Electronic device

Abstract

This electronic device comprises an electronic component having a functioning part, a mount part on which the electronic component is mounted, and a joining material for joining the electronic component and the mount part. The mount part has a rear surface facing one side in the thickness direction of the electronic component, and a first surface and a second surface which face the other side in the thickness direction and to which the electronic component is joined. The second surface is positioned further on the other side in the thickness direction than the first surface. The first surface overlaps at least a portion of the outer periphery of the electronic component when viewed in the thickness direction. The second surface overlaps the functioning part when viewed in the thickness direction.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Conventionally, electronic devices have been known in which electronic components such as diodes, transistors, and ICs are covered with a resin package. Patent Document 1 discloses a semiconductor device (electronic device) including a semiconductor element as the electronic component. The semiconductor device described in Patent Document 1 includes a semiconductor element, leads, a bonding material, and a sealing resin. In this semiconductor device, the semiconductor element is, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) chip. The semiconductor element is bonded to the leads by the bonding material. The leads mount the semiconductor element and are electrically connected to the semiconductor element. The bonding material is interposed between the semiconductor element and the leads and bonds them together. The sealing resin covers a portion of the leads, the semiconductor element, and the bonding material.

[0003] Japanese Patent Application Laid-Open No. 2021-93473

[0004] In a configuration in which an electronic component is mounted to a bonded object using a bonding material, such as the semiconductor device described in Patent Document 1, the thicker the bonding material, the higher the bonding strength of the electronic component to the bonded object and the higher the mounting reliability. On the other hand, the thermal conductivity from the electronic component to the bonded object decreases, and the heat dissipation of the electronic component decreases. Conversely, the thinner the bonding material, the better the thermal conductivity from the electronic component to the bonded object and the higher the heat dissipation of the electronic component. On the other hand, the bonding strength of the electronic component to the bonded object decreases, and the mounting reliability decreases.

[0005] An object of the present disclosure is to provide an electronic device that is improved over conventional devices. In particular, in view of the above circumstances, an object of the present disclosure is to provide an electronic device that ensures mounting reliability of electronic components while improving heat dissipation.

[0006] An electronic device according to a first aspect of the present disclosure includes a first electronic component having a functional unit, a mounting unit on which the first electronic component is mounted, and a bonding material that bonds the first electronic component to the mounting unit. The mounting unit has a back surface facing one side in a thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded. The second surface is located on the other side in the thickness direction than the first surface. The first surface overlaps at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction. The second surface overlaps the functional unit when viewed in the thickness direction.

[0007] According to the above configuration, in the electronic device, it is possible to improve heat dissipation while ensuring the mounting reliability of the electronic components.

[0008] FIG. 1 is a perspective view showing an electronic device according to a first embodiment. FIG. 2 is a plan view showing the electronic device according to the first embodiment. FIG. 3 is a plan view showing a main part of the electronic device according to the first embodiment. FIG. 4 is an enlarged view of a part of FIG. 3, showing electronic components and a bonding material in a see-through manner. FIG. 5 is a bottom view showing the electronic device according to the first embodiment. FIG. 6 is a front view showing the electronic device according to the first embodiment. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 3. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 4. FIG. 10 is an enlarged cross-sectional view showing a main part of an electronic device according to a first modified example of the first embodiment, corresponding to the cross section of FIG. 9. FIG. 11 is an enlarged plan view showing a main part of an electronic device according to a second modified example of the first embodiment, corresponding to FIG. 4. FIG. 12 is an enlarged plan view showing a main part of an electronic device according to a third modified example of the first embodiment, corresponding to FIG. 4. FIG. 13 is an enlarged cross-sectional view of a main portion of an electronic device according to a third modified example of the first embodiment, taken along line XIII-XIII in FIG. 12 . FIG. 14 is an enlarged plan view of a main portion of an electronic device according to a fourth modified example of the first embodiment, corresponding to FIG. 4 . FIG. 15 is an enlarged cross-sectional view of a main portion of an electronic device according to a fourth modified example of the first embodiment, taken along line XV-XV in FIG. 14 . FIG. 16 is an enlarged plan view of a main portion of an electronic device according to a fifth modified example of the first embodiment, corresponding to FIG. 4 . FIG. 17 is a perspective view of an electronic device according to a second embodiment. FIG. 18 is a plan view of an electronic device according to the second embodiment, showing a resin member in perspective. FIG. 19 is a partially enlarged view of a portion of FIG. 18 , showing electronic components and bonding materials in perspective. FIG. 20 is a cross-sectional view taken along line XX-XX in FIG. 18 . FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 18 . Fig. 22 is a perspective view showing an electronic device according to a third embodiment, with the resin member omitted. Fig. 23 is a plan view showing the electronic device according to the third embodiment, with the resin member seen through. Fig. 24 is a view showing one of two input terminals in the plan view of Fig. 23 further seen through. Fig. 25 is an enlarged view of a part of Fig. 24 , with a plurality of electronic components and bonding materials seen through.Fig. 26 is a cross-sectional view taken along line XXVI-XXVI in Fig. 23. Fig. 27 is a cross-sectional view taken along line XXVII-XXVII in Fig. 23. Fig. 28 is a cross-sectional view taken along line XXVIII-XXVIII in Fig. 23. Fig. 29 is an enlarged plan view of a main part showing an electronic device according to a modified example of the third embodiment, and corresponds to Fig. 25.

[0009] Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals, and redundant description will be omitted. Terms such as "first," "second," and "third" in this disclosure are merely used as labels and are not intended to necessarily assign any order to their objects.

[0010] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an) object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an) object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on (an) object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an) object B" includes "a certain object A is in contact with a certain object B and is located on (an) object B" and "a certain object A is located on (an) object B with another object interposed between the certain object A and the certain object B." Furthermore, unless otherwise specified, "when viewed from a certain direction, an object A overlaps an object B" includes "an object A overlaps the entire object B" and "an object A overlaps a part of an object B." Furthermore, "an object A (a constituent material thereof) contains a certain material C" includes "an object A (a constituent material thereof) is made of a certain material C" and "an object A (a constituent material thereof) mainly consists of a certain material C."

[0011] First Embodiment: FIGS. 1 to 9 show an electronic device A1 according to a first embodiment. The electronic device A1 is used in electronic devices equipped with a power conversion circuit, such as a DC-DC converter. As shown in FIGS. 1 to 9, the electronic device A1 includes an electronic component 1A, a first lead 21, a second lead 22, a third lead 23, a bonding material 3, a plurality of conductive members 4, and a resin member 5. For ease of understanding, the resin member 5 is shown in perspective with an imaginary line (two-dot chain line) in FIG. 3. The electronic component 1A and the bonding material 3 are shown in perspective with imaginary lines in FIG. 4. The conductive members 4 and the resin member 5 are also omitted from FIG. 4.

