IC inspection socket

Abstract

An IC inspection socket comprising: a pin block having a plurality of contact probes; a floating plate for guiding an IC package to be inspected; and a heat-generating body for heating the IC package. The heat-generating body is in contact with the IC package.

Description

IC inspection socket

[0001] The present invention relates to an IC (Integrated Circuit) inspection socket.

[0002] An IC inspection socket is used to inspect an IC package (see, for example, Patent Document 1).

[0003] The IC testing socket has a pin block on which a plurality of contact probes corresponding to each electrode terminal of the IC are erected, and a guide member provided above the pin block. When the IC package to be tested is inserted into the guide member with the electrode terminals facing downward, the IC package is guided onto the contact probes in a predetermined position. By pressing the IC package from above to below appropriately, the electrode terminals of the IC package come into contact with the contact probes, ensuring an electrical path for testing.

[0004] Japanese Patent Application Laid-Open No. 2020-17455

[0005] Inspection of IC packages covers not only performance at room temperature but also performance at high temperatures, i.e., high-temperature performance. Conventional technology, in which high-temperature performance is inspected by installing the inspection equipment in dedicated equipment that can reproduce a high-temperature environment, such as a high-temperature room, has not made it possible to easily inspect high-temperature performance.

[0006] An example of an object of the present invention is to provide an IC test socket capable of testing high temperature performance. Other objects of the present invention will become apparent from the description of this specification.

[0007] One aspect of the present invention is an IC testing socket comprising a pin block having a plurality of contact probes, a floating plate that guides an IC package to be tested, and a heating element that heats the IC package, the heating element contacting the IC package.

[0008] According to an aspect of the present invention, the IC testing socket can heat the IC package to be tested using a built-in heating element. Unlike conventional methods, there is no need to install the entire testing device in a high-temperature chamber. Instead, the testing device can be installed in a room-temperature environment, and the temperature of the IC package to be tested can be directly raised to test its high-temperature performance. If the heating element is not heated, performance testing at room temperature is also possible.

[0009] 2. An external view showing an example of the configuration of an IC inspection socket. A top view of a socket main body as viewed from the positive side of the Z axis. A side view of the socket main body as viewed from the negative side of the Y axis. A side view of the socket main body as viewed from the negative side of the X axis. A top view of a pin block as viewed from the positive side of the Z axis. A top view of a heating element as viewed from the positive side of the Z axis. A diagram showing an example of an inner layer pattern. A top view of a floating plate as viewed from the positive side of the Z axis. A bottom view of a floating plate as viewed from the negative side of the Z axis. A side view of a floating plate as viewed from the negative side of the Y axis. A side view of a floating plate as viewed from the negative side of the X axis. A cross-sectional view taken along XII-XII in FIG. 2 in a state not being inspected. A cross-sectional view taken along XII-XII in FIG. 2 in a state being inspected. A schematic diagram for explaining heating of an IC package during inspection. A diagram showing a modified inner layer pattern.

[0010] Although a preferred embodiment of the present invention will be described below, the form to which the present invention can be applied is not limited to the following embodiment. Three orthogonal axes are shown to indicate common directions in each figure. The three orthogonal axes are a right-handed system in which the positive Z-axis direction is the upward direction and the XY plane is the horizontal plane. The negative Z-axis direction is the downward direction.

[0011] 1 is an external view showing an example of the configuration of an IC testing socket 10 according to this embodiment. The IC testing socket 10 includes a socket body 30, a lid 14 disposed above the socket body 30, and a pressure mechanism 16. In FIG. 1, the IC testing socket 10 is intentionally shaded to make it easier to distinguish.

[0012] The socket body 30 is mounted on the inspection device body 11 and electrically connected to the electrical circuit for inspection. The lid 14 is supported by a lid swing shaft 18 along the X-axis direction, supported by the bearing 12, so as to be able to swing up and down, and supports a pressure mechanism 16 above the socket body 30. The pressure mechanism 16 applies a downward load to the IC package 9 to be inspected that is inserted into the socket body 30.

[0013] The lid 14 has a hook 20 on the side opposite the lid swing shaft 18. The hook 20 is swingably supported by a hook swing shaft 22 along the X-axis direction. The hook 20 is biased by a coil spring 24 around the hook swing shaft 22 in the clockwise direction when viewed from the negative side of the X-axis.

