A method for mounting power semiconductor elements onto a printed circuit board using an alignment device.

Abstract

This is a method for mounting a power semiconductor element on a printed circuit board using an alignment device. The method for mounting a power semiconductor element (10) on a printed circuit board (20) includes the steps of providing the power semiconductor element (10) and an alignment device (30), mounting the alignment device (30) onto the power semiconductor element (10), and simultaneously moving the power semiconductor element (10) in a third direction (300) to insert at least one terminal (11) of the power semiconductor element (10) into at least one first alignment structure (34) of the alignment device (30), wherein the at least one terminal (11) has a first portion (111) oriented in a fourth direction (400) and a second portion oriented in a third direction (300). The above method further includes the steps of providing a printed circuit board (20), inserting at least partially a first portion (111) of at least one terminal (11) into at least one contact hole (21) of the printed circuit board (20), and aligning an alignment device (30) with the printed circuit board (20), and fixing the first portion (111) of at least one terminal (11) of a power semiconductor element (10) to the printed circuit board (20).

Description

Technical Field

[0001] The present disclosure relates to a power semiconductor device, an alignment device, and a method of mounting a power semiconductor device on a printed circuit board using the alignment device.

Background Art

[0002] When implementing a power semiconductor module in an application, the power semiconductor module must be interconnected with control electronics such as a gate driver or other integrated circuit for control. These control devices are generally disposed on an assembly substrate such as a control substrate realized by, for example, a printed circuit board. Such an assembly substrate can be disposed on top of the power semiconductor module. The electrical connection between the power semiconductor module and the assembly substrate is generally provided by terminals such as auxiliary terminals / control terminals or power terminals of the power module. In order to facilitate the process of mechanically and electrically interconnecting the power module to the assembly substrate, it is necessary to accurately position the power module relative to the position of the assembly substrate.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The object is to mount a power semiconductor device on a printed circuit board (PCB) in a simple manner while still enabling proper alignment of the power semiconductor device with respect to the printed circuit board (PCB).

Means for Solving the Problems

[0004] This object is solved by the features of the independent claims. Advantageous embodiments are indicated in the dependent claims.

[0005] For example, embodiments of the present disclosure claimed in an independent claim address, in whole or in part, the aforementioned shortcomings of the prior art. Further embodiments of power semiconductor elements, alignment devices, and methods for interconnecting power semiconductor elements to an assembly substrate, such as a printed circuit board (PCB), are the subject of further claims.

[0006] A method is provided for mounting a power semiconductor element on a printed circuit board (PCB), the method comprising the steps of providing the power semiconductor element and a alignment device. The method further comprises the steps of mounting the alignment device on the power semiconductor element and, simultaneously with the steps of moving the power semiconductor element in a third direction to insert at least one terminal of the power semiconductor element into at least one first alignment structure of the alignment device, wherein the at least one terminal has a first portion oriented in a fourth direction and a second portion oriented in a third direction. Furthermore, the printed circuit board (PCB) is provided, and the printed circuit board (PCB) is aligned with the alignment device at the same time as the steps of at least partially inserting the first portion of the at least one terminal into at least one contact hole of the printed circuit board (PCB). After at least partially inserting the first portion of the at least one terminal, the first portion of the at least one terminal of the power semiconductor element is fixed to the printed circuit board (PCB).

[0007] Mounting a alignment device onto a power semiconductor element ensures that at least one terminal of the power semiconductor element is properly aligned with and adequately supported by a printed circuit board (PCB). Furthermore, the alignment device can provide proper alignment between the power semiconductor element and another component such as a heat sink or cooling device. Alternatively, mounting a alignment device onto a power semiconductor element includes inserting at least one terminal into at least one first alignment structure. Alternatively, the step of inserting at least one terminal into at least one first alignment structure is performed before the mounting step to facilitate the mounting of the alignment device onto the power semiconductor element. The step of mounting the alignment device onto the power semiconductor element also includes mounting the semiconductor element onto the alignment device.

[0008] By aligning the alignment device with the printed circuit board (PCB), a first portion of at least one terminal of the power semiconductor element is also aligned with the corresponding contact hole on the printed circuit board (PCB).

[0009] This feature facilitates the proper alignment of terminals of power semiconductor elements, such as press-fit terminals, solder terminals, or pin terminals, with respect to contact holes on a printed circuit board (PCB), such as a control board. Therefore, it is possible to avoid situations where some terminals of a power semiconductor element, such as auxiliary terminals, power terminals, or control terminals, are bent or misaligned, preventing them from fitting into the contact holes of the PCB. The terminals are fixed to the PCB, for example, by soldering or by press-fit contact at the ends of the terminals. The terminals may feature a crossbar for further support during insertion into the PCB. In addition, the alignment device provides mechanical support to the terminals when inserting them into the contact holes, due to the crossbar or any corresponding structure.

[0010] Alternatively, or in addition to the above, the PCB and power semiconductor elements are mounted together with further mounting structures to improve the mechanical stability and connection between the power semiconductor elements and the printed circuit board.