[0012] For ease of explanation, the thickness direction of the electronic device A1 is referred to as the "thickness direction z." In the following explanation, one side of the thickness direction z may be referred to as the "downward direction," and the other side may be referred to as the "upward direction." Terms such as "upper," "lower," "upper," "lower," "top surface," and "bottom surface" indicate the relative positional relationship of components in the thickness direction z and do not necessarily define the relationship with the direction of gravity. Furthermore, "plan view" refers to the view in the thickness direction z. A direction perpendicular to the thickness direction z is referred to as the "first direction x." For example, the first direction x is the up-down direction in the plan view of the electronic device A1 (see FIGS. 2 and 3). A direction perpendicular to the thickness direction z and the first direction x is referred to as the "second direction y." The second direction y is the left-right direction in the plan view of the electronic device A1 (see FIGS. 2 and 3).

[0013] The electronic component 1A is the functional center of the electronic device A1. The electronic component 1A is mounted on a first lead 21. The electronic component 1A has a main surface 10a and a back surface 10b. The main surface 10a and the back surface 10b are spaced apart in the thickness direction z. The main surface 10a faces upward in the thickness direction z, and the back surface 10b faces downward in the thickness direction z. The back surface 10b faces opposite the first lead 21. The dimension of the electronic component 1A in the thickness direction z (the distance between the main surface 10a and the back surface 10b along the thickness direction z) is not limited in any way, but is, for example, 50 μm or more and 200 μm or less.

[0014] The electronic component 1A includes a functional unit 11. The functional unit 11 is, for example, a power transistor. The power transistor is, for example, a vertical-structure metal-oxide-semiconductor field-effect transistor (MOSFET). The functional unit 11 is not limited to a MOSFET, and may be another transistor such as an insulated gate bipolar transistor (IGBT), or may be an LSI or a diode. The functional unit 11 becomes a heat source when the electronic device A1 is powered. For ease of understanding, a dot pattern is drawn on the functional unit 11 in FIG. 4 .

[0015] The functional unit 11 includes a semiconductor layer 110, a first electrode 111, a second electrode 112, and a third electrode 113. The semiconductor layer 110 includes a semiconductor material. The semiconductor material is, for example, silicon carbide (SiC). Other semiconductor materials such as silicon (Si) or gallium nitride (GaN) may also be used. A current corresponding to the power converted by the functional unit 11 flows through the first electrode 111. A current corresponding to the power before conversion by the functional unit 11 flows through the second electrode 112. A drive signal for driving the functional unit 11 is input to the third electrode 113. In an example where the functional unit 11 is a MOSFET, the first electrode 111 is a drain, the second electrode 112 is a source, and the third electrode 113 is a gate. The first electrode 111 is disposed on the back surface 10b. The second electrode 112 and the third electrode 113 are disposed on the main surface 10a.

[0016] The first lead 21 mounts the electronic component 1A and forms part of a conductive path between the electronic component 1A and a circuit board (not shown) on which the electronic device A1 is mounted. The first lead 21 includes a mounting portion 211 and a terminal portion 212. The mounting portion 211 and the terminal portion 212 are integrally formed.

[0017] The mounting portion 211 is covered with a resin member 5. The above-described electronic component 1A is mounted on the mounting portion 211. The mounting portion 211 is electrically connected to the first electrode 111 of the electronic component 1A via the bonding material 3.

[0018] The mounting portion 211 has a first surface 210a, a second surface 210b, and a back surface 210d. The first surface 210a and the second surface 210b are each located lower than the electronic component 1A in the thickness direction z. The first surface 210a and the second surface 210b each face upward in the thickness direction z. As shown in FIGS. 4 and 9 , the electronic component 1A is bonded across the first surface 210a and the second surface 210b.

[0019] First surface 210a is disposed so as to surround second surface 210b in plan view. First surface 210a is, for example, flat and extends along a plane (xy plane) perpendicular to thickness direction z. In the illustrated example, first surface 210a overlaps the entire outer periphery 19 of electronic component 1A in plan view.

[0020] The second surface 210b is located higher in the thickness direction z than the first surface 210a. In other words, the second surface 210b is located closer to the electronic component 1A than the first surface 210a in the thickness direction z. The second surface 210b is, for example, flat and extends along the xy plane. In this embodiment, the second surface 210b is located inside the electronic component 1A in a planar view. Furthermore, the second surface 210b overlaps the entire functional unit 11 in a planar view. The second surface 210b is rectangular in a planar view.

[0021] The back surface 210d faces downward in the thickness direction z. That is, the back surface 210d faces the opposite side to the first surface 210a and the second surface 210b in the thickness direction z. The back surface 210d is, for example, flat and extends along the xy plane. In the illustrated example, the back surface 210d is exposed from the resin member 5. In a plan view, the back surface 210d overlaps the first surface 210a and the second surface 210b.

[0022] The mounting portion 211 includes a base 2111 and a protruding portion 2112. In a plan view, the base 2111 surrounds the protruding portion 2112. The protruding portion 2112 protrudes upward in the thickness direction z beyond the base 2111. The thickness (dimension in the thickness direction z) of the protruding portion 2112 is greater than the thickness (dimension in the thickness direction z) of the base 2111. The lower surface of the base 2111 and the lower surface of the protruding portion 2112 are flush with each other. The first surface 210a described above is the upper surface of the base 2111. The second surface 210b described above is the upper surface of the protruding portion 2112. The back surface 210d described above is the lower surface of the base 2111 and the lower surface of the protruding portion 2112. The protruding dimension of the protruding portion 2112 relative to the base portion 2111 (the distance between the first surface 210a and the second surface 210b in the thickness direction z) is not particularly limited, but is, for example, 20 μm or more and 50 μm or less.

[0023] The mounting portion 211 has a through-hole 211A formed in a base portion 2111. The through-hole 211A passes through the base portion 2111 (mounting portion 211) in the z direction. The through-hole 211A has a circular shape in a plan view.

[0024] The terminal portion 212 extends in the first direction x from the edge of the mounting portion 211 on the other side in the first direction x. The terminal portion 212 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The portion of the terminal portion 212 covered with the resin member 5 is bent. The surface of the terminal portion 212 exposed from the resin member 5 may be plated (for example, tin plated). The portion of the terminal portion 212 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted, or the like.

[0025] The second lead 22 is spaced apart from the first lead 21. The second lead 22 is electrically connected to the second electrode 112 of the electronic component 1A via the conductive member 4. The second lead 22 includes a pad portion 221 and a terminal portion 222.

[0026] The pad portion 221 is covered with a resin member 5. A conductive member 4 is joined to the pad portion 221. The surface of the pad portion 221 to which the conductive member 4 is joined may be plated with, for example, silver or tin. The terminal portion 222 is connected to the pad portion 221. The terminal portion 222 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The terminal portion 222 extends, for example, in the first direction x parallel to the terminal portion 212. The surface of the terminal portion 222 exposed from the resin member 5 may be plated (for example, tin plated). The portion of the terminal portion 222 exposed from the resin member 5 is conductively joined to a circuit board (not shown) or the like on which the electronic device A1 is mounted.

