Method for removing protective tape and apparatus for removing protective tape

Abstract

To provide a peeling device and a peeling method capable of quickly folding a peeled protective tape in two and discarding it.SOLUTION: A protective tape peeling method according to the present invention peels off a circular protective tape (T2) that is attached to a wafer (W) and protects the entire surface of one side of the wafer and includes a holding step of holding the other side of the wafer on a holding table (20) with the protective tape facing up, a peeling tape attachment step of attaching one end (T31) of a strip-shaped peeling tape (T3) to the outer periphery of the protective tape, a peeling step of moving a gripping portion (3) that grips the other end (T32) of the peeling tape in the extending direction of the peeling tape, and peeling off the protective tape while being folded at a folding area (T24) that extends in a direction perpendicular to the extending direction of the peeling tape, a folding step of folding the peeled protective tape in a direction perpendicular to the peeling direction such that adhesive surfaces (T22) are aligned, and a disposal step of disposing of the protective tape folded in the folding step in a trash can (8).SELECTED DRAWING: Figure 9

Description

Technical Field

[0006] , , , , ,

[0001] The present invention relates to a method for peeling a protective tape and a protective tape peeling device.

Background Art

[0002] In Patent Document 1, a method is disclosed in which a dicing tape is attached to the other surface of a wafer with a protective tape attached to one surface of the wafer and a ring frame, and then the protective tape is peeled from the wafer.

[0003] In the peeling of the protective tape, a strip-shaped peeling tape is attached to the outer peripheral portion of the protective tape, and the peeling tape formed in a strip shape is gripped by a gripping portion, and the gripping portion is moved parallel to the upper surface of the wafer while bending the protective tape above the wafer. Then, the protective tape peeled from the wafer is in a state of being gripped by the gripping portion via the peeling tape, and is discarded by moving the gripping portion to a trash can and releasing the gripping of the peeling tape.

[0004] Here, in Patent Document 2, the peeled protective tape is folded in two and dropped, and then discarded into a trash can. Such folding in two of the protective tape is achieved by discharging air from a nozzle onto the peeled protective tape to form a folding trigger. Then, the gripping portion is moved to attach the peeling tape and the end portion of the protective sheet, and further, the peeling tape and the protective sheet are passed between a pair of rollers.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] In Patent Document 2, since the protective tape needs to be folded in half, it is necessary to go through the various steps described above, which presents the problem that the time required to fold and dispose of the peeled protective tape is extended.

[0007] This invention has been made in view of the above, and aims to provide a method for peeling off protective tape and a protective tape peeling device that allows the peeled protective tape to be quickly folded in half and disposed of. [Means for solving the problem]

[0008] A method for peeling off protective tape according to one aspect of the present invention is a method for peeling off a circular protective tape that is attached to a wafer and protects the entire surface of one side of the wafer, comprising: a holding step of holding the other side of the wafer with the protective tape facing upwards using a holding table; a release tape attachment step of attaching one end of a strip-shaped release tape to the outer circumference of the protective tape; a peeling step of moving a gripping portion that grips the other end of the release tape toward the center of the protective tape in the direction in which the release tape extends, and peeling off the protective tape on the wafer while bending it in a bending area extending in a direction perpendicular to the direction in which the release tape extends, so that the adhesive surface of the protective tape faces upwards; a folding step of folding the protective tape peeled off in the peeling step so that the adhesive surfaces are aligned in a direction perpendicular to the peeling direction; and a disposal step of discarding the protective tape folded in the folding step into a trash can.

[0009] This method allows the protective tape to be folded quickly by simply aligning the adhesive layers in a direction perpendicular to the peeling direction, thus reducing the time required for disposal.

[0010] In one aspect of the present invention, the peeling step includes a gripping step in which a pair of rollers that sandwich the folded area of ​​the protective tape are rotated to grip the outer periphery of the peeled protective tape, and in the folding step, the protective tape, which is gripped at both ends by the pair of rollers and the gripping part, is folded in a valley fold in a direction parallel to the peeling direction of the protective tape.

