Film forming apparatus

Abstract

The present invention provides a film forming apparatus which is capable of making the boundary of an external electrode constant and clear and suppressing variations in the appearance and the quality. A film forming apparatus 1 according to an embodiment of the present invention comprises: a mask 110 which has a mask hole 112; a sub-mask 120 which is superposed on the mask 110 and has a guide hole 122; and a receiving stage 130 with which one end surface T of an electronic component C comes into contact. A target 352 is disposed so as to face the upper surfaces of the mask 110 and the sub-mask 120 in an inclined manner, and the mask 110 and the sub mask 120 have a slide mechanism 144 for shifting the relative position of the guide hole 122 so as to bring one corner of the electronic component C into contact with one corner of the guide hole 122 that faces the normal N of the target 352.

Description

Film forming equipment

[0001] The present invention relates to a film forming apparatus.

[0002] Currently, chip-type electronic components with external electrodes formed on both ends are widely used in various electronic circuits. For example, chip capacitors are formed by dividing a block of laminated dielectric sheets with internal electrodes into individual rectangular parallelepiped pieces. External electrodes are formed on both ends of the rectangular parallelepiped elements using a conductive material connected to the internal electrodes.

[0003] As shown in Patent Document 1, a method for forming external electrodes involves inserting and holding electronic components in through-holes provided on a transport strip, exposing (exposing) portions of the electronic components through the through-holes using a push-in pin of a component pusher, and then applying (forming a film of) a conductive paste to these exposed portions to form external electrodes. In this case, the through-holes in the strip act as a mask that covers portions of the electronic components and prevents the paste from adhering.

[0004] Japanese Patent Application Publication No. 09-22846

[0005] In the above method, the electronic component is inverted while being held in place to form a film on both opposing ends of the electronic component. This requires the electronic component to be firmly held on the ribbon to prevent it from falling. In the above method, the electronic component is forced into a through-hole that is smaller than the size of the electronic component that can be elastically held. Forcing the electronic component into a small through-hole with a force such as a push pin can damage the surface of the electronic component or deform the electronic component. Furthermore, after forming a film on one exposed end to form an external electrode on both end surfaces of the electronic component, the applied film may be pushed out by a force to push the applied end out and protrude the opposite end, potentially damaging the applied surface.

[0006] To address this issue, the through-holes serving as masks are made larger than the electronic components, making it easier to insert and move the electronic components within the through-holes. However, this makes it impossible to hold the electronic components. Furthermore, gaps are formed between the electronic components and the through-holes. This allows the conductive material to penetrate through these gaps during film formation, resulting in inconsistent or unclear boundaries between the external electrodes and the electronic components, resulting in variations in product appearance and quality. Due to variations in the formation of electronic components and through-holes, it is extremely difficult to create through-holes large enough to hold the electronic components without creating gaps between them and push the electronic components with a force strong enough to prevent damage to the electronic components.

[0007] The embodiments of the present invention have been proposed to solve the problems of the conventional technology as described above, and their purpose is to provide a film forming apparatus that can make the boundaries of external electrodes uniform and clear, thereby reducing variations in appearance and quality.

[0008] In order to achieve the above object, a film formation apparatus according to an embodiment is a film formation apparatus for forming an electrode on an end portion of a rectangular parallelepiped electronic component, the film formation apparatus comprising: a mask having a mask hole covering a portion of the electronic component, the opening of the mask hole being large and having the same shape as a cross section of the electronic component parallel to the opening; a sub-mask overlaid on the mask, the sub-mask having a guide hole covering a portion of the electronic component exposed from the mask hole, the opening of the guide hole being large and having the same shape as a cross section of the electronic component parallel to the opening; a support table for holding one surface of the mask and contacting one end portion of the electronic component that has passed through the mask hole; a chamber capable of creating a vacuum inside; and a target that is disposed in a film-forming chamber provided in the chamber and contains a film-forming material to be deposited on the electronic component by sputtering, wherein the target is disposed so that the normal to the sputtering surface of the target faces the upper surfaces of the mask and the sub-mask at an angle, the mask and the sub-mask are disposed so that one corner of the mask hole and the guide hole faces the normal to the target, and the mask and the sub-mask further have a slide mechanism that shifts the relative position of the guide hole so that one corner of the electronic component comes into contact with one corner of the guide hole facing the normal to the target.

[0009] According to the embodiment of the present invention, it is possible to provide a film forming apparatus that can make the boundaries of external electrodes uniform and clear, thereby reducing variations in appearance and quality.

[0010] 1A and 1B are a perspective view and a cross-sectional view, respectively, of an electronic component on which a film is to be formed in an embodiment; FIG. 1B is a partial perspective plan view showing a film forming apparatus according to an embodiment; FIG. 1C is a plan view showing an electronic component inserted into a guide hole and a mask hole; and FIG. 1D is a plan view showing a state in which a corner of the electronic component is in contact with a corner of the guide hole. FIG. 1C is a perspective view, a side view, and a side view, respectively, showing a state in which a film is formed on one end of an electronic component. FIG. 1A is a plan view showing a mask and a cross-sectional view taken along arrows B-B; FIG. 1B is a plan view showing a sub-mask overlapping with a mask and a cross-sectional view taken along arrows C-C; FIG. 1C is a plan view showing a receiving table and a cross-sectional view taken along arrows D-D; and FIG. 1D is a partial enlarged view showing a receiving table on which the sub-mask and the mask are overlapped. FIG. 1D is an explanatory diagram showing a procedure for inverting the sub-mask and the mask. FIG. 1E is a cross-sectional view taken along arrows A-A in FIG. 2 showing a film forming apparatus according to an embodiment; FIG. 1F is an explanatory diagram showing the movement of an electronic component due to the movement of the sub-mask; and FIG. 1G is an explanatory diagram showing the angle between the sub-mask and the target. FIG. 9 is a cross-sectional view showing the film formation chamber of FIG. 8 when it is open. FIG. 9 is a cross-sectional view showing the film formation chamber of FIG. 8 when a film is being formed. FIG. 10 is a side view (A) showing a state in which a film is being formed when there is a gap between the guide hole and the electronic component, and a side view (B) showing the electronic component on which a film has been formed. FIG. 11 is a partial cross-sectional view showing a modified example of a sub-mask. FIG. 12 is a partial cross-sectional view showing a modified example of a slide mechanism. FIG. 13 is a perspective plan view showing a modified example in which a supply unit has an inversion mechanism and a supply mechanism.

[0011] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, proportions, etc. of each part are exaggerated for ease of understanding.

[0012] [Electronic Component] As shown in FIG. 1A , the electronic component C formed according to this embodiment is a chip-shaped electronic component C having electrodes E (external electrodes) made of a conductive material formed on both ends. For example, elements such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C of this embodiment has a rectangular parallelepiped (including cubic and thin plate) outer shape. The end of the electronic component C is a region including a rectangular end face T and four side faces S in its vicinity, and both ends are a pair of separate regions. The electrodes E are formed in close contact with each other so as to cover both ends in a box-like shape. The ends on which the electrodes E are formed are also referred to as electrode formation regions R.

[0013] FIG. 1B is a cross-sectional view of a multilayer ceramic capacitor formed as an electronic component C, in which dielectric sheets on which internal electrodes En are formed are stacked. A pair of electrodes E formed on the outer surface of the electronic component C has a multilayer structure in which multiple layers of conductive material are stacked, and are electrically connected to the internal electrodes En of the electronic component C. In this embodiment, nickel chromium (NiCr), copper (Cu), titanium (Ti), or aluminum (Al) can be selectively deposited. For example, a copper (Cu) seed layer for the electrode E is deposited on a titanium (Ti) base layer for improving adhesion. Then, using the seed layer as a seed, copper (Cu) is deposited by electroplating in the electrode formation region R, thereby completing the electronic component C with the electrode E formed thereon. Because the base layer and seed layer also form part of the electrode E, the deposition of these layers will also be referred to as "depositing the electrode E" in the following description of this embodiment.

[0014] In the following description, the straight line passing through the centers of both end faces T covered by the electrode E is referred to as the axis Axc of the electronic component C. In this embodiment, for example, the electronic component C may be an extremely small one having a length in the axis Axc direction of 0.6 mm, a length of the electrode E in the axis Axc direction of 0.2 mm, and a rectangular cross section perpendicular to the axis Axc of the electrode E measuring 0.3 mm × 0.3 mm. However, the present invention is applicable to both smaller and larger electronic components C.

[0015] 2 , the film forming apparatus 1 of this embodiment includes a supply unit 2, a film forming unit 3, and a control device 4. The supply unit 2 supplies the electronic component C to the film forming unit 3 in a state in which the electronic component C is masked in areas other than one electrode formation region R by mask holes 112 in a mask 110 and guide holes 122 in a sub-mask 120, which will be described later. The mask 110 and the sub-mask 120 are loaded into the film forming unit 3 so that one corner of the mask hole 112 and one corner of the guide hole 122 face a target 352, which will be described later. In this embodiment, the masks are loaded in a state in which they are horizontally offset by 45° with the center of the mask 110 as the axis. The film forming unit 3 deposits an electrode material in the unmasked, exposed electrode formation region R. At this time, as shown in FIGS. 3A, 3B, 4A, and 4B, the relative positions of the mask hole 112 and the guide hole 122 are shifted so that one corner of the electronic component C comes into contact with one corner of the guide hole 122, thereby closing the gap between the guide hole 122 and two adjacent side surfaces of the electronic component C. In this manner, regions other than one electrode formation region R of the electronic component C are masked, and film formation is performed toward one corner of the electronic component C. The control device 4 controls each of the supply unit 2 and the film formation unit 3. In the following description, the horizontal alignment direction of the supply unit 2 and the film formation unit 3 is referred to as the Y direction, the horizontal direction perpendicular to this is referred to as the X direction, and the vertical direction is referred to as the Z direction. The electronic component C is inserted into the guide hole 122 and the mask hole 112 so that the axis Axc is aligned with the Z direction.

