Method for peeling temporary-fixing tape, peelable member, component (member) manufacturing device, and component (member) manufacturing method
Patent Information
- Application Number
- JP2024567969
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Priority Date
- 2023-12-28
- Filing Date
- 2023-12-28
- Publication Date
- 2025-07-11
AI Technical Summary
Current methods for peeling temporary fixing tapes in electronic component manufacturing, such as heat-foaming and UV-cured release tapes, face challenges like contamination from adhesive residue, quality issues due to heat exposure, and complexity in temperature control, and require external stimuli like heat or light for peeling, which can damage products.
A method involving a stretchable temporary fixing tape with a peelable adhesive layer that is stretched in one or multiple directions to detach from components without external stimulation, utilizing a peeling member with a stretching mechanism to apply tension perpendicular to the adhesive surface, allowing for efficient and residue-free peeling.
This method enables easy and efficient peeling of temporary fixing tapes from electronic components without contamination, eliminating the need for heat or light, thus preventing damage and simplifying the peeling process, while ensuring the quality of the components.
Abstract
Description
Temporary fixing tape peeling method, peeling member and part (member) manufacturing device, and part (member) manufacturing method
[0001] The present invention relates to a method for removing a temporary fixing tape that temporarily fixes a member in a manufacturing process of a member such as an electronic component, a removing member, a manufacturing apparatus for a component (member), and a manufacturing method for a component (member).
[0002] In the manufacturing process of electronic components such as semiconductor wafers, multilayer ceramic capacitors (sometimes referred to as MLCCs), and inductors, electronic components are temporarily fixed on adhesive tape, and after various processes such as grinding, processing, transport, and chipping by dicing are performed, the processed electronic components are peeled off from the adhesive tape. Tapes used to temporarily fix components (components) in such manufacturing processes are sometimes referred to as "temporary fixing tapes" or "process tapes." Temporary fixing tapes are required to have adhesive properties that prevent the components (components) from peeling off during processing, but also to be easily peeled off from the components (components) after processing without contaminating them.
[0003] For example, Patent Document 1 discloses a method for peeling off a component (member) by heating a heat-foaming release tape in a state where the component (member) is temporarily fixed to the tape, thereby foaming or expanding balloons in the adhesive layer, thereby reducing the adhesive function of the adhesive layer (see, for example, Patent Document 1). Patent Document 2 discloses a method for peeling off a component (member) by irradiating an active energy ray such as UV light with a component (member) temporarily fixed to the tape, thereby reducing the adhesive function by a curing reaction of the adhesive layer (see, for example, Patent Document 2).
[0004] Japanese Patent No. 5572418 Japanese Patent Application Laid-Open No. 2015-108044
[0005] Heat-foaming release tape requires heating during release, which can affect the temporarily fixed product, potentially affecting the product. In particular, in the manufacturing process of MLCCs, applying heat to laminated thin films can cause quality problems such as cracking. Furthermore, because multiple processing steps are performed consecutively, products may be transferred from one temporary fixing tape to another between processes. In this case, multiple temporary fixing tapes are temporarily fixed to a single product, and some temporary fixing tapes are released and some are not, depending on the process. This necessitates the use of two types of process tapes with different foaming temperatures. Furthermore, precise temperature control is required to ensure that the temporarily fixing tape that is released foams and the temporarily fixing tape that is not released does not foam. Such temperature control is difficult, and the expected peeling efficiency is not always achieved.
[0006] In the temporary fixing method using an active energy ray-curable peelable tape, when the tape is peeled off by irradiating it with UV, the product may be affected by the irradiation of the active energy ray. Furthermore, the product needs to be UV-transmitting, and if the temporary fixing tape is not irradiated with a sufficient amount of UV, the adhesive strength may not be sufficiently reduced, making the product difficult to peel off or leaving adhesive residue. Furthermore, the UV irradiation device is large and expensive, which complicates the manufacturing equipment and manufacturing process.
[0007] The present invention has been made in view of the above-mentioned circumstances, and has an object to provide a method for peeling off a temporary fixing tape that is unlikely to contaminate a part (component) due to adhesive residue and that can be peeled off from the part (component) efficiently in a simple manner, a peeling member, a part (component) manufacturing device that is equipped with the peeling member, and a method for manufacturing a part (also referred to as a component or a processed product).
[0008] The present invention has the following aspects. [1] A method for peeling off a temporary fixing tape having one or more components fixed thereto, the temporary fixing tape having an extensible base and a temporary fixing layer on one surface of the extensible base, being releasable by stretching, the components being fixed to the temporary fixing layer, and the temporary fixing tape being stretched in at least one direction by a stretching means to peel off the temporary fixing tape from the components. [2] The method for peeling off a temporary fixing tape according to [1] above, in which the temporary fixing tape is stretched in two different directions, the two directions forming an angle of approximately 90°. [3] The method for peeling off a temporary fixing tape according to [1] or [2] above, in which the temporary fixing tape is stretched in all directions. [4] The method for peeling off a temporary fixing tape according to any of [1] to [3] above, in which the stretching means applies tension in the horizontal direction to the adhesive surface between the component and the temporary fixing layer. [5] The method for peeling off a temporary fixing tape according to any one of [1] to [4] above, wherein the stretching means applies tension to the adhesive surface between the component and the temporary fixing layer in a direction opposite to the component-mounting side. [6] The method for peeling off a temporary fixing tape according to any one of [1] to [5] above, wherein the stretching means has a stretching member, and the stretching member presses the temporary fixing tape from the side opposite to the component-mounting side of the temporary fixing tape, thereby peeling off the temporary fixing tape from the component. [7] The method for peeling off a temporary fixing tape according to [6] above, wherein the stretching member has an annular shape in a plan view having an outer periphery and a hollow region inside the outer periphery, and a part of the surface of the outer periphery is covered by a covering portion that can rotate along the outer periphery of the outer periphery. [8] The method for peeling off a temporary fixing tape according to any of [1] to [7] above, wherein, when the temporary fixing tape is stretched in the one direction by the stretching means, the length of the temporary fixing tape after stretching in the direction generally perpendicular to the one direction is 0.9 or more relative to the length of the temporary fixing tape before stretching in the direction generally perpendicular to the one direction. [9] The method for peeling off a temporary fixing tape according to any of [1] to [8] above, wherein the temporary fixing layer of the temporary fixing tape is an adsorption layer having a large number of recesses formed on its surface.
[10] The method for peeling off a temporary fixing tape according to any of [1] to [9] above, wherein the temporary fixing layer of the temporary fixing tape is an adhesive layer.
[11] The method for peeling a temporary fixing tape according to any one of [1] to
[10] above, wherein the stress at 50% elongation (50% modulus) of the temporary fixing tape is in the range of 0.15 MPa to 20 MPa, and the elongation at break is 200% or more.
[12] The method for peeling a temporary fixing tape according to any one of [1] to
[11] above, wherein the elongation at peeling of the temporary fixing tape is in the range of 101% to 1500%.
[13] The method for peeling a temporary fixing tape according to any one of [1] to
[12] above, wherein the component is an electronic component.
[14] The surface area of the surface of the component that comes into contact with the temporary fixing tape is 100 mm. 2The method for peeling a temporary fixing tape according to any one of [1] to
[13] above, which is as follows:
[15] A peeling member used for peeling a temporary fixing tape having an extensible substrate and a temporary fixing layer on one surface of the extensible substrate, and which is peelable by stretching, the peeling member having a holding part for holding the temporary fixing tape, a hollow part formed by the holding part, and stretching means, the holding part being arranged so that the temporary fixing tape covers the hollow part, and the stretching means having a function of stretching the temporary fixing tape in at least one direction within the plane of the temporary fixing tape covering the hollow part.
[16] The peeling member according to
[15] above, wherein the stretching means is a roll, and the roll is arranged in a first stretching direction.
[17] The peeling member according to
[15] above, wherein the stretching means is a roll, and the roll is arranged in each of the first stretching direction and a second stretching direction which forms an angle of approximately 90° with respect to the first stretching direction.
[18] The peeling member according to
[15] above, wherein the stretching means is drivable up and down within the hollow portion, and further comprises a stretching member that passes through the hollow portion and presses the temporary fixing tape covering the hollow portion in the passing direction.
[19] The peeling member according to
[18] above, wherein the stretching member is annular in plan view having an outer periphery and a hollow region inside the outer periphery, and a part of the surface of the outer periphery is covered by a covering portion that is rotatable along the outer periphery of the outer periphery.
[20] A component manufacturing device comprising the temporary fixing tape peeling member according to any of
[15] to
[19] above.
[21] A component manufacturing method comprising at least a peeling step of peeling a component fixed on a temporary fixing tape using the temporary fixing tape peeling method according to any of [1] to
[14] above.
[22] The component manufacturing method according to
[21] above, wherein the component is an electronic component.
[23] The component has a surface area of 100 mm2 or less of the surface that comes into contact with the temporary fixing tape. 2
[24] The method for manufacturing a component according to any one of
[21] to
[23] above, wherein the component is a multilayer ceramic capacitor.
[0009] According to the method for peeling off a temporary fixing tape of the present invention, components fixed to one side of the tape can be easily and simply peeled off by simply pulling and stretching the temporary fixing tape in one or more desired directions. Therefore, when peeling off the tape from the components, it is not necessary to apply external stimuli such as light or heat, which are used in conventional methods for peeling off temporary fixing tapes, making the peeling operation easy and preventing adhesive residue on the components.
[0010] That is, according to the present invention, it is possible to provide a method for peeling a temporary fixing tape that is unlikely to contaminate a part (component) due to adhesive residue and that can be peeled from the part (component) efficiently in a simple manner, a peeling member, a part (component) manufacturing device that is provided with the peeling member, and a method for manufacturing a part (component, processed product).
[0011] FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. FIG. 15 is a schematic diagram showing an example of a method for peeling off a temporary fixing tape according to the present disclosure. Fig. 1 is a schematic diagram showing an example of a stretching means (stretching member). Fig. 2 is a schematic diagram showing an example of a stretching means (stretching member). Fig. 3 is a schematic diagram showing an embodiment of a method for manufacturing a component (component) according to the present disclosure. Fig. 4 is a schematic diagram illustrating the vertical movement distance of the stretching means (stretching member) (the protrusion distance of the tape by the stretching means) when the component (component) is peeled off from the temporary fixing tape. Fig. 5 is a schematic diagram showing a method for measuring the surface adhesive strength of the temporary fixing tape.
[0012] 1. Method for Peeling Off Temporary Fixing Tape The method for peeling off a temporary fixing tape disclosed herein (hereinafter may be referred to as "this peeling method") is a method for peeling off a temporary fixing tape having one or more components (members) temporarily fixed to a surface thereof, the temporary fixing tape having an extensible base material and a temporary fixing layer on one surface of the extensible base material, and being peelable by stretching, the components (members) being temporarily fixed to the temporary fixing layer, and the temporary fixing tape being stretched in at least one direction by stretching means to peel off the tape from the components (members).
[0013] The parts fixed to the temporary fixing tape are also called members. When parts are processed, the parts before processing may be referred to as "workpiece" or "parts before processing," and the parts after processing may be referred to as "workpiece" or "parts after processing." Parts before and after processing may be collectively referred to as "parts" or "adherends." Hereinafter, they may be referred to as "parts."
[0014] "Stretching" and "extension" refer to the extension of the length of an object such as a tape or a substrate. In the invention of the present disclosure, the term "extension" is sometimes used because it includes cases where an object such as a tape or a substrate not only extends in length but also stretches out. In this specification, "extension", "extension", and "extension" are used interchangeably unless otherwise specified.
[0015] Fig. 1 is a schematic diagram showing an example of a method for peeling off a temporary process tape according to the present disclosure, with Fig. 1(a) being a perspective view and Figs. 1(b) and 1(c) being side views. As illustrated in Fig. 1, this peeling method is a method in which one or more components (members) 3 are temporarily fixed on the temporary fixing layer 1 of a temporary fixing tape 100 that is peelable by stretching and that has a temporary fixing layer 1 on one side of an extensible substrate 2, and the temporary fixing tape 100 is stretched in at least one direction (arrow P) by a stretching means, thereby peeling it off from the component (member) 3 (Figs. 1(b) and 1(c)).
[0016] The temporary fixing tape used in this peeling method is releasable by stretching. The term "releasable by stretching" means that when the temporary fixing tape is stretched (stretched) in one or more directions, the tape stretches and peels from the adherend. Specifically, the adhesive area between the tape and the component decreases, making it releasable from the component. In this peeling method, a temporary fixing tape having the above-described functions is used. Therefore, stretching the temporary fixing tape generates stretching stress in the temporary fixing tape. Furthermore, as the adhesive surface peels from the periphery due to stretching, the adhesive area gradually decreases. It is believed that when this stretching stress becomes greater than the adhesive force between the component and the temporary fixing layer, the component will peel from the temporary fixing tape. Therefore, this peeling method does not require heating or light irradiation treatment for peeling, or equipment for performing such treatment, as is the case with conventional thermal expansion peeling tapes and UV-curable peeling tapes. Furthermore, to enable tape peeling by these treatments, there is no need to consider the optical properties or heat resistance of the tape or the component, and deterioration or damage to the component is less likely to occur. Furthermore, unlike expanding tape used to separate multiple processed parts, the temporary fixing tape used in this peeling method is easier to stretch and peels from the parts during the stretching process, so it can be easily peeled off just by stretching.
[0017] [Peeling Method] In this peeling method, the temporary fixing tape is stretched in at least one direction by a stretching means to peel it off from a component (member). Fig. 2 is a schematic diagram showing an example of the peeling method of the temporary fixing tape of the present disclosure, and corresponds to a view of the temporary fixing tape on which a component is placed (temporarily fixed) as seen from the component placement surface (top surface). As schematically shown in Fig. 2, the adhesive surface 4 between the temporary fixing layer (not shown) of the temporary fixing tape 100 and the component 3 (not shown) is stretched in a first stretching direction (arrow P). Fig. 2 schematically shows a case where the first stretching direction P is one direction parallel to the longitudinal direction of the temporary fixing tape 100.
[0018] The temporary fixing tape is usually stretched by applying tension, and when the directions of tension are different, the stretching directions are considered to be different. When the directions of tension are the same or opposite by 180°, the stretching directions are considered to be the same.
[0019] The number of components (members) temporarily fixed on the temporary fixing layer of the temporary fixing tape is not particularly limited, and may be one, or two or more components may be temporarily fixed. In addition, the multiple components may be arranged without any space between them, or may be arranged with intervals between them.
[0020] The component (member) to be temporarily fixed to the temporary fixing tape may be temporarily fixed to the upper surface of the temporary fixing tape, or may be temporarily fixed to the lower surface of the temporary fixing tape. The upper surface of the temporary fixing tape refers to the surface above the substrate when viewed from the side (cross section) of the temporary fixing tape, and the component is temporarily fixed by a temporary fixing layer located above the substrate of the temporary fixing tape. The lower surface of the temporary fixing tape refers to the surface below the substrate when viewed from the side (cross section) of the temporary fixing tape, and the component is temporarily fixed by a temporary fixing layer located below the substrate of the temporary fixing tape. When the component is temporarily fixed to the lower surface of the temporary fixing tape, the temporary fixing tape is stretched to separate from the component, and at the same time, the component falls under its own weight and can be detached from the temporary fixing tape, which is preferable because it eliminates the need for tasks such as picking up the component after separation.
[0021] In a plan view of the temporary fixing tape, the temporary fixing layer may have an excess portion (hereinafter also referred to as "excess portion") which is a region other than the adhesive surface with the component. By applying tension to the excess portion and stretching it, the temporary fixing tape including the adhesive surface can be stretched.
[0022] In this peeling method, when the temporary fixing tape is stretched in one direction by the stretching means, it is preferable that the length L' of the stretched temporary fixing tape in the direction generally perpendicular to the stretching direction is 0.9 or more relative to the length L of the temporary fixing tape before stretching in the direction generally perpendicular to the stretching direction. When the temporary fixing tape is stretched, the width in the direction generally perpendicular to the stretching direction becomes smaller than the width before stretching due to a necking phenomenon. When multiple components are temporarily fixed to the surface of the temporary fixing layer, the occurrence of a necking phenomenon can easily cause damage to the components due to collisions between the components. According to this peeling method, by setting the ratio (L' / L) of the length L of the temporary fixing tape before stretching in the direction generally perpendicular to the stretching direction to the length L of the temporary fixing tape before stretching in the direction generally perpendicular to the stretching direction to be 0.9 or more, the temporary fixing tape can be efficiently peeled from the components while suppressing collisions between the components due to necking. In particular, L' / L is preferably 1 or more, more preferably greater than 1, and even more preferably 1.1 or more. L' / L is usually 2 or less, and more preferably 1.5 or less from the viewpoint of quickly carrying out the present peeling method.
[0023] The temporary fixing tape is stretched in at least one direction. The first stretching direction can be set arbitrarily in a plan view of the temporary fixing tape. For example, in the case of a temporary fixing tape having a longitudinal direction and a lateral direction, the first stretching direction may be a direction parallel to the longitudinal direction, a lateral direction, a direction roughly perpendicular to the longitudinal direction, or another direction such as a direction inclined at a desired angle relative to the longitudinal direction. Furthermore, regardless of the longitudinal direction and lateral direction of the tape, a single direction may be set based on an arbitrary point in the plane of the temporary fixing tape. The first stretching direction may be unidirectional or bidirectional, as will be described later.
[0024] Note that "substantially perpendicular" does not necessarily mean that the angle is exactly 90° relative to the stretching direction; it is sufficient if the angle is approximately 90°. Directions that form an angle of 85° to 95°, and even directions that form an angle of 88° to 92°, relative to the stretching direction are acceptable.
[0025] An example of this peeling method is the method schematically shown in FIG. 3 , but this peeling method is not limited to this example. FIG. 3 is a schematic diagram showing an example of a method for peeling a temporary fixing tape according to the present disclosure, with FIG. 3( a) being a side view and FIG. 3( b) being a top view. FIG. 3 schematically shows an example in which a component 3 is temporarily fixed to a temporary fixing layer (not shown) of a temporary fixing tape 100, and the temporary fixing tape 100 is stretched in a first stretching direction P by a stretching means 10. FIG. 3 illustrates an example in which the stretching means 10 is two rolls facing each other in the first stretching direction P, and the rotation directions of the two rolls constituting the stretching means 10 are reversed, thereby pulling and stretching the tape from both sides in the first stretching direction P in both directions by the rotation of each roll. The temporary fixing tape may be stretched in a unidirectional first stretching direction by differentiating the peripheral speeds of the two rolls. Note that FIG. 1 shows an example in which the first stretching direction P is unidirectional, while FIG. 3 shows an example in which the first stretching direction P is bidirectional.
[0026] The stretching means is not limited to a roll, and may be, for example, a stretching means that uses two or more movable temporary fixing tape holders, holds different ends of the temporary fixing tape with the temporary fixing tape holders, and moves the temporary fixing tape holders. At least one of the two or more temporary fixing tape holders moves in a different direction or at a different speed from the other temporary fixing tape holders, thereby stretching the temporary fixing tape. In the embodiment of Fig. 3, tension is applied in the horizontal direction to the adhesive surface between the component (member) 3 and the temporary fixing layer of the temporary fixing tape 100 by the stretching means 8. Note that Fig. 3 shows an embodiment in which the component 3 is placed on the upper surface of the temporary fixing tape 100 and temporarily fixed thereto, but the component may also be placed on the lower surface of the temporary fixing tape 100 and temporarily fixed thereto.
[0027] In the case of a long temporary fixing tape, from the viewpoint of being able to stretch continuously, stretching in the first stretching direction is preferably performed by a stretching means using two or more rolls. The stretching ratio in the first stretching direction is not particularly limited, but from the viewpoint of being able to peel the entire temporary fixing tape, it is preferably 1.1 or more. From the viewpoint of the efficiency of the peeling operation, a stretching ratio of 2 or less is preferred.
[0028] When this peeling method is performed on a component (member) production line, the first stretching direction is preferably a direction intersecting the transport direction of the temporary fixing tape, and more preferably a direction approximately perpendicular to the transport direction. This is because it is possible to peel off the temporarily fixed components while transporting the temporary fixing tape. Furthermore, when this peeling method is performed on a component production line, the stretching direction may be omnidirectional. Stretching methods that enable the stretching direction to be omnidirectional on a production line are not particularly limited, but examples include a method in which a stretching member is pressed against the transported temporary fixing tape from the side opposite the component placement side to protrude the temporary fixing tape so that it forms a convex shape toward the component placement side (a push-up or push-down method). Performing this peeling method on a component production line refers to, for example, continuously manufacturing pre-processed components on the temporary fixing tape, or performing processing such as cutting or dicing on the pre-processed components, and then peeling the components from the temporary fixing tape using this peeling method.
[0029] In this peeling method, the stretching means may stretch the temporary fixing tape in two or more different directions. That is, the stretching means may stretch the temporary fixing tape in one direction (first stretching direction) and one or more directions (also referred to as "different stretching directions") different from the one direction (first stretching direction). The stretching direction may be one direction, two or more directions, or all directions. When the stretching direction is one direction, the device for this peeling method can simply and efficiently peel the temporary fixing tape. When the different stretching directions are two or more directions (particularly all directions), the adhesive surface is stretched in two or more directions, so the temporary fixing tape can be uniformly peeled from the part. When stretching in different stretching directions, the holder may function as the stretching means by being driven. When stretching the temporary fixing tape in two or more different directions, stretching in each direction may be performed simultaneously (simultaneous stretching) or sequentially (sequential stretching). The stretching means can be appropriately selected depending on the stretching method, and examples thereof include rolls, grippers, stages, pins, etc., which are preferably movable. For example, the stage and pins are preferably movable up and down.
