Methods for installing electronic components in wiring and wiring on which electronic components are installed

Abstract

To provide a method for installing an electronic component on a wire and a wire having an electronic component installed thereon.SOLUTION: A method for installing an electronic component E1 on a wire includes the steps of: providing a first line 11 and an insulating layer 12 covering the first line 11; cutting the first line 11 and the insulating layer 12 in the wire to form a first open hole, wherein the first line 11 after being cut forms a first line segment 11a and a second line segment 11b; removing part of the insulating layer 12 covering the first line 11 at a position of the first open hole to form a first opening 141 for partially exposing the first line segment 11a and a second opening 142 for partially exposing the second line segment 11b; and installing, in the first open hole, a first electronic component E1 having a first end E1a electrically connected to the first line segment 11a and a second end E1b electrically connected to the second line segment 11b.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a method for installing electronic components and wiring, and particularly to a method for installing electronic components on wiring and wiring on which electronic components are installed.

Background Art

[0002] A circuit board contains various electronic components, and electronic components such as resistors, capacitors, transistors, etc. can be mounted on the surface of the circuit board by various connection techniques such as surface mount technology (SMT). Regardless of the technology, it is necessary to connect and install each electronic component on the circuit board based on the circuit board's line layout.

[0003] In addition, due to the limitation of the circuit board's area size, not many electronic components can be installed on the circuit board, so the function of the circuit board is limited. For example, the flexible wiring structure described in Taiwan Patent No. TWM353516U and the component module having the flexible wiring disclose a flexible wiring structure, but similarly, due to the limitation of the circuit board's area size, not many electronic components can be installed on the circuit board.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Therefore, how to provide a method for installing electronic components on wiring and wiring on which electronic components are installed has already become an urgent research topic.

Means for Solving the Problems

[0005] In view of the above-mentioned problems, the present invention provides a method for installing an electronic component in wiring. The method includes the steps of: providing wiring having a first line and an insulating layer covering the first line; forming a first opening by cutting the first line and the insulating layer in the wiring, wherein the cut first line forms a first line segment and a second line segment; forming a first opening that partially exposes the first line segment and a second opening that partially exposes the second line segment by partially removing the insulating layer covering the first line at the location of the first opening; and installing a first electronic component in the first opening, having a first terminal electrically connected to the first line segment exposed by the first opening and a second terminal electrically connected to the second line segment exposed by the second opening.

[0006] The present invention includes another method for installing electronic components in wiring. The method further includes: providing wiring having a first line, a second line installed alongside the first line, and an insulating layer covering the first and second lines; forming a slot that partially exposes the first and second lines by removing a portion of the insulating layer covering the first line and a portion of the insulating layer covering the second line at a predetermined location for component installation; and installing a second electronic component in the slot having a third terminal electrically connected to the first line exposed by the slot and a fourth terminal electrically connected to the second line exposed by the slot.

[0007] The present invention includes wiring on which an electronic component is installed. The wiring includes a first line, an insulating layer, a first opening, a first aperture, and a second aperture. The first line includes a first line segment and a second line segment. The insulating layer covers the first line. The first opening is located within the insulating layer and between the first line segment and the second line segment. The first aperture is located within the first aperture and partially exposes the first line. The second aperture is located within the first aperture and partially exposes the second line. A first electronic component is installed within the first aperture, having a first terminal electrically connected to the first line segment exposed by the first aperture, and a second terminal electrically connected to the second line segment exposed by the second aperture.

[0008] The present invention further includes wiring comprising a first line, a second line, an insulating layer, and a slot, on which an electronic component is installed. The second line is installed alongside the first line. The insulating layer covers the first line and the second line. The slot is located within the insulating layer and partially exposes the first line and the second line. A second electronic component is installed within the slot, having a third terminal electrically connected to the first line exposed by the slot, and a fourth terminal electrically connected to the second line exposed by the slot.

