Carrying container

JPWO2024257241A5Pending Publication Date: 2026-03-12
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Filing Date
2025-12-12
Publication Date
2026-03-12

AI Technical Summary

Technical Problem

Existing transport containers for semiconductor samples risk damaging the samples due to electrostatic charges between the storage container and cover, causing the sample mesh to adhere to the cover and fall out during removal.

Method used

A transport container design featuring a metal surface layer on the storage container and a conductive layer on the cover, arranged in a grid pattern to neutralize electrostatic charges, ensuring the sample mesh remains secure and preventing damage during handling.

Benefits of technology

The design effectively neutralizes electrostatic charges between the cover and storage container, preventing sample damage and loss by ensuring the sample mesh remains securely attached to the container during transport and handling.

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Abstract

This carrying container includes: a storage container SC that comprises, on an upper surface SCa thereof, a storage groove part SG in which a metal mesh MS on which a sample SM is placed is stored; and a cover CV that is a transparent resin member and that comprises a conductor layer CL provided to an inner surface CVb thereof. Moreover, the upper surface including the storage groove part SG of the storage container SC comprises a surface layer MC which is a metal member, and the conductor layer CL of the cover CV touches the surface layer MC of the storage container SC while the cover CV is fitted to the storage container SC.
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Description

Transport container

[0001] The present invention relates to a transport container, and more particularly to a mesh transport container.

[0002] In recent years, semiconductor devices have become increasingly miniaturized. High-integration technology has made dramatic advances, particularly in semiconductor devices with three-dimensional structures. To analyze these semiconductor devices, observations using transmission electron microscopes (TEM) and scanning transmission electron microscopes (STEM) are becoming increasingly common.

[0003] When observing a semiconductor device sample with a TEM, a wafer is first processed using a processing device such as a focused ion beam (FIB) device to prepare a sample. In recent semiconductor device observations, the sample is processed into a thin piece and placed on a metal mesh or the like equipped with a grid for sample placement. The mesh with the sample placed on it is stored in a mesh transport container (hereinafter referred to as the "transport container") and transported to the TEM. Thereafter, the mesh is transferred to a mesh holder (hereinafter referred to as the "holder") and inserted into the TEM for sample observation.

[0004] When the mesh on which the sample is placed is moved between the FIB device and the TEM, it is necessary to transport the mesh while preventing the sample from being damaged or from being contaminated with dust.

[0005] Japanese Patent Laid-Open Publication No. 2007-39106 (Patent Document 1) discloses a mesh transport container, which includes a base for accommodating an elastic sheet-like member and a cover for covering the base, and the mesh with a sample attached thereto is inserted into a slit in the sheet-like member.

[0006] Japanese Patent Application Laid-Open No. 2007-39106

[0007] According to the investigations of the present inventors, it was found that when the cover is removed from the base, the mesh to which the sample is attached falls out of the transport container, causing damage to the sample. In other words, there is a need for a transport container that prevents damage to the sample.

[0008] Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0009] In one embodiment, the transfer container includes a storage container having an upper surface and a storage groove provided on the upper surface to store a metal mesh on which a sample is placed, and a cover made of a transparent resin member having an inner surface and a conductive layer provided on the inner surface. The upper surface of the storage container including the storage groove has a surface layer made primarily of a metal member, and when the cover is attached to the storage container, the conductive layer of the cover is in contact with the surface layer of the storage container.

[0010] In one embodiment, the transfer container includes a storage container having a top surface and a storage groove formed on the top surface to store a metal mesh on which a sample is placed, and a cover made primarily of a first metal member and having an outer surface, an inner surface, and a plurality of window portions penetrating from the outer surface to the inner surface. The top surface of the storage container including the storage groove has a surface layer made primarily of a second metal member, and each of the plurality of window portions has a transparent resin member disposed on the outer surface side and a conductive layer disposed on the inner surface side, and when the cover is attached to the storage container, the first metal member or the conductive layer of the cover contacts the surface layer of the storage container.

[0011] In one embodiment, the transfer container includes a storage container having a top surface, a first storage groove and a second storage groove provided on the top surface, each of which stores a metal mesh on which a sample is placed, and a cover made primarily of a first metal member and having an outer surface, an inner surface, and a plurality of first small holes and a plurality of second small holes penetrating from the outer surface to the inner surface, the top surface of the storage container including the storage grooves has a surface layer made primarily of the second metal member, the plurality of first small holes and the plurality of second small holes on the outer surface of the cover are covered with a transparent resin member, and when the cover is attached to the storage container, the first metal member of the cover is in contact with the surface layer of the storage container, and in a plan view, the plurality of first small holes overlap the first storage groove and the plurality of second small holes overlap the second storage groove.

[0012] According to one embodiment, it is possible to provide a transport container that can prevent damage to a sample.