[0030] When the temporary fixing tape is stretched in different directions, the stretching ratios in the different directions are not particularly limited, but are preferably 1.1 or more. From the viewpoint of the efficiency of the peeling operation, a stretching ratio of 2 or less is preferred. When the tape is stretched in two or more different directions, the respective stretching ratios may be the same or different.
[0031] In this peeling method, the temporary fixing tape may be stretched in two different directions. It is preferable that the two stretching directions form an angle of approximately 90°. In this peeling method, the stretching means stretches the temporary fixing tape in two directions, one direction P and one direction P2 different from the one direction P1, and it is preferable that the two directions P1 and P2 form an angle of approximately 90°, i.e., that the two directions are approximately perpendicular to each other, because this enables uniform stretching. The range of an angle of approximately 90° is the same as the range of "approximately perpendicular" described above. When the angle formed by the direction P1 and the direction P2 is 180°, the directions P1 and P2 are bidirectional and are the same stretching direction.
[0032] FIG. 4 is a schematic diagram showing an example of this peeling method, as seen from the mounting surface (top surface) side of the part (member). In FIG. 4( a), two rolls are arranged as the stretching means 8 facing each other in the first stretching direction P1, and one roll is moved in the unilateral first stretching direction P1 to stretch the temporary fixing tape 100 in the unilateral first stretching direction P1. As another example of the peeling method, the temporary process tape may be stretched in both first stretching directions by varying the peripheral speeds of the two rolls that constitute the stretching means 8 in FIG. 4. In particular, when a long temporary fixing tape is continuously stretched, a stretching means using two or more rolls is preferred for stretching in the first stretching direction. As shown schematically in Fig. 4, by stretching the temporary fixing tape 100, the area of the adhesive surface 4 on the surface of the component 3 that is in contact with the temporary fixing tape 100 (the area shown by the dashed lines in Figs. 4(a) and 4(b)) is reduced to a value smaller than the area of the adhesive surface before stretching, and the temporary fixing tape 100 is peeled off from the component 3. In the example shown in Fig. 4(a), a holding part 9 that holds the temporary fixing tape is provided in a direction intersecting with the first stretching direction P1. The holding part 9 may also function as a stretching means.
[0033] 4(b) shows an example in which two rolls are arranged as the first stretching means 8A facing each other in a first stretching direction P1, and two rolls are arranged as the second stretching means 8B facing each other in a stretching direction (second stretching direction) P2 different from the first stretching direction P1. In the example shown in FIG. 4(b), one roll serving as the first stretching means 8A moves in one direction in the first stretching direction P1, and one roll serving as the second stretching means 8B moves in one direction in the second stretching direction P2, thereby biaxially stretching the tape in directions P1 and P2. In the peeling method exemplified in FIG. 4(b), the temporary fixing tape 100 may be stretched in one direction or both directions in the first stretching direction P1 by the first stretching means 8A, or in one direction or both directions in the second stretching direction P2 by the second stretching means 8B, or both. 4(b), the different stretching direction (second stretching direction) P2 is a direction that is roughly perpendicular to the first stretching direction P1, but this is not limited to this in the present peeling method, and the angle between the first stretching direction and the second stretching direction may be greater than 0 and less than 360°. However, cases where the angle between the first stretching direction and the different stretching direction is 180° are excluded, as these are considered to be bidirectional and the same stretching direction. In particular, from the viewpoint of uniformly peeling the temporary fixing tape from the component, it is preferable that the different stretching direction is roughly perpendicular to the first stretching direction.
[0034] 4(b) illustrates a method in which the temporary fixing tape is stretched while the stretching means 8A, 8B move in the stretching direction, but as shown in FIG. 4(c), for example, the rolls serving as the stretching means 8A, 8B may rotate at fixed positions, so that the rotation of the roll serving as the first stretching means 8A stretches the temporary fixing tape 100 in both directions in a first stretching direction P1, and the rotation of the roll serving as the second stretching means 8B stretches the temporary fixing tape 100 in both directions in a second stretching direction P2. In this case, it is preferable that the rolls serving as the stretching means 8A, 8B have the function of holding the temporary fixing tape 100, that is, they serve as both stretching means and holding parts.
[0035] In the present peeling method, the temporary fixing tape may be stretched in all directions. In the present peeling method, the stretching means stretches the temporary fixing tape in all directions, whereby the temporary fixing tape is stretched in all directions within its plane, thereby enabling uniform stretching.
[0036] 5 is a schematic diagram showing an embodiment in which the temporary fixing tape 100 is stretched in all directions. Stretching the temporary fixing tape in all directions means that, when any one point on the plane of the temporary fixing tape is the center, the temporary fixing tape is stretched in all directions of 360° around the center. By stretching in all directions on the plane of the temporary fixing tape 100, the adhesive surface 4 between the temporary fixing layer and one or more components (members) can also be stretched in all directions of 360°. Note that, although the adhesive surface 4 in FIG. 5 is rectangular, the shape of the adhesive surface 4 is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, a triangular shape, a polygonal shape with five or more sides, or the like, appropriately set depending on the shape of the adherend surface of the component.
[0037] The method of stretching the temporary fixing tape (adhesive surface) in two or more stretching directions may be sequential stretching or simultaneous stretching. When there are two or more different stretching directions, the temporary fixing tape (adhesive surface) may be stretched in a plurality of different stretching directions in order, or may be stretched in a plurality of different stretching directions simultaneously, or may be stretched in a combination of these. When the temporary fixing tape is stretched in all directions, it is preferable to stretch it in all directions simultaneously. Since the stretching is performed by applying tension to the excess part of the temporary fixing tape, the order of stretching can be controlled by controlling the direction in which tension is applied to the excess part according to the order of stretching.
[0038] When stretching in the first stretching direction and stretching in a different stretching direction are carried out simultaneously, any one of the directions is set as the first stretching direction.
[0039] The stretching of the adhesive surface between the component (member) and the temporary fixing layer is carried out, for example, by applying tension to the excess portion. Specifically, tension is applied to the tape by a method of gripping and pulling the temporary fixing tape with a stretching means, a method of pulling the temporary fixing tape while winding it with a stretching means, a method of pressing (pressing) a movable stage against the temporary fixing tape as a stretching means to push the temporary fixing tape (pushing it up or down), or the like. The stretching means may apply tension to the adhesive surface between the component and the temporary fixing layer in the horizontal direction, or may apply tension in the direction opposite to the side of the temporary fixing tape on which the component is placed.
[0040] 6 shows an example in which tension is applied in the direction opposite to the side of the temporary fixing tape 100 on which the component 3 is placed. Applying tension in the direction opposite to the side on which the component (member) 3 is placed is preferable from the viewpoint of saving space in the device. The direction in which tension is applied (symbol Q in FIG. 6 ) can be, for example, the direction in which the end of the temporary fixing tape is pulled against the adhesive surface between the component and the temporary fixing tape during stretching, or the opposite to the protruding direction when the stretching member is pressed against the temporary fixing tape to protrude (the push-up direction when pushing up against the tape surface, and the push-down direction when pushing down against the tape surface).
[0041] The stretching means can stretch the temporary fixing tape by directly applying tension in the horizontal direction to the adhesive surface between the component (member) and the temporary fixing layer. The stretching means can also stretch the temporary fixing tape by applying tension in three-dimensional directions, including the vertical direction, to the adhesive surface between the component and the temporary fixing layer by pressing a stretching member against the surface of the temporary fixing tape opposite to the component-mounting surface. Among these, the latter is preferred from the viewpoint of space saving of the device, etc.
[0042] When tension is applied in the direction opposite to the component placement side of the temporary fixing tape, as shown in FIG. 6 , the angle θ between the adhesive surfaces of the component (member) 3 and the temporary fixing tape 100 (in other words, the horizontal plane S of the temporary fixing tape 100) and the tension application direction Q (the angle θ of the tension relative to the adhesive surface) is preferably greater than 0° and less than 90°. In particular, from the viewpoint of facilitating the application of uniform tension, the angle θ is preferably 5° to 89°, and more preferably 10° to 88°. Furthermore, the preferred range of the angle θ may be 5° to 85°, or 10° to 80°. The angle θ may be fixed or may vary during a continuous peeling operation. When the angle θ is 0°, tension is applied horizontally to the adhesive surface between the component and the temporary fixing layer. In particular, it is preferable that the angle θ is within the above range and the temporary fixing tape is stretched in all directions, because this facilitates the simultaneous peeling of a large number of components when the components are temporarily fixed to the temporary fixing layer.
[0043] Specific stretching means and methods that enable stretching in two or more stretching directions (stretching in a direction different from the first stretching direction) include, for example, the means and methods shown in Figures 7 to 11, but are not limited to these.
[0044] FIG. 7 schematically illustrates an embodiment in which a component (member) 3 is temporarily fixed to a temporary fixing layer (not shown) of a temporary fixing tape 100 and stretched in a first stretching direction P1. Similar to FIG. 3 , FIG. 7( a) is a top view of a long temporary fixing tape 100 being stretched between two rolls, as seen from the component placement surface. In FIG. 7( a), both ends of the temporary fixing tape 100 are held by holders 9, and the temporary fixing tape 100 is stretched in a direction P2 that forms an angle of approximately 90° within the temporary fixing tape with respect to the stretching direction P1. In the example shown in FIG. 7( a), the two holders 9 are movable, and by moving so that the distance between them gradually increases toward the first stretching direction P2, the adhesive surface (not shown) is stretched in a different stretching direction. While FIG. 7 illustrates an embodiment in which stretching in the first stretching direction and stretching in a different stretching direction are performed simultaneously, both stretching operations may be performed sequentially. In FIG. 7, the component 3 is placed on the upper surface of the temporary fixing tape 100, but even if the component 3 is placed on the lower surface of the temporary fixing tape 100, the temporary fixing tape 100 can be peeled off from the component 3 in the same manner.
[0045] 7(b), a roll serving as the stretching means 8 is disposed in the transport direction (machine direction: MD) of the temporary fixing tape 100, and holders 9 are disposed on both sides in the direction perpendicular to the transport direction (MD direction) (cross direction: CD direction). The roll serving as the stretching means 8 stretches the temporary fixing tape 100 in a first stretching direction P1 parallel to the transport direction (MD direction) while winding up the transported temporary fixing tape 100. Meanwhile, the holders 9, which also function as stretching means, guide the transport of the temporary fixing tape 100 and grip both ends of the temporary fixing tape 100 to apply tension in the direction P2. At this time, the holders 9 may stretch the temporary fixing tape 100 in a second stretching direction P2. 7(b) shows an example in which the stretching means 8 is located in the conveying direction (MD direction) and the stretching means also stretches the temporary fixing tape 100 in a first stretching direction P1 parallel to the conveying direction (MD direction), but it is also possible to have a holder 9 that does not have a stretching function located in the conveying direction (MD direction) and have the holder 9 arranged in a direction intersecting the conveying direction (CD direction) serve as the stretching means 8 to stretch the temporary fixing tape 100 only in the second stretching direction P2. In this case, it is possible to simultaneously convey the temporary fixing tape 100 and stretch it in the width direction.
[0046] 8 and 9 are schematic diagrams illustrating one embodiment in which tension is applied to the temporary fixing tape in a direction opposite to the side on which a component (member) is placed, and FIG. 8 is a cross-sectional view along line X-X in FIG. 9 . As shown in FIG. 8 , the temporary fixing tape 100 is aligned with the holder 9, so that its excess portion is positioned opposite the side on which the component (member) 3 is placed (the adhesive surface side), and by applying tension to the excess portion, the adhesive surface (not shown) can be stretched in the stretching direction P (horizontal direction). In FIG. 8 , the member 3 (hereinafter referred to as the component 3) is placed on the upper surface of the temporary fixing tape 100, and the direction Q of tension application is downward with respect to the temporary fixing tape 100. Although not shown, the component 3 is placed on the lower surface of the temporary fixing tape 100, and the holder 9 is positioned on the upper surface of the temporary fixing tape 100, with the direction Q of tension application being upward with respect to the temporary fixing tape 100, so that the same operation as in FIG. 8 can be performed.
[0047] Fig. 9 is a schematic diagram seen from the side on which the component (member) 3 in Fig. 8 is placed. Tension is applied to the excess portion of the temporary fixing tape 100 in the direction opposite to the side on which the component 3 is placed. As explained in Fig. 8, a part of the temporary fixing tape 100 is bent via the holder 9 in the direction opposite to the side on which the component 3 is placed, and by applying tension to the excess portion by pulling the end, the entire adhesive surface (not shown) is stretched as shown in Fig. 9. Note that the dashed line representing the holder 9 in Fig. 9 indicates that it is on the opposite side of the temporary fixing tape 100 from the side on which the member 3 is placed.
[0048] 8 , for example, as shown schematically in FIG. 10 , the temporary fixing tape 100 is held by a stretching member 10 at a position opposite the component (member) 3 with respect to the holder 9, and the stretching member 10 is moved in the opposite direction to the component 3 (the direction of arrow Y) with respect to the holder 9, thereby applying tension to the excess portion of the temporary fixing tape 100 in the same direction as the moving direction Y of the stretching member 10 (the direction of arrow Q). At this time, the holder 9 may be moved in the direction opposite to the moving direction Y of the stretching member 10 in conjunction with the movement of the stretching member 10. When the holder 9 is moved in the direction opposite to the moving direction Y of the stretching member 10 in conjunction with the movement of the stretching member 10, the movements of the holder 9 and the stretching member 10 can be linked by providing a control unit (not shown) that controls the movements of the holder 9 and the stretching member 10. 10 , the component 3 is placed on the upper surface of the temporary fixing tape 10, and the direction of tension Q is downward relative to the temporary fixing tape, but the component 3 may also be placed on the lower surface of the temporary fixing tape 10. When the component 3 is placed on the lower surface of the temporary fixing tape 10, the same operation can be performed by arranging the holder 9 and the extension member 10 on the upper surface side of the temporary fixing tape 100 and orienting the direction of tension Q upward relative to the temporary fixing tape 100.
[0049] 11 , for example, the temporary fixing tape 100 is fixed by another holder 9′ on the side opposite to the side on which the component (member) 3 is placed relative to the holder 9, and the adhesive surface (not shown) is pressed against the component 3 from the back side of the temporary fixing tape 100 (the side opposite to the side on which the component 3 is placed) in the direction Y in FIG. 11 by a stretching member 10 (for example, a stage or a piston), thereby applying tension to the excess portion in the direction opposite to the pressing direction Y by the stretching member 10 (the direction of arrow Q in FIG. 11 ). In this case, the holder 9′ may be configured to move in the direction opposite to the pressing direction Y of the stretching member 10 in conjunction with the movement of the stretching member 10. When the holder 9′ is moved in the direction opposite to the pressing direction Y of the stretching member 10 in conjunction with the movement of the stretching member 10, the movements of the holder 9′ and the stretching member 10 can be linked by providing a control unit (not shown) that controls the movements of the holder 9′ and the stretching member 10. 11, the member 3 is placed on the upper surface of the temporary fixing tape 10, and the direction of tension Q is downward relative to the temporary fixing tape, but the member 3 may also be placed on the lower surface of the temporary fixing tape 10. When the member 3 is placed on the lower surface of the temporary fixing tape 10, the same operation can be performed by arranging the holders 9 and 9' and the stretching member 10 on the upper surface side of the temporary fixing tape 10, pressing the tape 10 from above with the stretching member 10 to protrude the tape 10 to the opposite side, and making the direction of tension Q upward relative to the temporary fixing tape 10.
[0050] The method shown in Figure 10 or Figure 11 is preferred from the viewpoint that the adhesive surface is stretched uniformly in all directions within the adhesive surface, and that stretching in all directions is performed simultaneously. From this viewpoint, a preferred stretching method is one in which the stretching means 8 applies tension to the adhesive surface between the component (member 3) and the temporary fixing tape 100 in the direction opposite the component 3, as shown in Figure 8, thereby stretching the adhesive surface. As such a stretching method, for example, a method in which the excess end portion of the temporary fixing tape is pulled in the direction opposite the component 3, as schematically shown in Figure 10, or a method in which the stretching means 10 presses the adhesive surface between the component (member 3) and the temporary fixing tape 100 toward the surface on which the component 3 is placed, as schematically shown in Figure 11, is more preferred. In Figures 10 and 11, arrow Y indicates the movement direction of the holder 9 and the stretching member 10, respectively.
[0051] After being peeled from the temporary fixing tape by the above-described present peeling method, the component (member) can be separated from the temporary fixing tape by, for example, suction, clamping, sweeping, etc. Furthermore, the orientation of the temporary fixing layer of the temporary fixing tape, the orientation of the component mounting surface, and the orientation of the peeling member of the temporary fixing tape may be set so that the component 3 can be detached from the temporary fixing tape by falling under its own weight.
[0052] [Components (Members)] The components (components) may be components before machining, polishing, cutting, etching, etc. (components before machining, or workpieces), or may be components that have been machined (components after machining, or workpieces). Examples of components include electronic components such as semiconductor wafers, multilayer ceramic capacitors, and inductors, optical components such as optical glass and polarizing plates, and ceramic green sheets. Smaller components are preferred because the adhesive area with the tape per component is smaller, and the effect of using this peeling method is more pronounced.
[0053] The size of the part (component) to be peeled off from the tape is not particularly limited, but the adhesive area with the temporary fixing tape before stretching per part (component) (the surface area of the part in contact with the temporary fixing tape) is 500 mm 2 It can be less than, for example, 100 mm 2 Preferably less than 50 mm 2 Preferably less than 30 mm 2 Less than 10 mm is more preferable. 2 Even more preferably, 3 mm or less 2 Preferably less than 1 mm 2 The following is particularly preferred: The surface area of the surface in contact with the temporary fixing tape is 1 mm 2 A micro component with a surface area of 0.5 mm or less 2 More preferably, it is 0.2 mm or less. 2 More preferably, 0.1 mm or less 2 Particularly preferred is 0.2 mm or less 2 The lower limit of the size of the above-mentioned parts (members) is not particularly limited, but for example, it is 0.001 mm 2 More than 0.005 mm, preferably 0.005 mm 2 More than 0.01 mm, preferably 0.01 mm 2More than 0.05 mm, preferably 0.05 mm 2 That's all.
[0054] When the size of the part (component) to be temporarily fixed is relatively large, the tape can be stretched while pressing the part from above, making it difficult for the part to follow the stretching deformation of the tape, and the contact area of the tape tends to decrease with the degree of stretching, making it more likely to peel off. 2 In the case of the following micro-components, they are fragile and precise and cannot be held down from above, and as the tape stretches and deforms, the micro-components follow the tape while maintaining their adhesive surface, making it impossible to peel them off. However, by using the tape described below, this following can be suppressed, which has the effect of reducing the contact area relative to the degree of tape stretching, making it possible to easily peel off even micro-components.
[0055] The part (member) may be further processed after being peeled off from the temporary fixing tape. The processing to be performed may be the same or different.
[0056] [Temporary Fixing Tape] The temporary fixing tape (hereinafter sometimes referred to as the present tape) used in the present peeling method has a temporary fixing layer on one side of a substrate. The present tape may be a single-sided tape having a temporary fixing layer on one side of the substrate, or a double-sided tape having a temporary fixing layer on each side of the substrate. The present tape may also have a temporary fixing layer on one side of the substrate and an adhesive layer with a stronger adhesive strength than the temporary fixing layer on the other side. When the present tape is double-sided, it is preferable that the surface of the temporary fixing layer on which the part (member) is not fixed has a release liner.
[0057] The temporary fixing tape used in this peeling method may be in a long shape (strip or roll shape) or in a sheet shape. In the case of a sheet shape, the shape may be selected appropriately according to the shape of the part (member), such as a square, circle, or ellipse.
[0058] The stress at 25% elongation (25% modulus) of the temporary fixing tape is preferably in the range of 0.15 MPa to 10 MPa, more preferably in the range of 0.16 MPa to 10 MPa, more preferably in the range of 0.17 MPa to 5 MPa, and even more preferably in the range of 0.18 MPa to 4.5 MPa. This allows the temporary fixing tape to exhibit good temporary fixing properties and reduces the tension in the initial stage of stretching.
[0059] The stress at 50% elongation (50% modulus) of the temporary fixing tape is preferably in the range of 0.15 MPa to 20 MPa, more preferably in the range of 0.20 MPa to 18 MPa, more preferably in the range of 0.25 MPa to 15 MPa, and even more preferably in the range of 0.3 MPa to 10 MPa. By setting the stress at 50% elongation of the temporary fixing tape within the above range, the tension required for stretching does not become excessive, and the amount of elongation required to peel a component (member) from the temporary fixing tape can be suppressed. If the stress at 50% elongation is too large, the tape may be too hard and unable to be stretched. On the other hand, if the stress at 50% elongation is too small, when stretching the tape to peel it from the adherend, only the margin portion not adhered to the component may stretch, and the tension may not be transmitted to the surface adhered to the adherend, preventing peeling.