[0011] A protective tape peeling apparatus according to one aspect of the present invention is a protective tape peeling apparatus for peeling off a circular protective tape attached to the entire surface of one side of a wafer, comprising: a holding table that holds the other side of the wafer on its holding surface; a peeling tape attachment mechanism that attaches one end of a strip-shaped peeling tape to the outer circumference of the protective tape; a gripping part that grips the other end of the peeling tape; a moving mechanism that moves the gripping part and the holding table relative to each other parallel to the holding surface in the direction in which the peeling tape extends; and the moving mechanism that moves the gripping part, which is gripping the peeling tape, toward the center of the protective tape. The device includes a folding mechanism that moves the protective tape and folds it in half while bending it so that the adhesive side of the protective tape faces upward, and a waste bin for discarding the protective tape folded in half by the folding mechanism. The folded protective tape has a valley fold line along the diameter of the protective tape in a direction parallel to the extending direction of the release tape. The folding mechanism includes two plates arranged in a single plane to support the lower surface of the protective tape, and a fitting mechanism that brings the two plates together so that the valley fold line becomes the valley and the adhesive sides of the protective tape face each other.

[0012] In this configuration, two plates are brought together by a folding mechanism, and the diameter parallel to the extension direction of the release tape is used as the valley fold line, folding the protective tape in half so that the adhesive surfaces face each other. As a result, the protective tape can be folded in half with a simple and quick operation of bringing the two plates together after peeling off the protective tape, reducing the time required for disposal of the protective tape.

[0013] In one aspect of the present invention, the protective tape is folded in a folded area, and the protective tape is sandwiched between a pair of rollers that extend in a direction perpendicular to the extending direction of the release tape in the folded area, and a motor that rotates the pair of rollers in the winding direction of the protective tape away from the wafer is provided, and the protective tape that has been peeled off the wafer and supported by the gripping part and the pair of rollers is sandwiched between two plates and the protective tape is folded. [Effects of the Invention]

[0014] According to the present invention, the peeled protective tape can be quickly folded in half and disposed of.

Brief Description of the Drawings

[0015] [Figure 1] It is a schematic perspective view of a wafer with a protective tape peeled off by the peeling method of the embodiment attached thereto and a ring frame supporting the same. [Figure 2] It is an explanatory diagram of the holding step. [Figure 3] It is an explanatory diagram of the holding step. [Figure 4] It is an explanatory diagram of the step of attaching the peeling tape. [Figure 5] It is an explanatory diagram of the step of attaching the peeling tape. [Figure 6] It is an explanatory diagram of the step of attaching the peeling tape and the sandwiching step. [Figure 7] It is an explanatory diagram of the sandwiching step, the bent portion forming step, and the roller sandwiching step. [Figure 8] It is an explanatory diagram of the roller sandwiching step and the peeling step. [Figure 9] It is an explanatory diagram of the peeling step, the folding step, and the disposal step including the gripping step. [Figure 10] It is an explanatory diagram of the folding step. [Figure 11] It is an explanatory diagram similar to FIG. 8 of the peeling step according to the modification.

Embodiments for Carrying Out the Invention

[0016] Hereinafter, referring to the accompanying drawings, a method for peeling a protective tape according to the present embodiment will be described. In the peeling method according to the present embodiment, as shown in each figure, the X, Y, and Z-axis directions are orthogonal to each other, and the Z-axis direction is the vertical direction. Further, the Y-axis direction is horizontal and orthogonal to the Z-axis direction, and is parallel to the extending direction of the peeling tape and the peeling direction of the protective tape as viewed from above, and the X-axis direction is horizontal and orthogonal to the Y-axis direction and the Z-axis direction.

[0017] (1) Holding step First, the outer periphery of a circular dicing tape T1 is attached to an annular ring frame F having an opening F1 as shown in Figure 1, so as to cover the opening F1. The wafer W shown in Figure 1 is, for example, a semiconductor wafer with a circular outer shape, and a number of devices are formed on one surface W1 of the wafer W, with a circular protective tape T2 attached to it. The protective tape T2 is, for example, a circular film having an outer diameter equivalent to that of the wafer W, and the entire surface W1 of the wafer W is protected by the protective tape T2. The protective tape T2 comprises an exposed surface T21 made of a substrate and an adhesive surface T22 made of an adhesive glue layer.

[0018] When attaching the dicing tape T1 to the other side W2 of the wafer W, the wafer W and the ring frame F are aligned so that the center of the wafer W is located at the center of the opening F1 of the ring frame F. After this alignment, the adhesive surface of the dicing tape T1 on the inside of the opening F1 is pressed against the other side W2 of the wafer W to attach it. With this attachment, the wafer W is supported by the ring frame F via the dicing tape T1.

[0019] Next, as shown in Figure 2, the wafer W supported by the ring frame F via the dicing tape T1 is transported to the holding unit 2 by the transport unit 10.

