Display system

Abstract

Provided are a display device having a novel configuration and a display system having a novel configuration. This display system has a first display device capable of AR display, and a second display device. The first display device has a first display unit that displays a first image so as to overlap a transparent image, and the second display device has a second display unit. The first display device has the function of acquiring position information of the second display unit, and the display position of the first image is determined using the position information of the second display unit as a reference.

Description

Display System

[0001] One aspect of the present invention relates to a display device and a display system including the display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include a semiconductor device, an imaging device, a display device, a light-emitting device, a power storage device, a memory device, a display system, an electronic device, a lighting device, an input device, an input / output device, a driving method thereof, or a manufacturing method thereof.

[0003] In this specification and the like, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics. Display devices (liquid crystal display devices, light-emitting display devices, etc.), projection devices, lighting devices, electro-optical devices, power storage devices, memory devices, semiconductor circuits, imaging devices, electronic devices, etc. may be referred to as semiconductor devices. Alternatively, they may be referred to as including semiconductor devices.

[0004] BACKGROUND ART Smartphones, tablets, wearable electronic devices, and stationary electronic devices are becoming increasingly popular as electronic devices equipped with display devices for augmented reality (AR) or virtual reality (VR). Examples of wearable electronic devices include head-mounted displays (HMDs) and eyeglass-type electronic devices. Examples of stationary electronic devices include head-up displays (HUDs).

[0005] One known AR technology is a technology that uses a two-dimensional barcode printed on paper or the like. The two-dimensional barcode is captured by a camera, the captured image is identified, and a three-dimensional image corresponding to the two-dimensional barcode is displayed at the position of the two-dimensional barcode, thereby achieving a visual effect in which real space and virtual space are superimposed. Patent Document 1 discloses a game system that utilizes AR technology, which uses a game device (electronic device), a board, and cards.

[0006] JP 2012-178068 A

[0007] As in Patent Document 1, there are display systems that overlay an AR display on a two-dimensional barcode printed on a paper medium or the like. However, with printed materials such as paper media, it is difficult to change the content after printing, and it has been necessary to use multiple printed materials such as game boards and game cards. In other words, to enjoy multiple games, multiple printed materials are required, which poses problems such as poor portability, increased storage space, and a higher risk of loss.

[0008] Therefore, an object of one embodiment of the present invention is to realize a system that uses a display device such as a liquid crystal display or an organic EL display instead of a printed material that is overlaid with an AR display. Note that although the problem to be solved by the present invention has been described above using a game system as an example, the problem to be solved by the present invention is not limited to game systems.

[0009] In other words, an object of one embodiment of the present invention is to realize a display system in which an AR display of a first electronic device (such as a goggle-type device) and a normal display of a second electronic device (such as a smartphone or a tablet) are linked and superimposed on each other. Another object of the present invention is to enable a realistic display and a variety of expressions that have not been possible in the past by superimposing the AR display and the normal display.

[0010] Another object of one embodiment of the present invention is to provide a display device or a display system with a novel configuration, or a method for operating a display device or a display system with a novel configuration.

[0011] It should be noted that the description of multiple problems does not preclude the existence of each other's problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Furthermore, problems other than those listed will become apparent from the description in the specification, drawings, claims, etc., and these problems may also be problems of one embodiment of the present invention.

[0012] One embodiment of the present invention is a display system having a first display device and a second display device, wherein the first display device has a first display portion that displays a first image superimposed on a transmitted image, and the second display device has a second display portion, the first display device having a function of acquiring position information of the second display portion, and the display position of the first image is determined based on the position information of the second display portion.

[0013] In the display system described above, the first display portion has light-transmitting properties, and the transmitted image is an image transmitted through the first display portion.

[0014] Alternatively, in the display system described above, the first display device has an imaging means, and the transmission image is an image captured by the imaging means.

[0015] In any one of the display systems described above, it is preferable that the first image is displayed when at least a part of the second display portion is located within the range of the transmitted image.

[0016] In any one of the display systems described above, it is preferable that the first image is generated in accordance with position information.

[0017] In any one of the display systems described above, the first display device is preferably a glasses type.

[0018] In any one of the display systems described above, the first display device is preferably a goggle type.

[0019] In any one of the display systems described above, it is preferable that the second display device has a hinge portion, and that the second display device has a function of being folded at the hinge portion.

[0020] In any one of the display systems described above, it is preferable that the first display device has a first layer, a second layer, and a third layer, the first layer having a drive circuit and a CPU, the second layer having a pixel circuit, the third layer having a display device, the first layer having a first transistor having a semiconductor layer having silicon in a channel formation region, the second layer having a second transistor having a semiconductor layer having a metal oxide in a channel formation region, and the third layer having an organic EL device.

[0021] In any one of the display systems described above, the metal oxide preferably comprises indium, an element M (wherein M is aluminum, gallium, yttrium, or tin), and zinc.

[0022] In any one of the display systems described above, the organic EL device is preferably a light-emitting device processed by photolithography.

[0023] A display system according to one embodiment of the present invention can realize a display system in which an AR display of a first electronic device (such as a goggle-type device) and a normal display of a second electronic device (such as a smartphone or a tablet) are linked and superimposed on each other. Superimposing the AR display and the normal display enables a realistic display and a variety of expressions that have not been possible in the past.

[0024] Another embodiment of the present invention can provide a display device or a display system with a novel configuration, or a method for operating a display device or a display system with a novel configuration.

[0025] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these will become apparent from the description in the specification, drawings, claims, etc., and it is possible to extract other effects from the description in the specification, drawings, claims, etc.

[0026] FIG. 1 is a schematic diagram illustrating an example of the configuration of a display system. FIGS. 2A to 2C are schematic diagrams illustrating an example of the configuration of a display system. FIGS. 3A and 3B are schematic diagrams illustrating an example of the configuration of a display system. FIGS. 4A and 4B are schematic diagrams illustrating an example of the configuration of a display system. FIG. 5 is a schematic diagram illustrating an example of the configuration of a display system. FIGS. 6A and 6B are schematic diagrams illustrating an example of the configuration of a display system. FIGS. 7A and 7B are schematic diagrams illustrating an example of the configuration of a display system. FIG. 8 is a flow diagram illustrating the operation of the display system. FIG. 9 is a flow diagram illustrating the operation of the display system. FIGS. 10A and 10B are diagrams illustrating an example of the configuration of a display device. FIG. 11 is a diagram illustrating an example of the configuration of a display device. FIGS. 12A to 12C are perspective views of a display module. FIGS. 13A and 13B are diagrams illustrating an example of the configuration of a display device. FIGS. 14A to 14D are diagrams illustrating an example of the configuration of a display device. FIGS. 15A to 15D are diagrams illustrating an example of the configuration of a display device. FIG. 16 is a timing chart illustrating a method of driving a display device. FIGS. 17A and 17B are diagrams showing an example of the configuration of a display device. FIGS. 18A and 18B are diagrams showing an example of the operation of a display device. FIGS. 19A and 19B are diagrams showing an example of the configuration of a display device. FIGS. 20A to 20D are diagrams showing an example of the configuration of a display device. FIGS. 21A to 21C are diagrams showing an example of the configuration of a display device. FIG. 22 is a block diagram showing an example of the configuration of a display device. FIG. 23 is a block diagram showing an example of the configuration of a display device. FIGS. 24A and 24B are diagrams showing an example of the configuration of a display device. FIG. 25 is a diagram showing an example of the configuration of a display device. FIG. 26 is a diagram showing an example of the configuration of a display device. FIGS. 27A to 27C are diagrams showing an example of the configuration of a display device. FIGS. 28A to 28F are diagrams showing an example of the configuration of a pixel. FIGS. 29A and 29B are diagrams showing an example of the configuration of a display device. FIG. 30 is a diagram showing an example of the configuration of a display device. FIG. 31 is a diagram showing an example of the configuration of a display device. FIG. 32 is a diagram showing an example of the configuration of a display device. FIG. 33 is a diagram showing an example of the configuration of a display device. FIG. 34 is a diagram showing an example of the configuration of a display device. FIG. 35 is a diagram showing an example of the configuration of a display device. FIG. 36 is a diagram showing an example of the configuration of a display device.Figs. 37A to 37F are diagrams showing an example of the configuration of a light-emitting device. Figs. 38A to 38C are diagrams showing an example of the configuration of a light-emitting device. Figs. 39A and 39B are diagrams showing an example of an electronic device. Figs. 40A and 40B are diagrams showing an example of an electronic device. Fig. 41A is a diagram showing an example of an electronic device. Fig. 41B is a cross-sectional view showing an example of an electronic device. Figs. 42A to 42D are diagrams showing an example of an electronic device. Figs. 43A to 43G are diagrams showing an example of an electronic device. Figs. 44A and 44B are diagrams showing an example of an electronic device.

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be readily understood by those skilled in the art that various modifications can be made to the embodiments and details. Furthermore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

[0028] "Electrically connected" includes cases where the connection is made via "something that has some kind of electrical effect." Here, there are no particular restrictions on the "something that has some kind of electrical effect" as long as it allows the exchange of electrical signals between the connected objects.

[0029] For ease of understanding, the position, size, range, etc. of each component shown in the drawings etc. may not represent the actual position, size, range, etc. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings etc.

[0030] Ordinal numbers such as "first," "second," and "third" are used to avoid confusion of components.

[0031] In the drawings illustrating the present invention, some components (e.g., the ratio of the size and thickness of the electrodes) may be exaggerated to facilitate understanding, and some components may be omitted to avoid cluttering the drawings.

[0032] Embodiment 1 In this embodiment, a display device and a display system which are one embodiment of the present invention will be described with reference to FIGS.

[0033] [Configuration Example of Display Device and Display System] As shown in FIG. 1 , a display system according to one embodiment of the present invention includes a first display device 1000A and a second display device 1002. The first display device 1000A and the second display device 1002 each have a communication function. The display system according to one embodiment of the present invention may further include a third display device 1000B, or may include four or more display devices. FIGS. 1 and 2 illustrate an example of a display system including the first display device 1000A, the second display device 1002, and the third display device 1000B. Although the display system may include a wired communication function as the communication function, a wireless communication function (wireless communication function) is preferable because it can improve the usability of the display system.

[0034] 1 is a diagram showing a one-on-one game being played using a display system according to one embodiment of the present invention, in which a first display device 1000A (such as a display device with glasses) is worn by one of the game players (the first player), a third display device 1000B (such as a display device with glasses) is worn by the other of the game players (the second player), and a second display device 1002 (such as a tablet display device) is placed in a position visible to both the first and second players.

[0035] Here, the first player can view both the display image 1040 of the second display device 1002 and the display image of the first display device 1000A (an image of the three-dimensional virtual object 1041 viewed from the position of the first display device 1000A). Also, the second player can view both the display image 1040 of the second display device 1002 and the display image of the third display device 1000B (an image of the three-dimensional virtual object 1041 viewed from the position of the third display device 1000B). Also, a third party other than the players (for example, a spectator) can view the display image 1040 of the second display device 1002.

[0036] The display image of the first display device 1000A and the display image of the third display device 1000B each have an image of the same three-dimensional virtual object 1041 viewed from different positions (viewpoints). However, this is not limited to this, and the first display device 1000A and the third display device 1000B may each display different images. Furthermore, it is preferable to be able to arbitrarily set whether or not the display image of the first display device 1000A and the display image of the third display device 1000B each display images of the same three-dimensional virtual object 1041 viewed from different positions (viewpoints).

[0037] 2A shows an example of the field of view of a first player wearing a first display device 1000A. The first player can view a display image 1042 (an image of a three-dimensional virtual object 1041 viewed from the position of the first display device 1000A) and a display image 1044 displayed by the first display device 1000A, as well as a display image 1040 of the second display device 1002 that is viewed through the first display device 1000A. The display image 1044 is an example of an image displayed on the first display device 1000A for the first player.

[0038] 2A, the display position of the display image 1042 is preferably a position corresponding to the display position of the display image 1040. In the game of this illustrative example, the display image 1042 can be displayed at a position on the display image 1040 that corresponds to the positions of the pieces moved by the first player and the second player. In this way, the first display device 1000A can display the display image 1042 superimposed on a transmitted image (such as the display image 1040 of the second display device 1002).

[0039] Note that, when the display unit of the first display device 1000A has translucency, the transmitted image can be an image that passes through the display unit of the first display device 1000A (sometimes referred to as a see-through image). Alternatively, when the first display device 1000A has an imaging unit (imaging means such as a camera or an image sensor), the transmitted image can be an image that is captured by the imaging means of the first display device 1000A (sometimes referred to as a video see-through image).

[0040] That is, the display system of one embodiment of the present invention preferably has a function of acquiring position information of the first display device 1000A and the second display device 1002 and a function of determining, based on the acquired position information, the display position of the display image 1042. Here, the display position of the display image 1042 can be determined so as to be at a predetermined relative position with respect to the display image 1040 that is visible through the display portion of the first display device 1000A.

[0041] For example, the display position of the display image 1042 can be a position where it overlaps with the display image 1040 that is visible through the display unit of the first display device 1000A. Also, for example, the display position of the display image 1042 can be displayed at a position separated from the display image 1040 that is visible through the display unit of the first display device 1000A.

[0042] In addition, the display of the display image 1042 on the first display device 1000A may be performed in such a manner that the display image 1042 is displayed when at least a portion of the display unit of the second display device 1002 can be viewed as a transmitted image, and the display image 1042 is not displayed when the display unit cannot be viewed.

[0043] 2B shows an example of the field of view of a second player wearing the third display device 1000B. The second player can view a display image 1043 (an image of a three-dimensional virtual object 1041 viewed from the position of the third display device 1000B) and a display image 1045 displayed by the third display device 1000B, as well as a display image 1040 of the second display device 1002 that is viewed through the third display device 1000B. The display image 1045 is an example of an image displayed on the third display device 1000B for the second player.

[0044] 2B, the display position of display image 1043 is preferably a position corresponding to the display position of display image 1040. In the game of this illustrative example, display image 1043 can be displayed at a position on display image 1040 that corresponds to the positions of the pieces moved by the first player and the second player.

[0045] 2C , a third person (spectator) other than the player can view the display image 1040 of the second display device 1002. That is, even when the third person does not wear the first display device 1000A or the third display device 1000B, the third person can obtain part of the information from the display system of one embodiment of the present invention from the second display device 1002.

[0046] As shown in the above example, a new visual experience is made possible by combining and displaying (sometimes called linked display, linked display, coordinated display, collaborative display, etc.) a first display on a first display device capable of AR display, such as an eyeglass-type display device or a goggle-type display device, and a second display on a general display device, such as a tablet-type display device.

[0047] 3A and 3B will be used to describe a first display device 1000 and a second display device 1002 included in a display system of one embodiment of the present invention. As in the example described above, a display image of the first display device 1000 is displayed so as to correspond to the position of the second display device 1002 and the content of the display image. That is, the first display device 1000 has a function of acquiring position information of the first display device 1000 and the second display device 1002. Furthermore, the display portion 1010 of the first display device 1000 has a function of displaying an image on the display portion depending on the position of the display image of the second display device 1002.

[0048] 3A and 3B , the first display device 1000 has a display unit 1010, a housing 1011, a sensor unit 1012, a communication unit 1013, a control unit 1014, a mounting unit 1016, a display panel 1017, and an optical member 1019. The first display device 1000 may further include a camera unit 1015. Although not shown, the first display device 1000 and the second display device 1002 may each have a storage unit.

[0049] The first display device 1000 can project an image displayed on the display panel 1017 onto the display unit 1010 of the optical member 1019. Because the optical member 1019 is translucent, the user can see an image displayed in the display area superimposed on a transmitted image visually recognized through the optical member 1019. Therefore, each of the first display devices 1000 is an electronic device capable of AR display.

[0050] The second display device 1002 includes a display unit 1020, a housing 1021, a sensor unit 1022, a communication unit 1023, and a control unit 1024. The second display device 1002 may further include a camera unit 1025.

[0051] For example, a distance measuring sensor (hereinafter also referred to as a detection unit) capable of measuring the distance to an object may be provided as the sensor unit 1012 and the sensor unit 1022. For example, the sensor unit 1012 may be an image sensor or a distance image sensor such as a light detection and ranging (LIDAR) sensor.

[0052] The sensor units 1012 and 1022 may each include an acceleration sensor such as a gyro sensor. By using images obtained by the camera units 1015 and 1025 and images obtained by distance image sensors included in the sensor units 1012 and 1022, it is possible to obtain more information and more accurate position information.

[0053] As shown in FIG. 3B, wireless communication can be performed between a communication unit 1013 included in the first display device 1000 and a communication unit 1023 included in the second display device 1002.

[0054] The communication unit has a wireless communication device, and can supply a video signal and the like through the wireless communication device. Note that instead of or in addition to the wireless communication device, a connector to which a cable for supplying a video signal and a power supply potential can be connected may be provided. The first display device 1000 and the second display device 1002 can be paired using the communication units 1013 and 1023.

[0055] Furthermore, the communication between the first display device 1000 and the second display device 1002 may be direct communication or may be via a relay device. The relay device may be a wireless router such as Wi-Fi (registered trademark), an electronic device such as a smartphone, an electronic device such as a PC (personal computer), or a server connected via the Internet.

[0056] The display image 1042 of the first display device 1000A (an image of the three-dimensional virtual object 1041 viewed from the position of the first display device 1000A) described with reference to FIGS. 1 and 2 can be generated by the control unit 1014.

[0057] Alternatively, the display image 1042 of the first display device 1000A can be generated by the control unit 1024 of the second display device 1002. The first display device 1000 capable of AR display is a display device in the form of glasses worn on the head, and the mounting space and available power of the control unit 1014 are limited. On the other hand, in the second display device 1002 (such as a tablet) having a large display area, the mounting space of the control unit 1024 can be made larger, and the available power is also greater than that of the control unit 1014. Therefore, by sending data of the display image 1042 generated by the control unit 1024 from the communication unit 1023 to the communication unit 1013 and displaying it on the display unit 1010, the computational load of the control unit 1014 of the first display device 1000 is reduced, and as a result, the first display device 1000 can be used for a long period of time. It is preferable that the control unit 1024 has a GPU (Graphics Processing Unit).

[0058] Furthermore, if the display unit 1010 of the first display device 1000 has a display function that allows three-dimensional images to be recognized with binocular vision (for example, if parallax is provided between the left and right display units), more dynamic image expression becomes possible, which is preferable.

[0059] The housing 1011 may be provided with a touch sensor module. The touch sensor module has a function of detecting a touch on the outer surface of the housing 1011. The touch sensor module can detect a user's tap operation, slide operation, or the like, and execute various processes. For example, a tap operation can execute processes such as pausing or resuming a video, and a slide operation can execute processes such as fast-forwarding or fast-rewinding. Furthermore, providing a touch sensor module on each of the two housings 1011 can broaden the range of operations.

[0060] Various touch sensors can be used as the touch sensor module. For example, various types of touch sensors can be used, such as a capacitance type, a resistive film type, an infrared type, an electromagnetic induction type, a surface acoustic wave type, and an optical type. In particular, it is preferable to use a capacitance type or an optical type sensor in the touch sensor module.

[0061] When an optical touch sensor is used, a photoelectric conversion device (also called a photoelectric conversion element) can be used as the light receiving device (also called a light receiving element). The active layer of the photoelectric conversion device can be made of either or both of an inorganic semiconductor and an organic semiconductor.

[0062] The first display device 1000 is provided with a battery, which can be charged wirelessly and / or wired.

[0063] 4A, the first display device 1000 has a display unit 1010, a sensor unit 1012, a communication unit 1013, a control unit 1014, and a power supply unit 1018. Also, as shown in FIG. 4A, the second display device 1002 has a display unit 1020, a sensor unit 1022, a communication unit 1023, a control unit 1024, and a power supply unit 1028.

[0064] 3B and 4A illustrate a configuration in which the first display device 1000 and the second display device 1002 have the same functions, but this is not limiting. For example, as shown in FIG. 4B, the first display device 1000 and the second display device 1002 may have different functions.

[0065] In FIG. 4B , the first display device 1000 includes a camera unit 1015 and a headphone unit 1110 in addition to the configuration shown in FIG. 4A . The second display device 1002 includes a camera unit 1025 and a second communication unit 1029 in addition to the configuration shown in FIG. 4A . The camera unit 1015 may include an imaging unit such as an image sensor. Alternatively, multiple cameras may be provided to accommodate multiple angles of view, such as telephoto and wide-angle. The second communication unit 1029 may have a function for performing communication with a different function from the communication unit 1023. For example, the communication unit 1023 may have a function for communicating with the communication unit 1013, and the second communication unit 1029 may have a function for voice calls using a third-generation mobile communication system (3G), a fourth-generation mobile communication system (4G), a fifth-generation mobile communication system (5G), or the like, or a communication means for electronic payment, etc.

[0066] 3 and 4 illustrate communication between two devices, the first display device 1000 and the second display device 1002, but the present invention is not limited to this. For example, as shown in Fig. 5, the display system may further include a third display device 1000 (1000B) in addition to the first display device 1000 (1000A) and the second display device 1002. The display system may also include even more display devices.

[0067] Although FIGS. 1 and 2 illustrate an example in which a one-on-one game (chess) is played using the display system of one embodiment of the present invention, the display system of one embodiment of the present invention can be used for various applications. For example, games other than chess, such as shogi and reversi, can also be played. By using the display system of one embodiment of the present invention, it is not necessary to prepare items such as a game board and pieces for each type of game, and the game can be displayed on the first display device and the second display device, which is highly convenient. Furthermore, the display system can also be used for a multiplayer game, such as a Sugoroku game, as shown in FIG. 6A . Similar to FIGS. 2A and 2B , FIG. 6A is a schematic diagram illustrating the field of view of the first display device 1000 (e.g., a glasses-type display device). In FIG. 6A , a wearer of the first display device 1000 can view a display image 1060 displayed on the second display device 1002 through the display unit of the first display device 1000, and a display image 1061 is displayed in a position superimposed on the display image 1060. 6A shows an example in which a display device that can be folded along the dashed line is used as the second display device 1002. Using a foldable display device as the second display device 1002 is preferable because it enables space saving and is excellent in storability and convenience.

[0068] 1 and the like illustrates a situation in which a first player wearing a first display device 1000A and a second player wearing a third display device 1000B face each other at the same location and play a game against each other. However, the display system of one embodiment of the present invention is not limited to this example. For example, if the communication unit of the first display device 1000 or the second display device 1002 has a communication function such as the Internet, as described below, it is possible to play a game against a player in a remote location (a player who is not at the same location). For example, by each of the players who are not at the same location having the first display device 1000 and the second display device 1002, each of the players who are not at the same location can enjoy a realistic video experience and a game experience. Note that communication between display devices that are not at the same location may be direct communication between the devices or communication may be performed via a separately provided server.

[0069] The use of the display system according to one embodiment of the present invention is not limited to the amusement applications described above. For example, as shown in FIG. 6B , when designing (e.g., CAD) using a desktop PC (personal computer) having a second display device 1002, a display system can be used in which a two-dimensional drawing (display image 1060) is displayed on the second display device 1002 and a 3D image (display image 1061) corresponding to the two-dimensional drawing is displayed on the first display device 1000. Note that the display image 1061 may be displayed at a position that does not overlap with the display image 1060, as shown in FIG. 6B . This allows the user to perform design while checking the 3D image.

[0070] The use of the display system according to one embodiment of the present invention is not limited to personal use. For example, as shown in FIGS. 7A and 7B , a display system may be configured in which a first display device 1000 (such as a glasses-type display device) and a second display device 1002 used as digital signage can operate in cooperation with each other. FIG. 7A illustrates the first display device 1000 (such as a glasses-type display device) and the second display device 1002 used as a planar digital signage. The first display device 1000 displays a display image 1061 related to part of the content displayed by a display image 1060 on the second display device 1002.

