Laser machining head and laser machining system

Abstract

Conventionally, a cooperation-type robot capable of executing a task in cooperation with an operator has been pervasive. In conjunction therewith, there is a need for a laser machining head which is applicable to a manual operation mode in which an operator performs a laser emission operation manually, and to an automatic operation mode in which a laser machining system performs a laser emission operation automatically.　Provided is a laser machining head 14 with which a laser emission operation can be performed in a manual operation mode in which a control device 18 executes the laser emission operation in accordance with a manual laser emission command, and in an automatic operation mode in which the control device 18 automatically executes the laser emission operation in accordance with a machining program. The laser machining head comprises: a first input device 58 that receives an input operation for sending the manual laser emission command to the control device 18; and a distance measurement sensor 62 that measures a distance between the laser machining head 14 and a workpiece W when the control device 18 executes the laser emission operation in the automatic operation mode.

Description

[Technical field]

[0001] The present disclosure relates to a laser processing head and a laser processing system. [Background technology]

[0002] A laser processing head that is applied to a laser processing system that automatically performs a laser emission operation according to a processing program is known (Patent Document 1). On the other hand, a laser processing head that is manually operated by an operator is also known (Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2000-52076 A [Patent Document 2] JP 2000-24787 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the past, collaborative robots that can work in collaboration with an operator have become widespread. Accordingly, there is a demand for a laser processing head that can be used in both a manual operation mode in which the operator manually performs the laser emission operation and an automatic operation mode in which the laser processing system automatically performs the laser emission operation. [Means for solving the problem]

[0005] In one aspect of the present disclosure, a laser processing head capable of laser emission operation in a manual operation mode in which a control device performs a laser emission operation in accordance with a manual laser emission command and an automatic operation mode in which the control device automatically performs a laser emission operation in accordance with a processing program includes a first input device that accepts an input operation for sending a manual laser emission command to the control device, and a distance sensor that measures the distance between the laser processing head and a workpiece when the control device performs a laser emission operation in the automatic operation mode. [Brief description of the drawings]

[0006] [Figure 1] 1 is a schematic diagram of a laser processing system according to one embodiment. [Diagram 2] 2 is a block diagram of the laser processing system shown in FIG. 1. [Diagram 3] FIG. 2 is an enlarged view of a mode selection switch shown in FIG. [Figure 4] FIG. 2 is an enlarged view of the laser processing head shown in FIG. [Diagram 5] 3 shows a first input device according to another embodiment. [Figure 6] FIG. 13 is an enlarged view of a laser processing head according to another embodiment. [Figure 7] FIG. 7 is a block diagram of the laser processing head shown in FIG. 6. [Figure 8] 7 is a diagram for explaining the function of the contact detection device shown in FIG. 6. [Figure 9] FIG. 7 is a diagram for explaining the function of the command cutoff unit shown in FIG. 6, showing a state in which the command cutoff unit cuts off a manual laser emission command. [Figure 10] 7 is a diagram for explaining the function of the command cutoff unit shown in FIG. 6, showing a state in which the command cutoff unit permits transmission of a manual laser emission command. [Figure 11] 7 is a flowchart showing an example of an operation flow of the laser processing head shown in FIG. 6. [Figure 12] 12 is a flowchart showing an example of the process of step S2 in FIG. 11. [Figure 13] 12 is a flowchart showing an example of the process of step S3 in FIG. 11. [Figure 14] FIG. 11 is a block diagram of a laser processing head according to yet another embodiment. [Figure 15] 15 is a flowchart showing an example of the flow of step S2 executed by the laser processing head shown in FIG. 14. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. In various embodiments described below, similar elements are given the same reference numerals, and duplicated explanations will be omitted. First, a laser processing system 10 according to one embodiment will be described with reference to Figs. 1 and 2. The laser processing system 10 is a system that can perform laser processing (laser welding, laser cutting, etc.) on a workpiece W in collaboration with an operator.

[0008] Specifically, the laser processing system 10 includes a robot 12, a laser processing head 14, a laser oscillator 16, and a control device 18. The robot 12 moves the laser processing head 14 relative to the workpiece W. In this embodiment, the robot 12 is a vertical articulated robot, and has a robot base 20, a rotating body 22, a lower arm 24, an upper arm 26, and a wrist 28.

[0009] The robot base 20 is fixed on the floor of the work cell. The rotating body 22 is provided on the robot base 20 so as to be rotatable around a vertical axis. The lower arm 24 is provided on the rotating body 22 so as to be rotatable around a horizontal axis. The upper arm 26 is provided on the tip of the lower arm 24 so as to be rotatable. The wrist 28 has a wrist base 28a provided on the tip of the upper arm 26 so as to be rotatable around two axes that are perpendicular to each other, and a wrist flange 28b provided on the wrist base 28a so as to be rotatable.

[0010] Each component of the robot 12 (i.e., the robot base 20, the rotating body 22, the lower arm 24, the upper arm 26, and the wrist 28) is provided with a plurality of servo motors 30 (FIG. 2). In response to commands from the control device 18, these servo motors 30 rotate each movable component of the robot 12 (i.e., the rotating body 22, the lower arm 24, the upper arm 26, the wrist 28, and the wrist flange 28b) around a drive shaft. In this way, the robot 12 moves the laser processing head 14.

[0011] The robot 12 is also provided with a force sensor 32. The force sensor 32 detects an external force F applied to the robot 12. As an example, the force sensor 32 is provided in each servo motor 30 of the robot 12 and has a torque sensor that detects the torque applied to the output shaft of the servo motor 30.

[0012] As another example, the force sensor 32 is provided on a component of the robot 12 (e.g., the robot base 20 or the wrist 28) and has a 6-axis force sensor capable of detecting forces in 6 axial directions. Based on the detection data of the force sensor 32, the control device 18 is capable of identifying the magnitude and direction of the external force F applied to the robot and the part of the robot 12 to which the external force F was applied (e.g., the wrist 28).

[0013] The laser oscillator 16 internally oscillates a laser in response to a command (such as a laser power command) from the control device 18 to generate laser light LB. The laser oscillator 16 may be of any type, such as a fiber laser oscillator, a pulsed laser oscillator, a CO2 laser oscillator, or a solid-state laser (YAG laser) oscillator. The laser oscillator 16 supplies the generated laser light LB to the laser processing head 14 via a light guide 34. The light guide 34 may be composed of an optical fiber, a cavity, a light guide material such as quartz, a reflecting mirror, an optical lens, or the like.

[0014] The control device 18 controls a laser emission operation LO in which the laser oscillator 16 is operated to emit laser light LB from the laser processing head 14, and a movement operation MO in which the robot 12 is operated to move the laser processing head 14 attached to the robot 12 relative to the workpiece W. Specifically, the control device 18 is a computer having a processor 36, a memory 38, and an I / O interface 40, as shown in FIG.

