Workpiece machining method, machine tool, and program

Abstract

The workpiece machining method includes a step of preparing a workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material, and a step of burring the plate portion. When a direction from the base material toward the first coating layer is defined as a first direction, the step of burring the plate portion includes forming a through hole and a flange in a first region of the plate portion by moving a rotating burring tool in the first direction. Prior to the step of burring the plate portion, a step of removing the first coating layer from the first region of the plate portion is performed.

Description

[Technical field]

[0001] The present invention relates to a workpiece machining method, a machine tool, and a program. [Background technology]

[0002] 2. Description of the Related Art Burring is a known process for forming through holes and flanges in thin plate material in order to ensure sufficient threads when cutting screws or to enable pins or pipes to be fitted into the thin plate material.

[0003] As a related technique, Patent Document 1 discloses a drilling tool. The drilling tool described in Patent Document 1 is used to form a hole and a boss in a metal plate or a metal pipe wall. More specifically, the drilling tool is pressed against the metal plate or metal pipe wall while rotating at high speed. The metal is melted by frictional heat acting between the drilling tool and the metal plate or metal pipe wall, and frictional pressure acting from the drilling tool to the metal plate or metal pipe wall. As the metal melts, a boss is formed at the same time as the hole is formed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Publication No. 5-6007 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a workpiece processing method, a machine tool, and a program that enable good formation of through holes and flanges in plate material having a coating layer, such as a plating layer plated with pure zinc or a zinc alloy. [Means for solving the problem]

[0006] In some embodiments, a method for machining a workpiece includes preparing a workpiece having a plate portion including a base material and a first coating layer covering at least a portion of the base material, and burring the plate portion. When a direction from the base material toward the first coating layer is defined as a first direction, burring the plate portion includes forming a through hole and a flange in a first region of the plate portion by moving a rotating burring tool in the first direction. Prior to burring the plate portion, a step of removing the first coating layer from the first region of the plate portion is performed.

[0007] In some embodiments, the machine tool includes a workpiece support device that supports a workpiece having a plate portion including a base material and a first coating layer that covers at least a part of the base material, a processing head that supports a burring tool rotatably around a rotation axis, a rotation drive device that rotates the burring tool around the rotation axis, a moving device that moves the processing head relative to the workpiece support device, a removal device that removes a part of the first coating layer from the workpiece, and a control device that controls the rotation drive device, the moving device, and the removal device. The control device is capable of executing a removal mode in which the first coating layer is removed from a first region of the plate portion by transmitting a control command to at least the removal device, and a burring processing mode in which the plate portion is burred by transmitting a control command to at least the rotation drive device and the moving device. When the direction from the base material toward the first coating layer is defined as a first direction, the burring processing mode is a mode in which a through hole and a flange are formed in the first region from which the first coating layer has been removed by using the burring tool that moves in the first direction in a rotating state.

[0008] In some embodiments, the program is a program for causing a machine tool to execute a workpiece machining method including the steps of: removing the first coating layer from a first region of a plate portion, the plate portion including a base material and a first coating layer covering at least a portion of the base material, while the workpiece is supported by a workpiece supporting device; and burring the plate portion after the first coating layer has been removed from the first region of the plate portion. When a direction from the base material toward the first coating layer is defined as a first direction, the step of burring the plate portion includes forming a through hole and a flange in the first region of the plate portion by moving a rotating burring tool in the first direction. Effect of the Invention

[0009] The present invention provides a workpiece processing method, a machine tool, and a program that enable good formation of through holes and flanges in plate material having a coating layer, such as a plating layer plated with pure zinc or a zinc alloy. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an example of a workpiece prepared in a preparation step. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing a state in which a removal step of removing the first coating layer from the first region of the plate portion is being performed. [Diagram 3] FIG. 3 is a schematic cross-sectional view illustrating an example of a workpiece after the first coating layer has been removed from the first region of the plate portion. [Figure 4] FIG. 4 is a schematic cross-sectional view showing a state in which the burring tool moves toward the first region of the plate portion. [Diagram 5] FIG. 5 is a schematic cross-sectional view showing a state in which burring is performed on a first region of a plate portion. [Figure 6] FIG. 6 is a schematic cross-sectional view showing a state in which the tapping tool moves toward the through hole. [Figure 7]FIG. 7 is a schematic cross-sectional view showing how a female screw is formed on the wall surface of a through hole. [Figure 8] FIG. 8 is a schematic cross-sectional view showing a state after a female thread has been formed on the wall surface of the through hole. [Figure 9] FIG. 9 is a schematic cross-sectional view showing a state in which the flange is broken into small pieces in the comparative example. [Figure 10] FIG. 10 is a schematic perspective view showing an example of a workpiece. [Figure 11] FIG. 11 is a schematic perspective view showing an example of a workpiece. [Figure 12] FIG. 12 is a schematic perspective view illustrating an example of a workpiece. [Figure 13] FIG. 13 is a schematic cross-sectional view showing a state in which a removal step of removing the first coating layer from the first region of the plate portion is performed. [Figure 14] FIG. 14 is a schematic cross-sectional view showing a state in which a removal step is performed using a chemical solution. [Figure 15] FIG. 15 is a schematic cross-sectional view illustrating a state in which the removing step is performed using the second tool. [Figure 16] FIG. 16 is a schematic perspective view showing an example of a burring tool. [Figure 17] FIG. 17 is a diagram illustrating a machine tool according to the first embodiment. [Figure 18] FIG. 18 is a schematic cross-sectional view showing a state in which a second wall, which is an obstacle, is present between the laser head and the first region of the plate portion. [Figure 19] FIG. 19 is a diagram illustrating a machine tool according to the first embodiment. [Figure 20] FIG. 20 is a diagram illustrating a machine tool according to the first embodiment. [Figure 21] FIG. 21 is a diagram illustrating an example of a tool exchange device. [Figure 22] FIG. 22 is a diagram illustrating a machine tool according to the first embodiment. [Diagram 23]FIG. 23 is a flowchart showing an example of a workpiece machining method in an embodiment. [Figure 24] FIG. 24 is a diagram illustrating a schematic view of a part of a machine tool in the second embodiment. [Diagram 25] FIG. 25 is an enlarged view of a portion of FIG. [Figure 26] FIG. 26 is a diagram illustrating a machine tool according to the second embodiment. [Figure 27] FIG. 27 is a diagram illustrating a machine tool according to the second embodiment. [Figure 28] FIG. 28 is a diagram illustrating a schematic view of a part of a machine tool in the second embodiment. [Figure 29] FIG. 29 is a diagram illustrating a schematic view of a part of a machine tool in the second embodiment. [Diagram 30] FIG. 30 is a diagram illustrating an example of a storage medium on which a program is recorded. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, a workpiece machining method, a machine tool 1, and a program 822 according to an embodiment will be described with reference to the drawings. In the following description of the embodiment, parts and members having the same functions are denoted by the same reference numerals, and repeated description of parts and members denoted by the same reference numerals will be omitted.

