Work handling sheet, method for handling workpieces, device manufacturing method, and use of work handling sheet.
The work handling sheet with an interfacial ablation layer efficiently separates and places micro LEDs using laser ablation, addressing the challenge of high-density LED mounting by reducing laser light needs and ensuring precise placement.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- LINTEC CORP
- Filing Date
- 2021-12-28
- Publication Date
- 2026-06-18
AI Technical Summary
Existing methods struggle to efficiently handle and mount large numbers of fine micro light-emitting diodes (LEDs) during the manufacturing process, particularly in high-density mounting applications.
A work handling sheet with a base material and an interfacial ablation layer that converts ultraviolet light into thermal energy with a conversion efficiency of 60% or more, allowing precise separation of LEDs using laser ablation, facilitated by an adhesive layer containing additives like ultraviolet absorbers and photoinitiators.
The work handling sheet effectively separates and places micro LEDs with high accuracy, reducing laser light requirements and preventing damage, thus enhancing the efficiency and precision of LED mounting processes.
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