[0016] [Mask] Figure 5 shows a mask 110, with Figure 5(A) being a plan view and Figure 5(B) being a cross-sectional view taken along the line B-B in Figure 5(A). Restriction holes 113, which will be described later, do not appear in the cross-sectional view taken along the line B-B in Figure 5(A), but are shown in Figure 5(B) for ease of understanding. As shown in Figures 5(A) and (B), the mask 110 has a plate 111, mask holes 112, restriction holes 113, and slide grooves 114.

[0017] The plate 111 is a circular, plate-like member. The mask holes 112 are a plurality of holes into which electronic components C are inserted one by one through guide holes 122 in a sub-mask 120 superimposed on the mask 110, covering a portion of the electronic component C. Each mask hole 112 penetrates the surface of the plate 111 in a direction perpendicular to the surface and has a rectangular parallelepiped shape in which the axis Axc of the inserted electronic component C is aligned vertically. A vertical line passing through the center of the mask hole 112 is defined as the axis Axm. The length of the mask hole 112 in the axis Axm direction is shorter than the length of the electronic component C in the axis Axc direction. More specifically, the length of the mask hole 112 in the axis Axm direction is half the length of the electronic component C in the axis Axc direction other than one electrode formation region R. In other words, the length of the mask hole 112 in the axis Axm direction is half the length of the non-sputtered region of the electronic component C in the axis Axc direction (see FIG. 4A ).

[0018] The opening 112a at the end of the mask hole 112 is large and has the same shape as the cross section of the electronic component C parallel to the opening 112a. The size of the opening 112a and the cross section of the mask hole 112 perpendicular to the axis Axm that follows the opening 112a need only be large enough to allow the electronic component C to fall and be inserted under its own weight, with the axis Axc aligned vertically. In other words, the inner diameter of the mask hole 112 is large enough to allow the electronic component C to pass through, and the cross section of the mask hole 112 perpendicular to the axis Axm is slightly larger than the cross section of the electronic component C perpendicular to the axis Axc, but smaller than the size that would cause the axis Axc to be inserted at an angle relative to the vertical. Therefore, the size is set larger than the size that requires press-fitting. Furthermore, the mask holes 112 are arranged in a matrix within a plurality of compartments 112b that are arranged symmetrically about the center of the plate body 111.

[0019] The restriction holes 113 are through-holes into which restriction portions 132 of the receiving table 130, which will be described later, are inserted to align the mask 110 with the receiving table 130 and prevent misalignment. A plurality of restriction holes 113 are provided outside each compartment 112b to correspond to the plurality of restriction portions 132. The restriction holes 113 have a shape corresponding to the shape of the restriction portions 132 and a size corresponding to the size of the restriction portions 132 so as to achieve an allowable misalignment state.

[0020] The slide grooves 114 are slots parallel to the diagonal of the openings 112a of the mask holes 112. Slide protrusions 124 of the sub-mask 120, which will be described later, are inserted into the slide grooves 114. A plurality of slide grooves 114 are provided outside each compartment 112b to correspond to the plurality of slide protrusions 124.

[0021] [Submask] Figure 6 shows the submask 120 overlapping the mask 110, with Figure 6(A) being its plan view and Figure 6(B) being a cross-sectional view taken along the arrows C-C in Figure 6(A). The restriction hole 113 and a restriction hole 123 (described later) are not visible in the cross-sectional view taken along the arrows C-C in Figure 6(A), but are illustrated in Figure 6(B) for ease of understanding. As shown in Figures 6(A) and (B), the submask 120 is overlapped on the mask 110 and has a guide hole 122 that covers a portion of the electronic component C exposed through the mask hole 112. By moving relative to the mask 110, one corner of the electronic component C comes into contact with one corner of the inner surface of the guide hole 122. The submask 120 has a plate 121, a guide hole 122, a restriction hole 123, and a slide protrusion 124.

[0022] The plate 121 is a circular plate-like member. The plate 121 has the same size and shape as the plate 111 of the mask 110. The guide holes 122 are placed on top of the mask 110, and electronic components C are inserted into them one by one. Each guide hole 122 penetrates the surface of the plate 121 in a direction perpendicular to the surface and has a rectangular parallelepiped shape such that the axis Axc of the inserted electronic component C is aligned vertically. A vertical line passing through the center of the guide hole 122 is defined as the axis Axn. The length of the guide hole 122 in the axis Axn direction is shorter than the length of the electronic component C in the axis Axc direction. More specifically, the length of the guide hole 122 in the axis Axn direction is half the length of the electronic component C in the axis Axc direction other than one electrode formation region R. In other words, the length of the guide hole 122 in the axis Axn direction is half the length of the non-sputtered region of the electronic component C in the axis Axc direction (see FIG. 4A ).

[0023] The opening 122a at the end of the guide hole 122 is large and has the same shape as the cross section of the electronic component C parallel to the opening 122a. The size of the cross section of the opening 122a in the guide hole 122 perpendicular to the axis Axn is sufficient if the electronic component C can be inserted by dropping under its own weight and the axis Axc is vertical. In other words, the inner diameter of the guide hole 122 is large enough to allow the electronic component C to pass through, and the cross section of the guide hole 122 perpendicular to the axis Axn is slightly larger than the cross section of the electronic component C perpendicular to the axis Axc, but smaller than the size that would cause the axis Axc to be inserted at an angle relative to the vertical. Therefore, the size is set larger than the size that requires press-fitting. In this embodiment, the mask hole 112 and the guide hole 122 are formed to have the same size.

[0024] A plurality of guide holes 122 are provided in a matrix in each of a plurality of compartments 122b arranged symmetrically about the center of the plate 121. The position of each compartment 122b corresponds to the position of the compartment 112b of the mask 110 that is placed thereon, and the position of the guide holes 122 in each compartment 122b corresponds to the position of the mask hole 112 in each compartment 112b. In other words, as shown in Figure 6(B) , when the axis Axm of the mask hole 112 and the axis Axn of the guide hole 122 are aligned, the openings at the lower ends of the guide holes 122 and the openings at the upper ends of the mask hole 112 are aligned without any misalignment in the horizontal directions (X, Y directions, and θ direction), allowing the electronic component C to pass through.

[0025] The restriction holes 123 are through-holes into which restriction portions 132 of the receiving table 130, which will be described later, are inserted to align the sub-mask 120 with the receiving table 130 and prevent misalignment. A plurality of restriction holes 123 are provided outside each compartment 112b to correspond to the plurality of restriction portions 132. Therefore, the restriction holes 123 also correspond to the restriction holes 113 of the mask 110. Like the restriction holes 113, the restriction holes 123 have a shape corresponding to the shape of the restriction portions 132 and a size corresponding to the size of the restriction portions 132 so as to achieve an allowable misalignment state.

[0026] When the sub-mask 120 is superimposed on the mask 110, the slide protrusions 124 are inserted into the slide grooves 114 of the mask 110. A plurality of slide protrusions 124 are provided outside each compartment 112b so as to correspond to the plurality of slide grooves 114. This allows the mask 110 and the sub-mask 120 to be positioned relative to each other and allows them to slide in a direction parallel to the diagonal of the openings of the guide holes 122 and mask holes 112.

[0027] [Receiving Table] The receiving table 130 is a table that holds one surface of the mask 110 or one surface of the sub-mask 120 and that comes into contact with one end or the other end of the electronic component C inserted into the mask hole 112 or the guide hole 122 .

[0028] 7A and 7B, the receiving base 130 has a plate 131 and a restricting portion 132. The plate 131 is a circular plate-like member having the same diameter as the mask 110 and the sub-mask 120. When the mask 110 or the sub-mask 120 is superimposed, the receiving base 130 closes the lower ends of the mask holes 112 or the guide holes 122 in each section 122b.

[0029] The restricting portion 132 is a cylindrical pin fixed to one surface of the plate body 131. As shown in Fig. 7C , the restricting portion 132 is provided at a position corresponding to the restricting holes 113, 123 of the mask 110 or the submask 120. Note that in Fig. 7C , for ease of understanding, the restricting holes 113, 123, the mask hole 112, and the guide hole 122 are conveniently shown side by side on the same cross section. When the mask 110 and the submask 120 are placed on the receiving table 130, the restricting portion 132 is inserted into the restricting hole 113 or the restricting hole 123, thereby aligning the receiving table 130 with the mask 110 or the submask 120 during movement and preventing positional deviation.

[0030] The restriction portion 132 being inserted into the restriction hole 113 or the restriction hole 123 means that when it is inserted into one, it cannot be inserted into the other. For example, as shown in FIG. 7C , when the mask 110 and the sub-mask 120 are stacked on the receiving base 130 in this order, the restriction portion 132 is inserted into the restriction hole 113 of the mask 110 but is not inserted into the restriction hole 123 of the mask 110, allowing the sub-mask 120 to move (see FIGS. 10A and 10B ). Conversely, when the sub-mask 120 and the mask 110 are stacked on the receiving base 130 in this order, the restriction portion 132 is inserted into the restriction hole 123 of the sub-mask 120 but is not inserted into the restriction hole 113 of the mask 110, allowing the mask 110 to move.

