Electronic device

Abstract

This electronic device comprises: a conductive support member; an electronic element disposed in the conductive support member; and a sealing resin that covers the electronic element and the conductive support member. The sealing resin has a first resin side surface directed in a first direction orthogonal to the thickness direction of the conductive support member. A first gate trace is formed in the first resin side surface. The conductive support member includes a first part positioned closest to the first gate trace in the first direction. The first part is positioned at the inner side relative to the first gate trace in the thickness direction and in a second direction orthogonal to the first direction. The first gate trace has a first dimension which is a length in the thickness direction. The first gate trace and the first part are separated by a first distance in the first direction. A proportion of the first distance with respect to the first size is 500% or lower.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Conventionally, semiconductor devices manufactured using lead frames are known as one type of electronic device. An example of such a semiconductor device is described in Patent Document 1. The semiconductor device described in this document includes a conductive support member, a semiconductor element, and a sealing resin. The conductive support member includes a die pad and multiple terminals. The semiconductor element is mounted on the die pad. The multiple terminals are arranged around the die pad. The sealing resin collectively seals the die pad, the semiconductor element, and portions of the multiple terminals.

[0003] The encapsulating resin is formed by transfer molding. When forming the encapsulating resin, a lead frame is placed in a mold, and fluidized resin is poured into the mold cavity, filling it, and then solidified. In Figure 12 of the same document, the resin is injected, for example, from the center in the horizontal direction above the page. The area near the resin injection point is not provided with any parts that will become lead frame terminals (conductive support members), so as not to impede the flow of the resin. However, if the fluidized resin is injected forcefully during the encapsulating resin formation, air is likely to be entrained during the injection, and the air is likely to remain as pinholes (voids) near the resin injection point after the resin is filled. This could lead to improper filling of the encapsulating resin.

[0004] Japanese Patent Application Laid-Open No. 2022-55599

[0005] An object of the present disclosure is to provide an electronic device that is improved over conventional electronic devices. In particular, in view of the above-described circumstances, an object of the present disclosure is to provide an electronic device that is suitable for suppressing insufficient filling of the sealing resin.

[0006] An electronic device provided by a first aspect of the present disclosure includes a conductive support member, at least one electronic element arranged on one side of the conductive support member in a thickness direction, and a sealing resin covering the at least one electronic element and a portion of the conductive support member. The sealing resin has a first resin side surface facing one side in a first direction perpendicular to the thickness direction. A first gate mark having a surface rougher than other regions of the first resin side surface is formed on the first resin side surface. The conductive support member includes a first portion located closest to the first gate mark in the first direction and located inward from the first gate mark in a second direction perpendicular to the thickness direction and the first direction, as viewed in the thickness direction. A first distance, which is the distance between the first gate mark and the first portion in the first direction, to a first dimension, which is the length of the first gate mark in the thickness direction, is greater than 0% and not more than 500%.

[0007] A second aspect of the present disclosure provides an electronic device comprising a conductive support member, at least one electronic element disposed on one side of the conductive support member in a thickness direction, and a sealing resin covering the at least one electronic element and a portion of the conductive support member. The sealing resin has a first resin side surface facing one side in a first direction perpendicular to the thickness direction, a second resin side surface facing the other side in the first direction, a third resin side surface facing one side in a second direction perpendicular to the thickness direction and the first direction, and a fourth resin side surface facing the other side in the second direction. The first resin side surface has a first gate mark formed thereon, the first gate mark having a surface rougher than other regions of the first resin side surface. The conductive support member includes a die pad portion and a plurality of first lead terminals. Each of the plurality of first lead terminals protrudes from the third resin side surface to one side in the second direction. The at least one electronic element is mounted on the die pad portion. The plurality of first lead terminals are arranged at intervals in the first direction and include a one-end first terminal located at one end in the first direction. The one-end first terminal has a first lead portion, a first pad portion, and a first extension portion. The first lead portion is located on one side of the die pad portion in the first direction and extends in the second direction. The first pad portion is connected to an end of the first lead portion on the other side in the second direction and extends to the other side in the first direction. The first extension portion is connected to an end of the first lead portion on the other side in the second direction and extends to the other side in the second direction. The first extension portion includes a portion located inward from the first gate mark in the second direction when viewed in the thickness direction.

[0008] According to the above configuration, it is possible to suppress insufficient filling of the sealing resin in the electronic device.

[0009] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a plan view illustrating an electronic device according to a first embodiment of the present disclosure. FIG. 2 is a plan view corresponding to FIG. 1 , seen through the sealing resin. FIG. 3 is a front view illustrating an electronic device according to a first embodiment of the present disclosure. FIG. 4 is a left side view illustrating an electronic device according to a first embodiment of the present disclosure. FIG. 5 is a rear view illustrating an electronic device according to a first embodiment of the present disclosure. FIG. 6 is a right side view illustrating an electronic device according to a first embodiment of the present disclosure. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 2. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 2. FIG. 9 is a partial enlarged view of FIG. 2. FIG. 10 is a plan view illustrating a manufacturing process for an electronic device according to a first embodiment of the present disclosure. FIG. 11 is a plan view illustrating a manufacturing process for an electronic device according to a first embodiment of the present disclosure. FIG. 12 is a plan view illustrating a manufacturing process for an electronic device according to a first embodiment of the present disclosure. FIG. 13 is a plan view illustrating an electronic device according to a first modification of the first embodiment, seen through the sealing resin. FIG. 14 is a partial enlarged view of FIG. 13. FIG. 15 is a plan view showing an electronic device according to a second embodiment of the present disclosure. FIG. 16 is a plan view corresponding to FIG. 15 , seen through the sealing resin. FIG. 17 is a front view showing an electronic device according to a second embodiment of the present disclosure. FIG. 18 is a left side view showing an electronic device according to a second embodiment of the present disclosure. FIG. 19 is a rear view showing an electronic device according to a second embodiment of the present disclosure. FIG. 20 is a right side view showing an electronic device according to a second embodiment of the present disclosure. FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 16 . FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 16 . FIG. 23 is a circuit configuration diagram of an electronic device according to a second embodiment of the present disclosure. FIG. 24 is a plan view showing an electronic device according to a first modified example of the second embodiment, seen through the sealing resin.

[0011] Preferred embodiments of the present disclosure will now be described in detail with reference to the drawings.

[0012] Terms such as "first," "second," and "third" in this disclosure are used merely as labels and are not necessarily intended to dictate any ordering of their objects.

[0013] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on a certain object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on a certain object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on a certain object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on a certain object B" includes "a certain object A is located on a certain object B with a certain object A in contact with the certain object B" and "a certain object A is located on a certain object B with another object interposed between the certain object A and the certain object B." Unless otherwise specified, the phrase "an object A overlaps an object B when viewed in a certain direction" includes "an object A overlaps the entire object B" and "an object A overlaps a part of an object B." In the present disclosure, "a surface A faces in (one side or the other side of) direction B" is not limited to the case where the angle of surface A with respect to direction B is 90°, but also includes the case where surface A is tilted with respect to direction B.

[0014] First Embodiment: An electronic device according to a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 9 . The electronic device A1 of this embodiment includes a plurality of electronic elements 1, a conductive support member 2, a plurality of wires 31 to 34, and a sealing resin 5. Of these, the conductive support member 2 includes a die pad portion 21, a plurality of first lead terminals 22, and a plurality of second lead terminals 23. The specific use of the electronic device A1 is not limited in any way, but it may be surface-mounted on a wiring board of an inverter device for an electric vehicle or a hybrid vehicle, for example. The package format of the electronic device A1 is a small outline package (SOP). The package format of the electronic device A1 is not limited to SOP.

[0015] 1 and 2 are plan views showing the electronic device A1. FIG. 3 is a front view showing the electronic device A1. FIG. 4 is a left side view showing the electronic device A1. FIG. 5 is a rear view showing the electronic device A1. FIG. 6 is a right side view showing the electronic device A1. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 2. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 2. FIG. 9 is a partially enlarged view of FIG. 2. For ease of understanding, FIG. 2 shows the sealing resin 5 through which light passes. In FIG. 2, the penetrated sealing resin 5 is indicated by an imaginary line (two-dot chain line).

[0016] In the description of the present disclosure, three mutually orthogonal directions will be referred to as appropriate. As an example, in the description of the electronic device A1, the thickness direction of the die pad portion 21 (conductive support member 2) will be referred to as the "thickness direction z." One direction orthogonal to the thickness direction z (the left-right direction in FIG. 1 ) will be referred to as the "first direction x." A direction orthogonal to both the thickness direction z and the first direction x (the up-down direction in FIG. 1 ) will be referred to as the "second direction y." As shown in FIGS. 1 and 2 , the electronic device A1 is rectangular (or approximately rectangular) when viewed in the thickness direction z (in a plan view).

[0017] 1 and 2 , in this embodiment, the multiple electronic elements 1 include a first semiconductor element 11, an insulating element 12, and a second semiconductor element 13. The first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 are elements that form the functional core of the electronic device A1. In the electronic device A1, the first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 are each composed of individual elements. When viewed in the thickness direction z, the first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 each have a rectangular shape with the long side extending in the first direction x.

[0018] The first semiconductor element 11 is a controller (control element) of a gate driver that drives switching elements such as IGBTs and MOSFETs. The first semiconductor element 11 has a circuit that converts a control signal input from an ECU or the like into a PWM control signal, a transmission circuit that transmits the PWM control signal to the second semiconductor element 13, and a reception circuit that receives an electrical signal from the second semiconductor element 13. The first semiconductor element 11 is an example of a "first electronic element" in the present disclosure.

[0019] The second semiconductor element 13 is a gate driver (drive element) for driving the switching element. The second semiconductor element 13 has a receiving circuit for receiving a PWM control signal, a circuit for driving the switching element based on the PWM control signal, and a transmitting circuit for transmitting an electrical signal to the first semiconductor element 11. An example of the electrical signal is an output signal from a temperature sensor disposed near the motor. The second semiconductor element 13 is an example of a "second electronic element" in the present disclosure.

[0020] The isolation element 12 is an element for transmitting PWM control signals and other electrical signals in an isolated state. In the electronic device A1, the isolation element 12 is an inductive type. An example of an inductive isolation element 12 is an isolation transformer. An isolation transformer transmits electrical signals in an isolated state by inductively coupling two inductors (coils). The isolation element 12 has a silicon substrate. A copper inductor is formed on the substrate. The inductors include a transmitting inductor and a receiving inductor, which are stacked in the thickness direction z. A dielectric layer made of silicon dioxide (SiO2) or the like is interposed between the transmitting inductor and the receiving inductor. The dielectric layer electrically insulates the transmitting inductor from the receiving inductor. Alternatively, the isolation element 12 may be a capacitive type. An example of a capacitive isolation element 12 is a capacitor. The isolation element 12 may also be a photocoupler.

[0021] In the electronic device A1, the second semiconductor element 13 requires a power supply voltage higher than that required for the first semiconductor element 11. This results in a significant potential difference between the first semiconductor element 11 and the second semiconductor element 13. Therefore, in the electronic device A1, a first circuit including the first semiconductor element 11 as a component and a second circuit including the second semiconductor element 13 as a component are insulated from each other by an insulating element 12. The first circuit and the second circuit have relatively different potentials. In the electronic device A1, the second circuit has a higher potential than the first circuit. Furthermore, the insulating element 12 relays signals between the first circuit and the second circuit. For example, in an inverter device for an electric vehicle or a hybrid vehicle, the voltage applied to the ground of the first semiconductor element 11 is approximately 0 V, while the voltage applied to the ground of the second semiconductor element 13 may transiently reach 600 V or higher.

[0022] 2 and 7 , a plurality of electrodes 111 are provided on the upper surface of the first semiconductor element 11 (the surface facing the same direction as the mounting surface 211 of the die pad portion 21, which will be described later). The plurality of electrodes 111 are electrically connected to a circuit configured in the first semiconductor element 11. Similarly, a plurality of electrodes 131 are provided on the upper surface of the second semiconductor element 13 (the surface facing the same direction as the mounting surface 211, which will be described later). The plurality of electrodes 131 are electrically connected to a circuit configured in the second semiconductor element 13.

