Semiconductor module

Abstract

This semiconductor module comprises: a substrate; at least one semiconductor element located on the substrate; and an optical fiber cable connected to the semiconductor element. In addition, the optical fiber cable is directly or indirectly fixed to the substrate at a plurality of spots.

Description

Semiconductor Module

[0001] The disclosed embodiments relate to a semiconductor module.

[0002] Conventionally, semiconductor modules have been known in which semiconductor elements (hereinafter also referred to as optical elements) that convert electrical signals into optical signals are mounted on a substrate, and in some cases, these semiconductor modules are connected to optical fiber cables that transmit the converted optical signals from the optical elements to the outside (see Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2020-9824

[0004] The semiconductor module of the present disclosure includes a substrate, at least one semiconductor element located on the substrate, and an optical fiber cable connected to the semiconductor element, and the optical fiber cable is fixed directly or indirectly to the substrate at multiple locations.

[0005] FIG. 1 is a plan view of a semiconductor module according to an embodiment. FIG. 2 is a side view of the semiconductor module according to an embodiment. FIG. 3 is a plan view of a semiconductor module according to another embodiment 1. FIG. 4 is a side view of the semiconductor module according to another embodiment 1. FIG. 5 is an enlarged plan view of a semiconductor module according to another embodiment 1. FIG. 6 is an enlarged plan view of a semiconductor module according to another embodiment 2. FIG. 7 is a plan view of a semiconductor module according to another embodiment 3. FIG. 8 is an enlarged plan view of a semiconductor module according to another embodiment 3. FIG. 9 is a plan view of a semiconductor module according to another embodiment 4. FIG. 10 is a side view of a semiconductor module according to another embodiment 4. FIG. 11 is a plan view of a semiconductor module according to another embodiment 5. FIG. 12 is an enlarged plan view of a semiconductor module according to another embodiment 5.

[0006] Hereinafter, embodiments of the semiconductor module disclosed herein will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments described below. Furthermore, the embodiments can be appropriately combined as long as the processing content is not contradictory. Furthermore, the same components in the following embodiments are designated by the same reference numerals, and redundant explanations will be omitted.

[0007] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0008] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis direction, Y-axis direction, and Z-axis direction, which are perpendicular to each other, are defined, and the positive Z-axis direction is the vertically upward direction.

[0009] Conventionally, semiconductor modules have been known in which semiconductor elements (hereinafter also referred to as optical elements) that convert electrical signals into optical signals are mounted on a substrate. These semiconductor modules may be connected to optical fiber cables that transmit the converted optical signals from the optical elements to the outside.

[0010] However, in the above-mentioned conventional technology, the optical fiber cable is fixed only on the semiconductor element, so if external vibrations or impacts are applied to the substrate or the optical fiber cable, there is a risk that the connection point of the optical fiber cable may be damaged.

[0011] Therefore, there is a need for a technology that can overcome the above-mentioned problems and improve the mechanical strength of semiconductor modules.

[0012] First, a semiconductor module 1 according to an embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a plan view of the semiconductor module 1 according to the embodiment, and Fig. 2 is a side view of the semiconductor module 1 according to the embodiment.

[0013] In each of the following embodiments, the semiconductor module 1 will be described as an optical module in which an optical element 3 is mounted on a substrate, but the semiconductor module according to the present disclosure does not necessarily have to be an optical module.

[0014] 1 and 2, a semiconductor module 1 according to the embodiment includes a substrate 2, a plurality of optical elements 3 (optical elements 3a to 3d), and a heat dissipation member 4. The optical elements 3 are an example of semiconductor elements.

[0015] The substrate 2 has, for example, a rectangular plate shape in plan view. In addition to the optical elements 3a to 3d and the heat dissipation member 4, a power supply IC 5, a control IC 6, and a plurality of passive components 7 are positioned on a first surface 21 (here, the top surface) of the substrate 2. The passive components 7 include, for example, resistors, capacitors, and coils.

[0016] 1 and 2, a connector is located on the second surface 22 (here, the lower surface) of the substrate 2. The substrate 2 is electrically connected to a motherboard via this connector.

[0017] The optical element 3 is a semiconductor element that converts an electrical signal into an optical signal. Alternatively, the optical element 3 may convert an optical signal into an electrical signal. An interface unit 31 is located on the top surface of each optical element 3.

