Conveyance method, conveyance device, and analysis system

Abstract

The present invention improves the transfer accuracy of a mesh on which a sample analyzed by using a charged particle beam device is mounted. This conveyance method includes: (a) a step for using a first conveyance unit to pick up and hold the mesh that has been placed on a first placement table; (b) a step, after step (a), for using a first imaging unit to image the mesh held by the first conveyance unit; (c) a step for correcting the position or angle of the mesh from the first image acquired in step (b), and (d) a step, after step (c), for using the first conveyance unit to mount the mesh on a mesh holder.

Description

TRANSPORT METHOD, TRANSPORT DEVICE, AND ANALYSIS SYSTEM

[0001] The present invention relates to a transport method, a transport device, and an analysis system, and more particularly to a transport method and a transport device for transporting a mesh on which a sample to be analyzed using a charged particle beam device is mounted.

[0002] In recent years, miniaturization has been promoted in cutting-edge semiconductor devices. To observe the structure of cutting-edge semiconductor devices, a known technique involves extracting a sample from a wafer using a focused ion beam (FIB) device, transferring (adhering) the extracted sample to a mesh, and then observing the sample using a scanning electron microscope (SEM).

[0003] Patent Document 1 (WO 2021 / 210087) describes a method in which a mesh on a stage is transported by a manipulator and mounted on a holder, and then observed using a TEM (Transmission Electron Microscope).

[0004] International Publication No. 2021 / 210087

[0005] Conventionally, the mesh to which the sample piece is transferred has been manually fixed to the holder, which has resulted in poor mesh positioning accuracy, a poor attachment angle when transferring the sample piece, and failures such as the sample piece not being within the field of view of the mesh recognition.

[0006] The present invention has been conceived to solve such problems, and an object of the present invention is to improve the accuracy of transferring meshes.

[0007] A brief summary of a representative embodiment of the present invention will be given below.

[0008] One embodiment of the transport method is a method for transporting a mesh carrying a sample to be analyzed using a charged particle beam device, and includes the steps of: (a) picking up and holding the mesh placed on a first mounting table using a first transport unit; (b) after step (a), imaging the mesh held on the first transport unit using a first imaging unit; (c) correcting the position or angle of the mesh from the first image acquired in step (b); and (d) after step (c), loading the mesh onto a mesh holder using the first transport unit.

[0009] According to the present invention, the accuracy of transferring the mesh can be improved.

[0010] 1 is a schematic diagram showing a transport device according to an embodiment; FIG. 2 is a plan view showing the transport device shown in FIG. 1; FIG. 3 is a plan view showing a mesh according to an embodiment; FIG. 4 is a perspective view showing a mesh holder according to an embodiment; FIG. 5 is a flowchart showing a transport method according to an embodiment; FIG. 6 is a flowchart showing a transport method according to an embodiment; FIG. 7 is a flowchart showing a transport method according to an embodiment; FIG. 8 is a flowchart showing a transport method according to an embodiment; FIG. 9 is a flowchart showing a transport method according to an embodiment; FIG. 10 is a flowchart showing a transport method according to an embodiment; FIG. 11 is a flowchart showing a transport method according to an embodiment; FIG. 12 is a flowchart showing a transport method according to an embodiment; FIG. 13 is a diagram showing an image showing an imaging result by an upper camera according to an embodiment; FIG. 14 is a perspective view showing a transport unit according to an embodiment; FIG. 15 is a bottom view showing a transport unit after correction according to an embodiment; FIG. 16 is a bottom view showing a transport unit and a mesh according to an embodiment; FIG. 17 is an image showing an imaging result by a lower camera according to an embodiment; FIG. 18 is a plan view showing a positional relationship between a mesh holder and a transport unit when a mesh is mounted according to an embodiment; FIG. 19 is a side view showing a positional relationship between a mesh holder and a mesh when a mesh is mounted according to an embodiment; FIG. 19 is an enlarged plan view explaining transfer of a sample piece to a mesh; FIG. 19 is an image view showing an image of a mounting table taken by an upper camera according to an embodiment; FIG. 19 is a diagram showing transfer of a mesh from a mounting table to another mounting table according to a first modified embodiment of the embodiment. Fig. 1 is a schematic diagram showing an analysis system according to an embodiment; Fig. 2 is a schematic diagram showing an analysis system according to a modified example 2 of the embodiment; Fig. 3 is a schematic diagram showing an analysis system according to a modified example 2 of the embodiment; Fig. 4 is a plan view showing a mesh and a mesh holder according to a comparative example; Fig. 5 is an enlarged plan view illustrating the transfer of a test piece to a mesh according to a comparative example.

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all drawings for explaining the embodiments, components having the same functions are designated by the same reference numerals, and repeated explanations thereof will be omitted. In addition, in the embodiments, explanations of the same or similar parts will not be repeated unless particularly necessary.

[0012] The X direction (X axis) and the Y direction (Y axis) are perpendicular to each other and are both directions along a horizontal plane. Here, the direction perpendicular to the X and Y directions is called the Z direction (Z axis) or vertical direction.

[0013] Both FIBs (Focused Ion Beams) and SEMs (Scanning Electron Microscopes) are devices capable of observing microscopic shapes. FIBs are devices that scan a finely focused ion beam over the surface of a sample, detecting secondary electrons and other generated electrons to observe a microscopic image. SEMs are devices that irradiate a sample with an electron beam to observe a microscopic image of the sample surface. Because ions have a larger mass than electrons, the sample is scraped off when irradiated with an FIB ion beam. Taking advantage of this, FIBs are also used for microfabrication of samples. FIB-SEMs, which are equipped with an FIB, an SEM, and a tiltable stage, are widely used as devices for preparing and observing sample pieces for TEM observation. The preparation of sample pieces by irradiating an ion beam using an FIB, is described, for example, in JP 2016-50853 A.

[0014] When observing a sample using FIB-SEM, a semicircular plate called a mesh is mounted on a mesh holder, and the mesh and mesh holder are then loaded into the FIB-SEM device, after which the sample piece is transferred onto the mesh. One of the main applications of FIB-SEM is automated microsampling. Microsampling is the preparation of sample pieces for TEM observation, and automated microsampling refers to the technology that automates this preparation.

[0015] The embodiments described below relate to a method for transferring a mesh from a mounting table to a mesh holder before being placed in an FIB-SEM device, a method for transferring a mesh removed from an FIB-SEM device from the mesh holder to the mounting table, and a transfer device for the same. The embodiments described below also relate to a method for transferring a mesh from a mounting table to a mesh holder before being placed in an optical specimen transfer device or a TEM device, a method for transferring a mesh removed from an optical specimen transfer device or a TEM device from the mesh holder to the mounting table, and a transfer device for the same (see Variation 2).

[0016] (Embodiment) <Configuration of Transfer Device> Figures 1 and 2 show a transfer device of this embodiment. Figure 1, which is a side view, and Figure 2, which is a plan view, correspond to each other and show the same transfer device. As shown in Figures 1 and 2, the transfer device of this embodiment includes a stage ST for a mesh MS, a transfer unit (manipulator) MP that transports the mesh MS by suction at its bottom, and a mesh holder MH on which the mesh MS can be mounted.

