Machining system

Abstract

This machining system comprises: an irradiation optical system capable of irradiating an object with an energy beam for machining the object; a mounting device that allows the object to be mounted on a mounting surface; a first changing device capable of changing at least one of a positional relationship and a posture relationship between the object mounted on the mounting device and the irradiation optical system; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a second changing device capable of changing a positional relationship between the light receiving device and the irradiation optical system; and a control device. Under control of the control device, the position of the light receiving device is changed to a first position capable receiving the energy beam, from a second position different from the first position, by the second changing device.

Description

Processing System

[0001] The present invention relates to the technical field of processing systems that can process objects, for example.

[0002] Patent Literature 1 describes a processing system that processes an object by irradiating the object with laser light. This type of processing system is required to process the object appropriately.

[0003] US Patent Application Publication No. 2002 / 0017509

[0004] According to a first aspect, there is provided a processing system comprising an irradiation optical system capable of irradiating an object with an energy beam for processing the object, a mounting device capable of mounting the object on a mounting surface, a first change device capable of changing at least one of the positional relationship and attitude relationship between the object mounted on the mounting device and the irradiation optical system, a light receiving device capable of receiving the energy beam emitted from the irradiation optical system, a second change device capable of changing the positional relationship between the light receiving device and the irradiation optical system, and a control device, wherein under the control of the control device, the second change device changes the position of the light receiving device from a second position different from the first position to a first position where it can receive the energy beam.

[0005] According to a second aspect, there is provided a processing system comprising: an irradiation optical system capable of irradiating an object with a processing beam for processing the object and with a measurement beam for measuring the object, and including at least an objective optical system; a light receiving device capable of receiving the processing beam and the measurement beam emitted from the irradiation optical system; a position changing device capable of changing at least one of the irradiation position of the processing beam on the object and the irradiation position of the measurement beam on the object; and a control device, wherein the control device controls the position changing device based on the reception result of the processing beam by the light receiving device and the reception result of the measurement beam by the light receiving device.

[0006] According to a third aspect, there is provided a processing system comprising: a deflection optical system capable of deflecting an energy beam for processing or measuring an object and changing the irradiation position of the energy beam on the object; an irradiation optical system capable of irradiating the object with the energy beam emitted from the deflection optical system; a light-receiving device capable of receiving the energy beam emitted from the irradiation optical system; a position changing device capable of changing the irradiation position of the energy beam on the object by changing the position or attitude of the deflection optical system; and a control device that controls the position changing device based on a reception result of the energy beam by the light-receiving device, wherein the light-receiving device comprises a beam-passing member formed with a plurality of passing regions through which the energy beam emitted from the irradiation optical system can pass, and a light-receiving unit that can receive each of the energy beams that have passed through each of the plurality of passing regions, and the deflection optical system deflects the energy beam so that the energy beam scans the plurality of passing regions in a single direction along the surface of the beam-passing member, and the control device controls the position changing device based on a reception result of the energy beam by the light-receiving device.

[0007] According to a fourth aspect, there is provided a processing system including: an emission optical system capable of emitting an energy beam for processing or measuring an object, the emission optical system including a plurality of focusing position adjustment optical systems capable of adjusting the focusing position of the energy beam and having different focal lengths; a plurality of irradiation optical systems capable of irradiating the object with the energy beam emitted from the emission optical system, the irradiation optical systems being detachable from the emission optical system and including at least an objective optical system; an exchange device capable of exchanging the irradiation optical systems attached to the emission optical system; and a control device that identifies the type of the irradiation optical system attached to the emission optical system, selects one focusing position adjustment optical system from the plurality of focusing position adjustment optical systems based on the identified type, and moves the one focusing position adjustment optical system so that the selected one focusing position adjustment optical system is positioned in the optical path of the energy beam.

[0008] According to a fifth aspect, there is provided a processing system comprising an irradiation optical system capable of irradiating an object with an energy beam, a first change device capable of changing at least one of the positional relationship and attitude relationship between the object and the irradiation optical system, a light receiving device capable of receiving the energy beam emitted from the irradiation optical system, a second change device capable of changing the positional relationship between the light receiving device and the irradiation optical system, and a control device, wherein, under the control of the control device, the second change device changes the position of the light receiving device from a second position different from the first position to a first position where it can receive the energy beam.

[0009] According to a sixth aspect, there is provided a processing system comprising an irradiation optical system capable of irradiating an object with a first beam and irradiating the object with a second beam different from the first beam, a light receiving device capable of receiving the first beam and the second beam emitted from the irradiation optical system, a position changing device capable of changing at least one of the irradiation position of the first beam on the object and the irradiation position of the second beam on the object, and a control device, wherein the control device controls the position changing device based on the result of receiving the first beam by the light receiving device and the result of receiving the second beam by the light receiving device.

[0010] According to a seventh aspect, there is provided a processing system comprising: a deflection optical system capable of deflecting an energy beam to change the irradiation position of the energy beam on an object; an irradiation optical system capable of irradiating the object with the energy beam emitted from the deflection optical system; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a position changing device capable of changing the irradiation position of the energy beam on the object by changing the position or attitude of the deflection optical system; and a control device that controls the position changing device based on a result of reception of the energy beam by the light receiving device, wherein the light receiving device comprises a beam passing member having a plurality of passing areas formed therein through which the energy beam emitted from the irradiation optical system can pass, and a light receiving unit that can receive each of the energy beams that have passed through each of the plurality of passing areas, and the control device controls the position changing device based on a result of reception of the energy beam by the light receiving device.

[0011] According to an eighth aspect, there is provided a processing system including: an emission optical system capable of emitting an energy beam, the emission optical system including a plurality of focusing position adjustment optical systems capable of adjusting the focusing position of the energy beam and having different focal lengths; a plurality of irradiation optical systems capable of irradiating the object with the energy beam emitted from the emission optical system, the irradiation optical systems being detachable from the emission optical system and including at least an objective optical system; an exchange device capable of exchanging the irradiation optical systems attached to the emission optical system; and a control device that identifies the type of the irradiation optical system attached to the emission optical system, selects one focusing position adjustment optical system from the plurality of focusing position adjustment optical systems based on the identified type, and moves the one focusing position adjustment optical system so that the selected one focusing position adjustment optical system is positioned in the optical path of the energy beam.

[0012] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0013] FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a processing system according to a first embodiment. FIG. 2 is a block diagram showing an example of the configuration of the processing system according to the first embodiment. FIG. 3 is a cross-sectional view showing the configuration of a processing head according to the first embodiment. FIG. 4 is a perspective view showing a processing shot area. FIG. 5 is a perspective view showing a measurement shot area. FIG. 6 is a cross-sectional view showing an example of the configuration of a mounting adapter used to attach an irradiation optical system to an emission optical system. FIGS. 7(a) to 7(c) are cross-sectional views showing the process of attaching an irradiation optical system to an emission optical system. FIG. 8 is a cross-sectional view conceptually showing an example of the configuration of a head exchange device. FIGS. 9(a) to 9(g) are cross-sectional views showing an example of an irradiation optical system. FIG. 10 is a block diagram showing an example of the configuration of a processing system according to a second embodiment. FIG. 11(a) is a cross-sectional view showing a calibration position where an optical measurement device is located when a calibration operation is performed, and FIG. 11(b) is a cross-sectional view showing a non-calibration position where an optical measurement device is located when a calibration operation is not performed. FIG. 12 is a cross-sectional view showing the configuration of an optical measurement device. FIG. 13 is a plan view showing a search mark formed by a light passing region. FIG. 14 is a plan view showing a beam passing member on which multiple search marks are formed. FIG. 15 is a plan view showing a beam passing member on which multiple search marks are formed. FIG. 16 is a plan view showing multiple search marks onto which processing light is irradiated. FIG. 17 shows light reception information output by a light receiving element. FIG. 18 is a plan view showing a reference irradiation position of the processing light and an actual irradiation position of the processing light within a processing shot area. FIGS. 19(a) to 19(c) each show light reception information output by a light receiving element. FIG. 20 is a plan view showing a reference irradiation position of the measurement light and an actual irradiation position of the measurement light within a measurement shot area. FIG. 21 is a plan view showing the actual irradiation position of the processing light and the actual irradiation position of the measurement light within a processing shot area and a measurement shot area. FIGS. 22(a) to 22(c) each show light reception information output by a light receiving element. FIG. 23 is a cross-sectional view showing the configuration of a processing head in a third embodiment. Fig. 24 is a cross-sectional view showing the configuration of a machining head according to a fourth embodiment. Fig. 25 is a cross-sectional view showing the configuration of a machining head according to a fifth embodiment.FIG. 26 is a cross-sectional view showing the configuration of a machining head according to the fifth embodiment.

[0014] Hereinafter, an embodiment of a machining system will be described with reference to the drawings. In the following, an embodiment of a machining system will be described using a machining system SYS capable of machining a workpiece W, which is an example of an object. However, the present invention is not limited to the embodiment described below.

[0015] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For convenience of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0016] (1) Machining System SYS of First Embodiment First, the machining system SYS of the first embodiment will be described. In the following description, the machining system SYS of the first embodiment will be referred to as the "machining system SYSa."

[0017] (1-1) Overall Configuration of Machining System SYSa First, the configuration of the machining system SYSa in the first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view that schematically shows an example of the configuration of the machining system SYSa in the first embodiment. Figure 2 is a block diagram that shows an example of the configuration of the machining system SYSa in the first embodiment.

[0018] As shown in FIGS. 1 and 2 , the machining system SYSa includes a machining unit 1 and a control unit 2. The machining unit 1 may be referred to as a machining device, and the control unit 2 may be referred to as a control device. At least a portion of the machining unit 1 may be housed in an internal space SP of a housing 3. The internal space SP of the housing 3 may be purged with a purge gas (i.e., gas) such as nitrogen gas, or may not be purged with a purge gas. The internal space SP of the housing 3 may or may not be evacuated. However, the machining unit 1 does not have to be housed in the internal space SP of the housing 3. A local space surrounding only a portion of the machining unit 1 may be purged with a purge gas or may be evacuated.

[0019] The machining unit 1 is capable of machining a workpiece W, which is an object to be machined (which may also be referred to as a base material), under the control of the control unit 2. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin, a composite material such as CFRP (Carbon Fiber Reinforced Plastic), paint (for example, a paint layer applied to a base material), glass, or an object made of any other material.

[0020] The machining unit 1 irradiates the workpiece W with processing light EL to process the workpiece W. The processing light EL may be any type of light as long as it can process the workpiece W when irradiated thereon. In the first embodiment, the processing light EL is described using an example in which the processing light EL is laser light, but the processing light EL may be a type of light other than laser light. Furthermore, the wavelength of the processing light EL may be any wavelength as long as it can process the workpiece W when irradiated thereon. For example, the processing light EL may be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The processing light EL may include pulsed light. Alternatively, the processing light EL may not include pulsed light. In other words, the processing light EL may be continuous light. Note that, because light is an example of an energy beam, the processing light EL may also be referred to as a processing beam.

[0021] The processing unit 1 may perform additional processing on the workpiece W. That is, the processing unit 1 may perform additional processing to form a shaped object on the workpiece W. The processing unit 1 may perform subtractive processing on the workpiece W. That is, the processing unit 1 may perform subtractive processing to remove a portion of the workpiece W. The processing unit 1 may perform marking processing to form a desired mark on the surface of the workpiece W. The processing unit 1 may perform peening processing to change the surface characteristics of the workpiece W. The processing unit 1 may perform peeling processing to peel the surface of the workpiece W. The processing unit 1 may perform welding processing to join one workpiece W to another workpiece W. The processing unit 1 may perform cutting processing to cut the workpiece W. The processing unit 1 may perform flattening processing (in other words, remelt processing) to melt the surface of the workpiece W and solidify the melted surface to make the surface closer to a flat surface.

[0022] The machining unit 1 may machine the workpiece W to form a desired structure on the surface of the workpiece W. However, the machining unit 1 may perform a different machining operation from the machining operation for forming a desired structure on the surface of the workpiece W.

[0023] An example of a desired structure is a riblet structure. The riblet structure may include a structure that can reduce the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). For this reason, the riblet structure may be formed on a workpiece W having a component that is installed (in other words, located) in the fluid. Note that the term "fluid" here refers to a medium (e.g., at least one of gas and liquid) that flows relative to the surface of the workpiece W. For example, when the surface of the workpiece W moves relative to a medium while the medium itself is stationary, this medium may also be referred to as a fluid. Note that the state in which the medium is stationary may also refer to a state in which the medium is not moving relative to a predetermined reference object (e.g., the ground surface).

[0024] Examples of workpieces W on which riblet structures can be formed include at least one of an aircraft, a wind turbine, an engine turbine, and a power-generating turbine. When such riblet structures are formed on the workpiece W, the workpiece W becomes more easily movable relative to the fluid. This reduces the resistance that hinders the movement of the workpiece W relative to the fluid, leading to energy savings. In other words, it becomes possible to manufacture environmentally friendly workpieces W. For example, if the workpiece W is a component exposed on the surface of an aircraft (e.g., at least a part of the aircraft), the resistance that hinders the movement of the aircraft is reduced, leading to fuel savings for the aircraft. For example, if the workpiece W is a wind turbine (e.g., at least a part of the wind turbine), the resistance that hinders the movement (typically, rotation) of the wind turbine is reduced, leading to higher efficiency of the wind turbine. For example, if the workpiece W is an engine turbine (e.g., at least a part of the engine turbine), the resistance that hinders the movement (typically, rotation) of the engine turbine is reduced, leading to higher efficiency and energy savings for the engine turbine. For example, if the workpiece W is a power generation turbine (for example, at least a part of the power generation turbine), the resistance that hinders the movement (typically, rotation) of the power generation turbine is reduced, which leads to higher efficiency of the power generation turbine (i.e., improved power generation efficiency). Therefore, the processing unit 1 may be able to contribute to "13.2.2 Reduce total greenhouse gas emissions per year" which is one of the targets set out in Goal 13 of the Sustainable Development Goals (SDGs) led by the United Nations, "Take urgent action to combat climate change and its impact."

[0025] The processing unit 1 is further capable of measuring the measurement object M under the control of the control unit 2. In order to measure the measurement object M, the processing unit 1 irradiates the measurement object M with measurement light ML for measuring the measurement object M. Specifically, the processing unit 1 measures the measurement object M by irradiating the measurement light ML onto the measurement object M and detecting (i.e., receiving) at least a portion of return light RL returning from the measurement object M irradiated with the measurement light ML. The light returning from the measurement object M irradiated with the measurement light ML is light from the measurement object M generated by the irradiation of the measurement light ML.

[0026] The measurement light ML may be any type of light as long as it can measure the measurement object M by irradiating it onto the measurement object M. In the first embodiment, the description will be given using an example in which the measurement light ML is laser light. However, the measurement light ML may be a type of light other than laser light. Furthermore, the wavelength of the measurement light ML may be any wavelength as long as it can measure the measurement object M by irradiating it onto the measurement object M. For example, the measurement light ML may be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The measurement light ML may include pulsed light (e.g., pulsed light having an emission time of picoseconds or less). Alternatively, the measurement light ML may not include pulsed light. In other words, the measurement light ML may be continuous light. Note that light is an example of an energy beam, and therefore the measurement light ML may be referred to as a measurement beam.

[0027] The machining unit 1 may be capable of using the measurement light ML to measure the characteristics of the measurement object M. The characteristics of the measurement object M may include, for example, at least one of the position of the measurement object M, the shape of the measurement object M, the reflectance of the measurement object M, the transmittance of the measurement object M, the temperature of the measurement object M, and the surface roughness of the measurement object M.

[0028] In the following description, an example will be described in which the machining unit 1 measures at least the position of the measurement object M. The position of the measurement object M may include the position of the surface of the measurement object M. The position of the surface of the measurement object M may include the position of at least a portion of the surface of the measurement object M. Furthermore, the position of the measurement object M may mean the position of the measurement object M with respect to the machining head 13 (i.e., the relative position). In other words, the position of the measurement object M may mean the position of the measurement object M in a measurement coordinate system based on the machining head 13. Furthermore, as will be described later, the operation of measuring the position of the measurement object M may include the operation of measuring the shape of the measurement object M. This is because the shape of the measurement object M can be calculated from the position of the measurement object M.

[0029] The measurement object M may include, for example, a workpiece W to be machined by the machining unit 1. The measurement object M may include, for example, any object placed on a stage 15, which will be described later. The measurement object M may include, for example, the stage 15. The measurement object M may include, for example, an optical measurement device 18b used in a calibration operation, which will be described later in the second embodiment.

[0030] In order to process the workpiece W and measure the measurement object M, the processing unit 1 is equipped with a processing light source 11, a measurement light source 12, a processing head 13, a head drive system 141, a position measurement device 142, a stage 15, a stage drive system 161, a position measurement device 162, and a head exchange device 17.

[0031] The processing light source 11 generates the processing light EL. When the processing light EL is a laser beam, the processing light source 11 may include, for example, a laser diode. Furthermore, the processing light source 11 may be a light source capable of pulse oscillation. In this case, the processing light source 11 can generate pulsed light as the processing light EL. Note that the processing light source 11 may also be a CW (continuous wave) light source that generates a CW beam.

[0032] The measurement light source 12 generates the measurement light ML. When the measurement light ML is a laser beam, the measurement light source 12 may include, for example, a laser diode. Furthermore, the measurement light source 12 may be a light source capable of pulse oscillation. In this case, the measurement light source 12 can generate pulsed light as the processing light EL. Note that the measurement light source 12 may also be a CW (continuous wave) light source that generates a CW.

[0033] The machining head 13 irradiates the workpiece W with the machining light EL generated by the machining light source 11 and the measurement object M with the measurement light ML generated by the measurement light source 12. In order to irradiate the workpiece W with the machining light EL and the measurement object M with the measurement light ML, the machining head 13 includes a machining optical system 131, a measurement optical system 132, a synthesis optical system 133, a deflection optical system 134, and an irradiation optical system 135. The machining head 13 irradiates the workpiece W with the machining light EL via the machining optical system 131, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135. The machining head 13 also irradiates the measurement light ML onto the measurement object M via the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135. The configuration of the machining head 13 will be described in detail later with reference to FIG. 3.

[0034] The head drive system 141 moves the machining head 13. That is, the head drive system 141 changes the position of the machining head 13. For this reason, the head drive system 141 may be referred to as a moving device. The head drive system 141 may, for example, move (i.e., linearly move) the machining head 13 along a movement axis along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The head drive system 141 may, for example, move the machining head 13 along at least one of the θX direction, the θY direction, and the θZ direction in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. That is, the head drive system 141 may rotate (i.e., rotationally move) the machining head 13 around at least one of the rotation axis along the X-axis direction (i.e., the A-axis), the rotation axis along the Y-axis direction (i.e., the B-axis), and the rotation axis along the Z-axis direction (i.e., the C-axis).

[0035] When the head drive system 141 moves the machining head 13, the relative positional relationship between the machining head 13 and the stage 15 (and further, the workpiece W placed on the stage 15) changes. As a result, the relative positional relationship between the machining shot area PSA (see FIG. 4 described later) where the machining head 13 performs machining and the workpiece W changes. In other words, the machining shot area PSA moves with respect to the workpiece W. The machining unit 1 may machine the workpiece W while moving the machining head 13. Specifically, the machining unit 1 may set the machining shot area PSA at a desired position on the workpiece W by moving the machining head 13, and machine the desired position on the workpiece W.

[0036] Furthermore, when the head drive system 141 moves the processing head 13, the relative positional relationship between the measurement shot area MSA (see FIG. 5 described later) where the processing head 13 performs measurement and the measurement object M changes. In other words, the measurement shot area MSA moves with respect to the measurement object M. The processing unit 1 may measure the measurement object M while moving the processing head 13. Specifically, the processing unit 1 may set the measurement shot area MSA at a desired position on the measurement object M by moving the processing head 13, and measure the desired position of the measurement object M.

[0037] Furthermore, when the head drive system 141 moves the machining head 13, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135 provided in the machining head 13) and the workpiece W placed on the stage 15 changes. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may change. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may change. Note that the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may be considered to be the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. Therefore, the head drive system 141 may be considered to function as a change device that can change at least one of the positional relationship and attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W.

[0038] The position measurement device 142 is capable of measuring the position of the machining head 13. The position measurement device 142 may include, for example, an interferometer (e.g., a laser interferometer). The position measurement device 142 may include, for example, an encoder (for example, at least one of a linear encoder and a rotary encoder). The position measurement device 142 may include, for example, a potentiometer. When the head drive system 141 uses a stepping motor as a drive source, the position measurement device 142 may include, for example, an open-loop control position detection device. The open-loop control position detection device is a position detection device that measures the position of the machining head 13 by estimating the amount of movement of the machining head 13 from the integrated value of the number of pulses used to drive the stepping motor.

[0039] Since the machining head 13 is equipped with the irradiation optical system 135, the operation of measuring the position of the machining head 13 may be considered equivalent to the operation of measuring the position of the irradiation optical system 135 equipped in the machining head 13. In other words, the position measurement device 142 may be considered to measure the position of the irradiation optical system 135 equipped in the machining head 13.

[0040] The workpiece W is placed on the stage 15. For this reason, the stage 15 may be referred to as a placement device. Specifically, the workpiece W is placed on a placement surface 151, which is at least a portion of the upper surface of the stage 15. The stage 15 is capable of supporting the workpiece W placed on the stage 15. The stage 15 may also be capable of holding the workpiece W placed on the stage 15. In this case, the stage 15 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, a jig for holding the workpiece W may hold the workpiece W, and the stage 15 may hold the jig that holds the workpiece W. Alternatively, the stage 15 may not hold the workpiece W placed on the stage 15. In this case, the workpiece W may be placed on the stage 15 in a clampless manner.

[0041] The stage drive system 161 moves the stage 15. That is, the stage drive system 161 changes the position of the stage 15. For this reason, the stage drive system 161 may be referred to as a movement device. The stage drive system 161 may, for example, move the stage 15 (i.e., move linearly) along a movement axis along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The stage drive system 161 may, for example, move the stage 15 along at least one of the θX direction, the θY direction, and the θZ direction in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. That is, the stage drive system 161 may rotate (i.e., rotationally move) the stage 15 around at least one of the rotation axis along the X-axis direction (i.e., the A-axis), the rotation axis along the Y-axis direction (i.e., the B-axis), and the rotation axis along the Z-axis direction (i.e., the C-axis).

[0042] When the stage drive system 161 moves the stage 15, the relative positional relationship between the machining head 13 and the stage 15 (and further, the workpiece W placed on the stage 15) changes. As a result, the relative positional relationship between the workpiece W and a processing shot area PSA (see FIG. 4 described later) where the machining head 13 performs processing changes. In other words, the processing shot area PSA moves relative to the workpiece W. The machining unit 1 may process the workpiece W while moving the stage 15. Specifically, the machining unit 1 may set the processing shot area PSA at a desired position on the workpiece W by moving the stage 15, and process the desired position on the workpiece W.

[0043] Furthermore, when the stage drive system 161 moves the stage 15, the relative positional relationship between the measurement shot area MSA (see FIG. 5 described later) where the processing head 13 performs measurement and the measurement object M changes. In other words, the measurement shot area MSA moves with respect to the measurement object M. The processing unit 1 may measure the measurement object M while moving the stage 15. Specifically, the processing unit 1 may set the measurement shot area MSA at a desired position on the measurement object M by moving the stage 15, and measure the desired position of the measurement object M.

[0044] Furthermore, when the stage drive system 161 moves the stage 15, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135 provided in the machining head 13) and the workpiece W placed on the stage 15 changes. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may change. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may change. As described above, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may be considered to be the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. Therefore, the stage drive system 161 may be considered to function as a change device that can change at least one of the positional relationship and attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W.

[0045] The position measurement device 162 can measure the position of the stage 15. The position measurement device 162 may include, for example, an interferometer (e.g., a laser interferometer). The position measurement device 162 may include, for example, an encoder (for example, at least one of a linear encoder and a rotary encoder). The position measurement device 162 may include, for example, a potentiometer. When the stage drive system 161 uses a stepping motor as a drive source, the position measurement device 162 may include, for example, an open-loop control position detection device. The open-loop control position detection device is a position detection device that measures the position of the stage 15 by estimating the amount of movement of the stage 15 from the integrated value of the number of pulses used to drive the stepping motor.

[0046] The head exchanging device 17 is a device that can exchange the irradiation optical system 135 included in the processing head 13. For example, the head exchanging device 17 may remove the irradiation optical system 135 attached to the processing head 13. For example, the head exchanging device 17 may attach the irradiation optical system 135 to a processing head 13 to which the irradiation optical system 135 is not attached. As an example, the head exchanging device 17 may remove the first irradiation optical system 135 attached to the processing head 13 and then attach a second irradiation optical system 135 different from the first irradiation optical system 135 to the processing head 13. In other words, the head exchanging device 17 may exchange the first irradiation optical system 135 attached to the processing head 13 for the second irradiation optical system 135. For this reason, the irradiation optical system 135 may be detachable from the processing head 13. The configuration of the irradiation optical system 135 detachable from the processing head 13 and the configuration of the head exchanging device 17 will be described in detail later with reference to Figures 6 to 9.

[0047] The control unit 2 controls the operation of the machining unit 1. For example, the control unit 2 may control the operation of the machining head 13 provided in the machining unit 1. For example, the control unit 2 may control the operation of at least one of the machining optical system 131, the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135 provided in the machining head 13. For example, the control unit 2 may control the operation of the head drive system 141 provided in the machining unit 1 (e.g., the movement of the machining head 13). For example, the control unit 2 may control the operation of the stage drive system 161 provided in the machining unit 1 (e.g., the movement of the stage 15). For example, the control unit 2 may control the operation of the head exchange device 17 provided in the machining unit 1.

[0048] The control unit 2 may control the operation of the machining unit 1 based on the measurement results of the measurement object M by the machining unit 1. Specifically, the control unit 2 may generate measurement data of the measurement object M (e.g., data related to at least one of the position and shape of the measurement object M) based on the measurement results of the measurement object M, and control the operation of the machining unit 1 based on the generated measurement data. For example, the control unit 2 may generate measurement data of at least a portion of the workpiece W based on the measurement results of the workpiece W, which is an example of the measurement object M (e.g., calculate at least one of the position and shape of at least a portion of the workpiece W), and control the operation of the machining unit 1 to machine the workpiece W based on the measurement data.

[0049] The control unit 2 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control unit 2 functions as a device that controls the operation of the machining unit 1 by the arithmetic device executing a computer program. This computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be performed by the control unit 2, which will be described later. In other words, this computer program is a computer program for causing the control unit 2 to function so as to cause the machining unit 1 to perform the operations to be described later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control unit 2, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control unit 2. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control unit 2 via a network interface.

