Substrate processing apparatus and substrate processing method

Abstract

The present invention is a substrate processing apparatus for processing a substrate. According to an embodiment of the present invention, a substrate processing apparatus is provided. The substrate processing apparatus includes a reaction tube in which substrate processing is performed, a boat that is carried in and out through the reaction tube via a boat lifting unit and on which a plurality of substrates are placed in the vertical direction, a substrate loading unit in which a loading area is formed where the plurality of substrates are loaded and unloaded onto the boat through a substrate transfer robot, an outside air inflow unit that adjusts the amount of outside air flowing into the loading area, a gas control device that adjusts the injection amount of an inert gas, a particle measurement sensor that measures particle information in the loading area, and a control unit that adjusts one or more of the outside air inflow unit and the gas control device.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method for processing a substrate.

Background Art

[0002] Generally, semiconductor elements and display elements are manufactured through various processes such as thin film deposition and etching on a substrate, and a batch-type deposition system is used as a system for processing the substrate.

[0003] In a batch-type deposition system, a FOUP (Front Opening Unified Pod) that accommodates a plurality of substrates through a load port can be carried into the system and stored in a stocker. Such a stocker is composed of a plurality of vertically stacked shelves, and the FOUP stored in the stocker can be brought into close contact with the FIMS (Front-opening Interface Mechanical Standard) door unit by a transfer robot moving along a vertically extended transfer robot rail.

[0004] After the FIMS is in close contact with the door unit, the substrate transfer robot can receive a plurality of substrates using transfer forks with the FOUP having one side open, and stack the plurality of substrates on the boat while the substrate transfer robot moves downward.

[0005] In the batch-type deposition system as described above, a plurality of substrates can be loaded inside the substrate loading unit, a boat can be formed inside, and the plurality of substrates can be stacked on the boat in a loading area inside the substrate loading unit.

[0006] In this case, the loading area is an area where multiple substrates are exposed, and when particles are generated within the loading area, it can have a significant impact on wafer quality. However, it is impossible to detect particles within the loading area in real time, and it is impossible for users to be aware of the particles. As a result, a problem arises in that it is impossible to respond to wafer quality defects caused by the unexpected generation of particles. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] The present invention aims to solve many problems, including those described above, and provides a substrate processing apparatus and a substrate processing method that execute a sequence capable of suppressing particles by controlling the airflow rate of a fan filter unit (FFU) or the flow rate of purge gas in order to remove particles from within the loading area where the substrate is loaded. However, the above-mentioned problems are illustrative and do not limit the scope of the present invention. [Means for solving the problem]

[0008] According to one embodiment of the present invention, a substrate processing apparatus is provided. The substrate processing apparatus includes: a reaction tube having an opening formed at the bottom, in which substrate processing is performed; a boat on which a plurality of substrates are loaded and unloaded via the reaction tube through a boat lifting unit and placed in the vertical direction; a substrate loading section located below the reaction tube, with a loading area formed inside where the plurality of substrates are loaded and unloaded onto the boat via a substrate transfer robot; an outside air inlet section formed on one side of the substrate loading section, communicating with the loading area and allowing outside air to flow into the loading area, and adjusting the amount of outside air flowing in; a gas control device that adjusts the amount of inert gas injected into the loading area; a particle measuring sensor that measures particle information of the loading area; and a control unit that adjusts one or more of the outside air inlet section and the gas control device based on the particle information received from the particle measuring sensor so as to reduce particles in the loading area.

[0009] According to one embodiment of the present invention, the control unit may include a particle quantity determination unit that compares the amount of particles measured by the particle measuring sensor with a previously set reference value; and a particle size determination unit that determines the size of the particles measured by the particle measuring sensor if the amount of particles measured is greater than or equal to the reference value.

[0010] According to one embodiment of the present invention, the control unit can control the strength of the outside air inlet so as to increase the amount of outside air flowing into the loading area when particles larger than a set size are measured by the particle measuring sensor at or above a reference value.

[0011] According to one embodiment of the present invention, the control unit can control the gas control device to increase the amount of inert gas injected when particles smaller than a set size are measured by the particle measuring sensor at or above a reference value.

[0012] According to one embodiment of the present invention, when the particle measuring sensor detects particles larger than a previously set size at or above a reference value, the control unit can drive the outside air inlet and the gas control device at predetermined time intervals, respectively, to alternately increase the amount of outside air flowing into the loading area and increase the amount of inert gas injected.