[0023] 2 and 7 , the insulating element 12 is positioned between the first semiconductor element 11 and the second semiconductor element 13 in the second direction y. A plurality of first electrodes 121 and a plurality of second electrodes 122 are provided on the upper surface of the insulating element 12 (the surface facing the same direction as the mounting surface 211 described above). Each of the plurality of first electrodes 121 and the plurality of second electrodes 122 is electrically connected to either the transmitting inductor or the receiving inductor. The plurality of first electrodes 121 are arranged along the first direction x and are positioned closer to the first semiconductor element 11 than the second semiconductor element 13 in the second direction y. The plurality of second electrodes 122 are arranged along the first direction x and are positioned closer to the second semiconductor element 13 than the first semiconductor element 11 in the second direction y.

[0024] The conductive support member 2 is a component that forms conductive paths between the first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 and the wiring substrate of the inverter device in the electronic device A1. The conductive support member 2 is made of, for example, an alloy containing copper (Cu). The conductive support member 2 is formed from a lead frame 81, which will be described later. The first semiconductor element 11, the insulating element 12, and the second semiconductor element 13 are mounted on the conductive support member 2. As shown in FIGS. 1 and 2 , the conductive support member 2 includes a die pad portion 21, a plurality of first lead terminals 22, and a plurality of second lead terminals 23. The first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 are mounted on the die pad portion 21. In this embodiment, the die pad portion 21 includes a first die pad 21A and a second die pad 21B. The first die pad 21A is disposed on the y1 side in the second direction y. The second die pad 21B is disposed on the y2 side in the second direction y. The first die pad 21A and the second die pad 21B are spaced apart from each other in the second direction y. Therefore, a pad gap G2 is provided between the first die pad 3 and the second die pad 4 in the second direction y. In a plan view, the pad gap G2 extends along the first direction x. In the electronic device A1, the first semiconductor element 11 and the insulating element 12 are mounted on the first die pad 21A, and the second semiconductor element 13 is mounted on the second die pad 21B.

[0025] The die pad portion 21 (the first die pad 21A and the second die pad 21B) is covered with sealing resin 5. The die pad portion 21 (each of the first die pad 21A and the second die pad 21B) has a mounting surface 211 facing the z1 side in the thickness direction z. The first semiconductor element 11 and the insulating element 12 are mounted on the mounting surface 211 of the first die pad 21A. The second semiconductor element 13 is mounted on the mounting surface 211 of the second die pad 21B. Each of the first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 is bonded to either the mounting surface 211 of the first die pad 21A or the mounting surface 211 of the second die pad 21B via a conductive bonding material (such as solder or metal paste) not shown. The thickness of the first die pad 21A and the second die pad 21B (die pad portion 21) is, for example, not less than 100 μm and not more than 300 μm.

[0026] 2 and 7 , a plurality of through holes 212 are formed in the first die pad 21A. Each of the plurality of through holes 212 penetrates the first die pad 21A in the thickness direction z and extends along the first direction x. When viewed in the thickness direction z, at least one of the plurality of through holes 212 is located between the first semiconductor element 11 and the insulating element 12. The plurality of through holes 212 are arranged along the first direction x.

[0027] The plurality of first lead terminals 22 are components that are joined to a wiring board such as an inverter device to form a conductive path between the electronic device A1 and the wiring board. At least one of the plurality of first lead terminals 22 is electrically connected to the first semiconductor element 11. As shown in FIGS. 1, 2, and 4, the plurality of first lead terminals 22 are arranged at intervals from one another in the first direction x. The plurality of first lead terminals 22 are exposed from the sealing resin 5 (a third resin side surface 55 described below) so as to extend toward the y1 side in the second direction y. The plurality of first lead terminals 22 include a one-end first terminal 22A, an other-end first terminal 22B, and a plurality of intermediate first terminals 22C.

[0028] The one-end first terminal 22A is located at the end on the x1 side in the first direction x of the multiple first lead terminals 22. As shown in FIG. 2 , the one-end first terminal 22A has a first lead portion 221, a first pad portion 222, and a first extending portion 223.

[0029] The first lead portion 221 is located on the x1 side of the first die pad 21A (die pad portion 21) in the first direction x and extends along the second direction y. The first lead portion 221 has a portion exposed from the sealing resin 5 and a portion covered by the sealing resin 5. As shown in FIG. 3 , the portion of the first lead portion 221 exposed from the sealing resin 5 is bent into a gull-wing shape. The portion of the first lead portion 221 exposed from the sealing resin 5 may be plated. The plating layer formed by the plating process is made of an alloy containing tin (Sn), such as solder, and covers the portion exposed from the sealing resin 5. The plating layer improves solder adhesion to the exposed portion and prevents erosion of the exposed portion due to soldering when the electronic device A1 is surface-mounted on a wiring board of an inverter device by soldering.

[0030] The first pad portion 222 is connected to the end of the first lead portion 221 on the y2 side in the second direction y and extends to the x2 side in the first direction x. The end of the first pad portion 222 on the x2 side in the first direction x is connected to the first die pad 21A. The upper surface of the first pad portion 222 (the surface facing the z1 side in the thickness direction z) may be plated. The plating layer formed by this plating process is made of a metal containing, for example, silver (Ag) and covers the upper surface of the first pad portion 222. This plating layer increases the bonding strength of the wire 32 (described below) while protecting the lead frame 81 (described below) from impact during wire bonding of the wire 32. The entire surface of the first pad portion 222 is covered with the sealing resin 5. The first pad portion 222 is flat (or approximately flat).

[0031] The first extending portion 223 is connected to the end of the first lead portion 221 on the y2 side in the second direction y and extends toward the y2 side in the second direction y. In the example shown, the first extending portion 223 has a generally elongated shape with the second direction y as its longitudinal direction. The first extending portion 223 is hatched in Figures 2 and 9. Details of the first extending portion 223 will be described later.

[0032] The other-end first terminal 22B is located at the end on the x2 side in the first direction x of the plurality of first lead terminals 22. The other-end first terminal 22B has a lead portion 224 and a pad portion 225, as shown in FIG.

[0033] The lead portion 224 is located on the x2 side in the first direction x with respect to the first die pad 21A (die pad portion 21) and extends along the second direction y. The lead portion 224 has a portion exposed from the sealing resin 5 and a portion covered by the sealing resin 5. As shown in FIG. 5 , the portion of the lead portion 224 exposed from the sealing resin 5 is bent into a gull-wing shape. Like the first lead portion 221, the portion of the lead portion 224 exposed from the sealing resin 5 may be covered with a plating layer (for example, an alloy containing Sn, such as solder).

[0034] The pad portion 225 is connected to the end of the lead portion 224 on the y2 side in the second direction y and extends to the x1 side in the first direction x. The end of the pad portion 225 on the x1 side in the first direction x is connected to the first die pad 21A. The upper surface of the pad portion 225 (the surface facing the z1 side in the thickness direction z) may be covered with a plating layer (e.g., a metal containing Ag), similar to the upper surface of the first pad portion 222. The pad portion 225 is covered over its entire surface with sealing resin 5. The pad portion 225 is flat (or approximately flat).

[0035] 2 and 4, the plurality of intermediate first terminals 22C are arranged between the one-end first terminal 22A and the other-end first terminal 22B. As shown in FIG. 2, each of the plurality of intermediate first terminals 22C includes a lead portion 226 and a pad portion 227.

[0036] The lead portion 226 is a portion extending along the second direction y. The lead portion 226 has a portion exposed from the sealing resin 5 and a portion covered by the sealing resin 5. As shown in Fig. 7 , the portion of the lead portion 226 exposed from the sealing resin 5 is bent into a gull-wing shape. Like the first lead portion 221, the portion of the lead portion 226 exposed from the sealing resin 5 may be covered with a plating layer (for example, an alloy containing Sn, such as solder).

[0037] The pad portion 227 is connected to the end portion on the y2 side in the second direction y of the lead portion 226. The upper surface of the pad portion 227 (the surface facing the z1 side in the thickness direction z) may be covered with a plating layer (for example, a metal containing Ag), similar to the upper surface of the first pad portion 222. The pad portion 227 is covered over its entire surface with sealing resin 5. The pad portion 227 is flat (or approximately flat).

[0038] The second lead terminals 23 are joined to a wiring board such as an inverter device to form a conductive path between the electronic device A1 and the wiring board. At least one of the second lead terminals 23 is electrically connected to the second semiconductor element 13. As shown in FIGS. 1, 2, and 6, the second lead terminals 23 are arranged at intervals in the first direction x. The second lead terminals 23 are exposed from the sealing resin 5 (a fourth resin side surface 56 described below) so as to extend toward the y2 side in the second direction y. The second lead terminals 23 include a one-end second terminal 23A, an other-end second terminal 23B, and a plurality of intermediate second terminals 23C.

[0039] The one-end second terminal 23A is located at the end on the x1 side in the first direction x of the plurality of second lead terminals 23. As shown in FIG. 2 , the one-end second terminal 23A has a second lead portion 231, a second pad portion 232, and a second extending portion 233.

[0040] The second lead portion 231 is located on the x1 side in the first direction x with respect to the second die pad 21B (die pad portion 21) and extends along the second direction y. The second lead portion 231 has a portion exposed from the sealing resin 5 and a portion covered by the sealing resin 5. As shown in FIG. 3 , the portion of the second lead portion 231 exposed from the sealing resin 5 is bent into a gull-wing shape. Like the first lead portion 221, the portion of the second lead portion 231 exposed from the sealing resin 5 may be covered with a plating layer (for example, an alloy containing Sn, such as solder).

[0041] The second pad portion 232 is connected to the end of the second lead portion 231 on the y1 side in the second direction y and extends to the x2 side in the first direction x. The end of the second pad portion 232 on the x2 side in the first direction x is connected to the second die pad 21B. The upper surface of the second pad portion 232 (the surface facing the z1 side in the thickness direction z) may be covered with a plating layer (e.g., a metal containing Ag), similar to the upper surface of the first pad portion 222. The second pad portion 232 is entirely covered with the sealing resin 5. The second pad portion 232 is flat (or approximately flat).

[0042] The second extension portion 233 is connected to the end of the second lead portion 231 on the y1 side in the second direction y and extends toward the y1 side in the second direction y. In the illustrated example, the second extension portion 233 has a generally elongated shape with the second direction y as its longitudinal direction. In FIGS. 2 and 9 , the second extension portion 233 is hatched. A terminal gap G1 is provided between the first extension portion 223 (one-end first terminal 22A) and the second extension portion 233 (one-end second terminal 23A) in the second direction y. As shown in FIGS. 2 and 3 , the terminal gap G1 overlaps with the pad gap G2 when viewed in the first direction x. Details of the second extension portion 233 will be described later.

[0043] The other-end second terminal 23B is located at the end on the x2 side in the first direction x of the plurality of second lead terminals 23. The other-end second terminal 23B has a lead portion 234 and a pad portion 235, as shown in FIG.

[0044] The lead portion 234 is located on the x2 side in the first direction x relative to the second die pad 21B (die pad portion 21) and extends along the second direction y. The lead portion 234 has a portion exposed from the sealing resin 5 and a portion covered by the sealing resin 5. As shown in FIG. 5 , the portion of the lead portion 234 exposed from the sealing resin 5 is bent into a gull-wing shape. Like the first lead portion 221, the portion of the lead portion 234 exposed from the sealing resin 5 may be covered with a plating layer (for example, an alloy containing Sn, such as solder).

[0045] The pad portion 235 is connected to the end of the lead portion 234 on the y1 side in the second direction y and extends to the x1 side in the first direction x. The end of the pad portion 235 on the x1 side in the first direction x is connected to the second die pad 21B. The upper surface of the pad portion 235 (the surface facing the z1 side in the thickness direction z) may be covered with a plating layer (for example, a metal containing Ag), similar to the upper surface of the first pad portion 222. The pad portion 235 is covered over its entire surface with sealing resin 5. The pad portion 235 is flat (or approximately flat).