[0071] 7B shows a first display device 1000 (such as a glasses-type display device) and a second display device 1002 used as curved digital signage. The first display device 1000 displays a display image 1061 related to part of the content displayed by a display image 1060 of the second display device 1002. As shown in FIG. 7B , the first display device 1000 may be worn by two or more people.

[0072] In the example shown in Figures 7A and 7B, it is also possible to link display devices owned by different owners, such as linking a first display device 1000 owned by an individual and a second display device 1002 that is public (owned by a facility, etc.) to display information.

[0073] Next, the structures of the display device and the display system according to one embodiment of the present invention, which are illustrated in FIGS. 1 to 7, will be described below.

[0074] <Display Unit and Display Panel> The display unit 1010, the display unit 1020, and the display panel 1017 each have a display function. For example, one or more selected from a liquid crystal display device, a light-emitting device including an organic electroluminescence (EL), and a light-emitting device including a light-emitting diode such as a micro LED can be used for the display unit 1010, the display unit 1020, and the display panel 1017. In consideration of productivity and light-emitting efficiency, it is preferable to use a light-emitting device including an organic electroluminescence (EL) for the display unit 1010, the display unit 1020, and the display panel 1017.

[0075] <Sensor Unit> The sensor unit 1012 and the sensor unit 1022 have a function of acquiring information related to the positional tables of the first display device 1000 and the second display device 1002, respectively. More specifically, the sensor unit 1022 has a function of measuring one or more of force, displacement, position, speed, acceleration, angular velocity, number of rotations, distance, light, magnetism, temperature, sound, time, electric field, current, voltage, power, radiation, humidity, gradient, vibration, odor, and infrared rays.

[0076] The sensor unit 1012 and the sensor unit 1022 may also have a function of detecting the user's line of sight using data obtained by the above function (e.g., imaging data of light, etc.) For example, the function of detecting the line of sight can be performed using the pupil center corneal reflection (PCCR) method or the bright / dark pupil effect method.

[0077] Furthermore, the sensor unit 1012 preferably has a function of measuring brain waves in addition to the functions of the sensor unit 1022. For example, the sensor unit 1012 may have a mechanism for measuring brain waves from a weak current flowing through a plurality of electrodes that come into contact with the head. The sensor unit 1012 having the function of measuring brain waves allows the user to operate the first display device 1000 and / or the second display device 1002 in accordance with their thoughts. In this case, the user does not need to operate the display devices with both hands, and can therefore perform input operations without holding anything in both hands (with both hands free).

[0078] <Communication Unit> The communication units 1013 and 1023 each have a function of communicating wirelessly or via a wire. The communication units 1013 and 1023 are preferably configured to communicate wirelessly, since this reduces the number of components such as cables for connection.

[0079] When the communication units 1013 and 1023 have a function of wireless communication, the communication units 1013 and 1023 can communicate via antennas. As a communication means (communication method) between the communication units 1013 and 1023, for example, communication can be performed by connecting each device to a computer network such as the Internet, an intranet, an extranet, a PAN (Personal Area Network), a LAN (Local Area Network), a CAN (Campus Area Network), a MAN (Metropolitan Area Network), a WAN (Wide Area Network), or a GAN (Global Area Network), which is the foundation of the World Wide Web (WWW). When performing wireless communication, communication standards such as LTE (Long Term Evolution), GSM (Global System for Mobile Communication: registered trademark), EDGE (Enhanced Data Rates for GSM Evolution), CDMA2000 (Code Division Multiple Access 2000), and W-CDMA (registered trademark), or specifications standardized by IEEE such as Wi-Fi (registered trademark), Bluetooth (registered trademark), and ZigBee (registered trademark), can be used as communication protocols or communication technologies.

[0080] <Control Unit> The control unit 1014 and the control unit 1024 each have a function of controlling the display unit. The control unit 1014 and the control unit 1024 have, for example, a pixel circuit, a backup circuit, an image conversion circuit, etc. Note that the image conversion circuit can perform 3D image data construction processing, conversion processing from 3D image data to 2D image data, image data amplifier conversion processing, and down-conversion processing.

[0081] The control units 1014 and 1024 perform various data processing and program control by interpreting and executing instructions from various programs using the processors. The programs that can be executed by the processors may be stored in the memory area of ​​the processors or may be stored in the storage unit.

[0082] In addition to a CPU, other microprocessors such as a DSP (Digital Signal Processor) and a GPU can be used alone or in combination as the control unit 1014 and the control unit 1024. Furthermore, these microprocessors may be configured to be realized by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array) or an FPAA (Field Programmable Analog Array).

[0083] The control unit 1014 and the control unit 1024 may each have a main memory. The main memory can include a volatile memory such as a random access memory (RAM) or a non-volatile memory such as a read only memory (ROM).

[0084] The RAM provided in the main memory may be, for example, a dynamic random access memory (DRAM), and a virtual memory space is allocated and used as a working space for the control unit 1014 and the control unit 1024. The operating system, application programs, program modules, program data, etc. stored in the storage unit are loaded into the RAM for execution. The data, programs, program modules, etc. loaded into the RAM are directly accessed and operated by the control unit 1014 and the control unit 1024.

[0085] On the other hand, the ROM can store a BIOS (Basic Input / Output System), which does not require rewriting, firmware, etc. As the ROM, a mask ROM, an OTPROM (One Time Programmable Read Only Memory), an EPROM (Erasable Programmable Read Only Memory), etc. can be used. Examples of EPROMs include UV-EPROMs (Ultra-Violet Erasable Programmable Read Only Memories), which allow stored data to be erased by exposure to ultraviolet light, EEPROMs (Electrically Erasable Programmable Read Only Memories), and flash memories.

[0086] Furthermore, it is preferable that the control units 1014 and 1024 have a processor specialized for parallel calculations rather than a CPU. For example, it is preferable that the control units 1014 and 1024 have a processor having a large number of processor cores (for example, several tens to several hundreds) capable of parallel processing, such as a GPU, a TPU (Tensor Processing Unit), or an NPU (Neural Processing Unit). This enables the control units 1014 and 1024 to perform calculations, particularly those related to neural networks, at high speed.

[0087] <Storage Unit> The storage unit may be, for example, a storage device using a nonvolatile storage element such as a flash memory, MRAM (Magnetoresistive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistive RAM), or FeRAM (Ferroelectric RAM), or a storage device using a volatile storage element such as a DRAM (Dynamic RAM) or SRAM (Static RAM). Alternatively, a recording media drive such as a hard disk drive (HDD) or a solid state drive (SSD) may be used.

[0088] The power supply unit 1018 and the power supply unit 1028 each have a function of supplying power to the display unit. The power supply unit 1018 and the power supply unit 1028 can be, for example, a primary battery or a secondary battery. Note that, for example, a lithium-ion secondary battery can be suitably used as the secondary battery.

[0089] Next, an example of a method for operating the display system of one embodiment of the present invention will be described with reference to FIGS.

[0090] [Example of Operation Method of Display System] An example of an operation method of the display system will be described below. Fig. 8 is a flowchart showing the operation method of the display system.

[0091] The operation starts in step S1. At this time, it is assumed that the first display device 1000 is in a started state (a state in which operation is possible), and the second display device 1002 is in a powered-on state.

[0092] In step S2, the first display device 1000 is worn. The first display device 1000 recognizes that it has been worn, and the system starts up. In step S2, for example, if the first display device 1000 is in the form of glasses, an image from a camera in front of the display device 1000 may be provided to the user, or an image of other content may be displayed.

[0093] In step S3, pairing is performed between the first display device 1000 and the second display device 1002. When pairing is completed, the first display device 1000 and the second display device 1002 are able to exchange data in both directions.

[0094] In step S4 , the first display device 1000 acquires the position information of the first display device 1000 and the second display device 1002 .

[0095] In step S5, two-dimensional image data (for example, display image 1042 shown in FIG. 2A) of a three-dimensional virtual object (for example, three-dimensional virtual object 1041 shown in FIG. 1) viewed from first display device 1000 is generated.

[0096] In step S6, the image data generated in step S5 is displayed on the display unit 1010 of the first display device 1000 based on the position information.

[0097] In step S7, if the sensor unit of the first display device 1000 or the second display device 1002 detects a change in the position of the first display device 1000 or the second display device 1002, the process proceeds to step S4. Alternatively, if any operation is performed on the first display device 1000 or the second display device 1002, the process proceeds to step S4 to perform processing according to the operation.

[0098] The process ends in step S8. Step S8 corresponds to, for example, removing the first display device 1000, turning off the power of the first display device 1000 or the second display device 1002, or canceling the pairing between the first display device 1000 and the second display device 1002.

[0099] The above has described an example of the operation method of the display system of one embodiment of the present invention. In the flowchart shown in Fig. 8 , step S5 shows the step of generating two-dimensional image data of a three-dimensional virtual object viewed from the first display device 1000, but the processing of step S5 is not necessarily performed. For example, if the first display device 1000 displays only planar content, the operation method of the display system may not include step S5, as shown in Fig. 9 .

[0100] In the above example, the first display device 1000 capable of AR display is described as a display device in the form of glasses worn on the head, but is not necessarily limited to this shape. Even a display device that is not worn on the head, such as a smartphone or tablet, can be used as the first display device 1000 if it has an imaging means (a camera, an image sensor, etc.) and is capable of AR display.

[0101] As described above, by using the display device and the display system of one embodiment of the present invention, a display device or a display system having a novel configuration can be provided. Furthermore, by using the display device and the display system of one embodiment of the present invention, a method for operating a display device or a display system having a novel configuration can be provided. By using the display device and the display system of one embodiment of the present invention, realistic display and a variety of expressions can be realized.

[0102] This embodiment mode can be combined with the descriptions of other embodiment modes as appropriate.

[0103] Embodiment 2 Hereinafter, a configuration example of a display device applicable to the display device of the electronic device exemplified in Embodiment 1 will be described with reference to the drawings.

[0104] 10A is a perspective view of a display device 10A that can be used as the display device of the electronic device described in Embodiment 1. The display device 10A can be used as the first display device 1000 and the second display device 1002.

[0105] The display device 10A has a substrate 11 and a substrate 12. The display device 10A has a display unit 13 composed of elements provided between the substrate 11 and the substrate 12. The display unit 13 is an area in the display device 10A that displays an image. The display unit 13 has a plurality of pixels 230. Each pixel 230 has a pixel circuit 51 and a light-emitting element 61.

[0106] Furthermore, when the pixels 230 are arranged in a matrix of 1920 x 1080 pixels, a display unit 13 capable of displaying at a resolution of so-called full high-definition (also referred to as "2K resolution," "2K1K," or "2K") can be realized. Furthermore, when the pixels 230 are arranged in a matrix of 3840 x 2160 pixels, for example, a display unit 13 capable of displaying at a resolution of so-called ultra high-definition (also referred to as "4K resolution," "4K2K," or "4K") can be realized. Furthermore, when the pixels 230 are arranged in a matrix of 7680 x 4320 pixels, for example, a display unit 13 capable of displaying at a resolution of so-called super high-definition (also referred to as "8K resolution," "8K4K," or "8K") can be realized. By increasing the number of pixels 230, a display unit 13 capable of displaying at a resolution of 16K or even 32K can also be realized.

[0107] The pixel density (resolution) of the display unit 13 is preferably 1000 ppi or more and 10000 ppi or less, but may be, for example, 2000 ppi or more and 6000 ppi or less, or 3000 ppi or more and 5000 ppi or less.

[0108] There are no particular limitations on the screen ratio (aspect ratio) of the display unit 13. The display unit 13 can support various screen ratios, such as 1:1 (square), 4:3, 16:9, and 16:10.

[0109] In this specification and the like, the term “element” may be replaced with “device.” For example, a display element, a light-emitting element, and a liquid crystal element may be replaced with a display device, a light-emitting device, and a liquid crystal device.

[0110] The display device 10A receives various signals and power supply potentials from the outside via the terminal unit 14, and can display images using display elements provided in the display unit 13. Various elements can be used as the display elements. Representative examples include light-emitting elements that have a function of emitting light, such as organic EL elements and LED elements, liquid crystal elements, and MEMS (Micro Electro Mechanical Systems) elements.

[0111] A plurality of layers are provided between the substrate 11 and the substrate 12, and each layer is provided with a transistor for performing circuit operation or a display element for emitting light. The plurality of layers are provided with pixel circuits having a function of controlling the operation of the display elements, drive circuits having a function of controlling the pixel circuits, function circuits having a function of controlling the drive circuits, and the like.

[0112] FIG. 10B is a perspective view showing a schematic configuration of each layer provided between the substrate 11 and the substrate 12.

[0113] A layer 20 is provided on the substrate 11. The layer 20 includes a driver circuit 30, a functional circuit 40, and an input / output circuit 80. The layer 20 includes a transistor 21 (also referred to as a Si transistor) having silicon in a channel formation region 22. The substrate 11 is, for example, a silicon substrate. A silicon substrate is preferable because it has higher thermal conductivity than a glass substrate. By providing the driver circuit 30, the functional circuit 40, and the input / output circuit 80 on the same layer, the wiring electrically connecting the driver circuit 30, the functional circuit 40, and the input / output circuit 80 can be shortened. This shortens the charging and discharging time of the control signal used by the functional circuit 40 to control the driver circuit 30, thereby reducing power consumption. Furthermore, the charging and discharging time required for the input / output circuit 80 to supply signals to the functional circuit 40 and the driver circuit 30 is shortened, thereby reducing power consumption.

[0114] The transistor 21 can be, for example, a transistor having single crystal silicon in a channel formation region (also referred to as a "c-Si transistor"). In particular, when a transistor having single crystal silicon in a channel formation region is used as the transistor provided in the layer 20, the on-state current of the transistor can be increased. Therefore, it is preferable because the circuit included in the layer 20 can be driven at high speed. Furthermore, since a Si transistor can be formed by microfabrication so that the channel length is 3 nm to 10 nm, the display device 10A can be provided with an accelerator such as a CPU or a GPU, an application processor, or the like, integrated with the display unit.

[0115] Alternatively, a transistor having polycrystalline silicon in a channel formation region (also referred to as a "poly-Si transistor") may be provided in the layer 20. Low temperature polysilicon (LTPS) may be used as the polycrystalline silicon. Note that a transistor having LTPS in a channel formation region is also referred to as an "LTPS transistor." Alternatively, an OS transistor may be provided in the layer 20.

[0116] The driving circuit 30 can be various circuits such as a shift register, a level shifter, an inverter, a latch, an analog switch, and a logic circuit. The driving circuit 30 includes, for example, a gate driver circuit, a source driver circuit, and the like. The driving circuit 30 may also include an arithmetic circuit, a memory circuit, a power supply circuit, and the like. Because the gate driver circuit, the source driver circuit, and other circuits can be arranged overlapping the display unit 13, the width of the non-display area (also called a frame) around the periphery of the display unit 13 of the display device 10A can be made significantly narrower than when these circuits and the display unit 13 are arranged side by side, thereby enabling the display device 10A to be made more compact.

[0117] The functional circuit 40 has, for example, the function of an application processor for controlling each circuit in the display device 10A and generating signals for controlling each circuit. The functional circuit 40 may also have a circuit for correcting image data, such as a GPU, and a CPU. The functional circuit 40 may also have an LVDS (Low Voltage Differential Signaling) circuit, a MIPI (Mobile Industry Processor Interface) circuit, a D / A (Digital to Analog) conversion circuit, and the like, which function as an interface for receiving image data and the like from outside the display device 10A. The functional circuit 40 may also have a circuit for compressing and decompressing image data, a power supply circuit, and the like.

[0118] A layer 50 is provided over the layer 20. The layer 50 includes a pixel circuit group 55 including a plurality of pixel circuits 51. The layer 50 may include a transistor 52 having a metal oxide in a channel formation region 54. In other words, an OS transistor may be provided in the layer 50. The pixel circuit 51 may include an OS transistor. Note that the layer 50 can be stacked over the layer 20.

[0119] A Si transistor may be provided in the layer 50. For example, the pixel circuit 51 may be configured to include a transistor having single crystal silicon or polycrystalline silicon in the channel formation region. LTPS may be used as the polycrystalline silicon. For example, the layer 50 may be formed on a separate substrate and then bonded to the layer 20.

[0120] Furthermore, for example, the pixel circuit 51 may be configured with multiple types of transistors using different semiconductor materials. When the pixel circuit 51 is configured with multiple types of transistors using different semiconductor materials, the transistors may be provided in different layers for each type of transistor. For example, when the pixel circuit 51 is configured with Si transistors and OS transistors, the Si transistors and the OS transistors may be provided overlapping each other. By providing the transistors overlapping each other, the area occupied by the pixel circuit 51 can be reduced. This can improve the resolution of the display device 10A. Note that a configuration in which an LTPS transistor and an OS transistor are combined is sometimes referred to as LTPO.

[0121] The transistor 52, which is an OS transistor, is preferably a transistor including an oxide containing at least one of indium, an element M (the element M is aluminum, gallium, yttrium, or tin), and zinc in a channel formation region. Such an OS transistor has a characteristic of extremely low off-state current. Therefore, it is preferable to use an OS transistor, particularly as a transistor provided in a pixel circuit, because analog data written to the pixel circuit can be held for a long period of time.

[0122] A layer 60 is provided on the layer 50. A substrate 12 is provided on the layer 60. The substrate 12 is preferably a light-transmitting substrate or a layer made of a light-transmitting material. A plurality of light-emitting elements 61 are provided on the layer 60. The layer 60 can be configured to be stacked on the layer 50. The light-emitting elements 61 can be, for example, organic electroluminescence elements (also referred to as organic EL elements). However, the light-emitting elements 61 are not limited thereto, and for example, inorganic EL elements made of inorganic materials can also be used. Note that "organic EL elements" and "inorganic EL elements" may be collectively referred to as "EL elements." The light-emitting elements 61 may include inorganic compounds such as quantum dots. For example, quantum dots can be used in the light-emitting layer to function as a light-emitting material.

[0123] As shown in FIG. 10B , the display device 10A of one embodiment of the present invention can have a stacked structure including the light-emitting element 61, the pixel circuit 51, the driver circuit 30, and the functional circuit 40. This allows for an extremely high pixel aperture ratio (effective display area ratio). For example, the pixel aperture ratio can be 40% or more and less than 100%, preferably 50% or more and 95% or less, and more preferably 60% or more and 95% or less. Furthermore, the pixel circuits 51 can be arranged at extremely high density, thereby achieving extremely high pixel resolution. For example, in the display portion 13 of the display device 10A (a region where the pixel circuit 51 and the light-emitting element 61 are stacked), pixels can be arranged with a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and further preferably 6000 ppi or more, and 20,000 ppi or less, or 30,000 ppi or less.

[0124] Because the display device 10A has extremely high resolution, it can be suitably used in VR devices such as head-mounted displays or eyeglass-type AR devices. For example, even in a configuration in which the display unit of the display device 10A is viewed through an optical component such as a lens, the display device 10A has an extremely high-resolution display unit, so that pixels are not visible even when the display unit is enlarged with a lens, thereby providing a highly immersive display.

[0125] When display device 10A is used as a wearable VR or AR display device, the diagonal size of display unit 13 can be 0.1 inches or more and 5.0 inches or less, preferably 0.5 inches or more and 2.0 inches or less, and more preferably 1 inch or more and 1.7 inches or less. For example, the diagonal size of display unit 13 may be 1.5 inches or close to 1.5 inches. Setting the diagonal size of display unit 13 to 2.0 inches or less allows processing with a single exposure process using an exposure device (typically a scanner device), thereby improving the productivity of the manufacturing process.

[0126] Furthermore, the display device 10A according to one embodiment of the present invention can be applied to devices other than wearable electronic devices. In this case, the diagonal size of the display unit 13 may exceed 2.0 inches. The configuration of the transistors used in the pixel circuits 51 may be appropriately selected depending on the diagonal size of the display unit 13. For example, when single-crystal Si transistors are used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 3 inches. When LTPS transistors are used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 30 inches, and more preferably 1 inch to 30 inches. When LTPO is used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 50 inches, and more preferably 1 inch to 50 inches. When OS transistors are used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 200 inches, and more preferably 50 inches to 100 inches.

[0127] Display devices using single-crystal Si transistors are very difficult to increase in size because it is difficult to increase the size of the single-crystal Si substrate. Furthermore, when LTPS transistors are used in display devices, it is difficult to accommodate larger screen sizes (typically, diagonal screen sizes exceeding 30 inches) because a laser crystallization apparatus is used in the manufacturing process. On the other hand, OS transistors are not restricted by the use of a laser crystallization apparatus or can be manufactured at a relatively low process temperature (typically, 450° C. or lower) in the manufacturing process, so they can accommodate display devices with relatively large areas (typically, diagonal screen sizes of 50 inches to 100 inches). Furthermore, LTPO transistors can accommodate diagonal screen sizes between those using LTPS transistors and those using OS transistors (typically, 1 inch to 50 inches).

[0128] A specific configuration example of the drive circuit 30 and the functional circuit 40 will be described with reference to Fig. 11. Fig. 11 is a block diagram illustrating the pixel circuit 51, drive circuit 30, and functional circuit 40 of the display device 10A, a plurality of wirings connecting the pixel circuit 51, drive circuit 30, and functional circuit 40, and bus wiring and the like within the display device 10A.

[0129] In a display device 10A shown in FIG. 11, a layer 50 has a plurality of pixel circuits 51 arranged in a matrix.

[0130] 11 , a layer 20 includes a drive circuit 30, a functional circuit 40, and an input / output circuit 80. The drive circuit 30 includes, for example, a source driver circuit 31, a digital-to-analog converter (DAC) 32, an amplifier circuit 35, a gate driver circuit 33, and a level shifter 34. The functional circuit 40 includes, for example, a memory device 41, a GPU (AI accelerator) 42, an EL correction circuit 43, a timing controller 44, a CPU 45, a sensor controller 46, and a power supply circuit 47. The functional circuit 40 has the function of an application processor.

[0131] The input / output circuit 80 supports transmission methods such as LVDS (Low Voltage Differential Signaling), and has a function of distributing control signals, image data, and the like input via the terminal unit 14 to the drive circuit 30 and the function circuit 40. The input / output circuit 80 also has a function of outputting information from the display device 10A to the outside via the terminal unit 14.

[0132] In addition, the display device 10A in FIG. 11 illustrates a configuration in which the circuits included in the drive circuit 30 and the circuits included in the functional circuit 40 are electrically connected to the bus line BSL.

[0133] For example, the source driver circuit 31 has a function of transmitting image data to the pixel circuit 51 of the pixel 230. Therefore, the source driver circuit 31 is electrically connected to the pixel circuit 51 via the wiring SL. Note that a plurality of source driver circuits 31 may be provided.

[0134] The digital-analog conversion circuit 32 has a function of converting image data that has been digitally processed by a GPU, a correction circuit, etc., which will be described later, into analog data. The image data converted into analog data is amplified by an amplifier circuit 35, such as an operational amplifier, and transmitted to the pixel circuits 51 via the source driver circuit 31. Note that the image data may be transmitted in the order of the source driver circuit 31, the digital-analog conversion circuit 32, and the pixel circuits 51. The digital-analog conversion circuit 32 and the amplifier circuit 35 may also be included in the source driver circuit 31.

[0135] For example, the gate driver circuit 33 has a function of selecting a pixel circuit 51 to which image data is to be sent. Therefore, the gate driver circuit 33 is electrically connected to the pixel circuit 51 through a wiring GL. Note that a plurality of gate driver circuits 33 may be provided corresponding to the source driver circuits 31.

[0136] The level shifter 34 has a function of converting signals input to the source driver circuit 31, the digital-to-analog conversion circuit 32, the gate driver circuit 33, etc., to appropriate levels, for example.

