Film for manufacturing electronic components

Abstract

To provide films for manufacturing electronic components that can prevent occurrence of static electricity during the production process; to provide films for manufacturing electronic components that allow an increase in cooling efficiency during the production process; to provide films for manufacturing electronic components having uniform thickness; and films for manufacturing electronic components that allow easy peeling of ceramic sheets while electronic components are made and also allow the electronic components to be made without damage.SOLUTION: An example of the present invention provides a film 10 for manufacturing electronic components that includes a polymer layer and metal nanowires 112 dispersed in the polymer layer.SELECTED DRAWING: Figure 3

Description

【Technical Field】 【0001】 The present invention relates to a film for manufacturing electronic components, specifically, a film for manufacturing electronic components used in the manufacture of multilayer electronic components. 【Background Art】 【0002】 In the case of high-end (High-End) thin-layer / high-stack MLCC (Multilayer Ceramic Capacitors), when the deviation of the raw material thickness of the polyester film (Polyester Film) used in manufacturing increases, the dispersion of the dielectric layer thickness of the MLCC increases, resulting in a decrease in the withstand voltage characteristics and an increase in the short circuit (Short) rate. Also, the thinner the dielectric layer, the more the foreign matter contamination due to static electricity in the forming and laminating process (Roll to Roll) has a great impact on the product characteristics of the MLCC. 【0003】 In the prior art, in order to closely adhere and cool the extruded high-temperature film for manufacturing electronic components, an antistatic agent is added into the sheet at the polymer polymerization stage, or physically adhered and cooled through an air nozzle (Air Nozzle). At this time, in order to impart antistatic properties to the film, a low molecular weight antistatic agent is introduced into the interior and moved to the surface, or solution coating and drying are performed on the surface of the completed film. 【0004】 However, when an excessive amount of the antistatic agent is added, the compatibility in the molten polymer decreases, which may cause a decrease in the surface roughness of the sheet. Also, in the case of an air nozzle, the optimal cooling conditions are determined by the distance between the nozzle, the cooling casting roll (Casting Roll), and the extruded film sheet, and the maximum air volume does not necessarily lead to the maximum cooling effect. When increasing the air volume to maximize the adhesion degree and cooling efficiency of the extruded film sheet, air traces may occur on the surface of the extruded film sheet. 【0005】 Therefore, we began to devise a film for manufacturing electronic components that utilizes metal nanowire materials to ensure both conductivity and magnetism, while also reducing damage during the film manufacturing process and the electronic component manufacturing process. [Overview of the project] [Problems that the invention aims to solve] 【0006】 One of the objectives of the present invention is to provide a film for manufacturing electronic components that can prevent the generation of static electricity during the manufacturing process. Another objective of the present invention is to provide a film for manufacturing electronic components that can increase cooling efficiency during the manufacturing process. Another objective of the present invention is to provide a film for manufacturing electronic components having a uniform thickness. Another objective of the present invention is to provide a film for manufacturing electronic components that facilitates the peeling of ceramic sheets during the manufacturing of electronic components, thereby enabling the manufacturing of electronic components without damage. [Means for solving the problem] 【0007】 One example of the present invention is a film for manufacturing electronic components, comprising a polymer layer and metal nanowires dispersed within the polymer layer. [Effects of the Invention] 【0008】 One of the effects of the present invention is that it can provide a film for manufacturing electronic components that can prevent the generation of static electricity during the manufacturing process. 【0009】 Another effect of the present invention is that it can provide a film for manufacturing electronic components that can increase cooling efficiency during the manufacturing process. 【0010】 Another effect of the present invention is that it can provide a film for manufacturing electronic components having a uniform thickness. 