[0050] The control unit 2 does not have to be provided inside the machining unit 1. For example, the control unit 2 may be provided outside the machining unit 1 as a server or the like. In this case, the control unit 2 and the machining unit 1 may be connected via a wired and / or wireless network (or a data bus and / or communication line). As the wired network, for example, a network using a serial bus interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network compliant with IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control unit 2 and the machining unit 1 may be configured to be able to send and receive various information via the network. The control unit 2 may also be able to send information such as commands and control parameters to the machining unit 1 via the network. The machining unit 1 may include a receiving device that receives information such as commands and control parameters from the control unit 2 via the network. The machining unit 1 may also include a transmitting device (i.e., an output device that outputs information to the control unit 2) that transmits information such as commands and control parameters to the control unit 2 via the network. Alternatively, a first control device that performs part of the processing performed by the control unit 2 may be provided inside the machining unit 1, while a second control device that performs another part of the processing performed by the control unit 2 may be provided outside the machining unit 1.

[0051] A computational model that can be constructed by machine learning may be implemented in the control unit 2 by the computation device executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control unit 2 may control the operation of the machining unit 1 using the computational model. That is, the operation of controlling the operation of the machining unit 1 may include the operation of controlling the operation of the machining unit 1 using the computational model. Note that a computational model that has been constructed by offline machine learning using teacher data may be implemented in the control unit 2. Furthermore, the computational model implemented in the control unit 2 may be updated by online machine learning on the control unit 2. Alternatively, the control unit 2 may control the operation of the machining unit 1 using a computational model implemented in a device external to the control unit 2 (i.e., a device provided outside the machining unit 1) in addition to or instead of the computational model implemented in the control unit 2.

[0052] The recording medium for recording the computer program executed by the control unit 2 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, an optical disk such as a DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, or Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, or any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control unit 2 when the control unit 2 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) provided in the control unit 2, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0053] (1-2) Configuration of the Processing Head 13 Next, an example of the configuration of the processing head 13 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view showing an example of the configuration of the processing head 13.

[0054] 3 , the processing light EL generated by the processing light source 11 is incident on the processing head 13 via an optical transmission member 111 such as an optical fiber. The processing light source 11 may be disposed outside the processing head 13. Alternatively, the processing light source 11 may be disposed inside the processing head 13.

[0055] As described above, the processing head 13 includes the processing optical system 131 , the measurement optical system 132 , the synthesis optical system 133 , the deflection optical system 134 , and the irradiation optical system 135 .

[0056] The processing optical system 131 is an optical system into which the processing light EL from the processing light source 11 is incident. The processing optical system 131 is an optical system that emits the processing light EL incident on the processing optical system 131 toward the combining optical system 133. The processing light EL emitted by the processing optical system 131 is irradiated onto the workpiece W via the combining optical system 133, the deflection optical system 134, and the irradiation optical system 135.

[0057] The processing optical system 131 may include, for example, a position adjustment optical system 1311, an angle adjustment optical system 1312, and a galvanometer mirror 1313. However, the processing optical system 131 does not have to include at least one of the position adjustment optical system 1311, the angle adjustment optical system 1312, and the galvanometer mirror 1313.

[0058] The position adjustment optical system 1311 can adjust the emission position of the processing light EL from the processing optical system 131. The position adjustment optical system 1311 may include, for example, a parallel plane plate that can be tilted with respect to the traveling direction of the processing light EL, and the emission position of the processing light EL may be changed by changing the tilt angle of the parallel plane plate.

[0059] The angle adjustment optical system 1312 can adjust the emission angle (i.e., emission direction) of the processing light EL from the processing optical system 131. The angle adjustment optical system 1312 may include, for example, a mirror that can be tilted with respect to the traveling direction of the processing light EL, and the emission angle of the processing light EL may be changed by changing the tilt angle of this mirror.

[0060] The galvanometer mirror 1313 deflects the processing light EL (i.e., changes the emission angle of the processing light EL). By deflecting the processing light EL, the galvanometer mirror 1313 changes the focusing position of the processing light EL in a plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane). Typically, as shown in FIG. 3 , the processing head 13 irradiates the workpiece W with the processing light EL in a state where the optical axis EX intersects with the surface of the workpiece W. Therefore, when the focusing position of the processing light EL in a plane intersecting the optical axis EX is changed, the irradiation position PA of the processing light EL on the surface of the workpiece W is changed (i.e., moved) in a direction along the surface of the workpiece W. In other words, the irradiation position PA of the processing light EL is changed along at least one of the X-axis direction and the Y-axis direction. Because the galvanometer mirror 1341 can change the irradiation position PA of the processing light EL in this way, it may also be referred to as a position changing optical system or a position changing device.

[0061] The galvanometer mirror 1313 includes an X-scanning mirror 1313X and a Y-scanning mirror 1313Y. Each of the X-scanning mirror 1313X and the Y-scanning mirror 1313Y is a tilt-angle variable mirror whose angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1313 is changeable. The X-scanning mirror 1313X deflects the processing light EL so as to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction. In this case, the X-scanning mirror 1313X may be rotatable or swingable about the Y-axis. In other words, the galvanometer mirror 1313 may be able to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction by changing the position of the X-scanning mirror 1313X in the θY direction (or its orientation about the Y-axis). The Y-scanning mirror 1313Y deflects the processing light EL so as to change the irradiation position PA of the processing light EL on the workpiece W along the Y-axis direction. In this case, the Y scanning mirror 1313Y may be rotatable or swingable around the X axis. In other words, the galvanometer mirror 1313 may be able to change the irradiation position PA of the processing light EL on the workpiece W along the Y axis direction by changing the position of the Y scanning mirror 1313Y in the θX direction (or the orientation about the X axis).

[0062] The processing light EL emitted from the processing optical system 131 (in this case, the processing light EL emitted from the galvanometer mirror 1313) enters the combining optical system 133. The combining optical system 133 includes a beam splitter (e.g., a polarizing beam splitter) 1331. The beam splitter 1331 emits the processing light EL incident on the beam splitter 1331 toward the deflection optical system 134. In the example shown in FIG. 3 , the processing light EL incident on the beam splitter 1331 passes through the polarization splitting surface of the beam splitter 1331 and is emitted toward the deflection optical system 134. Therefore, in the example shown in FIG. 3 , the processing light EL enters the polarization splitting surface of the beam splitter 1331 in a state having a polarization direction that can pass through the polarization splitting surface (e.g., a polarization direction that becomes p-polarized with respect to the polarization splitting surface).

[0063] The processing light EL emitted from the combining optical system 133 is incident on the deflection optical system 134. The deflection optical system 134 emits the processing light EL incident on the deflection optical system 134 toward the irradiation optical system 135.

[0064] The deflection optical system 134 includes a galvanometer mirror 1341. The processing light EL incident on the deflection optical system 134 is incident on the galvanometer mirror 1341. The galvanometer mirror 1341 deflects the processing light EL (i.e., changes the emission angle of the processing light EL). By deflecting the processing light EL, the galvanometer mirror 1341 changes the focusing position of the processing light EL in a plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane). Typically, as shown in FIG. 3 , the machining head 13 irradiates the workpiece W with the processing light EL in a state where the optical axis EX intersects with the surface of the workpiece W. Therefore, when the focusing position of the processing light EL in the plane intersecting the optical axis EX is changed, the irradiation position PA of the processing light EL on the surface of the workpiece W is changed (i.e., moved) in a direction along the surface of the workpiece W. In other words, the irradiation position PA of the processing light EL is changed along at least one of the X-axis direction and the Y-axis direction. In this way, the galvanometer mirror 1341 may be called a position changing device because it can change the irradiation position PA of the processing light EL.

[0065] The galvanometer mirror 1341 includes an X-scanning mirror 1341X and a Y-scanning mirror 1341Y. Each of the X-scanning mirror 1341X and the Y-scanning mirror 1341Y is a tilt-angle variable mirror whose angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1341 is changeable. The X-scanning mirror 1341X deflects the processing light EL so as to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction. In this case, the X-scanning mirror 1341X may be rotatable or swingable about the Y-axis. In other words, the galvanometer mirror 1341 may be able to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction by changing the position of the X-scanning mirror 1341X in the θY direction (or its orientation about the Y-axis). The Y-scanning mirror 1341Y deflects the processing light EL so as to change the irradiation position PA of the processing light EL on the workpiece W along the Y-axis direction. In this case, the Y scanning mirror 1341Y may be rotatable or swingable around the X axis. In other words, the galvanometer mirror 1341 may be able to change the irradiation position PA of the processing light EL on the workpiece W along the Y axis direction by changing the position of the Y scanning mirror 1341Y in the θX direction (or the orientation about the X axis).

[0066] At least one of the galvanometer mirrors 1341 and 1313 allows the processing light EL to scan a processing shot area PSA defined with reference to the processing head 13. In other words, at least one of the galvanometer mirrors 1341 and 1313 allows the irradiation position PA to move within the processing shot area PSA defined with reference to the processing head 13. An example of the processing shot area PSA is shown in FIG. 4. As shown in FIG. 4, the processing shot area PSA indicates an area (in other words, a range) where processing is performed by the processing head 13 while the positional relationship between the processing head 13 and the workpiece W is fixed (i.e., without change). Typically, the processing shot area PSA is set to coincide with or be narrower than the scanning range of the processing light EL deflected by at least one of the galvanometer mirrors 1341 and 1313 while the positional relationship between the processing head 13 and the workpiece W is fixed. Furthermore, by moving the processing head 13 by the head drive system 141 and / or by moving the stage 15 by the stage drive system 161, the processing shot area PSA (irradiation position PA) can be relatively moved on the surface of the workpiece W. The scanning range of the processing light EL described above may be the maximum range of the range scanned by the processing light EL.

[0067] 3 , the processing light EL emitted from the deflection optical system 134 is incident on the irradiation optical system 135. As described above, when at least one of the galvanometer mirror 1341 provided in the deflection optical system 134 and the galvanometer mirror 1313 provided in the processing optical system 131 deflects the processing light EL, the incident position of the processing light EL on the irradiation optical system 135 changes. Therefore, each of the galvanometer mirrors 1341 and 1313 may be considered to function as a position changing device that can change the incident position of the processing light EL on the irradiation optical system 135 by deflecting the processing light EL.

[0068] The incident position of the processing light EL into the irradiation optical system 135, which changes depending on the deflection of the processing light EL by at least one of the galvanometer mirror 1341 of the deflection optical system 134 and the galvanometer mirror 1313 of the processing optical system 131, may be the incident position of the processing light EL incident on the optical member closest to the deflection optical system 134 (the most incident side) among the optical members constituting the irradiation optical system 135. Furthermore, the incident angle of the processing light EL incident on the irradiation optical system 135 (typically, the incident angle with respect to the optical axis EX of the irradiation optical system 135) may change depending on the deflection of the processing light EL by at least one of the galvanometer mirror 1341 of the deflection optical system 134 and the galvanometer mirror 1313 of the processing optical system 131.

[0069] The irradiation optical system 135 is an optical system capable of irradiating the workpiece W with the processing light EL. In order to irradiate the workpiece W with the processing light EL, the irradiation optical system 135 is equipped with an fθ lens 1351 that can function as an objective optical system. The processing light EL emitted from the deflection optical system 134 is incident on the fθ lens 1351. The fθ lens 1351 irradiates the processing light EL emitted from the deflection optical system 134 onto the workpiece W. Specifically, the fθ lens 1351 emits the processing light EL in a direction along the optical axis EX of the irradiation optical system 135. As a result, the processing light EL emitted by the fθ lens 1351 travels in a direction along the optical axis EX to be incident on the workpiece W. Note that the optical axis EX of the irradiation optical system 135 may be the optical axis of the fθ lens 1351.

[0070] The fθ lens 1351 may focus the processing light EL from the galvanometer mirror 1341 onto the workpiece W. In this case, the processing light EL emitted from the fθ lens 1351 may be irradiated onto the workpiece W without passing through another optical element (in other words, an optical member such as a lens) having power. In this case, the fθ lens 1351 may be referred to as the final optical element because it is the optical element having the final stage of power (i.e., the optical element closest to the workpiece W) among multiple optical elements arranged on the optical path of the processing light EL. The power of the optical element may be the reciprocal of the focal length of the optical element. In this case, the processing light EL from the galvanometer mirror 1341 may be a parallel beam. The irradiation optical system 135 may include an objective optical system having projection characteristics different from fθ.

[0071] At least one of the X scanning mirror 1341X and Y scanning mirror 1341Y constituting the galvanometer mirror 1341 and the X scanning mirror 1313X and Y scanning mirror 1313Y constituting the galvanometer mirror 1313 may be disposed at the entrance pupil position of the fθ lens 1351 serving as the irradiation optical system and / or at a conjugate position thereof. When the galvanometer mirrors 1341 and 1313 are constituted by a plurality of scanning mirrors, a relay optical system may be disposed between the scanning mirrors to make the scanning mirrors optically conjugate with each other.

[0072] Furthermore, measurement light ML generated by the measurement light source 12 is incident on the processing head 13 via an optical transmission member 121 such as an optical fiber. The measurement light source 12 may be arranged outside the processing head 13. The measurement light source 12 may be arranged inside the processing head 13.

[0073] The measurement light source 12 may include an optical frequency comb light source. An optical frequency comb light source is a light source that can generate light containing frequency components equally spaced on the frequency axis (hereinafter referred to as an "optical frequency comb") as pulsed light. In this case, the measurement light source 12 emits pulsed light containing frequency components equally spaced on the frequency axis as the measurement light ML. However, the measurement light source 12 may include a light source other than the optical frequency comb light source.

[0074] In the example shown in FIG. 3 , the processing system SYSa includes a plurality of measurement light sources 12. For example, the processing system SYSa may include a measurement light source 12#1 and a measurement light source 12#2. The plurality of measurement light sources 12 may each emit a plurality of measurement light beams ML that are phase-synchronized and coherent with each other. For example, the plurality of measurement light sources 12 may have different oscillation frequencies. Therefore, the plurality of measurement light beams ML emitted by the plurality of measurement light sources 12 may be measurement light beams ML with different pulse frequencies (e.g., the number of pulsed light beams per unit time, which is the reciprocal of the emission period of the pulsed light beam). However, the processing system SYSa may also include a single measurement light source 12.

[0075] The measurement light ML emitted from the measurement light source 12 is incident on the measurement optical system 132. The measurement optical system 132 is an optical system that emits the measurement light ML incident on the measurement optical system 132 toward the synthesis optical system 133. The measurement light ML emitted from the measurement optical system 132 is irradiated onto the measurement object M via the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135.

[0076] The measurement optical system 132 includes, for example, a mirror 1320 , a beam splitter 1321 , a beam splitter 1322 , a detector 1323 , a beam splitter 1324 , a mirror 1325 , a detector 1326 , a mirror 1327 , and a galvanometer mirror 1328 .

[0077] The measurement light ML emitted from the measurement light source 12 is incident on the beam splitter 1321. Specifically, the measurement light ML emitted from the measurement light source 12#1 (hereinafter referred to as "measurement light ML#1") is incident on the beam splitter 1321. The measurement light ML emitted from the measurement light source 12#2 (hereinafter referred to as "measurement light ML#2") is incident on the beam splitter 1321 via the mirror 1320. The beam splitter 1321 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1321 toward the beam splitter 1322. In other words, the beam splitter 1321 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1321 from different directions toward the same direction (i.e., the direction in which the beam splitter 1322 is disposed).

[0078] The beam splitter 1322 reflects measurement light ML#1-1, which is a part of measurement light ML#1 that is incident on the beam splitter 1322, toward the detector 1323. The beam splitter 1322 emits measurement light ML#1-2, which is another part of measurement light ML#1 that is incident on the beam splitter 1322, toward the beam splitter 1324. The beam splitter 1322 reflects measurement light ML#2-1, which is a part of measurement light ML#2 that is incident on the beam splitter 1322, toward the detector 1323. The beam splitter 1322 emits measurement light ML#2-2, which is another part of measurement light ML#2 that is incident on the beam splitter 1322, toward the beam splitter 1324.

[0079] The measurement beams ML#1-1 and ML#2-1 emitted from the beam splitter 1322 are incident on the detector 1323. The detector 1323 receives (i.e., detects) the measurement beams ML#1-1 and ML#2-1. In particular, the detector 1323 receives interference light generated by the interference between the measurement beams ML#1-1 and ML#2-1. Note that the operation of receiving interference light generated by the interference between the measurement beams ML#1-1 and ML#2-1 may be considered equivalent to the operation of receiving the measurement beams ML#1-1 and ML#2-1. The detection result of the detector 1323 is output to the control unit 2.

[0080] The measurement beams ML#1-2 and ML#2-2 emitted from the beam splitter 1322 are incident on the beam splitter 1324. The beam splitter 1324 emits at least a portion of the measurement beam ML#1-2 incident on the beam splitter 1324 toward a mirror 1325. The beam splitter 1324 emits at least a portion of the measurement beam ML#2-2 incident on the beam splitter 1324 toward a mirror 1327.

[0081] The measurement light ML#1-2 emitted from the beam splitter 1324 is incident on the mirror 1325. The measurement light ML#1-2 incident on the mirror 1325 is reflected by the reflecting surface of the mirror 1325 (the reflecting surface may also be referred to as a reference surface). Specifically, the mirror 1325 reflects the measurement light ML#1-2 incident on the mirror 1325 toward the beam splitter 1324. That is, the mirror 1325 emits the measurement light ML#1-2 incident on the mirror 1325 as measurement light ML#1-3, which is its reflected light, toward the beam splitter 1324. In this case, the measurement light ML#1-3 may also be referred to as a reference light. The measurement light ML#1-3 emitted from the mirror 1325 is incident on the beam splitter 1324. The beam splitter 1324 emits the measurement beams ML#1-3 incident on the beam splitter 1324 toward the beam splitter 1322. The measurement beams ML#1-3 emitted from the beam splitter 1324 are incident on the beam splitter 1322. The beam splitter 1322 emits the measurement beams ML#1-3 incident on the beam splitter 1322 toward the detector 1326.

[0082] On the other hand, measurement light ML#2-2 emitted from beam splitter 1324 is incident on mirror 1327. Mirror 1327 reflects measurement light ML#2-2 incident on mirror 1327 toward galvanometer mirror 1328. That is, mirror 1327 emits measurement light ML#2-2 incident on mirror 1327 toward galvanometer mirror 1328.

[0083] The galvanometer mirror 1328 deflects the measurement light ML#2-2 (i.e., changes the emission angle of the measurement light ML#2-2). By deflecting the measurement light ML#2-2, the galvanometer mirror 1328 changes the focusing position of the measurement light ML#2-2 in a plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane). Typically, as shown in FIG. 3 , the machining head 13 irradiates the measurement object M with the measurement light ML#2-2 in a state in which the optical axis EX intersects with the surface of the measurement object M (in the example shown in FIG. 3 ). Therefore, when the focusing position of the measurement light ML#2-2 in the plane intersecting the optical axis EX is changed, the irradiation position MA of the measurement light ML#2-2 on the surface of the measurement object M is changed (i.e., moved) in a direction along the surface of the measurement object M. In other words, the irradiation position MA of the measurement light ML#2-2 is changed along at least one of the X-axis direction and the Y-axis direction. In this way, the galvanometer mirror 1328 can change the irradiation position MA of the measurement light ML#2-2, and therefore may be referred to as a position changing optical system or a position changing device.

[0084] The galvanometer mirror 1328 includes an X-scan mirror 1328X and a Y-scan mirror 1328Y. Each of the X-scan mirror 1328X and the Y-scan mirror 1328Y is a tilt-angle variable mirror whose angle with respect to the optical path of the measurement light ML#2-2 incident on the galvanometer mirror 1328 is changeable. The X-scan mirror 1328X deflects the measurement light ML#2-2 so as to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the X-axis direction. In this case, the X-scan mirror 1328X may be rotatable or swingable around the Y-axis. In other words, the galvanometer mirror 1328 may be able to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the X-axis direction by changing the position of the X-scan mirror 1328X in the θY direction (or the orientation about the Y-axis). The Y-scanning mirror 1328Y deflects the processing light EL so as to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the Y-axis direction. In this case, the Y-scanning mirror 1328Y may be rotatable or swingable around the X-axis. In other words, the galvanometer mirror 1328 may be able to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the Y-axis direction by changing the position of the Y-scanning mirror 1328Y in the θX direction (or the orientation about the X-axis).

[0085] Measurement light ML#2-2 emitted from measurement optical system 132 (in this case, measurement light ML#2-2 emitted from galvanometer mirror 1328) is incident on combining optical system 133. Beam splitter 1331 of combining optical system 133 emits measurement light ML#2-2 incident on beam splitter 1331 toward deflection optical system 134. In the example shown in FIG. 3, measurement light ML#2-2 incident on combining optical system 133 is reflected on the polarization separation surface and is thereby emitted toward deflection optical system 134. Therefore, in the example shown in FIG. 3, measurement light ML#2-2 is incident on the polarization separation surface of beam splitter 1331 in a state having a polarization direction that can be reflected on the polarization separation surface (for example, a polarization direction that becomes s-polarized light with respect to the polarization separation surface).

[0086] As described above, the processing light EL is incident on the beam splitter 1331 in addition to the measurement light ML#2-2. That is, both the measurement light ML#2-2 and the processing light EL pass through the beam splitter 1331. The beam splitter 1331 outputs the processing light EL and the measurement light ML#2-2, which are incident on the beam splitter 1331 from different directions, in the same direction (that is, toward the same deflection optical system 134). Therefore, the beam splitter 1331 essentially functions as a combining optical element that combines the processing light EL and the measurement light ML#2-2.

[0087] Note that, when the wavelengths of the processing light EL and the measurement light ML are different, the combining optical system 133 may include a dichroic mirror as a combining optical element instead of the beam splitter 1331. Even in this case, the combining optical system 133 can combine the processing light EL and the measurement light ML#2-2 using the dichroic mirror (that is, combine the optical path of the processing light EL and the optical path of the measurement light ML#2-2).

[0088] The measurement light ML#2-2 emitted from the combining optical system 133 is incident on the deflection optical system 134. The deflection optical system 134 emits the measurement light ML#2-2 incident on the deflection optical system 134 toward the irradiation optical system 135.

[0089] The measurement light ML#2-2 incident on the deflection optical system 134 is incident on the galvanometer mirror 1341. The galvanometer mirror 1341 deflects the measurement light ML#2-2 in the same manner as when deflecting the processing light EL. Therefore, the galvanometer mirror 1341 can change the irradiation position MA of the measurement light ML#2-2 on the surface of the measurement object M in a direction along the surface of the measurement object M. In other words, the galvanometer mirror 1341 may be able to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the X-axis direction by changing the position of the X-scanning mirror 1341X in the θY direction (or the orientation about the Y-axis). The galvanometer mirror 1341 may be able to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the Y-axis direction by changing the position of the Y-scanning mirror 1341Y in the θX direction (or the orientation about the X-axis). In this way, the galvanometer mirror 1341 can change the irradiation position MA of the measurement light ML#2-2, and therefore may be called a position changing optical system or a position changing device.

[0090] As described above, the processing light EL is incident on the galvanometer mirror 1341 in addition to the measurement light ML#2-2. That is, the processing light EL and measurement light ML#2-2 combined by the beam splitter 1331 are incident on the galvanometer mirror 1341. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same galvanometer mirror 1341. For this reason, the galvanometer mirror 1341 can change the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2 in synchronization with each other. That is, the galvanometer mirror 1341 can change the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2 in conjunction with each other.

[0091] On the other hand, as described above, measurement light ML#2-2 is irradiated onto measurement object M via galvanometer mirror 1328, while processing light EL is irradiated onto workpiece W without passing through galvanometer mirror 1328. Therefore, processing system SYSa can use galvanometer mirror 1328 to move irradiation position MA of measurement light ML#2-2 independently with respect to irradiation position PA of processing light EL. That is, processing system SYSa can use galvanometer mirror 1328 to change the relative positional relationship between irradiation position PA of processing light EL and irradiation position MA of measurement light ML#2-2. In particular, processing system SYSa can use galvanometer mirror 1328 to change the relative positional relationship between irradiation position PA of processing light EL and irradiation position MA of measurement light ML#2-2 along a direction intersecting the irradiation direction of measurement light ML#2-2 (at least one of the X-axis direction and the Y-axis direction in the example shown in FIG. 3 ).

[0092] Similarly, as described above, the processing light EL is irradiated onto the measurement object M via the galvanometer mirror 1313, while the measurement light ML#2-2 is irradiated onto the workpiece W without passing through the galvanometer mirror 1313. Therefore, the processing system SYSa can use the galvanometer mirror 1313 to move the irradiation position PA of the processing light EL independently with respect to the irradiation position MA of the measurement light ML#2-2. That is, the processing system SYSa can use the galvanometer mirror 1313 to change the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2. In particular, the processing system SYSa can use the galvanometer mirror 1328 to change the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2 along a direction intersecting the irradiation direction of the processing light EL (at least one of the X-axis direction and the Y-axis direction in the example shown in FIG. 3 ).

[0093] At least one of the galvanometer mirrors 1341 and 1328 allows measurement light ML#2-2 to scan a measurement shot area MSA that is determined based on the processing head 13. In other words, at least one of the galvanometer mirrors 1341 and 1328 allows the irradiation position MA to move within the measurement shot area MSA that is determined based on the processing head 13. An example of the measurement shot area MSA is shown in FIG. 5. As shown in FIG. 5, the measurement shot area MSA indicates an area (in other words, a range) where measurement is performed by the processing head 13 while the positional relationship between the processing head 13 and the measurement object M is fixed (i.e., without change). Typically, the measurement shot area MSA is set to coincide with or be narrower than the scanning range of the measurement light ML deflected by at least one of the galvanometer mirrors 1341 and 1328 while the positional relationship between the processing head 13 and the measurement object M is fixed. Furthermore, by moving the processing head 13 by the head drive system 141 and / or by moving the stage 15 by the stage drive system 161, the measurement shot area MSA (irradiation position MA) can be relatively moved on the surface of the measurement object M. Note that the scanning range of the measurement light ML described above may be the maximum range of the range scanned by the measurement light ML.

[0094] 3 again, measurement light ML#2-2 emitted from deflection optical system 134 is incident on irradiation optical system 135. As described above, when at least one of galvanometer mirror 1341 included in deflection optical system 134 and galvanometer mirror 1328 included in measurement optical system 132 deflects measurement light ML#2-2, the incident position of measurement light ML#2-2 into irradiation optical system 135 changes. Therefore, each of galvanometer mirrors 1341 and 1328 may be considered to function as a position changing device that can change the incident position of measurement light ML#2-2 into irradiation optical system 135 by deflecting measurement light ML#2-2.

