Detection device

Abstract

A detection device (1) comprises: a board (21) having a cutout part (22) between both ends in a first direction; a terminal part provided at one end of the board (21) in the first direction; a first optical sensor (10A) provided on the board (21) between the cutout part (22) and the terminal part; a second optical sensor (10B) provided on the board (21) between the cutout part (22) and the other end of the board (21); and a flexible printed circuit board (70) on which a light source (60) and a plurality of electronic components are mounted. A lower electrode of each of the first optical sensor (10A) and the second optical sensor (10B) is electrically connected to the terminal part. The terminal part is connected to a first end of the flexible printed circuit board (70). The board (21) is disposed at a position where the flexible printed circuit board (70) is bent and the cutout part (22) of the board (21) overlaps the light source (60).

Description

Detection Device

[0001] The present invention relates to a detection device.

[0002] BACKGROUND ART There are known devices for detecting biological information from a human body. Patent Document 1 discloses a pulse wave sensor that can measure pulse waves without restricting the movement of a subject.

[0003] JP 2012-065900 A

[0004] If a substrate having a plurality of optical sensors, a light source, and a battery are separately fixed and housed inside an annular housing, the housing will become large.

[0005] An object of the present invention is to provide a detection device that can be made compact even when it houses a substrate having an optical sensor and members connected to the substrate.

[0006] A detection device according to one embodiment of the present invention comprises a substrate having a cutout between both ends in a first direction, a terminal provided at one end of the substrate in the first direction, a first optical sensor provided on the substrate between the cutout and the terminal, a second optical sensor provided on the substrate between the cutout and the other end of the substrate, and a flexible printed circuit board on which a light source and a plurality of electronic components are mounted, wherein each of the first optical sensor and the second optical sensor is formed by stacking a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode, and a sealing film on the substrate in this order, the lower electrodes of the first optical sensor and the second optical sensor being electrically connected to the terminal, and the terminal being connected to a first end of the flexible printed circuit board, and the substrate is positioned such that the cutout of the substrate overlaps with the light source when the flexible printed circuit board is bent.

[0007] A detection device according to one embodiment of the present invention comprises a substrate having an optical sensor, a terminal portion provided at one end of the substrate in a first direction, and a flexible printed circuit board on which a light source and a plurality of electronic components are mounted, wherein the optical sensor is formed by stacking a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode, and a sealing film on the substrate in this order, each of the lower electrode and the upper electrode of the optical sensor being electrically connected to the terminal portion, the terminal portion being connected to a first end of the flexible printed circuit board, and the substrate being arranged such that the flexible printed circuit board is bent and the other end of the substrate in the first direction is positioned adjacent to the light source.

[0008] FIG. 1 is a schematic diagram showing an example of the appearance of a detection device according to embodiment 1 when a finger is placed inside the detection device, as viewed from the side of the housing. FIG. 2 is a schematic cross-sectional view taken along the line A-A in FIG. 1. FIG. 3 is a developed view showing an example of the front side of the substrate and the flexible printed circuit board shown in FIG. 1 when unfolded. FIG. 4 is a developed view showing an example of the back side of the substrate and the flexible printed circuit board shown in FIG. 1 when unfolded. FIG. 5 is a developed view showing the flexible printed circuit board shown in FIG. 4 in a bent state. FIG. 6 is a side view of the substrate and the flexible printed circuit board shown in FIG. 5. FIG. 7 is a schematic cross-sectional view showing an example of the stacked structure of an optical sensor taken along the line B-B in FIG. 3. FIG. 8 is a schematic cross-sectional view showing an example of the stacked structure of an optical sensor taken along the line C-C in FIG. 3. FIG. 9 is a developed view showing an example of the front side of the substrate and the flexible printed circuit board according to embodiment 2 when unfolded. FIG. 10 is a developed view showing an example of the back side of the substrate and the flexible printed circuit board according to embodiment 2 when unfolded. FIG. 11 is a developed view showing the flexible printed circuit board shown in FIG. 10 in a bent state. Fig. 12 is a side view of the substrate and flexible printed circuit board shown in Fig. 11. Fig. 13 is a development view showing an example of development of the front side of the substrate and the flexible printed circuit board of embodiment 3. Fig. 14 is a development view showing an example of development of the back side of the substrate and the flexible printed circuit board of embodiment 3. Fig. 15 is a development view showing a state in which the flexible printed circuit board shown in Fig. 14 is bent. Fig. 16 is a side view of the substrate and the flexible printed circuit board shown in Fig. 15.

[0009] Modes for carrying out the invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, for clarity of explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each figure, elements similar to those described above with reference to the previous figures may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] In this specification and claims, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0011] (Embodiment 1) FIG. 1 is a schematic diagram showing an example of the appearance of a detection device according to embodiment 1 when a finger is placed inside the detection device, as viewed from the side of the housing. FIG. 2 is a schematic cross-sectional view taken along the line A-A in FIG. 1. FIG. 3 is a developed view showing an example of the front side of the substrate and the flexible printed circuit board shown in FIG. 1 when unfolded. FIG. 4 is a developed view showing an example of the back side of the substrate and the flexible printed circuit board shown in FIG. 1 when unfolded. FIG. 5 is a developed view showing the flexible printed circuit board shown in FIG. 4 in a bent state. FIG. 6 is a side view of the substrate and the flexible printed circuit board shown in FIG. 5. FIG. 7 is a schematic cross-sectional view showing an example of the stacked structure of an optical sensor taken along the line B-B in FIG. 3. FIG. 8 is a schematic cross-sectional view showing an example of the stacked structure of an optical sensor taken along the line C-C in FIG. 3.

[0012] The detection device 1 shown in FIG. 1 is a ring-shaped device that can be attached to and detached from the human body, and is worn on a finger Fg of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, little finger, etc. The human body is an individual to be authenticated, whose identity is verified by the detection device 1. The detection device 1 can detect biometric information about a living body from the finger Fg on which it is worn. The finger Fg is an example of a measurement target. The measurement target is a living body or part of a living body, and is a measurement target. The detection device 1 is made into a ring or wristband, making it easy for the user to carry. In the following description, it is assumed that the detection device 1 is used as a ring.