[0018] The interface section 31 is connected to an optical connector 33 via an optical fiber cable 32. That is, the optical fiber cable 32 is fixed to the substrate 2 via the interface section 31 and the optical element 3.

[0019] In an embodiment, the interface unit 31 and the optical connector 33 may be connected via a plurality of optical fiber cables 32. For example, in an embodiment, the interface unit 31 and the optical connector 33 may be connected via a transmitting-side cable group 32A and a receiving-side cable group 32B.

[0020] The transmitting side cable group 32A is made up of a plurality of optical fiber cables 32 that transmit optical signals transmitted from the optical element 3. The receiving side cable group 32B is made up of a plurality of optical fiber cables 32 that transmit optical signals received by the optical element 3.

[0021] The heat dissipation member 4 is a so-called heat sink, and is located above the plurality of optical elements 3. Note that the heat dissipation member 4 does not necessarily have to cover the entire upper surface of the plurality of optical elements 3. In other words, as shown in FIG. 1 , the upper surfaces of the plurality of optical elements 3 may be partially exposed from the heat dissipation member 4.

[0022] The heat dissipation member 4 is located close to the optical elements 3 and dissipates heat generated from the optical elements 3 to the outside of the semiconductor module 1. The heat dissipation member 4 may be in direct contact with the optical elements 3. Alternatively, the heat dissipation member 4 may be in contact with the optical elements 3 via a thermal interface material (TIM). In other words, the heat dissipation member 4 may be thermally connected to the optical elements 3.

[0023] The heat dissipation member 4 may be made of a metal with a relatively high thermal conductivity, such as aluminum, copper, iron, etc. A TIM is a composite material containing a thermally conductive filler in a resin.

[0024] The heat dissipation member 4 has a first portion 41 and a plurality of third portions (not shown). The first portion 41 is a plate-shaped portion that is disposed facing the first surface 21 of the substrate 2 at a distance. The plurality of third portions are leg-shaped portions that are provided on the first portion 41. Specifically, the plurality of third portions extend from the first portion 41 toward the substrate 2 and contact the substrate 2 (are placed on the substrate 2). The plurality of third portions are also positioned at intervals from one another along a predetermined direction (the Y-axis direction in the drawing).

[0025] These third portions have a shape in which their thickness is partially increased from the first portion 41. The third portions may be integrated with the first portion 41. The plurality of third portions may be connected to the first portion 41 and the substrate 2. The plurality of third portions extend in a fixed direction (here, the X-axis direction).

[0026] In addition, in the embodiment, the optical fiber cable 32 extends from the interface portion 31 in a direction approaching the heat dissipation member 4 (in the negative X-axis direction in the figure), passes above the heat dissipation member 4 in the same direction, and extends to the optical connector 33.

[0027] Here, in the embodiment, the optical fiber cable 32 may be fixed to the heat dissipation member 4 by an elastic member 42 located between the optical fiber cable 32 and the heat dissipation member 4. In other words, the optical fiber cable 32 may be fixed to the substrate 2 via the elastic member 42 and the heat dissipation member 4.

[0028] In this manner, in the embodiment, the optical fiber cable 32 may be indirectly fixed to the substrate 2 at a plurality of locations (here, the interface portion 31 and the elastic member 42). This makes it possible to reduce excessive load on the connection location of the optical fiber cable 32 (i.e., the interface portion 31) when the substrate 2 or the optical fiber cable 32 is subjected to external vibration or impact.

[0029] That is, in the embodiment, it is possible to improve the mechanical strength of the semiconductor module 1. Furthermore, in the embodiment, the optical fiber cable 32 is fixed to the substrate 2 at a plurality of points, which makes it possible to reduce breakage of the connection points of the optical fiber cable 32.

[0030] In addition, in the embodiment, the optical fiber cable 32 may be fixed to the substrate 2 via the heat dissipation member 4. This can improve the mechanical strength of the semiconductor module 1 and can also increase the heat dissipation efficiency of the multiple optical elements 3.

[0031] In addition, in the embodiment, the optical fiber cable 32 may be fixed to the heat dissipation member 4 via the elastic member 42. In this way, when external vibrations or impacts are applied to the substrate 2 or the optical fiber cable 32, the elastic member 42 can absorb such external vibrations or impacts.

[0032] That is, the embodiment can further improve the mechanical strength of the semiconductor module 1. The elastic member 42 may be made of a material having a suitable degree of elasticity, such as a resin, a sponge, or a silicone sheet.

