Electronic devices and methods for manufacturing electronic devices

Abstract

SOLUTION: An electronic device that includes a first display area and a second display area located at a position different from the first display area in plan view, includes: a substrate; a plurality of first electrodes located on the substrate; a plurality of organic layers located on the first electrode; and a second electrode that is located on the organic layer and spreads out so as to overlap the plurality of first electrodes in a plan view. The second electrode located in the second display area has a plurality of openings formed at positions that do not overlap the first electrode in plan view, and is divided into a plurality of unit areas on the basis of the plurality of first electrodes, and the plurality of unit areas include an open area that includes an opening and a non-open area that does not include an opening.EFFECT: The intensity of diffracted light that occurs when light passes through an electronic device can be reduced.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] Embodiments of the present disclosure relate to an electronic device and a method for manufacturing an electronic device.

Background Art

[0002] Devices such as smartphones and tablet PCs require high-definition display devices. For example, a display device is required to have a pixel density of 400 ppi or more. There is also a demand for display devices corresponding to ultra-high definition (UHD). Such a display device may have a pixel density of, for example, 800 ppi or more.

[0003] An organic EL display device as an example of an electronic device has attracted attention due to its good responsiveness, low power consumption, and / or high contrast. As a method for forming pixels of an organic EL display device, a vapor deposition method is known. In the vapor deposition method, pixels and electrodes are formed in a desired pattern using a vapor deposition mask in which through holes are formed in a desired pattern. For example, first, a substrate on which a first electrode is formed in a pattern corresponding to pixels is prepared. Subsequently, an organic material is deposited on the first electrode using a vapor deposition mask to form a light-emitting layer. Then, a conductive material is deposited on the light-emitting layer to form a second electrode.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In electronic devices, regions where a second electrode is absent may be formed on the substrate. In these regions, light easily penetrates the electronic device. On the other hand, if these regions lacking a second electrode are arranged periodically, light diffraction can occur, potentially increasing the intensity of the diffracted light. [Means for solving the problem]

[0006] An electronic device according to one embodiment of the present disclosure includes a first display area and a second display area located at a different position from the first display area in a plan view. The electronic device comprises a substrate, a plurality of first electrodes located on the substrate, a plurality of organic layers located on the first electrodes, and a second electrode located on the organic layers and extending so as to overlap the plurality of first electrodes in a plan view. The second electrode located in the second display area has a plurality of openings formed at positions that do not overlap the first electrodes in a plan view, and is divided into a plurality of unit regions based on the plurality of first electrodes. The plurality of unit regions include opening regions that include openings and non-opening regions that do not include openings.

[0007] A method for manufacturing an electronic device according to one embodiment of the present disclosure is a method for manufacturing an electronic device including a first display area and a second display area located at a different position from the first display area in a plan view. The method for manufacturing an electronic device includes a preparation step of preparing a laminate including a substrate, a plurality of first electrodes located on the substrate, and a plurality of organic layers located on the first electrodes; a second electrode formation step of forming a second electrode on the organic layer so as to overlap the plurality of first electrodes in a plan view; and an aperture formation step of forming a plurality of apertures in the second electrode located in the second display area at positions that do not overlap the first electrode in a plan view. The second electrode located in the second display area is divided into a plurality of unit areas based on the plurality of first electrodes. The plurality of unit areas include aperture areas that include apertures and non-aperture areas that do not include apertures. [Effects of the Invention]

[0008] According to this disclosure, the intensity of diffracted light generated when light passes through an electronic device can be reduced. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing an example of an electronic device according to one embodiment of the present disclosure. [Figure 2] This is a plan view showing enlarged views of the first and second display areas in Figure 1. [Figure 3] This is a plan view showing an enlarged view of the second display area in Figure 2. [Figure 4] Figure 3 is a cross-sectional view along line AA. [Figure 5] Figure 3 is a cross-sectional view along line BB. [Figure 6] This is a plan view showing an enlarged version of Figure 3. [Figure 7] This is a cross-sectional view showing an enlarged version of Figure 4. [Figure 8] This is a cross-sectional view, further enlarged, as shown in Figure 7. [Figure 9] This is a cross-sectional view illustrating the method for calculating the average thickness of the second electrode. [Figure 10] This is a cross-sectional view illustrating the substrate preparation process for a method of manufacturing electronic devices. [Figure 11] Figure 10 is a plan view. [Figure 12] This is a cross-sectional view illustrating the organic layer formation process in a method for manufacturing electronic devices. [Figure 13] Figure 12 is a plan view. [Figure 14] This is a cross-sectional view illustrating the process of forming a first colored organic layer in the organic layer formation process of a method for manufacturing electronic devices. [Figure 15] This is a cross-sectional view illustrating the process of forming a second organic layer in the organic layer formation process of an electronic device manufacturing method. [Figure 16] This is a modified example of Figure 15. [Figure 17] This is a cross-sectional view illustrating the second electrode formation step in a method for manufacturing electronic devices. [Figure 18] This is a plan view of Figure 17. [Figure 19]It is a cross-sectional view for explaining an irradiation step of a method for manufacturing an electronic device. [Figure 20] It is a plan view showing a state in which an opening is formed in a second electrode in an irradiation step of a method for manufacturing an electronic device. [Figure 21] It is a plan view showing an example of a method for forming an opening by a laser in an irradiation step of a method for manufacturing an electronic device. [Figure 22] It is a diagram for explaining a laser including pulses used in an irradiation step of a method for manufacturing an electronic device. [Figure 23] It is a plan view showing an example of a first basic pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 24] It is a plan view showing an example of a second basic pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 25] It is a plan view showing an example of a second basic pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 26] It is a plan view showing an example of a third basic pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 27] It is a plan view showing an example of a block pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 28] It is a plan view showing an example of a block pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 29] It is a plan view showing an example of a block pattern constituting a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 30] It is a plan view showing a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 31] It is a plan view showing a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 32] It is a plan view showing a first display region and a second display region of an electronic device according to an embodiment of the present disclosure. [Figure 33] This is a cross-sectional view showing a second display area of ​​an electronic device according to one embodiment of the present disclosure. [Figure 34] This is a cross-sectional view showing an enlarged version of Figure 33. [Figure 35] This is a modified example of Figure 34. [Figure 36] This is a cross-sectional view illustrating the substrate preparation process for a method of manufacturing electronic devices. [Figure 37] This is a plan view of Figure 36. [Figure 38] This is a cross-sectional view illustrating the organic layer formation process in a method for manufacturing electronic devices. [Figure 39] This is a cross-sectional view illustrating the second electrode formation step in a method for manufacturing electronic devices. [Figure 40] This is a cross-sectional view illustrating the irradiation process in a method for manufacturing electronic devices. [Figure 41] This is a cross-sectional view showing a second display area of ​​an electronic device according to one embodiment of the present disclosure. [Figure 42] This is a modified example of Figure 41. [Figure 43] This is a cross-sectional view showing a second display area of ​​an electronic device according to one embodiment of the present disclosure. [Figure 44] This is a cross-sectional view illustrating the organic layer formation process in a method for manufacturing electronic devices. [Figure 45] This is a cross-sectional view illustrating the second electrode formation step in a method for manufacturing electronic devices. [Figure 46] This is a cross-sectional view illustrating the irradiation process in a method for manufacturing electronic devices. [Figure 47] This is a cross-sectional view illustrating the suppression layer formation process in a method for manufacturing electronic devices. [Figure 48] This is a cross-sectional view illustrating the second electrode formation step in a method for manufacturing electronic devices. [Figure 49] This is a plan view showing the second display area of ​​an electronic device according to a comparative example. [Figure 50] This is a plan view showing the second display area of ​​the electronic device according to the first embodiment. [Figure 51]This is a plan view showing the second display area of ​​an electronic device according to the second embodiment. [Figure 52] This is a plan view showing the second display area of ​​an electronic device according to the third embodiment. [Figure 53] This figure illustrates the method for evaluating diffraction in comparative examples and each embodiment. [Figure 54] This figure shows the evaluation results of the projection patterns in the comparative example. [Figure 55] This figure shows the evaluation results of the projection pattern in the first embodiment. [Figure 56] This figure shows the evaluation results of the projection pattern in the second embodiment. [Figure 57] This figure shows the evaluation results of the projection pattern in the third embodiment. [Figure 58] This figure shows the results of extracting the intensity of diffracted light along the fourth direction in the comparative example and the first to third examples. [Figure 59] This figure shows the results of extracting the peak intensity of the diffracted light from Figure 58. [Figure 60] Figure 58 shows the result of integrating the peak intensities of the diffracted light for each predetermined area. [Figure 61] This figure shows the results of extracting the peak intensity of the diffracted light from Figure 60 and converting it to dB. [Figure 62] This figure shows the diffraction evaluation results for the comparative example and the first to third examples. [Figure 63] This is a plan view showing the second display area of ​​an electronic device according to the fourth embodiment. [Figure 64] This is a plan view showing the second display area of ​​an electronic device according to the fifth embodiment. [Figure 65] This is a plan view showing the second display area of ​​an electronic device according to the sixth embodiment. [Figure 66] This is a plan view showing the second display area of ​​the electronic device according to the seventh embodiment. [Figure 67] This is a plan view showing the second display area of ​​an electronic device, based on an example. [Figure 68]This figure shows the diffraction evaluation results for the 4th to 7th examples and the reference example. [Figure 69] This figure shows the relationship between the percentage of unopened areas and the maximum peak intensity. [Figure 70] This figure shows the relationship between the unopened percentage and the average total dB value. [Modes for carrying out the invention]

[0010] In this specification and these drawings, unless otherwise specified, terms such as "substrate," "base material," "plate," "sheet," and "film," which refer to a material that forms the basis of a certain structure, are not distinguished from one another solely by differences in designation.

[0011] In this specification and these drawings, unless otherwise specified, terms that define shape and geometric conditions and their degree, such as "parallel" and "orthogonal," as well as values ​​of lengths and angles, should be interpreted not strictly, but to include a range that allows for the expectation of similar functionality.

[0012] In this specification and these drawings, unless otherwise specified, when a component or region is described as being "on top of," "below," "upper side," "lower side," or "upward" or "downward" of another component or region, this includes cases where one component is in direct contact with another. Furthermore, it also includes cases where another component is included between one component and another, i.e., where they are indirectly in contact. Unless otherwise specified, the terms "on top," "upper side," or "upward," or "down," "lower side," or "downward," may be used in reverse order of their vertical direction.

[0013] In this specification and these drawings, unless otherwise specified, identical or similarly functioning parts are denoted by the same or similar reference numerals, and repeated descriptions may be omitted. Dimensional ratios in the drawings may differ from actual ratios for illustrative purposes, and some components may be omitted from the drawings.

[0014] Unless otherwise specified in this specification and these drawings, one embodiment of this specification may be combined with other embodiments to the extent that it does not conflict with the other embodiments. Other embodiments may also be combined with each other to the extent that it does not conflict with the other embodiments.

[0015] In this specification and these drawings, unless otherwise specified, when multiple steps are disclosed regarding a method such as a manufacturing method, other steps not disclosed may be performed between the disclosed steps. The order of the disclosed steps is arbitrary as long as it does not cause inconsistency.

[0016] In this specification and these drawings, unless otherwise specified, the range represented by the symbol "~" includes the numerical values ​​placed before and after the symbol "~".

[0017] The first aspect of this disclosure is, An electronic device comprising a first display area and a second display area located at a different position from the first display area in a plan view, circuit board and A plurality of first electrodes located on the substrate, Multiple organic layers located on the first electrode, The system comprises a second electrode located on the organic layer and extending so as to overlap the plurality of first electrodes in a plan view, The second electrode located in the second display area has multiple openings formed in positions that do not overlap with the first electrode in a plan view, and is divided into multiple unit areas based on the multiple first electrodes. The plurality of unit regions are electronic devices that include an opening region containing the opening and a non-opening region that does not contain the opening.

[0018] A second aspect of this disclosure relates to an electronic device according to the first aspect described above, The unit region may be demarcated by a rectangle formed by connecting the center points of four adjacent first electrodes.

[0019] A third aspect of this disclosure relates to an electronic device according to the first aspect described above, The ratio of the number of non-opening regions to the number of unit regions may be 5% or more and 95% or less.

[0020] A fourth aspect of this disclosure relates to an electronic device according to the third aspect described above, The ratio of the number of non-opening regions to the number of unit regions may be 10% or more and 80% or less.

[0021] A fifth aspect of this disclosure relates to an electronic device according to the first aspect described above, The plurality of first electrodes include a plurality of first color electrodes, a plurality of second color electrodes, and a plurality of third color electrodes. The plurality of organic layers include a plurality of first-color organic layers located on the first color electrode, a plurality of second-color organic layers located on the second color electrode, and a plurality of third-color organic layers located on the third color electrode. The first color electrode and the second color electrode are arranged alternately along the first direction and alternately along the second direction perpendicular to the first direction. The third color electrode may be arranged along the first direction such that it is positioned between the first color electrode and the second color electrode in the first direction, and also arranged along the second direction such that it is positioned between the first color electrode and the second color electrode in the second direction.

