Substrate processing system and substrate processing method

Abstract

To provide a substrate processing system that includes a wet processing system which has high productivity, and with which processing for photolithography other than exposure processing is carried out wet, and that is connected to an exposure device.SOLUTION: Provided is a substrate processing system comprising: a wet processing system 2 that has a wet processing device with which any of substrate processing from a process of forming a resist film on a substrate to a process of developing the resist film after exposure is carried out wet, and that is connected to an exposure device; a dry processing system 3 that has a dry processing device with which the same kind of substrate processing as the wet processing device is carried out dry; and a relay conveyance system 4 that conveys the substrate between the wet processing system 2 and the dry processing system 3. The wet processing system 2 is disposed so that, when viewed from the direction of connection of the wet processing system 2 and the exposure device, the exposure device projects from one side in the depth direction that is perpendicular to the direction of connection in a top view, and the dry processing system 3 is disposed so as to adjoin the one side in the depth direction of the wet processing system 2.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a substrate processing system and a substrate processing method.

Background Art

[0002] Patent Document 1 discloses a substrate processing system including a processing station in which a plurality of processing units for processing a substrate are provided in multiple stages in the vertical direction, a cassette mounting unit on which a cassette for accommodating a plurality of substrates is placed, and a substrate transfer mechanism disposed between the processing station and the cassette mounting unit. A plurality of transfer units for temporarily accommodating substrates transferred between the cassette mounting unit and the processing station and substrates transferred between the stages of the processing units are provided in multiple stages between the processing station and the substrate transfer mechanism. Further, the substrate transfer mechanism includes a first transfer arm for transferring a substrate between the cassette mounting unit and each transfer unit, and a second transfer arm for transferring a substrate between the stages of each transfer unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technology according to the present disclosure provides a highly productive system which is a substrate processing system including a processing system for performing a photolithography process other than an exposure process and connected to an exposure apparatus.

Means for Solving the Problems

[0005] One aspect of the present disclosure is a substrate processing system comprising: a wet processing apparatus having a wet processing apparatus that wetly performs any substrate processing, from the formation of a resist film on a substrate to the development of the resist film after exposure; a dry processing apparatus having a dry processing apparatus that dryly performs the same type of substrate processing as the wet processing apparatus; and a relay transport system that transports a substrate between the wet processing system and the dry processing system, wherein the wet processing system is arranged such that, when viewed from the direction of connection between the wet processing system and the exposure apparatus, the exposure apparatus protrudes from one side in the depth direction perpendicular to the connection direction in a top view, and the dry processing system is arranged adjacent to the one side in the depth direction of the wet processing system. [Effects of the Invention]

[0006] According to this disclosure, a substrate processing system connected to an exposure apparatus, which includes a processing system that performs photolithography processing other than exposure processing, can be provided as a highly productive system. [Brief explanation of the drawing]

[0007] [Figure 1] This is an explanatory diagram showing a schematic of the internal configuration of a wafer processing system as a substrate processing system according to the first embodiment. [Figure 2] This diagram shows a schematic representation of the internal configuration of the front side of the wet processing system. [Figure 3] This diagram shows a schematic representation of the internal configuration on the rear side of the wet processing system. [Figure 4] This figure schematically shows a cross-section of the transfer block portion of the wafer processing system shown in Figure 1. [Figure 5] This figure shows another example of a dry processing system. [Figure 6] This figure shows another example of a connection section between a wet processing system and a relay / transport system. [Figure 7] This figure shows another example of a connection section between a wet processing system and a relay / transport system. [Figure 8]This figure shows another example of a wet processing system. [Figure 9] This figure shows another example of a connection section between a wet processing system and a relay / transport system. [Figure 10] This figure shows another example of a connection section between a wet processing system and a relay / transport system. [Figure 11] This is an explanatory diagram showing a schematic of the internal configuration of a wafer processing system as a substrate processing system according to the second embodiment. [Figure 12] This figure illustrates a modified example of a wafer processing system as a substrate processing system according to the second embodiment. [Figure 13] This is an explanatory diagram showing a schematic of the internal configuration of a wafer processing system as a substrate processing system according to the third embodiment. [Figure 14] Figure 13 shows the wafer processing system as viewed from the cassette station side. [Modes for carrying out the invention]

[0008] In photolithography, a manufacturing process for semiconductor devices, a series of processes are performed to form a desired resist pattern on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer"). These processes include, for example, a resist film formation process to form a resist film on the substrate, an exposure process to expose the resist film, and a development process to develop the exposed resist film. Of these processes, the resist film formation process and the development process are performed in a coating and developing system having substrate processing equipment for each process, while the exposure process is performed in an exposure apparatus. The coating and developing system is generally used in direct connection to the exposure apparatus. Furthermore, in the coating and developing system, for example, the resist film formation process and the development process are performed using a liquid, i.e., a wet process.

[0009] In a wet coating and developing system that performs development processing and the like in a wet manner, when the exposure apparatus is larger in length in the connecting direction between the coating and developing system and the exposure apparatus in a top view, that is, in depth, the exposure apparatus may protrude from the back side surface of the wet coating and developing system when viewed from the connecting direction. Further, the area adjacent to the back side surface of the exposure apparatus in the depth direction is a maintenance area where maintenance apparatuses are arranged during maintenance of the exposure apparatus.

[0010] Conventionally, when the exposure apparatus is larger in depth as described above, in the space adjacent to the back side surface of the wet coating and developing system in the depth direction, and in the space between the back side surface of the wet coating and developing system and the back side end of the above-described maintenance area in the view in the connecting direction, no apparatuses or the like are arranged, and this space may be wasted. That is, there is room for improvement in terms of productivity in a conventional substrate processing system including a wet processing system that performs photolithography processing other than exposure processing in a wet manner and is connected to an exposure apparatus. Similarly, there is also room for improvement in terms of productivity in a substrate processing system including a dry processing system that performs photolithography processing other than exposure processing using a gas, that is, in a dry manner and is connected to an exposure apparatus.

[0011] Therefore, the technology according to the present disclosure provides a highly productive substrate processing system including a processing system that performs photolithography processing other than exposure processing and is connected to an exposure apparatus.

[0012] Hereinafter, the substrate processing system and the substrate processing method according to the present embodiment will be described with reference to the drawings. In the present specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0013] (First Embodiment) <Coating and Developing Processing System> FIG. 1 is an explanatory diagram showing an outline of the internal configuration of a wafer processing system as a substrate processing system according to the first embodiment. FIGS. 2 and 3 are diagrams each showing an outline of the internal configuration of the front side and the back side of a wet processing system described later. FIG. 4 is a diagram schematically showing a cross section of the wafer processing system of FIG. 1 at a transfer block portion described later.