[0013] 13 is an external view of a transport container according to embodiment 1. FIG. 14 is a plan view of a storage container according to embodiment 1. FIG. 15 is a cross-sectional view taken along line A-A in FIG. 2. FIG. 16 is a plan view of a cover according to embodiment 1. FIG. 17 is a cross-sectional view taken along line B-B in FIG. 4. FIG. 18 is a plan view of a transport container according to embodiment 1. FIG. 19 is a cross-sectional view taken along line C-C in FIG. 6. FIG. 19 is a plan view of a transport container according to modified example 1. FIG. 20 is a cross-sectional view of a transport container according to modified example 2. FIG. 21 is a cross-sectional view of a transport container according to modified example 3. FIG. 22 is a cross-sectional view of line E-E in FIG. 11. FIG. 23 is a cross-sectional view of a transport container according to modified example 4. FIG. 24 is a cross-sectional view of line F-F in FIG. 13. FIG. 25 is a plan view of a transport container according to modified example 5. FIG. 26 is an enlarged view of small holes SH and SH1 shown in FIG. 15. FIG. 27 is a cross-sectional view of a transport container according to modified example 6. FIG. 28 is a schematic diagram of a transfer device according to embodiment 2. FIG. 29 is a flow chart showing a transfer process according to embodiment 2.

[0014] Hereinafter, embodiments will be described in detail with reference to the drawings. In all drawings for explaining the embodiments, components having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted. In the following embodiments, explanations of identical or similar parts will not be repeated unless particularly necessary. Hatching may be used even in plan views.

[0015] (Embodiment) A transfer container is used when transferring a sample processed by a focused ion beam (FIB) to an observation device such as a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM). By storing and transferring the sample in a transfer container, it is possible to prevent the sample from being damaged and dust from adhering to the sample.

[0016] <Technical Issues of Related Art> First, the technical issues of the transport container in the related art identified by the present inventors will be described. The transport container in the related art includes a storage groove for storing a metal mesh on which a sample is mounted, a storage container provided with a screw hole, and a cover to which a screw is attached. By placing the cover on the storage container and attaching the cover to the storage container with the screws, the mesh on which the sample is mounted is sealed within the storage groove.

[0017] In a transport container according to the related art, the storage container is made of nylon resin, which has excellent properties such as heat resistance, mechanical properties, and chemical resistance. Meanwhile, the cover is made of highly transparent acrylic resin. By forming the cover from a transparent resin member, it is possible to check from the outside of the transport container whether the mesh is stored in the storage groove. Two-dimensional codes or the like are printed on the mesh, storage groove, and transport container, and their correspondence is managed. However, mistakes can occur, such as the mesh not being stored in the designated storage groove or being stored in the wrong storage groove. Therefore, transport errors can be prevented by checking from the outside of the transport container that the mesh is stored in the storage groove before transporting the transport container.

[0018] In the case of a transport container in the related art, a transfer of electric charges occurs when the storage container and the cover come into contact. For example, the acrylic resin of the cover tends to accumulate a negative charge, while the nylon resin of the storage container tends to accumulate a positive charge. Because the metal mesh is housed in the storage container, the mesh also acquires the positive charge of the storage container. If the cover is opened in this state, the positively charged mesh is attracted to and adheres to the negatively charged cover. When the cover is then removed, the mesh attached to the cover may unexpectedly fall off, potentially damaging the sample mounted on the mesh or causing the mesh to be lost.

[0019] In view of the above, a technical problem in the related art is to provide a transport container that prevents damage or loss of a sample caused by charging of the cover or storage container.

[0020] (Embodiment 1) A transfer container HC1 according to embodiment 1 will be described below with reference to Figures 1 to 7. Figure 1 is an external view of a transfer container according to embodiment 1. Figure 2 is a plan view of a storage container according to embodiment 1. Figure 3 is a cross-sectional view taken along line A-A in Figure 2. Figure 4 is a plan view of a cover according to embodiment 1. Figure 5 is a cross-sectional view taken along line B-B in Figure 4. Figure 6 is a plan view of a transfer container according to embodiment 1. Figure 7 is a cross-sectional view taken along line C-C in Figure 6.

[0021] As shown in FIG. 1, the transfer container HC1 has a storage container SC, a cover CV, and a screw head SCRH provided in the center of the outer surface CVa of the cover CV.