【0011】 Another effect of the present invention is that it can provide a film for manufacturing electronic components that facilitates the peeling of ceramic sheets during the manufacturing of electronic components, enabling the manufacturing of electronic components without damage. [Brief explanation of the drawing] 【0012】 [Figure 1] This is a schematic cross-sectional view showing a film for manufacturing electronic components according to an example of the present invention. [Figure 2] Figure 1 is a schematic perspective view of the film used for manufacturing electronic components. [Figure 3] This is a cross-sectional view specifically illustrating the internal structure of a film for manufacturing electronic components according to an example of the present invention. [Figure 4] This is a plan view of a film for manufacturing electronic components according to a modified example of the present invention. [Figure 5] This is a process diagram showing a part of the manufacturing process for a film for electronic component manufacturing according to an example of the present invention. [Figure 6] This is a comparative graph that schematically shows the effect of improving peel strength when using a film for manufacturing electronic components according to an example of the present invention. [Figure 7] This is a comparative graph that schematically shows the improvement effect on the wrinkle defect rate of ceramic sheets when using a film for manufacturing electronic components according to an example of the present invention. [Figure 8] This is a comparative graph that schematically shows the improvement in the number of burn occurrences when using a film for manufacturing electronic components according to an example of the present invention. [Modes for carrying out the invention] 【0013】 Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. 【0014】 Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Also, components with the same function within the scope of the same idea are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included. 【0015】 In drawings, the first direction can be defined as the lamination direction or thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction. 【0016】 Films 10 and 11 for manufacturing electronic components, according to an example and a modified version of the present invention, can be used to manufacture electronic components such as capacitors (MLCCs, Multilayer Ceramic Capacitors), inductors, and resistors. For example, in the process of laminating a multilayer capacitor, films 10 and 11 for manufacturing electronic components function as a substrate supporting the molding layer and printing layer of the capacitor at the bottom of the lowest layer, allowing the electronic components to be easily fixed during the lamination process, while simultaneously reducing static electricity generation and thus preventing the inclusion of foreign matter. Films 10 and 11 for manufacturing electronic components can be peeled off from the electronic components after the lamination process. 【0017】 Hereinafter, the configuration of the film for manufacturing electronic components according to the present invention will be specifically described based on the illustrated matters in each drawing. 【0018】 FIG. 1 is a cross-sectional view schematically showing a film for manufacturing electronic components according to an example of the present invention. 【0019】 A film 10 for manufacturing electronic components according to an example can include a polymer layer 100 and metal nanowires 112 dispersed in the polymer layer 100. Referring to FIG. 1, the polymer layer 100 can include a surface layer 110 and a back layer 120 disposed on one surface of the surface layer 110. 【0020】 FIG. 2 is a perspective view schematically showing the film for manufacturing electronic components of FIG. 1. 【0021】 FIG. 3 is a cross-sectional view specifically showing the internal configuration of a film for manufacturing electronic components according to an example of the present invention. 【0022】 Referring to FIG. 2, metal nanowires 112 are dispersed in the surface layer 110 of the film 10 for manufacturing electronic components according to an example. 【0023】 Specifically, referring to FIG. 3, the surface layer 110 can include a first resin layer 111 and metal nanowires 112 dispersed in the first resin layer 111. 【0024】 The first resin layer 111 may contain a polyester compound or a polyester polymer, for example, the main repeating unit may be at least one selected from ethylene terephthalate and ethylene naphthalate. As an example, the first resin layer 111 may contain polyethylene terephthalate (PET, poly(ethylene terephthalate)) formed by condensation polymerization of ethylene glycol with terephthalic acid. In this case, polyethylene terephthalate can be produced using the direct method using terephthalic acid as described above, but it can also be produced by the DMT method using dimethyl terephthalate. 【0025】 The metal nanowire 112 can be a wire-shaped structure having a size in the nanometer range. Here, the average particle size of the metal nanowire 112 can be 10 nm to 1.0 μm, and the aspect ratio can be 10 to 500. Specifically, in the film 10 for manufacturing electronic components according to an example of the present invention, the metal nanowire 112 can contain a metallic substance, and the metallic substance can be a monatomic ferromagnetic metal. The metal nanowire can be synthesized by a Vapor-Liquid-Solid (VLS) process, but is not limited to this. 【0026】 Examples of single-atom ferromagnetic metals include, but are not limited to, nickel (Ni), cobalt (Co), iron (Fe), or alloys of two or more of these. By including metal nanowires 112 of a metal that simultaneously possesses magnetism and conductivity in one example of an electronic component manufacturing film 10, the cooling efficiency is improved by ensuring close contact between the molten extruded sheet and the casting roll or cooling roll in the casting process described later, while simultaneously providing antistatic properties and preventing damage to the ceramic layer due to static electricity. This makes it possible to manufacture an electronic component manufacturing film 10 with a uniform thickness, improve wrinkle defects that may occur in the lamination process due to static electricity, and prevent contamination by foreign matter due to static electricity, ultimately improving the properties of electronic components such as MLCCs. 