[0014] The wafer processing system 1 in FIG. 1 includes a wet processing system 2, a dry processing system 3, and a relay transfer system 4.

[0015] As shown in FIGS. 1 to 3, the wet processing system 2 includes a cassette station 10, a processing station 11, and an interface station 12, and is connected to an exposure apparatus E. The exposure apparatus E performs an exposure process on a wafer W as a substrate, specifically, performs an exposure process on the wafer W by a liquid immersion method. In the wet processing system 2, the cassette station 10, the processing station 11, and the interface station 12 are integrally connected.

[0016] Hereinafter, the connection direction between the wet processing system 2 and the exposure apparatus E is referred to as the width direction, and the direction perpendicular to the connection direction, that is, the width direction, in a top view is referred to as the depth direction.

[0017] The cassette station 10 of the wet processing system 2 is for loading and unloading a cassette C which is a storage container configured to be able to store a plurality of wafers W. The cassette station 10 is provided, for example, with a cassette mounting table 20 at an end on one side in the width direction (the negative Y direction in FIG. 1 etc.). On the cassette mounting table 20, a plurality of, for example, four mounting plates 21 are provided. The mounting plates 21 are arranged in a row in the depth direction (the X direction in FIG. 1). The cassette C can be mounted on these mounting plates 21 when loading and unloading the cassette C with respect to the outside of the wet processing system 2.

[0018] Furthermore, the cassette station 10 is provided with a transport device 23 for transporting wafers W on, for example, the other side in the width direction (the positive Y direction in Figure 1). The transport device 23 has a transport arm 23a configured to be movable in the depth direction (X direction in Figure 1). The transport arm 23a of the transport device 23 is also configured to be movable in the vertical direction and around the vertical axis. This transport device 23 can transport wafers W between the cassettes C on each mounting plate 21 and the transfer device 51 of the transfer tower 50, which will be described later.

[0019] Furthermore, the cassette station 10 may be provided with a storage section (not shown) where cassettes C are placed and stored, either above the cassette mounting table 20 or in a part further from the exposure device E than the cassette mounting table 20 (the negative side in the Y direction in Figure 1).

[0020] The processing station 11 is equipped with multiple processing devices for performing predetermined processes such as resist film formation.

[0021] The processing station 11 is divided into multiple blocks (two in the example shown in the figure), each equipped with various devices. The interface station 12 has processing block BL1, and the cassette station 10 has transfer block BL2.

[0022] Processing block BL1 has, for example, a first block G1 on the front side (negative X direction in Figure 1) and a second block G2 on the back side (positive X direction in Figure 1).

[0023] For example, in the first block G1, as shown in Figure 2, a plurality of liquid processing devices, such as a developing device 30 for developing a wafer W and a resist coating device 31 for applying a resist solution to the wafer W to form a resist film, are arranged from bottom to top in this order. The developing device 30 is an example of a wet processing device. A wet processing device is a device that performs wafer processing as a substrate processing, from the process of forming a resist film on the wafer W to the process of developing the resist film after exposure, that is, any wafer processing for photolithography, in a wet manner.

[0024] For example, four developing units 30 and four resist coating units 31 are arranged in a row in the width direction (Y direction in the diagram). The number and arrangement of these developing units 30 and resist coating units 31 can be arbitrarily selected.

[0025] In these developing apparatus 30 and resist coating apparatus 31, a predetermined processing solution is applied to the wafer W, for example, by a spin coating method. In the spin coating method, for example, the processing solution is discharged onto the wafer W from a discharge nozzle, and the wafer W is rotated to diffuse the processing solution onto the surface of the wafer W.

[0026] For example, in the second block G2, as shown in Figure 3, multiple heat treatment devices 40 for performing heat treatment such as heating and cooling of wafers W are arranged in a vertical direction (up and down direction in the figure) and a width direction (Y direction in the figure). The number and arrangement of the heat treatment devices 40 can also be arbitrarily selected.

[0027] Furthermore, as shown in Figure 1, the processing block BL1 is provided with a transport path R1 that extends in the width direction in the portion between the first block G1 and the second block G2. In the processing block BL1, multiple developing devices 30 and resist coating devices 31 are arranged along this transport path R1 that extends in the width direction. A transport device R2 for transporting wafers W is arranged along the transport path R1.

[0028] The transport device R2 has a transport arm R2a that is movable, for example, in the width direction (Y direction in Figure 1), the vertical direction, and in the direction around the vertical axis. The transport device R2 moves the transport arm R2a holding the wafer W within the wafer transport area D and can transport the wafer W to predetermined devices in the surrounding first block G1, second block G2, and the transfer towers 50 and 60 described later. Multiple transport devices R2 can be arranged vertically, for example as shown in Figure 3, and the wafer W can be transported to predetermined devices of roughly the same height in the first block G1, second block G2, and transfer towers 50 and 60, respectively.

[0029] Furthermore, the transport path R1 is equipped with a shuttle transport device R3 that transports wafers W linearly between the transfer tower 50 and the transfer tower 60.

[0030] The shuttle transport device R3 moves the supported wafer W linearly in the Y direction, and can transport the wafer W between the equipment of the transfer tower 50 and the equipment of the transfer tower 60, which are of similar height.

[0031] As shown in Figure 1, the transfer block BL2 has a transfer tower 50 located in the center in the depth direction (X direction in the figure). Specifically, the transfer tower 50 is located in the transfer block BL2 adjacent to the transport path R1 of the processing block BL1 in the width direction (Y direction in the figure). As shown in Figure 3, the transfer tower 50 has multiple transfer devices 51 arranged to overlap vertically.

[0032] As shown in Figure 1, the interface station 12 is located between the processing station 11 and the exposure apparatus E, and is used for the transfer of wafers W between them. A transfer tower 60 is provided at the interface station 12, adjacent to the transport path R1 of the processing block BL1 in the width direction (Y direction in the figure). As shown in Figure 3, multiple transfer devices 61 are installed in the transfer tower 60 so as to overlap vertically.