[0137] For example, the storage device 41 has a function of storing image data to be displayed on the pixel circuits 51. The storage device 41 can be configured to store the image data as digital data or analog data.

[0138] Furthermore, when image data is stored in the storage device 41, it is preferable to use a nonvolatile memory as the storage device 41. In this case, for example, a NAND type memory or the like can be used as the storage device 41.

[0139] Furthermore, when temporary data generated by the GPU 42, the EL correction circuit 43, the CPU 45, etc. is stored in the storage device 41, it is preferable to use a volatile memory as the storage device 41. In this case, for example, an SRAM (Static Random Access Memory), a DRAM (Dynamic Random Access Memory), etc. can be used as the storage device 41.

[0140] As an example, the GPU 42 has a function of performing processing to output image data read from the storage device 41 to the pixel circuit 51. In particular, the GPU 42 is configured to perform pipeline processing in parallel, and therefore can quickly process image data to be output to the pixel circuit 51. The GPU 42 can also have a function as a decoder for restoring encoded images.

[0141] The functional circuit 40 may also include multiple circuits capable of improving the display quality of the display device 10A. For example, such circuits may include a correction circuit (color adjustment, dimming) that detects color unevenness in the displayed image and corrects the color unevenness to produce an optimal image. For example, if a light-emitting device using an organic EL is used as the display element, the functional circuit 40 may include an EL correction circuit that corrects image data in accordance with the characteristics of the light-emitting device. As an example, the functional circuit 40 includes an EL correction circuit 43.

[0142] Furthermore, artificial intelligence may be used for the image correction described above. For example, the current flowing through the pixel circuit (or the voltage applied to the pixel circuit) may be monitored and acquired, and the displayed image may be acquired by an image sensor or the like, and the current (or voltage) and the image may be treated as input data for an artificial intelligence calculation (e.g., an artificial neural network), and the output result may be used to determine whether or not the image should be corrected.

[0143] Furthermore, the AI ​​calculations can be applied not only to image correction but also to up-conversion processing that increases the resolution of image data. As an example, the GPU 42 in Fig. 11 illustrates blocks for performing various correction calculations (color unevenness correction 42a, up-conversion 42b, etc.).

[0144] The algorithm for performing the upconversion process of image data can be selected from the nearest neighbor method, the bilinear method, the bicubic method, the rapid and accurate image super-resolution (RAISR) method, the anchored neighborhood regression (ANR) method, the A+ method, the super-resolution convolutional neural network (SRCNN) method, and the like.

[0145] The upconversion process may be configured to use a different algorithm for each region determined according to the point of gaze. For example, the upconversion process for the region at and near the point of gaze may be performed using a slow but highly accurate algorithm, while the upconversion process for regions other than the point of gaze may be performed using a fast but less accurate algorithm. This configuration can shorten the time required for the upconversion process. It can also reduce the power consumption required for the upconversion process.

[0146] Furthermore, in addition to up-conversion processing, down-conversion processing may be performed to reduce the resolution of image data. If the resolution of the image data is greater than the resolution of the display unit 13, a portion of the image data may not be displayed on the display unit 13. In such a case, down-conversion processing can be performed to display the entire image data on the display unit 13.

[0147] For example, the timing controller 44 has a function of controlling the drive frequency (frame frequency, frame rate, refresh rate, etc.) at which an image is displayed. For example, when a still image is displayed on the display device 10A, the drive frequency can be lowered by the timing controller 44, thereby reducing the power consumption of the display device 10A.

[0148] The CPU 45 has a function of performing general-purpose processing such as, for example, running an operating system, controlling data, performing various calculations, and running programs. The CPU 45 has a role of issuing commands such as writing or reading image data to or from the storage device 41, correcting image data, and operating a sensor (described later). The CPU 45 may also have a function of transmitting a control signal to at least one of the circuits included in the functional circuit 40.

[0149] The sensor controller 46 has a function of controlling the sensor, for example. In addition, in Fig. 11, a wiring SNCL is illustrated as a wiring for electrically connecting to the sensor.

[0150] The sensor may be, for example, a touch sensor that can be provided in the display unit 13. Alternatively, the sensor may be, for example, an illuminance sensor.

[0151] For example, the power supply circuit 47 has a function of generating voltages to be supplied to the pixel circuits 51, the drive circuits 30, the functional circuits 40, etc. The power supply circuit 47 may also have a function of selecting the circuits to which the voltage is supplied. For example, the power supply circuit 47 can reduce the power consumption of the entire display device 10A by stopping the voltage supply to the CPU 45, the GPU 42, etc. during the period when a still image is being displayed.

[0152] As described above, the display device of one embodiment of the present invention can have a stacked structure including a display element, a pixel circuit, a driver circuit, and a functional circuit 40. The driver circuit and the functional circuit, which are peripheral circuits, can be arranged to overlap with the pixel circuit, and the width of the frame can be significantly reduced, thereby enabling a miniaturized display device. Furthermore, the display device of one embodiment of the present invention can be lightweight because the wiring connecting the circuits can be shortened by stacking the circuits. Furthermore, the display device of one embodiment of the present invention can have a display portion with improved pixel resolution, thereby enabling a display device with excellent display quality.

[0153] <Configuration Example of Display Module> Next, a configuration example of a display module including the display device 10A will be described.

[0154] 12A to 12C are perspective views of a display module 70. The display module 70 shown in FIG. 12A has a structure in which an FPC 74 (Flexible Printed Circuit) is provided on the terminal section 14 of the display device 10A. The FPC 74 has a structure in which wiring is provided on a film made of an insulating material. The FPC 74 is also flexible. The FPC 74 functions as wiring for supplying video signals, control signals, power supply potential, and the like from the outside to the display device 10A. An IC may also be mounted on the FPC 74.

[0155] 12B has a configuration in which a display device 10A is provided on a printed wiring board 71. The printed wiring board 71 has a structure in which wiring is provided inside or on the surface, or inside and on the surface, of a substrate made of an insulating material.

[0156] 12B, terminal portion 14 of display device 10A is electrically connected to terminal portion 72 of printed wiring board 71 via wire 73. Wire 73 can be formed by wire bonding. Furthermore, ball bonding or wedge bonding can be used as the wire bonding.

[0157] After forming the wires 73, the wires 73 may be covered with a resin material or the like. Note that the electrical connection between the display device 10A and the printed wiring board 71 may be achieved by a method other than wire bonding. For example, the electrical connection between the display device 10A and the printed wiring board 71 may be achieved by an anisotropic conductive adhesive, a bump, or the like.

[0158] 12B , terminal portion 72 of printed wiring board 71 is electrically connected to FPC 74. For example, if the pitch of the electrodes in terminal portion 14 of display device 10A differs from the pitch of the electrodes in FPC 74, terminal portion 14 and FPC 74 may be electrically connected via printed wiring board 71. Specifically, the spacing (pitch) between the multiple electrodes in terminal portion 14 can be converted to the spacing between the multiple electrodes in terminal portion 72 using wiring formed on printed wiring board 71. In other words, even if the pitch of the electrodes in terminal portion 14 differs from the pitch of the electrodes in FPC 74, electrical connection between the electrodes can be achieved.

[0159] Furthermore, various elements such as resistor elements, capacitor elements, and semiconductor elements can be provided on the printed wiring board 71 .

[0160] 12C , the terminal portion 72 may be electrically connected to a connection portion 75 provided on the underside (the side on which the display device 10A is not provided) of the printed wiring board 71. For example, by using a socket-type connection portion as the connection portion 75, the display module 70 can be easily attached to and detached from other devices.

[0161] 13A and 13B show a configuration example of a pixel circuit 51 and a light-emitting element 61 connected to the pixel circuit 51. Fig. 13A is a diagram showing the connection of each element, and Fig. 13B is a diagram schematically showing the hierarchical relationship between a layer 20 including a driver circuit, a layer 50 including a plurality of transistors included in the pixel circuit 51, and a layer 60 including the light-emitting element 61.

[0162] 13A and 13B includes a transistor 52A, a transistor 52B, a transistor 52C, and a capacitor 53. The transistors 52A, 52B, and 52C can be OS transistors. Each of the transistors 52A, 52B, and 52C preferably includes a back gate electrode. In this case, the back gate electrode may be supplied with the same signal as that of the gate electrode, or may be supplied with a signal different from that of the gate electrode.

[0163] The transistor 52B includes a gate electrode electrically connected to the transistor 52A, a first terminal electrically connected to the light-emitting element 61, and a second terminal electrically connected to the wiring ANO. The wiring ANO is a wiring for applying a potential for supplying a current to the light-emitting element 61.

[0164] The transistor 52A has a first terminal electrically connected to the gate electrode of the transistor 52B, a second terminal electrically connected to the wiring SL that functions as a source line, and a gate electrode that has the function of controlling the conductive state or non-conductive state based on the potential of the wiring GL1 that functions as a gate line.

[0165] The transistor 52C includes a first terminal electrically connected to the wiring V0, a ​​second terminal electrically connected to the light-emitting element 61, and a gate electrode having a function of controlling a conductive state or a non-conductive state based on the potential of the wiring GL2 functioning as a gate line. The wiring V0 is a wiring for applying a reference potential and a wiring for outputting a current flowing through the pixel circuit 51 to the driver circuit 30 or the functional circuit 40.

[0166] The capacitor 53 includes a first conductive film electrically connected to the gate electrode of the transistor 52B and a second conductive film electrically connected to the second terminal of the transistor 52C.

[0167] The light-emitting element 61 includes a first electrode electrically connected to the first terminal of the transistor 52B and a second electrode electrically connected to a wiring VCOM. The wiring VCOM is a wiring for applying a potential for supplying a current to the light-emitting element 61.

[0168] This allows the intensity of light emitted by the light-emitting element 61 to be controlled in accordance with an image signal applied to the gate electrode of the transistor 52B. Also, the reference potential of the wiring V0 applied via the transistor 52C can suppress variations in the gate-source voltage of the transistor 52B.

[0169] Furthermore, a current value that can be used to set pixel parameters can be output from the wiring V0. More specifically, the wiring V0 can function as a monitor line for outputting the current flowing through the transistor 52B or the current flowing through the light-emitting element 61 to the outside. The current output to the wiring V0 is converted into a voltage by a source follower circuit or the like and output to the outside. Alternatively, it can be converted into a digital signal by an A-D converter or the like and output to the functional circuit 40 or the like.

[0170] Note that the light-emitting element described in one embodiment of the present invention refers to a self-luminous display element such as an organic light-emitting diode (OLED). Note that the light-emitting element electrically connected to the pixel circuit can be a self-luminous light-emitting element such as an LED (light-emitting diode), a micro LED, a quantum-dot light-emitting diode (QLED), or a semiconductor laser.

[0171] In the configuration shown in FIG. 13B as an example, the wiring electrically connecting the pixel circuits 51 and the drive circuit 30 can be shortened, thereby reducing the wiring resistance of the wiring. This allows data to be written at high speed, enabling the display device 10A to be driven at high speed. This allows the display device 10A to have a sufficient frame period even if the number of pixel circuits 51 is increased, thereby increasing the pixel density of the display device 10A. Furthermore, increasing the pixel density of the display device 10A can increase the resolution of the image displayed by the display device 10A. For example, the pixel density of the display device 10A can be 1000 ppi or more, 5000 ppi or more, or 7000 ppi or more. Therefore, the display device 10A can be used as a display device for AR or VR, for example, and can be suitably applied to electronic devices such as HMDs, in which the display unit is close to the user.

[0172] 13A and 13B show an example of the pixel circuit 51 including three transistors in total, but one embodiment of the present invention is not limited thereto. Below, a configuration example of a pixel circuit applicable to the pixel circuit 51 and an example of a driving method thereof will be described.

[0173] A pixel circuit 51A shown in Figure 14A includes a transistor 52A, a transistor 52B, and a capacitor 53. Figure 14A also shows a light-emitting element 61 connected to the pixel circuit 51A. A wiring SL, a wiring GL, a wiring ANO, and a wiring VCOM are electrically connected to the pixel circuit 51A. The pixel circuit 51A has a configuration in which the transistor 52C is removed from the pixel circuit 51 shown in Figure 13A and the wirings GL1 and GL2 are replaced with a wiring GL.

[0174] The transistor 52A has a gate electrically connected to the wiring GL, one of its source and drain electrically connected to the wiring SL, and the other electrically connected to the gate of the transistor 52B and one electrode of the capacitor C1. The transistor 52B has one of its source and drain electrically connected to the wiring ANO, and the other electrically connected to the anode of the light-emitting element 61. The other electrode of the capacitor C1 is electrically connected to the anode of the light-emitting element 61. The light-emitting element 61 has a cathode electrically connected to the wiring VCOM.

[0175] 14B has a configuration in which a transistor 52C is added to the pixel circuit 51A. A wiring V0 is electrically connected to the pixel circuit 51B.

[0176] A pixel circuit 51C shown in FIG. 14C is an example in which transistors having a pair of gates electrically connected are used as the transistors 52A and 52B of the pixel circuit 51A. A pixel circuit 51D shown in FIG. 14D is an example in which the same transistors are used as the pixel circuit 51B. This can increase the current that the transistors can pass. Note that, although transistors having a pair of gates electrically connected are used for all the transistors here, this is not a limitation. Alternatively, a transistor having a pair of gates electrically connected to different wirings may be used. For example, reliability can be improved by using a transistor in which one of the gates is electrically connected to a source.

[0177] 15A has a configuration in which a transistor 52D is added to the pixel circuit 51B. The pixel circuit 51E is electrically connected to wirings GL1, GL2, and GL3 that function as gate lines. Note that in this embodiment and other embodiments, the wirings GL1, GL2, and GL3 may be collectively referred to as wirings GL. Therefore, the number of wirings GL is not limited to one, and there may be multiple wirings GL.

[0178] The gate of the transistor 52D is electrically connected to a wiring GL3, one of the source and drain of the transistor 52D is electrically connected to the gate of the transistor 52B, and the other is electrically connected to a wiring V0. The gate of the transistor 52A is electrically connected to a wiring GL1, and the gate of the transistor 52C is electrically connected to a wiring GL2.

[0179] By simultaneously turning on the transistors 52C and 52D, the source and gate of the transistor 52B have the same potential, and the transistor 52B can be turned off. This makes it possible to forcibly cut off the current flowing through the light-emitting element 61. Such a pixel circuit is suitable for use in a display method in which display periods and off periods are alternately provided.

[0180] 15B is an example in which a capacitor 53A is added to the pixel circuit 51E. The capacitor 53A functions as a storage capacitor.

[0181] 15C and 15D are examples in which transistors each having a pair of gates are applied to the pixel circuit 51E or 51F, respectively. Transistors 52A, 52C, and 52D are transistors in which a pair of gates are electrically connected, and transistor 52B is a transistor in which one gate is electrically connected to its source.

[0182] Next, a description will be given of an example of a method for driving a display device to which pixel circuit 51 E is applied. Note that the same driving method can also be applied to display devices to which pixel circuits 51 F, 51 G, and 51 H are applied.

[0183] 16 is a timing chart illustrating a driving method of a display device using the pixel circuit 51E. The timing chart illustrates the transition of potentials of the wirings GL1[k], GL2[k], and GL3[k], which are gate lines in the kth row, and the wirings GL1[k+1], GL2[k+1], and GL3[k+1], which are gate lines in the k+1th row. The timing chart also illustrates the timing of signals applied to the wirings SL, which function as source lines.

[0184] Here, an example of a driving method is shown in which one horizontal period is divided into a light-on period and a light-off period. The horizontal period for the kth row and the horizontal period for the k+1th row are shifted by the selection period of the gate line.

[0185] In the lighting period of the kth row, a high-level potential is first applied to the wiring GL1[k] and the wiring GL2[k], and a source signal is applied to the wiring SL. This brings the transistors 52A and 52C into conduction, and a potential corresponding to the source signal is written from the wiring SL to the gate of the transistor 52B. After that, a low-level potential is applied to the wiring GL1[k] and the wiring GL2[k], bringing the transistors 52A and 52C into non-conduction, and the gate potential of the transistor 52B is maintained.

[0186] Subsequently, the lighting period of the k+1th row begins, and data is written in the same manner as above.

[0187] Next, the off-period will be described. During the off-period of the kth row, a high-level potential is applied to the wiring GL2[k] and the wiring GL3[k]. As a result, the transistors 52C and 52D are turned on, and the same potential is applied to the source and gate of the transistor 52B, so that almost no current flows through the transistor 52B. As a result, the light-emitting element 61 is turned off. All pixels located on the kth row are turned off. The pixels on the kth row are maintained in the off state until the next light-on period.

[0188] Next, the process shifts to the off period of the k+1th row, and all the pixels of the k+1th row are turned off in the same manner as above.

[0189] This driving method, in which the display is not always on during one horizontal period but has an off period during one horizontal period, can also be called duty driving. Duty driving can reduce the afterimage phenomenon when displaying moving images, thereby realizing a display device with high moving image display performance. In particular, in VR devices, reducing afterimages can alleviate so-called VR sickness.

[0190] In duty driving, the ratio of the on period to one horizontal period can be called the duty ratio. For example, a duty ratio of 50% means that the on period and the off period are the same length. The duty ratio can be freely set and can be adjusted as appropriate within a range of, for example, more than 0% and less than 100%.

[0191] Furthermore, a configuration different from the pixel circuit described above will be described with reference to FIGS. 17A and 17B.

[0192] Fig. 17A shows a block diagram of a pixel 230. The pixel shown in Fig. 17A has a memory circuit MEM (Memory) in addition to a switching transistor (Switching Tr), a driving transistor (Driving Tr), and a light-emitting element (LED).

[0193] Data DataW is supplied to the memory circuit MEM through the wiring SL2 and the transistor 52A. When the data DataW is supplied to the pixel in addition to the image data Data, the current flowing through the light-emitting element increases, and the display device can achieve high luminance.

[0194] FIG. 17B shows a specific circuit diagram of the pixel circuit 51I.

[0195] A pixel circuit 51I shown in Fig. 17B includes a transistor 52w, a transistor 52A, a transistor 52B, a transistor 52C, a capacitor 53s, and a capacitor 53w. Fig. 17B also shows a light-emitting element 61 connected to the pixel circuit 51I.

[0196] The transistor 52w functions as a switching transistor. The transistor 52B functions as a driving transistor. One of the source or drain of the transistor 52w is electrically connected to one electrode of a capacitor 53w. The other electrode of the capacitor 53w is electrically connected to one of the source or drain of the transistor 52A. One of the source or drain of the transistor 52A is electrically connected to the gate of the transistor 52B. The gate of the transistor 52B is electrically connected to one electrode of a capacitor 53s. The other electrode of the capacitor 53s is electrically connected to one of the source or drain of the transistor 52B. One of the source or drain of the transistor 52B is electrically connected to one of the source or drain of the transistor 52C. One of the source or drain of the transistor 52C is electrically connected to one electrode of the light-emitting element 61. Although each transistor shown in FIG. 17B has a backgate electrically connected to the gate, the connection of the backgate is not limited to this. Furthermore, the transistor does not necessarily have to have a backgate.

[0197] Here, a node NM is defined as a node to which the other electrode of the capacitor 53w, one of the source or drain of the transistor 52A, the gate of the transistor 52B, and one electrode of the capacitor 53s are connected, and a node NA is defined as a node to which the other electrode of the capacitor 53s, one of the source or drain of the transistor 52B, one of the source or drain of the transistor 52C, and one electrode of the light-emitting element 61 are connected.

[0198] The gate of the transistor 52w is electrically connected to the wiring GL1. The gate of the transistor 52C is electrically connected to the wiring GL1. The gate of the transistor 52A is electrically connected to the wiring GL2. The other of the source and the drain of the transistor 52w is electrically connected to the wiring SL1. The other of the source and the drain of the transistor 52C is electrically connected to the wiring V0. The other of the source and the drain of the transistor 52A is electrically connected to the wiring SL2. Note that in this embodiment and the like, the wirings SL1 and SL2 may be collectively referred to as wirings SL. Thus, the number of wirings SL is not limited to one, and may be multiple.

[0199] The other of the source and the drain of the transistor 52B is electrically connected to a wiring ANO. The other electrode of the light-emitting element 61 is electrically connected to a wiring VCOM.

[0200] The wirings GL1 and GL2 can function as signal lines for controlling the operation of the transistors. The wiring SL1 can function as a signal line for supplying image data Data to the pixels. The wiring SL2 can function as a signal line for writing data DataW to the memory circuit MEM. For example, the wiring SL2 can function as a signal line for supplying a correction signal to the pixels. The wiring V0 functions as a monitor line for acquiring electrical characteristics of the transistor 52B. Furthermore, by supplying a specific potential from the wiring V0 to the other electrode of the capacitor 53s through the transistor 52C, writing of an image signal can be stabilized.

[0201] The transistor 52A and the capacitor 53w constitute a memory circuit MEM. The node NM is a memory node, and data DataW supplied from the wiring SL2 can be written to the node NM by turning on the transistor 52A. By using an OS transistor with extremely low off-state current as the transistor 52A, the potential of the node NM can be held for a long time.

[0202] In the pixel circuit 51I, image data Data supplied from the wiring SL1 is supplied to a capacitor 53w via a transistor 52w. One of the source or drain of the transistor 52w is capacitively coupled to a node NM. Therefore, the potential of the node NM to which data DataW is written changes in accordance with the image data Data. In addition, the node NA and the node NM are capacitively coupled via a capacitor 53s. Therefore, the potential of the node NA changes in accordance with the data DataW and the image data Data.

[0203] The transistor 52w functions as a selection transistor that determines whether or not image data Data is supplied. The transistor 52C functions as a reset transistor that determines whether or not the potential of the node NA is set equal to that of the wiring V0.

[0204] Furthermore, in the display device of one embodiment of the present invention, defective pixels can be detected by using the functional circuit 40 overlapping with the pixel circuit group 55. By using information about the defective pixels, display defects due to the defective pixels can be corrected, and normal display can be achieved.

[0205] A part or all of the correction methods exemplified below may be executed by a circuit provided outside the display device. Alternatively, a part of the correction method may be executed by the functional circuit 40, and another part may be executed by a circuit provided outside the display device.

[0206] A more specific example of the correction method will be described below. Fig. 18A is a flowchart of the correction method described below.

[0207] First, the correction operation is started in step E1.

[0208] Subsequently, in step E2, the pixel current is read out, for example, by driving each pixel to output a current to a monitor line electrically connected to the pixel.

[0209] When pixel circuit group 55 is divided into a plurality of sections 59, such as in a display device 10B described below, the current readout operation can be performed simultaneously for each section 59. By dividing pixel circuit group 55 into a plurality of sections 59, the current readout operation for all pixels can be performed in an extremely short time.

[0210] Next, in step E3, the read current is converted into a voltage. At this time, if a digital signal is to be handled in subsequent processing, it can be converted into digital data in step E3. For example, analog data can be converted into digital data using an analog-to-digital converter (ADC).

[0211] Next, in step E4, pixel parameters for each pixel are obtained based on the obtained data, such as the threshold voltage or field effect mobility of the driving transistor, the threshold voltage of the light-emitting element, and the current value at a predetermined voltage.

[0212] Next, in step E5, each pixel is judged to be abnormal based on the pixel parameter, for example, if the value of the pixel parameter exceeds (or falls below) a predetermined threshold value, the pixel is recognized as an abnormal pixel.

[0213] The abnormalities include dark spot defects with significantly low brightness relative to the input data potential, and bright spot defects with significantly high brightness.

[0214] In step E5, the address of the abnormal pixel and the type of defect can be identified and obtained.

[0215] Subsequently, in step E6, correction processing is performed.