[0013] According to one embodiment of the present invention, the outside air inlet may include a fan filter unit formed on one side of the loading area, which adjusts the amount of outside air flowing in from the outside air inlet.

[0014] According to one embodiment of the present invention, a substrate processing method is provided. The substrate processing method includes a process step in which a boat on which a plurality of substrates are placed in the vertical direction via a boat lifting unit is loaded or unloaded through an opening formed at the bottom of a reaction tube in which the substrate processing is performed, and the plurality of substrates are processed; a particle measurement step, before or after the process step, in which particle information of a loading area in which the plurality of substrates are loaded and unloaded onto the boat is measured inside a substrate loading section located at the bottom of the reaction tube; and a control step, in which one or more of an outside air inlet section that adjusts the amount of outside air flowing into the loading area and a gas control device that adjusts the amount of inert gas injected into the loading area, are adjusted so as to reduce the particles in the loading area based on the particle information measured in the particle measurement step.

[0015] According to one embodiment of the present invention, the control step may include a particle quantity determination step of comparing the amount of particles measured in the particle measurement step with a previously set reference value; and a particle size determination step of determining the size of the particles measured in the particle measurement step if the amount of particles measured is greater than or equal to the reference value.

[0016] According to one embodiment of the present invention, the control step may include a fan filter unit control step that controls the strength of the outside air inlet so as to increase the amount of outside air flowing into the loading area when particles larger than the size already set in the particle measurement step are measured above a reference value;

[0017] According to one embodiment of the present invention, the control step may include a gas supply control step in which the gas control device controls the amount of inert gas injected if particles smaller than a size already set in the particle measurement step are measured at or above a reference value; [Effects of the Invention]

[0018] According to some embodiments of the present invention configured as described above, particles of different sizes within the loading area can be monitored in real time, and when particles are generated, the number of particles can be reduced through a suppression control algorithm.

[0019] Furthermore, by selectively driving the control of ambient air or the injection amount of inert gas based on particles generated by physical detachment and particles generated by chemical reactions, and controlling them in different ways depending on the cause, the generation of additional particles can be prevented, thereby improving the processing quality of the substrate. Of course, the scope of the present invention is not limited by such effects. [Brief explanation of the drawing]

[0020] [Figure 1] This figure shows a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] This flowchart shows the drive of a substrate processing apparatus according to one embodiment of the present invention. [Figure 3] This table shows the operation of the fan filter unit and gas control device based on the particle size measured by the substrate processing apparatus of the present invention. [Figure 4]It is a flowchart showing a substrate processing method according to an embodiment of the present invention. [Figure 5a] It is a graph showing the change in the amount of particles due to the driving of the fan filter unit and the gas control device of a substrate processing apparatus according to an embodiment of the present invention. [Figure 5b] It is a graph showing the change in the amount of particles due to the driving of the fan filter unit and the gas control device of a substrate processing apparatus according to an embodiment of the present invention.

Mode for Carrying Out the Invention

[0021] Hereinafter, many preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0022] Each embodiment of the present invention is provided to more fully explain the present invention to those having ordinary knowledge in the relevant technical field. The following embodiments can be modified in many different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to further enrich and complete the present disclosure and to fully convey the idea of the present invention to those skilled in the art. Also, the thickness and size of each layer in the drawings are exaggerated for the sake of convenience and clarity of explanation.

[0023] Hereinafter, each embodiment of the present invention will be described with reference to the drawings schematically showing each ideal embodiment of the present invention. In each drawing, for example, various deformations of the illustrated shape can be expected due to manufacturing technology and / or tolerance. Therefore, the embodiments of the idea of the present invention should not be construed as being limited to the specific shape of the region illustrated in this specification, and should include, for example, changes in shape brought about during manufacturing.

[0024] FIG. 1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a flowchart showing the driving of the substrate processing apparatus of FIG. 1, and FIG. 3 is a table showing the driving of the fan filter unit and the gas control device 80 according to the particle size measured by the substrate processing apparatus of the present invention.

[0025] First, a substrate processing apparatus according to one embodiment of the present invention can be broadly divided into a reaction tube 10, a boat 20, an outside air inlet 70, a gas control device 80, a particle measuring sensor 40, and a control unit 50.