[0009] As described above, the method for installing electronic components on wiring according to the present invention and the wiring on which electronic components are installed allow for the installation and connection of electronic components connected in series and parallel in a flexible, economical, and optimal manner by installing electronic components on wiring using readily available wiring. [Brief explanation of the drawing]

[0010] [Figure 1A-1D] This is a cross-sectional step flowchart of a first method for installing electronic components on wiring according to the present invention. [Figure 2A-2D] These are top views corresponding to Figures 1A to 1D. [Figure 3] This is a cross-sectional view showing the installation of electronic components on the first track. [Figure 4A-4C]This is a cross-sectional step flowchart of a second method for installing electronic components on wiring according to the present invention. [Figure 5A-5B] This is a perspective view and a partially enlarged view showing the installation of electronic components on wiring by combining the first and second methods according to the present invention. [Figures 6A-6E] This is a step flowchart for bending wiring tracks according to the present invention. [Modes for carrying out the invention]

[0011] Referring to Figures 1A to 1D, and correspondingly to Figures 2A to 2D and Figure 3, Figures 1A to 1D are cross-sectional step flowcharts of a first method for installing electronic components on wiring according to the present invention, Figures 2A to 2D are top views corresponding to Figures 1A to 1D, and Figure 3 is a cross-sectional view in which electronic components are installed on a first line. The method for installing electronic components on wiring comprises the following steps. As shown in Figures 1A and 2A, first, wiring 10 is provided, which includes a first line 11 and an insulating layer 12, the insulating layer 12 includes a two-layer structure, upper and lower, covering the first line 11, and for simplification, only the upper insulating layer 12 is shown in the figures. As shown in Figures 1B and 2B, a first opening 13 is formed by cutting the first line 11 and the insulating layer 12 on the wiring 10, and the first line 11 after cutting forms a first line segment 11a and a second line segment 11b. In embodiments of the present invention, the method for cutting the insulating layer 12 and the first line 11 includes using various tools such as cutting tools and punching machines. Furthermore, the underlying insulating layer 12 may or may not be cut, and is not limited in the present invention. As shown in Figures 1C and 2C, a first opening 141 and a second opening 142 are formed by partially removing the insulating layer 12 covering the first line 11 at the location of the first opening 13, wherein the first opening 141 partially exposes the first line segment 11a of the first line 11, and the second opening 142 partially exposes the second line segment 11b of the first line 11. In embodiments of the present invention, the method for removing a portion of the insulating layer 12 includes melting or cutting. As shown in Figures 1D, 2D, and 3, a first electronic component E1 is placed in the first opening 13, and the first electronic component E1 has a first terminal (pin) E1a and a second terminal (pin) E1b, the first terminal E1a is electrically connected to the first line segment 11a exposed by the first opening 141, and the second terminal E1b is electrically connected to the second line segment 11b exposed by the second opening 142.In embodiments of the present invention, the method for installing the first electronic component E1 on the first line segment 11a and the second line segment 11b includes surface mount technology (SMT), or the first terminal E1a and the second terminal E1b of the first electronic component E1 are bonded to the first line segment 11a and the second line segment 11b using an adhesive.

[0012] Referring to Figures 4A to 4C, Figures 4A to 4C are step flowcharts of a cross-section of a second method for installing electronic components on wiring according to the present invention. In the steps of the method described above, by installing the first electronic component E1 on both ends of the broken first line 11, not only are the terminals of the electronic component connected to the same line, but in fact, since the wiring 10 includes multiple parallel lines, the terminals of the electronic component can also be connected to each of the parallel lines in the wiring 10. More specifically, the wiring 10 has a second line 15, the first line 11 is installed alongside the second line 15, and the insulating layer 12 covers the second line 15. The method for installing electronic components on wiring comprises the following steps. As shown in Figure 4A, Figure 4A shows a cross-sectional view of the first line 10 and the second line 15 running parallel in the wiring 10. As shown in Figure 4B, a slot 16 is formed by removing a portion of the insulating layer 12 covering the first line 11 and a portion of the insulating layer 12 covering the second line 15 at a predetermined position for component installation. As shown in Figure 4C, a second electronic component E2 is installed in the slot 16, and the second electronic component E2 has a third terminal E2a that is electrically connected to the first line 11 exposed by the slot 16, and a fourth terminal E2b that is electrically connected to the second line 15 exposed by the slot 16.