[0020] The transport unit 10 shown in Figure 2 comprises an arm unit 100 that is movable in three orthogonal directions and can rotate around the Z-axis, and a ring frame suction unit 101 fixed to the lower part of the arm unit 100. The ring frame suction unit 101 has a plurality of suction pads 103 attached to the lower end of a suction tube 102, and the ring frame F is held in place by suction via these suction pads 103.

[0021] Furthermore, the holding unit 2 that constitutes the protective tape peeling device 1 (hereinafter referred to as peeling device 1) includes a holding table 20 that holds the other side W2 of the wafer W via the dicing tape T1, and a ring frame holding unit 21 that holds the ring frame F.

[0022] The holding table 20 is a disc-shaped member. The upper surface of the holding table 20 is provided with a holding surface 201 for suction holding of the dicing tape T1 in the area corresponding to the wafer W, and the holding surface 201 is connected to a suction source (not shown). The holding surface 201 is provided parallel to the XY plane. The holding table 20 is supported by the moving part 11 via a connecting member 23 connected to the bottom surface.

[0023] The moving part 11, for example, has a movable plate 110 to which a connecting member 23 is fixed, which reciprocates in the X-axis direction while sliding along the guide rail 111. Therefore, the moving part 11 can move the holding table 20 and the ring frame holding part 21, which are connected to the connecting member 23, back and forth integrally in the X-axis direction.

[0024] Multiple ring frame holding sections 21 are arranged around the holding table 20 at equal angles (for example, four, though only two are shown in the figure). Each ring frame holding section 21 includes a clamping clamp 210 and an air cylinder 211 that raises and lowers the clamping clamp 210 in the Z-axis direction. The clamping clamp 210 can clamp the ring frame F with a pair of clamping members that can move closer to and further apart from each other. Alternatively, the ring frame holding portion 21 may be omitted, and the holding surface 201 of the holding table 20 may hold the dicing tape T1 by suction, with the holding table 20 holding the ring frame F via the dicing tape T1.

[0025] In the transport unit 10, the ring frame F is held by suction via the suction pad 103, and the wafer W supported by the ring frame F is moved onto the holding surface 201 of the holding table 20 via the dicing tape T1. Next, the ring frame suction unit 101 is lowered, and the other side W2 of the wafer W is brought into contact with the holding surface 201 of the holding table 20 via the dicing tape T1, and the ring frame F is brought into contact with the clamping clamp 210. In this state, a suction source (not shown) connected to the holding surface 201 is activated to hold the other side W2 of the wafer W on the holding surface 201 via the dicing tape T1. At this time, the protective tape T2 attached to one side W1 of the wafer W is facing upwards and is held on the holding table 20.

[0026] In this state, the suction hold by the suction pad 103 of the transport unit 10 is released, and the suction pad 103 is separated from the ring frame F. The ring frame F is then held by the clamping clamp 210. Furthermore, by driving the air cylinder 211 to lower the clamping clamp 210, which is holding the ring frame F, to the -Z side, the ring frame F is held by the ring frame holding unit 21 as shown in Figure 3.

[0027] (2) Process of applying release tape The gripping section 3 shown in Figure 4, which constitutes the peeling device 1, is provided to grip the peeling tape T3 by a pair of clamping plates that can move closer to and further apart from each other in the Z-axis direction. The gripping section 3 is provided to be movable in the X-axis direction by an X-axis movement mechanism 31 (see Figure 5, etc.) and is also provided to be rotatable around the Y-axis by a rotation mechanism 32 (see Figure 5, etc.). In the peeling tape application process, in this embodiment, the gripping section 3 is positioned above the ring frame holding section 21 on the +X side.

[0028] The release tape application mechanism 4 shown in Figure 4, which constitutes the release device 1, applies a strip-shaped release tape T3 to the protective tape T2. The release tape application mechanism 4 includes, as shown in order from the -X side, a release tape supply unit 40 that supplies the release tape T3, a cutter 41 that cuts the release tape T3, and a release tape pressing unit 42.

[0029] The release tape supply unit 40 includes a release tape roll (not shown) that supports the wound release tape T3, and a support roller 400 on which the release tape T3 unwound from the release tape roll is wrapped. The release tape supply unit 40 also includes a pair of drive rollers 401 that extend in the Y-axis direction and are arranged side by side in the Z-axis direction, with the release tape T3 that is pulled out after passing through the support roller 400 being sandwiched between the pair of drive rollers 401. The support roller 400 and the pair of drive rollers 401 rotate around the Y-axis via a drive unit (not shown) such as a motor. The release tape supply unit 40 is able to supply the release tape T3 toward the gripping unit 3 on the +X side by the rotation of the support roller 400 and the pair of drive rollers 401. Here, the direction in which the release tape T3 extends is parallel to the X-axis direction and perpendicular to the Y-axis direction when viewed from the Z-axis direction.