[0022] The storage container SC will be described with reference to Figures 2 and 3. As shown in Figure 3, the storage container SC has a cylindrical shape with an upper surface SCa, a lower surface SCb, and a side surface SCc. A protruding flange FL is provided on the side surface SCc of the storage container SC facing the lower surface SCb. Furthermore, the upper surface SCa is provided with a plurality of storage grooves (mesh storage grooves) SG and screw holes TH. The storage grooves SG and screw holes TH are concave relative to the upper surface SCa. The storage container SC has a layered structure consisting of a thick main body PC and a surface layer MC that is thinner than the main body PC and is provided on the surface of the main body PC. The surface layer MC is provided over the entire area of ​​the side surface SCc of the storage container SC, including the upper surface SCa, the lower surface SCb, and the flange FL, and on the upper surface SCa, the surface layer MC is provided over the entire area except for the screw holes TH. The surface layer MC is also provided on the storage groove SG so as to cover the surface of the main body PC. Note that the surface layer MC may also be provided within the screw holes TH so as to cover the surface of the main body PC. The main body PC is primarily made of a resin material such as nylon resin. The surface layer MC is primarily made of a metal material such as copper, aluminum, or stainless steel. Alternatively, the storage container SC may have a structure in which the main body PC is primarily made of a metal material without the surface layer MC (in other words, the surface layer MC and the main body PC are made of the same metal material), with the storage groove SG and the screw hole TH provided in the main body PC. Alternatively, a surface layer MC primarily made of a metal material may be placed on the main body PC primarily made of a resin material, with the storage groove SG provided in the surface layer MC. In this case, the film thickness of the surface layer MC is thicker than the depth of the storage groove SG. In other words, the top surface SCa of the storage container SC, including the storage groove SG, is made of the surface layer MC primarily made of a metal material.

[0023] FIG. 2 is a plan view of the storage container SC as viewed from the top surface SCa. A screw hole TH is located at the center of the circular top surface SCa, and multiple circular storage grooves SG are arranged annularly at predetermined intervals around the screw hole TH in the peripheral region of the top surface SCa. In FIG. 2, meshes MS carrying samples SM are stored in two storage grooves SG. The mesh MS is, for example, a metal disk, primarily made of copper, gold, molybdenum, or nickel. As shown in FIG. 3, the metal mesh MS contacts a surface layer MC, primarily made of a metal member, within the storage groove SG.

[0024] The cover CV will be described with reference to Figures 4 and 5. As shown in Figure 5, the cover CV has a cap shape (which can also be considered a cylindrical shape) with an outer surface CVa and an inner surface CVb. The cover CV is primarily made of a transparent resin member such as acrylic resin. A screw SCR having a screw head (gripping portion) SCRH and a threaded portion SCRP is attached to the cover CV. A conductor layer CL is provided on the inner surface CVb of the cover CV, and the conductor layer CL is, for example, a metal wiring MW having a desired width.

[0025] 4 is a plan view of the cover CV as viewed from the inner surface CVb side. A screw SCR is provided at the center of the circular inner surface CVb. Furthermore, a plurality of metal wirings MW are provided in a grid pattern on the circular inner surface CVb. The metal wirings MW extending in the mutually orthogonal X and Y directions are linked (connected) at their intersections. Furthermore, although not shown, annular metal wirings MW may be arranged around the periphery of the circular inner surface CVb, and the metal wirings MW extending in the X and Y directions may be linked to the annular metal wirings MW.

[0026] The transfer container HC1 will be described with reference to Figures 6 and 7. Figures 6 and 7 show a state in which a mesh MS carrying a sample SM is housed in the housing groove SG and a cover CV is attached to the storage container SC. As shown in Figure 7, the cover CV is fixed to the storage container SC with screws SCR, and metal wiring MW (in other words, a conductor layer CL) provided on the inner surface CVb of the cover CV is pressure-bonded to a metallic surface layer MC provided on the top surface SCa of the storage container SC.

[0027] 6 is a plan view of the transfer container HC1 as seen from the outer surface CVa of the cover CV. When the cover CV and the storage container SC are charged with opposite polarities, reducing the spacing between the metal wiring MW is effective in shielding the electric field that occurs between them. However, it is important to set the width and spacing of the metal wiring MW to a level that ensures visibility inside the transfer container HC1.

[0028] The first embodiment has the following features.

[0029] A metallic surface layer MC is disposed on the top surface SCa of the storage container SC, and metal wiring MW (i.e., conductive layer CL) is disposed on the inner surface CVb of the cover CV. When the cover CV is attached to the storage container SC, the metal wiring MW (i.e., conductive layer CL) on the inner surface CVb of the cover CV is pressed against the surface layer MC on the top surface SCa of the storage container SC. In other words, even if the cover CV and the storage container SC are electrically charged, charge transfer occurs between them, making them electrically neutral. Because the metallic mesh MS is in contact with the surface layer MC within the storage groove SG, the cover CV and the mesh MS are electrically neutral. Therefore, when the cover CV is removed from the storage container SC, the mesh MS carrying the sample is attracted to and adheres to the cover CV, preventing it from falling out of the transfer container HC1, which could result in damage to the sample SM or loss of the mesh MS.

[0030] By providing the metal wiring MW arranged in a grid pattern on the cover CV made of a transparent resin member, it is possible to ensure a space between adjacent metal wirings MW, thereby ensuring visibility of the inside of the transfer container HC1.

[0031] A mesh MS carrying a sample SM is stored in the storage groove portion SG of the storage container SC, and a cover CV is attached (screwed and fixed) to the storage container SC so as to cover the storage groove portion SG, thereby preventing dust, moisture, etc. from adhering to the sample SM.