[0026] As shown in Figure 1, the reaction tube 10 has an opening at the bottom and can contain a boat 20 and a process tube in which multiple substrates S are processed. Various components necessary for the deposition process, such as a gas supply unit and a gas discharge unit, can be installed inside the reaction tube 10.

[0027] Specifically, the reaction tube 10 may consist of an inner tube and an outer tube, and may be made of a heat-resistant material such as quartz. The reaction tube 10 has an exhaust port (not shown) for exhausting the inside, and the exhaust port may be connected to a pump (not shown) with pumping capability.

[0028] A manifold may be formed on one side of the reaction tube 10, with gas supply pipes (not shown) installed for supplying gas into the reaction tube 10, and each of the gas supply pipes may be connected to a gas nozzle (not shown) extending upward from the inside of the reaction tube 10.

[0029] The boat 20 is loaded and unloaded via the reaction tube 10 through the boat lifting unit 21, and multiple substrates S picked up by the substrate transfer robot are placed on it in the vertical direction, allowing the boat to move up and down with the multiple substrates S stacked inside. At this time, when the boat 20 is raised, a support part can be sealed and connected to the reaction tube 10.

[0030] Once the loading of multiple substrates S into the boat 20 is complete, the boat 20 may be raised and positioned inside the reaction tube 10. Process gases are injected from the reaction tube 10, and thin films may be deposited onto the multiple substrates S.

[0031] As shown in Figure 1, the outside air inlet 70 is formed on at least one side of the substrate loading section 100 and may include a blower fan and a filter section.

[0032] The outside air inlet 70 is a device that adjusts the amount of outside air flowing in from the inlet pipe.

[0033] For example, the outside air inlet 70 may include a plurality of blower fans formed on the side of the loading area A, and outside air can flow into the loading area A from outside through the rotation of the blower fans. In this case, the amount of outside air flowing in may change depending on the rotational strength of the blower fans.

[0034] The outside air inlet 70 may include a filter section that filters out contaminants contained in the outside air before it flows into the loading area A through the blower fan. The filter section may be formed by being coupled to each of the plurality of blower fans, or it may be formed to surround at least one side of the frame to which the plurality of blower fans are coupled.

[0035] For example, the outside air inlet 70 may be formed on one side of the loading area A and may include a fan filter unit that adjusts the amount of outside air flowing in from the outside air inlet 70.

[0036] The outside air inlet 70 is formed on one side of the substrate loading section 100 and allows outside air to flow into the loading area A via an inlet pipe that communicates with the loading area A.

[0037] The inlet pipe may be formed on the side of the substrate loading section 100 behind the blower fan, or it may be formed above the blower fan so that the outside air flowing into the inlet pipe flows from top to bottom.

[0038] Furthermore, an exhaust pipe 60 and a shut-off valve 61 may be formed in at least a part of the substrate loading section 100 so that the internal gas of the loading area A can be exhausted to the outside. In this case, the exhaust pipe 60 can be exhausted in all directions by means of a slit damper formed on the side, a T / R damper (damper) formed at the bottom, and an L / A exhaust pipe formed at the top.

[0039] The exhaust pipes 60 can be formed on all four sides of the substrate loading section 100, and the exhaust of air or gas within the loading area A can induce a change in the flow within the loading area A, thereby inducing the discharge of particles remaining in the loading area A.

[0040] As shown in Figure 1, the gas control device 80 can adjust the amount of inert gas injected into the loading area A.

[0041] Specifically, the gas control device 80 is formed outside the loading area A and may be formed in at least a portion of the flow path line connecting the gas supply unit 81 that supplies the inert gas and the loading area A.

[0042] The gas control device 80 is a gas control valve that either shuts off the flow of the inert gas or shuts off the backflow of gas or outside air. For example, the gas control device 80 is a mass flow controller (MFC) that can accurately and quickly control the flow rate of the inert gas supplied. The gas control device 80 can be controlled by the control unit 50, which will be described later.

[0043] The aforementioned inert gas may include nitrogen gas and argon gas, and may also include other gases whose gas molecular bonds are strong and do not break easily, or whose atoms themselves do not stably undergo chemical reactions.