[0011] At least one terminal is inserted into the slot of the alignment device so that the first portion of at least one terminal is oriented in the same direction as the slot, restricting the movement of at least one terminal in the first and / or second directions. Even if the terminal is tilted or in an unnatural position, the slot receives at least one terminal and orients the first and second portions of the terminal at predetermined angles, properly aligning it to the printed circuit board (PCB) for further mounting. Thus, before the power semiconductor element is mounted on the printed circuit board (PCB), the first and second portions of the terminal are at predetermined angles. Movement of the terminal in the first and / or second directions can be restricted. For proper alignment of the terminal with respect to the printed circuit board (PCB), restricting movement in the first or second direction may already be sufficient. Mounting the alignment device to the power semiconductor element is done in a simple manner. The power semiconductor element is simply moved toward the alignment device in a third direction. Alternatively, or in addition to this, the alignment device is moved toward the semiconductor power element in the opposite direction to the third direction. Inserting at least one terminal into the alignment device restricts the movement of at least one terminal in a third direction by the rear wall of the first alignment structure, such as a slot. Even if the terminal is not properly positioned with respect to the third direction, the rear wall will provide support and, if necessary, bend the terminal to a predetermined position and / or angle for further mounting.

[0012] After mounting the alignment device and the power semiconductor element, at least one terminal is well supported by the alignment device. Insertion of the first portion of at least one terminal involves moving the power semiconductor element in a fourth direction. The power semiconductor element alone can be moved toward the printed circuit board (PCB) in the fourth direction without further alignment of the power semiconductor element. Alternatively or in addition, the power semiconductor element is moved toward the printed circuit board in the fourth direction together with the alignment device. Alternatively or in addition, the printed circuit board is moved toward the power semiconductor element and / or the alignment device in a fifth direction. The alignment device already provides simple alignment of at least one terminal toward the printed circuit board (PCB), in particular the corresponding contact hole. This is a simple step for mounting or attaching the power semiconductor element to the printed circuit board (PCB). There is no need to be overly careful to prevent bending of at least one terminal of the power semiconductor element.

[0013] While the first portion of at least one terminal is inserted, movement of at least one terminal in a fifth direction opposite to the fourth direction is restricted. Any bottom surface of the slot can provide support for the terminal while it is being inserted into the corresponding contact hole of the printed circuit board (PCB). This bottom surface restricts movement of the terminal in the fifth direction, thus preventing undesirable bending of the terminal in the fifth direction in particular. Alternatively or in addition to the above, when terminals with a crossbar, such as press-fit terminals, are used to connect power semiconductor elements to a printed circuit board (PCB), support may be provided by the top surface of the side wall. In the case of terminals with a crossbar, support for the terminal may be provided by the top surface of the side wall alone, without the need for a bottom surface. In addition, if a crossbar is available, a recess in the top surface can further improve support for the terminal in the fifth direction and / or the third direction. The recess in the top surface can also provide further alignment in the third direction, in particular when the first portion of the terminal is bent toward the power semiconductor element.

[0014] The alignment device is mounted on the power semiconductor element by fixing at least one second mounting structure of the alignment device to at least one corresponding first mounting structure of the power semiconductor element. These mounting structures simplify the mounting step and secure the elements to each other. These mounting structures are an integrated part of the alignment device and the power semiconductor element, providing positioning and fixing of the alignment device on the corresponding structure on the power semiconductor element. Alternatively or in addition thereto, the mounting structures of the alignment device and the power semiconductor element may be different parts that are permanently or temporarily available on the alignment device and / or on the power semiconductor element.

[0015] Mounting of the alignment device on the printed circuit board is optional. In this case, the alignment device is mounted on the printed circuit board (PCB) by, for example, fixing at least one third mounting structure of the alignment device to at least one fourth mounting structure of the printed circuit board (PCB). Fixing is achieved not only by the terminals and contact holes of the power semiconductor element, but also by separate and / or integrated mounting structures, improving mounting. This avoids terminal detachment. The term "fixing" refers, for example, to mechanical fixing and / or electrical contact between the terminal and the printed circuit board.

[0016] Depending on the terminal fixing and mounting structure used, mounting the alignment device to the printed circuit board may occur simultaneously with the insertion of at least a portion of the first part of at least one terminal. For example, if at least one terminal is fixed to the printed circuit board by soldering, mounting can be performed before fixing the terminal to the PCB and securing the power semiconductor element and the printed circuit board, thus avoiding detachment of at least one terminal. "Before fixing the terminal to the PCB" means, for example, mounting the alignment device at the same time as inserting at least one terminal.

[0017] Alternatively, mounting the alignment device to the printed circuit board is performed after at least partially inserting the first portion of at least one terminal. For example, by using press-fit terminals, insertion is performed first, followed by mounting, and then the terminal is secured to the PCB. In this case, the mounting structure is, for example, a screw and screw hole. Alternatively, mounting is performed after securing at least one terminal to the PCB and securing the entire setup.