[0095] The irradiation optical system 135 is an optical system that can irradiate the measurement light ML#2-2 onto the measurement object M (workpiece W in the example shown in FIG. 3). Specifically, the fθ lens 1351 irradiates the measurement light ML#2-2 emitted from the deflection optical system 134 onto the measurement object M. Specifically, the fθ lens 1351 emits the measurement light ML#2-2 in a direction along the optical axis EX of the irradiation optical system 135. As a result, the measurement light ML#2-2 emitted by the fθ lens 1351 travels in a direction along the optical axis EX and is incident on the measurement object M.

[0096] The fθ lens 1351 may focus the measurement light ML#2-2 emitted from the deflection optical system 134 onto the measurement object M. In this case, the measurement light ML#2-2 emitted from the fθ lens 1351 may be irradiated onto the measurement object M without passing through another optical element having power (in other words, an optical member such as a lens). In this case, the fθ lens 1351 may be referred to as the final optical element because it is the optical element having the final power (in other words, the optical element closest to the workpiece W) among multiple optical elements arranged on the optical path of the measurement light ML#2-2. In this case, the measurement light ML#2-2 emitted from the deflection optical system 134 and incident on the fθ lens 1351 may be a parallel beam.

[0097] When the measurement object M is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is generated from the measurement object M. In other words, when the measurement object M is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is emitted from the measurement object M. The light resulting from the irradiation of the measurement light ML#2-2 (in other words, the light emitted from the measurement object M due to the irradiation of the measurement light ML#2-2) may include at least one of the measurement light ML#2-2 reflected by the measurement object M (i.e., reflected light), the measurement light ML#2-2 scattered by the measurement object M (i.e., scattered light), the measurement light ML#2-2 diffracted by the measurement object M (i.e., diffracted light), and the measurement light ML#2-2 transmitted through the measurement object M (i.e., transmitted light).

[0098] At least a portion of the light emitted from the measurement object M due to the irradiation of the measurement light ML#2-2 is incident on the irradiation optical system 135 as return light RL. Specifically, of the light emitted from the measurement object M due to the irradiation of the measurement light ML#2-2, light traveling along the optical path of the measurement light ML#2-2 incident on the measurement object M is incident on the irradiation optical system 135 as return light RL. In this case, the optical path of the measurement light ML#2-2 emitted from the irradiation optical system 135 and incident on the measurement object M may be the same as the optical path of the return light RL emitted from the measurement object M and incident on the irradiation optical system 135. The return light RL incident on the irradiation optical system 135 is incident on the deflection optical system 134 via the fθ lens 1351. The return light RL incident on the deflection optical system 134 is incident on the combining optical system 133 via the galvanometer mirror 1341. The beam splitter 1331 of the combining optical system 133 emits the return light RL incident on the beam splitter 1331 toward the measurement optical system 132. In the example shown in Fig. 3, the return light RL incident on the beam splitter 1331 is reflected on the polarization separation surface and is emitted toward the measurement optical system 132. Therefore, in the example shown in Fig. 3, the return light RL is incident on the polarization separation surface of the beam splitter 1331 in a state in which it has a polarization direction that allows it to be reflected by the polarization separation surface.

[0099] The return light RL emitted from the beam splitter 1331 is incident on a galvanometer mirror 1328 of the measurement optical system 132. The galvanometer mirror 1328 emits the return light RL incident on the galvanometer mirror 1328 toward a mirror 1327. The mirror 1327 reflects the return light RL incident on the mirror 1327 toward the beam splitter 1324. The beam splitter 1324 emits at least a portion of the return light RL incident on the beam splitter 1324 toward the beam splitter 1322. The beam splitter 1322 emits at least a portion of the return light RL incident on the beam splitter 1322 toward a detector 1326.

[0100] As described above, in addition to the return light RL, the measurement light ML#1-3 is incident on the detector 1326. That is, the return light RL that travels toward the detector 1326 via the measurement object M, and the measurement light ML#1-3 that travels toward the detector 1326 without traveling through the measurement object M, are incident on the detector 1326. The detector 1326 receives (i.e., detects) the measurement light ML#1-3 and the return light RL. In particular, the detector 1326 receives interference light generated by interference between the measurement light ML#1-3 and the return light RL. Note that the operation of receiving interference light generated by interference between the measurement light ML#1-3 and the return light RL may be considered equivalent to the operation of receiving the measurement light ML#1-3 and the return light RL. The detection result of the detector 1326 is output to the control unit 2.

[0101] The control unit 2 acquires the detection results of the detector 1323 and the detector 1326. The control unit 2 may generate measurement data of the measurement object M (e.g., measurement data related to at least one of the position and the shape of the measurement object M) based on the detection results of the detector 1323 and the detection results of the detector 1326.

[0102] Specifically, since the pulse frequency of measurement light ML#1 is different from the pulse frequency of measurement light ML#2, the pulse frequency of measurement light ML#1-1 is different from the pulse frequency of measurement light ML#2-1. Therefore, the interference light between measurement light ML#1-1 and measurement light ML#2-1 is interference light in which pulse light appears in synchronization with the timing when the pulse light constituting measurement light ML#1-1 and the pulse light constituting measurement light ML#2-1 simultaneously enter detector 1323. Similarly, the pulse frequency of measurement light ML#1-3 is different from the pulse frequency of return light RL. Therefore, the interference light between measurement light ML#1-3 and return light RL is interference light in which pulse light appears in synchronization with the timing when the pulse light constituting measurement light ML#1-3 and the pulse light constituting return light RL simultaneously enter detector 1326. Here, the position (position on the time axis) of the pulsed light of interference light detected by the detector 1326 varies depending on the positional relationship between the processing head 13 and the measurement object M. This is because the interference light detected by the detector 1326 is interference light between the return light RL heading toward the detector 1326 via the measurement object M and the measurement light ML#1-3 heading toward the detector 1326 without passing through the measurement object M. On the other hand, the position (position on the time axis) of the pulsed light of interference light detected by the detector 1323 does not vary depending on the positional relationship between the processing head 13 and the measurement object M (that is, essentially, the positional relationship between the processing head 13 and the measurement object M). For this reason, it can be said that the time difference between the pulsed light of interference light detected by the detector 1326 and the pulsed light of interference light detected by the detector 1323 indirectly indicates the positional relationship between the processing head 13 and the measurement object M. Specifically, it can be said that the time difference between the pulsed light of interference light detected by the detector 1326 and the pulsed light of interference light detected by the detector 1323 indirectly indicates the distance between the processing head 13 and the measurement object M in the direction along the optical path of the measurement light ML (i.e., the direction along the traveling direction of the measurement light ML). Therefore, the control unit 2 can calculate the distance between the processing head 13 and the measurement object M in the direction along the optical path of the measurement light ML (e.g., the Z-axis direction) based on the time difference between the pulsed light of interference light detected by the detector 1326 and the pulsed light of interference light detected by the detector 1323.In other words, the control unit 2 can calculate the position of the measurement object M in a direction along the optical path of the measurement light ML (e.g., the Z-axis direction). More specifically, the control unit 2 can calculate the distance between the irradiated portion of the measurement object M irradiated with the measurement light ML#2-2 and the machining head 13. The control unit 2 can calculate the position of the irradiated portion in a direction along the optical path of the measurement light ML (e.g., the Z-axis direction). Furthermore, because the irradiation position of the measurement light ML#2-2 on the measurement object M is determined by the drive states of the galvanometer mirrors 1341 and 1328, the control unit 2 can calculate the position of the irradiated portion in a direction intersecting the optical path of the measurement light ML (e.g., at least one of the X-axis direction and the Y-axis direction) based on the drive states of the galvanometer mirrors 1341 and 1328. As a result, the control unit 2 can generate measurement data indicating the position of the irradiated portion in a measurement coordinate system based on the machining head 13 (e.g., a position in a three-dimensional coordinate space).

[0103] The processing head 13 may irradiate multiple portions of the measurement object M with the measurement light ML#2-2. For example, at least one of the galvanometer mirrors 1341 and 1328 may change the irradiation position of the measurement light ML#2-2 on the measurement object M so that the processing head 13 irradiates multiple portions of the measurement object M with the measurement light ML#2-2. For example, at least one of the processing head 13 and the stage 15 may move so that the processing head 13 irradiates multiple portions of the measurement object M with the measurement light ML#2-2. When the measurement light ML#2-2 is irradiated to multiple portions of the measurement object M, the control unit 2 can generate measurement data indicating the positions of the multiple portions of the measurement object M. As a result, the control unit 2 can generate measurement data indicating the shape of the measurement object M based on the measurement data indicating the positions of the multiple portions. For example, the control unit 2 can generate measurement data indicating the shape of the measurement object M by calculating a three-dimensional shape consisting of a virtual plane (or curved surface) connecting multiple parts whose positions have been identified as the shape of the measurement object M.

[0104] (1-3) Configuration of the machining head 13 with replaceable irradiation optical system 135 In the first embodiment, as described above, the irradiation optical system 135 that irradiates the workpiece W with the processing light EL and the measurement object M with the measurement light ML is replaceable. Hereinafter, the configuration of the machining head 13 with a replaceable irradiation optical system 135 will be further described with reference to FIG. 3.

[0105] 3, the processing optical system 131, the measurement optical system 132, the synthesis optical system 133, and the deflection optical system 134 may be housed in a head housing 136 of the processing head 13. On the other hand, the irradiation optical system 135 may be housed in a head housing 137 of the processing head 13 that is different from the head housing 136. At least one of the head housings 136 and 137 may be referred to as a lens barrel.

[0106] In this case, the processing light EL and the measurement light ML are each incident on the irradiation optical system 135 housed in the head housing 137 via the processing optical system 131, the measurement optical system 132, the combining optical system 133, and the deflection optical system 134 housed in the head housing 136. In other words, the optical system including the processing optical system 131, the measurement optical system 132, the combining optical system 133, and the deflection optical system 134 housed in the head housing 136 emits the processing light EL and the measurement light ML to the irradiation optical system 135. For convenience of explanation, in the following description, the optical system including the processing optical system 131, the measurement optical system 132, the combining optical system 133, and the deflection optical system 134 will be referred to as the emission optical system 130 that emits the processing light EL and the measurement light ML to the irradiation optical system 135.

[0107] The head housing 137 is attachable to the head housing 136. The head housing 137 attached to the head housing 136 is detachable from the head housing 136. In other words, the head housing 137 is detachable from the head housing 136. In this case, the irradiation optical system 135 housed in the head housing 137 may be considered to be attachable to the emission optical system 130 housed in the head housing 136. The irradiation optical system 135 attached to the emission optical system 130 may be considered to be detachable from the emission optical system 130. In other words, the irradiation optical system 135 may be considered to be detachable from the emission optical system 130.

[0108] In the first embodiment, the head housing 137 may be detachable from the head housing 136 via the mounting adapter 138. That is, the irradiation optical system 135 may be detachable from the emission optical system 130 via the mounting adapter 138. However, the head housing 137 may be detachable from the head housing 136 without using the mounting adapter 138. That is, the irradiation optical system 135 may be detachable from the emission optical system 130 without using the mounting adapter 138.

[0109] An example of the mounting adapter 138 is shown in Fig. 6. As shown in Fig. 6, the mounting adapter 138 may be attached to the head housing 136. In the example shown in Fig. 6, the mounting adapter 138 may be attached to the head housing 136 so that the upper surface of the mounting adapter 138 (specifically, the surface facing the +Z side) faces the lower surface of the head housing 136 (specifically, the surface facing the -Z side).

[0110] The lower surface of the mounting adapter 138 (specifically, the surface facing the -Z side) may be used as a mounting surface 1380 to which the head housing 137 is attached. In other words, the head housing 137 may be attached to the mounting adapter 138 so that the mounting surface 1370, which is the upper surface of the head housing 137, faces the mounting surface 1380 of the mounting adapter 138. As a result, the head housing 137 is attached to the head housing 136 via the mounting adapter 138.

[0111] At least one mounting pin 1381 may be formed on a mounting surface 1380 of the mounting adapter 138 to mount the head housing 137 to the mounting adapter 138. At least one mounting pin 1382 may be formed on a side surface of each mounting pin 1381. As shown in the enlarged view of the mounting pin 1381 on the right side of FIG. 6 , the state of each mounting pin 1382 may be switchable between a state in which each mounting pin 1382 is housed inside the mounting pin 1381 (so that each mounting pin 1382 does not protrude from the side surface of the mounting pin 1381) and a state in which each mounting pin 1382 is not housed inside the mounting pin 1381 (so that each mounting pin 1382 protrudes from the side surface of the mounting pin 1381). For example, the state of each mounting pin 1382 can be switched between a state in which each mounting pin 1382 is housed inside mounting pin 1381 and a state in which each mounting pin 1382 is not housed inside mounting pin 1381 using a force that moves the mounting pin 1382.

[0112] The force that moves the mounting pin 1382 may be a force applied to the mounting pin 1382 from the head housing 137. For example, during the process of attaching the head housing 137 to the mounting adapter 138, the mounting pin 1382 may come into contact with the surface of the head housing 137 (e.g., the surface forming the mounting hole 1371, described below). In this case, a force that pushes the mounting pin 1382 from the surface of the head housing 137 is applied to the mounting pin 1382. The mounting pin 1382 may move due to the force that pushes the mounting pin 1382 from the surface of the head housing 137. In other words, the mounting pin 1382 may be housed inside the mounting pin 1381 due to the force that pushes the mounting pin 1382 from the surface of the head housing 137. Note that in this case, the curvature of at least a portion of the surface of the mounting pin 1382 may be set to an appropriate curvature so that a force is appropriately applied to the mounting pin 1382 from the surface of the head housing 137. At least a portion of the surface of the mounting pin 1382 may be curved.

[0113] The force that moves the mounting pin 1382 may be, for example, a force caused by a gas (e.g., air). The force that moves the mounting pin 1382 may be, for example, a force caused by the pressure of a gas (e.g., air). In this case, a pneumatic device that supplies gas may move the mounting pin 1382. The gas used to move the mounting pin 1382 may be a purge gas, or a gas different from the purge gas.

[0114] 6 and 7, two mounting pins 1381 are arranged on a straight line intersecting the optical axis EX of the irradiation optical system 135. However, the number of mounting pins 1381 is not limited to two. A single mounting pin 1381 may be formed. Three or more mounting pins 1381 may be formed.

[0115] Furthermore, in order to attach the head housing 137 to the mounting adapter 138, mounting holes 1371 into which mounting pins 1381 of the mounting adapter 138 can be inserted may be formed in the mounting surface 1370 of the head housing 137. The number of mounting holes 1371 formed in the head housing 137 may be the same as the number of mounting pins 1381 formed in the mounting adapter 138. Furthermore, the mounting holes 1371 may be connected to mounting holes 1372 into which mounting pins 1382 of the mounting adapter 138 can be inserted. The number of mounting holes 1372 connected to each mounting hole 1371 may be the same as the number of mounting pins 1382 formed in each mounting pin 1381.

[0116] In this case, to attach the head housing 137 to the mounting adapter 138, the state of each mounting pin 1382 may be switched to a state in which each mounting pin 1382 is housed inside the mounting pin 1381, as shown in FIG. 7A. Thereafter, as shown in FIG. 7B, the head housing 137 may be aligned with the mounting adapter 138 so that each mounting pin 1381 is inserted into each mounting hole 1371. Thereafter, as shown in FIG. 7C, the state of each mounting pin 1382 may be switched to a state in which each mounting pin 1382 is not housed inside the mounting pin 1381. As a result, as shown in FIG. 7C, the mounting pins 1382 are inserted into the mounting holes 1372, and the head housing 137 is fixed to the mounting adapter 138. That is, the head housing 137 is attached to the head housing 136. In other words, the irradiation optical system 135 is attached to the emission optical system 130.

[0117] On the other hand, in order to remove the head housing 137 attached to the mounting adapter 138, the state of each mounting pin 1382 may be switched to a state in which each mounting pin 1382 is housed inside the mounting pin 1381, as shown in FIG. 7B. Thereafter, each mounting pin 1381 may be removed from each mounting hole 1371, as shown in FIG. 7A. As a result, the head housing 137 is removed from the mounting adapter 138, as shown in FIG. 7A. In other words, the head housing 137 is removed from the head housing 136. In other words, the irradiation optical system 135 is removed from the emission optical system 130.

[0118] A groove may be formed in at least one of the mounting surface 1380 of the mounting adapter 138 and the mounting surface 1370 of the head housing 137. After the head housing 137 is attached to the mounting adapter 138, the groove may be evacuated. In this case, if the head housing 137 is properly attached to the mounting adapter 138, the mounting surface 1370 is in proper contact with the mounting surface 1380, and therefore it is assumed that the air pressure in the groove will be reduced to a certain value or less. On the other hand, if the head housing 137 is not properly attached to the mounting adapter 138, the mounting surface 1370 is not in proper contact with the mounting surface 1380, and therefore it is assumed that the air pressure in the groove will not be reduced to a certain value or less. For this reason, the control unit 2 may determine whether the head housing 137 is properly attached to the mounting adapter 138 based on the air pressure in the evacuated groove.

[0119] The force that moves the mounting pin 1382 may include a force caused by a spring (or any elastic body) in addition to the force caused by the gas described above. For example, the state of the mounting pin 1382 may be set to a state in which the mounting pin 1382 protrudes from the side surface of the mounting pin 1381 due to the force applied to the mounting pin 1382 from the spring. In this state, the state of the mounting pin 1382 may be switched to a state in which the mounting pin 1382 is housed inside the mounting pin 1381 due to the force caused by the gas. In other words, when the pneumatic device is in the off state, the mounting pin 1382 may protrude from the side surface of the mounting pin 1381, while when the pneumatic device is in the on state, the mounting pin 1382 may be housed inside the mounting pin 1381. In this case, even if the pneumatic device fails due to an unexpected event (i.e., even if the pneumatic device is turned off), the head housing 137 will not come off the mounting adapter 138. Therefore, damage to the irradiation optical system 135 due to falling can be prevented. Therefore, the mounting pins 1381 and the mounting holes 1371 can function as a fall prevention mechanism that prevents the head housing 137 from falling off the mounting adapter 138. The mounting pins 1381 and the mounting holes 1371 can function as a fall prevention mechanism that prevents the head housing 137 from falling off the mounting adapter 138. However, the processing head 13 may be provided with other fall prevention mechanisms (fall prevention mechanisms) in addition to the fall prevention mechanism (fall prevention mechanism) including the mounting pins 1381 and the mounting holes 1371.

[0120] Furthermore, in the above example, the mounting adapter 138 is attached to the head housing 136. However, the mounting adapter 138 may also be attached to the head housing 137. When the irradiation optical system 135 is replaceable, as will be described later, multiple head housings 137 are selectively attached to the head housing 136. In this case, the mounting adapter 138 may be attached to each of the multiple head housings 137.

[0121] (1-4) Configuration of Head Exchange Device 17 Next, the configuration of the head exchange device 17 that exchanges the irradiation optical system 135 will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view conceptually showing an example of the configuration of the head exchange device 17.

[0122] As shown in FIG. 8, the head exchanging device 17 includes a storage device 171 , a transport device 172 , and a housing 173 .

[0123] The storage device 171 can store the irradiation optical system 135 that can be attached to the processing head 13. Typically, the storage device 171 can store a plurality of irradiation optical systems 135, each of which can be attached to the processing head 13. In the example shown in Fig. 8, the storage device 171 stores N (N is a variable indicating an integer of 2 or more) irradiation optical systems 135 (specifically, irradiation optical systems 135#1 to 135#N).

[0124] As described above, the irradiation optical system 135 is attached to the processing head 13 (particularly, the emission optical system 130) in a state in which the irradiation optical system 135 is housed in the head housing 137. Therefore, the storage device 171 may be able to house the irradiation optical system 135 housed in the head housing 137. In other words, the storage device 171 may be able to house the head housing 137 in which the irradiation optical system 135 is housed.

[0125] The storage device 171 may store a plurality of irradiation optical systems 135 having different optical characteristics. Examples of the plurality of irradiation optical systems 135 having different optical characteristics are shown in Figures 9(a) to 9(g). Figures 9(a) to 9(g) each show seven irradiation optical systems 135 having different optical characteristics.

[0126] For example, as shown in FIGS. 9A to 9C , the storage device 171 may accommodate a plurality of irradiation optical systems 135 having different numerical apertures NA (numerical apertures). Specifically, as the numerical aperture NA of the irradiation optical system 135 increases, the machining accuracy and measurement accuracy increase, but the working distance between the irradiation optical system 135 and the workpiece W (or the measurement object M) decreases. Therefore, as the numerical aperture NA of the irradiation optical system 135 increases, the machining accuracy and measurement accuracy increase, but the possibility of the irradiation optical system 135 colliding with the workpiece W (or the measurement object M) increases. On the other hand, as the numerical aperture NA of the irradiation optical system 135 decreases, the working distance between the irradiation optical system 135 and the workpiece W (or the measurement object M) increases, but the machining accuracy and measurement accuracy decrease. Therefore, as the numerical aperture NA of the irradiation optical system 135 decreases, the possibility of the irradiation optical system 135 colliding with the workpiece W (or the measurement object M) decreases, but the machining accuracy and measurement accuracy decrease. Therefore, the storage device 171 may store multiple irradiation optical systems 135 with different numerical apertures NA, taking into consideration the trade-off between the effect of improving processing accuracy and measurement accuracy (hereinafter referred to as the accuracy improvement effect) and the effect of preventing collisions between the irradiation optical system 135 and the workpiece W (or the object to be measured M) (hereinafter referred to as the collision prevention effect).

[0127] In other words, multiple irradiation optical systems 135 with different working distances may be housed. Here, the working distance may be the distance along the optical axis EX from the final optical element of the irradiation optical system 135 to the focusing position of the processing light EL. The working distance may also be the distance along the optical axis EX from the optical element located closest to the exit side among one or more optical elements constituting the irradiation optical system 135 to the focusing position of the processing light EL. The working distance may also be the distance along the direction parallel to the optical axis EX from the portion of the head housing 137 housing the irradiation optical system 135 closest to the workpiece W to the focusing position of the processing light EL. Here, the focusing position of the processing light EL may be the rear focal position of the irradiation optical system 135.

[0128] As one example, the storage device 171 may house an irradiation optical system 135-1 whose numerical aperture NA is set to a first numerical aperture NA1 in order to achieve both an accuracy improvement effect and a collision prevention effect. As another example, the storage device 171 may house, in addition to or instead of the irradiation optical system 135-1, an irradiation optical system 135-2 whose numerical aperture NA is set to a second numerical aperture NA2 that is larger than the first numerical aperture NA1 in order to prioritize an accuracy improvement effect over a collision prevention effect. As another example, the storage device 171 may house, in addition to or instead of at least one of the irradiation optical systems 135-1 and 135-2, an irradiation optical system 135-3 whose numerical aperture NA is set to a third numerical aperture NA3 that is smaller than the first numerical aperture NA1 in order to prioritize a collision prevention effect over an accuracy improvement effect.

[0129] In this case, when the irradiation optical system 135-1 is attached to the machining head 13, the machining system SYSa can machine the workpiece W with a first machining accuracy and measure the measurement object M with a first measurement accuracy while reducing the possibility of collision between the irradiation optical system 135 and the workpiece W (or the measurement object M). Furthermore, when the irradiation optical system 135-2 is attached to the machining head 13, the machining system SYSa can machine the workpiece W with a second machining accuracy higher than the first machining accuracy and measure the measurement object M with a second measurement accuracy higher than the first measurement accuracy. Furthermore, when the irradiation optical system 135-3 is attached to the machining head 13, the machining system SYSa can further prevent collision between the irradiation optical system 135 and the workpiece W (or the measurement object M) compared to when the irradiation optical system 135-1 is attached to the machining head 13. Furthermore, because the working distance is longer, as shown in Figure 9 (c), the processing system SYSa can properly process the workpiece W to form a deep hole in the workpiece W, and can properly measure the inside of the deep hole formed in the measurement object M.

[0130] 9(d), the storage device 171 may accommodate an irradiation optical system 135-4 that is specialized for processing the workpiece W using the processing light EL. For example, the storage device 171 may accommodate an irradiation optical system 135-4 that prioritizes improving processing accuracy over improving measurement accuracy. For example, the storage device 171 may accommodate an irradiation optical system 135-4 that is designed solely to improve processing accuracy, without any consideration for improving measurement accuracy. In this case, when the irradiation optical system 135-4 is attached to the processing head 13, the processing system SYSa can process the workpiece W more appropriately.

[0131] 9( e), the storage device 171 may house an irradiation optical system 135-5 that is specialized for measuring the measurement object M using the measurement light ML. For example, the storage device 171 may house an irradiation optical system 135-5 that prioritizes improving measurement accuracy over improving processing accuracy. For example, the storage device 171 may house an irradiation optical system 135-5 that is designed solely to improve measurement accuracy, without any consideration for improving processing accuracy. In this case, when the irradiation optical system 135-5 is attached to the processing head 13, the processing system SYSa can more appropriately measure the measurement object M.

[0132] For example, as shown in FIG. 9( f), the storage device 171 may house an irradiation optical system 135-6 whose size (so-called width) in a direction intersecting the irradiation direction of the processing light EL and the measurement light ML is limited to a certain size or less. Because the irradiation optical system 135-6 is housed in the head housing 137, the storage device 171 may house the irradiation optical system 135-6 housed in the head housing 137 whose size (so-called width) in a direction intersecting the irradiation direction of the processing light EL and the measurement light ML is limited to a certain size or less. In this case, when the irradiation optical system 135-6 is attached to the processing head 13, the processing system SYSa can insert the irradiation optical system 135-6 into a hole having a width equal to or less than a certain size formed in the workpiece W or the measurement object M. Therefore, the processing system SYSa can properly process the workpiece W to form a deep hole in the workpiece W and properly measure the interior of the deep hole formed in the measurement object M.

[0133] 9( g), the storage device 171 may house an irradiation optical system 135-7 capable of emitting at least one of the processing light EL and the measurement light ML in a direction intersecting the optical axis EX of the irradiation optical system 135 (e.g., the optical axis of the fθ lens 1351). In this case, the irradiation optical system 135-7 may include a mirror 1352 capable of reflecting at least one of the processing light EL and the measurement light ML emitted from the fθ lens 1351 so as to change the traveling direction of at least one of the processing light EL and the measurement light ML emitted from the fθ lens 1351. Furthermore, the mirror 1352 may be rotatable about the optical axis EX of the irradiation optical system 135 (e.g., the optical axis of the fθ lens 1351). When such an irradiation optical system 135-7 is attached to the machining head 13, the machining system SYSa can irradiate the processing light EL or the measurement light ML onto the surface of the workpiece W or the measurement object M along the optical axis EX of the irradiation optical system 135.