[0033] Furthermore, as shown in Figure 1, a post-exposure cleaning device 62 and a pre-exposure cleaning device 63 are provided on the front side (negative X direction in the figure) and the back side (positive X direction in the figure) of the interface station 12, respectively. The post-exposure cleaning device 62 cleans the wafer W after exposure by the exposure device E. The pre-exposure cleaning device 63 cleans the wafer W on which the resist film has been formed, specifically cleaning the back surface of the wafer W before exposure by the exposure device E. For example, as shown in Figure 2, multiple post-exposure cleaning devices 62 (three in the example shown) are arranged vertically (up and down direction in the figure) on the front side of the interface station 12. Although not shown in the figure, multiple pre-exposure cleaning devices 63 are arranged on the back side of the interface station 12, similar to the post-exposure cleaning devices 62. The number and arrangement of the post-exposure cleaning devices 62 and pre-exposure cleaning devices 63 can also be arbitrarily selected.

[0034] Furthermore, as shown in Figure 1, the interface station 12 is equipped with transport devices R4 to R6.

[0035] The transport device R4 is located adjacent to the transfer tower 60 in the width direction (Y direction in the figure) and has a transport arm R4a that is movable, for example, in the depth direction (X direction in Figure 1), vertical direction and in the direction around the vertical axis. The transport device R4 can hold the wafer W with the transport arm R4a and transport the wafer W between the multiple transfer devices 61 of the transfer tower 60 and the exposure device E.

[0036] The transport device R5 is provided between the transfer tower 60 and the post-exposure cleaning device 62 and has, for example, a transport arm R5a that is movable in the vertical direction and around the vertical axis. The transport device R5 can hold the wafer W with the transport arm R5a and transport the wafer W between the multiple transfer devices 61 of the transfer tower 60 and the multiple post-exposure cleaning devices 62.

[0037] The transport device R6 is provided between the transfer tower 60 and the pre-exposure cleaning device 63 and has, for example, a transport arm R6a that is movable in the vertical direction and around the vertical axis. The transport device R6 can hold the wafer W with the transport arm R6a and transport the wafer W between the multiple transfer devices 61 of the transfer tower 60 and the multiple pre-exposure cleaning devices 63.

[0038] Furthermore, as shown in Figure 1, the transfer block BL2 of the processing station 11 has a transfer tower 52 at its rear end (the positive X-direction in the figure). As shown in Figure 4, the transfer tower 52 has a transfer device 53. In the transfer tower 52, multiple transfer devices 53 may be arranged to overlap in the vertical direction (up and down direction in Figure 4). The transfer tower 52 may also have a cooling device 54 for cooling the wafers.

[0039] Furthermore, as shown in Figure 1, a transfer device R7 is provided in the transfer block BL2. The transfer device R7 is provided between the transfer tower 50 and the transfer tower 52 and has, for example, a transfer arm R7a that is movable in the vertical direction and in the direction about the vertical axis. The transfer device R7 can hold the wafer W with the transfer arm R7a and transport the wafer W between the multiple transfer devices 51 of the transfer tower 50, the multiple transfer devices 53 of the transfer tower 52 and the cooling device 54.

[0040] As shown in Figure 1, the dry processing system 3 includes a load lock station 100 and a processing station 101. In the dry processing system 3, the load lock station 100 and the processing station 101 are integrally connected. In this example, the direction of connection between the load lock station 100 and the processing station 101 and the direction of connection between the wet processing system 2 and the exposure apparatus E are perpendicular when viewed from above.

[0041] The load lock station 100 is equipped with a load lock device 110 that is configured to switch between a reduced pressure atmosphere and an atmospheric pressure atmosphere.

[0042] The processing station 101 includes a vacuum transport chamber 120 and a processing device 121.

[0043] The vacuum transport chamber 120 consists of a sealed enclosure, and its interior is kept under reduced pressure (vacuum). The vacuum transport chamber 120 is formed in a roughly polygonal shape (pentagon in the example shown in the figure) when viewed from above.

[0044] Multiple processing units 121 (four in the example shown) are provided at the processing station 101, for example. At least one of the processing units 121 provided at the processing station 101 is a dry processing unit, which performs the same type of wafer processing as the wet processing unit of the wet processing system 2, but in a dry manner. Specifically, it performs the development process performed by the developing unit 30 of the wet processing system 2 in a dry manner. Dry processing is a method that uses gas, specifically a method that uses gas under reduced pressure. Dry processing can be said to obtain the desired effect mainly by gas, while wet processing can be said to obtain the effect mainly by liquid.

[0045] In the processing station 101, a plurality of processing devices 121 and load lock stations 100 are arranged outside the vacuum transport chamber 120, for example, so as to surround the vacuum transport chamber 120 in a top view, that is, so as to be aligned around a vertical axis passing through the center of the vacuum transport chamber 120.

[0046] Furthermore, a transport device 122 for transporting wafers W is provided inside the vacuum transport chamber 120. The transport device 122 has, for example, a transport arm 122a that is movable in a direction around a vertical axis. The transport device 122 can transport wafers W between multiple processing units 121 and load lock devices 110 by holding the wafers W with the transport arm 122a.

[0047] The relay transport system 4 transports the wafer W between the wet processing system 2 and the dry processing system 3, specifically transporting the wafer W in wafer units, i.e., one wafer at a time.

[0048] This relay transport system 4 is provided with a transport path 130, which transports wafers W between the wet processing system 2 and the dry processing system 3. The transport path 130 of the relay transport system 4 constitutes a transport path that extends in the depth direction (X direction in the figure), including the transfer tower 50 of the transfer block BL2. This transport path is perpendicular in a top view to the transport path that extends in the width direction (Y direction in the figure), including the transport path R1 of the processing block BL1.

[0049] In this embodiment, the relay transport system 4 is connected to a portion of the wet processing system 2 that is spaced apart from the exposure apparatus E from the processing block BL1, and more specifically, it is connected to the transfer block BL2. More specifically, the transport path 130 of the relay transport system 4 is connected to the transfer block BL2.

[0050] A transport device 131 for transporting wafers W is arranged in the transport path 130. The transport device 131 has a transport arm 131a that is movable, for example, in the vertical direction and around the vertical axis. The transport device 131 can hold the wafer W in the transport arm 131a and transport the wafer W between the multiple transfer devices 53, cooling devices 54 and load lock devices 110 of the transfer tower 52.

[0051] Furthermore, the wafer processing system 1 has a control device 5 that controls the wafer processing system 1, including the control of the transport device. The control device 5 is, for example, a computer equipped with a processor such as a CPU and memory, and has a program storage unit (not shown). The program storage unit stores a program that controls the operation of the drive systems of the various processing devices and various transport devices described above, and controls the wafer processing described later. Note that the above program may have been recorded on a storage medium H that is readable by the computer and installed from the storage medium H to the control device 5. The storage medium H may be temporary or permanent.