[0018] In addition, the alignment device may also be mounted on another component, such as a heat sink or cooler, by fixing at least one fifth mounting structure of the alignment device to at least one sixth mounting structure of another component. For example, if another component, such as a cooler, and a printed circuit board (PCB) are commonly joined by common long screws or bolts, the third and fifth mounting structures may be identical parts. The other component may be a cooler or heat sink mounted below the semiconductor element if the printed circuit board (PCB) is mounted above the power semiconductor element. Generally, the other component, such as a cooler, is typically mounted on the side of the power semiconductor element opposite to the side of the power semiconductor element to which the printed circuit board is mounted. The alignment device may be fixed only to the power semiconductor element, but may also be fixed to the corresponding mounting structure of another component, such as a cooler or heat sink, which would provide improved mechanical support. Mounting structures and their counterparts are, for example, clamps and shoulders, and / or screws and threads, and / or adhesives and other adhesives. Combinations of the listed mounting structures are also possible. Different mounting structures are not limited to a specific type of mounting structure. For example, combinations of clamps and shoulders with screws and threads are possible.

[0019] Power semiconductor elements are also provided. The power semiconductor element comprises a side surface and at least one terminal located on the side surface of the power semiconductor element. The at least one terminal comprises a first portion oriented in a fourth direction and a second portion oriented in a third direction. The third direction is at a predetermined first angle with respect to the fourth direction. The terminal may be a press-fit terminal. For example, a press-fit terminal has a press-fit connector on its end portion. In addition to or instead of that, the press-fit terminal may have a crossbar for providing mechanical support when inserting the press-fit terminal into a contact hole. Alternatively, the terminal may be a pin terminal. A pin terminal can be soldered to a printed circuit board. A pin terminal may also have a crossbar. Thus, mechanical support is provided by the alignment device if there is mechanical support such as a recess on the side wall of the slot for the crossbar. The power semiconductor element further comprises at least one first mounting structure adapted to mount the power semiconductor element to at least one corresponding second mounting structure of the alignment device. Mounting structures and their correspondings include, for example, clamps and shoulders, and / or screws and threads, and / or adhesives and other adhesives. Combinations of the listed mounting structures are also possible. Different mounting structures are not limited to specific types of mounting structures. For example, combinations of clamps and shoulders with screws and threads are possible. Power semiconductor elements can be permanently connected, for example, by adhesive bonding, permanent clamping, or permanent screw fastening. On the other hand, fastening by clamping or screw fastening can facilitate the temporary placement of power semiconductor elements.

[0020] Power semiconductor elements may be any elements that require proper alignment of terminals with respect to a printed circuit board. Power semiconductor elements include, but are not limited to, electronic chips; semiconductor chips; embedded semiconductor chips; substrates on which one or more chips are arranged; diodes; components containing silicon and / or silicon carbide and / or gallium nitride; circuit elements; discrete elements such as resistors, capacitors, inductive components and / or transistors; or switching elements such as IGBTs, HEMTs, MOSFETs, etc.

[0021] Furthermore, the power semiconductor element may be, for example, a molded large power package having auxiliary terminals, power terminals and / or control terminals on at least one side. Nevertheless, the alignment device can also be applied to other types of power semiconductor elements, and / or the arrangement of auxiliary terminals, power terminals and / or control terminals. These terminals can be implemented as pin terminals, or as press-fit terminals. These terminals comprise a second part according to the power semiconductor element and a first part for external interconnection. These terminals are made of, for example, copper or a corresponding copper alloy. Other conductive materials are possible.

[0022] A positioning device is also provided. The positioning device comprises a second side surface extending in a first direction and a second direction, a third side surface extending in the first direction and the second direction, and at least one second mounting structure adapted to attach the positioning device to the corresponding at least one first mounting structure of the power semiconductor element.

[0023] The alignment device further comprises at least one first alignment structure adapted to receive the terminals of the power semiconductor element, and includes at least one side wall protruding from the second side in the direction opposite to the third direction and extending in a fourth direction. The third direction is at a predetermined first angle with respect to the fourth direction, the fourth direction is at a predetermined second angle with respect to the first direction, and the third direction is at a predetermined third angle with respect to the first direction. The alignment structure further comprises a rear wall provided by at least a portion of the second side, the rear wall enclosing a space by at least two of the side walls and forming at least one slot oriented in the fourth direction and the third direction.

[0024] The alignment device further comprises a bottom surface extending in the first and second directions, protruding from the second side surface and / or from the third side surface in the third direction. In this case, at least one side wall extends in the third direction and protrudes from the bottom surface in the fourth direction.

[0025] Alignment in the first direction and / or the second direction is provided by at least one side wall of at least one slot, whereas for alignment in the fifth direction and mechanical support when inserting at least one terminal, e.g., a press-fit terminal without a crossbar, into a corresponding contact hole, the bottom surface of the slot is optionally used. Alternatively, at least one terminal comprises a crossbar such that the upper surface of at least one side wall supports at least one terminal in the fifth direction. Instead or in addition, depressions on the upper surface of the side wall for the crossbar are available. These depressions can also support alignment in the fifth direction and / or the third direction. This results in an improvement in alignment in the third direction, especially when the terminal is bent towards the power semiconductor element. Support in the third direction is also provided by the rear wall of the alignment device. By restricting movement of the terminal in different directions, unwanted bending of the terminal is prevented and the reaction force required to insert the terminal into the contact hole is provided, especially when inserting a press-fit terminal into a contact hole.

[0026] The alignment device can be easily mounted in the peripheral region of the power semiconductor element where at least one terminal is located. On the one hand, the alignment device can be fixedly connected, e.g., by gluing, permanent clamping or permanent screwing. On the other hand, fixation by clamping or screwing can facilitate a temporary arrangement of the alignment device. Here, for example, the clamp used for mounting and fixing the alignment device fits the corresponding mounting structure of the power semiconductor element.