[0033] In addition, in the embodiment, the interface unit 31 and the heat dissipation member 4 may be spaced apart from each other. This makes it possible to reduce the external vibration or impact on the interface unit 31 when the heat dissipation member 4 is subjected to external vibration or impact.

[0034] That is, in the embodiment, the mechanical strength of the semiconductor module 1 can be further improved.

[0035] Furthermore, in the example of Figures 1 and 2, an example is shown in which a midpoint of the optical fiber cable 32 is fixed to the substrate 2 via the heat dissipation member 4 and the elastic member 42, but the present disclosure is not limited to such an example.

[0036] For example, in the technology of the present disclosure, a midpoint of the optical fiber cable 32 may be directly fixed to a surface (e.g., the first surface 21) of the substrate 2. Furthermore, in the technology of the present disclosure, a midpoint of the optical fiber cable 32 may be indirectly fixed to the substrate 2 via a member that does not have a heat dissipation function.

[0037] This also reduces excessive load on the connection points of the optical fiber cable 32 when external vibrations or shocks are applied to the substrate 2 or the optical fiber cable 32. That is, in the embodiment, the mechanical strength of the semiconductor module 1 can be improved.

[0038] 1, the optical elements 3a to 3d are arranged in a direction (Y-axis direction) perpendicular to the extension direction (X-axis direction) of the optical fiber cable 32 when viewed along the extension direction of the optical fiber cable 32. Specifically, the optical elements 3a to 3d are arranged in the positive direction of the Y-axis in the order of optical element 3d, optical element 3c, optical element 3b, and optical element 3a.

[0039] Furthermore, the optical elements 3a to 3d are positioned apart from one another. With this configuration, when multiple optical elements 3a to 3d are positioned on the substrate 2, thermal interference between the optical elements 3a to 3d can be reduced.

[0040] 1, among the plurality of optical elements 3a to 3d, optical element 3a and optical element 3b located closest to optical element 3a are displaced from each other in the extension direction (X-axis direction) of optical fiber cable 32 and in a direction perpendicular to said extension direction (Y-axis direction). Similarly, among the plurality of optical elements 3a to 3d, optical element 3d and optical element 3c located closest to optical element 3d are displaced from each other in the X-axis direction and Y-axis direction.

[0041] In this way, the plurality of optical elements 3 are arranged with a staggered arrangement, which in this embodiment makes it possible to reduce the size of the substrate 2 while ensuring the distance between adjacent optical elements 3, in other words, while reducing the thermal interference between adjacent optical elements 3.

[0042] Here, an example has been described in which two adjacent optical elements (for example, optical element 3a and optical element 3b) among the plurality of optical elements 3a to 3d are spaced apart in the X-axis direction and the Y-axis direction. However, the present disclosure is not limited to this, and in all of the plurality of optical elements 3a to 3d, the positions of two adjacent semiconductor elements may be shifted in the extension direction of optical fiber cable 32 (X-axis direction) and in a direction perpendicular to this extension direction (Y-axis direction).

[0043] For example, the optical elements 3a to 3d may be arranged in a staggered manner, which also reduces the thermal interference between the optical elements 3 and allows the size of the substrate 2 to be reduced.

[0044] A blower (not shown), such as a cooling fan, that blows air toward the semiconductor module 1 may be located on the negative X-axis side of the semiconductor module 1. The blower generates air W that blows in the positive X-axis direction.

[0045] The wind W sent from the blower hits the first part 41 of the heat dissipation member 4 and flows along the first surface 21 of the substrate 2 so as to pass through the ventilation passage 100 formed between the substrate 2 and the first part 41.

[0046] In the embodiment, the wind W hits the plurality of optical elements 3 located on the outlet side of the ventilation passage 100, thereby further improving the heat dissipation efficiency of the plurality of optical elements 3.

[0047] Furthermore, in the embodiment, the plurality of optical elements 3 are arranged in a direction (here, the Y-axis direction) that intersects with the flow direction of the wind W, so that the wind W hits all of the optical elements 3 approximately evenly. Therefore, according to the embodiment, the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0048] 2 , the power supply IC 5 and the control IC 6 may be located below the heat dissipation member 4. The power supply IC 5 and the control IC 6 may be thermally connected to the heat dissipation member 4. This allows the heat generated from the power supply IC 5 and the control IC 6 to be efficiently dissipated by the heat dissipation member 4.