[0031] In this manner, the lower end of the electronic component C inserted into the mask hole 112 and the guide hole 122 comes into contact with the receiving table 130, thereby exposing only the electrode formation region R on the upper end side, and the mask hole 112 and the guide hole 122 cover the region other than the electrode formation region R (see FIG. 4A ). The receiving table 130 and the mask 110 and sub-mask 120 supported thereby form the holding member H (see FIG. 8 ). That is, with the electronic component C inserted into the mask hole 112 of the mask 110 and the guide hole 122 of the sub-mask 120 of the holding member H, the region other than the electrode formation region R is covered by the mask 110 and the sub-mask 120, and a film is formed in the film forming unit 3 on the electrode formation region R exposed through the guide hole 122 or the mask hole 112.

[0032] In this embodiment, the electronic component C is inserted vertically into the mask hole 112 and the guide hole 122, so that one end of the electronic component C that contacts the receiving base 130 faces downward, and the other end on the opposite side faces upward. However, there is a possibility that both ends of the electronic component C will become one end (lower end) and the other end (upper end) due to insertion into the mask hole 112 and the guide hole 122. Furthermore, there is a possibility that the mask 110 and the sub-mask 120 will both face downward and upward due to inversion.

[0033] As will be described later, in order to form a film on one end of an electronic component C and then form a film on the other end, the overlapping pedestal 130, mask 110, and sub-mask 120 are inverted. In this case, a pair of pedestals 130A and 130B are used to sandwich the electronic component C (see FIG. 8 ). The pedestal 130A faces the underside of the mask 110, and the lower ends of the electronic components C that pass through the mask holes 112 come into contact with it. The pedestal 130B is then placed over the mask 110 so as to face the upper surface of the sub-mask 120 that is overlapped with the mask 110, so that the upper ends of the electronic components C that pass through the guide holes 122 come into contact with the covered pedestal 130B. By inverting the pedestal 130A in this state, the overlapping state of the pedestal 130A, mask 110, sub-mask 120, and pedestal 130B is inverted.

[0034] By performing this inversion, the state in which one end of the electronic component C that has passed through the mask hole 112 contacts the top of the receiving table 130A is reversed to the state in which the other end of the electronic component C that has passed through the guide hole 122 contacts the top of the receiving table 130B.

[0035] In this way, when the overlapping of the mask 110 and the submask 120 is reversed, the mask 110 corresponds to the submask 120, and the submask 120 corresponds to the mask 110. In other words, the functions of the mask 110 and the submask 120 are interchanged.

[0036] The mask 110 is positioned by the restricting portion 132 of the receiving base 130A. The sub-mask 120 is positioned on the mask 110 by the slide protrusion 124. At this time, the sub-mask 120 is not directly positioned by the restricting portion 132 of the receiving base 130. When the receiving base 130B is placed in this state, the restricting portion 132 of the receiving base 130B is inserted into the restricting hole 123 of the sub-mask 120, thereby positioning the sub-mask 120. In other words, the sub-mask 120 is directly positioned on the receiving base 130B. This prevents the sub-mask 120 from shifting position relative to the receiving base 130B.

[0037] In this state, the restricting portions 132 of the receiving base 130B do not reach the restricting holes 113 of the mask 110, and the mask 110 is not positioned by the receiving base 130B. The mask 110 is allowed to move relative to the sub-mask 120 within the range of the slide grooves 114.

[0038] In other words, the receiving tables 130A and 130B are positioned via the mask 110 and the sub-mask 120.

[0039] Furthermore, when the overlapping of the mask 110 and the sub-mask 120 is reversed, the end face T of the electronic component C that was on the upper side becomes the lower side and is positioned at the lower end of the guide hole 122, and the end face T that was on the lower side becomes the upper side and is exposed from the upper end of the mask hole 112. In other words, when the upper and lower end faces T of the electronic component C are reversed, the mask 110 and the sub-mask 120 are also reversed and fall downward along the electronic component C, so that the exposed end of the electronic component C is reversed. As a result, the mask hole 112 takes on the function of the guide hole 122.

[0040] The receiving bases 130A and 130B have the same shape. In the following description, when there is no need to distinguish between the receiving bases 130A and 130B, they will be referred to as receiving bases 130. In this embodiment, all receiving bases 130 have the same size and shape, and the functions are the same regardless of which one is used interchangeably.

[0041] In addition, the electronic component C passing through the mask hole 112 and the guide hole 122 means that the lower end face T of the electronic component C inserted into the mask hole 112 and the guide hole 122 abuts against the receiving table 130, thereby setting the electronic component C on the receiving table 130, as shown in Figures 8(A) to (D).

[0042] The holder H is formed by either the receiving table 130A or the receiving table 130B and the mask 110 or the sub-mask 120 supported thereby (see FIG. 8). That is, with the electronic components C inserted into the mask holes 112 of the mask 110 of the holder H and the guide holes 122 of the sub-mask 120, a film is formed in the film forming unit 3 on the electrode formation regions R exposed through the guide holes 122 or the mask holes 112.

[0043] [Holder] The holder 140 is a transport jig on which the receiving table 130 is placed and which is transported within the supply unit 2 and the film forming unit 3. As shown in Figures 2 and 9, the holder 140 has a base 141, a stage 142, an extension 143, and a slide mechanism 144.

[0044] The base 141 is a circular plate with a larger diameter than the receiving table 130, and is mounted on the rotary tables 212 and 321 (described later) via legs provided at the bottom. The stage 142 is a circular plate with a larger diameter than the receiving table 130 but a smaller diameter than the base 141, and is supported above the base 141 via a pillar so as to be parallel to the base 141. A hole 142a is formed in the stage 142 so that the receiving table 130 fits into it to restrict its movement (see FIG. 10 ). The extension 143 stands upright from the vicinity of the outer edge of the base 141, and is a member that is gripped by a holder 362 of the loading / unloading unit 360 (described later).

[0045] As shown in FIG. 10A, the slide mechanism 144 shifts the relative position of the guide hole 122 with respect to the mask hole 112 so that one corner of the electronic component C inserted into the guide hole 122 contacts one corner of the guide hole 122 as shown in FIGS. 10B and 10C. Also, as shown in FIGS. 10D and 10E, the slide mechanism 144 shifts the relative position of the guide hole 122 with respect to the mask hole 112 so that one corner of the electronic component C opposite the above contacts the corner of the guide hole 122 opposite the above. To this end, the slide mechanism 144 has a pair of pushers 144a and 144b arranged on opposite sides of the support pedestal 130 on the stage 142. The pair of pushers 144a and 144b are cylinders that advance and retract a drive shaft. The drive shaft is on a straight line passing through the center of the submask 120 and parallel to the diagonal of the guide hole 122. Furthermore, the drive shaft is in contact with opposite edges 125a and 125b of the sub-mask 120. The cylinder of the pusher 144a is connected to a power source via electrodes and wiring provided on a pusher 324, which will be described later.

[0046] 10(B) and 10(C), the drive shaft of one pusher 144a extends and the drive shaft of the other pusher 144b retracts, causing the sub-mask 120 to slide in one direction. The drive shaft of the other pusher 144b extends and the drive shaft of one pusher 144a retracts, causing the sub-mask 120 to slide in the other direction. As a result, one corner of the electronic component C comes into contact with one corner of the guide hole 122.

[0047] 2 and 9, the supply unit 2 has a transport unit 210 housed in a housing 2a. The transport unit 210 is a mechanism that transports the mask 110 and the sub-mask 120 with the electronic components C inserted into the mask holes 112 and the guide holes 122. The transport unit 210 of this embodiment transports the mask 110 and the sub-mask 120 that are placed together with the receiving table 130 to the stage 142 of the holder 140. In other words, the transport unit 210 transports a plurality of holders 140, each of which holds a plurality of sets of the mask 110, the sub-mask 120, and the receiving table 130.

[0048] The transport unit 210 has a turntable 212 that is rotated intermittently by a motor 211. The turntable 212 has a plurality of holding holes 212a, which are through-holes, formed at equal intervals. The holders 140 are held by these holding holes 212a. The holding holes 212a are provided at equal intervals in the circumferential direction. In this embodiment, four holding holes 212a are provided, and therefore four holders 140 are held on the turntable 212 at 90° intervals.

[0049] A loading / unloading position PA and a delivery position PB are set in the supply unit 2. The turntable 212 repeats intermittent rotation, rotating and stopping so that each holding hole 212a of the turntable 212 is positioned at each position. In the present embodiment, the turntable 212 intermittently rotates counterclockwise as viewed in FIG. 2 .

[0050] The carry-in / carry-out position PA is a position at which the mask 110 and the sub-mask 120, with electronic components C inserted into the mask holes 112 and the guide holes 122, are carried in and out of the film forming apparatus 1. The transfer position PB is a position at which electronic components C are transferred between the film forming unit 3 and the supply unit 2. That is, the transfer position PB is a position at which electronic components C are supplied from the supply unit 2 to the film forming unit 3, or at which electronic components C that have already been film-formed in the film forming unit 3 are returned to the supply unit 2.