[0030] The cutter 41 extends linearly in the Y-axis direction with a sharp cutting edge at its lower end and is movable up and down in the Z-axis direction. The release tape pressing section 42 is, for example, movable up and down in the Z-axis direction and can press the release tape T3 against the protective tape T2 with its lower end. In this embodiment, a heater 420 that generates heat when an electric current is passed through it is attached to the release tape pressing section 42, and the release tape pressing section 42 can heat the contact area between the release tape T3 and the protective tape T2 while pressing it. In the release tape application process, the cutter 41 and the release tape pressing section 42 are positioned, for example, above the outer circumference on the +X side of the protective tape T2 in the illustrated example.

[0031] As shown in Figure 4, in the release tape application process, first, the tip of the release tape T3 supplied from the release tape supply unit 40 is gripped by the gripping unit 3. Next, the release tape pressing unit 42 descends and pushes the release tape T3 downward, bringing the release tape T3 into contact with the exposed surface T21 of the protective tape T2 and pressing it down. Furthermore, the heater 420 is energized and generates heat, heating the contact area between the release tape T3 and the protective tape T2 by the release tape pressing unit 42, and the release tape T3 is adhered to the exposed surface T21 of the protective tape T2.

[0032] Next, as shown in Figure 5, the cutter 41 descends, and the cutting edge of the cutter 41 cuts into the release tape T3, cutting the release tape T3 into strips. As a result, as shown in Figure 6, one end T31 of the strip-shaped release tape T3 is attached to the outer circumference of the protective tape T2 attached to the wafer W. In this state, the gripping part 3 maintains that the other end T32 of the strip-shaped release tape T3 is gripped, and the state in which the extending direction of the release tape T3 is parallel to the X-axis when viewed from the Z-axis direction is also maintained. In addition, in order to facilitate gripping the release tape T3 with the gripping part 5 in the clamping process described later, it is preferable that the release tape T3 gripped by the gripping part 3 is inclined at a predetermined angle upward from one end T31 to the other end T32. After the cutter 41 cuts the release tape T3, the cutter 41 and the release tape pressing part 42 rise to the +Z side and retract from the release tape T3.

[0033] (3) Clamping process As shown in Figure 6, the clamping section 5 constituting the peeling device 1 comprises two plates 50 extending in the Y-axis direction. The two plates 50 are formed such that the longer sides extending in the Y-axis direction are longer than the Y-axis width of the peeling tape T3, and are arranged so that they can approach and separate from each other in the X-axis direction. The positions of each plate 50 in the Z-axis direction (height direction) are the same, and by bringing the two plates 50 closer together, their longer sides can come into contact with the peeling tape T3, allowing the peeling tape T3 to be clamped from both sides in the X-axis direction.

[0034] In the clamping process, as shown in Figure 6, each plate 50 is brought closer to each other from both sides in the X-axis direction toward approximately the middle portion of the strip-shaped release tape T3 that is being held by the gripping part 3. Then, both sides of the release tape T3 are clamped with the long sides of each plate 50.

[0035] (4) Folding process In the folding portion formation process, the moving portion 11 moves the holding portion 2 to the +X side. This movement applies force due to the movement of the holding portion 2 to the intermediate portion of the strip-shaped release tape T3, which is located between the clamped portion held by the clamping portion 5 and the portion to which the protective tape T2 is attached. As a result, as shown in Figure 7, the strip-shaped release tape T3 folds toward the -X side, and the folded portion T33 of the release tape T3 is formed on the outer circumference of the protective tape T2 in a shape such as a double fold (a shape in which the opposite sides of the adhesive surface are folded toward each other).

[0036] (5) Roller clamping process As shown in Figure 7, the roller clamping section 6, which constitutes the peeling device 1, is positioned above the clamping section 5 and includes a pair of rollers 60 extending in the Y-axis direction parallel to the two plates 50 of the clamping section 5, and a motor 61 (not shown in Figure 7, see Figures 8 and 9) that rotates the pair of rollers 60 around the Y-axis. The direction in which the rollers 60 extend is parallel to the Y-axis direction (the direction perpendicular to the extension direction of the peeling tape T3) when viewed from the Z-axis direction. The positions of each roller 60 in the Z-axis direction (height direction) are the same and they are arranged so that they can move closer to and further apart from each other in the X-axis direction, allowing the peeling tape T3 and the protective tape T2 to be clamped between them.