[0027] The mounting structure is an integral part of the alignment device that provides positioning and fixing of the corresponding structural alignment device on the power semiconductor element. Alternatively, the mounting structure of the alignment device and / or the power semiconductor element may be different parts that are fixedly or temporarily available on the alignment device and / or the power semiconductor element.

[0028] The alignment device can also function with power terminals having a different design from pin terminals or press-fit terminals, such as a sheet. In addition to or instead of this, the alignment device may have an opening or other alignment structure for the insertion of a power terminal that can also be used as an alignment structure and / or mounting structure. This further improves the mounting and alignment between the alignment device and the power semiconductor device. The use of the alignment structure on the power terminal can support the alignment and mounting between the alignment device and the power semiconductor device.

[0029] The alignment device may be made of any electrically insulating material filled with particles or fibers of an inorganic material, particularly a thermoplastic resin material or a thermosetting resin material. The alignment device can be manufactured by transfer molding, injection molding, or other applicable molding processes.

[0030] The alignment device may be attached to only one power semiconductor device. Alternatively, the alignment device may be realized as a common element for a plurality of power semiconductor devices. For example, several equivalent power modules are arranged in a row on a cooler or heat sink to form a six-pack power module. Here, the alignment device can be fixed only to the power module, but may also be fixed to the corresponding mounting structure of the cooler or heat sink, which will result in an improvement in mechanical support. In this case, several power semiconductor devices may have a common printed circuit board that is aligned with the alignment device that is mounted and commonly used.

[0031] In addition to the described alignment structures for terminals, such as press-fit terminals, the alignment device may incorporate further features for precise alignment between pin terminals or press-fit terminals and a printed circuit board (PCB), where control terminals are inserted into holes. On the other hand, there may be pins inserted into corresponding holes or recesses of the printed circuit board (PCB) for precise alignment between control terminals and the printed circuit board (PCB) in the lateral direction, i.e., a first direction, a second direction and / or a third direction or a combination of these directions. These pins may have, for example, a simple circular shape, a square shape, or a polygonal shape, or a more complex shape having a cross-shaped contour, which can also provide alignment in a fourth direction and / or a fifth direction. On the other hand, there may be a bed stop on which the printed circuit board (PCB) is positioned to provide precise vertical positioning of the printed circuit board (PCB) in the fourth direction. In addition, the alignment device may have mounting holes for fixing the alignment device to the printed circuit board (PCB) and / or fixing the alignment device to another component such as a heat sink or cooler.

[0032] This disclosure includes several aspects of a method for mounting power semiconductor elements onto a printed circuit board (PCB), power semiconductor elements, and alignment devices used for mounting power semiconductor elements. All features described in relation to one of these aspects are also disclosed herein in relation to other aspects, even if each feature is not explicitly mentioned in the context of a particular aspect. For example, the methods described herein are directed toward a method for mounting power semiconductor elements using the alignment devices described herein. Thus, features and advantages described in relation to power semiconductor elements or alignment devices can be applied to methods, and vice versa.

[0033] This disclosure is applicable to a variety of modifications and alternative forms, the details of which are shown in the drawings as an example and described in detail. However, it should be understood that this disclosure is not intended to limit itself to any specific embodiments and examples described. Rather, it is intended to encompass all modifications, equivalents, and alternatives that fall within the scope of this disclosure as defined by the appended claims.

[0034] The attached drawings are included to provide further understanding. In the drawings, elements of the same structure and / or function may be referred to by the same reference numerals. Please understand that the embodiments shown in the drawings are illustrative and not necessarily drawn to scale. [Brief explanation of the drawing]

[0035] [Figure 1] This is a perspective view of a power semiconductor element and a positioning device according to one embodiment. [Figure 2] This is a top view of a power semiconductor element and an alignment device according to one embodiment. [Figure 3] This is a side view of a power semiconductor element and a positioning device according to one embodiment. [Figure 4] These are different side views of a power semiconductor element and a alignment device according to one embodiment. [Figure 5] This figure shows the steps of an example of a method for mounting a power semiconductor device. [Modes for carrying out the invention]

[0036] Figure 1 is a perspective view of a positioning device 30 mounted on a power semiconductor element 10. The power semiconductor element 10 comprises a package body having a first side surface 12 extending in a first direction 100 and a second opposite direction 200. At least one terminal 11 is located on the first side surface 12. The terminal 11 may be either a pin terminal or a press-fit terminal. The terminal may include a crossbar and / or a press-fit contact. The positioning device 30 comprises a second side surface 31 and a third side surface 32. In the mounting position, the third side surface 32 of the positioning device 30 abuts against the first side surface 12 of the power semiconductor element 10. In Figure 1, at least one terminal 11 is a press-fit terminal. At least one terminal 11 comprises a first portion 111 and a second portion 112. In the case of a press-fit terminal, the first portion 111 is characterized by a crossbar 113 and an end portion 114. The crossbar 113 is optional and provides mechanical support to the alignment device 30 when inserting the terminal 11, which is realized as a press-fit portion, into the contact hole 21 (not shown in Figure 1) of the printed circuit board 20. Alternatively, at least one terminal 11 is a pin terminal without the crossbar 113. The first portion 111 extends along a fourth direction 400. The second portion extends along a third direction 300. The third direction 300 is at a predetermined first angle 150 with respect to the fourth direction 400. The first angle 150 may be a right angle, but is not limited to a right angle. The first angle 150 may be acute or obtuse. The crossbar 113 extends along a first direction 100 and a second direction 200. The terminal 11 has a press-fit connector at the end portion 114.