[0046] 2 and 6, the plurality of intermediate second terminals 23C are arranged between the one-end second terminal 23A and the other-end second terminal 23B. As shown in FIG. 2, each of the plurality of intermediate second terminals 23C includes a lead portion 236 and a pad portion 237.

[0047] The lead portion 236 is a portion extending along the second direction y. The lead portion 236 has a portion exposed from the sealing resin 5 and a portion covered by the sealing resin 5. As shown in Fig. 7 , the portion of the lead portion 236 exposed from the sealing resin 5 is bent into a gull-wing shape. Like the first lead portion 221, the portion of the lead portion 236 exposed from the sealing resin 5 may be covered with a plating layer (for example, an alloy containing Sn, such as solder).

[0048] The pad portion 237 is connected to the end portion on the y1 side in the second direction y of the lead portion 236. The upper surface of the pad portion 237 (the surface facing the z1 side in the thickness direction z) may be covered with a plating layer (for example, a metal containing Ag), similar to the upper surface of the first pad portion 222. The pad portion 237 is covered over its entire surface with sealing resin 5. The pad portion 237 is flat (or approximately flat).

[0049] The plurality of wires 31 to 34, together with the die pad portion 21 (first die pad 21A and second die pad 21B), the plurality of first lead terminals 22, and the plurality of second lead terminals 23, respectively constitute conductive paths that enable the first semiconductor element 11, the second semiconductor element 13, and the insulating element 12 to perform predetermined functions. The composition of the plurality of wires 31 to 34 includes, for example, gold (Au). Alternatively, the composition of these wires may include copper or aluminum (Al).

[0050] 2 and 7, each of the plurality of wires 31 is connected to one of the plurality of first electrodes 121 of the insulating element 12 and one of the plurality of electrodes 111 of the first semiconductor element 11. This establishes mutual conduction between the first semiconductor element 11 and the insulating element 12. The plurality of wires 31 are arranged along the first direction x.

[0051] 2 and 7 , each of the plurality of wires 32 is connected to one of the plurality of electrodes 111 of the first semiconductor element 11 and one of the first pad portion 222 of the one-end first terminal 22A, the pad portion 225 of the other-end first terminal 22B, and the pad portions 227 of the plurality of intermediate first terminals 22C. As a result, at least one of the one-end first terminal 22A, the other-end first terminal 22B, and the plurality of intermediate first terminals 22C is electrically connected to the first semiconductor element 11.

[0052] 2 and 7 , each of the plurality of wires 33 is connected to one of the plurality of second electrodes 122 of the insulating element 12 and one of the plurality of electrodes 131 of the second semiconductor element 13. This provides mutual conduction between the second semiconductor element 13 and the insulating element 12. The plurality of wires 33 are arranged along the first direction x. In the electronic device A1, the plurality of wires 33 straddle the first die pad 21A and the second die pad 21B.

[0053] 2 and 7 , each of the plurality of wires 34 is connected to one of the plurality of electrodes 131 of the second semiconductor element 13 and to one of the pad portions 235 of the other-end second terminal 23B and the pad portions 237 of the plurality of intermediate second terminals 23C. As a result, at least one of the other-end second terminal 23B and the plurality of intermediate second terminals 23C is electrically connected to the second semiconductor element 13.

[0054] As shown in FIGS. 1 and 2 , the sealing resin 5 covers the first semiconductor element 11, the second semiconductor element 13, the insulating element 12, the die pad portion 21 (the first die pad 21A and the second die pad 21B), and portions of each of the plurality of first lead terminals 22 and the plurality of second lead terminals 23. Furthermore, as shown in FIG. 7 , the sealing resin 5 covers the plurality of wires 31 to 34. The sealing resin 5 has electrical insulation properties. The sealing resin 5 insulates the first die pad 21A and the second die pad 21B from each other. The sealing resin 5 is made of a material containing, for example, black epoxy resin. When viewed in the thickness direction z, the sealing resin 5 is rectangular.

[0055] As shown in FIGS. 3 to 6, the sealing resin 5 has a resin main surface 51, a resin rear surface 52, a first resin side surface 53, a second resin side surface 54, a third resin side surface 55, and a fourth resin side surface 56.

[0056] 3 to 6 , the resin main surface 51 and the resin back surface 52 are located apart from each other in the thickness direction z. The resin main surface 51 and the resin back surface 52 face opposite each other in the thickness direction z. The resin main surface 51 faces the z1 side in the thickness direction z, and the resin back surface 52 faces the z2 side in the thickness direction z. Each of the resin main surface 51 and the resin back surface 52 is flat (or approximately flat).

[0057] As shown in FIGS. 3 to 6 , the first resin side surface 53, the second resin side surface 54, the third resin side surface 55, and the fourth resin side surface 56 are connected to the resin main surface 51 and the resin back surface 52, respectively, and are sandwiched between the resin main surface 51 and the resin back surface 52 in the thickness direction z. As shown in FIGS. 1 , 4 , and 6 , the first resin side surface 53 is located on the x1 side of the first direction x and faces the x1 side of the first direction x. The second resin side surface 54 is located on the x2 side of the first direction x and faces the x2 side of the first direction x. The third resin side surface 55 and the fourth resin side surface 56 are located apart from each other in the second direction y and are connected to the first resin side surface 53 and the second resin side surface 54. As shown in FIGS. 1 , 3 , and 5 , the third resin side surface 55 is located on the y1 side of the second direction y and faces the y1 side of the second direction y. A portion of each of the multiple first lead terminals 22 protrudes from the third resin side surface 55. The fourth resin side surface 56 is located on the y2 side in the second direction y and faces the y2 side in the second direction y. A portion of each of the plurality of second lead terminals 23 protrudes from the fourth resin side surface 56.

[0058] As shown in FIGS. 3 , 4 , and 6 , the first resin side surface 53 includes a first upper portion 531, a first lower portion 532, and a first intermediate portion 533. The first upper portion 531 is connected to the resin main surface 51 on the z1 side in the thickness direction z and connected to the first intermediate portion 533 on the z2 side in the thickness direction z. The first upper portion 531 is inclined with respect to the resin main surface 51. The first lower portion 532 is connected to the resin back surface 52 on the z2 side in the thickness direction z and connected to the first intermediate portion 533 on the z1 side in the thickness direction z. The first lower portion 532 is inclined with respect to the resin back surface 52. The first intermediate portion 533 is connected to the first upper portion 531 on the z1 side in the thickness direction z and connected to the first lower portion 532 on the z2 side in the thickness direction z. The in-plane directions of the first intermediate portion 533 are the thickness direction z and the second direction y. When viewed in the thickness direction z, the first intermediate portion 533 is located outward from the resin main surface 51 and the resin back surface 52 .

[0059] 3 , a first gate mark 591 is formed on the first resin side surface 53. The first gate mark 591 has a rougher surface than other regions of the first resin side surface 53 excluding the first gate mark 591. The first gate mark 591 appears when the sealing resin 5 is cut at the first gate 891 in the step of forming the sealing resin 5 in the manufacturing process of the electronic device A1, which will be described later. In the electronic device A1, the first gate mark 591 includes a region located in the first lower portion 532 and a region located in the first intermediate portion 533. The first gate mark 591 is located at the center of the first resin side surface 53 in the second direction y.

[0060] As shown in FIGS. 2 and 9 , the first extension portion 223 of the one-end first terminal 22A includes a portion located inward from the first gate mark 591 in the second direction y when viewed in the thickness direction z. The second extension portion 233 of the one-end second terminal 23A includes a portion located inward from the first gate mark 591 in the second direction y when viewed in the thickness direction z. The first extension portion 223 and the second extension portion 233 are located closest to the first gate mark 591 in the first direction x on the conductive support member 2. The portions of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y when viewed in the thickness direction z correspond to an example of a “first portion” in the present disclosure. In FIG. 3 , the portions (first portions) of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y are hatched.

[0061] 3 , in this embodiment, as viewed in the first direction x, a portion of the first extending portion 223 that is located more inward than the first gate mark 591 in the second direction y overlaps with the first gate mark 591. As viewed in the first direction x, a portion of the second extending portion 233 that is located more inward than the first gate mark 591 in the second direction y overlaps with the first gate mark 591. In the illustrated example, the entire portions of the first extending portion 223 and the second extending portion 233 that are located more inward than the first gate mark 591 in the second direction y overlap with the first gate mark 591 as viewed in the first direction x.

[0062] In this embodiment, the first gate mark 591 and portions (first portions) of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y satisfy the following relationship. In this embodiment, regarding the relationship between the distance (first distance D1) in the first direction x between the first gate mark 591 and portions of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y and the length (first dimension L1) of the first gate mark 591 in the thickness direction z (see FIGS. 3 and 9 ), the ratio of the first distance D1 to the first dimension L1 is, for example, in the range of more than 0% and not more than 500%, preferably in the range of 40 to 200%. A specific value of the first distance D1 is, for example, more than 0 mm and not more than 2.4 mm, preferably 0.21 to 1.0 mm. In the example illustrated in this embodiment, the first distance D1 is approximately 0.35 mm. In the illustrated example, the first dimension L1 is about 0.5 mm.

[0063] The length of the first gate mark 591 in the second direction y (second dimension L2) and the first distance D1 are in a relationship where, as one of them becomes relatively large, the other becomes relatively small (see FIG. 3). The second dimension L2 is, for example, 1.0 to 5.0 mm, and the product of the second dimension L2 and the first distance D1 is, for example, 0.21 to 5.0 mm. 2 In the illustrated example of this embodiment, the second dimension L2 is about 3.0 mm.

[0064] When viewed in the first direction x, the ratio of the area (area S2) of the portions (first portions) of the first extending portion 223 and the second extending portion 233 that are located inward from the first gate mark 591 in the second direction y and that overlap with the first gate mark 591 to the area (area S1) of the first gate mark 591 is greater than 0% and not more than 50% (see FIG. 3 ). In the example illustrated in the present embodiment, the ratio of the area S2 of the portions (first portions) of the first extending portion 223 and the second extending portion 233 that are located inward from the first gate mark 591 in the second direction y and that overlap with the first gate mark 591 to the area S1 of the first gate mark 591 is approximately 30%.

[0065] The ratio of the length in the second direction y (third dimension L3) of the portion (first portion) of the first extension portion 223 and the second extension portion 233 that is located inward from the first gate mark 591 in the second direction y to the second dimension L2 is 50 to 100% (see FIG. 3). The ratio of the first distance D1 to the second dimension L2 is greater than 0% and not more than 50% (see FIGS. 3 and 9). In the example illustrated in this embodiment, the third dimension L3 is approximately 2.5 mm.

[0066] In this embodiment, the ratio of the first distance D1 to the dimension (fourth dimension L4) in the thickness direction z between the resin main surface 51 and the resin back surface 52 is greater than 0% and not more than 70% (see FIGS. 3 and 9).

[0067] As shown in FIGS. 4 to 6 , the second resin side surface 54 includes a second upper portion 541, a second lower portion 542, and a second intermediate portion 543. The second upper portion 541 is connected to the resin main surface 51 on the z1 side in the thickness direction z and connected to the second intermediate portion 543 on the z2 side in the thickness direction z. The second upper portion 541 is inclined with respect to the resin main surface 51. The second lower portion 542 is connected to the resin back surface 52 on the z2 side in the thickness direction z and connected to the second intermediate portion 543 on the z1 side in the thickness direction z. The second lower portion 542 is inclined with respect to the resin back surface 52. The second intermediate portion 543 is connected to the second upper portion 541 on the z1 side in the thickness direction z and connected to the second lower portion 542 on the z2 side in the thickness direction z. The in-plane directions of the second intermediate portion 543 are the thickness direction z and the second direction y. When viewed in the thickness direction z, the second intermediate portion 543 is located outward from the resin main surface 51 and the resin back surface 52 .