[0032] In the resin storage SC, the main body PC is a resin member, and the surface layer MC of the main body PC is made of a thin metal member, thereby realizing a lightweight storage container SC. Furthermore, since the cover CV is made of a resin member, the weight of the transport container HC1 is reduced, making it easier to transport the transport container HC1. Furthermore, since the main body PC of the resin storage SC is made of nylon resin, which has excellent mechanical properties, the mechanical strength of the storage container SC is ensured, and damage to the sample SM due to stress from outside the transport container HC1 can be prevented.

[0033] <Modification 1> Modification 1 is a modification of the metal wiring MW provided on the cover CV of the transfer container HC1 in the first embodiment, and a structure different from that in the first embodiment will be described. In modification 1, the conductor layer CL has annular metal wiring AMW and radial metal wiring RMW. Figure 8 is a plan view of a transfer container HC2 in modification 1, as viewed from the outer surface CVa side of the cover CV.

[0034] A conductor layer CL is provided on the inner surface CVb of the cover CV, and the conductor layer CL has a plurality of annular metal wirings AMW and a plurality of radial metal wirings RMW. The plurality of annular metal wirings AMW are arranged at equal intervals so as to form concentric circles about the center O of the circular cover CV in a plan view. The plurality of annular metal wirings AMW are arranged at intervals such that two adjacent annular metal wirings AMW overlap the storage groove portion SG in a plan view. Furthermore, the interval between two adjacent annular metal wirings AMW may be smaller than the diameter of the circular mesh MS. However, the interval between the two annular metal wirings AMW is set to an extent that ensures the aforementioned visibility.

[0035] The plurality of radial metal wirings RMW extend radially from the center O and link (connect) the plurality of annular metal wirings AMW. Each of the plurality of radial metal wirings RMW electrically connects the plurality of annular metal wirings AMW. The annular metal wirings AMW and the radial metal wirings RMW are made of the same metal material as the metal wirings MW in the first embodiment. As in the first embodiment, with the cover CV attached to the storage container SC, the annular metal wirings AMW or the radial metal wirings RMW provided on the inner surface CVb of the cover CV are pressure-bonded to the surface layer MC provided on the upper surface SCa of the storage container SC. Therefore, the first modification also has the same features as the first embodiment.

[0036] Furthermore, the first modification has the following feature: When the cover CV is attached to the storage container SC using the screws SCR, the cover CV rotates relative to the storage container SC, but the mesh MS can be seen between the two annular metal wirings AMW arranged above the storage groove portion SG regardless of the fixed position of the cover CV.

[0037] <Variation 2> Variation 2 is a variation of the conductor layer CL provided on the cover CV of the transfer container HC1 in the first embodiment, and a structure different from that of the first embodiment will be described. In Variation 2, the conductor layer CL is a transparent conductive film TEC or the like. FIG. 9 is a plan view of a transfer container HC3 in Variation 2, viewed from the outer surface CVa side of the cover CV. FIG. 10 is a cross-sectional view along line D-D in FIG. 9. As shown in FIGS. 9 and 10, a transparent conductive film TEC is provided on the inner surface CVb of the cover CV. As shown in FIG. 9, in plan view, the transparent conductive film TEC covers multiple storage grooves SG. The transparent conductive film TEC is primarily made of indium tin oxide or zinc oxide. As in the first embodiment, when the cover CV is attached to the storage container SC, the transparent conductive film TEC provided on the inner surface CVb of the cover CV is pressure-bonded to the surface layer MC provided on the upper surface SCa of the storage container SC. Therefore, the second modification has the same features as the first modification.

[0038] Furthermore, according to the second modification, the transparent conductive film TEC is provided over the entire area of ​​the inner surface CVb of the cover CV, so that the electric field from the charged portion of the cover CV can be more reliably shielded.

[0039] <Modification 3> Modification 3 relates to the cover CV of the transfer container HC1 in the first embodiment. In Modification 3, a metal member is used as the main material for the cover CV1. Fig. 11 is a plan view of a transfer container HC4 in Modification 3, as viewed from the outer surface CV1a side of the cover CV1. Fig. 12 is a cross-sectional view taken along line E-E in Fig. 11.

[0040] As shown in FIGS. 11 and 12 , the cover CV1 is a metal member and is provided with multiple windows WD. The multiple windows WD are arranged in a ring shape around a screw SCR provided in the center of the cover CV1 and are spaced apart from one another. In a plan view, the windows WD are arranged to overlap the storage grooves SG of the storage container SC. The diameter of the circular windows WD is designed to be larger than the diameter of the circular storage grooves SG so that the storage grooves SG are positioned within the windows WD of the cover CV1 when the cover CV1 is attached to the storage container SC. The windows WD are openings provided in the cover CV1, and a transparent resin member TPP and metal wiring MW arranged in a grid pattern are embedded in the windows WD. In the windows WD, the transparent resin member TPP is provided on the outer surface CV1a of the cover CV1, and the metal wiring MW is provided on the inner surface CV1b of the cover CV1. The cover CV1 and the metal wiring MW are primarily made of metal, such as copper, aluminum, or stainless steel. The transparent resin member TPP is primarily made of acrylic resin, for example. That is, the cover CV1 is primarily made of a metal and includes an outer surface CV1a, an inner surface CV1b, and multiple windows WD penetrating from the outer surface CV1a to the inner surface CV1b. Furthermore, in each of the multiple windows WD, a transparent resin member TPP is disposed on the outer surface CV1a side, and a conductive film CL is disposed on the inner surface CV1b side. As in the first embodiment, when the cover CV1 is attached to the storage container SC, the metal wiring MW or the metal cover CV1 provided on the inner surface CV1b of the cover CV1 is pressure-bonded to a metal surface layer MC provided on the top surface SCa of the storage container SC. Therefore, the third modification also has the same features as the first embodiment.