[0052] Incidentally, when the exposure apparatus E is, for example, for immersion exposure, the exposure apparatus E may have a greater length in the depth direction (X direction in the diagram), i.e., greater depth, than the wet processing system 2. In cases where the exposure apparatus E has a greater depth, the wet processing system 2 is arranged such that the exposure apparatus E protrudes from the back side of the wet processing system 2 (positive X direction in the diagram). The wet processing system 2 is arranged similarly in the wafer processing system 1. In the wafer processing system 1, the dry processing system 3 is arranged adjacent to the back side (positive X direction in the diagram) of the wet processing system 2 in the depth direction. Specifically, in the wafer processing system 1, the dry processing system 3 is adjacent to the back side of the wet processing system 2 in the depth direction, with a work passage used for maintenance of various devices in between.

[0053] Furthermore, a maintenance area MA for the exposure device E is provided on the rear side of the exposure device E (the positive side in the X direction in the diagram). Specifically, the dry processing system 3 is positioned such that its rear end (positive X-direction in the diagram) is located in front of (negative X-direction in the diagram) the rear end (positive X-direction in the diagram) of the maintenance area MA for the exposure apparatus E. More specifically, since a maintenance area for the dry processing system 3 is also set up at the rear of the dry processing system 3, the dry processing system 3 is positioned such that the rear end of the maintenance area for the dry processing system 3 is located in front of the rear end of the maintenance area for the exposure apparatus E.

[0054] The rear end (positive X-direction in the figure) of the maintenance area MA for the exposure apparatus E is set relative to, for example, the rear end (positive X-direction in the figure) of the rail RA for the crane used for maintenance of the exposure apparatus E, and more specifically, coincides with the rear end of the rail RA. The rail RA is permanently installed, for example, in the factory where the wafer processing system 1 is installed.

[0055] <Example of wafer processing 1> Next, an example of wafer processing using wafer processing system 1 will be described. In wafer processing using the wafer processing system 1, the wafer W is selectively transported to either a developing apparatus 30 that performs wet developing processing or a processing apparatus 121 that performs dry developing processing. In this example, each wafer W undergoes only one development process, and only one of either a wet development process or a dry development process is performed. That is, the wafer W is transported to only one of either the development apparatus 30 that performs the wet development process or the processing apparatus 121 that performs the dry development process.

[0056] If only wet development processing is performed, the dry processing system 3 of the wafer processing system 1 is not used, and only the wet processing system 2 is used. On the other hand, if only dry development processing is performed, for example, after the processing up to the development processing (excluding the exposure processing) of the photolithography processing is performed in the wet processing system 2, the wafer W is transported to the dry processing system 3 via the transport of the relay transport system 4, and the dry development processing is performed. The following provides a more detailed explanation.

[0057] In both wet and dry developing processes, wafer processing using wafer processing system 1 first involves the transport device 23 of wet processing system 2 removing the wafer W from the cassette C on the cassette mounting table 20 and transporting it to the transfer device 51 of the transfer tower 50 of transfer block BL2.

[0058] Next, the wafer W is transported by the transport device R2 to the heat treatment device 40 in the processing block BL1 and subjected to temperature control treatment. After that, the wafer W is transported to the resist coating device 31, where a resist film is formed on the wafer W. Subsequently, the wafer W is transported to the heat treatment device 40 and subjected to pre-bake (PAB) treatment. Similar heat treatments are performed in the pre-bake treatment, the subsequent PEB (Post Exposure Bake) treatment, and the post-bake treatment. However, the heat treatment devices 40 used for each heat treatment are different from each other.

[0059] Next, the wafer W is transported to the transfer device 61 of the transfer tower 60 of the interface station 12. Subsequently, the wafer W is transported by the transfer device R6 to the pre-exposure cleaning device 63, where the back surface of the wafer W is cleaned. After that, the wafer W is transported to the transfer device 61 of the transfer tower 60. Next, the wafer W is transported by the transfer device R4 to the exposure device E, where it is immersion exposed.

[0060] After immersion exposure, the wafer W is transported by the transport device R4 to the transfer device 61 of the transfer tower 60. Next, the wafer W is transported by the transport device R5 to the post-exposure cleaning device 62 and cleaned. After that, the wafer W is transported back to the transfer device 61 of the transfer tower 60. Next, the wafer W is transported to the heat treatment apparatus 40 by the transport device R2 and subjected to PEB treatment.

[0061] Subsequently, the wafer W is subjected to either a wet development process or a dry development process.

[0062] If a wet development process is performed, the wafer W after PEB processing is transported to the development apparatus 30 by the transport device R2. After the wet development process is performed in the development apparatus 30, the wafer W is transported to the heat treatment apparatus 40 for post-bake processing. After that, the wafer W is transported to the transfer device 51 of the transfer tower 50 of the transfer block BL2. Then, the wafer W is returned to the cassette C on the cassette mounting table 20 by the transport device 23.

[0063] On the other hand, when dry development processing is performed, the wafer W after PEB processing is transported by transport device R2 to the transfer device 51 of the transfer tower 50 of the transfer block BL2. Next, the wafer W is transported by transport device R7 to the transfer device 53 of the transfer tower 52. Subsequently, the wafer W is transported by transport device 131 of the relay transport system 4 via the transport path 130 to the load lock device 110 of the dry processing system 3. After the inside of the load lock device 110 is depressurized, the wafer W is transported by transport device 122 to a predetermined processing device 121 where dry development processing is performed. After that, the wafer W is returned to the load lock device 110. Subsequently, after the inside of the load lock device 110 is returned to an atmospheric pressure atmosphere, the wafer W is transported by transport device 131 of the relay transport system 4 via the transport path 130 to the cooling device 54 of the transfer tower 52 of the transfer block BL2, where it is cooled to approximately room temperature. Subsequently, the wafer W is transported by the transport device R7 to the transfer device 51 of the transfer tower 50 in the transfer block BL2. Then, the wafer W is returned to the cassette C on the cassette mounting table 20 by the transport device 23.

[0064] <Example 2 of wafer processing> In the wafer processing example 1 described above, the wafer W was subjected to development processing only once, and either wet development processing or dry development processing was performed on the wafer W. In wafer processing using wafer processing system 1, the wafer W may be subjected to development processing multiple times, in which case both wet development processing and dry development processing may be performed on the wafer W.