[0022] A sixth aspect of this disclosure relates to an electronic device according to the fifth aspect described above, The unit region may be demarcated by a rectangle formed by connecting the center point of one first color electrode, the center point of one second color electrode, and the center points of two third color electrodes in four adjacent first electrodes.

[0023] A seventh aspect of this disclosure relates to an electronic device according to the fifth aspect described above, The second display area is divided into a plurality of basic patterns, each including one first color electrode or one second color electrode and one third color electrode. The plurality of basic patterns include two or more basic patterns among a first basic pattern including two openings, a second basic pattern including one opening, and a third basic pattern not including an opening. In the second display area, any two or more of the basic patterns may be arranged regularly along the first and second directions.

[0024] The eighth aspect of this disclosure relates to an electronic device according to the seventh aspect described above, The multiple basic patterns include the first basic pattern and the second basic pattern, In the second display area, the first basic pattern and the second basic pattern may be arranged regularly along the first and second directions.

[0025] A ninth aspect of this disclosure relates to an electronic device according to the seventh aspect described above, The multiple basic patterns include the first basic pattern, the second basic pattern, and the third basic pattern, In the second display area, the first basic pattern, the second basic pattern, and the third basic pattern may be arranged regularly along the first and second directions.

[0026] A tenth aspect of this disclosure relates to an electronic device according to the fifth aspect described above, The second display area is divided into a plurality of basic patterns, each including one first color electrode or one second color electrode and one third color electrode. The plurality of basic patterns include a second basic pattern which includes one of the openings, In the second display area, the second basic pattern may be arranged along the first and second directions.

[0027] An eleventh aspect of this disclosure relates to an electronic device according to the first aspect described above, The organic layer may include an organic layer opening that overlaps the opening in a plan view.

[0028] A twelfth aspect of this disclosure relates to an electronic device according to the first aspect described above, The substrate comprises an insulating layer located between the substrate and the organic layer in the direction normal to the substrate, The insulating layer may include a first insulating layer opening that overlaps the first electrode in a plan view.

[0029] A thirteenth aspect of this disclosure relates to an electronic device according to the twelfth aspect described above, The insulating layer may include a second insulating layer opening that overlaps the opening in a plan view.

[0030] A fourteenth aspect of this disclosure is: A method for manufacturing an electronic device, comprising a first display area and a second display area located at a different position from the first display area in a plan view, A preparation step of preparing a laminate comprising a substrate, a plurality of first electrodes located on the substrate, and a plurality of organic layers located on the first electrodes, A second electrode formation step involves forming a second electrode on the organic layer so as to overlap a plurality of first electrodes in a plan view, The process includes forming an aperture in the second electrode located in the second display area, at a position that does not overlap with the first electrode in a plan view, The second electrode located in the second display area is divided into multiple unit areas based on the multiple first electrodes, A method for manufacturing an electronic device, wherein a plurality of the aforementioned unit regions include an opening region containing the opening and a non-opening region not containing the opening.

[0031] A fifteenth aspect of this disclosure relates to a method for manufacturing an electronic device according to the fourteenth aspect described above, The opening formation step may include a removal step in which the opening is formed by removing a portion of the second electrode.

[0032] A sixteenth aspect of this disclosure relates to a method for manufacturing an electronic device according to the fifteenth aspect described above, The removal step may include an irradiation step in which a laser is irradiated onto the second electrode to form the aperture.

[0033] A 17th aspect of this disclosure relates to a method for manufacturing an electronic device according to the 14th aspect described above, Prior to the second electrode formation step, the method may include a suppression layer formation step in which a suppression layer is formed to suppress the formation of the second electrode at the location where the opening is formed on the substrate.

[0034] Hereinafter, one embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is merely one example of the embodiments of the present disclosure, and the present disclosure shall not be construed as being limited to these embodiments only.

[0035] An electronic device 10 and a method for manufacturing the same according to one embodiment of the present disclosure will be described with reference to Figures 1 to 22.

[0036] First, let's describe the configuration of the electronic device 10.

[0037] Figure 1 is a plan view showing an example of an electronic device 10. Figure 1 is a view of an electronic device 10 according to one embodiment of the present disclosure, as seen along the direction normal to the substrate 15 of the electronic device 10. In the following description, viewing along the direction normal to the surface of a base material such as a substrate is also referred to as a plan view. The outer edge of the electronic device 10 may include an edge extending in a first direction D1 and an edge extending in a second direction D2. The second direction D2 may be a direction perpendicular to the first direction D1.

[0038] The electronic device 10 includes a first display area 101 and a second display area 102. The second display area 102 is located at a different position from the first display area 101 in a plan view. The second display area 102 may have a smaller area than the first display area 101. As shown in Figure 1, the second display area 102 may be surrounded by the first display area 101. Although not shown, a portion of the outer edge of the second display area 102 may be collinear with a portion of the outer edge of the first display area 101.

[0039] Figure 2 is a plan view showing an enlarged view of the second display area 102 and its surroundings in Figure 1. In the first display area 101 and the second display area 102, the multiple elements 20 may be arranged along two different directions. For example, the multiple elements 20 located in the first display area 101 may be arranged along the first direction D1 with an 11th period P11 and along the second direction D2 with a 21st period P21. For example, the multiple elements 20 located in the second display area 102 may be arranged along the first direction D1 with a 12th period P12 and along the second direction D2 with a 22nd period P22. The 12th period P12 may be the same as the 11th period P11. The 22nd period P22 may be the same as the 21st period P21.

[0040] Element 20 is, for example, a pixel. If element 20 is a pixel, the image is displayed in the first display area 101 and the second display area 102.

[0041] The element 20 includes a second electrode 50. The second electrode 50 located in the first display area 101 is also referred to as the second electrode 50X. The second electrode 50 located in the second display area 102 is also referred to as the second electrode 50Y.

[0042] The second electrode 50X has a first occupancy ratio. The first occupancy ratio is calculated by dividing the total area of ​​the second electrodes 50 located in the first display area 101 by the area of ​​the first display area 101. The second electrode 50Y has a second occupancy ratio. The second occupancy ratio is calculated by dividing the total area of ​​the second electrodes 50 located in the second display area 102 by the area of ​​the second display area 102. The second occupancy ratio may be smaller than the first occupancy ratio. For example, as will be described later, a plurality of openings 51 may be formed in the second electrode 50Y.

[0043] The ratio of the second market share to the first market share may be, for example, 0.05 or greater, 0.1 or greater, or 0.2 or greater. The ratio of the second market share to the first market share may be, for example, 0.5 or less, 0.8 or less, or 0.95 or less. The range of the ratio of the second market share to the first market share may be determined by a first group consisting of 0.05, 0.1 and 0.2, and / or a second group consisting of 0.5, 0.8 and 0.95. The range of the ratio of the second market share to the first market share may be determined by a combination of any one value from the first group and any one value from the second group. The range of the ratio of the second market share to the first market share may be determined by a combination of any two values ​​from the first group. The range of the ratio of the second market share to the first market share may be determined by a combination of any two values ​​from the second group. For example, it may be 0.05 or more and 0.95 or less, 0.05 or more and 0.8 or less, 0.05 or more and 0.5 or less, 0.05 or more and 0.2 or less, 0.05 or more and 0.1 or less, 0.1 or more and 0.95 or less, 0.1 or more and 0.8 or less, 0.1 or more and 0.5 or less, 0.1 or more and 0.2 or less, 0.2 or more and 0.95 or less, 0.2 or more and 0.8 or less, 0.2 or more and 0.5 or less, 0.5 or more and 0.95 or less, 0.5 or more and 0.8 or less, and 0.8 or more and 0.95 or less.

[0044] When the second occupancy rate is smaller than the first occupancy rate, the second display area 102 has a higher transmittance than the first display area 101. In this case, in the second display area 102, light reaching the electronic device 10 can easily reach optical components, etc., located on the back side of the substrate 15. Optical components are components that perform some function by detecting light. Examples of optical components include cameras, fingerprint sensors, facial recognition sensors, and other sensors.

[0045] In this embodiment, elements 20 that can function as pixels are arranged not only in the first display area 101 but also in the second display area 102. Therefore, the second display area 102 can detect light and display images.

[0046] The second electrode 50X may extend over almost the entire area of ​​the first display area 101. For example, the first occupancy rate may be 90% or more, 95% or more, 98% or more, 99% or more, 99.5% or more, 99.9% or more, or 100%.

[0047] Figure 3 is a plan view showing an example of the second display area 102. Figure 4 is a cross-sectional view of the second display area 102 of Figure 3, viewed along line AA. Figure 5 is a cross-sectional view of the second display area 102 of Figure 3, viewed along line BB. The electronic device 10 includes a substrate 15, a plurality of first electrodes 30, a plurality of organic layers 40, and a second electrode 50. The substrate 15 includes a first surface 16 and a second surface 17. The second surface 17 is located on the opposite side of the first surface 16.

[0048] Multiple first electrodes 30 may be located on the first surface 16 of the substrate 15. Multiple organic layers 40 may be located on the first electrodes 30. The second electrode 50 may be located on the organic layers 40. The second electrode 50 may extend so as to overlap the multiple first electrodes 30 in a plan view. The element 20 may be composed of a laminated structure including the first electrodes 30, the organic layers 40, and the second electrode 50. The element 20 can perform some function by applying a voltage between the first electrode 30 and the second electrode 50, or by allowing a current to flow between the first electrode 30 and the second electrode 50. The elements 20 may be arranged on the first surface 16 along the in-plane direction of the first surface 16.

[0049] The electronic device 10 may be an active-matrix type. For example, although not shown in the figures, the electronic device 10 may include switches electrically connected to each of the multiple elements 20. The switches are, for example, transistors. The switches can control the ON / OFF state of the voltage applied to the elements 20 or the current flowing through the elements 20.

[0050] The multiple organic layers 40 may include multiple first-color organic layers 40A, multiple second-color organic layers 40B, and multiple third-color organic layers 40C. The first-color organic layer 40A may be, for example, a red light-emitting layer. The second-color organic layer 40B may be, for example, a blue light-emitting layer. The third-color organic layer 40C may be, for example, a green light-emitting layer. When describing a configuration common to the first-color organic layer 40A, the second-color organic layer 40B, and the third-color organic layer 40C, the term and symbols "organic layer 40" will be used.

[0051] The multiple first electrodes 30 may include multiple first color electrodes 30A, multiple second color electrodes 30B, and multiple third color electrodes 30C. The first color electrode 30A overlaps the first color organic layer 40A in a plan view. That is, the first color organic layer 40A is located on the first color electrode 30A. The second color electrode 30B overlaps the second color organic layer 40B in a plan view. That is, the second color organic layer 40B is located on the second color electrode 30B. The third color electrode 30C overlaps the third color organic layer 40C in a plan view. That is, the third color organic layer 40C is located on the third color electrode 30C. When describing a configuration common to the first color electrode 30A, the second color electrode 30B, and the third color electrode 30C, the term and symbol "first electrode 30" will be used.

[0052] The multiple elements 20 may include multiple first elements 20A, multiple second elements 20B, and multiple third elements 20C. The first element 20A includes a first color electrode 30A, a first color organic layer 40A, and a second electrode 50. The second element 20B includes a second color electrode 30B, a second color organic layer 40B, and a second electrode 50. The third element 20C includes a third color electrode 30C, a third color organic layer 40C, and a second electrode 50. When describing a configuration common to the first element 20A, the second element 20B, and the third element 20C, the term and reference numeral "element 20" shall be used.

[0053] The first element 20A and the second element 20B may be arranged alternately along the first direction D1 and the second direction D2. That is, the first color electrode 30A included in the first element 20A and the second color electrode 30B included in the second element 20B may be arranged alternately along the first direction D1 and alternately along the second direction D2. Also, the first color organic layer 40A included in the first element 20A and the second color organic layer 40B included in the second element 20B may be arranged alternately along the first direction D1 and alternately along the second direction D2. The third element 20C may be arranged along the first direction D1 and the second direction D2 so as to be located between the first element 20A and the second element 20B. In other words, the third color electrode 30C included in the third element 20C may be arranged along the first direction D1 so as to be located between the first color electrode 30A and the second color electrode 30B in the first direction D1, and also along the second direction D2 so as to be located between the first color electrode 30A and the second color electrode 30B in the second direction D2. Similarly, the third color organic layer 40C included in the third element 20C may be arranged along the first direction D1 so as to be located between the first color organic layer 40A and the second color organic layer 40B in the first direction D1, and also along the second direction D2 so as to be located between the first color organic layer 40A and the second color organic layer 40B in the second direction D2. Such an arrangement of elements 20 is also called a pentile arrangement.

[0054] The substrate 15, the first electrode 30, the organic layer 40, and the second electrode 50 will be described in more detail.

[0055] The substrate 15 may be a plate-shaped member having insulating properties. The substrate 15 may also be light-transmitting. For example, the substrate 15 may be a glass substrate. Although not shown in the figures, a wiring layer may be located between the substrate 15 and the element 20. The wiring layer can transmit electrical signals, power, etc., to the element 20.

[0056] The transmittance of the substrate 15 may be, for example, 70% or more, or 80% or more. The transmittance of the substrate 15 is measured by the test method for total light transmittance of transparent plastic materials in accordance with JIS K7361-1.