[0014] Hook 20 engages with engaging claw 21, thereby maintaining a state in which lid 14 covers the top of socket body 30. When hook 20 is released and lid 14 is swung, socket body 30 is exposed, allowing IC package 9 to be inserted or removed.

[0015] Fig. 2 is a top view of the socket body 30. Fig. 3 is a side view of the socket body 30 as viewed from the negative Y-axis side. Fig. 4 is a side view of the socket body 30 as viewed from the negative X-axis side.

[0016] The socket body 30 has, stacked in this order from the negative Z-axis side (bottom), a pin block 40, a heating element 60, and a floating plate 80. The positions of these three components in a direction parallel to the XY plane are determined by positioning pins 35.

[0017] The pin block 40 is a component equivalent to a base for mounting on the inspection device main body 11 (see FIG. 1). A plurality of contact probes are erected along the Z-axis direction (vertical direction) in the center of the pin block 40 as viewed from the positive side of the Z-axis. A collection of a plurality of contact probes will be referred to as a contact probe array 31 in the following description.

[0018] The floating plate 80 is a guide part that guides the IC package 9 to be inspected so that it is at a predetermined relative position and posture with respect to the contact probe array 31. The floating plate 80 is elastically supported in the Z-axis direction (up and down direction) from the upper surface of the pin block 40 by a guide screw 32 and a floating spring 33.

[0019] Specifically, the guide screw 32 is a long screw that extends in the vertical direction and is screwed onto the upper surface of the pin block 40. The neck of the guide screw 32 is fitted into the floating plate 80 so that there is a small gap in the fitting portion. The floating plate 80 is guided by the guide screw 32 and can slide up and down.

[0020] A floating spring 33 is sandwiched between the lower surface of the floating plate 80 and the upper surface of the pin block 40. The floating plate 80 is constantly biased upward (toward the positive side of the Z axis). The upper surface of the floating plate 80 abuts against the seating surface of the guide screw 32, thereby restricting its upward movement.

[0021] The heating element 60 is a plate-shaped component. The heating element 60 is elastically supported above and below the upper surface of the pin block 40 by the heating element springs 34 between the pin block 40 and the floating plate 80. The heating element 60 is constantly biased upward (toward the positive side of the Z axis) by the heating element springs 34. The upper surface of the heating element 60 abuts against the lower surface of the floating plate 80, thereby restricting upward movement of the heating element 60.

[0022] Figure 5 is a top view of the pin block 40 as viewed from the positive side of the Z axis. The pin block 40 has, on its top surface, probe insertion holes 41 through which the contact probe array 31 is inserted, female threaded portions 42 for the guide screws 32, spring receiving holes 43, spring receiving holes 44, and pin holes 45. The probe insertion holes 41 correspond to each of the multiple white circles within the area surrounded by the dashed line in Figure 5. Each of these white circles is the insertion hole for one of the contact probes. The spring receiving holes 43 are receiving holes for the floating springs into which the lower ends of the floating springs 33 are fitted. The spring receiving holes 44 are receiving holes for the heating element springs into which the lower ends of the heating element springs 34 are fitted. The pin holes 45 are holes into which the lower ends of the positioning pins 35 are fitted.

[0023] 6 is a top view of the heating element 60 as viewed from the positive side of the Z axis. The heating element 60 is a plate-shaped heat-generating member having an electric circuit that serves as a heat source. The heating element 60 is made of, for example, low temperature co-fired ceramics (LTCC).

[0024] The heating element 60 has probe insertion holes 61, through which each contact probe of the contact probe array 31 is inserted, at a contact portion that contacts the IC package 9. In the example of FIG. 6 , the contact portion is provided in the center of the heating element 60. The heating element 60 has screw insertion holes 62, spring insertion holes 63, pin insertion holes 65, a relief portion 66, and an inner layer pattern 68 (only a portion of which is shown in FIG. 6 ). The screw insertion holes 62 are through holes through which the guide screws 32 are inserted. The spring insertion holes 63 are through holes through which the floating springs 33 are inserted. The pin insertion holes 65 are through holes through which the positioning pins 35 are inserted. The inner layer pattern 68 is wiring formed inside a non-conductive ceramic main body 69. The inner layer pattern 68 is provided at least in the contact portion of the heating element 60 that contacts the IC package 9.