[0134] 8 again, the transport device 172 can transport the irradiation optical system 135 between the head exchange device 17 and the machining head 13. Specifically, the transport device 172 may remove the irradiation optical system 135 stored in the storage device 171 from the storage device 171. Then, the transport device 172 may transport the irradiation optical system 135 removed from the storage device 171 to the machining head 13. Then, the transport device 172 may attach the irradiation optical system 135 transported to the machining head 13 to the machining head 13. Furthermore, the transport device 172 may remove the irradiation optical system 135 attached to the machining head 13 from the machining head 13. Then, the transport device 172 may transport the irradiation optical system 135 removed from the machining head 13 from the machining head 13 to the storage device 171. Then, the transport device 172 may store the irradiation optical system 135 transported to the storage device 171 in the storage device 171.

[0135] When a plurality of irradiation optical systems 135 are housed in the housing device 171, the control unit 2 may select one of the plurality of irradiation optical systems 135 as the irradiation optical system 135 to be attached to the machining head 13. For example, the control unit 2 may select one of the plurality of irradiation optical systems 135 as the irradiation optical system 135 to be attached to the machining head 13 based on an instruction from a user of the machining system SYSa. For example, the control unit 2 may select one of the plurality of irradiation optical systems 135 as the irradiation optical system 135 to be attached to the machining head 13 based on a machining mode performed by the machining system SYSa. For example, the control unit 2 may select one of the plurality of irradiation optical systems 135 as the irradiation optical system 135 to be attached to the machining head 13 based on a measurement mode performed by the machining system SYSa. Thereafter, the transport device 172 may transport one irradiation optical system 135 selected by the control unit 2 from the storage device 171 to the processing head 13 .

[0136] The transport device 172 may include a transport arm 1721 that can grasp or temporarily hold the irradiation optical system 135 in order to transport the irradiation optical system 135. In this case, the transport device 172 may use the transport arm 1721 to transport the irradiation optical system 135 between the head exchange device 17 and the processing head 13.

[0137] When the transport device 172 transports the irradiation optical system 135 using the transport arm 1721, a magazine-type auto tool changer (ATC) used in machine tools may be used as the head exchanging device 17. In this case, the storage device 171 may be referred to as a magazine. In other words, the magazine of the auto tool changer may be used as the storage device 171. In this case, cutting tools that are normally stored in a magazine do not need to be stored in the magazine that functions as the storage device 171 for storing multiple irradiation optical systems 135.

[0138] Alternatively, a turret-type automatic tool changer used in a machine tool may be used as the head changing device 17. In this case, the storage device 171 may function as a tool pot having a drum shape. In other words, the tool pot of the automatic tool changer may be used as the storage device 171. In this case, cutting tools that are normally stored in the tool pot do not have to be stored in the tool pot that functions as the storage device 171 for storing multiple irradiation optical systems 135. In this case, the transport device 172 may directly rotate the tool pot used as the storage device 171 so that the desired irradiation optical system 135 is located at a position closest to the transport device 172, and may grip or temporarily hold the irradiation optical system 135 located at a position closest to the transport device 172. Alternatively, the tool pot used as the storage device 171 may rotate so that the desired irradiation optical system 135 is located at a desired position without using the force of the transport device 172. 8 , the tool pot used as the storage device 171 may be rotated so that the desired irradiation optical system 135 to be attached to the machining head 13 is positioned closest to the +Y side. Thereafter, the desired irradiation optical system 135 may move so as to protrude from the transfer opening 1731 toward the +Y side, and the machining head 13 may approach the irradiation optical system 135 protruding from the transfer opening 1731 so that the irradiation optical system 135 protruding from the transfer opening 1731 can be attached to the machining head 13.

[0139] When an automatic tool changer of a machine tool is used as the head exchange device 17, the machining system SYSa may be manufactured using the machine tool. For example, the machining head 13 may be attached to the spindle of the machine tool, thereby manufacturing the machining system SYSa. In this case, an internal device of the housing of the machine tool that has already been designed, developed, or mass-produced may be used as a component of the machining system SYSa. For example, a stage of the machine tool may be used as the stage 15 of the machining system SYSa. For example, a guide mechanism of the machine tool may be used as at least one of the head drive system 141 and the stage drive system 161 of the machining system SYSa. Alternatively, an internal device of the housing of the machine tool may be at least partially improved, and the partially improved device may be used as a component of the machining system SYSa. As a result, the cost of the machining system SYSa can be reduced compared to when the components of the machining system SYSa are newly designed from scratch. The machining system SYS may use, as components of the machining system SYS, devices inside the housing of a machine tool that has already been designed, developed, or mass-produced (for example, an auto-tool changer, a stage, and a guide mechanism for the head).

[0140] The housing 173 houses at least a part of the storage device 171 and the transport device 172. Specifically, at least a part of the storage device 171 and the transport device 172 is housed in a storage space 1730 inside the housing 173.

[0141] A transfer opening 1731 may be formed in the housing 173. In this case, the transfer device 172 may transfer the irradiation optical system 135 between the head exchange device 17 and the processing head 13 via the transfer opening 1731.

[0142] The housing 173 may have a gas supply port 1732 formed therein. A purge gas (i.e., gas) such as nitrogen gas may be supplied to the storage space 1730 inside the housing 173 through the gas supply port 1732. That is, the processing system SYS may supply the purge gas to the storage space 1730 inside the housing 173 through the gas supply port 1732 using a gas supply device (not shown).

[0143] A purge gas may be supplied to the accommodation space 1730 via the gas supply port 1732 so that the air pressure in the accommodation space 1730 is higher than the air pressure in the space outside the housing 173 (specifically, the internal space SP inside the housing 3 that houses the machining unit 1). That is, a purge gas may be supplied to the accommodation space 1730 via the gas supply port 1732 so that the air pressure in the accommodation space 1730 is higher than the air pressure in the internal space SP in which the workpiece W is placed on the stage 15. In other words, a purge gas may be supplied to the accommodation space 1730 via the gas supply port 1732 so that the air pressure in the accommodation space 1730 is higher than the air pressure in the internal space SP in which the workpiece W is machined. As a result, the possibility of unnecessary substances generated during the machining of the workpiece W entering the accommodation space 1730 of the head exchange device 17 from the internal space SP in which the workpiece W is present is reduced. Therefore, the head exchange device 17 can prevent unwanted substances from adhering to the irradiation optical system 135 housed in the housing space 1730. An example of unwanted substances is fumes generated during the processing of the workpiece W.

[0144] The purge gas may be supplied toward the irradiation optical system 135 housed in the accommodation space 1730 via the gas supply port 1732. For example, the purge gas may be supplied toward at least one of the multiple irradiation optical systems 135 housed in the accommodation space 1730 via the gas supply port 1732. In this case, even if unnecessary substances adhere to the irradiation optical system 135 housed in the accommodation space 1730, the unnecessary substances adhered to the irradiation optical system 135 are removed by the purge gas supplied toward the irradiation optical system 135. Therefore, the head exchanging device 17 can prevent unnecessary substances from adhering to the irradiation optical system 135 housed in the accommodation space 1730.

[0145] Note that purge gas may be supplied to the mounting surface 1380 of the mounting adapter 138 for at least part of the period during which the head housing 137 is detached from the mounting adapter 138 (head housing 136). In this case, it is possible to prevent unwanted substances from adhering to the mounting surface 1380. Here, the period during which purge gas is supplied to the mounting surface 1380 of the mounting adapter 138 may be the entire period during which the head housing 137 is detached from the mounting adapter 138 (head housing 136).

[0146] (1-5) Technical Effects of the Machining System SYSa As described above, the machining system SYSa of the first embodiment is capable of replacing the irradiation optical system 135 attached to the machining head 13. Therefore, compared to a case in which the irradiation optical system 135 attached to the machining head 13 cannot be replaced, the machining system SYSa can more appropriately machine the workpiece W using one irradiation optical system 135 that matches the machining purpose. Furthermore, compared to a case in which the irradiation optical system 135 attached to the machining head 13 cannot be replaced, the machining system SYSa can more appropriately measure the measurement object M using one irradiation optical system 135 that matches the measurement purpose.

[0147] (2) Machining System SYSb of Second Embodiment Next, a description will be given of the machining system SYS in the second embodiment. In the following description, the machining system SYS in the second embodiment will be referred to as the "machining system SYSb."

[0148] (2-1) Configuration of Machining System SYSb First, the configuration of the machining system SYSb in the second embodiment will be described with reference to Fig. 10. Fig. 10 is a block diagram showing an example of the configuration of the machining system SYSb in the second embodiment. Note that in the following description, components that are the same as components that have already been described will be assigned the same reference numerals, and detailed description thereof will be omitted.

[0149] 10 , the machining system SYSb in the second embodiment differs from the machining system SYSa in the first embodiment described above in that it includes a machining unit 1b instead of the machining unit 1 described above. Other features of the machining system SYSb may be the same as other features of the machining system SYSa.

[0150] The machining unit 1b differs from the machining unit 1 in that it further includes an optical measurement device 18b, a measurement drive system 191b, and a position measurement device 192b. Other features of the machining unit 1b may be the same as other features of the machining unit 1.

[0151] The optical measurement device 18b is a component used in the calibration operation. The calibration operation is an operation for calibrating (in other words, controlling or adjusting) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML. The calibration operation is performed under the control of the control unit 2. In other words, the processing system SYSb performs the calibration operation under the control of the control unit 2. Note that the details of the calibration operation and the details of the optical measurement device 18b will be described in detail later, but a brief overview will be provided below.

[0152] To perform the calibration operation, the machining head 13, under the control of the control unit 2, irradiates at least one of the processing light EL and the measurement light ML onto the optical measurement device 18b. That is, the machining head 13 emits at least one of the processing light EL and the measurement light ML toward the optical measurement device 18b via the irradiation optical system 135. The optical measurement device 18b, under the control of the control unit 2, measures at least one of the processing light EL and the measurement light ML irradiated onto the optical measurement device 18b. That is, the optical measurement device 18b measures at least one of the processing light EL and the measurement light ML emitted from the irradiation optical system 135. Specifically, the optical measurement device 18b receives at least one of the processing light EL and the measurement light ML irradiated onto the optical measurement device 18b. That is, the optical measurement device 18b receives at least one of the processing light EL and the measurement light ML emitted from the irradiation optical system 135. For this reason, the optical measurement device 18b may be referred to as a light receiving device. Light reception information indicating the result of reception of at least one of the processing light EL and the measurement light ML by the optical measurement device 18b is output from the optical measurement device 18b to the control unit 2.

[0153] The control unit 2 calibrates at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the light reception information. Specifically, the control unit 2 calculates (in other words, acquires) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the light reception information. That is, the control unit 2 acquires irradiation position information regarding at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the light reception information. Then, the control unit 2 calibrates at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the irradiation position information.

[0154] The measurement drive system 191b moves the optical measurement device 18b under the control of the control unit 2. In other words, the measurement drive system 191b moves the position of the optical measurement device 18b. For this reason, the measurement drive system 191b may be referred to as a movement device. The measurement drive system 191b may move (i.e., linearly move) the optical measurement device 18b, for example, along a movement axis along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The measurement drive system 191b may move the optical measurement device 18b along at least one of the θX direction, the θY direction, and the θZ direction, in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. In other words, the measurement drive system 191b may rotate (i.e., rotationally move) the optical measurement device 18b around at least one of the rotation axis along the X-axis direction (i.e., the A-axis), the rotation axis along the Y-axis direction (i.e., the B-axis), and the rotation axis along the Z-axis direction (i.e., the C-axis).

[0155] When the measurement drive system 191b moves the optical measurement device 18b, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135 provided in the machining head 13) and the optical measurement device 18b changes. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the optical measurement device 18b along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may change. For example, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the optical measurement device 18b along at least one of the θX direction, the θY direction, and the θZ direction may change. Note that the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the optical measurement device 18b along at least one of the θX direction, the θY direction, and the θZ direction may be considered to be the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the optical measurement device 18b. Therefore, the measurement drive system 191b may be considered to function as a change device that can change at least one of the positional relationship and the attitude relationship between the processing head 13 (particularly the irradiation optical system 135) and the optical measurement device 18b.

[0156] The measurement drive system 191b may move the optical measurement device 18b so that the optical measurement device 18b is located at a calibration position CP1 as shown in FIG. 11(a) during at least a portion of a calibration period in which a calibration operation is performed. The calibration position CP1 is a position where the optical measurement device 18b can receive at least one of the processing light EL and the measurement light ML. On the other hand, the measurement drive system 191b may move the optical measurement device 18b so that the optical measurement device 18b is located at a non-calibration position CP2 as shown in FIG. 11(b) during at least a portion of a processing period in which the machining unit 1 processes the workpiece W. The non-calibration position CP2 is a position where the optical measurement device 18b cannot receive at least one of the processing light EL and the measurement light ML. Similarly, the measurement drive system 191b may move the optical measurement device 18b so that the optical measurement device 18b is located at the non-calibration position CP2 during at least a portion of a measurement period in which the machining unit 1 measures the measurement target M. That is, the measurement drive system 191b may move the optical measurement device 18b so that the optical measurement device 18b is located at a non-calibration position CP2 different from the calibration position CP1 during at least a part of the processing period and the measurement period. That is, the measurement drive system 191b may move the optical measurement device 18b between the calibration position CP1 and the non-calibration position CP2.

[0157] In this case, during the machining period, the optical measurement device 18b located at the non-calibration position CP2 does not receive the machining light EL. Therefore, the machining light EL emitted toward the workpiece W to machine the workpiece W is not blocked by the optical measurement device 18b. Therefore, even if the machining unit 1b includes the optical measurement device 18b, the machining unit 1b can properly machine the workpiece W. Similarly, during the measurement period, the optical measurement device 18b located at the non-calibration position CP2 does not receive the measurement light ML. The measurement light ML emitted toward the measurement object M to measure the measurement object M is not blocked by the optical measurement device 18b. Therefore, even if the machining unit 1b includes the optical measurement device 18b, the machining unit 1b can properly measure the measurement object M. Furthermore, typically, the light intensity of the processing light EL received by the optical measurement device 18b is lower than the light intensity of the processing light EL when machining the workpiece W. During the processing period, the optical measurement device 18b is not irradiated with high-intensity processing light EL, thereby preventing deterioration or damage to the optical measurement device 18b. On the other hand, during the calibration period, the optical measurement device 18b located at the calibration position CP1 can receive at least one of the processing light EL and the measurement light ML. In other words, the processing unit 1b can irradiate the optical measurement device 18b with at least one of the processing light EL and the measurement light ML. Therefore, during the calibration period, the processing system SYSb can appropriately perform the calibration operation.

[0158] The measurement drive system 191b may move the optical measurement device 18b between the calibration position CP1 and the non-calibration position CP2 by moving the optical measurement device 18b along a direction intersecting the direction in which at least one of the processing light EL and the measurement light ML is irradiated. In other words, the measurement drive system 191b may move the optical measurement device 18b between the calibration position CP1 and the non-calibration position CP2 by changing the relative positional relationship between the optical measurement device 18b and the processing head 13 (particularly, the irradiation optical system 135) along a direction intersecting the direction in which at least one of the processing light EL and the measurement light ML is irradiated. In the example shown in FIG. 11A, the direction in which at least one of the processing light EL and the measurement light ML is irradiated is the Z-axis direction. Therefore, the measurement drive system 191b may move the optical measurement device 18b along a direction intersecting the Z-axis direction. In this case, the calibration position CP1 and the non-calibration position CP2 may be spaced apart from each other along a direction intersecting the direction in which at least one of the processing light EL and the measurement light ML is irradiated.

[0159] As shown in FIG. 11A, the calibration position CP1 may be a position on the optical path of at least one of the processing light EL and the measurement light ML. The calibration position CP1 may be a position where the processing head 13 (particularly, the irradiation optical system 135) can irradiate at least one of the processing light EL and the measurement light ML. On the other hand, as shown in FIG. 11B, the non-calibration position CP2 may be a position away from the optical paths of the processing light EL and the measurement light ML. The non-calibration position CP2 may be a position where the processing head 13 (particularly, the irradiation optical system 135) cannot irradiate the processing light EL and the measurement light ML. The non-calibration position CP2 may be a position where the processing head 13 (particularly, the irradiation optical system 135) is prohibited from irradiating the processing light EL and the measurement light ML. The non-calibration position CP2 may be a position outside the area where the processing unit 1b can process (e.g., the above-mentioned processing shot area PSA). The non-calibration position CP2 may be a position outside the area where measurement is possible with the machining unit 1b (for example, the above-mentioned measurement shot area MSA).

[0160] The calibration position CP1 may be a position on the stage 15. In this case, the optical measurement device 18b located at the calibration position CP1 may be placed on the stage 15. The stage 15 may hold the optical measurement device 18b. Alternatively, the stage 15 may not hold the optical measurement device 18b. On the other hand, the non-calibration position CP2 may be a position separated from the stage 15. In particular, the non-calibration position CP2 may be a position separated from the stage 15 along a direction intersecting the direction in which at least one of the processing light EL and the measurement light ML is irradiated.

[0161] The non-calibration position CP2 may be a position inside the accommodation device 171 of the head exchanging device 17 described above. In other words, the non-calibration position CP2 may be a position inside the housing 173 that accommodates the accommodation device 171 (i.e., a position inside the accommodation space 1730). In this case, the optical measurement device 18b located at the non-calibration position CP2 may be accommodated in the accommodation device 171. The optical measurement device 18b located at the non-calibration position CP2 may be accommodated in the accommodation space 1730. The optical measurement device 18b located at the non-calibration position CP2 may be accommodated in an accommodation space different from the accommodation space 1730. On the other hand, the calibration position CP1 may be a position outside the accommodation device 171. In other words, the calibration position CP1 may be a position outside the housing 173 (i.e., a position outside the accommodation space 1730).

[0162] Note that even when the head drive system 141 described above moves the machining head 13, the positional relationship between the machining head 13 (particularly, the irradiation optical system 135 provided in the machining head 13) and the optical measurement device 18b changes. For this reason, the head drive system 141 may be considered to function as a change device that can change at least one of the positional relationship and the attitude relationship between the machining head 13 (particularly, the irradiation optical system 135) and the optical measurement device 18b. In this case, in addition to or instead of moving the optical measurement device 18b using the measurement drive system 191b, the machining system SYSb may move the machining head 13 using the head drive system 141 to relatively move the optical measurement device 18b between the calibration position CP1 and the non-calibration position CP2.

[0163] 10 , the position measurement device 192b can measure the position of the optical measurement device 18b under the control of the control unit 2. The position measurement device 192b may include, for example, an interferometer (e.g., a laser interferometer). The position measurement device 192b may include, for example, an encoder (for example, at least one of a linear encoder and a rotary encoder). The position measurement device 192b may include, for example, a potentiometer. When the measurement drive system 191b uses a stepping motor as a drive source, the position measurement device 192b may include, for example, an open-loop control type position detection device. The open-loop control type position detection device is a position detection device that measures the position of the optical measurement device 18b by estimating the movement amount of the optical measurement device 18b from the integrated value of the number of pulses for driving the stepping motor.

[0164] (2-2) Configuration of Optical Measuring Device 18b Next, the configuration of the optical measuring device 18b will be described with reference to Fig. 12. Fig. 12 is a cross-sectional view showing the configuration of the optical measuring device 18b.

[0165] 12, the optical measurement device 18b includes a beam passing member 181b, a light receiving element 182b, and a light receiving optical system 183b. The beam passing member 181b is a member having a light passing region 184b formed therein through which at least one of the processing light EL and the measurement light ML can pass. The light receiving element 182b can receive at least one of the processing light EL and the measurement light ML that has passed through the light passing region 184b of the beam passing member 181b. The light receiving element 182b is a sensor corresponding to the wavelengths of the processing light EL and the measurement light ML. Examples of the light-receiving element 182b include at least one of a photodetector, a CCD (Charge Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, and a sensor using an InGaAs (Indium Gallium Arsenide) element. In particular, in the second embodiment, the light-receiving element 182b may be capable of receiving at least one of the processing light EL and the measurement light ML that have passed through the light passing region 184b of the beam passing member 181b via the light-receiving optical system 183b. Therefore, the beam passing member 181b may be disposed above the light-receiving optical system 183b, and the light-receiving optical system 183b may be disposed above the light-receiving element 182b. The beam passing member 181b may be disposed between the processing head 13 and the light receiving optical system 183b, and the light receiving optical system 183b may be disposed between the beam passing member 181b and the light receiving element 182b.

[0166] The beam passing member 181b, the light receiving element 182b, and the light receiving optical system 183b may be disposed inside a depression 1801b (i.e., a recess) formed in the base member 180b of the optical measurement device 18b. However, at least one of the beam passing member 181b, the light receiving element 182b, and the light receiving optical system 183b may be disposed at any position different from the depression 1801b.

[0167] The beam passing member 181b includes a glass substrate 1811b and an attenuation film 1812b formed on at least a portion of the surface of the glass substrate 1811b. The attenuation film 1812b is a member capable of attenuating the processing light EL and measurement light ML incident on the attenuation film 1812b. The attenuation film 1812b may include, for example, a chromium film or a chromium oxide film. Note that "attenuation of the processing light EL by the attenuation film 1812b" in the second embodiment may include not only making the intensity of the processing light EL passing through the attenuation film 1812b smaller than the intensity of the processing light EL incident on the attenuation film 1812b, but also blocking (i.e., shielding) the processing light EL incident on the attenuation film 1812b. Similarly, "attenuation of the measurement light ML by the attenuation film 1812b" in the second embodiment may include not only making the intensity of the measurement light ML that has passed through the attenuation film 1812b smaller than the intensity of the measurement light ML that has entered the attenuation film 1812b, but also blocking (i.e., shielding) the measurement light ML that has entered the attenuation film 1812b. Therefore, when the processing light EL is incident on the attenuation film 1812b, the processing light EL attenuated by the attenuation film 1812b may be incident on the light receiving element 182b via the attenuation film 1812b, or the processing light EL may be blocked by the attenuation film 1812b so that the processing light EL does not enter the light receiving element 182b. Similarly, when the measurement light ML is incident on the attenuation film 1812b, the measurement light ML attenuated by the attenuation film 1812b may be incident on the light receiving element 182b via the attenuation film 1812b, or the measurement light ML may be blocked by the attenuation film 1812b and not be incident on the light receiving element 182b. For this reason, the attenuation film 1812b may be referred to as a light blocking film.

[0168] At least one opening 1813b is formed in the attenuation film 1812b. In the example shown in FIG. 12, multiple openings 1813b are formed in the attenuation film 1812b. The openings 1813b are through-holes that penetrate the attenuation film 1812b in the Z-axis direction. Therefore, when the processing light EL is incident on the opening 1813b formed in the attenuation film 1812b, the processing light EL passes through the beam passing member 181b via the opening 1813b. In other words, the processing light EL is incident on the light receiving element 182b via the opening 1813b without being attenuated or blocked by the attenuation film 1812b. Similarly, when the measurement light ML is incident on the opening 1813b formed in the attenuation film 1812b, the measurement light ML passes through the beam passing member 181b via the opening 1813b. That is, the measurement light ML is incident on the light receiving element 182b through the opening 1813b without being attenuated or blocked by the attenuation film 1812b.

[0169] In this way, the portion of the beam passing member 181b where the attenuation film 1812b is not formed (i.e., the portion where the opening 1813b is formed) functions as a light passing region 184b that passes each of the processing light EL and the measurement light ML. Therefore, the light passing region 184b is formed in the beam passing member 181b by the opening 1813b. When multiple openings 1813b are formed, multiple light passing regions 184b may be formed in the beam passing member 181b by the multiple openings 1813b.

[0170] The light passing region 184b may have a predetermined shape in a plane (typically, the XY plane) along the surface of the beam passing member 181b. That is, the opening 1813b forming the light passing region 184b may have a predetermined shape in a plane (typically, the XY plane) along the surface of the beam passing member 181b. In this case, the light passing region 184b may form a mark (i.e., a pattern) having a predetermined shape corresponding to the shape of the light passing region 184b in a plane (typically, the XY plane) along the surface of the beam passing member 181b. That is, a mark (i.e., a pattern) having a predetermined shape may be formed in the beam passing member 181b by the light passing region 184b formed by the opening 1813b having a predetermined shape. For example, as shown in FIG. 13 , the beam passing member 181b may have a light passing region 184b that forms a search mark 185b, which is an example of a mark, formed therein. The light passing region 184b forming the search mark 185b may include two first linear light passing regions 184b-1 and one second linear light passing region 184b-2. Each of the two first linear light passing regions 184b-1 may extend along a first direction. The two first linear light passing regions 184b-1 may be spaced apart along a third direction perpendicular to the first direction. The one second linear light passing region 184b-2 may be located between the two first linear light passing regions 184b-1. The one second linear light passing region 184b-2 may extend along a second direction inclined (i.e., diagonally intersecting) with respect to the first direction. In other words, the light passage region 184b forming the search mark 185b may be formed by two first linear openings 1813b-1, each extending along a first direction and spaced apart along a third direction perpendicular to the first direction, and a second linear opening 1813b-2 located between the two first linear openings 1813b-1 and extending along a second direction inclined with respect to the first direction (i.e., intersecting diagonally).13, the light passage region 184b forming the search mark 185b includes two first linear light passage regions 184b-1 each extending along the Y-axis direction and spaced apart along the X-axis direction orthogonal to the Y-axis direction, and a second linear light passage region 184b-2 extending along a direction inclined to (i.e., intersecting obliquely with) the X-axis direction. That is, in the example shown in FIG. 13, the light passage region 184b forming the search mark 185b is formed by two first linear openings 1813b-1 each extending along the Y-axis direction and spaced apart along the X-axis direction orthogonal to the Y-axis direction, and a second linear opening 1813b-2 extending along a direction inclined to (i.e., intersecting obliquely with) the X-axis direction.

[0171] Note that examples of the angle formed by the second linear opening 1813b-2 and the X-axis include at least one of 75 degrees, 60 degrees, 45 degrees, 30 degrees, and 15 degrees. The angle formed by the second linear opening 1813b-2 and the X-axis may be an angle different from the angle exemplified here. Furthermore, the second linear opening 1813b-2 extending along a direction inclined with respect to the X-axis direction (i.e., diagonally intersecting with the X-axis direction) is also inclined with respect to the Y-axis direction.

[0172] Examples of the angle between the second linear opening 1813b-2 and the Y axis include at least one of 75 degrees, 60 degrees, 45 degrees, 30 degrees, and 15 degrees. The angle between the second linear opening 1813b-2 and the Y axis may be an angle different from the angle exemplified here. The angle between the second linear opening 1813b-2 and the Y axis may be the same as the angle between the second linear opening 1813b-2 and the X axis. The angle between the second linear opening 1813b-2 and the Y axis may be different from the angle between the second linear opening 1813b-2 and the X axis.