[0027] The third lead 23 is spaced apart from the first lead 21 and is located on the opposite side of the first lead 21 from the second lead 22 in the second direction y. The third lead 23 is electrically connected to the third electrode 113 of the electronic component 1A via the conductive member 4. The third lead 23 includes a pad portion 231 and a terminal portion 232.

[0028] The pad portion 231 is covered with a resin member 5. A conductive member 4 is bonded to the pad portion 231. The surface of the pad portion 231 to which the conductive member 4 is bonded may be silver-plated, tin-plated, or the like. The terminal portion 232 is connected to the pad portion 231. The terminal portion 232 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The terminal portion 232 extends, for example, in the first direction x parallel to the terminal portion 212. The surface of the terminal portion 232 exposed from the resin member 5 may be plated (for example, tin-plated). The portion of the terminal portion 232 exposed from the resin member 5 is conductively bonded to a circuit board (not shown) or the like on which the electronic device A1 is mounted.

[0029] The bonding material 3 bonds the electronic component 1A and the mounting portion 211 (first lead 21). In this embodiment, the bonding material 3 includes a conductive material, such as solder, a metal paste material, or a sintered metal.

[0030] As shown in FIG. 9 , the bonding material 3 includes a first bonding portion 31, a second bonding portion 32, and a fillet portion 30. The first bonding portion 31 is interposed between the first surface 210a and the back surface 10b. That is, the first bonding portion 31 is interposed between the base portion 2111 and the electronic component 1A. The second bonding portion 32 is interposed between the second surface 210b and the back surface 10b. That is, the second bonding portion 32 is interposed between the protrusion portion 2112 and the electronic component 1A. The fillet portion 30 protrudes from the electronic component 1A in a plan view. The fillet portion 30 covers a portion of each side surface of the electronic component 1A. Note that the bonding material 3 does not necessarily include the fillet portion 30.

[0031] 3, the plurality of conductive members 4 are conductively joined to the electronic component 1A and the second lead 22 and the third lead 23. This establishes mutual conduction between the electronic component 1A and the second lead 22 and the third lead 23. The plurality of conductive members 4 include a first member 41 and a second member 42.

[0032] 8 , the first member 41 is bonded to the second electrode 112 of the electronic component 1A and the pad portion 221 of the second lead 22, thereby establishing electrical continuity between them. The first member 41 contains copper. In this embodiment, the first member 41 is a metal clip. The first member 41 is electrically bonded to the second electrode 112 and the pad portion 221 via a conductive bonding material 49.

[0033] The second member 42 is bonded to the third electrode 113 of the electronic component 1A and the pad portion 231 of the third lead 23, thereby providing electrical continuity between them. The second member 42 is a metal wire and is formed by wire bonding. The second member 42 contains any of gold, aluminum, and copper.

[0034] 1 to 3 and 5 to 9, the resin member 5 covers the electronic component 1A, a portion of the first lead 21, a portion of the second lead 22, a portion of the third lead 23, the bonding material 3, and the plurality of conductive members 4. The resin member 5 has electrical insulation properties. The constituent material of the resin member 5 includes, for example, black epoxy resin. The resin member 5 has a resin main surface 51, a resin back surface 52, a pair of resin side surfaces 53, a pair of resin side surfaces 54, a pair of openings 55, and a mounting hole 56.

[0035] The resin main surface 51 and the resin back surface 52 are spaced apart from each other in the thickness direction z. The resin main surface 51 faces upward in the thickness direction z. That is, the resin main surface 51 faces the same side as the first surface 210a and the second surface 210b in the thickness direction z. The resin back surface 52 faces downward in the thickness direction z. That is, the resin back surface 52 faces the same side as the second surface 210b in the thickness direction z. The back surface 210d is exposed from the resin back surface 52. The resin back surface 52 and the back surface 210d are flush with each other.

[0036] The pair of resin side surfaces 53 are spaced apart from each other in the first direction x. The pair of resin side surfaces 53 are connected to the resin main surface 51 and the resin back surface 52. As shown in FIGS. 3 and 6 , the terminal portion 212 of the first lead 21, the terminal portion 222 of the second lead 22, and the terminal portion 232 of the third lead 23 protrude from one of the pair of resin side surfaces 53.

[0037] The pair of resin side surfaces 54 are spaced apart from each other in the second direction y. The pair of resin side surfaces 54 are connected to the resin main surface 51 and the resin back surface 52.

[0038] 5 , the pair of openings 55 are spaced apart from each other in the second direction y. Each of the pair of openings 55 is recessed inward into the resin member 5 from the resin main surface 51 and one of the pair of resin side surfaces 54. A portion of the upper surface of the mounting portion 211 of the first lead 21 is exposed from the pair of openings 55.

[0039] 2, 3, and 8, the mounting hole 56 penetrates the resin member 5 in the thickness direction z from the resin main surface 51 to the resin back surface 52. In a plan view, the mounting hole 56 is contained within the through hole 211A of the mounting portion 211. The inner circumferential surface of the mounting portion 211 that defines the through hole 211A is covered by the resin member 5. As a result, in a plan view, the maximum dimension of the mounting hole 56 is smaller than the dimension of the through hole 211A.

[0040] The electronic device A1 configured as above has the following functions and effects.

[0041] In the electronic device A1, the mounting portion 211 has a first surface 210a and a second surface 210b to which the electronic component 1A is bonded. The first surface 210a and the second surface 210b each face upward (the other side) in the thickness direction z. The first surface 210a overlaps at least a portion of the outer periphery 19 of the electronic component 1A as viewed in the thickness direction z. The second surface 210b is located above (the other side) the first surface 210a in the thickness direction z and overlaps the functional unit 11 as viewed in the thickness direction z. With this configuration, the second surface 210b reduces the distance between the mounting portion 211 and the electronic component 1A in the thickness direction z below (one side of) the functional unit 11, which is a heat source. This improves thermal conductivity from the electronic component 1A (functional unit 11) to the mounting portion 211. In other words, heat dissipation from the heat generated by the electronic component 1A can be improved. Furthermore, because the first surface 210a provides a large distance along the thickness direction z between the mounting portion 211 and the electronic component 1A in part of the outer periphery 19 of the electronic component 1A, it is possible to ensure an appropriate thickness for the bonding material 3 (first bonding portion 31) sandwiched between the mounting portion 211 and the electronic component 1A. In other words, the bonding strength of the electronic component 1A to the mounting portion 211 is appropriately ensured, thereby improving the mounting reliability of the electronic component 1A. Therefore, the electronic device A1 can improve the heat dissipation performance of the electronic component 1A (functional portion 11) against heat generated by the electronic component 1A while ensuring the mounting reliability of the electronic component 1A to the mounting portion 211.

