Laser processing apparatus and laser processing method

Abstract

To provide a laser processing device which can simultaneously emit a laser beam to form a groove in a workpiece and emit a laser beam to suppress the generation of molten debris.SOLUTION: Laser beam irradiation means of a laser processing device includes an oscillation mechanism 38 which oscillates the pulse laser beam. The oscillation mechanism 38 comprises: a group setting part 48 which sets the number of pulse laser beams to be emitted by the time the molten debris is solidified as one group under such a condition that the pulse laser beams are emitted at a time interval that is shorter than the time that molten debris is generated by emission of the pulse laser beams to a workpiece; and a time interval setting part 40 which sets the time to cool down the heat generated by emission of one group of pulse laser beams as the time interval between one group and one adjacent group, and sets the time interval of the pulse laser beams constituting the one group, and sets a repetition frequency with the one group as one unit.SELECTED DRAWING: Figure 2

Claims

[Claim 1] A laser processing apparatus comprising: a holding means for holding a workpiece; a laser beam irradiation means for irradiating a laser beam onto the workpiece held by the holding means; and a feeding means for relative feeding of the holding means and the laser beam irradiation means, The laser beam irradiation means includes an oscillation mechanism that emits a pulsed laser beam, and a concentrator that focuses the pulsed laser beam emitted by the oscillation mechanism and irradiates the workpiece held by the holding means. The oscillation mechanism is, A group setting unit sets the number of pulsed laser beams to be irradiated onto a workpiece at time intervals shorter than the time required for molten debris to be generated, and groups them together, based on the condition that pulsed laser beams are irradiated onto the workpiece at time intervals shorter than the time required for molten debris to be generated. The system includes a time interval setting unit that sets the time required for the heat generated by the irradiation of a group of pulsed laser beams to dissipate as the time interval between a group and an adjacent group, and sets the time interval between the pulsed laser beams constituting the group. A laser processing apparatus that sets the repetition frequency with the group as a single unit. [Claim 2] The oscillation mechanism comprises multiple laser diodes that emit pulsed laser beams, In the group setting unit, one group is set by the pulsed laser beam emitted by the plurality of laser diodes. The laser processing apparatus according to claim 1, wherein the time interval setting unit inputs signals to the plurality of laser diodes at desired time intervals using a pulse delay generator, and inputs signals so that the time it takes for the heat generated by the irradiation of one group of pulsed laser beams to dissipate becomes the time interval between one group and an adjacent group. [Claim 3] The oscillation mechanism comprises multiple oscillators that emit pulsed laser beams, In the group setting unit, one group is set by the pulsed laser beams emitted by the plurality of oscillators. The laser processing apparatus according to claim 1, wherein the time interval setting unit applies voltage to the plurality of oscillators at desired time intervals using a delay voltage converter, and applies voltage so that the time it takes for the heat generated by the irradiation of one group of pulsed laser beams to dissipate becomes the time interval between one group and an adjacent group. [Claim 4] The laser processing apparatus according to claim 1, wherein the repetition frequency is set by thinning out a predetermined number of groups from a plurality of groups that oscillate per second. [Claim 5] A laser processing method for processing a workpiece, A preparation step for preparing a laser processing apparatus according to any one of claims 1 to 4, which irradiates a workpiece with a laser beam of a wavelength that has absorption properties, A groove forming process in which grooves are formed by irradiating a workpiece with a laser beam, The groove forming process includes a molten debris suppression step to suppress the generation of molten debris, In order to carry out the molten debris suppression process simultaneously with the groove formation process, In the group setting unit, the number of pulsed laser beams for a group to be irradiated until the molten debris solidifies is set, provided that the pulsed laser beams are irradiated at time intervals shorter than the time it takes for molten debris to be generated by the irradiation of the workpiece with pulsed laser beams. A laser processing method in which the time interval setting unit sets the time until the heat generated by the irradiation of one group of pulsed laser beams dissipates as the time interval between one group and an adjacent group, and sets the time interval between the pulsed laser beams constituting one group. [Claim 6] When a pulsed laser beam is irradiated onto a workpiece, molten debris is generated at time t1, and the molten debris solidifies at time t2, The time interval setting unit sets the time interval t3 of the group of pulsed laser beams to t3 < t1. The laser processing method according to claim 5, wherein the group setting unit sets the number n of pulsed laser beams in one group to the integer part of n = (t2 / t3) + 1.

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