[0037] In the roller clamping process, the moving part 11 slightly moves the holding part 2 to the +X side. This applies tension to the release tape T3, which is clamped and fixed by the clamping part 5, while applying force to the edge portion T23 of the protective tape T2. As the holding part 2 continues to move to the +X side, the folded portion T33 of the release tape T3 is maintained, and the edge portion T23 of the protective tape T2 attached to the wafer W is peeled away from the wafer W. The edge portion T23 of the protective tape T2 is curled upwards while the folded portion T33 of the release tape T3 is attached to it.

[0038] In this state, the gripping portion 3 is moved toward the -X side by the X-axis movement mechanism 31, causing a portion of the release tape T3 above the gripping portion held by each plate 50 to rise toward the +Z side from each plate 50. Next, each roller 60 of the roller gripping portion 6 moves toward each other in the X-axis direction, and as shown in Figure 7, it grips the raised portion of the release tape T3. After that, the two plates 50 move apart from each other in the X-axis direction, and the gripping portion 5 releases the release tape T3.

[0039] (6) Peeling process As shown in Figure 8, during the peeling process, the gripping part 3 is rotated around the Y axis by the rotation mechanism 32, while the gripping part 3 is moved toward the -X side by the X-axis movement mechanism 31, so that the other end T32 side of the peeling tape T3 is reversed around the Y axis. In other words, the gripping part 3, which is gripping the other end T32 side of the peeling tape T3, is moved toward the center of the protective tape T2 in the -X axis direction (the direction in which the peeling tape T3 extends).

[0040] Next, the motor 61 is driven, causing the two rollers 60 to rotate relative to each other in the direction of winding (winding up) the release tape T3 upward. Simultaneously, the moving unit 11 moves the holding unit 2, including the holding table 20, relative to each other in the X-axis direction. In this embodiment, the holding table 20 is moved to the +X side by the moving unit 11 relative to each roller 60, whose position in the X-axis direction is fixed. Therefore, each roller 60 moves relative to the holding table 20 in a direction parallel to the protective tape T2 and the holding surface 201 (in this embodiment, the -X axis direction). Simultaneously with this movement and winding by each roller 60, the X-axis moving mechanism 31 moves the gripping unit 3, which grips the release tape T3, away from each roller 60 to the -X side.

[0041] In the peeling process, the first to third speeds described below are made equal. The first speed is the rotational speed of the two rollers 60, that is, the speed at which the two rollers 60 wind up the peeling tape T3 and protective tape T2 by a predetermined length per unit time. The second speed is the movement speed of the holding table 20 (holding unit 2), that is, the speed at which the peeling tape T3 and protective tape T2 are peeled off from one side W1 of the wafer W by a predetermined length per unit time. The third speed is the movement speed of the gripping unit 3, that is, the speed at which the peeling tape T3 and protective tape T2, after being wound up by the two rollers 60, are moved toward the -X side away from the two rollers 60 by a predetermined length per unit time.

[0042] Initially, when the peeling process begins, the two rollers 60 only grip and wind up the release tape T3. However, once the peeling has progressed to a certain extent, the process transitions to a stage where, in addition to the release tape T3, the protective tape T2 is also gripped and wound up by the two rollers 60 from the +X side edge portion T23. During this transition process, by matching the first to third speeds described above, the peeling continues while the shape of the bent portion T33 of the release tape T3 is shifted from the release tape T3 to the protective tape T2, forming a bent area T24. As a result, the protective tape T2 is bent from the +X side edge portion T23 and peels away from the wafer W. Furthermore, after the two plates 50 separate from each other during the roller clamping process, the rollers 60 of the roller clamping section 6 may be moved (descended) in the -Z direction to form the bending area T24.

[0043] As shown in Figure 8, the protective tape T2, which is peeled off from the wafer W while being bent, has a bending area T24 formed in the Y-axis direction (a direction perpendicular to the extending direction of the release tape T3). In the bending area T24, each roller 60 extends in the Y-axis direction (a direction perpendicular to the extending direction of the release tape T3) and sandwiches the protective tape T2.