[0060] The stress (modulus) of the temporary fixing tape at 25% and 50% elongation refers to the stress values measured when the tape is punched out into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the lengthwise direction at a tensile speed of 500 mm / min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of a measurement atmosphere of 23°C and 50% RH, at an elongation of 25% and 50%. Note that in this specification, the elongation of the modulus refers to the ratio of the elongated length to the gauge length before elongation [(gauge length after elongation - gauge length before elongation) / gauge length before elongation} × 100 (%)].
[0061] The breaking stress (breaking strength) of the temporary fixing tape is not particularly limited as long as it can be peeled off without breaking during the tape stretching process, but can be, for example, within the range of 1 MPa to 100 MPa, preferably within the range of 3 MPa to 90 MPa, preferably within the range of 5 MPa to 95 MPa, preferably within the range of 5 MPa to 80 MPa, preferably within the range of 10 MPa to 90 MPa, preferably within the range of 10 MPa to 75 MPa, preferably within the range of 15 MPa to 88 MPa, preferably within the range of 15 MPa to 70 MPa, preferably within the range of 20 MPa to 85 MPa, preferably within the range of 25 MPa to 80 MPa. By setting the breaking stress of the temporary fixing tape within the above range, it is possible to prevent tearing during stretching and the stress required for stretching from becoming excessive, and stretching becomes possible with low stress.
[0062] The breaking stress of the temporary fixing tape refers to the stress value measured when the tape is punched out into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the length direction at a pulling rate of 500 mm / min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under measurement atmosphere conditions of 23°C and 50% RH, and breaks.
[0063] The breaking elongation of the temporary fixing tape is not particularly limited as long as it can be peeled off without breaking during the tape stretching process, but can be, for example, in the range of 200% to 3000%, preferably in the range of 250% to 2500%, preferably in the range of 300% to 2500%, preferably in the range of 300% to 2000%, preferably in the range of 400% to 2000%, preferably in the range of 400% to 1500%, preferably in the range of 500% to 1500%, preferably in the range of 500% to 1300%, preferably in the range of 600% to 1300%, preferably in the range of 500% to 1000%, preferably in the range of 600% to 1000%. By setting the breaking elongation of the temporary fixing tape within the above range, the stress required to stretch the tape can be reduced, and the stretching distance required until the part (component) peels off can be shortened.
[0064] The breaking elongation of the temporary fixing tape refers to the elongation [{(gauge length after elongation−gauge length before elongation) / gauge length before elongation}×100(%)] measured when the tape is punched out into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the lengthwise direction at a tensile speed of 500 mm / min under measurement atmosphere conditions of 23°C and 50% RH using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) to break.
[0065] The 180° peel adhesive strength of the temporary fixing tape is not particularly limited as long as it is capable of temporarily fixing components (members), but can be in the range of 0.05 N / mm to 1 N / mm, preferably in the range of 0.06 N / mm to 0.8 N / mm, preferably in the range of 0.07 N / mm to 0.5 N / mm, and preferably in the range of 0.1 N / mm to 0.3 N / mm. When the 180° peel adhesive strength of the temporary fixing tape is within the above range, components can be temporarily fixed with sufficient adhesive strength, instability during the temporary fixing process can be suppressed, and problems such as adhesive residue on the components are less likely to occur when the tape is peeled off.
[0066] The 180° peel adhesive strength of the temporary fixing tape is measured by the following method in accordance with JIS Z 0237. If the temporary fixing layer is an adhesive layer, the temporary fixing tape is cut to a length of 150 mm and a width of 25 mm, and the surface on the temporary fixing layer side is attached to a stainless steel plate (length 100 mm, width 30 mm, thickness 3 mm) under conditions of an atmosphere of 23 ° C. and 50% RH. After applying a load of 2 kg to the laminated structure of the temporary fixing tape and the stainless steel (SUS) plate, pressure is applied once back and forth with a roller to bond them together, and the test piece is left to stand for 1 hour under conditions of an atmosphere of 23 ° C. and 50% RH. The test piece can be measured by pulling it in the 180° direction at a tensile speed of 300 mm / min using a Tensilon tensile tester (model: RTF-1210, manufactured by A & D Co., Ltd.) under conditions of an atmosphere of 23 ° C. and 50% RH. Furthermore, if the temporary fixing layer is an adsorption layer, the measurement can be performed by attaching a 20 mm wide tape at 23°C with the surface on the temporary fixing layer side (adsorption layer side) to a stainless steel plate, applying pressure with a 2 kg roller in one reciprocating motion, leaving it to stand for 1 hour under conditions of an atmosphere of 23°C and 50% RH, and then pulling it in the 180° direction at a pulling rate of 300 mm / min using a Tensilon tensile tester.
[0067] The elongation at peeling of the temporary fixing tape is preferably in the range of 101% to 1500%, more preferably in the range of 105% to 800%, and even more preferably in the range of 110% to 500%. In particular, when the temporary fixing layer of the temporary fixing tape is an adhesive layer, the elongation at peeling of the temporary fixing tape is preferably in the range of 101% to 1500%, more preferably in the range of 105% to 1000%, and even more preferably in the range of 110% to 500%. Furthermore, when the temporary fixing layer of the temporary fixing tape is an adsorption layer, the elongation at peeling of the temporary fixing tape is preferably in the range of 101% to 400%, more preferably in the range of 105% to 300%, and even more preferably in the range of 110% to 250%. By setting the elongation at peeling of the temporary fixing tape in the above range, a component (member) placed on the temporary fixing layer can be peeled off even if the distance the tape is stretched is small. In particular, the surface area of the surface (adhered surface) fixed to the temporary fixing tape is 100 mm 2 (1 cm 2 ) or less, and even 1 mm 2 In the case of the following minute parts, they can be peeled off from the temporary fixing tape without the need for excessive stretching.
[0068] The elongation at peeling of the temporary fixing tape refers to the ratio of the length between the gauge lines of the tape after elongation when the tape is stretched and the adherend is peeled off (initial gauge line length + length of the stretched portion of the tape) to the initial length of the tape (initial gauge line length), and is a value measured and calculated by the following method. Temporary fixing tape (hereinafter referred to as tape) was cut to a length of 200 mm x width of 20 mm, and both end portions of 50 mm x 20 mm were laminated with a 50 μm thick PET film, and used as gripping tabs to stretch the tape in the longitudinal direction. Three aluminum blocks measuring 10 mm in length, 10 mm in width, and 4 mm in thickness were prepared, lined up in the center of the surface of the temporary fixing layer of the tape in the longitudinal direction of the tape, and pressed together with a load of 1 kg / 3 pieces for 10 seconds to prepare a test specimen. The tab at one end of the tape was placed on a fixture while the aluminum blocks of the test specimen were held horizontally facing downward. The tab on the other end of the tape was then gripped and stretched horizontally at a rate of 300 mm / min. The elongation at peeling was calculated from the elongation of the tape when all three aluminum blocks had fallen from the tape using the following formula. In the formula, "initial gauge length + elongated length of the tape" refers to the gauge length of the tape after elongation when all the aluminum blocks had fallen. The gauge length refers to the length of the tape excluding the tab regions on both sides (tape length 200 mm - tab region length 50 mm x 2 = 100 mm). {(initial gauge length + elongated length of the tape) / initial gauge length} x 100 = elongation at peeling [%]
[0069] <Extensible Substrate> The extensible substrate in the temporary fixing tape (hereinafter may be referred to as substrate) may have extensibility (stretchability), and may have a single layer or a multi-layer structure of two or more layers. The substrate may have extensibility in at least one direction, and preferably has extensibility (stretchability) in all directions within the plane of the substrate.
[0070] The substrate has at least extensibility that allows it to stretch under tension, but it may also have elasticity that allows it to stretch under tension and then shrink to return to its original shape when the tension is released, or it may not need to return to its original shape once stretched. From the viewpoint of having extensibility, the substrate preferably has at least one of the following physical properties.
[0071] The breaking elongation of the substrate is preferably 200% or more from the viewpoint of exhibiting extensibility (stretchability), and is preferably 300% or more, more preferably 400% or more, and even more preferably 500% or more. The breaking elongation of the substrate is not particularly limited as long as it is stretchable, but can be, for example, 2000% or less, preferably 1800% or less, more preferably 1700% or less, and even more preferably 1500% or less. By having the breaking elongation of the substrate within the above range, even if the adhesive strength between the temporary fixing tape and the component (member) is high, the temporary fixing tape can be stretched while suppressing breakage, and the stretching distance of the tape until the adhesive state between the temporary fixing tape and the component (peel elongation of the tape) is not too long, making it possible to work in a small space. The breaking elongation of the substrate can be adjusted by appropriately selecting the material, applying stretching during the manufacturing process of the substrate, or the like.
[0072] The breaking elongation of the substrate refers to the elongation at break when the substrate is punched out into a dumbbell shape having a gauge length of 20 mm and a width of 5 mm, and pulled in the length direction at a tensile speed of 500 mm / min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of a measurement atmosphere of 23°C and 50% RH [{(gauge length at break−gauge length before elongation) / gauge length before elongation}×100(%)].
[0073] The breaking strength of the substrate is preferably 20 MPa or more, more preferably 30 MPa or more, and even more preferably 40 MPa or more, while the breaking strength of the substrate is preferably 120 MPa or less, more preferably 100 MPa or less, even more preferably 90 MPa or less, and even more preferably 85 MPa or less. By having the breaking strength of the substrate within the above range, the temporary fixing tape can be made less likely to tear during the stretching process, and the stress of stretching (stretching) the temporary fixing tape can be prevented from becoming too large. The breaking strength of the substrate can be adjusted by appropriately selecting the material, applying stretching during the manufacturing process of the substrate, or the like.
[0074] The breaking strength of the substrate refers to the stress value measured when the substrate was punched out into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the length direction at a pulling rate of 500 mm / min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of a measurement atmosphere of 23°C and 50% RH, and breaking.
[0075] The 50% modulus of the substrate is preferably 0.1 MPa or more, preferably 0.3 MPa or more, more preferably 1.0 MPa or more, and even more preferably 5.0 MPa or more, while the 50% modulus of the substrate is preferably 20.0 MPa or less, more preferably 18.0 MPa or less, and more preferably 15.0 MPa or less. By setting the 50% modulus of the substrate within the above range, defects associated with shape deformation such as slippage when a load is applied to the temporary fixing tape or a part (member), can be suppressed, and the temporary fixing tape can be stretched with a relatively light force in the initial stage of stretching. The 50% modulus of the substrate can be adjusted by appropriately selecting the material, applying stretching during the manufacturing process of the substrate, or the like.
[0076] The 100% modulus of the substrate is preferably 0.1 MPa or more, preferably 0.3 MPa or more, more preferably 0.5 MPa or more, and even more preferably 1 MPa or more, while the 100% modulus of the substrate is preferably 25.0 MPa or less, more preferably 22 MPa or less, and more preferably 20.0 MPa or less. By setting the 100% modulus of the substrate within the above range, defects associated with shape deformation such as slippage when a load is applied to the temporary fixing tape or a part (member), can be suppressed, and the temporary fixing tape can be stretched with a relatively small force in the initial stage of stretching. The 100% modulus of the substrate can be adjusted by appropriately selecting the material, applying stretching during the manufacturing process of the substrate, or the like.
[0077] The 50% modulus and 100% modulus of the substrate refer to the stress value at an elongation of 50% and 100% when the substrate is punched into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the longitudinal direction at a tensile speed of 500 mm / min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of a measurement atmosphere of 23°C and 50% RH. The elongation in the above modulus is the ratio of the elongated length to the gauge length before elongation [{(gauge length after elongation - gauge length before elongation) / gauge length before elongation} × 100 (%)].
[0078] The rubber hardness of the substrate is preferably 25A or more, more preferably 30A or more, even more preferably 50A or more, and even more preferably 85A or more, while the rubber strength of the substrate is preferably 100A or less, more preferably 98A or less. By setting the rubber hardness of the substrate within the above range, it is possible to prevent tearing during the process of stretching the temporary fixing tape, while at the same time imparting flexibility to the substrate, thereby reducing the force required to stretch the tape in the initial stage of tape stretching. The rubber hardness of the substrate can be adjusted by, for example, changing the molecular weight of the resin constituting the substrate, changing the monomer units constituting the copolymer, selecting the composition, or by appropriately selecting materials.
[0079] The rubber hardness of the substrate is Shore A hardness, and refers to a value measured in accordance with JIS K 6253 using a durometer (spring type rubber hardness tester) (model: GS-719G, manufactured by Teclock Corporation).
[0080] The thickness of the substrate is not particularly limited, but can be, for example, 5 μm or more, preferably 10 μm or more, more preferably 25 μm or more, and even more preferably 40 μm or more, while the thickness of the substrate is preferably 500 μm or less, more preferably 250 μm or less, and even more preferably 200 μm or less. By setting the thickness of the substrate within the above range, the strength of the temporary fixing tape can be ensured, and the stretchability of the temporary fixing tape can be improved, making it possible to stretch the tape more easily with small stress.
[0081] The thickness of the substrate is the average value of the thicknesses measured at a total of 10 points, 5 points at 10 mm intervals in the length direction and 5 points at 10 mm intervals in the width direction, using a dial thickness gauge (manufactured by Ozaki Seisakusho Co., Ltd., model G-0.4N or model G-2.4N).
[0082] (Composition) The substrate is composed of a substrate composition containing a resin as a main component. As the substrate, a resin layer such as a resin film or a resin sheet can be used. Furthermore, the substrate may be composed only of a resin, or may contain any component other than the resin.
[0083] Examples of resins constituting the substrate include styrene-based resins, urethane-based resins, polyolefin resins, polyester resins, polystyrene, polycarbonate, polymethylpentene, polysulfone, polyether ether ketone, polyether sulfone, polyetherimide, polyimide, fluororesin, nylon, acrylic resin, etc. These resins may be used alone or in combination of two or more.
[0084] The resin preferably has hard segments X and soft segments Y, and the soft segments Y are block copolymers composed of a random copolymer of linear structural units and structural units having side chains. The random presence of linear structural units that contribute to crystallinity and structural units having side chains that contribute to extensibility within the soft segments Y constituting the block copolymer facilitates both improved stretchability (extensibility) and strength at break. In other words, the loss of extensibility due to steric hindrance of the structural units having side chains in the soft segments Y can be suppressed, and the extensibility provided by the soft segments Y can be maintained. Meanwhile, the presence of linear structural units in the soft segments Y allows the soft segments Y to form a crystalline structure between molecules when stretched, thereby increasing cohesive force and strength at break. The block copolymer is preferably a triblock or higher copolymer, and a triblock copolymer is preferred, as this facilitates the exertion of the effects of the hard segments X and the soft segments Y. Examples of such resins include styrene-based resins which are styrene-based block copolymers having a hard segment X and a soft segment Y and / or hydrogenated products thereof, urethane-based resins which are urethane-based block copolymers having a hard segment X and a soft segment Y and / or hydrogenated products thereof, and acrylic-based resins which are acrylic-based block copolymers having a hard segment X and a soft segment Y and / or hydrogenated products thereof. Among these, it is more preferable that the block copolymer is a triblock copolymer, since this can achieve both excellent breaking strength and extensibility due to excellent cohesive force.
[0085] The resin is preferably a thermoplastic resin, and among the above-mentioned resins, styrene-based resins, urethane-based resins, and acrylic-based resins are preferred from the viewpoint of being easily adjustable to a suitable breaking stress and breaking elongation. The substrate is preferably composed primarily of a resin selected from the group consisting of styrene-based resins, urethane-based resins, and acrylic-based resins, as this facilitates the production of substrates with excellent moldability and excellent breaking elongation and breaking stress. The content of the resin selected from the above group contained in 100% by mass of all resin components constituting the substrate is preferably 50% to 100% by mass, more preferably 70% to 100% by mass, more preferably 80% to 100% by mass, and even more preferably 90% to 100% by mass. It is particularly preferred that the content be substantially 100% by mass, i.e., that the substrate is composed of a resin selected from the above group.
[0086] (Styrene-based resin) The styrene-based resin used for the substrate may be any resin having a structural unit derived from an aromatic vinyl compound, and among these, a resin containing a structural unit derived from styrene represented by the following general formula (1) is preferred, and a styrene-based block copolymer is more preferred because it provides a substrate with a low elastic modulus in a low elongation range, high strength, and excellent elongation at break.
[0087]
[0088] The styrene-based resin preferably contains structural units derived from aromatic vinyl compounds, particularly structural units derived from styrene represented by the general formula (1), in the range of 5 to 75% by mass, more preferably 5 to 50% by mass, still more preferably 10 to 45% by mass, and particularly preferably 10 to 40% by mass, because this makes it easier to obtain the elongation at break and stress at break of the substrate in suitable ranges.
[0089] The styrene resin may have one or more functional groups such as a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an epoxy group, etc. in the molecular chain and / or at the molecular terminal, or may have no functional groups, as long as the purpose and effects of the invention are not impaired. For example, hydrogen atoms on the benzene ring of the styrene resin may be substituted with alkyl groups such as methyl and ethyl, and the number of alkyl groups to be substituted may be any number from 1 to 5.
[0090] Among the styrene-based resins, styrene-based block copolymers are preferred because they have a low modulus of elasticity in the low elongation range, and can provide a substrate with high strength and excellent elongation at break. The styrene-based resin may be composed of one type of styrene-based block copolymer, or a mixture of two or more types of styrene-based block copolymers.
[0091] The styrene-based block copolymer is a copolymer of an aromatic vinyl compound and a conjugated diene compound, and is a copolymer containing a block mainly composed of aromatic vinyl compound units (hereinafter also referred to as polymer block (A)) and a block mainly composed of conjugated diene compound units (hereinafter also referred to as polymer block (B)), and / or a hydrogenated product thereof. Here, "mainly composed of" means that, with the total mass of all polymer blocks being 100% by mass, the structural unit contained in each polymer block accounts for 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and may even be substantially 100% by mass.
[0092] The preferred range of the proportion of the styrene-derived structural unit represented by the general formula (1) or the like in the styrene-based block copolymer can be the same as the preferred range of the styrene-derived structural unit represented by the general formula (1) or the like in the styrene-based resin described above, because the elongation at break and stress at break of the substrate can be easily obtained within a suitable range.
[0093] Specific compounds constituting the polymer block (A) and the polymer block (B) of the styrene-based block copolymer include, for example, aromatic vinyl compounds and conjugated diene compounds disclosed in JP-A-2022-094735.
[0094] The styrene-based block copolymer may be a styrene-based diblock copolymer, a styrene-based triblock copolymer, or a tetrablock or higher styrene-based block copolymer. The styrene-based block copolymer may also be a mixture of a diblock copolymer and a triblock copolymer. Among these, it is more preferable for the styrene-based resin to contain at least a styrene-based triblock copolymer, from the viewpoint of achieving both excellent cohesion and extensibility of the substrate.
[0095] Specific examples of styrene-based block copolymers include styrene-isoprene block copolymers, styrene-isoprene-styrene block copolymers, styrene-isoprene-butadiene-styrene block copolymers, styrene-butadiene-styrene block copolymers, styrene-ethylene-butylene block copolymers, and styrene-ethylene-propylene block copolymers. These may be used alone or in combination of two or more. Examples of the above mixtures include a mixture of a styrene-isoprene block copolymer and a styrene-isoprene-styrene block copolymer.
[0096] The styrene block copolymer may also be a hydrogenated styrene block copolymer. A hydrogenated styrene block copolymer is a copolymer in which the double bonds in the main chain of the styrene block copolymer are hydrogenated. Among these, a hydrogenated styrene block copolymer composed of a polymer block A mainly composed of styrene compound units and a polymer block B which is a block composed of a random copolymer of units in which a linear butadiene structure is hydrogenated and units in which an isoprene structure is hydrogenated is preferred. The polymer block B contains linear structural units that contribute to crystallinity and structural units having side chains that contribute to extensibility, which are present randomly, making it easier to achieve both improved extensibility and breaking strength of the tape.
[0097] Examples of the hydrogenated styrene-based block copolymer include hydrogenated products of the block copolymers listed above as specific examples of the styrene-based block copolymer. Specific examples include styrene-ethylene / butylene-styrene block copolymer (SEBS) and styrene-ethylene-ethylene / propylene-styrene block copolymer (SEEPS). The styrene-ethylene-ethylene / propylene-styrene block copolymer is a hydrogenated product of a block copolymer formed from styrene-butadiene-isoprene-styrene. The styrene-ethylene / butylene-styrene block copolymer is a hydrogenated product of a styrene-isoprene / butadiene-styrene block copolymer. Of these, hydrogenated products of styrene-isoprene-butadiene-styrene block copolymer are particularly preferred.
[0098] The content of the styrene-based block copolymer in the substrate is preferably in the range of 100% by mass to 50% by mass, more preferably in the range of 100% by mass to 60% by mass, more preferably in the range of 100% by mass to 70% by mass, even more preferably in the range of 100% by mass to 80% by mass, particularly preferably in the range of 100% by mass to 90% by mass, and may even be substantially 100% by mass, whereby the substrate has a low elastic modulus in the low elongation range, high strength, and excellent elongation at break.