[0015] The processor 36 has a CPU or a GPU, etc., is communicatively connected to the memory 38 and the I / O interface 40 via a bus 42, and performs various arithmetic processing for executing the laser processing described below while communicating with these components. The memory 38 has a RAM or a ROM, etc., and temporarily or permanently stores various data used in the arithmetic processing executed by the processor 36 and various data generated during the arithmetic processing.

[0016] The I / O interface 40 has, for example, an Ethernet (registered trademark) port, a USB port, an optical fiber connector, or an HDMI (registered trademark) terminal, and communicates data with an external device via a wired or wireless connection under instructions from the processor 36. The robot 12 (specifically, the servo motor 30 and the force sensor 32), the laser processing head 14, and the laser oscillator 16 are connected to the I / O interface 40 so as to be able to communicate with each other.

[0017] The control device 18 is further provided with an input device 44 and a display device 46. The input device 44 has a keyboard, a mouse, a touch panel, or the like, and receives data input from an operator. The display device 46 has a liquid crystal display, an organic EL display, or the like, and displays various data.

[0018] The input device 44 and the display device 46 are communicatively connected to the I / O interface 40 via wire or wirelessly. The input device 44 and the display device 46 may be integrated into the housing of the control device 18, or may be provided separately from the housing of the control device 18 as, for example, a single computer (such as a PC).

[0019] In this embodiment, the control device 18 is provided with a mode selection switch 48. The mode selection switch 48 is for selecting an operation mode DM of the laser processing executed by the control device 18. As shown in Fig. 3, in this embodiment, the mode selection switch 48 is configured to be able to switch the operation mode DM between a manual operation mode DM1 represented as "MANUAL" and an automatic operation mode DM2 represented as "AUTO".

[0020] The operator can switch the operation mode DM between a manual operation mode DM1 and an automatic operation mode DM2 by operating the mode selection switch 48. The manual operation mode DM1 is an operation mode DM in which the operator holds and carries the laser processing head 14 by hand, manually causes the control device 18 to execute a laser emission operation LO, and manually laser processes the workpiece W with the laser light LB emitted from the laser processing head 14. In this manual operation mode DM1, the operator manually gives a manual laser emission command CM1, which will be described later, to the control device 18, and the processor 36 of the control device 18 executes the laser emission operation LO in response to the manual laser emission command CM1.

[0021] On the other hand, the automatic operation mode DM2 is an operation mode DM in which the processor 36 of the control device 18 automatically executes the laser emission operation LO and the movement operation MO in accordance with the processing program PG1 created in advance. Specifically, the processor 36 sequentially generates commands to the laser oscillator 16 in accordance with the processing program PG1, and operates the laser oscillator 16 in accordance with the commands to automatically execute the laser emission operation LO in which the laser processing head 14 emits the laser light LB.

[0022] Furthermore, the processor 36 sequentially generates commands (position commands, speed commands, torque commands, etc.) for the robot 12 (specifically, each servo motor 30) in accordance with the machining program PG1, and operates the robot 12 in accordance with the commands to automatically execute a movement operation MO that moves the laser machining head 14 relative to the workpiece W. This machining program PG1 is created by an operator and is stored in advance in the memory 38. Note that FIG. 3 shows a state in which the automatic operation mode DM2 ("AUTO") is selected by the mode selection switch 48.

[0023] The laser processing head 14 is detachably attached to the wrist flange 28b of the robot 12. Specifically, as shown in Fig. 4, the laser processing head 14 includes a head body 50, a nozzle 52, an attachment / detachment tool 54, a gripper 56, a first input device 58, a second input device 60, and a distance measurement sensor 62. The head body 50 is hollow, and houses therein optical system components such as optical lenses (collimator lenses, focus lenses, etc.) and a lens driver (e.g., a servo motor) that displaces the optical lenses in response to commands from the control device 18.

[0024] The nozzle 52 is hollow and is provided at the tip of the head body 50. In this embodiment, the nozzle 52 has a truncated cone shape whose cross-sectional area decreases from its base end to its tip end, and an emission port 52a is formed at its tip end. A hollow chamber is formed inside the nozzle 52 and the head body 50, and an assist gas AG is supplied into the chamber from an externally provided assist gas supply device (not shown). The laser light LB generated by the laser oscillator 16 propagates through the chamber and is emitted along the optical axis A from the emission port 52a together with the assist gas AG.

[0025] The attachment / detachment tool 54 is provided on the head body 50 and is attached to and detached from the wrist flange 28b of the robot 12. As an example, the attachment / detachment tool 54 may have a fastener such as a bolt and be fastened to the wrist flange 28b by the fastener. As another example, the attachment / detachment tool 54 may have an engaging part that detachably engages with an engaged part formed on the wrist flange 28b, and may be attached to and detached from the wrist flange 28b by the engagement between the engaged part and the engaging part. As yet another example, the attachment / detachment tool 54 may have an electromagnet and be attracted and fixed to the wrist flange 28b by the electromagnetic force generated by the electromagnet. The laser processing head 14 is detachably attached to the wrist flange 28b of the robot 12 via the attachment / detachment tool 54.

[0026] The grip portion 56 is provided at the base end of the head body 50 so that the operator can hold it with one hand. The grip portion 56 may have projections and recesses corresponding to the fingers of one hand so that the operator can easily hold it with one hand. The operator can carry the laser processing head 14 by holding the grip portion 56 and removing the laser processing head 14 from the wrist flange 28b.

[0027] The first input device 58 accepts an input operation for transmitting a manual laser emission command CM1 to the control device 18. In the present embodiment, the first input device 58 has a push button, a switch, a touch panel, or the like that can be manually operated by an operator, and is provided on the laser processing head 14 (for example, the head body 50 or the grip portion 56).

[0028] When the first input device 58 receives an input operation by an operator (for example, pressing a push button by hand, toggling a switch, or touching a touch panel), it supplies a manual laser emission command CM1 to the control device 18. The manual laser emission command CM1 may be an ON signal (or a "1" signal).

[0029] When the control device 18 receives a manual laser emission command CM1 while executing the manual operation mode DM1, the control device 18 executes a laser emission operation LO in response to the manual laser emission command CM1. Thus, in the manual operation mode DM1, the operator can manually laser process the workpiece W with the laser light LB emitted along the optical axis A from the emission port 52a of the laser processing head 14 while carrying the laser processing head 14 by hand. In this embodiment, the first input device 58 is provided adjacent to the grip portion 56 so that the operator can perform input operation with one hand holding the grip portion 56.

[0030] The second input device 60 receives an input operation for transmitting a manual gas injection command CM2 for injecting the assist gas AG. Specifically, the second input device 60 has a push button, a switch, a touch panel, or the like that can be manually operated by an operator, and upon receiving an input operation by the operator, transmits the manual gas injection command CM2 to the control device 18. 2 may be an ON signal (or a "1" signal).

