Methods for manufacturing alloy materials and their applications
By forming a W-Cu alloy through an oxidizing and reducing treatment process, the method addresses the challenge of weak joints in W-Cu bonding, achieving strong and reliable connections for high-temperature applications.
JP7880932B2Active Publication Date: 2026-06-26NORITAKE MACHINE TECHNO CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NORITAKE MACHINE TECHNO CO LTD
- Filing Date
- 2024-10-22
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
Conventional joining methods for tungsten (W) members with other metal members, such as copper (Cu), fail to achieve strong and reliable joints due to the lack of interdiffusion between these metals, limiting their application in high-temperature environments.
Method used
A manufacturing method involving the formation of an oxidizing contact between a W source and a Cu source, followed by a reducing atmosphere treatment, results in the creation of a W-Cu alloy at their interface, enabling strong and reliable bonding.
Benefits of technology
The method produces a W-Cu alloy with sufficient thickness for robust joint formation, enhancing the bonding strength and reliability between W and Cu members, suitable for ultra-high temperature components.
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Abstract
To provide a novel technique that can provide a robust and reliable junction between a tungsten component and other metallic components.SOLUTION: A manufacturing method disclosed herein prepares an oxidation contact body where a W source containing the tungsten (W) element contacts a Cu source containing the copper (Cu) element, and W and Cu are oxidized at the boundary between the W source and the Cu source, then conducts calcination processing for the oxidation contact body under a reduction atmosphere. By this, a W- Cu alloy that is an alloy material where the W element and the Cu element are mutually diffused can be produced. Using the W- Cu alloy enables robust joining of the tungsten component with other metallic components.SELECTED DRAWING: None
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