[0017] The stage ST can be equipped with at least one mounting base LCC. Here, the stage ST is equipped with three mounting bases LCC, but the number of mounting bases LCC may be more or less than three. The stage ST is a circular rotary table that can rotate around an axis in the vertical direction, but it may also be a stage that can be driven in the X and Y directions. A rotary table is highly space-efficient.

[0018] The mounting base LCC has a circular upper surface in a plan view and is approximately cylindrical in shape. Multiple mounting bases LCC can be placed on the upper surface of the stage ST, arranged along a circular orbit around the center of the stage ST in a plan view. Each mounting base LCC is rotatable about its cylindrical axis, and multiple mounting units 3 are arranged on the upper surface of the mounting base LCC along a circumference centered on the axis. The mounting units 3 each include a recess (hole) 4 on the upper surface of the mounting base LCC, and a mesh MS can be placed on the bottom surface of the recess 4. The recess 4 is circular in a plan view and has a diameter of, for example, approximately 3 mm. Here, one mounting base LCC has eight mounting units 3. The mounting base LCC is also called, for example, a mesh cartridge or an LC container. The mounting units 3 (recesses 4) may be arranged in a matrix on the upper surface of the mounting base LCC, rather than being arranged along a circumference.

[0019] The upper surface 1A of the main body 5 of the mesh holder MH, the bottom surface of the recess 4, and the lowermost surface of the transport part MP are all surfaces that lie along a horizontal plane.

[0020] The transfer unit MP picks up the mesh MS from the hole in the mounting table LCC and transfers it to the mesh holder MH. The transfer unit MP also performs the reverse operation. The transfer unit MP can be driven in the X, Y, and Z directions to move between the stage ST and the mesh holder MH. The tip (bottom) of the transfer unit MP that picks up the mesh MS can rotate around an axis in the Z direction. The transfer unit MP picks up and holds the mesh MS, for example, by vacuum suction. The vacuum can be generated by a vacuum pump or a vacuum generator using compressed air. Because the mesh MS is small and light, suction by a vacuum generator is sufficient. The success of suction of the mesh MS can also be monitored by monitoring the suction pressure. In addition to vacuum suction, electrostatic suction methods can also be used, and a method of picking up the mesh MS by pinching it from above and below like tweezers can also be used.

[0021] Here, we will explain the TEM mesh onto which sample pieces are transferred by automatic microsampling. Figure 3 shows the planar shape of the mesh MS. The mesh MS is made of a plate-like member with a roughly semicircular planar shape. That is, the mesh MS has an upper surface (front surface), a lower surface (bottom surface, back surface) parallel to the upper surface, and side surfaces connecting the upper and lower surfaces. Also, although a semicircular mesh is described here, the mesh may also be circular.

[0022] TEM samples are sometimes called Lamella, and mesh MS is also called TEM mesh, TEM grid, Lamella carrier, or LC. The mesh MS is a metal piece with a diameter of 3 mm, and the mesh used here has a crescent-shaped comb-like shape. Each of the multiple comb teeth protruding outward from the end of the mesh MS is a pillar (columnar portion) PL. A TEM sample piece is attached to each of these pillars PL within the FIB-SEM device.

[0023] The mesh MS is provided with an alignment mark AM1 consisting of a circular through-hole in plan view and an alignment mark AM2 consisting of a triangular through-hole. The size and position of the alignment marks AM1 and AM2 are the same for all meshes MS. Here, we will explain the cases where the alignment marks are circular and triangular in shape, but the shape of the alignment marks is not limited to these shapes. In addition, a two-dimensional code (two-dimensional matrix code, identification code) CD1 is provided on the top surface of the mesh MS.

[0024] The mesh holder MH is mounted on a table HT that can be driven in the X and Z directions, for example. FIG. 4 shows a perspective view of the mesh holder MH. The mesh holder MH secures the mesh MS that has been transported by the transport unit MP. One or more meshes MS can be secured to the mesh holder MH. In this example, four meshes MS can be secured. The mesh MS can be secured using screws or springs, but the spring method is used here.

[0025] The mesh holder MH includes a main body 5, a cylinder HC that penetrates the main body 5, and a mesh holder H1 that is connected to the upper end of the cylinder HC on the main body 5. The mesh holder H1 is a plate-shaped member that is parallel to the upper surface 1A of the main body 5. The cylinder HC and the mesh holder H1 are biased toward the lower side of the main body 5 in the Z direction by a spring (coil spring) CS that is a biasing part that wraps around the cylinder HC inside the main body 5. In other words, the mesh holder H1 is biased toward the upper surface 1A of the main body 5 by the spring CS.

[0026] In the spring type, a cylinder pin CP inside the transfer system pushes up a spring CS of the mesh holder MH, creating a gap between the mesh holder H1 and the holder. When the transfer unit MP inserts the mesh MS into this gap and then lowers the cylinder pin CP, the mesh holder H1 descends, and the mesh MS is fixed (mounted) on the upper surface 1A of the mesh holder MH. The cylinder pin CP is controlled by compressed air. There may be one or more cylinder pins CP, and there may also be multiple cylinder pins CP.

[0027] As shown in FIG. 1 , one of the main features of this embodiment is that the transport device includes a camera (lower camera) C1 for confirming the orientation of the mesh MS, which is disposed directly below the transport path of the mesh MS transported by the transport unit MP. Another main feature of this embodiment is that the transport device includes a camera (upper camera) C2 disposed directly above the mounting unit 3 on the upper surface of the mounting table LCC. The camera C2 is used to confirm the position of the mounting unit 3 (the center position of the recess 4) or the orientation of the mesh MS placed on the mounting unit 3, or to read a two-dimensional code on the surface of the mesh MS. The mounting table LCC may be provided with a two-dimensional code (two-dimensional matrix code, identification code) CD2, for example, on its side. In this case, a camera C3 (see FIG. 2 ), which is a code reader for reading the two-dimensional code on the mounting table LCC, is installed near the stage ST.

[0028] 1 and 2, each of the stage ST, transport unit MP, table HT, and cameras C1, C2, and C3 is connected to a control unit 1, which is, for example, a computer. More specifically, the power that drives each of the stage ST, transport unit MP, and table HT is connected to the control unit 1. The operations of each of the stage ST, transport unit MP, and table HT are controlled by the control unit 1. The control unit 1 is connected to a storage unit 2. Although not shown, the control unit 1 may also be connected to a display unit, an operation unit, and the like.

[0029] Camera C2 captures an image of the surface (top surface) of the mesh MS directly below it from above. In other words, camera C2 is positioned above the mounting table LCC. At this time, the coordinates of the stage ST are moved so that the mesh MS is directly below camera C2. In FIG. 2 , camera C2 captures an image, for example, in the area SH2 surrounded by a dashed line. When capturing an image with camera C2, the mesh MS is illuminated with a camera light source. The metal mesh MS glows white during capture due to the illumination, while the surface of the mounting table LCC, including the surface of the recess 4, appears as a black background. The intensity of the camera light source and the exposure time of camera C2 are adjusted to create a contrast between the mesh MS and the recess 4 of the mounting table LCC. Furthermore, when capturing an image of a recess 4 without a mesh MS placed inside, the image is captured under brighter conditions than when capturing an image of the mesh MS. The image captured by camera C2 is sent to the control unit 1 for image processing.