[0031] When the control device 18 receives a manual gas emission command CM2 while executing the manual operation mode DM1, it operates the assist gas supply device to supply the assist gas AG from the assist gas supply device to the laser processing head 14. As a result, the assist gas AG is emitted together with the laser light LB from the emission port 52a of the laser processing head 14 held by the operator.

[0032] The second input device 60 is a manual gas ejection command CM 2 to the assist gas supply device. In this embodiment, the second input device 60 is also provided adjacent to the grip portion 56 and the first input device 58, similar to the above-mentioned first input device 58, so that the operator can perform input operation with one hand holding the grip portion 56.

[0033] When the control device 18 executes the laser emission operation LO in the automatic operation mode DM2, the distance measurement sensor 62 measures the distance d between the laser processing head 14 (e.g., the emission port 52a) and the workpiece W. Specifically, the distance measurement sensor 62 is, for example, a capacitance type, an infrared type, a laser type, or a sound wave type (e.g., an ultrasonic type) distance measurement sensor.

[0034] For example, in the case of a capacitance type, the distance measuring sensor 62 is provided on the head body 50 (or the nozzle 52) so as to measure the distance to the object located closest to the laser processing head 14. On the other hand, in the case of an infrared type, a laser type, or a sound wave type, the distance measuring sensor 62 is attached to the head body 50 (or the nozzle 52) so that the measurement direction D (in other words, the radiation direction of the infrared rays, laser, or sound waves) in which the distance to the object is measured is parallel to the optical axis A. That is, in this case, the distance measuring sensor 62 measures the distance d in the direction of the optical axis A between the laser processing head 14 (exit port 52a) and the workpiece W.

[0035] The distance measurement sensor 62 continuously (e.g., periodically) measures the distance d when the control device 18 executes the laser emission operation LO in the automatic driving mode DM2. In the automatic driving mode DM2, when the distance d measured by the distance measurement sensor 62 is within a predetermined allowable range RG, the processor 36 of the control device 18 executes the laser emission operation LO, whereas when the distance d is outside the allowable range RG, the processor 36 does not execute the laser emission operation LO.

[0036] In addition, when the movement operation MO is being performed in the automatic driving mode DM2, the processor 36 detects whether the external force F detected by the force sensor 32 is greater than or equal to a predetermined threshold value F th When the moving distance MO exceeds the threshold value, the motion of the robot 12 is stopped. This allows the robot 12 to be brought to an emergency stop when the robot 12 collides with a surrounding object (for example, the operator) during the moving motion MO.

[0037] As described above, in this embodiment, the laser processing head 14 is configured to be capable of laser emission operation in a manual operation mode DM1 in which the control device 18 executes the laser emission operation LO in accordance with a manual laser emission command CM1, and an automatic operation mode DM2 in which the control device 18 automatically executes the laser emission operation LO in accordance with the processing program PG1.

[0038] In order to make the laser processing head 14 applicable to both the manual operation mode DM1 and the automatic operation mode DM2, the laser processing head 14 is equipped with a first input device 58 that accepts an input operation for sending a manual laser emission command CM1 to the control device 18, and a distance measuring sensor 62 that measures the distance d between the laser processing head 14 and the workpiece W when the control device 18 executes the laser emission operation LO in the automatic operation mode DM2.

[0039] According to this configuration, the operator can perform laser processing while freely switching between the manual operation mode DM1 and the automatic operation mode DM2 according to the progress of the laser processing. This allows various laser processing to be performed. In addition, in the manual operation mode DM1, the operator can manually control the laser emission operation LO by operating the first input device 58, while in the automatic operation mode DM2, the control device 18 can automatically control the laser emission operation LO based on the distance d measured by the distance measuring sensor 62. Therefore, the safety of the laser processing work can be ensured.

[0040] In this embodiment, the first input device 58 has a push button, a switch, or a touch panel that can be manually operated by the operator. With this configuration, the operator can transmit the manual laser emission command CM1 to the control device 18 in the manual operation mode DM1 with a simple operation.

[0041] In the present embodiment, the laser processing head 14 further includes a second input device 60 that receives an input operation for transmitting a manual gas emission command CM2 for emitting the assist gas AG. According to this configuration, the operator can also manually control the emission of the assist gas AG in the manual operation mode DM1.

[0042] In this embodiment, the laser processing head 14 further includes an attachment / detachment tool 54 that is attached to and detached from the robot 12 (specifically, the wrist flange 28b) that moves the laser processing head 14, and a gripping part 56 that can be held by an operator with one hand. The first input device 58 is provided adjacent to the gripping part 56 so that input operation can be performed with the one hand holding the gripping part 56.

[0043] According to this configuration, the operator can easily perform the laser emission operation LO in the manual operation mode DM1 by operating the attachment / detachment tool 54 to remove the laser processing head 14 from the robot 12 while holding the gripping portion 56 with one hand, and then operating the first input device 58 with the same hand.

[0044] On the other hand, the operator can easily perform the laser emission operation LO in the automatic operation mode DM2 by attaching the laser processing head 14 to the robot 12 via the attachment / detachment tool 54. This allows the operator to more smoothly and easily switch between the manual operation mode DM1 and the automatic operation mode DM2.

[0045] The first input device 58 is not limited to a push button, a switch, or a touch panel, and may include a foot pedal or a foot switch that allows the operator to input with his or her foot. Such a configuration is shown in Fig. 5. In the laser processing head 14' shown in Fig. 5, the first input device 58' has a foot pedal or a foot switch, and is provided separately from the head body 50.

[0046] The first input device 58' is electrically connected to electronic components (e.g., a processor described later) housed inside the head body 50. Upon receiving an input operation by an operator (e.g., pressing a foot pedal with a foot or switching a foot switch), the first input device 58' transmits a manual laser emission command CM1 to the control device 18 via the electronic components in the head body 50.

[0047] The first input device 58, 58' is not limited to a push button, a switch, a touch panel, a foot pedal, or a foot switch, and may be any type of input device. For example, the first input device 58, 58' may have a microphone that detects the voice of the operator and a voice analysis unit that analyzes the voice. In this case, the first input device 58, 58' receives a voice input operation by the operator and transmits a manual laser emission command CM1 to the control device 18.

[0048] Also, the second input device 60 may be omitted from the laser processing head 14 or 14'. In this case, the second input device 60 may be provided in the control device 18. Or, the above-mentioned input device 44 may function as the second input device 60. In this case, the operator may operate the input device 44 to operate the assist gas supply device and supply the assist gas AG to the laser processing head 14 or 14'.

[0049] Also, the above-mentioned grip portion 56 may be omitted, and the operator may carry the laser processing head 14 or 14' by, for example, gripping the head body 50. Also, the first input device 58 may be provided at any position on the laser processing head 14 or 14', and the grip portion 56 and the first input device 58 may be disposed so that the operator can grip the grip portion 56 (or the head body 50) with one hand and operate the first input device 58 with the other hand.