[0099] Styrenic resins can be produced using known methods, and the production method can be appropriately selected depending on the type of styrene-based resin. For example, known methods can be used to produce styrene-based block copolymers, such as a method of sequentially polymerizing blocks using an anionic living polymerization method, or a method of producing a block copolymer having a living active terminal and then reacting it with a coupling agent to produce a coupled block copolymer. In addition, when the styrene-based resin is a mixture of two or more types of styrene-based block copolymers, it is also possible to produce them as a mixture simultaneously in a single polymerization step. For more specific production methods of various styrene-based resins, for example, the methods disclosed in International Publication No. 2019-003933 and JP-A-2022-094735 can be used.
[0100] (Urethane-based resin) As the urethane-based resin used in the substrate, a reaction product of a polyol and a polyisocyanate can be suitably used. Specific examples of the reaction product include ester-based polyurethane, ether-based polyurethane, and polycarbonate-based polyurethane. The urethane-based resins may be used alone or in combination of two or more.
[0101] The polyol can be appropriately selected depending on the purpose, and examples thereof include polyester polyol, polyether polyol, polycarbonate polyol, and acrylic polyol. One type of polyol may be used, or two or more types may be used in combination. Among these, polyester polyol and polyether polyol are preferred as polyols from the viewpoint of obtaining the mechanical properties of the substrate. When heat resistance is required in the substrate, it is preferable to use polyester polyol, and when water resistance and biodegradability are required, it is preferable to use polyether polyol.
[0102] Examples of the polyester polyol include polyesters obtained by an esterification reaction between a low-molecular-weight polyol and a polycarboxylic acid, polyesters obtained by a ring-opening polymerization reaction of a cyclic ester compound such as ε-caprolactone, and copolymer polyesters thereof.
[0103] Examples of the low molecular weight polyol include aliphatic alkylene glycols having a Mw of approximately 60 to 280, such as ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, neopentyl glycol, and 1,3-butanediol, and cyclohexanedimethanol.
[0104] Examples of the polycarboxylic acid include aliphatic dicarboxylic acids such as succinic acid, adipic acid, sebacic acid, and dodecanedicarboxylic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid, and naphthalenedicarboxylic acid; and anhydrides or esters thereof.
[0105] Examples of the polyether polyol include those obtained by addition polymerization of alkylene oxide using one or more compounds having two or more active hydrogen atoms as an initiator.
[0106] Examples of the polycarbonate polyol include polycarbonate polyols obtained by reacting a carbonate ester and / or phosgene with a low-molecular-weight polyol described below.
[0107] Examples of the carbonate ester include methyl carbonate, dimethyl carbonate, ethyl carbonate, diethyl carbonate, cyclocarbonate, and diphenyl carbonate.
[0108] Examples of low-molecular-weight polyols that can be used to produce the polycarbonate polyols and are reactive with carbonate esters and / or phosgene include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, 1,2-propanediol, 1,3-propanediol, dipropylene glycol, tripropylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,5-hexanediol, 1,6-hexanediol, and 2,5-hexanediol. , 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, 2-methyl-1,3-propanediol, neopentyl glycol, 2-butyl-2-ethyl-1,3-propanediol, 3-methyl-1,5-pentanediol, 2-ethyl-1,3-hexanediol, 2-methyl-1,8-octanediol, 1,4-cyclohexanedimethanol, hydroquinone, resorcinol, bisphenol A, bisphenol F, 4,4'-biphenol, and the like.
[0109] The polyisocyanate can be appropriately selected depending on the purpose, and examples thereof include alicyclic polyisocyanates, aliphatic polyisocyanates, aromatic polyisocyanates, etc. Examples of the polyisocyanate include alicyclic polyisocyanates, etc. One type of polyisocyanate may be used, or two or more types may be used in combination.
[0110] Examples of the alicyclic polyisocyanate include isophorone diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, 4,4'-dicyclohexylmethane diisocyanate, 2,4-methylcyclohexane diisocyanate, 2,6-methylcyclohexane diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate, bis(2-isocyanatoethyl)-4-cyclohexylene-1,2-dicarboxylate, 2,5-norbornane diisocyanate, 2,6-norbornane diisocyanate, dimer acid diisocyanate, bicycloheptane triisocyanate, etc. One type of alicyclic polyisocyanate may be used, or two or more types may be used in combination.
[0111] In the urethane resin, the equivalent ratio (NCO / OH equivalent ratio) of the isocyanate group (NCO) of the polyisocyanate to the hydroxyl group (OH) of the polyol is preferably in the range of 1 to 20, more preferably in the range of 1.1 to 13, even more preferably in the range of 1.2 to 5, and particularly preferably in the range of 1.5 to 3.
[0112] As a method for producing a urethane resin by reacting a polyol with a polyisocyanate, a known method can be used, such as a method in which a polyol charged in a reaction vessel is heated under normal or reduced pressure to remove moisture, and then a polyisocyanate is supplied all at once or in portions to cause a reaction. The reaction conditions for the polyol and polyisocyanate are not particularly limited and can be appropriately selected taking into consideration various conditions such as safety, quality, and cost, but the reaction temperature is preferably 70°C to 120°C, and the reaction time is preferably 30 minutes to 5 hours.
[0113] When reacting a polyol with a polyisocyanate, a catalyst such as a tertiary amine catalyst or an organometallic catalyst can be used as needed. The reaction can be carried out in a solvent-free environment or in the presence of an organic solvent. Examples of organic solvents include ester-based solvents such as methyl acetate, ethyl acetate, propyl acetate, and butyl acetate; ketone-based solvents such as acetone, methyl ethyl ketone, methyl butyl ketone, and cyclohexanone; ether ester-based solvents such as methyl cellosolve acetate and butyl cellosolve acetate; aromatic hydrocarbon-based solvents such as toluene and xylene; and amide-based solvents such as dimethylformamide and dimethylacetamide. These solvents can be used alone or in combination. The organic solvent can be removed during the production of the urethane resin or after the production of the polyurethane by an appropriate method such as heating under reduced pressure or drying at normal pressure.
[0114] (Acrylic Polymer) The acrylic polymer used in the substrate is not particularly limited, but preferably contains an acrylic block polymer. The acrylic block copolymer may be a diblock copolymer, a triblock copolymer, or a tetrablock or higher block copolymer. Two or more acrylic block copolymers with different block structures may be used in combination. Among these, an acrylic triblock copolymer is more preferred because it can achieve both excellent breaking strength and extensibility due to its excellent cohesive force.
[0115] As the acrylic block copolymer, a triblock copolymer having a repeating unit represented by the general formula (2) can be used.
[0116]
[0117] (In the above general formula (2), A, B, and C each independently represent a repeating unit, A and C each independently represent a methacrylic acid alkyl ester monomer unit, B represents an acrylic acid alkyl ester monomer unit, p, q, and r each independently represent the degree of polymerization of each monomer unit. A and C may be methacrylic acid alkyl ester monomer units having the same chemical structure or may be methacrylic acid alkyl ester monomer units having different chemical structures. In the above general formula (2), * represents a bond representing a bond to another atom, and the same applies hereinafter.)
[0118] In the general formula (2), A and C each independently represent a methacrylic acid alkyl ester monomer unit. The term "methacrylic acid alkyl ester monomer unit" refers to a structural unit derived from a methacrylic acid alkyl ester monomer, i.e., a repeating unit derived from a methacrylic acid ester monomer, when the methacrylic acid alkyl ester monomer is (co)polymerized or graft polymerized. The methacrylic acid alkyl ester monomer unit is preferably a methacrylic acid alkyl ester monomer unit represented by the following general formula (3):
[0119]
[0120] (In the above general formula (3), R 1 represents an alkyl group having 1 to 12 carbon atoms, and one or more hydrogen atoms in the alkyl group are substituted by R 2 The substituent R 2 is, for example, a halogen atom, an amino group, or a cyano group.
[0121] In the above general formula (3), R 1 is preferably an alkyl group having 1 to 12 carbon atoms, and from the viewpoint of improving the cohesiveness and breaking strength of the substrate, an alkyl group having 1 to 4 carbon atoms is more preferred, and an alkyl group having 1 or 2 carbon atoms is even more preferred. In addition, in the above general formula (3), the alkyl group having 1 to 12 carbon atoms may be linear, branched, or cyclic, but from the viewpoint of improving the cohesiveness and obtaining a substrate with high breaking strength, a linear or branched group is preferred, and a linear group is more preferred.
[0122] In the general formula (3), examples of the alkyl group having 1 to 12 carbon atoms include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, t-butyl, n-pentyl, isopentyl, hexyl, octyl, nonyl, decyl, undecyl, and dodecyl, as well as cyclic alkyl groups such as cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, dicyclopentanyl, and adamantyl. Among these, from the viewpoint of forming a substrate with high breaking strength, methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, t-butyl, and cyclobutyl are preferred, with methyl, ethyl, and propyl being more preferred. One or more hydrogen atoms in the alkyl group may be substituted with a halogen atom, an amino group, or a cyano group.
[0123] Examples of the alkyl methacrylate monomer include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, n-pentyl methacrylate, isopentyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, pentadecyl methacrylate, cyclohexyl methacrylate, lauryl methacrylate, tridecyl methacrylate, 2-hexyldecyl methacrylate, etc. Of these, methyl methacrylate is preferred.
[0124] In the general formula (2), B represents an acrylate alkyl ester monomer unit. In this specification, the term "acrylate alkyl ester monomer unit" refers to a structural unit derived from an acrylate alkyl ester monomer when the acrylate alkyl ester monomer is (co)polymerized or graft polymerized, i.e., a repeating unit derived from an acrylate ester monomer. The acrylate alkyl ester monomer unit is preferably an acrylate alkyl ester monomer unit represented by the following general formula (4):
[0125]
[0126] (In the above general formula (4), R 3 represents an alkyl group having 1 to 12 carbon atoms, and one or more hydrogen atoms in the alkyl group are substituted by R 4 The substituent R 4 is, for example, a halogen atom, an amino group, or a cyano group.
[0127] In the above general formula (4), R 3 is more preferably an alkyl group having 1 to 12 carbon atoms, and even more preferably an alkyl group having 4 to 8 carbon atoms. In the above general formula (4), the alkyl group having 1 to 12 carbon atoms may be linear, branched, or cyclic, but is preferably linear or branched. In addition, the alkyl group having 1 to 12 carbon atoms is the same as the alkyl group exemplified in the above general formula (3).
[0128] Preferred R in the above general formula (4) 3 is a linear or branched alkyl group such as methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, t-butyl, n-pentyl, isopentyl, hexyl, octyl, nonyl, decyl, undecyl, or dodecyl, or a cyclic alkyl group such as cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, dicyclopentanyl, or adamantyl. One or more hydrogen atoms in the alkyl group may be substituted with a halogen atom, an amino group, or a cyano group.
[0129] Examples of the alkyl acrylate monomer include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, sec-butyl acrylate, t-butyl acrylate, amyl acrylate, isoamyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, etc. Among these, from the viewpoint of imparting extensibility to the substrate, n-butyl acrylate, 2-ethylhexyl acrylate, and copolymers thereof are preferred.
[0130] In the general formula (2), p, q, and r each independently represent the degree of polymerization of each monomer unit. The values of p, q, and r relate to the molecular weight, etc. p / (p+q+r) is preferably 0.02 to 0.40, more preferably 0.05 to 0.37. q / (p+q+r) is preferably 0.20 to 0.95, more preferably 0.25 to 0.90. r / (p+q+r) is preferably 0.02 to 0.40, more preferably 0.05 to 0.37.
[0131] The acrylic block copolymer is preferably an acrylic block copolymer having a repeating unit represented by the following general formula (5).
[0132]
[0133] (In the above general formula (5), R 1 and R 5 each independently represents an alkyl group having 1 to 12 carbon atoms, and one or more hydrogen atoms in the alkyl group are substituted by a substituent R 2 The substituent R 2 is, for example, a halogen atom, an amino group, or a cyano group. 3 represents an alkyl group having 1 to 12 carbon atoms, and one or more hydrogen atoms in the alkyl group are substituted by a substituent R 4 The substituent R 4 is a halogen atom, an amino group, or a cyano group.
[0134] In the above general formula (5), R 1 is R in the above general formula (3). 1 In the general formula (5), R 3 is R in the above general formula (4). 3 In the general formula (5), R 5 is R in the above general formula (3). 1 In the general formula (5), p, q, and r are the same as p, q, and r in the general formula (2). 1 and R 5 may be the same or different.
[0135] When the acrylic triblock copolymer is represented by the general formula (5), R 1 From the viewpoint of enabling the substrate to exhibit high breaking strength, R is preferably selected from the group consisting of linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, and t-butyl groups, and cyclobutyl groups. 3 From the viewpoint of enabling the substrate to exhibit high elongation at break, R is preferably selected from the group consisting of a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, an octyl group, a nonyl group, a decyl group, or an undecyl group. 5 is preferably selected from the group consisting of a linear or branched alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and the like, and a cyclobutyl group, from the viewpoint of enabling the substrate to exhibit high breaking strength.
[0136] Preferred forms of the acrylic triblock copolymer include polymethyl methacrylate block-polyn-butyl acrylate block-polymethyl methacrylate block, polyethyl methacrylate block-polyn-butyl acrylate block-polyethyl methacrylate block, polypropyl methacrylate block-polyn-butyl acrylate block-polypropyl methacrylate block, polymethyl methacrylate block-polyt-butyl acrylate block-polymethyl methacrylate block, and polymethyl methacrylate block-polypropyl acrylate block-polymethyl methacrylate block.
[0137] The acrylic block copolymer may contain only one or more of the triblock copolymers, or may contain only one or more of the diblock copolymers. Furthermore, a mixture of the triblock copolymer and the diblock copolymer can be used as the acrylic block copolymer, and the content of the diblock copolymer in the mixture can be appropriately selected depending on the purpose.
[0138] The weight-average molecular weight (hereinafter also referred to as "Mw") of the acrylic block copolymer is preferably in the range of 50,000 to 300,000, more preferably in the range of 100,000 to 250,000, and even more preferably in the range of 130,000 to 230,000. The number-average molecular weight (hereinafter also referred to as "Mn") of the acrylic block copolymer is preferably in the range of 50,000 to 300,000, more preferably in the range of 100,000 to 250,000, and even more preferably in the range of 130,000 to 230,000. It is more preferable that the Mw of the block copolymer is in the range of 100,000 to 250,000 and the Mn is in the range of 100,000 to 250,000, and even more preferably that the Mw of the block copolymer is in the range of 130,000 to 230,000 and the Mn is in the range of 130,000 to 230,000. The preferred ranges of Mw and Mn of the acrylic triblock copolymers represented by general formulas (2) and (5) are also the same as the above ranges.
[0139] The Mw and / or Mn of the acrylic block copolymer are preferably within the above ranges from the viewpoint of achieving both excellent elongation and strength at break while also achieving formability and solubility in solvents for obtaining a substrate of uniform thickness, and it is particularly preferred that Mw and Mn simultaneously satisfy the above ranges. If the Mw or Mn of the acrylic block copolymer is too small, it is difficult to obtain the elongation and strength at break of the substrate, while if the Mw or Mn is too large, it is difficult to dissolve in a solvent, making molding such as heat melting difficult, and making it difficult to obtain the desired substrate.
[0140] The Mw and Mn of the acrylic block copolymer are measured by GPC using a GPC device (HLC-8329GPC, manufactured by Tosoh Corporation). Mw and Mn are values converted into standard polystyrene, and the measurement conditions by GPC are the same as those described above.
[0141] The acrylic block copolymer may be modified with a functional group such as a hydroxyl group, a carboxyl group, an acid anhydride group, an amino group, or a trimethoxysilyl group in the molecular side chain or at the molecular main chain terminal, if necessary.
[0142] The method for producing the acrylic block copolymer can be appropriately selected from conventionally known production methods, and examples thereof include a method for sequentially polymerizing a block copolymer by an anionic living polymerization method, a cationic living polymerization method, etc. Furthermore, when the block copolymer has stereoregularity such as syndiotacticity, a known method using an organometallic complex may be used.
[0143] When the resin constituting the base material is an acrylic polymer, the acrylic polymer may be a cured product of the acrylic block copolymer. The cured product of the acrylic block copolymer can be formed, for example, by irradiating a composition containing the acrylic block copolymer, a polymerizable monomer, and a photopolymerization initiator with active energy rays such as ultraviolet rays.
[0144] The polymerizable monomer is not particularly limited as long as it can be polymerized by irradiation with active energy rays, but a polyfunctional (meth)acrylate is preferred. The polyfunctional (meth)acrylate is not particularly limited, and known polyfunctional (meth)acrylates can be used. Examples include polyfunctional (meth)acrylates having two or more polymerizable double bonds per molecule, such as 1,2-ethanediol diacrylate, 1,2-propanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, neopentyl glycol diacrylate, tripropylene glycol diacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, tris(2-acryloyloxy)isocyanurate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, di(trimethylolpropane)tetraacrylate, di(pentaerythritol)pentaacrylate, and di(pentaerythritol)hexaacrylate. Other examples of polyfunctional acrylates include urethane acrylate, polyester acrylate, and epoxy acrylate. These may be used alone or in combination of two or more. The polymerizable monomer is preferably used in an amount of 0.5 to 50 parts by weight, more preferably 1 to 40 parts by weight, 1.5 to 30 parts by weight, or even more preferably 2 to 25 parts by weight, per 100 parts by weight of the acrylic block copolymer.
[0145] Examples of the photopolymerization initiator include carbonyl compounds such as acetophenones, benzophenones, Michler's ketones, and benzoins; sulfur compounds such as tetramethylthiuram monosulfide and thioxanthones; phosphorus compounds such as acylphosphine oxides; titanium compounds such as titanocenes; and azo compounds. One or more photopolymerization initiators may be used alone or in combination. Among these, acetophenones and benzophenones are preferred. The content of the photopolymerization initiator is preferably 0.1 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and even more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the acrylic block copolymer.
[0146] (Other Components) In addition to the various resins described above, the substrate may contain other components as needed. Examples of other components include the tackifier resin, crosslinking agent, antioxidant, UV absorber, filler, polymerization inhibitor, surface conditioner, antistatic agent, antifoaming agent, viscosity modifier, light stabilizer, weather stabilizer, heat stabilizer, antioxidant, leveling agent, additives such as organic pigment, inorganic pigment, pigment dispersant, silica beads, and organic beads, and inorganic fillers, as described below. Examples of inorganic fillers include silicon oxide, aluminum oxide, titanium oxide, zirconia, and antimony pentoxide. These may be used alone or in combination of two or more. The content of other components contained in the substrate can be appropriately selected within a range that does not impair the properties of the tape.
[0147] <Temporary Fixing Layer> The "temporary fixing layer" in the temporary fixing tape is not particularly limited as long as it can fix a component (member) and can release its adhesion to the component when the temporary fixing tape is stretched. Such a temporary fixing layer may be, for example, an adhesive layer that can temporarily fix a component by tackiness (adhesion), or an adsorption layer that can temporarily fix a component by exhibiting a suction cup function through numerous recesses formed on the surface. Note that "temporary fixation" refers to the ability to maintain a state in which a component is adhered to the tape. This term "temporary fixation" refers to the fact that a component is fixed to the tape at least temporarily during the manufacturing process, but it may also be permanently "fixed." The temporary fixability of a temporary fixing tape refers to a retention time of 60 minutes or more as measured by the "holding force" measurement method described in the Examples section below.
[0148] The average thickness of the temporary fixing layer is preferably 1 μm or more, more preferably 10 μm or more, even more preferably 30 μm or more, and particularly preferably 40 μm or more. Also, it is preferably 500 μm or less, more preferably 300 μm or less, even more preferably 200 μm or less, and particularly preferably 100 μm or less. When the temporary fixing tape has temporary fixing layers on both sides of the substrate, the average thickness of the temporary fixing layer on one side of the substrate and the average thickness of the temporary fixing layer on the other side may be the same or different, but it is preferable that they are the same thickness.
[0149] The average thickness of the temporary fixing layer was determined by cutting the temporary fixing layer to an arbitrary size, measuring the thickness at five locations at 10 mm intervals in the lengthwise direction and at five locations at 10 mm intervals in the widthwise direction using a dial thickness gauge (manufactured by Ozaki Seisakusho Co., Ltd., Model G-0.4N or Model G-2.4N), and averaging the thicknesses at these 10 locations. When the temporary fixing layer is an adsorption layer, the adsorption layer is fragile and difficult to isolate, so the combined thickness of the temporary fixing layer and the release liner is measured using a release liner as a support, and the thickness is determined by subtracting the thickness of the support. When the temporary fixing layer is an adsorption layer, the portions of the surface of the adsorption layer where recesses are formed are assumed to have virtual surfaces. The virtual surfaces are located in the same plane as the plane where no recesses are formed in the cross section of the adsorption layer.
[0150] <<Adhesive Layer>> When the temporary fixing layer is an adhesive layer, the storage modulus G′ (23° C.) of the adhesive layer at 23° C. is 1×10 4 Pa or more is preferable, and 1.5 × 10 4 Pa or more is more preferable, and 1.5 × 10 5 Pa or more is more preferable, and 2×10 5 Pa or more is particularly preferable. 7 Pa or less is preferable, and 1×10 6 Pa or less is more preferable, and 9×10 5 Pa or less is more preferable, and 2×10 5 Pa or less is particularly preferred. By setting the storage modulus G' (23°C) of the adhesive layer at 23°C within the above range, peeling from the part can be suppressed even when stress is applied, for example, when a part (member) is processed on the temporary fixing tape, and it becomes easier to achieve both the adhesive strength required for temporary fixation and the releasability by stretching. The storage modulus G' of the adhesive layer is determined by overlapping the adhesive layers to a thickness of about 2 mm to form a test piece, attaching parallel plates with a diameter of 7.9 mm to a viscoelasticity tester (Rheometrics, Inc., Ares 2kSTD), clamping the test piece, and measuring the value at a frequency of 1 Hz and 23°C.