[0041] In addition, in Modification 3, in order to position the storage groove SG inside the window WD of the cover CV1 when the cover CV1 is attached to the storage container SC, a protrusion CP is provided on the cover CV1 and a recess RC is provided on the storage container SC, as shown in FIG. 11 . Then, when the cover CV1 is attached to the storage container SC, the protrusion CP of the cover CV1 fits into the recess RC of the storage container SC. In this way, the window WD of the cover CV1 and the storage groove SG of the storage container SC are aligned. Alternatively, a structure in which the recess RC is provided on the cover CV1 and the protrusion CP is provided on the storage container SC may be adopted. In other words, by providing positioning means on both the cover CV1 and the storage container SC, it is easy to check the mesh MS stored in the storage container SC from outside the transfer container HC4.

[0042] Furthermore, in the window portion WD, the transparent resin member TPP is arranged on the outer surface CV1a side of the cover CV1, and the metal wiring MW is arranged on the inner surface CV1b side of the cover CV1, so that the influence of the electric field generated by the transparent resin member TPP being charged on the mesh MS can be shielded by the metal wiring MW.

[0043] <Modification 4> Modification 4 relates to the window WD of the cover CV1 in Modification 3. In Modification 4, the window WD1 has a plurality of small holes SH. Fig. 13 is a plan view of a transfer container HC5 in Modification 4, as viewed from the outer surface CV1a side of the cover CV1. Fig. 14 is a cross-sectional view taken along line F-F in Fig. 13.

[0044] As shown in FIGS. 13 and 14 , the window WD1, through which the mesh MS stored in the storage groove SG of the storage container SC is visually observed, has a plurality of small holes SH arranged in a matrix. The small holes SH penetrate the metal cover CV1 and are covered with a transparent resin member TPP1 on the outer surface CV1a side of the cover CV1. The transparent resin member TPP1 is primarily made of, for example, acrylic resin. In plan view, the plurality of small holes SH are arranged to overlap with the storage groove SG of the storage container SC. In other words, the cover CV1 is primarily made of a metal member and has an outer surface CV1a, an inner surface CV1b, and a plurality of circular small holes SH that penetrate from the outer surface CV1a to the inner surface CV1b. Furthermore, the plurality of small holes SH are covered with the transparent resin member TPP1 on the outer surface CV1a side of the cover CV1. As in the first embodiment, when the cover CV1 is attached to the storage container SC, the metal cover CV1 is pressed against the metal surface layer MC provided on the top surface SCa of the storage container SC. Therefore, the fourth modification has the same features as the first embodiment.

[0045] The window WD1 has a plurality of small holes SH, which makes it easy to check the mesh MS stored in the storage container SC from outside the transfer container HC5.

[0046] Furthermore, by covering the multiple small holes SH provided in the window WD1 with the transparent resin member TPP1, it is possible to prevent dust from adhering to the sample SM mounted on the mesh MS.

[0047] Furthermore, by providing positioning means on each of the cover CV1 and the storage container SC, similar to the third modification, it becomes easy to check the mesh MS stored in the storage container SC from outside the transfer container HC5.

[0048] <Modification 5> Modification 5 relates to the small holes SH of the cover CV1 in Modification 4. FIG. 15 is a plan view of a transfer container HC6 in Modification 5, viewed from the outer surface CV1a of the cover CV1. FIG. 16 is an enlarged view of the small holes SH1 and SH2 shown in FIG. 15. As shown in FIG. 15, the cover CV1 has multiple windows WD2, each of which has multiple small holes SH1. The window WD2, through which the mesh MS stored in the storage groove SG of the storage container SC can be visually observed, has multiple small holes SH1. In other words, when the cover CV1 is attached to the storage container SC, the multiple small holes SH1 arranged in the window WD2 overlap with the storage groove SG in a plan view. As shown in FIG. 16, the multiple small holes SH1 are equally spaced at a pitch P1. The pitch is the distance between the centers of two adjacent circular small holes SH1.