[0030] Camera C1 looks up from below and captures the rear side of the mesh MS picked up by the transport unit MP. After the mesh MS is picked up by the transport unit MP, the top surface (front surface) of the mesh MS is hidden by the transport unit MP, so it is necessary to capture an image from the rear side in order to recognize its orientation at the time of pickup. When capturing an image with camera C1, the coordinates of the transport unit MP are moved so that it is directly above camera C1. In other words, camera C1 is positioned below the bottom of the transport unit MP. In Figure 2, camera C1 captures an image, for example, in area SH1 surrounded by a dashed line. Here, too, the brightness and exposure time of the camera light source are adjusted to create a contrast between the mesh MS and the background. The image captured by camera C1 is sent to control unit 1 and undergoes image processing.

[0031] <Transportation Operation> The mesh transport operation performed using the above-described transport device will be described below with reference to the flows in Figures 5 to 11. The flows in Figures 5 to 7 explain the transport operation before the mesh is loaded into the FIB-SEM device. The flows in Figures 8 and 9 explain the transport operation after the mesh is recovered (transported out) from the FIB-SEM device. The flow in Figure 10 explains part of the flow in Figure 6 in more detail. The flow in Figure 11 explains part of the flow in Figure 9 in more detail.

[0032] First, as shown in Fig. 5, a pre-transfer operation is performed. That is, before the transfer, the mounting table LCC is set on the carrier transfer system (CTS), which is the transfer device of this embodiment (step S100 in Fig. 5). If a mesh MS is not mounted on the mounting table LCC, the mesh MS is also mounted.

[0033] The movable axes of the transport system are initialized (step S110 in FIG. 5). The X-axis, Y-axis, Z-axis, and R-axis (rotation axes, see FIG. 2) of the transport unit MP correspond to the movable axes. This initialization operation is necessary to ensure high-precision transport.

[0034] The stage ST is moved (step S120 in FIG. 5), and the presence or absence of a cap is confirmed using a height sensor (step S130 in FIG. 5). The height sensor is located on the mounting table LCC. The cap refers to a lid on the mounting table LCC, and is attached to prevent contamination or scattering. If the cap remains attached to the mounting table LCC, the transport unit MP cannot pick up the substrate, so a confirmation is made before transport.

[0035] The stage ST continues to move, and the ID of the mounting table LCC is read (step S140 in FIG. 5). Some mounting tables LCC are assigned an ID (two-dimensional code CD2), which is read by a code reader (camera C3) inside the transport device, and the information on the mounting table LCC is linked to the information on the mesh MS inside it. Here, the control unit 1 stores the information on the two-dimensional code CD2 in the memory unit 2.

[0036] Next, the stage ST is moved (rotated) so that the placement unit 3 of the placement table LCC is directly below the camera C2. The camera C2 captures an image of the mesh MS placed on the placement unit 3, and the presence or absence of the mesh MS is confirmed (step S150 in FIG. 5). If the image of the mesh MS matches the pre-registered exterior model, the control unit 1 determines that the mesh MS is present. If the mesh MS is not present, the control unit 1 stores information indicating that the mesh MS is not present in the memory unit 2.

[0037] In parallel with the confirmation of the presence of the mesh MS, the two-dimensional code CD1 engraved on the surface of the mesh MS is also read (step S160 in FIG. 5). Because the two-dimensional code CD1 is engraved in a predetermined position on the surface of the mesh MS, after the orientation of the mesh MS is recognized, the two-dimensional code CD1 is detected by searching a specific area of ​​the mesh MS. The read ID information is transmitted to the control unit 1. The control unit 1 stores the information in the memory unit 2 and associates the ID of the mounting table LCC (information on the two-dimensional code CD2) with the ID of the mesh MS (information on the two-dimensional code CD1). In other words, the control unit 1 associates the information and stores it in the memory unit 2.

[0038] When multiple LCCs are installed, the IDs of the LCCs are read, the mesh MSs are checked, and the mesh MSs are read. In other words, steps S140 to S160 are repeated for all LCCs. Reading is skipped for LCCs whose information has already been read. The operator can also choose not to read a specific LCC. Next, the mesh transport operation shown in FIG. 6 is performed.

[0039] That is, in order to transport the mesh MS, the stage ST is moved so that the mesh MS is located directly below the camera C2 (upper camera) (step S170 in FIG. 6).

[0040] Next, the mesh MS is imaged by the camera C2 (step S180 in FIG. 6 ). An example of the image obtained in this manner is shown in FIG. 12 . In FIG. 12 , horizontal and vertical lines intersect at the center of the image, and the center point of the mesh MS is ideally located at the intersection of the horizontal and vertical lines (center of the camera's angle of view). The center point of the mesh MS is the center of the circle if the semicircular mesh MS is assumed to be a circle rather than a semicircle, and is the intersection point of the two dashed lines shown in FIG. 12 . In the example shown in FIG. 12 , the center of the image (reference point, center of the camera's angle of view) and the center point of the mesh MS are misaligned in the X and Y directions.

[0041] Ideally, the arcs of the semicircular mesh MS face upward in Fig. 12. Here, the mesh MS is rotationally shifted (angularly shifted) by the angle θ formed by the vertical line and a dashed line extending perpendicular to the direction in which the pillars PL are aligned. The amount of rotational shift in Fig. 12, that is, the angle θ, is, for example, 45 degrees. Ideally, the angle θ is 0 degrees.

[0042] Subsequently, the image captured by the camera C2 in step S180 is transmitted to the control unit 1, and the control unit 1 performs image processing (step S190 in FIG. 6).

[0043] Next, the transport unit MP is moved so as to correct the positional deviation in the X and Y directions of the mesh MS and the rotational deviation in the rotational direction obtained by the image processing (step S200 in FIG. 6). Note that if the center of the image (reference point) and the center point of the mesh MS overlap, meaning no positional deviation has occurred, and the angle θ is 0 degrees, meaning no rotational deviation has occurred, then there is no need to perform the position and angle corrections performed in steps S190 and S200, which will be described later. Even in such cases, the control unit 1 performs the image processing of step S190 and determines whether correction is necessary.

[0044] Next, the mesh MS is sucked by the transport unit MP (step S210 in FIG. 6). At this time, the transport unit MP sucks the center of the mesh MS by camera image processing (although it can also be any position other than the center).

[0045] The transport unit MP is shown in Figures 13 and 14. Figure 14 is a view of the tip (lower end) of the transport unit MP as seen from below. In Figure 14, the bottom surface of the transport unit MP, which is the surface that can come into contact with the mesh MS, is hatched. Two holes 6 are provided on the bottom surface of the transport unit MP. Suction is performed through the holes 6, and the mesh MS is adsorbed to this bottom surface. The tip of the transport unit MP has a roughly circular shape in a plan view, but the left and right portions (both shoulder portions) on the upper side of Figure 14 are hollowed out.