[0049] For example, a plurality of power supply ICs 5 may be located on the substrate 2. This makes it possible to supply power to the optical element 3 at a plurality of reference voltages.

[0050] Another embodiment Next, a semiconductor module 1 according to another embodiment will be described with reference to Fig. 3 to Fig. 12. Fig. 3 is a plan view of the semiconductor module 1 according to another embodiment 1, and Fig. 4 is a side view of the semiconductor module 1 according to another embodiment 1. Fig. 5 is an enlarged plan view of the semiconductor module 1 according to another embodiment 1.

[0051] 3 and other figures, in another embodiment 1, the configuration of the heat dissipation member 4 differs from that of the above-described embodiment. Specifically, in another embodiment 1, the heat dissipation member 4 may be configured with a first portion 41, a third portion (not shown), and a plurality of second portions 43.

[0052] The second portions 43 are positioned upright on the upper surface 41 a of the first portion 41. In another embodiment 1, the second portions 43 are plate-shaped (i.e., heat dissipation fins). The plate-shaped second portions 43 are positioned, for example, along the same direction as the direction in which the optical fiber cable 32 extends (the X-axis direction in the figure). The second portions 43 are also positioned side by side in a direction perpendicular to the direction in which the second portions 43 extend (the Y-axis direction in the figure).

[0053] In this way, by providing a plurality of second portions 43 positioned upright on the upper surface 41 a of the first portion 41 , the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0054] In another embodiment 1, as shown in Figure 3, etc., an optical fiber cable 32 may be positioned between adjacent second parts 43, and the optical fiber cable 32 may be fixed to the upper surface 41a of the first part 41 via an elastic member 42.

[0055] In this way, by passing the optical fiber cable 32 between adjacent second parts 43 and adhesively fixing it to the upper surface 41a of the first part 41, there is no need to extend it excessively in the planar direction of the substrate 2, and there is no need to arrange a separate fixing member.

[0056] Therefore, according to the first alternative embodiment, the semiconductor module 1 can be manufactured compactly and at low cost.

[0057] In another embodiment 1, as shown in Figure 5, the distance B1 between adjacent second portions 43 may be larger than the overall width A1 of all optical fiber cables 32 connected to the same optical element 3 (see Figure 3) (i.e., A1 < B1).

[0058] This reduces interference between all the optical fiber cables 32 connected to the same optical element 3 (see FIG. 3) and the second portion 43 on the upper surface 41 a of the first portion 41 .

[0059] Although the examples of FIGS. 3 to 5 show examples in which the second portion 43 has a plate shape (i.e., a heat dissipation fin), the present disclosure is not limited to such examples.

[0060] 6 is an enlarged plan view of a semiconductor module 1 according to another embodiment 2. For example, as shown in FIG. 6, the second portions 43 may be pin-shaped (i.e., heat dissipation pins). The pin-shaped second portions 43 are arranged in a matrix, for example, standing on the upper surface 41 a of the first portion 41. This also further improves the heat dissipation efficiency of the multiple optical elements 3.

[0061] FIG. 7 is a plan view of a semiconductor module 1 according to another embodiment 3, and FIG. 8 is an enlarged plan view of the semiconductor module 1 according to another embodiment 3. As shown in FIG.

[0062] 7 and other figures, in Alternative Embodiment 3, the arrangement of the second portion 43 differs from that of the above-described Alternative Embodiment 1. Specifically, in Alternative Embodiment 3, the second portion 43 is also located between the transmitting-side cable group 32A and the receiving-side cable group 32B connected to the same optical element 3.

[0063] This also eliminates the need for excessive extension in the planar direction of the substrate 2 and the need for a separate fixing member, as in the above-described alternative embodiment 1. Therefore, according to alternative embodiment 3, the semiconductor module 1 can be manufactured compactly and at low cost.

[0064] In another embodiment 3, the second portion 43 is also located between the transmitting cable group 32A and the receiving cable group 32B connected to the same optical element 3, thereby increasing the number of second portions 43 located on the heat dissipation member 4. This further improves the heat dissipation efficiency of the multiple optical elements 3.

[0065] In another embodiment 3, as shown in FIG. 8, the distance B1 between adjacent second portions 43 may be greater than the width A2 of the transmitting cable group 32A (or the receiving cable group 32B) (i.e., A2 < B1).