【0027】 As shown in Figure 3, the metal nanowires 112 can have a structure in which they are dispersed inside the surface layer 110, but are not limited to this. For example, the metal nanowires 112 can be dispersed not only in the surface layer 110 but also inside the second resin layer 121 of the back layer 120. On the other hand, when the metal nanowires 112 are dispersed inside the surface layer 110, the surface layer 110 adheres closely to the cooling roll (casting roll) 320 described later, and the magnetic and conductive properties of the metal nanowires 112 can further improve the antistatic properties and adhesion of the film 10. 【0028】 In one example of a film 10 for manufacturing electronic components, the metal nanowires 112 can have a needle-like shape. That is, the metal nanowires 112 can have a columnar shape extended in one direction, but are not limited to this. 【0029】 If the metal nanowire 112 is needle-shaped, the aspect ratio (or length-to-width ratio) of the metal nanowire 112 can be between 10 and 500. Furthermore, by mixing multiple metal nanowires 112 with large differences in aspect ratio from each other and dispersing them in the first resin layer 111, the surface resistance of the final electronic component manufacturing film 10 can be adjusted. 【0030】 In one example of a film 10 for manufacturing electronic components, the metal nanowires 112 can be included in a content of less than 0.2 wt% relative to the content of the surface layer 110. 【0031】 [Table 1] 【0032】 Referring to Experimental Examples 1-3 in Table 1 above, it is preferable that the content of metal nanowires 112 is less than 0.2 wt% relative to the content of the surface layer 110. As in Comparative Examples 2 and 3, when the content of metal nanowires 112 is 0.2 wt% or more relative to the content of the surface layer 110, the high content of metal nanowires 112 can cause aggregation within the surface layer 110, potentially reducing the antistatic properties of the film. 【0033】 Furthermore, referring to Experimental Examples 1-3 in Table 1 above, the thickness deviation of the final electronic component fabrication film 10 can be reduced when metal nanowires 112 are included in the surface layer 110, compared to Comparative Example 1 which does not include metal nanowires 112. Here, thickness deviation can be defined as the value obtained by measuring the thickness of the surface layer 110 containing metal nanowires 112 in any multiple regions, for example, 10 different regions, and subtracting the minimum value (min) from the maximum value (Max) among the measured thicknesses. 【0034】 In other words, as shown in Experimental Examples 1-3, by including metal nanowires 112 in the surface layer 110, a more uniform surface layer 110 can be obtained, and as a result, the overall thickness of the film 10 for electronic component fabrication can also be made uniform. 【0035】 Furthermore, referring to Experimental Examples 1-3 in Table 1 above, it can be seen that static electricity generation is reduced when metal nanowires 112 are included in the surface layer 110 compared to Comparative Example 1, which does not contain metal nanowires 112. This reduction in static electricity generation prevents the inclusion of foreign matter during the roll-to-roll process for manufacturing the electronic component manufacturing film 10, and prevents the inclusion of foreign matter into electronic components when electronic components such as MLCCs are later laminated onto the electronic component manufacturing film 10. 【0036】 Furthermore, referring to Table 1 above, the peel force (mN) can be reduced when the metal nanowires 112 are included in the surface layer 110, compared to Comparative Example 1 which does not contain the metal nanowires 112. In this disclosure, a reduction in peel force means that the electronic component manufacturing films 10 and 11 can be easily peeled off from the electronic component or the molded and printed layer of the electronic component after the lamination process of the electronic component. 【0037】 Referring to Figure 3, an example of an electronic component manufacturing film 10 may further include a back layer 120 disposed on one surface of the surface layer 110. 【0038】 The back layer 120 may include a second resin layer 121 and a filler 122 dispersed within the second resin layer 121. 【0039】 The second resin layer 121 may have at least one main repeating unit selected from ethylene terephthalate and ethylene naphthalate, and may contain the same substance as the first resin layer 111, but is not limited thereto. For example, the second resin layer 121 may also contain PET, but is not limited thereto, and may contain other polyester compounds or polyester polymers. The polyethylene terephthalate of the second resin layer 121 can be produced using the direct method using terephthalic acid as described above, but it can also be produced by the DMT method using dimethyl terephthalate. 