[0037] The alignment device 30 further comprises at least one first alignment structure 34 adapted to receive the terminals 11 of the power semiconductor element 10. In Figure 1, the alignment structure 34 comprises a base surface 35 extending in a first direction 100 and a second direction 200. The base surface 35 is arbitrary. At least one side wall 36 protrudes from the base surface 35 in a fourth direction 400. The fourth direction 400 is at a predetermined second angle 250 with respect to the first direction 100. At least one side wall 36 extends in a third direction 300. The third direction 300 is at a predetermined third angle 350 with respect to the first direction 100. Each of the second angle 250 and the third angle 350 may be, but is not limited to, a right angle. Each of the second angle 250 and the third angle 350 may be acute and / or obtuse. The alignment structure 34 further comprises a rear wall 38 provided by at least a portion of the second side surface 32. In Figure 1, at least two of the bottom surface 35, the rear wall 38, and the side walls 36 enclose the space and form at least one slot 39. Alternatively, if the bottom surface 35 is absent, only the two side walls 36 and the rear wall 38 enclose the space and form at least one slot 39. In this case, at least one of the 36 side walls protrudes from the second side surface 31 in the direction opposite to the third direction 300 and extends in the fourth direction 400. The slot 39 is oriented in the fourth direction 400 and the third direction 300 to receive the terminal 11. The rear wall 38 restricts the movement of at least one terminal in the third direction 300. The side walls 36 of the slot 39 restrict the movement of the terminal 11 in the first direction 100 and / or the second direction 200. Each side wall 36 has a top surface 37. The upper surface 37 may have one or more recesses 371. When press-fit terminals are used, the crossbar 113 can be located on the upper surface 37 of the side wall 36 or within the recesses 371. The recesses 371 support the insertion of the terminals 11 into the printed circuit board 20 (not shown in Figure 1) when moving the printed circuit board 20 toward the power semiconductor element 10 in a fifth direction 500 opposite to the fourth direction 400. Alternatively or in addition, the power semiconductor element 10 is moved toward the printed circuit board 20 in the fourth direction 400 together with the alignment device 30.When the movement of the printed circuit board 20 applies a force to the terminal 11 in the fifth direction 500, the upper surface 37 of the side wall 36, and optionally the bottom surface 35, also restrict the movement of the terminal 11 in the fifth direction 500.

[0038] The alignment device 30 further comprises at least one second mounting structure 33 adapted to attach the alignment device 30 to at least one corresponding first mounting structure 13 of the power semiconductor element 10. In this embodiment, the second mounting structure 33 is a clamp fixed to the corresponding first mounting structure 13, which is a shoulder. Alternatively, the second mounting structure 33 and the first mounting structure 13 are fastened in reverse, in which case the second mounting structure 33 is the shoulder and the first mounting structure 13 is the clamp. Alternative mounting structures and their counterparts are screws and threads, as well as / or adhesives and other adhesives.

[0039] The alignment device 30 further comprises at least one third mounting structure 331 and at least one fifth mounting structure 332. The third mounting structure 331 can be mounted on at least one corresponding fourth mounting structure 22 on a printed circuit board 20 (not shown in Figure 1). The fifth mounting structure 332 can be mounted on a corresponding sixth mounting structure 41 (not shown in Figure 1) on another component such as a heat sink or cooling device.

[0040] The listed mounting structures and their corresponding counterparts are as interchangeable as the first mounting structure 13 and the second mounting structure 33. Possible mounting structures and their counterparts are screws and threads, as well as / or adhesives and other adhesives.

[0041] For the alignment of the alignment device 30 with respect to the printed circuit board 20 (not shown in Figure 1), at least one second alignment structure 341 and / or at least one third alignment structure 342 of the alignment device 30 are used together with at least one fourth alignment structure 23 (not shown in Figure 1) of the printed circuit board. These alignment structures may be pins, bed stops, or different protrusions and their corresponding holes, gaps, indentations, or different recesses. These alignment structures may be any type of key lock mechanism.

[0042] Figure 2 is a top view of the alignment device 30 mounted on the power semiconductor element 10. The alignment device 30 is mounted on the first mounting structure 13 of the power semiconductor element 10 via two second mounting structures 33. In this embodiment, two clamps are used as the second mounting structures 33. The corresponding first mounting structures 13 are two shoulders.

[0043] Two of the side walls 36 restrict the movement of at least one terminal 11 of the power semiconductor element 10 in the first direction 100 and the second direction 200. Thus, a stable arrangement of the terminal 11 in the first alignment structure 34, which is designed as a slot 39, is provided. Furthermore, the rear wall 38 restricts the movement of the terminal 11 in the third direction 300 and supports the terminal 11 during the mounting process. In addition, the upper surface 37 of the side wall 36 used for mounting the crossbar 113 is used for support in the fourth direction 400.