[0051] [Film Forming Unit] The film forming unit 3 is an apparatus that uses plasma to form a film on the portion of the electronic component C that is exposed through the guide hole 122, i.e., the electrode formation region R. As shown in Figures 2 and 9, the film forming unit 3 has a chamber 31, a transport unit 32, a heating unit 33, a pre-treatment unit 34, a film forming treatment unit 35, a cooling unit 36, and a load lock unit 37.

[0052] (Chamber) The chamber 31 is a container whose interior can be evacuated to a vacuum by exhausting the gas through the exhaust unit 311. The exhaust unit 311 can be, for example, a turbo pump connected to an exhaust port.

[0053] (Transport Unit) The transport unit 32 supports multiple sets of masks 110, sub-masks 120, and receiving tables 130, and positions the holders 140 holding each set of masks 110, sub-masks 120, and receiving tables 130 in positions facing the heating unit 33, pre-processing unit 34, film-forming processing unit 35, cooling unit 36, and load lock unit 37, respectively. The transport unit 32 of this embodiment has a rotary table 321, a driving source 322, a sealer 323, and a pusher 324. The rotary table 321 is a circular table that carries the holder 140 that has been carried into the chamber 31 and is rotated intermittently by a motor, which is the driving source 322, to move the holder 140 to each unit, such as the heating unit 33, pre-processing unit 34, film-forming processing unit 35, cooling unit 36, and load lock unit 37.

[0054] The turntable 321 has a plurality of holding holes 321a formed at equal intervals. The holders 140 are held by these holding holes 321a. The holding holes 321a are provided at equal intervals in the circumferential direction. In this embodiment, eight holding holes 321a are provided, and therefore eight holders 140 are held on the turntable 321 at 45° intervals. The film forming unit 3 has a supply position P1, a heating position P2, a pre-processing position P3, film forming positions P4 to P7, and a cooling position P8. The turntable 321 repeatedly rotates and stops intermittently so that each holding hole 321a of the turntable 321 is positioned at each position. In this embodiment, the turntable 321 rotates counterclockwise in FIG. 2.

[0055] The seal 323 is a member that seals each part and isolates the internal region from the chamber 31. The holder 140 is placed on the seal 323 and is held in holding holes 321a that are provided at equal intervals in the turntable 321. Therefore, the holder 140 is held on the turntable 321 via the seal 323. The seal 323 is held by the edges of the holding holes 321a. An opening is provided at the bottom of the seal 323.

[0056] The pusher 324 raises and lowers the sealing body 323 at positions corresponding to each part of the film forming unit 3. Therefore, the pusher 324 is provided at a position corresponding to each part of the film forming unit 3. The pusher 324 has a drive shaft 324b that is raised and lowered by a drive source 324a such as a cylinder, and a sealing plate 324c that is provided on the drive shaft 324b and contacts the bottom surface of the sealing body 323 to seal the opening. The drive shaft 324b is rotatable relative to the sealing plate 324c, and the drive source 324a includes a motor that rotates the drive shaft 324b to rotate the sealing body 323.

[0057] (Heating Unit) The heating unit 33 corresponds to the heating position P2 and heats the electronic component C. The heating unit 33 has a heater that generates heat when energized. The heating unit 33 is provided on the ceiling side of the chamber 31, is sealed by the raised sealing body 323, and has a heating chamber that heats the electronic component C.

[0058] (Pretreatment Unit) The pretreatment unit 34 corresponds to the pretreatment position P3 and performs surface treatment on the electrode formation region R using plasma. The surface treatment is, for example, an ion bombardment process in which ions generated in a process gas by the plasma clean the surface of the electrode formation region R. The pretreatment unit 34 is provided on the ceiling side of the chamber 31, is sealed by a raised seal 323, and has a treatment chamber in which surface treatment is performed on the electronic component C inserted in the holding member H.

[0059] (Film Formation Processing Unit) The film formation processing unit 35 corresponds to film formation positions P4 to P7, and performs film formation processing by sputtering on the electrode formation region R of the electronic component C. Sputtering is a process in which a film formation material is knocked out from a target 352 by ions generated in a sputtering gas by plasma, and deposited on the surface of the electrode formation region R. The film formation processing unit 35 has a film formation chamber 351 that is provided on the ceiling side of the chamber 31 and sealed by a raised seal 323, and in which film formation processing is performed on the electrode formation region R exposed from the submask 120.

[0060] The film formation chamber 351 is configured in a container 351a attached to the upper part of the chamber 31. The container 351a is provided with a target 352 containing a film formation material. The target 352 is a member formed from the film formation material that is deposited on the electronic component C by sputtering to form a film. The target 352 is held by a backing plate (not shown) and connected to a power supply via an electrode. In the film formation processing unit 35 of this embodiment, a pair of targets 352 are arranged in opposing positions. The planes of the two targets 352 (sputtering surfaces eroded by sputtering) are inclined relative to the horizontal direction so as to face the horizontal submask 120, and the central axes of the targets 352 are inclined relative to the vertical direction. In other words, the target 352 is arranged such that the normal N of the sputtering surface (a line perpendicular to the sputtering surface and parallel to the axis of the target) faces the upper surfaces of the mask 110 and the submask 120 at an incline (see FIG. 11 ).

[0061] The mask 110 and sub-mask 120 described above are arranged such that one corner of the mask hole 112 and the guide hole 122 faces the normal N of the target 352. Furthermore, the slide mechanism 144 shifts the relative positions of the guide holes 122 of the mask 110 and the sub-mask 120 so that one corner of the electronic component C comes into contact with one corner of the guide hole 122 facing the normal N of the target 352.

[0062] The angle of the sputtering surface of the target 352 is based on the angle of the flat surface before it is eroded by sputtering. In this embodiment, the tilt angle of each target 352 is set so that the angle α formed between a plane parallel to the opening 122 a of the guide hole 122 or the opening 112 a of the mask hole 112 and a plane of each target 352 facing the sub-mask 120 is greater than 0 degrees and less than 90 degrees (see FIG. 11 ).

[0063] The film formation chamber 351 is also provided with a shutter 353. The shutter 353 is a conical member that shields the target 352 and has a window that exposes the target 352. The shutter 353 is provided so as to be rotatable about its axis by a motor (not shown). By rotating the shutter 353 and moving the position of the window, it is possible to switch which target 352 is used for sputtering. Note that the target 352 on the side shielded by the shutter 353 can be pre-sputtered to clean the surface of the target 352.

[0064] In this embodiment, four film formation processing units 35 having targets 352 of different film formation materials are provided corresponding to the four film formation positions P4 to P7. For example, the film formation processing unit 35 has a target 352 containing nickel chromium (NiCr) at film formation position P4, copper (Cu) at film formation position P5, titanium (Ti) at film formation position P6, and aluminum (Al) at film formation position P7.

[0065] 10(B) and 10(C), in the film formation chamber 351, one of the drive shafts of the pushers 144a and 144b of the slide mechanism 144 extends and the other retracts, causing the sub-mask 120 to slide. As a result, one corner of the electronic component C comes into contact with one corner of the guide hole 122 (see FIG. 3(B)). At this time, one opposing corner of the electronic component C comes into contact with one corner of the mask hole 112. In other words, one corner of the guide hole 122 that the corner of the electronic component C comes into contact with faces one corner of the mask hole 112 (see FIG. 4(A)).

[0066] One corner of electronic component C that contacts guide hole 122 faces target 352. Because target 352 is inclined as described above, one of the two side surfaces of the portion of electronic component C exposed from guide hole 122 faces one of targets 352 (the side used for film formation), and the other two side surfaces are in a shadow position relative to target 352 on the side used for film formation, as shown in Fig. 11. The shadow position refers to a position that is blocked by one side surface of electronic component C and where the film formation material is not deposited (see Fig. 4(B)).

[0067] Therefore, the slide mechanism 144 brings one corner of the electronic component C, of ​​which two adjacent sides out of the four sides are positioned toward one of the targets 352, into contact with one corner of the guide hole 122, and brings one corner of the electronic component C, of ​​which the other two adjacent sides are positioned in a shadow position relative to the target 352, into contact with one corner of the guide hole 122.

[0068] In this case, the above-described shadow position can be created by setting the angle α between a plane parallel to the opening 122a of the guide hole 122 and a plane of the target 352 facing the sub-mask 120 to be greater than 0 degrees and less than 90 degrees. This angle need not necessarily be achieved when the sub-mask 120 is slid; it may be set to this angle before the sub-mask 120 is slid. More preferably, as shown in FIG. 11 , the angle α is set so that the normal N of the target 352 is inclined (close to horizontal) relative to the line dl connecting the edge of the end face T of the electronic component C and the edge of the guide hole 122. In other words, the angle α is set to be close to 90 degrees relative to the horizontal. This suppresses deposition of the film formation material in the gap between the guide hole 122 and the electronic component C on the opposite side of the target 352.

[0069] The movement of the mask 110, the sub-mask 120, and the receiving pedestal 130 between the turntable 321 and the film formation chamber 351 is achieved by raising and lowering the holder 140 using the pusher 324. In other words, the pusher 324 in the film formation processing unit 35 is an opening and closing mechanism that moves the holder 140 between a sealed position where the sealer 323 seals the film formation chamber 351 and accommodates the holder 140 holding the mask 110, the sub-mask 120, and the receiving pedestal 130 in the film formation chamber 351, and an open position where the sealer 323 opens the film formation chamber 351 and ejects the holder 140 from the film formation chamber 351, while maintaining the vacuum in the chamber 31. The drive shaft 324b of the pusher 324 raises and lowers the sealing plate 324c and also raises and lowers the holder 140 independently of the sealing plate 324c.