【0040】 The filler 122 can be a conventional inorganic filler. For example, the filler 122 can be silica (SiO2), but is not limited to this, and may include one or more inorganic fillers such as BaSO4, CaCO3, and TiO2, and the average particle size of the filler 122 can be 2 μm to 5 μm, but is not limited to this. 【0041】 The back layer 120 contains a filler 122, which allows the sheet shape to be maintained during the roll-to-roll process of manufacturing the sheet 10 for electronic component manufacturing, and also allows for smooth sheet transfer during the elongation process in the roll-to-roll process. Furthermore, the filler 122 ensures that the rigidity of the sheet 10 is sufficiently maintained during the manufacturing process. 【0042】 On the other hand, although it has been shown that the filler 122 is dispersed only inside the back layer 120, it is not limited to this. For example, the filler 122 may also be dispersed inside the surface layer 110. 【0043】 On the other hand, referring to Figure 3, in one example of a film 10 for manufacturing electronic components, the average thickness of the back layer 120 can be greater than the average thickness of the front layer 110. 【0044】 In this disclosure, "average thickness" does not mean the thickness in any single region, but rather the average value of the thicknesses in any multiple regions of the configuration. For example, the average thickness of the surface layer 110 may mean the average value of the shortest distance measured between one surface of the surface layer 110 and another surface of the surface layer 110 facing each other in any multiple separated regions of the surface layer 110. 【0045】 Furthermore, the ratio of the thicknesses of the surface layer 110 and the back layer 120 can be between 1:9 and 3:7. That is, if the average thickness of the entire electronic component manufacturing film 10 composed of the surface layer 110 and the back layer 120 is 100, then the average thickness of the surface layer 110 can be between 10 and 30, and consequently the average thickness of the back layer 120 can be between 90 and 70. 【0046】 Because the surface layer 110 and the back layer 120 have the above-mentioned average thickness ratio, the film 10 for manufacturing electronic components, as an example, can have sufficient magnetism and conductivity, and can also have sufficient rigidity during the manufacturing process due to the filler 122. 【0047】 Figure 4 is a plan view of a film for manufacturing electronic components according to a modified example of the present invention. 【0048】 Referring to Figure 4, a modified version of the film 11 for manufacturing electronic components is shown. 【0049】 A modified version of the film 11 for manufacturing electronic components may include a surface layer 110, a back layer 120 disposed on one side of the surface layer 110, and a release layer 200 disposed on the other side facing the surface layer 110. 【0050】 Since the modified film 11 for manufacturing electronic components includes only a release layer 200 in addition to the film 10 for manufacturing electronic components according to one example, the above-described explanation for the film 10 for manufacturing electronic components according to one example can be applied identically to the remaining overlapping components other than the release layer 200. 【0051】 The release layer 200 is placed on the other side of the surface layer 110 and allows for easy separation of the electronic component or the molded / printed layer of the electronic component, which is later placed on the electronic component manufacturing film 11, from the electronic component manufacturing film 11. 【0052】 The release layer 200 can be a silicone release layer. For example, the release layer 200 may include a colored coating composition containing a mixed component including alkenylpolysiloxane and hydrogen polysiloxane, a platinum catalyst-containing compound, an epoxy compound, a dye, and a residual solvent, and may have a structure in which the colored coating composition is applied at least once. On the other hand, the material of the release layer 200 according to the present invention is not limited thereto. Another example is that the release layer 200 according to the present invention may include a silicone release composition mainly composed of dimethylpolysiloxane. On the other hand, the release layer 200 may have an average thickness of 10 nm to 200 nm. 【0053】 The release layer 200 can be applied and placed on the other surface of the surface layer 110 after the extrusion and cooling process of the film 10, which will be described later. 【0054】 The modified film 11 for manufacturing electronic components includes a release layer 200, a surface layer 110, and a back layer 120, and further includes metal nanowires 112 and a filler 122, thereby maintaining a low surface resistance (Sheet resistance, ohm / sq, Ω / □) on the surface of the release layer 200 of the modified film 11 for manufacturing electronic components. 【0055】 As an example, the release layer 200 of the film 11 for manufacturing electronic components according to a modified version of the present invention may have one surface facing the surface layer 110 and another surface facing the aforementioned surface, and the surface resistance on the other surface of the release layer 200 may be 10^10 Ω / □ or less. This reduces the amount of static electricity generated by the film 11 for manufacturing electronic components according to the modified version, and prevents contamination of foreign matter and damage to electronic components due to static electricity. 