Heat diffusion member

Abstract

To provide a heat diffusion member capable of suppressing the generation of localized a high temperature portion on the surface of a casing of an electronic device incorporating a heating element, and capable of reducing the temperature of the heating element by 2°C or more.SOLUTION: A heat diffusion member is a laminate made up of multiple layers including a low thermal conductivity layer and a high thermal conductivity layer. The low thermal conductivity layer is composed of a low thermal conductivity material sheet with a thermal conductivity of 0.13 to 0.34 W / m K and a specific heat of 0.9 to 1.67 J / g K. The high thermal conductivity layer is composed of a graphite sheet whose in-plane thermal conductivity in the high thermal conductivity layer is 1500 W / m K or more.SELECTED DRAWING: Figure 1

Claims

1. A heat diffusing member, A laminate comprising multiple layers including a low thermal conductivity layer and a high thermal conductivity layer, The low thermal conductivity layer is composed of a non-adhesive, low thermal conductivity material sheet having a thermal conductivity of 0.13 to 0.34 W / m·K and a specific heat of 0.9 to 1.67 J / g·K. The high thermal conductivity layer is composed of a graphite sheet with a thermal conductivity in the planar direction of the high thermal conductivity layer of 1500 W / m·K or higher. The high thermal conductivity layer and the low thermal conductivity layer are bonded together via an adhesive layer. The adhesive layer is made of a double-sided adhesive sheet, and the thickness of the adhesive layer is configured to be 0.005 to 0.28 mm. When placed between the housing of an electronic device and a heating element disposed inside the housing, the high thermal conductivity layer is oriented so that it faces the housing side and the low thermal conductivity layer faces the heating element side, and the layer is positioned so that a gap is formed between the low thermal conductivity layer and the heating element. The total thickness of the heat diffusion member is configured to be 0.048 to 1 mm. Heat diffusing member.

2. A heat diffusing member according to claim 1, On one side of the low thermal conductivity layer opposite to the high thermal conductivity layer side, a protective layer is provided to cover that side. The protective layer is made of a single-sided adhesive sheet, and the thickness of the protective layer is configured to be 0.004 to 0.03 mm. Heat diffusing member.

3. A heat diffusion member according to claim 1 or claim 2, The low thermal conductivity material sheet is non-combustible paper. Heat diffusing member.

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