[0025] The relief portion 66 is a cutout portion where the width of the heating element 60 is partially narrowed. The relief portion 66 is a portion that fits loosely onto the protrusion 84 of the floating plate 80 (see FIG. 9).

[0026] 7 is a diagram showing an example of an inner layer pattern 68. The inner layer pattern 68 (thick solid line) is a metal wire at least partly arranged so as to thread between the probe insertion holes 61 (white circles indicated by thin lines). Specifically, the inner layer pattern 68 has an outer peripheral portion 68a arranged outside the group of probe insertion holes 61 and an inter-hole meandering portion 68b threading between the probe insertion holes 61. Because the metal wire is wired so as to thread between the probe insertion holes 61, it is possible to prevent temperature unevenness during heating when viewing the entire group of probe insertion holes 61.

[0027] External wiring 67 is connected to both ends of the inner layer pattern 68. Electricity is applied to the inner layer pattern 68 from the heat source power supply circuit of the inspection device main body 11 via the external wiring 67. The inner layer pattern 68 acts as a kind of heating wire.

[0028] Fig. 8 is a top view of the floating plate 80 as viewed from the positive side of the Z axis. Fig. 9 is a bottom view of the floating plate 80 as viewed from the negative side of the Z axis. Fig. 10 is a side view of the floating plate 80 as viewed from the negative side of the Y axis. Fig. 11 is a side view of the floating plate 80 as viewed from the negative side of the X axis.

[0029] 8 , the floating plate 80 has an accommodation hole 81, a screw insertion hole 82, a positioning hole 85, and a wiring hole 87. The accommodation hole 81 is a through hole that accommodates the IC package 9 to be inspected. The screw insertion hole 82 is a through hole through which the guide screw 32 is inserted. The positioning hole 85 is a through hole through which the positioning pin 35 is inserted. The wiring hole 87 is a through hole through which the state of the external wiring 67 is observed from above.

[0030] As shown in Figure 9, the floating plate 80 has, on its underside, a spring receiving hole 83, a protrusion 84, a wiring groove 86, and an observation groove 89. The spring receiving hole 83 is a receiving hole for the floating spring into which the upper end of the floating spring 33 fits. The protrusion 84 is a protrusion that comes into contact with the upper surface of the pin block 40 during inspection. The wiring groove 86 is a groove for passing the external wiring 67 connected to the heating element 60 from the outside. The wiring groove 86 can prevent the external wiring 67 from shifting or breaking due to sliding of the heating element 60. The observation groove 89 is a groove provided along the X-axis direction, crossing the accommodation hole 81.

[0031] The protrusions 84 are provided at the center of the floating plate 80 in the X-axis direction, on both sides of the Y-axis minus and plus sides, facing the Z-axis minus side (downward). The contour shape of the protrusions 84 when viewed from below matches the contour shape of the relief portions 66 of the heating element 60 when viewed from above. The outer peripheral vertical surface of the protrusions 84 functions as a guide when sliding the heating element 60 up and down. The protrusion length Ht (see FIG. 10) of the protrusions 84 is set larger than the thickness Wh of the heating element 60 (see FIG. 4: dimension in the Z-axis direction).

[0032] 12 is a cross-sectional view taken along line XII-XII in FIG. 2 in a state before inspection, with the contact probe array 31 omitted from the illustration.

[0033] When not in inspection, the floating plate 80 is biased in the positive direction of the Z axis relative to the pin block 40 by the floating spring 33. The floating plate 80 is maintained in a state in which its upper surface abuts against the seating surface of the guide screw 32, and is raised a first distance D1 above the upper surface of the pin block 40. Specifically, the seating height Hn of the guide screw 32 is set to be larger than the hole length L (see FIG. 4) of the screw insertion hole 82 through which the guide screw 32 is inserted. In FIG. 4, the seating height Hn is the distance from the upper surface of the pin block 40 to the lower surface of the seating surface of the guide screw 32 when the screw is fastened. The difference between the seating height Hn and the hole length L of the screw insertion hole 82 is the first distance D1.

[0034] The heating element 60 is disposed between the floating plate 80 and the pin block 40 so that the protrusions 84 of the floating plate 80 fit into the notched spaces provided by the recesses 66 .