[0013] 2, the detection device 1 includes a housing 200, a substrate 21, a light source 60, a first optical sensor 10A, a second optical sensor 10B, and a flexible printed circuit board 70. The detection device 1 includes a battery 300 connected to the flexible printed circuit board 70 inside the housing 200, and is a device that operates using power from the battery 300. The substrate 21 and the flexible printed circuit board 70 are electrically connected.

[0014] The housing 200 is formed in a ring shape (annular shape) that can be worn on the finger Fg and is a wearable component that is worn on a living body. In the example shown in FIG. 2 , the housing 200 includes a first housing 210 and a second housing 220. The first housing 210 and the second housing 220 are integrally formed into a ring shape. The first housing 210 is a component that comes into contact with the human body on which the housing 200 is worn. The first housing 210 houses the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. The first housing 210 is formed in a ring shape using a housing material such as a transparent synthetic resin or silicone. The first housing 210 has a light irradiator 60R that protrudes inward, allowing light from the light source 60 to be irradiated onto the finger Fg from the light irradiator 60R. The light irradiator 60R is, for example, a translucent convex lens.

[0015] Second housing 220 has a surface of housing 200 that covers part of outer peripheral surface 210A of first housing 210. Second housing 220 is formed in a ring shape from a material such as metal or non-transparent synthetic resin. In this embodiment, second housing 220 is provided on the top surface of first housing 210, i.e., the surface that corresponds to the surface of finger Fg on the back of the hand, but may also be configured to cover the entire top surface of first housing 210.

[0016] The housing 200 accommodates a flexible printed circuit board 70, on which the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. are mounted, and a battery 300, inside the first housing 210. The flexible printed circuit board 70 is accommodated inside the first housing 210 with a first end 71 bent at a bending portion 73. A substrate 21, on which the first optical sensor 10A and the second optical sensor 10B are mounted, is connected to the first end 71 of the bending portion 73. The flexible printed circuit board 70 is accommodated inside the housing 200 by, for example, forming the housing 200 in a ring shape using a mold and filling the periphery with a filler material. The detection device 1 is disposed inside the housing 200, more inward than the flexible printed circuit board 70, so that light from the finger Fg can be received by the first optical sensor 10A and the second optical sensor 10B.

[0017] 2 to 4 , the flexible printed circuit board 70 is formed in a deformable band shape extending from a first end portion 71 to a second end portion 72. The flexible printed circuit board 70 has mounting areas 73A, 73B, 73C, 73D, and 73E provided between the first end portion 71 and the second end portion 72. On the first surface 70A of the flexible printed circuit board 70, the light source 60 is mounted in the mounting area 73C located in the center of the mounting areas 73A, 73B, 73C, 73D, and 73E, and the remaining areas are unmounted. In other words, the first surface 70A of the flexible printed circuit board 70 is the surface on which the light source 60 is mounted, and the second surface 70B is the surface on which the light source 60 is not mounted.

[0018] On a second surface 70B opposite to the first surface 70A of the flexible printed circuit board 70, electronic components are mounted in each of mounting areas 73A, 73B, 73C, 73D, and 73E. The electronic components include, for example, a control circuit 122 in the mounting area 73A, a detection circuit 123 in the mounting area 73B, a control circuit 124 in the mounting area 73C, a control circuit 125 in the mounting area 73D, and a power supply circuit 126 in the mounting area 73E.

[0019] As shown in FIG. 2 , the flexible printed circuit board 70 has a substrate 21 having a cutout portion 22 shown in FIGS. 3 and 4 mounted on it so as to straddle the vicinity of the light source 60 in the mounting area 73C. As shown in FIG. 3 , the substrate 21 has the first optical sensor 10A, the second optical sensor 10B, etc. mounted on a surface 21H. As shown in FIGS. 3 and 4 , the flexible printed circuit board 70 electrically connects the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. to the electronic device. The substrate 21 is connected to a first end portion 71 of the flexible printed circuit board 70 so that the surface 21H on which the first optical sensor 10A, the second optical sensor 10B, etc. are mounted is continuous with the second surface 70B of the flexible printed circuit board 70.

[0020] 2 , the first optical sensor 10A and the second optical sensor 10B are disposed so as to sandwich the light source 60 in the circumferential direction 200C. That is, the detection device 1 is disposed so as to line up the first optical sensor 10A, the light source 60, and the second optical sensor 10B in this order in the circumferential direction 200C. By disposing the first optical sensor 10A and the second optical sensor 10B so as to sandwich the light source 60 in the circumferential direction 200C, the first optical sensor 10A and the second optical sensor 10B can detect light emitted by the light source 60 around the light source 60.

[0021] As shown in FIGS. 2 to 4 , the detection device 1 further includes a substrate 21 and a terminal portion 40. The substrate 21 is an insulating substrate, for example, formed in a strip shape using a film-like resin or the like. The first optical sensor 10A and the second optical sensor 10B are mounted on a surface 21H of the substrate 21, making the substrate 21 deformable. The terminal portion 40 is provided at one end 21A of the surface 21H of the substrate 21. As shown in FIG. 4 , the substrate 21 is attached to a flexible printed circuit board 70 via the terminal portion 40, thereby electrically connecting the substrate 21 to the flexible printed circuit board 70. That is, in a plan view, the back surface 21R of the substrate 21 is continuous with the first surface 70A of the flexible printed circuit board 70. The flexible printed circuit board 70 has a battery charging coil 127 provided at a second end 72. The battery charging coil 127 is formed by winding a conductor inside the flexible printed circuit board 70.

[0022] In the following description, the first direction Dx is a direction in a plane parallel to the substrate 21 and the flexible printed circuit board 70, and is the same direction as the circumferential direction 200C. The second direction Dy is a direction in a plane parallel to the substrate 21, and is a direction perpendicular to the first direction Dx. The second direction Dy may intersect with the first direction Dx without being perpendicular thereto. The third direction Dz is a direction perpendicular to the first direction Dx and the second direction Dy. The third direction Dz is a normal direction to the substrate 21. In addition, "plan view" refers to the positional relationship when viewed from a direction perpendicular to the substrate 21.