[0012] (First embodiment) A workpiece machining method and a machine tool 1A according to a first embodiment will be described with reference to Figs. 1 to 23. Fig. 1 is a schematic cross-sectional view showing an example of a workpiece 9 prepared in a preparation step. Fig. 2 is a schematic cross-sectional view showing a state in which a removal step of removing the first coating layer 93 from the first region RG1 of the plate portion 90 is performed. Fig. 3 is a schematic cross-sectional view showing an example of the workpiece 9 after the first coating layer 93 has been removed from the first region RG1 of the plate portion 90. Fig. 4 is a schematic cross-sectional view showing a state in which a burring tool 10 moves toward the first region RG1 of the plate portion 90. Fig. 5 is a schematic cross-sectional view showing a state in which a burring process is performed on the first region RG1 of the plate portion 90. Fig. 6 is a schematic cross-sectional view showing a state in which a tap tool 18 moves toward a through hole 96. Fig. 7 is a schematic cross-sectional view showing a state in which a female screw 96s is formed on the wall surface of the through hole 96. FIG. 8 is a schematic cross-sectional view showing a state after a female screw 96s is formed on the wall surface of the through hole 96. FIG. 9 is a schematic cross-sectional view showing a state in which the flange 97 is finely cracked in a comparative example. FIG. 10 is a schematic perspective view showing an example of the workpiece 9. FIG. 11 is a schematic perspective view showing an example of the workpiece 9. FIG. 12 is a schematic perspective view showing an example of the workpiece 9. FIG. 13 is a schematic cross-sectional view showing a state in which a removal step of removing the first coating layer 93 from the first region RG1 of the plate portion 90 is performed. FIG. 14 is a schematic cross-sectional view showing a state in which the removal step is performed using the chemical liquid L. FIG. 15 is a schematic cross-sectional view showing a state in which the removal step is performed using the second tool T2. FIG. 16 is a schematic perspective view showing an example of the burring tool 10. FIG. 17 is a diagram showing a machine tool 1A in the first embodiment. Fig. 18 is a schematic cross-sectional view showing a state where a second wall 99b, which is an obstacle, is present between the laser head 51 and the first region RG1 of the plate portion 90. Figs. 19 and 20 are diagrams showing a machine tool 1A in the first embodiment. Fig. 21 is a diagram showing an example of a tool exchange device 6. Fig. 22 is a diagram showing a machine tool 1A in the first embodiment. Fig. 23 is a flowchart showing an example of a workpiece machining method in an embodiment.

[0013] As illustrated in FIG. 1, in a first step ST1, a workpiece 9 is prepared. The first step ST1 is a preparation step. The workpiece 9 prepared in the preparation step has a plate portion 90. In the example described in FIG. 1, the plate portion 90 is constituted by a first wall 99a. The workpiece 9 may have a second wall 99b in addition to the first wall 99a. In the example described in FIG. 1, the second wall 99b is disposed opposite the first wall 99a. The workpiece 9 may have a third wall 99c in addition to the first wall 99a and the second wall 99b. In the example described in FIG. 1, the third wall 99c connects the first wall 99a and the second wall 99b. The workpiece 9 may have a fourth wall 99d (see FIG. 10, if necessary) disposed opposite the third wall 99c.

[0014] In the example shown in FIG. 1, a plate portion 90 of a workpiece 9 includes a base material 91 and a first coating layer 93 that covers at least a portion of the base material 91.

[0015] As illustrated in Fig. 2, in the second step ST2, the first coating layer 93 is removed from the first region RG1 of the plate portion 90. The second step ST2 is a removing step. Fig. 3 shows the workpiece 9 after the removing step has been performed.

[0016] 4, in a third step ST3, the relative position of the workpiece 9 with respect to the burring tool 10 is changed so that the burring tool 10 faces the first region RG1 of the workpiece 9. The third step ST3 is a position changing step.

[0017] As illustrated in FIG. 4, in this specification, a direction from the base material 91 toward the first coating layer 93 is defined as a first direction DR1, and a direction opposite to the first direction DR1 is defined as a second direction DR2.

[0018] After the position changing step (third step ST3) is performed, the first direction DR1 coincides with the direction from the burring tool 10 toward the first region RG1 of the workpiece 9.

[0019] As illustrated in Figures 4 and 5, in a fourth step ST4, the plate portion 90 is burred. The fourth step ST4 is a process of burring the plate portion 90 (hereinafter referred to as the "burring process"). Note that "burring" refers to a process of stretching the edge of a hole into a cylindrical shape. As illustrated in Figure 5, by burring the plate portion 90, the edge of the hole is stretched into a cylindrical shape, and as a result, a flange 97 is formed.

[0020] In the example described in Figures 4 and 5, the burring process (fourth step ST4) includes forming a through hole 96 and a flange 97 in the first region RG1 of the plate portion 90 by moving the rotating burring tool 10 in a first direction DR1.

[0021] As illustrated in Fig. 9, a case is assumed in which the burring process is performed without removing the first coating layer 93 from the first region RG1 of the plate portion 90. In this case, due to the presence of the first coating layer 93 (for example, due to the presence of the first coating layer 93 containing elemental zinc), the flange 97 may not be formed well. For example, as illustrated in Fig. 9, due to the presence of the first coating layer 93, the flange 97 may be cracked into small pieces.

[0022] In contrast, in the first embodiment, a step of removing the first coating layer 93 from the first region RG1 of the plate portion 90 is performed before the burring step (see FIG. 2). Therefore, regardless of the material of the first coating layer 93, the presence of the first coating layer 93 does not cause poor formation of the flange 97 during the burring step. For example, the presence of the first coating layer 93 does not prevent the generation or transmission of frictional heat by the burring tool 10 in a rotating state in the first region RG1. In other words, the frictional heat generated between the burring tool 10 and the plate portion 90 is effectively transmitted to the entire first region RG1, and the through hole 96 and the flange 97 are well formed in the first region RG1 (see FIG. 5).

[0023] (Optional configuration) Next, a workpiece machining method in the first embodiment and optional additional configurations that can be adopted in the machine tool 1A will be described with reference to FIGS.

[0024] (1st coating layer 93) As illustrated in FIG. 4, the first coating layer 93 is a coating layer disposed on the surface of the first region RG1 of the plate portion 90 opposite to the surface that will come into contact with the burring tool 10.

[0025] The first coating layer 93 is, for example, a plating layer 93a that covers at least a part of the base material 91. More specifically, the first coating layer 93 is, for example, a plating layer 93a of pure zinc or a zinc alloy (in other words, the first coating layer 93 is a plating layer 93a formed by plating at least a part of the base material 91 with pure zinc or a zinc alloy). The plating layer 93a may be a plating layer formed by any method. For example, the plating layer 93a may be formed on the base material 91 by electroforming, may be formed on the base material 91 by electroless plating, may be formed on the base material 91 by hot-dip plating, or may be formed on the base material 91 by vacuum plating (for example, vacuum deposition).

[0026] Alternatively, or additionally, the first coating layer 93 may be a color coating layer and / or a corrosion protection layer.

[0027] Conventionally, when a base material covered with a first coating layer containing zinc is subjected to burring using a method using frictional heat, a flange cannot be formed satisfactorily (see FIG. 9). In contrast, in the first embodiment, the first coating layer 93 is removed in the first region RG1, so that the through hole 96 and the flange 97 can be formed satisfactorily in the first region RG1 regardless of the material of the first coating layer 93.

[0028] 10, the first coating layer 93 faces an internal region SP of the workpiece 9 (more specifically, a cavity defined by the workpiece 9). More specifically, in the example shown in Fig. 10, the workpiece 9 is a pipe 9a, and the first coating layer 93 faces an internal space SP1 of the pipe 9a.

[0029] Alternatively, as illustrated in Fig. 11, a cross section perpendicular to the longitudinal direction of the workpiece 9 may have a C-shape. In the example illustrated in Fig. 11, the first coating layer 93 also faces the internal region SP of the workpiece 9 (more specifically, the substantial cavity portion defined by the workpiece 9).

[0030] 10 and 11, when the first coating layer 93 is an inner coating layer that coats the inner surface of the base material 91, it is preferable that an access opening OP is formed in the workpiece 9 to allow a means for removing the first coating layer 93 to access the first region RG1. The access opening OP may be formed in advance prior to the execution of the removing step (second step ST2), or may be formed in the workpiece 9 at the timing when the removing step (second step ST2) is executed. The access opening OP may be a through-hole type opening OP1 as exemplified in FIG. 10, or may be a slit type opening OP2 as exemplified in FIG. 11.

[0031] In the example shown in Fig. 2, the means for removing the first coating layer 93 includes a laser B. As exemplified in Fig. 13, the means for removing the first coating layer 93 may include, in addition to the laser B, an assist gas G supplied toward the workpiece 9. The assist gas G has a function of removing the molten material melted by the laser B from the irradiation target area of ​​the laser B. The assist gas G may be air, oxygen, or an inert gas such as nitrogen or argon.

