Colloidal silica and its manufacturing method

JP7877553B2Active Publication Date: 2026-06-22FUSO CHEM
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
FUSO CHEM
Filing Date
2025-06-13
Publication Date
2026-06-22

AI Technical Summary

Technical Problem

Conventional methods for producing colloidal silica with reduced fine particles are insufficient to meet the requirements of advanced semiconductor manufacturing processes, leading to residue issues that affect yield and surface quality.

Method used

A method involving a specific heat treatment process for colloidal silica production, including controlled pH, stirring power, and alkoxysilane addition rates, followed by solvent replacement and heat treatment, to reduce fine particle content.

Benefits of technology

The method produces colloidal silica with a significantly lower fine particle content, reducing residual particles on polished surfaces and improving surface roughness during CMP processes.

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Abstract

To provide colloidal silica with a small amount of fine particles.SOLUTION: Colloidal silica having a fine particle content parameter 2 as defined below of 8.0% or less and an average secondary particle diameter of 20 nm to 69.3 nm is provided. Definition of fine particle content parameter 2: (i) Ultra-pure water having an electrical resistivity of 18.2 MΩ or more is added to a colloidal silica sample to be measured to dilute the same so that the silica concentration after dilution becomes 0.1 mass%. The obtained diluted solution is used as a measurement sample 2. (ii) The particle size distribution of the measurement sample 2 is measured by a particle size distribution measuring device based on a scanning electrical mobility diameter measurement method. (iii) From the measured values of the obtained particle size distribution, the fine particle content parameter 2 of the colloidal silica sample is calculated using the following formula. Fine particle content parameter 2=(total number of detected particles of 15 nm or less)÷(total number of detected particles of all particles)×100 [%]SELECTED DRAWING: None
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Citation Information

Patent Citations

  • JP2020075830A

  • JP2020164351A

  • JP2021054684A

  • JP2021116208A

  • JP2022109711A