[0068] 5 , a second gate mark 592 is formed on the second resin side surface 54. The second gate mark 592 has a rougher surface than other regions of the second resin side surface 54 excluding the second gate mark 592. The second gate mark 592 appears when the sealing resin 5 is cut at the second gate 892 in the step of forming the sealing resin 5 in the manufacturing process of the electronic device A1, which will be described later. In the electronic device A1, the second gate mark 592 includes a region located in the second lower portion 542 and a region located in the second intermediate portion 543. The second gate mark 592 is located at the center of the second resin side surface 54 in the second direction y.

[0069] As shown in FIGS. 3 to 5 , the third resin side surface 55 includes a third upper portion 551, a third lower portion 552, and a third intermediate portion 553. The third upper portion 551 is connected to the resin main surface 51 on its z1 side in the thickness direction z and connected to the third intermediate portion 553 on its z2 side in the thickness direction z. The third upper portion 551 is inclined with respect to the resin main surface 51. The third lower portion 552 is connected to the resin back surface 52 on its z2 side in the thickness direction z and connected to the third intermediate portion 553 on its z1 side in the thickness direction z. The third lower portion 552 is inclined with respect to the resin back surface 52. The third intermediate portion 553 is connected to the third upper portion 551 on its z1 side in the thickness direction z and connected to the third lower portion 552 on its z2 side in the thickness direction z. The in-plane directions of the third intermediate portion 553 are the thickness direction z and the first direction x. When viewed in the thickness direction z, the third intermediate portion 553 is located outward from the resin main surface 51 and the resin back surface 52. From the third intermediate portion 553, a portion of each of the plurality of first lead terminals 22 is exposed.

[0070] As shown in FIGS. 3 , 5 , and 6 , the fourth resin side surface 56 includes a fourth upper portion 561, a fourth lower portion 562, and a fourth intermediate portion 563. The fourth upper portion 561 is connected to the resin main surface 51 on the z1 side in the thickness direction z and connected to the fourth intermediate portion 563 on the z2 side in the thickness direction z. The fourth upper portion 561 is inclined with respect to the resin main surface 51. The fourth lower portion 562 is connected to the resin back surface 52 on the z2 side in the thickness direction z and connected to the fourth intermediate portion 563 on the z1 side in the thickness direction z. The fourth lower portion 562 is inclined with respect to the resin back surface 52. The fourth intermediate portion 563 is connected to the fourth upper portion 561 on the z1 side in the thickness direction z and connected to the fourth lower portion 562 on the z2 side in the thickness direction z. The in-plane directions of the fourth intermediate portion 563 are the thickness direction z and the first direction x. When viewed in the thickness direction z, the fourth intermediate portion 563 is located outward from the resin main surface 51 and the resin back surface 52. From the fourth intermediate portion 563, a portion of each of the plurality of second lead terminals 23 is exposed.

[0071] A motor driver circuit in an inverter device typically includes a half-bridge circuit including a low-side (low potential side) switching element and a high-side (high potential side) switching element. The following description focuses on the case where these switching elements are MOSFETs. In the low-side switching element, the reference potentials of the source of the switching element and the gate driver driving the switching element are both ground. In the high-side switching element, the reference potentials of the source of the switching element and the gate driver driving the switching element are both equivalent to the potential at the output node of the half-bridge circuit. The potential at the output node changes depending on the driving of the high-side and low-side switching elements, so the reference potential of the gate driver driving the high-side switching element also changes. When the high-side switching element is on, the reference potential is equivalent to the voltage applied to the drain of the high-side switching element (e.g., 600 V or higher). In the electronic device A1, the ground of the first semiconductor element 11 and the ground of the second semiconductor element 13 are separated. Therefore, when the electronic device A1 is used as a gate driver for driving a high-side switching element, a voltage equivalent to the voltage applied to the drain of the high-side switching element is transiently applied to the ground of the second semiconductor element 13.

[0072] Next, an example of a method for manufacturing the electronic device A1 will be described below with reference to Figures 10 to 12. Figures 10 to 12 are plan views showing a step in the method for manufacturing the electronic device A1.

[0073] First, as shown in FIG. 10 , a lead frame 81 is prepared. The lead frame 81 is a plate-shaped material. In this embodiment, the base material of the lead frame 81 is copper. The lead frame 81 may be formed by etching a metal plate or by punching a metal plate. The lead frame 81 has a main surface 81A and a back surface 81B separated in the thickness direction z. The lead frame 81 includes an outer frame 811, a first die pad 812A, a second die pad 812B, a plurality of first leads 813, a plurality of second leads 814, a plurality of support leads 815, a dam bar 816, and a plurality of extensions 817. Of these, the outer frame 811 and the dam bar 816 do not constitute the electronic device A1. The first die pad 812A is a portion that will later become the first die pad 21A. The second die pad 812B is a portion that will later become the second die pad 21B. The plurality of first leads 813 are portions that will later become the plurality of first lead terminals 22. The plurality of second leads 814 are portions that will later become the plurality of second lead terminals 23. The plurality of support leads 815 are portions that will later become the first lead portion 221 of the one-end first terminal 22A, the second lead portion 231 of the one-end second terminal 23A, the lead portion 224 of the other-end first terminal 22B, and the lead portion 234 of the other-end second terminal 23B. The plurality of extension portions 817 are portions that will later become the first extension portion 223 of the one-end first terminal 22A and the second extension portion 233 of the one-end second terminal 23A.

[0074] 11, the first semiconductor element 11 and the insulating element 12 are bonded to the first die pad 812A by die bonding, and the second semiconductor element 13 is bonded to the second die pad 812B by die bonding. After these steps, each of the plurality of wires 31 to 34 is formed by wire bonding.

[0075] Next, the encapsulating resin 5 is formed by transfer molding. In this process, the lead frame 81 is placed in a mold having multiple cavities. At this time, the portion of the lead frame 81 that corresponds to the conductive support member 2 of the electronic device A1 and that is covered by the encapsulating resin 5 is placed in one of the multiple cavities. Then, fluidized resin is poured from a pot through a runner into each of the multiple cavities. As shown in FIG. 12 , the lead frame 81 is provided with a first gate 891 and a second gate 892. In each cavity 88, the first gate 891 is an inlet for the fluidized resin. In each cavity 88, the second gate 892 is an outlet for the fluidized resin. After the fluidized encapsulating resin 5 in the multiple cavities 88 is solidified, resin burrs located outside each of the multiple cavities 88 are removed using high-pressure water or the like. When the resin burrs located at the first gate 891 are removed, a first gate mark 591 is formed in the encapsulating resin 5. Similarly, when the resin burrs located at the second gate 892 are removed, second gate marks 592 are formed in the sealing resin 5. In this way, the formation of the sealing resin 5 is completed.

[0076] Thereafter, dicing is performed to separate the first die pad 812A, the second die pad 812B, the plurality of first leads 813, the plurality of second leads 814, and the plurality of support leads 815, which have been connected to each other by the outer frame 811 and the dam bar 816. By going through the steps described above, the electronic device A1 is manufactured.

[0077] Next, the effects of the electronic device A1 will be described.

[0078] The electronic device A1 includes a conductive support member 2, multiple electronic elements 1 arranged on the z1 side of the conductive support member 2 in the thickness direction z, and a sealing resin 5. The sealing resin 5 covers the multiple electronic elements 1 and a portion of the conductive support member 2. The sealing resin 5 has a first resin side surface 53 facing the x1 side in the first direction x. A first gate mark 591 having a rougher surface than other regions of the first resin side surface 53 is formed on the first resin side surface 53. The one-end first terminal 22A (one of the multiple first lead terminals 22 constituting the conductive support member 2) has a first extension portion 223, and the one-end second terminal 23A (one of the multiple second lead terminals 23 constituting the conductive support member 2) has a second extension portion 233. The first extension portion 223 and the second extension portion 233 are located on the conductive support member 2 closest to the first gate mark 591 in the first direction x. When viewed in the thickness direction z, the first extending portion 223 and the second extending portion 233 include a portion (first portion) located in the second direction y more inward than the first gate mark 591. Regarding the relationship between the distance (first distance D1) in the first direction x between the first gate mark 591 and the portion (first portion) of the first extending portion 223 and the second extending portion 233 located inward than the first gate mark 591 in the second direction y, and the length (first dimension L1) of the first gate mark 591 in the thickness direction z, the ratio of the first distance D1 to the first dimension L1 is greater than 0% and not more than 500%.

[0079] According to this configuration, the portions (first portions) of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y are located relatively close to the first gate mark 591. In the process of forming the sealing resin 5, when fluidized resin flows in force from the gate corresponding to the first gate mark 591, the fluidized resin fills the cavity while entraining air. In this embodiment, the portions (first portions) of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y are located relatively close to the first gate mark 591 as described above. As a result, when the resin collides with the portions (first portions) of the first extension portion 223 and the second extension portion 233, the flow rate of the fluidized resin is reduced, making it less likely to entrain air. This prevents pinholes (voids) from being formed due to air entrainment, and prevents improper filling of the sealing resin 5. Even if the fluidized resin flowing in from the gate during the formation of the sealing resin 5 entrains air, if the portions (first portions) of the first extension portion 223 and the second extension portion 233 that are located inward from the first gate mark 591 in the second direction y are configured to be relatively close to the first gate mark 591, the resin will collide with those portions (first portions) of the first extension portion 223 and the second extension portion 233, thereby breaking down the air entrained in the resin and suppressing the occurrence of pinholes.

[0080] The distance (first distance D1) in the first direction x between the first gate mark 591 and the portions (first portions) of the first extending portion 223 and the second extending portion 233 that are positioned inward from the first gate mark 591 in the second direction y is greater than 0 mm and not more than 2.4 mm. With this configuration, it is possible to significantly suppress the occurrence of pinholes when the sealing resin 5 is formed.

[0081] The length of the first gate mark 591 in the second direction y (second dimension L2) and the first distance D1 are in a relationship where one becomes relatively larger and the other becomes relatively smaller. The product of the length of the first gate mark 591 in the second direction y (second dimension L2) and the first distance D1 is 0.21 to 5.0 mm. 2According to this configuration, when forming the sealing resin 5, it is possible to suppress the occurrence of pinholes while maintaining an appropriate resin filling speed (amount of resin filled per unit time).

[0082] As viewed in the first direction x, portions (first portions) of the first extending portion 223 and the second extending portion 233 located inward from the first gate mark 591 in the second direction y overlap with the first gate mark 591. As viewed in the first direction x, the ratio of the area (area S2) of the portions (first portions) of the first extending portion 223 and the second extending portion 233 located inward from the first gate mark 591 in the second direction y that overlap with the first gate mark 591 to the area (area S1) of the first gate mark 591 is greater than 0% and not more than 50%. With this configuration, when forming the sealing resin 5, the resin can be more accurately collided with the corresponding portions (first portions) of the first extending portion 223 and the second extending portion 233. This is advantageous in terms of suppressing pinholes in the sealing resin 5 and further suppressing poor filling of the sealing resin 5.

[0083] The ratio of the length in the second direction y (third dimension L3) of the portion (first portion) of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y to the length in the second direction y (second dimension L2) of the first gate mark 591 is 50 to 100%. The ratio of the first distance D1 to the second dimension L2 is greater than 0% and less than 50%. The ratio of the first distance D1 to the dimension in the thickness direction z between the resin main surface 51 and the resin back surface 52 (fourth dimension L4) is greater than 0% and less than 70%. With this configuration, even if the second dimension L2, third dimension L3, fourth dimension L4, etc. vary depending on the size of the electronic device A1, the occurrence of pinholes during the formation of the sealing resin 5 can be significantly suppressed.