[0070] Furthermore, the drive source 324a of the pusher 324 in the film formation processing unit 35 includes a motor, and by rotating the drive shaft 324b, the stage 142 can be rotated independently of the sealing plate 324c. As a result, while the film formation chamber 351 remains sealed, the pusher 324 rotates the holder 140 holding the mask 110, the sub-mask 120, and the receiving table 130, thereby functioning as a switching mechanism that switches one corner of the electronic component C facing the target 352 to the opposite corner. The electronic component C only needs to be rotated in accordance with the positions of the multiple targets 352 so that one corner faces one of the targets 352. The amount of rotation (angle) is not limited to a specific value. For example, the rotation may be 180 degrees or in 90-degree increments.

[0071] (Cooling Unit) The cooling unit 36 ​​cools the electronic components C before they are discharged into the atmosphere to a temperature that prevents the deposited film from being oxidized in the atmosphere. The cooling unit 36 ​​has a cooling chamber that is sealed by a sealant 323 at the cooling position P8. The cooling chamber is provided with a cooler that introduces and circulates a cooling gas (not shown).

[0072] (Load Lock Unit) The load lock unit 37 is sealed by a sealant 323 at the supply position P1, and has a load lock chamber 370 that allows the holder 140 to be loaded and unloaded while maintaining a vacuum inside the chamber 31. A load lock unit 360 loads and unloads the holder 140, on which the mask 110, the sub-mask 120, and the receiving table 130 are mounted, into and out of the chamber 31 via the load lock unit 37.

[0073] The loading / unloading unit 360 has an arm 361 and a holder 362. The arm 361 is a long member provided between the supply unit 2 and the chamber 31 in a direction parallel to the plane of the turntable 321. The arm 361 is provided so as to be rotatable intermittently in 180° increments around an axis parallel to the rotation axis of the turntable 321 and to be movable along this axis by a drive mechanism (not shown).

[0074] The holders 362 are provided on both ends of the arm 361 and are members that hold the holder 140. The holders 362 hold the holder 140 by a holding mechanism such as a vacuum chuck, an electrostatic chuck, or a mechanical chuck. In this embodiment, the holder 362 has a mechanical chuck that chucks and holds the extension portion 143 of the holder 140. The holder 362 also functions as a lid that opens and closes the load lock chamber 370. In other words, the holder 362 is provided with a sealant such as an O-ring for sealing the load lock chamber 370.

[0075] The load lock chamber 370 allows the holder 140 to be loaded and unloaded while maintaining a vacuum inside the chamber 31. The load lock chamber 370 is a space that can be sealed by being surrounded by the through-hole of the chamber 31, the holder 362 of the loading / unloading unit 360, the sealing body 323 of the chamber 31, and the sealing plate 324c biased by the pusher 324.

[0076] An exhaust line 370c is connected to the load lock chamber 370. The exhaust line 370c is connected to an exhaust device 370a and a valve 370b and serves as a path for reducing the pressure in the sealed load lock chamber 370. Furthermore, the exhaust line 370c has a valve 370d and is provided with a vent line 370e for breaking the vacuum in the load lock chamber 370.

[0077] [Control Device] The control device 4 is a device that controls each part of the film forming apparatus 1 (see FIG. 4). This control device 4 can be configured, for example, by a computer that operates according to a predetermined program. The control device 4 has a processor that executes the program, a memory that stores various information such as the program and operating conditions, and an information input / output device. It also has a drive circuit that drives each part.

[0078] For example, using the above-mentioned program, the control device 4 controls the transportation of the holder 140 by the transport unit 210, the loading / unloading of the receiving table 130 into the chamber 31 by the loading / unloading unit 360 and the load lock chamber 370, the transportation of the receiving table 130 by the transport unit 32, heating by the heating unit 33, plasma processing by the pre-treatment unit 34, film formation processing by the film formation treatment unit 35, cooling by the cooling unit 36, and movement of the submask 120 by the slide mechanism 144.

[0079] The control device 4 causes the slide mechanism 144 to bring one corner of the side of the electronic component C on which a film is to be formed into contact with one corner of the mask hole 112 or the guide hole 122, and then causes the target 352 to form a film on the end of the electronic component C exposed from the mask hole 112 or the sub-mask 120. Furthermore, the control device 4 controls the slide mechanism 144 to rotate the mask 110, the sub-mask 120, and the receiving table 130 in a horizontal plane using the switching mechanism (pusher 324), and then to shift the relative positions of the guide holes 122.

[0080] [Operation] The process of forming a film on an electronic component C using the film forming apparatus 1 according to the present embodiment as described above will be described with reference to the explanatory diagrams of FIGS. 1 to 11 as well as FIGS. 12 and 13. As a prerequisite for the description, as shown in FIG. 3A, electronic components C are previously accommodated in the mask holes 112 of the mask 110 and the guide holes 122 of the sub-mask 120, which are placed on the receiving table 130. The regulating portions 132 of the receiving table 130 are inserted into the regulating holes 113 of the mask 110, thereby aligning the mask 110 with the receiving table 130 and preventing misalignment. The slide protrusions 124 of the sub-mask 120 are inserted into the slide grooves 114 of the mask 110, thereby preventing the sub-mask 120 from shifting in directions other than the sliding direction.

[0081] The receiving table 130 on which the mask 110 and the sub-mask 120, each containing an electronic component C, are stacked, i.e., the holding member H, is placed on the stage 142 of the holder 140. The holder 140 is placed by an operator from the loading / unloading position PA into each holding hole 212a of the turntable 212 of the supply unit 2, and is transported by the rotation of the turntable 212.

[0082] The holder 140 held in the holding hole 212a is positioned at the delivery position PB. The loading / unloading unit 360 loads the holder 140 into the chamber 31 via the load lock chamber 370. The loaded holder 140 is held on the rotary table 321 while being mounted on the sealing body 323.

[0083] Specifically, when a holder 140 on which a holding member H holding an electronic component C is placed is carried in, as shown in FIG. 9 , in the chamber 31 of the film forming unit 3, the lower end of the load lock chamber 370 is sealed by a seal 323 biased by a pusher 324. At this time, the turntable 321 is stopped with the holding holes 321a positioned at positions corresponding to the respective parts of the film forming unit 3. The pusher 324 arranged corresponding to the load lock chamber 370 passes through the holding holes 321a and rises, and the sealing plate 324c comes into contact with and pushes up the seal 323 directly above, raising the seal 323 to the ceiling of the chamber 31, thereby sealing the lower end of the load lock chamber 370. The chamber 31 is evacuated by the exhaust unit 311.

[0084] The loading / unloading unit 360 has holders 362 provided on both ends of an arm 361, which are positioned above the load lock chamber 370 and at a transfer position PB. At the transfer position PB, the holder 362 of the loading / unloading unit 360 descends and then ascends while holding the holder 140. The arm 361 of the loading / unloading unit 360 rotates, so that the held holder 140 is positioned facing the opening at the top of the load lock chamber 370. The arm 361 then descends, and the holder 362 seals the top end of the load lock chamber 370. As a result, the load lock chamber 370 is hermetically sealed by the seal 323 and the holder 362.

[0085] In this state, the exhaust device 370a exhausts air from the exhaust line 370c, thereby reducing the pressure in the load lock chamber 370 to the same level as that in the chamber 31. The holder 362 releases its hold on the holder 140, so that the holder 140 is placed on the sealing body 323 that seals the load lock chamber 370. Furthermore, as shown in FIG. 12 , the pusher 324 descends, unsealing the load lock chamber 370 and placing the sealing body 323 on the rotary table 321. In this manner, the holder 140 is carried into the chamber 31 of the film forming unit 3. The pusher 324 descends through the holding hole 321a, and the sealing plate 324c separates from the sealing body 323 and moves to a standby position below the lower surface of the rotary table 321. This enables the rotary table 321 to rotate.

[0086] The turntable 321 transports the holder 140 to the heating unit 33, and a pusher 324 disposed corresponding to the heating unit 33 raises the sealing body 323, thereby sealing the holder 140 while accommodating it in the heating chamber. In the heating chamber, the electronic component C is heated. When the heating process is completed or when the electronic component C is about to be transported to the next step, the sealing body 323 is lowered to release the sealing, and the holder 140 is placed on the turntable 321 in preparation for the next transport.

[0087] Next, the rotary table 321 transports the holder 140 to the pre-treatment section 34, and the seal 323 is raised by a pusher 324 disposed corresponding to the pre-treatment section 34, thereby sealing the holder 140 while accommodating it in a treatment chamber. In the treatment chamber, the electronic component C held by the holder 140 is subjected to surface treatment. When the surface treatment is completed or when the electronic component C is about to be transported to the next stage, the seal 323 is lowered to release the seal, and the holder 140 is placed on the rotary table 321 in preparation for the next transport.

[0088] Furthermore, the turntable 321 transports the holder 140 to one of the film formation processing units 35, where a pusher 324 corresponding to the film formation processing unit 35 lifts the sealant 323 to seal the film, and film formation is performed in the electrode formation region R within the film formation chamber 351. The pusher 324 corresponding to this film formation processing unit 35 passes through the holding hole 321a of the stopped turntable 321 and rises, and the sealing plate 324c contacts and pushes up the sealant 323 directly above, lifting the sealant 323 to the ceiling of the chamber 31 and sealing the lower end of the film formation chamber 351. Thereafter, the drive shaft 324b continues to rise and stops the holder 140 at a height at which a film is formed in the film formation chamber 351 (film formation height). When the drive shaft 324b comes into contact with the holder 140, the slide mechanism 144 is connected to a power source via electrodes and wiring provided on the pusher 324.