[0044] Furthermore, the protective tape T2, which is peeled off from the wafer W, is wound up by each roller 60 and then moved to the -X side via the gripping unit 3 and the X-axis moving mechanism 31 on the wafer W held on the holding table 20 so that the adhesive surface T22 of the protective tape T2 faces upward. At this time, similar to the winding of the release tape T3, each roller 60 is rotated via the motor 61 in the direction of winding the protective tape T2 off the wafer W. In addition, the gripping unit 3 is moved to the -X side by the X-axis moving mechanism 31, and the holding unit 2 is moved to the +X side by the moving unit 11, so that the gripping unit 3 and the holding table 20 are moved relative to each other in the X-axis direction (the direction in which the release tape T3 extends parallel to the holding surface 201). Here, the moving unit 11 and the X-axis moving mechanism 31 constitute the moving mechanism.

[0045] By proceeding with the peeling while matching the first to third speeds described above, the protective tape T2 is peeled off from the entire surface W1 of one side of the wafer W, as shown in Figure 9. Immediately after peeling the protective tape T2 from the wafer W, the rotation of each roller 60 and the movement of the gripping part 3 toward the -X side are continued, and when the outer peripheral portion of the peeled protective tape T2 toward the +X side reaches each roller 60, the rotation of each roller 60 and the movement of the gripping part 3 are stopped.

[0046] As a result, the state shown in Figure 9 is reached, and the outer circumference of the peeled protective tape T2 on the side opposite to the release tape T3 (+X side) is gripped by the pair of rollers 60 (gripping step). Also, since the release tape T3 remains gripped by the gripping part 3, the outer circumference of the peeled protective tape T2 on the side of the release tape T3 (-X side) is supported (gripped) by the gripping part 3. In this state, the protective tape T2 peeled from the wafer W is supported (gripped) at both radial ends parallel to the X axis by the pair of rollers 60 and the gripping part 3.

[0047] (7) Folding process The two-fold mechanism 7, which constitutes the peeling apparatus 1, is provided so as to be positioned on the lower side (-Z side) of the protective tape T2 peeled off in the peeling process, as shown in the simplified dashed line illustration in Figure 9. As shown in Figure 10, the two-fold mechanism 7 comprises two plates 71 and a joining mechanism 72 that brings the two plates 71 together, and folds the protective tape T2 peeled off from the wafer W in half. The two-fold mechanism 7 is provided so as to be movable in the Y-axis direction by a Y-axis movement mechanism 73. As a result, the two-fold mechanism 7 is moved between a position that overlaps the upper part of the holding part 2 and a position that is shifted in the Y-axis direction from that position and does not overlap the upper part of the holding part 2.

[0048] The two plates 71 are arranged side by side parallel to the XY plane and support the lower surface of the protective tape T2 peeled off from the wafer W. When the wafer W is supported by the two plates 71, the release tape T3 is supported at both ends in the X-axis direction by a pair of rollers 60 and a gripping portion 3. The two plates 71 are formed in substantially identical rectangular shapes, and their ends extending parallel to the X-axis direction are arranged side by side in the Y-axis direction as adjacent abutting ends 711. The width of each plate 71 in the X-axis direction is approximately equal to the diameter of the protective tape T2, and the width of each plate 71 in the Y-axis direction is larger than the radius of the protective tape T2. Therefore, when the protective tape T2 is supported with the two plates 71 arranged side by side, the protective tape T2 is contained within the range of the two plates 71 in the Y-axis direction.

[0049] The joining mechanism 72 includes a rotating support portion 721 provided at each of the abutting ends 711 of the two plates 71. The rotating support portion 721 drives the plates 71 in the rotational direction, with its center position extending slightly below the abutting ends 711 in the Y-axis direction. The driving of the rotating support portion 721 makes it possible for the two plates 71 to rotate between a position parallel to the XY plane and an upright position parallel to the ZY plane, as shown by the dashed line in Figure 10. As a result, the upper surfaces of the two plates 71 that supported the protective tape T2 in the state shown in Figure 9 now face each other in the Y-axis direction, as shown by the dashed line in Figure 10.

[0050] In the folding process, the bi-folding mechanism 7 is moved by the Y-axis moving mechanism 73 so that the abutting ends 711 of each plate 71 are positioned below the diameter position parallel to the X-axis direction of the protective tape T2 that was peeled off from the wafer W in the peeling process. At this time, the protective tape T2 is supported by a pair of rollers 60 at the +X side end with a diameter parallel to the X-axis direction (the direction in which the peeling tape T3 extends), and the -X side end is supported by the gripping part 3 via the peeling tape T3. Thus, in addition to being supported by the pair of rollers 60 and the gripping part 3, the protective tape T2 is supported from below by the two plates 71.