[0066] This reduces interference between the transmitting cable group 32A or the receiving cable group 32B and the second portion 43 on the upper surface 41a of the first portion 41.

[0067] In another embodiment 3, the distance A3 between the transmitting cable group 32A and the receiving cable group 32B connected to the same optical element 3 may be larger than the width B2 of the second portion 43 (i.e., B2 < A3).

[0068] This reduces interference between the transmitting cable group 32A or the receiving cable group 32B and the second portion 43 on the upper surface 41a of the first portion 41.

[0069] Fig. 9 is a plan view of a semiconductor module 1 according to another embodiment 4, and Fig. 10 is a side view of the semiconductor module 1 according to another embodiment 4. As shown in Fig. 10 and other figures, another embodiment 4 differs from the above-described embodiments in the arrangement of the optical fiber cables 32.

[0070] Specifically, in another embodiment 4, the optical fiber cable 32 may extend from the interface portion 31 in a direction away from the heat dissipation member 4 (in the positive direction of the X-axis in the figure), and may change direction to approach the heat dissipation member 4 (in the negative direction of the X-axis in the figure) at a curved portion 32a formed along the way.

[0071] In another fourth embodiment, the intermediate portion 32 b of the optical fiber cable 32 that has been turned toward the heat dissipation member 4 may be fixed to the upper surface 41 a of the first portion 41 of the heat dissipation member 4 .

[0072] This also reduces excessive load on the connection points of the optical fiber cable 32 when external vibrations or shocks are applied to the substrate 2 or the optical fiber cable 32. That is, in the embodiment, the mechanical strength of the semiconductor module 1 can be improved.

[0073] In another embodiment 4, the optical fiber cable 32 may be located between adjacent second portions 43. This eliminates the need for an extra extension in the planar direction of the substrate 2 and the need for a separate fixing member. Therefore, according to the another embodiment 4, the semiconductor module 1 can be manufactured compactly and at low cost.

[0074] In another embodiment 4, the orientation of the optical fiber cable 32 may be changed depending on the curved portion 32 a. This reduces the amount of load applied to the connection portion of the optical fiber cable 32, thereby reducing the risk of breakage of the connection portion of the optical fiber cable 32.

[0075] In another embodiment 4, the direction of the optical fiber cable 32 is changed by the curved portion 32a, thereby reducing loss of the optical signal transmitted through the optical fiber cable 32. The radius of curvature of the curved portion 32a is preferably, for example, 15 mm or more.

[0076] In another fourth embodiment, as shown in FIG. 10, the upper end 32a1 of the curved portion 32a may be located higher than the portion 32b of the optical fiber cable 32 that is fixed to the heat dissipation member 4.

[0077] In this way, by raising the upper end 32a1 of the curved portion 32a, the radius of curvature of the curved portion 32a can be increased, thereby reducing damage to the connection point of the optical fiber cable 32 and reducing loss of the optical signal.

[0078] Furthermore, by lowering the portion 32b fixed to the heat dissipation member 4, the height of the second portion 43 itself can be increased even if the height of the entire heat dissipation member 4 is the same, thereby further improving the heat dissipation efficiency of the multiple optical elements 3.

[0079] In each of the embodiments described so far, an example has been shown in which a pair of interface units 31 and optical connectors 33 are connected by two cable groups (transmitting side cable group 32A and receiving side cable group 32B), but the present disclosure is not limited to such examples.

[0080] Fig. 11 is a plan view of a semiconductor module 1 according to another embodiment 5, and Fig. 12 is an enlarged plan view of the semiconductor module 1 according to another embodiment 5. As shown in Fig. 11 and other figures, in another embodiment 5, a pair of interface units 31 and optical connectors 33 may be connected by a single optical fiber cable group 32C.

[0081] Such a group of optical fiber cables 32C may include optical fiber cables 32 that transmit optical signals transmitted from the optical element 3, or may include optical fiber cables 32 that transmit optical signals received by the optical element 3.

[0082] In another embodiment 5, a midpoint of the optical fiber cable group 32C may be fixed to the heat dissipation member 4. This can improve the mechanical strength of the semiconductor module 1.

[0083] In another embodiment 5, as shown in FIG. 12, the distance B1 between adjacent second portions 43 may be greater than the width A4 of the optical fiber cable group 32C (that is, A4<B1).

[0084] This reduces interference between the optical fiber cable group 32C and the second portion 43 on the upper surface 41a of the first portion 41.

