voltage or current contained in the information satisfies predetermined conditions. [Claim 13] A measurement method utilizing a first chip and a second chip positioned in close proximity to each other and capable of wireless communication via inductive coupling, The first chip comprises a first transmission control unit that generates a transmission signal and a first transmission coil connected to the first transmission control unit that transmits the transmission signal. The second chip comprises a second receiving coil capable of receiving the transmission signal by inductive coupling with the first transmitting coil, a second detection unit for detecting a voltage or current applied to the second receiving coil, a second transmitting coil, and a memory for recording detection information of the voltage or current detected by the second detection unit. The steps include generating a transmission signal in the first transmission control unit of the first chip, The steps include transmitting the transmission signal from the first transmission coil provided on the first chip, The steps include receiving the transmission signal with the second receiving coil provided on the second chip, A measurement method characterized by comprising the step of detecting a change in the relative position of the first chip and the second chip, or vibration, pressure change, temperature change, or electromagnetic wave applied to the first and second chips, when a change in voltage or current generated in the receiving coil satisfies predetermined conditions. [Claim 14] The measurement method according to claim 13, wherein the predetermined condition is that the amplitude of the voltage or current generated when the receiving coil receives the transmission signal increases or decreases from a predetermined value. [Claim 15] A measurement method utilizing a first chip and a second chip positioned in close proximity to each other and capable of wireless communication via inductive coupling, Each of the first and second chips comprises a transmission control unit that generates a transmission signal, a transmission coil connected to the transmission control unit that transmits the transmission signal, a receiving coil capable of receiving the transmission signal from another chip, and a detection unit that detects the voltage or current applied to the receiving coil. The steps include generating a transmission signal in the transmission control unit of the first chip, The steps include transmitting the transmission signal from the transmission coil provided on the first chip, The steps include receiving the transmission signal with the receiving coil provided on the second chip, A measurement method characterized by comprising the step of detecting a change in the relative position between the first chip and the second chip, or vibration, pressure change, temperature change, or electromagnetic wave applied to the first and second chips, when a change in voltage or current generated in the receiving coil provided on the second chip satisfies predetermined conditions.

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