[0044] As shown in Figure 1, the particle measurement sensor 40 may include a device for measuring particle information in the loading region A inside the substrate loading section 100 where the reaction tube 10 and boat 20 are formed.

[0045] Specifically, the particle measurement sensor 40 can measure the size and quantity of particles present in loading area A by sampling a portion of the gas or air in loading area A and measuring the particle information contained in the sample. In this case, the particle information may include the size and quantity of particles contained in the sample.

[0046] For example, the particle measurement sensor 40 is formed inside the substrate loading section 100, and a portion of the gas or air in the loading area A flows into the particle measurement sensor 40, allowing the size and quantity of particles contained in the incoming gas or air to be measured. Preferably, the particle measurement sensor 40 is formed on one side of the substrate loading section 100, and the gas or air flowing into the sampling port 41, which communicates with the loading area A, is used as a sample. The size and quantity of particles contained within the sample are measured, and through this, particle information present in the loading area A can be measured.

[0047] The particle measurement sensor 40 is connected to the control unit 50 by wire or wireless connection, and can record and store the particle information, and can transmit the particle information to the control unit 50.

[0048] The sampling port 41 is located at the bottom of the loading area A of the FIMS, boat 20, transport robot, etc., and may be formed as one or more collection ports for collecting particles falling to the bottom.

[0049] The control unit 50 can adjust one or more of the atmospheric atmosphere and inert gas atmosphere inside the loading area A based on the particle information received from the particle measurement sensor 40, so as to reduce the number of particles in the loading area A.

[0050] Specifically, the control unit 50 can control the airflow output of the fan filter unit, which adjusts the amount of outside air flowing into the loading area A, from 0% to 100% based on particle information measured from the particle measuring sensor 40. It can also adjust the flow rate of the inert gas injected from the gas control device 80, which adjusts the amount of inert gas injected into the loading area, from 0 slm to 2,000 slm, and selectively control the fan filter unit and the gas control device 80.

[0051] The control unit 50 may include a particle quantity determination unit 51 that compares the amount of particles measured by the particle measurement sensor 40 with a previously set reference value, and a particle size determination unit 52 that determines the size of the particles measured by the particle measurement sensor 40 if the amount of particles measured is greater than or equal to the reference value.

[0052] Specifically, the control unit 50 can control the strength of the fan filter unit to increase the amount of outside air flowing into the loading area A if the particle measurement sensor 40 measures particles larger than a set size at or above a reference value.

[0053] For example, if the particle measurement sensor 40 detects particles, and the particle quantity determination unit 51 determines that the particles measured at or above the reference value are larger than the size set by the particle size determination unit 52, the control unit 50 can control the fan filter unit's strength to drive it even stronger than the maintained state.

[0054] At this time, by strongly controlling the drive of the fan filter unit, the exhaust pipe, including the slit damper, T / R damper, L / A, etc., can be opened, thereby reducing the particle concentration in the loading region A.

[0055] Specifically, if particles larger than the set size are generated in amounts exceeding the aforementioned reference value, it generally indicates that physical detachment of the material surface, such as peeling or cracking, has occurred, or that dust or a source of contamination has been introduced from the outside. In such cases, the control unit 50 controls the fan filter unit to drive strongly, and by introducing a large volume of outside air, the foreign matter floating in the loading area A can be discharged to the outside.

[0056] Furthermore, the control unit 50 can control the gas control device 80, which adjusts the amount of inert gas injected into the loading area A to increase the amount of inert gas injected when particles smaller than a set size are measured by the particle measurement sensor 40 in amounts exceeding a reference value.

[0057] For example, if the particle quantity determination unit 51 determines that any particles detected by the particle measurement sensor 40 that are measured at or above the reference value are smaller than the size set by the particle size determination unit 52, the control unit 50 can control the gas control device 80 to increase the amount of inert gas injected into the loading area A.

[0058] At this time, the fan filter unit is driven at its existing strength so that the inert gas can flow into the loading region A, and the exhaust pipe, including the slit damper, T / R damper, L / A, etc., is opened to reduce the particle concentration in the loading region A.

[0059] Specifically, if particles smaller than the set size, for example, fine particles at the 0.1 μm level, are generated in amounts exceeding the aforementioned reference value, these are generally fumes discharged from the substrate loading section 100, such as reactants formed by the bonding of elements or ions like H+, OH-, and Cn with oxygen. Therefore, the control unit 50 can be controlled to supply a large amount of inert gas to suppress the formation of particles through chemical reactions, thereby preventing particle generation and allowing the generated particles to be discharged.