[0065] For example, if the development process is performed twice, the first development may be a wet process and the second a dry process, or vice versa. Furthermore, in this case, heat treatment may be performed before the first development process, between the first and second development processes (i.e., between the wet and dry development processes), or after the second development process.

[0066] Specifically, in the wafer processing system 1, the wafer W may be transported to an apparatus corresponding to the first development process where either a wet or dry development process is performed, and then transported to an apparatus corresponding to the second development process via the transport path 130 of the relay transport system 4 where either a wet or dry development process is performed. In this case, heat treatment may be performed in the heat treatment apparatus 40 of the wet processing system 2 at least one of the following times: between the wet development process and the dry development process before the first development process, or after the second development process. Whether or not this heat treatment is performed can be selected depending on the purpose.

[0067] <Main effects of this embodiment> In the wafer processing system 1, as described above, the wet processing system 2 is arranged such that the exposure apparatus E protrudes to the rear from the rear side of the wet processing system 2 (the positive X-direction side in Figure 1). Conventionally, when the wet processing system 2 is arranged in this manner, the space adjacent to the rear side of the wet processing system 2 in the depth direction, and the space between the rear side of the wet processing system 2 and the rear end of the maintenance area MA for the exposure apparatus in the width direction (Y-direction in Figure 1), was wasted space with no equipment or anything installed there. In contrast, in this embodiment, the dry processing system 3 is installed in the above space. A relay transport system 4 is provided to transport the wafer W between the dry processing system 3 and the wet processing system 2, making it possible to selectively or consecutively perform wet and dry photolithography processing (specifically, development processing). In this way, the wafer processing system 1 makes effective use of the space that was previously wasted, making it possible to selectively or consecutively perform wet and dry photolithography processing, thus achieving high productivity. In other words, according to this embodiment, a wafer processing system 1 that includes a wet processing system 2 and is connected to an exposure apparatus E can be provided, which is a highly productive system.

[0068] Furthermore, in this embodiment, whether the series of processes for forming a resist pattern, including exposure processing, includes wet photolithography processing or dry photolithography processing, the wafer W is processed in-line. That is, the wafer W is removed from the cassette C that is brought into the wafer processing system 1, the series of processes described above are performed, and then it is not transported out of the wafer processing system 1 until it is returned to the cassette C for transport outside the wafer processing system 1. To enable such in-line processing, the control device 5 manages the timing of the start of wafer W transport for the series of processes, the completion timing of each process in the series, the timing of returning the wafer W to the cassette C, etc. Therefore, the control device 5 can easily grasp the status of each process in the series and adjust the transport timing, regardless of whether the series of processes includes wet photolithography processing or dry photolithography processing.

[0069] Furthermore, in this embodiment, in the wet processing system 2, multiple developing devices 30 that perform wet developing are arranged along a transport path R1 that extends in the width direction (Y direction in Figure 1), and wafers W are transported between the wet processing system 2 and the dry processing system 3 via a transport path that extends in the depth direction (X direction in Figure 1), including the transport path 130 of the relay transport system 4. In other words, in this embodiment, the developing devices 30 that perform wet developing are arranged along the transport path R1 toward the exposure apparatus E, and when dry developing is performed, wafers W are transported from the transport path R1 in a direction perpendicular to the transport path R1. Therefore, whether wet or dry developing is performed, the transport path of wafers W is simple, resulting in good transport efficiency.

[0070] Furthermore, in this embodiment, one end of the transport path 130 of the relay transport system 4 is connected to the dry processing system 3, and the other end is not directly connected to the exposure apparatus E, but is connected to the exposure apparatus E via the wet processing system 2, which is generally kept under positive pressure relative to the exposure apparatus E. In other words, the dry processing system 3 and the exposure apparatus E are connected to each other via the wet processing system 2, which is kept under positive pressure relative to the exposure apparatus E. Since corrosive gases may be used in dry developing processes etc. in the dry processing system 3, connecting the dry processing system 3 and the exposure apparatus E as described above can suppress the entry of corrosive gases into the exposure apparatus E.

[0071] <Other examples of dry treatment systems> Figure 5 shows another example of a dry processing system. The configuration of the dry processing system is not limited to the examples shown in Figure 1, etc. For example, as in the dry processing system 3A in Figure 5, the vacuum transport chamber 120A may be formed in a rectangular shape when viewed from above, which is long in the direction of connection between the load lock station 100 and the processing station 101A. In this case, a plurality of processing devices 121 may be arranged in a line along the above connection direction. In this case, the transport arm 122Aa of the transport device 122A is configured to be movable, for example, in the direction of connection and around the vertical axis.

[0072] Furthermore, the connection direction between the load lock station 100 and the processing station 101A, and the connection direction between the wet processing system 2 and the exposure device E, may be parallel when viewed from above. The same applies to the dry processing system 3 shown in Figure 1, etc.

[0073] In the above example, a cooling device for cooling the wafer W after dry development was provided in the wet processing system 2, but the cooling device may also be provided in the dry processing system. If provided in the dry processing system, the cooling device is arranged to be connected to, for example, the load lock device 110. Furthermore, although the PEB treatment was performed in the wet treatment system 2 in the above example, it may also be performed in a dry treatment system. In this case, the PEB treatment may be performed in the treatment device 121, or in a heating device provided separately from the treatment device 121. Furthermore, when corrosive gases are used in the dry developing process, the dry processing system may be equipped with a heating device that removes the corrosive gases adhering to the wafer W during the dry developing process by heating. While this type of heating device can also be installed in the wet processing system 2, installing it in the dry processing system can suppress damage to the wet processing system 2 from the corrosive gases.

[0074] <Another example of the connection part of a relay transport system to a wet processing system 1> Figures 6 and 7 show other examples of connections between a wet processing system and a relay / transport system. In the above example, the relay transport system 4 was connected to a transfer block BL2, which is located further from the exposure device E than the processing block BL1 in the wet processing system 2. In contrast, in the examples of Figures 6 and 7, the connection point of the relay transport system 4A to the wet processing system 2A is the cassette station 10, although it is located further from the exposure device E than the processing block BL1. Specifically, the connection point of the transport path 130A of the relay transport system 4A to the wet processing system 2A is the processing station 11 side (positive side in the Y direction in Figure 6) of the cassette station 10.

[0075] In this example, the transfer tower 52 (see Figure 1) is omitted from the transfer block BL2A, and instead, a transfer box 24 is provided at the rear end (positive X direction in Figure 6) of the cassette station 10, on the processing station 11 side. The transfer box 24 has a plurality of transfer devices 25, for example, as shown in Figure 7. The transfer box 24 may also have a cooling device. In this example, the transport device 23 of the cassette station 10 can also transport wafers W to the transfer devices 25.