[0042] In the electronic device A1, the first surface 210a overlaps the four corners of the electronic component 1A in the thickness direction z. This configuration ensures an appropriate thickness of the bonding material 3 at the four corners of the electronic component 1A in a planar view. Heat generation from the electronic component 1A causes thermal stress to be applied to the bonding material 3. If this thermal stress causes the electronic component 1A to peel from the mounting portion 211, the peeling is likely to occur at the outer periphery 19 (particularly the four corners) of the electronic component 1A. However, in the electronic device A1, the appropriate thickness of the bonding material 3 is ensured at the four corners of the electronic component 1A in a planar view, thereby suppressing peeling of the electronic component 1A from the mounting portion 211. Therefore, the electronic device A1 can improve the mounting reliability of the electronic component 1A on the mounting portion 211 compared to a case in which the first surface 210a does not overlap the four corners of the electronic component 1A in the thickness direction z. In particular, in the electronic device A1, the first surface 210a overlaps the entire outer periphery 19 of the electronic component 1A when viewed in the thickness direction z. This configuration ensures an appropriate thickness of the bonding material 3 along the outer periphery 19 of the electronic component 1A in a plan view. Therefore, the electronic device A1 can further improve the mounting reliability of the electronic component 1A on the mounting portion 211.

[0043] In the electronic device A1, the second surface 210b overlaps the entire functional unit 11 as viewed in the thickness direction z. With this configuration, the electronic device A1 can improve the heat dissipation performance of the electronic component 1A (functional unit 11) compared to a case where the second surface 210b overlaps only a portion of the functional unit 11 as viewed in the thickness direction z.

[0044] In the electronic device A1, the thickness of the electronic component 1A is 50 μm or more and 200 μm or less. Research by the present inventors has revealed that when the thickness of the electronic component 1A is within this range (50 μm or more and 200 μm or less), heat from the functional unit 11 is not dispersed as well inside the electronic component 1A (e.g., the semiconductor layer 110) compared to when the thickness is greater than this range. In other words, it has been discovered that when the thickness of the electronic component 1A is within the above-mentioned range, a thermal gradient can be created within the electronic component 1A. Therefore, in the electronic device A1, by reducing the distance along the thickness direction z between the electronic component 1A and the mounting portion 211 below the functional unit 11, which is a heat source, the electronic device A1 can adequately ensure heat dissipation for heat generated by the electronic component 1A (functional unit 11).

[0045] 10 shows an electronic device A2 according to a first modified example of the first embodiment. The electronic device A2 differs from the electronic device A1 in the following respects: the bonding material 3 of the electronic device A2 does not include the second bonding portion 32.

[0046] In the electronic device A2, the bonding material 3 does not include the second bonding portion 32, and the protruding portion 2112 contacts the main surface 10a. That is, the first electrode 111 contacts the protruding portion 2112 and is directly conductive thereto.

[0047] Like the electronic device A1, the electronic device A2 can improve heat dissipation while ensuring mounting reliability. Furthermore, in the electronic device A2, the electronic component 1A is in contact with the mounting portion 211. Therefore, the thermal conductivity from the electronic component 1A to the mounting portion 211 is higher in the electronic device A2 than in the electronic device A1. In other words, the electronic device A2 can improve heat dissipation more than the electronic device A1.

[0048] 11 shows an electronic device A3 according to a second modification of the first embodiment. The electronic device A3 differs from the electronic device A1 in the following respects: the shape of the protrusion 2112 of the electronic device A3 in a plan view is different from the shape of the protrusion 2112 of the electronic device A1 in a plan view.

[0049] 11 , the protrusion 2112 of the electronic device A3 has a shape in plan view where a strip-shaped portion extending in the first direction x intersects with a strip-shaped portion extending in the second direction y. In this case, the upper surface of the protrusion 2112, i.e., the second surface 210b, overlaps with a portion of the functional unit 11 in plan view. Furthermore, the upper surface of the base 2111, i.e., the first surface 210a, overlaps with a portion of the outer periphery 19 of the electronic component 1A in plan view, and overlaps with at least the four corners of the electronic component 1A.

[0050] Like the electronic device A1, the electronic device A3 can improve heat dissipation while ensuring mounting reliability. Furthermore, in the electronic device A3, the first surface 210a overlaps the four corners of the electronic component 1A in a plan view. Therefore, like the electronic device A1, the electronic device A3 can improve the mounting reliability of the electronic component 1A on the mounting portion 211 compared to a case where the first surface 210a does not overlap the four corners of the electronic component 1A in the thickness direction z.

[0051] 12 and 13 show an electronic device A4 according to a third modified example of the first embodiment. The electronic device A4 differs from the electronic device A1 in the following respects. First, the mounting portion 211 of the electronic device A4 includes a groove 2113 instead of the protrusion 2112. Second, the mounting portion 211 of the electronic device A4 further includes a third surface 210c.

[0052] The groove 2113 is recessed from the base 2111 in the thickness direction z. The thickness (dimension in the thickness direction z) of the groove 2113 is smaller than the thickness (dimension in the thickness direction z) of the base 2111. The lower surface of the base 2111 and the lower surface of the groove 2113 are flush with each other. As shown in FIG. 12 , the groove 2113 is formed in a rectangular ring shape in a plan view. In this modification, the base 2111 has a portion surrounding the groove 2113 and a portion surrounded by the groove 2113 in a plan view.

[0053] The mounting portion 211 has a first surface 210a, a second surface 210b, a third surface 210c, and a back surface 210d. As shown in FIG. 13 , the third surface 210c is located higher in the thickness direction z than the first surface 210a. In this modification, as shown in FIG. 13 , the third surface 210c is located at the same position as the second surface 210b in the thickness direction z. The first surface 210a is the upper surface of the groove 2113. The second surface 210b is the upper surface of a portion of the base 2111 that is surrounded by the groove 2113 in a plan view. The third surface 210c is the upper surface of a portion of the base 2111 that surrounds the groove 2113 in a plan view. The back surface 210d is the lower surface of the base 2111 and the lower surface of the groove 2113.

[0054] In the electronic device A4, similarly to the electronic device A1, the second surface 210b can reduce the distance in the thickness direction z between the mounting portion 211 and the electronic component 1A below the functional unit 11, which is a heat source. This improves thermal conductivity from the electronic component 1A (functional unit 11) to the mounting portion 211. Furthermore, the first surface 210a can increase the distance in the thickness direction z between the mounting portion 211 and the electronic component 1A in at least a portion of the outer periphery 19 of the electronic component 1A. In other words, similarly to the electronic device A1, the electronic device A4 can improve heat dissipation performance for heat generated by the electronic component 1A (functional unit 11) while ensuring the mounting reliability of the electronic component 1A relative to the mounting portion 211.

[0055] In the electronic device A4, the first surface 210a is the upper surface of a groove 2113 that is recessed downward in the thickness direction z from the base 2111. With this configuration, the step between the groove 2113 and the base 2111 located outside the groove 2113 prevents the bonding material 3 from spreading outward from the groove 2113. In other words, the electronic device A4 can prevent the thickness of the bonding material 3 from unintentionally becoming smaller at the outer periphery 19 of the electronic component 1A in a plan view.

[0056] 14 and 15 show an electronic device A5 according to a fourth modified example of the first embodiment. The electronic device A5 differs from the electronic device A4 in the following respect: the second surface 210b of the electronic device A5 is disposed in the groove 2113, not in the base 2111.