[0089] 9, 10(B), 10(C), and 3(B), with the holder 140 positioned at the film formation height, the slide mechanism 144 slides the submask 120 so that one corner of the electronic component C on which a film is to be formed (the corner on which a film is to be formed next) faces one corner of the guide hole 122. This brings one corner of the electronic component C into contact with one corner of the guide hole 122.

[0090] After the movement of the submask 120 is completed, power is applied to the target 352 to form a film in the electrode formation region R. At this time, because the target 352 is disposed at an angle as described above, two adjacent side surfaces of one of the four side surfaces of the electronic component C are positioned facing the target 352 used for film formation, and the other side surface is in the shadow of the target 352, as shown in FIG. 11 . Therefore, the film formation material is deposited on the two adjacent side surfaces and the top surface of the electronic component C, but is not deposited on the other two adjacent side surfaces.

[0091] After film formation on two adjacent side surfaces of one of the electronic components C is completed, the holder 140 holding the mask 110, sub-mask 120, and receiving table 130 is rotated 180° parallel to the top surface of the sub-mask 120 by the switching mechanism (pusher 324). This switches the corner of the electronic component C facing the target 352 to the opposite corner. After the switching mechanism rotates the holder 140, the slide mechanism 144 shifts the relative position of the guide hole 122. This brings the corner of the electronic component C diagonally opposite to the corner on which the film has been formed into contact with one corner of the guide hole 122. Film formation is then performed on the other two adjacent side surfaces of the electronic component C (the side surfaces adjacent to the corner diagonally opposite to the corner on which the film has been formed) and on the top surface.

[0092] As described above, the turntable 321 transports the holder 140 to one of the film-forming processing units 35 at film-forming positions P4 to P7, where film formation is performed in the electrode formation region R. When film formation is completed or when the holder is about to be transported to the next stage, the sealing body 323 is lowered to release the seal and prepare for the next transport.

[0093] Furthermore, the turntable 321 transports the holder 140 on which the electronic component C has been formed to the cooling unit 36, and the pusher 324 raises the sealing body 323, thereby sealing the holder 140 while accommodating it in a cooling chamber. In the cooling chamber, the electronic component C is cooled. When the cooling is completed or when the electronic component C is about to be transported to the next stage, the sealing body 323 is lowered to release the sealing and prepare for the next transport.

[0094] Thereafter, the turntable 321 transports the holder 140, which is equipped with the holding member H holding the electronic component C on which the film has been formed, to a load / unload position corresponding to the load lock chamber 370, and by performing the reverse operation of the above-described loading, the load / unload unit 360 unloads the holder 140 from the chamber 31 via the load lock chamber 370. The unloaded holder 140 is held in the holding hole 212a of the turntable 212 positioned at the delivery position PB of the supply unit 2 and is then delivered. Furthermore, the holder 140 is transported by the turntable 212 to the load / unload position PA and is taken out by an operator.

[0095] In this manner, the electrode E is formed on one end of the electronic component C. Next, the formation of the electrode E on the other end of the electronic component C will be described. At this time, the receptacle 130 after the electrode E has been formed on one end of the electronic component C and held in the holding hole 212a will be referred to as receptacle 130A in the following description. Next, the electrode E is formed on the other end of the electronic component C using receptacle 130B, which has been prepared in advance.

[0096] Fig. 8(A) shows a state in which an electronic component C having an electrode E formed on one end is held by a holding member H consisting of a mask 110 and a sub-mask 120 mounted on the receiving table 130A before the receiving table 130B is placed on top of it. Fig. 8(B) is a diagram showing a state in which an operator has placed the receiving table 130B on top of the electronic component C in the state of Fig. 8(A). As shown in Fig. 8(B), the pair of receiving tables 130A and 130B sandwich the mask 110 and the sub-mask 120 via the electronic component C having an electrode E formed on one end of the mask 110 and the sub-mask 120. The restricting portion 132 of the newly placed receiving table 130B enters the restricting hole 123 of the sub-mask 120, aligning the electronic component C and preventing misalignment.

[0097] Then, as shown in FIG. 8(C), the worker inverts (turns over) the two stacked pedestals 130A and 130B together. As a result, the pedestal 130B, which was stacked on top in FIG. 8(B), becomes the bottommost, with one end of the electronic component C on which the electrode E is formed facing downward, and the end face T abuts and is held by the pedestal 130B. At the same time, the sub-mask 120 is positioned on the pedestal 130B, and the mask 110 is positioned on top of that. Therefore, the inverted sub-mask 120 and mask 110 mounted on the inverted pedestal 130B become new holding members H. The restricting portions 132 of the pedestal 130B enter the restricting holes 123 of the sub-mask 120, thereby aligning them and maintaining a state in which misalignment is prevented. Furthermore, the slide protrusions 124 of the sub-mask 120 remain inserted into the slide grooves 114 of the mask 110, allowing the mask 110 and the sub-mask 120 to slide relative to each other, and preventing the mask 110 from shifting in any direction other than the sliding direction.

[0098] As shown in FIG. 8D , the upper receiving table 130A is removed from the new holding member H. This inversion causes the electrode formation region R, one end of which is in contact with the receiving table 130B and the other end of which is not coated with the film-forming material, to protrude from the mask 110 so as to have the same amount of exposure as before inversion. Then, the receiving table 130B, on which the sub-mask 120 containing the electronic component C and the mask 110 are superimposed, i.e., the new holding member H, is placed on the holder 140 at the loading / unloading position PA. Thereafter, the holder 140 is transported from the supply unit 2 to the film-forming unit 3, as described above, and film formation is performed. This allows film formation to be performed on the electrode formation region R opposite the electrode formation region R on which film formation has already been performed, as described above.

[0099] Although the mask 110 and the sub-mask 120 may be upside down, they have a common configuration, and therefore the mask holes 112 function in the same way as the guide holes 122 to mask the film forming material. In other words, the mask 110 and the sub-mask 120 are configured to have the functions of both.

[0100] [Effects] (1) This embodiment provides a film forming apparatus 1 for forming an electrode E on an end portion of a rectangular parallelepiped electronic component C, the film forming apparatus 1 including: a mask 110 having a mask hole 112 that covers a portion of the electronic component C, the mask hole 112 having an opening 112a that is large and has the same shape as a cross section of the electronic component C parallel to the opening 112a; a sub-mask 120 that is overlaid on the mask 110, the sub-mask 120 having a guide hole 122 that covers a portion of the electronic component C exposed through the mask hole 112, the opening 122a of the guide hole 122 having the same shape as a cross section of the electronic component C parallel to the opening 122a, the sub-mask 120 being large and overlaid on the mask 110; a support 130 that holds one surface of the mask 110 and that comes into contact with one end surface T of the electronic component C that has passed through the mask hole 112; a chamber 31 that can be evacuated; and a target 352 that is disposed in a film forming chamber 351 provided in the chamber 31 and that contains a film forming material that is deposited on the electronic component C by sputtering.

[0101] The target 352 is arranged so that the normal N of the sputtering surface of the target 352 faces the upper surfaces of the mask 110 and sub-mask 120 at an angle, and the mask 110 and sub-mask 120 are arranged so that one corner of the mask hole 112 and the guide hole 122 faces the normal N of the target 352.Furthermore, the mask 110 and sub-mask 120 have a slide mechanism 144 that shifts the relative position of the guide hole 122 so that one corner of the electronic component C comes into contact with one corner of the guide hole 122 facing the normal N of the target 352.

[0102] The film forming apparatus 1 also has a control device 4 that uses a slide mechanism 144 to bring one corner of the electronic component C on the side where the film is to be formed into contact with one corner of the mask hole 112 or the guide hole 122, and then uses a target 352 to form a film on the end of the electronic component C that is exposed from the mask hole 112 or the submask 120.

[0103] Therefore, the side surface S of the electronic component C facing the tilted target 352 and on which a film is to be formed can be brought into close contact with the opening 122a of the guide hole 122 or the opening 112a of the mask hole 112, preventing the formation of gaps through which the film-forming material can penetrate. Therefore, the boundary between the electrode E, which is the region on which the electrode material is to be formed, and the region on which the electrode material is not to be formed can be made uniform and clear, thereby reducing variations in appearance and quality. In particular, by utilizing the corners of the rectangular parallelepiped electronic component C and the corners of the guide hole 122 and mask hole 112, the electronic component C can be aligned in a fixed position during film formation, thereby more reliably making the boundary between the region on which the film is to be formed and the region on which the film is not to be formed uniform and clear.

[0104] For example, as shown in FIG. 14A , if a film is formed with a gap between the electronic component C and the mask hole 112, the film-forming material will seep in through the gap during film formation. As a result, as shown in FIG. 14B , the film will be formed in an area extending beyond the electrode formation region R, and the boundary between the film-forming region and the non-film-forming region will be unclear. In this embodiment, as described above, the corner of the electronic component C facing the target 352 is brought into contact with the corner of the guide hole 122, thereby closing the gap between the guide hole 122 and the two adjacent side surfaces of the electronic component C. This prevents the film-forming material from seeing between these two side surfaces and the guide hole 122, as shown in FIGS. 4A and 4B , and clearly defines the boundary between the film-forming region and the non-film-forming region.

