Ejector cooling system

Abstract

To provide a heat pump device that can reduce the dimensions in the depth direction. [Solution] The heat pump device comprises a condenser that performs heat exchange between chiller water and a refrigerant to condense the refrigerant, a refrigerant tank that stores the refrigerant condensed by the condenser, and a flow rate adjustment unit that adjusts the flow rate of chiller water supplied to the condenser from a water supply path, wherein the condenser is located at the top of the heat pump device and the flow rate adjustment unit is located at the bottom of the heat pump device.

Description

Technical Field

[0001] The present invention relates to a heat pump device capable of reducing the dimension in the depth direction.

Background Art

[0002] As a heat pump device, for example, the one described in Patent Document 1 has already been provided. This heat pump device includes a condenser that condenses a refrigerant and a refrigerant tank that stores the condensed refrigerant. A coolant (chilled water) for condensing the refrigerant is supplied to the condenser.

[0003] Conventionally, the water supply path for supplying chilled water to the condenser and the drainage path from the condenser have been configured to be the shortest path in order to reduce the pressure loss. A flow rate adjustment valve for adjusting the flow rate of the chilled water supplied to the condenser is provided in the water supply path.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the conventional configuration, since the flow rate adjustment valve and the condenser are arranged side by side in the horizontal direction, there has been a problem that the dimension in the depth direction of the heat pump device becomes large.

[0006] The present invention has been made in view of the above, and an object thereof is to provide a heat pump device capable of reducing the dimension in the depth direction.

Means for Solving the Problems

[0007] To solve the above-mentioned problems and achieve the objective, the heat pump device according to the present invention comprises a condenser that performs heat exchange between chiller water and a refrigerant to condense the refrigerant, a refrigerant tank that stores the refrigerant condensed by the condenser, and a flow rate adjustment unit that adjusts the flow rate of chiller water supplied to the condenser from a water supply path, wherein the condenser is located at the top of the heat pump device and the flow rate adjustment unit is located at the bottom of the heat pump device.

[0008] Furthermore, the heat pump device according to the present invention is characterized in that the flow rate adjustment unit adjusts the flow rate of chiller water supplied from the water supply path to the condenser, and also adjusts the flow rate of chiller water sent to the drainage path.

[0009] Furthermore, the heat pump device according to the present invention is characterized in that the flow rate adjustment unit includes a first electric valve provided in the piping connecting the water supply path to the condenser, and a second electric valve provided in the piping extending vertically from the water supply path toward the drainage path.

[0010] Furthermore, the heat pump device according to the present invention is characterized in that the flow rate adjustment unit is a three-way valve that branches the chiller water path in the vertical direction from the water supply path toward the drainage path.

[0011] Furthermore, the heat pump device according to the present invention is characterized in that the top of the refrigerant tank is positioned below the midpoint height of the condenser.

[0012] Furthermore, the heat pump device according to the present invention is characterized in that the flow rate adjustment unit is located on the chiller water outlet side of the refrigerant tank.

[0013] Furthermore, the heat pump device according to the present invention is characterized in that the flow rate adjustment unit is arranged such that, when projected from above downwards, at least a portion of it overlaps with the condenser.

[0014] Furthermore, the heat pump device according to the present invention is characterized in that the inlet of the water supply path and the outlet of the drainage path are connected to external piping in the same direction and parallel to each other.

[0015] Furthermore, the heat pump device according to the present invention is characterized in that the inlet of the water supply path is provided with a portion that is widened in diameter.

[0016] Furthermore, the heat pump device according to the present invention is characterized in that the inlet of the water supply path is straight at least at the point where the diameter is widened.

[0017] Furthermore, the heat pump device according to the present invention is characterized in that piping is connected to the inlet and outlet sides of the condenser on the same surface of the condenser, facing the same direction.

[0018] Furthermore, the heat pump device according to the present invention is characterized in that the inlet of the water supply path and the outlet of the drainage path are connected to external piping facing the same direction on the first surface, and the inlet and outlet sides of the condenser are connected to a second surface opposite to the first surface of the condenser, facing the same direction. [Effects of the Invention]

[0019] According to the present invention, it is possible to realize a heat pump device that can reduce the dimensions in the depth direction. [Brief explanation of the drawing]

[0020] [Figure 1] Figure 1 is a schematic diagram of a heat pump device according to an embodiment of the present invention. [Figure 2] Figure 2 is a schematic diagram of a heat pump device according to a modified embodiment of the present invention. [Figure 3] Figure 3 is a schematic diagram of a heat pump system according to a comparative example. [Modes for carrying out the invention]

[0021] Hereinafter, embodiments for implementing the present invention will be described with reference to the accompanying drawings.

[0022] <Embodiment> FIG. 1 is a schematic configuration diagram of a heat pump device 1 according to an embodiment of the present invention. The heat pump device 1 illustrated here uses chilled water used in a factory or the like to condense a refrigerant, and uses the refrigerant in a heat pump cycle including a pump, a waste heat recovery device, an expansion valve, an evaporator, an ejector, etc., and uses chilled water in a factory.