[0044] Figure 3 is a side view of the alignment device 30 mounted on the power semiconductor element 10 and the printed circuit board 20 which is not yet mounted. At least one second mounting structure 33 of the alignment device 30 is attached to at least one first mounting structure 13 of the power semiconductor element 10. When the power semiconductor element 10 is moved in a fourth direction 400, or when the printed circuit board 20 is moved toward the power semiconductor element 10 in a fifth direction 500, at least one terminal 11 is inserted into the corresponding at least one contact hole 21 of the printed circuit board 20. During insertion, the terminal 11 is supported by at least one side wall 36. Furthermore, the alignment structure 34 provides mechanical support in the fifth direction 500 when inserting the terminal 11 into the contact hole 21 while the power semiconductor element 10 is moved in the fourth direction 400. In the case of a press-fit terminal, the terminal 11 is also supported in the fifth direction 500 by the upper surface 37 of at least one side wall 36.

[0045] The alignment device 30 further includes at least one third mounting structure 331 for mounting to at least one corresponding fourth mounting structure 22 of the printed circuit board 20. The alignment device 30 further includes at least one fifth mounting structure 332 for mounting to at least one corresponding sixth mounting structure 41 of another component, such as a cooling device. In Figure 3, the third mounting structure 331 and the fifth mounting structure 332 may form a common mounting structure, such as screw holes for common fixing screws.

[0046] Figure 4 is a schematic side view of a different alignment device 30 mounted on a power semiconductor element 10. The third side surface 32 of the alignment device 30 abuts against the first side surface 12 of the power semiconductor element 10. The terminal 11 is located on the first side surface 12. The first portion 111 of the terminal 11 is oriented in a fourth direction 400, and the second portion 112 of the terminal 11 is oriented in a third direction 300 and protrudes from the second side surface 12. The third direction 300 is at a predetermined first angle 150 with respect to the fourth direction 400. The first angle 150 may be a right angle, but is not limited to a right angle. The first angle 150 may be acute or obtuse. The first portion 111 of the terminal 11 is supported in the third direction 300 by a portion of the second side surface 31 that forms a rear wall 38. The first portion 111 is not necessarily in contact with the rear wall 38. A gap may still exist between the first portion 111 and the rear wall 38. The rear wall 38 restricts the movement of the terminal 11 and still provides sufficient support to the terminal 11 during the mounting procedure, preventing even undesirable bending or breakage of the terminal 11. The second portion 112 of the terminal 11 is supported in the fifth direction 500 by the bottom surface 35. The second portion 112 is not necessarily in contact with the bottom surface 35. A gap may still exist between the second portion 112 and the bottom surface 35. The bottom surface 35 restricts the movement of the terminal 11 and still provides sufficient support to the terminal 11 during the mounting procedure, preventing even undesirable bending or breakage of the terminal 11. Alternatively or in addition, for example, the crossbar 113 of the press-fit terminal is located on the upper surface 37 of the side wall 36 for further support. In this case, the alignment device 30 does not have a bottom surface 35. To further improve mechanical support in the fifth direction 500 and / or the third direction 300, and alignment in the third direction 300, the crossbar 113 is located in a recess 371 of the upper surface 37. The second alignment structure 341 and / or the third alignment structure 342 provide alignment of the alignment device 30 with respect to the printed circuit board 20 (not shown in Figure 4). The end portion 114 is used to secure the terminal 11 to the printed circuit board 20 (not shown in Figure 4).The end portion is, for example, the press-fit contact of a press-fit terminal.