[0023] 2 to 4 , the battery 300 is a film-type lithium ion battery that is bendable. The battery 300 is electrically connected to the power supply circuit 126 in the mounting area 73E on the second surface 70B of the flexible printed circuit board 70 via a connection portion 310. The width of the battery 300 in the first direction Dx is equal to or less than the width of the flexible printed circuit board 70 in the second direction Dy, and the length of the battery 300 in the first direction Dx is shorter than the length of the flexible printed circuit board 70 in the first direction Dx. This allows the detection device 1 to be mounted on the flexible printed circuit board 70 so that the battery 300 does not protrude from the flexible printed circuit board 70.

[0024] 5 and 6 , the first end 71 of the flexible printed circuit board 70 is bent at the bending portion 73, so that the first optical sensor 10A and the second optical sensor 10B are positioned on both sides of the light source 60 in the circumferential direction 200C of the housing 200. The substrate 21 has a cutout portion 22 between both ends in the circumferential direction 200C of the housing 200, i.e., in the first direction Dx (longitudinal direction) of the substrate 21. The first optical sensor 10A is positioned on one end 21A side of the cutout portion 22, and the second optical sensor 10B is positioned on the other end 21B side of the cutout portion 22. The flexible printed circuit board 70 is bent at the bending portion 73, so that the cutout portion 22 of the substrate 21 is positioned to overlap the light source 60. The notch 22 being positioned to overlap the light source 60 means that the light source 60 is attached to the flexible printed circuit board 70 with the light source 60 positioned in the area of ​​the notch 22 of the substrate 21. The substrate 21 may or may not be fixed to the flexible printed circuit board 70 by an adhesive member.

[0025] The terminal unit 40 is a member for electrically connecting the first optical sensor 10A and the second optical sensor 10B on the substrate 21 to the control circuit 122 and the power supply circuit 126 on the flexible printed circuit board 70. The terminal unit 40 supplies a power signal (electric power) from the power supply circuit 126 to the first optical sensor 10A and the second optical sensor 10B via wiring. The terminal unit 40 has a plurality of terminals (not shown) and is configured to be electrically connectable to a plurality of wirings.

[0026] The terminal portion 40 is provided at one end 21A of the substrate 21 in the first direction Dx. As shown in FIG. 4 , the terminal portion 40 is connected to a connection portion (not shown) at a first end 71 of a first surface 70A of the flexible printed circuit board 70. When the electrically connected flexible printed circuit board 70 is bent at a bending portion 73, the terminal portion 40 is sandwiched between the first surfaces 70A of the flexible printed circuit boards 70, as shown in FIG. 6 , and is accommodated in the housing 200 in this state. The terminal portion 40 supplies power from the power supply circuit 126 to the first optical sensor 10A and the second optical sensor 10B.

[0027] 2 , the flexible printed circuit board 70 is housed inside the housing 200 such that a first surface 70A on which the first optical sensor 10A, the second optical sensor 10B, and the light source 60 are mounted faces an inner peripheral surface 200B of the housing 200. If the flexible printed circuit board 70 is translucent, the first optical sensor 10A, the second optical sensor 10B, and the light source 60 may be mounted on a second surface 70B opposite the first surface 70A. In this case, the light source 60 may be disposed so that it emits light toward the flexible printed circuit board 70 and the light that has passed through the flexible printed circuit board 70 is emitted toward the outside of the housing 200.

[0028] As shown in FIG. 2 , the light source 60 is provided inside the first housing 210 of the housing 200 and is configured to be able to irradiate light toward the finger Fg wearing the housing 200. For example, an inorganic light emitting diode (LED) or an organic light emitting diode (OLED) is used as the light source 60. The light source 60 irradiates light of a predetermined wavelength. In the example shown in FIGS. 4 and 5 , the light source 60 includes a first light source 61 that irradiates red light, a second light source 62 that irradiates near-infrared light, and a second light source 63 that irradiates green light.

[0029] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include pulse waves, pulse rates, and blood vessel images of the finger or palm. That is, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects vascular patterns such as veins.

[0030] Each of the first optical sensor 10A and the second optical sensor 10B detects light emitted by the light source 60 and reflected by a finger Fg or the like, directly incident light, etc. The first optical sensor 10A and the second optical sensor 10B are organic photodiodes (OPDs). The first optical sensor 10A is provided on the housing 200 so as to be adjacent to one end of the light source 60 in the circumferential direction 200C of the housing 200. The second optical sensor 10B is provided on the housing 200 so as to be adjacent to the other end of the light source 60 in the circumferential direction 200C of the housing 200.

[0031] 7, the first optical sensor 10A includes a substrate 21 and a photodiode PD. In this embodiment, the first optical sensor 10A further includes a wiring 26 and an insulating layer 27.

[0032] A wiring 26 is provided on the upper surface of the region of the substrate 21 corresponding to the first optical sensor 10A. The wiring 26 is a shielding layer and is formed, for example, of a metal wiring, made of a material having better conductivity than the lower electrode 11 of the photodiode PD. The wiring 26 is provided in a layer between the substrate 21 and the photodiode PD in the third direction Dz. The wiring 26 is electrically connected to a terminal portion 40 on the substrate 21. Note that the wiring 26 may be formed, for example, in the same layer as the lower electrode 11, or may be formed of metal. An insulating layer 27 is provided on the substrate 21, covering the wiring 26. The insulating layer 27 may be an inorganic insulating film or an organic insulating film.

[0033] The photodiode PD is provided on the insulating layer 27. The photodiode PD has a lower electrode 11, a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15 (upper electrode 15A). In the photodiode PD, the lower electrode 11, the lower buffer layer 12 (hole transport layer), the active layer 13, the upper buffer layer 14 (electron transport layer), and the upper electrode 15A are stacked in this order in a third direction Dz perpendicular to the substrate 21.

[0034] The lower electrode 11 is an anode electrode of the photodiode PD and is formed of a light-transmitting conductive material such as indium tin oxide (ITO). The characteristics (e.g., voltage-current characteristics and resistance value) of the active layer 13 change depending on the light irradiated thereon. An organic material is used as the material for the active layer 13. Specifically, the active layer 13 has a bulk heterostructure in which a p-type organic semiconductor and an n-type fullerene derivative (PCBM), which is an n-type organic semiconductor, are mixed. The active layer 13 may be made of, for example, a low molecular weight organic material such as C60 (fullerene), PCBM (phenyl C61-butyric acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (5,6,11,12-tetraphenyltetracene), or PDI (a perylene derivative).