[0050] Next, a laser processing head 64 according to another embodiment will be described with reference to Fig. 6 and Fig. 7. The laser processing head 64 can be applied to the laser processing system 10 in place of the above-mentioned laser processing head 14, and can be detachably attached to the wrist flange 28b of the robot 12. The laser processing head 64 differs from the above-mentioned laser processing head 14 in the following configuration.

[0051] Specifically, the laser processing head 64 further includes a mode selection switch 48, a contact detection device 66, and a processor 68. In this embodiment, the mode selection switch 48 is integrally provided on the head body 50, and can be switched between the manual operation mode DM1 and the automatic operation mode DM2, similarly to the above-described embodiment.

[0052] The contact detection device 66 detects whether the laser processing head 64 and the workpiece W are in contact or not in contact with each other. Specifically, the contact detection device 66 has a conductive cable 66a and a resistance sensor 66b (FIG. 7). One end of the conductive cable 66a is electrically connected to the head body 50 of the laser processing head 64, and the other end is electrically connected to the workpiece W, thereby electrically connecting the laser processing head 64 and the workpiece W.

[0053] In this embodiment, at least a portion of the head body 50 and nozzle 52 of the laser processing head 64 is made of a conductive material (e.g., metal). The workpiece W is made of a metal (e.g., iron or copper). Therefore, if the tip of the nozzle 52 of the laser processing head 64 comes into contact with the workpiece W, as shown in FIG. 8, a closed circuit 70 is formed by the workpiece W, the head body 50 and nozzle 52 of the laser processing head 64, and the conductive cable 66a.

[0054] The resistance sensor 66b applies a voltage to the closed circuit 70 to measure the resistance R of the closed circuit 70. When the laser processing head 64 and the workpiece W are in contact as shown in Fig. 8, the resistance R measured by the resistance sensor 66b is an extremely small value R0 (R0 ≒ 0). On the other hand, when the laser processing head 64 and the workpiece W are out of contact (i.e., the tip of the nozzle 52 is separated from the workpiece W), the resistance R measured by the resistance sensor 66b is an extremely large value R1 (R1 ≒ ∞ >> R0).

[0055] The contact detection device 66 is configured to detect whether the laser processing head 64 is in contact with the workpiece W or not, based on the resistance R measured by the resistance sensor 66b. The resistance sensor 66b supplies the processor 68 with measurement data of the measured resistance R or contact determination data indicating whether the laser processing head 64 is in contact with the workpiece W as detection data DD. The processor 68 can determine whether the laser processing head 64 is in contact with the workpiece W or not, based on the detection data DD of the resistance sensor 66b. The resistance sensor 66b may be built into the head body 50.

[0056] 7, the processor 68 has a CPU, a GPU, or the like, and is built into the head body 50. The processor 68 is communicatively connected to the mode selection switch 48, the first input device 58, the second input device 60, the distance measurement sensor 62, and the resistance sensor 66b via a bus (or a communication line) 72.

[0057] Here, in this embodiment, the processor 68 functions as a command cutoff unit 74, and cuts off the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18 when the condition CD for executing the laser emission operation LO in the manual operation mode DM1 is not satisfied. The function of this command cutoff unit 74 will be described with reference to Figs. 9 and 10.

[0058] 9 is a schematic diagram showing a state in which the command cutoff unit 74 cuts off the manual laser emission command CM1. Specifically, the manual laser emission command CM1 transmitted by the first input device 58 is transmitted to the control device 18 through a communication line 76, and the communication line 76 is provided with a cutoff circuit 78.

[0059] The cutoff circuit 78 has, for example, an electronically controllable switch 78a (relay or the like) and is built into the head body 50 of the laser processing head 64. The command cutoff unit 74 cuts off the manual laser emission command CM1 or permits transmission of the manual laser emission command CM1 by opening and closing the switch 78a of the cutoff circuit 78 in accordance with a predetermined condition CD.

[0060] For example, the condition CD for performing the laser emission operation LO in the manual operation mode DM1 includes a first condition CD1 that the manual operation mode DM1 is selected by the mode selection switch 48, and a second condition CD2 that the laser processing head 64 is in contact with the workpiece W.

[0061] When the first condition CD1 or the second condition CD2 is not satisfied, the command cutoff unit 74 opens the switch 78a of the cutoff circuit 78, thereby cutting off the manual laser emission command CM1, as shown in Fig. 9. On the other hand, when the first condition CD1 and the second condition CD2 are satisfied, the command cutoff unit 74 closes the switch 78a of the cutoff circuit 78, as shown in Fig. 10, thereby permitting the transmission of the manual laser emission command CM1.

[0062] In this way, the processor 68 functions as a command cutoff unit 74 and operates the cutoff circuit 78 to cut off the manual laser emission command CM1 or permit transmission of the manual laser emission command CM1 in accordance with the condition CD. The cutoff circuit 78 (switch 78a) may be configured with an analog circuit, or may be configured with a digital circuit realized by signal processing executed by the processor 68. The cutoff circuit 78 shown in Figs. 9 and 10 is merely an example, and may be configured with any circuit.

[0063] Next, the function of the laser processing head 64 will be described with reference to Fig. 11. When the processor 68 of the laser processing head 64 receives an operation start command from the control device 18, the processor 68 starts the flow shown in Fig. 11. In step S1, the processor 68 determines whether or not the manual operation mode DM1 has been selected by the mode selection switch 48. If the manual operation mode DM1 has been selected by the mode selection switch 48, the processor 68 determines YES and proceeds to step S2, whereas if the processor 68 determines NO, the processor 68 proceeds to step S3.

[0064] In step S2, the processor 68 executes a flow of the manual operation mode DM1. This step S2 will be described with reference to Fig. 12. At the start of step S2, the processor 68 may open the switch 78a of the interrupter circuit 78 as shown in Fig. 9, or may close the switch 78a as shown in Fig. 10.

[0065] After the start of step S2, in step S11, the processor 68 transmits a manual driving mode transition command CM3 to the control device 18. When the processor 36 (FIG. 2) of the control device 18 receives the manual driving mode transition command CM3, it transitions the driving mode DM to the manual driving mode DM1.

[0066] After transitioning to the manual operation mode DM1, the processor 36 of the control device 18 becomes capable of accepting a manual laser emission command CM1, but rejects an automatic operation start command CM4 for starting a laser emission operation LO and a movement operation MO in the automatic operation mode DM2. Note that in this step S11, the mode selection switch 48 may supply a manual operation mode transition command CM3 to the control device 18. Note that the manual operation mode transition command CM3 may be an ON signal (or a "1" signal).