【0056】 Other overlapping configurations are omitted because the explanation for the example of a film for manufacturing electronic components can be applied to them identically. 【0057】 Figure 5 is a process diagram showing a part of the manufacturing process of a film for electronic component manufacturing according to an example of the present invention. 【0058】 Referring to Figure 5, a molten sheet 10 for manufacturing electronic components, including a surface layer 110 and a back layer 120, is extruded from the extruder 310. At this time, in order to uniformly elongate the extruded molten sheet 10 for manufacturing electronic components in the lateral direction and make the thickness uniform, it is necessary to minimize the degree of crystallinity within the extruded molten sheet 10. 【0059】 Therefore, the extruded molten sheet 10 for electronic component manufacturing shown in Figure 5 undergoes a cooling process while in close contact with a casting roll or a cooling roll 320. The extruded molten sheet 10 for electronic component manufacturing can have a temperature of 260°C to 270°C and is cooled by the cooling roll 320, which has a temperature of 20°C to 25°C. At this time, the surface layer 110 of the molten sheet 10 for electronic component manufacturing can be in close contact with the surface of the cooling roll 320, and high adhesion can be ensured by including metal nanowires 112 inside the surface layer 110. 【0060】 For the cooling process in the cooling roll 320 to be more efficient, the molten sheet 10 for electronic component manufacturing must adhere more closely to the cooling roll 320. As described above, the film 10 for electronic component manufacturing of the present invention contains metal nanowires 112 internally, and therefore can have magnetic properties. 【0061】 The magnetic band 330 is utilized by taking advantage of the magnetic properties of the film 10 for manufacturing electronic components. The magnetic force of the magnetic band 330 is in the range of 0.05 to 10 N. For example, if the magnetic band has north pole magnetism, the side of the molten sheet 10 for manufacturing electronic components that is close to the magnetic band 330 will have south pole magnetism, and the side of the molten sheet 10 for manufacturing electronic components that is close to the cooling roll 320 will have north pole magnetism. In this case, if the cooling roll 320 is controlled to have south pole magnetism, the molten sheet 10 for manufacturing electronic components can be brought into close contact with the cooling roll 320 without physical damage by utilizing the magnetic force. On the other hand, it is also possible to control the magnetic force to be formed in the opposite direction to the example described above. 【0062】 Conventionally, methods for adhering molten sheets 10 for electronic component manufacturing include a physical adhesion method using an air nozzle or an electrical adhesion method using the addition of an antistatic agent and the application of electricity. 【0063】 However, in the case of the physical adhesion method, the spray from the air nozzle may leave air marks on the surface of the molten sheet 10, potentially causing physical damage to the surface of the molten sheet 10 and resulting in uneven thickness. 【0064】 Even in the case of electrical adhesion, excessive addition of antistatic agents may reduce compatibility within the molten polymer, potentially leading to a decrease in the surface roughness of the final film 10. 【0065】 In this invention, by utilizing the magnetism of the metal nanowire 112, the magnetic band 330 having magnetism, and the cooling roll 320, the molten sheet 10 for manufacturing electronic components can be effectively attached to the cooling roll 320 without physical damage. 【0066】 Thereafter, the cooled molten sheet 10 for electronic component manufacturing can be stretched 1.5 to 3 times in the longitudinal direction and 2 to 4 times in the transverse direction to produce a film with a thickness of 15 μm to 50 μm. 【0067】 Figure 6 is a comparative graph that schematically shows the effect of improving peel strength when using a film for manufacturing electronic components according to an example of the present invention. 【0068】 Referring to Figure 6, a graph is shown comparing the peel strength of a conventional film that does not contain metal nanowires 112 with an example and a modified example of films 10 and 11 for manufacturing electronic components that contain metal nanowires 112 as in the present invention. 【0069】 As shown in the graph in Figure 6, the electronic component manufacturing films 10 and 11 according to the example and modified examples can have a peeling force reduced by approximately 25% compared to existing films. This allows for easy peeling of electronic components or the molded and printed layers of electronic components that are later mounted on the electronic component manufacturing films 10 and 11 according to the example and modified examples, thereby preventing damage to the electronic components or the molded and printed layers of electronic components. 【0070】 Figure 7 is a comparative graph schematically showing the improvement effect on the wrinkle defect rate of the molded and printed layers when using a film for manufacturing electronic components according to an example of the present invention. 