[0047] Figure 5 shows the steps of a method for mounting a power semiconductor element 10 onto a printed circuit board 20. In the first step S1, the power semiconductor element 10 is provided. In the second step S2, a aligning device 30 is provided. In the third step S3, the power semiconductor element 10 is moved toward the aligning device 30 in a third direction 300 so that at least one terminal 11 of the power semiconductor element 10 is inserted into at least one first aligning structure 34 of the aligning device 30. Alternatively or in addition, the aligning device 30 is moved toward the semiconductor power element 10 in the opposite direction to the third direction 300. The aligning structure 34 is, for example, a slot 39 that receives the terminal 11. Both the slot 39 and the first portion 111 of the terminal 11 are oriented in the same direction, for example, a fourth direction 400 and / or a third direction 300. The slot 39 provides at least one side wall 36 that restricts the movement of the terminal 11 toward the first direction 100 and / or a second direction 200. Furthermore, the movement of the terminal 11 in the third direction 300 is restricted by the rear wall 38. If the terminal 11 includes a crossbar 113 located on the upper surface 37, the upper surface 37 of the side wall 36 restricts the movement of the press-fit terminal in the fifth direction 500. In addition, the movement of the terminal 11 in the fifth direction 500 may be restricted by, for example, the bottom surface 35. The terminal 11 is, for example, a press-fit terminal or a pin terminal. In the fourth step S4, the alignment device 30 is mounted on the power semiconductor element 10 by fixing at least one second mounting structure 33 of the alignment device 30 to the corresponding at least one first mounting structure 13 of the power semiconductor element 10, for example by fitting a clamp to a shoulder or by adhesive bonding. Depending on the mounting method, the third step S3 and the fourth step S4 may be performed simultaneously. Mounting structures and their correspondings are, for example, clamps and shoulders, and / or screws and threads. Adhesives and / or other adhesives are used to join the mounting structures and their counterparts. Combinations of the listed mounting structures are also possible. They can be used in pairs or in different quantities to provide a stable mounting of the alignment device 30 to the semiconductor element 10.For example, the first mounting structure is a shoulder, and the second mounting structure comprises two clamps. In the fifth step S5, the printed circuit board 20 is provided. In the sixth step S6, the alignment device 30 is aligned with the printed circuit board 20. For alignment, at least one second alignment structure 341 and / or at least one third alignment structure 342 of the alignment device 30 is used together with at least one fourth alignment structure 23 or other corresponding alignment structures. The alignment structure 34 may be a pin, a bed stop, or different protrusions and corresponding holes, gaps, or different recesses. The alignment structure 34 may be any type of key lock mechanism. In the seventh step S7, the first portion 111 of at least one terminal 11 is inserted into at least one contact hole 21 of the printed circuit board 20. For this purpose, the power semiconductor element 10 is moved toward the printed circuit board 20 in a fourth direction 400. Alternatively, or in addition to that, the printed circuit board 20 is moved toward the semiconductor power element 10 in a fifth direction 500. By inserting at least one terminal 11 into at least one contact hole 21, a force is acted in the fifth direction 500, opposite to the direction of movement, which is the fourth direction 400. This force acts on the first portion 111 and the second portion 112 of the terminal 11, and as a result acts on the slot 39, its side wall 36, the upper surface 37, and / or the bottom surface 34, supporting the terminal 11 and preventing undesirable bending of the first portion 111 and the second portion 112 when the first portion 111 is inserted into the contact hole 21 of the printed circuit board 20. The sixth step S6 and the seventh step S7 may be performed simultaneously. In the eighth step S8, the first portion 111 of at least one terminal 11 is fixed to the printed circuit board 20. Fixation is performed, for example, by soldering or by press-fit contact. After fixing at least one terminal 11 to the printed circuit board 20, the alignment device 30 can remain attached to the power semiconductor element 10.In any ninth step S9, the alignment device 30 is mounted on the printed circuit board 20. In this case, at least one third mounting structure 331 of the alignment device 30 is fixed to at least one fourth mounting structure 22 of the printed circuit board 20. Depending on the mounting structure used, the ninth step may be performed after the eighth step S8, in which at least one terminal 11 is fixed to the printed circuit board 20 to secure the entire structure. For example, this may occur when screws and screw holes are used as the mounting structure. Alternatively, the ninth step S9 is performed concurrently with the seventh step S7, in which a first portion 111 of at least one terminal 11 is inserted into at least one contact hole 21 of the printed circuit board 20. This is the case, for example, when press-fit terminals are used as terminals 11 and shoulders and clamps are used as the mounting structure. Alternatively, the step S9 of mounting the alignment device 30 on the printed circuit board 20 is performed before step S8 and after step S7. In this case, the first portion 111 of at least one terminal 11 is fixed to the printed circuit board 20 by soldering. To avoid possible delamination, the alignment device 30 and the printed circuit board 20 are mounted together. In any 10th step S10, at least one 5th mounting structure 332 of the alignment device 30 is fixed to at least one 6th mounting structure 41 of another component, such as a cooler or heat sink. The 10th step S10 may be performed before step S5 or between steps S5 and S9.

[0048] If, after the power semiconductor element 10 is mounted on the printed circuit board 20, the alignment device 30 is not permanently fixed to the cooling device, and / or the alignment device 30 is not permanently connected to the printed circuit board 20 and / or the power semiconductor element 10 or another component, the alignment device 30 can be removed.

[0049] The embodiments shown in the above figures represent exemplary embodiments of power semiconductor elements and alignment devices for mounting power semiconductor elements, and therefore do not constitute a complete list of all embodiments relating to improved arrangements for power semiconductor elements or alignment devices. Actual arrangements of power semiconductor elements or alignment devices may differ from the exemplary embodiments described above. [Explanation of symbols]

[0050] 10 Power semiconductor element; 11 Terminal; 111 First part; 112 Second part; 113 Crossbar; 114 Head part; 12 First side; 13 First mounting structure; 20 Printed circuit board; 21 Contact hole; 22 Fourth mounting structure; 23 Fourth alignment structure; 30 Alignment device; 31 Second side; 32 Third side; 33 Second mounting structure; 331 Third mounting structure; 332 Fifth mounting structure; 34 First alignment structure; 341 Second alignment structure; 342 Third alignment structure; 35 Bottom surface; 36 Side wall; 37 Top surface; 371 Recess; 38 Rear wall; 39 Slot; 41 Sixth mounting structure; 100 First direction; 150 Predetermined first angle; 200 Second direction; 250 Predetermined second angle; 300 Third direction; 350 A predetermined third angle; 400 Fourth direction; 500 Fifth direction.

