Resin sheets, laminates, metal-clad laminates, printed circuit boards, and semiconductor packages

JP7878323B2Active Publication Date: 2026-06-23RESONAC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
RESONAC CORP
Filing Date
2021-10-14
Publication Date
2026-06-23

AI Technical Summary

Benefits of technology

【0008】 本開示によれば、支持体が無い状態での取り扱いが可能であり、低熱膨張性を有し、10GHz帯以上の高周波数帯における比誘電率(Dk)が2.65~3.30及び10GHz帯以上の高周波数帯における誘電正接(Df)が0.00097以下の樹脂シートを提供することができる。さらに、当該樹脂シートを用いて製造される、積層板、プリント配線板及び半導体パッケージを提供することができる。

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Abstract

Provided is a resin sheet which contains a resin component (A) and an inorganic filler (B). The component (A) contains (A1) an elastomer having a number average molecular weight of 10,000 or more. The content of the component (A1) is 30 mass% or more relative to the component (A). The content of the component (B) is 40-95 vol% relative to the total amount of the resin sheet.
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Claims

1. A resin sheet containing (A) a resin component and (B) an inorganic filler, The above-mentioned component (A) comprises (A1) an elastomer with a number average molecular weight of 10,000 or more, (A2) an elastomer with a number average molecular weight of less than 10,000, and (A3) a thermosetting resin, wherein the content of component (A1) is 30% by mass or more based on the above-mentioned component (A), The content of component (B) is 40 to 95% by volume based on the total amount of the resin sheet. A resin sheet in which the total content of component (A1) and component (A2) is 60 to 95% by mass based on component (A).

2. The resin sheet according to claim 1, wherein the content of component (B) is 60 to 95% by volume based on the total amount of the resin sheet.

3. The resin sheet according to claim 1 or 2, which does not contain an organic solvent, or if it does contain an organic solvent, the amount of the organic solvent is less than 1% by mass based on the total amount of the resin sheet.

4. A resin sheet according to any one of claims 1 to 3, wherein it does not contain glass fibers, or if it contains glass fibers, the amount of glass fibers is 10% by volume or less based on the total amount of the resin sheet.

5. The resin sheet according to any one of claims 1 to 4, wherein the (A1) component comprises one or more selected from the group consisting of styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, acrylic elastomers, silicone elastomers, and derivatives thereof.

6. The resin sheet according to any one of claims 1 to 5, wherein the (A2) component comprises one or more selected from the group consisting of polybutadiene elastomers and styrene elastomers.

7. The resin sheet according to any one of claims 1 to 6, wherein the (A3) component comprises one or more selected from the group consisting of epoxy resin, phenolic resin, unsaturated imide resin, cyanate resin, isocyanate resin, benzoxazine resin, oxetane resin, amino resin, unsaturated polyester resin, allyl resin, dicyclopentadiene resin, silicone resin, triazine resin, and melamine resin.

8. A laminate containing a cured resin sheet according to any one of claims 1 to 7.

9. A metal-clad laminate comprising a metal foil and a cured resin sheet according to any one of claims 1 to 7.

10. A printed circuit board comprising a laminate according to claim 8 or a metal-clad laminate according to claim 9.

11. A semiconductor package comprising a printed circuit board according to claim 10 and a semiconductor element.