[0057] The substrate 15 may or may not be flexible. The material of the substrate 15 may be appropriately selected depending on the application of the electronic device 10. As the material of the substrate 15, for example, rigid materials that do not allow flexibility such as quartz glass, Pyrex® glass, synthetic quartz plate, alkali-free glass, or flexible materials that allow flexibility such as resin film, optical resin plate, thin glass, etc., can be used. The substrate 15 may also be a laminate having a barrier layer on one or both sides of a resin film.

[0058] The thickness of the substrate 15 may be appropriately selected depending on the material used for the substrate 15 and the application of the electronic device 10. The thickness of the substrate 15 may be, for example, 0.005 mm or more. The thickness of the substrate 15 may be, for example, 5 mm or less.

[0059] The first electrode 30 contains a conductive material. For example, the first electrode 30 may contain a metal, a conductive metal oxide, or other inorganic material. The first electrode 30 may contain a conductive metal oxide such as indium tin oxide. As the material for the first electrode 30, indium tin oxide, referred to as ITO, indium zinc oxide, referred to as IZO, etc., may be used.

[0060] The organic layer 40 contains an organic material. When the organic layer 40 is energized, it can perform some function. Energization means that a voltage is applied to the organic layer 40 or that an electric current flows through the organic layer 40. The organic layer 40 can be an emissive layer that emits light when energized, or a layer whose light transmittance or refractive index changes when energized. The organic layer 40 may also contain an organic semiconductor material. The organic layer 40 may further contain a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, or the like.

[0061] The second electrode 50 contains a conductive material such as a metal. Platinum, gold, silver, copper, iron, tin, chromium, aluminum, indium, lithium, sodium, potassium, calcium, magnesium, chromium, carbon, etc., can be used as the material for the second electrode 50. These conductive materials may be used individually or in combination of two or more types. When two or more materials are used, layers made of each material may be laminated. An alloy containing two or more materials may also be used as the conductive material.

[0062] Next, we will explain the opening 51 in more detail.

[0063] As shown in Figures 3 to 6, the second electrode 50 located in the second display area 102 has a plurality of openings 51 formed in positions that do not overlap with the first electrode 30 in a plan view. The openings 51 may be surrounded by the second electrode 50 in a plan view. The openings 51 may be located between two adjacent first electrodes 30 in a plan view. For example, the openings 51 may be located between two adjacent first electrodes 30 in a first direction D1. For example, the openings 51 may be located between two adjacent first electrodes 30 in a second direction D2.

[0064] Because multiple apertures 51 are formed in the second electrode 50, light can more easily pass through the electronic device 10 compared to when the second electrode 50 extends across the entire second display area 102. This makes it possible to increase the transmittance of the second display area 102.

[0065] As shown in Figures 3 to 6, the organic layer 40 may include an organic layer aperture 41 that overlaps the aperture 51 in a plan view. The organic layer aperture 41 may be located between two adjacent first electrodes 30 in a first direction D1, similar to the aperture 51. The organic layer aperture 41 may be located between two adjacent first electrodes 30 in a second direction D2, similar to the aperture 51.

[0066] Here, we will explain the problems that may arise when multiple apertures 51 are formed in the second electrode 50. When multiple apertures 51 are arranged periodically, it is conceivable that the light diffracted as it passes through the apertures 51 may reinforce each other in a specific direction of light propagation. In this case, the clarity of the image generated by the optical component overlapping the second display area 102 may decrease.

[0067] To solve these problems, this embodiment proposes reducing the regularity of the arrangement of the multiple apertures 51. This suppresses the incidence of diffracted light with high intensity onto optical components such as sensors. As a result, for example, blurring of images generated by the sensor can be suppressed.

[0068] First, let's explain the unit region 57. Figure 6 is a plan view showing an enlarged version of Figure 3. In Figure 6, for the sake of clarity, the organic layer 40 and the second electrode 50 have been removed from Figure 3, and the first electrode 30 and the opening 51 are shown.

[0069] The second electrode 50 located in the second display area 102 is divided into multiple unit areas 57 based on a plurality of first electrodes 30. The unit areas 57 may be polygons defined by boundary lines 58 connecting the center points of the first electrodes 30. For example, the unit areas 57 may be divided by a quadrilateral obtained by connecting the center points of four adjacent first electrodes 30. Here, the four adjacent first electrodes 30 refer to four first electrodes 30 that are adjacent to one first electrode 30 in a first direction D1, second direction D2, third direction D3, or fourth direction D4. The third direction D3 and the fourth direction D4 are directions that intersect the first direction D1 and the second direction D2, respectively. As shown in Figure 6, the third direction D3 may be a direction inclined at 45 degrees with respect to the first direction D1 and the second direction D2, respectively. The fourth direction D4 is a direction that is inclined at 45 degrees with respect to the first direction D1 and the second direction D2, and may also be a direction perpendicular to the third direction D3.

[0070] For example, as shown in Figure 6, the unit region 57 may be demarcated by a rectangle obtained by connecting the center point of one first color electrode 30A, the center point of one second color electrode 30B, and the center points of two third color electrodes 30C in four adjacent first electrodes 30. Here, the one first color electrode 30A and the one second color electrode 30B are adjacent in the first direction D1 or the second direction D2. The one first color electrode 30A and one of the two third color electrodes 30C are adjacent in the third direction D3. The one first color electrode 30A and the other of the two third color electrodes 30C are adjacent in the fourth direction D4.

[0071] As shown in Figure 6, the multiple unit regions 57 include an opening region 57A that includes an opening 51 and a non-opening region 57B that does not include an opening 51. In other words, the unit region 57 is classified into an opening region 57A where an opening 51 is formed and a non-opening region 57B where an opening 51 is not formed. To put it another way, as shown in Figures 3, 4, and 6, there is a region (opening region 57A) where an opening 51 is formed between two adjacent first electrodes 30 in the first direction D1 or the second direction D2, but as shown in Figures 3, 5, and 6, there is also a region (non-opening region 57B) where an opening 51 is not formed between two adjacent first electrodes 30 in the first direction D1 or the second direction D2.

[0072] As shown in Figure 6, one opening 51 may be formed in one opening region 57A. Although not shown, two or more openings 51 may be formed in one opening region 57A.

[0073] As shown in Figure 6, in a plan view, the center point of the aperture 51 and the center point of the aperture region 57A may coincide. Here, the center point of the aperture 51 is the centroid of the aperture 51 in a plan view. The centroid of the aperture 51 is calculated by analyzing the image of the second display region 102 generated based on the light reflected by the electronic device 10. The center point of the aperture region 57A is defined as the intersection of the two diagonals of the rectangle that constitutes the aperture region 57A. Although not shown in the figure, in a plan view, the center point of the aperture 51 and the center point of the aperture region 57A may be offset.

[0074] The open area 57A and the non-open area 57B may be arranged across the entire second display area 102. The arrangement of the open area 57A and the non-open area 57B is arbitrary. As shown in Figures 2, 3, and 6, the open area 57A and the non-open area 57B may be arranged randomly.

[0075] When all unit regions 57 are aperture regions 57A, the arrangement of the multiple apertures 51 is highly regular, and the diffracted light tends to reinforce each other. In contrast, by including non-aperture regions 57B that do not contain apertures 51 in the unit region 57, the regularity of the arrangement of the multiple apertures 51 can be reduced. Therefore, it is possible to suppress the incidence of diffracted light with high intensity on optical components such as sensors.

[0076] The ratio of the number of non-opening regions 57B to the number of unit regions 57 may be, for example, 5% or more, 10% or more, or 20% or more. The ratio of the number of non-opening regions 57B to the number of unit regions 57 may be, for example, 50% or less, 80% or less, or 95% or less. The range of the ratio of the number of non-opening regions 57B to the number of unit regions 57 may be determined by a first group consisting of 5%, 10%, and 20%, and / or a second group consisting of 50%, 80%, and 95%. The range of the ratio of the number of non-opening regions 57B to the number of unit regions 57 may be determined by a combination of any one value included in the first group and any one value included in the second group. The range of the ratio of the number of non-opening regions 57B to the number of unit regions 57 may be determined by a combination of any two values ​​included in the first group. The range of the ratio of the number of non-opening regions 57B to the number of unit regions 57 may be determined by any two combinations of values ​​included in the second group described above. For example, it may be 5% or more and 95% or less, 5% or more and 80% or less, 5% or more and 50% or less, 5% or more and 20% or less, 5% or more and 10% or less, 10% or more and 95% or less, 10% or more and 80% or less, 10% or more and 50% or less, 10% or more and 20% or less, 20% or more and 95% or less, 20% or more and 80% or less, 20% or more and 50% or less, 50% or more and 95% or less, 50% or more and 80% or less, and 80% or more and 95% or less.

[0077] The number of unit regions 57 and the number of non-aperture regions 57B are measured over the entire area of ​​the second display region 102. The number of unit regions 57 can be calculated from the number of first electrodes 30 located in the second display region 102. The number of non-aperture regions 57B can be calculated by subtracting the number of aperture regions 57A from the number of unit regions 57. The number of aperture regions 57A can be calculated by analyzing the image of the second display region 102 generated based on the light reflected by the electronic device 10. The number of aperture regions 57A can be calculated by counting the number of apertures 51 identified based on the difference between the reflectance of light in the area overlapping with the first electrode 30, the second electrode 50, etc., and the reflectance of light in the area overlapping with the aperture 51.

[0078] In Figures 2, 3, 6, and Figures 23 to 32 (described later), as well as in the embodiments described later, the first electrode 30, organic layer 40, and opening 51 are circular in shape in a plan view in order to clearly explain the technical concept of this embodiment. However, the shape of the first electrode 30, organic layer 40, and opening 51 is not limited to a circle. In the other drawings, the first electrode 30, organic layer 40, and opening 51 are rectangular with curved corners.

[0079] Next, the cross-sectional structure of the second electrode 50 will be described.

[0080] Figure 7 is a cross-sectional view showing an enlarged view of Figure 4. The second electrode 50 includes a side surface 52 facing the opening 51. Similarly, the organic layer 40 includes a side surface 42 facing the organic layer opening 41. As shown in Figure 7, the upper end 43 of the side surface 42 of the organic layer 40 may be in contact with the lower end 54 of the side surface 52 of the second electrode 50. Such a relationship between the side surfaces 42 and 52 can be achieved when the organic layer opening 41 and the opening 51 are formed by laser processing.

[0081] Figure 8 is a cross-sectional view showing a further enlargement of Figure 7. As shown in Figures 7 and 8, the upper end 53 of the side surface 52 of the second electrode 50 may be raised compared to the surrounding second electrode 50. Such a raised surface can occur when the second electrode 50 melts during laser processing. The raised upper end 53 of the side surface 52 of the second electrode 50 increases the height of the side surface 52 of the second electrode 50. This allows the electrical resistance of the second electrode 50 to be lowered.

[0082] In Figures 7 and 8, the symbol t1 represents the height of the side surface 52 of the second electrode 50. The symbol t2 represents the average thickness of the region of the second electrode 50 that overlaps with the first electrode 30 in a plan view. The height t1 is the distance between the upper end 53 and the lower end 54 of the side surface 52 in the direction normal to the first surface 16 of the substrate 15. The height t1 of the side surface 52 and the thickness of the second electrode 50 are calculated based on a cross-sectional image of the electronic device 10. The cross-sectional image is obtained by observing the cross-section of the electronic device 10 using a scanning electron microscope.

[0083] Referring to Figure 9, the method for calculating the average thickness t2 of the second electrode 50 will be explained. The average thickness t2 is calculated by averaging thicknesses t21, t22, and t23. Thickness t21 is the thickness of the second electrode 50 that coincides with the center position of the first electrode 30 in the in-plane direction of the first surface 16. In Figure 9, the straight line passing through the center position of the first electrode 30 and extending in the direction normal to the substrate 15 is represented by the symbol Lc. Thicknesses t22 and t23 are the thicknesses of the second electrode 50 at an intermediate position between the end 31 of the first electrode 30 and the straight line Lc in the in-plane direction of the first surface 16.

[0084] The height t1 of the side surface 52 may be greater than the average value t2 of the thickness of the second electrode 50. That is, t1 / t2 may be greater than 1.0. t1 / t2 may be, for example, 1.1 or greater, 1.2 or greater, 1.3 or greater, or 1.4 or greater. t1 / t2 may be, for example, 1.5 or less, 1.6 or less, 1.8 or less, or 2.0 or less. The range of t1 / t2 may be defined by a first group consisting of 1.1, 1.2, 1.3 and 1.4, and / or a second group consisting of 1.5, 1.6, 1.8 and 2.0. The range of t1 / t2 may be defined by a combination of any one value from the first group and any one value from the second group. The range of t1 / t2 may be defined by a combination of any two values ​​from the first group. The range of t1 / t2 may be determined by any two combinations of values ​​included in the second group described above. For example, t1 / t2 may be 1.1 or more and 2.0 or less, 1.1 or more and 1.8 or less, 1.1 or more and 1.6 or less, 1.1 or more and 1.5 or less, 1.1 or more and 1.4 or less, 1.1 or more and 1.3 or less, 1.1 or more and 1.1 or less, 1.1 or more and 1.2 or less, 1.2 or more and 2.0 or less, 1.2 or more and 1.8 or less, 1.2 or more and 1.6 or less, 1.2 or more and 1.5 or less, 1.2 or more and 1.4 or less, 1.2 or more and 1.3 or less, 1.3 or more and 2.0 or less. It is also acceptable for it to be below, or between 1.3 and 1.8, or between 1.3 and 1.6, or between 1.3 and 1.5, or between 1.3 and 1.4, or between 1.4 and 2.0, or between 1.4 and 1.8, or between 1.4 and 1.6, or between 1.4 and 1.5, or between 1.5 and 2.0, or between 1.5 and 1.8, or between 1.5 and 1.6, or between 1.6 and 2.0, or between 1.6 and 1.8, or between 1.8 and 2.0.