[0035] The heating element 60 is biased in the positive direction of the Z axis against the pin block 40 by the heating element spring 34. A floating plate 80 hangs over the heating element 60. The thickness Wh of the heating element 60 is set to be smaller than the protrusion length Ht of the protrusion 84. Therefore, the heating element 60 is suspended above the upper surface of the pin block 40 by a second distance D2.

[0036] 13 is a cross-sectional view taken along line XII-XII in FIG. 2 during testing, with the contact probe array 31 omitted from the illustration.

[0037] During testing, the IC package 9 is pressed downward against the contact probe array 31 by the pressure mechanism 16 (see FIG. 1 ). Accordingly, the floating plate 80 is also pressed downward, and the protrusions 84 come into contact with the upper surface of the pin block 40. The distance from the lower surface of the protrusions 84 of the floating plate 80 to the upper surface of the pin block 40 decreases from the first distance D1 to a third distance D3. The third distance D3 is substantially zero.

[0038] As the floating plate 80 is pushed down, the heating element 60 is also pushed down. The second distance D2 also decreases, but because the thickness Wh of the heating element 60 is set to be smaller than the protrusion length Ht of the protrusion 84, the second distance D2 does not become "0" and the fourth distance D4 is maintained. The fourth distance D4 is greater than zero and smaller than the second distance D2.

[0039] The heating element 60 is constantly biased upward (towards the positive side of the Z axis) by the heating element spring 34. This ensures contact between the heating element 60 and the IC package 9. The pressing force of the pressure mechanism 16 also acts on the heating element 60, but the elastic support of the heating element spring 34 allows this force to be appropriately released, preventing damage to the heating element 60.

[0040] FIG. 14 is a schematic diagram for explaining heating of the IC package 9 during inspection, and is a diagram showing a schematic cross section taken along the line XII-XII in FIG.

[0041] During testing, current is passed through the inner layer pattern 68 of the heating element 60 via the external wiring 67. The inner layer pattern 68 of the heating element 60 acts as a heating wire. The heating element 60 heats up around the contact portion of the heating element 60 that comes into contact with the IC package 9. This makes it possible to easily test the high-temperature performance of the IC package 9 even in a room-temperature environment.

[0042] Even if the electrode terminals of the IC package 9 come into contact with the contact probes 39 due to the temperature rise of the heating element 60 and heat conduction occurs, a drop in the temperature of the IC package 9 can be suppressed.

[0043] The heating element 60 is spaced apart from the upper surface of the pin block 40 even during testing, which prevents heat from the heating element 60 from being directly conducted to the pin block 40 and escaping. This provides more efficient heat transfer characteristics than a configuration in which the heating element 60 is not spaced apart.

[0044] The state of the IC package 9 during inspection can be visually confirmed through the space 4 formed between the observation groove portion 89 and the heating element 60. The space 4 can also be used for routing wiring etc. when attaching a thermocouple to the IC package 9 or the heating element 60.

[0045] (Modifications) Although the embodiments of the present invention have been described, the forms to which the present invention can be applied are not limited to the above-described forms, and constituent elements can be added, omitted, or modified as appropriate.

[0046] For example, the inner layer pattern 68 is not limited to the example in Fig. 7, and the pattern can be changed or set depending on the arrangement of the probe insertion holes 61. For example, an inner layer pattern 68B shown in Fig. 15 may be used.

[0047] Furthermore, in the above embodiment, one socket is configured to inspect one IC package 9, but a configuration may be adopted in which one socket can inspect a plurality of IC packages 9.

[0048] (Summary) The disclosure of the above embodiment and modified examples can be summarized as follows.

[0049] An aspect of the present disclosure is an IC testing socket comprising a pin block having a plurality of contact probes, a floating plate that guides an IC package to be tested, and a heating element that heats the IC package, the heating element contacting the IC package.

[0050] According to this aspect, the IC inspection socket can heat the IC package to be inspected using a built-in heating element. Even when inspecting high-temperature performance, there is no need to install the entire inspection device in a high-temperature chamber, and the inspection device can be installed in a room-temperature environment and the temperature of the IC package to be inspected can be directly raised to inspect the high-temperature performance. Even if heat conduction occurs due to contact between the electrode terminals of the IC package and the contact probes, a temperature drop in the IC package can be suppressed. If heating by a heating element is not required, the same socket can also be used to inspect room-temperature performance.