[0067] In step S12, the processor 68 starts an operation of detecting contact or non-contact between the laser processing head 64 and the workpiece W by the contact detection device 66. Specifically, the processor 68 starts an operation of causing the resistance sensor 66b to measure the resistance R and continuously (e.g., periodically) acquiring the detection data DD from the resistance sensor 66b.

[0068] In step S13, the processor 68 determines whether or not the first input device 58 has received an input operation for transmitting a manual laser emission command CM1. If the first input device 58 has received an input operation by the operator, the processor 68 determines YES and proceeds to step S14, whereas if the processor 68 determines NO, the processor 68 proceeds to step S20.

[0069] In step S14, the processor 68 determines whether or not the manual driving mode DM1 has been selected by the mode selection switch 48 (i.e., whether or not the condition CD1 is satisfied), similarly to step S1 described above. If the processor 68 determines YES, the process proceeds to step S15, whereas if the processor 68 determines NO (i.e., the mode selection switch 48 has been switched to the automatic driving mode DM2, and the condition CD1 is not satisfied), the process proceeds to step S18.

[0070] In step S15, the processor 68 determines whether the laser processing head 64 is in contact with the workpiece W (i.e., whether the condition CD2 is satisfied). Specifically, the processor 68 determines whether the contact detection device 66 detects contact between the laser processing head 64 and the workpiece W or whether the contact is not detected, based on the detection data DD most recently acquired from the resistance sensor 66b.

[0071] If contact between the laser processing head 64 and the workpiece W is detected, the processor 68 judges the result to be YES and proceeds to step S16, whereas if non-contact between the laser processing head 64 and the workpiece W is detected (i.e., condition CD2 is not satisfied), the processor 68 judges the result to be NO and proceeds to step S19.

[0072] In step S16, the processor 68 permits transmission of a manual laser emission command CM1 from the first input device 58 to the control device 18. Specifically, the processor 68 functions as a command cutoff unit 74, and operates the cutoff circuit 78 to close the switch 78a, as shown in FIG.

[0073] This enables the first input device 58 to transmit the manual laser emission command CM1 to the control device 18 through the communication line 76 in response to the operator's input operation received in step S13. The processor 36 of the control device 18 executes the laser emission operation LO in response to the manual laser emission command CM1 from the first input device 58, and as a result, the laser light LB is emitted from the emission port 52a of the laser processing head 64. In this way, the operator can manually laser process the workpiece W.

[0074] In step S17, the processor 68 determines whether or not an operation end command has been received from the control device 18. If an operation end command has been received, the processor 68 determines YES, ends the flow of step S2, and ends the flow shown in Fig. 11. On the other hand, if the processor 68 determines NO, the process returns to step S13. Note that when the processor 68 determines YES in this step S17, the processor 68 may function as the command interruption unit 74 and operate the interruption circuit 78 to open the switch 78a.

[0075] On the other hand, if the determination in step S14 is NO, in step S18, the processor 68 cuts off the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18. Specifically, the processor 68 functions as a command cutoff unit 74, and operates the cutoff circuit 78 to open the switch 78a, as shown in FIG.

[0076] As a result, the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18 is blocked, and the processor 36 of the control device 18 does not execute the laser emission operation LO. After this step S18, the processor 68 of the laser processing head 64 proceeds to step S3 in FIG.

[0077] On the other hand, if the determination in step S15 is NO, in step S19, the processor 68 functions as the command cutoff unit 74, similarly to the above-mentioned step S18, and cuts off the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18. Then, the processor 68 returns to step S13.

[0078] Moreover, if the determination in step S13 is NO, in step S20, similarly to the above-mentioned step S14, the processor 68 determines whether or not the manual operation mode DM1 is selected by the mode selection switch 48. If the processor 68 determines YES, the process proceeds to step S17, whereas if the processor 68 determines NO, the process proceeds to step S3 in FIG.

[0079] Thus, while the processor 68 judges YES in steps S13 to S15 and judges NO in step S17, it continues to permit the transmission of the manual laser emission command CM1 in step S16. This allows the operator to continue manual laser processing while operating the first input device 58.

[0080] On the other hand, if the processor 68 determines YES in step S13 and then determines NO in step S14 or S15, the processor 68 cuts off the manual laser emission command CM1 in step S18 or S19. As a result, the laser emission operation LO in the manual operation mode DM1 is prohibited.

[0081] 11 again, if NO is determined in step S1 (or after NO is determined in step S20 in FIG. 12, or after execution of step S18), in step S3, processor 68 executes the flow of automatic driving mode DM2. This step S3 will be described with reference to FIG. 13. At the start of step S3, processor 68 may open switch 78a of shutoff circuit 78 as shown in FIG. 9.

[0082] After starting step S3, in step S21, the processor 68 transmits an automatic driving mode transition command CM5 to the control device 18. When the processor 36 (FIG. 2) of the control device 18 receives the automatic driving mode transition command CM5, it transitions the driving mode DM to the automatic driving mode DM2. Note that in this step S21, the mode selection switch 48 may supply the automatic driving mode transition command CM5 to the control device 18. Also, the automatic driving mode transition command CM5 may be an OFF signal (or a "0" signal).

[0083] After transitioning to the automatic operation mode DM2, the processor 36 of the control device 18 becomes capable of receiving the automatic operation start command CM4 described above, but rejects the manual laser emission command CM1 from the laser processing head 64. Then, when the processor 36 receives the automatic operation start command CM4 from the operator via the input device 44, for example, it automatically executes the laser emission operation LO and the movement operation MO in the automatic operation mode DM2 in accordance with the processing program PG1.

[0084] In step S22, the processor 68 starts an operation to acquire the distance d measured by the distance measurement sensor 62. Specifically, the processor 68 operates the distance measurement sensor 62 to continuously (e.g., periodically) measure the distance d between the laser processing head 64 and the workpiece W. The processor 68 continuously (e.g., periodically) acquires the distance d measured by the distance measurement sensor 62.

[0085] In step S23, the processor 68 determines whether the distance d most recently acquired from the distance measuring sensor 62 is within a predetermined allowable range RG. For example, the allowable range RG is d≦d th (For example, d th = 3 [mm]), or [d th1 ,d th2 ] (e.g., d th1 = 0.1 [mm], d th2 =3[mm]) range (i.e., d th1 ≦d≦d th2If the distance d is within the tolerance range RG, the processor 68 determines YES and proceeds to step S25, whereas if the distance d is outside the tolerance range RG, the processor 68 determines NO and proceeds to step S24.

[0086] In step S24, the processor 68 transmits a laser emission prohibit command CM6 to the control device 18. This laser emission prohibit command CM6 is a command for prohibiting the processor 36 of the control device 18 from emitting laser light in the automatic driving mode DM2. When the processor 36 of the control device 18 receives the laser emission prohibit command CM6, 2 The laser emission operation LO at the laser output terminal 14 is stopped (or not started).

