Methods for manufacturing alloy materials and their applications

By forming a W-Cu alloy through an oxidizing and reducing treatment process, the method addresses the challenge of weak joints in W-Cu bonding, achieving strong and reliable connections for high-temperature applications.

JP7880932B2Active Publication Date: 2026-06-26NORITAKE MACHINE TECHNO CO LTD
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
JP2024185728
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-10-22
Publication Date
2026-06-26
Estimated Expiration
2040-10-29

AI Technical Summary

Technical Problem

Conventional joining methods for tungsten (W) members with other metal members, such as copper (Cu), fail to achieve strong and reliable joints due to the lack of interdiffusion between these metals, limiting their application in high-temperature environments.

Method used

A manufacturing method involving the formation of an oxidizing contact between a W source and a Cu source, followed by a reducing atmosphere treatment, results in the creation of a W-Cu alloy at their interface, enabling strong and reliable bonding.

Benefits of technology

The method produces a W-Cu alloy with sufficient thickness for robust joint formation, enhancing the bonding strength and reliability between W and Cu members, suitable for ultra-high temperature components.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007880932000002
    Figure 0007880932000002
  • Figure 0007880932000003
    Figure 0007880932000003
  • Figure 0007880932000004
    Figure 0007880932000004
Patent Text Reader

Abstract

To provide a novel technique that can provide a robust and reliable junction between a tungsten component and other metallic components.SOLUTION: A manufacturing method disclosed herein prepares an oxidation contact body where a W source containing the tungsten (W) element contacts a Cu source containing the copper (Cu) element, and W and Cu are oxidized at the boundary between the W source and the Cu source, then conducts calcination processing for the oxidation contact body under a reduction atmosphere. By this, a W- Cu alloy that is an alloy material where the W element and the Cu element are mutually diffused can be produced. Using the W- Cu alloy enables robust joining of the tungsten component with other metallic components.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Production of copper-tungsten alloy

    JP1995216477A

  • Production of improved copper and tungsten composite material

    JP1998046207A

  • Production of cu-w alloy substrate for heat radiation plate of semiconductor element

    JP1998060553A

  • Production of ultrafine w / Cu metal composite powder and high density bulk material by mechanochemical method

    JP1998245603A

  • Tungsten - copper composite powder coated with tungsten and production method therefor

    JP2003328002A