[0216] An example of the correction process will be described with reference to Fig. 18B. Fig. 18B schematically shows a pixel, each of which is a set of 3 x 3 pixel circuits 51 and light-emitting elements 61. Here, it is assumed that the central pixel is a pixel 151 that has a dark point defect. Fig. 18B schematically shows a state in which pixel 151 is turned off and the surrounding pixels 150 are turned on at a predetermined brightness.

[0217] A dark point defect is a defect in which the brightness of the pixel is unlikely to reach normal brightness even if a correction is made to increase the data potential input to the pixel. Therefore, as shown in Figure 18B, a correction is made to increase the brightness of pixels 150 surrounding a pixel 151 with a dark point defect. This makes it possible to display a normal image even if a dark point defect occurs.

[0218] In the case of a bright spot defect, the bright spot defect can be made less noticeable by lowering the brightness of the surrounding pixels.

[0219] In particular, in the case of a display device with high resolution (e.g., 1000 ppi or more), it is difficult to visually distinguish adjacent pixels, so it is particularly effective to use a correction method that compensates for abnormal pixels using surrounding pixels.

[0220] On the other hand, it is preferable to correct pixels in which an abnormality such as a dark spot defect or a bright spot defect has occurred so that no data potential is input.

[0221] In this way, correction parameters can be set for each pixel. By applying the correction parameters to input image data, corrected image data can be generated to display an optimal image on the display device 10A.

[0222] Furthermore, since variations exist in pixel parameters not only for abnormal pixels and pixels surrounding the abnormal pixels but also for pixels not determined to be abnormal pixels, unevenness due to the variations may be visible when an image is displayed. Therefore, for pixels not determined to be abnormal pixels, correction parameters can be set to cancel (level out) the variations in pixel parameters. For example, a reference value based on the median or average value of pixel parameters for some or all pixels can be set, and a correction value for canceling the difference between the pixel parameters of a specific pixel and the reference value can be set as the correction parameter for that pixel.

[0223] Furthermore, for pixels surrounding an abnormal pixel, it is preferable to set correction data that takes into consideration both the amount of correction for compensating for the abnormal pixel and the amount of correction for canceling variations in pixel parameters.

[0224] Then, in step E7, the correction operation is completed.

[0225] Thereafter, an image can be displayed based on the correction parameters obtained in the above correction operation and the input image data.

[0226] A neural network may be used in one of the steps of the correction operation. In the neural network, correction parameters can be determined based on inference results obtained by machine learning, for example. For example, when the correction parameters are determined using a neural network, high-precision correction can be performed so that abnormal pixels are not noticeable, without using a detailed correction algorithm.

[0227] The above is the explanation of the correction method.

[0228] 19A and 19B show perspective views of a display device 10B, which is a modification of the display device 10A. Fig. 19B is a perspective view for explaining the configuration of each layer of the display device 10B. To reduce repetition of explanation, differences from the display device 10A will be mainly explained.

[0229] The display device 10B has a pixel circuit group 55 including a plurality of pixel circuits 51 and a drive circuit 30 stacked on top of each other. In the display device 10B, the pixel circuit group 55 is divided into a plurality of sections 59, and the drive circuit 30 is divided into a plurality of sections 39. Each of the plurality of sections 39 has a source driver circuit 31 and a gate driver circuit 33.

[0230] FIG. 20A shows an example of the configuration of a pixel circuit group 55 included in the display device 10B. FIG. 20B shows an example of the configuration of a drive circuit 30 included in the display device 10B. The partitions 59 and the partitions 39 are each arranged in a matrix of m rows and n columns (m and n are each integers equal to or greater than 1). In this specification, the partition 59 in the first row and first column is referred to as partition 59[1,1], and the partition 59 in the mth row and nth column is referred to as partition 59[m,n]. Similarly, the partition 39 in the first row and first column is referred to as partition 39[1,1], and the partition 39 in the mth row and nth column is referred to as partition 39[m,n]. FIGS. 20A and 20B show a case where m is 4 and n is 8. That is, the pixel circuit group 55 and the drive circuit 30 are each divided into 32 sections.

[0231] Each of the plurality of sections 59 has a plurality of pixel circuits 51, a plurality of wirings SL, and a plurality of wirings GL. In each of the plurality of sections 59, one of the plurality of pixel circuits 51 is electrically connected to at least one of the plurality of wirings SL and at least one of the plurality of wirings GL.

[0232] One of the sections 59 and one of the sections 39 are arranged to overlap (see FIG. 20C ). For example, section 59[i,j] (i is an integer between 1 and m, inclusive; j is an integer between 1 and n, inclusive) and section 39[i,j] are arranged to overlap. The source driver circuit 31[i,j] in section 39[i,j] is electrically connected to the wiring SL in section 59[i,j]. The gate driver circuit 33[i,j] in section 39[i,j] is electrically connected to the wiring GL in section 59[i,j]. The source driver circuit 31[i,j] and the gate driver circuit 33[i,j] have the function of controlling the multiple pixel circuits 51 in section 59[i,j].

[0233] By overlapping the section 59[i,j] and the section 39[i,j], the connection distance (wiring length) between the pixel circuit 51 in the section 59[i,j] and the source driver circuit 31 and gate driver circuit 33 in the section 39[i,j] can be made extremely short. As a result, the wiring resistance and parasitic capacitance are reduced, which shortens the time required for charging and discharging, enabling high-speed driving. This also reduces power consumption. Furthermore, miniaturization and weight reduction can be achieved.

[0234] Furthermore, display device 10B has a configuration in which each section 39 has a source driver circuit 31 and a gate driver circuit 33. Therefore, display unit 13 can be divided into sections 59 corresponding to sections 39, and image data can be rewritten. For example, it is possible to rewrite image data only in sections of display unit 13 where changes have occurred in the image, and to retain image data in sections where no changes have occurred, thereby realizing a reduction in power consumption.

[0235] In the present embodiment and other embodiments, one of the display units 13 divided into sections 59 is referred to as a sub-display unit 19. Therefore, it can be said that the sub-display units 19 are divided into sections 39. The display device 10B described with reference to FIGS. 19 and 20 shows a case in which the display unit 13 is divided into 32 sub-display units 19 (see FIG. 19A ). The sub-display units 19 include a plurality of pixels 230 shown in FIG. 13 and other embodiments. Specifically, one sub-display unit 19 includes one of the sections 59 including a plurality of pixel circuits 51, and a plurality of light-emitting elements 61. Furthermore, one section 39 has the function of controlling the plurality of pixels 230 included in one sub-display unit 19.

[0236] Furthermore, the display device 10B can arbitrarily set the drive frequency for image display for each sub-display unit 19 by using the timing controller 44 of the functional circuit 40. The functional circuit 40 has a function of controlling the operation of each of the multiple sections 39 and the multiple sections 59. In other words, the functional circuit 40 has a function of controlling the drive frequency and operation timing of each of the multiple sub-display units 19 arranged in a matrix. The functional circuit 40 also has a function of adjusting synchronization between the sub-display units.

[0237] Furthermore, a timing controller 441 and an input / output circuit 442 may be provided for each partition 39 (see FIG. 20D ). The input / output circuit 442 may be, for example, an I2C (Inter-Integrated Circuit) interface. In FIG. 20D , the timing controller 441 included in partition 39[i,j] is indicated as timing controller 441[i,j]. Furthermore, the input / output circuit 442 included in partition 39[i,j] is indicated as input / output circuit 442[i,j].

[0238] For example, the functional circuit 40 supplies to the input / output circuit 442[i,j] operation parameters such as setting signals for the scanning direction and drive frequency of the gate driver circuit 33[i,j], and the number of pixels to be thinned out of image data when reducing the resolution (the number of pixels not to be rewritten when rewriting image data). The source driver circuit 31[i,j] and the gate driver circuit 33[i,j] operate in accordance with these operation parameters.

[0239] Furthermore, if the sub-display unit 19 has a light-receiving element, which will be described later, the input / output circuit 442 outputs information photoelectrically converted by the light-receiving element to the function circuit 40 .

[0240] The display device 10B in the electronic device of one embodiment of the present invention has pixel circuits 51 and drive circuits 30 stacked together, and can achieve low power consumption by varying the drive frequency for each sub-display unit 19 in response to the movement of the user's line of sight.

[0241] FIG. 21A shows a display unit 13 having sub-display units 19 arranged in four rows and eight columns. FIG. 21A also shows a first region S1 to a third region S3 centered around a fixation point G. The CPU 45 assigns each of the multiple sub-display units 19 to either a first region 29A overlapping with the first region S1 or the second region S2, or a second region 29B overlapping with the third region S3. That is, the CPU 45 assigns each of the multiple sections 39 to either the first region 29A or the second region 29B. In this case, the first region 29A overlapping with the first region S1 or the second region S2 includes the region overlapping with the fixation point G. The second region 29B includes the sub-display units 19 located outside the first region 29A (see FIG. 21B).

[0242] The operation of the drive circuits (source driver circuit 31 and gate driver circuit 33) included in each of the multiple sections 39 is controlled by the functional circuit 40. For example, the second section 29B overlaps with the third region S3, which includes the stable fixation field, the induced field, and the auxiliary field, and is an area where the user's ability to distinguish is low. Therefore, even if the number of times image data is rewritten per unit time (hereinafter also referred to as the "number of image rewrites") in the second section 29B is lower than that in the first section 29A, the actual display quality perceived by the user (hereinafter also referred to as the "actual display quality") is less degraded. In other words, even if the drive frequency (also referred to as the "second drive frequency") of the sub-display unit 19 included in the second section 29B is lower than the drive frequency (also referred to as the "first drive frequency") of the sub-display unit 19 included in the first section 29A, the actual display quality is less degraded.

[0243] Lowering the drive frequency can reduce the power consumption of the display device. On the other hand, lowering the drive frequency also reduces the display quality. In particular, the display quality when displaying moving images is reduced. According to one aspect of the present invention, by setting the second drive frequency lower than the first drive frequency, it is possible to reduce power consumption in areas where user visibility is low while suppressing a substantial reduction in display quality. According to one aspect of the present invention, it is possible to maintain display quality while reducing power consumption.

[0244] The first drive frequency may be 30 Hz or more and 500 Hz or less, preferably 60 Hz or more and 500 Hz or less. The second drive frequency is preferably equal to or less than the first drive frequency, more preferably equal to or less than half the first drive frequency, and even more preferably equal to or less than one-fifth the first drive frequency.

[0245] Furthermore, among the sub-display units 19 overlapping the third region S3, the area farther from the first area 29A may be designated as a third area 29C (see FIG. 21C ), and the drive frequency (also referred to as the "third drive frequency") of the sub-display units 19 included in the third area 29C may be set lower than that of the second area 29B. The third drive frequency is preferably equal to or lower than the second drive frequency, more preferably equal to or lower than half the second drive frequency, and even more preferably equal to or lower than one-fifth the second drive frequency. By significantly reducing the number of times the image is rewritten, power consumption can be further reduced. Furthermore, image data rewriting may be stopped as necessary. Stopping image data rewriting can further reduce power consumption.

[0246] When such a driving method is used, it is preferable to use a transistor with extremely low off-state current as the transistor constituting the pixel circuit 51. For example, it is preferable to use an OS transistor as the transistor constituting the pixel circuit 51. Because the off-state current of an OS transistor is extremely low, image data supplied to the pixel circuit 51 can be held for a long period of time. In particular, it is preferable to use an OS transistor as the transistor 52A.

[0247] Furthermore, when the video scene displayed on the display unit 13 changes, an image with significantly different brightness, contrast, or color tone from the immediately preceding image may be displayed. In such a case, a difference occurs in the timing of image switching between the first area 29A and an area with a lower drive frequency than the first area 29A, resulting in a significant difference in brightness, contrast, or color tone between the two areas, which may result in a loss of substantial display quality. In such a case, for example, when the video scene changes, the image data in areas other than the first area 29A may be rewritten at the same drive frequency as the first area 29A, and then the drive frequency for the areas other than the first area 29A may be lowered.

[0248] Furthermore, if it is determined that the amount of change in the gaze point G has exceeded a certain amount, the image data of areas other than the first area 29A may also be rewritten at the same drive frequency as the first area 29A, and if it is determined that the amount of change is within the certain amount, the drive frequency of the areas other than the first area 29A may be reduced. Furthermore, if it is determined that the amount of change in the gaze point G is small, the drive frequency of the areas other than the first area 29A may be further reduced.

[0249] Furthermore, if the display device 10B does not have a frame memory, which is a storage device that temporarily stores image data, or if it has one frame memory for the entire display unit 13, the second drive frequency and the third drive frequency must both be an integer multiple of the first drive frequency.

[0250] By providing a frame memory corresponding to each of the multiple sub-display units 19, the second drive frequency and the third drive frequency can be set to any value, not just an integer fraction of the first drive frequency. By setting the second drive frequency and the third drive frequency to any value, the degree of freedom in setting the drive frequency can be increased. Therefore, the actual degradation of display quality can be reduced.

[0251] 22 is a block diagram illustrating an example of the configuration of a display device 10B having a frame memory 443 for each sub-display unit 19. In Fig. 22, the input / output circuit 80 has an image information input unit 461 and a clock signal input unit 462. The functional circuit 40 also has an image data temporary storage unit 463, an operation parameter setting unit 464, an internal clock signal generation unit 465, an image processing unit 466, a memory controller 467, and multiple frame memories 443.

[0252] One of the plurality of frame memories 443 has a function of storing image data to be displayed on one of the plurality of sub-display units 19. For example, frame memory 443[1,1] has a function of storing image data to be displayed on sub-display unit 19[1,1]. Similarly, frame memory 443[m,n] has a function of storing image data to be displayed on sub-display unit 19[m,n].

[0253] 22, each of the plurality of sub-display sections 19 is electrically connected to one of the plurality of sections 39. In FIG. 22, each of the plurality of sections 39 includes a source driver circuit 31, a gate driver circuit 33, a timing controller 441, and an input / output circuit 442.

[0254] Image data to be displayed on the display unit 13 and operating parameters of the display device 10B are supplied from the outside to the image information input unit 461. A clock signal is supplied from the outside to the clock signal input unit 462. The clock signal is also supplied to an internal clock signal generation unit 465 via the clock signal input unit 462.

[0255] The internal clock signal generating unit 465 has a function of using an externally supplied clock signal to generate a clock signal (also referred to as an "internal clock signal") to be used within the display device 10B. The internal clock signal is supplied to the image data temporary storage unit 463, the operation parameter setting unit 464, the memory controller 467, the partition 39, etc., and is used to synchronize the operation timing of each circuit constituting the display device 10B.

[0256] The image data input via the image information input unit 461 is supplied to an image data temporary storage unit 463. The operation parameters input via the image information input unit 461 are supplied to an operation parameter setting unit 464.

[0257] The image data temporary storage unit 463 holds the supplied image data and, in synchronization with an internal clock signal, supplies the image data to the image processing unit 466. By providing the image data temporary storage unit 463, it is possible to eliminate the difference between the timing at which image data is supplied from the outside and the timing at which the image data is processed inside the display device 10B.

[0258] The operation parameter setting unit 464 has a function of holding the supplied operation parameters. The operation parameters include information for determining the drive frequency, scanning direction, resolution settings, etc. for each of the multiple sub-display units 19.

[0259] Image processing unit 466 has a function of performing arithmetic processing of the image data stored in image data temporary storage unit 463. For example, image processing unit 466 has a function of performing contrast adjustment, brightness adjustment, gamma correction, etc. of the image data. Image processing unit 466 also has a function of dividing the image data stored in image data temporary storage unit 463 for each sub-display unit 19.

[0260] The memory controller 467 has a function of controlling the operation of the plurality of frame memories 443. The image data divided for each sub-display unit 19 by the image processing unit 466 is stored in each of the plurality of frame memories 443. Furthermore, the plurality of frame memories 443 have a function of supplying image data to the respective partitions 39 in response to a read request signal (read) from the corresponding partition 39.

[0261] 23, the storage device 41 may be used as a frame memory 443. That is, the storage device 41 may store image data divided for each sub-display unit 19.

[0262] The frame memory 443 may be provided in a location other than the functional circuit 40. The frame memory 443 may be provided in a semiconductor device other than the display device 10B.

[0263] The areas set in the display unit 13 are not limited to the three areas, the first area 29A, the second area 29B, and the third area 29C. Four or more areas may be set in the display unit 13. By setting a plurality of areas in the display unit 13 and gradually lowering the drive frequency, it is possible to further reduce the actual degradation of display quality.

[0264] The image displayed in the first area 29A may be subjected to the above-described upconversion process. By displaying an upconverted image in the first area 29A, the display quality can be improved. The image displayed in areas other than the first area 29A may be subjected to the above-described upconversion process. By displaying an upconverted image in areas other than the first area 29A, the actual degradation in display quality when the drive frequency in areas other than the first area 29A is reduced can be further reduced.

[0265] It is also possible to use a high-precision algorithm to upconvert the image displayed in the first area 29A and a low-precision algorithm to upconvert the image displayed in areas other than the first area 29A. Even in this case, it is possible to further reduce the substantial degradation in display quality when the drive frequency for areas other than the first area 29A is reduced.

[0266] Furthermore, high-speed rewriting can be achieved by simultaneously rewriting image data for all sub-display sections 19 instead of for each sub-display section 19. In other words, high-speed rewriting can be achieved by simultaneously rewriting image data for all sections 39 instead of for each section 39.

[0267] Generally, in the case of line-sequential driving, the source driver circuit simultaneously writes image data to all pixels in one row while the gate driver circuit selects the pixels in that row. For example, if the display unit 13 is not divided into sub-display units 19 and has a resolution of 4000 x 2000 pixels, the source driver circuit must write image data to 4000 pixels while the gate driver circuit selects one row of pixels. When the frame frequency is 120 Hz, one frame time is approximately 8.3 msec. Therefore, the gate driver circuit must select 2000 rows of pixels in approximately 8.3 msec, and the time required to select one row of pixels, i.e., the time required to write image data per pixel, is approximately 4.17 μsec. In other words, the higher the resolution of the display unit and the higher the frame frequency, the more difficult it becomes to ensure sufficient time for rewriting image data.

[0268] In the display device 10B exemplified in this embodiment, the display unit 13 is divided into four sections in the row direction. Therefore, in one sub-display unit 19, the time required to write image data per pixel can be four times longer than when the display unit 13 is not divided. According to one aspect of the present invention, even when the frame frequency is set to 240 Hz or even 360 Hz, it is easy to ensure the time required to rewrite image data, thereby realizing a display device with high display quality.

[0269] Furthermore, in the display device 10B exemplified in this embodiment, the display unit 13 is divided into four in the row direction, so the length of the wiring SL electrically connecting the source driver circuit and the pixel circuit is reduced to one-fourth, which reduces the resistance and parasitic capacitance of the wiring SL to one-fourth, thereby shortening the time required to write (rewrite) image data.

[0270] In addition, in the display device 10B exemplified in this embodiment, the display unit 13 is divided into eight sections in the column direction, so the length of the wiring GL electrically connecting the gate driver circuit and the pixel circuit is reduced to one-eighth, which reduces the resistance and parasitic capacitance of the wiring GL to one-eighth, improving signal degradation and delay and making it easier to ensure sufficient time for rewriting image data.

[0271] According to the display device 10B of one embodiment of the present invention, it is easy to ensure sufficient time for writing image data, and therefore high-speed rewriting of the displayed image can be realized. As a result, a display device with high display quality can be realized, and in particular, a display device with excellent moving image display can be realized.

[0272] <Variation 2> Figures 24A and 24B show perspective views of a display device 10C, which is a variation of the display device 10A. Note that the display device 10C is also a variation of the display device 10B. Figure 24B is a perspective view for explaining the configuration of each layer of the display device 10C. To reduce repetition of explanation, differences from the display device 10A and the display device 10B will be mainly explained.

[0273] The pixel circuit group 55 including a plurality of pixel circuits 51, the drive circuit 30, the functional circuit 40, and the terminal section 14 may be provided on the same layer. The display device 10C has the pixel circuit group 55, the drive circuit 30, the functional circuit 40, and the terminal section 14 provided on the layer 20. By providing the pixel circuit group 55, the drive circuit 30, and the functional circuit 40 on the same layer, the wiring electrically connecting them can be shortened. This reduces wiring resistance and parasitic capacitance, and reduces power consumption.

[0274] For example, when c-Si transistors are used as the transistors used in the display device 10C, a single-crystal silicon substrate can be used as the layer 20 to provide the pixel circuit group 55, the drive circuit 30, the function circuit 40, and the terminal portion 14. Furthermore, by using a single-crystal silicon substrate as the layer 20, the substrate 11 can be omitted. This allows the weight of the display device 10C to be reduced. Furthermore, this allows the production cost of the display device 10C to be reduced. This improves the productivity of the display device 10C.

[0275] Note that the transistors used in the display device 10C are not limited to c-Si transistors, and various transistors such as poly-Si transistors or OS transistors can be used as the transistors used in the display device 10C.

[0276] In addition, in the display device 10C shown in Fig. 24, the display unit 13 is composed of sub-display units 19 arranged in a matrix of m rows and n columns. Therefore, the pixel circuit group 55 is divided into sections 59 arranged in a matrix of m rows and n columns. Fig. 25 shows a planar layout of the layer 20. Fig. 25 shows the sections 59 when m is 4 and n is 8.

[0277] In the display device 10C, the drive circuit 30 is divided into four regions: drive circuit 30a, drive circuit 30b, drive circuit 30c, and drive circuit 30d. The drive circuits 30a, 30b, 30c, and 30d are provided outside the pixel circuit group 55. Specifically, of the four sides of the periphery of the pixel circuit group 55, the drive circuit 30a is provided on a first side, the drive circuit 30c is provided on a third side facing the first side across the pixel circuit group 55, the drive circuit 30b is provided on a second side, and the drive circuit 30d is provided on a fourth side facing the second side across the pixel circuit group 55.

[0278] The drive circuit 30a and the drive circuit 30c each have 16 gate driver circuits 33. The drive circuit 30b and the drive circuit 30d each have 16 source driver circuits 31. One of the gate driver circuits 33 is electrically connected to a plurality of pixel circuits 51 included in one of the sections 59. One of the source driver circuits 31 is electrically connected to a plurality of pixel circuits 51 included in one of the sections 59.

[0279] 25, the gate driver circuit 33 electrically connected to the section 59[1,1] is indicated as gate driver circuit 33[1,1], and the source driver circuit 31 electrically connected to the section 59[1,1] is indicated as source driver circuit 31[1,1]. Similarly, the gate driver circuit 33 electrically connected to the section 59[4,8] is indicated as gate driver circuit 33[4,8], and the source driver circuit 31 electrically connected to the section 59[4,8] is indicated as source driver circuit 31[4,8].

[0280] The driver circuit 30a includes gate driver circuits 33[1,1] to 33[1,4], gate driver circuits 33[2,1] to 33[2,4], gate driver circuits 33[3,1] to 33[3,4], and gate driver circuits 33[4,1] to 33[4,4]. The driver circuit 30b includes source driver circuits 31[1,1] to 31[1,8] and source driver circuits 31[2,1] to 31[2,8]. The driver circuit 30c includes gate driver circuits 33[1,5] to 33[1,8], gate driver circuits 33[2,5] to 33[2,8], gate driver circuits 33[3,5] to 33[3,8], and gate driver circuits 33[4,5] to 33[4,8]. The driver circuit 30d includes source driver circuits 31[3,1] to 31[3,8] and source driver circuits 31[4,1] to 31[4,8].