[0076] Furthermore, in this example, the transport device 131A located on the transport path 130A of the relay transport system 4A can hold the wafer W in the transport arm 131Aa and transport the wafer W between the transfer device 25 and the load lock device 110 of the transfer box 24.

[0077] The lower part of the cassette station 10 becomes a chemical chamber CH, which houses liquid bottles for storing the processing liquid used in the processing block BL1, etc. In this example, the relay transport system 4A may be positioned higher than the chemical chamber CH. This prevents the relay transport system 4A from interfering with worker operations in the chemical chamber, such as replacing the liquid bottles mentioned above.

[0078] <Other examples of wet processing systems> Figure 8 shows another example of a wet processing system. In the examples above, the processing station 11 of the wet processing systems 2 and 2A had only one processing block BL1. In contrast, the wet processing system 2B in Figure 8 has two processing blocks BL3 and BL4 arranged in the width direction (Y direction in the figure) of the processing station 11A, starting from the cassette station 10 side.

[0079] Processing blocks BL3 and BL4 are configured in substantially the same way as processing block BL1 shown in Figure 1, etc. Specifically, processing blocks BL3 and BL4 are configured, for example, on the front side On the negative X-direction side (Figure 8), multiple developing devices 30 and resist coating devices 31 are arranged in a row (for example, two) along the width direction (Y direction in the figure). In addition, in processing blocks BL3 and BL4, multiple heat treatment devices 40 are provided arranged in a row in the vertical direction and the width direction (Y direction in the figure), for example, on the back side (positive Y-direction side in Figure 8).

[0080] The number of developing devices 30 arranged in the width direction may be the same or different between processing block BL3 and processing block BL4. The same applies to the resist coating device 31 and the heat treatment device 40.

[0081] Furthermore, in processing blocks BL3 and BL4, transport paths R8 and R9 extending in the width direction are provided in the area between the part where liquid processing equipment such as the developing device 30 is installed and the part where the heat processing equipment 40 is installed. In processing blocks BL3 and BL4, multiple developing devices 30 and resist coating devices 31 are arranged along these transport paths R8 and R9 that extend in the width direction. Transport devices R10 and R11 for transporting wafers W are arranged in transport paths R8 and R9, respectively.

[0082] The transfer device R10 can transport wafers W to the surrounding liquid processing equipment, heat processing equipment 40, the transfer device 51 of the transfer tower 50, and the transfer device of the transfer tower 55 described later. The transfer device R11 can transport wafers W to the surrounding liquid processing equipment, heat processing equipment 40, the transfer device of the transfer tower 55 described later, and the transfer device 61 of the transfer tower 60.

[0083] Furthermore, processing station 11A has a relay block BL5 between processing block BL3 and processing block BL4.

[0084] The relay block BL5 has a transfer tower 55 located in the center in the depth direction (X direction in the diagram). Specifically, the transfer tower 55 is located in the transfer block BL2 between the transport path R8 of processing block BL3 and the transport path R9 of processing block BL4. Multiple transfer devices (not shown) are installed in the transfer tower 55 so as to overlap vertically.

[0085] In this example, the relay block BL5 may be connected to the relay transport system 4B, specifically, the transport path 130B of the relay transport system 4B may be connected to the relay block BL5. In other words, if the transport path 130B of the relay transport system 4B is connected to a part of the wet processing system 2B that is further from the exposure apparatus E than the processing block BL4, another processing block BL3 may exist in a part that is further from the exposure apparatus E than that part.

[0086] When the relay transport system 4 is connected to the relay block BL5, the transfer tower 52 (see Figure 1) is omitted from the transfer block BL2A, and instead, a transfer tower 56 is provided at the rear end (positive X direction in Figure 8) of the relay block BL5. The transfer tower 56 is equipped with multiple transfer devices (not shown) that overlap vertically. The transfer tower 56 may also have a cooling device. In this example, a transport device R12 is placed between the transfer tower 55 of the relay block BL5 and the transfer tower 56. The transport device R12 can transport wafers W between the multiple transfer devices of the transfer tower 55 and the multiple transfer devices of the transfer tower 56.

[0087] Furthermore, in this example, the transport device 131B located on the transport path 130B of the relay transport system 4B can hold the wafer W in the transport arm 131Ba and transport the wafer W between the transfer device and the load lock device 110 of the transfer tower 56.

[0088] <Another example of the connection portion of a relay transport system to a wet processing system 2> Figures 9 and 10 show other examples of connections between a relay and transport system and a wet processing system. As shown in Figures 9 and 10, the connection point of the relay transport system 4C to the wet processing system 2C may be an interface station 12A. Specifically, the connection point of the transport path 130C of the relay transport system 4C to the wet processing system 2C may be an interface station 12A.

[0089] In this example, the transfer device 64 is located at the rear end of the interface station 12A (the positive X-direction side in Figures 9 and 10). The transfer device 64 is located above the pre-exposure cleaning device 63, for example, as shown in Figure 10. In this example, the transport device R6 of the interface station 12 can also transport wafers W to the transfer device 64.

[0090] Furthermore, in this example, as shown in Figure 9, the transport path 130C extending in the depth direction (X direction in the figure) of the relay transport system 4C is equipped with a shuttle transport device 132, a transfer device 133, and a transport device 134 in order from the interface station 12 side along the depth direction when viewed from above.

[0091] As shown in Figure 10, the shuttle transport device 132 and the transfer device 133 are installed at the same height as the transfer device 64 of the interface station 12A, and the shuttle transport device 132 transports the wafer W between the transfer device 133 and the transfer device 64. The transport device 134 can transport the wafer W between the transfer device 133 and the load lock device 110 of the dry processing system 3A.

[0092] As the relay transport system 4C is configured as described above, the area in front of it (the negative X-direction side in Figure 10) corresponding to the pre-exposure cleaning device 63 is left empty. Therefore, it is possible to prevent the relay transport system 4C from interfering with the work (e.g., maintenance work) performed by an operator on the pre-exposure cleaning device 63. Note that the dry processing system in this example is not limited to the example shown in Figure 9, but may be configured as, for example, the dry processing system 3 in Figure 1.