[0085] When forming an organic layer aperture 41 in an organic layer 40 by laser processing, the angle that the side surface 42 facing the organic layer aperture 41 makes with respect to the first surface 16 of the substrate 15 can be adjusted by adjusting the direction of light irradiation. For example, the organic layer aperture 41 can be formed so that the side surface 42 rises steeply. In this case, the width u1 of the side surface 42 of the organic layer 40 is smaller than the width of the side surface of the organic layer formed by the vapor deposition method. Because the side surface 42 of the organic layer 40 rises steeply, the variation in the effective area of ​​each organic layer 40 is reduced. For example, if the organic layer 40 is an emissive layer, the variation in the luminous intensity of the light emitted from each emissive layer is reduced. For example, the variation in the luminance distribution of the electronic device 10 according to its position in the plane of the electronic device 10 can be suppressed. "Effective area of ​​organic layer 40" means the area of ​​the organic layer 40 that has the thickness necessary to perform its function and overlaps with the first electrode 30 and the second electrode 50 in a plan view.

[0086] In this application, the width u1 of the side surface 52 is defined as the in-plane distance of the first surface 16 from the position where the height of the side surface 52 is t4 to the position where it is t5. t4 is 0.2 × t3, and t5 is 0.8 × t3. The symbol t3 represents the average thickness of the region of the organic layer 40 located between the side surface 42 and the end 31 of the first electrode 30 in a plan view. The thickness of the organic layer 40 is calculated based on a cross-sectional image of the electronic device 10, similar to the thickness of the second electrode 50.

[0087] The width u1 may be, for example, 0.1 μm or more, 0.2 μm or more, 0.3 μm or more, or 0.4 μm or more. The width u1 may be, for example, 0.5 μm or less, 1.0 μm or less, 1.5 μm or less, or 2.0 μm or less. The range of the width u1 may be defined by a first group consisting of 0.1 μm, 0.2 μm, 0.3 μm and 0.4 μm, and / or a second group consisting of 0.5 μm, 1.0 μm, 1.5 μm and 2.0 μm. The range of the width u1 may be defined by a combination of any one value included in the first group and any one value included in the second group. The range of the width u1 may be defined by a combination of any two values ​​included in the first group. The range of the width u1 may be defined by a combination of any two values ​​included in the second group. The width u1 may be, for example, 0.1 μm or more and 2.0 μm or less, 0.1 μm or more and 1.5 μm or less, 0.1 μm or more and 1.0 μm or less, 0.1 μm or more and 0.5 μm or less, 0.1 μm or more and 0.4 μm or less, 0.1 μm or more and 0.3 μm or less, 0.1 μm or more and 0.2 μm or less, 0.2 μm or more and 2.0 μm or less, 0.2 μm or more and 1.5 μm or less, 0.2 μm or more and 1.0 μm or less, 0.2 μm or more and 0.5 μm or less, 0.2 μm or more and 0.4 μm or less, 0.2 μm or more and 0.3 μm or less, or 0.3 μm or more and 2.0 μm or less. However, it is also acceptable for it to be between 0.3 μm and 1.5 μm, between 0.3 μm and 1.0 μm, between 0.3 μm and 0.5 μm, between 0.3 μm and 0.4 μm, between 0.4 μm and 2.0 μm, between 0.4 μm and 1.5 μm, between 0.4 μm and 1.0 μm, between 0.4 μm and 0.5 μm, between 0.5 μm and 2.0 μm, between 0.5 μm and 1.5 μm, between 0.5 μm and 1.0 μm, between 1.0 μm and 2.0 μm, between 1.0 μm and 1.5 μm, and between 1.5 μm and 2.0 μm.

[0088] If the side surface 52 of the second electrode 50 is raised, the second electrode 50 includes a base 55 located outside the upper end 53, as shown in Figures 7 and 8. The thickness of the second electrode 50 decreases as it moves outward from the upper end 53. "Outside" refers to the side away from the center of the opening 51 in a plan view. The base 55 is located at a point where the thickness of the second electrode 50 is sufficiently smaller than the height t1 of the side surface 52. For example, the thickness t6 of the second electrode 50 at the base 55 is 1.05 times the average thickness t2 of the second electrode 50.

[0089] The symbol 51a represents the outer edge of the aperture 51 in a plan view. The symbol u2 represents the distance from the outer edge 51a of the aperture 51 to the base 55 in a plan view. The distance u2 may be, for example, 0.05 μm or more, 0.1 μm or more, or 0.5 μm or more. The distance u2 may be, for example, 2.0 μm or less, 3.0 μm or less, or 5.0 μm or less. The range of the distance u2 may be defined by a first group consisting of 0.05 μm, 0.1 μm, and 0.5 μm, and / or a second group consisting of 2.0 μm, 3.0 μm, and 5.0 μm. The range of the distance u2 may be defined by a combination of any one value from the first group and any one value from the second group. The range of the distance u2 may be defined by a combination of any two values ​​from the first group. The range of distance u2 may be determined by any two combinations of values ​​included in the second group described above. The distance u2 may be, for example, 0.05 μm or more and 5.0 μm or less, 0.05 μm or more and 3.0 μm or less, 0.05 μm or more and 2.0 μm or less, 0.05 μm or more and 0.5 μm or less, 0.05 μm or more and 0.1 μm or less, 0.1 μm or more and 5.0 μm or less, 0.1 μm or more and 3.0 μm or less, 0.1 μm or more and 2.0 μm or less, 0.1 μm or more and 0.5 μm or less, 0.5 μm or more and 5.0 μm or less, 0.5 μm or more and 3.0 μm or less, 0.5 μm or more and 2.0 μm or less, 2.0 μm or more and 5.0 μm or less, 2.0 μm or more and 3.0 μm or less, or 3.0 μm or more and 5.0 μm or less.

[0090] The dimensions of the components of the electronic device 10, the distances between components, etc., are measured by observing images of the cross-section of the electronic device 10 using a scanning electron microscope.

[0091] The second electrode 50 may include a uniform region 56. The uniform region 56 is, for example, a region having a thickness of 1.05 times or less the average value t2. The uniform region 56 extends to surround the aperture 51 in a plan view. The uniform region 56 may extend outside the base 55. The uniform region 56 may occupy most of the second electrode 50. The occupancy rate of the uniform region 56 in the second electrode 50 may be, for example, 90% or more, 95% or more, 98% or more, or 99% or more. When most of the second electrode 50 is the uniform region 56, light easily passes through the second electrode 50. This can increase the transmittance of the electronic device 10.

[0092] Next, a method for manufacturing the electronic device 10 described above will be explained.

[0093] First, a substrate preparation process is carried out. Figure 10 is a cross-sectional view showing the state in which the first electrode 30 has been formed on the substrate 15. Figure 11 is a plan view of Figure 10. Figure 10 corresponds to a cross-sectional view of Figure 11 along the CC line. In the substrate preparation process, a substrate 15 on which the first electrode 30 has been formed is prepared. The first electrode 30 is formed, for example, by forming a conductive layer constituting the first electrode 30 on the substrate 15 by a sputtering method or the like, and then patterning the conductive layer by a photolithography method or the like.

[0094] Next, the organic layer formation process is carried out. Figure 12 is a cross-sectional view showing the state in which the first electrode 30 and the organic layer 40 have been formed on the substrate 15. Figure 13 is a plan view of Figure 12. Figure 12 corresponds to a cross-sectional view of Figure 13 along the DD line. In the organic layer formation process, the organic layer 40 is formed on the first electrode 30. The organic layer 40 is formed, for example, by depositing an organic material onto the substrate 15 and the first electrode 30 using a deposition method with a deposition mask having through holes corresponding to the organic layer 40. In this way, a laminate 18 can be prepared, which includes the substrate 15, a plurality of first electrodes 30 located on the substrate 15, and a plurality of organic layers 40 located on the first electrodes 30.

[0095] As shown in Figure 13, the first organic layer 40A and the second organic layer 40B may be arranged alternately along the first direction D1 and also alternately along the second direction D2. The third organic layer 40C may be arranged along the first direction D1 such that it is located between the first organic layer 40A and the second organic layer 40B in the first direction D1, and also along the second direction D2 such that it is located between the first organic layer 40A and the second organic layer 40B in the second direction D2. The first organic layer 40A and the third organic layer 40C may also be arranged alternately along the third direction D3 and also alternately along the fourth direction D4. Furthermore, the second organic layer 40B and the third organic layer 40C may also be arranged alternately along the third direction D3 and also alternately along the fourth direction D4.

[0096] The organic layer formation process includes the steps of forming a first-color organic layer 40A, forming a second-color organic layer 40B, and forming a third-color organic layer 40C. Figure 14 is a cross-sectional view showing an example of the process of forming the first-color organic layer 40A. First, a first deposition mask 80A including a plurality of through holes 81 is prepared. Next, the first deposition mask 80A and the substrate 15 on which the first electrode 30 is formed are placed facing each other. After that, a first deposition process is carried out in which the material for the first-color organic layer 40A is deposited onto the first electrode 30 through the through holes 81 of the first deposition mask 80A. As shown in Figure 14, the first-color organic layer 40A may be formed not only in the region that overlaps with the first electrode 30 in a plan view, but also in the region that does not overlap with the first electrode 30.

[0097] Figure 15 is a cross-sectional view showing an example of the process for forming the second color organic layer 40B. First, a second deposition mask 80B including a plurality of through holes 81 is prepared. Next, the second deposition mask 80B and the substrate 15 on which the first electrode 30 and the first color organic layer 40A are formed are placed facing each other. Then, a second deposition process is carried out in which the material for the second color organic layer 40B is deposited onto the first electrode 30 through the through holes 81 of the second deposition mask 80B. As shown in Figure 15, the second color organic layer 40B may be formed not only in the region that overlaps the first electrode 30 in a plan view, but also in the region that does not overlap the first electrode 30.

[0098] Although not shown in the diagram, in the process of forming the third color organic layer 40C, similar to the case of the first color organic layer 40A and the second color organic layer 40B, a third deposition step is performed in which the material for the third color organic layer 40C is deposited onto the first electrode 30 through the through-holes of the third deposition mask. In this way, an organic layer 40 including the first color organic layer 40A, the second color organic layer 40B, and the third color organic layer 40C can be formed on the first electrode 30.

[0099] Figure 16 is a cross-sectional view showing another example of the process for forming the second color organic layer 40B. As shown in Figure 16, the second deposition process may be carried out such that a portion of the second color organic layer 40B overlaps the first color organic layer 40A. In this case, the first color organic layer 40A and the second color organic layer 40B include an overlapping portion 45 that partially overlaps each other at a position that does not overlap the first electrode 30. Although not shown, the first color organic layer 40A and the third color organic layer 40C may partially overlap each other. Also, the second color organic layer 40B and the third color organic layer 40C may partially overlap each other.

[0100] Next, the second electrode formation process is carried out. Figure 17 is a cross-sectional view showing the state in which the second electrode 50 has been formed on the organic layer 40. Figure 18 is a plan view of Figure 17. Figure 17 corresponds to a cross-sectional view of Figure 18 along the EE line. In the second electrode formation process, the second electrode 50 is formed on the organic layer 40 so as to overlap the multiple first electrodes 30 in a plan view. For example, the second electrode 50 is formed over the entire area of ​​the first surface 16 side of the substrate 15 by a vapor deposition method.

[0101] The second electrode 50 may be formed over the entire area of ​​the first display area 101 and the second display area 102. The second electrode 50 may include a layer that extends continuously without gaps. The second electrode 50 may consist of a single layer that extends continuously without gaps. The second electrode 50 may be formed by a single deposition process.

[0102] Subsequently, an aperture formation process is carried out. In the aperture formation process, multiple apertures are formed in the second electrode 50 located in the second display area 102 at positions that do not overlap with the first electrode 30 in a plan view. The aperture formation process may include a preparation step and a removal step.

[0103] First, a preparation step is performed. In the preparation step, the arrangement of multiple openings 51 formed on the second electrode 50 located in the second display area 102 is calculated. More specifically, multiple unit areas 57 partitioned based on multiple first electrodes 30 of the second electrode 50 are classified into opening areas 57A where openings 51 are formed and non-opening areas 57B where openings 51 are not formed. The preparation step may include an arrangement determination step. In the arrangement determination step, the arrangement of the opening areas 57A and non-opening areas 57B is determined. For example, the arrangement of the opening areas 57A and non-opening areas 57B may be determined randomly. The preparation step may also include a ratio determination step. In the ratio determination step, the ratio of the number of non-opening areas 57B to the number of unit areas 57 is determined. In the arrangement determination step described above, the arrangement of the opening areas 57A and non-opening areas 57B may be determined so as to satisfy the ratio determined in the ratio determination step.