[0013] Refer to Figures 5A and 5B, which are perspective and partially enlarged views of a combination of the first and second methods according to the present invention for installing electronic components on wiring. In this embodiment, the first and second methods are combined simultaneously to install both the first electronic component E1 and the second electronic component E2 on wiring 10. The wiring has a second line, the first line is installed alongside the second line, and an insulating layer covers the first and second lines. In this embodiment, the method for installing electronic components on wiring includes the following steps. In step S10, wiring 10 is provided, which includes a first line 11 and an insulating layer 12, the insulating layer 12 includes an upper and lower two-layer structure and covers the first line 11. In step S11, a first opening 13 is formed by cutting the first line 11 and the insulating layer 12 on the wiring 10, and the cut first line 11 forms a first line segment 11a and a second line segment 11b. In step S12, a first opening 141 and a second opening 142 are formed by removing the insulating layer 12 covering the first line 11 at the location of the first opening 13, and the first opening 141 partially exposes the first line segment 11a of the first line 11, and the second opening 142 partially exposes the second line segment 11b of the first line 11. In step S13, a first electronic component E1 is placed in the first opening 13. The first electronic component E1 has a first terminal E1a and a second terminal E1b. The first terminal E1a is electrically connected to the first line segment 11a exposed by the first opening 141, and the second terminal E1b is electrically connected to the second line segment 11b exposed by the second opening 142. In step S14, a slot 16 is formed by removing a portion of the insulating layer 12 covering the first line 11 and a portion of the insulating layer 12 covering the second line 15 at the predetermined component installation location. In step S15, a second electronic component E2 is placed in the slot 16. The second electronic component E2 has a third terminal E2a and a fourth terminal E2b. The third terminal E2a is electrically connected to the first line segment 11 exposed in the slot 16, and the fourth terminal E2b is electrically connected to the second line segment 15 exposed in the slot 16.

[0014] Referring again to Figure 1D, in the embodiment of Figure 1D, the wiring on which the electronic components are installed includes wiring 10, which has a first line 11, an insulating layer 12, a first opening 13, a first opening 141 and a second opening 142. The first line 11 includes a first line segment 11a and a second line segment 11b. The insulating layer 12 covers the first line 11. The first opening 13 is located within the insulating layer 12 and between the first line segment 11a and the second line segment 11b. The first opening 141 is located within the first opening 13 and partially exposes the first line segment 11a. The second opening 142 is located within the first opening 13 and partially exposes the second line segment 11b. A first electronic component E1 is installed in the first opening 13, and the first electronic component E1 has a first terminal E1a and a second terminal E1b, the first terminal E1a is electrically connected to the first line segment 11a exposed by the first opening 141, and the second terminal E1b is electrically connected to the second line segment 11b exposed by the second opening 142.

[0015] Referring again to Figure 3, in the embodiment of Figure 3, the wiring on which the electronic component is installed includes a first line 11, a second line 15, an insulating layer 12, and a slot 16. The second line 15 is installed alongside the first line 11. The insulating layer 12 covers the first line 11 and the second line 15. The slot 16 is located within the insulating layer 12 and partially exposes the first line 11 and the second line 15. A second electronic component E2 is installed within the slot 16, and the second electronic component E2 has a third terminal E2a and a fourth terminal E2b, the third terminal E2a is electrically connected to the exposed first line 11 in the slot 16, and the fourth terminal E2b is electrically connected to the exposed second line 15 in the slot 16.