[0049] In the fifth modification, the cover CV1 includes a plurality of spare small holes SH2. The spare small holes SH2 are arranged in the region between adjacent windows WD2 (in other words, the region between adjacent storage grooves SG). As shown in FIG. 16 , the spare small holes SH2 are arranged at equal intervals with a pitch P1. The arrangement pitch P1 of the spare small holes SH2 is equal to the arrangement pitch P1 of the small holes SH1. Adjacent small holes SH1 and spare small holes SH2 are also arranged at equal intervals with the pitch P1. In other words, the plurality of small holes SH1 and the plurality of spare small holes SH2 are each arranged at equal intervals with the pitch P1. In FIGS. 15 and 16 , in a plan view, the small holes SH1 that overlap the window WD2 are shown as white, and the spare small holes SH2 arranged in the region between adjacent windows WD2 are shown as hatched.

[0050] As in the structure of Modification 4 shown in FIG. 14, in Modification 5, the plurality of small holes SH1 and the plurality of preliminary small holes SH2 are covered with a transparent resin member TPP1.

[0051] According to the fifth modification, a plurality of auxiliary small holes SH2 are provided in the region between adjacent windows WD2, and the arrangement pitch P1 of the auxiliary small holes SH2 is set equal to the arrangement pitch P1 of the plurality of small holes SH1 provided in the window WD2. As a result, even if rotational misalignment occurs when the cover CV1 is attached to the storage container SC, visibility of the mesh MS from outside the transfer container HC6 can be ensured.

[0052] Furthermore, there is no need to provide the positioning means for the cover CV1 and the storage container SC described in the fourth modified example.

[0053] <Variation 6> Variation 6 is a variation of the first embodiment. FIG. 17 is a cross-sectional view of a transfer container HC7 of Variation 6. As shown in FIG. 17, the storage container SC and the cover CV are primarily made of the same transparent resin member TPP2. The transparent resin member TPP2 is primarily made of, for example, acrylic resin. Because both the storage container SC and the cover CV are materials that easily accumulate negative charges, a potential difference is unlikely to occur between the cover CV and the mesh MS stored in the storage groove SG of the storage container SC. This prevents the mesh MS from falling off when the cover CV is opened.

[0054] (Embodiment 2) Embodiment 2 relates to a transfer device (mesh transfer device) and a transfer method (mesh transfer method) for transferring the mesh MS stored in the transfer container and transferred in the embodiment 1 to the holder HD of the analysis device. Fig. 18 is a schematic diagram of the transfer device in embodiment 2. Fig. 19 is a flow chart showing the transfer process in embodiment 2.

[0055] 18, the transfer device TE includes a storage container base SCS, a cover storage unit CVS, a holder tray HDT, a transfer mechanism TM, and a manipulator MP. The storage container base SCS, the cover storage unit CVS, the holder tray HDT, and the transfer mechanism TM are all primarily made of metal members and are connected to ground (earth potential).

[0056] Next, the transfer method will be described with reference to the flow diagram of the transfer process in Fig. 19. First, the transfer device TE and the transfer container HC1 are prepared. Here, the transfer container HC1 in the first embodiment will be used for the description.

[0057] Next, step S1 shown in Fig. 19 is performed. That is, the holder HD is placed on the holder tray HDT. Here, the holder HD is a jig for inserting the sample SM into an observation device such as a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM). Since the holder tray HDT is installed, when the holder HD is placed on the holder tray HDT, the metal holder HD is also grounded. Note that step S1 may be performed prior to step S4, which will be described later.

[0058] Next, steps S2 and S3 shown in FIG. 19 are performed. In step S2, the transfer container HC1 is placed on the storage container base SCS. In step S3, the cover CV1 is opened and placed on the cover holder CVS. First, the transfer container HC1 shown in FIG. 7 is placed on the storage container base SCS, and the flange FL of the storage container SC is hooked onto the hook HK of the storage container base SCS to secure the storage container SC to the storage container base SCS. Next, the cover CV1 of the transfer container HC1 is opened, and the cover CV1 is placed on the cover holder CVS. As shown in FIG. 18, the cover holder CVS has a protrusion PR, and the metal wiring MW, which is a conductive layer CL provided on the inner surface CVb of the cover CV, contacts the protrusion PR. In other words, even if the cover CV is charged, the charge flows to ground via the cover holder CVS.

[0059] When the transfer container HC1 shown in Figure 7 is placed on the storage container base SCS, charge accumulated in the transfer container HC1 during the transfer process flows to ground via the grounded storage container base SCS. The inner surface CVb of the cover CV of the transfer container HC1 is provided with metal wiring MW (conductor layer CL), and the storage container SC is covered with a surface layer MC made of a metal material. The metal wiring MW (conductor layer CL) of the cover CV is in contact with the surface layer MC of the storage container SC. Therefore, charge accumulated in the cover CV flows to ground via the metal wiring MW, surface layer MC, and storage container base SCS. Furthermore, if a charged worker touches the transfer container HC1 when opening the cover CV, the charge carried by the worker also flows to ground via a similar path. Because the storage container SC containing the mesh MS and the cover CV are at the same potential (ground potential), the mesh MS is prevented from sticking to the cover CV and falling off when the cover CV is opened.