[0057] In this modification, the groove portion 2113 includes a deep portion and a shallow portion. The deep portion is recessed further from the base portion 2111 than the shallow portion. The shallow portion has a rectangular shape in a plan view, and the deep portion has a rectangular ring shape surrounding the shallow portion. The shallow portion overlaps the functional portion 11 in a plan view. In this modification, the first surface 210a is the upper surface of the deep portion, and the second surface 210b is the upper surface of the shallow portion.

[0058] 15, in this modification, the second surface 210b is located lower than the third surface 210c in the thickness direction z. With this configuration, a portion of the electronic component 1A is accommodated in the groove 2113.

[0059] Like the electronic device A4, the electronic device A5 can improve heat dissipation while ensuring mounting reliability. Also, like the electronic device A4, the electronic device A5 can suppress the bonding material 3 from spreading outward from the groove portion 2113. This prevents the thickness of the bonding material 3 of the electronic device A5 from unintentionally becoming smaller at the outer periphery 19 of the electronic component 1A in a plan view.

[0060] 16 shows an electronic device A6 according to a fifth modified example of the first embodiment. The electronic device A6 differs from the electronic device A4 in the following respects: the shape of the groove 2113 in the electronic device A6 when viewed from above is different from the shape of the groove 2113 in the electronic device A4 when viewed from above.

[0061] In the electronic device A6, the second surface 210b has a portion that extends from outside the electronic component 1A to the electronic component 1A in a plan view. This extending portion overlaps the functional unit 11 in a plan view. Furthermore, the first surface 210a overlaps the four corners of the electronic component 1A in a plan view.

[0062] In the electronic device A6, like the electronic device A4, at least a portion of the second surface 210b overlaps the functional unit 11 in a planar view. Therefore, like the electronic device A4, the electronic device A6 can improve heat dissipation. Furthermore, in the electronic device A6, the first surface 210a overlaps the four corners of the electronic component 1A in a planar view, thereby improving the mounting reliability of the electronic component 1A relative to the mounting unit 211. From the above, like the electronic device A4, the electronic device A6 can improve heat dissipation while ensuring mounting reliability. Note that, as can be seen from the example shown in the electronic device A6, in the electronic device of the present disclosure, if the second surface 210b overlaps at least a portion of the functional unit 11, heat dissipation of heat generated by the electronic component 1A (functional unit 11) is improved.

[0063] 17 to 21 show an electronic device B1 according to a second embodiment. The electronic device B1 differs from the electronic device A1 mainly in the following respects. First, the electronic device B1 includes an electronic component 1B instead of the electronic component 1A. Second, the electronic device B1 differs from the electronic device A1 in its package structure.

[0064] The electronic device B1 has a small outline package (SOP) type package structure and includes an electronic component 1B, a first lead 21, a plurality of leads 24, a bonding material 3, a plurality of conductive members 43, 44, 45, and a resin member 5.

[0065] The electronic component 1B has a functional unit 11 and a control unit 12. The functional unit 11 of the electronic component 1B is a power transistor, similar to the functional unit 11 of the electronic component 1A. For ease of understanding, a dot pattern is drawn on the functional unit 11 in FIG. 19 . The control unit 12 controls the functional unit 11 (power transistor). For example, the control unit 12 includes a gate drive circuit as one of its functional elements. In addition, the control unit 12 may include other circuits such as a protection circuit or an active clamp circuit. The gate drive circuit generates a drive signal that controls the drive of the functional unit 11 (the switching operation of the power transistor) based on a control signal input from outside.

[0066] 18 , 20 , and 21 , electronic component 1B has multiple electrodes 114, 115, and 121. Multiple electrodes 114 are arranged on main surface 10 a and are electrically connected to functional unit 11. Electrode 115 is arranged on back surface 10 b and is electrically connected to functional unit 11. Electrode 115 is electrically connected to mounting portion 211 via bonding material 3. Multiple electrodes 121 are arranged on main surface 10 a and are electrically connected to control unit 12.

[0067] As shown in FIG. 18 , each of the multiple leads 24 is spaced apart from the first lead 21. The multiple leads 24 are electrically connected to the electronic component 1B via multiple conductive members 43, 44, and 45. In the illustrated example, one of the multiple leads 24 is not connected to any of the multiple conductive members 43, 44, and 45 and is not electrically connected to the electronic component 1B. The multiple leads 24 are arranged around the first lead 21 (mounting portion 211). In the illustrated example, some of the leads 24 are arranged on one side of the first lead 21 in the first direction x and some are arranged on the other side of the first direction x. Of the multiple leads 24, those arranged on one side of the first lead 21 in the first direction x protrude from the resin side surface 53 on one side of the first direction x. Of the multiple leads 24, those arranged on the other side of the first lead 21 in the first direction x protrude from the resin side surface 53 on the other side of the first direction x. The leads 24 are spaced apart from one another in the second direction y on one side in the first direction x and on the other side in the second direction y.

[0068] Each of the multiple leads 24 includes a pad portion 241 and a terminal portion 242. The pad portion 241 is covered with a resin member 5. One of the multiple conductive members 43, 44, and 45 is connected to the pad portion 241. The terminal portion 242 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The terminal portion 242 extends outward from the pad portion 241 in the first direction x. The terminal portion 242 is bent in a gull-wing shape when viewed along the second direction y. The terminal portion 242 is used as an external terminal of the electronic device B1.

[0069] Each of the plurality of conductive members 43, 44, and 45 is, for example, a metal wire and is formed by wire bonding. The composition of each of the plurality of conductive members 43, 44, and 45 includes either gold, aluminum, or copper. Each of the plurality of conductive members 43 is bonded to one of the plurality of electrodes 114 and one of the plurality of pad portions 241. Each of the plurality of conductive members 44 is bonded to one of the plurality of electrodes 121 and one of the plurality of pad portions 241. Each of the plurality of conductive members 45 is bonded to the mounting portion 211 and one of the plurality of pad portions 241. Due to the plurality of conductive members 43, 44, and 45, the plurality of leads 24 includes one that is conductive to the electrode 114, one that is conductive to the electrode 115, and one that is conductive to the electrode 121.

[0070] The electronic device B1 according to the second embodiment has the same functions and effects as the electronic device A1, as follows. Specifically, the mounting portion 211 of the electronic device B1 has a first surface 210a and a second surface 210b to which the electronic component 1B is bonded. The first surface 210a and the second surface 210b each face the other side (upward) in the thickness direction z. The first surface 210a overlaps at least a portion of the outer periphery 19 of the electronic component 1B as viewed in the thickness direction z. The second surface 210b is located above the first surface 210a in the thickness direction z and overlaps the functional unit 11 as viewed in the thickness direction z. Therefore, in the electronic device B1, similar to the electronic device A1, the second surface 210b reduces the distance along the thickness direction z between the mounting portion 211 and the electronic component 1B below the functional unit 11, which is a heat source, thereby improving thermal conductivity from the electronic component 1B (functional unit 11) to the mounting portion 211. In other words, the heat dissipation performance of the electronic component 1B can be improved. Furthermore, similar to the electronic device A1, the first surface 210a reduces the distance along the thickness direction z between the mounting portion 211 and the electronic component 1B at a portion of the outer periphery 19 of the electronic component 1B, thereby ensuring an appropriate thickness for the bonding material 3 (first bonding portion 31) sandwiched between the mounting portion 211 and the electronic component 1B. In other words, the bonding strength of the electronic component 1B to the mounting portion 211 can be appropriately ensured, improving the mounting reliability of the electronic component 1B. Therefore, the electronic device B1 can improve the heat dissipation performance for heat generated by the electronic component 1B (functional portion 11) while ensuring the mounting reliability of the electronic component 1B on the mounting portion 211.