[0281] The arrangement of the pixel circuit group 55, the drive circuit 30, and the function circuit 40 provided in the layer 20 is not limited to the configuration shown in FIG. 25 . For example, the configuration shown in FIG. 26 may be used. In FIG. 26 , the drive circuit 30 is divided into two regions, a drive circuit 30a and a drive circuit 30b. For example, the drive circuit 30a is provided with 32 gate driver circuits 33 (gate driver circuit 33[1,1] to gate driver circuit 33[4,8]), and the drive circuit 30b is provided with 32 source driver circuits 31 (source driver circuit 31[1,1] to source driver circuit 31[4,8]).

[0282] In the display devices 10B and 10C according to an embodiment of the present invention, the display unit 13 is divided into 32 sub-display units 19. However, the display unit 13 of the display devices 10B and 10C according to an embodiment of the present invention is not limited to 32 divisions, and may be divided into 16, 64, or 128 divisions, for example. Increasing the number of divisions of the display unit 13 can further reduce the actual degradation in display quality perceived by the user.

[0283] In this embodiment, a structural example of a display device that can be applied to an electronic device of one embodiment of the present invention will be described. The display device described below can be applied to the first display device 1000, the second display device 1002, and the like in Embodiment 1.

[0284] One embodiment of the present invention is a display device having light-emitting elements (also referred to as light-emitting devices). The display device has two or more light-emitting elements that emit different light colors. Each light-emitting element has a pair of electrodes and an EL layer therebetween. The light-emitting elements are preferably organic EL elements (organic electroluminescent elements). The two or more light-emitting elements that emit different light colors each have an EL layer containing a different light-emitting material. For example, a full-color display device can be realized by having three types of light-emitting elements that emit red (R), green (G), or blue (B) light, respectively.

[0285] When fabricating a display device having multiple light-emitting elements that emit different colors of light, it is necessary to form at least one layer containing a light-emitting material (light-emitting layer) in an island shape. When fabricating a partial or entire EL layer, a method of forming island-shaped organic films by vapor deposition using a shadow mask such as a metal mask is known. However, this method can cause deviations in the shape and position of the island-shaped organic films from the design due to various factors such as the accuracy of the metal mask, misalignment between the metal mask and the substrate, deflection of the metal mask, and spreading of the contours of the deposited film due to vapor scattering, making it difficult to achieve high-definition and high-aperture display devices. Furthermore, during vapor deposition, the contours of the layer can become blurred, resulting in thinning of the edges. In other words, the thickness of the island-shaped light-emitting layer can vary depending on the location. Furthermore, when fabricating large, high-resolution, or high-definition display devices, there is a concern that low dimensional accuracy of the metal mask and deformation due to heat, etc., can reduce manufacturing yield. Therefore, measures have been taken to artificially increase the resolution (also known as pixel density) by adopting special pixel arrangements such as a pentile array.

[0286] In this specification, the term "island-like" refers to a state in which two or more layers formed using the same material in the same process are physically separated. For example, an island-like light-emitting layer refers to a state in which the light-emitting layer is physically separated from an adjacent light-emitting layer.

[0287] In one embodiment of the present invention, an EL layer is processed into a fine pattern by photolithography without using a shadow mask such as a fine metal mask (FMM). This makes it possible to realize a display device with high definition and a large aperture ratio, which have been difficult to achieve until now. Furthermore, since the EL layer can be individually fabricated, a display device with extremely vivid images, high contrast, and high display quality can be realized. Note that, for example, the EL layer may be processed into a fine pattern using both a metal mask and photolithography.

[0288] Furthermore, the EL layer can be partially or entirely separated physically. This can suppress leakage current between adjacent light-emitting elements through a layer shared between the light-emitting elements (also referred to as a common layer). This can prevent crosstalk caused by unintended light emission, thereby realizing a display device with extremely high contrast. In particular, a display device with high current efficiency at low luminance can be realized.

[0289] One embodiment of the present invention can also be a display device that combines a white-emitting light-emitting element and a color filter. In this case, light-emitting elements provided in pixels (subpixels) that emit light of different colors can have the same configuration, and all layers can be common layers. Furthermore, part or all of each EL layer is separated by photolithography. This suppresses leakage current through the common layer, thereby realizing a display device with high contrast. In particular, in an element having a tandem structure in which multiple light-emitting layers are stacked via a highly conductive intermediate layer, leakage current through the intermediate layer can be effectively prevented, thereby realizing a display device that combines high brightness, high definition, and high contrast.

[0290] Furthermore, it is preferable to provide an insulating layer that covers at least the side surfaces of the island-shaped light-emitting layers. The insulating layer may be configured to cover a portion of the top surface of the island-shaped EL layer. The insulating layer is preferably made of a material that has barrier properties against water and oxygen. For example, an inorganic insulating film that is difficult for water or oxygen to diffuse can be used. This suppresses deterioration of the EL layer and realizes a highly reliable display device.

[0291] Furthermore, there is a region (recess) between two adjacent light-emitting elements where the EL layer of either light-emitting element is not provided. When a common electrode, or a common electrode and a common layer, is formed to cover the recess, a phenomenon in which the common electrode is separated by a step at the edge of the EL layer (also called a step discontinuity) may occur, resulting in insulation of the common electrode on the EL layer. Therefore, it is preferable to use a configuration in which the local step located between two adjacent light-emitting elements is filled with a resin layer functioning as a planarization film (also called LFP: Local Filling Planarization). The resin layer functions as a planarization film. This suppresses step discontinuity of the common layer or common electrode, thereby achieving a highly reliable display device.

[0292] A more specific example of the structure of the display device of one embodiment of the present invention will be described below with reference to the drawings.

[0293] 27A shows a schematic top view of a display device 100 of one embodiment of the present invention. The display device 100 includes a plurality of light-emitting elements 110R that exhibit red light, a plurality of light-emitting elements 110G that exhibit green light, and a plurality of light-emitting elements 110B that exhibit blue light, over a substrate 101. In FIG. 27A , the symbols R, G, and B are assigned within the light-emitting regions of the light-emitting elements to easily distinguish them from one another.

[0294] The light emitting elements 110R, 110G, and 110B are arranged in a matrix. Fig. 27A shows a so-called stripe arrangement in which light emitting elements of the same color are arranged in one direction. Note that the arrangement method of the light emitting elements is not limited to this, and arrangement methods such as an S-stripe arrangement, a delta arrangement, a Bayer arrangement, or a zigzag arrangement may also be used, or a pentile arrangement, a diamond arrangement, or the like may also be used.

[0295] As the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B, for example, an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode) is preferably used. Examples of the light-emitting substance contained in the EL element include a substance that emits fluorescence (fluorescent material), a substance that emits phosphorescence (phosphorescent material), and a substance that exhibits thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material). As the light-emitting substance contained in the EL element, not only organic compounds but also inorganic compounds (such as quantum dot materials) can be used.

[0296] 27A also shows a connection electrode 111C that is electrically connected to the common electrode 113. The connection electrode 111C is given a potential (e.g., an anode potential or a cathode potential) to be supplied to the common electrode 113. The connection electrode 111C is provided outside the display area where the light-emitting elements 110R and the like are arranged.

[0297] The connection electrode 111C can be provided along the periphery of the display area. For example, it may be provided along one side of the periphery of the display area, or it may be provided over two or more sides of the periphery of the display area. That is, when the top surface shape of the display area is rectangular, the top surface shape of the connection electrode 111C can be a strip shape (rectangle), an L-shape, a U-shape (square bracket shape), a square shape, or the like.

[0298] 27B and 27C are schematic cross-sectional views corresponding to dashed dotted lines A1-A2 and A3-A4 in Fig. 27A, respectively. Fig. 27B shows a schematic cross-sectional view of light-emitting element 110R, light-emitting element 110G, and light-emitting element 110B, and Fig. 27C shows a schematic cross-sectional view of connection portion 140 where connection electrode 111C and common electrode 113 are connected.

[0299] The light-emitting element 110R has a pixel electrode 111R, an organic layer 112R, a common layer 114, and a common electrode 113. The light-emitting element 110G has a pixel electrode 111G, an organic layer 112G, a common layer 114, and a common electrode 113. The light-emitting element 110B has a pixel electrode 111B, an organic layer 112B, a common layer 114, and a common electrode 113. The common layer 114 and the common electrode 113 are provided in common to the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B.

[0300] The organic layer 112R of the light-emitting element 110R contains a light-emitting organic compound that emits at least red light. The organic layer 112G of the light-emitting element 110G contains a light-emitting organic compound that emits at least green light. The organic layer 112B of the light-emitting element 110B contains a light-emitting organic compound that emits at least blue light. The organic layer 112R, the organic layer 112G, and the organic layer 112B can also be called EL layers, and each contains at least a layer (light-emitting layer) that contains a light-emitting organic compound.

[0301] Hereinafter, when describing matters common to light emitting element 110R, light emitting element 110G, and light emitting element 110B, they may be referred to as light emitting element 110. Similarly, when describing matters common to components distinguished by alphabets, such as organic layer 112R, organic layer 112G, and organic layer 112B, they may be described using symbols without the alphabets.

[0302] The organic layer 112 and the common layer 114 may each independently include one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. For example, the organic layer 112 may have a stacked structure of a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer from the pixel electrode 111 side, and the common layer 114 may have an electron injection layer.

[0303] The pixel electrode 111R, pixel electrode 111G, and pixel electrode 111B are provided for each light-emitting element. The common electrode 113 and common layer 114 are provided as a continuous layer common to each light-emitting element. A conductive film transmissive to visible light is used for either the pixel electrode or the common electrode 113, and a conductive film reflective to visible light is used for the other. By making each pixel electrode transmissive and the common electrode 113 reflective, a bottom-emission display device can be obtained. Conversely, by making each pixel electrode reflective and the common electrode 113 transmissive, a top-emission display device can be obtained. Note that by making both the pixel electrodes and the common electrode 113 transmissive, a dual-emission display device can be obtained.

[0304] A protective layer 121 is provided on the common electrode 113 to cover the light emitting elements 110R, 110G, and 110B. The protective layer 121 has a function of preventing impurities such as water from diffusing from above into each light emitting element.

[0305] The edge of the pixel electrode 111 preferably has a tapered shape. When the edge of the pixel electrode has a tapered shape, the portion of the organic layer 112 provided along the side surface of the pixel electrode also has a tapered shape. By tapering the side surface of the pixel electrode, the coverage of the EL layer provided along the side surface of the pixel electrode can be improved. Furthermore, by tapering the side surface of the pixel electrode, foreign matter (for example, dust or particles) during the manufacturing process can be easily removed by a process such as cleaning, which is preferable.

[0306] In this specification and the like, the term "tapered shape" refers to a shape in which at least a part of a side surface of a structure is inclined with respect to a substrate surface. For example, it is preferable that the structure has a region in which the angle between the inclined side surface and the substrate surface (also referred to as the taper angle) is less than 90°.

[0307] The organic layer 112 is processed into an island shape by photolithography. As a result, the angle between the top surface and the side surface of the organic layer 112 at its edge is close to 90 degrees. On the other hand, an organic film formed using a fine metal mask (FMM) or the like tends to become gradually thinner closer to the edge. For example, the top surface is formed in a sloped shape over a range of 1 μm to 10 μm, making it difficult to distinguish between the top surface and the side surface.

[0308] Between two adjacent light emitting elements, an insulating layer 125, a resin layer 126, and a layer 128 are provided.

[0309] Between two adjacent light-emitting elements, the side surfaces of the organic layers 112 face each other with the resin layer 126 interposed therebetween. The resin layer 126 is located between the two adjacent light-emitting elements and is provided so as to fill the ends of each organic layer 112 and the region between the two organic layers 112. The resin layer 126 has a smooth, convex upper surface, and a common layer 114 and a common electrode 113 are provided covering the upper surface of the resin layer 126.

[0310] The resin layer 126 functions as a planarization film that fills in a step located between two adjacent light-emitting elements. By providing the resin layer 126, it is possible to prevent a phenomenon (also called step disconnection) in which the common electrode 113 is divided by a step at the end of the organic layer 112, and the common electrode on the organic layer 112 is isolated. The resin layer 126 can also be called LFP (Local Filling Planarization).

[0311] An insulating layer containing an organic material can be suitably used as the resin layer 126. For example, acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene resin, phenolic resin, precursors of these resins, etc. can be used as the resin layer 126. Alternatively, organic materials such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin can be used as the resin layer 126.

[0312] Furthermore, a photosensitive resin can be used as the resin layer 126. A photoresist can be used as the photosensitive resin. The photosensitive resin can be a positive-type material or a negative-type material.

[0313] The resin layer 126 may contain a material that absorbs visible light. For example, the resin layer 126 itself may be made of a material that absorbs visible light, or the resin layer 126 may contain a pigment that absorbs visible light. For example, the resin layer 126 may be a resin that can be used as a color filter that transmits red, blue, or green light and absorbs other light, or a resin that contains carbon black as a pigment and functions as a black matrix.

[0314] The insulating layer 125 is provided in contact with the side surface of the organic layer 112. The insulating layer 125 is also provided to cover the upper end portion of the organic layer 112. A portion of the insulating layer 125 is provided in contact with the upper surface of the substrate 101.

[0315] The insulating layer 125 is located between the resin layer 126 and the organic layer 112, and functions as a protective film for preventing the resin layer 126 from contacting the organic layer 112. If the organic layer 112 and the resin layer 126 come into contact with each other, the organic layer 112 may be dissolved by an organic solvent or the like used when forming the resin layer 126. Therefore, as shown in this embodiment, by providing the insulating layer 125 between the organic layer 112 and the resin layer 126, it is possible to protect the side surfaces of the organic layer.

[0316] The insulating layer 125 can be an insulating layer containing an inorganic material. For example, an inorganic insulating film such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used for the insulating layer 125. The insulating layer 125 may have a single-layer structure or a stacked-layer structure. Examples of oxide insulating films include a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, a hafnium oxide film, and a tantalum oxide film. Examples of nitride insulating films include a silicon nitride film and an aluminum nitride film. Examples of oxynitride insulating films include a silicon oxynitride film and an aluminum oxynitride film. Examples of nitride oxide insulating films include a silicon nitride oxide film and an aluminum nitride oxide film. In particular, by using an inorganic insulating film such as a metal oxide film, an aluminum oxide film, or a silicon oxide film formed by an ALD method as the insulating layer 125, an insulating layer 125 with few pinholes and excellent protection of the EL layer can be formed.

[0317] In this specification and elsewhere, an oxynitride refers to a material whose composition contains more oxygen than nitrogen, and a nitride oxide refers to a material whose composition contains more nitrogen than oxygen. For example, silicon oxynitride refers to a material whose composition contains more oxygen than nitrogen, and silicon nitride oxide refers to a material whose composition contains more nitrogen than oxygen.

[0318] The insulating layer 125 can be formed by a sputtering method, a CVD method, a PLD method, an ALD method, or the like. The insulating layer 125 is preferably formed by an ALD method because it has good coverage.

[0319] Furthermore, a reflective film (e.g., a metal film containing one or more selected from silver, palladium, copper, titanium, aluminum, etc.) may be provided between the insulating layer 125 and the resin layer 126, so that the light emitted from the light-emitting layer is reflected by the reflective film, thereby improving the light extraction efficiency.

[0320] The layer 128 is a remaining portion of a protective layer (also referred to as a mask layer or a sacrificial layer) for protecting the organic layer 112 during etching of the organic layer 112. The layer 128 can be made of a material that can be used for the insulating layer 125. In particular, it is preferable to use the same material for the layer 128 and the insulating layer 125 because a common processing device or the like can be used for both.

[0321] In particular, inorganic insulating films such as metal oxide films such as aluminum oxide films and hafnium oxide films, or silicon oxide films formed by the ALD method have few pinholes and therefore have an excellent function of protecting the EL layer, and can be suitably used for the insulating layer 125 and the layer 128.

[0322] A protective layer 121 is provided to cover the common electrode 113 .

[0323] The protective layer 121 may have, for example, a single-layer structure or a stacked structure including at least an inorganic insulating film. Examples of the inorganic insulating film include oxide films or nitride films such as a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, an aluminum oxynitride film, and a hafnium oxide film. Alternatively, the protective layer 121 may be made of a semiconductor material or a conductive material such as indium gallium oxide, indium zinc oxide, indium tin oxide, or indium gallium zinc oxide.

[0324] The protective layer 121 may also be a laminated film of an inorganic insulating film and an organic insulating film. For example, a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable. Furthermore, it is preferable that the organic insulating film functions as a planarizing film. This allows the upper surface of the organic insulating film to be flat, improving the coverage of the inorganic insulating film thereon and enhancing the barrier properties. Furthermore, since the upper surface of the protective layer 121 is flat, when a structure (e.g., a color filter, a touch sensor electrode, a lens array, etc.) is provided above the protective layer 121, the influence of uneven shapes caused by the structure below can be reduced, which is preferable.

[0325] 27C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected. In the connection portion 140, an opening is provided in the insulating layer 125 and the resin layer 126 above the connection electrode 111C. The connection electrode 111C and the common electrode 113 are electrically connected in the opening.

[0326] 27C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected, but the common electrode 113 may be provided on the connection electrode 111C via the common layer 114. In particular, when a carrier injection layer is used for the common layer 114, the electrical resistivity of the material used for the common layer 114 is sufficiently low and the common layer 114 can be formed thin, so that there is often no problem even if the common layer 114 is located at the connection portion 140. This allows the common electrode 113 and the common layer 114 to be formed using the same masking mask, thereby reducing manufacturing costs.

[0327] The above is a description of an example of the configuration of the display device.

[0328] [Pixel Layout] The following mainly describes pixel layouts that are different from those in Fig. 27A. There are no particular limitations on the arrangement of light-emitting elements (sub-pixels), and various methods can be applied.

[0329] Examples of the top surface shape of the sub-pixel include a triangle, a quadrangle (including a rectangle and a square), a polygon such as a pentagon, a polygon with rounded corners, an ellipse, a circle, etc. Here, the top surface shape of the sub-pixel corresponds to the top surface shape of the light-emitting region of the light-emitting element.

[0330] An S-stripe arrangement is applied to the pixel 150 shown in Fig. 28A. The pixel 150 shown in Fig. 28A is composed of three sub-pixels: light-emitting elements 110a, 110b, and 110c. For example, the light-emitting element 110a may be a blue light-emitting element, the light-emitting element 110b may be a red light-emitting element, and the light-emitting element 110c may be a green light-emitting element.

[0331] The pixel 150 shown in FIG. 28B includes a light-emitting element 110a having a generally trapezoidal top surface shape with rounded corners, a light-emitting element 110b having a generally triangular top surface shape with rounded corners, and a light-emitting element 110c having a generally rectangular or hexagonal top surface shape with rounded corners. Furthermore, the light-emitting element 110a has a larger light-emitting area than the light-emitting element 110b. In this manner, the shape and size of each light-emitting element can be determined independently. For example, the more reliable the light-emitting element, the smaller the size can be. For example, the light-emitting element 110a may be a green light-emitting element, the light-emitting element 110b may be a red light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0332] The pixels 124a and 124b shown in Fig. 28C are arranged in a Pentile arrangement. Fig. 28C shows an example in which a pixel 124a having light-emitting elements 110a and 110b and a pixel 124b having light-emitting elements 110b and 110c are arranged alternately. For example, the light-emitting element 110a may be a red light-emitting element, the light-emitting element 110b may be a green light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0333] The pixels 124a and 124b shown in Figures 28D and 28E are arranged in a delta configuration. The pixel 124a has two light-emitting elements (light-emitting elements 110a and 110b) in the top row (first row) and one light-emitting element (light-emitting element 110c) in the bottom row (second row). The pixel 124b has one light-emitting element (light-emitting element 110c) in the top row (first row) and two light-emitting elements (light-emitting elements 110a and 110b) in the bottom row (second row). For example, the light-emitting element 110a may be a red light-emitting element, the light-emitting element 110b may be a green light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0334] FIG. 28D shows an example in which each light-emitting element has a substantially rectangular top surface shape with rounded corners, and FIG. 28E shows an example in which each light-emitting element has a circular top surface shape.

[0335] 28F shows an example in which light-emitting elements of each color are arranged in a zigzag pattern. Specifically, when viewed from above, the positions of the upper edges of two light-emitting elements arranged in a column direction (e.g., light-emitting elements 110a and 110b, or light-emitting elements 110b and 110c) are misaligned. For example, light-emitting element 110a may be a red light-emitting element, light-emitting element 110b may be a green light-emitting element, and light-emitting element 110c may be a blue light-emitting element.

[0336] In photolithography, the finer the pattern to be processed, the more significant the effect of light diffraction becomes. This reduces the fidelity of the photomask pattern when it is transferred by exposure, making it difficult to process the resist mask into the desired shape. Therefore, even if the photomask pattern is rectangular, it is likely to have rounded corners. As a result, the top surface shape of the light-emitting element may be polygonal with rounded corners, elliptical, circular, or the like.

[0337] Furthermore, in a manufacturing method of a display panel according to one embodiment of the present invention, the EL layer is processed into an island shape using a resist mask. The resist film formed on the EL layer needs to be cured at a temperature lower than the heat resistance temperature of the EL layer. Therefore, depending on the heat resistance temperature of the material for the EL layer and the curing temperature of the resist material, the resist film may not be cured sufficiently. A resist film that is not cured sufficiently may have a shape that is different from the desired shape during processing. As a result, the top surface shape of the EL layer may become a polygon with rounded corners, an ellipse, a circle, or the like. For example, when a resist mask with a square top surface shape is formed, a resist mask with a circular top surface shape may be formed, resulting in a circular top surface shape of the EL layer.

[0338] In order to form the top surface of the EL layer into a desired shape, a technique for correcting a mask pattern in advance (OPC (Optical Proximity Correction) technique) may be used so that the design pattern and the transfer pattern coincide with each other. Specifically, the OPC technique adds a correction pattern to the corners of figures on the mask pattern.

[0339] This concludes the description of the pixel layout.

[0340] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0341] Embodiment 4 This embodiment describes another structural example of a display device (display panel) that can be applied to an electronic device of one embodiment of the present invention. The display device (display panel) exemplified below can be applied to the first display device 1000, the second display device 1002, and the like in Embodiment 1.

[0342] The display device of this embodiment can be a high-resolution display device. For example, the display device of one embodiment of the present invention can be used for a display portion of a wristwatch-type or bracelet-type information terminal (wearable device), a VR device such as a head-mounted display, or a head-mountable wearable device such as a glasses-type AR device.

[0343] 29A shows a perspective view of a display module 280. The display module 280 includes a display device 200A and an FPC 290. Note that the display panel included in the display module 280 is not limited to the display device 200A, and may be any of display devices 200B to 200G described below.

[0344] The display module 280 has a substrate 291 and a substrate 292. The display module 280 has a display unit 281. The display unit 281 is an area for displaying an image.

[0345] 29B is a perspective view schematically illustrating the configuration on the substrate 291 side. A circuit portion 282, a pixel circuit portion 283 on the circuit portion 282, and a pixel portion 284 on the pixel circuit portion 283 are stacked on the substrate 291. A terminal portion 285 for connecting to the FPC 290 is provided in a portion of the substrate 291 that does not overlap with the pixel portion 284. The terminal portion 285 and the circuit portion 282 are electrically connected by a wiring portion 286 composed of a plurality of wirings.

[0346] The pixel section 284 has a plurality of periodically arranged pixels 284a. An enlarged view of one pixel 284a is shown on the right side of Fig. 29B. The pixel 284a has a light-emitting element 110R that emits red light, a light-emitting element 110G that emits green light, and a light-emitting element 110B that emits blue light.

[0347] The pixel circuit portion 283 has a plurality of pixel circuits 283a arranged periodically. Each pixel circuit 283a is a circuit that controls the light emission of three light-emitting devices included in one pixel 284a. One pixel circuit 283a may be configured to have three circuits that control the light emission of one light-emitting device. For example, the pixel circuit 283a may be configured to have at least one selection transistor, one current control transistor (drive transistor), and a capacitor for each light-emitting device. In this case, a gate signal is input to the gate of the selection transistor, and a source signal is input to the source. This realizes an active matrix display panel.