[0151] Examples of adhesives constituting the adhesive layer include acrylic adhesives, silicone adhesives, urethane adhesives, rubber adhesives, etc. Among these adhesives, adhesives selected from acrylic adhesives, rubber adhesives, and urethane adhesives are preferred.
[0152] The adhesive resin, which is the main component of the acrylic adhesive, contains one or more acrylic polymers. The acrylic polymer may be a block copolymer, a random copolymer, or a mixture of a block copolymer and a random copolymer. The acrylic polymer may also have a crosslinked structure (e.g., a reaction product of an acrylic copolymer and a crosslinking agent).
[0153] The acrylic block copolymer may be a diblock copolymer, a triblock copolymer, or a tetrablock or higher block copolymer. Furthermore, the acrylic pressure-sensitive adhesive resin may be a combination of two or more acrylic block copolymers with different block structures. Among these, it is preferable to use at least one of an acrylic diblock copolymer and an acrylic triblock copolymer as the acrylic block copolymer. It is more preferable to use an acrylic triblock copolymer because it is easy to obtain cohesive strength and has excellent holding power. Preferred acrylic block copolymers are those disclosed in, for example, WO 2021 / 149567, WO 2021 / 149568, WO 2021 / 149569, etc.
[0154] The acrylic random copolymer can be produced, for example, by polymerizing a (meth)acrylate monomer. The term "(meth)acrylate" refers to acrylate and methacrylate collectively. Similarly, "(meth)acryloyl" refers to acryloyl and methacryloyl, and "(meth)acrylic" refers to acrylic and methacrylic collectively. Preferred acrylic random copolymers and the monomers constituting them can be similar to the acrylic polymers disclosed in, for example, WO 2019 / 003933, WO 2021 / 039877, WO 2021 / 039878, etc.
[0155] The adhesive resin, which is the main component of a rubber-based adhesive, contains one or more rubber-based resins. Examples of rubber-based resins include synthetic rubber and natural rubber, and rubber materials that can be used as adhesive resins. Examples of rubber-based resins include non-diene rubber and diene rubber. Examples of non-diene rubber include silicone rubber. Examples of diene rubber include homopolymers of conjugated diene compounds and copolymers of conjugated diene compounds with other compounds. Examples of such homopolymers include polybutadiene, polyisoprene, polyisobutylene, and chloroprene rubber. Examples of such copolymers include acrylonitrile-butadiene rubber, styrene-butadiene rubber (SBR), and styrene-based resins.
[0156] Among these, styrene-based resins are preferred as rubber-based pressure-sensitive adhesive resins. As the styrene-based resins, the styrene-based block copolymers are preferred, and among these, block copolymers of an aromatic vinyl compound and a conjugated diene compound are preferred, with block copolymers of a monovinyl-substituted aromatic compound and a conjugated diene compound being preferred. The monovinyl-substituted aromatic compound refers to a compound in which one functional group having a vinyl group is bonded to an aromatic ring. A typical example of the aromatic ring is a benzene ring. The benzene ring may be a benzene ring substituted with a functional group such as an alkyl group, without a vinyl group. The monovinyl-substituted aromatic compound constitutes the hard segment (A segment) in the block copolymer, and specific examples include styrene, α-methylstyrene, vinyltoluene, and vinylxylene. Styrene is particularly preferred. The conjugated diene compound constitutes the soft segment (B segment) in the block copolymer, and specific examples include 1,3-butadiene and isoprene.
[0157] The copolymerization ratio of the aromatic vinyl compound in the styrene-based block copolymer is preferably 70% by mass or more, more preferably 90% by mass or more, and may be substantially 100% by mass, based on 100% by mass of the total mass of the block copolymer. Two or more aromatic vinyl compounds may be used in combination. Furthermore, the copolymerization ratio of the conjugated diene compound in the styrene-based block copolymer is preferably 70% by mass or more, more preferably 90% by mass or more, and may be substantially 100% by mass, based on 100% by mass of the total mass of the block copolymer. Two or more conjugated dienes may be used in combination.
[0158] The block copolymer may be in the form of a diblock copolymer, a triblock copolymer, a radial copolymer, a mixture thereof, or the like. Triblock copolymers and radial copolymers preferably have an A segment, such as a styrene block, at the end of the polymer chain. The A segments at the end of the polymer chain tend to aggregate to form domains, which is thought to form a pseudo-crosslinked structure and improve the cohesion of the PSA. The block copolymer may also be a hydrogenated block copolymer.
[0159] Specific examples of styrene-based block copolymers (including hydrogen block copolymers) of aromatic vinyl compounds and conjugated diene compounds include styrene-isoprene copolymer (SI), styrene-isoprene-styrene copolymer (SIS), styrene-isoprene-butadiene-styrene copolymer (SIBS), styrene-butadiene-styrene copolymer (SBS), styrene-ethylene-butylene-styrene copolymer (SEBS), styrene-ethylene-propylene-styrene copolymer (SEPS), etc. Among these, mixtures of styrene-isoprene copolymer and styrene-isoprene-styrene copolymer are particularly preferred because they can exhibit good temporary fixation properties.
[0160] The adhesive resin that is the main component of the urethane-based adhesive can be a urethane-based polymer, which is a reaction product of a polyol and a polyisocyanate. The urethane-based polymer is not particularly limited as long as it can function as an adhesive, and examples thereof include ether-based polyurethane, ester-based polyurethane, and carbonate-based polyurethane. Examples of polyols that constitute the urethane-based polymer include polyether polyol, polyester polyol, polycarbonate polyol, and polycaprolactone polyol. Examples of polyisocyanate compounds include diphenylmethane diisocyanate, tolylene diisocyanate, and hexamethylene diisocyanate.
[0161] The adhesive constituting the adhesive layer may contain, in addition to the adhesive resin described above, a crosslinking agent such as an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, or an aziridine-based crosslinking agent. When a crosslinking agent is used, the gel fraction value obtained by measuring the insoluble portion after immersing the adhesive layer in toluene for 24 hours is used as an indicator of the degree of crosslinking. The gel fraction of the adhesive layer can be appropriately set depending on the purpose. However, from the viewpoint of obtaining an adhesive layer with good cohesiveness and adhesiveness, the gel fraction of the adhesive layer is preferably 10% by mass or more and 70% by mass or less, more preferably 25% by mass or more and 65% by mass or less, and even more preferably 35% by mass or more and 60% by mass or less. The gel fraction refers to a value measured by the following method.
[0162] (Measurement Method) The adhesive was coated onto a release sheet so that the thickness after drying was 50 μm, dried at 100°C for 3 minutes, and aged at 40°C for 2 days. A 50 mm square sample was then cut out. The mass of the sample before immersion in toluene was then measured. After immersion in a toluene solution at 23°C for 24 hours, the toluene-insoluble portion of the sample was separated by filtration through a 300-mesh wire screen, and the mass (G2) of the residue after drying at 110°C for 1 hour was measured. The gel fraction was calculated according to the following formula (3): Gel fraction (mass%) = G2 / G1 × 100 (3) In formula (3), G1 is the mass of the sample before immersion in toluene, and G2 is the mass of the residue after drying at 110°C for 1 hour.
[0163] The adhesive constituting the adhesive layer may contain a tackifier resin in addition to the above-mentioned adhesive resin. Specific examples of the tackifier resin include rosin-based tackifier resins, polymerized rosin-based tackifier resins, polymerized rosin ester-based tackifier resins, rosin phenol-based tackifier resins, stabilized rosin ester-based tackifier resins, disproportionated rosin ester-based tackifier resins, hydrogenated rosin ester-based tackifier resins, terpene-based tackifier resins, terpene phenol-based tackifier resins, petroleum resin-based tackifier resins, (meth)acrylate-based tackifier resins, etc. Specific examples of tackifier resins include tackifier resins disclosed in, for example, WO 2021 / 039877, WO 2021 / 039878, WO 2021 / 149567, WO 2021 / 149568, WO 2021 / 149569, etc. The content of the tackifier resin is preferably in the range of 5 to 65 parts by mass, more preferably in the range of 8 to 55 parts by mass, per 100 parts by mass of the adhesive resin.
[0164] The adhesive constituting the adhesive layer may contain a filler in addition to the adhesive resin described above. When the filler is exposed from the adhesive layer during the stretching process of the temporary fixing tape, the adhesive area with the part (member) is reduced, allowing the tape to be peeled off more easily and quickly. The filler may be an inorganic filler made of an inorganic material such as a metal, a metal compound, carbon, or graphite, an organic filler made of an organic material such as a resin filler, or an organic-inorganic composite filler such as a silicone resin filler. These may be used alone or in combination of two or more. The filler may be hollow or solid, and may be a core-shell type in which a shell is formed on the surface of a core. Specifically, a core-shell type filler in which a shell formed of a silicone resin is coated on the surface of a core formed of a rubber elastomer such as silicone rubber can be exemplified. Specific examples of the filler include various fillers disclosed in, for example, WO 2021 / 039877, WO 2021 / 039878, WO 2021 / 149567, WO 2021 / 149568, WO 2021 / 149569, etc. Examples include the various fillers disclosed in WO 2021 / 149569.
[0165] When the adhesive layer contains a filler, the content of the filler can be 5 parts by mass or more and 100 parts by mass or less, and preferably 10 parts by mass or more and 75 parts by mass or less, 12 parts by mass or more and 70 parts by mass or less, 15 parts by mass or more and 60 parts by mass or less, or 20 parts by mass or more and 55 parts by mass or less, relative to 100 parts by mass of the adhesive resin, from the viewpoint of dispersing the filler in the adhesive layer and suppressing the occurrence of adhesive residue.
[0166] In addition to the materials described above, the adhesive layer may contain any optional components, such as polymer components other than the adhesive resin, crosslinking agents, antioxidants, ultraviolet absorbers, fillers, polymerization inhibitors, surface conditioners, antistatic agents, antifoaming agents, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispersants, plasticizers, softeners, flame retardants, metal deactivators, silica beads, organic beads, and other additives; and inorganic fillers such as silicon oxide, aluminum oxide, titanium oxide, zirconia, and antimony pentoxide.
[0167] <<Adsorption Layer>> When the temporary fixing layer is an adsorption layer, numerous recesses are formed on the surface of the adsorption layer, and these recesses exhibit a suction cup function, allowing the temporary fixing of a component (member). Stretching the tape releases the suction cup function, allowing the tape to be peeled off from the component. The adsorption layer only needs to have recesses formed on at least the surface that will be attached to the component, and recesses may be formed on both sides of the layer. The adsorption layer only needs to have numerous recesses formed on at least the surface, but it is preferable that micropores (also referred to as voids or bubbles) are formed within the layer. The adsorption layer may have a closed-cell structure or an open-cell structure, with a porous structure having an open-cell structure being preferred. Since the adsorption layer adheres to the component via its suction cup function, it usually does not have tackiness. However, it may have tackiness by incorporating a tackifier resin or the like. A lack of tackiness is particularly preferred because it is less likely to leave adhesive residue when the tape is stretched. The adsorption layer is also called a micro-suction cup layer due to the suction cup function provided by the recesses on its surface.
[0168] The average opening diameter of the recesses formed on the surface of the adsorption layer is not particularly limited as long as the recesses can exhibit a suction cup function on the surface of the adsorption layer, but can be, for example, 300 μm or less, preferably 250 μm or less, 200 μm or less, 150 μm or less, 120 μm or less, 100 μm or less, 80 μm or less, or 50 μm or less. The average opening diameter of the recesses is also not particularly limited as long as the suction cup function can be exhibited, and can be, for example, 0.1 μm or more, preferably 0.5 μm or more, and even more preferably 1.0 μm or more, more preferably 5.0 μm or more, and even more preferably 10 μm or more. The average opening diameter of the recesses refers to the average opening diameter of the recesses when the adsorption layer is viewed in plan, and is a value obtained by taking an enlarged photograph of the adsorption layer surface at a magnification of 100x using a tabletop low-vacuum scanning electron microscope (SEM, Hitachi High-Technologies Corporation, "MiniscopeTM3030Plus"), measuring the opening diameters of any recess located in the center of the photograph and all 30 recesses located in its vicinity, and calculating the average value.
[0169] The number of recesses present on one surface of the adsorption layer is, for example, 300 / cm per unit area. 2More preferably, 500 particles / cm per unit area 2 More preferably, 1000 particles / cm per unit area 2 More preferably, 10,000 particles / cm per unit area 2 Although there is no particular upper limit to the number of recesses present on one surface of the adsorption layer, the number of recesses per unit area is preferably 1,000,000 / cm from the viewpoint of the mechanical strength of the adsorption layer. 2 Preferably, 500,000 particles / cm or less 2 Preferably, 200,000 particles / cm or less 2 Preferably, 100,000 particles / cm or less 2 Preferably, the number of particles per unit area is 50,000 or less, and more preferably, 50,000 particles / cm 2 The number of recesses per unit area on the surface of the adsorption layer was determined by taking an enlarged photograph (100x magnification) of the surface of the adsorption layer using a tabletop low-vacuum scanning electron microscope (SEM, manufactured by Hitachi High-Technologies Corporation, "Miniscope™3030Plus"), counting the number of recesses present in any 0.5 mm x 0.5 mm square area, and expressing the number in units of cm 2 It can be measured by converting it into the number of pieces per unit.
[0170] The aperture ratio of the recesses in a planar view of the adsorption layer is preferably 1% or more, more preferably 3% or more, even more preferably 5% or more, and particularly preferably 10% or more. The upper limit of the aperture ratio of the recesses is not particularly limited, but the aperture ratio of the recesses is, for example, 99% or less. From the viewpoint of the mechanical strength of the adsorption layer, the aperture ratio of the recesses is preferably 90% or less, more preferably 80% or less, even more preferably 70% or less, even more preferably 60% or less, and particularly preferably 50% or less. The aperture ratio of the recesses refers to the ratio of the projected area of the recesses to the area of the adsorption layer surface when viewed in plan. The aperture ratio of the recesses was measured by using an electron microscope (Keyence Corporation, Digital Microscope VHX6000) to photograph the surface of the adsorption layer at 200x magnification (automatic brightness adjustment, 1.27 mm long x 1.7 mm wide), calculating the area of the black portions of the image and the total area of the image using software analysis, and then dividing the area of the projected black portions by the total area. In the above image, the black portions are recesses formed on the surface of the adsorption layer, and the area of the black portions corresponds to the projected area of the recesses.
[0171] The apparent density of the adsorption layer is, for example, 0.1 g / cm 3 1.0g / cm or more 3 and preferably 0.15 g / cm or less. 3 0.95g / cm or more 3 Preferably, 0.2 g / cm or less 3 0.9g / cm or more 3 More preferably, 0.3 g / cm 3 0.85g / cm or more 3 The following is even more preferable. By setting the apparent density of the adsorption layer within the above range, it is possible to improve the surface adhesion both initially and over time. The apparent density of the adsorption layer is a value calculated in accordance with JIS K6767, and is calculated by preparing a test piece of the adsorption layer cut into a rectangle of 4 cm length x 5 cm width, measuring the mass [g] of the test piece, and calculating the apparent volume (length x width x thickness) [cm ] of the test piece. 3 ] and then divide the mass by the apparent volume.
[0172] The resin constituting the adsorption layer is not particularly limited as long as it can exhibit the function of the adsorption layer, and examples thereof include synthetic rubbers such as acrylic polymers such as acrylic polymers (including acrylic rubber), urethane resins (including urethane rubber), silicone resins (including silicone rubber), butadiene rubber (polybutadiene, acrylonitrile butadiene rubber, styrene butadiene rubber, methyl methacrylate butadiene rubber, etc.), polyisoprene, ethylene propylene rubber (EPR), ethylene propylene diene terpolymer rubber (EPDM), polynorbornene, nitrile rubber, chloroprene rubber, butyl rubber, halogenated butyl rubber, ethylene-vinyl acetate rubber (EVA), fluororubber, ethylene acrylic rubber, polyester elastomer, epichlorohydrin rubber, and polysulfide rubber; natural rubber, chlorinated polyethylene, polyolefin (polyethylene), polystyrene, polyimide, polyvinyl chloride, polypropylene, polyester, phenolic resin, polyacetal resin, silicone resin; and polyolefin-based, polyurethane-based, polyester-based, polyamide-based, and polystyrene-based thermoplastic elastomers. The above resins may be used alone or in combination of two or more. Among these, from the viewpoint of exhibiting good flexibility and deformability and easily performing the suction cup function, resins selected from the group consisting of acrylic resins (acrylic polymers), butadiene rubber, and urethane resins are preferred. The resin constituting the adsorption layer preferably contains one or more resins selected from these groups as the main component, preferably at 50% by mass or more, more preferably at 80% by mass or more, even more preferably at 90% by mass or more, and particularly preferably at 100% by mass. Furthermore, from the viewpoint of exhibiting good flexibility and deformability and easily performing the suction cup (adsorption) function, the resin constituting the adsorption layer is preferably rubber or elastomer.
[0173] The adsorption layer may contain a crosslinking agent, a tackifying resin, a filler, and other optional components, similar to the adhesive layer described above.
[0174] The adsorption layer can be formed, for example, by mechanically foaming a resin emulsion, coating it, and then heating and drying it. For example, when the resin constituting the adsorption layer is an acrylic polymer, an acrylic polymer adsorption layer can be formed by mechanically foaming a (meth)acrylic acid ester polymer emulsion and then heating and drying it. The resin emulsion is converted into a foamed resin emulsion by mechanically processing the resin emulsion to disperse and incorporate air bubbles into the resin emulsion, i.e., by mechanically foaming the resin emulsion. The resin composition for forming an adsorption layer before mechanical foaming is referred to as a "resin emulsion," and the mechanically foamed resin composition for forming an adsorption layer is referred to as a "foamed resin emulsion." The solids concentration of the foamed resin emulsion is not particularly limited as long as the desired adsorption layer can be formed, and can be set appropriately. For example, a range of 30 to 60% by mass is preferred, where the total amount of the foamed resin emulsion is 100% by mass. By setting the solid content concentration of the foam resin emulsion within the above range, the foam state formed in the emulsion can be easily reproduced even after drying, and the bubble structure of the adsorption layer can be easily adjusted. In addition, the foam resin emulsion can have an expansion ratio of, for example, 1.2 times or more and 4 times or less, preferably 1.5 times or more and 3.5 times or less, and more preferably 1.8 times or more and 3 times or less. The specific gravity of the foam resin emulsion can be, for example, 0.1 g / cm 3 1.0g / cm or more 3 and preferably 0.15 g / cm or less. 3 0.95g / cm or more 3 Preferably, 0.2 g / cm or less 3 0.9g / cm or more 3 Preferably, 0.3 g / cm or less 3 0.8g / cm or more 3 The following is even more preferred:
[0175] Known methods can be used for mechanically treating resin emulsions, including known bubble-generating methods (stirring and mixing methods), such as stirring and mixing emulsions, or known methods for generating fine bubbles or microbubbles. Known fine bubble and microbubble generating methods include methods that use generation principles such as fluidizing a liquid to entrain gas or blowing gas into a stationary liquid. Examples of methods for fluidizing a liquid include swirling liquid flow, static mixer, ejector, Venturi, and pressurized dissolution. Examples of methods for blowing gas into a stationary liquid include pore, rotary, ultrasonic, vapor condensation, and electrolysis. Furthermore, the apparatus used for mechanical foaming of resin emulsions is not particularly limited, but includes, for example, a batch-type foaming machine, a continuous foaming machine, and a fine bubble generator. Examples of fine bubble generators include devices that generate bubbles through the pores of porous ceramics. Examples of gases introduced during mechanical foaming include air, nitrogen, and oxygen.
[0176] The temporary fixing tape having an adsorption layer preferably has a surface adhesive strength F1 in the range of 10 N / 20 mm to 300 N / 20 mm one hour after application to the adherend, preferably in the range of 20 N / 20 mm to 200 N / 20 mm, and more preferably in the range of 30 N / 20 mm to 100 N / 20 mm. Furthermore, the surface adhesive strength F2 in the range of 24 hours after application to the adherend is preferably in the range of 10 N / 20 mm to 300 N / 20 mm, preferably in the range of 20 N / 20 mm to 200 N / 20 mm, and more preferably in the range of 30 N / 20 mm to 100 N / 20 mm. By having the surface adhesive strengths F1 and F2 of the temporary fixing tape having an adsorption layer each within the above ranges, the part to be temporarily fixed (adherend) can be sufficiently held, and the stress required for peeling by elongation and stretching is not excessive, allowing for peeling with low elongation and low stress. Furthermore, the rate of change of the surface adhesive force F2 relative to the surface adhesive force F1 (= F2 / F1 × 100) is preferably, for example, 50% or more, more preferably 60% or more, even more preferably 70% or more, and particularly preferably 80% or more. On the other hand, the rate of change is preferably 210% or less, more preferably 200% or less, even more preferably 180% or less, even more preferably 160% or less, particularly preferably 140% or less, and even particularly preferably 120% or less. By keeping the rate of change of F2 relative to F1 within the above range, the change in surface adhesive force over time is suppressed, and the stress required for peeling by elongation and stretching is not excessive, making it possible to peel with low elongation and low stress. Furthermore, the occurrence of adhesive residue on the adherend due to an increase in surface adhesive force over time can be suppressed. The surface adhesive forces F1 and F2 can be measured by the method described in the Examples below.