[0051] The heating element may have insertion holes corresponding to the plurality of contact probes, and a metal wire at least a portion of which is provided so as to thread between the insertion holes.

[0052] In this case, heat can be distributed throughout the entire heating element, preventing uneven temperature distribution, compared to when the metal wire is not arranged like a stitch.

[0053] The heating element may be between the pin block and the floating plate.

[0054] In this case, the heating element comes into direct contact with the IC package, and the IC package can be heated efficiently.

[0055] The heating element may be elastically supported by the pin block.

[0056] By elastically supporting the heating element, contact between the heating element and the IC package can be ensured. During testing, the IC package is pressed against the heating element, but the pressing force acting on the heating element is appropriately released, preventing damage to the heating element and the IC package.

[0057] The floating plate may have a protrusion that contacts the pin block.

[0058] During inspection, even if the floating plate is pushed toward the pin block, the protrusions come into contact with the pin block, ensuring a space equal to the protruding dimension of the protrusions.

[0059] The protrusion length of the protrusion may be longer than the thickness of the heating element.

[0060] In this case, the heating element can be housed in the space created when the protrusion contacts the pin block, and the floating plate can be protected from the load that presses on it.

[0061] The floating plate may have a wiring groove on its lower surface through which external wiring connected to the heating element passes.

[0062] In this case, it is possible to prevent the wiring from being displaced or broken due to sliding of the heating element.

[0063] The floating plate may have a groove on its lower surface through which the IC package accommodated in the accommodation hole can be viewed from the side.

[0064] In this case, the state of the IC package during inspection can be visually confirmed, so that the inspection of the IC package can be performed accurately and damage to the IC package during inspection can be suppressed. Furthermore, it can also be used for routing wiring when attaching a thermocouple to an IC package or a heating element.

[0065] DESCRIPTION OF THE REFERENCE NUMERALS 4...Space 9...IC package 10...IC testing socket 11...Testing device main body 12...Bearing portion 14...Cover 16...Pressure mechanism 18...Cover swing shaft 20...Hook 21...Engagement claw 22...Hook swing shaft 24...Coil spring 30...Socket main body 31...Contact probe array 32...Guide screw 33...Floating spring 34...Heater element spring 35...Positioning pin 39...Contact probe 40...Pin block 41...Probe insertion hole 42...Female thread portion 43...Spring receiving hole for floating spring 44...Spring receiving hole for heater element spring 45...Pin hole 60...Heater element 61...Probe insertion hole 62...Screw insertion hole 63...Spring insertion hole 65...Pin insertion hole 66...Relief portion 67...External wiring 68, 68B...Inner layer pattern 68a...Outer periphery 68b...Meandering portion between holes 69...Ceramic main body 80...Floating plate 81...Accommodation hole 82...Screw insertion hole 83...Spring receiving hole for floating spring 84...Protrusion 85...Positioning hole 86...Wiring groove 87...Wiring hole 89...Observation groove D1...First distance D2...Second distance D3...Third distance D4...Fourth distance Hn...Seat height Ht...Protrusion length L...Hole length Wh...Thickness of heating element Wt...Protrusion length

Claims

1. a pin block having a plurality of contact probes; a floating plate for guiding an IC package to be inspected; a heating element for heating the IC package, the heating element has insertion holes corresponding to the plurality of contact probes, The heating element is in contact with the IC package.

2. 2. The IC testing socket according to claim 1, wherein said heating element has a metal wire at least a portion of which is provided between said insertion holes.

3. An IC inspection socket as described in claim 1, wherein the heating element has a metal wire provided around at least a portion of the plurality of insertion holes.

4. A pin block having a plurality of contact probes; a floating plate for guiding an IC package to be inspected; a heating element for heating the IC package, The heating element is located between the pin block and the floating plate and contacts the IC package.

5. 5. The IC testing socket according to claim 1, wherein said heating element is elastically supported by said pin block.

6. 6. The IC testing socket according to claim 1, wherein said floating plate has a protrusion that contacts said pin block.

7. 7. The IC testing socket according to claim 6, wherein a length of said projection is longer than a thickness of said heating element.