[0093] (Second Embodiment) Figure 11 is an explanatory diagram illustrating the schematic internal configuration of a wafer processing system as a substrate processing system according to the second embodiment. In the first embodiment described using Figure 1, the relay transport system had only one transport path. In contrast, in this embodiment, as shown in Figure 11, the relay transport system 4D has two transport paths: a forward transport path 135 for transporting wafers W from the wet processing system 2 to the dry processing system 3, and a return transport path 136 for transporting wafers W from the dry processing system 3 to the wet processing system 2.

[0094] The transport path 135 is connected, for example, to the relay block BL5 of the processing station 11A of the wet processing system 2D. A transport device 137 is also located on the transport path 135. The transport device 137 can transport wafers W between the multiple transfer devices of the transfer tower 56 of the relay block BL5 and the load lock device 110 of the dry processing system 3B.

[0095] The transport return path 136 is connected, for example, to the transfer block BL2A ​​of the processing station 11A of the wet processing system 2D. A transport device 138 is also located on the transport return path 136. The transport device 138 can transport wafers W between the multiple transfer devices 53 of the transfer tower 52 of the transfer block BL2A, the cooling device 54, and the load lock device 123 of the dry processing system 3B, which will be described later.

[0096] In this embodiment, the dry processing system 3B includes a load lock device 110 through which the wafer W passes before the dry developing process, as well as a load lock device 123 through which the wafer W passes after the dry developing process.

[0097] The load lock device 110 is installed in the load lock station 100 of the dry processing system 3B and is positioned adjacent to the far side (positive X direction in the figure) of the forward transport path 135 of the relay transport system 4D. In contrast, the load lock device 123 is installed in the processing station 101B of the dry processing system 3B and is positioned between the vacuum transport chamber 120A of the processing station 101B and the return transport path 136 of the relay transport system 4D. In other words, the load lock device 123 is positioned adjacent to the near side (negative X direction in the figure) of the vacuum transport chamber 120A and adjacent to the far side (positive X direction in the figure) of the return transport path 136 of the relay transport system 4. In this example, the transport device 122A in the vacuum transport chamber 120A can also transport wafers W to the load lock device 123.

[0098] In this embodiment, the same main effects as described above in the first embodiment can be obtained. Furthermore, in this embodiment, the transport device within the wet processing system 2D involved in transporting from the wet processing system 2D to the dry processing system 3B is different from the transport device within the wet processing system 2D involved in transporting from the dry processing system 3B to the wet processing system. As a result, the production efficiency of processing in the wet processing system is high. In addition, the efficiency of parallel processing of wet development and dry development on separate wafers W is also high.

[0099] <Modified form of the second embodiment> Figure 12 is a diagram illustrating a modified example of the wafer processing system as a substrate processing system according to the second embodiment. In the example shown in Figure 11, the forward transport path 135 of the relay transport system 4D is connected to the relay block BL5 of the processing station 11A of the wet processing system 2D. However, as shown in Figure 12, the forward transport path 135A may be connected to the interface station 12A of the wet processing system 2E, similar to the transport path 130c shown in Figure 9.

[0100] In this case, the transport forward path 135 is provided with a shuttle transport device 132, a transfer device 133, and a transport device 134, similar to the transport path 130C shown in Figure 9.

[0101] (Third embodiment) Figure 13 is an explanatory diagram showing a schematic of the internal configuration of a wafer processing system as a substrate processing system according to the third embodiment. Figure 14 is a diagram showing the wafer processing system of Figure 13 as viewed from the cassette station side. In the first and second embodiments, the relay transport system transported wafers W in wafer units. In contrast, in this embodiment, the relay transport system 4E in Figures 13 and 14 transports wafers W in cassette units C. Specifically, the relay transport system 4E in Figures 13 and 14 transports wafers W between the wet processing system 2F and the dry processing system 3C in cassette units C. When processing in the dry processing system 3C is performed after some processing in the wet processing system 2F, the wafers W are stored in cassette units C on the cassette mounting table 20 of the wet processing system 2F, for example, after the processing to be performed in the wet processing system 2F is completed. Subsequently, the wafers W are transported to the dry processing system 3C in cassette units C, and processing in the dry processing system 3 is performed. After the processing in the dry processing system 3 is completed, the wafers W are returned to the wet processing system 2F, for example, in cassette units C.

[0102] The relay transport system 4E has a transport area 140 extending in the depth direction (X direction in the figure), as shown in Figure 13, for example, and a transport device 141 is provided in the transport area 140. The transport device 141 has, as shown in Figure 14, a multi-joint arm 142 configured to hold a cassette C, a column 143 that supports the multi-joint arm 142 so as to be movable in the vertical direction, and a rail 144 that supports the column 143 so as to be movable in the depth direction (X direction in the figure). The rail 144 is provided so as to extend along the depth direction (X direction in the figure).

[0103] In this embodiment, the dry processing system 3C has a cassette station 150 on the opposite side of the processing station 101 of the load lock station 100, where cassette C is loaded and unloaded.

[0104] The cassette station 150 has, for example, a cassette mounting platform 151 at one end in the width direction (the negative Y direction in Figure 13). Multiple mounting plates 152, for example two, are provided on the cassette mounting platform 151. The mounting plates 152 are arranged in a row in the depth direction (the X direction in Figure 1). Cassettes C can be placed on these mounting plates 152 when loading or unloading cassettes C to and from the outside of the dry processing system 3C.

[0105] Furthermore, the cassette station 150 is provided with a transport device 160 for transporting wafers W on the other side in the width direction (the positive Y direction in Figure 1). The transport device 160 can transport wafers W between the cassettes C on each mounting plate 152 and the load lock device 110. Furthermore, the dry processing system in this example is not limited to the examples shown in Figures 13 and 14. For example, the dry processing system may be one in which a cassette station 150 or equivalent is connected to the load lock station 100 of the dry processing system 3 in Figure 1, on the opposite side from the processing station 101.

[0106] <Other variations> In the above example, the process performed wet by the wet processing system and dry by the dry processing system was assumed to be a developing process. However, any process for photolithography is acceptable, such as the formation of a photolithography film like a resist film or the cleaning of the wafer W.

[0107] Furthermore, in the above example, the wafer W was transported to the dry processing system after processing in the wet processing system, and after the dry processing was completed, it was transported back into the wet processing system, thus completing the processing step. However, this is not limited to this example. For example, after the dry processing of the wafer W in the dry processing system is completed, the wafer W may be stored in a cassette placed on the dry processing system without being transported back into the wet processing system, thereby completing the preparation for transporting the wafer W to the outside.