[0177] <Optional Configuration> When the temporary fixing layer of the temporary fixing tape is an adsorption layer, an intermediate layer may be provided between the adsorption layer and the substrate. The intermediate layer can further enhance the adhesion between the adsorption layer and the substrate. The intermediate layer is not particularly limited as long as it is a layer that can bond the substrate and the adsorption layer, and examples thereof include a pressure-sensitive adhesive layer and a primer layer. The thickness of the intermediate layer is not particularly limited, but from the viewpoint of favorably expressing distortion in the adsorption layer when the tape is stretched and peeled off and obtaining high adhesion between the substrate and the adsorption layer, it is preferably in the range of 0.01 μm to 100 μm, more preferably in the range of 0.1 μm to 50 μm, and even more preferably in the range of 0.5 μm to 20 μm.
[0178] <<Release Liner>> The temporary fixing tape may have a release liner. When the temporary fixing tape is double-sided, it is preferable that a release liner be provided on one of the opposing main surfaces of the temporary fixing tape, opposite the surface on which a component (member) is placed. When the temporary fixing tape is peeled off by pressing an extension member against the side opposite the component placement side of the temporary fixing tape to protrude the temporary fixing tape toward the component placement side, by providing a release liner on the surface of the temporary fixing tape opposite the component placement side, adhesion between the temporary fixing tape and the extension member can be suppressed. The release liner is not particularly limited, and known ones can be used. For example, paper, plastic film, polytetrafluoroethylene (PTFE) film, plastic film whose surface has been subjected to a release treatment such as silicone treatment or silicone fluoride treatment, etc. can be used.
[0179] 2. Peeling Member The peeling member of the present disclosure (hereinafter also referred to as the present peeling member) has a holding portion that holds the temporary fixing tape, a hollow portion formed by the holding portion, and stretching means, the holding portion is arranged so that the temporary fixing tape covers the hollow portion, and the stretching means has the function of stretching the temporary fixing tape in at least one direction within the plane of the temporary fixing tape that covers the hollow portion. Note that a member that is temporarily fixed to the temporary fixing tape is also referred to as a component.
[0180] 10 to 17 are schematic diagrams showing examples of specific embodiments of the present release member. Each of the drawings will be described in detail later. The present release member is preferably used to efficiently carry out the release method described above in "1. Method for Peeling Temporary Process Tape." In other words, the present release member is used to peel off a temporary fixing tape that has an extensible substrate and a temporary fixing layer on one surface of the extensible substrate and is peelable by stretching.
[0181] (Holding section) The holding section of the present peeling member can hold the excess portion of the temporary fixing tape (for example, the end of the tape) and apply tension to the temporary fixing tape. The holding section may be a movable holder. Furthermore, the holding section (holder) may have the function of stretching the temporary fixing tape in addition to the function of holding the temporary fixing tape. By having the holding section also function as a stretching means, the temporary fixing tape can be stretched in one or more stretching directions while being held.
[0182] The holding part is not particularly limited, but the holding parts exemplified in the above section "1. Method for peeling off temporary fixing tape" can be used, and examples thereof include a roll, a frame having a cavity such as a square or circular shape (for example, a ring-shaped disk, an O-ring, etc.), a clamping tool such as a clip, etc.
[0183] The material of the holding part (holding tool) is not particularly limited as long as it does not inhibit the extension of the temporary fixing tape, and examples thereof include metal, plastic, wood, and mineral, with metal or plastic being preferred from the viewpoints of corrosion resistance, effects on components, etc.
[0184] (Stretching means) The stretching means in this peeling member has the function of stretching the temporary fixing tape covering the hollow portion in at least one direction. The stretching means directly or indirectly stretches the region of the temporary fixing tape that overlaps with the hollow portion. The stretching means only needs to have the function of stretching the temporary fixing tape, and may also serve as a holding section (holding tool).
[0185] The stretching means may have a function of stretching in only one direction, or may have a function of stretching the temporary fixing tape covering the hollow portion in one direction and at least one direction different from the one direction. This is because the temporary fixing tape covering the hollow portion can be stretched multiaxially. In particular, it is preferable that the stretching means has a function of stretching the temporary fixing tape covering the hollow portion in all directions. This is because the temporary fixing tape can be stretched uniformly in all directions, and multiple components fixed to the temporary fixing tape in an area that overlaps with the hollow portion in a plan view can be simultaneously peeled off all at once.
[0186] In the present peeling member, when stretching the temporary fixing tape covering the hollow portion in two or more directions, the stretching means may have a function of stretching the temporary fixing tape covering the hollow portion in two or more directions simultaneously, or may have a function of stretching the temporary fixing tape in each direction sequentially. In the present peeling member, the stretching means may have a function of simultaneously stretching the temporary fixing tape covering the hollow portion in a first stretching direction and in at least one direction different from the first stretching direction.
[0187] The peeling member may have one or more stretching means (stretching members). Examples of the stretching means (stretching members) that can be used include those exemplified in the above section "1. Temporary Fixing Tape Peeling Method." Examples include a roll, a stage that can be driven up and down within a hollow portion, a protruding pin that can be driven up and down within a hollow portion, a clamping and moving unit that clamps and expands the tape, and other expanding means used in conventional expanding devices. For example, FIG. 13 shows an example in which the stretching means 10 is a roll. Also, FIGS. 11, 16, and 17 show examples in which the stretching means 10 is a stretching member that can be driven up and down within a hollow portion and that can pass through the hollow portion and press the temporary fixing tape 100 covering the hollow portion in the passing direction. In the above figures, the stretching member is a stage.
[0188] The stretching means (stretching member) 10 shown in Figures 11, 16, and 17 can be driven up and down within the hollow portion, and the stretching means (stretching member) 10 presses the temporary fixing tape 100 from the side opposite to the side on which the component (component) 3 is placed, causing the temporary fixing tape 100 to protrude so as to form a convex shape toward the side on which the component (component) 3 is placed. This stretches the temporary fixing tape 100, allowing the component (component) 3 to be peeled off. From the viewpoint of being able to simultaneously press the adhesive surfaces 4 between multiple components (components) 3 and the temporary fixing tape 100, it is preferable that the area of the top of the stretching means (stretching member) that comes into contact with the temporary fixing tape be larger than the surface area of the surface of the component (component) on the opposite side of the stretching means of the temporary fixing tape that comes into contact with the tape. When multiple components (components) are placed on the temporary fixing tape, it is even more preferable that the area of the top of the stretching means (stretching member) be larger than the sum of the surface areas of the surfaces of the multiple components (components) that come into contact with the tape.
[0189] When the stretching means is a stretching member (stage) that can be driven up and down within the hollow portion, the portion where the stretching means (stretching member) presses the temporary fixing tape, for example, the top of the stretching means (stretching member), may be pointed or planar. In particular, the top is preferably planar, from the viewpoint that one stretching means (stretching member) can uniformly press the adhesive surfaces between a large number of components and the temporary fixing tape from the side opposite the component placement side of the temporary fixing tape. When the top of the stretching member has a surface, the shape of the surface in plan view is appropriately selected from elliptical, circular, triangular, rectangular, other polygonal, etc.
[0190] When the stretching means (stretching member) is a stretching member that can be driven up and down within a hollow portion and the top of the stretching means (stretching member) is planar (when the stretching means is a stage that can be driven up and down within a hollow portion), the top surface of the stretching means (stretching member) may be rough or smooth. The top surface of the stretching means (stretching member) may have an uneven shape, collectively referred to as a matte or satin finish, or may be treated with Teflon (registered trademark) to provide slipperiness. The top surface of the stretching member may be flat or curved. In particular, when the top surface of the stretching means (stretching member) is a rough, flat surface, when the temporary fixing tape is pushed toward the component mounting surface by driving the stretching means, contact between the tape and the stretching means is more likely to occur locally at the edge (corner) of the top surface than at the top surface, which makes slippage between the tape and the top of the stretching means more likely, and thus the temporary fixing tape is more easily stretched.
[0191] Furthermore, when the stretching means (stretching member) is a stretching member (stage) that can be driven up and down within a hollow portion, the stretching means (stretching member) preferably has an outer periphery (rim) and a hollow region inside the outer periphery (rim) in a planar view. The contact area between the temporary fixing tape and the stretching means (stretching member) is reduced at the top surface of the stretching means (stretching member), making it easier to stretch the temporary fixing tape. Examples of the shape of the outer periphery in a planar view include a circular shape (annular), a triangular shape, a quadrangular shape, and a polygonal shape with pentagons or more (polygonal frame shape). When the shape of the surface adhesive force in a planar view is polygonal, it is preferable that the corners have curvature in order to prevent the tape from breaking due to contact with the outer periphery during stretching. In particular, it is preferable that the outer periphery (rim) be annular with a hollow region inside, since this allows for uniform stretching in all directions. Examples of shapes having the outer periphery (rim) and a hollow region inside the outer periphery (rim) include spoke shapes. The planar shape of the hollow region is not particularly limited, and can be set appropriately depending on the shape of the outer periphery, such as a circle or a polygon.
[0192] Figure 18 is a schematic diagram showing an example of a stretching means (stretching member), with Figure 18(a) being a side view and Figure 18(b) being a top view. The stretching means (stretching member) 10 shown in Figure 18 has a circular spoke shape in plan view, having an outer periphery (rim) 21 and a hollow region 22 inside the outer periphery (rim) 21. The hollow region 22 is an area surrounded by the outer periphery (rim) 21.
[0193] Furthermore, when the stretching means (stretching member) has an annular shape in plan view having an outer periphery and a hollow region inside the outer periphery, it is preferable that a portion of the surface of the outer periphery be covered with a covering portion that can rotate along the outer periphery of the outer periphery. Figure 19 is a schematic diagram showing an example of a stretching means (stretching member), with Figure 19(a) being a side view, Figure 19(b) being a top view, and Figure 19(c) being an X-X cross-sectional view of Figure 19(b). The stretching means (stretching member) 10 shown in Figure 19 has a portion of the surface of the outer periphery 21 of the stretching means (stretching member) 10 shown in Figure 18 covered with multiple covering portions 25, and as shown in Figure 19(c), the covering portions 25 can rotate around the central axis of the cross-section of the outer periphery 21. In other words, the covering portions 25 can rotate along the outer periphery of the outer periphery 21. The arrow in Figure 19(c) indicates the rotation of the covering portions 25. The cross-sectional shape of the outer periphery is preferably circular so that the covering portion covering the surface of the outer periphery (rim) can rotate along the outer periphery of the outer periphery (rim). It is more preferable that the covering portion has a rough surface, since this further improves the extensibility of the temporary fixing tape. It is also preferable that the covering portion is formed from a low-adhesion material such as an olefin resin, a fluororesin, or Teflon. The covering portion covers at least a portion of the outer periphery, but it may also cover the entire outer periphery as long as it can rotate along the outer periphery of the outer periphery (rim).
[0194] 18 and 19, reference numeral 23 denotes a support that supports the extension member in the vertical direction, and reference numeral 24 denotes a bone portion that connects the support and the extension member.
[0195] When the stretching means (stretching member) is a stretching member (e.g., a stage, a convex pin, etc.) that can be driven up and down within the hollow portion, the vertical movement distance of the stretching means when the part (member) is peeled off from the temporary fixing tape (the protrusion distance of the tape by the stretching means) is not particularly limited, but can be, for example, 500 mm (50 cm) or less. In particular, even if the movement distance of the stretching means (the protrusion distance of the tape by the stretching means) is small, the part can be peeled off by stretching the temporary fixing tape. From the viewpoint of operability and simplification of the peeling process, 300 mm (30 cm) or less is preferable, 200 mm (20 cm) or less is more preferable, and 100 mm (10 cm) or less is even more preferable. The smaller the movement distance of the stretching means when the part (member) is peeled off from the temporary fixing tape (the protrusion distance of the tape by the stretching means), the better. However, from the viewpoint of compatibility with temporary fixability, 5 mm or more is preferable, and 10 mm or more is more preferable. The vertical movement distance of the stretching means (stretching member) when a component (member) is peeled off from the temporary fixing tape (the protrusion distance of the tape by the stretching means) refers to the movement distance from the position S (position before stretching) where the top of the stretching means (stretching member) 10 contacts the underside of the temporary fixing tape 100 placed on a horizontal plane, as indicated by the symbol h in Fig. 22, to the time when the component 3 is peeled off from the temporary fixing tape 100. It is preferable to adjust the physical properties of the temporary fixing tape applied to this peeling member, such as the elongation at peeling, taking into consideration the movement distance.
[0196] The material of the stretching means (stretching member) is not particularly limited as long as it does not inhibit the stretching of the temporary fixing tape, and may be any of metal, plastic, wood, and mineral. From the viewpoints of corrosion resistance, influence on members, etc., metal or plastic is preferred.
[0197] (Hollow Portion) In this peeling member, the hollow portion is formed by the holding portion. The hollow portion corresponds to the area surrounded by the holding portion. For example, as shown in FIG. 12, when two holders 9 are arranged side by side as the holding portion, the area sandwiched between the two holding portions (holders) 9 corresponds to the hollow portion. Also, as shown in FIG. 14, if the holding portion (holder) 9 is ring-shaped, i.e., a frame, the inside of the frame (ring) corresponds to the hollow portion. In plan view, the hollow portion may be an open system as shown in FIG. 12, or a closed system as shown in FIG. 14.
[0198] The shape of the hollow portion in plan view is not particularly limited and may be appropriately selected from, for example, an ellipse, a circle, a triangle, a rectangle, or other polygons. Furthermore, the size of the hollow portion in plan view is not particularly limited, but it is preferably large enough to contain the components fixed to the temporary fixing tape in plan view. When multiple components are fixed to the temporary fixing tape, it is preferably large enough to contain all of the components.
[0199] 12 and 13 are top views showing an example of a specific embodiment of the present peeling member. As a specific embodiment of the present peeling member, for example, as shown in Fig. 12, it has a stretching member as the stretching means 10 and a holder as the holding part 9, and the holding part (holder) 9 forms a hollow part (no reference number). A temporary fixing tape 100 (the dotted line part in Fig. 12) is arranged so as to cover the hollow part.
[0200] The stretching means (stretching member) 10 may be a pair of rolls as exemplified in Fig. 13. The roll serving as the stretching means (stretching member) can stretch the region located in the hollow portion of the temporary fixing tape while holding the temporary fixing tape, for example, by winding up the temporary fixing tape. Alternatively, the roll serving as the stretching means (stretching member) may have the function of holding the end of the temporary fixing tape, and one or both of the stretching means (stretching members) may be movable to stretch the temporary fixing tape.
[0201] 12 and 13 , one or both of the holding parts (holding tools) 9 may be movable, and the holding parts (holding tools) 9 may have the function of stretching the temporary fixing tape in a direction different from the stretching direction by the stretching means (stretching member) 10. The holding parts (holding tools) also perform the same function as the stretching means (stretching member), and this peeling member can stretch the temporary fixing tape biaxially in a plan view, and can release the adhesive state between the tape and the component by stretching the tape.
[0202] Another preferred embodiment of the present peeling member is a peeling member having a holding portion (holding tool) 9 and a stretching means (stretching member) 10 having a holding function, as shown in FIG. 10 . The holding portion (holding tool) 9 is ring-shaped, as shown in FIG. 14 , for example, and has a hollow portion inside which the adhesive surface 4 between the component (not shown) and the temporary fixing layer is located. In the example shown in FIG. 10 , a temporary fixing tape 100 is attached to the holding portion (holding tool) 9 so as to cover the hollow portion of the holding portion (holding tool) 9, and an excess portion of the tape is placed on the opposite side of the component 3 via the holding portion (holding tool) 9 (so as to cover part of the surface of the holder 9). An end of the temporary fixing tape 100 is held by a movable stretching member 10 having a holding function. By moving the stretching member 10 in the direction opposite the component 3 (the direction indicated by arrow Y in FIG. 10 ), the adhesive surface between the component 3 and the temporary fixing layer is stretched in all directions within the plane, and the temporary fixing tape 100 is peeled off from the component 3.
[0203] In this peeling member, it is preferable that the stretching means passes through the hollow portion and has a stretching member that presses the temporary fixing tape covering the hollow portion in the passing direction. Another preferred embodiment of this peeling member is a peeling member having two holding portions (holding tools) 9, 9' and a stretching member 10, as shown in Fig. 11 . In the example shown in Fig. 11 , temporary fixing tape 100 is attached to holding portion (holding tool) 9 so as to cover the hollow portion of holding portion (holding tool) 9, and the excess portion of the tape is positioned on the opposite side of the holding portion (holding tool) 9 from the mounting surface side of component 3, and the end of the tape is fixed by holding portion (holding tool) 9'. In the hollow portion, a stretching means (stretching member) 10 is disposed on the side of the temporary fixing tape 100 opposite to the side on which the component 3 is placed, and the stretching means (stretching member) 10 is moved in the direction shown by arrow Y in Figure 11 (the direction in which the stretching means passes through the hollow portion) to press the stretching means (stretching member) 10 from the back side of the adhesive surface between the component 3 and the temporary fixing layer toward the component 3. As a result, the adhesive surface located in the hollow portion is stretched in all directions within the plane, and the component 3 is peeled off from the temporary fixing tape 100.
[0204] In FIG. 11 , one holding portion (holding tool) 9′ holds and fixes the end of the temporary fixing tape 100. However, as shown in FIGS. 15 and 16 , for example, the temporary fixing tape 100 may be positioned so as to cover the hollow portion formed by the holding portion (holding tool) 9, and the excess portion of the temporary fixing tape 100 may be folded via the holding portion (holding tool) 9. Furthermore, with the excess portion and the adhesive surface positioned parallel to each other, the excess portion may be pressed by the holding portion (holding tool) 9′ located on the component 3 mounting surface side of the temporary fixing tape 100. As in FIG. 11 , by moving the stretching member 10 from the back side of the adhesive surface 4 between the component 3 and the temporary fixing layer (the opposite side from the component mounting surface of the temporary fixing tape 100) to the component 3 side (component mounting side), the adhesive surface 4 is stretched in all directions within the plane, and the component 3 is peeled off from the temporary fixing tape 100. Note that FIG. 16 is a cross-sectional view taken along line A-A′ in FIG. 15 .
[0205] In another embodiment of the peeling member, as shown in FIG. 17 , a holding portion (holding tool) 9 is used to press the excess portion of the temporary fixing tape 100 from the component 3 mounting surface of the temporary fixing tape 100 (adhesive surface 4 between the component 3 and the temporary fixing tape 100), and the hollow portion of the holding portion (holding tool) 9 is covered with the temporary fixing tape 100. The stretching member 10 is then moved so that it protrudes from the back side of the adhesive surface 4 between the component 3 and the temporary fixing layer (the opposite side to the component mounting surface of the temporary fixing tape 100) to the component 3 side (component mounting side), whereby the adhesive surface 4 is stretched in all directions within the plane, and the component 3 is peeled off from the temporary fixing tape 100.
[0206] 16 and 17 , the component (member) 3 is placed on the upper surface of the temporary fixing tape 100, and the direction of tension is downward relative to the temporary fixing tape 100, but the component (member) 3 may also be placed on the lower surface of the temporary fixing tape 100. When the component (member) 3 is placed on the lower surface of the temporary fixing tape 100, the stretching means (stretching member) 10 is placed on the upper surface side of the temporary fixing tape 100, and the stretching means (stretching member) 10 presses the temporary fixing tape 100 from the upper surface side to protrude the temporary fixing tape 100 to the opposite side (surface side), and the direction of tension is made upward relative to the temporary fixing tape 100, thereby enabling the same operations as those in FIGS.
[0207] Of the above-mentioned present peeling members, from the viewpoint that they can be uniformly stretched in all directions within the adhesive surface between the temporary fixing tape and the component, and can be suitably used in a method in which stretching in all directions is performed simultaneously, the present peeling members schematically shown in Figures 10, 11 and 13 to 17 are preferred. Also, the present peeling members schematically shown in Figures 14 to 17 are preferred from the viewpoint that they make it possible to continuously peel off the temporary fixing tape, and to bond components to multiple locations on a long temporary fixing tape, thereby making it possible to improve the efficiency of the peeling operation.
[0208] In a component manufacturing method (a method for processing a member (workpiece)), by carrying out this peeling method using this peeling member, a component can be peeled from the temporary fixing tape simply by stretching the temporary fixing tape. The component peeled from the temporary fixing tape is further separated from the temporary fixing tape by a desired separation method. The separation method is not particularly limited, and may be, for example, any of suction, clamping, sweeping, or the like, or a separation method in which the component falls under its own weight. When separation is performed by suction, examples of the suction means include a suction cup, a suction machine, and a suction collet. When separation is performed by clamping, examples include tweezers and a clamp. When separation is performed by sweeping, examples include a swinging plate, air pressure, a brush, and the like.