[0060] Furthermore, when the problem is addressed by introducing a large volume of outside air, the control unit 50 can control the system to increase the density of the inert gas, thereby preventing the formation of oxides and carbon-bonded compounds.

[0061] When the particle measurement sensor 40 detects particles larger than a previously set size at or above a reference value, the control unit 50 drives the fan filter unit and the gas control device 80 at predetermined time intervals, respectively, to alternately increase the amount of outside air flowing into the loading area A and increase the amount of inert gas injected.

[0062] In other words, if the particle quantity determination unit 51 measures the amount at or above the reference value, and the particle size determination unit 52 determines that particles larger than and smaller than the already set size are present, the control unit 50 can exhaust particles due to physical detachment by driving the fan filter unit to its maximum capacity, and the gas control device 80 can increase the amount of inert gas injected into the loading area A to exhaust particles due to chemical reactions.

[0063] In this case, after driving the fan filter unit for a certain period of time, the process can be repeated alternately while controlling the gas control device 80 for a certain period of time.

[0064] As shown in Figure 2, the substrate processing apparatus according to the present invention is driven by a sampling port 41 formed on one side of the substrate loading section 100, through which the loading area A and the particle measurement sensor 40 communicate, allowing particles to flow in.

[0065] Subsequently, the particle measurement sensor 40 can sample and measure a portion of the gas or air in loading area A. At this time, the particle quantity determination unit 51 of the control unit 50 can determine whether the measured particles are above a reference value, and if it is determined that the particles do not reach the reference value, the standard flow rate control state can be maintained. That is, as in the case of C-1 in Figure 3, the airflow rate of the fan filter unit can be maintained at the standard state, the gas control device 80 can be controlled not to inject gas, and the exhaust pipe can be opened.

[0066] Next, the particles of the continuously flowing sample can be measured, or the particles sampled at a predetermined next cycle, such as a certain period of time or before and after a process, can be measured.

[0067] Furthermore, if the particle quantity determination unit 51 of the control unit 50 determines that the measured particle quantity is above a reference value, the particle size determination unit 52 can determine whether or not there are particles larger than the size already set.

[0068] If none of the detected particles are larger than the already set size, that is, if the particles are smaller than or the same size as the already set size, the gas control device 80 can increase the amount of inert gas injected. In other words, as in the case of C-2 in Figure 3, the airflow of the fan filter unit can be maintained at the standard state, the injection amount of the gas control device 80 can be maximized, and the exhaust pipe can be opened.

[0069] If any of the detected particles are larger than the already set size, the airflow of the fan filter unit can be strongly controlled. That is, as in the cases of C-3 and C-4 in Figure 3, the airflow of the fan filter unit can be increased to its maximum speed and controlled to open the exhaust pipe.

[0070] At this time, the particle size determination unit 52 of the control unit 50 can determine whether or not there are particles smaller than the already set size.

[0071] If no particles smaller than the already set size are detected, the fan filter unit's airflow can be maintained at a high speed, and the gas control device 80 can either refrain from injecting inert gas or maintain a standard flow rate control state. That is, as in the case of C-3 in Figure 3, the fan filter unit's airflow can be increased to its maximum speed, the gas control device 80 can refrain from injecting gas, and the exhaust pipe can be opened.

[0072] Next, the particles of the continuously flowing sample can be measured, or the particles sampled at a predetermined next cycle, such as a certain period of time or before and after a process, can be measured.

[0073] If any of the detected particles are smaller than the already set size, the fan filter unit's airflow can be maintained at a high level, and the gas control device 80 can increase the amount of inert gas injected. That is, as in the case of C-4 in Figure 3, the fan filter unit's airflow can be increased to its maximum speed, the gas control device 80's injection amount can be maximized, and the exhaust pipe can be opened.

[0074] Next, the particles of the continuously flowing sample can be measured, or the particles sampled at a predetermined next cycle, such as a certain period of time or before and after a process, can be measured.

[0075] Figure 4 is a flowchart showing a substrate processing method according to one embodiment of the present invention.

[0076] A substrate processing method according to one embodiment of the present invention may include a process processing step (S100), a particle measurement step (S200), and a control step (S300).