[0108] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0109] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that will be apparent to those skilled in the art from the description herein, in addition to or instead of the effects described herein.

[0110] Furthermore, the following configuration examples also fall within the technical scope of this disclosure. (1) A wet processing apparatus having a wet processing apparatus that performs any of the substrate processing steps from the formation of a resist film on the substrate to the development of the resist film after exposure, and a wet processing system connected to an exposure apparatus, A dry processing system having a dry processing apparatus that performs the same type of substrate processing as the wet processing apparatus in a dry manner, The system includes a relay transport system for transporting substrates between the wet processing system and the dry processing system, The wet processing system is arranged such that, when viewed from the direction of connection between the wet processing system and the exposure apparatus, the exposure apparatus protrudes from one side in the depth direction perpendicular to the connection direction when viewed from above. The dry processing system is a substrate processing system arranged adjacent to one side of the wet processing system in the depth direction. (2) In the wet processing system, a plurality of wet processing devices are arranged so as to be aligned along a transport path extending in the connecting direction, The substrate processing system according to (1), wherein the substrate is transported between the wet processing system and the dry processing system via a transport path extending in the depth direction, which includes the transport path of the relay transport system. (3) The substrate processing system according to (1) or (2), wherein the relay transport system is connected to a portion of the wet processing system that is spaced apart from the exposure apparatus from the processing block including the wet processing apparatus. (4) The substrate processing system according to any one of (1) to (3), wherein the relay transport system is connected to a portion of the wet processing system that is closer to the exposure apparatus than the processing block including the wet processing apparatus. (5) The relay transport system includes a transport forward path for transporting substrates from the wet processing system to the dry processing system, and a transport return path for transporting substrates from the dry processing system to the wet processing system, A substrate processing system according to any one of (1) to (3), wherein the forward transport path and the return transport path are connected to different parts of the wet processing system. (6) The relay transport system includes a transport forward path for transporting substrates from the wet processing system to the dry processing system, and a return transport return path for transporting substrates from the dry processing system to the wet processing system, The substrate processing system according to (4), wherein the forward transport path and the return transport path are connected to different parts of the wet processing system. (7) The substrate processing system according to (6), wherein the transport return path is connected to a portion of the wet processing system that is spaced apart from the processing block and the exposure apparatus. (8) The relay transport system transports substrates in units of containers configured to accommodate multiple substrates, according to any one of (1) to (3) above. (9) The substrate processing system according to any one of (1) to (8), wherein the transport path of the relay transport system is connected at one end to the wet processing system and at the other end is not directly connected to the exposure apparatus but is connected to the exposure apparatus via the wet processing system. (10) A substrate processing method for performing substrate processing, The substrate processing is any of the processes from forming a resist film on the substrate to developing the resist film after exposure. A wet processing system having a wet processing apparatus that performs the aforementioned substrate processing in a wet manner, and a dry processing system having a dry processing apparatus that performs the same type of processing as the wet processing apparatus in a dry manner, are arranged adjacent to each other. A substrate processing method that selectively transports a substrate to either a wet processing apparatus or a dry processing apparatus. [Explanation of Symbols]

[0111] 1. Wafer Processing System 2, 2A, 2B, 2C, 2D, 2E, 2F Wet Processing System 3, 3A, 3B, 3C Dry Processing Systems 4, 4A, 4B, 4C, 4D, 4E Relay Transport System 30 Developing equipment 121 Processing Unit W wafer

Claims

1. A wet processing apparatus is provided that performs any of the substrate processing steps, from forming a resist film on a substrate to developing the resist film after exposure, and is connected to an exposure apparatus. A dry processing system having a dry processing apparatus that performs the same type of substrate processing as the wet processing apparatus in a dry manner, The system includes a relay transport system for transporting substrates between the wet processing system and the dry processing system, The wet processing system is arranged such that, when viewed from the direction of connection between the wet processing system and the exposure apparatus, the exposure apparatus protrudes from one side in the depth direction perpendicular to the connection direction when viewed from above. The dry processing system is a substrate processing system arranged adjacent to one side of the wet processing system in the depth direction.

2. In the wet processing system, a plurality of wet processing devices are arranged so as to be aligned along a transport path extending in the connecting direction. The substrate processing system according to claim 1, wherein the substrate is transported between the wet processing system and the dry processing system via a transport path extending in the depth direction, which includes the transport path of the relay transport system.

3. The substrate processing system according to claim 1 or 2, wherein the relay transport system is connected to a portion of the wet processing system that is spaced apart from the exposure apparatus from the processing block including the wet processing apparatus.

4. The substrate processing system according to claim 1 or 2, wherein the relay transport system is connected to a portion of the wet processing system that is closer to the exposure apparatus than the processing block including the wet processing apparatus.

5. The relay transport system includes a transport forward path for transporting substrates from the wet processing system to the dry processing system, and a transport return path for transporting substrates from the dry processing system to the wet processing system. The substrate processing system according to claim 1 or 2, wherein the forward transport path and the return transport path are connected to different parts of the wet processing system.

6. The relay transport system includes a transport forward path for transporting substrates from the wet processing system to the dry processing system, and a transport return path for transporting substrates from the dry processing system to the wet processing system. The substrate processing system according to claim 4, wherein the forward transport path and the return transport path are connected to different parts of the wet processing system.

7. The substrate processing system according to claim 6, wherein the transport return path is connected to a portion of the wet processing system that is spaced apart from the processing block and away from the exposure apparatus.

8. The substrate processing system according to claim 1 or 2, wherein the relay transport system transports substrates in units of containers configured to accommodate multiple substrates.

9. The substrate processing system according to claim 1 or 2, wherein the transport path of the relay transport system is connected at one end to the wet processing system and at the other end is connected to the exposure apparatus via the wet processing system without being directly connected to the exposure apparatus.

10. A substrate processing method for performing substrate processing, The substrate processing is any of the processes from forming a resist film on the substrate to developing the resist film after exposure. A wet processing apparatus having a wet processing apparatus for performing the aforementioned substrate processing in a wet manner, and connected to an exposure apparatus, is arranged such that, when viewed from the direction of connection between the wet processing apparatus and the exposure apparatus, the exposure apparatus protrudes from one side in the depth direction perpendicular to the connection direction when viewed from above. A dry processing system having a dry processing apparatus that performs the same type of processing as the wet processing apparatus in a dry manner is arranged adjacent to one side of the wet processing system in the depth direction, A substrate processing method that selectively transports a substrate to either a wet processing apparatus or a dry processing apparatus.

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