【0071】 Referring to Figure 7, a graph is shown comparing the wrinkle defect rate (ppm) of conventional films that do not contain metal nanowires 112 with films 10 and 11 for manufacturing electronic components, including an example and a modified example, that contain metal nanowires 112 as in the present invention. 【0072】 As shown in the graph in Figure 7, the films 10 and 11 for manufacturing electronic components, according to one example and a modified example, can have a wrinkle defect rate reduced by approximately 81% compared to existing films, thereby achieving a uniform average thickness. The uniform thickness of the films 10 and 11 prevents damage to the electronic components or the molding and printing layer shape of electronic components that are later placed on the films 10 and 11, and prevents the phenomenon of foreign matter contamination due to static electricity. 【0073】 Figure 8 is a schematic comparison graph showing that when using a film for manufacturing electronic components according to an example of the present invention, the number of times burn marks occur on the surface of auxiliary materials in the lamination equipment due to static electricity is improved. 【0074】 Referring to Figure 8, a graph is shown comparing the number of times burning occurs when a conventional film without metal nanowires 112 is used with films 10 and 11 for manufacturing electronic components, including an example and a modified example, that contain metal nanowires 112 as in the present invention. 【0075】 If antistatic measures are not adequately taken, excessive voltage and current may be generated by static electricity, potentially causing a burnt phenomenon due to the flow of current exceeding the capacity to accommodate. 【0076】 As shown in the graph in Figure 8, when tested on 20,000 products, the films 10 and 11 for electronic component manufacturing, based on the first example and modified versions, showed a reduction of approximately 96% in the burning phenomenon compared to the existing films. This makes it possible to prevent damage to the laminated auxiliary materials later on, based on the first example and modified versions. 【0077】 Although embodiments of the present invention have been described in detail above, the present invention is not limited to the embodiments described above and the attached drawings, but is limited by the attached claims. Accordingly, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, without departing from the technical idea of ​​the present invention as described in the claims, and these also fall within the scope of the present invention. [Explanation of symbols] 【0078】 10, 11: Film for manufacturing electronic components 110: Surface layer 111: 1st resin layer 112: Metal nanowires 120: Back layer 121: Second resin layer 122: Filler 200: Release layer 310: Extruder 320: Cooling Roll 330: Magnetic band

Claims

[Claim 1] Polymer layer and The polymer layer contains metal nanowires, The aforementioned metal nanowires do not extend outward from the polymer layer in a film for manufacturing electronic components. [Claim 2] The film for manufacturing electronic components according to claim 1, wherein the polymer layer contains a polyester compound. [Claim 3] The film for manufacturing electronic components according to claim 2, wherein the polyester compound is PET (Polyethylene terephosphate). [Claim 4] The film for manufacturing electronic components according to claim 3, wherein the metal nanowires include a ferromagnetic metal. [Claim 5] The film for manufacturing electronic components according to claim 4, wherein the ferromagnetic metal comprises at least one of nickel (Ni), cobalt (Co), iron (Fe), or an alloy thereof. [Claim 6] The film for manufacturing electronic components according to claim 5, wherein the polymer layer includes a surface layer and a back layer disposed on the surface layer. [Claim 7] The film for manufacturing electronic components according to claim 6, wherein the metal nanowires are dispersed within the surface layer of the polymer layer. [Claim 8] The film for manufacturing electronic components according to claim 6, further comprising a filler dispersed within the polymer layer. [Claim 9] The film for manufacturing electronic components according to claim 8, wherein the filler is dispersed within the back layer. [Claim 10] The film for manufacturing electronic components according to claim 6, wherein the aspect ratio of the metal nanowire is 10 to 500. [Claim 11] The film for manufacturing electronic components according to claim 10, wherein the content of the metal nanowires in the surface layer is less than 0.2 wt%. [Claim 12] The film for manufacturing electronic components according to claim 11, wherein the polymer layer further comprises a release layer disposed on the surface layer. [Claim 13] The average thickness of the back layer is greater than the average thickness of the surface layer. The film for manufacturing electronic components according to claim 12, wherein the ratio of the thickness of the surface layer and the back layer is 1:9 to 3:

7. [Claim 14] The film for manufacturing electronic components according to claim 13, wherein the surface resistance on the surface of the release layer is 10^10 Ω / □ or less.

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