[0035] The active layer 13 can be formed using these low-molecular-weight organic materials by a vapor deposition (dry process). In this case, the active layer 13 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 13 can also be formed by a coating (wet process). In this case, the active layer 13 is made of a material that combines the above-mentioned low-molecular-weight organic material with a high-molecular-weight organic material. Examples of high-molecular-weight organic materials that can be used include P3HT (poly(3-hexylthiophene)) and F8BT (F8-alt-benzothiadiazole). The active layer 13 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0036] The lower buffer layer 12 is a hole transport layer. The upper buffer layer 14 is an electron transport layer. The lower buffer layer 12 and the upper buffer layer 14 are provided to facilitate the holes and electrons generated in the active layer 13 to reach the lower electrode 11 or the upper electrode 15. The lower buffer layer 12 (hole transport layer) is in direct contact with the lower electrode 11, and is also provided in the region between adjacent lower electrodes 11. The active layer 13 is in direct contact with the lower buffer layer 12. The material of the hole transport layer is a metal oxide layer. As the metal oxide layer, tungsten oxide (WO ３ ), molybdenum oxide, etc. are used.

[0037] The upper buffer layer 14 (electron transport layer) is in direct contact with the active layer 13, and the upper electrode 15 is in direct contact with the upper buffer layer 14. Ethoxylated polyethyleneimine (PEIE) is used as the material for the electron transport layer.

[0038] The materials and manufacturing methods of the lower buffer layer 12, the active layer 13, and the upper buffer layer 14 are merely examples, and other materials and manufacturing methods may be used. For example, the lower buffer layer 12 and the upper buffer layer 14 are not limited to single-layer films, and may be formed as multilayer films including an electron blocking layer and a hole blocking layer.

[0039] The upper electrode 15 is provided on the upper buffer layer 14. The upper electrode 15 is a cathode electrode of the photodiode PD and is continuously formed across the entire first optical sensor 10A and the second optical sensor 10B. In other words, the upper electrode 15 is continuously provided on the multiple photodiodes PD. The upper electrode 15 faces the multiple lower electrodes 11, sandwiching the lower buffer layer 12, the active layer 13, and the upper buffer layer 14 between them. The upper electrode 15 is formed of a light-transmitting conductive material such as ITO or IZO. A portion of the end of the upper surface 150 of the upper electrode 15 is electrically connected to a conductive material 24 and is electrically connected to a power electrode 211 via the conductive material 24. The power electrode 211 is electrically connected to a battery 300, allowing power to be supplied from the battery 300. In the first optical sensor 10A, a sealing film 160 is provided on the upper electrode 15 and the like. The sealing film 160 is an inorganic film such as a silicon nitride film or an aluminum oxide film, or a resin film such as an acrylic film. The sealing film 160 is not limited to a single layer, but may be a laminated film of two or more layers combining the inorganic film and the resin film. In the detection device 1, the photodiode PD is well sealed by the sealing film 160, and moisture intrusion from the upper surface side can be suppressed.

[0040] 8 , the second optical sensor 10B has the lower electrode 11 of the second optical sensor 10B in a region of the substrate 21 different from the region of the lower electrode 11 of the first optical sensor 10A. The lower electrode 11 is covered with a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15 (upper electrode 15B). In this embodiment, the second optical sensor 10B has a substrate 21, a photodiode PD, wiring 26, and an insulating layer 27. The photodiode PD, wiring 26, and insulating layer 27 have the same configuration as the photodiode PD, wiring 26, and insulating layer 27 of the first optical sensor 10A. That is, the photodiode PD of the second optical sensor 10B has the lower electrode 11, the lower buffer layer 12, the active layer 13, the upper buffer layer 14, and the upper electrode 15B. In the second optical sensor 10B, the sealing film 160 is provided on the upper electrode 15B and the like, thereby sealing the photodiode PD well.

[0041] 4, the substrate 21 has the areas of the first optical sensor 10A and the second optical sensor 10B and is an integrally formed single common substrate. The substrate 21 has a cutout portion 22 formed in the first direction Dx between the area of ​​the first optical sensor 10A and the area of ​​the second optical sensor 10B. The substrate 21 has the cutout portion 22 between the first optical sensor 10A and the second optical sensor 10B, and a connecting portion 23 that contacts the cutout portion 22 and is located between the first optical sensor 10A and the second optical sensor 10B.

[0042] The cutout portion 22 is formed over a distance longer than the length of the light source 60 in the first direction Dx. The cutout portion 22 is formed over a distance longer than the length of the light source 60 and shorter than the length (width) of the substrate 21 in the second direction Dy. The substrate 21 integrally connects the first optical sensor 10A and the second optical sensor 10B via a connecting portion 23 along the cutout portion 22. The connecting portion 23 includes the lower buffer layer 12, the active layer 13, the upper buffer layer 14, and the electrode connecting portion 151 of the upper electrode 15. As a result, the connecting portion 23 integrally forms the upper electrodes 15A and 15B of the first optical sensor 10A and the second optical sensor 10B. The first optical sensor 10A and the second optical sensor 10B are connected by the connecting portion 23 and operate using power supplied from the power supply electrode 211 to the common upper electrode 15.

[0043] The cutout portion 22 is formed in a shape that allows the light source 60 to be placed therein. In this embodiment, the cutout portion 22 is formed in a substantially rectangular shape in a plan view, but may be, for example, a semicircular, triangular, polygonal, or other shape. The cutout portion 22 may be a through-hole that allows light from the light source 60 to pass through. The electrode connecting portion 151 is provided on the connecting portion 23 of the substrate 21 so as to be stacked on the upper buffer layer 14, the active layer 13, and the lower buffer layer 12.

[0044] The multiple wirings 26 of the substrate 21 are connected to the control circuit 122 via multiple signal lines (not shown) of the flexible printed circuit board 70. In other words, the control circuit 122 is electrically connected to the lower electrodes 11 of the first optical sensor 10A and the second optical sensor 10B via multiple signal lines.