[0016] Referring together to Figures 1D, 3, and 5A, the wiring on which the electronic components are installed includes a first line 11, an insulating layer 12, a first opening 13, a first opening 141, a second opening 142, and a slot 16. The first line 11 includes a first line segment 11a and a second line segment 11b. The insulating layer 12 covers the first line 11 and the second line 15. The second line 15 is installed alongside the first line 11. The first opening 13 is located within the insulating layer 12 and between the first line segment 11a and the second line segment 11b. The first opening 141 is located within the first opening 13 and partially exposes the first line segment 11a. The second opening 142 is located within the first opening 13 and partially exposes the second line segment 11b. A first electronic component E1 is installed in the first opening 13, and the first electronic component E1 has a first terminal E1a and a second terminal E1b, the first terminal E1a is electrically connected to the exposed first line segment 11a in the first opening 141, and the second terminal E1b is electrically connected to the exposed second line segment 11b in the second opening 142. The slot 16 is located within the insulating layer 12 and partially exposes the first line 11 and the second line 15. A second electronic component E2 is installed in the slot 16, and the second electronic component E2 has a third terminal E2a and a fourth terminal E2b, the third terminal E2a is electrically connected to the exposed first line segment 11 in the slot 16, and the fourth terminal E2b is electrically connected to the exposed second line segment 15 in the slot 16.

[0017] In embodiments of the present invention, the first electronic component E1 and the second electronic component E2 include surface mount technology components, terminal type components (e.g., resistors, capacitors, transistors, light-emitting diodes, etc.), and fuses, and the first electronic component E1 and the second electronic component E2 are installed on the first line 11 and the second line 15 by using different installation methods depending on the different first electronic component E1 and the second electronic component E2. The wiring 10 includes transmission wiring made of Flexible Flat Cable (FFC) material, such as IDE (Integrated Device Electronics) wiring and SATA (Serial Advanced Technology Attachment) wiring. Therefore, the method of installing electronic components on wiring according to the present invention allows for the flexible installation of a wide variety of electronic components on the wiring 10.

[0018] Referring to Figures 6A to 6E, Figures 6A to 6E are step flowcharts for bending wiring lines according to the present invention. Since the wiring 10 and lines are made of a flexible material, if the wiring is not limited to being installed on a flat surface, the present invention allows each line within the wiring 10 to be bent by the bending method and connected to the required position as needed. As shown in Figure 6A, first, the installation position of the bending line 17 is drawn on the insulating layer 12 on the wiring 10. As shown in Figure 6B, based on the position of the bending line 17, the excess first line 11, second line 15 and the insulating layer 12 covering the outside of the first line 11 and second line 15 are removed. As shown in Figure 6C, the first line 11 and second line 15 at one end of the wiring 10 are connected to the circuit board B. As shown in Figure 6D, on a plane, the first track 11 and the second track 15 are bent in various predetermined directions and angles based on their installation positions. In this embodiment of the present invention, the bending angle is 90 degrees as an example, but is not limited to 90 degrees. As shown in Figure 6E, in space, the three-dimensional wiring structure of the wiring 10 is formed by bending the first track 11 and the second track 15 in various predetermined directions and angles based on their installation positions. Note that while the step flowcharts for bending the wiring in Figures 6A to 6E were explained using the first method of installing electronic components on the wiring (Figures 1A to 1D) as an example, in practice, the step flowcharts for bending the wiring in Figures 6A to 6E can also be applied to the second method of installing electronic components on the wiring (Figures 4A to 4C) and to combinations of the first and second methods (Figures 5A and 5B).

[0019] As described above, the method for installing electronic components on a wiring according to the present invention can install and connect electronic components connected in series and parallel in a flexible, economical, and optimal manner by installing the electronic components on the wiring with easily available wirings. Further, compared with the prior art using a Flexible Printed Circuit material, in the prior art, in the manufacturing process of processing, it is necessary to perform processing with a flexible circuit board. For example, by performing drilling, development, exposure, and etching on the circuit board, the installation of the circuit is completed, so it is necessary to use more steps and materials in the overall processing and manufacturing method. In comparison, the method for installing electronic components on a wiring according to the present application only requires attaching a molded electronic component to the circuit of a single copper wire in the wiring, so the material loss is relatively small. Further, compared with conventional products originally using flexible wiring materials, the product completed by combining the Surface Mount Technology (SMT) with flexible wiring (FFC) materials according to the present application can withstand the high temperature of 260 degrees in SMT manufacturing, so the high-temperature resistance characteristics of the product can be significantly enhanced, and it can be more widely applied to various electronic components such as resistors, capacitors, light-emitting diodes, etc., and due to the complexity, the diversity of the product can be realized. Further, compared with the conventional flexible flat wiring where a fuse can only be installed at the input / output position of the circuit board, when installing a fuse as an electronic component on a wiring according to the present application, the product completed by combining the Surface Mount Technology (SMT) with flexible wiring (FFC) materials can install the fuse at a position near the battery module, so when an overcurrent load occurs, the fuse can achieve the effects of rapid response and instantaneous fusing, and the safety of the product can be further enhanced.