[0084] The multiple electronic elements 1 include a first semiconductor element 11 (first electronic element), a second semiconductor element 13 (second electronic element), and an insulating element 12. The first semiconductor element 11 and the first die pad 21A form a first circuit, and the second semiconductor element 13 and the second die pad 21B form a second circuit. The insulating element 12 is mounted on either the first die pad 21A or the second die pad 21B, relays signal transmission and reception between the first circuit and the second circuit, and insulates the first circuit and the second circuit from each other. With the electronic device A1 configured in this manner, pinholes are suppressed in the sealing resin 5 as described above, and a decrease in the dielectric strength voltage of each separated portion of the conductive support member 2 can be prevented.

[0085] First Modification of First Embodiment: Figures 13 and 14 show an electronic device according to a first modification of the first embodiment. Figure 13 is a plan view showing an electronic device A11 of this modification. Figure 14 is a partial enlarged view of Figure 13. In Figure 13, the sealing resin 5 is shown transparently for ease of understanding. In Figure 13 and subsequent figures, elements that are the same as or similar to those of the electronic device A1 of the above embodiment are given the same reference numerals as in the above embodiment, and descriptions thereof will be omitted where appropriate.

[0086] In the electronic device A11 of this modified example, the configurations of the one-end first terminal 22A and the one-end second terminal 23A are different from those of the electronic device A1 of the above embodiment. In the one-end first terminal 22A, the first extending portion 223 is located on the x1 side in the first direction x with respect to the first lead portion 221. In the one-end second terminal 23A, the second extending portion 233 is located on the x1 side in the first direction x with respect to the second lead portion 231. The first extending portion 223 and the second extending portion 233 are located on the x1 side in the first direction x with respect to the electronic device A1 of the above embodiment. As a result, for the portion (first portion) of the first extension portion 223 and the second extension portion 233 that is located inward from the first gate mark 591 in the second direction y, the first distance D1 in the first direction x between the first gate mark 591 and that portion is smaller than the first distance D1 in the electronic device A1.

[0087] In the electronic device A11 of this modified example, the portions (first portions) of the first extension portion 223 and the second extension portion 233 that are located inward from the first gate mark 591 in the second direction y are located relatively close to the first gate mark 591. In the process of forming the sealing resin 5, when fluidized resin flows in forcefully from the gate corresponding to the first gate mark 591, the fluidized resin fills the cavity while entraining air. In the present embodiment, the portions (first portions) of the first extension portion 223 and the second extension portion 233 that are located inward from the first gate mark 591 in the second direction y are located relatively close to the first gate mark 591 as described above. As a result, when the resin collides with the portions (first portions) of the first extension portion 223 and the second extension portion 233, the flow rate of the fluidized resin is reduced, making it less likely to entrain air. This makes it possible to suppress the occurrence of pinholes (voids) due to the entrapment of air and to suppress imperfect filling of the sealing resin 5. Even if air is entrapped in the fluidized resin flowing in from the gate during the formation of the sealing resin 5, with the configuration in which the portions (first portions) of the first extending portion 223 and the second extending portion 233 that are located more inward than the first gate mark 591 in the second direction y are arranged relatively close to the first gate mark 591, the resin collides with the portions (first portions) of the first extending portion 223 and the second extending portion 233, thereby breaking down the air entrapped in the resin and suppressing the occurrence of pinholes.

[0088] In the electronic device A11 of this modification, the first extension portion 223 of the one-end first terminal 22A is located closer to the x1 side in the first direction x than the first lead portion 221. The second extension portion 233 of the one-end second terminal 23A is located closer to the x1 side in the first direction x than the second lead portion 231. This reduces the first distance D1 in the first direction x between the first gate mark 591 and the first portion (first portion) of the first extension portion 223 and the second extension portion 233 located inward from the first gate mark 591 in the second direction y. This configuration is advantageous for suppressing pinholes in the sealing resin 5 and further suppressing insufficient filling of the sealing resin 5. The electronic device A11 also achieves the same effects as the electronic device A1 of the above embodiment.

[0089] Second Embodiment: An electronic device according to a second embodiment of the present disclosure will be described with reference to FIGS. 15 to 23 . The electronic device A2 of this embodiment includes a plurality of electronic elements 1, a conductive support member 2, a plurality of wires 41 to 46, and a sealing resin 5. The specific use of the electronic device A2 is not limited in any way, but it may be used, for example, to detect the battery voltage of an electric vehicle. The electronic device A2 does not necessarily detect the battery voltage of an electric vehicle; it may also detect a voltage other than that of an electric vehicle, or it may detect a voltage used in industrial equipment, home appliances, or power supplies, rather than electric vehicles. The electronic device A1 is a surface-mount semiconductor package, and in this embodiment, the package format is a small outline package (SOP), as shown in FIGS. 1 to 8 .

[0090] 15 and 16 are plan views showing the electronic device A2 of this embodiment. FIG. 17 is a front view showing the electronic device A2. FIG. 18 is a left side view showing the electronic device A2. FIG. 19 is a rear view showing the electronic device A2. FIG. 20 is a right side view showing the electronic device A2. FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 16. FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 16. FIG. 23 is a circuit configuration diagram of the electronic device A2. For ease of understanding, FIG. 16 shows the sealing resin 5 through which light passes. In FIG. 16, the through sealing resin 5 is indicated by imaginary lines.

[0091] In the description of the electronic device A2, three mutually orthogonal directions, i.e., a thickness direction z, a first direction x, and a second direction y, will be referred to as appropriate. As shown in Figures 15 and 16, the electronic device A2 has a rectangular (or approximately rectangular) shape when viewed in the thickness direction z (in a plan view).

[0092] The conductive support member 2 is a member that forms a conductive path between multiple electronic elements 1 and a circuit board of an electric vehicle or the like in the electronic device A2. The conductive support member 2 includes a metal such as copper, nickel, or iron (Fe). As shown in FIGS. 15 and 16 , the conductive support member 2 includes a die pad portion 21, multiple first lead terminals 25, and multiple second lead terminals 26. The conductive support member 2 is obtained from the same lead frame. The conductive support member 2 is formed, for example, by processing a metal plate material selected from punching, bending, etching, and the like. A plating layer made of silver, nickel, gold, or the like may be provided at appropriate locations on each of the conductive support member 2 (the die pad portion 21, multiple first lead terminals 25, and multiple second lead terminals 26) as needed.

[0093] The die pad portion 21 supports a plurality of electronic elements 1. In this embodiment, the die pad portion 21 has a first die pad 21A and a second die pad 21B. The first die pad 21A is disposed on the y1 side in the second direction y. The second die pad 21B is disposed on the y2 side in the second direction y. The first die pad 21A and the second die pad 21B are spaced apart from each other in the second direction y. The die pad portion 21 (each of the first die pad 21A and the second die pad 21B) has a mounting surface 211 facing the z1 side in the thickness direction z. There are no limitations on the planar shape of each of the first die pad 21A and the second die pad 21B, but in the illustrated example, they are rectangular.

[0094] The plurality of first lead terminals 25 are components that are joined to a circuit board of an electric vehicle or the like to form a conductive path between the electronic device A1 and the circuit board. As shown in Figures 15, 16, and 18, the plurality of first lead terminals 25 are arranged at intervals from one another in the first direction x. The plurality of first lead terminals 25 are exposed from the sealing resin 5 (a third resin side surface 55 described below) so as to extend toward the y1 side in the second direction y. The plurality of first lead terminals 25 include a one-end first terminal 25A, an other-end first terminal 25B, and a plurality of intermediate first terminals 26C.

[0095] The one-end first terminal 25A is located at the end on the x1 side in the first direction x of the plurality of first lead terminals 25. As shown in FIG.

[0096] The terminal portion 251 is a portion of the one-end first terminal 25A that is exposed from the sealing resin 5. The terminal portion 251 protrudes from the sealing resin 5 toward the y1 side in the second direction y. In a plan view, the terminal portion 251 has a rectangular shape with the second direction y as its longitudinal direction. As shown in FIG. 17 , the terminal portion 251 is bent in a gull-wing shape when viewed in the first direction x. The tip portion of the terminal portion 251 is a portion that is joined to a circuit board when the electronic device A2 is mounted on the circuit board of an electric vehicle or the like.

[0097] The lead portion 252 is a portion of the one-end first terminal 25A that is covered with the sealing resin 5. The lead portion 252 is connected to the terminal portion 251 and extends from the terminal portion 251 inward into the sealing resin 5. The lead portion 252 is appropriately bent in a plan view and includes a portion that extends in the second direction y, a portion that extends in the first direction x, and a portion that is connected to the two portions and extends in a direction inclined with respect to the second direction y and the first direction x. The end of the lead portion 252 opposite the terminal portion 251 is connected to the first die pad 21A.

[0098] The other-end first terminal 25B is located at the end on the x2 side in the first direction x of the plurality of first lead terminals 25. The other-end first terminal 25B has a terminal portion 254 and a lead portion 255, as shown in FIG.

[0099] The terminal portion 254 is a portion of the other-end first terminal 25B that is exposed from the sealing resin 5. The terminal portion 254 protrudes from the sealing resin 5 toward the y1 side in the second direction y. In a plan view, the terminal portion 254 has a rectangular shape with the second direction y as its longitudinal direction. As shown in FIG. 19 , the terminal portion 254 is bent in a gull-wing shape when viewed in the first direction x. The tip portion of the terminal portion 254 is a portion that is joined to a circuit board when the electronic device A2 is mounted on the circuit board of an electric vehicle or the like.

[0100] The lead portion 255 is a portion of the other-end first terminal 25B that is covered with the sealing resin 5. The lead portion 255 is connected to the terminal portion 254 and extends from the terminal portion 254 inward into the sealing resin 5. The end of the lead portion 255 opposite the terminal portion 254 is connected to the first die pad 21A.

[0101] 16 and 18, the multiple intermediate first terminals 25C are arranged between the one-end first terminals 25A and the other-end first terminals 25B. As shown in FIG. 16, each of the multiple intermediate first terminals 25C includes a terminal portion 256 and a lead portion 257. Thus, the electronic device A2 includes multiple terminal portions 256 and multiple lead portions 257. Unless otherwise specified, the terminal portion 256 and the lead portion 257 described below are common to all intermediate first terminals 25C.

[0102] The terminal portion 256 is a portion of each intermediate first terminal 25C that is exposed from the sealing resin 5. Each terminal portion 254 protrudes from the sealing resin 5 toward the y1 side in the second direction y. In a plan view, each terminal portion 256 is strip-shaped with the second direction y as its longitudinal direction. The multiple terminal portions 256 are arranged at equal intervals along the first direction x. As shown in FIG. 21 and other figures, each terminal portion 256 is bent in a gull-wing shape when viewed in the first direction x. The multiple terminal portions 256 overlap each other when viewed in the first direction x. The tip portion of each terminal portion 256 is a portion that is joined to a circuit board when the electronic device A2 is mounted on the circuit board of an electric vehicle or the like.

[0103] The lead portion 257 is a portion of each intermediate first terminal 25C that is covered with the sealing resin 5. The lead portion 257 is connected to the terminal portion 256 and extends from the terminal portion 256 inwardly of the sealing resin 5.

[0104] The second lead terminals 26 are components that are joined to a circuit board of an electric vehicle or the like to form a conductive path between the electronic device A1 and the circuit board. As shown in Figures 15, 16, and 20, the second lead terminals 26 are arranged at intervals in the first direction x. The second lead terminals 26 are exposed from the sealing resin 5 (a fourth resin side surface 56 described below) so as to extend toward the y2 side in the second direction y. The second lead terminals 26 include a first end second terminal 26A and an other end second terminal 26B.

[0105] The one-end second terminal 26A is located at the end on the x1 side in the first direction x of the plurality of second lead terminals 26. The one-end second terminal 26A has a terminal portion 261 and a lead portion 262, as shown in FIG.

[0106] The terminal portion 261 is a portion of the one-end second terminal 26A that is exposed from the sealing resin 5. The terminal portion 261 protrudes from the sealing resin 5 toward the y2 side in the second direction y. In a plan view, the terminal portion 261 has a rectangular shape with the second direction y as its longitudinal direction. As shown in FIG. 17 , the terminal portion 261 is bent in a gull-wing shape when viewed in the first direction x. The tip portion of the terminal portion 261 is a portion that is joined to a circuit board when the electronic device A2 is mounted on the circuit board of an electric vehicle or the like.