[0071] In addition, the electronic device B1 has a common configuration with the electronic devices A1 to A6, and thus has the same effects as the electronic devices A1 to A6.

[0072] In the electronic device B1 of the second embodiment, the second surface 210b is formed to have a shape similar to the outer shape of the functional unit 11 in a plan view, but in a different configuration, the second surface 210b may be formed to have a shape similar to the outer shape (outer periphery 19) of the electronic component 1B in a plan view. In this configuration, the second surface 210b, i.e., the protrusions 2112, are evenly arranged with respect to the electronic component 1B, thereby preventing the electronic component 1B from tilting.

[0073] In the electronic device B1 of the second embodiment described above, an example was shown in which the mounting portion 211 includes a base portion 2111 and a protrusion portion 2112, but instead of this configuration, the mounting portion 211 may be configured to include a base portion 2111 and a groove portion 2113, similar to the electronic devices A4 to A6 described above.

[0074] In the second embodiment, the electronic device B1 is not limited to an SOP-type package structure and may employ other package structures. For example, the electronic device B1 may have a terminal insertion-type package structure similar to the electronic device A1, or a leadless package structure. Examples of leadless package structures include BGA (Ball Grid Array), LGA (Land Grid Array), DFN (Dual Flatpack No-leaded), and QFN (Quad Flat No-leaded). In other words, the package structure of the electronic device disclosed herein is not limited in any way.

[0075] 22 to 28 show an electronic device C1 according to a third embodiment. The electronic device C1 differs from the electronic device A1 mainly in the following respects. First, the electronic device C1 includes multiple electronic components 1C and 1D instead of the electronic component 1A. Second, the electronic device C1 differs from the electronic device A1 in its package structure.

[0076] The electronic device C1 includes a plurality of electronic components 1C, 1D, a pair of support substrates 611, 612, a pair of mounting portions 621, 622, a pair of wiring substrates 631, 632, two input terminals 71, 72, an output terminal 73, a pair of signal terminals 741, 742, a pair of signal terminals 751, 752, a plurality of conductive members 46, 47, 48, and a resin member 5.

[0077] Each of the electronic components 1C and 1D has a configuration similar to that of the electronic component 1A described above. That is, each of the electronic components 1C and 1D includes a functional unit 11 in which a power transistor is formed. For ease of understanding, a dot pattern is depicted on each functional unit 11 of the electronic components 1C and 1D in FIG. 25 . Similarly to the electronic component 1A, each of the electronic components 1C and 1D has a main surface 10a, a back surface 10b, a first electrode 111, a second electrode 112, and a third electrode 113.

[0078] The multiple electronic components 1C are electrically connected in parallel. That is, the first electrodes 111 of the multiple electronic components 1C are electrically connected to each other, and the second electrodes 112 of the multiple electronic components 1C are electrically connected to each other. The multiple electronic components 1D are electrically connected in parallel. That is, the first electrodes 111 of the multiple electronic components 1D are electrically connected to each other, and the second electrodes 112 of the multiple electronic components 1D are electrically connected to each other.

[0079] The pair of support substrates 611, 612 support a plurality of electronic components 1C, 1D via a pair of mounting portions 621, 622. Each of the pair of support substrates 611, 612 is, for example, a DBC (Direct Bonded Copper) substrate.

[0080] The pair of mounting portions 621, 622 are bonded to the pair of support substrates 611, 612, respectively. The composition of each of the pair of mounting portions 621, 622 includes copper. A plurality of electronic components 1C are bonded to the mounting portion 621. The first electrodes 111 of the plurality of electronic components 1C are electrically connected to each other via the mounting portion 621. The plurality of electronic components 1D are bonded to the mounting portion 622. The first electrodes 111 of the plurality of electronic components 1D are electrically connected to each other via the mounting portion 622.

[0081] Each of the pair of mounting portions 621, 622 has a first surface 620a, a second surface 620b, and a back surface 620d. The first surface 620a, the second surface 620b, and the back surface 620d described below are common to the mounting portions 621, 622 unless otherwise specified.

[0082] In a plan view, the first surface 620a is disposed so as to surround the second surface 620b. The first surface 620a is, for example, flat and extends along the xy plane. As shown in FIG. 25 , in a plan view, the first surface 620a of the mounting portion 621 overlaps with the four corners of each electronic component 1C. In a plan view, the first surface 620a of the mounting portion 622 overlaps with the four corners of each electronic component 1D.

[0083] The second surface 620b is located higher in the thickness direction z than the first surface 620a. The second surface 620b is, for example, flat and extends along the xy plane. In plan view, the second surface 620b has a strip shape extending in the second direction y. As shown in FIG. 25 , in plan view, the second surface 620b of the mounting portion 621 is formed across multiple electronic components 1C and overlaps the functional units 11 of each electronic component 1C. In plan view, the second surface 620b of the mounting portion 622 is formed across multiple electronic components 1D and overlaps the functional units 11 of each electronic component 1D.

[0084] The back surface 620d faces downward in the thickness direction z. That is, the back surface 620d faces the opposite side to the first surface 620a and the second surface 620b in the thickness direction z. The back surface 620d is, for example, flat and extends along the xy plane. The back surface 620d of the mounting portion 621 is bonded to the support substrate 611, and the back surface 620d of the mounting portion 622 is bonded to the support substrate 612.

[0085] Each of the pair of mounting portions 621 and 622 includes a base portion 6201 and a protruding portion 6202. The base portion 6201 and the protruding portion 6202 described below are common to both the mounting portions 621 and 622.

[0086] In a plan view, the base 6201 surrounds the protruding portion 6202. The thickness (dimension in the thickness direction z) of the protruding portion 6202 is greater than the thickness (dimension in the thickness direction z) of the base 6201. The protruding portion 6202 protrudes upward in the thickness direction z beyond the base 6201. The first surface 620a described above is the upper surface of the base 6201. The second surface 620b described above is the upper surface of the protruding portion 6202. The back surface 620d described above is the lower surface of the base 6201 and the lower surface of the protruding portion 6202.

[0087] The pair of wiring boards 631, 632 are respectively bonded to the pair of mounting portions 621, 622. The pair of wiring boards 631, 632 are formed of DBC substrates, for example, similar to the support substrates 611, 612. The wiring board 631 transmits drive signals and detection signals for each electronic component 1C. The wiring board 632 transmits drive signals and detection signals for each electronic component 1D.