Claims

1. An arrangement configuration comprising an alignment device (30) and a power semiconductor element (10), The semiconductor element (10) comprises a first side surface (12) and at least one terminal located on the first side surface (12), and the alignment device (30) is mounted on the power semiconductor element (10). - A second side surface (31) extending in the first direction (100) and the second direction (200), - A third surface (32) extending in the first direction (100) and the second direction (200), - The alignment device (30) is fitted to at least one second mounting structure (33) which is fitted to the corresponding first mounting structure (13) of the power semiconductor element (10), - comprising at least one first alignment structure (34) adapted to receive the terminal (11) of the power semiconductor element (10), the at least one first alignment structure (34) is - At least two side walls (36) protruding from the second side surface (31) in a direction opposite to the third direction (300) and extending in the fourth direction (400), - comprising a rear wall (38) provided by at least a portion of the second side surface (31), the rear wall (38) enclosing the space by at least two of the side walls (36) and forming at least one slot (39) oriented in the third direction (300) and the fourth direction (400), - The slot (39) is configured to receive the terminal (11), - The rear wall (38) restricts the movement of the terminal (11) of the power semiconductor element (10) in the third direction (300), - The two side walls (36) restrict the movement of the terminals (11) of the power semiconductor element (10) in the first direction (100) and the second direction (200), - The second side surface (31) is offset from the third side surface (32) in the third direction (300), and the third direction (300) is oriented away from the power semiconductor element fixed to the alignment device. - The first direction (100) and the second direction (200) are parallel to each other, and the third direction (300) is perpendicular to the first direction (100) and the second direction (200), - The third side surface (32) of the alignment device (30) is configured to contact the first side surface (12) of the power semiconductor element (10), - The fourth direction (400) is perpendicular to the first direction (100), the second direction (200), and the third direction (300). - The third side surface (32) extends in the first or second direction to one of the at least two side walls (36), - The second mounting structure (33) extends beyond the second side surface (31) and the third side surface (32) in a direction opposite to the third direction (300). Arrangement configuration.

2. The first alignment structure (34) comprises a bottom surface (35) extending in the first direction (100), the second direction (200), and the third direction (300), and the at least one side wall (36) extending in the third direction (300) and protruding from the bottom surface (35) in the fourth direction (400). The arrangement configuration described in claim 1.

3. The at least one side wall (36) has an upper surface (37) that supports the crossbar (113) of the at least one terminal (11) of the power semiconductor element (10), The arrangement configuration according to claim 1 or 2.

4. The upper surface (37) of the at least one side wall (36) has a recess (371) to improve the support and position of the crossbar (113) of the at least one terminal (11) of the power semiconductor element (10), The arrangement configuration described in claim 3.

5. A method of mounting the alignment device (30) on the power semiconductor element (10) according to claim 1 or 2, and mounting the power semiconductor element (10) on a printed circuit board (20), - The step of providing the power semiconductor element (10), - The step of providing the alignment device (30), - The steps of moving the power semiconductor element (10) in the third direction (300) to insert at least one terminal (11) of the power semiconductor element (10), which has a first portion (111) oriented in the fourth direction (400) and a second portion oriented in the third direction (300), into the at least one first alignment structure (34) of the alignment device (30), - A step of mounting the alignment device (30) onto the power semiconductor element (10), which is performed simultaneously with the insertion step, - The step of providing the printed circuit board (20), - The step of aligning the printed circuit board (20) with the alignment device (30), - A step performed simultaneously with the alignment step, comprising inserting at least partially the first portion (111) of the at least one terminal (11) into at least one contact hole (21) of the printed circuit board (20), wherein the insertion of the first portion (111) of the at least one terminal (11) includes moving the power semiconductor element (10) together with the alignment device (30) in the fourth direction (400), - The step of fixing the first portion (111) of at least one terminal (11) of the power semiconductor element (10) to the printed circuit board (20), method.

6. The step of inserting at least one terminal (11) is: - The step of receiving the at least one terminal (11) in the slot (39) of the alignment device (30) such that the first portion (111) of the at least one terminal (11) is oriented in the same direction as the slot (39), - The step of restricting the movement of the at least one terminal (11) in the first direction (100) and / or the second direction (200), The method according to claim 5.

7. The step of inserting the at least one terminal (11) includes the step of restricting the movement of the at least one terminal (11) in the third direction (300), The method according to claim 5.

8. The step of inserting the first portion (111) of the at least one terminal (11) includes the step of restricting the movement of the at least one terminal (11) in a fifth direction (500) opposite to the fourth direction (400), The method according to claim 5.

9. Mounting the alignment device (30) onto the power semiconductor element (10) includes the step of fixing the at least one second mounting structure (33) of the alignment device (30) to the corresponding at least one first mounting structure (13) of the power semiconductor element (10), The method according to claim 5.

10. A step of mounting the alignment device (30) onto the printed circuit board (20), which is performed at the same time as, or after, the step of inserting at least partially the first portion (111) of the at least one terminal (11), The method according to claim 5.

11. Mounting the alignment device (30) onto the printed circuit board (20) includes the step of fixing at least one third mounting structure (331) of the alignment device (30) to at least one fourth mounting structure (22) of the printed circuit board (20), The method according to claim 10.

12. The step of mounting the alignment device (30) on another component by fixing at least one fifth mounting structure (332) of the alignment device (30) to at least one sixth mounting structure (41) of another component, The method according to claim 5.

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