[0023] As shown in FIG. 1, the heat pump device 1 includes a housing 2, a condenser 3 that condenses a refrigerant, a refrigerant tank 4 that stores the refrigerant condensed by the condenser 3, and a flow rate adjustment unit (electric valves 5 (first electric valve) and electric valve 6 (second electric valve)) that adjusts the flow rate of chilled water.

[0024] The heat pump device 1 according to the present embodiment is, for example, an ejector cooling device, and includes a pump that boosts the pressure of the refrigerant, a waste heat recovery device that heats the refrigerant with heat source hot water to generate a driving flow, an expansion valve that reduces the pressure of the refrigerant, an evaporator that cools a cooling medium with the refrigerant decompressed by the expansion valve, an ejector that sucks the refrigerant evaporated by the evaporator as a suction flow by the driving flow of the refrigerant from the waste heat recovery device, and discharges a refrigerant in which the driving flow and the suction flow are mixed, and a condenser 3 that cools the refrigerant discharged from the ejector. The refrigerant condensed by the condenser 3 is stored in the subsequent refrigerant tank 4 from the refrigerant outlet. The stored refrigerant is then sucked by a pump. The refrigerant tank 4 is configured to store the refrigerant using gravity. The refrigerant tank 4 is disposed higher than the pump.

[0025] The housing 2 houses the condenser 3, the refrigerant tank 4, the electric valve 5, and the electric valve 6. In FIG. 1, the right side of the paper surface is the front surface, and the left side of the paper surface is the rear surface.

[0026] The condenser 3 exchanges heat between the refrigerant flowing in from the ejector and chiller water supplied from the outside via the electric valve 5, thereby condensing the refrigerant. After the chiller water is heated by heat exchange with the refrigerant in the condenser 3, it is sent through the drainage path to a cooling device (such as a cooling tower) installed outside the system, where it is cooled and then sent back to the condenser 3 as chiller water. The refrigerant condensed in the condenser 3 is stored in the downstream refrigerant tank 4, and the stored refrigerant is then sucked out by a pump.

[0027] Furthermore, piping is connected to both the inlet and outlet sides of condenser 3, facing the same direction on the same side (front) of condenser 3.

[0028] The refrigerant tank 4 is positioned relatively low relative to the condenser 3 to store the refrigerant using gravity. Furthermore, it is desirable that the refrigerant tank 4 be positioned so that at least its top is below the midpoint of the condenser 3 in order to store the refrigerant using gravity.

[0029] The flow rate adjustment unit includes an electric valve 5 that adjusts the flow rate of chiller water supplied from the water supply path to the condenser 3, and an electric valve 6 that adjusts the flow rate of chiller water sent to the drainage path. The electric valve 5 is installed in the piping connecting the water supply path to the condenser 3. The electric valve 6 is installed in the piping that extends vertically from the water supply path to the drainage path.

[0030] The electric valves 5 and 6 are located below the condenser 3. More specifically, when projected from above downwards, the electric valves 5 and 6 are positioned such that at least a portion of them overlap with the condenser 3. Furthermore, the electric valves 5 and 6 are located on the chiller water outlet side of the refrigerant tank 4.

[0031] Furthermore, the inlet of the water supply route and the outlet of the drainage route are connected to external piping in parallel, facing the same direction (towards the rear). In other words, the surface (front) to which the inlet and outlet piping of the condenser 3 are connected and the surface (rear) to which the inlet of the water supply route and the outlet piping of the drainage route are connected are on opposite sides of each other. Also, the inlet of the water supply route has a straight section where it is widened.

[0032] <Variation> Figure 2 is a schematic diagram of a heat pump device 1A according to a modified embodiment of the present invention. As shown in Figure 2, the heat pump device 1A is equipped with a three-way valve 5A as a flow rate adjustment unit for adjusting the flow rate of chiller water.

[0033] The three-way valve 5A branches the chiller water pathways vertically from the water supply pathway to the drainage pathway. The downward branch is connected to the condenser 3, and the upward branch is connected to the drainage pathway. Therefore, the three-way valve 5A adjusts the flow rate of chiller water supplied from the water supply pathway to the condenser 3 and the flow rate of chiller water sent to the drainage pathway, respectively.

[0034] <Comparative Example> Figure 3 is a schematic diagram of the heat pump device 1B according to a comparative example. As shown in Figure 3, the heat pump device 1B is equipped with a flow rate adjustment unit (motorized valve 5B and motorized valve 6B) for adjusting the flow rate of chiller water.

[0035] The flow rate adjustment unit includes an electric valve 5B that adjusts the flow rate of chiller water supplied from the water supply path to the condenser 3, and an electric valve 6B that adjusts the flow rate of chiller water sent to the drainage path. The electric valve 5B is installed in the piping connecting the water supply path to the condenser 3. The electric valve 6B is installed in the piping that extends vertically from the water supply path to the drainage path.

[0036] <Comparison of each configuration> As in the comparative example, when the electric valve 5B and the condenser 3 are arranged horizontally, the depth length L21 of the heat pump device 1B becomes large.