[0046] 13, the transport unit MP includes a support 15 extending in the vertical direction, a hole 17 provided in the bottom surface of the support 15, and a suction nozzle 16 provided in the vertically extending hole 17 and movable in the vertical direction (up and down). Two holes 6 are provided at the tip (bottom surface) of the suction nozzle 16.

[0047] In step S200, the transport unit MP moves in accordance with the amount of positional deviation in the X and Y directions of the mesh MS obtained by the image processing in step S190. Also, in step S200, the transport unit MP rotates (for example, 45 degrees) in accordance with the amount of rotational deviation of the mesh MS obtained by the image processing in step S190 (see FIG. 15). In other words, the movement or rotation of the transport unit MP corrects the positional deviation or rotational deviation of the mesh MS.

[0048] 16 shows the state in which the mesh MS is sucked onto the tip of the transport unit MP in step S210. In FIG. 16, the transport unit MP holding the mesh MS is shown from below, with the suction nozzle 16 hidden by the mesh MS indicated by a dashed line. When the mesh MS is viewed from the rear, the two-dimensional code CD1 on the top surface of the mesh MS cannot be seen.

[0049] Because the portion of the mesh MS where the pillars PL are aligned (the pillar portion) is where the sample piece is mounted, the bottom surface of the transport unit MP is spaced apart from the pillar portion when suctioning the mesh MS so that a portion of the transport unit MP does not come into contact with the pillar portion. Specifically, a suction nozzle 16 is used that has a hollowed-out shape, so that the pillar portion can be avoided even when suctioning the mesh MS near its center after rotation correction. That is, the bottom surface of the transport unit MP that can come into contact with the mesh MS is located in the area surrounding the center of the suctioned mesh MS in a plan view, near the periphery of the semicircular mesh MS. The tip of the transport unit MP (suction nozzle 16) that suctions the mesh MS is preferably made of a conductive material to prevent static electricity from sticking.

[0050] Next, after the mesh MS is adsorbed, the transport part MP is moved to directly above the camera (lower camera) C1 (area SH1) (step S220 in FIG. 6). In this way, the mesh MS is picked up by the transport part MP.

[0051] Next, the rear surface of the mesh MS is imaged by the camera C1 (step S230 in FIG. 6). An example of the image obtained by this image capture is shown in FIG. 17. Although the corrections performed in steps S180 to S200 have almost completely eliminated the positional and rotational deviations of the mesh MS, positional and rotational deviations may occur again when the mesh MS is attracted in step S210. In this case, as shown in FIG. 17, a rotational deviation of angle θ has occurred.

[0052] Next, the image is sent to the control unit 1, and the control unit 1 performs image processing (step S240 in FIG. 6).

[0053] Subsequently, the cylinder HC of the mesh holder MH is raised to create a gap between the mesh retainer H1 and the upper surface 1A of the main body 5 of the mesh holder MH (step S250 in FIG. 6).

[0054] The transport unit MP is moved so that the mesh MS enters the gap 1A (step S260 in FIG. 6). Here, as shown in FIG. 18, the transport unit MP is moved to a position where the mesh MS and the mesh holder H1 overlap in a plan view, with the transport unit MP and the mesh holder H1 spaced apart from each other. In FIG. 18, the portion of the transport unit MP where the transport unit MP and the mesh MS come into contact is indicated by hatching. Also, part of the outline of the transport unit MP near its tip is indicated by a dashed line.

[0055] 19, when the transport unit MP is moved to the mesh holder MH in step S260 and before the mesh holder H1 is lowered (step S270 in FIG. 6), the back surface of the mesh MS is in contact with the upper surface 1A of the mesh holder MH, which is the surface on which the mesh MS is mounted. In other words, the distance between the back surface of the mesh MS and the upper surface 1A of the mesh holder MH is 0 mm.

[0056] Next, with the back surface of the mesh MS in contact with the upper surface 1A of the mesh holder MH, the cylinder of the mesh holder MH is lowered, and the mesh MS is held down by the mesh holder H1 (step S270 in FIG. 6 ). This secures (mounts) the mesh MS to the mesh holder MH. A spring CS1 is embedded in the hole 17 in the bottom surface of the support 15 constituting the transport unit MP. When the back surface of the mesh MS is pressed against the upper surface 1A of the mesh holder MH, the spring CS1 biases the mesh MS and the suction nozzle 16 in the hole 17 downward. This prevents a gap from forming between the upper surface 1A and the mesh MS, even if the support 15 of the transport unit MP moves up and down slightly. In other words, the mesh MS can be secured by the mesh holder H1 while the back surface of the mesh MS is pressed against the upper surface 1A of the mesh holder MH without applying a load to the mesh holder MH or the like. The spring CS1 may be another elastic body.

[0057] 6 are repeated the same number of times as the number of meshes MS to be mounted on the mesh holder MH. That is, the process returns from step S270 to step S170.

[0058] 7, that is, the operation of transporting the mesh holder MH into the FIB-SEM device is performed. When the mesh MS is transported into the FIB-SEM device, the mesh MS is transported in a state where it is mounted on the mesh holder MH.

[0059] First, the table HT (see FIG. 2) on which the mesh holder is mounted is raised (step S280 in FIG. 7).

[0060] Subsequently, the mesh holder MH is released from the table HT (step S290 in FIG. 7).

[0061] Subsequently, the mesh holder MH is fixed to a CTS-ARM (not shown), which is an arm (transport unit) for transporting the mesh holder MH into the FIB-SEM device (step S300 in FIG. 7).

[0062] Next, the table HT is lowered, and the mesh holder MH is transferred from the table HT to the CTS-ARM (step S310 in FIG. 7).

[0063] Next, the CTS-ARM is inserted into the FIB-SEM device (step S320 in FIG. 7).

[0064] Subsequently, after the mesh holder MH is received by a mesh holder MH receiving mechanism (not shown) in the FIB-SEM device, the mesh holder MH is released from its fixation by the CTS-ARM (step S330 in FIG. 7).

[0065] Subsequently, the CTS-ARM is retracted from inside the FIB-SEM device to outside the FIB-SEM device (step S340 in FIG. 7).

[0066] Thereafter, the sample piece processed and extracted in the FIB-SEM device is transferred to the pillar PL of the mesh MS mounted on the mesh holder MH in the FIB-SEM device, and the sample piece is observed (analyzed) by the SEM. In other words, automatic micro-sampling is performed.

[0067] Here, we have explained that the mesh holder MH is transported into the FIB-SEM device using a transport arm or the like, but the mesh holder MH may also be manually removed from the table HT by an operator and transported into the FIB-SEM device manually.

[0068] The general flow of automated microsampling is as follows: First, a deposition gas is sprayed onto a bulk sample, such as a semiconductor substrate, to form a protective film. Next, an etching process is performed to extract a sample piece from the bulk sample, creating the sample piece. Next, a needle for extracting the sample piece is brought close to the sample piece, and the needle and the sample piece are bonded together by deposition.