[0173] The light passing region 184b forming the search mark 185b may further include two third linear light passing regions 184b-3 aligned along a direction intersecting the direction in which the two first linear light passing regions 184b-1 are aligned. That is, the light passing region 184b may further include two linear openings 1813b-3 forming the two third linear light passing regions 184b-3. Each of the two third linear light passing regions 184b-3 may extend along a direction intersecting the direction in which the first linear light passing region 184b-1 extends. The two third linear light passing regions 184b-3 may be spaced apart along the direction in which the first linear light passing region 184b-1 extends. The second linear light passing region 184b-2 may be located between the two third linear light passing regions 184b-3.

[0174] The length (i.e., longitudinal size) of the first linear light passage region 184b-1 forming the search mark 185b is, for example, 0.1 mm to 1.0 mm, but may be other lengths. The width (i.e., lateral size) of the first linear light passage region 184b-1 forming the search mark 185b is, for example, several μm, but may be other widths. The width (i.e., lateral size) of the second linear light passage region 184b-1 forming the search mark 185b is, for example, several μm, but may be other widths. The size of the search mark 185b (e.g., the size in at least one of the X-axis direction and the Y-axis direction) is, for example, 0.1 mm to several mm, but may be other sizes. The distance between the two first linear light passage regions 184b-1 forming the search mark 185b is, for example, 0.1 mm to several mm, but may be other distances. The angle between the first linear light passing region 184b-1 and the second linear light passing region 184b-2 inclined relative to the first linear light passing region 184b-1 is 10 to 20 degrees (e.g., 15 degrees), but may be other angles.

[0175] A plurality of search marks 185b (or a plurality of arbitrary marks, the same applies hereinafter) may be formed on the beam transmitting member 181b. That is, a plurality of light passing regions 184b forming a plurality of search marks 185b (or a plurality of arbitrary marks) may be formed on the beam transmitting member 181b. For example, as shown in FIG. 14 , a plurality of search marks 185b distributed in a matrix pattern may be formed on the beam transmitting member 181b. In the example shown in FIG. 14 , a plurality of search marks 185b regularly arranged along each of the X-axis direction and the Y-axis direction are formed on the beam transmitting member 181b.

[0176] The plurality of search marks 185b may include at least two search marks 185b in which the second linear opening 1813b-2 forms a different angle with the X-axis. The plurality of search marks 185b may include at least two search marks 185b in which the second linear opening 1813b-2 forms a different angle with the Y-axis. The plurality of search marks 185b may include at least two search marks 185b in which the second linear opening 1813b-2 forms the same angle with the X-axis. The plurality of search marks 185b may include at least two search marks 185b in which the second linear opening 1813b-2 forms the same angle with the Y-axis.

[0177] When multiple (i.e., two or more) search marks 185b are formed on the beam passing member 181b, the machining unit 1b may sequentially irradiate at least two different search marks 185b with the processing light EL during the calibration period. Similarly, the machining unit 1b may sequentially irradiate at least two different search marks 185b with the measurement light ML during the calibration period.

[0178] The size of the mark forming area 186b where the multiple search marks 185b are formed on the beam passing member 181b is smaller than or equal to the size of at least one of the processing shot area PSA and the measurement shot area MSA. As a result, the processing unit 1b can sequentially irradiate the multiple search marks 185b with the processing light EL using at least one of the galvanometer mirrors 1313 and 1341 while keeping the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the optical measurement device 18b fixed. In other words, by changing the irradiation position PA of the processing light EL within the processing shot area PSA set on the beam passing member 181b, the processing unit 1b can sequentially irradiate the processing light EL to the multiple search marks 185b distributed in the mark forming area 186b where the irradiation position PA of the processing light EL can be set using at least one of the galvanometer mirrors 1313 and 1341. Similarly, while keeping the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the optical measurement device 18b fixed, the machining unit 1b can sequentially irradiate the measurement light ML onto the multiple search marks 185b using at least one of the galvanometer mirrors 1328 and 1341. In other words, by changing the irradiation position MA of the measurement light ML within the measurement shot area MSA set on the beam passing member 181b, the machining unit 1b can sequentially irradiate the measurement light ML onto the multiple search marks 185b distributed in the mark forming area 186b in which the irradiation position MA of the measurement light ML can be set using at least one of the galvanometer mirrors 1328 and 1341. However, the size of the mark forming area 186b in which the multiple search marks 185b are formed on the beam passing member 181b may be larger than the size of at least one of the processing shot area PSA and the measurement shot area MSA.

[0179] The position of the optical measurement device 18b when at least one of the processing shot area PSA and the measurement shot area MSA overlaps at least a portion of the mark formation area 186b may be referred to as a calibration position CP1. The position of the optical measurement device 18b when the processing shot area PSA and the measurement shot area MSA do not overlap with the mark formation area 186b may be referred to as a non-calibration position CP2.

[0180] When the processing unit 1b sequentially irradiates at least two search marks 185b with the processing light EL, the light-receiving element 182b may receive the processing light EL that has passed through each of the at least two search marks 185b. For example, FIG. 15 is a cross-sectional view taken along line A-A' in FIG. 14, showing five search marks 185b (specifically, search marks 185b#1 to 185b#5) onto which the processing unit 1b sequentially irradiates the processing light EL. As shown in FIG. 15, the light-receiving element 182b may receive the processing light EL that has passed through search mark 185b#1, the processing light EL that has passed through search mark 185b#2, the processing light EL that has passed through search mark 185b#3, the processing light EL that has passed through search mark 185b#4, and the processing light EL that has passed through search mark 185b#5.

[0181] Detailed explanation will be omitted to avoid duplication, but similarly, when the processing unit 1b sequentially irradiates measurement light ML onto at least two search marks 185b, the light receiving element 182b may receive measurement light ML that has passed through each of the at least two search marks 185b.

[0182] In this case, the light-receiving optical system 183b may change the direction of travel of the processing light EL that has passed through at least two search marks 185b formed at different positions on the beam-passing member 181b so that the processing light EL that has passed through each of the at least two search marks 185b is directed toward the same light-receiving element 182b. For example, as shown in FIG. 15 , the light-receiving optical system 183b may emit the processing light EL that has passed through search mark 185b#1 from a first emission portion RP#1 of the light-receiving optical system 183b toward the light-receiving element 182b. As a result, the processing light EL that has emerged from the first emission portion RP#1 of the light-receiving optical system 183b may pass through an optical path from the first emission portion RP#1 toward the light-receiving element 182b and enter the light-receiving element 182b. Furthermore, the light receiving optical system 183b may emit the processing light EL that has passed through the search mark 185b#2 toward the light receiving element 182b from a second emission portion RP#2 of the light receiving optical system 183b, which is different from the first emission portion RP#1. As a result, the processing light EL that has passed through the second emission portion RP#2 of the light receiving optical system 183b may pass through an optical path from the second emission portion RP#2 toward the light receiving element 182b and be incident on the light receiving element 182b. Furthermore, the light receiving optical system 183b may emit the processing light EL that has passed through the search mark 185b#3 toward the light receiving element 182b from a third emission portion RP#3 of the light receiving optical system 183b, which is different from the first emission portion RP#1 to the second emission portion RP#2. As a result, the processing light EL emitted from the third emission portion RP#3 of the light-receiving optical system 183b may pass through an optical path from the third emission portion RP#3 toward the light-receiving element 182b and be incident on the light-receiving element 182b. Furthermore, the light-receiving optical system 183b may emit the processing light EL that has passed through the search mark 185b#4 toward the light-receiving element 182b from a fourth emission portion RP#4 of the light-receiving optical system 183b, which is different from the first emission portion RP#1 to the third emission portion RP#3. As a result, the processing light EL emitted from the fourth emission portion RP#4 of the light-receiving optical system 183b may pass through an optical path from the fourth emission portion RP#4 toward the light-receiving element 182b and be incident on the light-receiving element 182b. In addition, the light receiving optical system 183b may emit the processing light EL that has passed through the search mark 185b#5 toward the light receiving element 182b from a fifth emission portion RP#5 of the light receiving optical system 183b, which is different from the first emission portion RP#1 to the fourth emission portion RP#4.As a result, the processing light EL emitted from the fifth exit portion RP#5 of the light receiving optical system 183b may pass through an optical path from the fifth exit portion RP#5 to the light receiving element 182b and enter the light receiving element 182b. As a result, the light receiving element 182b can properly receive the processing light EL that has passed through at least two search marks 185b via the light receiving optical system 183b. Therefore, the optical measurement device 18b does not need to have at least two light receiving elements 182b for receiving the processing light EL that has passed through at least two search marks 185b. In other words, the optical measurement device 18b only needs to have a single light receiving element 182b for receiving the processing light EL that has passed through at least two search marks 185b. In this case, the light receiving optical system 183b may be considered to function as a focusing optical system that focuses the processing light EL that has passed through the beam passing member 181b on the light receiving element 182b. In this way, light (processing light EL, measurement light ML) from multiple search marks 185b with different spatial positions is guided to the same position on the light receiving element 182b by the light receiving optical system 183b, making it less susceptible to the effects of in-plane differences in the sensitivity of the light receiving element 182b.

[0183] Detailed explanations will be omitted to avoid duplication, but similarly, when the processing unit 1b sequentially irradiates measurement light ML onto at least two search marks 185b, the light receiving optical system 183b may change the direction of travel of the measurement light ML that has passed through each of the at least two search marks 185b so that the measurement light ML that has passed through each of the at least two search marks 185b formed at different positions on the beam passing member 181b is directed toward the same light receiving element 182b.

[0184] When both the processing light EL and the measurement light ML are incident on the light receiving element 182b via the light receiving optical system 183b, the influence of chromatic aberration may occur. For this reason, the optical measurement device 18b may be provided with an optical element for reducing the influence of chromatic aberration. An example of an optical element for reducing the influence of chromatic aberration is an achromatic lens. An example of an optical element for reducing the influence of chromatic aberration is a dichroic mirror. When a dichroic mirror is used, the dichroic mirror may separate the processing light EL that has passed through the light receiving optical system 183b from the measurement light ML that has passed through the light receiving optical system 183b. The processing light EL and measurement light ML separated by the dichroic mirror may be received by two different light receiving elements 182b, respectively.

[0185] It should be noted that the optical measurement device 18b does not have to include a single light receiving element as the light receiving element 182b. The optical measurement device 18b may include any type of light receiving element 182b as long as one search mark 185b irradiated with each of the processing light EL and the measurement light ML can be identified from the light receiving results by the light receiving element 182b. For example, the optical measurement device 18b may include a two-dimensional sensor as the light receiving element 182b. For example, the optical measurement device 18b may include a two-dimensional sensor as the light receiving element 182b in which multiple light receiving elements are arranged in a matrix. For example, the optical measurement device 18b may include a two-dimensional sensor including a light receiving surface that extends two-dimensionally as the light receiving element 182b.

[0186] Considering that the workpiece W is machined by irradiation with the processing light EL, there is a possibility that at least a portion of the optical measurement device 18b may also be machined (essentially destroyed) by irradiation with the processing light EL. Therefore, the control unit 2 may control the intensity of the processing light EL (e.g., the amount of energy per unit area in a plane intersecting the direction of travel of the processing light EL) so that the intensity of the processing light EL irradiated to the optical measurement device 18b (e.g., the amount of energy per unit area on the light-receiving surface of the light-receiving element 182b) is smaller than the intensity of the processing light EL irradiated to the workpiece W to machine the workpiece W (e.g., the amount of energy per unit area on the surface of the workpiece W). In this case, the control unit 2 may control the processing light source 11 itself to control the intensity of the processing light EL. Alternatively, the control unit 2 may control a light-reducing member (not shown) disposed on the exit side of the processing light source 11 to control the intensity of the processing light EL. As a result, the possibility of the optical measurement device 18b being destroyed by irradiation with the processing light EL is reduced or eliminated.

[0187] (2-3) Calibration Operation Performed Using Optical Measurement Device 18b Next, the calibration operation performed using the optical measurement device 18b will be described. In particular, the flow of the calibration operation will be described below.

[0188] 11(a) described above, the measurement drive system 191b moves the optical measurement device 18b so that the optical measurement device 18b is positioned at a calibration position CP1 where the optical measurement device 18b can receive at least one of the processing light EL and the measurement light ML. In other words, the measurement drive system 191b moves the optical measurement device 18b so that the position of the optical measurement device 18b is changed from the non-calibration position CP2 to the calibration position CP1.

[0189] Here, in the Z-axis direction, the calibration position CP1 may be set at or near the processing surface, which is the surface of the workpiece W onto which the processing light EL is irradiated in order to process the workpiece W. For example, considering that the workpiece W is processed by irradiating the processing light EL onto the workpiece W placed on the mounting surface 151 of the stage 15, the processing surface of the workpiece W is located above (i.e., on the +Z side of) the mounting surface 151. Therefore, the calibration position CP1 at which the optical measurement device 18b is located may be located above the mounting surface 151 of the stage 15. In other words, the calibration position CP1 may be located between the mounting surface 151 of the stage 15 and the machining head 13 (particularly, the irradiation optical system 135).

[0190] However, in the Z-axis direction, the calibration position CP1 may be at the same position as the mounting surface 151 of the stage 15. Alternatively, in the Z-axis direction, the calibration position CP1 may be at a position below (i.e., on the -Z side of) the mounting surface 151 of the stage 15. Even in this case, the machining system SYSb can change the calibration position CP1 at which the optical measurement device 18b is located along the Z-axis direction by rotating the stage 15 around at least one of the rotation axis along the X-axis direction (i.e., the A-axis) and the rotation axis along the Y-axis direction (i.e., the B-axis). Alternatively, the machining system SYSb can change the calibration position CP1 at which the optical measurement device 18b is located along the Z-axis direction by moving the stage 15 along the Z-axis direction. Therefore, the machining system SYSb can bring the calibration position CP1 closer to the machining surface of the workpiece W during at least a part of the calibration period.

[0191] In addition, in at least one of the X-axis direction and the Y-axis direction, the calibration position CP1 may be the same position as the reference position of the stage 15. Alternatively, the calibration position CP1 may be a position different from the reference position of the stage 15. The reference position of the stage 15 may be the center position of the movement stroke of the stage 15. When the stage 15 rotates around a rotation axis along the Z-axis direction (i.e., the C-axis), the reference position of the stage 15 may be a position on the C-axis. The reference position of the stage 15 may be the position of the machining origin of the machining head 13.

[0192] However, when the irradiation optical system 135 emits the processing light EL by reflecting the processing light EL using a mirror, the irradiation position PA of the processing light EL emitted from the irradiation optical system 135 via at least one of the galvanometer mirrors 1313 and 1341 may vary depending on the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. Similarly, when the irradiation optical system 135 emits the measurement light ML by reflecting the measurement light ML using a mirror, the irradiation position MA of the measurement light ML emitted from the irradiation optical system 135 via at least one of the galvanometer mirrors 1328 and 1341 may vary depending on the positional relationship between the machining head 13 (particularly, the irradiation optical system 135) and the workpiece W. In this case, the calibration position CP1 may be the same position as the reference position of the stage 15 in at least one of the X-axis direction and the Y-axis direction. As a result, even if the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML may fluctuate depending on the positional relationship between the processing head 13 (particularly, the irradiation optical system 135) and the workpiece W, the processing system SYSb can perform calibration operations appropriately.

[0193] 11, the machining system SYSb may include a regulating member 4b that regulates the optical measurement device 18b so that the optical measurement device 18b is positioned at the calibration position CP1. An example of the regulating member 4b is a stopper that limits the movement of the optical measurement device 18b by coming into contact with the optical measurement device 18b positioned at the calibration position CP1. In this case, the measurement drive system 191b can appropriately move the optical measurement device 18b so that the optical measurement device 18b is positioned at the calibration position CP1.

[0194] Furthermore, the head drive system 141 moves the machining head 13 so that the machining head 13 is located at a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the machining light EL. In this case, the control unit 2 may calculate the position of the optical measurement device 18b based on the measurement result of the position measurement device 192b, and control the head drive system 141 so that the machining head 13 moves toward a position where the machining head 13 can irradiate the optical measurement device 18b located at the calculated position with the machining light EL.

[0195] The optical measurement device 18b may move to a space below the stage 15. The optical measurement device 18b may be disposed in a space below the stage 15. In this case, the stage 15 may move at the timing when the processing head 13 irradiates the optical measurement device 18b with at least one of the processing light EL and the measurement light ML. Specifically, the stage 15 may move from a position above the optical measurement device 18b to another position. For example, the stage 15 may move from a position above the optical measurement device 18b to another position by moving along at least one of the X-axis direction and the Y-axis direction. For example, the stage 15 may move from a position above the optical measurement device 18b to another position by rotating around a rotation axis along at least one of the X-axis direction and the Y-axis direction. As a result, the optical measurement device 18b, which was hidden by the stage 15, is exposed. Therefore, the processing head 13 can irradiate the optical measurement device 18b with at least one of the processing light EL and the measurement light ML.

[0196] (2-3-2) Irradiation of the processing light EL and the measurement light ML to the optical measurement device 18b After that, the processing head 13 may irradiate the optical measurement device 18b with the processing light EL under the control of the control unit 2. Specifically, the processing head 13 may irradiate at least one search mark 185b formed on the optical measurement device 18b with the processing light EL.

[0197] In the second embodiment, in particular, the machining head 13 may irradiate at least one search mark 185b with the processing light EL while the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the optical measurement device 18b is fixed. In this case, the machining head 13 may irradiate the desired search mark 185b with the processing light EL by using at least one of the galvanometer mirrors 1313 and 1341 to move the irradiation position PA of the processing light EL on the beam passing member 181b. Specifically, the control unit 2 may generate a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the desired search mark 185b with the processing light EL. Then, the machining head 13 may irradiate the desired search mark 185b with the processing light EL by controlling at least one of the galvanometer mirrors 1313 and 1341 based on the galvanometer control signal.

[0198] As shown in FIG. 16 , the processing head 13 may irradiate the search mark 185b with the processing light EL along a first scanning direction in which the two first linear light passage regions 184b-1 and one second linear light passage region 184b-2 that constitute the search mark 185b are aligned. That is, the processing head 13 may irradiate the search mark 185b with the processing light EL along the first scanning direction by moving the irradiation position PA of the processing light EL along the first scanning direction. In the example shown in FIG. 16 , the first scanning direction is the X-axis direction. Therefore, the processing head 13 may irradiate the search mark 185b with the processing light EL by moving the irradiation position PA of the processing light EL along the X-axis direction.

[0199] The processing head 13 may irradiate the search mark 185b with the processing light EL along a second scanning direction in which the two third linear light passage regions 184b-3 and one second linear light passage region 184b-2 constituting the search mark 185b are aligned. That is, the processing head 13 may irradiate the search mark 185b with the processing light EL along the second scanning direction by moving the irradiation position PA of the processing light EL along the second scanning direction. In the example shown in FIG. 16 , the second scanning direction is the Y-axis direction. Therefore, the processing head 13 may irradiate the search mark 185b with the processing light EL by moving the irradiation position PA of the processing light EL along the Y-axis direction.

[0200] If the difference between the movement accuracy of the irradiation position PA in the first scanning direction and the movement accuracy of the irradiation position PA in the second scanning direction is less than the allowable amount, the machining head 13 may move the irradiation position PA along one of the first and second scanning directions, but may not move the irradiation position PA along the other of the first and second scanning directions. In this case, the irradiation position information described below, which is generated when moving the irradiation position PA along one of the first and second scanning directions, may be used as information about the irradiation position PA moving along the first scanning direction, or may be used as information about the irradiation position PA moving along the second scanning direction. Note that when the machining head 13 moves the irradiation position PA along the first scanning direction (X-axis direction), the angle between the second linear opening 1813b-2 and the Y axis may be less than 45 degrees. When the processing head 13 moves the irradiation position PA along the second scanning direction (Y-axis direction), the angle formed by the second linear opening 1813b-2 and the X-axis may be smaller than 45 degrees.

[0201] If the difference between the movement accuracy of the irradiation position PA in the first scanning direction and the movement accuracy of the irradiation position PA in the second scanning direction exceeds a tolerance, the processing head 13 may move the irradiation position PA along each of the first and second scanning directions. In this case, the irradiation position information (described below) generated when moving the irradiation position PA along the first scanning direction may be used as information about the irradiation position PA moving along the first scanning direction, but does not have to be used as information about the irradiation position PA moving along the second scanning direction. The irradiation position information (described below) generated when moving the irradiation position PA along the second scanning direction may be used as information about the irradiation position PA moving along the second scanning direction, but does not have to be used as information about the irradiation position PA moving along the first scanning direction. Note that, when the difference between the movement accuracy of the irradiation position PA in the first scanning direction and the movement accuracy of the irradiation position PA in the second scanning direction is less than the tolerance, the angle formed by the second linear opening 1813b-2 and the Y axis may be the same as the angle formed by the second linear opening 1813b-2 and the X axis. For example, the angle formed by the second linear opening 1813b-2 and the Y axis and the angle formed by the second linear opening 1813b-2 and the X axis may be 45 degrees.

[0202] As described above, when at least two search marks 185b are formed with different angles between the second linear opening 1813b-2 and the X-axis, even if the difference between the movement accuracy of the irradiation position PA in the first scanning direction and the movement accuracy of the irradiation position PA in the second scanning direction exceeds the allowable amount, the machining head 13 may move the irradiation position PA along one of the first and second scanning directions while not moving the irradiation position PA along the other of the first and second scanning directions. In this case, the irradiation position information described below, which is generated when the irradiation position PA is moved along one of the first and second scanning directions, may be used as information about the irradiation position PA moving along the first scanning direction, or may be used as information about the irradiation position PA moving along the second scanning direction.

[0203] The control unit 2 may move the irradiation position PA along one scanning direction using at least one of the galvanometer mirrors 1313 and 1341, while moving the optical measurement device 18b along the same scanning direction. The control unit 2 may move the irradiation position PA in one movement direction using at least one of the galvanometer mirrors 1313 and 1341, while moving the optical measurement device 18b in the same movement direction. In this case, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 and the optical measurement device 18b so that the movement speed of the irradiation position PA on the beam passing member 181b caused by at least one of the galvanometer mirrors 1313 and 1341 is faster than the movement speed of the irradiation position PA on the beam passing member 181b caused by the movement of the optical measurement device 18b. As a result, the light-receiving time during which the light-receiving element 182b can receive the processing light EL is longer than when the optical measurement device 18b does not move. This makes it possible to improve the S / N ratio of the light receiving element 182b. For example, if the scanning mirror provided in at least one of the galvanometer mirrors 1313 and 1341 needs to be rotated at a relatively high speed due to speed dependency in at least one of the galvanometer mirrors 1313 and 1341, the light receiving time becomes short. Even in such a case, the machining system SYSb can extend the light receiving time by moving the optical measuring device 18b. This makes it possible to improve the S / N ratio of the light receiving element 182b.

[0204] The control unit 2 may control the movement speed of the irradiation position PA on the beam passing member 181b (i.e., the scanning speed of the processing light EL). For example, the control unit 2 may set the movement speed of the irradiation position PA on the beam passing member 181b to a first speed that is faster than a second speed, thereby shortening the time required to measure the processing light EL compared to when the movement speed of the irradiation position PA is set to the second speed. For example, the control unit 2 may set the movement speed of the irradiation position PA on the beam passing member 181b to a second speed that is slower than the first speed, thereby improving the measurement accuracy of the processing light EL compared to when the movement speed of the irradiation position PA is set to the first speed.

[0205] As described above, when multiple search marks 185b are formed on the optical measurement device 18b, the processing head 13 may sequentially irradiate the multiple search marks 185b with the processing light EL. That is, the processing head 13 may sequentially irradiate the multiple search marks 185b with the processing light EL along a direction along the surface of the beam passing member 181b on which the multiple search marks 185b are formed. In other words, the processing head 13 may sequentially scan the multiple search marks 185b with the processing light EL. That is, the processing head 13 may sequentially scan the multiple search marks 185b with the processing light EL along a direction along the surface of the beam passing member 181b on which the multiple search marks 185b are formed.

[0206] As shown in Fig. 16 , the processing head 13 may sequentially irradiate the processing light EL onto the multiple search marks 185b along the scanning direction. That is, the processing head 13 may move the irradiation position PA of the processing light EL along the scanning direction to sequentially irradiate the multiple search marks 185b with the processing light EL. In the example shown in Fig. 16 , the scanning direction is the X-axis direction. Therefore, the processing head 13 may move the irradiation position PA of the processing light EL along the X-axis direction to sequentially irradiate the multiple search marks 185b with the processing light EL.

[0207] 16 , when a plurality of mark groups MG including a plurality of search marks 185 b arranged along the scanning direction (e.g., the X-axis direction) are formed along a direction intersecting the scanning direction (e.g., the Y-axis direction), the processing head 13 may repeat the operation of sequentially irradiating the plurality of search marks 185 b included in each mark group MG with the processing light EL for the plurality of mark groups MG. For example, the processing head 13 may sequentially irradiate the plurality of search marks 185 b included in the first mark group MG#1 with the processing light EL, sequentially irradiate the plurality of search marks 185 b included in the second mark group MG#2 with the processing light EL, sequentially irradiate the plurality of search marks 185 b included in the third mark group MG#3 with the processing light EL, and sequentially irradiate the plurality of search marks 185 b included in the fourth mark group MG#4 with the processing light EL.

[0208] When the processing light EL is irradiated onto the search mark 185b, the light-receiving element 182b receives the processing light EL that has passed through the light passage region 184b that forms the search mark 185b. In other words, the light-receiving element 182b receives the processing light EL via the search mark 185b. The light-receiving element 182b receives the processing light EL that has passed through the search mark 185b. As a result, the light-receiving element 182b receives the processing light EL that has passed through one of the two first linear light passage regions 184b-1 that make up the search mark 185b, then receives the processing light EL that has passed through the second linear light passage region 184b-2 that makes up the search mark 185b, and then receives the processing light EL that has passed through the other of the two first linear light passage regions 184b-1 that make up the search mark 185b. 17, which is a graph showing the light reception result of the processed light EL by the light receiving element 182b, the light receiving element 182b outputs light reception information indicating, as a light reception result, a light reception signal including pulse signals in which a pulse waveform P1 corresponding to the processed light EL that has passed through one of the two first linear light passing regions 184b-1, a pulse waveform P2 corresponding to the processed light EL that has passed through the second linear light passing region 184b-2, and a pulse waveform P3 corresponding to the processed light EL that has passed through the other of the two first linear light passing regions 184b-1 appear in sequence. When the processed light EL is irradiated sequentially onto multiple search marks 185b, the light receiving element 182b outputs light reception information indicating, as a light reception result, a light reception signal including multiple pulse signals in which the pulse waveforms P1 to P3 appear in sequence.