[0037] In contrast, in this embodiment, the condenser 3 is located at the top of the heat pump device 1, and the electric valves 5 and 6 are located at the bottom of the heat pump device 1, so the length L1 in the depth direction of the heat pump device 1 is smaller than the length L21. Similarly, in this modified example, the condenser 3 is located at the top of the heat pump device 1A, and the three-way valve 5A is located at the bottom of the heat pump device 1A, so the length L11 in the depth direction of the heat pump device 1A is smaller than the length L21.

[0038] Furthermore, since the electric valves 5 and 6 are positioned so that at least a portion of them overlap with the condenser 3 when projected from above downwards, the depth length L1 of the heat pump device 1 can be reliably reduced. Similarly, since the three-way valve 5A is positioned so that at least a portion of it overlaps with the condenser 3 when projected from above downwards, the depth length L11 of the heat pump device 1A can be reliably reduced.

[0039] Furthermore, in the comparative example, the electric valve 5B and the condenser 3 are arranged horizontally, so the water supply path and the drainage path are at the same height as the condenser 3. As a result, the length L22 from the water supply path and the drainage path to the connection point with the outside is large, making connection work difficult.

[0040] In contrast, in this embodiment, since the electric valves 5 and 6 are located below the condenser 3, the length L2 to the connection point of the water supply path and drainage path to the outside is smaller than the length L22, making connection work easier. Similarly, in this modified example, since the three-way valve 5A is located below the condenser 3, the length L12 to the connection point of the water supply path and drainage path to the outside is smaller than the length L22, making connection work easier.

[0041] Furthermore, in the embodiment and its modifications, the inlet of the water supply route and the outlet of the drainage route are connected to external piping in parallel, facing the same direction (rear). As a result, the inlet and outlet are close together, and the piping is parallel, making the connection work easy.

[0042] Furthermore, in the comparative example, the condenser 3 and refrigerant tank 4 are located on the front side, making it impossible to secure maintenance space on the front side. In contrast, in the embodiment and modified example, there is space on the front side, so components requiring maintenance, such as pumps, can be placed on the front side, improving maintainability.

[0043] Furthermore, in the embodiments and modifications, the inlet of the water supply path is provided with a section that is widened in diameter. Moreover, in the embodiments and modifications, at least the widened section of the inlet of the water supply path is straight. As a result, the pressure loss on the inlet side, where the pressure is high, can be reduced.

[0044] Furthermore, the configurations illustrated in the above embodiments are functionally schematic and do not necessarily have to be physically represented as shown. In other words, the forms of distribution and integration of each device and component are not limited to those shown, and all or part of them can be functionally or physically distributed and integrated in any unit according to various usage situations. [Explanation of Symbols]

[0045] 1, 1A, 1B Heat pump equipment 2 cabinets 3. Condenser 4 Refrigerant tank 5, 5B, 6, 6B electric valves 5A Three-way valve

Claims

1. A condenser that performs heat exchange between the coolant and the refrigerant flowing in from the ejector, and condenses the refrigerant, An electric valve that adjusts the flow rate of coolant supplied to the condenser from a water supply path that supplies coolant from the outside, and the flow rate of coolant directly supplied from the water supply path to a drainage path that drains coolant to the outside. In an ejector cooling system equipped with, The condenser is located at the top of the ejector cooling device, The ejector cooling device is characterized in that the electric valve is located at the bottom of the ejector cooling device.

2. The aforementioned electric valve is A first electric valve is provided in the piping connecting the water supply path to the condenser, A second electric valve is provided in a pipe that extends vertically from the water supply route toward the drainage route, The ejector cooling device according to claim 1, characterized by including the following:

3. The ejector cooling device according to claim 1, characterized in that the electric valve is a three-way valve that branches the path of the coolant in the vertical direction from the water supply path toward the drainage path.

4. The ejector cooling device according to claim 1, characterized in that it includes a refrigerant tank for storing the refrigerant condensed by the condenser using gravity.

5. The ejector cooling device according to claim 4, characterized in that the top of the refrigerant tank is positioned below the midpoint height of the condenser.

6. The ejector cooling device according to claim 4, characterized in that the electric valve is located on the coolant outlet side of the refrigerant tank.

7. The ejector cooling device according to claim 1, characterized in that the electric valve is arranged such that, when projected from above to below, at least a portion of it overlaps with the condenser.

8. The ejector cooling device according to claim 1, characterized in that the inlet of the water supply route and the outlet of the drainage route are connected to external piping in the same direction and parallel to each other.

9. The ejector cooling device according to claim 1, characterized in that the inlet of the water supply path has a portion that is widened.

10. The ejector cooling device according to claim 9, characterized in that the inlet of the water supply path is straight at least at the portion where the diameter is widened.

11. The ejector cooling device according to claim 1, characterized in that piping is connected to the inlet and outlet sides of the condenser on the same surface of the condenser, facing the same direction.

12. The inlet of the water supply route and the outlet of the drainage route are connected to external piping facing the same direction on the first surface. The ejector cooling device according to claim 1, characterized in that piping is connected to the inlet and outlet sides of the condenser, and to the second surface of the condenser opposite to the first surface, both facing the same direction.

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