[0077] As shown in Figure 4, the process step (S100) is the step in which a boat 20 on which multiple substrates S are placed in the vertical direction is brought in or brought out through an opening formed at the bottom of the reaction tube 10 where the substrate processing takes place, via a boat lifting unit 21, and the multiple substrates S are processed.

[0078] The process stage (S100) is the stage in which multiple substrates S picked up by a substrate transfer robot are placed vertically on a boat 20, stacked inside, and then raised and lowered through a boat lifting unit 21, and transported into a reaction tube 10 which is formed as a process tube, where the multiple substrates S are processed.

[0079] The process step (S100) may include the step in which the support section is sealed and connected to the reaction tube 10 when the boat 20 is raised.

[0080] The particle measurement step (S200) is a step performed before or after the process processing step (S100) in which particle information of the loading area A is measured using a particle measurement sensor 40 inside the substrate loading section 100 in which the reaction tube 10 and boat 20 are formed.

[0081] As shown in Figure 4, the particle measurement step (S200) may be performed before the process processing step (S100), and although not shown in the figure, it may also be performed after the process processing step (S100) or during the process processing step (S100).

[0082] The particle measurement step (S200) is a step in which a portion of the gas or air in the loading area A, formed inside the substrate loading section 100, flows into the particle measurement sensor 40, and the size and quantity of particles contained in the incoming gas or air are measured.

[0083] Preferably, the particle measurement step (S200) is a step in which the size and quantity of particles contained within a sample are measured using gas or air flowing into a sampling port 41 communicating with the loading area A as a sample, and through this, particle information present in the loading area A is measured.

[0084] As shown in Figure 4, the control step (S300) is a step in which the control unit 50 adjusts one or more of the atmospheric atmosphere and inert gas atmosphere inside the loading area A so as to reduce the number of particles in the loading area A based on the particle information measured in the particle measurement step (S200). Specifically, this step involves controlling the outside air inlet 70, which adjusts the amount of outside air flowing into the loading area A, and the gas control device 80, which adjusts the amount of inert gas injected into the loading area.

[0085] Specifically, the control stage (S300) may include a particle quantity determination stage (S310) which compares the amount of particles measured in the particle measurement stage (S200) with a previously set reference value, and a particle size determination stage (S320) which, if the measured amount of particles is greater than or equal to the reference value, determines the size of the particles measured in the particle measurement stage (S200).

[0086] The control stage (S300) may include a fan filter unit control stage (S330) and a gas supply control stage (S340).

[0087] The fan filter unit control step (S330) is a step in which, if particles larger than the size already set in the particle measurement step (S200) are measured above a reference value, the strength of the outside air inlet 70 is controlled so that the amount of outside air flowing into the loading area A is increased.

[0088] For example, if, among the particles detected in the particle measurement stage (S200), the particles that are judged to be above the reference value in the particle quantity determination stage (S310) are judged to be even larger than the size set in the particle size determination stage (S320), the fan filter unit control stage (S330) is a stage in which the strength of the outside air inlet 70, for example, the fan filter unit, is controlled to be driven even stronger than the maintained state.

[0089] At this time, the fan filter unit control step (S330) further includes a step in which the exhaust pipe, including the slit damper, T / R damper, L / A, etc., is opened by strongly controlling the drive of the fan filter unit, thereby reducing the particle density in the loading region A.

[0090] The gas supply control stage (S340) is a stage in which the gas control device 80 adjusts the amount of inert gas injected into the loading area A to increase the amount of inert gas injected when particles smaller than the size already set in the particle measurement stage (S200) are measured in a value greater than or equal to a reference value.

[0091] For example, if, among the particles detected in the particle measurement stage (S200), the particles measured at or above the reference value in the particle quantity determination stage (S310) are determined to be even smaller than the size set in the particle size determination stage (S320), the gas supply control stage (S340) is a stage in which the gas control device 80 is controlled to increase the amount of inert gas injected into the loading area A.

[0092] At this time, the gas supply control step (S340) further includes a step in which the drive of the outside air inlet 70, for example, the fan filter unit, is maintained at an existing strength so that the inert gas can flow into the loading area A, and the exhaust pipe, including the slit damper, T / R damper, L / A, etc., is opened, thereby reducing the particle concentration in the loading area A.