[0045] The control circuit 122 is a circuit that supplies control signals to the multiple photodiodes PD to control the detection operation. The multiple photodiodes PD each output an electrical signal corresponding to the light irradiated thereon as a detection signal Vdet to the detection circuit 123. The detection circuit 123 is a circuit that detects the detection signal Vdet. The detection circuit 123 is, for example, an analog front end (AFE). The detection circuit 123 is a signal processing circuit that has at least the functions of a detection signal amplifier circuit and an A / D converter circuit. The detection signal amplifier circuit amplifies the detection signal Vdet. The A / D converter circuit converts the analog signal output from the detection signal amplifier circuit into a digital signal.

[0046] The charging control circuit 124 controls the power of wireless power transmission, in which electrical energy reaches the battery charging coil 127 from the outside by electromagnetic means. The coupling method for wireless power transmission can be selected from among electromagnetic induction, electromagnetic resonance, radio wave, etc. The control circuit 124 charges the battery 300 using the wirelessly transmitted power.

[0047] The control circuit 125 supplies a control signal to the light source 60 to control the turning on or off of the light source 60. The power supply circuit 126 supplies a power supply signal (electric power) from the battery 300 via the terminal unit 40 to the first optical sensor 10A and the second optical sensor 10B.

[0048] The above describes an example of the configuration of the detection device 1 according to this embodiment. Note that the configuration described above using Figures 1 to 8 is merely an example, and the configuration of the detection device 1 according to this embodiment is not limited to this example. The configuration of the detection device 1 according to this embodiment can be flexibly modified depending on the specifications and operation.

[0049] [Assembly Example of the Detection Device] Next, an assembly example of the detection device 1 will be described. As shown in FIGS. 3 and 4 , the flexible printed circuit board 70 has the light source 60 mounted on its first surface 70A, and the control circuit 122, the detection circuit 123, the control circuit 124, the control circuit 125, and the power supply circuit 126 mounted on its second surface 70B. The first optical sensor 10A and the second optical sensor 10B are formed on the substrate 21, and the terminal portion 40 is mounted on the substrate 21. The substrate 21 is connected to a first end portion 71 of the flexible printed circuit board 70 by connecting the connection portion on the first surface 70A of the flexible printed circuit board 70 to the terminal portion 40. As shown in FIG. 5 , the flexible printed circuit board 70 is bent at the bending portion 73, and the other end portion 21B of the substrate 21 is brought close to the first surface 70A of the flexible printed circuit board 70, and the substrate 21 is placed on the first surface 70A of the flexible printed circuit board 70 so that the notch portion 22 of the substrate 21 overlaps the light source 60. The battery 300 is electrically connected to the flexible printed circuit board 70 at a second end 72. The substrate 21, the flexible printed circuit board 70, and the battery 300 are housed in a mold in a ring shape, and a filling material is filled around them to form the housing 200, and the substrate 21, the flexible printed circuit board 70, and the battery 300 are housed inside the housing 200. As a result, the detection device 1 is formed as a device in which the flexible printed circuit board 70 is bent and the substrate 21, the flexible printed circuit board 70, and the battery 300 are housed in the housing 200, with the cutout portion 22 positioned so as to overlap the light source 60, as shown in FIG.

[0050] [Operational Example of the Detection Device] Next, a detection example of the detection device 1 attached to a finger Fg will be described. In the example shown in FIG. 2 , the detection device 1 is in a state in which the inner circumferential surface 210B of the first housing 210 of the housing 200 is in contact with or close to the finger Fg. The detection device 1 operates the first optical sensor 10A and the second optical sensor 10B by supplying power from the battery 300 to the common upper electrode 15 via the terminal portion 40. The detection device 1 turns on the light source 60, causing the light source 60 to irradiate light toward the finger Fg. The light source 60 irradiates light to one side and the other side in the circumferential direction 200C. The detection device 1 receives light reflected by the finger Fg or the like with the first optical sensor 10A and the second optical sensor 10B. The detection device 1 detects information about the living body of the finger Fg based on the amount of light received by each of the two photodiodes PD of the first optical sensor 10A and the second optical sensor 10B.

[0051] In this manner, in the detection device 1, the substrate 21 having the first optical sensor 10A and the second optical sensor 10B is connected to the flexible printed circuit board 70 via the terminal portion 40, and the flexible printed circuit board 70 is bent so that the cutout portion 22 of the substrate 21 is positioned so as to overlap the light source 60 of the flexible printed circuit board 70. As a result, even if the substrate 21 and the flexible printed circuit board 70 having the light source 60 are connected in series as separate components, the detection device 1 can be configured to position the substrate 21 by bending the flexible printed circuit board 70 in the connection direction, thereby reducing the storage space required. As a result, the detection device 1 can prevent the components that connect and store the substrate 21 having the multiple optical sensors and the flexible printed circuit board 70 having the light source 60 from becoming larger.

[0052] In the detection device 1, the first optical sensor 10A and the second optical sensor 10B can share the lower buffer layer 12, the active layer 13, the upper buffer layer 14, and the upper electrode 15. This simplifies the configuration of the substrate 21 because the detection device 1 only needs to supply power to the integrated upper electrode 15 for the first optical sensor 10A and the second optical sensor 10B. As a result, even if the detection device 1 has a plurality of optical sensors arranged on the substrate 21, it is possible to prevent the substrate 21 from becoming large.

[0053] In the detection device 1, a plurality of electronic components are mounted on the second surface 70B of the flexible printed circuit board 70 opposite the light source 60. As a result, in the detection device 1, by mounting a plurality of electronic components on the second surface 70B of the flexible printed circuit board 70 and mounting the light source 60 on the opposite first surface 70A, the configuration of the flexible printed circuit board 70 can be simplified and the accommodation space can be further reduced in size.

[0054] In the detection device 1, the substrate 21 and the flexible printed circuit board 70 are housed in a ring-shaped housing 200. This allows the detection device 1 to detect light emitted by the light source 60 with high accuracy over a wide range of the housing 200 using multiple optical sensors, without increasing the size of the ring-shaped housing 200.