[0069] Next, the connected portion of the bulk sample and the sample piece is cut to separate the sample piece. Next, the pillar PL of the mesh MS to which the sample piece is to be transferred is automatically image-recognized. Next, as shown on the left side of Figure 20, the positions of the pillar PL and the sample piece 7 are automatically recognized, and the needle 8 is brought close to the pillar PL. Next, as shown on the right side of Figure 20, the pillar PL and the sample piece 7 are subjected to deposition processing, and then the needle 8 and the sample piece 7 are separated.

[0070] The above is the general flow of automatic microsampling using FIB-SEM. Next, as shown in Figure 8, the mesh holder MH is recovered. This operation is the reverse of the operation described with reference to Figure 7.

[0071] That is, the CTS-ARM is inserted into the FIB-SEM device (step S400 in FIG. 8).

[0072] Subsequently, the mesh holder MH in the FIB-SEM device is fixed to the CTS-ARM (step S410 in FIG. 8).

[0073] Subsequently, the CTS-ARM is retracted from inside the FIB-SEM device to outside the FIB-SEM device (step S420 in FIG. 8).

[0074] Subsequently, the table HT is raised (step S430 in FIG. 8).

[0075] Next, the mesh holder MH and the CTS-ARM are released from their fixed positions (step S440 in FIG. 8).

[0076] Next, the mesh holder MH is fixed to the table HT (step S450 in FIG. 8).

[0077] Subsequently, the table HT is lowered to retrieve the mesh holder MH (step S460 in FIG. 8). Next, the mesh retrieval operation shown in FIG.

[0078] That is, the transport unit MP is moved to the mesh holder MH (step S470 in FIG. 9).

[0079] Next, the mesh MS to be collected is sucked by the transport unit MP (step S480 in FIG. 9).

[0080] Next, with the mesh MS being attracted, the cylinder HC of the mesh holder MH and the mesh retainer H1 are raised (step S490 in FIG. 9).

[0081] Next, the transport unit MP is moved to remove the mesh MS from the mesh holder MH, and the transport unit MP holding the mesh MS by suction is moved to directly above the camera (lower camera) C1 (area SH1) (step S500 in FIG. 9). In this way, the mesh MS is picked up by the transport unit MP.

[0082] Subsequently, in step S500, the mesh MS is removed from the mesh holder MH, and then the cylinder HC and the mesh holder H1 are lowered (step S510 in FIG. 9).

[0083] Next, the camera (lower camera) C1 captures an image of the rear surface of the mesh MS (step S520 in FIG. 9).

[0084] Subsequently, the image captured by the camera C1 in step S520 is transmitted to the control unit 1, and the control unit 1 performs image processing (step S530 in FIG. 9).

[0085] Next, the stage ST is moved so that the collection table LCC is located directly below the camera (upper camera) C2 (step S540 in FIG. 9).

[0086] Next, the camera (upper camera) C2 captures an image of the placement section 3 (recess 4) of the placement table LCC (step S550 in FIG. 9). This image is sent to a computer, which calculates the hole center. A correction calculation is performed for the transport section MP so that the hole center coincides with the center of the mesh MS to be collected.

[0087] Next, the transport unit MP is moved based on the above correction calculation (step S560 in FIG. 9), thereby correcting the positional deviation of the mesh MS held by the transport unit MP.

[0088] Next, the suction of the mesh MS is released, and the mesh MS is collected on the mounting table LCC (step S570 in FIG. 9). If the mesh MS sticks to the suction nozzle of the transport part MP, the mesh MS suction release is repeated.

[0089] The operations of steps S470 to S570 are repeated until all the meshes MS to be collected are collected.

[0090] Next, the flow of image processing when the mesh MS is transported will be specifically described with reference to FIG.

[0091] The image of the mesh MS captured by the camera (upper camera) C2 in step S180 of FIG.

[0092] Next, the control unit 1 performs a binarization process to distinguish between the mesh MS and the background (step S191 in FIG. 10). That is, as shown in FIG. 17, a process is performed to distinguish between the white mesh MS and the other black portions (hatched portions in FIG. 17).

[0093] After the binarization process in step S191, the outer shape of the captured mesh MS is matched with a pre-registered outer shape model of the mesh MS, and the center of the mesh MS is roughly calculated (step S192 in FIG. 10). The outer shape model is created from a mesh with the same specifications as the mesh MS to be transported. When creating the model, the mesh image can be used as is, or parts of the shape that may become noise can be masked and excluded from the matching target. Since the mesh MS is crescent-shaped, successful matching allows the center of the semicircle to be roughly calculated. Furthermore, successful matching means that the mesh MS is confirmed to be in stock.

[0094] Next, the circular alignment mark AM1 (see FIG. 3) is searched for in the captured image of the mesh MS (step S193 in FIG. 10). First, the alignment mark AM1 is searched for in the entire captured image, as it is easier to find than the triangular alignment mark AM2 (see FIG. 3). The position of the alignment mark AM1 on the mesh MS is determined. If the alignment marks AM1 and AM2 are neither circular nor triangular, the one that is easier to find is searched for first.

[0095] When the detection of alignment mark AM1 is complete, two pieces of coordinate information are obtained: the approximate center of mesh MS determined by matching, and the position of alignment mark AM1. Based on this, the position of alignment mark AM2 is detected (step S194 in Figure 10). The position of alignment mark AM2 on mesh MS is also determined. However, since it takes time to detect alignment mark AM2 from the entire image, only the area around the position of alignment mark AM2 estimated from the position of alignment mark AM1 and the center position of mesh MS is detected. This shortens the time required to detect the two alignment marks AM1 and AM2.

[0096] Next, the control unit 1 calculates the center of the mesh MS and the rotational deviation from the positions of the alignment marks AM1 and AM2 (step S195 in FIG. 10). The center position calculated from the alignment marks AM1 and AM2 is more accurate than the center position calculated by contour matching, and high-precision transport can be expected. The above steps S191 to S195 correspond to the image processing in step S190 in FIG. 6.

[0097] The deviation of the center position of the mesh MS is calculated as one or more pixels of the image captured by camera C2. The distance fed back to the transport unit MP can be calculated from the distance per pixel. Based on this calculation result, the transport unit MP is moved to an offset position from the center of the camera's angle of view, which is the reference pickup position (step S201 in FIG. 10). At the same time, if the mesh MS is rotated (has a rotational deviation), the suction nozzle at the tip of the transport unit MP is rotated according to the amount of rotation (step S202 in FIG. 10). These steps S201 and S202 correspond to the movement of the transport unit MP in step S200 in FIG. 6, i.e., the correction of the positional deviation and rotational deviation.

[0098] Subsequently, the mesh MS is attracted (step S210 in FIG. 10).

[0099] Next, the robot moves to above the lower camera to capture an image of the rear surface of the mesh MS (step S220 in FIG. 10).

[0100] Next, in the same manner as the above-described operations, an image is taken using the lower camera, the rear surface of the mesh MS is binarized, its outline is matched, and each alignment mark is detected, and the mesh MS is then transported to the mesh holder MH.