[0348] The circuit portion 282 includes a circuit for driving each pixel circuit 283a of the pixel circuit portion 283. For example, it is preferable that the circuit portion 282 includes one or both of a gate line driver circuit and a source line driver circuit. In addition, the circuit portion 282 may include at least one of an arithmetic circuit, a memory circuit, a power supply circuit, and the like. Furthermore, a transistor provided in the circuit portion 282 may constitute a part of the pixel circuit 283a. That is, the pixel circuit 283a may be composed of a transistor included in the pixel circuit portion 283 and a transistor included in the circuit portion 282.

[0349] The FPC 290 functions as wiring for supplying a video signal, a power supply potential, and the like from the outside to the circuit portion 282. An IC may be mounted on the FPC 290.

[0350] The display module 280 can be configured such that one or both of the pixel circuit unit 283 and the circuit unit 282 are provided overlapping below the pixel unit 284, thereby enabling the aperture ratio (effective display area ratio) of the display unit 281 to be extremely high. For example, the aperture ratio of the display unit 281 can be 40% or more and less than 100%, preferably 50% or more and 95% or less, and more preferably 60% or more and 95% or less. Furthermore, the pixels 284a can be arranged at an extremely high density, enabling the resolution of the display unit 281 to be extremely high. For example, it is preferable that the pixels 284a be arranged in the display unit 281 at a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and even more preferably 6000 ppi or more, and 20,000 ppi or less, or 30,000 ppi or less.

[0351] Because such a display module 280 has extremely high resolution, it can be suitably used in VR devices such as head-mounted displays, or in glasses-type AR devices. For example, even in a configuration in which the display unit of the display module 280 is viewed through lenses, the display module 280 has an extremely high-resolution display unit 281, so even when the display unit is enlarged with lenses, the pixels are not visible, allowing for a highly immersive display. Furthermore, the display module 280 is not limited to this, and can be suitably used in electronic devices with relatively small display units. For example, it can be suitably used in the display unit of a wearable electronic device such as a wristwatch.

[0352] [Display Device 200A] A display device 200A shown in FIG. 30 includes a substrate 301, light-emitting elements 110R, 110G, and 110B, a capacitor 240, and a transistor 310.

[0353] Substrate 301 corresponds to substrate 291 in FIGS. 29A and 29B.

[0354] The transistor 310 has a channel formation region in a substrate 301. The substrate 301 can be, for example, a semiconductor substrate such as a single crystal silicon substrate. The transistor 310 includes a part of the substrate 301, a conductive layer 311, a low-resistance region 312, an insulating layer 313, and an insulating layer 314. The conductive layer 311 functions as a gate electrode. The insulating layer 313 is located between the substrate 301 and the conductive layer 311 and functions as a gate insulating layer. The low-resistance region 312 is a region in which the substrate 301 is doped with impurities and functions as one of a source and a drain. The insulating layer 314 is provided to cover a side surface of the conductive layer 311.

[0355] An element isolation layer 315 is provided between two adjacent transistors 310 so as to be embedded in the substrate 301 .

[0356] In addition, an insulating layer 261 is provided to cover the transistor 310 , and a capacitor 240 is provided over the insulating layer 261 .

[0357] The capacitor 240 has a conductive layer 241, a conductive layer 245, and an insulating layer 243 located therebetween. The conductive layer 241 functions as one electrode of the capacitor 240, the conductive layer 245 functions as the other electrode of the capacitor 240, and the insulating layer 243 functions as a dielectric of the capacitor 240.

[0358] The conductive layer 241 is provided over the insulating layer 261 and is buried in the insulating layer 254. The conductive layer 241 is electrically connected to one of the source and drain of the transistor 310 by a plug 271 buried in the insulating layer 261. The insulating layer 243 is provided to cover the conductive layer 241. The conductive layer 245 is provided in a region overlapping with the conductive layer 241 with the insulating layer 243 interposed therebetween.

[0359] An insulating layer 255a is provided to cover the capacitor 240, an insulating layer 255b is provided over the insulating layer 255a, and an insulating layer 255c is provided over the insulating layer 255b.

[0360] An inorganic insulating film can be preferably used for each of the insulating layers 255a, 255b, and 255c. For example, it is preferable to use a silicon oxide film for the insulating layer 255a and the insulating layer 255c, and a silicon nitride film for the insulating layer 255b. This allows the insulating layer 255b to function as an etching protection film. In this embodiment, an example is shown in which part of the insulating layer 255c is etched to form a recess, but the insulating layer 255c does not necessarily have to have a recess.

[0361] Light emitting elements 110R, 110G, and 110B are provided on insulating layer 255c. The configurations of light emitting elements 110R, 110G, and 110B can be those of embodiment 3. Here, the layered structure from substrate 301 to insulating layer 255c corresponds to substrate 101 in embodiment 3.

[0362] In the display device 200A, a separate light-emitting device is fabricated for each emitted color, resulting in minimal change in chromaticity between low-luminance and high-luminance emission. Furthermore, because the organic layers 112R, 112G, and 112B are spaced apart from one another, crosstalk between adjacent subpixels can be suppressed even in a high-resolution display panel. This allows for the realization of a high-resolution, high-quality display panel.

[0363] In the region between adjacent light emitting elements, an insulating layer 125, a resin layer 126, and a layer 128 are provided.

[0364] The pixel electrode 111R, pixel electrode 111G, and pixel electrode 111B of the light-emitting element are electrically connected to one of the source and drain of the transistor 310 via a plug 256 embedded in the insulating layers 255a, 255b, and 255c, a conductive layer 241 embedded in the insulating layer 254, and a plug 271 embedded in the insulating layer 261. The height of the top surface of the insulating layer 255c and the height of the top surface of the plug 256 are the same or approximately the same. Various conductive materials can be used for the plug.

[0365] A protective layer 121 is provided on the light emitting elements 110R, 110G, and 110B. A substrate 170 is attached to the protective layer 121 with an adhesive layer 171.

[0366] There is no insulating layer covering the upper end of each pixel electrode 111 between two adjacent pixel electrodes 111. This allows the distance between adjacent light-emitting elements to be extremely narrow, resulting in a high-definition or high-resolution display device.

[0367] 31 has a configuration in which a transistor 310A and a transistor 310B, each having a channel formed in a semiconductor substrate, are stacked. Note that in the following description of the display panel, descriptions of parts that are the same as those of the display panel described above may be omitted.

[0368] The display device 200B has a configuration in which a substrate 301B on which a transistor 310B, a capacitor 240, and a light-emitting device are provided and a substrate 301A on which a transistor 310A is provided are bonded together.

[0369] Here, an insulating layer 345 is provided on the lower surface of the substrate 301B, and an insulating layer 346 is provided on the insulating layer 261 provided on the substrate 301A. The insulating layers 345 and 346 function as protective layers and can suppress the diffusion of impurities into the substrates 301B and 301A. The insulating layers 345 and 346 can be made of an inorganic insulating film that can be used for the protective layer 121 or the insulating layer 332 described below.

[0370] The substrate 301B is provided with a plug 343 that penetrates the substrate 301B and an insulating layer 345. Here, it is preferable to provide an insulating layer 344 that covers the side surface of the plug 343 and functions as a protective layer.

[0371] Furthermore, in the substrate 301B, a conductive layer 342 is provided below the insulating layer 345. The conductive layer 342 is embedded in the insulating layer 335, and the lower surfaces of the conductive layer 342 and the insulating layer 335 are flattened. The conductive layer 342 is electrically connected to a plug 343.

[0372] On the other hand, in the substrate 301A, a conductive layer 341 is provided on an insulating layer 346. The conductive layer 341 is embedded in the insulating layer 336, and the upper surfaces of the conductive layer 341 and the insulating layer 336 are flattened.

[0373] It is preferable to use the same conductive material for the conductive layers 341 and 342. For example, a metal film containing an element selected from Al, Cr, Cu, Ta, Ti, Mo, and W, or a metal nitride film containing the above elements (titanium nitride film, molybdenum nitride film, tungsten nitride film), etc., can be used. In particular, it is preferable to use copper for the conductive layers 341 and 342. This allows the use of Cu-Cu (copper-copper) direct bonding technology (technology that achieves electrical conductivity by connecting Cu (copper) pads together).

[0374] [Display Device 200C] A display device 200C shown in FIG. 32 has a configuration in which a conductive layer 341 and a conductive layer 342 are joined via a bump 347.

[0375] 32 , by providing a bump 347 between the conductive layer 341 and the conductive layer 342, the conductive layer 341 and the conductive layer 342 can be electrically connected. The bump 347 can be formed using a conductive material containing, for example, gold (Au), nickel (Ni), indium (In), tin (Sn), or the like. Alternatively, for example, solder may be used as the bump 347. An adhesive layer 348 may be provided between the insulating layer 345 and the insulating layer 346. When the bump 347 is provided, the insulating layer 335 and the insulating layer 336 may not be provided.

[0376] [Display Device 200D] A display device 200D shown in FIG. 33 differs from the display device 200A mainly in the configuration of the transistors.

[0377] The transistor 320 is a transistor (OS transistor) in which a metal oxide (also referred to as an oxide semiconductor) is used for a semiconductor layer in which a channel is formed.

[0378] The transistor 320 includes a semiconductor layer 321 , an insulating layer 323 , a conductive layer 324 , a pair of conductive layers 325 , an insulating layer 326 , and a conductive layer 327 .

[0379] Substrate 331 corresponds to substrate 291 in FIGS. 29A and 29B.

[0380] An insulating layer 332 is provided over a substrate 331. The insulating layer 332 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the substrate 331 to the transistor 320 and prevents oxygen from being released from the semiconductor layer 321 toward the insulating layer 332. The insulating layer 332 can be, for example, a film through which hydrogen or oxygen is less likely to diffuse than a silicon oxide film, such as an aluminum oxide film, a hafnium oxide film, or a silicon nitride film.

[0381] A conductive layer 327 is provided over the insulating layer 332, and an insulating layer 326 is provided to cover the conductive layer 327. The conductive layer 327 functions as a first gate electrode of the transistor 320, and part of the insulating layer 326 functions as a first gate insulating layer. An oxide insulating film such as a silicon oxide film is preferably used for at least a portion of the insulating layer 326 that is in contact with the semiconductor layer 321. The top surface of the insulating layer 326 is preferably planarized.

[0382] The semiconductor layer 321 is provided over the insulating layer 326. The semiconductor layer 321 preferably includes a metal oxide (also referred to as an oxide semiconductor) film exhibiting semiconductor characteristics. A pair of conductive layers 325 is provided over and in contact with the semiconductor layer 321 and functions as a source electrode and a drain electrode.

[0383] An insulating layer 328 is provided to cover top surfaces and side surfaces of the pair of conductive layers 325 and side surfaces of the semiconductor layer 321, and an insulating layer 264 is provided over the insulating layer 328. The insulating layer 328 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 264 or the like into the semiconductor layer 321 and prevents oxygen from being released from the semiconductor layer 321. The insulating layer 328 can be an insulating film similar to the insulating layer 332.

[0384] An opening reaching the semiconductor layer 321 is provided in the insulating layer 328 and the insulating layer 264. An insulating layer 323 in contact with the top surface of the semiconductor layer 321 and a conductive layer 324 are buried in the opening. The conductive layer 324 functions as a second gate electrode, and the insulating layer 323 functions as a second gate insulating layer.

[0385] The top surfaces of the conductive layer 324, the insulating layer 323, and the insulating layer 264 are planarized so that their heights are the same or approximately the same, and insulating layers 329 and 265 are provided to cover them.

[0386] The insulating layer 264 and the insulating layer 265 function as interlayer insulating layers. The insulating layer 329 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 265 or the like to the transistor 320. The insulating layer 329 can be formed using an insulating film similar to the insulating layer 328 and the insulating layer 332.

[0387] A plug 274 electrically connected to one of the pair of conductive layers 325 is provided to be embedded in the insulating layer 265, the insulating layer 329, and the insulating layer 264. Here, the plug 274 preferably includes a conductive layer 274a covering the side surfaces of the openings of the insulating layer 265, the insulating layer 329, the insulating layer 264, and the insulating layer 328 and part of the top surface of the conductive layer 325, and a conductive layer 274b in contact with the top surface of the conductive layer 274a. In this case, the conductive layer 274a is preferably made of a conductive material through which hydrogen and oxygen do not easily diffuse.

[0388] [Display Device 200E] A display device 200E illustrated in FIG. 34 has a stacked structure of a transistor 320A and a transistor 320B each including an oxide semiconductor as a semiconductor in which a channel is formed.

[0389] The transistor 320A, the transistor 320B, and the peripheral configuration thereof can be adapted from the display device 200D.

[0390] Although two transistors including an oxide semiconductor are stacked here, the present invention is not limited to this structure, and for example, three or more transistors may be stacked.

[0391] [Display Device 200F] A display device 200F illustrated in FIG. 35 has a stacked structure of a transistor 310 in which a channel is formed in a substrate 301 and a transistor 320 in which a channel is formed and a semiconductor layer containing metal oxide.

[0392] An insulating layer 261 is provided to cover the transistor 310, and a conductive layer 251 is provided over the insulating layer 261. An insulating layer 262 is provided to cover the conductive layer 251, and a conductive layer 252 is provided over the insulating layer 262. The conductive layers 251 and 252 each function as wirings. An insulating layer 263 and an insulating layer 332 are provided to cover the conductive layer 252, and the transistor 320 is provided over the insulating layer 332. An insulating layer 265 is provided to cover the transistor 320, and a capacitor 240 is provided over the insulating layer 265. The capacitor 240 and the transistor 320 are electrically connected by a plug 274.

[0393] The transistor 320 can be used as a transistor that forms a pixel circuit. The transistor 310 can be used as a transistor that forms a pixel circuit or a driver circuit (gate line driver circuit, source line driver circuit) that drives the pixel circuit. The transistors 310 and 320 can be used as transistors that form various circuits such as an arithmetic circuit or a memory circuit.

[0394] With this configuration, not only pixel circuits but also driving circuits etc. can be formed directly below the light-emitting device, which makes it possible to make the display panel smaller than when driving circuits are provided around the periphery of the display area.

[0395] [Display Device 200G] A display device 200G shown in Figure 36 has a stacked structure of a transistor 310 whose channel is formed in a substrate 301, a transistor 320A whose channel is formed in a semiconductor layer containing metal oxide, and a transistor 320B.

[0396] The transistor 320A can be used as a transistor that forms a pixel circuit. The transistor 310 can be used as a transistor that forms a pixel circuit or a transistor that forms a driver circuit (gate line driver circuit, source line driver circuit) for driving the pixel circuit. The transistor 320B may be used as a transistor that forms a pixel circuit or a transistor that forms the driver circuit. The transistor 310, the transistor 320A, and the transistor 320B can be used as transistors that form various circuits such as an arithmetic circuit or a memory circuit.

[0397] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0398] Embodiment 5 In this embodiment, a light-emitting device (light-emitting element) that can be used for a display device of one embodiment of the present invention will be described.

[0399] In this specification, etc., a device fabricated using a metal mask or an FMM (fine metal mask, high-resolution metal mask) may be referred to as a device with an MM (metal mask) structure. Also, in this specification, etc., a device fabricated without using a metal mask or an FMM may be referred to as a device with an MML (metal maskless) structure.

[0400] In this specification and the like, a structure in which at least light-emitting layers are separately fabricated for light-emitting devices with different emission wavelengths may be referred to as an SBS (Side By Side) structure. The SBS structure allows the materials and configuration to be optimized for each light-emitting device, increasing the degree of freedom in the selection of materials and configurations, and facilitating improvements in brightness and reliability.

[0401] In this specification and the like, holes or electrons may be referred to as "carriers." Specifically, a hole injection layer or an electron injection layer may be referred to as a "carrier injection layer," a hole transport layer or an electron transport layer may be referred to as a "carrier transport layer," and a hole block layer or an electron block layer may be referred to as a "carrier block layer." Note that the above-mentioned carrier injection layer, carrier transport layer, and carrier block layer may not be clearly distinguishable from each other depending on their cross-sectional shapes or characteristics. Furthermore, one layer may have two or three functions among the carrier injection layer, carrier transport layer, and carrier block layer.

[0402] In this specification and the like, a light-emitting device (also referred to as a light-emitting element) has an EL layer between a pair of electrodes. The EL layer has at least a light-emitting layer. Here, examples of layers (also referred to as functional layers) included in the EL layer include a light-emitting layer, a carrier injection layer (a hole injection layer and an electron injection layer), a carrier transport layer (a hole transport layer and an electron transport layer), and a carrier block layer (a hole block layer and an electron block layer).

[0403] As the light-emitting device, for example, an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode) is preferably used. Examples of the light-emitting material contained in the light-emitting device include a fluorescent material (fluorescent material), a phosphorescent material (phosphorescent material), a material exhibiting thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material), and an inorganic compound (such as a quantum dot material). Furthermore, an LED such as a micro LED (light-emitting diode) can also be used as the light-emitting device.

[0404] The light emitting device can emit light of infrared, red, green, blue, cyan, magenta, yellow, white, etc. The color purity can be improved by providing the light emitting device with a microcavity structure.

[0405] 37A, the light-emitting device has an EL layer 763 between a pair of electrodes (a lower electrode 761 and an upper electrode 762). The EL layer 763 can be composed of multiple layers, such as a layer 780, a light-emitting layer 771, and a layer 790.

[0406] The light-emitting layer 771 contains at least a light-emitting substance (also referred to as a light-emitting material).

[0407] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, the layer 780 includes one or more of a layer containing a substance with high hole-injecting properties (hole-injecting layer), a layer containing a substance with high hole-transporting properties (hole-transporting layer), and a layer containing a substance with high electron-blocking properties (electron-blocking layer). The layer 790 also includes one or more of a layer containing a substance with high electron-injecting properties (electron-injecting layer), a layer containing a substance with high electron-transporting properties (electron-transporting layer), and a layer containing a substance with high hole-blocking properties (hole-blocking layer). When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layers 780 and 790 have the opposite structures to those described above.

[0408] A structure including the layer 780, the light-emitting layer 771, and the layer 790 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 37A is referred to as a single structure in this specification.

[0409] 37B shows a modified example of the EL layer 763 included in the light-emitting device shown in Fig. 37A. Specifically, the light-emitting device shown in Fig. 37B has a layer 781 on a lower electrode 761, a layer 782 on the layer 781, a light-emitting layer 771 on the layer 782, a layer 791 on the light-emitting layer 771, a layer 792 on the layer 791, and an upper electrode 762 on the layer 792.

[0410] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, for example, the layer 781 can be a hole injection layer, the layer 782 can be a hole transport layer, the layer 791 can be an electron transport layer, and the layer 792 can be an electron injection layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layer 781 can be an electron injection layer, the layer 782 can be an electron transport layer, the layer 791 can be a hole transport layer, and the layer 792 can be a hole injection layer. Such a layer structure allows carriers to be efficiently injected into the light-emitting layer 771, and the efficiency of carrier recombination in the light-emitting layer 771 can be increased.

[0411] 37C and 37D, a variation of the single structure is a configuration in which multiple light-emitting layers (light-emitting layers 771, 772, and 773) are provided between layer 780 and layer 790. While an example having three light-emitting layers is shown in FIGS. 37C and 37D, the number of light-emitting layers in a single-structure light-emitting device may be two, or may be four or more. Furthermore, a light-emitting device with a single structure may have a buffer layer between the two light-emitting layers.

[0412] 37E and 37F, a configuration in which a plurality of light-emitting units (light-emitting unit 763a and light-emitting unit 763b) are connected in series via a charge generation layer 785 (also referred to as an intermediate layer) is referred to as a tandem structure in this specification. Note that the tandem structure may also be referred to as a stack structure. By using a tandem structure, a light-emitting device capable of emitting light with high brightness can be obtained. Furthermore, compared to a single structure, the tandem structure can reduce the current required to obtain the same brightness, thereby improving reliability.

[0413] 37D and 37F are examples of display devices having a layer 764 overlapping with the light-emitting device. Fig. 37D is an example in which the layer 764 overlaps with the light-emitting device shown in Fig. 37C, and Fig. 37F is an example in which the layer 764 overlaps with the light-emitting device shown in Fig. 37E.

[0414] The layer 764 can be a color conversion layer, a color filter (coloring layer), or both.

[0415] 37C and 37D , the light-emitting layers 771, 772, and 773 may be made of light-emitting materials that emit light of the same color, or even the same light-emitting material. For example, the light-emitting layers 771, 772, and 773 may be made of a light-emitting material that emits blue light. In the subpixel that emits blue light, blue light emitted by the light-emitting device can be extracted. In the subpixel that emits red light and the subpixel that emits green light, a color conversion layer is provided as the layer 764 shown in FIG. 37D to convert blue light emitted by the light-emitting device into light with a longer wavelength, thereby allowing red or green light to be extracted.

[0416] Furthermore, light-emitting materials with different emission colors may be used for the light-emitting layers 771, 772, and 773. When the lights emitted by the light-emitting layers 771, 772, and 773 are complementary in color, white light can be obtained. For example, a light-emitting device with a single structure preferably has a light-emitting layer containing a light-emitting material that emits blue light and a light-emitting layer containing a light-emitting material that emits visible light with a wavelength longer than blue.

[0417] For example, when a light-emitting device with a single structure has three light-emitting layers, it preferably has a light-emitting layer containing a light-emitting material that emits red (R) light, a light-emitting layer containing a light-emitting material that emits green (G) light, and a light-emitting layer containing a light-emitting material that emits blue (B) light. The stacking order of the light-emitting layers may be R, G, B from the anode side, or R, B, G from the anode side, etc. In this case, a buffer layer may be provided between R and G or B.

[0418] Furthermore, for example, when a light-emitting device with a single structure has two light-emitting layers, it is preferable that the light-emitting layer has a light-emitting substance that emits blue (B) light and the light-emitting layer has a light-emitting substance that emits yellow light. This structure is sometimes called a BY single.

[0419] A color filter may be provided as layer 764 shown in Figure 37D. When white light passes through the color filter, light of a desired color can be obtained.

[0420] A light-emitting device that emits white light preferably contains two or more types of light-emitting materials. To obtain white light emission, light-emitting materials can be selected so that the light emitted from each of the two or more light-emitting materials has a complementary color relationship. For example, by making the emission color of the first light-emitting layer and the emission color of the second light-emitting layer complementary to each other, a light-emitting device that emits white light as a whole can be obtained. The same applies to a light-emitting device having three or more light-emitting layers.

[0421] 37E and 37F, the light-emitting layer 771 and the light-emitting layer 772 may be made of a light-emitting material that emits light of the same color, or even the same light-emitting material.

[0422] For example, in the light-emitting devices included in the subpixels emitting light of each color, light-emitting materials emitting blue light may be used for the light-emitting layers 771 and 772. In the subpixel emitting blue light, the blue light emitted by the light-emitting device can be extracted. In the subpixel emitting red light and the subpixel emitting green light, a color conversion layer is provided as the layer 764 shown in FIG. 37F to convert the blue light emitted by the light-emitting device into light of a longer wavelength, thereby allowing red or green light to be extracted.

[0423] Furthermore, when the light-emitting devices having the configurations shown in FIG. 37E or 37F are used for the subpixels emitting light of each color, different light-emitting materials may be used for each subpixel. Specifically, in a light-emitting device included in a subpixel emitting red light, light-emitting layers 771 and 772 may each contain a light-emitting material that emits red light. Similarly, in a light-emitting device included in a subpixel emitting green light, light-emitting layers 771 and 772 may each contain a light-emitting material that emits green light. In a light-emitting device included in a subpixel emitting blue light, light-emitting layers 771 and 772 may each contain a light-emitting material that emits blue light. A display device having such a configuration can be said to employ a tandem-structure light-emitting device and also have an SBS structure. Therefore, it can have the advantages of both the tandem structure and the SBS structure. This allows for a highly reliable light-emitting device to be realized.