[0051] In this state, the rotating support unit 721 drives the two plates 71 to rotate to the upright position shown by the dashed line in Figure 10, bringing them together. This rotation sandwiches the protective tape T2 between the two plates 71, and folds the diameter of the protective tape T2 parallel to the X-axis direction (parallel to the peeling direction) into a valley fold. In other words, the protective tape T2 is folded so that the adhesive surfaces T22 face each other in the Y-axis direction (perpendicular to the peeling direction). As a result, the adhesive surfaces T22 on both sides of the diameter of the protective tape T2 adhere to each other, folding the protective tape T2 in half, and the protective tape T2 becomes roughly semicircular with a thickness of two. The folded protective tape T2 has a valley fold line along the diameter of the protective tape T2 in the direction parallel to the extending direction of the peeling tape T3 (X-axis direction).

[0052] In this state, with the protective tape T2 folded by the alignment mechanism 72, the -X end of the protective tape T2 is folded in half together with the release tape T3. The +X end of the protective tape T2 protrudes from the two plates 71 and is held between the pair of rollers 60, so it is not folded in half.

[0053] In this state, the X-axis movement mechanism 31 moves the gripping part 3 to the -X side, separating the protective tape T2 from the pair of rollers 60, and the roller clamping part 6 releases the +X side end of the protective tape T2. Furthermore, the X-axis movement mechanism 31 moves the gripping part 3 to the -X side, displacing the release tape T3 and protective tape T2, which are sandwiched between the two joined plates 71, to the -X side. Due to this displacement, the +X side end of the protective tape T2, which has been released from the clamping of the roller clamping part 6 that protrudes from the two plates 71, is pulled between the two plates 71 and folded in half with a diameter parallel to the X axis. As a result, the entire +X side end of the protective tape T2 is pulled between the two plates 71, and the entire protective tape T2 is folded.

[0054] After the entire protective tape T2 is folded, the rotating support unit 721 drives the two plates 71 to the open position shown by the solid line in Figure 9, releasing the pinching of the folded protective tape T2. Then, the Y-axis movement mechanism 73 moves the folding mechanism 7 to a retracted position above the holding unit 2 where it does not overlap.

[0055] (8) Disposal process As shown in Figure 9, the waste bin 8, which constitutes the peeling device 1, is positioned below (-Z side) the gripping portion 3 that supports the protective tape T2 folded in the folding process, and this position is appropriately adjusted within the range of movement of the X-axis movement mechanism 31 that moves the gripping portion 3. The waste bin 8 is formed in the shape of a container with an open top and is sized to accommodate multiple folded protective tapes T2.

[0056] In the disposal process, the rotating mechanism 32 is driven to face the gripping part 3 downwards, suspending the folded protective tape T2 via the release tape T3. In this state, the protective tape T2 is positioned above the trash can 8 located below, and then the gripping part 3 releases its grip on the release tape T3, causing the protective tape T2 to fall into the trash can 8. As a result, the protective tape T2, which was folded in half by the folding mechanism 7 in the folding process, is disposed of in the trash can 8. Depending on the type of release tape T3, the folded protective tape T2 may be held so that it hangs down from the gripping part 3 due to its own weight. In this case, the rotating mechanism 32 does not need to be provided.

[0057] According to the above embodiment, the protective tape T2, after being peeled off in the peeling process, can be quickly folded in half by folding it from a direction perpendicular to the peeling direction (Y-axis direction) at a diameter position parallel to the peeling direction. Moreover, since the folding process can be performed without changing the state in which the gripping part 3 and the pair of rollers 60 support both sides of the protective tape T2 in the X-axis direction immediately after peeling, the folding process can be carried out quickly. This makes it possible to shorten the time required for disposal of the protective tape T2.

[0058] Furthermore, in order to fold the protective tape T2 in half, the folding mechanism 7 rotates to bring the two plates 71 together, so the folding process can be performed quickly with a simple operation, which also reduces the time required to dispose of the protective tape T2.

[0059] Furthermore, in this embodiment, the protective tape T2 is folded in half so that the adhesive surfaces T22 of the protective tape T2 stick together, preventing the adhesive surfaces T22 from being exposed when discarded. This prevents the protective tape T2 from becoming bulky by sticking to the side of the trash can 8, thus reducing the amount of protective tape T2 that can be disposed of in the trash can 8. In addition, while conventional methods involve spraying air to prevent the protective tape T2 from sticking to the trash can 8, this method eliminates the need for such air spraying, thus avoiding dust being stirred up from the trash can 8.