[0101] That is, the rear surface of the mesh MS is imaged by the camera C1 (step S230 in FIG. 10). The image of the mesh MS imaged by the camera (lower camera) C1 in step S230 is transmitted to the control unit 1.

[0102] Next, the control unit 1 performs binarization processing (step S241 in FIG. 10).

[0103] Next, the outer shape of the captured mesh MS is matched with a pre-registered outer shape model of the mesh MS, and the center of the mesh MS is roughly calculated (step S242 in FIG. 10).

[0104] Next, the circular alignment mark AM1 is detected from the captured image of the mesh MS (step S243 in FIG. 10). First, the alignment mark AM1 is detected from the entire image captured from the rear side of the mesh MS.

[0105] Next, the position of alignment mark AM2 is detected based on two pieces of coordinate information: the center of the rough mesh MS obtained from matching, and the position of alignment mark AM1 (step S244 in FIG. 10). Alignment mark AM1, which requires a relatively short time to detect, is detected before alignment mark AM2. This reduces the time required to detect the two alignment marks AM1 and AM2.

[0106] Next, the control unit 1 calculates the center of the mesh MS and the rotational deviation from the positions of the alignment marks AM1 and AM2 (step S245 in FIG. 10). The above steps S241 to S245 correspond to the image processing in step S240 in FIG.

[0107] Subsequently, the cylinder HC of the mesh holder MH is raised to create a gap between the mesh retainer H1 and the upper surface 1A of the main body 5 of the mesh holder MH (step S250 in FIG. 10).

[0108] The deviation of the center position of the mesh MS is calculated as one or more pixels of the image captured by camera C1. The distance fed back to the transport unit MP can be calculated from the distance per pixel. Based on this calculation result, the transport unit MP is moved to an offset position from the center of the camera's angle of view, which is the reference pickup position (step S261 in FIG. 10). At the same time, if the mesh MS is rotated (has rotational deviation), the suction nozzle at the tip of the transport unit MP is rotated according to the amount of rotation (step S262 in FIG. 10). These steps S261 and S262 correspond to the movement of the transport unit MP in step S260 in FIG. 6, i.e., the correction of positional and rotational deviations.

[0109] Next, with the back surface of the mesh MS in contact with the upper surface 1A of the mesh holder MH, the cylinder of the mesh holder MH is lowered and the mesh holder H1 holds down the mesh MS (step S270 in FIG. 10). This fixes (mounts) the mesh MS to the mesh holder MH.

[0110] Subsequently, the adsorption of the mesh MS is released (step S271 in FIG. 10).

[0111] Next, the transport unit MP is moved to the standby position (step S272 in FIG. 10).

[0112] Next, the flow of the mesh MS recovery operation performed after automatic microsampling by FIB-SEM will be specifically described with reference to Fig. 11. In this recovery operation, either the flow using the upper camera or the flow using the lower camera may be performed first, or these flows may be performed simultaneously.

[0113] First, steps S480 to S520 described with reference to Fig. 9 are performed (steps S480 to S520 in Fig. 11). Next, steps S531 to S535, which are the processing steps for the image captured by the lower camera, are performed in the same procedure as steps S241 to S245 described with reference to Fig. 10.

[0114] Furthermore, the camera (upper camera) C2 is used to capture an image of the recess 4, which is the mounting portion 3 of the mounting table LCC into which the mesh MS is to be collected (step S550 in FIG. 11). The imaging conditions at this time are different from when the mesh MS is in the recess 4, and brighter imaging conditions are applied.

[0115] Next, the image captured in step S550 is sent to the control unit 1, which then performs binarization processing (step S551 in FIG. 11). This makes it easy to distinguish between the flat portion that is the top surface of the mounting table LCC and the sunken portion that is the recess 4. That is, as shown in FIG. 21, in the image captured in step S550, the inside of the recess 4 is displayed in black, and the flat portion that is the top surface of the mounting table LCC outside the recess 4 is displayed in white.

[0116] Once the recess 4 is recognized, the center of the circular hole is calculated (step S552 in FIG. 11). These coordinates become the target coordinates for collecting the mesh MS. In FIG. 21, the center position of the circular recess 4 is shifted from the center of the camera's angle of view, which is the reference placement position (the reference position of the transport unit MP before correction).

[0117] The above-described steps S550 to S552 may be performed either before or after steps S490 to S535, or may be performed during steps S490 to S535. Steps S550 to S552 may be performed at any time after the stage ST and mounting table LCC have been last moved (rotated) before performing step S535 described below. For example, if the stage ST and mounting table LCC have never been moved (rotated) after the mesh MS was picked up from the mounting table LCC in step S220 of FIG. 6, steps S550 to S552 may be performed at any time after step S220.

[0118] Next, by performing both steps S535 and S552, the center position of the mesh MS is calculated by the lower camera, and the center position of the recess 4 is calculated by the upper camera. Then, the transport unit MP is moved so that these center positions coincide with each other, thereby correcting the positional deviation between the mesh MS and the recess 4 (step S553 in FIG. 11). At this time, rotational deviation of the mesh MS may also be corrected.

[0119] Next, with the mesh MS placed in the center of the recess 4, the suction of the mesh MS by the transport part MP is released (step S570 in FIG. 11), thereby completing the collection of the mesh MS.

[0120] Next, the transport unit MP is moved to the standby position (step S571 in FIG. 11).

[0121] <Effects of this Embodiment> The effects of this embodiment will be described below with reference to comparative examples shown in FIGS. 26 and 27. FIG.

[0122] One possible method for mounting (fixing) a mesh on a mesh holder is to manually transfer and fix the mesh onto the mesh holder. In this case, it is possible to use a jig to hold the mesh during transfer or a guide to move the mesh to the mounting position on the mesh holder. However, manual transfer poses the problem of unstable transfer accuracy. Specifically, as shown in FIG. 26 , mesh MS1 is not fixed straight to mesh holder MH1, which can lead to misalignment and rotational misalignment. In the comparative example shown in FIG. 26 , meshes MS1 to MS3 are fixed by mesh holder H1 by manually tightening screw S1.

[0123] Other possible problems include mesh MS2 being contaminated, mesh MS3 being deformed or damaged, or mesh MS4 being scratched. Furthermore, there is also the risk of the mesh being dropped or lost. However, here we will mainly focus on the issue of positional accuracy.

[0124] In automatic microsampling using FIB-SEM, the position of the LC pillar is automatically recognized, and the sample piece at the tip of the needle, whose position has also been automatically recognized, is brought close to the pillar and bonded. However, if the accuracy of the mesh's positioning relative to the mesh holder is poor, it may not be within the observation field range of the charged particle beam (FIB or SEM), and bonding of the sample piece may fail.

[0125] Furthermore, if there is a deviation in the mesh transfer position accuracy, particularly in the rotational direction, when attempting to bring the sample piece close to the corner of the pillar tip, which is the target, the middle of the pillar PL may collide with the corner of the sample piece 7 before it approaches the target, as shown in Figure 27, and adhesion may fail. If the middle of the pillar PL collides with the corner of the sample piece 7, there is a risk that the sample piece 7 will peel off from the needle 8 and be lost. To avoid such errors, it is necessary to mount the mesh on the mesh holder with high precision.