[0032] 14, the means for removing the first coating layer 93 may include a chemical solution L (e.g., an organic solution) for removing the first coating layer 93. In the example shown in FIG. 14, the chemical solution L is applied to the first coating layer 93, thereby removing the first coating layer 93 from the first region RG1 of the plate portion 90.

[0033] Alternatively or additionally, as illustrated in Fig. 15, the means for removing the first coating layer 93 may include a tool (e.g., a cutting tool, a file, etc.) for removing the first coating layer 93. Hereinafter, the tool for removing the first coating layer 93 will be referred to as a second tool T2. In the example illustrated in Fig. 15, the first coating layer 93 is removed from the first region RG1 of the plate portion 90 by contacting the second tool T2 with the first coating layer 93.

[0034] In the example shown in FIG. 10 and FIG. 11, the workpiece 9 has a first wall 99a in which a first region RG1 to be burred (the region surrounded by a broken line in FIG. 10 and FIG. 11 is the first region RG1) is disposed, and a second wall 99b disposed opposite the first wall 99a. An access opening OP is formed in the second wall 99b. In the example shown in FIG. 10 and FIG. 11, the access opening OP is disposed opposite the first region RG1 (more specifically, a region to be removed RT described later). Therefore, a means for removing the first coating layer 93 (for example, a laser B for removing the first coating layer 93, a chemical solution L for removing the first coating layer 93, a tool T1 for applying the chemical solution L for removing the first coating layer 93, or a second tool T2 for removing the first coating layer 93) can easily approach the first coating layer 93 through the access opening OP.

[0035] In the example shown in FIG. 3, by removing the first coating layer 93 from the first region RG1 of the plate portion 90, an exposed surface 91s where the base material 91 is substantially exposed is formed in the first region RG1.

[0036] In this specification, the portion of the region occupied by the first coating layer 93 that will be removed by the above-mentioned removal step (or the removal device 5 described below) is defined as a removal target region RT (see Figs. 1 and 2). The above-mentioned first direction DR1 coincides with the direction from the portion of the base material 91 that contacts the removal target region RT toward the removal target region RT.

[0037] In this specification, the region formed by removing the first coating layer 93 is defined as the removed region RB (see FIG. 3). In other words, the removal target region RT becomes the removed region RB by performing the removal process (second step ST2). The above-mentioned first direction DR1 coincides with the direction from the exposed surface 91s toward the removed region RB.

[0038] The size of the access opening OP may be set according to the size of the region to be removed RT or the size of the through hole 96 formed in the first region RG1 in the burring process. For example, the larger the size of the region to be removed RT or the size of the through hole 96, the larger the size of the access opening OP may be.

[0039] In the example shown in Fig. 3, the size of the access opening OP (more specifically, the opening area of ​​the access opening OP) is smaller than the size of the removed region RB (more specifically, the area of ​​the removed region RB). The small size of the access opening OP suppresses a decrease in strength of the workpiece 9 caused by the presence of the access opening OP. Alternatively, the size of the access opening OP may be equal to or larger than the size of the removed region RB.

[0040] In the example shown in Fig. 6, the inner diameter of the access opening OP is larger than the inner diameter of the through hole 96. Alternatively, the inner diameter of the access opening OP may be equal to or smaller than the inner diameter of the through hole 96. In the example shown in Fig. 6, the through hole 96 is disposed opposite the access opening OP.

[0041] (Second coating layer 94) 1, the plate portion 90 of the workpiece 9 is disposed on the second direction DR2 side of the base material 91, and includes a second coating layer 94 that covers at least a part of the base material 91. In the example shown in FIG. 1, the workpiece 9 prepared in the preparation process (first step ST1) includes the base material 91, a first coating layer 93, and a second coating layer 94. In addition, the base material 91 is sandwiched between the first coating layer 93 and the second coating layer 94.

[0042] The material of the second coating layer 94 may be the same as the material of the first coating layer 93 , or may be different from the material of the first coating layer 93 .

[0043] The second coating layer 94 is, for example, a plating layer 94a that covers at least a portion of the base material 91. The plating layer 94a may be a plating layer formed by any method. For example, the plating layer 94a may be formed on the base material 91 by electroforming, by electroless plating, by hot-dip plating, or by vacuum plating (for example, vacuum deposition).

[0044] Alternatively or additionally, the second coating layer 94 may be a color coating layer and / or a corrosion protection layer. The second coating layer 94 may be a coating layer containing elemental zinc. For example, the second coating layer 94 may be a plating layer of pure zinc or a zinc alloy.

[0045] In the example shown in FIGS. 10 and 11, the second coating layer 94 is an outer surface coating layer that coats the outer surface of the base material 91.

[0046] In the example shown in Fig. 2 and Fig. 3, the second coating layer 94 is not subject to removal in the removal step (second step ST2). In other words, the second coating layer 94 is not removed by the removal step (second step ST2) and is maintained as it is. Alternatively, the removal step (second step ST2) may remove both the first coating layer 93 and the second coating layer 94 from the first region RG1 of the plate portion 90. The removal of the first coating layer 93 and the second coating layer 94 from the first region RG1 of the plate portion 90 may be performed by laser irradiation, by a chemical solution, or by a tool such as a cutting tool (in other words, the second tool T2).

[0047] (Base material 91) The material of the base material 91 is, for example, a metal such as iron or stainless steel. The base material 91 has a sufficient thickness to enable the formation of a flange 97. In the example shown in FIG. 1, the thickness of the base material 91 is greater than the thickness of the first coating layer 93 and greater than the thickness of the second coating layer 94.

[0048] (Work 9) The workpiece 9 may be a pipe as shown in Fig. 10, or an angle bar as shown in Fig. 12. The workpiece 9 may be a channel bar or a flat plate. The workpiece 9 may be a long workpiece extending in a direction perpendicular to the first direction DR1.

[0049] The workpiece 9 may be a part that defines a flow path through which a fluid flows, a part for heating and cooling equipment, a part for a home appliance, an automobile part, a part for a control panel, a building part, a part for a shelf, a part for furniture, a part for agricultural machinery, a part for kitchen equipment, or a part for logistics equipment.

[0050] The thickness TH (see FIG. 1) of the plate portion 90 in the first region RG1 is, for example, not less than 0.5 mm and not more than 6 mm.

[0051] (Removal process) 2, the step of removing the first coating layer 93 (removal step: second step ST2) includes removing the first coating layer 93 from the first region RG1 of the plate portion 90 by irradiating the first coating layer 93 with a laser B. In the example shown in FIG. 2, in the removal step, the traveling direction of the laser B toward the first coating layer 93 is the second direction DR2 (in other words, the direction opposite to the direction from the base material 91 toward the first coating layer 93).

[0052] As illustrated in Fig. 2, an access opening OP (more specifically, a through hole for access) may be formed in the second wall 99b of the workpiece 9 by the laser B emitted from the laser head 51. In the example illustrated in Fig. 2, the laser B emitted from the laser head 51 passes through the access opening OP formed in the second wall 99b of the workpiece 9. In addition, the laser B passing through the access opening OP is irradiated onto the first wall 99a of the workpiece 9, thereby removing the first coating layer 93 from a part of the first wall 99a.

[0053] Alternatively, or additionally, as illustrated in FIG. 14, the removal process (second step ST2) for removing the first coating layer 93 may include removing the first coating layer 93 from the first region RG1 of the plate portion 90 by applying a chemical solution L to the first coating layer 93.

[0054] 14, the chemical liquid L is supplied so as to cross an access opening OP formed in the second wall 99b of the workpiece 9. In addition, the chemical liquid L supplied so as to cross the access opening OP is applied to the first wall 99a of the workpiece 9, thereby removing the first coating layer 93 from a portion of the first wall 99a.

[0055] Alternatively, or additionally, as illustrated in FIG. 15, the removal process (second step ST2) of removing the first coating layer 93 may include removing the first coating layer 93 from the first region RG1 of the plate portion 90 by contacting a second tool T2, such as a cutting tool, with the first coating layer 93.