[0424] 37E and 37F, the light-emitting layer 771 and the light-emitting layer 772 may be made of light-emitting materials that emit light of different colors. When the light emitted by the light-emitting layer 771 and the light emitted by the light-emitting layer 772 are complementary colors, white light can be obtained. A color filter may be provided as the layer 764 shown in FIG. 37F. When white light passes through the color filter, light of a desired color can be obtained.

[0425] 37E and 37F show an example in which the light-emitting unit 763a has one light-emitting layer 771 and the light-emitting unit 763b has one light-emitting layer 772, but this is not limiting. Each of the light-emitting unit 763a and the light-emitting unit 763b may have two or more light-emitting layers.

[0426] 37E and 37F show examples of light emitting devices having two light emitting units, but the present invention is not limited to this. The light emitting device may have three or more light emitting units.

[0427] Specifically, the light-emitting device configurations shown in FIGS. 38A to 38C can be given.

[0428] 38A shows a configuration having three light-emitting units. Note that a configuration having two light-emitting units may be called a two-stage tandem structure, and a configuration having three light-emitting units may be called a three-stage tandem structure.

[0429] 38A , a plurality of light-emitting units (light-emitting unit 763a, light-emitting unit 763b, and light-emitting unit 763c) are connected in series via charge generation layer 785. Light-emitting unit 763a includes layer 780a, light-emitting layer 771, and layer 790a, light-emitting unit 763b includes layer 780b, light-emitting layer 772, and layer 790b, and light-emitting unit 763c includes layer 780c, light-emitting layer 773, and layer 790c.

[0430] 38A , it is preferable that the light-emitting layers 771, 772, and 773 each contain a light-emitting material that emits light of the same color. Specifically, the light-emitting layers 771, 772, and 773 may each contain a red (R) light-emitting material (a so-called R\R\R three-stage tandem structure), the light-emitting layers 771, 772, and 773 may each contain a green (G) light-emitting material (a so-called G\G\G three-stage tandem structure), or the light-emitting layers 771, 772, and 773 may each contain a blue (B) light-emitting material (a so-called B\B\B three-stage tandem structure).

[0431] Note that the light-emitting materials that emit light of the same color are not limited to the above configuration. For example, as shown in FIG. 38B , a tandem light-emitting device may be used in which light-emitting units having a plurality of light-emitting materials are stacked. FIG. 38B shows a configuration in which a plurality of light-emitting units (light-emitting unit 763a and light-emitting unit 763b) are connected in series via a charge generation layer 785. Furthermore, light-emitting unit 763a includes layer 780a, light-emitting layer 771a, light-emitting layer 771b, light-emitting layer 771c, and layer 790a. Light-emitting unit 763b includes layer 780b, light-emitting layer 772a, light-emitting layer 772b, light-emitting layer 772c, and layer 790b.

[0432] In the structure shown in FIG. 38B , light-emitting layers 771a, 771b, and 771c are configured to emit white light (W) by selecting light-emitting materials that are complementary to each other. Light-emitting layers 772a, 772b, and 772c are configured to emit white light (W) by selecting light-emitting materials that are complementary to each other. That is, the structure shown in FIG. 38C has a two-tiered W / W tandem structure. Note that the stacking order of the light-emitting materials that are complementary to each other in light-emitting layers 771a, 771b, and 771c is not particularly limited. The implementer can select the optimal stacking order as appropriate. Although not shown, a three-tiered W / W / W tandem structure or a four-tiered or more tandem structure may also be used.

[0433] In addition, when a light-emitting device having a tandem structure is used, there are a B\Y two-stage tandem structure having a light-emitting unit that emits yellow (Y) light and a light-emitting unit that emits blue (B) light, a R·G\B two-stage tandem structure having a light-emitting unit that emits red (R) and green (G) light and a light-emitting unit that emits blue (B) light, a light-emitting unit that emits yellow (Y) light and a light-emitting unit that emits blue (B) light, and a light-emitting unit that emits blue (B) light. Examples of such a tandem structure include a B\Y\B three-stage tandem structure having, in this order, a light-emitting unit that emits blue (B) light, a light-emitting unit that emits yellow-green (YG) light, and a light-emitting unit that emits blue (B) light, and a B\G\B three-stage tandem structure having, in this order, a light-emitting unit that emits blue (B) light, a light-emitting unit that emits green (G) light, and a light-emitting unit that emits blue (B) light.

[0434] Furthermore, as shown in FIG. 38C, a light-emitting unit having one light-emitting substance and a light-emitting unit having a plurality of light-emitting substances may be combined.

[0435] 38C , a plurality of light-emitting units (light-emitting unit 763a, light-emitting unit 763b, and light-emitting unit 763c) are connected in series via charge generation layer 785. Light-emitting unit 763a includes layer 780a, light-emitting layer 771, and layer 790a. Light-emitting unit 763b includes layer 780b, light-emitting layer 772a, light-emitting layer 772b, light-emitting layer 772c, and layer 790b. Light-emitting unit 763c includes layer 780c, light-emitting layer 773, and layer 790c.

[0436] For example, in the configuration shown in Figure 38C, a three-stage tandem structure of B\R·G·YG\B can be applied, in which light-emitting unit 763a is a light-emitting unit that emits blue (B) light, light-emitting unit 763b is a light-emitting unit that emits red (R), green (G), and yellow-green (YG) light, and light-emitting unit 763c is a light-emitting unit that emits blue (B) light.

[0437] For example, the number of layers of the light-emitting units and the order of the colors can be, from the anode side, a two-layer structure of B and Y, a two-layer structure of B and light-emitting unit X, a three-layer structure of B, Y, and B, and the number of layers of the light-emitting layers in light-emitting unit X and the order of the colors can be, from the anode side, a two-layer structure of R and Y, a two-layer structure of R and G, a two-layer structure of G and R, a three-layer structure of G, R, and G, or a three-layer structure of R, G, and R. Furthermore, another layer can be provided between the two light-emitting layers.

[0438] 37C and 37D, the layer 780 and the layer 790 may each independently have a laminated structure made up of two or more layers, as shown in FIG. 37B.

[0439] 37E and 37F, the light-emitting unit 763a includes a layer 780a, a light-emitting layer 771, and a layer 790a, and the light-emitting unit 763b includes a layer 780b, a light-emitting layer 772, and a layer 790b.

[0440] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, the layers 780a and 780b each have one or more of a hole injection layer, a hole transport layer, and an electron blocking layer. The layers 790a and 790b each have one or more of an electron injection layer, an electron transport layer, and a hole blocking layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layers 780a and 790a have the opposite structures to those described above, and the layers 780b and 790b also have the opposite structures to those described above.

[0441] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, for example, the layer 780a may have a hole injection layer, a hole transport layer on the hole injection layer, and an electron blocking layer on the hole transport layer. The layer 790a may have an electron transport layer and a hole blocking layer between the light-emitting layer 771 and the electron transport layer. The layer 780b may have a hole transport layer and an electron blocking layer on the hole transport layer. The layer 790b may have an electron transport layer, an electron injection layer on the electron transport layer, and a hole blocking layer between the light-emitting layer 771 and the electron transport layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, for example, the layer 780a may have an electron injection layer, an electron transport layer on the electron injection layer, and an electron blocking layer on the electron transport layer. Layer 790a has a hole transport layer and may further have an electron blocking layer between light-emitting layer 771 and the hole transport layer. Layer 780b has an electron transport layer and may further have a hole blocking layer on the electron transport layer. Layer 790b has a hole transport layer and a hole injection layer on the hole transport layer and may further have an electron blocking layer between light-emitting layer 771 and the hole transport layer.

[0442] When a light-emitting device having a tandem structure is fabricated, two light-emitting units are stacked via a charge generation layer 785. The charge generation layer 785 has at least a charge generation region. The charge generation layer 785 has a function of injecting electrons into one of the two light-emitting units and injecting holes into the other when a voltage is applied between a pair of electrodes.

[0443] Next, materials that can be used in light-emitting devices will be described.

[0444] Of the lower electrode 761 and the upper electrode 762, a conductive film that transmits visible light is used for the electrode from which light is extracted. A conductive film that reflects visible light is preferably used for the electrode from which light is not extracted. When the display device has a light-emitting device that emits infrared light, a conductive film that transmits visible light and infrared light is preferably used for the electrode from which light is extracted, and a conductive film that reflects visible light and infrared light is preferably used for the electrode from which light is not extracted.

[0445] A conductive film that transmits visible light may also be used for the electrode on the side from which light is not extracted. In this case, the electrode is preferably disposed between the reflective layer and the EL layer 763. That is, light emitted from the EL layer 763 may be reflected by the reflective layer and extracted from the display device.

[0446] Materials for forming the pair of electrodes of a light-emitting device can include metals, alloys, electrically conductive compounds, and mixtures thereof. Specific examples of such materials include metals such as aluminum, titanium, chromium, manganese, iron, cobalt, nickel, copper, gallium, zinc, indium, tin, molybdenum, tantalum, tungsten, palladium, gold, platinum, silver, yttrium, and neodymium, as well as alloys containing these metals in combination. Examples of such materials include indium tin oxide (In-Sn oxide, also referred to as ITO), In-Si-Sn oxide (also referred to as ITSO), indium zinc oxide (In-Zn oxide), and In-W-Zn oxide. Examples of such materials include aluminum alloys, such as an aluminum-nickel-lanthanum alloy (Al-Ni-La), and an alloy of silver, palladium, and copper (Ag-Pd-Cu, also referred to as APC). Other examples of the material include elements belonging to Group 1 or 2 of the periodic table (e.g., lithium, cesium, calcium, and strontium) that are not listed above as examples, rare earth metals such as europium and ytterbium, alloys containing appropriate combinations of these, and graphene.

[0447] The light-emitting device preferably has a micro-optical resonator (microcavity) structure. Therefore, one of a pair of electrodes of the light-emitting device is preferably an electrode that is transparent and reflective to visible light (semi-transmissive / semi-reflective electrode), and the other is preferably an electrode that is reflective to visible light (reflective electrode). By having the light-emitting device have a microcavity structure, light emitted from the light-emitting layer can be resonated between the two electrodes, thereby intensifying the light emitted from the light-emitting device.

[0448] The semi-transmitting / semi-reflective electrode can have a stacked structure of a conductive layer that can be used as a reflective electrode and a conductive layer that can be used as an electrode that is transparent to visible light (also referred to as a transparent electrode).

[0449] The light transmittance of the transparent electrode is 40% or more. For example, it is preferable to use an electrode having a visible light (light with a wavelength of 400 nm or more and less than 750 nm) transmittance of 40% or more for the transparent electrode of a light-emitting device. The visible light reflectance of the semi-transmissive / semi-reflective electrode is 10% or more and 95% or less, preferably 30% or more and 80% or less. The visible light reflectance of the reflective electrode is 40% or more and 100% or less, preferably 70% or more and 100% or less. The resistivity of these electrodes is 1×10 −２ Preferably, it is Ωcm or less.

[0450] The light-emitting device has at least a light-emitting layer. The light-emitting device may further have, as a layer other than the light-emitting layer, a layer containing a substance with high hole-injection properties, a substance with high hole-transport properties, a hole-blocking material, a substance with high electron-transport properties, an electron-blocking material, a substance with high electron-injection properties, or a bipolar substance (a substance with high electron-transport properties and high hole-transport properties). For example, the light-emitting device may have, in addition to the light-emitting layer, one or more layers selected from a hole-injection layer, a hole-transport layer, a hole-blocking layer, a charge-generating layer, an electron-blocking layer, an electron-transport layer, and an electron-injection layer.

[0451] The light-emitting device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0452] The light-emitting layer contains one or more light-emitting materials. As the light-emitting material, a material that emits light of blue, purple, blue-purple, green, yellow-green, yellow, orange, red, or the like is appropriately used. Furthermore, a material that emits near-infrared light can also be used as the light-emitting material.

[0453] The light-emitting material may include a fluorescent material, a phosphorescent material, a TADF material, and a quantum dot material.

[0454] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0455] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0456] The light-emitting layer may contain one or more organic compounds (host material, assist material, etc.) in addition to the light-emitting substance (guest material). As the one or more organic compounds, one or both of a substance with high hole transport properties (hole transport material) and a substance with high electron transport properties (electron transport material) can be used. As the hole-transporting material, a material with high hole transport properties that can be used for the hole-transporting layer, which will be described later, can be used. As the electron-transporting material, a material with high electron transport properties that can be used for the electron-transporting layer, which will be described later, can be used. Furthermore, as the one or more organic compounds, a bipolar material or a TADF material may be used.

[0457] The light-emitting layer preferably includes, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This configuration allows for efficient emission using Exciplex-Triple Energy Transfer (ExTET), which is energy transfer from the exciplex to the light-emitting material (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting material, energy transfer becomes smooth, allowing for efficient emission. This configuration simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting device.

[0458] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a material with high hole injection properties, such as an aromatic amine compound and a composite material containing a hole transport material and an acceptor material (electron acceptor material).

[0459] As the hole transporting material, a material having high hole transporting properties that can be used for the hole transport layer, which will be described later, can be used.

[0460] Examples of the acceptor material include oxides of metals belonging to Groups 4 to 8 of the periodic table. Specific examples include molybdenum oxide, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, tungsten oxide, manganese oxide, and rhenium oxide. Among these, molybdenum oxide is particularly preferred because it is stable in the atmosphere, has low hygroscopicity, and is easy to handle. Alternatively, organic acceptor materials containing fluorine can be used. Other organic acceptor materials that can be used include quinodimethane derivatives, chloranil derivatives, and hexaazatriphenylene derivatives.

[0461] For example, as a material with high hole injection properties, a material containing a hole transporting material and an oxide of a metal belonging to Groups 4 to 8 of the periodic table (typically, molybdenum oxide) may be used.

[0462] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light emitting layer. The hole transport layer is a layer that contains a hole transport material. The hole transport material is a material having a concentration of 1×10 −６ cm ２ A substance having a hole mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a material having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine (a compound having an aromatic amine skeleton), is preferred.

[0463] The electron blocking layer is provided in contact with the light-emitting layer. The electron blocking layer is a layer containing a material that has hole transport properties and can block electrons. The electron blocking layer can be made of a material that has electron blocking properties among the hole transport materials described above.

[0464] The electron blocking layer has hole transport properties and can therefore also be called a hole transport layer. Furthermore, a layer of the hole transport layer that has electron blocking properties can also be called an electron blocking layer.

[0465] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light emitting layer. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a molecular weight of 1×10 −６ cm ２ A substance having an electron mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0466] The hole-blocking layer is provided in contact with the light-emitting layer. The hole-blocking layer is a layer containing a material that has electron transport properties and can block holes. The hole-blocking layer can be made of a material that has hole-blocking properties and is selected from the above electron-transporting materials.

[0467] The hole blocking layer has electron transport properties and can therefore also be called an electron transport layer. Furthermore, a layer of the electron transport layer that has hole blocking properties can also be called a hole blocking layer.

[0468] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a material with high electron injection properties. Examples of the material with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the material with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0469] Furthermore, it is preferable that the LUMO level of the material having high electron injection properties has a small difference (specifically, 0.5 eV or less) from the work function value of the material used for the cathode.

[0470] The electron injection layer may contain, for example, lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF ｘ , x is an arbitrary number), 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenolatolithium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatolithium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenolatolithium (abbreviation: LiPPP), lithium oxide (LiO ｘ ), alkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used. The electron injection layer may have a stacked structure of two or more layers. For example, the stacked structure may have a structure in which lithium fluoride is used as the first layer and ytterbium is provided as the second layer.

[0471] The electron injection layer may contain an electron transporting material. For example, a compound having an unshared electron pair and an electron-deficient heteroaromatic ring can be used as the electron transporting material. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and a triazine ring can be used.

[0472] The lowest unoccupied molecular orbital (LUMO) level of an organic compound having an unshared electron pair is preferably −3.6 eV or more and −2.3 eV or less. Generally, the highest occupied molecular orbital (HOMO) level and the LUMO level of an organic compound can be estimated by CV (cyclic voltammetry), photoelectron spectroscopy, optical absorption spectroscopy, inverse photoelectron spectroscopy, or the like.

[0473] For example, 4,7-diphenyl-1,10-phenanthroline (abbreviation: BPhen), 2,9-di(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviation: NBPhen), 2,2-(1,3-phenylene)bis[9-phenyl-1,10-phenanthroline] (abbreviation: mPPhen2P), diquinoxalino[2,3-a:2′,3′-c]phenazine (abbreviation: HATNA), 2,4,6-tris[3′-(pyridin-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviation: TmPPPyTz), etc. can be used as the organic compound having an unshared electron pair. Note that NBPhen has a higher glass transition point (Tg) and is superior in heat resistance compared to BPhen.

[0474] As described above, the charge generation layer has at least a charge generation region. The charge generation region preferably contains an acceptor material, for example, a hole transport material and an acceptor material applicable to the hole injection layer.

[0475] The charge generation layer preferably includes a layer containing a material with high electron injection properties. This layer may also be called an electron injection buffer layer. The electron injection buffer layer is preferably provided between the charge generation region and the electron transport layer. By providing the electron injection buffer layer, the injection barrier between the charge generation region and the electron transport layer can be alleviated, so that electrons generated in the charge generation region can be easily injected into the electron transport layer.

[0476] The electron injection buffer layer preferably contains an alkali metal or an alkaline earth metal, and may contain, for example, an alkali metal compound or an alkaline earth metal compound. Specifically, the electron injection buffer layer preferably contains an inorganic compound containing an alkali metal and oxygen, or an inorganic compound containing an alkaline earth metal and oxygen, and may contain an inorganic compound containing lithium and oxygen (lithium oxide (Li ２ In addition, the electron injection buffer layer can be suitably made of the materials applicable to the electron injection layer described above.

[0477] The charge generation layer preferably has a layer containing a material with high electron transport properties. This layer can also be called an electron relay layer. The electron relay layer is preferably provided between the charge generation region and the electron injection buffer layer. When the charge generation layer does not have an electron injection buffer layer, the electron relay layer is preferably provided between the charge generation region and the electron transport layer. The electron relay layer has the function of preventing interaction between the charge generation region and the electron injection buffer layer (or the electron transport layer) and smoothly transferring electrons.

[0478] For the electron relay layer, it is preferable to use a phthalocyanine-based material such as copper (II) phthalocyanine (abbreviated as CuPc) or a metal complex having a metal-oxygen bond and an aromatic ligand.

[0479] It should be noted that the charge generation region, electron injection buffer layer, and electron relay layer may not be clearly distinguishable from one another depending on their cross-sectional shapes or characteristics.

[0480] The charge generation layer may contain a donor material instead of an acceptor material. For example, the charge generation layer may contain a layer containing an electron transport material and a donor material that can be used for the electron injection layer.

[0481] When light-emitting units are stacked, an increase in driving voltage can be suppressed by providing a charge generating layer between two light-emitting units.

[0482] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0483] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0484] Embodiment 6 In this embodiment, electronic devices that can be used as a display device of one embodiment of the present invention will be described with reference to FIGS. 39A to 44B.

[0485] The electronic devices of this embodiment include the display device of one embodiment of the present invention in their display portions. The display device of one embodiment of the present invention can easily achieve high definition and high resolution. Therefore, the display device of one embodiment of the present invention can be used in the display portions of various electronic devices.

[0486] Examples of electronic devices include electronic devices with relatively large screens such as television sets, desktop or notebook personal computers, computer monitors, digital signage, large game machines such as pachinko machines, as well as digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, and sound playback devices.

[0487] In particular, the display device of one embodiment of the present invention can be suitably used in electronic devices having a relatively small display area because it can increase the resolution. Examples of such electronic devices include wristwatch-type and bracelet-type information terminals (wearable devices), VR devices such as head-mounted displays, and head-mounted wearable devices such as glasses-type AR devices and MR devices shown in FIG. 3A and the like.

[0488] The display device of one embodiment of the present invention preferably has an extremely high resolution such as HD (1280 × 720 pixels), FHD (1920 × 1080 pixels), WQHD (2560 × 1440 pixels), WQXGA (2560 × 1600 pixels), 4K (3840 × 2160 pixels), or 8K (7680 × 4320 pixels). A resolution of 4K, 8K, or higher is particularly preferable. Furthermore, the pixel density (resolution) of the display device of one embodiment of the present invention is preferably 100 ppi or higher, more preferably 300 ppi or higher, more preferably 500 ppi or higher, more preferably 1000 ppi or higher, more preferably 2000 ppi or higher, more preferably 3000 ppi or higher, more preferably 5000 ppi or higher, and even more preferably 7000 ppi or higher. By using a display device having either or both of high resolution and high definition, it is possible to further enhance the sense of realism and depth. Furthermore, the screen ratio (aspect ratio) of the display device of one embodiment of the present invention is not particularly limited. For example, the display device can support various screen ratios such as 1:1 (square), 4:3, 16:9, and 16:10.

[0489] The electronic device of this embodiment may have a sensor (including the function of detecting, detecting, or measuring force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays).

[0490] The electronic device of the present embodiment can have various functions, such as a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, time, etc., a function to execute various software (programs), a wireless communication function, a function to read out programs or data recorded on a recording medium, etc.

[0491] 39A, 39B, 40A, and 40B will be used to describe examples of wearable devices that can be worn on the head. These wearable devices have one or both of a function for displaying AR content and a function for displaying VR content. Note that these wearable devices may also have a function for displaying SR (Substitutional Reality) or MR (Mixed Reality) content in addition to AR and VR. Having an electronic device with a function for displaying AR, VR, SR, MR, or other content can enhance the user's sense of immersion.

[0492] Electronic device 700A shown in Fig. 39A and electronic device 700B shown in Fig. 39B each have a pair of display panels 751, a pair of housings 721, a communication unit (not shown), a pair of mounting units 723, a control unit (not shown), an imaging unit (not shown), a pair of optical members 753, a frame 757, and a pair of nose pads 758. Electronic device 700A shown in Fig. 39A is an example of an electronic device that adds earphones 750 connected via wireless communication to first display device 1000 described in Fig. 3A .

[0493] The display device of one embodiment of the present invention can be applied to the display panel 751. Therefore, the electronic device can provide an extremely high-definition display.

[0494] The electronic device 700A and the electronic device 700B can each project an image displayed on the display panel 751 onto a display area 756 of the optical member 753. Because the optical member 753 is translucent, the user can see the image displayed in the display area superimposed on a transmitted image visually recognized through the optical member 753. Therefore, the electronic device 700A and the electronic device 700B are each electronic devices capable of AR display.

[0495] Electronic device 700A and electronic device 700B may be provided with a camera capable of capturing an image in front of them as an imaging unit. Furthermore, electronic device 700A and electronic device 700B may each be provided with an acceleration sensor such as a gyro sensor, thereby detecting the orientation of the user's head and displaying an image corresponding to that orientation in display area 756.

[0496] The communication unit has a wireless communication device, and can supply a video signal, etc. Instead of or in addition to the wireless communication device, a connector to which a cable through which a video signal and a power supply potential are supplied may be provided.

[0497] Furthermore, the electronic device 700A and the electronic device 700B are provided with batteries, which can be charged wirelessly and / or by wire.

[0498] The housing 721 may be provided with a touch sensor module. The touch sensor module has a function of detecting a touch on the outer surface of the housing 721. The touch sensor module can detect a tap operation or a slide operation by the user and perform various processes. For example, a tap operation can perform a process such as pausing or resuming a video, and a slide operation can perform a process such as fast-forwarding or fast-rewinding. Furthermore, providing a touch sensor module on each of the two housings 721 can expand the range of operations.