[0209] This peeling member is appropriately installed at a desired position in accordance with the component manufacturing apparatus and component (component) manufacturing method described below. If the component is to be separated from the temporary fixing tape by its own weight, it is preferable to install this peeling member so that the adhesive surface between the component and the temporary fixing layer is parallel to the vertical direction or so that the component faces downward.
[0210] The details of the peeling member include not only the details explained in this section, but also the contents explained in "1. Method for peeling off temporary fixing tape" above and the subsequent sections.
[0211] 3. Component Manufacturing Apparatus The component manufacturing apparatus of the present disclosure (hereinafter sometimes referred to as the present manufacturing apparatus) is equipped with the peeling member described above in "2. Peeling Member." By incorporating the above-described present peeling member into the manufacturing apparatus, the present manufacturing apparatus can efficiently manufacture components. Note that the components manufactured by the present manufacturing apparatus may also be referred to as members, processed products, etc.
[0212] The components (workpieces) manufactured by this manufacturing apparatus are not particularly limited, but examples include electronic components such as semiconductor wafers, multilayer ceramic capacitors, inductors, and various chip components. Among these electronic components, microcomponents (microelectronic components) can be efficiently manufactured by this manufacturing apparatus. This manufacturing apparatus can also be used to manufacture optical components such as optical glass and polarizing plates.
[0213] The size of the surface area of the part (member) that is fixed to the temporary fixing tape is not particularly limited, but the smaller the surface area, the easier it is to achieve the effects of the present invention. 2 It can be less than 100 mm 2 Preferably less than 50 mm 2 Preferably less than 30 mm 2 Preferably less than 10 mm 2 Preferably less than 3 mm 2 Preferably less than 1 mm 2 Preferably less than 0.8 mm 2 Preferably less than 0.5 mm 2 Preferably less than 0.2 mm 2 The lower limit of the surface area is not particularly limited, but is preferably 0.001 mm or less. 2 More than 0.005 mm, preferably 0.005 mm 2 More than 0.01 mm, preferably 0.01 mm 2 More than 0.05 mm, preferably 0.05 mm 2 That is all. In particular, it is preferable that the surface area of the surface (adhered surface) of a micro-component (microelectronic component) fixed to the temporary fixing tape is in the millimeter level or less, and more preferably in the micro level. More specifically, it is preferable that the micro-component (microelectronic component) is a component having a size that includes the dimensional size specified in JIS C 5101-22:2014 (IEC 60384-22:2011). In particular, it is preferable that the surface area of the surface of a micro-component (microelectronic component) fixed to the temporary fixing tape is 1 mm 2 Preferably, it is 0.8 mm or less. 2 More preferably, 0.5 mm or less 2 The following is even more preferred:
[0214] The manufacturing apparatus may have one or more other functions in addition to the peeling member. The other functions are not particularly limited, and examples thereof include a processing function for performing processes such as cutting, polishing, cutting, and etching, a pressure-welding function for pressing a component onto the temporary fixing tape, a transfer function for transferring a component from the temporary fixing tape to another adherend, a manufacturing function for manufacturing a component, an assembly function for assembling components together, and a joining function for joining a component to another component. A component manufacturing apparatus having these functions can complete the entire process of manufacturing a component on the temporary fixing tape with a single apparatus.
[0215] The temporary fixing tape used to fix components in this manufacturing apparatus is preferably the tape described in the section "1. Method for peeling off temporary fixing tape."
[0216] The details of this manufacturing method include not only the details explained in this section, but also the contents explained in the above "1. Method for peeling off temporary fixing tape" and "2. Peeling member" and the subsequent sections.
[0217] 4. Manufacturing Method of Component The manufacturing method of a component according to the present disclosure (hereinafter, sometimes referred to as the present manufacturing method) includes at least a peeling step of peeling off a component fixed on a temporary fixing tape using the method for peeling off a temporary fixing tape described above in the section "1. Method for Peeling Off a Temporary Fixing Tape." The component obtained by the present manufacturing method may be a processed product or an unprocessed workpiece.
[0218] FIG. 20 is a process diagram showing an example of a method for manufacturing a component according to the present disclosure, which includes a peeling step in which a component 3 is fixed onto a temporary fixing layer (not shown) of a temporary fixing tape 100, and the component 3 is peeled off from the temporary fixing tape 100 by stretching the temporary fixing tape 100 in one direction P ( FIGS. 20( a) and (b) ).
[0219] According to this manufacturing method, a large number of components can be peeled off from the temporary fixing tape at once simply by stretching the temporary fixing tape while the components are fixed to the temporary fixing tape. Therefore, there is no need to apply heat or energy rays when peeling off the components, making it possible to carry out the peeling step in component manufacturing simply and easily, and further making it possible to suppress the occurrence of component contamination such as glue residue.
[0220] One example of this manufacturing method includes a processing step of processing one or more workpieces (members) on a temporary fixing tape to obtain one or more workpieces, and a peeling step of peeling the workpieces from the temporary fixing tape, wherein the temporary fixing tape has an extensible base material and a temporary fixing layer on one surface of the extensible base material and can be peeled off by stretching, and in the peeling step, the temporary fixing tape is stretched in at least one direction by a stretching means to peel off the workpieces. The workpieces correspond to the processed parts in the above sections "2. Peeling member" and "3. Component manufacturing apparatus."
[0221] According to this manufacturing method, by processing workpieces (members) on the temporary fixing tape and then stretching the temporary fixing tape, it is possible to peel a large number of workpieces from the temporary fixing tape at once. Furthermore, according to this manufacturing method, the fixation of the workpieces can be released simply by stretching the tape, so that heating or irradiation with energy rays is not required when peeling the workpieces, making it possible to carry out the peeling step simply and easily, and further making it possible to suppress the occurrence of contamination of the workpieces, such as adhesive residue.
[0222] The temporary fixing tape used in this manufacturing method and the method for peeling it off are the same as those explained in the above section "1. Method for Peeling Off Temporary Fixing Tape," and therefore a description thereof will be omitted here. Furthermore, the parts that can be manufactured by this manufacturing method are not particularly limited, and as they have already been explained, a description thereof will be omitted here. The part peeled off from the temporary fixing tape in the peeling step may be processed (may be a processed product) or may not be processed (may be a workpiece).
[0223] In the peeling step, the components are peeled off from the temporary fixing tape using the peeling method described above in the section "1. Peeling method of temporary fixing tape." In the peeling step, it is preferable to use the peeling member described above in the section "2. Peeling member."
[0224] When the present manufacturing method further includes a processing step described below, in the peeling step, the part processed in the processing step (also referred to as a processed product or a processed member) is peeled from the temporary fixing tape using the peeling method described above in the section "1. Method for peeling off temporary fixing tape." In the peeling step, it is preferable to use the peeling member described above in the section "2. Peeling member."
[0225] After the peeling step, the components peeled from the temporary fixing tape are separated from the temporary fixing tape. The method for separating the components, etc. peeled from the temporary fixing tape is not particularly limited, and the separation method for separating the components, etc. from the temporary fixing tape described above in the section "2. Peeling member" can be used. The components, etc. may be further sent to the other steps described above.
[0226] In the peeling step of this manufacturing method, another adherend may be placed on the side of the component opposite the adhesive surface to which the temporary fixing tape is attached, and the temporary fixing tape may be peeled from the component using the above-mentioned peeling method from a composite having the temporary fixing tape, the component, and the other adherend in this order, while simultaneously transferring the component from the temporary fixing tape to the other adherend. That is, the peeling step may include a transfer step. Figure 21 is a process diagram showing another example of this manufacturing method, in which the other adherend 200 is placed on the surface of the component 3 opposite the adhesive surface to which the temporary fixing tape 100 is attached ( Figure 21( a) ), and the temporary fixing tape 100 is stretched to peel the component 3 from the composite having the temporary fixing tape 100, the component 3, and the other adherend 200 in this order, while simultaneously transferring the component 3 to the other adherend 200 ( Figures 21( b) and 21( c) ).
[0227] The other adherend to which the part is transferred is not particularly limited as long as it can directly or indirectly fix the transferred part, and examples thereof include adhesive tape, pressure-sensitive adhesive tape, other parts coated with adhesive, etc.
[0228] This manufacturing method may include at least the peeling step described above, but may also include other steps. For example, this manufacturing method may include a processing step of processing the component (also referred to as the workpiece or the pre-processed member) temporarily fixed on the temporary fixing tape before the peeling step. The type of processing performed on the component is not particularly limited, and examples include cutting, polishing, cutting, etching, etc., as already explained in the section "3. Component Manufacturing Apparatus." The component (workpiece) before processing and the component (processed product) after processing have already been explained, so a description thereof will be omitted here.
[0229] The manufacturing method of this component is not particularly limited as long as it can at least carry out the peeling step described above. In particular, by using the apparatus described in the above section "3. Component manufacturing apparatus," components can be manufactured efficiently.
[0230] The components obtainable by this manufacturing method are not particularly limited, and include the components already described in the above section "3. Component Manufacturing Apparatus." Of these, it is preferable that the components are electronic components, and for example, ultra-small electronic components such as multilayer ceramic capacitors and various chips are preferred. Furthermore, the size of the components obtainable by this manufacturing method is not particularly limited, and can be selected appropriately from the sizes already described. Among these, it is preferable that the surface area of the surface in contact with the temporary fixing tape is 100 mm 2 (1 cm 2 ) or less, because the effect of the peeling step in the present manufacturing method can be more significantly obtained.
[0231] 5. Others The present disclosure includes the following aspects. [1] A method for peeling off a temporary fixing tape having one or more members temporarily fixed to a surface thereof, the temporary fixing tape having an extensible base and a temporary fixing layer on at least one surface of the extensible base, being releasable by stretching, the members being temporarily fixed to the temporary fixing layer, and the temporary fixing tape being stretched in at least one direction by a stretching means to peel off the temporary fixing tape from the members. [2] The method for peeling off a temporary fixing tape according to [1] above, wherein the stretching means simultaneously or sequentially stretches the temporary fixing tape in the one direction and one or more directions different from the one direction. [3] The method for peeling off a temporary fixing tape according to [1] above or [2] above, wherein the stretching means stretches the temporary fixing tape in two different directions, the two directions forming an angle of approximately 90°. [4] The method for peeling off a temporary fixing tape according to any one of [1] to [3] above, wherein the stretching means stretches the temporary fixing tape in all directions. [5] The method for peeling off a temporary fixing tape according to any one of [1] to [4] above, wherein the stretching means applies tension in a horizontal direction to the adhesive surface between the member and the temporary fixing layer. [6] The method for peeling off a temporary fixing tape according to any one of [1] to [5] above, wherein the stretching means applies tension to the adhesive surface between the member and the temporary fixing layer in a direction opposite to the side on which the member is placed. [7] The method for peeling off a temporary fixing tape according to any one of [1] to [6] above, wherein the direction of the tension is 90° or less with respect to the adhesive surface. [8] The method for peeling a temporary fixing tape according to any one of [1] to [7] above, wherein, when the temporary fixing tape is stretched in the one direction by the stretching means, the length of the temporary fixing tape after stretching in the direction generally perpendicular to the one direction is 0.9 or more relative to the length of the temporary fixing tape before stretching in the direction generally perpendicular to the one direction. [9] The method for peeling a temporary fixing tape according to any one of [1] to [8] above, wherein the member is an electronic component.
[10] A temporary fixing tape peeling member having a holding part that holds the temporary fixing tape, a hollow part formed by the holding part, and stretching means, the holding part is arranged so that the temporary fixing tape covers the hollow part, and the stretching means has a function of stretching in at least one direction within the plane of the temporary fixing tape that covers the hollow part.
[11] The temporary fixing tape peeling member according to
[10] above, wherein the stretching means further has a stretching function of stretching the temporary fixing tape covering the hollow portion in at least one direction different from the one direction.
[12] The temporary fixing tape peeling member according to
[10] or
[11] above, wherein the stretching means has a function of simultaneously stretching the temporary fixing tape covering the hollow portion in the stretching direction and two or more directions different from the stretching direction.
[13] The temporary fixing tape peeling member according to any of
[10] to
[12] above, wherein the stretching means further has a stretching member that passes through the hollow portion and presses the temporary fixing tape covering the hollow portion in the passing direction.
[14] A component manufacturing device comprising the temporary fixing tape peeling member according to any of
[10] to
[13] above.
[15] A method for producing a workpiece, comprising: a processing step of processing one or more members on a temporary fixing tape to obtain one or more workpieces; and a peeling step of peeling the workpieces from the temporary fixing tape, wherein the temporary fixing tape has an extensible base material and a temporary fixing layer on at least one surface of the extensible base material and is peelable by stretching, and in the peeling step, the workpiece is peeled off by stretching the temporary fixing tape in at least one direction by a stretching means.
[16] A method for producing a workpiece according to the above
[15] , wherein the workpiece is an electronic component.
[0232] The present disclosure has been described above with respect to the present peeling method, the present peeling member, the present manufacturing apparatus, and the present manufacturing method, but the present disclosure is not limited to the configurations of the above embodiments. The present peeling method and the present manufacturing method may include any other process in the configurations of the above embodiments, or may be replaced with any process that performs a similar function. Furthermore, the present peeling member and the present manufacturing apparatus may include any other configuration in the configurations of the above embodiments, or may be replaced with any configuration that performs a similar function.
[0233] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these. Note that the temporary fixing tape may also be referred to simply as "tape."
[0234] 1. Evaluation of Tape Properties (1) Thickness Measurement The measurement object was cut to an arbitrary size, and the thickness was measured at five locations at 10 mm intervals in the length direction and at five locations at 10 mm intervals in the width direction using a dial thickness gauge (manufactured by Ozaki Seisakusho Co., Ltd., Model G-0.4N or Model G-2.4N). The value obtained by averaging the thicknesses at these 10 locations was regarded as the thickness of the object. The combined thickness of the adhesive layer, pressure-sensitive adhesive layer, and intermediate layer was measured using the release liner as the support, and the value obtained by subtracting the thickness of the support was regarded as the thickness.
[0235] (2) Apparent Density of Adsorption Layer According to JIS K6767, a test piece of the adsorption layer was cut into a rectangle of 4 cm length x 5 cm width, and the apparent volume (length x width x thickness) [cm ] of the test piece was calculated from the length, width, and thickness of the test piece. 3 The mass [g] of the test piece was measured, and the mass was divided by the apparent volume to obtain the apparent density.
[0236] (3) Average opening diameter on the surface of the adsorption layer: The adsorption layer was observed in plan view using a tabletop low-vacuum scanning electron microscope (SEM, Hitachi High-Technologies Corporation, "Miniscope™3030Plus"), and an enlarged photograph of the surface of the adsorption layer was taken at a magnification of 100x.The opening diameters of an arbitrary recess located at the center of the photograph and 30 recesses located nearby were all measured, and the average value was defined as the average opening diameter.
[0237] (4) Opening ratio on the surface of the adsorption layer: Using an electron microscope (Keyence Corporation, Digital Microscope VHX6000), the surface of the adsorption layer was photographed at 200x magnification (automatic brightness adjustment, 1.27 mm length × 1.7 mm width), and the area of the black parts and the total area of the imaged were calculated by software analysis. The opening ratio was calculated by dividing the area of the black parts by the total area. Note that in the above image, the black parts are recesses formed on the surface of the adsorption layer, and the area of the black parts corresponds to the projected area of the recesses.
[0238] (5) 50% Modulus, Breaking Strength, and Breaking Elongation The test specimen was punched into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm. Test specimens were then measured using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) at a measurement atmosphere of 23 °C and 50% RH, and pulled in the longitudinal direction at a tensile speed of 500 mm / min. The 50% modulus was calculated by dividing the stress value (unit: N) obtained at 50% elongation by the thickness (unit: mm) and width (unit: mm) of the test specimen used for the measurement. The breaking strength was calculated by dividing the stress value (unit: N) at break by the thickness (unit: mm) and width (unit: mm) of the test specimen, and the elongation at that time was calculated as the breaking elongation. The calculation formulas for the elongation and breaking elongation in the modulus are as described above.
[0239] (6) Holding Power The substrate surface of the temporary fixing tape obtained in the Examples and Comparative Examples was lined with a PET single-sided adhesive tape (#8625S manufactured by DIC Corporation) to prevent stretching and peeling of the substrate due to load, and the tape was cut to a width of 20 mm x a length of 100 mm. The tape was placed on the surface of a clean, smooth stainless steel plate (hairline polished with #360 waterproof abrasive paper) in an atmosphere of 23°C and 50% RH so that the adhesive area was 20 mm x 20 mm. A 2 kg roller was moved back and forth across the top surface to press the tape together, and the tape was left to stand for 1 hour in an environment of 23°C to prepare a test specimen. With the stainless steel plate constituting the test specimen fixed, a load of 1 kg was applied to the tape in an environment of 70°C, and the time from when the tape fell off the stainless steel plate was measured.
[0240] (7) Surface Adhesion Forces F1 and F2 As shown in Figure 23, a test stage was created by attaching a strong adhesive double-sided tape (#8625ER-140 manufactured by DIC Corporation) 52 to the surface of a 2 mm thick stainless steel plate 51a, and the surface opposite to the temporary fixing layer 1 of the substrate 2 of the temporary fixing tape 100 cut to 20 mm x 20 mm was attached to the strong adhesive double-sided tape 52 of the test stage to form a test piece 55. Next, a 2 mm thick x 50 mm long x 40 mm wide stainless steel plate 51b was attached to the surface of the temporary fixing layer 1 of the tape 100 and pressed with 1 kg for 10 seconds, and then left in an atmosphere of 23 ° C. and 50% RH for 1 hour or 24 hours. The strength [N / 20 mm] when the test piece 55 was peeled from the stainless steel plate 51b in the vertical direction N at a rate of 300 mm / min was measured. The surface adhesive strength of the tape measured after being left for 1 hour after being pressed was designated as F1, and the surface adhesive strength of the tape measured after being left for 24 hours after being pressed was designated as F2.
[0241] 2. Preparation of Substrates The following substrates (1) to (3) were prepared.
[0242] Substrate (1) As the substrate (1), an ester-based polyurethane resin film (Esmer URS, manufactured by Nihon Matai Co., Ltd., thickness 100 μm) was used.
[0243] Substrate (2) Toluene was added to a hydrogenated styrene-isoprene-styrene triblock copolymer (SEPS, "Septon 2063", manufactured by Kuraray Co., Ltd.), and the mixture was stirred to be uniform. The mixture was then applied to a release liner (Film Vina 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator so that the thickness after drying would be 100 μm, and the mixture was dried at 60° C. for 5 minutes to form the substrate (2).
[0244] Substrate (3) A 3-L three-neck flask was fitted with a three-way stopcock and the interior was purged with nitrogen. Then, 1,861 g of toluene and 14.3 g of 1,2-dimethoxyethane were added while stirring at room temperature. Subsequently, 44.3 g of a toluene solution containing 22.3 mmol of isobutylbis(2,6-di-t-butyl-4-methylphenoxy)aluminum was added, followed by 1.04 g of a cyclohexane solution of sec-butyllithium containing 1.78 mmol of sec-butyllithium. Subsequently, 21.9 g of methyl methacrylate was added to the mixture. The reaction solution was initially yellow, but became colorless after stirring at room temperature for 60 minutes. Subsequently, the internal temperature of the polymerization solution was cooled to -30°C, and 249 g of n-butyl acrylate was added dropwise over 2 hours. After completion of the dropwise addition, the mixture was stirred at -30°C for 5 minutes. Further, 21.9 g of methyl methacrylate was added to the mixture and stirred overnight at room temperature. Then, 24 g of methanol was added to terminate the polymerization reaction, and the resulting reaction solution was poured into 15 kg of methanol to precipitate. The precipitate was then collected and dried to obtain 296 g of acrylic triblock copolymer (1). The weight-average molecular weight (Mw) and molecular weight distribution (Mw / Mn) of the resulting acrylic triblock copolymer (1) were determined by GPC measurement using the method described above, and the weight-average molecular weight (Mw) was 100,000 and the molecular weight distribution (Mw / Mn) was 1.2.
[0245] To 100 parts by mass (solid content) of the acrylic triblock copolymer (1), 2.5 parts by mass of a polyfunctional polymerizable monomer (pentaerythritol triacrylate, manufactured by Toa Gosei Co., Ltd., Aronix M305, molecular weight 298, trifunctional) and 0.4 parts by mass of a photopolymerization initiator (Irgacure 184, manufactured by IGM Resins B.V.) were added, and ethyl acetate was further added and stirred to obtain a substrate material with a solid content of 40% by mass.
[0246] The obtained substrate material was applied to a release liner (PET38x1, A3, manufactured by Nippa Corporation) using an applicator so that the average thickness after drying would be 100 μm, and then dried for 2 minutes in a dryer at 80° C. Next, after bonding to the release liner (PET38x1, A3, manufactured by Nippa Corporation), the substrate material was irradiated with an integrated light dose of 1,000 mJ / cm using an electrodeless UV lamp system manufactured by Heraeus.2 The substrate (3) was prepared by irradiating the substrate with ultraviolet light so that the substrate (3) was
[0247] Substrate (4) A polyester film (Lumirror S10, Toray Industries, Inc., thickness 100 μm) was used as the non-extensible substrate (4).