[0126] Therefore, in the transfer device of this embodiment, the mesh MS is automatically transferred from the mounting table LCC to the mesh holder MH using the transfer unit MP. By performing the transfer automatically rather than manually, the transfer can be performed efficiently. Here, the mesh MS held by the transfer unit MP is imaged by a camera (lower camera) C1, and the positional and rotational deviations of the mesh MS are calculated from the acquired image. Based on the calculation results, the transfer unit MP is moved and rotated to perform correction. This improves the transfer accuracy of the mesh MS and prevents positional and rotational deviations from occurring when the mesh MS is placed on the mesh holder MH.

[0127] In addition, the mesh MS placed on the mounting table is imaged by a camera (upper camera) C2, and the positional and rotational deviations of the mesh MS are calculated from the acquired image. Based on the calculated results, the transport unit MP is moved and rotated to perform correction. This prevents positional and rotational deviations from occurring when the mesh MS is picked up by the transport unit MP. In other words, the transfer accuracy of the mesh MS is improved, and positional and rotational deviations from occurring when the mesh MS is placed on the mesh holder MH are prevented.

[0128] Even if correction is performed using the camera (upper camera) C2, there is a possibility that positional or rotational misalignment may occur due to the suction operation by the transport unit MP. However, by subsequently performing correction using the camera (lower camera) C1, the transfer accuracy of the mesh MS can be further improved.

[0129] Furthermore, in this embodiment, the cameras C1 and C2 are used to correct misalignment during the recovery operation of the mesh holder MH, which is performed after automatic microsampling by the FIB-SEM. If the mesh is manually transferred from the mesh holder to the mounting table during the recovery operation, or if the transfer is performed by a transport unit without this correction, there is a risk that the mesh returned to the recessed portion of the mounting table will be misaligned. In this case, there is a risk that the mesh will be damaged, dropped, or lost. In this embodiment, correcting misalignment using the cameras C1 and C2 prevents the mesh from being damaged, dropped, or lost, and allows the mesh MS to be transferred to the center of the recessed portion 4.

[0130] 6, when the mesh MS is loaded onto the mesh holder MH, the transport unit MP uses the mesh retainer H1 to secure the mesh MS in contact with the upper surface 1A of the mesh holder MH. By lowering the mesh retainer H1 while the mesh MS is in contact with the mesh holder MH and the transport unit MP is still adsorbing the mesh MS, misalignment between the mesh MS and the mesh holder MH can be prevented when the mesh MS is released from the transport unit MP. To perform this operation, the transport unit MP and the mesh retainer H1 are configured in shapes that prevent them from interfering with each other (see FIG. 18).

[0131] As described above, the transport method and transport device of this embodiment can improve the precision of mesh transfer.

[0132] <Variation 1> Replenishing mesh onto the transfer table can be performed manually. This replenishing operation can also be automated using a transport unit. However, if the mesh is manually transferred onto the mounting table, or if the transport unit transfers the mesh without any correction, there is a risk that the mesh will be misaligned when returned to the recess in the mounting table. In this case, there is a risk that the mesh will be damaged, dropped, or lost.

[0133] The following describes, with reference to Fig. 22, how a camera is used to make corrections when meshes MS are replenished (transferred) from, for example, a larger mounting table LLCC to the mounting table LCC shown in Fig. 1. Fig. 22 is a plan view showing a portion of a transport device that is a modified example of this embodiment.

[0134] The mounting base LLCC shown in Figure 22 is a cartridge that is larger than the mounting base LCC and can accommodate a larger number of meshes MS. Here, a transport unit (not shown) connected to the control unit 1 automatically transfers the meshes MS from the mounting base LLCC to the mounting base LCC. That is, a mesh MS is placed in each of a plurality of recesses 14 provided on the upper surface of the mounting base LLCC as the mounting portion 13. The transport unit sucks and picks up the mesh MS in the recesses 14, transports it while holding the mesh MS, and then transfers the mesh MS into the recesses 4, which are the mounting portions 3 of the mounting base LCC.

[0135] At this time, the mesh MS being transported by the transport unit is imaged in area SH3 by a camera (lower camera) not shown, and the image thus obtained is processed to calculate the amount of positional deviation of the mesh MS relative to the transport unit. If the transport unit is moved (corrected) based on the calculation results, the accuracy of transferring the mesh MS to the recess 4 can be improved. This lower camera is different from the camera C1 shown in FIG. 1, but the same camera as the camera C1 may be used.

[0136] Furthermore, before the transfer, an image of the destination recess 4 is captured in area SH2 by a camera (upper camera) not shown, and the image thus obtained is processed to calculate the amount of positional deviation between the mesh MS held in the transport unit and the recess 4. If the transport unit is moved (corrected) based on the calculation result, the accuracy of transferring the mesh MS to the recess 4 can be improved. This upper camera may be the same as the camera C2 shown in FIG. 1, or it may be a different camera.

[0137] Furthermore, before the transport unit picks up the mesh MS, an upper camera (not shown) on the mounting table LLCC may be used to capture an image of the mesh MS in the recess 14 in area SH4, similar to steps S180 to S200 in Fig. 5. The captured image can then be processed to calculate the amount of misalignment between the mesh MS and the transport unit, and the transport unit can be moved (corrected) based on this calculation result, thereby improving the accuracy of transferring the mesh MS to the recess 4. This upper camera is different from camera C2 shown in Fig. 1.

[0138] After the mesh MS is transferred to the mounting table LCC as described above and replenished, the transport operation or recovery operation described with reference to FIGS. 5 to 11 is carried out.

[0139] In this modification, the mesh MS can be transported with high precision by capturing images with the lower camera in area SH3, and performing image processing and correction. Also, the mesh MS can be transferred with even higher precision by capturing images, processing, and correcting them in area SH2 or SH4.

[0140] 1 to 19 and 21 relates to an analysis system 201 that combines a mesh transport device 100 and an FIB-SEM device 200, as shown in Fig. 23. In other words, the analysis system 201 includes the transport device 100 and the FIB-SEM device 200. The transport device 100 corresponds to the configuration shown in Fig. 1.

[0141] The object to which this transport device 100 transports the mesh is not limited to an FIB-SEM device, but may also be an optical specimen transfer device 300 shown in Fig. 24 or a TEM device 400 shown in Fig. 25. An analysis system 301 shown in Fig. 24 includes the transport device 100 and the optical specimen transfer device 300. An analysis system 401 shown in Fig. 25 includes the transport device 100 and the optical specimen transfer device 300.

[0142] 1 to 19 and 21 are used for a method of transferring a mesh from a mounting table to a mesh holder at a stage before the mesh is introduced into the optical specimen transfer device 300 or the TEM device 400, and for a method of transferring a mesh that has been carried out from the optical specimen transfer device 300 or the TEM device 400 from the mesh holder to the mounting table. Furthermore, the analysis system 301 shown in Fig. 24 may include a charged particle beam device such as an FIB-SEM device or a TEM device in addition to the optical specimen transfer device 300.