[0087] Thus, in this embodiment, the processor 68 of the laser processing head 64 functions as a command transmission unit 80 (FIG. 7) that transmits the laser emission prohibition command CM6 to the control device 18. Note that the laser emission prohibition command CM6 may be an OFF signal (or a “0” signal).

[0088] After step S24, the processor 68 returns to step S23. Thus, while the processor 68 determines NO in step S23, the processor 68 transmits a laser emission prohibit command CM6 in step S24, thereby prohibiting the control device 18 from performing the laser emission operation LO in the automatic operation mode DM2.

[0089] On the other hand, if the determination in step S23 is YES, in step S25, the processor 68 functions as a command sending unit 80 and sends a laser emission permission command CM7 to the control device 18. This laser emission permission command CM7 is a command for permitting the processor 36 of the control device 18 to execute the laser emission operation LO in the automatic driving mode DM2.

[0090] When the processor 36 of the control device 18 receives the laser emission permission command CM7, the processor 36 switches to the automatic operation mode DM in response to the automatic operation start command CM4. 2It is possible to execute the laser emission operation LO at this time. Note that the laser emission permission command CM7 may be an ON signal (or a "1" signal).

[0091] In step S26, similarly to step S14 described above, the processor 68 determines whether or not the manual operation mode DM1 has been selected by the mode selection switch 48. If the processor 68 determines YES, the process proceeds to step S28, whereas if the processor 68 determines NO, the process proceeds to step S27.

[0092] In step S27, processor 68 determines whether or not an operation end command has been received, similarly to step S17 described above. If processor 68 determines YES, it ends the flow of step S3, thereby ending the flow shown in Fig. 11. On the other hand, if processor 68 determines NO, it returns to step S23.

[0093] On the other hand, if the determination in step S26 is YES, in step S28, the processor 68 transmits a laser emission prohibition command CM6 to the control device 18, similarly to the above-mentioned step S24. Then, the processor 68 proceeds to step S2 in FIG.

[0094] As described above, in this embodiment, the laser processing head 64 further includes a command blocking unit 74 that blocks the manual laser emission command CM1 transmitted from the first input device 58 to the control device 18 when the condition CD (CD1, CD2) for executing the laser emission operation LO in the manual operation mode DM1 is not satisfied (i.e., when NO is determined in step S14 or S15).

[0095] According to this configuration, when the condition CD for ensuring the safety of the operator in the manual operation mode DM1 is not satisfied, the manual laser emission command CM1 is blocked, thereby prohibiting the laser beam LB from being emitted from the laser processing head 64. This makes it possible to reliably ensure the safety of the operator in the manual operation mode DM1.

[0096] In the present embodiment, the laser processing head 64 further includes a mode selection switch 48 that can select the manual operation mode DM1 or the automatic operation mode DM2. The condition CD also includes a first condition CD1 that the manual operation mode DM1 is selected by the mode selection switch 48.

[0097] Then, when the manual operation mode DM1 is not selected by the mode selection switch 48 (when determined as NO in step S14), the command cut-off unit 74 cuts off the manual laser emission command CM1 (step S18). According to this configuration, in order for the operator to perform laser processing in the manual operation mode DM, the operator needs to manually switch the mode selection switch 48 to the manual operation mode DM1. Therefore, it is possible to prevent the laser emission operation LO from being unintentionally performed in the manual operation mode DM.

[0098] Moreover, in this embodiment, the laser processing head 64 further includes a contact detection device 66 that detects contact or non-contact between the laser processing head 64 and the workpiece W. Moreover, the condition CD has a second condition CD2 that the laser processing head 64 is in contact with the workpiece W. Then, when non-contact is detected by the contact detection device 66 (when determined as NO in step S15), the command blocking unit 74 blocks the manual laser emission command CM1 (step S19).

[0099] According to this configuration, when the laser emission operation LO is being performed in the manual operation mode DM, it is possible to prevent the laser processing head 64 from moving away from the workpiece W and emitting the laser light LB from the laser processing head 64 in an unintended direction (for example, toward the operator). This makes it possible to more reliably ensure the safety of the operator in the manual operation mode DM1.

[0100] In addition, in this embodiment, the contact detection device 66 has a conductive cable 66a that electrically connects the laser processing head 64 and the workpiece W, and a resistance sensor 66b that measures the resistance R of the closed circuit 70 formed by the workpiece W, the laser processing head 64 in contact with the workpiece W, and the conductive cable 66a.

[0101] As a result, the contact detection device 66 is configured to detect contact or non-contact between the laser processing head 64 and the workpiece W based on the resistance R measured by the resistance sensor 66b. According to this configuration, contact or non-contact between the laser processing head 64 and the workpiece W can be detected quickly and reliably with a relatively simple configuration.

[0102] In addition, in this embodiment, the laser processing head 64 further includes a command sending unit 80 that sends a laser emission prohibition command CM6 to the control device 18 to cause the control device 18 to prohibit the laser emission operation LO in the automatic operation mode DM2 when the distance d measured by the distance measuring sensor 62 is outside the predetermined allowable range RG (i.e., when NO is determined in step S23).

[0103] According to this configuration, when performing the laser emission operation LO in the automatic operation mode DM2, if the workpiece W is not placed in an appropriate position with respect to the laser processing head 64, the laser emission operation LO can be prohibited. This makes it possible to improve the safety of the laser processing work performed in the automatic operation mode DM2.

[0104] The mode selection switch 48 may be omitted from the laser processing head 64, and the mode selection switch 48 may be provided in the control device 18, as in the embodiment shown in Fig. 1. The contact detection device 66 may be omitted from the laser processing head 64. In this case, steps S15 and S19 may be omitted from the flow shown in Fig. 12. The contact detection device 66 is not limited to a form having a conductive cable 66a and a resistance sensor 66b, and may have any sensor, such as a proximity sensor capable of detecting contact between the laser processing head 64 and the workpiece W.

[0105] It should be noted that the command transmission unit 80 may be omitted from the laser processing head 64. In this case, the processor 68 (or the distance measurement sensor 62) of the laser processing head 64 may supply measurement data of the distance d measured by the distance measurement sensor 62 to the control device 18. Then, the processor 36 of the control device 18 may determine whether or not the laser emission operation LO can be executed in the automatic operation mode DM2 based on the measurement data.

[0106] The processor 36 of the control device 18 may continuously (e.g., periodically) acquire measurement data of the distance d from the distance measuring sensor 62 while executing the laser emission operation LO and the movement operation MO in the automatic operation mode DM2. Then, the processor 36 may execute gap control to control the distance d between the laser processing head 14 and the workpiece W to a predetermined target distance d0 based on the acquired measurement data. This target distance d0 may be predetermined as a value within the above-mentioned allowable range RG.