[0060] Next, steps S4 and S5 shown in FIG. 19 are performed. In step S4, the mesh MS with the sample SM mounted thereon is removed from the storage container SC using the transfer mechanism TM and manipulator MP shown in FIG. 18 and set in the holder HD. Next, in step S5, the holder HD with the mesh MS set therein is inserted into the observation device, and sample observation is performed. In step S4, the transfer mechanism TM is connected to ground, so that the mesh MS can be prevented from sticking to the transfer mechanism TM. Furthermore, in step S5, the holder HD is connected to ground via the holder tray HDT, so that the mesh MS can be prevented from sticking to the holder HD.

[0061] Next, steps S6 and S7 shown in Fig. 19 are carried out. After the sample observation is completed, in step S6, the holder HD is removed from the observation device and placed on the holder tray HDT. Next, in step S7, the transfer mechanism TM and manipulator MP shown in Fig. 18 are used to remove the mesh MS set in the holder HD and return it to the storage groove SG of the storage container SC.

[0062] Next, step S8 shown in Fig. 19 is carried out. A cover CV is attached to the storage container SC containing the mesh MS. Here, since the cover CV is connected to ground by the cover holder CVS, the mesh MS can be prevented from sticking to the cover CV when the cover CV is attached.

[0063] Next, step S9 shown in Fig. 19 is carried out. That is, the transfer container HC1 with the cover CV attached thereto is removed from the storage container base SCS, and the series of steps is completed.

[0064] In the second embodiment, a transfer method using the transfer container HC1 of the first embodiment has been described, but the second embodiment can be applied to the transfer containers HC2 to HC6 shown in the first to fifth modifications.

[0065] The present invention has been specifically described above based on the embodiments thereof, but it goes without saying that the present invention is not limited to the above embodiments and can be modified in various ways without departing from the spirit and scope of the invention. For example, the container and cover are not limited to cylindrical shapes, but can be square or rectangular, for example. Furthermore, graphite or the like can be used as the conductive layer.

[0066] In addition, some of the contents described in the above embodiment will be described below.

[0067] [Notes] (Note 1) A transport container including: a storage container having an upper surface and a storage groove portion provided on the upper surface for storing a metal mesh on which a sample is placed; and a cover attached to the storage container, wherein the storage container and the cover are made of the same transparent resin material.

[0068] (Supplementary Note 2) The transport container according to Supplementary Note 1, wherein the transparent resin member is an acrylic resin.

[0069] (Supplementary Note 3) A transfer device comprising: a storage container base for placing a storage container containing a metal mesh on which a sample is placed; a cover storage section for placing a cover to be attached to the storage container; a holder tray for holding a holder; and a manipulator having a transfer mechanism at its tip, which holds the mesh using the transfer mechanism and transfers the mesh between the storage container and the holder, wherein the storage container base, the cover storage section, the holder tray and the transfer mechanism are connected to ground potential.

[0070] (Supplementary Note 4) (a) A step of preparing a transport container including a storage container having an upper surface and a storage groove provided on the upper surface and storing a metal mesh on which a sample is placed, and a cover made of a transparent resin member and having an inner surface and a conductive layer provided on the inner surface, wherein the storage container has a laminated structure of a main body and a surface layer that is a metal member as a main material covering the main body, and wherein the conductive layer of the cover is in contact with the surface layer of the storage container when the cover is attached to the storage container; (b) A step of preparing a transfer device including a storage container base on which the storage container is placed, a cover storage unit on which the cover is placed, a holder tray that holds a holder, and a manipulator that is provided at the tip of the holder tray with a transfer mechanism, which holds the mesh with the transfer mechanism and transfers the mesh between the storage container and the holder, wherein the storage container base, the cover storage unit, the holder tray, and the transfer mechanism are connected to ground potential; (c) placing the transport container on the storage container base; (d) removing the cover attached to the transport container and placing it on the cover storage section; and (e) using the manipulator, holding the mesh with the transfer mechanism and attaching it to the holder.

[0071] (Appendix 5) The mesh transfer method described in Appendix 4 further includes the steps of: (f) moving the mesh attached to the holder to the storage container placed on the storage container base; and (g) attaching the cover placed on the cover storage section to the storage container.

[0072] (Supplementary Note 6) In the mesh transfer method according to Supplementary Note 5, the cover storage section is electrically connected to a conductive layer provided on the inner surface of the cover.

[0073] (Supplementary Note 7) The mesh transfer method according to Supplementary Note 4, wherein the main body of the storage container is a resin member.

[0074] (Supplementary Note 8) The mesh transfer method according to Supplementary Note 4, wherein the main body and the surface layer of the storage container are the metal members.