[0056] 15, a second tool T2 such as a cutting tool is inserted into an access opening OP formed in a second wall 99b of the workpiece 9. In addition, the first coating layer 93 is removed from a portion of the first wall 99a of the workpiece 9 by the second tool T2 inserted into the access opening OP.

[0057] (Position change process) In the example shown in Fig. 3 and Fig. 4, after the first coating layer 93 is removed from the first region RG1 of the plate portion 90, before a step of burring the plate portion 90 (burring step: fourth step ST4) is performed, the relative position of the workpiece 9 with respect to the burring tool 10 is changed so that the burring tool 10 faces the first region RG1 of the workpiece 9 (hereinafter referred to as a "position changing step"). As exemplified in Fig. 3 and Fig. 4, the position changing step may include turning over the workpiece 9. More specifically, the position changing step may include rotating the workpiece 9 by 180 degrees around an axis AT parallel to the longitudinal direction of the workpiece 9.

[0058] (Burring process) The process of burring the plate portion 90 (burring process: fourth step ST4) includes transmitting frictional heat generated between the rotating burring tool 10 and the plate portion 90 to the first region RG1 of the plate portion 90, and pressing the first region RG1 of the plate portion 90 in the first direction DR1 by the rotating burring tool 10.

[0059] Frictional heat generated between the rotating burring tool 10 and the plate portion 90 is transmitted to the first region RG1 of the plate portion 90, whereby the first region RG1 is softened (more specifically, plasticized) by the frictional heat. In the first embodiment, before the step of burring the plate portion 90 (burring step: fourth step ST4) is performed, the first coating layer 93 that covered the surface of the base material 91 on the first direction DR1 side is removed from the first region RG1 (see Figs. 2 and 3). Therefore, during the burring step, frictional heat is transmitted well to the entire first region RG1, and the presence of the first coating layer 93 does not impede the transmission of frictional heat.

[0060] As illustrated in FIG. 5, in the step of burring the plate portion 90 (burring step: fourth step ST4), the first region RG1 softened by frictional heat is pressed in a first direction DR1 by the burring tool 10. In addition, the first region RG1 softened by frictional heat is pressed in the first direction DR1 by the burring tool 10, whereby a through hole 96 is formed in the first region RG1 and the edge of the through hole 96 is stretched cylindrically toward the first direction DR1. In this way, a flange 97 is formed in the first region RG1. In the example illustrated in FIG. 5, in the step of burring the plate portion 90, the formation of the through hole 96 and the formation of the flange 97 are performed simultaneously.

[0061] In this specification, forming the through hole 96 in the first region RG1 includes forming the through hole 96 through which the burring tool 10 passes in the first region RG1 in which no pilot hole is provided (see Figs. 4 and 5). In addition, in this specification, forming the through hole 96 in the first region RG1 includes forming the through hole 96 through which the burring tool 10 passes in the first region RG1 by expanding a pilot hole previously formed in the first region RG1. In other words, a pilot hole may or may not be provided in the first region RG1 before the step of burring the plate portion 90 (burring step: fourth step ST4).

[0062] As illustrated in Figures 4 and 5, the step of burring the plate portion 90 (burring step: fourth step ST4) may include moving the rotating burring tool 10 in the first direction DR1 so that the rotating burring tool 10 crosses the second coating layer 94 and the base material 91 in this order. In the example illustrated in Figures 4 and 5, the second coating layer 94 is not removed from the first region RG1 before the burring step is performed, and the second coating layer 94 is maintained as it is. By omitting the step of removing the second coating layer 94 from the first region RG1, the total time required to process the workpiece is shortened.

[0063] (Burring tool 10) 4, the burring tool 10 has a tip portion 11 having a tapered shape and a column portion 13 continuing to the tip portion 11. The burring tool 10 may have a tip portion 11 having a tapered shape, a column portion 13 continuing to the tip portion 11, and a shoulder portion 15 continuing to the column portion 13. In other words, the burring tool 10 may have the tip portion 11 having a tapered shape, the shoulder portion 15, and the column portion 13 disposed between the tip portion 11 and the shoulder portion 15.

[0064] The tip portion 11 and the column portion 13 have a function of forming a through hole 96 and a flange 97 in the first region RG1 of the plate portion 90. More specifically, the tip portion 11 in a rotating state presses the first region RG1 of the plate portion 90 in the first direction DR1, thereby expanding the hole formed in the first region RG1. As a result, the through hole 96 is formed in the first region RG1. Furthermore, the column portion 13 in a rotating state is inserted into the through hole 96 formed in the first region RG1, thereby adjusting the shape of the through hole 96 and the shape of the flange 97. When a cross section perpendicular to the central axis of the burring tool 10 is defined as a transverse section, the size and shape of the transverse section of the column portion 13 may be approximately constant along the central axis of the burring tool 10.

[0065] The cross-sectional shape of the tip portion 11 of the burring tool 10 may be circular, or may be a rounded polygonal shape (for example, a rounded rectangle) as exemplified in Fig. 16, or may be another shape. The cross-sectional shape of the column portion 13 of the burring tool 10 may be circular, or may be a rounded polygonal shape (for example, a rounded rectangle) as exemplified in Fig. 16, or may be another shape.

[0066] 5, the shoulder portion 15 has a function of adjusting the shape of the surface on the second direction DR2 side of the plate portion 90 of the workpiece 9. More specifically, the shoulder portion 15 in a rotating state presses the surface on the second direction DR2 side of the plate portion 90, thereby adjusting the shape of the surface.

[0067] (Tool exchange process) The workpiece machining method in the first embodiment may include a step of replacing the burring tool 10 held by the machining head 30 with a tapping tool 18 (see FIG. 6) (hereinafter referred to as a "tool changing step"). The tool changing step is performed, for example, by using a tool changing device. Alternatively, the tool changing step may be performed manually. Also, when the machine tool in the first embodiment includes a second machining head that holds the tapping tool 18 in addition to the machining head 30 that holds the burring tool 10, the tool changing step may be omitted.

[0068] (Tapping process) 6 and 7, the workpiece machining method in the first embodiment may include a step of forming a female thread on a wall surface 96w that defines the through hole 96 (hereinafter referred to as a "tapping step"). The tapping step is performed as a fifth step ST5 after the fourth step ST4 (burring step).

[0069] 6 and 7, the tapping step (fifth step ST5) includes moving the rotating tapping tool 18 in the first direction DR1 to form a female thread 96s in a wall surface 96w that defines the through hole 96. Fig. 8 shows the state after the tapping step has been performed.

[0070] In the first embodiment, the flange 97 is well formed in the burring process because the first coating layer 93 is removed from the first region RG1 of the plate portion 90. In addition, because the flange 97 is well formed, the female thread 96s can be easily formed on the inner peripheral surface of the flange 97 by performing the tapping process.

[0071] (Machine tool 1A) As illustrated in FIG. 17, the machine tool 1A in the first embodiment includes a workpiece supporting device 2, a machining head 30, a rotation driving device 36 (eg, a motor 36m), a moving device 4, a removing device 5, and a control device 8.

[0072] The workpiece supporting device 2 supports a workpiece 9. The workpiece supporting device 2 may have a first chuck 21 that supports a first portion of the workpiece 9, and a second chuck 23 that supports a second portion of the workpiece 9.

[0073] The machining head 30 supports the burring tool 10 rotatably around a rotation axis AX. In the example shown in Fig. 4, the machining head 30 has a rotating body 31 and a frame 33 that rotatably supports the rotating body 31. In the example shown in Fig. 4, the rotating body 31 supports the burring tool 10 via a first tool holder HD1.

[0074] The rotation drive device 36 rotates the burring tool 10 about a rotation axis AX that coincides with the central axis of the burring tool 10. More specifically, the rotation drive device 36 rotates the rotor 31 about a first axis AX1, thereby rotating the burring tool 10 about the rotation axis AX. In the example shown in Fig. 4, the first axis AX1, which is the rotation axis of the rotor 31, and the rotation axis AX of the burring tool 10 are coaxial.