[0055] (Embodiment 2) Fig. 9 is a development view showing an example of a front surface side of a substrate and a flexible printed circuit board of embodiment 2. Fig. 10 is a development view showing an example of a back surface side of a substrate and a flexible printed circuit board of embodiment 2. Fig. 11 is a development view showing a state in which the flexible printed circuit board shown in Fig. 10 is bent. Fig. 12 is a side view of the substrate and the flexible printed circuit board shown in Fig. 11.

[0056] In the second embodiment, the detection device 1 includes the housing 200, the terminal unit 40, the light source 60, the first optical sensor 10A, the flexible printed circuit board 70, and the substrate 21-1. The detection device 1 includes a battery 300 connected to the flexible printed circuit board 70 inside the housing 200 and operates on power from the battery 300. The flexible printed circuit board 70 has multiple electronic components mounted thereon. The electronic components include the control circuit 122 in the mounting area 73A, the detection circuit 123 in the mounting area 73B, the control circuit 124 in the mounting area 73C, the control circuit 125 in the mounting area 73D, and the power supply circuit 126 in the mounting area 73E. In the second embodiment, similar to the first embodiment, the detection device 1 accommodates the terminal unit 40, the light source 60, the first optical sensor 10A, the flexible printed circuit board 70, and the substrate 21-1 in the ring-shaped housing 200.

[0057] The substrate 21-1 is an insulating substrate, and is formed in a strip shape using, for example, a film-like resin. The first optical sensor 10A is mounted on a surface 21H of the substrate 21-1 near the other end 21B, making the substrate 21-1 deformable. The substrate 21-1 has a terminal portion 40 provided at one end 21A of the surface 21H of the substrate 21-1. As shown in FIG. 10 , the substrate 21-1 is attached to the flexible printed circuit board 70 via the terminal portion 40, thereby electrically connecting to the flexible printed circuit board 70. That is, in a plan view, the rear surface 21R of the substrate 21-1 is a surface that is continuous with the first surface 70A of the flexible printed circuit board 70.

[0058] The number of optical sensors in the substrate 21-1 is reduced compared to the first embodiment, and the length in the first direction Dx is shortened. Therefore, the flexible printed circuit board 70 differs from the first embodiment in that the light source 60 is mounted in the mounting region 73B on the first surface 70A, rather than in the mounting region 73C, based on the length of the substrate 21, the length of the bent portion, and the like. In the second embodiment, the position of the light source 60 in the flexible printed circuit board 70 is moved toward the first end 71 due to a change in the length of the substrate 21 in the first direction Dx (circumferential direction 200C).

[0059] 9 and 10 , the first end 71 of the flexible printed circuit board 70 is bent at a bending portion 73, thereby positioning the first optical sensor 10A adjacent to the light source 60 in the circumferential direction 200C of the housing 200. As shown in FIG. 11 , the flexible printed circuit board 70 is bent at the bending portion 73, thereby positioning the substrate 21-1 near the light source 60. The substrate 21-1 shown in FIG. 12 may or may not be fixed to the flexible printed circuit board 70 by an adhesive member.

[0060] 10 is a member for electrically connecting the first optical sensor 10A on the substrate 21 to the control circuit 122 and power supply circuit 126 on the flexible printed circuit board 70. The terminal unit 40 supplies a power signal (electric power) from the power supply circuit 126 to the first optical sensor 10A via wiring. The terminal unit 40 has a plurality of terminals (not shown) and is configured to be electrically connectable to a plurality of wirings.

[0061] 12 is housed inside the housing 200 so that a first surface 70A on which the first optical sensor 10A and the light source 60 are mounted faces an inner peripheral surface 200B of the housing 200. If the flexible printed circuit board 70 is light-transmitting, the first optical sensor 10A and the light source 60 may be mounted on a second surface 70B opposite the first surface 70A. In this case, the light source 60 may be disposed so that it emits light toward the flexible printed circuit board 70 and the light that has passed through the flexible printed circuit board 70 is emitted toward the outside of the housing 200.

[0062] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include the pulse wave, pulse rate, and blood vessel image of the finger or palm. In other words, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects blood vessel patterns such as veins.

[0063] The first optical sensor 10A detects light emitted by the light source 60 and reflected by the finger Fg or the like, as well as directly incident light. The first optical sensor 10A is an organic photodiode (OPD). The first optical sensor 10A is provided on the housing 200 so as to be adjacent to one end of the light source 60 in the circumferential direction 200C of the housing 200.

[0064] The above describes an example of the configuration of the detection device 1 according to embodiment 2. Note that the configuration described above using Figures 9 to 12 is merely an example, and the configuration of the detection device 1 according to embodiment 2 is not limited to this example. The configuration of the detection device 1 according to embodiment 2 can be flexibly modified depending on the specifications and operation.

[0065] [Assembly Example of the Detection Device] Next, an assembly example of the detection device 1 according to the second embodiment will be described. As shown in FIGS. 9 and 10 , the flexible printed circuit board 70 has the light source 60 mounted on its first surface 70A, and the control circuit 122, the detection circuit 123, the control circuit 124, the control circuit 125, and the power supply circuit 126 mounted on its second surface 70B. The substrate 21-1 has the first optical sensor 10A formed thereon and the terminal portion 40 mounted thereon. The substrate 21-1 is connected to a first end portion 71 of the flexible printed circuit board 70 by connecting the connection portion on the first surface 70A of the flexible printed circuit board 70 to the terminal portion 40. As shown in FIG. 11 , the flexible printed circuit board 70 is bent at the bending portion 73, and the other end portion 21B of the substrate 21-1 is brought closer to the light source 60, and the substrate 21-1 is disposed on the first surface 70A of the flexible printed circuit board 70 so that the first optical sensor 10A of the substrate 21-1 is adjacent to the light source 60. 11 , the substrate 21-1 covers the mounting area 73A on the first surface 70A of the flexible printed circuit board 70, and is disposed so that the other end 21B is adjacent to the light source 60. The battery 300 is electrically connected to the flexible printed circuit board 70 at a second end 72. The substrate 21-1, the flexible printed circuit board 70, and the battery 300 are housed in a mold in a ring shape, and a filling material is filled around them to form the housing 200, thereby housing the substrate 21-1 inside the housing 200. In this way, the detection device 1 is formed as a device in which the flexible printed circuit board 70 is bent, and the substrate 21-1, the flexible printed circuit board 70, and the battery 300 are housed in the housing 200, with the first optical sensor 10A positioned adjacent to the light source 60.

