Method for manufacturing laminates, laminates, printed circuits, device circuits, and electrical and electronic equipment.

The method addresses the challenge of achieving high adhesion and temperature resistance in fluororesin-metal laminates by using high-frequency plasma treatment and surface treatments with triazine-based agents, resulting in laminates suitable for high-frequency electronic substrates.

JP7894647B2Inactive Publication Date: 2026-07-24IWATE UNIVERSITY
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
IWATE UNIVERSITY
Filing Date
2023-03-27
Publication Date
2026-07-24
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Conventional methods struggle to achieve high adhesion of metal films on fluororesins like PTFE while maintaining nano-level smoothness and high-temperature resistance required for high-frequency electronic substrates, as PTFE has low surface energy and is difficult to form composites with metals.

Method used

A method involving high-frequency plasma treatment with ammonia gas, optionally mixed with oxygen, followed by treatment with triazine-based molecular bonding agents and/or silane coupling agents, and electroless plating or metal foil bonding to create a laminate with fluororesins and metal films, ensuring high adhesion and temperature resistance.

Benefits of technology

The method produces a laminate with fluororesins and metal films that have high adhesion and maintain nano-level smoothness, achieving practical peel strengths and high-temperature resistance, suitable for high-frequency electronic substrates.

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Patent Text Reader

Abstract

To provide: a method for manufacturing a laminate of a fluorine resin and a metal (copper) film having high adhesion required for a practical level and high temperature resistance (260°C and 5 minutes) required when being used as an electronic substrate while maintaining smoothness of a nano-level; and a laminate of a fluorine resin and a metal (copper) film manufactured by the manufacturing method.SOLUTION: A method for manufacturing a laminate of a fluorine resin and a metal film includes: performing high frequency (RF) plasma treatment on a fluorine resin substrate while introducing ammonia gas thereto; Introducing a hydrophilic group into a surface of the fluorine resin substrate; treating the surface of the fluorine resin substrate by using a triazine-based molecular bonding agent; and then performing electroless plating treatment on the surface of the fluorine resin substrate.SELECTED DRAWING: None
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