[0104] After the preparation step, a removal step is performed. In the removal step, a portion of the second electrode 50 is removed based on the arrangement calculated in the preparation step, thereby forming a plurality of apertures 51 in the second electrode 50. The removal step may include an irradiation step. In the irradiation step, the second electrode 50 is irradiated with a laser L1. Figure 19 is a cross-sectional view showing an example of the irradiation step. As shown in Figure 19, the laser L1 may be irradiated onto the second electrode 50 through a through hole 91 in the laser mask 90. ​​Figure 20 is a plan view showing the state in which a plurality of apertures 51 have been formed in the second electrode 50. By irradiating the second electrode 50 with a laser L1, apertures 51 can be formed in the second electrode 50 as shown in Figure 20. In this way, a second electrode 50 can be obtained that includes a plurality of unit regions 57, including an aperture region 57A containing the apertures 51 and a non-aperture region 57B not containing the apertures 51.

[0105] The irradiation step may include a step of irradiating the region of the organic layer 40 that overlaps with the aperture 51 after the aperture 51 has been formed in the second electrode 50 with a laser L1. By irradiating the organic layer 40 with a laser L1, an organic layer aperture 41 that overlaps with the aperture 51 can be formed in the organic layer 40.

[0106] As shown in Figure 16 above, if the first organic layer 40A and the second organic layer 40B partially overlap each other, the overlapping portion 45 may be irradiated with the laser L1. This allows the overlapping portion 45 to be removed.

[0107] Figure 21 shows an example of a method for forming an aperture with a laser L1 during the irradiation process. In Figure 21, the region where the aperture 51 is to be formed is shown by a dotted line. As shown in Figure 21, the spot 92 of the laser L1 irradiated onto the second electrode 50 may have a spot diameter Sr smaller than the dimensions of the aperture 51. In this case, the laser L1 may be irradiated onto the region of the second electrode 50 where the aperture 51 is to be formed by scanning the light source in the in-plane direction of the first surface 16 of the substrate 15 with a laser mask 90 between the light source of the laser L1 and the second electrode 50.

[0108] For example, a YAG laser can be used as the laser L1. The light source that generates the YAG laser may include an oscillation medium containing a crystal in which neodymium is added to yttrium, aluminum, and garnet. In this case, a laser with a wavelength of approximately 1064 nm can be generated as the fundamental wave. Furthermore, by passing the fundamental wave through a nonlinear optical crystal, a second harmonic with a wavelength of approximately 532 nm can be generated. Furthermore, by passing the fundamental wave and the second harmonic through a nonlinear optical crystal, a third harmonic with a wavelength of approximately 355 nm can be generated. The laser irradiated onto the second electrode 50 may include one, two, or three of the fundamental wave, second harmonic, and third harmonic. A laser other than a YAG laser may be used as the laser L1.

[0109] In the irradiation process, the second electrode 50 may be intermittently irradiated with pulses of laser L1. That is, instead of continuous light, a laser L1 containing pulses obtained by pulse oscillation may be used as the laser L1 irradiated onto the second electrode 50. This makes it easier to control the heat generated on the second electrode 50 due to the irradiation of laser L1. Figure 22 shows an example of a laser L1 containing pulses. In Figure 22, the symbol W1 represents the pulse width of laser L1, the symbol W2 represents the pulse period W2 of laser L1, and the symbol P1 represents the peak output of laser L1. The pulse width W1 is the half-width of the pulse peak.

[0110] During the irradiation process, parameters such as the spot diameter Sr of the laser L1, pulse width W1, pulse period W2, peak output P1, and pulse energy may be appropriately adjusted. This allows for adjustment of the degree of bulging formed on the upper end 53 of the side surface 52 of the second electrode 50. It also allows for adjustment of the width u1 of the side surface 42 of the organic layer 40.

[0111] According to this embodiment, the multiple unit regions 57 of the second electrode 50 include an aperture region 57A that includes an aperture 51 and a non-aperture region 57B that does not include an aperture 51. By including the aperture region 57A in the unit region 57, light is made more easily transmitted through the electronic device 10. As a result, the transmittance in the second display region 102 of the electronic device 10 can be increased. On the other hand, by including the non-aperture region 57B in the unit region 57, the regularity of the arrangement of the multiple apertures 51 can be reduced. As a result, it is possible to suppress the incidence of diffracted light with high intensity on optical components such as sensors. As a result, for example, blurring of the image generated by the sensor can be suppressed.

[0112] Various modifications can be made to the embodiment described above. Other embodiments will be described below, with reference to the drawings as necessary. In the following description and the drawings used therein, parts that can be configured in the same way as the embodiment described above will be given the same reference numerals as those used for the corresponding parts in the embodiment described above, and redundant explanations will be omitted. In addition, if it is clear that the effects and advantages obtained in the embodiment described above can also be obtained in other embodiments, the explanation may be omitted.

[0113] Referring to Figures 23 to 31, other embodiments of the electronic device 10 and its manufacturing method according to the present disclosure will be described.

[0114] Figures 23 to 26 are plan views showing an example of a basic pattern constituting the second display area 102 of the electronic device 10. In this embodiment, the second display area 102 is divided into a plurality of basic patterns 110, as shown in Figures 23 to 26. As shown in Figures 23 to 26, each basic pattern 110 includes one first color electrode 30A or one second color electrode 30B and one third color electrode 30C. In each basic pattern 110, the first color electrode 30A or the second color electrode 30B and the third color electrode 30C may be adjacent in the third direction D3. Here, in each basic pattern 110, the first color electrode 30A and the second color electrode 30B are not distinguished from each other. That is, each basic pattern 110 may include the first color electrode 30A, or it may include the second color electrode 30B instead of the first color electrode 30A, but in either case it is represented as the same basic pattern 110. Basic pattern 110 may include two or more basic patterns from among the first basic pattern 110A shown in Figure 23, the second basic patterns 110B and 110B' shown in Figures 24 and 25, and the third basic pattern 110C shown in Figure 26.

[0115] As shown in Figure 23, the first basic pattern 110A includes two openings 51. In the first basic pattern 110A, an opening 51 is positioned adjacent to the first color electrode 30A or the second color electrode 30B in the first direction D1, and an opening 51 is also positioned adjacent to the first color electrode 30A or the second color electrode 30B in the second direction D2. It can also be said that an opening 51 is positioned adjacent to the third color electrode 30C in the first direction D1, and an opening 51 is also positioned adjacent to the third color electrode 30C in the second direction D2.

[0116] As shown in Figures 24 and 25, the second basic patterns 110B and 110B' include one aperture 51. In the second basic pattern 110B shown in Figure 24, the aperture 51 is positioned adjacent to the first color electrode 30A or the second color electrode 30B in the first direction D1. It can also be said that the aperture 51 is positioned adjacent to the third color electrode 30C in the second direction D2. In the second basic pattern 110B' shown in Figure 25, the aperture 51 is positioned adjacent to the first color electrode 30A or the second color electrode 30B in the second direction D2. It can also be said that the aperture 51 is positioned adjacent to the third color electrode 30C in the first direction D1.

[0117] As shown in Figure 26, the third basic pattern 110C does not include the opening 51. In other words, the opening 51 is not provided in the third basic pattern 110C.

[0118] The second display area 102 may be composed of two or more basic patterns from the first basic pattern 110A, the second basic pattern 110B, 110B', and the third basic pattern 110C. In this case, several basic patterns 110 may be combined to form a plurality of block patterns 120, and the second display area 102 may be composed of a plurality of block patterns 120. Figures 27 to 29 are plan views showing an example of a block pattern constituting the second display area 102 of the electronic device 10. The block pattern 120 may include pattern A 120A as shown in Figure 27, pattern B 120B as shown in Figure 28, and pattern C 120C as shown in Figure 29.

[0119] As shown in Figure 27, pattern A 120A may consist of four first basic patterns 110A arranged along the first direction D1 and the second direction D2. As shown in Figure 28, pattern B 120B may consist of four second basic patterns 110B arranged along the first direction D1 and the second direction D2. As shown in Figure 29, pattern C 120C may consist of two second basic patterns 110B and two third basic patterns 110C arranged along the first direction D1 and the second direction D2 such that the second basic pattern 110B and the third basic pattern 110C are adjacent to each other in the first direction D1 and the second direction D2.

[0120] Figure 30 is a plan view showing an example of a second display area 102 of the electronic device 10 according to this embodiment. The second display area 102 shown in Figure 30 is composed of pattern A 120A and pattern B 120B. When pattern A 120A is represented by the symbol "A" and pattern B 120B is represented by the symbol "B", in the second display area 102 shown in Figure 30, pattern A 120A and pattern B 120B are arranged as follows.

[0121] ··ABA·· ··BAB·· ··ABA··

[0122] As shown in Figure 30, in the second display area 102, patterns A 120A and B 120B are arranged regularly along the first direction D1 and the second direction D2. More specifically, patterns A 120A and B 120B are arranged alternately along the first direction D1 and alternately along the second direction D2. Since pattern A 120A is composed of the first basic pattern 110A and pattern B 120B is composed of the second basic pattern 110B, it can also be said that in the second display area 102, the first basic pattern 110A and the second basic pattern 110B are arranged regularly along the first direction D1 and the second direction D2.

[0123] Figure 31 is a plan view showing another example of the second display area 102 of the electronic device 10 according to this embodiment. The second display area 102 shown in Figure 31 is composed of pattern A 120A, pattern B 120B, and pattern C 120C. When pattern A 120A is represented by the symbol "A", pattern B 120B by the symbol "B", and pattern C 120C by the symbol "C", in the second display area 102 shown in Figure 31, pattern A 120A, pattern B 120B, and pattern C 120C are arranged as follows.

[0124] ··ABC·· ··CAB·· ··BCA··

[0125] As shown in Figure 31, in the second display area 102, patterns A 120A, B 120B, and C 120C are arranged regularly along the first direction D1 and the second direction D2. More specifically, patterns A 120A, B 120B, and C 120C are arranged sequentially along the first direction D1 and sequentially along the second direction D2. Since pattern A 120A is composed of the first basic pattern 110A, pattern B 120B is composed of the second basic pattern 110B, and pattern C 120C is composed of the second basic pattern 110B and the third basic pattern 110C, it can also be said that in the second display area 102, the first basic pattern 110A, the second basic pattern 110B, and the third basic pattern 110C are arranged regularly along the first direction D1 and the second direction D2.

[0126] In addition to the examples above, the second display area 102 may be composed of any combination of basic patterns 110. For example, the second display area 102 may be composed of pattern A 120A and pattern C 120C. That is, in the second display area 102, pattern A 120A and pattern C 120C may be arranged regularly along the first direction D1 and the second direction D2. In this case, pattern A 120A is composed of the first basic pattern 110A, and pattern C 120C is composed of the second basic pattern 110B and the third basic pattern 110C, so it can be said that in the second display area 102, the first basic pattern 110A, the second basic pattern 110B, and the third basic pattern 110C are arranged regularly along the first direction D1 and the second direction D2. The second display area 102 may also be composed of pattern B 120B. In other words, in the second display area 102, the B pattern 120B may be arranged along the first direction D1 and the second direction D2 (see Figure 65). In this case, since the B pattern 120B is composed of the second basic pattern 110B, it can be said that in the second display area 102, the second basic pattern 110B is arranged along the first direction D1 and the second direction D2.

[0127] In this embodiment as well, similar to the embodiment described above, the regularity of the arrangement of the multiple apertures 51 can be reduced. This makes it possible to suppress the incidence of diffracted light with high intensity on optical components such as sensors. For example, this makes it possible to suppress blurring of images generated by the sensor.

[0128] Furthermore, according to this embodiment, the determination of the arrangement of the opening region 57A and the non-opening region 57B during the opening formation process when manufacturing the electronic device 10 can be made easier. That is, by regularly arranging the basic pattern 110, it becomes unnecessary to randomly determine the arrangement of the opening 51, and the arrangement of the opening 51 can be determined efficiently. As a result, the manufacturing design of the electronic device 10 can be made easier.

[0129] Referring to Figure 32, other embodiments of the electronic device 10 and a method for manufacturing the same according to the present disclosure will be described.

[0130] Figure 32 is a plan view showing an example of a first display area 101 and a second display area 102 of an electronic device 10 according to this embodiment. A plurality of elements 20 located in the first display area 101 may be arranged along the first direction D1 with an 11th period P11 and along the second direction D2 with a 21st period P21. A plurality of elements 20 located in the second display area 102 may be arranged along the first direction D1 with a 12th period P12' and along the second direction D2 with a 22nd period P22'. The 12th period P12' may be greater than the 11th period P11. The 22nd period P22' may be greater than the 21st period P21.