[0107] The lead portion 262 is a portion of the one-end second terminal 26A that is covered with the sealing resin 5. The lead portion 262 is connected to the terminal portion 261 and extends from the terminal portion 261 inward into the sealing resin 5. The lead portion 262 is appropriately bent in a plan view, and includes a portion that extends in the second direction y and a portion that extends in the first direction x.

[0108] The other-end second terminal 26B is located at the end on the x2 side in the first direction x of the plurality of second lead terminals 26. The other-end second terminal 26B has a terminal portion 264 and a lead portion 265, as shown in FIG.

[0109] The terminal portion 264 is a portion of the other-end second terminal 26B that is exposed from the sealing resin 5. The terminal portion 264 protrudes from the sealing resin 5 toward the y2 side in the second direction y. In a plan view, the terminal portion 264 has a rectangular shape with the second direction y as its longitudinal direction. As shown in FIG. 19 , the terminal portion 264 is bent in a gull-wing shape when viewed in the first direction x. The tip portion of the terminal portion 264 is a portion that is joined to a circuit board when the electronic device A2 is mounted on the circuit board of an electric vehicle or the like.

[0110] The lead portion 265 is a portion of the other-end second terminal 26B that is covered with the sealing resin 5. The lead portion 265 is connected to the terminal portion 264 and extends from the terminal portion 264 inward into the sealing resin 5. The end of the lead portion 265 opposite the terminal portion 264 is connected to the second die pad 21B.

[0111] In the electronic device A2, the shapes and positional relationships of the conductive support member 2 (first die pad 21A, second die pad 21B, multiple first lead terminals 25, and multiple second lead terminals 26) are not limited to the example shown in the figure, and can be changed as appropriate depending on the specifications of the electronic device A2.

[0112] The electronic elements 1 are elements that perform electrical functions in the electronic device A2. While the specific functions of the electronic elements 1 are not limited in any way, in this embodiment, the electronic elements 1 have a function of detecting voltage. In the illustrated example, the electronic elements 1 include a first electronic element 14 and a second electronic element 15 that are separated from each other.

[0113] The second electronic element 15 is mounted on the mounting surface 211 of the second die pad 21B. In this embodiment, the second electronic element 15 outputs a first signal corresponding to the potential of the other-end second terminal 26B and a second signal corresponding to the potential of the one-end second terminal 26A to the first electronic element 14. The second electronic element 15 has a plurality of electrodes 151, 152, and 153 arranged on its upper surface in the thickness direction z.

[0114] The first electronic element 14 is mounted on the first die pad 21A. In this embodiment, the first electronic element 14 receives the first signal and the second signal from the second electronic element 15 and outputs a third signal corresponding to the potential difference between the other-end second terminal 26B and the one-end second terminal 26A. In other words, the first electronic element 14 outputs a detection signal (third signal) of the voltage applied between the other-end second terminal 26B and the one-end second terminal 26A. The first electronic element 14 has a plurality of electrodes 141, 142 arranged on its upper surface in the thickness direction z.

[0115] In the electronic device A2, the multiple electronic elements 1 (first electronic element 14 and second electronic element 15) have a circuit configuration, for example, as shown in Fig. 23. As shown in Fig. 23, the second electronic element 15 includes multiple resistor elements R1 to R4, and the first electronic element 14 includes an operational amplifier OP and a resistor element R5. The circuit configuration of the multiple electronic elements 1 is not limited to the example shown in Fig. 23.

[0116] The two resistor elements R1 and R2 are connected in series. The two resistor elements R1 and R2 divide the voltage at terminal T1 (the potential difference between the potential at terminal T1 and the reference potential of ground GND). In this embodiment, terminal T1 corresponds to each electrode 152. The connection point between the two resistor elements R1 and R2 is connected to the non-inverting input terminal of an operational amplifier OP. The two resistor elements R3 and R4 are connected in series. The two resistor elements R3 and R4 divide the voltage at terminal T2 (the potential difference between the potential at terminal T2 and the reference potential of ground GND). In this embodiment, terminal T2 corresponds to each electrode 151. The connection point between the two resistor elements R3 and R4 is connected to the inverting input terminal of the operational amplifier OP. When the electronic device A2 detects the voltage of a battery installed in an electric vehicle, one of terminal T1 and terminal T2 is electrically connected to the high-potential terminal of the battery, and the other is electrically connected to the low-potential terminal.

[0117] The operational amplifier OP receives a first signal corresponding to the potential of the terminal T1 (in this embodiment, a signal obtained by dividing the voltage at the terminal T1) and a second signal corresponding to the potential of the terminal T2 (in this embodiment, a signal obtained by dividing the voltage at the terminal T2), and outputs a third signal corresponding to the potential difference between the terminals T1 and T2. The resistor element R5 is an element (feedback resistor) for determining the amplification gain of the operational amplifier OP, and one end of the resistor element R5 is connected to the inverting input terminal of the operational amplifier OP, and the other end is connected to the output terminal of the operational amplifier OP. The first electronic element 14 does not necessarily have to include the resistor element R5.

[0118] The wires 41 to 46 electrically connect the mutually separated portions. Each of the wires 41 to 46 is a bonding wire. Each of the wires 41 to 46 contains, for example, any of gold, aluminum, and copper.

[0119] 16 , the wire 41 is joined to the electrode 151 of the second electronic element 15 and the lead portion 265, and electrically connects the second electronic element 15 to the other-end second terminal 26B. In other words, the terminal portion 264 of the other-end second terminal 26B is electrically connected to the second electronic element 15 via the wire 41.

[0120] 16 , the wire 42 is joined to the electrode 152 of the second electronic element 15 and the lead portion 262, and electrically connects the second electronic element 15 and the one-end second terminal 26A. In other words, the terminal portion 261 of the one-end second terminal 26A is electrically connected to the second electronic element 15 via the wire 42.

[0121] 16 , each of the plurality of wires 43 is joined to the electrode 141 of the first electronic element 14 and one of the plurality of lead portions 257, and electrically connects the first electronic element 14 to one of the plurality of intermediate first terminals 25C. In other words, each terminal portion 256 of the plurality of intermediate first terminals 25C is electrically connected to the first electronic element 14 via one of the plurality of wires 43.

[0122] 16 , the wire 44 is joined to the electrode 141 of the first electronic element 14 and the lead portion 255, and electrically connects the first electronic element 14 and the other-end first terminal 25B. In other words, the terminal portion 254 of the other-end first terminal 25B is electrically connected to the first electronic element 14 via the wire 44.

[0123] 16 , the wire 45 is joined to the electrode 141 of the first electronic element 14 and the lead portion 252, and electrically connects the first electronic element 14 and the one-end first terminal 25A. In other words, the terminal portion 251 of the one-end first terminal 25A is electrically connected to the first electronic element 14 via the wire 45.

[0124] 16 , the plurality of wires 46 are joined to the electrodes 153 of the second electronic element 15 and the electrodes 142 of the first electronic element 14, electrically connecting the second electronic element 15 and the first electronic element 14. Thus, the plurality of wires 46 are transmission paths for the first signal and the second signal.

[0125] The sealing resin 5 covers the die pad portion 21 (the first die pad 21A and the second die pad 21B), a portion of each of the plurality of first lead terminals 22 and the plurality of second lead terminals 23, the plurality of electronic elements 1 (the first electronic element 14 and the second electronic element 15), and the plurality of wires 41 to 46. The sealing resin 5 includes an insulating material such as an epoxy resin. Preferably, the sealing resin 5 is made of a resin material having a comparative tracking index (CTI) of 600 V or more. The sealing resin 5 has, for example, a rectangular parallelepiped shape. The dimension of the sealing resin 5 along the first direction x is, for example, 5 mm to 15 mm, and the dimension along the second direction y is, for example, 3 mm to 13 mm.

[0126] As shown in FIGS. 17 to 20, the sealing resin 5 has a resin main surface 51, a resin rear surface 52, a first resin side surface 53, a second resin side surface 54, a third resin side surface 55, and a fourth resin side surface 56.

[0127] 17 to 20 , the resin main surface 51 and the resin back surface 52 are located apart from each other in the thickness direction z. The resin main surface 51 and the resin back surface 52 face opposite each other in the thickness direction z. The resin main surface 51 faces the z1 side in the thickness direction z, and the resin back surface 52 faces the z2 side in the thickness direction z. Each of the resin main surface 51 and the resin back surface 52 is flat (or approximately flat).

[0128] As shown in FIGS. 17 to 20 , the first resin side surface 53, the second resin side surface 54, the third resin side surface 55, and the fourth resin side surface 56 are connected to the resin main surface 51 and the resin back surface 52, respectively, and are sandwiched between the resin main surface 51 and the resin back surface 52 in the thickness direction z. As shown in FIGS. 15 , 18 , and 20 , the first resin side surface 53 is located on the x1 side of the first direction x and faces the x1 side of the first direction x. The second resin side surface 54 is located on the x2 side of the first direction x and faces the x2 side of the first direction x. The third resin side surface 55 and the fourth resin side surface 56 are located apart from each other in the second direction y and are connected to the first resin side surface 53 and the second resin side surface 54. As shown in FIGS. 15 , 17 , and 19 , the third resin side surface 55 is located on the y1 side of the second direction y and faces the y1 side of the second direction y. A portion of each of the plurality of first lead terminals 22 protrudes from the third resin side surface 55. The fourth resin side surface 56 is located on the y2 side in the second direction y and faces the y2 side in the second direction y. A portion of each of the plurality of second lead terminals 23 protrudes from the fourth resin side surface 56.

[0129] 17 , a first gate mark 591 is formed on the first resin side surface 53. The first gate mark 591 has a rougher surface than other regions of the first resin side surface 53 excluding the first gate mark 591. The first gate mark 591 appears by cutting the sealing resin 5 at the first gate 891, similar to the step of forming the sealing resin 5 (see FIG. 12 ) in the manufacturing process of the electronic device A1 described above. The first gate mark 591 is located slightly shifted toward the y2 side in the second direction y from the center of the first resin side surface 53 in the second direction y.

[0130] 16 , the lead portion 262 of the one-end second terminal 26A includes an inner portion 262a, which is a portion located inward from the first gate mark 591 in the second direction y when viewed in the thickness direction z. The inner portion 262a is located closest to the first gate mark 591 in the first direction x of the conductive support member 2. This inner portion 262a corresponds to an example of the "first portion" of the present disclosure. In FIGS. 16 and 17 , the inner portion 262a is hatched.

[0131] 17 , in the present embodiment, when viewed in the first direction x, the inner portion 262a (first portion) overlaps with the first gate mark 591. In the illustrated example, the entire inner portion 262a overlaps with the first gate mark 591 when viewed in the first direction x.

[0132] In this embodiment, the first gate mark 591 and the inner portion 262a (first portion) satisfy the following relationship. Regarding the relationship between the distance (first distance D1) between the first gate mark 591 and the inner portion 262a in the first direction x and the length (first dimension L1) of the first gate mark 591 in the thickness direction z (see FIGS. 16 and 17 ), the ratio of the first distance D1 to the first dimension L1 is, for example, in the range of more than 0% and not more than 500%, preferably in the range of 40 to 200%. A specific value of the first distance D1 is, for example, in the range of more than 0 mm and not more than 2.4 mm, preferably in the range of 0.21 to 1.0 mm. In the illustrated example of this embodiment, the first distance D1 is approximately 0.35 mm. In the illustrated example, the first dimension L1 is approximately 0.5 mm.

[0133] The length of the first gate mark 591 in the second direction y (second dimension L2) and the first distance D1 are in a relationship where, as one of them becomes relatively large, the other becomes relatively small (see FIG. 17). The second dimension L2 is, for example, about 1.0 to 5.0 mm, and the product of the second dimension L2 and the first distance D1 is 0.21 to 5.0 mm. 2 In the illustrated example of this embodiment, the second dimension L2 is about 3.0 mm.