[0075] 17, the moving device 4 moves the machining head 30 relatively to the workpiece supporting device 2. In addition, the moving device 4 moves the laser head 51 relatively to the workpiece supporting device 2.

[0076] The removal device 5 removes a part of the first coating layer 93 from the workpiece 9. In the example shown in FIG. 17, the removal device 5 includes a laser irradiation device 50a having a laser head 51. Alternatively, or additionally, the removal device 5 may include a chemical solution application device 50b (see FIG. 14) and / or a cutting device 50c (see FIG. 15). As illustrated in FIG. 15, when a second tool T2 such as a cutting tool is attached to the processing head 30, the processing head 30 and the second tool T2 function as the removal device 5.

[0077] The control device 8 controls the rotation drive device 36, the moving device 4, and the removing device 5. Additionally, the control device 8 may control the workpiece supporting device 2.

[0078] The control device 8 can execute a removal mode M1. The removal mode M1 is a mode in which the control device 8 transmits a control command to at least the removal device 5, thereby removing the first coating layer 93 from the first region RG1 of the plate portion 90 using at least the removal device 5. More specifically, as illustrated in Fig. 17, the removal mode M1 includes transmitting an emission command E1 from the control device 8 to the laser irradiation device 50a so that the first coating layer 93 is removed from the first region RG1 of the plate portion 90 by the laser B emitted from the laser head 51.

[0079] For example, as illustrated in FIG. 17, the control device 8 executing the removal mode M1 transmits a first movement command S1 to the moving device 4 to move the laser head 51 relative to the workpiece support device 2. The moving device 4 receiving the first movement command S1 moves the laser head 51 relative to the workpiece support device 2 so that the first region RG1 of the plate portion 90 is positioned on the laser emission axis of the laser head 51. The control device 8 executing the removal mode M1 also transmits an emission command E1 to the laser irradiation device 50a. The laser irradiation device 50a receiving the emission command E1 emits a laser in a direction from the laser head 51 toward the first region RG1 of the plate portion 90. The moving device 4 receiving the first movement command S1 also moves the laser head 51 relative to the workpiece support device 2 so that the laser emitted from the laser head 51 scans the removal target region RT (see the dashed arrow in FIG. 2). In this way, the first coating layer 93 is removed from the first region RG1 of the plate portion 90 by the laser B emitted from the laser head 51. When the spot diameter of the laser B irradiated onto the first region RG1 is equal to the size of the region to be removed RT, scanning with the laser B is not necessary.

[0080] As illustrated in Figure 18, when the second wall 99b of the workpiece 9 is present between the laser emission port 52 of the laser head 51 and the first region RG1 of the plate portion 90, when the removal mode M1 is executed by the control device 8, an access opening OP (see Figure 2) is formed in the second wall 99b of the workpiece 9 by the laser B emitted from the laser head 51, and the first coating layer 93 is removed from the first region RG1 of the plate portion 90 by the laser B emitted from the laser head 51.

[0081] The control device 8 may be capable of executing an inversion mode M2 ​​in which the workpiece 9 is inverted. The inversion mode M2 ​​is a mode in which the control device 8 transmits a control command to the workpiece supporting device 2, thereby inverting the workpiece 9 using the workpiece supporting device 2.

[0082] For example, as illustrated in FIG. 19, the control device 8 executing the inversion mode M2 ​​transmits an inversion command RW to the workpiece supporting device 2 to invert the workpiece 9. The workpiece supporting device 2 receiving the inversion command RW inverts the workpiece 9. More specifically, the workpiece supporting device 2 receiving the inversion command RW rotates the workpiece 9 180 degrees around an axis AT parallel to the longitudinal direction of the workpiece 9. In the example illustrated in FIG. 19, the inversion of the workpiece 9 is performed by the workpiece supporting device 2 receiving the inversion command RW rotating the first chuck 21 and the second chuck 23 supporting the workpiece 9 180 degrees around an axis AT parallel to the longitudinal direction of the workpiece 9. FIG. 19 shows a state after the workpiece 9 has been inverted.

[0083] The control device 8 can execute a burring mode M3. The burring mode M3 is a mode in which the plate portion 90 is burred by transmitting a control command from the control device 8 to at least the rotation drive device 36 and the moving device 4. The burring mode M3 is also a mode in which a through hole 96 and a flange 97 are formed in the first region RG1 from which the first coating layer 93 has been removed, using the burring tool 10 that moves in a first direction DR1 in a rotating state.

[0084] For example, as illustrated in FIG. 20, the control device 8 executing the burring machining mode M3 transmits a second movement command S2 to the moving device 4 for moving the burring tool 10 relative to the workpiece support device 2. The moving device 4 receiving the second movement command S2 moves the burring tool 10 relative to the workpiece support device 2 so that the first region RG1 of the plate portion 90 is positioned on the rotation axis AX of the burring tool 10. The control device 8 executing the burring machining mode M3 also transmits a first rotation command R1 to the rotation drive device 36. The rotation drive device 36 receiving the first rotation command R1 rotates the burring tool 10 around the rotation axis AX. Furthermore, the moving device 4 receiving the second movement command S2 moves the burring tool 10 in the rotating state in the first direction DR1 so that the burring tool 10 in the rotating state crosses the first region RG1 of the plate portion 90 (see the arrow AR1 in FIG. 4 or FIG. 20). In this way, a through hole 96 and a flange 97 are formed in the first region RG1 of the plate portion 90. In the example shown in FIG. 5, the burring mode M3 is executed, so that a through hole 96 and a flange 97 are simultaneously formed in the first region RG1 of the plate portion 90.

[0085] The control device 8 may be capable of executing a tool change mode M4. The tool change mode M4 is a mode in which the burring tool 10 attached to the machining head 30 is changed to a tapping tool 18 by using at least the moving device 4 and the tool changer 6 by transmitting a control command from the control device 8 to at least the moving device 4 and the tool changer 6 (see FIG. 21 ).

[0086] For example, as illustrated in Fig. 21, the control device 8 executing the tool change mode M4 transmits a movement command S4 to the movement device 4. The movement device 4 receiving the movement command S4 moves the machining head 30 to the tool change position P1 (see Fig. 21). In addition, the control device 8 executing the tool change mode M4 transmits a tool change command C1 to the tool change device 6. The tool change device 6 receiving the tool change command C1 replaces the burring tool 10 held by the machining head 30 with a tapping tool 18.

[0087] The control device 8 may be capable of executing a tapping mode M5. The tapping mode M5 is a mode in which the control device 8 transmits a control command to at least the rotation drive device 36 and the movement device 4 to form a female screw 96s in a wall surface 96w that defines the through hole 96 using at least the rotation drive device 36 and the movement device 4.

[0088] For example, as illustrated in FIG. 22, the control device 8 executing the tapping mode M5 transmits a third movement command S3 to the moving device 4 for moving the tapping tool 18 relative to the workpiece support device 2. The moving device 4 receiving the third movement command S3 moves the tapping tool 18 relative to the workpiece support device 2 so that the central axis of the through hole 96 is located on the rotation axis AX of the tapping tool 18. The control device 8 executing the tapping mode M5 also transmits a second rotation command R2 to the rotation drive device 36. The rotation drive device 36 receiving the second rotation command R2 rotates the tapping tool 18 around the rotation axis AX. Furthermore, the moving device 4 receiving the third movement command S3 moves the rotating tapping tool 18 in the first direction DR1 so that the female screw 96s is formed on the wall surface 96w that defines the through hole 96. In this way, the female screw 96s is formed on the wall surface 96w that defines the through hole 96.