[0209] Furthermore, the processing head 13 may irradiate the optical measurement device 18b with measurement light ML in addition to or instead of irradiating the optical measurement device 18b with processing light EL under the control of the control unit 2. Specifically, the processing head 13 may irradiate the measurement light ML to at least one search mark 185b formed on the optical measurement device 18b.

[0210] Particularly in the second embodiment, the machining head 13 may irradiate at least one search mark 185b with the measurement light ML while the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the optical measurement device 18b is fixed. In this case, the machining head 13 may irradiate the desired search mark 185b with the measurement light ML by using at least one of the galvanometer mirrors 1328 and 1341 to move the irradiation position PA of the measurement light ML on the beam passing member 181b. Specifically, the control unit 2 may generate a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the desired search mark 185b with the measurement light ML. Thereafter, the machining head 13 may irradiate the desired search mark 185b with the measurement light ML by controlling at least one of the galvanometer mirrors 1328 and 1341 based on the galvanometer control signal.

[0211] As shown in FIG. 16 , the processing head 13 may irradiate the search mark 185b with the measurement light ML along a first scanning direction in which the two first linear light passage areas 184b-1 and one second linear light passage area 184b-2 that constitute the search mark 185b are aligned. That is, the processing head 13 may irradiate the search mark 185b with the measurement light ML along the first scanning direction by moving the irradiation position MA of the measurement light ML along the first scanning direction. In the example shown in FIG. 16 , the first scanning direction is the X-axis direction. Therefore, the processing head 13 may irradiate the search mark 185b with the measurement light ML by moving the irradiation position MA of the measurement light ML along the first X-axis direction.

[0212] The processing head 13 may irradiate the search mark 185b with the measurement light ML along a second scanning direction in which the two third linear light passing regions 184b-3 and one second linear light passing region 184b-2 that constitute the search mark 185b are aligned. That is, the processing head 13 may irradiate the search mark 185b with the measurement light ML along the second scanning direction by moving the irradiation position MA of the measurement light ML along the second scanning direction. In the example shown in FIG. 16 , the third scanning direction is the Y-axis direction. Therefore, the processing head 13 may irradiate the search mark 185b with the measurement light ML by moving the irradiation position MA of the measurement light ML along the Y-axis direction.

[0213] If the difference between the movement accuracy of the irradiation position MA in the first scanning direction and the movement accuracy of the irradiation position MA in the second scanning direction is less than the allowable amount, the machining head 13 may move the irradiation position MA along one of the first and second scanning directions, but may not move the irradiation position MA along the other of the first and second scanning directions. In this case, the irradiation position information described below, which is generated when the irradiation position MA is moved along one of the first and second scanning directions, may be used as information about the irradiation position MA moving along the first scanning direction, or may be used as information about the irradiation position MA moving along the second scanning direction. Note that when the machining head 13 moves the irradiation position MA along the first scanning direction (X-axis direction), the angle between the second linear opening 1813b-2 and the Y-axis may be less than 45 degrees. When the processing head 13 moves the irradiation position MA along the second scanning direction (Y-axis direction), the angle formed by the second linear opening 1813b-2 and the X-axis may be smaller than 45 degrees.

[0214] If the difference between the movement accuracy of the irradiation position MA in the first scanning direction and the movement accuracy of the irradiation position MA in the second scanning direction exceeds a tolerance, the machining head 13 may move the irradiation position MA along each of the first and second scanning directions. In this case, the irradiation position information (described below) generated when moving the irradiation position MA along the first scanning direction may be used as information about the irradiation position MA moving along the first scanning direction, but does not have to be used as information about the irradiation position MA moving along the second scanning direction. The irradiation position information (described below) generated when moving the irradiation position MA along the second scanning direction may be used as information about the irradiation position MA moving along the second scanning direction, but does not have to be used as information about the irradiation position MA moving along the first scanning direction. If the difference between the movement accuracy of the irradiation position MA in the first scanning direction and the movement accuracy of the irradiation position MA in the second scanning direction is less than the tolerance, the angle formed by the second linear opening 1813b-2 and the Y axis may be the same as the angle formed by the second linear opening 1813b-2 and the X axis. For example, the angle formed by the second linear opening 1813b-2 and the Y axis and the angle formed by the second linear opening 1813b-2 and the X axis may be 45 degrees.

[0215] As described above, when at least two search marks 185b are formed with different angles formed between the second linear opening 1813b-2 and the X-axis, even if the difference between the movement accuracy of the irradiation position MA in the first scanning direction and the movement accuracy of the irradiation position MA in the second scanning direction exceeds the allowable amount, the machining head 13 may move the irradiation position MA along one of the first and second scanning directions while not moving the irradiation position MA along the other of the first and second scanning directions. In this case, the irradiation position information described below, which is generated when the irradiation position MA is moved along one of the first and second scanning directions, may be used as information about the irradiation position MA moving along the first scanning direction or as information about the irradiation position MA moving along the second scanning direction.

[0216] The control unit 2 may move the irradiation position MA along one scanning direction using at least one of the galvanometer mirrors 1328 and 1341, while moving the optical measurement device 18b along the same scanning direction. The control unit 2 may move the irradiation position MA in one movement direction using at least one of the galvanometer mirrors 1313 and 1341, while moving the optical measurement device 18b in the same movement direction. In this case, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 and the optical measurement device 18b so that the movement speed of the irradiation position MA on the beam passing member 181b caused by at least one of the galvanometer mirrors 1328 and 1341 is faster than the movement speed of the irradiation position MA on the beam passing member 181b caused by the movement of the optical measurement device 18b. As a result, the light-receiving time during which the light-receiving element 182b can receive the measurement light ML is longer than when the optical measurement device 18b does not move. This makes it possible to improve the S / N ratio of the light receiving element 182b. For example, if the scanning mirror of at least one of the galvanometer mirrors 1328 and 1341 needs to be rotated at a relatively high speed due to speed dependency in at least one of the galvanometer mirrors 1328 and 1341, the light receiving time becomes short. Even in such a case, the machining system SYSb can extend the light receiving time by moving the optical measuring device 18b. This makes it possible to improve the S / N ratio of the light receiving element 182b.

[0217] The control unit 2 may control the movement speed of the irradiation position MA on the beam passing member 181b (i.e., the scanning speed of the processing light EL). For example, the control unit 2 may set the movement speed of the irradiation position MA on the beam passing member 181b to a first speed that is faster than the second speed, thereby shortening the time required to measure the measurement light ML compared to when the movement speed of the irradiation position MA is set to the second speed. For example, the control unit 2 may set the movement speed of the irradiation position MA on the beam passing member 181b to a second speed that is slower than the first speed, thereby improving the measurement accuracy of the measurement light ML compared to when the movement speed of the irradiation position MA is set to the first speed.

[0218] As described above, when multiple search marks 185b are formed on the optical measurement device 18b, the processing head 13 may sequentially irradiate the multiple search marks 185b with the measurement light ML. That is, the processing head 13 may sequentially irradiate the multiple search marks 185b with the measurement light ML along a direction along the surface of the beam passing member 181b on which the multiple search marks 185b are formed. In other words, the processing head 13 may sequentially scan the multiple search marks 185b with the measurement light ML. That is, the processing head 13 may sequentially scan the multiple search marks 185b with the measurement light ML along a direction along the surface of the beam passing member 181b on which the multiple search marks 185b are formed.

[0219] As shown in FIG. 16 , the processing head 13 may sequentially irradiate the measurement light ML onto the plurality of search marks 185b along the scanning direction. That is, the processing head 13 may move the irradiation position MA of the measurement light ML along the scanning direction, thereby sequentially irradiating the measurement light ML onto the plurality of search marks 185b along the scanning direction. In the example shown in FIG. 16 , the scanning direction is the X-axis direction. Therefore, the processing head 13 may sequentially irradiate the measurement light ML onto the plurality of search marks 185b by moving the irradiation position MA of the measurement light ML along the X-axis direction.

[0220] 16 , when a plurality of mark groups MG including a plurality of search marks 185 b arranged along the scanning direction (e.g., the X-axis direction) are formed along a direction intersecting the scanning direction (e.g., the Y-axis direction), the processing head 13 may repeat the operation of sequentially irradiating the plurality of search marks 185 b included in each mark group MG with the measurement light ML for the plurality of mark groups MG. For example, the processing head 13 may sequentially irradiate the plurality of search marks 185 b included in the first mark group MG#1 with the measurement light ML, sequentially irradiate the plurality of search marks 185 b included in the second mark group MG#2 with the measurement light ML, sequentially irradiate the plurality of search marks 185 b included in the third mark group MG#3 with the measurement light ML, and sequentially irradiate the plurality of search marks 185 b included in the fourth mark group MG#4 with the measurement light ML.

[0221] When the measurement light ML is irradiated onto the search mark 185b, the light receiving element 182b receives the measurement light ML that has passed through the light passing region 184b that forms the search mark 185b. In other words, the light receiving element 182b receives the measurement light ML that has passed through the search mark 185b. The light receiving element 182b receives the measurement light ML that has passed through the search mark 185b. As a result, the light receiving element 182b receives the measurement light ML that has passed through one of the two first linear light passing regions 184b-1 that form the search mark 185b, then receives the measurement light ML that has passed through the second linear light passing region 184b-2 that form the search mark 185b, and then receives the measurement light ML that has passed through the other of the two first linear light passing regions 184b-1 that form the search mark 185b. 17 is a graph showing the light reception result of the measurement light ML by the light receiving element 182b, the light receiving element 182b outputs light reception information indicating, as a light reception result, a light reception signal including pulse signals in which a pulse waveform P1 corresponding to the measurement light ML that has passed through one of the two first linear light passing regions 184b-1, a pulse waveform P2 corresponding to the measurement light ML that has passed through the second linear light passing region 184b-2, and a pulse waveform P3 corresponding to the measurement light ML that has passed through the other of the two first linear light passing regions 184b-1 appear in sequence. When the measurement light ML is irradiated onto the plurality of search marks 185b in sequence, the light receiving element 182b outputs light reception information indicating, as a light reception result, a light reception signal including a plurality of pulse signals in which the pulse waveforms P1 to P3 appear in sequence.

[0222] 17 shows an example in which the horizontal axis of the graph indicates the reception timing (i.e., time) of each of the processing light EL and the measurement light ML, but the horizontal axis of the graph may be considered to indicate the respective positions of the processing light EL and the measurement light ML. In other words, the above explanation can be expanded on the assumption that the horizontal axis of the graph shown in FIG. 17 indicates the respective positions of the processing light EL and the measurement light ML.

[0223] The processing head 13 does not simultaneously irradiate the optical measurement device 18b with the processing light EL and the measurement light ML. In this case, the processing head 13 does not need to irradiate the optical measurement device 18b with the measurement light ML during the period when the optical measurement device 18b is irradiated with the processing light EL. The processing head 13 does not need to irradiate the optical measurement device 18b with the processing light EL during the period when the optical measurement device 18b is irradiated with the measurement light ML. In this case, even if the optical measurement device 18b includes a single light-receiving element 182b, the light-receiving element 182b can appropriately receive the processing light EL that has passed through the search mark 185b and the measurement light ML that has passed through the search mark 185b. In other words, the light-receiving element 182b can output light-receiving information indicating the light-receiving result of the processing light EL that has passed through the search mark 185b and light-receiving information indicating the light-receiving result of the measurement light ML that has passed through the search mark 185b in output formats that can be distinguished from each other.

[0224] However, the processing head 13 may simultaneously irradiate the optical measurement device 18b with the processing light EL and the measurement light ML. In this case, the processing head 13 may irradiate the same search mark 185b with the measurement light ML during at least a portion of the period during which the processing light EL is irradiated onto the same search mark 185b. Alternatively, the processing head 13 may irradiate another search mark 185b different from the search mark 185b with the measurement light ML during at least a portion of the period during which the processing light EL is irradiated onto the search mark 185b.

[0225] When the processing head 13 simultaneously irradiates the optical measurement device 18b with the processing light EL and the measurement light ML, the optical measurement device 18b may be provided with multiple light receiving elements 182b. For example, the optical measurement device 18b may separately include a light receiving element 182b for receiving the processing light EL that has passed through the search mark 185b and a light receiving element 182b for receiving the measurement light ML that has passed through the search mark 185b. As a result, even when the processing head 13 simultaneously irradiates the optical measurement device 18b with the processing light EL and the measurement light ML, the optical measurement device 18b can output light reception information indicating the light reception result of the processing light EL that has passed through the search mark 185b and light reception information indicating the light reception result of the measurement light ML that has passed through the search mark 185b in output forms that can be distinguished from each other.

[0226] When the optical measurement device 18b is separately provided with a light receiving element 182b for receiving the processing light EL and a light receiving element 182b for receiving the measurement light ML, the processing head 13 may simultaneously irradiate the processing light EL and the measurement light ML onto the optical measurement device 18b. Alternatively, the processing head 13 does not have to simultaneously irradiate the processing light EL and the measurement light ML onto the optical measurement device 18b.

[0227] (2-3-3) Generation (Acquisition) of Irradiation Position Information After that, the control unit 2 calculates (in other words, acquires) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the light reception information output from the light receiving element 182 b. That is, the control unit 2 generates (acquires) irradiation position information regarding at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the light reception information.

[0228] (2-3-3-1) First Specific Example of Irradiation Position Information The control unit 2 may generate, as irradiation position information, information regarding the relative positional relationship between the reference irradiation position BPA of the processing light EL and the actual irradiation position PA of the processing light EL (hereinafter referred to as the "actual irradiation position APA"). Specifically, as described above, to perform the calibration operation, the processing head 13 irradiates one search mark 185b with the processing light EL based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL onto the search mark 185b. The reference irradiation position BPA may be the ideal irradiation position PA of the processing light EL (in other words, the designed or target irradiation position PA) when the processing head 13 irradiates one search mark 185b with the processing light EL based on the galvanometer control signal for irradiating the one search mark 185b with the processing light EL. On the other hand, the actual irradiation position APA may be the actual irradiation position PA of the processing light EL when the processing head 13 irradiates the same search mark 185b with the processing light EL based on the same galvanometer control signal for irradiating the same search mark 185b with the processing light EL. The light reception information obtained by the calibration operation includes information about this actual irradiation position APA. Therefore, the control unit 2 may calculate the actual irradiation position APA based on the light reception information. On the other hand, the information about the reference irradiation position BPA may be information already known to the control unit 2. As a result, the control unit 2 can generate irradiation position information including information about the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA based on the light reception information and the information about the reference irradiation position BPA.

[0229] As described above, when the processing light EL is sequentially irradiated onto the plurality of search marks 185 b distributed within the processing shot area PSA by the calibration operation, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each of the plurality of different positions within the processing shot area PSA. Specifically, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each position of the plurality of search marks 185 b distributed within the processing shot area PSA.

[0230] The information about the reference irradiation position BPA may be generated in advance based on light reception information obtained by the machining unit 1b in the initial machining state irradiating the optical measuring device 18b with the machining light EL before the calibration operation is performed. Therefore, the machining system SYSb may perform an initial operation to generate information about the reference irradiation position BPA before the calibration operation is performed.

[0231] Specifically, first, the state of the processing unit 1b is set to an initial processing state. The initial processing state of the processing unit 1b may be a state in which the processing unit 1b can actually irradiate a position within the processing shot area PSA with the processing light EL when a galvanometer control signal for controlling the galvanometer mirrors 1313 and 1341 to irradiate a position within the processing shot area PSA with the processing light EL is input to the galvanometer mirrors 1313 and 1341. In other words, the initial processing state of the processing unit 1b may be a state in which the ideal irradiation position PA of the processing light EL indicated by the galvanometer control signal coincides with the actual irradiation position PA of the processing light EL emitted by the processing unit 1b operating based on the galvanometer control signal.

[0232] In this case, to set the state of the machining unit 1b to the initial machining state, the control unit 2 may adjust the sensitivity (drive amount) of at least one of the galvanometer mirrors 1313 and 1341 to the galvanometer control signal. Note that, if the irradiation optical system 135 is replaceable as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to the galvanometer control signal for each irradiation optical system 135. For example, if a first irradiation optical system 135 is attached to the machining head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to a first sensitivity corresponding to the first irradiation optical system 135. For example, if a second irradiation optical system 135 different from the first irradiation optical system 135 is attached to the machining head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to a second sensitivity corresponding to the second irradiation optical system 135. Alternatively, even if the irradiation optical system 135 is replaceable as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to the galvanometer control signal to a predetermined sensitivity common to multiple irradiation optical systems 135.

[0233] At the same time, the measurement drive system 191b moves the optical measurement device 18b to the calibration position CP1 under the control of the control unit 2. Furthermore, the head drive system 141 moves the machining head 13 under the control of the control unit 2 to a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the machining light EL. In this case, the control unit 2 may acquire initial position information regarding the relative positional relationship between the optical measurement device 18b and at least one of the machining head 13 and the stage 15. Specifically, the control unit 2 may calculate the relative positional relationship between the optical measurement device 18b and at least one of the machining head 13 and the stage 15 based on the measurement results of at least one of the position measurement devices 142 and 162 and the measurement results of the position measurement device 192b. For example, the control unit 2 may calculate the relative positional relationship between the optical measurement device 18b located at the calibration position CP1 and the machining head 13 located at a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the machining light EL based on the measurement results of the position measurement device 142 and the position measurement device 192b. The control unit 2 may calculate the relative positional relationship between the optical measurement device 18b located at the calibration position CP1 and the stage 15 based on the measurement results of the position measurement device 162 and the position measurement device 192b. The initial position information acquired here may be used to move the optical measurement device 18b to the calibration position CP1 in the calibration operation. The initial position information may be used to move the machining head 13b to a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the machining light EL in the calibration operation. The initial position information may be used to move the stage 15 in the calibration operation. That is, the machining system SYSb may perform the calibration operation based on the initial position information acquired in the initial operation.

[0234] Then, the processing unit 1b irradiates the optical measurement device 18b with the processing light EL. Specifically, the processing unit 1b irradiates the desired search mark 185b formed on the optical measurement device 18b with the processing light EL. As a result, the optical measurement device 18b outputs light reception information indicating the light reception result of the processing light EL passing through the desired search mark 185b. This light reception information includes information regarding the actual irradiation position PA of the processing light EL at the desired position where the desired search mark 185b is located within the processing shot area PSA. As described above, in the processing unit 1b in the initial processing state, the actual irradiation position PA of the processing light EL coincides with the ideal irradiation position PA of the processing light EL. Therefore, the light reception information includes information regarding the ideal irradiation position PA (i.e., the reference irradiation position BPA) of the processing light EL at the desired position where the desired search mark 185b is located within the processing shot area PSA. Therefore, the control unit 2 can generate information regarding the reference irradiation position BPA based on the light reception information acquired during the initial operation. Alternatively, the control unit 2 may use the light reception information acquired by the initial operation as information about the reference irradiation position BPA.

[0235] Even in the initial operation, the processing unit 1b may irradiate the processing light EL to the plurality of search marks 185b formed on the optical measurement device 18b. In this case, the control unit 2 can generate information regarding the ideal irradiation positions PA (i.e., reference irradiation positions BPA) of the processing light EL at the plurality of positions where the plurality of search marks 185b distributed within the processing shot area PSA are respectively located, based on the light reception information acquired by the initial operation.

[0236] The control unit 2 may calculate the distance (in other words, the positional deviation) between the reference irradiation position BPA and the actual irradiation position APA in the direction along the surface of the beam passing member 181b as the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA. In particular, the control unit 2 may calculate the distance between the reference irradiation position BPA and the actual irradiation position APA at each of a plurality of positions within the processed shot area PSA. For example, FIG. 18 shows the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each of a plurality of positions within the processed shot area PSA. Considering that the surface of the beam passing member 181b is a surface along the XY plane, as shown in FIG. 18, the control unit 2 may calculate the distance ΔPx between the reference irradiation position BPA and the actual irradiation position APA in the X-axis direction as the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA. In particular, the control unit 2 may calculate the distance ΔPx at each of a plurality of positions within the processed shot area PSA. Furthermore, the control unit 2 may calculate the distance ΔPy between the reference irradiation position BPA and the actual irradiation position APA in the Y-axis direction as the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA. In particular, the control unit 2 may calculate the distance ΔPy at each of a plurality of positions within the processed shot area PSA.

[0237] 19(a) and 19(b), an example of an operation for calculating the distances ΔPx and ΔPy based on light reception information indicating the light reception result of the processing light EL irradiated on the desired search mark 185b will be described. However, the control unit 2 may calculate the distances ΔPx and ΔPy by performing an operation different from the operation described below.

[0238] 19(a) shows the light reception information (particularly, the pulse signal in which pulse waveforms P1 to P3 appear in sequence) when the actual irradiation position APA and the reference irradiation position BPA coincide. In particular, the upper part of FIG. 19(a) shows the light reception information acquired when the processing light EL is irradiated onto the desired search mark 185b in the initial operation, and the lower part of FIG. 19(a) shows the light reception information acquired when the processing light EL is irradiated onto the same desired search mark 185b in the calibration operation. When the actual irradiation position APA and the reference irradiation position BPA coincide, the timing at which the pulse waveforms P1 to P3 appear in the initial operation coincides with the timing at which the pulse waveforms P1 to P3 appear in the calibration operation.

[0239] 19(b) shows the light reception information (particularly, the pulse signal in which pulse waveforms P1 to P3 appear in sequence) when the actual irradiation position APA and the reference irradiation position BPA are separated along the X-axis direction. In particular, the upper part of FIG. 19(b) shows the light reception information acquired when the processing light EL is irradiated onto the desired search mark 185b in the initial operation, and the lower part of FIG. 19(b) shows the light reception information acquired when the processing light EL is irradiated onto the same desired search mark 185b in the calibration operation. When the actual irradiation position APA and the reference irradiation position BPA are separated along the X-axis direction, the timing at which the pulse waveforms P1 to P3 appear in the initial operation is advanced or delayed by a time Δtx corresponding to the distance ΔPx from the timing at which the pulse waveforms P1 to P3 appear in the calibration operation.

[0240] 19(c) shows the light reception information (particularly, the pulse signal in which pulse waveforms P1 to P3 appear in sequence) when the actual irradiation position APA and the reference irradiation position BPA are separated along the Y-axis direction. In particular, the upper drawing of FIG. 19(c) shows the light reception information acquired when the processing light EL is irradiated on the desired search mark 185b in the initial operation, and the lower drawing of FIG. 19(c) shows the light reception information acquired when the processing light EL is irradiated on the same desired search mark 185b in the calibration operation. When the actual irradiation position APA and the reference irradiation position BPA are separated along the Y-axis direction, the difference between the timing at which the pulse waveform P2 appears in the initial operation and the timing at which the pulse waveform P2 appears in the calibration operation is advanced or delayed by a time Δty corresponding to the distance ΔPy compared to the difference between the timing at which the pulse waveforms P1 and P3 appear in the initial operation and the timing at which the pulse waveforms P1 and P3 appear in the calibration operation.

[0241] Therefore, the control unit 2 may calculate the distance ΔPx based on the time Δtx corresponding to the difference between the timing at which the pulse waveforms P1 to P3 appear in the initial operation and the timing at which the pulse waveforms P1 to P3 appear in the calibration operation. The control unit 2 may calculate the distance ΔPy based on the time Δty corresponding to the difference between the timing at which the pulse waveform P2 appears in the initial operation and the timing at which the pulse waveform P2 appears in the calibration operation, and the difference between the timing at which the pulse waveforms P1 and P3 appear in the initial operation and the timing at which the pulse waveforms P1 and P3 appear in the calibration operation.

[0242] 19 shows an example in which the horizontal axis of the graph indicates the reception timing (i.e., time) of each of the processing light EL and the measurement light ML, but the horizontal axis of the graph may be considered to indicate the respective positions of the processing light EL and the measurement light ML. In other words, the above explanation can be expanded on the assumption that the horizontal axis of the graph shown in FIG. 19 indicates the respective positions of the processing light EL and the measurement light ML.

[0243] (2-3-3-2) Second Specific Example of Irradiation Position Information The control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between a reference irradiation position BMA of the measurement light ML and an actual irradiation position MA of the measurement light ML (hereinafter referred to as the "actual irradiation position AMA"). Specifically, as described above, in order to perform the calibration operation, the machining head 13 irradiates one search mark 185b with the measurement light ML based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so as to irradiate the one search mark 185b with the measurement light ML. The reference irradiation position BMA may be an ideal irradiation position MA of the measurement light ML (in other words, a designed or target irradiation position MA) when the machining head 13 irradiates one search mark 185b with the measurement light ML based on the galvanometer control signal for irradiating the one search mark 185b with the measurement light ML. On the other hand, the actual irradiation position AMA may be the actual irradiation position MA of the measurement light ML when the machining head 13 irradiates the same search mark 185b with the measurement light ML based on the same galvanometer control signal for irradiating the same search mark 185b with the measurement light ML. The light reception information obtained by the calibration operation includes information regarding this actual irradiation position AMA. Therefore, the control unit 2 may calculate the actual irradiation position AMA based on the light reception information. On the other hand, the information regarding the reference irradiation position BMA may be information known to the control unit 2. As a result, the control unit 2 can generate irradiation position information including information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA based on the light reception information and the information regarding the reference irradiation position BMA.

[0244] As described above, when the measurement light ML is sequentially irradiated onto a plurality of search marks 185b distributed within the measurement shot area MSA by the calibration operation, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each of a plurality of different positions within the measurement shot area MSA. Specifically, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each position of the plurality of search marks 185b distributed within the measurement shot area MSA.

[0245] The information about the reference irradiation position BMA may be generated in advance before the calibration operation is performed based on light reception information obtained by the machining unit 1b in the initial measurement state irradiating the optical measurement device 18b with the measurement light ML. Therefore, the machining system SYSb may perform an initial operation for generating information about the reference irradiation position BMA before performing the calibration operation.

[0246] Specifically, first, the state of machining unit 1b is set to an initial measurement state. The initial measurement state of machining unit 1b may be a state in which, when a galvanometer control signal for controlling galvanometer mirrors 1328 and 1341 to irradiate measurement light ML onto a position within measurement shot area MSA is input to galvanometer mirrors 1328 and 1341, machining unit 1b can actually irradiate measurement light ML onto a position within measurement shot area MSA. In other words, the initial measurement state of machining unit 1b may be a state in which the ideal irradiation position MA of measurement light ML indicated by the galvanometer control signal coincides with the actual irradiation position MA of measurement light ML emitted by machining unit 1b operating based on the galvanometer control signal.