[0107] Next, a laser processing head 84 according to still another embodiment will be described with reference to Fig. 14. The laser processing head 84 can be applied to the laser processing system 10 in place of the above-mentioned laser processing head 64. The laser processing head 84 differs from the above-mentioned laser processing head 64 in that it further includes a timer unit 86. The timer unit 86 is built into the head main body 50 together with, for example, the processor 68 and the resistance sensor 66b, and measures the elapsed time t from a certain point in time.

[0108] Next, step S2 executed by the laser processing head 84 will be described with reference to Fig. 15. The processor 68 of the laser processing head 84 executes the flow shown in Fig. 15 as step S2 in Fig. 11. In the flow shown in Fig. 15, the same processes as those in the flow shown in Fig. 12 are given the same step numbers, and duplicated explanations will be omitted.

[0109] In this embodiment, the processor 68 determines a waiting time t from the time t0 when the contact detection device 66 detects that the laser processing head 84 is not in contact with the workpiece W (i.e., when the result of step S15 is NO) until the manual laser emission command CM1 is cut off in step S19. th is set in advance.

[0110] For example, the operator may operate the input device 44 of the control device 18 to input the waiting time t th Enter (for example, t th = 0.4 [sec]). The processor 68 receives the waiting time t th and, for example, in a register built into the processor 68, th Register the setting information.

[0111] The laser processing head 84 further includes a memory (ROM, RAM, etc.), and the processor 68 stores the waiting time t th In this manner, the processor 68 may register the setting information of the waiting time t th Therefore, the processor 68 sets the waiting time t th This functions as a waiting time setting unit 82 (FIG. 14) that sets the waiting time.

[0112] 15, when the processor 68 judges NO in step S15, the processor 68 starts measuring the elapsed time t in step S31. Specifically, the processor 68 activates the timing unit 86 to start measuring the elapsed time t from the time t0 when the processor 68 judges NO in step S15.

[0113] In step S32, the processor 68 determines whether the elapsed time t measured by the timer 86 is equal to or shorter than a preset waiting time t th (i.e., t ≥ t th ) Processor 68 determines whether t ≧ t th If so, the answer is YES and the process proceeds to step S19. <t th If so, the result is NO, and the process proceeds to step S33.

[0114] In step S33, similarly to step S15 described above, the processor 68 determines whether or not the contact detection device 66 has detected contact between the laser processing head 84 and the workpiece W. If the processor 68 determines YES, the process returns to step S13, whereas if the processor 68 determines NO (i.e., the laser processing head 84 and the workpiece W are still not in contact), the process returns to step S32.

[0115] The technical significance of steps S31 to S33 will be described below. Once the processor 68 permits the transmission of the manual laser emission command CM1 in step S16, the processor 36 of the control device 18 executes the laser emission operation LO in the manual operation mode DM1. If a NO decision is made in step S15 during the execution of this laser emission operation LO (i.e., while the YES decision is continued in step S13), the processor 68 starts the standby time t0 from the time t0 when the NO decision is made in step S15. th Step S19 is not executed until the time has elapsed (that is, until the determination in step S32 is YES) (in other words, the laser emission operation LO is continued).

[0116] Then, the processor 68 determines the waiting time t th If the result of step S33 is NO continuously until the period t th When non-contact between the laser processing head 84 and the workpiece W is detected continuously for the entire time period, the command cutoff unit 74 executes step S19, and as a result, the laser emission operation LO is prohibited.

[0117] As described above, in this embodiment, the laser processing head 84 waits from the time t0 when the contact detection device 66 detects non-contact (determined as NO in step S15) while the control device 18 is executing the laser emission operation LO in the manual operation mode DM1 until the command cutoff unit 74 cuts off the manual laser emission command CM1 (i.e., executes step S19) until the time t10. th The standby time setting unit 82 sets a standby time.

[0118] Then, the command cutoff unit 74 starts the standby time t th When the time has elapsed (determined as YES in step S32), the manual laser emission command CM1 is shut off (step S19). Here, in the manual operation mode DM1, the operator may perform laser processing with the laser light LB emitted from the laser processing head 84 while bringing the tip of the laser processing head 84 into contact with the workpiece W and moving the laser processing head 84 to the workpiece W.

[0119] In this case, for example, the laser processing head 84 may be momentarily (for example, for only 0.3 [sec]) separated from the workpiece W due to unevenness on the surface of the workpiece W. Even if the laser processing head 84 is momentarily separated from the workpiece W in this way, the laser light LB from the laser processing head 84 is unlikely to be emitted in the direction of the operator, and therefore the safety of the operator may be ensured.

[0120] According to this embodiment, the waiting time t until the manual laser emission command CM1 is cut off in step S19 is th By setting the waiting time t th If non-contact between the laser processing head 84 and the workpiece W is still detected after the time has elapsed, the laser emission operation LO can be prohibited by immediately executing step S19. Therefore, according to this embodiment, the laser processing work can be efficiently performed and the safety of the operator can be reliably ensured.

[0121] The processor 68 may execute the flow shown in Fig. 11 according to a computer program PG2. This computer program PG2 may be stored in a memory (ROM, RAM, etc.) built into the laser processing head 14, 64, or 84. The functions of the command blocking unit 74, the command transmitting unit 80, and the waiting time setting unit 82 executed by the processor 68 may be functional modules realized by the computer program PG2.

[0122] The first input device 58' shown in FIG. 5 may be applied to the laser processing head 64 or 84. The processor 68 may execute the flow shown in FIG. 11 and control the lens drive unit described above. The timer 86 may be omitted from the laser processing head 84. In this case, the timer 86 may be provided in the control device 18, and the processor 68 may obtain information on the elapsed time t from the timer 86 of the control device 18. The light guide 34 may be omitted from the laser processing system 10. In this case, the laser oscillator 16 may be directly connected to the laser processing head 14, 14', 64, or 84.

[0123] The laser processing head 14, 14', 64, or 84 may be any type of device, such as a laser scanner (or a galvanometer scanner). The laser scanner has a plurality of mirrors that each reflect the laser light LB supplied from the laser oscillator 16, a plurality of mirror driving units that individually drive the plurality of mirrors, and an optical lens that focuses the laser light reflected by the mirrors. The laser scanner can move the irradiation point of the laser light LB irradiated to the workpiece W at high speed on the surface of the workpiece W by changing the orientation of the plurality of mirrors using the mirror driving units.

[0124] Furthermore, the robot 12 is not limited to being a vertical articulated robot, but may be, for example, a horizontal articulated robot or a parallel link robot, and may be configured to have first and second ball screw mechanisms for moving the workpiece W in a horizontal plane, and a third ball screw mechanism for moving the laser processing head 14, 14', 64 or 84 in the vertical direction.

[0125] The control device 18 may include a first control device 18A that controls the movement operation MO of the robot 12, and a second control device 18B that controls the laser emission operation LO of the laser oscillator 16. Although the present disclosure has been described above through the embodiments, the above-mentioned embodiments do not limit the invention according to the claims.