[0134] When viewed in the first direction x, the ratio of the area (area S2) of the portion of the inner portion 262a (first portion) that overlaps with the first gate mark 591 to the area (area S1) of the first gate mark 591 is greater than 0% and not more than 50% (see FIG. 17 ). In the example illustrated in the present embodiment, the ratio of the area S2 of the portion of the inner portion 262a that overlaps with the first gate mark 591 to the area S1 of the first gate mark 591 is about 15%.

[0135] The ratio of the length of the inner portion 262a (first portion) in the second direction y (third dimension L3) to the second dimension L2 is 50 to 100% (see FIG. 17). The ratio of the first distance D1 to the second dimension L2 is greater than 0% and not more than 50% (see FIGS. 16 and 17). In the example illustrated in the present embodiment, the third dimension L3 is approximately 1.5 mm.

[0136] In this embodiment, the ratio of the first distance D1 to the dimension (fourth dimension L4) in the thickness direction z between the resin main surface 51 and the resin back surface 52 is greater than 0% and not more than 70% (see FIGS. 16 and 17).

[0137] 19 , a second gate mark 592 is formed on the second resin side surface 54. The second gate mark 592 has a rougher surface than other regions of the second resin side surface 54 excluding the second gate mark 592. The second gate mark 592 appears when the sealing resin 5 is cut at the second gate 892 in the step of forming the sealing resin 5 (see FIG. 12 ) in the manufacturing process of the electronic device A1 described above. The second gate mark 592 is located slightly shifted toward the y2 side in the second direction y from the center of the second resin side surface 54 in the second direction y.

[0138] Next, the effects of the electronic device A2 will be described.

[0139] The electronic device A2 includes a conductive support member 2, multiple electronic elements 1 arranged on the z1 side of the conductive support member 2 in the thickness direction z, and a sealing resin 5. The sealing resin 5 covers the multiple electronic elements 1 and a portion of the conductive support member 2. The sealing resin 5 has a first resin side surface 53 facing the x1 side in the first direction x. A first gate mark 591 having a rougher surface than other regions of the first resin side surface 53 is formed on the first resin side surface 53. The one-end second terminal 26A (one of the multiple second lead terminals 26 constituting the conductive support member 2) has a lead portion 262. The lead portion 262 includes an inner portion 262a (first portion) that is located inward from the first gate mark 591 in the second direction y when viewed in the thickness direction z. The inner portion 262a is located closest to the first gate mark 591 in the first direction x of the conductive support member 2. Regarding the relationship between the distance (first distance D1) in the first direction x between the first gate mark 591 and the inner portion 262a (first portion) and the length (first dimension L1) of the first gate mark 591 in the thickness direction z, the ratio of the first distance D1 to the first dimension L1 is greater than 0% and less than 500%.

[0140] According to this configuration, the inner portion 262a (first portion), which is a portion of the lead portion 262 located inward from the first gate mark 591 in the second direction y, is located relatively close to the first gate mark 591. In the process of forming the sealing resin 5, when fluidized resin flows in forcefully from the gate corresponding to the first gate mark 591, the fluidized resin fills the cavity while entraining air. In this embodiment, the inner portion 262a (first portion), which is located inward from the first gate mark 591 in the second direction y, is located relatively close to the first gate mark 591 as described above. As a result, when the resin collides with the inner portion 262a (first portion), the flow rate of the fluidized resin is reduced, making it less likely to entrain air. This prevents pinholes (voids) from being formed due to air entrainment, and prevents improper filling of the sealing resin 5. Even if the fluidized resin flowing in from the gate during the formation of the sealing resin 5 entrains air, by configuring the inner portion 262a (first portion) located inward from the first gate mark 591 in the second direction y to be relatively close to the first gate mark 591, the resin collides with the inner portion 262a (first portion), thereby breaking down the air entrained in the resin and suppressing the occurrence of pinholes.

[0141] The distance (first distance D1) in the first direction x between the first gate mark 591 and the inner portion 262 a (first portion) is greater than 0 mm and is not greater than 2.4 mm. With this configuration, it is possible to significantly suppress the occurrence of pinholes when the sealing resin 5 is formed.

[0142] The length of the first gate mark 591 in the second direction y (second dimension L2) and the first distance D1 are in a relationship where one becomes relatively larger and the other becomes relatively smaller. The product of the length of the first gate mark 591 in the second direction y (second dimension L2) and the first distance D1 is 0.21 to 5.0 mm. 2 According to this configuration, when forming the sealing resin 5, it is possible to suppress the occurrence of pinholes while maintaining an appropriate resin filling speed (amount of resin filled per unit time).

[0143] As viewed in the first direction x, the inner portion 262a (first portion) overlaps with the first gate mark 591. As viewed in the first direction x, the ratio of the area (area S2) of the portion of the inner portion 262a (first portion) overlapping with the first gate mark 591 to the area (area S1) of the first gate mark 591 is greater than 0% and not greater than 50%. With this configuration, when forming the sealing resin 5, the resin can be more accurately collided with the inner portion 262a (first portion). This is advantageous in terms of suppressing the occurrence of pinholes in the sealing resin 5, and can further suppress poor filling of the sealing resin 5.

[0144] The ratio of the length of the inner portion 262a (first portion) in the second direction y (third dimension L3) to the length of the first gate mark 591 in the second direction y (second dimension L2) is 50 to 100%. The ratio of the first distance D1 to the second dimension L2 is greater than 0% and less than 50%. The ratio of the first distance D1 to the dimension in the thickness direction z between the resin main surface 51 and the resin back surface 52 (fourth dimension L4) is greater than 0% and less than 70%. With this configuration, even if the second dimension L2, third dimension L3, fourth dimension L4, etc. vary depending on the size of the electronic device A2, the occurrence of pinholes during the formation of the sealing resin 5 can be significantly suppressed.

[0145] First Modification of Second Embodiment: Fig. 24 shows an electronic device according to a first modification of the first embodiment. Fig. 24 is a plan view showing an electronic device A21 of this modification. For ease of understanding, Fig. 24 shows the sealing resin 5 in a transparent state. In Fig. 24, the transparent sealing resin 5 is shown by imaginary lines. In Fig. 24, elements that are the same as or similar to those of the electronic device A2 of the above embodiment are given the same reference numerals as in the above embodiment, and descriptions thereof will be omitted where appropriate.

[0146] In the electronic device A21 of this modified example, the arrangement and specific shapes of the die pad portion 21 (first die pad 21A and second die pad 21B), the plurality of first lead terminals 25, and the plurality of second lead terminals 26 differ from those of the electronic device A2 of the above embodiment.

[0147] 24 , in the electronic device A21, the die pad portion 21 (the first die pad 21A and the second die pad 21B) is located closer to the x1 side in the first direction x than in the previously described electronic device A2. The end portions of the first die pad 21A and the second die pad 21B on the x1 side in the first direction x are located closest to the first gate mark 591 in the first direction x of the conductive support member 2.

[0148] In the one-end first terminal 25A, the lead portion 252 extends in the second direction y. In a plan view, the lead portion 252 has a rectangular shape with the second direction y as its longitudinal direction. The end of the lead portion 252 opposite the terminal portion 251 is connected to the first die pad 21A. In the one-end second terminal 26A, the lead portion 262 extends in the second direction y. In a plan view, the lead portion 262 has a rectangular shape with the second direction y as its longitudinal direction. The end of the lead portion 262 opposite the terminal portion 261 is connected to the second die pad 21B.

[0149] 24 , the first die pad 21A includes an inner portion 213, which is a portion located inward from the first gate mark 591 in the second direction y, as viewed in the thickness direction z. The second die pad 21B includes an inner portion 214, which is a portion located inward from the first gate mark 591 in the second direction y, as viewed in the thickness direction z. The inner portions 213 and 214 are located closest to the first gate mark 591 in the first direction x, of the conductive support member 2. The inner portions 213 and 214 correspond to an example of a "first portion" in the present disclosure. In FIG. 24 , the inner portions 213 and 214 are hatched.

[0150] In the electronic device A11 of this modified example, the inner portions 213, 214 (first portions) of the first die pad 21A and the second die pad 21B, which are portions located inward from the first gate mark 591 in the second direction y, are located relatively close to the first gate mark 591. In the process of forming the sealing resin 5, when fluidized resin flows in forcefully from the gate corresponding to the first gate mark 591, the fluidized resin fills the cavity while entraining air. In the present embodiment, the inner portions 213, 214 (first portions) of the first die pad 21A and the second die pad 21B, which are located inward from the first gate mark 591 in the second direction y, are located relatively close to the first gate mark 591 as described above. As a result, when the resin collides with the inner portions 213, 214 (first portions), the flow rate of the fluidized resin is reduced, making it less likely to entrain air. This makes it possible to suppress the occurrence of pinholes (voids) due to entrapment of air and to suppress insufficient filling of the sealing resin 5. Even if air is entrapped in the fluidized resin flowing in from the gate during the formation of the sealing resin 5, by configuring the inner portions 213, 214 (first portions) of the first die pad 21A and the second die pad 21B, which are located inward from the first gate mark 591 in the second direction y, to be relatively close to the first gate mark 591, the resin collides with the inner portions 213, 214 (first portions), thereby breaking down the air entrapped in the resin and suppressing the occurrence of pinholes. In addition, the electronic device A21 exhibits the same effects as the electronic device A2 of the above embodiment.

[0151] The electronic device according to the present disclosure is not limited to the above-described embodiment, and the specific configuration of each part of the electronic device according to the present disclosure can be freely modified in various ways.