[0088] The two input terminals 71 and 72, the output terminal 73, and the multiple signal terminals 741, 742, 751, and 752 each include a portion covered by the resin member 5 and a portion exposed from the resin member 5. The input terminal 71 is electrically connected to the first electrodes 111 of the multiple electronic components 1C. The input terminal 72 is electrically connected to the second electrodes 112 of the multiple electronic components 1D. The output terminal 73 is electrically connected to the second electrodes 112 of the multiple electronic components 1C and the first electrodes 111 of the multiple electronic components 1D. The signal terminal 741 is electrically connected to the third electrodes 113 of the multiple electronic components 1C via the wiring board 631. The signal terminal 742 is electrically connected to the third electrodes 113 of the multiple electronic components 1D via the wiring board 632. The signal terminal 751 is electrically connected to the second electrodes 112 of the multiple electronic components 1C via the wiring board 631. The signal terminals 752 are electrically connected to the second electrodes 112 of the plurality of electronic components 1D via the wiring board 632 .

[0089] Each of the plurality of conductive members 46, 47 is, for example, a metal wire and is formed by wire bonding. Each of the plurality of conductive members 46, 47 contains gold, aluminum, or copper. Each of the plurality of conductive members 46 is bonded to one of the plurality of electronic components 1C, 1D and one of the pair of wiring boards 631, 632. The plurality of conductive members 46 includes one that electrically connects the third electrode 113 of electronic component 1C to the wiring board 631, one that electrically connects the second electrode 112 of electronic component 1C to the wiring board 631, one that electrically connects the third electrode 113 of electronic component 1D to the wiring board 632, and one that electrically connects the second electrode 112 of electronic component 1D to the wiring board 632. Each of the plurality of conductive members 47 is bonded to one of the pair of wiring boards 631, 632 and one of the plurality of signal terminals 741, 742, 751, 752. The plurality of conductive members 47 include one that connects the wiring board 631 and the signal terminal 741, one that connects the wiring board 631 and the signal terminal 751, one that connects the wiring board 632 and the signal terminal 742, and one that connects the wiring board 632 and the signal terminal 752.

[0090] Each of the plurality of conductive members 48 is, for example, a metal clip. The composition of each of the plurality of conductive members 48 includes, for example, copper. Each of the plurality of conductive members 48 is joined to one of the second electrodes 112 of the plurality of electronic components 1C and the mounting portion 622 via a conductive bonding material. Therefore, the second electrodes 112 of the plurality of electronic components 1C and the mounting portion 622 are electrically connected via the plurality of conductive members 48.

[0091] The electronic device C1 according to the third embodiment has the same functions and effects as the electronic devices A1 and B1, as follows. Specifically, the mounting portion 621 of the electronic device C1 has a first surface 620a and a second surface 620b to which the electronic components 1C are bonded. The first surface 620a and the second surface 620b each face the other side (upward) in the thickness direction z. The first surface 620a overlaps at least a portion of the outer periphery 19 of each electronic component 1C as viewed in the thickness direction z. The second surface 620b is located on the other side (upward) of the first surface 620a in the thickness direction z and overlaps the functional unit 11 as viewed in the thickness direction z. Therefore, in the electronic device C1, similar to the electronic devices A1 and B1, the second surface 620b reduces the distance along the thickness direction z between the mounting portion 621 and the electronic component 1B below the heat-generating functional unit 11, thereby improving thermal conductivity from each electronic component 1C (functional unit 11) to the mounting portion 621. In other words, the heat dissipation performance of each electronic component 1C can be improved. Furthermore, similar to the electronic devices A1 and B1, the first surface 620a reduces the distance along the thickness direction z between the mounting portion 621 and each electronic component 1C at a portion of the outer periphery 19 of each electronic component 1C. This allows the thickness of the bonding material 3 (first bonding portion 31) sandwiched between the mounting portion 621 and each electronic component 1C to be appropriately secured. In other words, the bonding strength of each electronic component 1C to the mounting portion 621 can be appropriately secured, improving the mounting reliability of each electronic component 1C. Therefore, the electronic device C1 can improve the heat dissipation performance for heat generated by each electronic component 1C (functional unit 11) while ensuring the mounting reliability of each electronic component 1C on the mounting portion 621. The same applies to the relationship between each electronic component 1D and the mounting portion 622. In other words, the electronic device C1 can improve the heat dissipation performance for heat generated by each electronic component 1D (functional unit 11) while ensuring the mounting reliability of each electronic component 1D on the mounting portion 622.

[0092] In addition, the electronic device C1 has a common configuration with the electronic devices A1 to A6 and B1, and thus has the same effects as the electronic devices A1 to A6 and B1.

[0093] In the third embodiment, an example was shown in which the protrusion 2112 was formed across multiple electronic components 1C, but unlike this example, one protrusion 2112 may be provided for each electronic component 1C. In this case, each protrusion 2112 is configured in the same manner as the protrusions 2112 of the electronic devices A1 to A3. This also applies to the protrusions 2112 for multiple electronic components 1D.

[0094] 29 shows an electronic device C2 according to a first modified example of the third embodiment. The electronic device C2 differs from the electronic device C1 in the following respects: each of the mounting portions 621 and 622 of the electronic device C2 includes a groove portion 6203 instead of a protrusion portion 6202.

[0095] In each mounting portion 621, 622, the groove portion 6203 is recessed from the base portion 6201 in the thickness direction z. The thickness (dimension in the thickness direction z) of the groove portion 6203 is smaller than the thickness (dimension in the thickness direction z) of the base portion 6201. The lower surface of the base portion 6201 and the lower surface of the groove portion 6203 are flush with each other. As shown in FIG. 29 , the groove portion 6203 is formed in a strip shape extending in the second direction y in a plan view. In this embodiment, as shown in FIG. 29 , in each mounting portion 621, 622, the groove portion 6203 has two portions spaced apart in the first direction x. One of the two portions spans a corner of the multiple electronic components 1C (1D) on one side in the first direction x, and the other of the two portions spans a corner of the multiple electronic components 1C (1D) on the other side in the first direction x.

[0096] In the electronic device C2, similar to the electronic devices A4 to A6, the second surface 620b reduces the distance in the thickness direction z between the mounting portion 621 and each electronic component 1C below the thickness direction z of the functional portion 11 of each electronic component 1C, which is a heat source. This improves thermal conductivity from each electronic component 1C (functional portion 11) to the mounting portion 621. Furthermore, the first surface 620a increases the distance in the thickness direction z between the mounting portion 621 and each electronic component 1C at least in a portion of the outer periphery 19 of each electronic component 1C. In other words, similar to the electronic devices A4 to A6, the electronic device C2 can improve heat dissipation performance for heat generated by each electronic component 1C (functional portion 11) while ensuring the mounting reliability of each electronic component 1C relative to the mounting portion 621. This also applies to the relationship between each electronic component 1C and the mounting portion 622 of the electronic device C2. That is, the electronic device C2 can improve the heat dissipation performance of the heat generated by each electronic component 1D (functional portion 11) while ensuring the mounting reliability of each electronic component 1D on the mounting portion 622.