[0089] Second embodiment A workpiece machining method, a machine tool 1B, and a program 822 in the second embodiment will be described with reference to Figs. 1 to 30. Fig. 24 is a diagram showing a part of the machine tool 1B in the second embodiment. Fig. 25 is a diagram showing an enlarged part of Fig. 24. Figs. 26 and 27 are diagrams showing a machine tool 1B in the second embodiment. Figs. 28 and 29 are diagrams showing a part of the machine tool 1B in the second embodiment. Fig. 30 is a diagram showing an example of a storage medium 82M having a program 822 recorded thereon.

[0090] In the second embodiment, differences from the first embodiment will be mainly described. On the other hand, in the second embodiment, repeated descriptions of matters already described in the first embodiment will be omitted. Therefore, it goes without saying that matters already described in the first embodiment can be applied to the second embodiment even if they are not explicitly described in the second embodiment. Conversely, all matters described in the second embodiment can be applied to the first embodiment.

[0091] As illustrated in FIG. 24, the machine tool 1B in the second embodiment includes a workpiece supporting device 2, a machining head 30, a rotational driving device 36, a moving device 4, a removal device 5 (e.g., a laser irradiation device 50a), and a control device 8.

[0092] The work support device 2, processing head 30, rotational drive device 36, moving device 4, removal device 5 (e.g., laser irradiation device 50a), and control device 8 have already been described in the first embodiment, so repeated explanations of these configurations will be omitted.

[0093] The second embodiment provides the same effects as the first embodiment.

[0094] The workpiece machining method in the second embodiment includes a preparation step (first step ST1), a removal step (second step ST2), and a burring step (fourth step ST4). Additionally, the workpiece machining method in the second embodiment may include a position change step (third step ST3) and / or a tapping step (fifth step ST5).

[0095] The preparation step, removal step, position change step, burring step, and tapping step have already been described in the first embodiment, so repeated description of these steps will be omitted.

[0096] (Optional configuration) Next, optional additional configurations that can be adopted in the second embodiment (or the above-described first embodiment) will be described with reference to FIGS.

[0097] (Work 9) 25, the workpiece 9 has a plate portion 90, and the plate portion 90 includes a base material 91 and a first coating layer 93 that covers at least a part of the base material 91. The workpiece 9 has been described in the first embodiment, so a repeated description of the workpiece 9 will be omitted.

[0098] (Work support device 2) In the example shown in FIG. 26, the workpiece supporting device 2 has a first chuck 21 that supports a first portion of the workpiece 9 and a second chuck 23 that supports a second portion of the workpiece 9.

[0099] The first chuck 21 may have a gripping member 211 capable of gripping the workpiece 9. The first chuck 21 may be movable together with the workpiece 9 in a direction parallel to the X-axis. In the example shown in FIG. 26, the X-axis is an axis parallel to the extension direction of the workpiece 9 gripped by the first chuck 21.

[0100] The second chuck 23 may have a plurality of guide rollers 231 that sandwich the workpiece 9. The plurality of guide rollers 231 guide the movement of the workpiece 9 (more specifically, a long workpiece) in a direction parallel to the X-axis.

[0101] 26, the workpiece supporting device 2 has a second rotation drive device 25 that rotates the workpiece 9 around an axis AT parallel to the longitudinal direction of the workpiece. The second rotation drive device 25 may include a first motor 25a that rotates the second rotating body 22 that supports the first chuck 21 around the axis AT, and a second motor 25b that rotates the third rotating body 24 that supports the second chuck 23 around the axis AT.

[0102] (Mobile device 4) 24, the moving device 4 moves the machining head 30 relatively to the workpiece supporting device 2. In addition, the moving device 4 moves the laser head 51 relatively to the workpiece supporting device 2.

[0103] In the example shown in Fig. 24, the moving device 4 includes a first moving device 40 that moves the machining head 30. As illustrated in Fig. 26, the moving device 4 may include a second moving device 46 (more specifically, a motor 46m such as a servo motor) that moves the workpiece 9. In the example shown in Fig. 26, the second moving device 46 moves the first chuck 21 in a direction parallel to the X-axis, thereby moving the workpiece 9 gripped by the first chuck 21 in a direction parallel to the X-axis.

[0104] In the example shown in FIG. 24, the first moving device 40 has a moving body (41a; 43a) that supports the processing head 30, and a driving device (41b; 43b) that moves the moving body (41a; 43a).

[0105] The first moving device 40 may have a first moving body 41a and a first driving device 41b that moves the first moving body 41a in a direction parallel to the Z axis. In the example described in FIG. 24, the first moving body 41a directly or indirectly supports the processing head 30 and is movable together with the processing head 30 in a direction parallel to the Z axis. The first moving body 41a may directly or indirectly support the laser head 51. In addition, the first moving body 41a may be movable together with the laser head 51 in a direction parallel to the Z axis. The Z axis is an axis perpendicular to the X axis. In the example described in FIG. 24, the Z axis is an axis parallel to the vertical direction.

[0106] The first moving device 40 may have a second moving body 43a and a second driving device 43b that moves the second moving body 43a in a direction parallel to the Y axis. In the example described in FIG. 24, the second moving body 43a directly or indirectly supports the processing head 30 and is movable in a direction parallel to the Y axis together with the processing head 30. The second moving body 43a may directly or indirectly support the laser head 51. In addition, the second moving body 43a may be movable in a direction parallel to the Y axis together with the laser head 51. The Y axis is an axis perpendicular to both the X axis and the Z axis. In the example described in FIG. 24, the Y axis is an axis parallel to a horizontal plane.

[0107] The first moving device 40 may have a third driving device 45b that moves the processing head 30 relative to the laser head 51. In the example shown in Fig. 24, the third driving device 45b moves the processing head 30 relative to the laser head 51 in a direction parallel to the Z axis.

[0108] (Laser irradiation device 50a) 24, the laser irradiation device 50a has a laser head 51, a laser light source 53, and an optical component 55 (e.g., an optical fiber, etc.) that transmits a laser from the laser light source 53 to the laser head 51. The laser head 51 has a laser emission port 52 that emits a laser.

[0109] (Processing head 30) The processing head 30 supports the burring tool 10 rotatably around a rotation axis AX. The processing head 30 has a rotating body 31 and a frame 33 that rotatably supports the rotating body 31. In the example shown in Fig. 24, the rotating body 31 supports the burring tool 10 via a first tool holder HD1.

[0110] The rotation drive device 36 rotates the rotating body 31 about the first axis AX1, thereby rotating the burring tool 10 about the rotation axis AX. In the example shown in Fig. 24, the first axis AX1 which is the rotation axis of the rotating body 31 and the rotation axis AX of the burring tool 10 are coaxial.

[0111] In the example described in Figures 28 and 29, the machining head 30 is capable of selectively holding a first tool holder HD1 (see Figure 28) that holds a burring tool 10 and a second tool holder HD2 (see Figure 29) that holds a tapping tool 18.

[0112] (Tool changer 6) The machine tool 1 may include a tool exchange device 6. As illustrated in Fig. 21, the tool exchange device 6 can exchange a first tool holder HD1 held by the machining head 30 (more specifically, the rotating body 31 of the machining head 30) with a second tool holder HD2 that holds a tapping tool 18. The tool exchange device 6 can also exchange a second tool holder HD2 held by the machining head 30 (more specifically, the rotating body 31 of the machining head 30) with a first tool holder HD1 that holds a burring tool 10.

[0113] The tool change device 6 may include a tool change arm 61, an arm rotation device 63 that rotates the tool change arm 61, and an arm moving device 65 that linearly moves the tool change arm 61. The arm rotation device 63 rotates the tool change arm 61 around a second axis AX2. In addition, the arm moving device 65 moves the tool change arm 61 in a direction parallel to the second axis AX2.

[0114] (Control device 8) The control device 8 controls the rotation drive device 36, the moving device 4 (e.g., the first drive device 41b, the second drive device 43b, the third drive device 45b, the motor 46m that moves the workpiece 9, etc.), and the removal device 5 (e.g., the laser irradiation device 50a). Additionally, the control device 8 may control the second rotation drive device 25 and / or the tool exchange device 6.