Explanation of Reference Numerals

[0020] 10 Wiring 11 First Circuit 11a First Line Segment 11b Second Line Segment 12 Insulation Layer [[ID=​​​142 Second opening 15 Second line 16 Slot 17 Fold line E1 First electronic component E1a First terminal E1b Second terminal E2 Second electronic component E2a Third terminal E2b Fourth terminal B Circuit board

Claims

1. A method for installing electronic components in wiring, The steps include providing a first line and wiring having an insulating layer covering the first line, The first line and the insulating layer within the wiring are cut to form a first opening, and the cut first line forms a first line segment and a second line segment, The steps of forming a first opening that partially exposes the first line segment of the first line and a second opening that partially exposes the second line segment of the first line by partially removing the insulating layer covering the first line at the location of the first opening, The step of installing a first electronic component in the first opening, having a first terminal electrically connected to the first line segment exposed by the first opening and a second terminal electrically connected to the second line segment exposed by the second opening, The wiring further comprises a second line, the first line being installed alongside the second line, and the insulating layer further covering the second line. The aforementioned method, The steps include forming a slot by removing a portion of the insulating layer covering the first line and a portion of the insulating layer covering the second line at a predetermined position for component installation, The steps include installing a second electronic component in the slot, which has a third terminal electrically connected to the first line exposed by the slot and a fourth terminal electrically connected to the second line exposed by the slot, The steps include: installing at least one bent wire on the insulating layer of the wiring; A step of removing the insulating layer that covers a portion of the first line, a portion of the second line, and the first line and the second line, based on the installation position of the at least one bend line, The steps include connecting one end of the first line and the second line of the wiring to the circuit board, A step of bending the first track and the second track on a plane at a first predetermined angle and in a first predetermined direction based on the installation position of the at least one bending line, A method for installing electronic components on wiring, further comprising the step of bending the first line and the second line in space at a second predetermined angle and in a second predetermined direction based on the installation position of the at least one bent line.

2. The first track includes the first line segment and the second line segment, An insulating layer covering the first line, A second track is installed alongside the first track and is covered by the insulating layer, A slot located within the insulating layer, which partially exposes the first line and the second line, A first opening located within the insulating layer and between the first line segment and the second line segment, A first opening located within the first opening and partially exposing the first track, The wiring includes a second opening located within the first opening and partially exposing the second track, A first electronic component is installed in the first opening, having a first terminal electrically connected to the first line segment exposed by the first opening, and a second terminal electrically connected to the second line segment exposed by the second opening. A second electronic component is installed in the slot, having a third terminal electrically connected to the first line exposed by the slot, and a fourth terminal electrically connected to the second line exposed by the slot. The wiring further comprises at least one bent wire placed on the insulating layer of the wiring, Based on the installation position of the at least one bend line, a portion of the first line, a portion of the second line, and the insulating layer covering the outside of the first line and the second line are removed. One end of the first line and the second line of the wiring are connected to the circuit board. Based on the installation position of the at least one bending line, the first track and the second track are bent on a plane at a first predetermined angle and in a first predetermined direction. Based on the installation position of the at least one bending line, the first track and the second track are bent in space at a second predetermined angle and in a second predetermined direction. Wiring on which electronic components characterized by the above are installed.

3. The wiring in which the electronic components according to claim 2 are installed is characterized in that the first electronic component and the second electronic component are fuses.

Images