[0066] [Operational Example of the Detection Device] Next, a detection example of the detection device 1 worn on a finger Fg will be described. In the detection device 1, the inner circumferential surface 210B of the first housing 210 of the housing 200 is in contact with or close to the finger Fg. The detection device 1 operates the first optical sensor 10A by supplying power from the battery 300 to the upper electrode 15 of the first optical sensor 10A via the terminal portion 40. The detection device 1 turns on the light source 60, causing the light source 60 to irradiate light toward the finger Fg. The light source 60 irradiates light to one side and the other side in the circumferential direction 200C. The detection device 1 receives light reflected by the finger Fg or the like with the first optical sensor 10A. The detection device 1 detects information about the living body of the finger Fg based on the amount of light received by each of the photodiodes PD of the first optical sensor 10A.

[0067] In this manner, in the detection device 1, the substrate 21-1 having the first optical sensor 10A is connected to the flexible printed circuit board 70 via the terminal portion 40, and by bending the flexible printed circuit board 70, the first optical sensor 10A on the substrate 21-1 is disposed adjacent to the light source 60 on the flexible printed circuit board 70. Thus, even if the substrate 21-1 and the flexible printed circuit board 70 having the light source 60 are connected in series as separate components, the detection device 1 can be housed in a smaller space by bending the flexible printed circuit board 70 and arranging the substrate 21-1. As a result, the detection device 1 can easily mount multiple electronic components on the flexible printed circuit board 70, improving the degree of freedom in the placement of the first optical sensor 10A and the light source 60. Furthermore, even if multiple electronic components are mounted on the flexible printed circuit board 70, the detection device 1 can house the first optical sensor 10A and the light source 60 in a state where they are adjacent to each other without increasing the size of the housing 200 that houses the flexible printed circuit board 70.

[0068] (Embodiment 3) Fig. 13 is a development view showing an example of a front surface side of a substrate and a flexible printed circuit board of embodiment 3. Fig. 14 is a development view showing an example of a back surface side of a substrate and a flexible printed circuit board of embodiment 3. Fig. 15 is a development view showing a state in which the flexible printed circuit board shown in Fig. 14 is bent. Fig. 16 is a side view of the substrate and the flexible printed circuit board shown in Fig. 15.

[0069] In the third embodiment, the detection device 1 includes the housing 200, the substrate 21-1, the terminal unit 40, the light source 60, the first optical sensor 10A, and the flexible printed circuit board 70 described above. The detection device 1 includes a battery 300 connected to the flexible printed circuit board 70 inside the housing 200, and is a device that operates using power from the battery 300. The first optical sensor 10A and the substrate 21-1 have the same configuration as the first optical sensor 10A and the substrate 21-1 of the second embodiment. The flexible printed circuit board 70 has multiple electronic components mounted thereon. The electronic components include the control circuit 122, the power supply circuit 126, and the control circuit 128 described above. In the third embodiment, similar to the first and second embodiments, the detection device 1 includes the terminal unit 40, the light source 60, the first optical sensor 10A, the flexible printed circuit board 70, and the substrate 21-1 housed in a ring-shaped housing 200.

[0070] 13 and 14 , in the flexible printed circuit board 70, the control circuit 122, the power supply circuit 126, and the control circuit 128 are mounted on the first surface 70A on which the light source 60 is mounted, and no electronic components are mounted on the second surface 70B. On the first surface 70A of the flexible printed circuit board 70, nothing is mounted in the mounting area 73A, and the light source 60 is mounted in the mounting area 73B, the control circuit 122 in the mounting area 73C, the control circuit 128 in the mounting area 73D, and the power supply circuit 126 in the mounting area 73E. The control circuit 128 includes a single circuit that combines the detection circuit 123, the control circuit 124, and the control circuit 125 described above.

[0071] 13 and 14 , the first end 71 of the flexible printed circuit board 70 is bent at the bending portion 73, thereby positioning the first optical sensor 10A adjacent to the light source 60 in the circumferential direction 200C of the housing 200 while bringing the other end 21B of the substrate 21-1 closer to the light source 60. As shown in FIG. 15 , the substrate 21-1 is disposed near the light source 60 by bending the flexible printed circuit board 70 at the bending portion 73. The substrate 21-1 shown in FIG. 16 may or may not be fixed to the flexible printed circuit board 70 by an adhesive member.

[0072] 16 is housed inside the housing 200 so that a first surface 70A on which the first optical sensor 10A, the light source 60, and the electronic components are mounted faces an inner peripheral surface 200B of the housing 200. If the flexible printed circuit board 70 is light-transmitting, it may be mounted on a second surface 70B opposite to the first surface 70A on which the first optical sensor 10A, the light source 60, and the electronic components are mounted. In this case, the light source 60 may be disposed so that it emits light toward the flexible printed circuit board 70 and the light that has passed through the flexible printed circuit board 70 is emitted toward the outside of the housing 200.

[0073] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include the pulse wave, pulse rate, and blood vessel image of the finger or palm. In other words, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects blood vessel patterns such as veins.

[0074] The above has described an example of the configuration of the detection device 1 according to embodiment 3. Note that the configuration described above using Figures 13 to 16 is merely an example, and the configuration of the detection device 1 according to embodiment 3 is not limited to this example. The configuration of the detection device 1 according to embodiment 3 can be flexibly modified depending on the specifications and operation.