[0126] As described above, the present disclosure describes the following aspects. (Aspect 1) A laser processing head capable of laser emission operation in a manual operation mode in which a control device performs a laser emission operation in accordance with a manual laser emission command, and an automatic operation mode in which the control device automatically performs a laser emission operation in accordance with a processing program, the laser processing head comprising: a first input device that accepts an input operation for sending a manual laser emission command to the control device; and a distance sensor that measures the distance between the laser processing head and a workpiece when the control device performs a laser emission operation in the automatic operation mode. (Aspect 2) The laser processing head of aspect 1, wherein the first input device has a push button, switch, or touch panel that the operator can operate by hand to input, or a foot pedal or foot switch that the operator can operate by foot to input. (Embodiment 3) The laser processing head according to embodiment 1 or 2, further comprising a second input device that accepts an input operation for issuing a manual gas ejection command for ejecting an assist gas. (Aspect 4) The laser processing head according to any one of aspects 1 to 3, further comprising a command blocking unit that blocks a manual laser emission command transmitted from the first input device to the control device when the conditions for executing a laser emission operation in manual operation mode are not met. (Aspect 5) A laser processing head as described in aspect 4, further comprising a mode selection switch capable of selecting a manual operation mode or an automatic operation mode, wherein the condition has a first condition that the manual operation mode is selected by the mode selection switch, and the command blocking unit blocks the manual laser emission command when the manual operation mode is not selected by the mode selection switch. (Example 6) A laser processing head as described in Example 4 or 5, further comprising a contact detection device that detects contact or non-contact between the laser processing head and the workpiece, wherein the condition has a second condition that the laser processing head is in contact with the workpiece, and the command blocking unit blocks the manual laser emission command when non-contact is detected by the contact detection device. (Example 7) The contact detection device of the laser processing head described in Example 6 has a conductive cable electrically connecting the laser processing head and the workpiece, and a resistance sensor measuring the resistance of a closed circuit formed by the workpiece, the laser processing head in contact with the workpiece, and the conductive cable, and is configured to detect contact or non-contact based on the resistance measured by the resistance sensor. (Aspect 8) A laser processing head as described in aspect 6 or 7, further comprising a wait time setting unit that sets a wait time from the time when non-contact is detected by the contact detection device while the control device is performing a laser emission operation in manual operation mode until the command blocking unit blocks the manual laser emission command, and the command blocking unit blocks the manual laser emission command when the wait time set by the wait time setting unit has elapsed from the time. (Aspect 9) A laser processing head described in any one of aspects 1 to 8, further comprising a command sending unit that sends a laser emission prohibition command to the control device to cause the control device to prohibit laser emission operation in automatic operation mode when the distance measured by the distance measuring sensor is outside a predetermined acceptable range. (Aspect 10) A laser processing head as described in any one of aspects 1 to 9, further comprising an attachment / detachment tool that is attached to and detached from a robot that moves the laser processing head, and a gripping portion that can be held in one hand by an operator, wherein the first input device is provided adjacent to the gripping portion so that input operation can be performed with the one hand holding the gripping portion. (Aspect 11) A laser processing system comprising: a robot; a laser processing head described in any one of aspects 1 to 10 that is removably attached to the robot; and a control device that performs laser emission operation in a manual operation mode and laser emission operation in an automatic operation mode. [Explanation of symbols]

[0127] 10 Laser processing system 12. Robot 14,14',64,84 Laser processing head 16 Laser Oscillator 18 Control device 36,68 processor 48 Mode selection switch 54 Attachment / detachment tool 56 Gripping part 58,58' First input device 60 Secondary input device 62 Distance Measuring Sensor 66 Contact detection device 70 Closed circuit 74 Command cutoff section 80 Command transmission unit 82 Waiting time setting section

Claims

1. A laser processing head capable of performing a laser emission operation in a manual operation mode in which a control device executes a laser emission operation in accordance with a manual laser emission command, and an automatic operation mode in which the control device automatically executes a laser emission operation in accordance with a processing program, a first input device that accepts an input operation for transmitting the manual laser emission command to the control device; a distance measuring sensor that measures the distance between the laser processing head and a workpiece when the control device executes the laser emission operation in the automatic operation mode.

2. The first input device is A push button, switch, or touch panel that can be operated by the operator's hand, or A foot pedal or foot switch that allows the operator to input with their feet. The laser processing head of claim 1 .

3. 3. The laser processing head according to claim 1, further comprising a second input device that accepts an input operation for issuing a manual gas ejection command for ejecting the assist gas.

4. 3. The laser processing head according to claim 1, further comprising a command blocking unit that blocks the manual laser emission command transmitted from the first input device to the control device when the conditions for executing the laser emission operation in the manual operation mode are not met.

5. Further comprising a mode selection switch capable of selecting the manual driving mode or the automatic driving mode, The conditions include a first condition that the manual operation mode is selected by the mode selection switch, The laser processing head according to claim 4 , wherein the command cut-off unit cuts off the manual laser emission command when the manual operation mode is not selected by the mode selection switch.

6. Further comprising a contact detection device for detecting contact or non-contact between the laser processing head and the workpiece, The conditions include a second condition that the laser processing head is in contact with the workpiece, The laser processing head according to claim 4 , wherein the command blocking unit blocks the manual laser emission command when the non-contact is detected by the contact detection device.

7. The contact detection device is A conductive cable electrically connecting the laser processing head and the workpiece; a resistance sensor for measuring a resistance of a closed circuit formed by the workpiece, the laser processing head in contact with the workpiece, and the conductive cable; The laser processing head of claim 6 , configured to detect the contact or the non-contact based on the resistance measured by the resistance sensor.

8. a standby time setting unit that sets a standby time from a time when the non-contact is detected by the contact detection device while the control device is performing the laser emission operation in the manual operation mode until the command interruption unit interrupts the manual laser emission command, 8. The laser processing head according to claim 6, wherein the command cut-off unit cuts off the manual laser emission command when the waiting time set by the waiting time setting unit has elapsed from the time point.

9. The laser processing head of claim 1 or 2, further comprising a command sending unit that sends a laser emission prohibition command to the control device to cause the control device to prohibit the laser emission operation in the automatic operation mode when the distance measured by the distance measuring sensor is outside a predetermined allowable range.

10. A detachable tool that is attached to and detached from a robot that moves the laser processing head; A gripping portion that can be held by an operator with one hand, 3. The laser processing head according to claim 1, wherein the first input device is provided adjacent to the grip portion so as to enable input operation with the one hand holding the grip portion.

11. Robots and The laser processing head according to claim 1 or 2, which is detachably attached to the robot; and a control device that executes the laser emission operation in the manual operation mode and the laser emission operation in the automatic operation mode.