[0093] Furthermore, if the particles detected in the particle measurement stage (S200) include both particles larger than and smaller than the already set size, the gas supply control stage (S340) and the fan filter unit control stage (S330) can be performed alternately.

[0094] Furthermore, if the detected particles persist for a certain period of time above the reference value, the boat 20 is removed from the reaction tube 10, or the inflow of substrates is stopped at the FIMS outside the substrate loading unit 100, thereby continuously controlling the loading area A so that no particles are detected, and thus protecting multiple substrates S from particles.

[0095] Figures 5a and 5b are graphs showing the change in particle quantity due to the operation of the outside air inlet section 70 and the gas control device 80 of the substrate processing apparatus according to one embodiment of the present invention.

[0096] Specifically, Figure 5a is a graph showing the size of particles detected by the particle measurement sensor 40 over time, and the number of particles detected after the fan filter unit has been driven. At this time, the size already set in the particle size determination unit 52 is 0.5 μm, and the standard flow rate control of the fan filter unit is 60%.

[0097] As shown in Figure 5a, four to five particles with a size of 0.5 μm or larger were detected at 300 sec, 500 sec, 800 sec, and 850 sec. Subsequently, at 900 sec, the fan filter unit was operated at 100% speed, and it was confirmed that no particles were detected by the particle measurement sensor 40. In other words, by operating the fan filter unit at maximum speed, particles floating in loading area A can be exhausted to the outside.

[0098] Figure 5b is a graph showing the size of particles detected by the particle measurement sensor 40 over time, and the number of particles detected after the gas control device 80 has been activated. At this time, the size already set in the particle size determination unit 52 is 0.1 μm, and the standard flow rate control of the gas control device 80 is 600 slm.

[0099] As shown in Figure 5b, 3 to 5 particles with a size of 0.1 μm were detected between 250 sec and 430 sec. Subsequently, at 450 sec, nitrogen gas from the gas control device 80 was injected at a flow rate of 1400 slm, and it was confirmed that no particles were detected by the particle measurement sensor 40. In other words, by increasing the flow rate of the inert gas from the gas control device 80, the formation of particles due to chemical reactions can be suppressed, and particles floating in the loading area A can be exhausted to the outside.

[0100] A substrate processing apparatus and substrate processing method according to one embodiment of the present invention can monitor particles of different sizes within the loading area in real time, and when particles are generated, the particles can be reduced through a suppression control algorithm. Furthermore, by selectively controlling the outside air inlet 70 or the gas control device 80 based on particles generated by physical detachment and particles generated by chemical reactions, and controlling them in different ways depending on the cause of generation, the generation of additional particles can be prevented, thereby improving the processing quality of the substrate.

[0101] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and a person with ordinary skill in the art will understand that a variety of modifications and equivalent other embodiments are possible. Therefore, the true scope of technical protection of the present invention should be determined by the technical idea of ​​the appended claims.

Claims

1. An opening is formed at the bottom, and the reaction tube is used for substrate processing. A boat on which multiple substrates are placed vertically, which is loaded and unloaded via the reaction tube through a boat lifting unit, A substrate loading section is located at the bottom of the reaction tube and has a loading area formed inside where the plurality of substrates are loaded and unloaded onto the boat via a substrate transfer robot. An outside air inlet is formed on one side of the substrate loading section, communicates with the loading area, and allows outside air to flow into the loading area, and adjusts the amount of outside air that flows in. A gas control device that adjusts the amount of inert gas injected into the loading area. A particle measuring sensor for measuring particle information in the loading area, and A control unit that adjusts one or more of the outside air inlet and the gas control device based on the particle information received from the particle measuring sensor so as to reduce the particles in the loading area. Includes, The control unit, If the particle measuring sensor detects particles larger than a previously set size exceeding a reference value, the strength of the outside air inlet is controlled to increase the amount of outside air flowing into the loading area. Substrate processing equipment.