[0115] 24, the control device 8 transmits an emission command E1 to the laser irradiation device 50a, thereby causing the laser head 51 to emit the laser B. More specifically, the control device 8 transmits the emission command E1 to the laser irradiation device 50a, and the laser irradiation device 50a receiving the emission command E1 emits the laser B from the laser head 51 (more specifically, the laser emission port 52 of the laser head 51).

[0116] 28 or 29, the control device 8 transmits a rotation command R to the rotary drive device 36 (e.g., the motor 36m) to rotate the burring tool 10 or the tapping tool 18. More specifically, the control device 8 transmits a rotation command R to the rotary drive device 36, and the rotary drive device 36 receiving the rotation command R rotates the burring tool 10 or the tapping tool 18 around the rotation axis AX.

[0117] 24 or 28, the control device 8 transmits a movement command S to the moving device 4, thereby moving the machining head 30 or the laser head 51 relative to the workpiece support device 2. More specifically, the control device 8 transmits the movement command S to the moving device 4, and the moving device 4 receiving the movement command S moves the machining head 30 or the laser head 51 relative to the workpiece support device 2.

[0118] 24, the control device 8 includes a hardware processor 80 (hereinafter, simply referred to as the "processor 80"), a memory 82, a communication circuit 84, and an input device 86 (for example, a display 862 with a touch panel). The processor 80, the memory 82, the communication circuit 84, and the input device 86 are connected to each other via a bus 88.

[0119] The memory 82 stores data 826 and a program 822. The program 822 stored in the memory 82 may include a first program 822a for implementing the above-mentioned removal mode M1, and may include a third program 822c for implementing the above-mentioned burring mode M3. The program 822 may include a second program 822b for implementing the above-mentioned reversal mode M2, and may include a fourth program 822d for implementing the above-mentioned tool change mode M4. The program 822 may also include a fifth program 822e for implementing the above-mentioned tapping mode M5.

[0120] The memory 82 is a storage medium readable by the processor 80 of the control device 8. The memory 82 may be, for example, a non-volatile or volatile semiconductor memory such as a RAM, a ROM, or a flash memory, a magnetic disk, or another type of memory.

[0121] Data required for removing the first coating layer 93 may be input to the control device 8 via the input device 86, may be input to the control device 8 from another computer via the communication circuit 84, or may be calculated or derived by the control device 8. Data required for removing the first coating layer 93 (e.g., work data 826a including data indicating the thickness of the first coating layer 93, data 826b indicating the position and size of the removal target region RT, characteristic data 826c of an obstacle between the removal target region RT and the laser head 51, laser output parameters 826d, a feed speed command value 826e for the laser head 51, first path data 826f defining a first movement path along which the removal device 5, such as the laser head 51, should move, etc.) is stored in the memory 82.

[0122] Data necessary for the burring process may be input to the control device 8 via the input device 86, may be input to the control device 8 from another computer via the communication circuit 84, or may be calculated or derived by the control device 8. Data necessary for the burring process (e.g., work data 826a, second path data 826g that defines the second movement path along which the burring tool 10 should move, etc.) are stored in the memory 82.

[0123] Data required for tapping may be input to the control device 8 via the input device 86, may be input to the control device 8 from another computer via the communication circuit 84, or may be calculated or derived by the control device 8. Data required for tapping (e.g., work data 826a, third path data 826h defining a third movement path along which the tap tool 18 should move, etc.) is stored in the memory 82. When data specifying the length of the flange 97 in a direction along the central axis of the through hole 96 is stored in the memory 82, the control device 8 may derive the third path data 826h (e.g., the third path data 826h defining the insertion depth of the tap tool 18 into the first wall 99a) based on the data. When data specifying the tool diameter of the burring tool 10 is stored in the memory 82, the control device 8 may derive the length of the flange 97 in a direction along the central axis of the through hole 96 based on the data.

[0124] The input device 86 is not limited to the touch panel display 862. For example, the control device 8 may include an input device 86 such as a button, a switch, a lever, a pointing device, or a keyboard, and a display that displays data input to the input device 86 or other information. In addition, a plurality of computers may cooperate to function as the control device 8. In addition, the memory 82 may be distributed and arranged in a plurality of locations. For example, a part of the memory 82 may be included in cloud storage.

[0125] The processor 80 of the control device 8 executes the program 822 stored in the memory 82, whereby the control device 8 generates a control command. Furthermore, the communication circuit 84 transmits the control command to the devices to be controlled (more specifically, the rotation drive device 36, the movement device 4, the removal device 5 such as the laser irradiation device 50a, the second rotation drive device 25, the tool changer 6, etc.). In this way, the processor 80 executes the program 822, whereby the control device 8 can control the rotation drive device 36, the movement device 4, the removal device 5 such as the laser irradiation device 50a, the second rotation drive device 25, the tool changer 6, etc.

[0126] 24, workpiece data 826a is stored in the memory 82. The workpiece data 826a includes, for example, shape data of the workpiece 9, data specifying the position of the through hole 96 to be formed by the burring process, and data specifying the size of the through hole 96 to be formed by the burring process (for example, data specifying the inner diameter of the through hole 96). The workpiece data 826a may also include data specifying the length of a flange to be formed by the burring process.

[0127] The control device 8 may derive the position of the region to be removed RT and the size of the region to be removed RT based on at least the work data 826a (more specifically, based on the shape data of the work 9, data specifying the position of the through hole 96 to be formed by the burring process, and data specifying the size of the through hole 96 to be formed by the burring process), and store data 826b indicating the derived position of the region to be removed RT and the size of the region to be removed RT in the memory 82.

[0128] In addition, the control device 8 may derive a first movement path along which the removal device 5, such as the laser head 51, should move based on data 826b indicating the position of the region to be removed RT and the size of the region to be removed RT, and store first path data 826f indicating the derived first movement path in the memory 82.

[0129] Furthermore, the control device 8 may generate a first movement command S1 based on the first path data 826f, and transmit the first movement command S1 to the movement device 4 so that the removal device 5, such as the laser head 51, moves along the first movement path. The movement device 4 receiving the first movement command S1 moves the removal device 5, such as the laser head 51, along the first movement path. In this way, the first coating layer 93 is removed in the removal target region RT.

[0130] In the above example, the position of the removal target region RT, the size of the removal target region RT, and the above-mentioned first movement path are automatically derived by the control device 8 based on the workpiece data 826a, so the operator does not need to input these data into the control device 8. This reduces the operator's workload and avoids the generation of defective workpieces due to input errors by the operator.

[0131] 24, workpiece data 826a is stored in the memory 82. The workpiece data 826a includes, for example, shape data of the workpiece 9, data for identifying the positions of the through holes 96 to be formed by burring, material data of the base material 91, plate thickness data of the base material 91, material data of the first coating layer 93, thickness data of the first coating layer 93, and the like.

[0132] The control device 8 may determine a laser output parameter 826d based on at least the workpiece data 826a, and store the determined laser output parameter 826d in the memory 82. The laser output parameter 826d includes, for example, power, pulse frequency, duty ratio, focal length, etc. The control device 8 may also determine a feed speed command value for the laser head 51 based on at least the workpiece data 826a, and store the determined feed speed command value 826e in the memory 82.

[0133] The control device 8 may determine a laser output parameter based on at least the characteristic data 826c of an obstacle (for example, the above-mentioned second wall 99b) between the removal target region RT and the laser head 51, and store the determined laser output parameter 826d in the memory 82. The control device 8 may determine a feed speed command value for the laser head 51 based on at least the characteristic data 826c of an obstacle (for example, the above-mentioned second wall 99b) between the removal target region RT and the laser head 51, and store the determined feed speed command value 826e in the memory 82. Note that the characteristic data 826c of the obstacle between the removal target region RT and the laser head 51 includes at least one of, for example, the presence or absence of the obstacle, the thickness of the obstacle, and the material of the obstacle.

[0134] For example, when an obstacle (for example, the above-mentioned second wall 99b) exists between the removal target region RT and the laser head 51, the obstacle needs to be removed by the laser. Therefore, in this case, it is preferable to relatively increase the laser output or relatively decrease the feed speed of the laser head 51.