[0075] AMW Annular metal wiring CL Conductive layer CP Convex portion CV, CV1 Cover CVa, CV1a Outer surface CVb, CV1b Inner surface CVS Cover storage section FL Flange portion HC1, HC2, HC3, HC4, HC5, HC6, HC7 Transport container HD Holder HDT Holder tray HK Hook MC Surface layer MP Manipulator MS Mesh MW Metal wiring O Center point PC Main body PR Protrusion RC Recessed portion RMW Radial metal wiring SC Storage container SCa Top surface SCb Bottom surface SCc Side surface SCR Screw SCRH Screw head (gripping portion) SCRP Threaded portion SCS Storage container base SG Storage groove portion (mesh storage groove portion) SH, SH1 Small hole portion SH2 Spare small hole SM Sample TE Transfer device TEC Transparent conductive film TM Transfer mechanism TPP, TPP1, TPP2 Transparent resin member TH Screw hole WD, WD1, WD2 Window

Claims

1. a storage container having an upper surface and a storage groove provided on the upper surface for storing a metal mesh on which a sample is placed; a cover that is a transparent resin member and has an inner surface and a conductive layer provided on the inner surface; Including, the upper surface of the storage container including the storage groove portion has a surface layer made of a metal member as a main material; A transport container, wherein when the cover is attached to the storage container, the conductive layer of the cover is in contact with the surface layer of the storage container.

2. 2. The transport container according to claim 1, In a plan view, the conductive layer overlaps the mesh.

3. 2. The transport container according to claim 1, The storage container is a transport container whose entirety is made of the metal member.

4. 2. The transport container according to claim 1, The storage container has a laminated structure of a resin member and the metal member covering the surface of the resin member.

5. 5. The transport container according to claim 4, The resin member of the storage container is made of nylon resin, and the transparent resin member of the cover is made of acrylic resin.

6. 2. The transport container according to claim 1, A transport container in which the metal member is made primarily of copper, aluminum or stainless steel.

7. 2. The transport container according to claim 1, The transport container, wherein the conductive layer is metal wiring arranged in a grid pattern on the inner surface of the cover.

8. 2. The transport container according to claim 1, The conductive layer is a plurality of annular metal traces concentrically arranged on the inner surface of the cover.

9. 9. The transport container according to claim 8, The transport container, wherein the spacing between adjacent annular metal wirings is smaller than the diameter of the mesh.

10. 9. The transport container according to claim 8, the conductive layer includes radial metal wiring extending radially from the center of the cover, The radial metal wiring is connected to the plurality of annular metal wirings.

11. 2. The transport container according to claim 1, the conductive layer is a transparent conductive film, The transparent conductive film covers the storage groove in a plan view.

12. 12. The transport container according to claim 11, The transparent conductive film is made of indium tin oxide or zinc oxide as a main material.

13. a storage container having an upper surface and a storage groove provided on the upper surface for storing a metal mesh on which a sample is placed; a cover made primarily of a first metal member, the cover having an outer surface, an inner surface, and a plurality of windows extending from the outer surface to the inner surface; Including, the upper surface of the storage container including the storage groove portion has a surface layer made of a second metal member as a main material; a transparent resin member is disposed on the outer surface side of each of the plurality of window portions, and a conductive layer is disposed on the inner surface side of each of the plurality of window portions; A transport container, wherein when the cover is attached to the storage container, the first metal member or the conductive layer of the cover is in contact with the surface layer of the storage container.

14. 14. The transport container according to claim 13, The transport container, wherein the conductive layer is metal wiring arranged in a grid pattern.

15. 14. The transport container according to claim 13, The storage container includes a plurality of the storage groove portions, The container has a recess, The cover has a protrusion, When the cover is attached to the storage container, the convex portion and the concave portion fit together, and the window portion overlaps the storage groove portion in a plan view.

16. a storage container having an upper surface and a first storage groove portion and a second storage groove portion provided on the upper surface, each of which stores a metal mesh on which a sample is placed; a cover made primarily of a first metal member, the cover having an outer surface, an inner surface, and a plurality of first small holes and a plurality of second small holes each having a circular shape, the first small holes penetrating from the outer surface to the inner surface; Including, the upper surface of the storage container including the first storage groove portion and the second storage groove portion has a surface layer that is primarily made of a second metal member; the first small holes and the second small holes are covered with a transparent resin member on the outer surface of the cover; With the cover attached to the storage container, the first metal member of the cover contacts the surface layer of the container; In a plan view, the plurality of first small holes overlap the first storage groove, and the plurality of second small holes overlap the second storage groove.

17. 17. The transport container of claim 16, The container has a recess, The cover has a protrusion, When the cover is attached to the storage container, the convex portion and the concave portion fit together, and in a planar view, the plurality of first small holes overlap with the first storage groove portion, and the plurality of second small holes overlap with the second storage groove portion.

18. 17. The transport container of claim 16, the cover has a plurality of third small holes in a region between the plurality of first small holes and the plurality of second small holes, The plurality of first small holes, the plurality of second small holes, and the plurality of third small holes are each arranged at equal intervals at equal pitches.

19. 20. The transport container of claim 18, The plurality of third small holes are covered with the transparent resin member.