[0131] The ratio of the 12th period P12' to the 11th period P11, P12' / P11, may be, for example, 1.0 or greater, 1.3 or greater, or 1.5 or greater. P12' / P11 may also be, for example, 2.0 or less, 3.0 or less, or 4.0 or less. The range of P12' / P11 may be determined by a first group consisting of 1.0, 1.3 and 1.5, and / or a second group consisting of 2.0, 3.0 and 4.0. The range of P12' / P11 may also be determined by a combination of any one value from the first group and any one value from the second group. The range of P12' / P11 may also be determined by a combination of any two values ​​from the first group. The range of P12' / P11 may also be determined by a combination of any two values ​​from the second group. P12' / P11 may be, for example, 1.0 to 4.0, 1.0 to 3.0, 1.0 to 2.0, 1.0 to 1.5, 1.0 to 1.3, 1.3 to 4.0, 1.3 to 3.0, 1.3 to 2.0, 1.3 to 1.5, 1.5 to 4.0, 1.5 to 3.0, 1.5 to 2.0, 2.0 to 4.0, 2.0 to 3.0, or 3.0 to 4.0.

[0132] As the numerical range for P22' / P21, which is the ratio of the 22nd period P22' to the 21st period P21, the aforementioned numerical range of P12' / P11 may be adopted.

[0133] Referring to Figures 33 to 40, other embodiments of the electronic device 10 and its manufacturing method according to the present disclosure will be described.

[0134] Figure 33 is a cross-sectional view showing an example of a second display area 102 of the electronic device 10 according to this embodiment. Figure 34 is a cross-sectional view showing an enlarged view of Figure 33. As shown in Figures 33 and 34, the electronic device 10 may include an insulating layer 60. The insulating layer 60 may be located between the substrate 15 and the organic layer 40 in the direction normal to the substrate 15.

[0135] The insulating layer 60 may include a first insulating layer opening 61. The first electrode 30 may be located in the first insulating layer opening 61. Although not shown in the figures, a portion of the first electrode 30 may be located between the insulating layer 60 and the first surface 16 of the substrate 15.

[0136] Furthermore, the insulating layer 60 may include a second insulating layer opening 62. The second insulating layer opening 62 may overlap the opening 51 of the second electrode 50 in a plan view. The second insulating layer opening 62 may also overlap the organic layer opening 41 of the organic layer 40 in a plan view. The insulating layer 60 includes a side surface 63 facing the second insulating layer opening 62. As shown in Figure 34, the upper end of the side surface 63 of the insulating layer 60 may be in contact with the lower end of the side surface 42 of the organic layer 40. Such a relationship between the side surface 63 and the side surface 42 can be achieved when the organic layer opening 41 and the second insulating layer opening 62 are formed by laser processing.

[0137] The insulating layer 60 contains an insulating material. For example, the insulating layer 60 may contain a resin material such as polyimide resin.

[0138] Although not shown in the figures, at the second opening 62 of the insulating layer, an insulating layer different from the insulating layer 60 may be located on the first surface 16 of the substrate 15. This prevents the two first electrodes 30 that are adjacent to each other across the second opening 62 of the insulating layer in a plan view from being electrically connected.

[0139] Figure 35 is a cross-sectional view showing another example of the second display area 102 of the electronic device 10 according to this embodiment. As shown in Figure 35, the insulating layer 60 does not necessarily include the second insulating layer opening 62. That is, the insulating layer 60 may be located on the first surface 16 of the substrate 15 at the organic layer opening 41. The thickness of the insulating layer 60 located at the organic layer opening 41 in a plan view may be smaller than the thickness of the insulating layer 60 overlapping the organic layer 40 in a plan view. Such an insulating layer 60 can be formed by partially removing the insulating layer 60 in the thickness direction during the irradiation process described later. By leaving the insulating layer 60 at the organic layer opening 41, it is possible to suppress the electrical connection between the two first electrodes 30 that are adjacent to each other across the organic layer opening 41 in a plan view.

[0140] In the manufacturing method of the electronic device 10 shown in Figures 34 and 35, first, a substrate preparation step is performed to prepare a substrate 15 on which the first electrode 30 is formed, similar to the above-described embodiment shown in Figures 10 and 11.

[0141] Next, an insulating layer formation process is carried out to form an insulating layer 60 on the substrate 15, in which an insulating layer first opening 61 is formed. Figure 36 is a cross-sectional view showing the state in which the first electrode 30 and the insulating layer 60 are formed on the substrate 15. Figure 37 is a plan view of Figure 36. Figure 36 corresponds to a cross-sectional view of Figure 37 viewed along the FF line.

[0142] In the insulating layer formation process, for example, first, a solution containing the insulating layer 60 material is applied to the first surface 16 side of the substrate 15, and the solution is dried to form an insulating layer 60 over the entire surface 16. Subsequently, the insulating layer 60 is exposed to light and developed to form an insulating layer first opening 61 in the insulating layer 60. In this way, an insulating layer 60 can be formed between the first electrodes 30.

[0143] Next, as shown in Figure 38, an organic layer formation step is performed to form an organic layer 40 on the first electrode 30. Figure 38 is a cross-sectional view showing the state in which the first electrode 30, insulating layer 60, and organic layer 40 are formed on the substrate 15. The organic layer 40 may be formed so as to overlap the first electrode 30 and insulating layer 60 in a plan view. In this way, a laminate 18 can be prepared, which includes the substrate 15, a plurality of first electrodes 30 located on the substrate 15, insulating layers 60 located between the first electrodes 30, and an organic layer 40 located on the first electrodes 30 and insulating layers 60.

[0144] Next, as shown in Figure 39, a second electrode formation step is performed to form a second electrode 50 on the organic layer 40. Figure 39 is a cross-sectional view showing the state in which the second electrode 50 has been formed on the organic layer 40. In the second electrode formation step, the second electrode 50 is formed on the organic layer 40 so as to overlap the plurality of first electrodes 30 in a plan view, similar to the embodiments shown in Figures 17 and 18.

[0145] Subsequently, an aperture forming step is performed to form multiple apertures on the second electrode 50 at positions that do not overlap with the first electrode 30 in a plan view. The aperture forming step may include a removal step to form an aperture 51 by removing a part of the second electrode 50. In the removal step, the aperture 51 may be formed by partially removing a region of the second electrode 50 that overlaps with the insulating layer 60 in a plan view. The removal step may include an irradiation step of irradiating the second electrode 50 with a laser L1. Figure 40 is a cross-sectional view showing an example of the irradiation step. As shown in Figure 40, the laser L1 may be irradiated onto a region of the second electrode 50 that overlaps with the insulating layer 60 in a plan view. By irradiating the second electrode 50 with a laser L1, an aperture 51 can be formed on the second electrode 50 as shown in Figures 34 and 35 above.

[0146] The irradiation step may include a step of irradiating the region of the organic layer 40 that overlaps with the aperture 51 after the aperture 51 has been formed in the second electrode 50 with a laser L1. By irradiating the organic layer 40 with a laser L1, an organic layer aperture 41 that overlaps with the aperture 51 can be formed in the organic layer 40, as shown in Figures 34 and 35 above.

[0147] Furthermore, the irradiation step may include a step of irradiating the region of the insulating layer 60 that overlaps with the organic layer opening 41 after the organic layer opening 41 has been formed in the organic layer 40 with a laser L1. By irradiating the insulating layer 60 with a laser L1, a second insulating layer opening 62 that overlaps with the opening 51 and the organic layer opening 41 can be formed in the insulating layer 60, as shown in Figure 34 above. In addition, in the step of irradiating the region of the insulating layer 60 that overlaps with the organic layer opening 41 with a laser L1, the insulating layer 60 may be partially removed in the thickness direction. By partially removing the insulating layer 60 in the thickness direction, an insulating layer 60 as shown in Figure 35 above can be formed.

[0148] Referring to Figures 41 and 42, other embodiments of the electronic device 10 and a method for manufacturing the same according to the present disclosure will be described.

[0149] Figure 41 is a cross-sectional view showing an example of an electronic device 10 according to this embodiment. As shown in Figure 41, the electronic device 10 may include a protective layer 70 that overlaps the second electrode 50 and the opening 51 in a plan view.

[0150] The protective layer 70 contains a material that is insulating and light-transmitting. The material of the protective layer 70 may be an organic material or an inorganic material. For example, the protective layer 70 may contain a resin material such as polyimide resin, acrylic resin, or epoxy resin. For example, the protective layer 70 may contain an inorganic material. The inorganic material may be an inorganic nitride such as silicon nitride, or an inorganic oxide such as silicon oxide or aluminum oxide. The protective layer 70 may consist of these materials and include two or more layers stacked in the direction normal to the substrate 15.

[0151] As shown in Figure 41, if the upper end 53 of the side surface 52 of the second electrode 50 is raised compared to the surrounding second electrode 50, the upper end 53 of the side surface 52 of the second electrode 50 can penetrate the protective layer 70. This increases the contact area between the second electrode 50 and the protective layer 70. This prevents the protective layer 70 from peeling off the second electrode 50.

[0152] As shown in Figure 41, the protective layer 70 may cover the sides of the organic layer 40. In this case, the protective layer 70 can prevent water vapor, oxygen, etc. from entering the organic layer 40 from the atmosphere. This can suppress the deterioration of the organic layer 40.

[0153] The protective layer 70 may extend along the cross-sectional shape of the organic layer 40. For example, as shown in Figure 41, the surface of the protective layer 70 overlapping the opening 51 may be located between the surface of the second electrode 50 overlapping the first electrode 30 and the first surface 16 of the substrate 15 in the direction normal to the substrate 15.

[0154] The protective layer 70 may have a thickness greater than the sum of the thicknesses of the first electrode 30, the organic layer 40, and the second electrode 50. Figure 42 is a cross-sectional view showing another example of the electronic device 10 according to this embodiment. As shown in Figure 42, the surface of the second electrode 50 overlapping the first electrode 30 may be located between the surface of the protective layer 70 overlapping the opening 51 and the first surface 16 of the substrate 15 in the direction normal to the substrate 15.

[0155] The manufacturing method for the electronic device 10 shown in Figures 41 and 42 may include a protective layer formation step for forming a protective layer 70. The protective layer formation step may be performed after the opening formation step. The protective layer formation step may include a coating step for applying a liquid containing the material for the protective layer 70 to the second electrode 50 and the opening 51. The protective layer 70 may also be formed by other methods.

[0156] Referring to Figures 43 to 46, other embodiments of the electronic device 10 and its manufacturing method according to the present disclosure will be described.

[0157] In the above-described embodiment, an example was shown in which the second electrode 50 located on the organic layer 40 is removed to form an opening 51. In this embodiment, an example will be described in which the region of the second electrode 50 that does not overlap with the organic layer 40 in a plan view is removed to form an opening 51.

[0158] Figure 43 is a cross-sectional view showing an example of an electronic device 10 according to this embodiment. As shown in Figure 43, the organic layer 40 does not face the opening 51 of the second electrode 50, and the end portion 47 of the organic layer 40 may overlap the second electrode 50 in a plan view.

[0159] In the manufacturing method of the electronic device 10 shown in Figure 43, first, a substrate preparation step is performed to prepare a substrate 15 on which the first electrode 30 is formed, similar to the above-described embodiment shown in Figures 10 and 11.

[0160] Next, as shown in Figure 44, an organic layer formation process is carried out to form an organic layer 40 on the first electrode 30. Figure 44 is a cross-sectional view showing the state in which the first electrode 30 and the organic layer 40 have been formed on the substrate 15. As shown in Figure 44, there may be a region between two adjacent organic layers 40 in a plan view where no organic layer 40 exists.

[0161] Next, as shown in Figure 45, a second electrode formation step is performed to form a second electrode 50 on the organic layer 40. Figure 45 is a cross-sectional view showing the state in which the second electrode 50 has been formed on the organic layer 40. In the second electrode formation step, the second electrode 50 is formed on the organic layer 40 and on the first surface 16 of the substrate 15 so as to overlap the plurality of first electrodes 30 in a plan view.

[0162] Subsequently, an aperture forming step is performed to form multiple apertures on the second electrode 50 at positions that do not overlap with the first electrode 30 in a plan view. The aperture forming step may include a removal step to form an aperture 51 by removing a part of the second electrode 50. In the removal step, the aperture 51 may be formed by partially removing a region of the second electrode 50 that does not overlap with the organic layer 40 in a plan view. The removal step may include an irradiation step of irradiating the second electrode 50 with a laser L1. Figure 46 is a cross-sectional view showing an example of the irradiation step. As shown in Figure 46, the laser L1 may be irradiated onto a region of the second electrode 50 that does not overlap with the organic layer 40 in a plan view. By irradiating the second electrode 50 with a laser L1, an aperture 51 can be formed on the second electrode 50 as shown in Figure 43 above.

[0163] In Figure 43, the symbol K1 represents the distance in plan view from the outer edge 51a of the opening 51 to the end 47 of the organic layer 40. The distance K1 may be, for example, 0.1 μm or more, 0.5 μm or more, or 1.0 μm or more. The distance K1 may be, for example, 2.0 μm or less, 4.0 μm or less, or 8.0 μm or less. The range of the distance K1 may be defined by a first group consisting of 0.1 μm, 0.5 μm and 1.0 μm, and / or a second group consisting of 2.0 μm, 4.0 μm and 8.0 μm. The range of the distance K1 may be defined by a combination of any one value from the first group and any one value from the second group. The range of the distance K1 may be defined by a combination of any two values ​​from the first group. The range of the distance K1 may be defined by a combination of any two values ​​from the second group. For example, it may be 0.1 μm or more and 8.0 μm or less, 0.1 μm or more and 4.0 μm or less, 0.1 μm or more and 2.0 μm or less, 0.1 μm or more and 1.0 μm or less, 0.1 μm or more and 0.5 μm or less, 0.5 μm or more and 8.0 μm or less, 0.5 μm or more and 4.0 μm or less, 0.5 μm or more and 2.0 μm or less, 0.5 μm or more and 1.0 μm or less, 1.0 μm or more and 8.0 μm or less, 1.0 μm or more and 4.0 μm or less, 1.0 μm or more and 2.0 μm or less, 2.0 μm or more and 8.0 μm or less, 2.0 μm or more and 4.0 μm or less, and 4.0 μm or more and 8.0 μm or less.