[0060] In the above embodiment, the folded portion T33 of the release tape T3 is formed into a double-fold shape as shown in Figure 7 during the folded portion formation process, and the folded area T24 of the protective tape T2 is formed into a double-fold shape using the release tape T3 during the peeling process. However, the double-fold shapes formed on the release tape T3 and protective tape T2 are not particularly limited. The shapes of the folded portion T33 and the folded area T24 can be appropriately changed depending on the peeling conditions and the type of protective tape T2. For example, as shown in Figure 11, the protective tape T2 may be peeled so that it hangs down from the roller clamping portion 6 between the portion clamped by the roller clamping portion 6 and the portion peeled off from the wafer W. In other words, the protective tape T2 may be peeled so that it is pulled upward vertically from the wafer W.

[0061] Furthermore, the folding mechanism 7 may be positioned shifted to the +X or -X side from the position shown in Figure 9, and the position of the trash can 8 should be changed accordingly.

[0062] Furthermore, the embodiments of the present invention are not limited to those described above, and may be modified, substituted, or transformed in various ways without departing from the spirit of the technical idea of ​​the present invention. Moreover, if the technical idea of ​​the present invention can be realized in a different way by advances in the art or by other derived arts, it may be implemented by that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial applicability]

[0063] As described above, the present invention is a method for peeling off a protective tape that has been attached to protect one side of a wafer, wherein the peeled protective tape can be quickly folded and discarded in a direction perpendicular to the peeling direction. [Explanation of Symbols]

[0064] 1: Peeling device (protective tape peeling device) 3: Grip part 4: Release tape application mechanism 7: Two-fold mechanism 71: Board 72: Alignment mechanism 8: Trash can 20: Holding Table 201: Holding surface 60: Laura 61: Motor T2: Protective tape T22: Adhesive surface T24: Folding area T3: Release tape T31: One end T32: The other end W: wafer W1: One side W2: The other side

Claims

1. A method for removing a protective tape, which is a circular protective tape attached to a wafer and protecting the entire surface of one side of the wafer, A holding step of holding the other side of the wafer with the protective tape facing upwards on a holding table, A release tape application step involves attaching one end of a strip-shaped release tape to the outer periphery of the protective tape, A peeling step is performed by moving a gripping portion that grasps the other end of the release tape toward the center of the protective tape in the direction in which the release tape extends, and peeling off the protective tape on the wafer while bending it in a bending area that extends in a direction perpendicular to the direction in which the release tape extends, with the adhesive surface of the protective tape facing upwards. A folding step in which the protective tape peeled off in the peeling step is folded so that the adhesive surfaces are aligned in a direction perpendicular to the peeling direction, A method for removing protective tape, comprising a disposal step of discarding the protective tape folded in the folding step into a trash can.

2. The peeling process includes a gripping step in which a pair of rollers that sandwich the folded area of ​​the protective tape are rotated to grip the outer periphery of the peeled protective tape, The method for peeling a protective tape according to claim 1, wherein in the folding step, the protective tape, which is gripped at both ends by the pair of rollers and the gripping portion, is folded in a valley fold along the diameter in the direction parallel to the peeling direction of the protective tape.

3. A protective tape peeling device for peeling off a circular protective tape that has been attached to the entire surface of one side of a wafer, A holding table that holds the other side of the wafer on the holding surface, A release tape attachment mechanism that attaches one end of a strip-shaped release tape to the outer circumference of the protective tape, A gripping portion for gripping the other end of the release tape, A moving mechanism that moves the gripping portion and the holding table relative to each other parallel to the holding surface in the direction of extension of the release tape, A folding mechanism that moves the gripping part, which is gripping the release tape, toward the center of the protective tape using the moving mechanism, and folds the protective tape in half while bending it so that the adhesive side of the protective tape is facing upwards, The device comprises a trash can for disposing of the protective tape that has been folded in half by the folding mechanism, The folded protective tape has a valley fold line along the diameter of the protective tape in a direction parallel to the extending direction of the release tape. The two-fold mechanism is, Two plates arranged in a single plane to support the underside of the protective tape, A protective tape peeling device comprising a fitting mechanism for aligning two plates so that the adhesive surfaces of the protective tape face each other, with the valley fold line forming the valley.

4. A pair of rollers that extend in a direction perpendicular to the extending direction of the release tape in the folded area where the protective tape is folded, and that sandwich the protective tape, The protective tape is wound up from the wafer and includes a motor that rotates the pair of rollers in the winding direction, The protective tape peeling device according to claim 3, wherein the protective tape, which has been peeled off the wafer and is supported by the gripping portion and the pair of rollers, is sandwiched between the two plates and the protective tape is folded.

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