2. The control unit, A particle quantity determination unit that compares the amount of particles measured by the particle measurement sensor with a previously set reference value, and If the particle is measured to be above a standard value, the particle size determination unit determines the size of the particle measured by the particle measurement sensor. A substrate processing apparatus according to claim 1, including the following:

3. An opening is formed at the bottom, and the reaction tube is used for substrate processing. A boat on which multiple substrates are placed vertically, which is loaded and unloaded via the reaction tube through a boat lifting unit, A substrate loading section is located at the bottom of the reaction tube and has a loading area formed inside where the plurality of substrates are loaded and unloaded onto the boat via a substrate transfer robot. An outside air inlet is formed on one side of the substrate loading section, communicates with the loading area, and allows outside air to flow into the loading area, and adjusts the amount of outside air that flows in. A gas control device that adjusts the amount of inert gas injected into the loading area. A particle measuring sensor for measuring particle information in the loading area, and A control unit that adjusts one or more of the outside air inlet and the gas control device based on the particle information received from the particle measuring sensor so as to reduce the particles in the loading area. Includes, The control unit, If the particle measuring sensor detects particles smaller than a previously set size in excess of a reference value, the gas control device is controlled to increase the amount of inert gas injected. Substrate processing equipment.

4. An opening is formed at the bottom, and the reaction tube is used for substrate processing. A boat on which multiple substrates are placed vertically, which is loaded and unloaded via the reaction tube through a boat lifting unit, A substrate loading section is located at the bottom of the reaction tube and has a loading area formed inside where the plurality of substrates are loaded and unloaded onto the boat via a substrate transfer robot. An outside air inlet is formed on one side of the substrate loading section, communicates with the loading area, and allows outside air to flow into the loading area, and adjusts the amount of outside air that flows in. A gas control device that adjusts the amount of inert gas injected into the loading area. A particle measuring sensor for measuring particle information in the loading area, and A control unit that adjusts one or more of the outside air inlet and the gas control device based on the particle information received from the particle measuring sensor so as to reduce the particles in the loading area. Includes, The control unit, If the particle measuring sensor detects particles larger than a previously set size at or above a reference value, and particles smaller than a previously set size at or above a reference value, the outside air inlet and the gas control device are driven at predetermined time intervals to alternately increase the amount of outside air flowing into the loading area and increase the amount of inert gas injected. Substrate processing equipment.

5. The aforementioned outside air inlet is, A fan filter unit formed on one side of the loading area, which adjusts the amount of outside air flowing in from the outside air inlet, A substrate processing apparatus according to claim 1, including the following:

6. A boat on which multiple substrates are placed vertically via a boat lifting unit is brought in or out through an opening formed at the bottom of a reaction tube where substrate processing takes place, and the process steps for processing the multiple substrates. A particle measurement step is performed before or after the aforementioned process step, in which particle information is measured in the loading area where the plurality of substrates are loaded and unloaded into the boat, inside the substrate loading section located at the bottom of the reaction tube, and A control step which adjusts one or more of the following so as to reduce the number of particles in the loading area based on the particle information measured in the particle measurement step: an outside air inlet which adjusts the amount of outside air flowing into the loading area, and a gas control device which adjusts the amount of inert gas injected into the inside of the loading area. Includes, The aforementioned control step is If particles larger than the size already set in the particle measurement stage are measured at or above a reference value, the fan filter unit control stage controls the strength of the outside air inlet so that the amount of outside air flowing into the loading area can be increased. including, Substrate processing method.

7. The aforementioned control step is A particle quantity determination step in which the amount of particles measured in the particle measurement step is compared with a previously set reference value, and If the particle is measured to be greater than or equal to a standard value, a particle size determination step is performed to determine the size of the particle measured in the particle measurement step. including, The substrate processing method according to claim 6.

8. A boat on which multiple substrates are placed vertically via a boat lifting unit is brought in or out through an opening formed at the bottom of a reaction tube where substrate processing takes place, and the process steps for processing the multiple substrates. A particle measurement step is performed before or after the aforementioned process step, in which particle information is measured in the loading area where the plurality of substrates are loaded and unloaded into the boat, inside the substrate loading section located at the bottom of the reaction tube, and A control step which adjusts one or more of the following so as to reduce the number of particles in the loading area based on the particle information measured in the particle measurement step: an outside air inlet which adjusts the amount of outside air flowing into the loading area, and a gas control device which adjusts the amount of inert gas injected into the inside of the loading area. Includes, The aforementioned control step is In the particle measurement stage, if particles smaller than the size already set are measured at a level exceeding a reference value, a gas supply control stage is performed to control the gas control device to increase the amount of inert gas injected. including, Substrate processing method.

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