[0143] The invention made by the present inventors has been specifically described above based on the embodiments thereof, but the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the invention.

[0144] The present invention can be widely used in transport methods, transport devices, and analysis systems.

[0145] REFERENCE SIGNS LIST 1 control unit 2 memory unit 3, 13 placement unit 4, 14 recess 5 main body 15 support 16 suction nozzle 17 hole AM1, AM2 alignment mark C1, C2, C3 camera CD1, CD2 two-dimensional code CP cylinder pin CS, CS1 spring HC cylinder HT table LCC, LLCC placement table MH, MH1 mesh holder MP transport unit MS, MS1, MS2, MS3 mesh PL pillar SH1 area SH2 area SH3 area SH4 area ST stage 100 transport device 201, 301, 401 analysis system 200 FIB-SEM device 300 optical sample piece transfer device 400 TEM device

Claims

1. A transportation method for transporting a mesh on which a sample to be analyzed using a charged particle beam device is mounted, comprising: (a) picking up and holding the mesh placed on a first placement table by a first conveying unit; (b) after the step (a), taking an image of the mesh held in the first transport unit using a first imaging unit; (c) correcting the position or angle of the mesh from the first image acquired in the (b) step; (d) after the step (c), loading the mesh onto a mesh holder by the first transport unit; and In the step (d), the mesh held by the first transport section is fixed to the mesh holder in a state where the mesh is in contact with the mounting surface of the mesh holder, which is the surface on which the mesh is mounted.

2. 2. The conveying method according to claim 1, A conveying method in which, in step (c), the position of the mesh is corrected by moving the first conveying unit, and in step (d), the angle of the mesh is corrected by rotating the first conveying unit around an axis perpendicular to the mounting surface of the mesh holder on which the mesh is mounted.

3. 2. The conveying method according to claim 1, (a1) further comprising, before the step (a), a step of capturing an image of the mesh placed on the first mounting table using a second imaging unit; In the step (a), the position or angle of the first transport unit relative to the mesh is corrected and picked up from the second image acquired in the step (a1).

4. 4. The conveying method according to claim 3, A conveying method in which, in step (a), the position of the first conveying unit relative to the mesh is corrected by moving the first conveying unit, and in step (d), the angle of the first conveying unit relative to the mesh is corrected by rotating the first conveying unit around an axis perpendicular to the mounting surface of the mesh holder, which is the surface on which the mesh is mounted.

5. 2. The conveying method according to claim 1, (e) after the step (d), a step of mounting a sample on the mesh mounted on the mesh holder and analyzing the sample using the charged particle beam device; (f) after the step (e), picking up and holding the mesh by the first conveying unit; (g) after the step (f), taking an image of the mesh held in the first transport unit using the first imaging unit; (h) correcting the position of the mesh from the third image acquired in (g); (i) after the step (a), taking an image of the mesh placement portion on the top surface of the first placement table using a second imaging unit; (j) correcting the position of the first conveying unit based on the third image and the fourth image acquired in the (i) step; (k) after the step (j), placing the mesh on the mesh placement unit by the first transport unit; The method of transport further comprises:

6. (delete)

7. 2. The conveying method according to claim 1, (a1) before the step (a), further comprising a step of transporting the mesh placed on the second placing table to the first placing table, The step (a1) (a2) picking up and holding the mesh placed on the second placement table by a second transport unit; (a3) after the step (a2), taking an image of the mesh held in the second transport unit using a third imaging unit; (a4) capturing an image of the mesh placement portion on the top surface of the first placement table using a second imaging unit; (a5) correcting the position of the second conveying unit based on the fifth image acquired in the (a3) ​​step and the sixth image acquired in the (a4) step; (a6) after the step (a5), placing the mesh on the mesh placing section by the second conveying section; The method of transport further comprises:

8. 2. The conveying method according to claim 1, the mesh comprises a first alignment mark and a second alignment mark; In the (c) step, the first alignment mark is detected from the first image, and then the second alignment mark is detected; the center position of the mesh is calculated from the positions of the first alignment mark and the second alignment mark; and the position or angle of the mesh is corrected from information on the position of the first alignment mark, the position of the second alignment mark, and the center position.

9. a mounting table on which a mesh on which a sample to be analyzed using the charged particle beam device can be mounted; a mesh holder capable of mounting the mesh; a first transport unit that transports the mesh between the mounting table and the mesh holder; a first imaging unit that images the mesh held by the first transport unit; a control unit that corrects a position or an angle of the mesh from a first image acquired by the first imaging unit; and the mesh holder includes a main body and a mesh holder that is movable in a direction perpendicular to a mounting surface of the main body on which the mesh is mounted; The mesh holder clamps the mesh by moving the mesh retainer toward the mounting surface while the mesh held by the first transport section is in contact with the mounting surface, thereby fixing the mesh to the mesh holder.

10. 10. The conveying device according to claim 9, The control unit corrects the position of the mesh by moving the first transport unit, and corrects the angle of the mesh by rotating the first transport unit around an axis perpendicular to the mounting surface of the mesh holder on which the mesh is mounted.

11. 10. The conveying device according to claim 9, a second imaging unit configured to image the mesh placed on the mounting table; the control unit corrects a position or an angle at which the first transport unit picks up the mesh placed on the placement table based on the second image acquired by the second imaging unit, and corrects a position or an angle of the mesh based on the first image acquired by the first imaging unit; The first transport unit transports the mesh whose position or angle has been corrected from the first image and places it on the mesh holder.

12. 10. The conveying device according to claim 9, a second imaging unit configured to image a mesh placement portion on the upper surface of the placement table; the control unit corrects the position of the mesh so that the center of the mesh coincides with the center of the mesh placement unit based on the third image acquired by the second imaging unit and the first image acquired by the first imaging unit by imaging the mesh picked up by the first transport unit from the mesh holder; The first transport unit transports the mesh, the position of which has been corrected based on the third image and the first image, and places it on the mounting table.

13. 10. The conveying device according to claim 9, a second imaging unit that captures an image of a first identification code provided on a surface of the mesh; a storage unit connected to the control unit; and The control unit stores information about the first identification code acquired from the third image acquired by the second imaging unit in the storage unit.

14. 14. The conveying device according to claim 13, a third imaging unit configured to capture an image of a second identification code provided on the mounting table; The control unit associates information about the first identification code with information about the second identification code acquired from a fourth image acquired by the third imaging unit and stores the information in the memory unit.

15. 10. The conveying device according to claim 9, the mesh holder includes a main body and a mesh holder that is movable in a direction perpendicular to a mounting surface of the main body on which the mesh is mounted; The mesh can be fixed by sandwiching the mesh between the mesh holder and the mounting surface, A conveying device in which the mesh retainer and the first conveying section do not interfere with each other.

16. (delete)

17. 10. The conveying device according to claim 9, A conveying device wherein the first conveying section is provided with an elastic body that urges the mesh toward the upper surface of the mesh holder when the back surface of the mesh it is holding is pressed against the upper surface of the mesh holder.

18. A conveying device according to claim 9; a charged particle beam device and / or an optical sample piece transfer device; An analysis system comprising: