Rotary electric machine unit

Abstract

The rotary electric machine unit according to the present disclosure comprises a rotary electric machine and a power conversion device. The power conversion device has a plurality of power modules, a plurality of AC wires, and a plurality of driving circuit boards which are provided corresponding to the respective ones of the plurality of power modules and on which a driving circuit for driving the plurality of power modules is mounted. When viewed from the axial direction, the plurality of driving circuit boards are each formed so that the length thereof in the circumferential direction becomes smaller toward the radially inner side. The driving circuit has: a first electronic processing unit of a low-voltage system having a first electronic component and a first wiring pattern connected to the first electronic component; and a second electronic processing unit of a high-voltage system that has a second electronic component and a second wiring pattern connected to the second electronic component and has a higher voltage level than the low voltage system. The plurality of driving circuit boards each have a first region in which the first electronic processing unit is mounted and a second region in which the second electronic processing unit is mounted, wherein the first region is disposed on the radially inner side than the second region.

Description

Rotating Electric Unit

[0001] This application claims priority to Japanese Patent Application No. 2023-017270, filed on February 8, 2023, the contents of which are incorporated herein by reference.

[0002] Conventionally, there has been known a rotating electric machine unit that reduces the overall size of the device by integrating a rotating electric machine and a power conversion device. For example, Patent Document 1 discloses a rotating electric machine unit including a rotating electric machine and a power conversion device arranged side by side in the axial direction. The power conversion device has a plurality of power modules and a single circular drive circuit board on which drive circuits for driving the plurality of power modules are mounted.

[0003] Japanese Patent No. 4708951

[0004] In the structure of Patent Document 1, the area of ​​the drive circuit board where the drive circuit is not mounted is large, and the utilization efficiency of the area of ​​the drive circuit board is low. Also, in the structure of Patent Document 1, the drive circuit board is circular, and the yield when manufacturing the drive circuit board is low, and the productivity of the drive circuit board is low.

[0005] The present disclosure has been made in consideration of the above-mentioned circumstances, and aims to provide a rotating electric unit that can improve the area utilization efficiency of a drive circuit board, thereby enabling the drive circuit board to be made smaller, and that can improve the productivity of the drive circuit board.

[0006] A rotating electric machine unit according to the present disclosure comprises a rotating electric machine having a stator around which a plurality of coils are wound, and a rotor that rotates about an axis relative to the stator, and a power conversion device that is arranged alongside the rotating electric machine in an axial direction along the axis of the rotor, wherein the power conversion device has a plurality of power modules that are provided corresponding to the plurality of coils and that are arranged in a circumferential direction, a plurality of AC wirings that electrically connect the plurality of coils and the plurality of power modules, and a plurality of drive circuit boards that are provided corresponding to the plurality of power modules and on which drive circuits that drive the plurality of power modules are mounted, When viewed from the axial direction, each of the multiple drive circuit boards is formed so that its circumferential length decreases as it moves radially inward, and the drive circuit has a first electronic processing unit of a low-voltage system having a first electronic component and a first wiring pattern connected to the first electronic component, and a second electronic processing unit of a high-voltage system having a second electronic component and a second wiring pattern connected to the second electronic component and having a higher potential than the low-voltage system, and each of the multiple drive circuit boards has a first region in which the first electronic processing unit is mounted and a second region in which the second electronic processing unit is mounted, and the first region is positioned radially inward from the second region.

[0007] According to the present disclosure, it is possible to provide a rotating electric unit that can improve the area utilization efficiency of the drive circuit board, thereby reducing the size of the drive circuit board, and can improve the productivity of the drive circuit board.

[0008] 12 is a circuit diagram of a rotating electric machine unit according to embodiment 1. FIG. 13 is a perspective view of a rotating electric machine unit according to embodiment 1. FIG. 14 is a cross-sectional view of a rotating electric machine according to embodiment 1. FIG. 15 is a top view of a power conversion device according to embodiment 1. FIG. 16 is a top view of a power conversion device according to embodiment 1, showing a state in which a control circuit board is removed. FIG. 17 is a top view of a capacitor module, AC wiring, and a drive circuit board according to embodiment 1. FIG. 18 is a cross-sectional view taken along line A-A of FIG. 6. FIG. 19 is a top view of a power module, a capacitor module, and AC wiring according to embodiment 1. FIG. 20 is a diagram showing an example of the shape of a drive circuit board according to embodiment 1. FIG. 21 is a diagram showing another example of the shape of a drive circuit board according to embodiment 1. FIG. 22 is a diagram showing another example of the shape of a drive circuit board according to embodiment 1. FIG. 23 is a top view of a control circuit board according to embodiment 1. FIG. 24 is a bottom view of a control circuit board according to embodiment 1. FIG. 25 is a diagram for explaining the manufacture of the drive circuit board shown in FIG. 9A. FIG. 26 is a diagram for explaining the manufacture of the drive circuit board shown in FIG. 9D. FIG. 27 is a top view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to embodiment 2. FIG. 28 is a cross-sectional view taken along line B-B of FIG. 12. 15 is a top view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to a modified example of embodiment 2. FIG. 16 is a top view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to embodiment 3. FIG. 17 is a cross-sectional view taken along line CC in FIG. 15. FIG. 18 is a top view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to a modified example of embodiment 3. FIG. 19 is a top view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to embodiment 4.

[0009] First Embodiment A rotating electric machine unit 1 according to an embodiment will now be described with reference to the drawings. First, the circuit configuration (electrical configuration) of the rotating electric machine unit 1 will be described with reference to Fig. 1. Fig. 1 is a circuit diagram of the rotating electric machine unit 1 according to this embodiment. The rotating electric machine unit 1 includes a rotating electric machine 2 and a power conversion device 3. The rotating electric machine unit 1 is mounted on a vehicle such as an electric vehicle, for example.

[0010] DC power is input to the power conversion device 3 from an on-board battery E (DC power source) mounted on the vehicle. The on-board battery E is, for example, a lithium-ion battery with an output voltage of several tens to several hundred volts. The power conversion device 3 converts the DC power output from the on-board battery E into AC power and supplies it to the rotating electric machine 2. The rotating electric machine 2 rotates using the AC power supplied from the power conversion device 3, driving the vehicle.

[0011] In this embodiment, the rotating electric machine 2 is a dual three-phase motor having two sets of three-phase windings (three-phase coils). The dual three phases are U1 phase, V1 phase, W1 phase, U2 phase, V2 phase, and W2 phase. The rotating electric machine 2 includes a plurality of coils 25 (six in this embodiment). The six coils 25 are provided corresponding to each of the dual three phases (U1 phase, V1 phase, W1 phase, U2 phase, V2 phase, and W2 phase).

[0012] The power conversion device 3 is a dual three-phase power conversion device equipped with an inverter circuit having two sets of three-phase AC full-bridge circuits. The power conversion device 3 has a power conversion unit 50 including a plurality of (six in this embodiment) power modules 5, an input capacitor 6, a drive circuit 7, a control circuit 8, a power supply circuit 9, and a plurality of (six in this embodiment) current detection units 10.

[0013] The input capacitor 6 is provided on the input side of the power conversion unit 50. The input capacitor 6 is a smoothing capacitor that stabilizes the voltage supplied from the vehicle battery E to prevent large fluctuations. The input capacitor 6 has multiple capacitor elements 6a connected in parallel. The input capacitor 6 is, for example, an aluminum electrolytic capacitor, a film capacitor, a ceramic capacitor, or an electric double layer capacitor.

[0014] Six power modules 5 are provided corresponding to each of the dual three phases (U1 phase, V1 phase, W1 phase, U2 phase, V2 phase, and W2 phase). The three power modules 5 corresponding to the U1 phase, V1 phase, and W1 phase form a first three-phase AC full-bridge circuit, and the three power modules 5 corresponding to the U2 phase, V2 phase, and W2 phase form a second three-phase AC full-bridge circuit.

[0015] Each power module 5 includes a pair of switching elements 5a, 5b. The switching elements 5a, 5b are, for example, insulated gate bipolar transistors (IGBTs) or metal oxide semiconductor field effect transistors (MOSFETs). The switching elements 5a, 5b are connected in series. The switching element 5a is an upper arm switching element connected to the positive electrode side of the on-board battery E. The switching element 5b is a lower arm switching element connected to the negative electrode side of the on-board battery E. The connection point between the switching elements 5a and 5b is electrically connected to the coil 25 of the corresponding phase of the rotating electric machine 2.

[0016] 1, each power module 5 may have a diode 5c connected in parallel to the switching element 5a and a diode 5d connected in parallel to the switching element 5b. In this case, the cathode of the diode 5c is connected to the high-potential terminal of the switching element 5a, and the anode of the diode 5c is connected to the low-potential terminal of the switching element 5a. The cathode of the diode 5d is connected to the high-potential terminal of the switching element 5b, and the anode of the diode 5d is connected to the low-potential terminal of the switching element 5b.

[0017] The power conversion unit 50 converts the DC power output from the vehicle battery E into AC power by switching the ON / OFF states of the switching elements 5 a, 5 b. The converted AC power is supplied to the rotating electric machine 2. The power conversion unit 50 also rectifies AC power generated in the rotating electric machine 2 by regenerative braking or the like and converts it into DC power. The converted DC power is smoothed by the input capacitor 6 and stored in the vehicle battery E.

[0018] Six current detection units 10 are provided corresponding to each of the dual three-phase (U1 phase, V1 phase, W1 phase, U2 phase, V2 phase, and W2 phase). In each phase, the current detection unit 10 detects the current flowing from the power module 5 to the coil 25. The detection results of the current detection units 10 are output to the control circuit 8.

[0019] The drive circuit 7 and control circuit 8 drive and control the multiple power modules 5 so that the rotating electric machine 2 is driven with a current, rotation speed, and torque based on control commands from an external control device mounted on a vehicle or the like. Furthermore, when an abnormality occurs in the rotating electric machine 2, such as damage to the rotating electric machine 2, the drive circuit 7 and control circuit 8 control the drive of the power modules 5 and the supply of power to the power modules 5 to be immediately stopped in a safe manner. The power supply circuit 9 supplies operating power (electric power) to the drive circuit 7 and control circuit 8.

[0020] The power supply circuit 9 generates a power supply voltage required for the operation of the drive circuit 7 and the control circuit 8. The power supply voltage generated by the power supply circuit 9 is lower than the voltage of the DC power supplied from the vehicle battery E. The power supply circuit 9 is composed of a power supply IC (Integrated Circuit) 91, a power supply IC peripheral element unit 92, etc. The power supply IC 91 generates a signal for operating the power supply circuit 9. The power supply IC peripheral element unit 92 is used to cause the power supply IC 91 to perform the desired operation. The power supply IC peripheral element unit 92 includes, for example, a step-up / step-down inductor, a transformer, a protective diode, a capacitor, a switching element and a digital IC for control and protection, and a resistor.

[0021] The control circuit 8 operates using a power supply voltage generated by a power supply circuit 9. The control circuit 8 controls the drive circuit 7. The control circuit 8 is composed of a microcontroller (microcomputer) 81, a microcomputer peripheral element unit 82, a control circuit connector 83, and the like. The control circuit 8 may include a protection circuit for electrically disconnecting the power module 5 and the rotating electric machine 2. The control circuit 8 may also include a communication IC and a communication IC peripheral element unit for communicating with the vehicle side. The detection result of the current detection unit 10 is input to the control circuit 8. The detection results of various sensors, such as a rotation sensor 26 of the rotating electric machine 2 (described later) and a temperature sensor provided in the power module 5, may also be input to the control circuit 8.

[0022] The microcontroller 81 generates a control signal for controlling the drive circuit 7 based on a control command from an external control device and the detection result of the current detection unit 10, and outputs the control signal to the drive circuit 7. The microcontroller peripheral element unit 82 is used to cause the microcontroller 81 to perform a desired operation. The microcontroller peripheral element unit 82 includes, for example, a step-up / step-down inductor, a transformer, a protective diode, a capacitor, a switching element and a digital IC for control and protection, and a resistor. The control circuit connector 83 is used to electrically connect the drive circuit 7 and the control circuit 8.

[0023] The drive circuit 7 operates on a power supply voltage generated by the power supply circuit 9. The drive circuit 7 drives the multiple power modules 5. Specifically, the drive circuit 7 drives the switching elements 5 a, 5 b to switch the states of the switching elements 5 a, 5 b between an on state and an off state. The drive circuit 7 is composed of a drive control IC (Integrated Circuit) 71, a drive control IC peripheral element section 72, a gate resistor section 73, a drive circuit connector 74, and the like.

[0024] A control signal generated by the microcontroller 81 is input to the drive control IC 71. The drive control IC 71 generates a drive signal for driving the power module 5 based on the control signal generated by the microcontroller 81, and outputs the drive signal to the power module 5.

[0025] The drive control IC peripheral element section 72 is used to cause the drive control IC 71 to perform a desired operation. The drive control IC peripheral element section 72 includes, for example, protective diodes, capacitors, control and protection switching elements and digital ICs, and resistors.

[0026] The gate resistor unit 73 is disposed between the drive control IC 71 and the power module 5. The gate resistor unit 73 is disposed close to the power module 5. The gate resistor unit 73 is used to characterize the switching behavior of the switching elements 5 a and 5 b when they are switched between the on state and the off state. The gate resistor unit 73 has gate resistors and diodes connected to the gates of the switching elements 5 a and 5 b.

[0027] The drive circuit connector 74 is used to electrically connect the drive circuit 7 and the control circuit 8. The drive circuit connector 74 is connected to the control circuit connector 83.

[0028] From the viewpoint of potential, the power conversion device 3 is divided into a high-voltage system which is the potential of a main circuit that generates power to drive the rotating electric machine 2, and a low-voltage system which is the potential of a control unit that controls the main circuit. The main circuit includes, for example, the power conversion unit 50, the gate resistor unit 73, and the input capacitor 6. The high-voltage system and the low-voltage system are insulated from each other.

[0029] The control circuit 8 is a low-voltage system. The drive circuit 7 serves as an interface between the two potentials of the low-voltage system and the high-voltage system. Specifically, the input side of the drive circuit 7 is the low-voltage system, and the output side of the drive circuit 7 is the high-voltage system. The drive circuit 7 incorporates an insulating unit for insulating the low-voltage system from the high-voltage system. The insulating unit is, for example, a pulse transformer or a photocoupler.

[0030] Next, the structure of the rotating electric machine unit 1 will be described with reference to Figures 2 to 10B. In this specification, the direction along the axis O (see Figure 3) of the rotor 22 of the rotating electric machine 2 is referred to as the "axial direction." Furthermore, the direction intersecting the axis O of the rotor 22 as viewed from the axial direction is referred to as the "radial direction," and the direction going around the axis O of the rotor 22 is referred to as the "circumferential direction." Figure 2 is a perspective view of the rotating electric machine unit 1. As shown in Figure 2, the rotating electric machine 2 and the power conversion device 3 are aligned in the axial direction. In the axial direction, the side where the power conversion device 3 is located is referred to as the upper side, and the side where the rotating electric machine 2 is located is referred to as the lower side.

[0031] Fig. 3 is a cross-sectional view of the rotating electric machine 2. As shown in Fig. 3, the rotating electric machine 2 includes a stator 21, a rotor 22, a rotating shaft 23, a housing 24, a plurality of coils 25, and a rotation sensor 26.

[0032] The stator 21 is annular. The stator 21 is provided so as to surround the outer periphery of the rotor 22. The stator 21 is fixed to a housing 24. The rotor 22 is provided inside the stator 21. The rotor 22 is rotatable around an axis O relative to the stator 21. A rotating shaft 23 is disposed at the center of the rotor 22. The lower end of the rotating shaft 23 is used as an output end that transmits the rotation of the rotor 22 to a vehicle or the like.

[0033] The housing 24 accommodates the stator 21, the rotor 22, and the rotating shaft 23. The upper end of the rotating shaft 23 is inserted into the top of the housing 24. A first bearing 27a is attached to the top of the housing 24, rotatably supporting the upper end of the rotating shaft 23. The lower end of the rotating shaft 23 is inserted into the bottom of the housing 24. A second bearing 27b is attached to the bottom of the housing 24, rotatably supporting the lower end of the rotating shaft 23.

[0034] The coils 25 are wound around the stator 21. Ends of the coils 25 pass through the top of the housing 24 and extend upward in the axial direction (i.e., toward the power converter 3). The end of the coils 25 for each phase is a connection portion 25a that is electrically connected to the power module 5 of the corresponding phase via AC wiring 11, which will be described later.

[0035] The rotation sensor 26 is attached to the upper end of the rotating shaft 23. The rotation sensor 26 detects the rotation angle of the rotating shaft 23. The rotation sensor 26 is, for example, a resolver. The rotation sensor 26 may also be a sensor using another detection method, such as a magnetoresistive element or a Hall element. The detection result of the rotation sensor 26 is output to the control circuit 8.

[0036] The power conversion device 3 has a plurality of power modules 5, a plurality (six in this embodiment) of capacitor modules 61 constituting the input capacitor 6, a plurality (six in this embodiment) of AC wirings 11, a plurality (six in this embodiment) of drive circuit boards 12, a control circuit board 13, a cooler 14, a base 15, and a fixing member 16. The plurality of capacitor modules 61 are provided corresponding to each of the plurality of power modules 5. The capacitor modules 61 are provided in parallel with the power modules 5. The plurality of AC wirings 11 are provided corresponding to each of the plurality of power modules 5. The plurality of drive circuit boards 12 are provided corresponding to each of the plurality of power modules 5. The number of the plurality of drive circuit boards 12 is equal to the number of phases of the stator 21.

[0037] 2 , the power conversion device 3 is covered from above by an upper cover 17. This ensures insulation between the various components constituting the power conversion device 3 and the components mounted around the rotating electrical machine unit 1, and prevents foreign matter from entering the rotating electrical machine unit 1 from the outside.

[0038] FIG. 4 is a top view of the power conversion device 3. FIG. 5 is a top view of the power conversion device 3, showing a state in which the control circuit board 13 has been removed. FIG. 6 is a top view of the capacitor module 61, AC wiring 11, and drive circuit board 12. FIG. 7 is a cross-sectional view taken along line A-A in FIG. 6. FIG. 8 is a top view of the power module 5, capacitor module 61, and AC wiring 11. FIGS. 9A to 9D are diagrams showing an example of the shape of the drive circuit board 12. FIG. 10A is a top view of the control circuit board 13, and FIG. 10B is a bottom view of the control circuit board 13.

[0039] The base 15 has a cylindrical shape and is fixed to the top of the housing 24. A plurality of capacitor modules 61 and the cooler 14 are fixed to the upper surface of the base 15.

[0040] The cooler 14 has a cylindrical shape. When viewed in the axial direction, the cooler 14 has a circular shape centered on the axis O. As shown in FIG. 7 , the power module 5 is mounted on a mounting surface 14a of the cooler 14. The power module 5 is joined to the mounting surface 14a of the cooler 14 by, for example, soldering. The cooler 14 and the power module 5 are thermally coupled. The drive circuit board 12 is provided above the power module 5. The power module 5 and the drive circuit board 12 are arranged spaced apart from each other.

[0041] The cooler 14 cools the power module 5. A refrigerant flow path (not shown) through which a refrigerant flows is formed in the cooler 14. The cooler 14 is provided with a supply port 14c (see FIG. 2 ) that communicates with the refrigerant flow path and through which a refrigerant is supplied from the outside. When viewed from the axial direction, the refrigerant flow path is formed to overlap with the power module 5. Note that the refrigerant flow path may be provided with cooling fins to improve heat transfer coefficient.

[0042] The cooler 14 is provided with a pedestal portion 14b that protrudes upward from the mounting surface 14a. The drive circuit board 12 and the control circuit board 13 are fixed to the pedestal portion 14b by fixing members 16. The fixing members 16 are, for example, screws, rivets, or pins. The pedestal portion 14b has fastening holes formed therein to fasten the fixing members 16. For example, when the fixing members 16 are screws, the fastening holes are threaded holes into which the fixing members 16 are screwed. The pedestal portion 14b may be formed by cutting out the cooler 14. A mold for manufacturing the cooler 14 may have a structure corresponding to the pedestal portion 14b.

[0043] As shown in Fig. 4, the capacitor modules 61 are arranged at equal intervals in the circumferential direction. The capacitor modules 61 are arranged radially outward of the drive circuit board 12 (i.e., the power module 5). Each capacitor module 61 has one or more capacitor elements 6a (see Fig. 1). In this embodiment, the capacitor module 61 has a rectangular shape when viewed in the axial direction. When viewed in the axial direction, the capacitor module 61 may have an arc shape that follows the outer periphery of the cooler 14.

[0044] The power modules 5 are arranged at equal intervals in the circumferential direction. As shown in Fig. 8, each power module 5 includes a main body 51, an input terminal 52, an output terminal 53, a signal terminal 54a on the upper arm side, and a signal terminal 54b on the lower arm side.

[0045] The main body 51 includes the switching elements 5a, 5b (see FIG. 1 ). When viewed in the axial direction, the main body 51 has a rectangular shape. The input terminal 52 is arranged to extend radially outward from the main body 51. The input terminal 52 is connected to the capacitor module 61. The input terminal 52 is fixed to a terminal of the capacitor module 61 using, for example, a screw. The input terminal 52 may be joined to the terminal of the capacitor module 61 by welding. The output terminal 53 is arranged to extend radially inward from the main body 51. The output terminal 53 is connected to the AC wiring 11.

[0046] The signal terminal 54a on the upper arm side is arranged to extend from the main body 51 to one side in the circumferential direction. The signal terminal 54b on the lower arm side is arranged to extend from the main body 51 to the other side in the circumferential direction. The signal terminals 54a, 54b then extend axially upward and are connected to the drive circuit board 12. The signal terminal 54a on the upper arm side is connected to the switching element 5a. The signal terminal 54b on the lower arm side is connected to the switching element 5b. The signal terminals 54a, 54b form a conduction path for the drive signal from the drive circuit 7 (i.e., the drive signal generated by the drive control IC 71). The drive signal from the drive circuit 7 is input to the switching elements 5a, 5b via the signal terminals 54a, 54b, respectively.

[0047] The arrangement of the input terminal 52, the output terminal 53, and the signal terminals 54a and 54b is not limited to the above. The output terminal 53 may be arranged to extend radially outward from the main body 51. The input terminal 52 and one of the signal terminals 54a and 54b may be arranged to extend from the main body 51 to one side in the circumferential direction, and the output terminal 53 and the other of the signal terminals 54a and 54b may be arranged to extend from the main body 51 to the other side in the circumferential direction.

[0048] The plurality of AC wirings 11 are respectively arranged between the plurality of drive circuit boards 12 (the plurality of power modules 5). The plurality of AC wirings 11 are arranged at equal intervals in the circumferential direction. The plurality of AC wirings 11 electrically connect the plurality of coils 25 to the plurality of power modules 5. Because a large current flows through the AC wirings 11, the AC wirings 11 tend to become hot. In order to improve the heat dissipation of the AC wirings 11, it is preferable that the AC wirings 11 be configured, for example, as a bus bar or harness with a large cross-sectional area.

[0049] A first end of the AC wiring 11 is electrically and mechanically connected to the output terminal 53 of the power module 5 by, for example, welding. A second end of the AC wiring 11 is electrically and mechanically connected to the connection portion 25a by, for example, TIG welding or laser welding. The AC wiring 11 extends radially outward from the first end connected to the output terminal 53, and the second end of the AC wiring 11 is disposed radially outward of the cooler 14. The AC wiring 11 has a portion that does not overlap with the drive circuit board 12 when viewed in the axial direction. In this embodiment, the entire AC wiring 11 extends so as not to overlap with the drive circuit board 12.

[0050] As shown in Fig. 5, the plurality of drive circuit boards 12 are arranged at equal intervals in the circumferential direction. The drive circuits 7 are mounted on the drive circuit boards 12. The drive circuit boards 12 are single-layer or multi-layer printed circuit boards. Examples of the printed circuit board that can be used include a paper phenol board, a paper epoxy board, a glass epoxy board, a ceramic board, and a composite board.

[0051] As shown in FIGS. 5 and 9A , in this embodiment, the drive circuit board 12 is trapezoidal. The drive circuit board 12 has a long side S3 and a short side S4 that are parallel to each other, and a pair of opposing sides S1 and S2 that connect the long side S3 and the short side S4 and are not parallel to each other. As shown in FIG. 5 , the drive circuit board 12 is arranged so that the long side S3 faces radially outward and the short side S4 faces radially inward. In other words, the drive circuit board 12 is arranged so that the pair of opposing sides S1 and S2 approach each other as they move radially inward. The line connecting the midpoint of the long side S3 and the midpoint of the short side S4 is referred to as the midpoint of the drive circuit board 12. The drive circuit board 12 is arranged so that the direction in which the midpoint of the drive circuit board 12 extends coincides with the radial direction. It is preferable that the drive circuit board 12 be symmetrical with respect to the midpoint line (i.e., be an isosceles trapezoid). As shown in Fig. 9B, the drive circuit board 12 may be triangular. In this case, the drive circuit board 12 is arranged so that a pair of opposing sides S1, S2 approach each other as they move radially inward. Also, as shown in Fig. 9C, a chamfered portion 12c may be formed on the top of the drive circuit board 12.

[0052] The drive circuit board 12 may be formed so that its circumferential length decreases radially inward when viewed from the axial direction. In Figures 9A to 9C, the drive circuit board 12 is formed so that its circumferential length gradually decreases radially inward when viewed from the axial direction. However, as shown in Figure 9D, the drive circuit board 12 may be formed so that its circumferential length decreases stepwise radially inward when viewed from the axial direction. In other words, the drive circuit board 12 may have a convex shape. In the example of Figure 9D, the pair of opposing sides S1, S2 are bent stepwise at the radial center. The pair of opposing sides S1, S2 may be bent in multiple steps.

[0053] As shown in FIG. 6 , electronic components such as a drive control IC 71, a drive control IC peripheral element section 72, a gate resistor section 73, and a drive circuit connector 74 are mounted on the drive circuit board 12. Lands for mounting these electronic components are also formed on the drive circuit board 12. Wiring patterns for electrically connecting these electronic components are also formed on the drive circuit board 12. The lands and wiring patterns are made of, for example, copper or a copper alloy. The drive circuit board 12 also has multiple connection through-holes 12a through which signal terminals 54a, 54b of the power module 5 are inserted. The signal terminals 54a, 54b are connected to the inner surfaces of the connection through-holes 12a. The signal terminals 54a, 54b are joined to the inner surfaces of the connection through-holes 12a by, for example, soldering. The multiple drive circuit boards 12 have the same shape. The electronic components, wiring patterns, and connection through-holes 12a are arranged in the same manner on the multiple drive circuit boards 12. When viewed as a whole, the power conversion device 3 includes a plurality of drive control ICs 71, a plurality of drive control IC peripheral element sections 72, a plurality of gate resistor sections 73, and a plurality of drive circuit connectors 74, each corresponding to a respective one of the plurality of power modules 5.

[0054] As described above, the drive circuit 7 serves as an interface between the two potentials of the low-voltage and high-voltage systems. In other words, the drive circuit 7 includes a first electronic processing unit E1 for the low-voltage system and a second electronic processing unit E2 for the high-voltage system. Specifically, the drive circuit connector 74 (the first electronic component for the low-voltage system), the drive control IC peripheral element unit 72 (the first electronic component for the low-voltage system), the low-voltage side (input terminal side) of the drive control IC 71, and the first wiring pattern connected thereto are included in the first electronic processing unit E1. The first electronic processing unit E1 has the same reference potential as the control circuit 8 system. The drive circuit 7 includes the high-voltage side (output terminal side) of the drive control IC 71, the gate resistor unit 73 (the second electronic component for the high-voltage system), the connection through-hole 12a, and the second wiring pattern connected thereto are included in the second electronic processing unit E2. The second electronic processing unit E2 has the same reference potential as the main circuit system.

[0055] 6, the drive circuit board 12 has a first region R1 in which the first electronic processing unit E1 is mounted and a second region R2 in which the second electronic processing unit E2 is mounted. The first region R1 is located radially inward of the second region R2. An insulating region is formed between the first region R1 and the second region R2, where no electronic components or wiring patterns are formed except for the drive control IC 71. The radial dimension of this insulating region is, for example, approximately 2 mm.

[0056] That is, the first region R1 is provided with the drive circuit connector 74, the drive control IC peripheral element section 72, the low-voltage side of the drive control IC 71, and the first wiring pattern connected thereto. The second region R2 is provided with the high-voltage side of the drive control IC 71, the gate resistor section 73, the connecting through-hole 12a, and the second wiring pattern connected thereto. In other words, the drive circuit connector 74, the drive control IC peripheral element section 72, and the low-voltage side of the drive control IC 71 are concentrated on the radially inner side of the drive circuit board 12. The high-voltage side of the drive control IC 71, the gate resistor section 73, and the connecting through-hole 12a are concentrated on the radially outer side of the drive circuit board 12. The drive control IC 71 is disposed across the first region R1 and the second region R2. An insulating section such as a photocoupler may be provided inside the drive control IC 71.

[0057] 6, the boundary between the first region R1 and the second region R2 is indicated by a virtual line L1. For example, the boundary between the first region R1 and the second region R2 may be disposed so as to pass through the radial center position of the drive circuit board 12. The location of the boundary between the first region R1 and the second region R2 is not limited to this, and it may be disposed radially inward or radially outward of the radial center position of the drive circuit board 12.

[0058] Here, compared to the second electronic processing unit E2, the first electronic processing unit E1 allows the first electronic components and first wiring patterns constituting the first electronic processing unit E1 to be spaced closer together. For example, if the first electronic processing unit E1 processes signals with a voltage of up to 24 V relative to the housing reference potential, the first electronic components and first wiring patterns of the first electronic processing unit E1 are spaced apart by 0.5 mm or more. On the other hand, in the second electronic processing unit E2, considering potential fluctuations on the main circuit side, a voltage exceeding 24 V may be applied even on the drive circuit board 12. If the second electronic processing unit E2 processes signals with a voltage of up to 48 V relative to the housing reference potential, the second electronic components and second wiring patterns of the second electronic processing unit E2 are spaced apart by 1.2 mm or more. In this case, the first electronic processing unit E1 and the second electronic processing unit E2 are spaced apart by 2.4 mm or more. When viewed from the axial direction, the drive circuit board 12 is formed so that its circumferential length decreases radially inward, and therefore the width (circumferential length) of the drive circuit board 12 is narrower in the first region R1 than in the second region R2. By mounting the first electronic processing unit E1, in which the first electronic components and first wiring patterns are closely spaced, in the first region R1, and mounting the second electronic processing unit E2, in which the second electronic components and second wiring patterns are widely spaced, in the second region R2, the drive circuit 7 can be efficiently mounted on the drive circuit board 12.

[0059] In this embodiment, the capacitor module 61 and the wiring connection 25a, which experience relatively large changes in current and voltage, are positioned radially outward from the cooler 14. The capacitor module 61 and the wiring connection 25a are positioned radially outward from the first electronic processing unit E1 mounted in the first region R1. That is, the capacitor module 61 and the wiring connection 25a are positioned at a distance from the first electronic processing unit E1 mounted in the first region R1. This prevents the first electronic processing unit E1 from being affected by the conductive noise and radiated noise generated by the capacitor module 61 and the wiring connection 25a. This prevents abnormalities in the drive and control of the power module 5 due to the conductive noise and radiated noise. Furthermore, the wiring connection 25a is positioned at a distance from the rotation sensor 26. This reduces the influence of the magnetic field caused by the current passing through the wiring connection 25a, thereby improving the detection accuracy of the rotation sensor 26.

[0060] The drive circuit board 12 has fixing through-holes 12b formed therein, through which fixing members 16 are inserted. The drive circuit board 12 is fixed to the base portion 14b by the fixing members 16. In this embodiment, the drive circuit board 12 is fixed to the cooler 14 using three fixing members 16. One fixing member 16 is provided at the end of the drive circuit board 12 on the radially inner side (i.e., on the short side S4 side). Two fixing members 16 are provided at both circumferential ends of the end of the drive circuit board 12 on the radially outer side (i.e., on the long side S3 side). The number of fixing members 16 is not limited to three. For example, in addition to the three fixing members 16, a fixing member 16 may be provided at the radial center of the drive circuit board 12, or at the circumferential center of the radially outer end of the drive circuit board 12.

[0061] The potential of the cooler 14 may be the housing reference potential, and the base 14b and the fixing member 16 may be conductive. The cooler 14 may be electrically connected to a wiring pattern formed on the drive circuit board 12. In this case, the cooler 14 may be electrically connected to a solid pattern formed on an inner layer of the drive circuit board 12, or may be electrically connected to a first wiring pattern of a low-voltage system formed on the upper or lower surface of the drive circuit board 12.

[0062] As shown in FIG. 4 , the control circuit board 13 is disposed above the drive circuit board 12. The control circuit board 13 is disposed at a distance from the drive circuit board 12. The control circuit board 13 is square (rectangular). The midpoint of the control circuit board 13 (i.e., the intersection of the diagonals) is located on the axis O. The control circuit board 13 is a multilayer printed circuit board having two or more layers. The control circuit board 13 is preferably a printed circuit board having four or more layers. In this case, the control circuit board 13 preferably has one or more inner layers formed of a solid pattern electrically connected to the housing reference potential. The solid pattern is provided in a large area excluding through holes for electrically connecting layers.

[0063] The control circuit board 13 is mounted with a control circuit 8 and a power supply circuit 9. Specifically, electronic components such as a microcontroller 81, a microcomputer peripheral element section 82, a control circuit connector 83, a power supply IC 91, and a power supply IC peripheral element section 92 are mounted on the control circuit board 13. Lands for mounting these electronic components are also formed on the control circuit board 13. Wiring patterns for electrically connecting these electronic components are also formed on the control circuit board 13. A sensor circuit, a protection circuit, or the like may also be mounted on the control circuit board 13.

[0064] As shown in FIG. 10A , a microcontroller 81 and multiple (six in this embodiment) microcomputer peripheral element units 82 are provided on the upper surface (first surface) 13a of the control circuit board 13. The microcontroller 81 is arranged on the axis O. The multiple microcomputer peripheral element units 82 are provided corresponding to the multiple power modules 5, respectively. The multiple microcomputer peripheral element units 82 are arranged in the circumferential direction. As shown in FIG. 10B , a multiple control circuit connectors 83, a power supply IC 91, and multiple power supply IC peripheral element units 92 are provided on the lower surface (second surface) 13b of the control circuit board 13. The power supply IC 91 is arranged on the axis O. The multiple control circuit connectors 83 are provided corresponding to the multiple power modules 5, respectively. The multiple control circuit connectors 83 are arranged in the circumferential direction. The multiple power supply IC peripheral element units 92 are provided corresponding to the multiple power modules 5, respectively. The multiple power supply IC peripheral element units 92 are arranged in the circumferential direction. Alternatively, the power supply IC 91 and a plurality of power supply IC peripheral element sections 92 may be provided on the upper surface 13a, and the microcontroller 81 and a plurality of microcontroller peripheral element sections 82 may be provided on the lower surface 13b.

[0065] The microcontroller 81 and the power supply IC 91 are arranged so as to overlap in the axial direction. It is preferable that a solid pattern formed on an inner layer of the control circuit board 13 is arranged between the microcontroller 81 and the power supply IC 91.

[0066] The control circuit connector 83 is disposed so as to overlap with the drive circuit connector 74 in the axial direction. The control circuit connector 83 is connected to the drive circuit connector 74. This electrically connects the control circuit board 13 and the drive circuit board 12. Note that the control circuit connector 83 and the drive circuit connector 74 are preferably electrically connected by wiring cables or pins of equal length on each board.

[0067] To prevent contact between the control circuit board 13 and the drive circuit board 12 and to ensure insulation between the control circuit board 13 and the drive circuit board 12, a spacer is preferably provided between the control circuit board 13 and the drive circuit board 12. The drive circuit connector 74 mounted on the drive circuit board 12 and the control circuit connector 83 mounted on the control circuit board 13 may function as spacers to ensure the spacing between the control circuit board 13 and the drive circuit board 12. For example, the control circuit connector 83 may be a male connector having a first resin housing and a plurality of conductive pins disposed within the first housing, and the drive circuit connector 74 may be a female connector having a second resin housing mated with the first housing and a plurality of sockets disposed within the second housing, each of which is connected to the plurality of conductive pins. In this case, the control circuit connector 83 is mated with the drive circuit connector 74 from above to electrically connect the control circuit board 13 and the drive circuit board 12. Furthermore, the abutment between the first housing and the second housing functions as the spacer.

[0068] The microcontroller 81 is disposed on the axis O, and the lengths of the wiring patterns connecting the microcontroller 81 to the control circuit connectors 83 (i.e., the conduction paths of the control signals output from the microcontroller 81 to the drive circuit boards 12) are equal to each other. The power supply IC 91 is disposed on the axis O, and the lengths of the wiring patterns connecting the power supply IC 91 to the control circuit connectors 83 (i.e., the conduction paths of the power output from the power supply IC 91 to the drive circuit boards 12) are equal to each other. As described above, the arrangements of the electronic components, wiring patterns, and connection through holes 12a are the same in the multiple drive circuit boards 12. That is, the wiring lengths and wiring inductances from the multiple drive circuit boards 12 to the multiple power modules 5 are equal to each other. As a result, the degree of delay of the control signals and drive signals can be prevented from varying among the phases. Therefore, for example, it is possible to prevent current from concentrating on a power module 5 of a phase with a large degree of delay in the control signals and drive signals from the power modules 5 of other phases. Furthermore, the temperature rise of the power module 5 can be suppressed, and the size of the cooler 14 for cooling the power module 5 can be reduced, so that the rotating electrical unit 1 can be made smaller.

[0069] Furthermore, in this embodiment, the capacitor module 61 and the wiring connection 25a, which experience large changes in current and voltage, are positioned at a distance from the control circuit board 13, which is located on the axis O. This prevents the control circuit 8 mounted on the control circuit board 13 from being affected by the conductive noise and radiated noise generated from the capacitor module 61 and the wiring connection 25a. This prevents abnormalities in the drive and control of the power module 5 caused by the conductive noise and radiated noise. The control circuit board 13 is also positioned at a distance from the second electronic processing unit E2. This prevents the influence of switching noise from the power module 5 superimposed on the input signal of the microcontroller 81, thereby improving the accuracy of the detection signals from the current detection unit 10 and the rotation sensor 26.

[0070] The control circuit board 13 is fixed to the cooler 14 using a fixing member 16 that is also used for the drive circuit board 12. The control circuit board 13 has a fixing through hole 13c formed therein, through which the fixing member 16 is inserted. In the present embodiment, of the three fixing members 16 used to fix the drive circuit board 12, the control circuit board 13 is fixed to the cooler 14 using the fixing member 16 provided at the radially inner end of the drive circuit board 12. That is, this fixing member 16 is inserted through the fixing through hole 13c formed in the control circuit board 13 and the fixing through hole 12b formed at the radially inner end of the drive circuit board 12, and is fastened to a fastening hole in the cooler 14.

[0071] The multiple current detection units 10 respectively detect currents flowing through the multiple AC wirings 11. In the present embodiment, the current detection unit 10 includes a current sensor IC 10a. The current sensor IC 10a is mounted on a control circuit board 13. As shown in FIG. 10B , the current sensor IC 10a is provided on a lower surface 13b of the control circuit board 13. The multiple current sensor ICs 10a are arranged in the circumferential direction. Note that the current sensor ICs 10a may also be provided on an upper surface 13a of the control circuit board 13. As shown in FIG. 4 , the current sensor IC 10a is arranged to overlap the AC wirings 11 in the axial direction. The current sensor IC 10a detects changes in the magnetic field caused by changes in the current flowing through the AC wirings 11. For example, the current sensor IC 10a is a Hall element, a magnetoresistive element, a fluxgate sensor, or the like.

[0072] As described above, the rotating electric machine unit 1 includes the rotating electric machine 2 having the stator 21 around which the plurality of coils 25 are wound and the rotor 22 that rotates about the axis O relative to the stator 21, and the power conversion device 3 that is arranged alongside the rotating electric machine 2 in the axial direction. The power conversion device 3 includes a plurality of power modules 5 that are provided corresponding to the plurality of coils 25 and that are arranged in the circumferential direction, a plurality of AC wirings 11 that electrically connect the plurality of coils 25 to the plurality of power modules 5, and a plurality of drive circuit boards 12 that are provided corresponding to the plurality of power modules 5 and on which drive circuits 7 that drive the plurality of power modules 5 are mounted. When viewed in the axial direction, each of the plurality of drive circuit boards 12 is formed so that the circumferential length decreases radially inward. The drive circuit 7 includes a first electronic processing unit E1 of a low-voltage system having a first electronic component (e.g., a drive control IC peripheral element unit 72 and a drive circuit connector 74) and a first wiring pattern connected to the first electronic component, and a second electronic processing unit E2 of a high-voltage system having a higher potential than the low-voltage system and having a second electronic component (e.g., a gate resistor unit 73) and a second wiring pattern connected to the second electronic component. Each of the multiple drive circuit boards 12 includes a first region R1 in which the first electronic processing unit E1 is mounted and a second region R2 in which the second electronic processing unit E2 is mounted. The first region R1 is positioned radially inward of the second region R2.

[0073] When a single drive circuit board is used, the area of ​​the drive circuit board where the drive circuit is not mounted, such as the area between the multiple power modules, is large, and the utilization efficiency of the area of ​​the drive circuit board is low. In this embodiment, multiple drive circuit boards 12 are provided corresponding to the multiple power modules 5, respectively, so that the area of ​​the drive circuit board 12 where the drive circuit 7 is not mounted can be reduced compared to when a single drive circuit board is used. Therefore, the utilization efficiency of the area of ​​the drive circuit board 12 can be improved, and the drive circuit board 12 can be made smaller.

[0074] Furthermore, by concentrating the first electronic processing unit E1 in the first region R1 and the second electronic processing unit E2 in the second region R2, the drive circuit 7 can be efficiently mounted on the drive circuit board 12, further improving the area utilization efficiency of the drive circuit board 12. The drive circuit board 12 is formed so that its circumferential length decreases radially inward. Therefore, the circumferential length of the drive circuit board 12 is narrower in the first region R1 than in the second region R2. By mounting the first electronic processing unit E1, in which the spacing between the first electronic components and the first wiring patterns is narrow, in the first region R1 and mounting the second electronic processing unit E2, in which the spacing between the second electronic components and the second wiring patterns is wide, in the second region R2, the drive circuit 7 can be more efficiently mounted on the drive circuit board 12.

[0075] Furthermore, since each of the multiple drive circuit boards 12 is formed so that its circumferential length decreases toward the radially inward direction, the multiple drive circuit boards 12 can be arranged more efficiently in the circumferential direction than, for example, when the drive circuit boards are rectangular. This makes it possible to reduce the size of the entire rotating electrical machine unit 1. Note that the closer the power module 5 and drive circuit boards 12 are arranged to the axis O, the more the entire rotating electrical machine unit 1 can be reduced in size.

[0076] Furthermore, because each of the multiple drive circuit boards 12 is formed so that its circumferential length decreases toward the radially inward direction, the number of fixing points for fixing the drive circuit boards 12 can be reduced compared to, for example, a rectangular drive circuit board. For example, if the drive circuit board is rectangular, it needs to be fixed at at least four points, but if the drive circuit board 12 is trapezoidal or triangular, it only needs to be fixed at at least three points. Furthermore, if the drive circuit board is rectangular, for example, it is difficult to distinguish between the radially inner and outer portions of the drive circuit board, which may lead to incorrect placement of the drive circuit board. To prevent such errors, it may be possible to provide a positioning structure on the drive circuit board, but this would increase manufacturing costs. In this embodiment, because the drive circuit board 12 is formed so that its circumferential length decreases toward the radially inward direction, it is easy to distinguish between the radially inner and outer portions of the drive circuit board 12, allowing for reliable placement of the drive circuit board 12.

[0077] FIG. 11A is a diagram illustrating the manufacture of the drive circuit board 12 shown in FIG. 9A . FIG. 11B is a diagram illustrating the manufacture of the drive circuit board 12 shown in FIG. 9D . The drive circuit board 12 is manufactured by cutting the drive circuit board 12 from a base substrate. As shown in FIGS. 11A and 11B , when the drive circuit board 12 is formed so that its circumferential length decreases radially inward, the drive circuit board 12 can be efficiently cut out from the base substrate. Therefore, compared to manufacturing a circular drive circuit board, for example, the yield when manufacturing the drive circuit board 12 can be improved, thereby improving the productivity of the drive circuit board 12. Furthermore, the amount of waste from the base substrate after cutting out the drive circuit board 12 can be reduced, thereby reducing the environmental impact. Furthermore, when a single drive circuit board is used, if the drive circuit board is found to be defective through an operational test after mounting a drive circuit on the drive circuit board, even if the defect is due to a single defect, the entire drive circuit board must be discarded. In this embodiment, by providing a plurality of drive circuit boards 12, it is possible to discard and replace only those drive circuit boards 12 that are confirmed to be defective, and to reuse the remaining drive circuit boards 12 as products without discarding them. Therefore, compared to using a single drive circuit board, it is possible to improve the productivity of the drive circuit boards 12 and reduce manufacturing costs.

[0078] Furthermore, in this embodiment, the amount of warping of the drive circuit board 12 can be reduced compared to when a single drive circuit board is used. As a result, poor connection between the power module 5 and the drive circuit board 12 due to warping of the drive circuit board 12 (e.g., poor connection between the signal terminals 54 a, 54 b of the power module 5 and the connection through-holes 12 a of the drive circuit board 12) can be suppressed. Furthermore, if the amount of warping of the drive circuit board is large, residual stress caused by correcting the warp continues to be applied to the drive circuit board, which may result in damage to the drive circuit board if external stress is applied to the drive circuit board due to vibrations of the rotating electric machine unit 1, etc. As described above, in this embodiment, the amount of warping of the drive circuit board 12 can be reduced, thereby preventing damage to the drive circuit board 12 due to vibrations of the rotating electric machine unit 1, etc.

[0079] The power conversion device 3 also has a control circuit board 13 that is disposed on the axis O and on which a control circuit 8 that controls the drive circuit 7 is mounted.

[0080] This allows for a reduction in the radial size of the rotating electrical machine unit 1. Furthermore, because the control circuit board 13 is disposed on the axis O, the multiple wires from the control circuit board 13 to the multiple drive circuit boards 12 can be disposed, for example, radially, to make the lengths of the wires from the control circuit board 13 to the multiple drive circuit boards 12 equal. This makes the influence of noise caused by the control processing of the power module 5 on the drive circuit boards 12 equal for each phase. As a result, there is no need to implement noise countermeasures tailored to the phase that is most affected by noise, which simplifies the noise countermeasure structure and allows for a more effective reduction in the size of the rotating electrical machine unit 1.

[0081] Second Embodiment A rotating electrical machine unit 1 according to a second embodiment will now be described with reference to Figures 12 and 13. Note that components having the same functions and actions as those in the first embodiment will be given the same reference numerals and their description will be omitted. Figure 12 is a top view of a capacitor module 61, AC wiring 11, drive circuit board 12, and current detection unit 10 according to the second embodiment. Figure 13 is a cross-sectional view taken along line B-B in Figure 12.

[0082] In this embodiment, the current sensor IC 10a is mounted on the drive circuit board 12. The current sensor IC 10a is mounted in the first region R1. The current sensor IC 10a is provided on the upper surface of the drive circuit board 12. However, the current sensor IC 10a may also be provided on the lower surface of the drive circuit board 12. It is preferable that the current sensor IC 10a be surface-mountable on the drive circuit board 12 by soldering or the like. An output signal from the current sensor IC 10a is output to the control circuit 8 via the drive circuit connector 74.

[0083] In this embodiment, the AC wiring 11 has a bent portion 11a that is bent toward the drive circuit board 12. When viewed from the axial direction, the bent portion 11a is disposed so as to overlap with the drive circuit board 12. The portion of the AC wiring 11 other than the bent portion 11a is disposed so as not to overlap with the drive circuit board 12. As shown in Fig. 13 , the current sensor IC 10a is disposed so as to overlap with the bent portion 11a in the axial direction.

[0084] 14 is a top view of a capacitor module 61, AC wiring 11, drive circuit board 12, and current detection unit 10 according to a modification of embodiment 2. As shown in Fig. 14, the AC wiring 11 does not have a bent portion 11a, and a portion of the AC wiring 11 extending linearly may be disposed so as to overlap with the drive circuit board 12 in the axial direction. In this case, the current sensor IC 10a is disposed so as to overlap with the portion of the AC wiring 11 in the axial direction.

[0085] As described above, in this embodiment, each of the multiple current detection units 10 has a current sensor IC 10a mounted on a corresponding one of the multiple drive circuit boards 12. When viewed in the axial direction, the current sensor IC 10a is arranged to overlap the corresponding one of the multiple AC wirings 11.

[0086] By mounting the current sensor IC 10a on the drive circuit board 12, the current detection unit 10 can be provided. This reduces the manufacturing cost of the current detection unit 10 and allows the current detection unit 10 to be miniaturized. Furthermore, the current sensor IC 10a can be disposed in close proximity to the corresponding AC wiring 11. This allows the current sensor IC 10a to reliably detect the current flowing through the corresponding AC wiring 11, and the current sensor IC 10a is less susceptible to the influence of currents flowing through other AC wirings 11, thereby improving the signal-to-noise ratio. Furthermore, by mounting the current sensor IC 10a on the drive circuit board 12, the current sensor IC 10a can be accurately positioned relative to the AC wiring 11, thereby improving the detection accuracy of the current detection unit 10.

[0087] Third Embodiment A rotating electrical machine unit 1 according to a third embodiment will now be described with reference to Figures 15 and 16. Note that components having the same functions and actions as those in the second embodiment will be given the same reference numerals and their description will be omitted. Figure 15 is a top view of a capacitor module 61, AC wiring 11, drive circuit board 12, and current detection unit 10 according to the third embodiment. Figure 16 is a cross-sectional view taken along line CC in Figure 15.

[0088] In this embodiment, the current detection unit 10 includes a current sensor IC 10a and a substantially U-shaped magnetic body 10b. In the illustrated example, the magnetic body 10b has a U-shape with right-angled corners. Specifically, as shown in FIG. 16 , the magnetic body 10b includes a first magnetic body portion 10b1 disposed above the drive circuit board 12, a second magnetic body portion 10b2 disposed below the drive circuit board 12, and a third magnetic body portion 10b3 connecting the first magnetic body portion 10b1 and the second magnetic body portion 10b2. The first magnetic body portion 10b1 and the second magnetic body portion 10b2 are disposed on either side of the drive circuit board 12 in the axial direction. An opening (magnetic gap) is formed between the first magnetic body portion 10b1 and the second magnetic body portion 10b2. When viewed from the axial direction, the third magnetic body portion 10b3 is disposed outside the drive circuit board 12. That is, when viewed in the axial direction, the third magnetic material portion 10b3 is disposed between the adjacent drive circuit boards 12.

[0089] The magnetic body 10b may be composed of a single magnetic body, or may be composed of three rectangular parallelepiped magnetic body portions corresponding to the first magnetic body portion 10b1, the second magnetic body portion 10b2, and the third magnetic body portion 10b3. The magnetic body 10b may be composed of a rectangular parallelepiped magnetic body portion and an L-shaped magnetic body portion. The magnetic body 10b may have an arc-shaped, such as a C-shape with rounded corners. The magnetic body 10b may be composed of multiple magnetic body plates stacked in the thickness direction. The magnetic body 10b may be made of a material such as an electromagnetic steel plate, a silicon steel plate, an Mn-Zn ferrite core, an Ni-Zn ferrite core, an amorphous core, an iron dust core, or permalloy.

[0090] A recess 14d for fixing the magnetic body 10b is formed in the cooler 14. The lower part of the second magnetic body part 10b2 is accommodated in the recess 14d. The magnetic body 10b is fixed to the cooler 14 by fixing the second magnetic body part 10b2 and the recess 14d with an adhesive.

[0091] As in the second embodiment, the current sensor IC 10a is mounted on the drive circuit board 12. The current sensor IC 10a is provided on the upper surface of the drive circuit board 12. Alternatively, the current sensor IC 10a may be provided on the lower surface of the drive circuit board 12. The AC wiring 11 has a bent portion 11a that bends toward the drive circuit board 12. When viewed from the axial direction, the bent portion 11a is positioned to overlap the drive circuit board 12. A portion of the AC wiring 11 (the bent portion 11a) and the current sensor IC 10a are positioned inside the space (i.e., the opening) surrounded by the first magnetic material portion 10b1, the second magnetic material portion 10b2, and the third magnetic material portion 10b3. The current sensor IC 10a is positioned so that the current detection direction of the current sensor IC 10a is perpendicular to the mounting surface of the drive circuit board 12 on which the current sensor IC 10a is mounted. In this embodiment, the axial position of the current sensor IC 10a is adjustable. The current sensor IC 10a is preferably disposed so that the axial position of the current sensor IC 10a coincides with the axial center position of the opening, thereby further improving the detection accuracy of the current detection unit 10.

[0092] 17 is a top view of a capacitor module 61, AC wiring 11, drive circuit board 12, and current detection unit 10 according to a modification of embodiment 3. As shown in Fig. 17, the AC wiring 11 does not have a bent portion 11a, and a portion of the AC wiring 11 extending linearly may be arranged to overlap with the drive circuit board 12 in the axial direction. In this case, the portion of the AC wiring 11 and the current sensor IC 10a are arranged inside the space surrounded by the first magnetic material portion 10b1, the second magnetic material portion 10b2, and the third magnetic material portion 10b3.

[0093] As described above, in this embodiment, each of the multiple current detection units 10 further includes a magnetic body 10b having a first magnetic body portion 10b1 and a second magnetic body portion 10b2 arranged on either side of a corresponding one of the multiple drive circuit boards 12 in the axial direction, and a third magnetic body portion 10b3 connecting the first magnetic body portion 10b1 and the second magnetic body portion 10b2. When viewed from the axial direction, the third magnetic body portion 10b3 is arranged outside the corresponding drive circuit board 12. The current sensor IC 10a and the corresponding AC wiring 11 are arranged inside the space of the magnetic body 10b surrounded by the first magnetic body portion 10b1, the second magnetic body portion 10b2, and the third magnetic body portion 10b3.

[0094] The provision of the magnetic body 10b can further improve the detection accuracy of the current detection unit 10. When a single drive circuit board is used, the magnetic body needs to be disposed, for example, below the drive circuit board. This increases the axial size of the rotating electric machine unit 1. In this embodiment, the magnetic body 10b can be disposed by utilizing the gap between adjacent drive circuit boards 12. Therefore, the axial size of the rotating electric machine unit 1 can be reduced compared to when a single drive circuit board is used. Furthermore, the axial distance between the drive circuit board 12 and the power module 5 can be reduced compared to when a single drive circuit board is used. As a result, the length of the signal terminals 54a, 54b of the power module 5 connected to the drive circuit board 12 can be shortened, thereby reducing the wiring inductance of the signal terminals 54a, 54b, thereby reducing the delay of the drive signal and reducing overshoot and undershoot.

[0095] Fourth Embodiment A rotating electrical machine unit 1 according to a fourth embodiment will now be described with reference to Fig. 18. Note that components having the same functions and actions as those in the first, second, and third embodiments are given the same reference numerals, and descriptions thereof will be omitted. Fig. 18 is a top view of a capacitor module 61, AC wiring 11, drive circuit board 12, and current detection unit 10 according to the fourth embodiment.

[0096] In this embodiment, a low-voltage system protection circuit 75 and a high-voltage system protection circuit 76 are mounted on the drive circuit board 12. The low-voltage system protection circuit 75 and the high-voltage system protection circuit 76 have the function of stopping the operation of the high-voltage system circuit (for example, the operation of the power module 5) by interrupting the drive signal of the drive control IC 71 when an abnormality is detected in the high-voltage system circuit of the power conversion device 3.

[0097] The low-voltage protection circuit 75 is a protection circuit against an overcurrent of a phase current flowing through the AC wiring 11. For example, the low-voltage protection circuit 75 is composed of a comparator 75c, a switching element 75d, a resistor 75a, and a capacitor 75b. The low-voltage protection circuit 75 is a low-voltage circuit connected to the first electronic processing unit E1 of the drive circuit 7. The low-voltage protection circuit 75 is mounted in the first region R1. The low-voltage protection circuit 75 is preferably disposed radially inward in the first region R1.

[0098] The comparator 75c is connected to the current sensor IC 10a mounted on the drive circuit board 12 and compares the signal voltage output from the current sensor IC 10a with a reference voltage. The comparator 75c outputs an output signal representing the comparison result to the switching element 75d. The switching element 75d switches between an ON state and an OFF state depending on the output signal from the comparator 75c. Specifically, when an overcurrent occurs and the signal voltage output from the current sensor IC 10a exceeds the reference voltage, the switching element 75d switches ON. The switching element 75d is connected to the input terminal side (low-voltage side) of the drive control IC 71. When the switching element 75d switches ON, the drive signal output from the drive control IC 71 is blocked by the switching element 75d and is not transmitted to the power module 5. The resistor 75a and the capacitor 75b are connected in series or parallel to the comparator 75c and / or the switching element 75d. The low-voltage system protection circuit 75 may further include electronic components such as an operational amplifier. The low-voltage protection circuit 75 may be configured to further include a magnetic sensor or the like for detecting an overcurrent in addition to the current sensor IC 10a.

[0099] The high-voltage system protection circuit 76 is a protection circuit for protecting the power module 5 from overvoltage. For example, the high-voltage system protection circuit 76 is composed of a voltage detection terminal 76a (detection unit), a voltage dividing resistor 76b, a capacitor 76c, and a high-voltage system terminal of the drive control IC 71 (not shown). Note that the capacitor 76c may be omitted. The high-voltage system protection circuit 76 is a high-voltage system circuit connected to the second electronic processing unit E2 of the drive circuit 7. The high-voltage system protection circuit 76 is mounted in the second region R2. The high-voltage system protection circuit 76 is preferably located away from the first region R1. The high-voltage system protection circuit 76 is preferably located away from the wiring pattern formed on the drive circuit board 12 that connects the drive control IC 71 and the signal terminals 54a and 54b of the power module 5.

[0100] In the illustrated example, a high-voltage system protection circuit 76 is provided for each of the upper-arm switching element 5a and the lower-arm switching element 5b. In the high-voltage system protection circuit 76 for the upper-arm switching element 5a, a voltage detection terminal 76a is one of the upper-arm signal terminals 54a of the power module 5 and is electrically connected to the switching element 5a, the input capacitor 6, and the on-board battery E. A voltage dividing resistor 76b is a resistor for dividing the voltage of the voltage detection terminal 76a. A capacitor 76c is provided on the output side of the voltage dividing resistor 76b and functions as a noise filter. In addition, in the high-voltage system protection circuit 76 for the lower-arm switching element 5b, the voltage detection terminal 76a is one of the lower-arm signal terminals 54b of the power module 5 and is electrically connected to the switching element 5b, the input capacitor 6, and the on-board battery E. Similar to the high-voltage system protection circuit 76 for the switching element 5a, the high-voltage system protection circuit 76 for the switching element 5b also includes a voltage dividing resistor 76b and a capacitor 76c. The high-voltage system protection circuit 76 may be provided for only one of the upper arm switching element 5a and the lower arm switching element 5b.

[0101] When the signal voltage output through the voltage-dividing resistor 76b and the capacitor 76c exceeds a predetermined threshold, an overvoltage detection signal is input to the drive control IC 71. For example, the high-voltage system protection circuit 76 may be provided with a comparator that compares the signal voltage output through the voltage-dividing resistor 76b and the capacitor 76c with a reference voltage, and when the signal voltage exceeds the reference voltage, the comparator outputs an overvoltage detection signal. The drive control IC 71 also has a function of blocking the drive signal. When the overvoltage detection signal is input to a high-voltage system terminal of the drive control IC 71, the drive control IC 71 blocks the drive signal. The high-voltage system protection circuit 76 may include a switching element connected to the output terminal side (high-voltage side) of the drive control IC 71, and the overvoltage detection signal may be input to this switching element. In this case, when the overvoltage detection signal is input to the switching element, the switching element blocks the drive signal. The high-voltage system protection circuit 76 may also include an electronic component such as an operational amplifier.

[0102] The configuration of the protection circuits 75, 76 is not limited to the above. The protection circuits 75, 76 may have a configuration other than that described above as long as they have the function of cutting off the drive signal from the drive control IC 71 when an abnormality is detected in the high-voltage circuit. For example, the protection circuits 75, 76 may have a temperature detection unit that detects the temperature of the power module 5 and be configured to cut off the drive signal from the drive control IC 71 when the temperature of the power module 5 exceeds a preset threshold. The protection circuits 75, 76 may also be protection circuits against arm short circuits between the upper arm and lower arm semiconductor elements built into the power module 5. Even in these cases, low-voltage protection circuits are mounted in the first region R1, and high-voltage protection circuits are mounted in the second region R2.

[0103] In this embodiment, protection circuits 75 and 76 are mounted on the drive circuit board 12. This allows the drive signal from the drive control IC 71 to be quickly shut off and the operation of the high-voltage circuitry to be stopped if an abnormality occurs in the high-voltage circuitry, thereby preventing damage to the power module 5 and the electronic components that make up the drive circuit 7. More specifically, the low-voltage control circuit 8 typically monitors the status of the high-voltage circuitry and shuts off the drive signal in the event of an abnormality. However, due to factors such as the long wiring from the control circuit 8 to the drive control IC 71 and the time required for signal processing by the microcontroller 81, shutting off the drive signal using the control circuit 8 can take tens of microseconds or more from the detection of an abnormality to the shutting off of the drive signal. When the protection circuits 75 and 76 are mounted on the drive circuit board 12, the wiring from the protection circuits 75 and 76 to the drive control IC 71 is short, and the drive signal can be shut off without going through the microcontroller 81. Therefore, by cutting off the drive signal using the protection circuits 75 and 76, the time required from detecting an abnormality to stopping the operation of the power module 5 can be reduced to, for example, about 0.1 μs to 10 μs.

[0104] Furthermore, the low-voltage system protection circuit 75 is mounted in the first region R1, and the high-voltage system protection circuit 76 is mounted in the second region R2. This increases the reliability of the operation of the protection circuits 75 and 76. More specifically, as described above, the protection circuits 75 and 76 have the function of stopping the operation of the high-voltage system circuit by interrupting the drive signal from the drive control IC 71 when an abnormality occurs in the high-voltage system circuit. When an abnormality occurs in the high-voltage system circuit, an overcurrent or overvoltage may occur in the high-voltage system circuit, or a steep current / voltage fluctuation may occur in the high-voltage system circuit, easily generating noise. If the low-voltage system protection circuit 75 is located close to the high-voltage system circuit, the above-mentioned noise may impede the operation of the low-voltage system protection circuit 75. Therefore, by mounting the low-voltage system protection circuit 75 in the first region R1, the effects of the above-mentioned noise can be reduced, allowing the low-voltage system protection circuit 75 to function reliably even when an abnormality occurs in the high-voltage system circuit. Furthermore, by arranging the low-voltage protection circuit 75 radially inward in the first region R1, it is possible to more effectively prevent the operation of the low-voltage protection circuit 75 from being hindered by noise.

[0105] Furthermore, the high-voltage system protection circuit 76 itself is likely to be a noise source. By mounting the high-voltage system protection circuit 76 in the second region R2, it is possible to prevent interference with the operation of the first electronic processing unit E1 mounted in the first region R1. By positioning the high-voltage system protection circuit 76 in the second region R2, away from the first region R1, it is possible to more effectively prevent interference with the operation of the first electronic processing unit E1 mounted in the first region R1. Furthermore, by positioning the high-voltage system protection circuit 76 away from the wiring pattern formed on the drive circuit board 12 that connects the drive control IC 71 to the signal terminals 54a and 54b of the power module 5, it is possible to reduce the influence of the high-voltage system protection circuit 76 on the drive signal of the drive control IC 71. As a result, it is possible to reliably drive and control the power module 5 regardless of whether it is operating normally or abnormally.

[0106] As described above, in this embodiment, the low-voltage system protection circuit 75 is mounted in the first region R1. The low-voltage system protection circuit 75 is connected to the first electronic processing unit E1 of the drive circuit 7 and is configured to interrupt the drive signal of the drive circuit 7 when an abnormality is detected in the high-voltage system circuit of the power conversion device 3. With the above configuration, when an abnormality occurs in the high-voltage system circuit, the operation of the high-voltage system circuit can be quickly stopped. Furthermore, because the low-voltage system protection circuit 75 is mounted in the first region R1, it is possible to prevent the operation of the low-voltage system protection circuit 75 from being hindered by noise generated from the high-voltage system circuit in the event of an abnormality.

[0107] Also, a high-voltage system protection circuit 76 is mounted in the second region R2. The high-voltage system protection circuit 76 is connected to the second electronic processing unit E2 of the drive circuit 7 and is configured to cut off the drive signal of the drive circuit 7 if an abnormality is detected in the high-voltage system circuit of the power conversion device 3. With this configuration, if an abnormality occurs in the high-voltage system circuit, the operation of the high-voltage system circuit can be quickly stopped. Furthermore, because the high-voltage system protection circuit 76 is mounted in the second region R2, it is possible to prevent the high-voltage system protection circuit 76 from interfering with the operation of the first electronic processing unit E1.

[0108] The technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present disclosure.

[0109] For example, the rotating electrical machine unit 1 may be a rotating electrical machine unit of a simplex three-phase drive system, or a rotating electrical machine unit of a multi-phase drive system with six or more phases.

[0110] In the above embodiment, the control circuit board 13 is disposed above the plurality of drive circuit boards 12. However, the control circuit board 13 may be provided in a housing different from the housing that houses the drive circuit boards 12 (i.e., the housing formed by the upper cover 17 and the base 15). In this case, the control circuit board 13 and the drive circuit boards 12 are electrically connected using a harness.

[0111] Various aspects of the present disclosure are summarized below as appendices.

[0112] (Supplementary Note 1) A rotating electric machine including a stator around which a plurality of coils are wound, and a rotor that rotates around an axis relative to the stator, and a power conversion device arranged alongside the rotating electric machine in an axial direction along the axis of the rotor, wherein the power conversion device comprises: a plurality of power modules arranged in a circumferential direction, each corresponding to the plurality of coils; a plurality of AC wirings electrically connecting the plurality of coils to the plurality of power modules, respectively; and a plurality of drive circuit boards arranged in a circumferential direction, each corresponding to the plurality of power modules, on which drive circuits that drive the plurality of power modules are mounted, wherein, when viewed from the axial direction, each of the plurality of drive circuit boards is formed so that the circumferential length decreases radially inward, and the drive circuit comprises: a first electronic processing unit of a low-voltage system having a first electronic component and a first wiring pattern connected to the first electronic component, and a second electronic component and a second wiring pattern connected to the second electronic component, and a second electronic processing unit of a high-voltage system having a higher potential than the low-voltage system, Each of the plurality of drive circuit boards has a first region in which the first electronic processing unit is mounted and a second region in which the second electronic processing unit is mounted, and the first region is positioned radially inward of the second region.

[0113] (Supplementary Note 2) The rotating electrical machine unit according to Supplementary Note 1, wherein the power conversion device includes a control circuit board disposed on the axis and on which a control circuit for controlling the drive circuit is mounted.

[0114] (Supplementary Note 3) The rotating electrical unit according to Supplementary Note 2, wherein a power supply circuit that supplies operating power (electric power) to the drive circuit and the control circuit is mounted on the control circuit board.

[0115] (Supplementary Note 4) The rotating electric unit according to any one of Supplementary Notes 1 to 3, wherein the power conversion device further includes a plurality of current detection units that respectively detect currents output from the plurality of power modules, wherein each of the plurality of current detection units has a current sensor IC mounted on a corresponding one of the plurality of drive circuit boards, and wherein when viewed from the axial direction, the current sensor IC is arranged to overlap a corresponding one of the plurality of AC wirings.

[0116] (Appendix 5) A rotating electric unit as described in Appendix 4, wherein each of the plurality of current detection units further includes a magnetic body having a first magnetic body portion and a second magnetic body portion arranged on either side of a corresponding one of the plurality of drive circuit boards in the axial direction, and a third magnetic body portion connecting the first magnetic body portion and the second magnetic body portion, wherein when viewed from the axial direction, the third magnetic body portion is arranged outside the corresponding drive circuit board, and the current sensor IC and the corresponding AC wiring are arranged inside a space in the magnetic body surrounded by the first magnetic body portion, the second magnetic body portion, and the third magnetic body portion.

[0117] (Appendix 6) A rotating electric unit according to any one of Appendices 1 to 5, wherein a low-voltage system protection circuit is mounted in the first area and is connected to the first electronic processing unit of the drive circuit and configured to cut off the drive signal of the drive circuit when an abnormality is detected in the high-voltage system circuit of the power conversion device.

[0118] (Appendix 7) A rotating electric unit according to any one of Appendices 1 to 6, wherein a high-voltage system protection circuit is mounted in the second area, the high-voltage system protection circuit being connected to the second electronic processing unit of the drive circuit and configured to cut off the drive signal of the drive circuit when an abnormality is detected in the high-voltage system circuit of the power conversion device.

[0119] REFERENCE SIGNS LIST 1 Rotating electric machine unit 2 Rotating electric machine 3 Power conversion device 5 Power module 6 Input capacitor 7 Drive circuit 8 Control circuit 9 Power supply circuit 10 Current detection section 10a Current sensor IC 10b Magnetic body 10b1 First magnetic body section 10b2 Second magnetic body section 10b3 Third magnetic body section 11 AC wiring 12 Drive circuit board 13 Control circuit board 21 Stator 22 Rotor 23 Rotating shaft 24 Housing 25 Coil 25a Wiring section (end of coil) 61 Capacitor module 71 Drive control IC 72 Drive control IC peripheral element section (first electronic component) 73 Gate resistor section (second electronic component) 74 Drive circuit connector (first electronic component) 75 Low-voltage system protection circuit 76 High-voltage system protection circuit 91 Power supply IC E1 First electronic processing section E2 Second electronic processing section R1 1st region R2 2nd region S1, S2 Opposing sides O Axial center

Claims

1. a rotating electric machine including a stator around which a plurality of coils are wound and a rotor that rotates about an axis relative to the stator; a power conversion device arranged alongside the rotating electric machine in an axial direction along an axis of the rotor; Equipped with The power conversion device is a plurality of power modules provided corresponding to the plurality of coils and arranged in a circumferential direction; a plurality of AC wirings electrically connecting the plurality of coils and the plurality of power modules, respectively; a plurality of drive circuit boards provided corresponding to the plurality of power modules, each of which has a drive circuit mounted thereon for driving the plurality of power modules; having The drive circuit has a first electronic processing unit of a low voltage system and a second electronic processing unit of a high voltage system having a higher potential than the low voltage system, each of the plurality of drive circuit boards has a first region in which the first electronic processing unit is mounted and a second region in which the second electronic processing unit is mounted; The first region is disposed radially inward from the second region. Rotating electric unit.

2. A rotating electric unit as described in claim 1, wherein the first electronic processing unit has a first electronic component and a first wiring pattern connected to the first electronic component, and the second electronic processing unit has a second electronic component and a second wiring pattern connected to the second electronic component.

3. A rotating electric unit as described in Claim 1, wherein, when viewed from the axial direction, each of the multiple drive circuit boards is formed so that its circumferential length decreases as it moves radially inward.

4. The rotating electrical unit according to claim 1 , wherein the plurality of drive circuit boards are disposed at equal intervals in the circumferential direction.

5. The rotating electric unit according to claim 1 , wherein the number of the plurality of drive circuit boards is equal to the number of phases of the stator.

6. 6. The rotating electrical unit according to claim 1, wherein the plurality of drive circuit boards have the same shape as each other.

7. 2 . The rotating electrical unit according to claim 1 , wherein a drive control IC of said drive circuit that generates a drive signal for driving said power module is disposed across said first area and said second area.

8. the power conversion device includes a capacitor module that is provided in parallel with the power module and smoothes DC power; The capacitor module is disposed radially outward from the second region. The rotating electrical machine unit according to claim 1 .

9. The rotating electric unit according to claim 1 , wherein ends of the plurality of coils are disposed radially outward from the first region.

10. 2 . The rotating electric unit according to claim 1 , wherein the power conversion device further comprises a control circuit board arranged on the axis and on which a control circuit for controlling the drive circuit is mounted.

11. The rotating electrical unit according to claim 10 , wherein a power supply circuit that supplies power to the drive circuit and the control circuit is mounted on the control circuit board.

12. The rotating electrical unit according to claim 11 , wherein a power supply IC that generates a signal for operating the power supply circuit is disposed on the shaft center.

13. The power conversion device further includes a plurality of current detection units each detecting a current output from the plurality of power modules, each of the plurality of current detection units includes a current sensor IC mounted on a corresponding one of the plurality of drive circuit boards; When viewed from the axial direction, the current sensor IC is disposed so as to overlap a corresponding one of the plurality of AC wirings. The rotating electrical machine unit according to claim 1 .

14. each of the plurality of current detection units further includes a magnetic body having a first magnetic body portion and a second magnetic body portion arranged to sandwich a corresponding one of the plurality of drive circuit boards in the axial direction, and a third magnetic body portion connecting the first magnetic body portion and the second magnetic body portion; When viewed from the axial direction, the third magnetic body portion is disposed outside the corresponding drive circuit board, the current sensor IC and the corresponding AC wiring are disposed inside a space surrounded by the first magnetic body portion, the second magnetic body portion, and the third magnetic body portion in the magnetic body; The rotating electrical machine unit according to claim 13.

15. A low-voltage system protection circuit is mounted in the first region and is connected to the first electronic processing unit of the drive circuit and configured to cut off a drive signal of the drive circuit when an abnormality is detected in the high-voltage system circuit of the power conversion device. The rotating electrical machine unit according to claim 1 .

16. A high-voltage system protection circuit is mounted in the second region and is connected to the second electronic processing unit of the drive circuit and configured to cut off a drive signal of the drive circuit when an abnormality is detected in the high-voltage system circuit of the power conversion device. The rotating electrical machine unit according to claim 1 .