[0247] In this case, to set the state of the machining unit 1b to the initial measurement state, the control unit 2 may adjust the sensitivity (drive amount) of at least one of the galvanometer mirrors 1328 and 1341 to the galvanometer control signal. Note that, if the irradiation optical system 135 is replaceable as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to the galvanometer control signal for each irradiation optical system 135. For example, if a first irradiation optical system 135 is attached to the machining head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to a third sensitivity corresponding to the first irradiation optical system 135. For example, if a second irradiation optical system 135 different from the first irradiation optical system 135 is attached to the machining head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to a fourth sensitivity corresponding to the second irradiation optical system 135. Alternatively, even if the irradiation optical system 135 is replaceable as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to the galvanometer control signal to a predetermined sensitivity common to multiple irradiation optical systems 135.

[0248] At the same time, the measurement drive system 191b moves the optical measurement device 18b to the calibration position CP1 under the control of the control unit 2. Furthermore, the head drive system 141 moves the machining head 13 under the control of the control unit 2 to a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the measurement light ML. In this case, the control unit 2 may acquire initial position information regarding the relative positional relationship between the optical measurement device 18b and at least one of the machining head 13 and the stage 15. Specifically, the control unit 2 may calculate the relative positional relationship between the optical measurement device 18b and at least one of the machining head 13 and the stage 15 based on the measurement results of at least one of the position measurement devices 142 and 162 and the measurement result of the position measurement device 192b. For example, the control unit 2 may calculate the relative positional relationship between the optical measurement device 18b located at the calibration position CP1 and the machining head 13 located at a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the measurement light ML, based on the measurement results of the position measurement device 142 and the position measurement device 192b. The control unit 2 may calculate the relative positional relationship between the optical measurement device 18b located at the calibration position CP1 and the stage 15, based on the measurement results of the position measurement device 162 and the position measurement device 192b. The initial position information acquired here may be used to move the optical measurement device 18b to the calibration position CP1 in the calibration operation. The initial position information may be used to move the machining head 13b to a position where the machining head 13 can irradiate the optical measurement device 18b located at the calibration position CP1 with the measurement light ML, based on the measurement results of the position measurement device 142 and the position measurement device 192b. The initial position information may be used to move the stage 15 in the calibration operation. That is, the machining system SYSb may perform the calibration operation based on the initial position information acquired in the initial operation.

[0249] Thereafter, the processing unit 1b irradiates the optical measurement device 18b with the measurement light ML. Specifically, the processing unit 1b irradiates the measurement light ML onto a desired search mark 185b formed on the optical measurement device 18b. As a result, the optical measurement device 18b outputs light reception information indicating the light reception result of the measurement light ML that has passed through the desired search mark 185b. This light reception information includes information regarding the actual irradiation position MA of the measurement light ML at the desired position where the desired search mark 185b is located within the measurement shot area MSA. As described above, in the processing unit 1b in the initial measurement state, the actual irradiation position MA of the measurement light ML and the ideal irradiation position MA of the measurement light ML coincide with each other. Therefore, the light reception information includes information regarding the ideal irradiation position MA (i.e., the reference irradiation position BMA) of the measurement light ML at the desired position where the desired search mark 185b is located within the measurement shot area MSA. Therefore, the control unit 2 can generate information regarding the reference irradiation position BMA based on the light reception information acquired by the initial operation. Alternatively, the control unit 2 may use the light reception information acquired by the initial operation as information about the reference irradiation position BMA.

[0250] Even in the initial operation, the processing unit 1b may irradiate the measurement light ML to the plurality of search marks 185b formed on the optical measurement device 18b. In this case, the control unit 2 can generate information regarding the ideal irradiation positions MA (i.e., reference irradiation positions BMA) of the measurement light ML at the plurality of positions where the plurality of search marks 185b distributed within the measurement shot area MSA are respectively located, based on the light reception information acquired by the initial operation.

[0251] The control unit 2 may calculate the distance (in other words, the positional deviation) between the reference irradiation position BMA and the actual irradiation position AMA in a direction along the surface of the beam passing member 181b as the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the distance between the reference irradiation position BMA and the actual irradiation position AMA at each of a plurality of positions within the measurement shot area MSA. For example, FIG. 20 shows the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each of a plurality of positions within the measurement shot area MSA. Considering that the surface of the beam passing member 181b is a surface along the XY plane, as shown in FIG. 20, the control unit 2 may calculate the distance ΔMx between the reference irradiation position BMA and the actual irradiation position AMA in the X-axis direction as the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the distance ΔMx at each of a plurality of positions within the measurement shot area MSA. Furthermore, the control unit 2 may calculate the distance ΔMy between the reference irradiation position BMA and the actual irradiation position AMA in the Y-axis direction as the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the distance ΔMy at each of a plurality of positions within the measurement shot area MSA.

[0252] The control unit 2 may calculate the distances ΔMx and ΔMy based on the light reception information indicating the result of receiving the measurement light ML by performing an operation similar to the operation of calculating the distances ΔPx and ΔPy based on the light reception information indicating the result of receiving the processing light EL. In other words, the description of an example of the operation of calculating the distances ΔPx and ΔPy based on the light reception information indicating the result of receiving the processing light EL described above can be reused as an example of the operation of calculating the distances ΔMx and ΔMy based on the light reception information indicating the result of receiving the measurement light ML by replacing the terms "actual irradiation position APA," "reference irradiation position BPA," "processing light EL," "distance ΔPx," and "distance ΔPy" with the terms "actual irradiation position AMA," "reference irradiation position BMA," "measurement light ML," "distance ΔMx," and "distance ΔMy," respectively. Therefore, the description of an example of the operation of calculating the distances ΔMx and ΔMy based on the light reception information indicating the result of receiving the measurement light ML will be omitted.

[0253] (2-3-3-3) Third Specific Example of Irradiation Position Information When the processing head 13 irradiates the same search mark 185b with the processing light EL and the measurement light ML, the control unit 2 may generate, as irradiation position information, information regarding the relative positional relationship between the actual irradiation position APA of the processing light EL and the actual irradiation position AMA of the measurement light ML. Specifically, the light reception information obtained by the processing head 13 irradiating one search mark 185b with the processing light EL includes information regarding the actual irradiation position APA of the processing light EL irradiated onto the one search mark 185b. Similarly, the light reception information obtained by the processing head 13 irradiating one search mark 185b with the measurement light ML includes information regarding the actual irradiation position AMA of the measurement light ML irradiated onto the one search mark 185b. Therefore, the control unit 2 can generate irradiation position information including information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA based on the light reception information.

[0254] When the processing light EL and the measurement light ML are sequentially irradiated onto the plurality of search marks 185 b by the calibration operation as described above, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each of a plurality of different positions in at least one of the processing shot area PSA and the measurement shot area MSA. Specifically, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each position of the plurality of search marks 185 b distributed in at least one of the processing shot area PSA and the measurement shot area MSA.

[0255] The control unit 2 may calculate the distance between the actual irradiation position APA and the actual irradiation position APA in a direction along the surface of the beam passing member 181b (in other words, the positional deviation) as the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the distance between the actual irradiation position APA and the actual irradiation position AMA at each of a plurality of positions within at least one of the processing shot area PSA and the measurement shot area MSA. For example, FIG. 21 shows the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each of a plurality of positions within at least one of the processing shot area PSA and the measurement shot area MSA. Considering that the surface of the beam passing member 181b is a surface along the XY plane, as shown in FIG. 21, the control unit 2 may calculate the distance ΔPMx between the actual irradiation position APA and the actual irradiation position AMA in the X-axis direction as the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the distance ΔPMx at each of a plurality of positions in at least one of the processing shot area PSA and the measurement shot area MSA. Furthermore, the control unit 2 may calculate the distance ΔPMy between the actual irradiation position APA and the actual irradiation position AMA in the Y-axis direction as the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the distance ΔPMy at each of a plurality of positions in at least one of the processing shot area PSA and the measurement shot area MSA.

[0256] Below, referring to Figures 22(a) and 22(b), we will explain an example of an operation for calculating distances ΔPMx and ΔPMy based on light reception information indicating the respective light reception results of the processing light EL and measurement light ML irradiated onto the desired search mark 185b.

[0257] 22(a) shows the light reception information (particularly, the pulse signal in which pulse waveforms P1 to P3 appear in order) when the actual irradiation position APA and the actual irradiation position AMA coincide. In particular, the upper drawing of FIG. 22(a) shows the light reception information acquired when the desired search mark 185b is irradiated with the processing light EL, and the lower drawing of FIG. 22(a) shows the light reception information acquired when the same desired search mark 185b is irradiated with the measurement light ML. When the actual irradiation position APA and the actual irradiation position AMA coincide, the timing at which the pulse waveforms P1 to P3 appear in the light reception result of the processing light EL coincides with the timing at which the pulse waveforms P1 to P3 appear in the light reception result of the measurement light ML.

[0258] 22(b) shows the light reception information (particularly, the pulse signal in which pulse waveforms P1 to P3 appear in sequence) when the actual irradiation positions APA and AMA are separated along the X-axis direction. In particular, the upper drawing in FIG. 22(b) shows the light reception information acquired when the desired search mark 185b is irradiated with the processing light EL, and the lower drawing in FIG. 22(b) shows the light reception information acquired when the same desired search mark 185b is irradiated with the measurement light ML. When the actual irradiation positions APA and AMA are separated along the X-axis direction, the timing at which the pulse waveforms P1 to P3 appear in the light reception result of the processing light EL is advanced or delayed by a time Δtx corresponding to the distance ΔPMx from the timing at which the pulse waveforms P1 to P3 appear in the light reception result of the measurement light ML.

[0259] 22(c) shows the light reception information (particularly, the pulse signal in which pulse waveforms P1 to P3 appear in sequence) when the actual irradiation position APA and the actual irradiation position AMA are separated along the Y-axis direction. In particular, the upper drawing of FIG. 22(c) shows the light reception information acquired when the desired search mark 185b is irradiated with the processing light EL, and the lower drawing of FIG. 22(c) shows the light reception information acquired when the same desired search mark 185b is irradiated with the measurement light ML. When the actual irradiation position APA and the actual irradiation position AMA are separated along the Y-axis direction, the difference between the timing at which the pulse waveform P2 appears in the light reception result of the processing light EL and the timing at which the pulse waveform P2 appears in the light reception result of the measurement light ML is advanced or delayed by a time Δty corresponding to the distance ΔPMy compared to the difference between the timing at which the pulse waveforms P1 and P3 appear in the light reception result of the processing light EL and the timing at which the pulse waveforms P1 and P3 appear in the light reception result of the measurement light ML.

[0260] For this reason, the control unit 2 may calculate the distance ΔPMx based on a time Δtx corresponding to the difference between the timing at which pulse waveforms P1 to P3 appear in the reception result of the processing light EL and the timing at which pulse waveforms P1 to P3 appear in the reception result of the measurement light ML. The control unit 2 may calculate the distance ΔPMy based on a time Δty corresponding to the difference between the timing at which pulse waveform P2 appears in the reception result of the processing light EL and the timing at which pulse waveform P2 appears in the reception result of the measurement light ML, and the difference between the timing at which pulse waveforms P1 and P3 appear in the reception result of the processing light EL and the timing at which pulse waveforms P1 and P3 appear in the reception result of the measurement light ML.

[0261] (2-3-4) Calibration of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the irradiation position information.Then, the control unit 2 calibrates (in other words, controls or adjusts) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the irradiation position information.

[0262] (2-3-4-1) Calibration of the irradiation position PA of the processing light EL based on irradiation position information regarding the relative positional relationship between the reference irradiation position BPA of the processing light EL and the actual irradiation position APA of the processing light EL. For example, if the irradiation position information includes information regarding the relative positional relationship between the reference irradiation position BPA of the processing light EL and the actual irradiation position APA of the processing light EL, the control unit 2 may calibrate the irradiation position PA of the processing light EL based on the irradiation position information. Specifically, the control unit 2 may control a position change device that can change the irradiation position PA of the processing light EL based on the irradiation position information so that the irradiation position PA of the processing light EL becomes the desired first irradiation position. Note that an example of a position change device that can change the irradiation position PA of the processing light EL is at least one of the galvanometer mirrors 1313 and 1341 that can change the irradiation position PA of the processing light EL. Therefore, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 based on the irradiation position information so that the irradiation position PA of the processing light EL becomes the desired first irradiation position.

[0263] As an example, the control unit 2 may calibrate the irradiation position PA of the processing light EL so that the actual irradiation position APA approaches the reference irradiation position BPA compared to before the calibration of the irradiation position PA of the processing light EL. That is, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 so that the actual irradiation position APA approaches the reference irradiation position BPA compared to before the calibration of the irradiation position PA of the processing light EL. Specifically, the control unit 2 may calibrate the irradiation position PA of the processing light EL so that the actual irradiation position APA, at which the processing light EL is actually irradiated, approaches the reference irradiation position BPA based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 so that the processing light EL is irradiated at the reference irradiation position BPA. In other words, the control unit 2 may calibrate the irradiation position PA of the processing light EL so that the actual irradiation position APA where the processing light EL is actually irradiated approaches the desired position based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 so as to irradiate the processing light EL at the desired position.

[0264] In this case, the control unit 2 may calibrate the irradiation position PA of the processing light EL at each of the multiple positions in the processing shot area PSA based on information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each of the multiple positions in the processing shot area PSA so that the actual irradiation position APA approaches the reference irradiation position BPA at each of the multiple positions in the processing shot area PSA. In other words, the control unit 2 may calibrate the irradiation position PA of the processing light EL at a position in the processing shot area PSA based on information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at a position in the processing shot area PSA so that the actual irradiation position APA approaches the reference irradiation position BPA at that position in the processing shot area PSA.

[0265] As another example, the control unit 2 may calibrate the irradiation position PA of the processing light EL so that the actual irradiation position APA coincides with the reference irradiation position BPA. That is, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 so that the actual irradiation position APA coincides with the reference irradiation position BPA. Specifically, the control unit 2 may calibrate the irradiation position PA of the processing light EL so that the reference irradiation position BPA is actually irradiated with the processing light EL based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 so that the processing light EL is irradiated with the reference irradiation position BPA. In other words, the control unit 2 may calibrate the irradiation position PA of the processing light EL so that the desired position is actually irradiated with the processing light EL based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 so that the processing light EL is irradiated with the desired position.

[0266] In this case, the control unit 2 may calibrate the irradiation position PA of the processing light EL at each of the multiple positions in the processing shot area PSA based on information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each of the multiple positions in the processing shot area PSA so that the actual irradiation position APA at each of the multiple positions in the processing shot area PSA coincides with the reference irradiation position BPA. In other words, the control unit 2 may calibrate the irradiation position PA of the processing light EL at a position in the processing shot area PSA based on information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at a position in the processing shot area PSA so that the actual irradiation position APA at a position in the processing shot area PSA coincides with the reference irradiation position BPA.

[0267] (2-3-4-2) Calibration of the irradiation position MA of the measurement light ML based on irradiation position information related to the relative positional relationship between the reference irradiation position BMA of the measurement light ML and the actual irradiation position AMA of the measurement light ML For example, when the irradiation position information includes information related to the relative positional relationship between the reference irradiation position BMA of the measurement light ML and the actual irradiation position AMA of the measurement light ML, the control unit 2 may calibrate the irradiation position MA of the measurement light ML based on the irradiation position information. Specifically, the control unit 2 may control a position changing device capable of changing the irradiation position MA of the measurement light ML based on the irradiation position information so that the irradiation position MA of the measurement light ML becomes the desired second irradiation position. Note that an example of a position changing device capable of changing the irradiation position MA of the measurement light ML is at least one of the galvanometer mirrors 1328 and 1341 capable of changing the irradiation position MA of the measurement light ML. Therefore, the control unit 2 may control at least one of the galvanometer mirrors 1328 and 1341 based on the irradiation position information so that the irradiation position MA of the measurement light ML becomes the desired second irradiation position.

[0268] As an example, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the actual irradiation position AMA approaches the reference irradiation position BMA compared to before the calibration of the irradiation position MA of the measurement light ML. That is, the control unit 2 may control at least one of the galvanometer mirrors 1328 and 1341 so that the actual irradiation position AMA approaches the reference irradiation position BMA compared to before the calibration of the irradiation position MA of the measurement light ML. Specifically, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the actual irradiation position AMA, where the measurement light ML is actually irradiated, approaches the reference irradiation position BMA based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so as to irradiate the measurement light ML at the reference irradiation position BMA. In other words, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the actual irradiation position AMA where the measurement light ML is actually irradiated approaches the desired position based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so as to irradiate the measurement light ML at the desired position.

[0269] In this case, the control unit 2 may calibrate the irradiation position MA of the measurement light ML at each of the multiple positions in the measurement shot area MSA based on information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each of the multiple positions in the measurement shot area MSA so that the actual irradiation position AMA approaches the reference irradiation position BMA at each of the multiple positions in the measurement shot area MSA. In other words, the control unit 2 may calibrate the irradiation position MA of the measurement light ML at a position in the measurement shot area MSA based on information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at a position in the measurement shot area MSA so that the actual irradiation position AMA approaches the reference irradiation position BMA at that position in the measurement shot area MSA.

[0270] As another example, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the actual irradiation position AMA coincides with the reference irradiation position BMA. That is, the control unit 2 may control at least one of the galvanometer mirrors 1328 and 1341 so that the actual irradiation position AMA coincides with the reference irradiation position BMA. Specifically, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the measurement light ML is actually irradiated at the reference irradiation position BMA based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so that the measurement light ML is irradiated at the reference irradiation position BMA. In other words, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the measurement light ML is actually irradiated at the desired position based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so that the measurement light ML is irradiated at the desired position.

[0271] In this case, the control unit 2 may calibrate the irradiation position PA of the measurement light ML at each of the multiple positions in the measurement shot area MSA based on information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each of the multiple positions in the measurement shot area MSA so that the actual irradiation position AMA coincides with the reference irradiation position BMA at each of the multiple positions in the measurement shot area MSA. In other words, the control unit 2 may calibrate the irradiation position MA of the measurement light ML at a position in the measurement shot area MSA based on information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at a position in the measurement shot area MSA so that the actual irradiation position AMA coincides with the reference irradiation position BMA at that position in the measurement shot area MSA.

[0272] (2-3-4-3) Calibration of at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on irradiation position information regarding the relative positional relationship between the actual irradiation position APA of the processing light EL and the actual irradiation position AMA of the measurement light ML. For example, if the irradiation position information includes information regarding the relative positional relationship between the actual irradiation position APA of the processing light EL and the actual irradiation position AMA of the measurement light ML, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the irradiation position information. Specifically, the control unit 2 may control a position changing device that can change at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the irradiation position information so that the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML becomes a predetermined positional relationship. For example, the control unit 2 may control at least one of the galvanometer mirrors 1313, 1328, and 1341 based on the irradiation position information so that the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML becomes a predetermined positional relationship.

[0273] As an example, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML so that the actual irradiation position APA of the processing light EL approaches the actual irradiation position AMA of the measurement light ML compared to before the calibration of at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML. In other words, the control unit 2 may control at least one of the galvanometer mirrors 1313, 1328, and 1341 so that the actual irradiation position APA of the processing light EL approaches the actual irradiation position AMA of the measurement light ML compared to before the calibration of at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML. Specifically, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML so that the actual irradiation position APA where the processing light EL is actually irradiated based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL at the desired position approaches the actual irradiation position AMA where the measurement light ML is actually irradiated based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measurement light ML at the same desired position.

[0274] In this case, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL at each of the plurality of positions in the processing shot area PSA and the irradiation position MA of the measurement light ML at each of the plurality of positions in the measurement shot area MSA, based on information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each of the plurality of positions in the processing shot area PSA and the measurement shot area MSA. In other words, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL at a position in the processing shot area PSA and the irradiation position MA of the measurement light ML at a position in the measurement shot area MSA, based on information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at a position in the processing shot area PSA and the measurement shot area MSA, based on information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at a position in the processing shot area PSA and the measurement shot area MSA.

[0275] As another example, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML so that the actual irradiation position APA of the processing light EL coincides with the actual irradiation position AMA of the measurement light ML. That is, the control unit 2 may control at least one of the galvanometer mirrors 1313, 1328, and 1341 so that the actual irradiation position APA of the processing light EL coincides with the actual irradiation position AMA of the measurement light ML. Specifically, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML so that the actual irradiation position APA at which the processing light EL is actually irradiated based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL at a desired position coincides with the actual irradiation position AMA at which the measurement light ML is actually irradiated based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measurement light ML at the same desired position.

[0276] In this case, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL at each of the plurality of positions in the processing shot area PSA and the irradiation position MA of the measurement light ML at each of the plurality of positions in the measurement shot area MSA, based on information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each of the plurality of positions in the processing shot area PSA and the measurement shot area MSA, so that the actual irradiation position APA coincides with the actual irradiation position AMA at each of the plurality of positions in the processing shot area PSA and the measurement shot area MSA. In other words, the control unit 2 may calibrate at least one of the irradiation position PA of the processing light EL at a position in the processing shot area PSA and the irradiation position MA of the measurement light ML at a position in the measurement shot area MSA, based on information regarding the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at a position in the processing shot area PSA and the measurement shot area MSA, so that the actual irradiation position APA coincides with the actual irradiation position AMA at the position in the processing shot area PSA and the measurement shot area MSA.

[0277] (2-3-5) Timing of Calibration Operation The machining system SYSb may perform the calibration operation before starting machining of the workpiece W. The machining system SYSb may perform the calibration operation before starting measurement of the measurement object M. The machining system SYSb may perform the calibration operation after completing machining of the workpiece W. The machining system SYSb may perform the calibration operation after completing measurement of the measurement object M. The machining system SYSb may perform the calibration operation after starting machining of the workpiece W and before completing machining of the workpiece W. In other words, the machining system SYSb may perform the calibration operation during at least a part of the machining period in which the workpiece W is being machined. The machining system SYSb may perform the calibration operation after starting measurement of the measurement object M and before completing measurement of the measurement object M. In other words, the machining system SYSb may perform the calibration operation during at least a part of the measurement period in which the measurement object M is being measured.

[0278] If the irradiation position PA of the processing light EL has not changed, there is not necessarily a high need to perform the above-mentioned calibration operation to calibrate the irradiation position PA of the processing light EL. On the other hand, if the irradiation position PA of the processing light EL has changed, there is a high need to perform the above-mentioned calibration operation to calibrate the irradiation position PA of the processing light EL. Therefore, the processing system SYSb may perform a calibration operation to calibrate the irradiation position PA of the processing light EL when it is assumed that the irradiation position PA of the processing light EL has changed.

[0279] As an example, the irradiation position PA of the processing light EL may change over time. For example, when the processing system SYSb starts operating, the temperature of the optical systems included in the processing system SYSb (specifically, at least one of the processing optical system 131, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135 used to irradiate the workpiece W with the processing light EL) may fluctuate over time. As a result, the irradiation position PA of the processing light EL may change due to fluctuations in the temperature of the optical systems of the processing system SYSb. For this reason, the processing system SYSb may perform a calibration operation to calibrate the irradiation position PA of the processing light EL when a predetermined time or more has elapsed since the previous calibration operation to calibrate the irradiation position PA of the processing light EL was performed.

[0280] As another example, the processing system SYSb may detect the temperature of the optical system of the processing system SYSb (particularly, the optical system used to irradiate the measurement object M with the processing light EL), and perform a calibration operation to calibrate the irradiation position PA of the processing light EL when a fluctuation in the detected temperature exceeds a predetermined temperature threshold. In this case, the processing system SYSb may include a temperature sensor for detecting the temperature of the optical system of the processing system SYSb. Note that, if the irradiation optical system 135 is replaceable, the temperature sensor for detecting the temperature of the irradiation optical system 135 may be disposed in the head housing 137 that houses the irradiation optical system 135. In this case, the detection result of the temperature sensor may be output to the control unit 2 via a signal contact formed in the head housing 137. Specifically, the detection result of the temperature sensor may be output to the control unit 2 via an output signal line formed by a first signal contact formed in the head housing 137 and a second signal contact formed in the mounting adapter 138 and in electrical contact with the first signal contact.

[0281] As another example, if the irradiation optical system 135 is replaceable, the irradiation position of the processing light EL may change when the irradiation optical system 135 is replaced. This is because the optical characteristics of the irradiation optical system 135 removed from the processing head 13 due to replacement of the irradiation optical system 135 (i.e., the irradiation optical system 135 before replacement) are not necessarily the same as the optical characteristics of the irradiation optical system 135 newly attached to the processing head 13 due to replacement of the irradiation optical system 135 (i.e., the irradiation optical system 135 after replacement). For this reason, the processing system SYSb may perform a calibration operation to calibrate the irradiation position PA of the processing light EL when the irradiation optical system 135 is replaced.

[0282] In the calibration operation performed when the irradiation optical system 135 is replaced, the actual irradiation position APA of the processing light EL before the irradiation optical system 135 is replaced may be used as the reference irradiation position BPA of the processing light EL. In this case, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the actual irradiation position APA of the processing light EL before the irradiation optical system 135 is replaced and the actual irradiation position APA of the processing light EL after the irradiation optical system 135 is replaced. The control unit 2 may calibrate the irradiation position PA of the processing light EL so that the actual irradiation position APA of the processing light EL after the irradiation optical system 135 is replaced approaches the actual irradiation position APA of the processing light EL before the irradiation optical system 135 is replaced. The control unit 2 may calibrate the irradiation position PA of the processing light EL so that the actual irradiation position APA of the processing light EL after the irradiation optical system 135 is replaced coincides with the actual irradiation position APA of the processing light EL before the irradiation optical system 135 is replaced.

[0283] The irradiation position information regarding the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA may be considered to be equivalent to information regarding the change in the actual irradiation position APA relative to the reference irradiation position BPA. In this case, the control unit 2 may be considered to calculate (acquire) information regarding the change in the irradiation position PA of the processing light EL as the irradiation position information regarding the irradiation position PA of the processing light EL.

[0284] Similarly, if the irradiation position MA of the measurement light ML has not changed, there is not necessarily a high need to perform the above-described calibration operation to calibrate the irradiation position MA of the measurement light ML. On the other hand, if the irradiation position MA of the measurement light ML has changed, there is a high need to perform the above-described calibration operation to calibrate the irradiation position MA of the measurement light ML. For this reason, the machining system SYSb may perform a calibration operation to calibrate the irradiation position MA of the measurement light ML when it is assumed that the irradiation position MA of the measurement light ML has changed.

[0285] As an example, the irradiation position MA of the measurement light ML may change over time. For example, when the processing system SYSb starts operating, the temperature of the optical systems included in the processing system SYSb (specifically, at least one of the measurement optical system 132, the combining optical system 133, the deflection optical system 134, and the irradiation optical system 135, which are used to irradiate the measurement object M with the measurement light ML) may fluctuate over time. As a result, the irradiation position MA of the measurement light ML may change due to fluctuations in the temperature of the optical systems of the processing system SYSb. For this reason, the processing system SYSb may perform a calibration operation to calibrate the irradiation position MA of the measurement light ML when a predetermined time or more has elapsed since the previous calibration operation to calibrate the irradiation position MA of the measurement light ML was performed.