[0075] [Assembly Example of Detection Device] Next, an assembly example of the detection device 1 according to the third embodiment will be described. As shown in FIGS. 13 and 14 , the flexible printed circuit board 70 has the light source 60, the control circuit 122, the control circuit 128, and the power supply circuit 126 mounted on the first surface 70A. The substrate 21-1 has the first optical sensor 10A formed thereon and the terminal portion 40 mounted thereon. The substrate 21-1 is connected to the first end portion 71 of the flexible printed circuit board 70 by connecting the connection portion on the first surface 70A of the flexible printed circuit board 70 to the terminal portion 40. As shown in FIG. 15 , the flexible printed circuit board 70 is bent at the bending portion 73, and the substrate 21-1 is disposed on the first surface 70A of the flexible printed circuit board 70 so that the first optical sensor 10A of the substrate 21-1 is adjacent to the light source 60. 15 , the substrate 21-1 covers the mounting area 73A on the first surface 70A of the flexible printed circuit board 70, and is disposed so that the other end 21B is adjacent to the light source 60. The battery 300 is electrically connected to the flexible printed circuit board 70 at a second end 72. The substrate 21-1, the flexible printed circuit board 70, and the battery 300 are housed in a mold in a ring shape, and a filling material is filled around them to form the housing 200, thereby housing the substrate 21-1 inside the housing 200. In this way, the detection device 1 is formed as a device in which the flexible printed circuit board 70 is bent, and the substrate 21-1, the flexible printed circuit board 70, and the battery 300 are housed in the housing 200, with the first optical sensor 10A positioned adjacent to the light source 60.

[0076] [Operational Example of the Detection Device] Next, a detection example of the detection device 1 worn on a finger Fg will be described. In the detection device 1, the inner circumferential surface 210B of the first housing 210 of the housing 200 is in contact with or close to the finger Fg. The detection device 1 operates the first optical sensor 10A by supplying power from the battery 300 to the upper electrode 15 of the first optical sensor 10A via the terminal portion 40. The detection device 1 turns on the light source 60, causing the light source 60 to irradiate light toward the finger Fg. The light source 60 irradiates light to one side and the other side in the circumferential direction 200C. The detection device 1 receives light reflected by the finger Fg or the like with the first optical sensor 10A. The detection device 1 detects information about the living body of the finger Fg based on the amount of light received by each of the photodiodes PD of the first optical sensor 10A.

[0077] In this manner, in the detection device 1, the substrate 21-1 having the first optical sensor 10A is connected to the flexible printed circuit board 70 via the terminal portion 40, and by bending the flexible printed circuit board 70, the first optical sensor 10A on the substrate 21-1 is disposed adjacent to the light source 60 on the flexible printed circuit board 70. Thus, even if the substrate 21-1 and the flexible printed circuit board 70 having the light source 60 are connected in series as separate components, the detection device 1 can be housed in a smaller space by bending the flexible printed circuit board 70 and arranging the substrate 21-1. As a result, the detection device 1 can easily mount multiple electronic components and the light source 60 on the flexible printed circuit board 70, thereby improving the degree of freedom in the placement of the first optical sensor 10A and the light source 60. Furthermore, even if multiple electronic components are mounted on the flexible printed circuit board 70, the detection device 1 can house the first optical sensor 10A and the light source 60 adjacent to each other without increasing the size of the housing 200.

[0078] In the detection device 1, a plurality of electronic components are mounted on the first surface 70A of the flexible printed circuit board 70 on which the light source 60 is mounted. In this way, by mounting the light source 60 and a plurality of electronic components on the first surface 70A of the flexible printed circuit board 70, the detection device 1 can further simplify the mounting of the flexible printed circuit board 70.

[0079] In the above-described embodiments, the detection device 1 has been described as containing the substrate 21, the substrate 21-1, the flexible printed circuit board 70, the battery 300, etc., inside the ring-shaped housing 200, but is not limited to this. The detection device 1 may be, for example, contained in a rectangular housing, or may be attached to the object to be measured without being contained in a housing.

[0080] The components of each of the above-described embodiments can be combined as appropriate. Furthermore, other effects and advantages brought about by the aspects described in the present embodiments that are obvious from the description in this specification or that can be conceived by a person skilled in the art are naturally understood to be brought about by the present invention.

[0081] DESCRIPTION OF SYMBOLS 1 Detection device 10A First optical sensor 10B Second optical sensor 11 Lower electrode 12 Lower buffer layer 13 Active layer 14 Upper buffer layer 15 Upper electrode 21, 21-1 Substrate 21A One end 21B Other end 22 Notch portion 23 Connecting portion 24 Conductive material 27 Insulating layer 40 Terminal portion 60 Light source 70 Flexible printed circuit board 70A First surface 70B Second surface 71 First end 72 Second end 73 Bent portion 122, 124, 125 Control circuit 123 Detection circuit 126 Power supply circuit 160 Sealing film 200 Housing 200C Circumferential direction 210 First housing 220 Second housing 300 Battery Dx First direction Dy Second direction Fg Finger PD Photodiode

Claims

1. A detection device comprising: a substrate having a cutout between both ends in a first direction; a terminal portion provided at one end of the substrate in the first direction; a first optical sensor provided on the substrate between the cutout and the terminal portion; a second optical sensor provided on the substrate between the cutout and the other end of the substrate; and a flexible printed circuit board on which a light source and a plurality of electronic components are mounted, wherein each of the first optical sensor and the second optical sensor is stacked on the substrate in the following order: a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode and a sealing film, the lower electrodes of the first optical sensor and the second optical sensor are electrically connected to the terminal portion, and the terminal portion is connected to a first end of the flexible printed circuit board, and the substrate is disposed in a position where the cutout of the substrate overlaps with the light source when the flexible printed circuit board is folded.

2. The detection device according to claim 1, wherein the first optical sensor and the second optical sensor share the lower buffer layer, the active layer, the upper buffer layer and the upper electrode in common.

3. A detection device comprising: a substrate having an optical sensor; a terminal portion provided at one end of the substrate in a first direction; and a flexible printed circuit board on which a light source and a plurality of electronic components are mounted, wherein the optical sensor is stacked on the substrate in the following order: a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode and a sealing film, each of the lower electrode and the upper electrode of the optical sensor being electrically connected to the terminal portion, the terminal portion being connected to a first end of the flexible printed circuit board, and the substrate is configured such that the flexible printed circuit board is folded and the other end of the substrate in the first direction is positioned adjacent to the light source.

4. A detection device according to claim 1 or 3, wherein the plurality of electronic components are mounted on a surface of the flexible printed circuit board opposite the light source.

5. A detection device according to claim 1 or 3, wherein a plurality of said electronic components are mounted on the surface of said flexible printed circuit board on which said light source is mounted.

6. The detection device according to claim 1 or 3, wherein the substrate and the flexible printed circuit board are housed in a ring-shaped housing.