[0164] A method for manufacturing the electronic device 10 according to another embodiment of the present disclosure will be described with reference to Figures 47 and 48.

[0165] In the above-described embodiment, an example was shown in which an opening 51 is formed by removing a part of the second electrode 50. In this embodiment, an example will be described in which a suppression layer 95 is formed on the substrate 15 before forming the second electrode 50 on the organic layer 40. The suppression layer 95 has the characteristic that the conductive material constituting the second electrode 50 does not easily adhere to it.

[0166] Figure 47 is a cross-sectional view showing an example of a suppression layer formation process for forming a suppression layer 95 on a substrate 15. The suppression layer formation process may be performed between the organic layer formation process and the second electrode formation process. That is, the suppression layer formation process may be performed after the organic layer formation process and before the second electrode formation process. In the example shown in Figure 47, similar to the embodiments described above shown in Figures 33 to 40, the insulating layer formation process is performed before the organic layer formation process, and an insulating layer 60 is formed between the first electrodes 30.

[0167] In the suppression layer formation process, a suppression layer 95 is formed at the location where the opening 51 is formed on the substrate 15. As shown in Figure 47, the suppression layer 95 may be formed on the substrate 15 via an insulating layer 60 and an organic layer 40. Although not shown, the insulating layer 60 may not be formed, and the suppression layer 95 may be formed on the substrate 15 only via the organic layer 40, or the suppression layer 95 may be formed directly on the substrate 15. The suppression layer formation process may include a step of depositing the suppression layer 95 material onto the substrate 15 via a mask 96. As shown in Figure 47, the suppression layer 95 may be formed in the region of the substrate 15 that overlaps with the through-holes 97 of the mask 96. The pattern of the through-holes 97 of the mask 96 corresponds to the pattern of the opening 51. That is, the shape and arrangement of the through-holes 97 of the mask 96 are determined based on the shape and arrangement of the opening 51 calculated in the preparation step described above.

[0168] Figure 48 is a cross-sectional view showing an example of the second electrode formation process. The second electrode 50 is formed by depositing the material for the second electrode 50 onto the substrate 15. As described above, the suppression layer 95 has the characteristic that the conductive material constituting the second electrode 50 does not easily adhere to it. Therefore, as shown in Figure 48, the formation of the second electrode 50 on the suppression layer 95 is suppressed. As a result, the region where the suppression layer 95 is formed functions as an opening 51.

[0169] The suppression layer 95 is light-transmitting. For example, the transmittance of the laminate including the substrate 15 and the suppression layer 95 may be 70% or more, or 80% or more. The transmittance of the laminate including the substrate 15 and the suppression layer 95 is measured by the test method for total light transmittance of transparent plastic materials in accordance with JIS K7361-1.

[0170] The material of the inhibition layer 95 may be the material of the nucleation inhibiting coating described in WO2017072678A1 or WO2019150327A1. For example, the material of the inhibition layer 95 may include organic materials such as low molecular weight organic materials and organic polymers. The organic material may be, for example, a polycyclic aromatic compound. A polycyclic aromatic compound includes an organic molecule comprising a core portion and at least one terminal portion bonded to the core portion. The organic molecule may contain one or more heteroatoms such as nitrogen, sulfur, oxygen, phosphorus, and aluminum. The number of terminal portions may be one or more, two or more, three or more, or four or more. If the organic molecule contains two or more terminal portions, the two or more terminal portions may be the same or different.

[0171] The terminal portion may contain a biphenylyl moiety represented by any of the following chemical structures: (la), (lb), and (lc). (la) TIFF0007911683000001.tif37170(lb) TIFF0007911683000002.tif56170(lc) TIFF0007911683000003.tif58170

[0172] The substituents Ra and Rb may each be independently selected from deuterium, fluorine, alkyl, cycloalkyl, arylalkyl, silyl, aryl, heteroaryl, fluoroalkyl, and any combination thereof, including C1-C4 alkyl. [Examples]

[0173] Next, embodiments of the present disclosure will be described in more detail by reference to examples. Embodiments of the present disclosure are not limited to the following examples unless they exceed the gist of the disclosure.

[0174] Figure 49 is a plan view showing the second display area 102' of an electronic device 10' according to a comparative example. The electronic device 10' shown in Figure 49 includes a plurality of first electrodes 30' and second electrodes 50'. The plurality of first electrodes 30' includes a plurality of first color electrodes 30A', a plurality of second color electrodes 30B', and a plurality of third color electrodes 30C'. The first color electrodes 30A' and second color electrodes 30B' are arranged alternately and periodically along a first direction D1 and alternately and periodically along a second direction D2. The third color electrode 30C' is arranged periodically along a first direction D1 such that it is located between the first color electrodes 30A' and the second color electrodes 30B' in the first direction D1, and is arranged periodically along a second direction D2 such that it is located between the first color electrodes 30A' and the second color electrodes 30B' in the second direction D2. The arrangement period of the first electrode 30 in the first direction D1 and the second direction D2 is 84.7 μm.

[0175] The shape of the first electrode 30' in plan view is circular. The diameters of the first color electrode 30A' and the second color electrode 30B' are 34.1 μm. The diameter of the third color electrode 30C' is 24.2 μm. The transmittance of the first electrode 30 is 0%. Here, transmittance is the total light transmittance for light with a wavelength of 550 nm.

[0176] Multiple apertures 51' are formed in the second electrode 50'. In the comparative example shown in Figure 49, apertures 51' are located in all of the unit regions 57' that are demarcated by rectangles formed by connecting the center points of four adjacent first electrodes 30'. That is, multiple unit regions 57' include aperture regions 57A' that contain apertures 51', but do not include non-aperture regions that do not contain apertures 51'. One aperture 51' is formed in one aperture region 57A'. In a plan view, the center point of the aperture 51 coincides with the center point of the aperture region 57A. In the comparative example, the ratio of the number of non-aperture regions to the number of unit regions 57' is 0%.

[0177] The shape of aperture 51' in plan view is circular. The diameter of aperture 51' is 23 μm. The transmittance of aperture 51' is 85%. The transmittance of the second electrode 50' is 38%. Here, transmittance is the total light transmittance for light with a wavelength of 550 nm.

[0178] Figure 50 is a plan view showing the second display area 102 of the electronic device 10 according to the first embodiment. The electronic device 10 shown in Figure 50 includes a plurality of first electrodes 30 and a plurality of second electrodes 50. The plurality of first electrodes 30 include a plurality of first color electrodes 30A, a plurality of second color electrodes 30B, and a plurality of third color electrodes 30C. The arrangement and arrangement period of the first electrodes 30 are the same as in the comparative example. The shape, size, and transmittance of the first electrodes 30 are also the same as in the comparative example.

[0179] Multiple apertures 51 are formed in the second electrode 50. In the first embodiment shown in Figure 50, the multiple unit regions 57 include aperture regions 57A containing apertures 51 and non-aperture regions 57B not containing apertures 51. One aperture 51 is formed in one aperture region 57A. In a plan view, the center point of the aperture 51 coincides with the center point of the aperture region 57A. The aperture regions 57A and non-aperture regions 57B are arranged randomly. In the first embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 50%. The shape, size, and transmittance of the apertures 51 are the same as in the comparative example. The transmittance of the second electrode 50 is also the same as in the comparative example.

[0180] Figure 51 is a plan view showing the second display area 102 of the electronic device 10 according to the second embodiment. The electronic device 10 shown in Figure 51 includes a plurality of first electrodes 30 and a plurality of second electrodes 50. The plurality of first electrodes 30 include a plurality of first color electrodes 30A, a plurality of second color electrodes 30B, and a plurality of third color electrodes 30C. The arrangement and arrangement period of the first electrodes 30 are the same as in the comparative example and the first embodiment. The shape, size, and transmittance of the first electrodes 30 are also the same as in the comparative example and the first embodiment.

[0181] Multiple apertures 51 are formed in the second electrode 50. In the second embodiment shown in Figure 51, the multiple unit regions 57 include aperture regions 57A containing apertures 51 and non-aperture regions 57B not containing apertures 51. One aperture 51 is formed in one aperture region 57A. In a plan view, the center point of the aperture 51 coincides with the center point of the aperture region 57A. The aperture regions 57A and non-aperture regions 57B are arranged randomly, similar to the first embodiment. In the second embodiment shown in Figure 51, there are fewer non-aperture regions 57B than in the first embodiment shown in Figure 50. That is, in the second embodiment shown in Figure 51, there are more aperture regions 57A (number of apertures 51) than in the first embodiment shown in Figure 50. In the second embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 25%. The shape, size, and transmittance of the apertures 51 are the same as in the comparative example and the first embodiment. The transmittance of the second electrode 50 is the same as that of the comparative example and the first embodiment.

[0182] Figure 52 is a plan view showing the second display area 102 of the electronic device 10 according to the third embodiment. The electronic device 10 shown in Figure 52 includes a plurality of first electrodes 30 and a plurality of second electrodes 50. The plurality of first electrodes 30 include a plurality of first color electrodes 30A, a plurality of second color electrodes 30B, and a plurality of third color electrodes 30C. The arrangement and arrangement period of the first electrodes 30 are the same as in the comparative example, the first embodiment, and the second embodiment. The shape, size, and transmittance of the first electrodes 30 are also the same as in the comparative example, the first embodiment, and the second embodiment.

[0183] Multiple apertures 51 are formed in the second electrode 50. In the third embodiment shown in Figure 52, the multiple unit regions 57 include aperture regions 57A containing apertures 51 and non-aperture regions 57B not containing apertures 51. One aperture 51 is formed in one aperture region 57A. In a plan view, the center point of the aperture 51 coincides with the center point of the aperture region 57A. The aperture regions 57A and non-aperture regions 57B are arranged randomly, similar to the first and second embodiments. In the third embodiment shown in Figure 52, there are fewer non-aperture regions 57B than in the second embodiment shown in Figure 51. That is, in the third embodiment shown in Figure 52, there are more aperture regions 57A (number of apertures 51) than in the second embodiment shown in Figure 51. In the third embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 12.5%. The shape, size, and transmittance of the apertures 51 are the same as in the comparative example, the first embodiment, and the second embodiment. The transmittance of the second electrode 50' is the same as that of the comparative example, the first example, and the second example.

[0184] For the comparative examples and the first to third embodiments described above, the diffraction occurring in the light that passed through the second electrode 50 was verified by simulation. Figure 53 is a diagram illustrating the method for evaluating diffraction in the comparative examples and each embodiment. As shown in Figure 53, light L1 was incident on the substrate 15 along the normal direction of the first surface 16 of the substrate 15. The wavelength of light L1 is 550 nm. The diameter of light L1 is 3 mm. Next, the diffraction occurring in the light that passed through the aperture 51 and the light that transmitted through the second electrode 50 was calculated by simulation. The symbol L2 represents the light that travels in a straight line without diffraction and reaches the screen 113. The symbol Pc represents the point where light L2 reaches on the screen 113. The symbol L3 represents the light that is diffracted when passing through the aperture 51. The distance between the second surface 17 of the substrate 15 and the screen 113 is 5000 mm.

[0185] Figure 54 shows the projection pattern of light reaching the screen 113 in the comparative example. Figure 55 shows the projection pattern of light reaching the screen 113 in the first embodiment. Figure 56 shows the projection pattern of light reaching the screen 113 in the second embodiment. Figure 57 shows the projection pattern of light reaching the screen 113 in the third embodiment. The projection patterns of light in Figures 55 to 57 are blurred compared to the projection pattern of light in Figure 54. Therefore, it can be seen that the intensity of diffracted light can be reduced in the first to third embodiments compared to the comparative example. Accordingly, the first to third embodiments can suppress the incidence of diffracted light with high intensity on optical components such as sensors.

[0186] Furthermore, the light projection pattern in Figure 55 is blurred compared to the light projection patterns in Figures 56 and 57. The light projection pattern in Figure 56 is blurred compared to the light projection pattern in Figure 57. Therefore, it can be seen that a larger ratio of the number of non-aperture regions 57B to the number of unit regions 57 effectively reduces the intensity of diffracted light.

[0187] Figure 58 shows the results of extracting the intensity of diffracted light in the comparative example and the first to third examples along the fourth direction D4. The horizontal axis represents the distance from point Pc in the fourth direction D4. The vertical axis represents the intensity of light that reached screen 113. The peak located in the center of the horizontal axis represents the 0th order diffracted light. As you move away from the 0th order diffracted light peak in the fourth direction D4, the 1st order diffracted light peak, the 2nd order diffracted light peak, the 3rd order diffracted light peak, and the 4th order diffracted light peak appear in order.

[0188] Figure 59 shows the results of extracting the peak intensities of the 0th to 10th order diffracted light from Figure 58. In the comparative example and the first to third examples, the peak intensity of the 1st order diffracted light is maximized, excluding the peak of the 0th order diffracted light. This peak intensity is also referred to as the maximum peak intensity.

[0189] Figure 60 shows the result of integrating the peak intensities of the diffracted light from Figure 58 for each predetermined area. This predetermined area is an 8.3 mm × 8.3 mm square area. Figure 61 shows the result of extracting the peak intensities of the diffracted light from Figure 60 and converting them to dB. The dB converted value is the minimum peak intensity P of the diffracted light, as shown in Figure 60. min Maximum peak intensity P max The ratio (P max / P min The common logarithm was calculated, and then multiplied by 10 to obtain the result. Next, the average value of the dB equivalent of the peak intensity was calculated for the first to third diffracted light. Similarly, the average value of the dB equivalent of the peak intensity for the first to third diffracted light was calculated for the first direction D1 and the second direction D2. Finally, the dB equivalent values ​​for these three directions were summed to obtain the dB average sum.

[0190] Figure 62 shows the diffraction evaluation results for the comparative example and the first to third examples. It was confirmed that the maximum peak intensity and the average dB sum in the first to third examples were reduced compared to the comparative example. Thus, it was confirmed that the intensity of diffracted light can be reduced according to the first to third examples compared to the comparative example.

[0191] Furthermore, other embodiments were also evaluated. Figure 63 is a plan view showing the second display area 102 of the electronic device 10 according to the fourth embodiment. The second display area 102 of the electronic device 10 shown in Figure 63 is composed of an arrangement of block patterns 120. More specifically, the second display area 102 of the electronic device 10 shown in Figure 63 is composed of pattern A 120A and pattern B 120B. When pattern A 120A is represented by the symbol "A" and pattern B 120B is represented by the symbol "B", in the second display area 102 of the electronic device 10 shown in Figure 63, pattern A 120A and pattern B 120B are arranged as follows.

[0192] ··AAB·· ··BAA·· ··ABA··

[0193] In the fourth embodiment, the arrangement and arrangement period of the first electrode 30 are the same as in the comparative example and the first to third embodiments. The shape, size, and transmittance of the first electrode 30 are also the same as in the comparative example and the first to third embodiments. The shape, size, and transmittance of the aperture 51 are also the same as in the comparative example and the first to third embodiments. The transmittance of the second electrode 50 is also the same as in the comparative example and the first to third embodiments. In the fourth embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 16.9%.

[0194] Figure 64 is a plan view showing the second display area 102 of the electronic device 10 according to the fifth embodiment. The second display area 102 of the electronic device 10 shown in Figure 64 is composed of an arrangement of block patterns 120. More specifically, the second display area 102 of the electronic device 10 shown in Figure 64 is composed of pattern A 120A and pattern B 120B. When pattern A 120A is represented by the symbol "A" and pattern B 120B is represented by the symbol "B", in the second display area 102 of the electronic device 10 shown in Figure 64, pattern A 120A and pattern B 120B are arranged as follows.

[0195] ··ABA·· ··BAB·· ··ABA··

[0196] In the fifth embodiment, the arrangement and arrangement period of the first electrode 30 are the same as in the comparative example and the first to fourth embodiments. The shape, size, and transmittance of the first electrode 30 are also the same as in the comparative example and the first to fourth embodiments. The shape, size, and transmittance of the aperture 51 are also the same as in the comparative example and the first to fourth embodiments. The transmittance of the second electrode 50 is also the same as in the comparative example and the first to fourth embodiments. In the fifth embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 25.4%.

[0197] Figure 65 is a plan view showing the second display area 102 of the electronic device 10 according to the sixth embodiment. The second display area 102 of the electronic device 10 shown in Figure 65 is composed of an arrangement of block patterns 120. More specifically, the second display area 102 of the electronic device 10 shown in Figure 65 is composed of B pattern 120B. When B pattern 120B is represented by the symbol "B", in the second display area 102 of the electronic device 10 shown in Figure 65, B pattern 120B is arranged as follows.

[0198] ··BBB·· ··BBB·· ··BBB··

[0199] In the sixth embodiment, the arrangement and arrangement period of the first electrode 30 are the same as in the comparative example and the first to fifth embodiments. The shape, size, and transmittance of the first electrode 30 are also the same as in the comparative example and the first to fifth embodiments. The shape, size, and transmittance of the aperture 51 are also the same as in the comparative example and the first to fifth embodiments. The transmittance of the second electrode 50 is also the same as in the comparative example and the first to fifth embodiments. In the sixth embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 50.9%.

[0200] Figure 66 is a plan view showing the second display area 102 of the electronic device 10 according to the seventh embodiment. The second display area 102 of the electronic device 10 shown in Figure 66 is composed of an arrangement of block patterns 120. More specifically, the second display area 102 of the electronic device 10 shown in Figure 66 is composed of C patterns 120C. When the C pattern 120C is represented by the symbol "C", the C pattern 120C in the second display area 102 of the electronic device 10 shown in Figure 66 is arranged as follows.

[0201] ··CCC·· ··CCC·· ··CCC··

[0202] In the seventh embodiment, the arrangement and arrangement period of the first electrode 30 are the same as in the comparative example and the first to sixth embodiments. The shape, size, and transmittance of the first electrode 30 are also the same as in the comparative example and the first to sixth embodiments. The shape, size, and transmittance of the aperture 51 are also the same as in the comparative example and the first to sixth embodiments. The transmittance of the second electrode 50 is also the same as in the comparative example and the first to sixth embodiments. In the seventh embodiment, the ratio of the number of non-aperture regions 57B to the number of unit regions 57 is 75.4%.

[0203] Figure 67 is a plan view showing the second display area 102' of the electronic device 10' according to the reference example. In the second display area 102' of the electronic device 10' shown in Figure 67, no opening is formed in the second electrode 50'. In the reference example, the arrangement and arrangement period of the first electrode 30' are the same as in the comparative example and the first to seventh embodiments. The shape, size, and transmittance of the first electrode 30' are also the same as in the comparative example and the first to seventh embodiments. The transmittance of the second electrode 50' is also the same as in the comparative example and the first to seventh embodiments. In the reference example, the ratio of the number of non-aperture areas to the number of unit areas is 100%.

[0204] The same evaluations as those for the comparative examples and the first to third examples were performed on the fourth to seventh examples and the reference example described above. Figure 68 shows the diffraction evaluation results for the fourth to seventh examples and the reference example. Figure 69 shows the relationship between the unaperture ratio (the ratio of the number of non-aperture regions to the number of unit regions) and the maximum peak intensity. Figure 70 shows the relationship between the unaperture ratio (the ratio of the number of non-aperture regions to the number of unit regions) and the dB average total value. Figures 69 and 70 are graphs summarizing the evaluation results of Figures 62 and 68 for the first to seventh examples, as well as the comparative examples and the reference example. In Figure 69, the horizontal axis shows the unaperture ratio (%) and the vertical axis shows the maximum peak intensity (%). In Figure 70, the horizontal axis shows the unaperture ratio (%) and the vertical axis shows the dB average total value (dB). In the graphs of Figures 69 and 70, the "□" plots show the results for the first to third examples and are referred to as random arrangements. The "△" plots show the results for the fourth to seventh examples and are referred to as pattern arrangements. The results of comparative examples and reference examples are also shown as "△" plots and are referred to as pattern arrangements.

[0205] As shown in Figure 69, it was confirmed that the larger the unopened ratio, the greater the reduction in maximum peak intensity. As shown in Figure 69, the maximum peak intensity was reduced when the unopened ratio was between 5% and 95%. In particular, the maximum peak intensity was significantly reduced when the unopened ratio was between 10% and 80%. Furthermore, as shown in Figure 70, it was confirmed that the average total dB value was reduced in the random arrangement shown in the first to third examples compared to the pattern arrangement shown in the fourth to seventh examples, as well as the comparative examples and reference examples.

Claims

1. An electronic device comprising a first display area and a second display area located at a different position from the first display area in a plan view, circuit board and A plurality of first electrodes located on the substrate, Multiple organic layers located on the first electrode, The system comprises a second electrode located on the organic layer and extending so as to overlap the plurality of first electrodes in a plan view, The second electrode located in the second display area has multiple openings formed in positions that do not overlap with the first electrode in a plan view, and is divided into multiple unit regions based on the multiple first electrodes. Each of the aforementioned unit regions includes an opening region containing the opening and a non-opening region not containing the opening. The plurality of first electrodes include a plurality of first color electrodes, a plurality of second color electrodes, and a plurality of third color electrodes. The plurality of organic layers include a plurality of first-color organic layers located on the first color electrode, a plurality of second-color organic layers located on the second color electrode, and a plurality of third-color organic layers located on the third color electrode. The first color electrode and the second color electrode are arranged alternately along a first direction and alternately along a second direction perpendicular to the first direction. The third color electrode is arranged along the first direction so as to be located between the first color electrode and the second color electrode in the first direction, and is arranged along the second direction so as to be located between the first color electrode and the second color electrode in the second direction. The second display area is divided into a plurality of basic patterns, each including one first color electrode or one second color electrode and one third color electrode. The plurality of basic patterns include two or more basic patterns from among a first basic pattern including two openings, a second basic pattern including one opening, and a third basic pattern not including an opening. An electronic device in which, in the second display area, any two or more of the basic patterns are arranged regularly along the first and second directions.

2. The electronic device according to claim 1, wherein the unit region is demarcated by a rectangle obtained by connecting the center points of four adjacent first electrodes.

3. The electronic device according to claim 1, wherein the ratio of the number of non-aperture regions to the number of unit regions is 5% or more and 95% or less.

4. The electronic device according to claim 3, wherein the ratio of the number of non-aperture regions to the number of unit regions is 10% or more and 80% or less.

5. The electronic device according to claim 1, wherein the unit region is demarcated by a rectangle obtained by connecting the center point of one first color electrode, the center point of one second color electrode, and the center points of two third color electrodes in four adjacent first electrodes.

6. The multiple basic patterns include the first basic pattern and the second basic pattern, The electronic device according to claim 1, wherein in the second display area, the first basic pattern and the second basic pattern are arranged regularly along the first direction and the second direction.

7. The multiple basic patterns include the first basic pattern, the second basic pattern, and the third basic pattern, The electronic device according to claim 1, wherein in the second display area, the first basic pattern, the second basic pattern, and the third basic pattern are arranged regularly along the first and second directions.

8. The electronic device according to claim 1, wherein the organic layer includes an organic layer opening that overlaps the opening in a plan view.

9. The substrate comprises an insulating layer located between the substrate and the organic layer in the direction normal to the substrate, The electronic device according to claim 1, wherein the insulating layer includes a first insulating layer opening that overlaps the first electrode in a plan view.

10. The electronic device according to claim 9, wherein the insulating layer includes a second insulating layer opening that overlaps the opening in a plan view.

11. A method for manufacturing an electronic device, comprising a first display area and a second display area located at a different position from the first display area in a plan view, A preparation step of preparing a laminate comprising a substrate, a plurality of first electrodes located on the substrate, and a plurality of organic layers located on the first electrodes, A second electrode formation step involves forming a second electrode on the organic layer so as to overlap a plurality of first electrodes in a plan view, The process includes forming an opening in the second electrode located in the second display area, at a position that does not overlap with the first electrode in a plan view, The second electrode located in the second display area is divided into a plurality of unit areas based on the plurality of first electrodes, Each of the aforementioned unit regions includes an opening region containing the opening and a non-opening region not containing the opening. The plurality of first electrodes include a plurality of first color electrodes, a plurality of second color electrodes, and a plurality of third color electrodes. The plurality of organic layers include a plurality of first-color organic layers located on the first color electrode, a plurality of second-color organic layers located on the second color electrode, and a plurality of third-color organic layers located on the third color electrode. The first color electrode and the second color electrode are arranged alternately along a first direction and alternately along a second direction perpendicular to the first direction. The third color electrode is arranged along the first direction so as to be located between the first color electrode and the second color electrode in the first direction, and is arranged along the second direction so as to be located between the first color electrode and the second color electrode in the second direction. The second display area is divided into a plurality of basic patterns, each including one first color electrode or one second color electrode and one third color electrode. The plurality of basic patterns include two or more basic patterns from among a first basic pattern including two openings, a second basic pattern including one opening, and a third basic pattern not including an opening. A method for manufacturing an electronic device, wherein in the second display area, any two or more of the basic patterns are arranged regularly along the first and second directions.

12. The method for manufacturing an electronic device according to claim 11, wherein the aperture forming step includes a removal step of forming the aperture by removing a part of the second electrode.

13. The method for manufacturing an electronic device according to claim 12, wherein the removal step includes an irradiation step of irradiating the second electrode with a laser to form the aperture.

14. A method for manufacturing an electronic device according to claim 11, comprising a suppression layer formation step of forming a suppression layer that suppresses the formation of the second electrode at the position where the opening is formed on the substrate, prior to the second electrode formation step.

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