[0248] The physical properties of each substrate are as follows:
[0249]
[0250] 3. Production of Temporary Fixing Tape A (Adsorption Layer Type) [Production Example 1-1] <Preparation of Adsorption Layer-Forming Resin Composition (1)> In a 2-L reaction vessel equipped with a stirrer, a thermometer, and a cooler, 200 parts by mass of ion-exchanged water was charged and heated to 80°C, and 225 parts by mass of ethyl acrylate (hereinafter abbreviated as "EA"), 225 parts by mass of n-butyl acrylate (hereinafter abbreviated as "BA"), 70 parts by mass of acrylonitrile (hereinafter abbreviated as "AN"), and 15 parts by mass of N-methylolacrylamide (hereinafter abbreviated as "N-MAM") were added. An emulsion prepared by emulsifying 15 parts by weight of sodium dodecylbenzenesulfonate, 6 parts by weight of acrylic acid (hereinafter abbreviated as "AA") in a solution of 15 parts by weight of sodium dodecylbenzenesulfonate and 5 parts by weight of ammonium persulfate in 200 parts by weight of ion-exchanged water was added dropwise over two hours to allow emulsion polymerization. After holding for two hours, the mixture was cooled to below 40°C, and the pH was adjusted to 7-8 with aqueous ammonia and the non-volatile content to 54% to 56% with ion-exchanged water to obtain an aqueous acrylic emulsion (1). The resulting aqueous acrylic emulsion (1) had a non-volatile content of 55% and a pH of 7.4. The specific gravity of the aqueous acrylic emulsion (1) (the resin composition for forming an adsorption layer before mechanical foaming) was 1.01.
[0251] To 100 parts by mass of the aqueous acrylic emulsion (1), 5 parts by mass of Amidair M-3 (a melamine crosslinking agent manufactured by DIC Corporation) was added, followed by 6 parts by mass of Sunspearl RA-33 (a surfactant manufactured by San Nopco Ltd.) and 5 parts by mass of RHEOBYK-H 7625-VF (a thickener manufactured by BYK Japan KK) and stirring uniformly. The mixture was then mechanically foamed by stirring for about 2 minutes using a household electric hand mixer (THM1300 manufactured by TESCOM Corporation, 600 to 1300 rpm, speed adjustment set to "1" out of 5 levels), to obtain a resin composition (1) for forming an adsorption layer (a foamy acrylic resin emulsion) having a specific gravity of 0.51.
[0252] <Preparation of Intermediate Layer-Forming Resin Composition (1)> A reaction vessel equipped with a stirrer, a reflux condenser, a nitrogen inlet tube, a thermometer, and a dropping funnel was charged with 75.94 parts by mass of n-butyl acrylate, 5 parts by mass of 2-ethylhexyl acrylate, 15 parts by mass of cyclohexyl acrylate, 4 parts by mass of acrylic acid, 0.06 parts by mass of 4-hydroxybutyl acrylate, and 200 parts by mass of ethyl acetate, and the mixture was heated to 65°C while stirring and blowing in nitrogen to obtain a mixture (1). Next, 4 parts by mass of a 2,2'-azobisisobutyronitrile solution (solids content 2.5% by mass) previously dissolved in ethyl acetate was added to the mixture (1), and the mixture was held at 65°C for 10 hours while stirring to obtain a mixture (2). Next, the mixture (2) was diluted with ethyl acetate to a solid content of 30% by mass, and the mixture was filtered through a 200-mesh wire screen to obtain a solution of acrylic copolymer (1) having a weight-average molecular weight of 1,600,000 (polystyrene equivalent).
[0253] To 100 parts by mass (solid content) of the acrylic copolymer (1), 2.0 parts by mass of an epoxy-based crosslinking agent (a solution having a solid content of 5% by mass obtained by mixing Tetrad X manufactured by Mitsubishi Gas Chemical Company, Inc. and ethyl acetate) was added, and the mixture was stirred and mixed uniformly to obtain a resin composition (1) for forming an intermediate layer, which is an acrylic pressure-sensitive adhesive 1.
[0254] <Preparation of Temporary Fixing Tape A (I)> The above-mentioned intermediate layer-forming resin composition (1) was applied to a release liner (1) (Film Vina 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator so that the thickness after drying was 10 μm, and then dried at 80 ° C. for 3 minutes to prepare an intermediate layer. Subsequently, the intermediate layer was attached to one side of a corona-treated substrate (1) so that the wet tension was 56 mN / m, and then laminated under a pressure of 0.2 MPa to prepare a laminated intermediate. Subsequently, the above-mentioned adsorption layer-forming resin composition (1) was applied to a release liner (2) (Film Vina 50E-0010NSD, manufactured by Fujimori Kogyo Co., Ltd.) using an applicator so that the thickness after drying was 110 μm, and then dried at 100 ° C. for 5 minutes to prepare an adsorption layer having an open-cell structure with numerous recesses formed on the surface. The release liner (1) of the laminated intermediate was peeled off, and the adsorption layer was attached to the surface of the exposed intermediate layer, followed by lamination under a pressure of 0.2 MPa, thereby producing a temporary fixing tape A (I) having an adsorption layer on one surface of the substrate via the intermediate layer.
[0255] [Production Example 1-2] <Production of Temporary Fixing Tape A (II)> A temporary fixing tape A (II) was produced in the same manner as in Production Example 1, except that the substrate (2) was used instead of the substrate (1).
[0256] [Production Example 1-3] <Production of Temporary Fixing Tape A (III)> A temporary fixing tape A (III) was produced in the same manner as in Production Example 1, except that the substrate (3) was used instead of the substrate (1).
[0257] [Production Example 1-4] <Production of Temporary Fixing Tape A (IV)> A temporary fixing tape A (IV) was produced in the same manner as in Production Example 1, except that the substrate (4) was used instead of the substrate (1).
[0258] Details of the adsorption layers and physical properties of the tapes of the temporary fixing tapes A(I) to A(IV) are as follows.
[0259]
[0260] 4. Production of Temporary Fixing Tape B (Adhesive Layer Type) [Production Example 2-1] <Preparation of Acrylic Triblock Copolymer> A mixed solution was prepared by adding 500 ml of dry toluene and 80 ml of a dry toluene solution containing 0.75 g of bis(pentamethylcyclopentadienyl)samarium tetrahydrofuranate complex [(C5Me5)2SmMe(THF)] as a polymerization initiator to a 1000 ml flask whose interior had been purged with argon. To this mixed solution, 12.0 ml of methyl methacrylate (hereinafter sometimes referred to as "MMA") was added at 0°C, and the mixture was stirred at 0°C for 30 minutes. A 20 ml sample of the solution was then taken from the system and designated Sample 1. After polymerization of the MMA, the polymerization reaction system was cooled to -78°C, and 88.0 ml of n-butyl acrylate (hereinafter sometimes referred to as "nBA") was added as the second monomer, followed by stirring at -78°C for 3 hours. Then, 20 ml of the solution was sampled from the system and designated Sample 2. After the polymerization of nBA described above, 12.0 ml of MMA was added to this polymerization system as the third monomer at -78°C, and the solution was stirred. After the solution became homogeneous, the temperature was raised to 0°C and the solution was stirred for an additional 1 hour. The polymerization was terminated by adding 50 ml of methanol to the resulting reaction mixture and reacting at room temperature for 2 hours. This reaction solution after polymerization termination was poured into a large amount of hexane, and a white precipitate was obtained. A portion of the white precipitate was then sampled and designated Sample 3.
[0261] NMR measurement, DSC measurement, and GPC (gel permeation chromatography) measurement were performed on each polymer in Samples 1 to 3. Based on the measurement results, the number average molecular weight (Mn), PMMA / PnBA (polymethyl methacrylate block / polyn-butyl acrylate block) ratio, etc. were determined. The white precipitate was confirmed to be an acrylic triblock copolymer (PMMA-b-PnBA-b-PMMA) of polymethyl methacrylate (PMMA) block-polyn-butyl acrylate (PnBA) block-polymethyl methacrylate (PMMA) block. The number average molecular weight (Mn) of the entire PMMA-b-PnBA-b-PMMA copolymer was 95,936, and the molecular weight distribution (Mw / Mn) was 1.09. The proportions of the individual polymer blocks were PMMA (11% by mass), PnBA (78% by mass), and PMMA (11% by mass).
[0262] <Preparation of Pressure-Sensitive Adhesive Composition (1)> 100 parts by mass (solid content) of the obtained acrylic triblock copolymer (PMMA-b-PnBA-b-PMMA), 50 parts by mass (solid content) of a terpene phenol-based tackifying resin (Tamanol 803L, Arakawa Chemical Industries, Ltd., softening point 150°C), and silicone particles (1) (KMP-600, manufactured by Shin-Etsu Chemical Co., Ltd., volume average particle size: 5 μm, particle size distribution (D 90 / D 10 50 parts by mass of 3.2) was added to ethyl acetate and stirred and mixed to homogeneity to obtain a pressure-sensitive adhesive composition (1) with a solid content of 40% by mass.
[0263] <Preparation of Temporary Fixing Tape B(I)> A solution of the above-mentioned pressure-sensitive adhesive composition (1) was applied to a release liner (Film Vina 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd., the same applies hereinafter) using an applicator so that the thickness after drying would be 50 μm, and an adhesive layer was prepared by drying for 3 minutes at 80° C. Next, one side of the above-mentioned substrate (1) was subjected to a corona treatment so that the wet tension would be 52 mN / m, and then the above-mentioned adhesive layer was attached to the corona-treated surface of the substrate and laminated under a pressure of 0.2 MPa, thereby producing a temporary fixing tape B(I) having an adhesive layer on one side of the substrate.
[0264] [Production Example 2-2] <Production of Temporary Fixing Tape B (II)> A temporary fixing tape B (II) was produced in the same manner as in Production Example 1, except that the substrate (2) was used instead of the substrate (1).
[0265] [Production Example 2-3] <Production of Temporary Fixing Tape B (III)> A temporary fixing tape B (III) was produced in the same manner as in Production Example 1, except that the substrate (3) was used instead of the substrate (1).
[0266] [Production Example 2-4] <Production of Temporary Fixing Tape B (IV)> A temporary fixing tape B (IV) was produced in the same manner as in Production Example 1, except that the substrate (4) was used instead of the substrate (1).
[0267] Details of the adhesive layer and physical properties of the tapes of the temporary fixing tapes B(I) to (IV) are as follows.
[0268]
[0269] [Examples 1-1 to 1-6, Comparative Examples 1-1 to 1-2] The resulting tape was cut to a length of 200 mm x width of 20 mm, and both ends of the tape (50 mm x 20 mm) were laminated with a 50 μm thick PET film to form gripping tabs for longitudinal stretching. Three aluminum blocks (10 mm long, 10 mm wide, and 4 mm thick) were prepared and aligned in series along the length of the tape at the center of the adsorption layer surface of the tape (the adhesive layer surface in Comparative Examples 1 and 2). The test specimen was then pressed against the tape with a load of 1 kg per block for 10 seconds. The tab at one end of the tape was placed in a fixture with the aluminum blocks of the test specimen facing downwards. The tab on the opposite side of the tape was then gripped and stretched horizontally at a rate of 300 mm / min.
[0270] The elongation at peeling of the tape when all three aluminum blocks had fallen from the tape was calculated using the following formula. In the formula, "initial gauge length + elongated length of tape" refers to the gauge length of the tape after elongation when all the aluminum blocks had fallen. The gauge length refers to the length of the tape excluding the tab regions on both sides (tape length 200 mm - tab region length 50 mm x 2 = 100 mm). {(initial gauge length + elongated length of tape) / initial gauge length} x 100 = elongation at peeling [%]
[0271] The evaluation results are shown below. The peeling evaluation criteria were as follows: ⊚: elongation of the tape at peeling less than 400%, ◯: 400% or more but less than 1000%, Δ: 1000% or more, and x: no peeling possible.
[0272]
[0273]
[0274] From the above results, it was suggested that the tape of the example using extensible tape peeled off the aluminum block by stretching it in the horizontal direction from a state in which the aluminum block was fixed by adhesion or adsorption. The temporary fixing tape whose temporary fixing layer is an adsorption layer had a smaller elongation at the time of peeling than the temporary fixing tape whose temporary fixing layer is an adhesive layer, and could be peeled off with a lower elongation.
[0275] [Examples 2-1 to 2-5, Comparative Examples 2-1 to 2-3] <Peeling method in which tension is applied perpendicular to the adhesive surface of the tape to stretch> The tape was cut to a length of 250 mm x width of 250 mm, and nine aluminum blocks measuring 10 mm in length, 10 mm in width, and 4 mm in thickness were prepared. These were arranged in a grid pattern and attached to the center of the adsorption layer surface of the tape (the adhesive layer surface in Comparative Examples 1 and 2), and then pressed with a rubber roller at a speed of 300 mm / min under a load of 2 kg / 30 mm to prepare a test specimen. The test specimen was placed on a fixing ring (inner cavity φ150 mm) for placing the tape in a device used as a stretching member. The stretching member A (outer circumference φ138 mm, spoke-shaped, with 10 mm-wide PP bands covering the outer rim of the spokes, arranged at 16 evenly spaced locations so that it could rotate along the outer rim of the rim; corresponding to Figure 18(b)) for pushing out the tape of the device was pushed up from the side opposite the aluminum blocks of the test specimen at a speed of 20 mm / s and a maximum distance of 30 cm. When all nine aluminum blocks were peeled off the tape, the elongation of the tape at peeling was calculated using the following formula. Peeling of the aluminum blocks was determined by whether the aluminum blocks slid when poked with a 50 μm-thick PET film. In the formula below, the "initial gauge length" is represented by 10 mm square grid marks on the tape, and "initial gauge length + elongated length of the tape" refers to the gauge length of the tape after elongation when all the aluminum blocks were peeled off. (Initial gauge length = 10 mm) {(initial gauge length + stretched length of tape) / initial gauge length} × 100 = elongation at peeling [%]
[0276] The height of the stretching member A when all nine aluminum blocks were peeled off was defined as the moving distance of the stretching means (the distance the tape was pushed out by the stretching means).
[0277] The evaluation results are shown below. The peeling evaluation criteria were as follows: ⊚: elongation of the tape at peeling was less than 400%, ◯: elongation of 400% or more, and x: no peeling was possible.
[0278]
[0279]
[0280] From the above results, the tape of the example using extensible tape peeled off the aluminum block by protruding and stretching due to the driving of the stretching member A from a state in which the aluminum block was fixed by adhesion or adsorption. It was suggested that the temporary fixing tape in which the temporary fixing layer is an adsorption layer has a smaller elongation at the time of peeling than the temporary fixing tape in which the temporary fixing layer is an adhesive layer, and can be peeled off with a lower elongation. It is presumed that the result of the tape of Comparative Example 2-2 was due to the fact that the stretching member A could not reach the elongation required to peel off the aluminum block due to the limit of its range of motion (device limit).
[0281] [Example 3] Temporary fixing tapes A(I) and B(I) were stretched in the same manner as in Example 2, except that the stretched member A was replaced with any of the following stretched members B to E. (Stretched members B to D) Stretched member B: a stretched member having a flat surface that was roughened by hard anodizing. Stretched member C: a stretched member having a curved surface (oval = 138 × 50 mm) that was roughened by hard anodizing. Stretched member D: a circular stretched member having, in plan view, an outer periphery and an inner hollow region surrounded by the outer periphery ( Fig. 18( a ), an embodiment of stretched member A without a covering portion).
[0282] The evaluation results are shown below. In Table 8, the results of Examples 2-1 and 2-4 are also shown.
[0283]
[0284] The above results suggest that when a temporary fixing tape is pressed and stretched by a stretching member, the push-up height required for the components to peel off varies depending on the stretching member. In other words, when the temporary fixing tape is stretched by the stretching member A, the push-up height (movement distance) of the stretching member until the temporarily fixed components peel off can be made smaller than when the temporary fixing tape is stretched by the other stretching members B to D, and it was suggested that the components temporarily fixed to the temporary fixing tape can be more easily peeled off.
[0285] 100...temporary fixing tape, 1...temporary fixing layer, 2...substrate, 3...part (member, processed product), 4...adhesive surface, 8, 8A, 8B...stretching means, 9, 9'...holding tool, 10...stretching member, 21...periphery (rim), 22...hollow region, 25...covering portion, P, P1, P2...stretching direction, Q...direction of tension, θ...angle formed by tension with respect to adhesive surface, Y...movement direction of stretching member
Claims
1. A method for peeling a temporary fixing tape to which one or more components are fixed, comprising: the temporary fixing tape having a stretchable base material and a temporary fixing layer on one surface of the stretchable base material, and being peelable by stretching; the temporary fixing layer containing an organic filler and / or an organic-inorganic composite filler; the component being fixed to the temporary fixing layer, and stretching the temporary fixing tape in at least one direction by a stretching means to peel the component from the temporary fixing tape.
2. The method for peeling a temporary fixing tape according to claim 1, wherein the temporary fixing tape is stretched in two different directions, and the two directions form an angle of approximately 90°.
3. The method for peeling a temporary fixing tape according to claim 1 or 2, wherein the temporary fixing tape is stretched in all directions.
4. The method for peeling a temporary fixing tape according to any one of claims 1 to 3, wherein the stretching means applies a tension in a horizontal direction with respect to the adhesion surface between the component and the temporary fixing layer.
5. The method for peeling a temporary fixing tape according to any one of claims 1 to 4, wherein the stretching means applies a tension in a direction opposite to the mounting side of the component with respect to the adhesion surface between the component and the temporary fixing layer.
6. The method for peeling a temporary fixing tape according to any one of claims 1 to 5, wherein the stretching means has a stretching member, and the stretching member presses the temporary fixing tape from the side opposite to the mounting side of the component on the temporary fixing tape to peel the temporary fixing tape from the component.
7. The method for peeling a temporary fixing tape according to claim 6, wherein the stretching member is annular in plan view, having an outer peripheral portion and a hollow region inside the outer peripheral portion, and a part of the surface of the outer peripheral portion is covered by a covering portion rotatable along the outer peripheral surface of the outer peripheral portion.
8. The method for peeling a temporary fixing tape according to any one of claims 1 to 7, wherein when the temporary fixing tape is stretched in the one direction by the stretching means, the length of the stretched temporary fixing tape in a direction substantially orthogonal to the one direction is 0.9 or more with respect to the length of the temporary fixing tape in a direction substantially orthogonal to the one direction before stretching.
9. The method for peeling a temporary fixing tape according to any one of claims 1 to 8, wherein the temporary fixing layer of the temporary fixing tape is an adsorption layer formed with a large number of recesses on the surface.
10. The method for peeling a temporary fixing tape according to any one of claims 1 to 8, wherein the temporary fixing layer of the temporary fixing tape is an adhesive layer.
11. The stress at 50% elongation (50% modulus) of the temporary fixing tape is in the range of 0.15 MPa to 20 MPa, and the elongation at break is 200% or more. A method for peeling a temporary fixing tape according to any one of claims 1 to 10.
12. The elongation at the time of peeling of the temporary fixing tape is in the range of 101% to 1500%. A method for peeling a temporary fixing tape according to any one of claims 1 to 11.
13. A method for peeling a temporary fixing tape according to any one of claims 1 to 12, wherein the component is an electronic component.
14. The surface area of the surface of the component that contacts the temporary fixing tape is 100 mm 2 The method for peeling the temporary fixing tape according to any one of claims 1 to 13, wherein the surface area is 100 mm or less.
15. A peeling member used for peeling a temporary fixing tape having an extensible base material and a temporary fixing layer on one surface of the extensible base material, and being peelable by stretching. The temporary fixing layer contains an organic filler and / or an organic-inorganic composite filler. The peeling member has a holding part for holding the temporary fixing tape, a hollow part formed by the holding part, and a stretching means. The holding part is arranged such that the temporary fixing tape covers the hollow part. The stretching means has a function of stretching at least in one direction within the surface of the temporary fixing tape covering the hollow part.
16. The stretching means is a roll, and the roll is arranged in a first stretching direction. The peeling member according to claim 15.
17. The stretching means is a roll, and the roll is arranged in each of a first stretching direction and a second stretching direction that forms an angle of approximately 90° with respect to the first stretching direction. The peeling member according to claim 15.
18. The stretching means is vertically drivable within the hollow part, and further has a stretching member that presses the temporary fixing tape passing through the hollow part in the passing direction. The peeling member according to claim 15.
19. The stretching member is annular in a plan view, having an outer peripheral part and a hollow region inside the outer peripheral part, and a part of the surface of the outer peripheral part is covered by a covering part that is rotatable along the outer peripheral surface of the outer peripheral part. The peeling member according to claim 18.
20. A component manufacturing apparatus including a peeling member for a temporary fixing tape according to any one of claims 15 to 19.
21. A method for manufacturing a component having at least a peeling step of peeling a component fixed on a temporary fixing tape using the method for peeling a temporary fixing tape according to any one of claims 1 to 14.
22. A method for manufacturing a component according to claim 21, wherein the component is an electronic component.
23. The surface area of the surface of the component that contacts the temporary fixing tape is 100 mm 2 The method for manufacturing a component according to claim 21 or 22, wherein the surface area is 100 mm or less.
24. The method for manufacturing a component according to any one of claims 21 to 23, wherein the component is a multilayer ceramic capacitor.