[0097] In addition, the electronic device C2 has the same configuration as the electronic device C1 and thus exhibits the same effects as the electronic device C1.

[0098] The configurations of the various parts in the above-described embodiments and modifications can be combined with each other to the extent that no technical contradiction occurs.

[0099] The electronic device according to the present disclosure is not limited to the above-described embodiments. The specific configuration of each part of the electronic device according to the present disclosure can be freely designed in various ways. For example, the present disclosure includes the embodiments described in the following appendices. Appendix 1. An electronic device comprising: a first electronic component having a functional part; a mounting part on which the first electronic component is mounted; and a bonding material that bonds the first electronic component to the mounting part, wherein the mounting part has a back surface facing one side in a thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded, the second surface being located on the other side in the thickness direction than the first surface, the first surface overlapping at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction, and the second surface overlapping the functional part when viewed in the thickness direction. Appendix 2. The electronic device according to Supplementary Note 1, wherein the first electronic component is rectangular when viewed in the thickness direction, and the second surface does not overlap any of the four corners of the first electronic component. Supplementary Note 3. The electronic device according to Supplementary Note 1 or Supplementary Note 2, wherein the entire second surface overlaps the first electronic component when viewed in the thickness direction, and the first surface overlaps the entire outer periphery of the first electronic component when viewed in the thickness direction. Supplementary Note 4. The electronic device according to Supplementary Note 1 or Supplementary Note 2, further comprising a second electronic component located on the other side of the mounting portion in the thickness direction, and the second surface straddles the first electronic component and the second electronic component when viewed in the thickness direction. Supplementary Note 5. The electronic device according to any of Supplementary Notes 1 to 4, wherein the mounting portion includes a base and a protruding portion protruding from the base to the other side in the thickness direction, the base having the first surface, and the protruding portion having the second surface. Supplementary Note 6. The electronic device according to any one of Supplementary Notes 1 to 4, wherein the mounting portion includes a base and a groove recessed from the base to one side in the thickness direction, the groove having the first surface, and the base having a third surface higher than the first surface. Supplementary Note 7. The electronic device according to Supplementary Note 6, wherein the groove has the second surface. Supplementary Note 8. The electronic device according to Supplementary Note 7, wherein the second surface is located on one side of the third surface in the thickness direction, and the groove accommodates a portion of the first electronic component.Appendix 9. The electronic device according to any one of Appendix 1 to Appendix 8, wherein the functional unit is a power transistor. Appendix 10. The electronic device according to Appendix 9, wherein the first electronic component has a control unit that controls the power transistor. Appendix 11. The electronic device according to any one of Appendix 1 to Appendix 10, further comprising a resin member that covers the first electronic component, wherein the resin member covers a portion of the mounting portion. Appendix 12. The electronic device according to Appendix 11, wherein the back surface is exposed from the resin member. Appendix 13. The electronic device according to Appendix 11 or Appendix 12, further comprising a lead that is electrically connected to the first electronic component, wherein the lead includes a portion that is covered by the resin member and a portion that is exposed from the resin member. Appendix 14. The electronic device according to any one of Appendix 1 to Appendix 13, wherein the first electronic component and the mounting portion are electrically connected via the bonding material.

[0100] A1 to A6, B1, C1, C2: Electronic device 1A, 1B, 1C, 1D: Electronic component 3: Bonding material 4: Conductive member 5: Resin member 10a: Main surface 10b: Back surface 11: Functional portion 12: Control unit 19: Outer periphery 21: First lead 22: Second lead 23: Third lead 24: Lead 30: Fillet portion 31: First bonding portion 32: Second bonding portion 41: First member 42: Second member 43 to 48: Conductive member 49: Conductive bonding material 51: Resin main surface 52: Resin back surface 53, 54: Resin side surface 55: Opening 56: Mounting hole 71, 72: Input terminal 73: Output terminal 110: Semiconductor layer 111: First electrode 112: Second electrode 113: Third electrode 114, 115, 121: Electrodes 210a: First surface 210b: Second surface 210c: Third surface 210d: Back surface 211: Mounting portion 211A: Through hole 212: Terminal portion 221: Pad portion 222: Terminal portion 231: Pad portion 232: Terminal portion 241: Pad portion 242: Terminal portion 611, 612: Support substrate 620a: First surface 620b: Second surface 620d: Back surface 621, 622: Mounting portion 631, 632: Wiring substrate 741, 742, 751, 752: Signal terminals 2111: Base portion 2112: Protrusion portion 2113: Groove portion 6201: Base portion 6202: Protrusion portion 6203: Groove portion

Claims

1. a first electronic component having a functional unit; a mounting portion on which the first electronic component is mounted; a bonding material that bonds the first electronic component and the mounting portion; Equipped with the mounting portion has a back surface facing one side in a thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is joined; the second surface is located on the other side in the thickness direction than the first surface, the first surface overlaps at least a portion of an outer periphery of the first electronic component when viewed in the thickness direction; The second surface overlaps the functional section when viewed in the thickness direction.

2. the first electronic component has a rectangular shape when viewed in the thickness direction, The electronic device according to claim 1 , wherein the second surface does not overlap any of the four corners of the first electronic component.

3. When viewed in the thickness direction, the entire second surface overlaps the first electronic component, The electronic device according to claim 1 , wherein the first surface overlaps an entire outer periphery of the first electronic component when viewed in the thickness direction.

4. a second electronic component located on the other side of the mounting portion in the thickness direction, The electronic device according to claim 1 , wherein the second surface straddles the first electronic component and the second electronic component when viewed in the thickness direction.

5. the mounting portion includes a base portion and a protruding portion protruding from the base portion to the other side in the thickness direction, The base has the first surface, The electronic device according to claim 1 , wherein the protrusion has the second surface.

6. the mounting portion includes a base portion and a groove portion recessed from the base portion to one side in the thickness direction, The groove portion has the first surface, The electronic device according to claim 1 , wherein the base portion has a third surface that is higher than the first surface.

7. The electronic device of claim 6 , wherein the groove comprises the second surface.

8. the second surface is located on one side in the thickness direction relative to the third surface, The electronic device according to claim 7 , wherein the groove accommodates a portion of the first electronic component.

9. 5. The electronic device according to claim 1, wherein the functional unit is a power transistor.

10. The electronic device according to claim 9 , wherein the first electronic component has a control unit that controls the power transistor.

11. Further, a resin member that covers the first electronic component is provided. The electronic device according to claim 1 , wherein the resin member covers a part of the mounting portion.

12. The electronic device according to claim 11 , wherein the rear surface is exposed from the resin member.

13. Further comprising a lead electrically connected to the first electronic component, The electronic device according to claim 11 , wherein the leads include a portion covered with the resin member and a portion exposed from the resin member.

14. The electronic device according to claim 1 , wherein the first electronic component and the mounting portion are electrically connected to each other via the bonding material.