[0105] (2) The device includes a holder 140 that holds the mask 110, the sub-mask 120, and the receiving table 130, and a switching mechanism (pusher 324) that switches one corner of the electronic component C that faces the target 352 to the opposite corner by rotating the holder 140. After the mask 110, the sub-mask 120, and the receiving table 130 are rotated by the switching mechanism, the slide mechanism 144 shifts the relative positions of the guide holes 122.

[0106] In this way, by rotating the holder 140 using the switching mechanism (pusher 324), the side of the electronic component C facing the target 352 can be switched, and a film can be formed uniformly and without unevenness in the film formation material on all four side surfaces of the electronic component C. Furthermore, by providing a pair of targets 352 as in this embodiment, after one target 352 is consumed, the other target 352 can be immediately used, allowing for continuous operation. Alternatively, one of the targets 352 can contain a different film formation material. It is also possible to use only one target 352. The number of targets 352 may be one or three or more. In any case, the switching mechanism may rotate the holder 140 so that the corner of the electronic component C faces the target 352 used for film formation.

[0107] When multiple targets 352 are used, the multiple targets 352 can be used one by one in succession, thereby extending the maintenance interval and shortening downtime, thereby increasing productivity. Also, the targets 352 can be switched each time a film is formed. In this case, the usage period of each target 352 can be extended. Furthermore, the maintenance interval can be extended and downtime can be shortened, thereby increasing productivity.

[0108] After film formation on two adjacent side surfaces of one side of the electronic component C is completed, the sub-mask 120 may be slid to the other side by the slide mechanism 144, as shown in FIGS. 13, 10D, and 10E. This results in one corner of the electronic component C, opposite to the above, contacting one corner of the mask hole 112. Furthermore, due to the tilted positioning of the target 352, the other two adjacent side surfaces of the four side surfaces of the electronic component C are positioned facing the target 352 on the opposite side, while one side surface is in a shadow relative to the target 352. By forming a film using the target 352 in this state, the film material is deposited on the other two adjacent side surfaces of the electronic component C (the side surfaces adjacent to the corner diagonally opposite to one corner of the electronic component C on which film formation has been performed) and on the top surface, but is not deposited on the two side surfaces on which film formation has already been performed. This can also be achieved with three or more targets 352. This allows for film formation with clear boundaries, as described above, and improves productivity.

[0109] (3) A plurality of film formation chambers 351 are provided, and a transport unit 32 is provided to support a plurality of sets of masks 110, sub-masks 120, and receiving tables 130, and to position each set of masks 110, sub-masks 120, and receiving tables 130 in a position facing the film formation chamber 351. The transport unit 32 has a seal 323 that seals the film formation chamber 351, and while maintaining a vacuum within the chamber 31, the seal 323 seals the film formation chamber 351 and accommodates the mask 110, sub-mask 120, and receiving tables 130 in the film formation chamber 351, and an opening / closing mechanism (pusher 324) that moves the film formation chamber 351 between this sealed position and an open position in which the seal 323 opens the film formation chamber 351 and ejects the mask 110, sub-mask 120, and receiving tables 130 from the film formation chamber. Therefore, films can be formed sequentially in the plurality of film forming chambers 351, which makes it possible to form films without contamination using a plurality of types of film forming materials and to form films of desired thicknesses.

[0110] (4) The angle formed between a plane parallel to the opening of the guide hole 122 and a plane of the target 352 facing the submask 120 is greater than 0 degrees and less than 90 degrees. This makes it possible to create a shadow region on the side of the electronic component C opposite to the side facing the target 352, where the film forming material does not wrap around.

[0111] When film formation is performed by blocking two side surfaces of the electronic component C with one corner of the guide hole 122, gaps are created on the two diagonal side surfaces. Because this region is in the shadow as described above, even if a gap is created, film formation material will not get into the gap and film formation will not occur, allowing film formation with a clear boundary.

[0112] Furthermore, at this time, the electronic component C pressed by the sub-mask 120 hits a corner of the mask 110 and stops. That is, a gap is created on the side of the mask hole 112 facing the target 352. However, the mask hole 112 is covered by the sub-mask 120, and the gap is hidden. This means that there is no problem even if a gap is created in the mask hole 112.

[0113] 11 , the normal N of the target 352 can be regarded as the direction in which sputtered particles fly from the target 352. The normal N of the target 352 is inclined at an angle α closer to 90° with respect to the horizontal than the line dl connecting the edge of the end face T of the electronic component C and the edge of the guide hole 122. Therefore, deposition is also suppressed in the gap between the guide hole 122 and the electronic component C on the opposite side of the target 352.

[0114] In this embodiment, the mask 110 and the sub-mask 120 have the same thickness. The difference between this thickness and the longitudinal length of the electronic component C determines the extent to which the electronic component C protrudes and exposes its side surface, and therefore the thickness of both is determined by the size of the electronic component C and the size of the desired film formation area. Because the angle of the target 352 cannot be easily changed, in order to avoid this change, the thicknesses of the mask 110 and the sub-mask 120 are determined so as to have an angle that casts a shadow as described above.

[0115] Furthermore, when depositing films on the two opposing side surfaces of the electronic component C, the upper end surface T is deposited twice. Therefore, the film formed on this end surface T is thicker. The closer the angle of the end surface T toward the target 352 is to 90 degrees, the thicker the deposited film. In other words, when the normal N faces the end surface T of the electronic component C at an angle less than 45 degrees (a tilted angle) (a direction in which α approaches 90 degrees), the deposited film can be thinner on the end surface T than on the side surfaces. Simulations, experiments, etc. may be performed to balance the film thickness on the side surfaces (one film deposition on each side surface) and the film thickness on the end surface T by depositing films twice.

[0116] [Modifications] The following modifications are also possible for this embodiment. (1) The sub-mask 120 may be formed as a plate that is thinner than the mask 110. In this case, for example, as shown in FIG. 15 , the sub-masks 120 may be placed on both sides of the mask 110, and one of the sub-masks 120 may be slid to move the corners of the electronic component C toward the corners of the sub-mask 120. After inversion, the other sub-mask 120 may be slid to move the corners of the electronic component C toward the corners of the sub-mask 120. The sum of the lengths of the mask hole 112 and the two guide holes 122 in the directions of the axes Axm and Axn when the mask 110 and the two sub-masks 120 are placed on top of each other is set to be equal to the length of the non-sputtered region of the electronic component C in the direction of the axis Axc.

[0117] As a result, the region covering the electronic component C can be adjusted to a desired thickness by changing only the dimensions of either the mask 110 or the pair of sub-masks 120, making it easy to set the required film-formed region or non-film-formed region. This dimension can be maintained even if the mask 110 or the pair of masks 110 are inverted.

[0118] (2) The slide mechanism 144 may be provided in the film formation processing unit 35. For example, the slide mechanism 144 may be configured such that the edge of the sub-mask 120 accommodated in the film formation chamber 351 is positioned on the drive shafts of pushers 144 a, 144 b provided in the film formation chamber 351, and the sub-mask 120 is urged to slide by the pushers 144 a, 144 b. In other words, the slide mechanism 144 is provided at a position (height direction) corresponding to the position of the sub-mask 120 in the mask 110 and sub-mask 120 into which the electronic component C, which has been raised together with the pedestal 130 by the pusher 324, is inserted.

[0119] When the film forming processing unit 35 is provided with the slide mechanism 144, the slide mechanism 144 can be fixed in place, which facilitates the connection of wiring, piping, etc., and reduces the weight of the holder 140. The configuration of the holder 140 is simplified, which reduces the transport load and saves energy. When there are multiple targets 352, multiple sets of slide mechanisms 144 are provided corresponding to the targets 352 so that they can slide in the direction toward each target 352.

[0120] Furthermore, when the film formation processing unit 35 is provided with a slide mechanism 144, as shown in Fig. 16, the slide mechanism 144 may be configured to slide the sub-mask 120 while pressing the surface of the sub-mask 120, rather than biasing the edge of the sub-mask 120. In this case, the slide mechanism 144 can come into contact with the surface of the sub-mask 120 when the holder 140 is raised from below and positioned at the film formation height. Therefore, precise height positioning is not required, which shortens the takt time and improves productivity.

[0121] (3) The supply unit 2 may have an inversion mechanism that inverts the holding member H, which is composed of the sub-mask 120, the mask 110, and the receiving table 130, to switch the portion of the electronic component C exposed through the mask hole 112 or the guide hole 122 from a portion including one end face T to a portion including the other end face T. For example, as shown in FIG. 17 , an inversion mechanism 500 that inverts the sub-mask 120 and the mask 110 while they are sandwiched between the receiving table 130 (see FIGS. 8B and 8C ) is provided at an inversion position PD set in the transport unit 210. A transfer device 420 that removes the receiving table 130 from the receiving portion 213 of the receiving table 130 provided in the center of the transport unit 210 and places the receiving table 130 on the end face T of the electronic component C exposed through the guide hole 122 of the sub-mask 120 so as to cover the sub-mask 120. At the removal position PE, which is set after the inversion position PD, there is provided a transfer device 410 that removes the receiving table 130 from the inverted mask 110 and places it on the mounting section 213. This allows the replacement of the receiving table 130 and the inversion of the holding member H to be performed automatically. In the embodiment shown in Fig. 17, the rotary table 212 rotates intermittently clockwise as viewed in the drawing.