[0152] The present disclosure includes embodiments described in the following appendices. Appendix 1. An electronic device comprising: a conductive support member; at least one electronic element arranged on one side of the conductive support member in a thickness direction; and a sealing resin covering the at least one electronic element and a portion of the conductive support member, wherein the sealing resin has a first resin side surface facing one side in a first direction perpendicular to the thickness direction, and a first gate mark having a surface rougher than other regions of the first resin side surface is formed on the first resin side surface, the conductive support member includes a first portion located closest to the first gate mark in the first direction and located inward from the first gate mark in a second direction perpendicular to the thickness direction and the first direction, as viewed in the thickness direction, and wherein a ratio of a first distance, which is the distance between the first gate mark and the first portion in the first direction, to a first dimension, which is the length of the first gate mark in the thickness direction, is greater than 0% and not more than 500%. Appendix 2. The electronic device described in Appendix 1, wherein the first distance is greater than 0 mm and not more than 2.4 mm. Appendix 3. The product of a second dimension, which is the length of the first gate mark in the second direction, and the first distance is 0.21 to 5.0 mm. 2Appendix 4. The electronic device of Appendix 2, wherein the first portion overlaps the first gate mark when viewed in the first direction. Appendix 5. The electronic device of Appendix 4, wherein the ratio of an area of ​​the portion of the first portion overlapping the first gate mark to an area of ​​the first gate mark when viewed in the first direction is greater than 0% and not more than 50%. Appendix 6. The electronic device of any of Appendixes 1 to 5, wherein a ratio of a third dimension, which is the length of the first portion in the second direction, to a second dimension, which is the length of the first gate mark in the second direction, is 50 to 100%. Appendix 7. The electronic device of Appendix 1 or 2, wherein the ratio of the first distance to the second dimension, which is the length of the first gate mark in the second direction, is greater than 0% and not more than 50%. Appendix 8. the sealing resin has a resin main surface facing one side in the thickness direction and a resin back surface facing the other side in the thickness direction, and a ratio of the first distance to a fourth dimension, which is the dimension in the thickness direction between the resin main surface and the resin back surface, is greater than 0% and not more than 70%.Supplementary Note 9. The electronic device according to any of Supplementary Note 1 to 8, wherein the conductive support member includes a die pad portion, a plurality of first lead terminals, and a plurality of second lead terminals, the sealing resin has a second resin side surface facing the other side in the first direction, a third resin side surface facing one side in the second direction, and a fourth resin side surface facing the other side in the second direction, each of the plurality of first lead terminals protruding from the third resin side surface to one side in the second direction, and each of the plurality of second lead terminals protruding from the fourth resin side surface to the other side in the second direction, and the at least one electronic element is mounted on the die pad portion.Supplementary Note 10. the die pad portion has a first die pad arranged on one side in the second direction and a second die pad arranged on the other side in the second direction and spaced apart from the first die pad in the second direction, and the at least one electronic element includes a first electronic element mounted on the first die pad and a second electronic element mounted on the second die pad.Supplementary Note 11. The electronic device of Supplementary Note 10, wherein the plurality of first lead terminals are arranged at intervals in the first direction and include one-end first terminals located at one end in the first direction, the plurality of second lead terminals are arranged at intervals in the first direction and include one-end second terminals located at one end in the first direction, and the first portion is included in at least one of the one-end first terminal and the one-end second terminal. Supplementary Note 12. The electronic device of Supplementary Note 11, wherein, as viewed in the first direction, a terminal gap provided between the one-end first terminal and the one-end second terminal in the second direction overlaps with a pad gap provided between the first die pad and the second die pad in the second direction. Supplementary Note 13. The electronic device of Supplementary Note 10, wherein the first portion is included in the first die pad and the second die pad.Appendix 14. a conductive support member; at least one electronic element arranged on one side of the conductive support member in a thickness direction; and a sealing resin covering the at least one electronic element and a portion of the conductive support member, wherein the sealing resin has a first resin side surface facing one side in a first direction perpendicular to the thickness direction, a second resin side surface facing the other side in the first direction, a third resin side surface facing one side in a second direction perpendicular to the thickness direction and the first direction, and a fourth resin side surface facing the other side in the second direction, wherein a first gate mark having a surface rougher than other regions of the first resin side surface is formed on the first resin side surface, the conductive support member including a die pad portion and a plurality of first lead terminals, each of the plurality of first lead terminals protruding from the third resin side surface to one side in the second direction, and the at least one electronic element being mounted on the die pad portion, and the plurality of first lead terminals being arranged at intervals in the first direction and including a one-end first terminal located at an end on one side in the first direction, an electronic device, wherein the one-end first terminal has a first lead portion, a first pad portion, and a first extending portion, the first lead portion is located on one side of the die pad portion in the first direction and extends in the second direction, the first pad portion is connected to an end of the first lead portion on the other side in the second direction and extends to the other side in the first direction, the first extending portion is connected to an end of the first lead portion on the other side in the second direction and extends to the other side in the second direction, and the first extending portion includes a portion located inward from the first gate mark in the second direction when viewed in the thickness direction.Supplementary Note 15. The electronic device according to Supplementary Note 14, wherein the first extending portion includes a portion located on one side of the first lead portion in the first direction.Supplementary Note 16. The electronic device according to Supplementary Note 14 or 15, wherein the conductive support member includes a plurality of second lead terminals each protruding from the fourth resin-side surface to the other side in the second direction, the plurality of second lead terminals being arranged at intervals in the first direction and including a one-end second terminal located at an end on one side in the first direction, the one-end second terminal having a second lead portion, a second pad portion, and a second extending portion, the second lead portion being located on one side in the first direction of the die pad portion and extending in the second direction, the second pad portion being connected to an end of the second lead portion on one side in the second direction and extending to the other side in the first direction, the second extending portion being connected to an end of the second lead portion on one side in the second direction and extending to one side in the second direction, and the second extending portion including a portion located inward from the first gate mark in the second direction when viewed in the thickness direction, and located at a position separated from the first extending portion on the other side in the second direction. Appendix 17. The electronic device according to Appendix 16, wherein the second extending portion includes a portion located on one side of the second lead portion in the first direction.

[0153] A1, A11, A2, A21: electronic device 1: electronic element 11: first semiconductor element (first electronic element) 111: electrode 12: insulating element 121: first electrode 122: second electrode 13: second semiconductor element (second electronic element) 131: electrode 14: first electronic element 141, 142: electrode 15: second electronic element 151, 152, 153: electrode 2: conductive support member 2: semiconductor element 21: die pad portion 21A: first die pad 21B: second die pad 211: mounting surface 212: through hole 213, 214: inner portion (first portion) 22: first lead terminal 22A: one end side first terminal 22B: other end side first terminal 22C: intermediate first terminal 221: first lead portion 222: First pad portion 223: First extension portion 224, 226: Lead portion 225, 227: Pad portion 23: Second lead terminal 23A: Second terminal on one end side 23B: Second terminal on the other end side 23C: Second intermediate terminal 231: Second lead portion 232: Second pad portion 233: Second extension portion 234, 236: Lead portion 235, 237: Pad portion 25: First lead terminal 25A: First terminal on one end side 25B: First terminal on the other end side 25C: First intermediate terminal 251, 254, 256: Terminal portion 252, 255, 257: Lead portion 26: Second lead terminal 26A: Second terminal on one end side 26B: Second terminal on the other end side 261, 264: Terminal portion 262,265: Lead portion 262a: Inner portion 2 (first portion) 31-34: Wires 41-46: Wires 5: Sealing resin 51: Resin main surface 52: Resin back surface 53: First resin side surface 531: First upper portion 532: First lower portion 533: First intermediate portion 54: Second resin side surface 541: Second upper portion 542: Second lower portion 543: Second intermediate portion 55: Third resin side surface 551: Third upper portion 552: Third lower portion 553: Third intermediate portion 56: Fourth resin side surface 561: Fourth upper portion 562: Fourth lower portion 563: Fourth intermediate portion 591: First gate mark 592: Second gate mark 81: Lead frame 81A: Main surface 81B: Back surface 811: Outer frame 812A: First die pad 812B: Second die pad 813: First lead 814: Second lead 815: Support lead 816: Dam bar 817: Extension portion 891: First gate 892: Second gate D1: First distance L1: First dimension L2: Second dimension L3: Third dimension L4: Fourth dimension S1, S2: Area OP: Operational amplifier R1 to R5: Resistor elements T1, T2: Terminals,

Claims

1. a conductive support member; At least one electronic element disposed on one side of the conductive support member in a thickness direction; a sealing resin that covers the at least one electronic element and a portion of the conductive support member, the sealing resin has a first resin side surface facing one side in a first direction perpendicular to the thickness direction, a first gate mark having a surface rougher than other regions of the first resin side surface is formed on the first resin side surface, the conductive support member includes a first portion that is located closest to the first gate mark in the first direction and that is located more inward than the first gate mark in a second direction perpendicular to the thickness direction and the first direction when viewed in the thickness direction, an electronic device, wherein a ratio of a first distance, which is a distance in the first direction between the first gate mark and the first portion, to a first dimension, which is a length of the first gate mark in the thickness direction, is greater than 0% and not more than 500%.

2. The electronic device of claim 1 , wherein the first distance is greater than 0 mm and is equal to or less than 2.4 mm.

3. The product of a second dimension, which is the length of the first gate mark in the second direction, and the first distance is 0.21 to 5.0 mm. 2 The electronic device according to claim 2 ,

4. The electronic device according to claim 1 , wherein the first portion overlaps the first gate mark when viewed in the first direction.

5. 5. The electronic device according to claim 4, wherein a ratio of an area of ​​a portion of the first part overlapping with the first gate mark to an area of ​​the first gate mark when viewed in the first direction is greater than 0% and not more than 50%.

6. 2. The electronic device according to claim 1, wherein a ratio of a third dimension, which is the length in the second direction of the first portion, to a second dimension, which is the length in the second direction of the first gate mark, is 50 to 100%.

7. The electronic device according to claim 1 , wherein a ratio of the first distance to a second dimension, which is a length of the first gate vestige in the second direction, is greater than 0% and is not more than 50%.

8. the sealing resin has a resin main surface facing one side in the thickness direction and a resin back surface facing the other side in the thickness direction, The electronic device according to claim 1 , wherein a ratio of the first distance to a fourth dimension, which is a dimension in the thickness direction between the resin main surface and the resin back surface, is greater than 0% and not more than 70%.

9. the conductive support member includes a die pad portion, a plurality of first lead terminals, and a plurality of second lead terminals; the sealing resin has a second resin side surface facing the other side in the first direction, a third resin side surface facing one side in the second direction, and a fourth resin side surface facing the other side in the second direction, each of the plurality of first lead terminals protrudes from the third resin side surface to one side in the second direction; each of the second lead terminals protrudes from the fourth resin-side surface to the other side in the second direction; 9. The electronic device according to claim 1, wherein the at least one electronic element is mounted on the die pad portion.

10. the die pad portion has a first die pad arranged on one side in the second direction and a second die pad arranged on the other side in the second direction and spaced apart from the first die pad in the second direction; The electronic device of claim 9 , wherein the at least one electronic element includes a first electronic element mounted on the first die pad and a second electronic element mounted on the second die pad.

11. the plurality of first lead terminals are arranged at intervals in the first direction and include a first terminal at one end in the first direction, the plurality of second lead terminals are arranged at intervals in the first direction and include a one-end second terminal located at an end on one side in the first direction, The electronic device according to claim 10 , wherein the first portion is included in at least one of the one-end-side first terminal and the one-end-side second terminal.

12. 12. The electronic device according to claim 11, wherein, when viewed in the first direction, a terminal gap provided between the one-end side first terminal and the one-end side second terminal in the second direction overlaps with a pad gap provided between the first die pad and the second die pad in the second direction.

13. The electronic device of claim 10 , wherein the first portion is included in the first die pad and the second die pad.

14. a conductive support member; At least one electronic element disposed on one side of the conductive support member in a thickness direction; a sealing resin that covers the at least one electronic element and a portion of the conductive support member, the sealing resin has a first resin side surface facing one side in a first direction perpendicular to the thickness direction, a second resin side surface facing the other side in the first direction, a third resin side surface facing one side in a second direction perpendicular to the thickness direction and the first direction, and a fourth resin side surface facing the other side in the second direction; a first gate mark having a surface rougher than other regions of the first resin side surface is formed on the first resin side surface, the conductive support member includes a die pad portion and a plurality of first lead terminals; each of the plurality of first lead terminals protrudes from the third resin side surface to one side in the second direction; the at least one electronic element is mounted on the die pad portion, the plurality of first lead terminals are arranged at intervals in the first direction and include a first terminal at one end in the first direction, the one-end first terminal has a first lead portion, a first pad portion, and a first extending portion; the first lead portion is located on one side of the die pad portion in the first direction and extends in the second direction; the first pad portion is connected to an end portion of the first lead portion on the other side in the second direction and extends to the other side in the first direction; the first extending portion is connected to an end portion of the first lead portion on the other side in the second direction and extends to the other side in the second direction, The electronic device, wherein the first extension portion includes a portion located inward in the second direction from the first gate mark when viewed in the thickness direction.

15. The electronic device according to claim 14 , wherein the first extension portion includes a portion located on one side of the first lead portion in the first direction.

16. the conductive support member includes a plurality of second lead terminals each protruding from the fourth resin side surface toward the other side in the second direction, the plurality of second lead terminals are arranged at intervals in the first direction and include a one-end second terminal located at an end on one side in the first direction, the one-end second terminal has a second lead portion, a second pad portion, and a second extending portion; the second lead portion is located on one side of the die pad portion in the first direction and extends in the second direction, the second pad portion is connected to an end portion of the second lead portion on one side in the second direction and extends to the other side in the first direction; the second extending portion is connected to an end portion of the second lead portion on one side in the second direction and extends to the one side in the second direction, 16. The electronic device of claim 14, wherein the second extension portion includes a portion that is located inward from the first gate mark in the second direction when viewed in the thickness direction, and is located at a position spaced apart from the first extension portion on the other side in the second direction.

17. The electronic device according to claim 16 , wherein the second extending portion includes a portion located on one side of the second lead portion in the first direction.