[0085] While the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments and various modifications are possible without departing from the spirit of the present disclosure. For example, in each of the above embodiments, an example has been shown in which multiple elastic members 42 that respectively fix multiple cable groups are positioned in a row in the Y-axis direction, but the present disclosure is not limited to such an example.

[0086] For example, the elastic members 42 may be positioned at the same intervals as the corresponding optical elements 3. This also improves the mechanical strength of the semiconductor module 1.

[0087] Further advantages and other aspects may readily occur to those skilled in the art. Therefore, the disclosure in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

[0088] The present technology may also be configured as follows: (1) A semiconductor module comprising: a substrate; at least one semiconductor element located on the substrate; and an optical fiber cable connected to the semiconductor element, wherein the optical fiber cable is directly or indirectly fixed to the substrate at a plurality of locations. (2) The semiconductor module according to (1), further comprising: a heat dissipation member located above the semiconductor element, wherein the optical fiber cable is fixed to the substrate via the heat dissipation member. (3) The semiconductor module according to (2), further comprising: an elastic member located between the optical fiber cable and the heat dissipation member. (4) The semiconductor module according to (2) or (3), wherein the heat dissipation member has a first portion and a plurality of second portions standing on the first portion, wherein the optical fiber cable is located between adjacent second portions and fixed to the first portion. (5) The semiconductor module according to (4), further comprising: a transmitting cable group consisting of a plurality of the optical fiber cables that transmit optical signals transmitted from the semiconductor element; and a receiving cable group consisting of a plurality of the optical fiber cables that transmit optical signals received by the semiconductor element, wherein the second portion is located between the transmitting cable group and the receiving cable group that are connected to the same semiconductor element. (6) The semiconductor module according to any one of (2) to (5), further comprising: an interface portion located on an upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable, wherein the optical fiber cable extends from the interface portion in a direction away from the heat dissipation member and changes direction toward the heat dissipation member at a curved portion formed midway. (7) The semiconductor module according to (6), wherein an upper end of the curved portion is located higher than a portion of the optical fiber cable that is fixed to the heat dissipation member. (8) The semiconductor module according to any one of (2) to (7), further comprising an interface portion located on an upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable, wherein the interface portion and the heat dissipation member are spaced apart from each other.

[0089] REFERENCE SIGNS LIST 1 semiconductor module 2 substrate 3, 3a to 3d optical element (an example of a semiconductor element) 32 optical fiber cable 32A transmitting side cable group 32B receiving side cable group 32C optical fiber cable group 32a curved portion 32a1 upper end portion 32b portion 4 heat dissipation member 41 first portion 41a upper surface 42 elastic member 43 second portion

Claims

1. A substrate, at least one semiconductor element located on the substrate, an optical fiber cable connected to the semiconductor element, comprising: the optical fiber cable is directly or indirectly fixed to the substrate at a plurality of locations; a semiconductor module.

2. further comprising a heat dissipation member located above the semiconductor element, the optical fiber cable is fixed to the substrate via the heat dissipation member; the semiconductor module according to Claim 1.

3. further comprising an elastic member located between the optical fiber cable and the heat dissipation member; the semiconductor module according to Claim 2.

4. the heat dissipation member has a first part and a plurality of second parts standing on the first part, the optical fiber cable is located between adjacent second parts and is fixed to the first part; the semiconductor module according to Claim 2 or 3.

5. a transmission-side cable group composed of a plurality of the optical fiber cables for transmitting an optical signal transmitted from the semiconductor element, a reception-side cable group composed of a plurality of the optical fiber cables for transmitting an optical signal received by the semiconductor element, further comprising: the second part is located between the transmission-side cable group and the reception-side cable group connected to the same semiconductor element; the semiconductor module according to Claim 4.

6. further comprising an interface part located on the upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable, the optical fiber cable extends away from the heat dissipation member from the interface part and changes direction to approach the heat dissipation member at a curved part formed in the middle; the semiconductor module according to Claim 2 or 3.

7. the upper end of the curved part is at a position higher than the part where the optical fiber cable is fixed to the heat dissipation member; the semiconductor module according to Claim 6.

8. further comprising an interface part located on the upper surface of the semiconductor element and connecting the semiconductor element and the optical fiber cable, the interface part and the heat dissipation member are spaced apart from each other; the semiconductor module according to Claim 2 or 3.