[0286] As another example, the processing system SYSb may detect the temperature of the optical system of the processing system SYSb (particularly, the optical system used to irradiate the measurement object M with the measurement light ML), and when the amount of change in the detected temperature exceeds a predetermined temperature threshold, perform a calibration operation to calibrate the irradiation position MA of the measurement light ML. In this case, the processing system SYSb may include a temperature sensor for detecting the temperature of the optical system of the processing system SYSb.

[0287] As another example, if the irradiation optical system 135 is replaceable, the irradiation position of the measurement light ML may change when the irradiation optical system 135 is replaced. This is because the optical characteristics of the irradiation optical system 135 removed from the machining head 13 due to replacement of the irradiation optical system 135 (i.e., the irradiation optical system 135 before replacement) are not necessarily the same as the optical characteristics of the irradiation optical system 135 newly attached to the machining head 13 due to replacement of the irradiation optical system 135 (i.e., the irradiation optical system 135 after replacement). For this reason, when the irradiation optical system 135 is replaced, the machining system SYSb may perform a calibration operation to calibrate the irradiation position MA of the measurement light ML.

[0288] In addition, in the calibration operation performed when the irradiation optical system 135 is replaced, the actual irradiation position AMA of the measurement light ML before the irradiation optical system 135 is replaced may be used as the reference irradiation position BMA of the measurement light ML. In this case, the control unit 2 may generate, as the irradiation position information, information regarding the relative positional relationship between the actual irradiation position AMA of the measurement light ML before the irradiation optical system 135 is replaced and the actual irradiation position AMA of the measurement light ML after the irradiation optical system 135 is replaced. Furthermore, the control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the actual irradiation position AMA of the measurement light ML after the irradiation optical system 135 is replaced approaches the actual irradiation position AMA of the measurement light ML before the irradiation optical system 135 is replaced. The control unit 2 may calibrate the irradiation position MA of the measurement light ML so that the actual irradiation position AMA of the measurement light ML after the irradiation optical system 135 is replaced coincides with the actual irradiation position AMA of the measurement light ML before the irradiation optical system 135 is replaced.

[0289] The irradiation position information regarding the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA may be considered to be equivalent to information regarding a change in the actual irradiation position AMA relative to the reference irradiation position BMA. In this case, the control unit 2 may be considered to have calculated (acquired) information regarding a change in the irradiation position MA of the measurement light ML as irradiation position information regarding the irradiation position MA of the measurement light ML.

[0290] (2-4) Technical Effects of the Machining System SYSb As described above, the machining system SYSb of the second embodiment can perform a calibration operation using the optical measurement device 18b. That is, the machining system SYSb can calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML. Therefore, the machining system SYSb can appropriately irradiate the processing light EL at an appropriate position. As a result, the machining system SYSb can appropriately machine the workpiece W. Furthermore, the machining system SYSb can appropriately irradiate the measurement light ML at an appropriate position. As a result, the machining system SYSb can appropriately measure the measurement object M.

[0291] (3) Machining System SYSc of Third Embodiment Next, the machining system SYS in the third embodiment will be described. Note that in the following description, the machining system SYS in the third embodiment will be referred to as the "machining system SYSc." The machining system SYSc in the third embodiment differs from each of the machining systems SYSa in the first embodiment to SYSb in the second embodiment in that it includes a machining unit 1c instead of the machining unit 1 or 1b. Other features of the machining system SYSc may be the same as other features of each of the machining systems SYSa to SYSb. The machining unit 1c differs from each of the machining units 1 or 1b in that it includes a machining head 13c instead of the machining head 13. Other features of the machining unit 1c may be the same as other features of the machining unit 1 or 1b. Therefore, in the following description, the configuration of the machining head 13c in the third embodiment will be described with reference to FIG. 23. FIG. 23 is a cross-sectional view showing the configuration of the machining head 13c in the third embodiment.

[0292] 23 , the processing head 13c differs from the processing head 13 in that it includes a processing optical system 131c instead of the processing optical system 131. Other features of the processing head 13c may be the same as other features of the processing head 13.

[0293] The processing optical system 131c differs from the processing optical system 131 in that it further includes a focus control optical system 1314c. Other features of the processing optical system 131c may be the same as those of the processing optical system 131. The focus control optical system 1314c is an optical system that can adjust (in other words, change) the focusing position of the processing light EL. Specifically, the focus control optical system 1314c is an optical system that can adjust the focusing position of the processing light EL along the irradiation direction of the processing light EL (e.g., the Z-axis direction). For this reason, the focus control optical system 1314c includes a focus lens 1315c that can change the focusing position of the processing light EL. Note that the focus lens 1315c may also be referred to as a focusing position adjustment optical system.

[0294] Here, in the third embodiment, as in the first or second embodiment described above, the irradiation optical system 135 is replaceable. In this case, replacement of the irradiation optical system 135 may cause a change in the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML. In particular, replacement of the irradiation optical system 135 may cause a change in the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML in the Z-axis direction, which is the irradiation direction of the processing light EL (or the irradiation direction of the measurement light ML). As a result, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML may become different from the desired positional relationship. For example, while the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML was the desired positional relationship before the irradiation optical system 135 was replaced, after the irradiation optical system 135 was replaced, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML may become different from the desired positional relationship. In other words, when the irradiation optical system 135 attached to the machining head 13 is replaced from the first irradiation optical system 135 to the second irradiation optical system 135, while the relative positional relationship between the focusing positions of the processing light EL and the measurement light ML emitted from the first irradiation optical system 135 is the desired positional relationship, the relative positional relationship between the focusing positions of the processing light EL and the measurement light ML emitted from the second irradiation optical system 135 may become a positional relationship different from the desired positional relationship. An example of the desired positional relationship is a positional relationship in which the focusing position of the processing light EL and the focusing position of the measurement light ML coincide in the Z-axis direction. In other words, an example of the desired positional relationship is a positional relationship in which the focusing position of the processing light EL and the focusing position of the measurement light ML are located at the same position in the Z-axis direction.

[0295] If the relative positional relationship between the focusing positions of the processing light EL and the measurement light ML is different from the desired positional relationship, for example, the processing system SYSc may process the workpiece W using the processing light EL whose focusing position is located on the surface of the workpiece W, while measuring the workpiece W using the measurement light ML whose focusing position is not located on the surface of the workpiece W (i.e., measurement light ML in a defocused state). As a result, the processing system SYSc has a technical problem of being unable to properly measure the workpiece W (or any measurement object M). As an example, the processing system SYSc has a technical problem of degraded measurement accuracy. Alternatively, for example, the processing system SYSc may process the workpiece W using the processing light EL whose focusing position is not located on the surface of the workpiece W (i.e., processing light EL in a defocused state), while measuring the workpiece W using the processing light EL whose focusing position is located on the surface of the workpiece W. As a result, the processing system SYSc has a technical problem of being unable to properly process the workpiece W. As an example, the processing system SYSc has a technical problem of degraded processing accuracy.

[0296] Therefore, in the third embodiment, in order to solve such technical problems, the focus control optical system 1314c includes a plurality of focus lenses 1315c, particularly, the focus control optical system 1314c includes a plurality of focus lenses 1315c having different focal lengths.

[0297] The first focus lens 1315c of the multiple focus lenses 1315c is used as a single focus lens 1315c for actually adjusting the focusing position of the processing light EL when the first irradiation optical system 135 of the multiple irradiation optical systems 135 that can be attached to the processing head 13 is attached to the processing head 13. Therefore, when the first irradiation optical system 135 is attached to the processing head 13, the first focus lens 1315c is located on the optical path of the processing light EL. On the other hand, the other focus lenses 1315c different from the first focus lens 1315c of the multiple focus lenses 1315c are not located on the optical path of the processing light EL. In other words, the other focus lenses 1315c are retracted from the optical path of the processing light EL.

[0298] The first focus lens 1315c may be capable of adjusting the focusing position of the processing light EL so that a desired relative positional relationship exists between the focusing position of the processing light EL and the focusing position of the measurement light ML when the first irradiation optical system 135 is attached to the machining head 13. When the desired positional relationship is one in which the focusing position of the processing light EL and the focusing position of the measurement light ML coincide in the Z-axis direction as described above, the first focus lens 1315c may be capable of adjusting the focusing position of the processing light EL so that the distance (i.e., positional deviation) between the focusing position of the processing light EL and the focusing position of the measurement light ML in the Z-axis direction when the first irradiation optical system 135 is attached to the machining head 13 is smaller than when another focus lens 1315c different from the first focus lens 1315c is positioned on the optical path of the processing light EL. Alternatively, the first focus lens 1315c may be capable of adjusting the focusing position of the processing light EL so that the focusing position of the processing light EL coincides with the focusing position of the measurement light ML in the Z-axis direction when the first irradiation optical system 135 is attached to the processing head 13.

[0299] On the other hand, the second focus lens 1315c, which is different from the first focus lens 1315c among the multiple focus lenses 1315c, is used as one focus lens 1315c for actually adjusting the focusing position of the processing light EL when a second irradiation optical system 135, which is different from the first irradiation optical system 135 among the multiple irradiation optical systems 135 that can be attached to the processing head 13, is attached to the processing head 13. Therefore, when the second irradiation optical system 135 is attached to the processing head 13, the second focus lens 1315c is located on the optical path of the processing light EL. On the other hand, the other focus lenses 1315c, which are different from the second focus lens 1315c among the multiple focus lenses 1315c, are not located on the optical path of the processing light EL. In other words, the other focus lenses 1315c are retracted from the optical path of the processing light EL.

[0300] The second focus lens 1315c may be capable of adjusting the focusing position of the processing light EL so that a desired relative positional relationship exists between the focusing position of the processing light EL and the focusing position of the measurement light ML when the second irradiation optical system 135 is attached to the machining head 13. When the desired positional relationship is one in which the focusing position of the processing light EL and the focusing position of the measurement light ML coincide in the Z-axis direction as described above, the second focus lens 1315c may be capable of adjusting the focusing position of the processing light EL so that the distance (i.e., positional deviation) between the focusing position of the processing light EL and the focusing position of the measurement light ML in the Z-axis direction when the second irradiation optical system 135 is attached to the machining head 13 is smaller than when another focusing lens 1315c different from the second focus lens 1315c is positioned on the optical path of the processing light EL. The second focus lens 1315c may be capable of adjusting the focusing position of the processing light EL so that the focusing position of the processing light EL coincides with the focusing position of the measurement light ML in the Z-axis direction when the second irradiation optical system 135 is attached to the processing head 13.

[0301] The multiple focus lenses 1315c may correspond to the multiple irradiation optical systems 135 that can be attached to the processing head 13, respectively. In other words, the multiple focus lenses 1315c may correspond one-to-one to the multiple irradiation optical systems 135 that can be attached to the processing head 13. In other words, the number of focus lenses 1315c included in the focus control optical system 1314c may be the same as the number of irradiation optical systems 135 that can be attached to the processing head 13. However, the number of focus lenses 1315c included in the focus control optical system 1314c does not have to be the same as the number of irradiation optical systems 135 that can be attached to the processing head 13.

[0302] The control unit 2 may identify the type of irradiation optical system 135 attached to the machining head 13 and, based on the identified type, select one focus lens 1315c from the plurality of focus lenses 1315c for actually adjusting the focusing position of the processing light EL. For example, if the control unit 2 identifies that the type of irradiation optical system 135 attached to the machining head 13 is the first irradiation optical system 135, it may select from the plurality of focus lenses 1315c a first focus lens 1315c corresponding to the first irradiation optical system 135 as the one focus lens 1315c for actually adjusting the focusing position of the processing light EL. For example, if the control unit 2 identifies that the type of irradiation optical system 135 attached to the machining head 13 is the second irradiation optical system 135, it may select from the plurality of focus lenses 1315c a second focus lens 1315c corresponding to the second irradiation optical system 135 as the one focus lens 1315c for actually adjusting the focusing position of the processing light EL. Thereafter, the control unit 2 may control the focus control optical system 1314 so that the selected focus lens 1315c is positioned on the optical path of the processing light EL, while the other unselected focus lenses 1315c are retracted from the optical path of the processing light EL.

[0303] In order to identify the type of the irradiation optical system 135 attached to the machining head 13, the irradiation optical system 135 may output information capable of identifying the type of the irradiation optical system 135 (e.g., information such as a model number) to the control unit 2. As an example, the irradiation optical system 135 may output the information capable of identifying the type of the irradiation optical system 135 to the control unit 2 via a signal contact formed on the head housing 137. Specifically, the irradiation optical system 135 may output the information capable of identifying the type of the irradiation optical system 135 to the control unit 2 via an output signal line formed by a first signal contact formed on the head housing 137 and a second signal contact formed on the mounting adapter 138 and in electrical contact with the first signal contact. In this case, the control unit 2 may identify the type of the irradiation optical system 135 based on the information capable of identifying the type of the irradiation optical system 135.

[0304] The focus control optical system 1314c may include a lens holder 1316c and an actuator 1317c to position one of the multiple focus lenses 1315c on the optical path of the processing light EL. The lens holder 1316c is a holding member capable of holding the multiple focus lenses 1315c. In particular, the lens holder 1316c may hold the multiple focus lenses 1315c so that the multiple focus lenses 1315c are aligned in a direction intersecting the optical path of the processing light EL. The actuator 1317c is a moving device capable of moving the lens holder 1316c under the control of the control unit 2. In particular, the actuator 1317c may move the lens holder 1316c in a direction intersecting the optical path of the processing light EL. In this case, the control unit 2 may use the actuator 1317c to move the lens holder 1316c so that one focus lens 1315c corresponding to one irradiation optical system 135 attached to the processing head 13 is positioned on the optical path of the processing light EL, while the other focus lens 1315c is retracted from the optical path of the processing light EL.

[0305] As described above, the machining system SYSc of the third embodiment can replace the focus lens 1315c that adjusts the focusing position of the processing light EL in accordance with replacement of the irradiation optical system 135 attached to the machining head 13. Therefore, even if the irradiation optical system 135 is replaceable, the machining system SYSc can maintain the desired relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML. Therefore, compared to when the focus lens 1315c is not replaced, the machining system SYSc can properly machine the workpiece W. Furthermore, compared to when the focus lens 1315c is not replaced, the machining system SYSc can properly measure the measurement object M.

[0306] In the above description, the processing optical system 131 includes the focus control optical system 1314c. However, the measurement optical system 132 may include the focus control optical system 1314c in addition to or instead of the pro...

Claims

1. a deflection optical system capable of deflecting an energy beam for processing or measuring an object to change an irradiation position of the energy beam on the object; an irradiation optical system capable of irradiating the object with the energy beam emitted from the deflection optical system; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a position change device that can change the irradiation position of the energy beam on the object by changing the position or attitude of the deflection optical system; a control device that controls the position changing device based on a result of receiving the energy beam by the light receiving device; Equipped with The light receiving device is a beam passing member having a plurality of passing regions formed therein through which the energy beam emitted from the irradiation optical system can pass; a light receiving unit capable of receiving each of the energy beams that have passed through each of the plurality of passing regions; Equipped with The deflection optical system deflects the energy beam so that the energy beam scans the plurality of passing regions in one direction along the surface of the beam passing member. Processing system.

2. The light receiving unit receives the energy beam that has passed through each of the plurality of passing regions via a light receiving optical system. The processing system of claim 1 .

3. the light receiving optical system emits the energy beam that has passed through a first passing region of the plurality of passing regions from a first portion of the light receiving optical system; the light receiving optical system emits the energy beam, which has passed through a second passing region different from the first passing region among the plurality of passing regions, from a second portion of the light receiving optical system different from the first portion; the energy beam emitted from the first portion passes through a first optical path from the first portion toward the light receiving portion and is incident on the light receiving portion; The energy beam emitted from the second portion travels from the first portion toward the light receiving unit, passes through a second optical path different from the first optical path, and is incident on the light receiving unit. The processing system according to claim 2 .

4. The light receiving device includes one light receiving unit. The processing system according to claim 2 .

5. The plurality of passing regions are formed on the beam passing member so that the deflection optical system deflects the energy beam on the surface of the beam passing member, thereby distributing the irradiation position of the energy beam within a settable scanning region. The processing system according to claim 2 .

6. The deflection optical system deflects the energy beam so that the energy beam scans the plurality of passing regions along the one direction while the positional relationship between the light receiving device and the irradiation optical system is fixed. The processing system of claim 1 .

7. Each of the plurality of passing regions includes a linear first region that extends in a first direction intersecting a direction in which the plurality of passing regions are arranged and through which the energy beam can pass, and a linear second region that extends in a second direction that obliquely intersects with the first direction and through which the energy beam can pass. The processing system according to claim 6 .

8. The control device calculates a first timing when the energy beam passes through the first area and a second timing when the energy beam passes through the second area based on a result of receiving the energy beam by the light receiving device, and controls the position changing device based on the first and second timings. The processing system according to claim 7 .

9. The position changing device includes a position changing optical system that can deflect the energy beam to change the irradiation position of the energy beam on the object. The processing system according to any one of claims 1 to 8.

10. the irradiation optical system is a first irradiation optical system, the first irradiation optical system is replaceable with a second irradiation optical system different from the first irradiation optical system; When the first irradiation optical system is replaced with the second irradiation optical system, the light receiving device receives the energy beam emitted from the second irradiation optical system. The processing system according to any one of claims 1 to 8.

11. The light receiving device is located on at least one optical path of the energy beam during at least a portion of a period during which the light receiving device receives the energy beam, and is located at a position away from the optical path of the energy beam during at least a portion of a period during which the object is processed or measured by the energy beam. The processing system according to any one of claims 1 to 8.

12. When the position change device is a first position change device, The light receiving device further includes a second position changing device that can change the positional relationship between the light receiving device and the irradiation optical system. The processing system according to any one of claims 1 to 8.

13. The control device controls the second position changing device to change the position of the light receiving device from a first position where the energy beam can be received to a second position different from the first position. The processing system of claim 12.

14. The irradiation optical system is a first irradiation optical system, the first irradiation optical system is replaceable with a second irradiation optical system different from the first irradiation optical system; The second position changer changes the positional relationship between the light receiving device and the irradiation optical system when the first irradiation optical system is replaced with the second irradiation optical system. The processing system of claim 12.

15. a deflection optical system capable of deflecting the energy beam to change the irradiation position of the energy beam on the object; an irradiation optical system capable of irradiating the object with the energy beam emitted from the deflection optical system; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a position change device that can change the irradiation position of the energy beam on the object by changing the position or attitude of the deflection optical system; a control device that controls the position changing device based on a result of receiving the energy beam by the light receiving device; Equipped with The light receiving device is a beam passing member having a plurality of passing regions formed therein through which the energy beam emitted from the irradiation optical system can pass; a light receiving unit capable of receiving each of the energy beams that have passed through each of the plurality of passing regions; Equipped with The control device controls the position changing device based on a result of receiving the energy beam by the light receiving device. Processing system.

16. an irradiation optical system that can irradiate an object with a processing beam for processing the object and can irradiate the object with a measurement beam for measuring the object, and that includes at least an objective optical system; a light receiving device capable of receiving the processing beam and the measurement beam emitted from the irradiation optical system; a position changing device capable of changing at least one of an irradiation position of the processing beam on the object and an irradiation position of the measurement beam on the object; Control device and Equipped with The control device controls the position changing device based on a result of receiving the processing beam by the light receiving device and a result of receiving the measurement beam by the light receiving device. Processing system.

17. the control device acquires an irradiation position of the processing beam and an irradiation position of the measurement beam based on a light receiving result by the light receiving device; The control device controls the position changing device based on the acquired irradiation position of the processing beam and the irradiation position of the measurement beam. The processing system of claim 16.

18. The control device controls the position changing device so that a deviation between an irradiation position of the processing beam on the object and an irradiation position of the measurement beam on the object becomes smaller compared to before controlling the position changing device.

18. The processing system of claim 17.

19. The control device controls the position changing device so that the irradiation position of the processing beam on the object coincides with the irradiation position of the measurement beam on the object.

18. The processing system of claim 17.

20. The position changing device includes a first position changing optical system capable of deflecting the processing beam to change the irradiation position of the processing beam on the object. The processing system of claim 16.

21. The position changing device includes a second position changing optical system that can change the irradiation position of the measurement beam on the object by deflecting the measurement beam.

21. The processing system of claim 20.

22. The light receiving device is a beam passing member having passing regions formed therein through which the processing beam and the measurement beam emitted from the irradiation optical system can pass; a light receiving section capable of receiving each of the processing beam and the measurement beam that have passed through the passing region; Equipped with The control device controls the position changing device based on a result of reception of the processing beam by the light receiving unit and a result of reception of the measurement beam by the light receiving unit. The processing system of claim 16.

23. The beam-passing member has a plurality of passing regions, The light receiving unit receives the processing beam that has passed through each of the plurality of passing regions, and receives the measurement beam that has passed through each of the plurality of passing regions.

23. The processing system of claim 22.

24. the processing system further includes a deflection optical system capable of deflecting the processing beam to change an irradiation position of the processing beam on the object and deflecting the measurement beam to change an irradiation position of the measurement beam on the object; the deflection optical system deflects each of the processing beam and the measurement beam so that each of the processing beam and the measurement beam scans the plurality of passing regions along one direction along a surface of the beam passing member; The control device controls the position changing device based on a result of receiving the processing beam by the light receiving device during a period in which the processing beam scans the plurality of passing regions and a result of receiving the measurement beam by the light receiving device during a period in which the measurement beam scans the plurality of passing regions.

24. The processing system of claim 23.

25. each of the plurality of passing regions includes a linear first region that extends in a first direction intersecting a direction in which the plurality of passing regions are arranged and through which each of the processing beam and the measurement beam can pass, and a linear second region that extends in a second direction obliquely intersecting the first direction and through which each of the processing beam and the measurement beam can pass, The control device calculating a first timing at which the processing beam passes through the first region and a second timing at which the processing beam passes through the second region based on a result of receiving the processing beam by the light receiving device; calculating a third timing when the measurement beam passes through the first region and a fourth timing when the measurement beam passes through the second region based on a result of reception of the measurement beam by the light receiving device; The position changing device is controlled based on at least one of a difference between the first timing and the third timing and a difference between the second timing and the fourth timing.

25. The processing system of claim 24.

26. the irradiation optical system is a first irradiation optical system, the first irradiation optical system is replaceable with a second irradiation optical system different from the first irradiation optical system; When the first irradiation optical system is replaced with the second irradiation optical system, the light receiving device receives each of the processing beam and the measurement beam emitted from the second irradiation optical system. The processing system of claim 16.

27. The light receiving device is located on an optical path of at least one of the processing beam and the measurement beam during at least a portion of a period during which the light receiving device receives the processing beam and the measurement beam, and is located at a position away from the optical paths of the processing beam and the measurement beam during at least a portion of a period during which the object is processed by the processing beam and at least a portion of a period during which the object is measured by the measurement beam. The processing system of claim 16.

28. The position changing device is capable of changing a relative positional relationship between an irradiation position of the processing beam on the object and an irradiation position of the measurement beam on the object in a first direction intersecting with an irradiation direction of the measurement beam.

28. The processing system of any one of claims 16 to 27.

29. The position changing device is capable of changing the relative positional relationship between the irradiation position of the processing beam on the object and the irradiation position of the measurement beam on the object.

28. The processing system of any one of claims 16 to 27.

30. an illumination optical system capable of irradiating an object with a first beam and irradiating the object with a second beam different from the first beam; a light receiving device capable of receiving the first beam and the second beam emitted from the irradiation optical system; a position changing device capable of changing at least one of an irradiation position of the first beam on the object and an irradiation position of the second beam on the object; Control device and Equipped with The control device controls the position changing device based on a result of receiving the first beam by the light receiving device and a result of receiving the second beam by the light receiving device. Processing system.

31. Using an irradiation optical system, irradiating an object with a processing beam for processing the object; irradiating the object with a measurement beam for measuring the object using the irradiation optical system; receiving the processing beam and the measurement beam emitted from the irradiation optical system using a light receiving device; changing at least one of the irradiation position of the processing beam on the object and the irradiation position of the measurement beam on the object; Including, Changing at least one of the irradiation position of the processing beam and the irradiation position of the measurement beam includes changing at least one of the irradiation position of the processing beam and the irradiation position of the measurement beam based on a reception result of the processing beam by the light receiving device and a reception result of the measurement beam by the light receiving device. Processing method.

32. Using a deflection optical system capable of deflecting an energy beam for processing or measuring an object, changing the irradiation position of the energy beam on the object; irradiating the object with the energy beam emitted from the deflection optical system via an irradiation optical system; receiving the energy beam emitted from the irradiation optical system using a light receiving device; Including, changing the irradiation position of the energy beam includes changing the irradiation position of the energy beam on the object by changing the position or attitude of the deflection optical system based on a result of receiving the energy beam by the light receiving device, The light receiving device is a beam passing member having a plurality of passing regions formed therein through which the energy beam emitted from the irradiation optical system can pass; a light receiving unit capable of receiving each of the energy beams that have passed through each of the plurality of passing regions; Equipped with Changing the irradiation position of the energy beam includes deflecting the energy beam using the deflection optical system so that the energy beam scans the plurality of passing regions in one direction along the surface of the beam passing member. Processing method.

33. Irradiating an object with a first beam using an irradiation optical system; irradiating the object with a second beam different from the first beam using the irradiation optical system; receiving the first beam and the second beam emitted from the irradiation optical system using a light receiving device; changing at least one of the irradiation position of the first beam on the object and the irradiation position of the second beam on the object; Including, Changing at least one of the irradiation position of the first beam and the irradiation position of the second beam includes changing at least one of the irradiation position of the first beam and the irradiation position of the second beam based on a result of receiving the first beam by the light receiving device and a result of receiving the second beam by the light receiving device. Processing method.

34. Using a deflection optical system capable of deflecting an energy beam, changing the irradiation position of the energy beam on the object; irradiating the object with the energy beam emitted from the deflection optical system via an irradiation optical system; receiving the energy beam emitted from the irradiation optical system using a light receiving device; Including, changing the irradiation position of the energy beam includes changing the irradiation position of the energy beam on the object by changing the position or attitude of the deflection optical system based on a result of receiving the energy beam by the light receiving device, The light receiving device is a beam passing member having a plurality of passing regions formed therein through which the energy beam emitted from the irradiation optical system can pass; a light receiving unit capable of receiving each of the energy beams that have passed through each of the plurality of passing regions; Equipped with Processing method.