[0122] (4) The supply unit 2 may have an insertion device 600 that inserts electronic components C into the guide holes 122 and the mask holes 112. For example, as shown in Fig. 17, an insertion mechanism 620 is provided that removes a plurality of electronic components C from a stocker 610 that stores the electronic components C and drops them above the guide holes 122, thereby inserting the electronic components C into each guide hole 122. This allows the electronic components C to be automatically inserted into the guide holes 122 and the mask holes 112.

[0123] The film formation procedure in this mode is described below. [1] Holding of holding member First, an empty holding member H (receiving table 130, mask 110, and sub-mask 120) without an electronic component C inserted therein is held in eight holding holes 212a evenly spaced on the rotary table 212.

[0124] [2] Insertion of Electronic Components The insertion mechanism 620 inserts electronic components C into the overlapping mask holes 112 and guide holes 122 of an empty holding member H positioned at the loading / unloading position PA. The holding member H with the electronic components C inserted therein moves to the next position by the intermittent rotation of the turntable 212 clockwise in the drawing.

[0125] [3] Transfer of the holding member to the film-forming unit The holding member H is transported to the delivery position PB by the intermittent rotation of the turntable 212, passing through the placement position PC, the inversion position PD, and the removal position PE. The carrying-in / carry-out unit 360 transfers the holding member H to the film-forming unit 3.

[0126] [4] Film Formation on One End of Electronic Component As described above, by intermittent rotation of the turntable 321, the holding member H is transported to the heating unit 33, where the electronic component C is heated, then transported to the pre-treatment unit 34, where the electronic component C is subjected to surface treatment, and then transported to the film-forming treatment units 35 (P4 to P7), where a film is formed on one end of the electronic component C. In the film-forming treatment, one corner of the electronic component C is brought into contact with one corner of the guide hole 122, and a film is formed on one of two adjacent side surfaces and the top surface of the electronic component C. After that, a corner of the electronic component C diagonally opposite the one corner is brought into contact with the corner opposite the one corner of the guide hole 122, and a film is formed on the other two adjacent side surfaces and the top surface of the electronic component C. The holding member H is transported to the cooling unit 36, where the electronic component C is cooled.

[0127] [5] Returning the holding member to the loading / unloading section The holding member H is transported to the supply position P1 and returned to the supply section 2 by the loading / unloading section 360. The returned holding member H passes through the loading / unloading position PA and is transported to the placement position PC.

[0128] [6] Reversing Holding Member The transfer device 420 places the receiving table 130 over the holding member H. The holding member H is transported to the reversal position PD, where the reversal mechanism 500 reverses (turns over) the holding member H. The reversed holding member H is transported to the removal position PE. At the removal position PE, the transfer device 410 removes the receiving table 130 located on the top surface. The removed receiving table 130 is returned to the placement section 213.

[0129] [7] Returning the Holding Member to the Film Forming Unit The inverted holding member H is transported to the delivery position PB and returned to the film forming unit 3 by the carry-in / carry-out unit 360.

[0130] [8] Film formation on the other end of the electronic component The holding member H returned to the film formation unit 3 is transported to the heating unit 33, where the electronic component C is heated, then to the pre-treatment unit 34, where the electronic component C is surface-treated, and then to each film-forming treatment unit 35 (P4 to P7), where the film is formed on the other end of the electronic component C. The film is formed on the other end in the same manner as the film is formed on one end. Thereafter, the holding member H is transported to the cooling unit 36, where the electronic component C is cooled.

[0131] [9] Returning the holding member to the loading / unloading section The holding member H having the electrodes E formed on both ends is transported to the supply position P1 and returned to the supply section 2 by the loading / unloading section 360. The returned holding member H is transported to the loading / unloading position PA.

[0132]

[10] Unloading of Electronic Components The electronic components C with electrodes formed on both ends are unloaded by the insertion device 600. By repeating the above operation, electronic components C with films formed on both ends are manufactured.

[0133] When the holding member H is loaded into the film-forming unit 3, it is preferable that the diagonal lines of the guide holes 122 in the sub-mask 120 and the mask holes 112 in the mask 110 are parallel to a line passing through the center of rotation of the transport unit 32. Therefore, it is preferable to rotate the mask 110 and the sub-mask 120 horizontally to the above-mentioned angle from the loading / unloading position PA to any position before the heating position P2. This rotation may be performed at any position between the loading / unloading position PA and the transfer position PB, or at the supply position P1. For example, as shown in FIG. 9 , the pusher 324 may receive the encapsulated body 323, rotate the drive shaft 324b to the above-mentioned angle, and then place the encapsulated body 323 on the turntable 321. Alternatively, the holding body 362 of the loading / unloading unit 360 may be rotatably mounted, and the holder 140 may be rotated to the above-mentioned angle before being handed over to the encapsulated body 323.

[0134] [Other Embodiments] While the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims.

[0135] REFERENCE SIGNS LIST 1 Film forming apparatus 2 Supply unit 2a Housing 3 Film forming unit 4 Control device 31 Chamber 32 Transport unit 33 Heating unit 34 Pre-processing unit 35 Film forming processing unit 36 ​​Cooling unit 37 Load lock unit 110 Mask 111 Plate 112 Mask hole 112a Opening 112b Compartment 113 Restricting hole 114 Slide groove 120 Submask 121 Plate 122 Guide hole 122a Opening 122b Compartment 123 Restricting hole 124 Slide protrusion 130, 130A, 130B Receiving table 131 Plate 132 Restricting unit 140 Holder 141 Base 142 Stage 142a Hole 143 Extension 144 Slide mechanism 144a, 144b Pusher 210 Conveyor section 211 Motor 212 Rotary table 212a Holding hole 213 Placement section 311 Exhaust section 321 Rotary table 321a Holding hole 322 Drive source 323 Sealing body 324 Pusher 324a Drive shaft 324b Sealing plate 351 Film formation chamber 351a Container 352 Target 353 Shutter 360 Loading / unloading section 361 Arm 362 Holder 370 Load lock chamber 370a Exhaust device 370b Valve 370c Exhaust line 370d Valve 370e Vent line 410 Transfer device 420 Transfer device 500 Reversal mechanism 600 Insertion device 610 Stocker 620 Loading mechanism Axc axis Axm axis Axn axis C Electronic component E Electrode En Internal electrode H Holding member R Electrode formation area S Side surface T End surface α Angle

Claims

1. A film forming apparatus for forming an electrode on an end portion of a rectangular parallelepiped electronic component, a mask having a mask hole that covers a part of the electronic component, the opening of the mask hole having the same shape and size as a cross section of the electronic component parallel to the opening; a sub-mask overlaid on the mask, the sub-mask having a guide hole covering a part of the electronic component exposed through the mask hole, the opening of the guide hole having the same shape as and large as a cross section of the electronic component parallel to the opening; a support that holds one surface of the mask and that is in contact with one end of the electronic component that has passed through the mask hole; a chamber capable of creating a vacuum inside; a target disposed in a film formation chamber provided in the chamber, the target containing a film formation material to be deposited on the electronic component by sputtering to form a film; and the target is disposed such that a normal to a sputtering surface of the target is inclined and faces the upper surfaces of the mask and the submask; the mask and the sub-mask are arranged such that one corner of the mask hole and one corner of the guide hole are oriented toward the normal to the target; the mask and the sub-mask further include a slide mechanism that shifts the relative positions of the guide holes so that one corner of the guide hole, which faces the normal line of the target, comes into contact with one corner of the electronic component; A film forming apparatus characterized by having a holder that holds the mask, the sub-mask, and the receiving table, and a switching mechanism that switches one corner of the electronic component facing the target to the opposite corner by rotating the holder.

2. 2. The film forming apparatus according to claim 1, further comprising a control device that uses the slide mechanism to bring one corner of the electronic component on the side where the film is to be formed into contact with one corner of the mask hole or the guide hole, and then uses the target to form a film on the end of the electronic component exposed from the mask hole or the submask.

3. 2. The film deposition apparatus according to claim 1, wherein the slide mechanism shifts the relative positions of the guide holes after the switching mechanism rotates the mask, the sub-mask, and the pedestal.

4. A plurality of the film formation chambers are provided, a transport unit that positions a plurality of holders, each of which holds a plurality of sets of the mask, the sub-mask, and the receiving table, at positions facing the film formation chamber; an opening and closing mechanism having a sealing body that seals the film formation chamber, the opening and closing mechanism moving the sealing body between a sealing position where the sealing body seals the film formation chamber and accommodates the holder holding the mask, the sub-mask, and the pedestal in the film formation chamber while maintaining a vacuum in the chamber, and an opening position where the sealing body opens the film formation chamber and ejects the holder from the film formation chamber; 2. The film forming apparatus according to claim 1, further comprising:

5. 2. The film forming apparatus according to claim 1, wherein an angle formed between a plane parallel to the opening of the mask hole or the guide hole and a plane of the target facing the sub-mask is greater than 0 degrees and less than 90 degrees.

6. the portion of the electronic component exposed through the mask hole or the guide hole includes either one of both end portions of the electronic component, a supply unit that supplies the electronic components inserted into the guide holes and the mask holes to the chamber; The film forming apparatus according to claim 1, characterized in that the supply unit has an inversion mechanism that inverts the sub-mask, the mask, and the support table to switch the portion of the electronic component exposed from the guide hole from a portion including one end to a portion including the other end.

7. 7. The film forming apparatus according to claim 6, wherein the mask and the sub-mask have the same thickness in the axial direction of the mask holes and the guide holes.

8. 7. The film forming apparatus according to claim 6, wherein a pair of said sub-masks are superimposed on both sides of said mask.