[0499] Various touch sensors can be used as the touch sensor module. For example, various types of touch sensors can be used, such as a capacitance type, a resistive film type, an infrared type, an electromagnetic induction type, a surface acoustic wave type, and an optical type. In particular, it is preferable to use a capacitance type or an optical type sensor in the touch sensor module.

[0500] When an optical touch sensor is used, a photoelectric conversion device (also called a photoelectric conversion element) can be used as the light receiving device (also called a light receiving element). The active layer of the photoelectric conversion device can be made of either or both of an inorganic semiconductor and an organic semiconductor.

[0501] The electronic device 800A shown in Figure 40A and the electronic device 800B shown in Figure 40B each have a pair of display units 820, a housing 821, a communication unit 822, a pair of mounting units 823, a control unit 824, a pair of imaging units 825, and a pair of lenses 832.

[0502] The display device of one embodiment of the present invention can be applied to the display portion 820. Therefore, an electronic device capable of displaying images with extremely high definition can be provided. This allows a user to feel a high sense of immersion.

[0503] The display unit 820 is provided inside the housing 821 at a position that can be viewed through the lens 832. In addition, by displaying different images on the pair of display units 820, it is possible to perform three-dimensional display using parallax.

[0504] The electronic device 800A and the electronic device 800B can be said to be electronic devices for VR. A user wearing the electronic device 800A or the electronic device 800B can view an image displayed on the display unit 820 through the lens 832.

[0505] It is preferable that electronic device 800A and electronic device 800B each have a mechanism that can adjust the left and right positions of lens 832 and display unit 820 so that they are optimally positioned according to the position of the user's eyes. It is also preferable that electronic device 800A and electronic device 800B each have a mechanism that can adjust the focus by changing the distance between lens 832 and display unit 820.

[0506] The mounting unit 823 allows the user to mount the electronic device 800A or the electronic device 800B on the head. Note that, in Fig. 40A and other figures, the mounting unit 823 is shaped like the temples of glasses, but is not limited to this. The mounting unit 823 may be shaped like a helmet or a band, for example, as long as it can be worn by the user.

[0507] The imaging unit 825 has a function of acquiring external information. Data acquired by the imaging unit 825 can be output to the display unit 820. An image sensor can be used for the imaging unit 825. Furthermore, multiple cameras may be provided to support multiple angles of view, such as telephoto and wide-angle.

[0508] Although an example including the imaging unit 825 is shown here, a distance measuring sensor (hereinafter also referred to as a detection unit) capable of measuring the distance to an object may be provided. That is, the imaging unit 825 is one aspect of the detection unit. As the detection unit, for example, an image sensor or a range image sensor such as a LIDAR (Light Detection and Ranging) can be used. By using an image obtained by the camera and an image obtained by the range image sensor, more information can be obtained, enabling more accurate gesture operations.

[0509] The electronic device 800A may have a vibration mechanism that functions as a bone conduction earphone. For example, a configuration having such a vibration mechanism can be applied to one or more of the display unit 820, the housing 821, and the wearing unit 823. This allows a user to enjoy video and audio simply by wearing the electronic device 800A, without the need for separate audio equipment such as headphones, earphones, or speakers.

[0510] The electronic device 800A and the electronic device 800B may each have an input terminal to which a cable can be connected for supplying a video signal from a video output device or the like and power for charging a battery provided in the electronic device.

[0511] The electronic device of one embodiment of the present invention may have a function of wireless communication with an earphone 750. The earphone 750 includes a communication unit (not shown) and has a wireless communication function. The earphone 750 can receive information (e.g., audio data) from the electronic device through the wireless communication function. For example, an electronic device 700A shown in FIG. 39A has a function of transmitting information to the earphone 750 through the wireless communication function. Furthermore, for example, an electronic device 800A shown in FIG. 40A has a function of transmitting information to the earphone 750 through the wireless communication function.

[0512] The electronic device may also have an earphone unit. Electronic device 700B shown in Fig. 39B has earphone unit 727. For example, earphone unit 727 and the control unit may be configured to be connected to each other by wire. Part of the wiring connecting earphone unit 727 and the control unit may be disposed inside housing 721 or wearing unit 723.

[0513] Similarly, electronic device 800B shown in Fig. 40B has earphone unit 827. For example, earphone unit 827 and control unit 824 can be configured to be connected to each other by wire. Part of the wiring connecting earphone unit 827 and control unit 824 may be disposed inside housing 821 or wearing unit 823. Furthermore, earphone unit 827 and wearing unit 823 may have magnets. This allows earphone unit 827 to be fixed to wearing unit 823 by magnetic force, which is preferable as it makes storage easier.

[0514] The electronic device may have an audio output terminal to which earphones or headphones can be connected. The electronic device may also have one or both of an audio input terminal and an audio input mechanism. For example, a sound collection device such as a microphone can be used as the audio input mechanism. By having the audio input mechanism, the electronic device may be endowed with the functionality of a so-called headset.

[0515] As described above, the electronic devices of one embodiment of the present invention are preferably either glasses-type electronic devices (such as the electronic devices 700A and 700B) or goggle-type electronic devices (such as the electronic devices 800A and 800B). The first display device 1000 described in Embodiment 1 is preferably the glasses-type electronic devices and goggle-type electronic devices described above.

[0516] Furthermore, the electronic device of one embodiment of the present invention can transmit information to the earphone by wire or wirelessly.

[0517] The electronic device 6500 shown in FIG. 41A is a portable information terminal that can be used as a smartphone.

[0518] The electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, a light source 6508, and the like. The display portion 6502 has a touch panel function.

[0519] The display device of one embodiment of the present invention can be applied to the display portion 6502 .

[0520] FIG. 41B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.

[0521] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and a display panel 6511, optical members 6512, a touch sensor panel 6513, a printed circuit board 6517, a battery 6518, etc. are arranged in the space surrounded by the housing 6501 and the protective member 6510.

[0522] A display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by adhesive layers (not shown).

[0523] In a region outside the display portion 6502, a part of the display panel 6511 is folded back, and an FPC 6515 is connected to the folded back part. An IC 6516 is mounted on the FPC 6515. The FPC 6515 is connected to a terminal provided on a printed circuit board 6517.

[0524] The flexible display of one embodiment of the present invention can be applied to the display panel 6511. Therefore, an extremely lightweight electronic device can be realized. In addition, since the display panel 6511 is extremely thin, a large-capacity battery 6518 can be mounted thereon while keeping the thickness of the electronic device small. Furthermore, by folding back a part of the display panel 6511 and arranging a connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device with a narrow frame can be realized.

[0525] 42A shows an example of a television set. A television set 7100 has a display portion 7000 built into a housing 7101. Here, the housing 7101 is supported by a stand 7103.

[0526] The display device of one embodiment of the present invention can be applied to the display portion 7000 .

[0527] 42A can be operated using operation switches provided on the housing 7101 and a separate remote control 7111. Alternatively, the display portion 7000 may be provided with a touch sensor, and the television set 7100 may be operated by touching the display portion 7000 with a finger or the like. The remote control 7111 may have a display portion that displays information output from the remote control 7111. Using operation keys or a touch panel provided on the remote control 7111, the channel and volume can be controlled, and an image displayed on the display portion 7000 can be controlled.

[0528] The television device 7100 is configured to include a receiver, a modem, and the like. Ordinary television broadcasts can be received using the receiver. Furthermore, by connecting to a wired or wireless communication network via the modem, it is possible to perform one-way (from a sender to a receiver) or two-way (between a sender and a receiver, or between receivers, etc.) information communication.

[0529] 42B shows an example of a laptop personal computer 7200. The laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. The housing 7211 includes a display portion 7000.

[0530] The display device of one embodiment of the present invention can be applied to the display portion 7000 .

[0531] 42C and 42D show an example of digital signage.

[0532] 42C includes a housing 7301, a display portion 7000, and a speaker 7303. The digital signage 7300 may further include an LED lamp, operation keys (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

[0533] 42D shows a digital signage 7400 attached to a cylindrical pillar 7401. The digital signage 7400 has a display unit 7000 provided along the curved surface of the pillar 7401.

[0534] 42C and 42D, the display device of one embodiment of the present invention can be applied to the display portion 7000.

[0535] The larger the display unit 7000, the more information can be provided at one time. Also, the larger the display unit 7000, the more easily it will attract people's attention, which can increase the advertising effectiveness of, for example, advertisements.

[0536] Applying a touch panel to the display unit 7000 is preferable because it not only displays images or videos on the display unit 7000 but also allows the user to intuitively operate it. Furthermore, when used to provide information such as route information or traffic information, intuitive operation can improve usability.

[0537] 42C and 42D , the digital signage 7300 or the digital signage 7400 is preferably capable of wirelessly linking with an information terminal 7311 or an information terminal 7411 such as a smartphone carried by a user. For example, advertising information displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411. By operating the information terminal 7311 or the information terminal 7411, the display on the display unit 7000 can be switched.

[0538] Furthermore, the digital signage 7300 or the digital signage 7400 can be made to run a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller), thereby allowing an unspecified number of users to simultaneously participate in and enjoy the game.

[0539] The electronic device shown in Figures 43A to 43G has a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), a connection terminal 9006, a sensor 9007 (including the function of detecting, detecting, or measuring force, displacement, position, speed, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays), a microphone 9008, etc.

[0540] The electronic devices shown in Figures 43A to 43G have various functions. For example, they may have a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, or time, a function to control processing using various software (programs), a wireless communication function, a function to read and process programs or data recorded on a recording medium, etc. Note that the functions of the electronic devices are not limited to these, and they may have various other functions. The electronic devices may have multiple display units. Furthermore, the electronic devices may be provided with a camera or the like to capture still images or videos and store them on a recording medium (external or built-in to the camera), display the captured images on the display unit, etc.

[0541] Details of the electronic device shown in Figures 43A to 43G will be described below.

[0542] FIG. 43A is a perspective view showing a mobile information terminal 9101. The mobile information terminal 9101 can be used as, for example, a smartphone. Note that the mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. The mobile information terminal 9101 can display text and image information on multiple surfaces. FIG. 43A shows an example in which three icons 9050 are displayed. Information 9051, indicated by a dashed rectangle, can also be displayed on another surface of the display unit 9001. Examples of the information 9051 include notifications of incoming emails, SNS (Social Networking Service), and phone calls, the title of emails or SNS messages, the sender's name, the date and time, the remaining battery level, and signal strength. Alternatively, an icon 9050 or the like may be displayed in the position where the information 9051 is displayed.

[0543] 43B is a perspective view showing the mobile information terminal 9102. The mobile information terminal 9102 has a function of displaying information on three or more surfaces of the display unit 9001. Here, an example is shown in which information 9052, information 9053, and information 9054 are displayed on different surfaces. For example, a user can check information 9053 displayed in a position that can be observed from above the mobile information terminal 9102 while the mobile information terminal 9102 is placed in a breast pocket of clothes. The user can check the display without taking the mobile information terminal 9102 out of the pocket and decide, for example, whether to answer a call.

[0544] 43C is a perspective view showing a tablet terminal 9103. The tablet terminal 9103 is capable of executing various applications such as mobile phone calls, e-mail, text browsing and creation, music playback, internet communication, and computer games, for example. The tablet terminal 9103 has a display unit 9001, a camera 9002, a microphone 9008, and a speaker 9003 on the front side of a housing 9000, operation keys 9005 as operation buttons on the left side of the housing 9000, and a connection terminal 9006 on the bottom.

[0545] FIG. 43D is a perspective view showing a wristwatch-type mobile information terminal 9200. The mobile information terminal 9200 can be used as, for example, a smart watch (registered trademark). The display surface of the display unit 9001 is curved, and display can be performed along the curved display surface. The mobile information terminal 9200 can also perform hands-free calling by communicating with, for example, a headset capable of wireless communication. The mobile information terminal 9200 can also perform data transmission and charging with another information terminal through a connection terminal 9006. Note that charging may be performed by wireless power supply.

[0546] 43E to 43G are perspective views showing a foldable mobile information terminal 9201. Also, FIG. 43E is a perspective view of the mobile information terminal 9201 in an unfolded state, FIG. 43G is a perspective view of the mobile information terminal 9201 in a folded state, and FIG. 43F is a perspective view of a state in the process of changing from one of FIG. 43E and FIG. 43G to the other. The mobile information terminal 9201 is highly portable when folded, and has a seamless, wide display area when unfolded, providing excellent visibility of the display. The display portion 9001 of the mobile information terminal 9201 is supported by three housings 9000 connected by hinges 9055. For example, the display portion 9001 can be bent with a curvature radius of 0.1 mm or more and 150 mm or less.

[0547] 44A and 44B includes a housing 8001, a housing 8002, a display portion 8003, and a hinge portion 8005. The portable information terminal 8000 can be folded at the hinge portion 8005.

[0548] The housing 8001 and the housing 8002 are connected by a hinge 8005. The portable information terminal 8000 can be unfolded from a folded state (FIG. 44A) as shown in FIG. 44B. This allows for excellent portability when carried around, and excellent visibility due to the large display area when in use.

[0549] The portable information terminal 8000 includes a flexible display portion 8003 that spans a housing 8001 and a housing 8002 that are connected by a hinge portion 8005 .

[0550] A display device manufactured using one embodiment of the present invention can be used for the display portion 8003. This enables the portable information terminal to be manufactured with a high yield.

[0551] The display portion 8003 can display at least one of document information, a still image, a moving image, etc. When document information is displayed on the display portion, the portable information terminal 8000 can be used as an electronic book terminal.

[0552] When the mobile information terminal 8000 is unfolded, the display portion 8003 is held in a state where the radius of curvature is large. For example, the display portion 8003 is held including a curved portion with a radius of curvature of 1 mm to 50 mm, preferably 5 mm to 30 mm. In part of the display portion 8003, pixels are continuously arranged from the housing 8001 to the housing 8002, and a curved display can be performed.

[0553] The display portion 8003 functions as a touch panel and can be operated with a finger, a stylus, or the like.

[0554] The display portion 8003 is preferably configured as a single flexible display, which allows continuous display without interruption between the housing 8001 and the housing 8002. Note that a display may be provided on each of the housings 8001 and 8002.

[0555] The hinge 8005 preferably has a locking mechanism so that the angle between the housing 8001 and the housing 8002 does not exceed a predetermined angle when the portable information terminal 8000 is unfolded. For example, the angle at which the locking occurs (the portable information terminal 8000 does not open any further) is preferably greater than or equal to 90 degrees and less than 180 degrees, and typically can be 90 degrees, 120 degrees, 135 degrees, 150 degrees, or 175 degrees. This can improve the convenience, safety, and reliability of the portable information terminal 8000.

[0556] If the hinge portion 8005 has a locking mechanism, excessive force is not applied to the display portion 8003, and damage to the display portion 8003 can be prevented. Therefore, a highly reliable portable information terminal can be realized.

[0557] The housing 8001 and the housing 8002 may include a power button, an operation button, an external connection port, a speaker, a microphone, and the like.

[0558] Either the housing 8001 or the housing 8002 is provided with a wireless communication module, which makes it possible to send and receive data via a computer network such as the Internet, a LAN (Local Area Network), or Wi-Fi (registered trademark).

[0559] As the second display device 1002 described in the first embodiment, electronic devices such as those shown in FIGS. 41 to 44 are suitable.

[0560] This embodiment mode can be combined with other embodiment modes as appropriate.

[0561] 10A: display device, 10B: display device, 10C: display device, 11: substrate, 12: substrate, 13: display section, 14: terminal section, 19: sub-display section, 20: layer, 21: transistor, 22: channel formation region, 29A: area, 29B: area, 29C: area, 30: drive circuit, 30a: drive circuit, 30b: drive circuit, 30c: drive circuit, 30d: drive circuit, 31: source driver circuit, 32: digital-to-analog conversion circuit, 33: gate driver circuit, 34: level shifter, 35: amplifier circuit, 39: section, 40: functional circuit, 41: storage device, 42: GPU, 42a: color matrix correction, 42b: up-conversion, 43: EL correction circuit, 44: timing controller, 45: CPU, 46: sensor controller, 47: power supply circuit, 50: layer, 51: pixel circuit, 51A: pixel circuit, 51B: pixel circuit, 51C: pixel circuit, 51D: pixel circuit, 51E: pixel circuit, 51F: pixel circuit, 51G: pixel circuit, 51H: pixel circuit, 51I: pixel circuit, 52: transistor, 52A: transistor, 52B: transistor, 52C: transistor, 52D: transistor, 52w: transistor, 53: capacitor, 53A: capacitor, 53s: capacitor , 53w: Capacitor, 55: Pixel circuit group, 59: Partition, 60: Layer, 61: Light-emitting element, 70: Display module, 71: Printed wiring board, 72: Terminal portion, 73: Wire, 74: FPC, 75: Connection portion, 80: Input / output circuit, 100: Display device, 101: Substrate, 110: Light-emitting element, 110a: Light-emitting element, 110b: Light-emitting element, 110B: Light-emitting element, 110c: Light-emitting element, 110G: Light-emitting element, 110R: Light-emitting element, 111: Pixel electrode, 111B: Pixel electrode, 111C: Connection electrode, 111G: Pixel electrode, 111R: Pixel electrode, 112: Organic layer, 112B: Organic layer, 11 2G: organic layer, 112R: organic layer, 113: common electrode, 114: common layer, 121: protective layer, 124a: pixel, 124b: pixel, 125: insulating layer, 126: resin layer, 128: layer, 140: connecting portion, 150: pixel, 151: pixel, 170: substrate, 171: adhesive layer, 200A: display device, 200B: display device, 200C: display device, 200D: display device, 200E: display device, 200F: display device, 200G: display device, 230: pixel, 240: capacitor, 241: conductive layer, 243: insulating layer, 245: conductive layer, 251: conductive layer, 252: conductive layer, 254: insulating layer,255a: insulating layer, 255b: insulating layer, 255c: insulating layer, 256: plug, 261: insulating layer, 262: insulating layer, 263: insulating layer, 264: insulating layer, 265: insulating layer, 271: plug, 274: plug, 274a: conductive layer, 274b: conductive layer, 280: display module, 281: display section, 282: circuit section, 283: pixel circuit section, 283a: pixel circuit, 284: pixel section, 284a: pixel, 285: terminal section, 286: wiring section, 290: FPC, 291: substrate, 292: substrate, 301: substrate, 301A: substrate, 301B: substrate, 310: transistor, 310A : transistor, 310B: transistor, 311: conductive layer, 312: low resistance region, 313: insulating layer, 314: insulating layer, 315: element isolation layer, 320: transistor, 320A: transistor, 320B: transistor, 321: semiconductor layer, 323: insulating layer, 324: conductive layer, 325: conductive layer, 326: insulating layer, 327: conductive layer, 328: insulating layer, 329: insulating layer, 331: substrate, 332: insulating layer, 335: insulating layer, 336: insulating layer, 341: conductive layer, 342: conductive layer, 343: plug, 344: insulating layer, 345: insulating layer, 346: insulating layer, 347: bump , 348: adhesive layer, 441: timing controller, 442: input / output circuit, 443: frame memory, 461: image information input unit, 462: clock signal input unit, 463: image data temporary storage unit, 464: operation parameter setting unit, 465: internal clock signal generation unit, 466: image processing unit, 467: memory controller, 700A: electronic device, 700B: electronic device, 721: housing, 723: wearing unit, 727: earphone unit, 750: earphone, 751: display panel, 753: optical member, 756: display area, 757: frame, 758: nose pad, 761: Lower electrode, 762: upper electrode, 763: EL layer, 763a: light-emitting unit, 763b: light-emitting unit, 763c: light-emitting unit, 764: layer, 771: light-emitting layer, 771a: light-emitting layer, 771b: light-emitting layer, 771c: light-emitting layer, 772: light-emitting layer, 772a: light-emitting layer, 772b: light-emitting layer, 772c: light-emitting layer, 773: light-emitting layer, 780: layer, 780a: layer, 780b: layer, 780c: layer, 781: layer, 782: layer, 785: charge generation layer, 790: layer, 790a: layer, 790b: layer, 790c: layer, 791: layer, 792: layer, 800A: electronic device, 800B: electronic device,820: display unit, 821: housing, 822: communication unit, 823: wearing unit, 824: control unit, 825: imaging unit, 827: earphone unit, 832: lens, 1000: display device, 1000A: display device, 1000B: display device, 1002: display device, 1010: display unit, 1011: housing, 1012: sensor unit, 1013: communication unit, 1014: control unit, 1015: camera unit, 1016: wearing unit, 1017: display panel, 1018: power supply unit, 1019: optical member, 1020: display unit, 1021: housing, 1022: sensor unit, 1023: communication unit, 1024: control unit control unit, 1025: camera unit, 1028: power supply unit, 1029: communication unit, 1040: display image, 1041: dimensional virtual object, 1042: display image, 1043: display image, 1044: display image, 1045: display image, 1060: display image, 1061: display image, 1110: headphone unit, 6500: electronic device, 6501: housing, 6502: display unit, 6503: power button, 6504: button, 6505: speaker, 6506: microphone, 6507: camera, 6508: light source, 6510: protective member, 6511: display panel, 6512: optical member, 6513 : Touch sensor panel, 6515: FPC, 6516: IC, 6517: Printed circuit board, 6518: Battery, 7000: Display unit, 7100: Television device, 7101: Housing, 7103: Stand, 7111: Remote control device, 7200: Notebook personal computer, 7211: Housing, 7212: Keyboard, 7213: Pointing device, 7214: External connection port, 7300: Digital signage, 7301: Housing, 7303: Speaker, 7311: Information terminal device, 7400: Digital signage, 7401: Pillar, 7411 : Information terminal, 8000: Portable information terminal, 8001: Housing, 8002: Housing, 8003: Display unit, 8005: Hinge unit, 9000: Housing, 9001: Display unit, 9002: Camera, 9003: Speaker, 9005: Operation keys, 9006: Connection terminal, 9007: Sensor, 9008: Microphone, 9050: Icon, 9051: Information, 9052: Information, 9053: Information, 9054: Information, 9055: Hinge, 9101: Portable information terminal, 9102: Portable information terminal, 9103: Tablet terminal, 9200: Portable information terminal, 9201: Portable information terminal,

Claims

1. a first display device; a second display device; the first display device has a first display unit that displays a first image superimposed on a transmission image, the first display unit has an organic EL device, the organic EL device has an EL layer processed by a photolithography method, the second display device has a second display unit, the first display device has a function of acquiring position information of the second display unit, a display position of the first image is determined based on the position information of the second display unit; Display system.

2. In claim 1, the first display unit is translucent, The transmitted image is an image transmitted through the first display unit. Display system.

3. In claim 1, the first display device has an imaging means, The transmission image is an image captured by the imaging means. Display system.

4. In claim 1, the first image is displayed when at least a part of the second display unit is located within a range of the transmission image; Display system.

5. In claim 1, The first image is generated according to the position information. Display system.

6. In claim 1, the first display device is a glasses type; Display system.

7. In claim 1, the first display device is a goggle type; Display system.

8. In claim 1, the second display device has a hinge portion, the second display device has a function of being folded at the hinge portion; Display system.

9. In any one of claims 1 to 8, The first display device includes: a first layer, a second layer, and a third layer; the first layer includes a drive circuit and a CPU; the second layer has pixel circuits; the third layer has a display device; the first layer includes a first transistor having a semiconductor layer having silicon in a channel formation region; the second layer includes a second transistor having a semiconductor layer having a metal oxide in a channel formation region; the third layer comprises an organic electroluminescent device; Display system.

10. In claim 9, The metal oxide comprises indium, an element M (wherein M is aluminum, gallium, yttrium, or tin), and zinc. Display system.