[0135] For example, as the thickness of the obstacle between the region to be removed RT and the laser head 51 increases, the laser output may be relatively increased or the feed speed of the laser head 51 may be relatively decreased.

[0136] For example, if the material of the obstacle between the region to be removed RT and the laser head 51 is a material that is easily melted by the laser (e.g., a material with high laser absorption characteristics or a material with a low melting point), the laser output may be made relatively small or the feed speed of the laser head 51 may be made relatively large.

[0137] The control device 8 may determine a laser output parameter based on at least both the above-mentioned work data 826a and the characteristic data 826c of an obstacle (for example, the above-mentioned second wall 99b) between the removal target region RT and the laser head 51, and store the determined laser output parameter 826d in the memory 82. The control device 8 may also determine a feed speed command value for the laser head 51 based on at least both the above-mentioned work data 826a and the characteristic data 826c of an obstacle (for example, the above-mentioned second wall 99b) between the removal target region RT and the laser head 51, and store the determined feed speed command value 826e in the memory 82.

[0138] In the above example, at least one of the laser output parameter 826d and the feed speed command value 826e of the laser head 51 is automatically derived by the control device 8 based on at least one of the workpiece data 826a and the characteristic data 826c of an obstacle (for example, the above-mentioned second wall 99b) between the removal target region RT and the laser head 51. This reduces the workload of the operator.

[0139] (Removal mode M1) The control device 8 can execute a removal mode M1 by controlling the removal device 5 (more specifically, the laser irradiation device 50a) and the movement device 4. As illustrated in Fig. 2 and Fig. 12 to Fig. 15, the removal mode M1 is a mode in which a removal means such as a laser B, a chemical solution L, a second tool T2, etc. is applied to the first coating layer 93 so that the first coating layer 93 is removed from the first region RG1 of the plate portion 90. An example in which the laser B is applied to the first coating layer 93 will be described below.

[0140] 17 or 26, the control device 8 executing the program 822 (more specifically, the first program 822a) transmits the above-mentioned laser output parameters 826d and an emission command E1 to the laser irradiation device 50a. The control device 8 executing the program 822 (more specifically, the first program 822a) also transmits a first movement command S1 to the movement device 4 based on a feed speed command value 826e of the laser head 51 stored in the memory 82 and the first path data 826f.

[0141] The laser irradiation device 50a receives the laser output parameter 826d and the emission command E1 and emits a laser having an output corresponding to the laser output parameter 826d toward the removal target region RT. The movement device 4 receives the first movement command S1 and moves the laser head 51 along the first movement path. In this way, the first coating layer 93 is removed from the first region RG1 of the plate portion 90. If an obstacle (e.g., the second wall 99b) is present on the laser emission axis of the laser head 51, the obstacle is removed by the laser emitted toward the removal target region RT.

[0142] (Reverse mode M2) The control device 8 may be capable of executing the inversion mode M2 ​​by controlling the workpiece supporting device 2 (more specifically, the second rotation driving device 25).

[0143] 19 or 27, the control device 8 executing the program 822 (more specifically, the second program 822b) transmits a reversal command RW to the second rotation drive device 25. The second rotation drive device 25 receiving the reversal command RW reverses the workpiece 9. More specifically, the second rotation drive device 25 receiving the reversal command RW reverses the workpiece 9 by rotating the first chuck 21 and the second chuck 23 180 degrees around an axis AT parallel to the longitudinal direction of the workpiece 9.

[0144] (Burring processing mode M3) The control device 8 controls the rotation drive device 36 and the movement device 4, thereby enabling the burring mode M3 to be executed.

[0145] 20 or 28, the control device 8 executing the program 822 (more specifically, the third program 822c) transmits a first rotation command R1 to the rotation drive device 36. In addition, the control device 8 executing the program 822 (more specifically, the third program 822c) transmits a second movement command S2 to the movement device 4 based on the second path data 826g stored in the memory 82.

[0146] The rotary drive device 36 receiving the first rotation command R1 rotates the burring tool 10 around the longitudinal center axis of the burring tool 10. More specifically, the rotary drive device 36 receiving the first rotation command R1 rotates the rotor 31 of the processing head 30 around the first axis AX1, thereby rotating the burring tool 10 around the rotation axis AX. The moving device 4 receiving the second movement command S2 moves the burring tool 10 along the second movement path. More specifically, the first drive device 41b receiving the second movement command S2 moves the processing head 30 along the Z-axis direction, thereby moving the burring tool 10 along the second movement path. In this way, the first region RG1 of the plate portion 90 is burred by the burring tool 10 in the rotating state. In other words, the burring tool 10 in the rotating state forms a through hole 96 and a flange 97 in the first region RG1 of the plate portion 90.

[0147] (Tool change mode M4) The control device 8 may be capable of executing a tool change mode M4 in which the burring tool 10 held by the machining head 30 is replaced with a tapping tool 18. The control device 8 controls the moving device 4 and the tool change device 6 to execute the tool change mode M4.

[0148] For example, in the example shown in FIG. 21 , the control device 8 executing the program 822 (more specifically, the fourth program 822d) transmits a movement command S4 to the movement device 4. Furthermore, the control device 8 executing the program 822 (more specifically, the fourth program 822d) transmits a tool change command C1 to the tool change device 6. The movement device 4 receiving the movement command S4 moves the machining head 30 to the tool change position P1. Furthermore, the tool change device 6 receiving the tool change command C1 replaces the burring tool 10 held by the machining head 30 with a tapping tool 18.

[0149] (Tapping mode M5) The control device 8 controls the rotation drive device 36 and the movement device 4 to thereby execute the tapping mode M5.

[0150] 22 or 29, the control device 8 executing the program 822 (more specifically, the fifth program 822e) transmits a second rotation command R2 to the rotation drive device 36. In addition, the control device 8 executing the program 822 (more specifically, the fifth program 822e) transmits a third movement command S3 to the movement device 4 based on the third path data 826h stored in the memory 82.

[0151] The rotation drive device 36 receiving the second rotation command R2 rotates the tap tool 18 around the longitudinal center axis of the tap tool 18. More specifically, the rotation drive device 36 receiving the second rotation command R2 rotates the rotating body 31 of the processing head 30 around the first axis AX1, thereby rotating the tap tool 18 around the rotation axis AX. In addition, the movement device 4 receiving the third movement command S3 moves the tap tool 18 along the third movement path. More specifically, the first drive device 41b receiving the third movement command S3 moves the processing head 30 along the Z-axis direction, thereby moving the tap tool 18 along the third movement path. In this way, the rotating tap tool 18 forms a female thread 96s on the wall surface 96w that defines the through hole 96.

[0152] (Workpiece processing method) The workpiece machining method in the embodiment may include a step of determining, before the execution of the above-mentioned removal step (second step ST2), at least one of a laser output parameter 826d and a feed speed command value 826e of the laser head 51 based on the above-mentioned workpiece data 826a stored in the memory 82 and / or characteristic data 826c of an obstacle (for example, the above-mentioned second wall 99b) between the removal target region RT and the laser head 51. In addition, the workpiece machining method in the embodiment may include a step of storing the determined laser output parameter 826d and / or the feed speed command value 826e of the laser head 51 in the memory 82.

[0153] The above-mentioned removal step (second step ST2) may include the control device 8 generating the above-mentioned first movement command S1 based on at least the above-mentioned first path data 826f stored in the memory 82. The above-mentioned removal step (second step ST2) may include the control device 8 generating the above-mentioned first movement command S1 based on at least the above-mentioned first path data 826f stored in the memory 82 and the above-mentioned feed speed command value 826e of the laser head 51.

[0154] The above-mentioned removal step (second step ST2) may include the movement device 4 receiving the above-mentioned first movement command S1 from the control device 8 moving the laser head 51 along the first movement path at a feed speed corresponding to the feed speed command value 826e, and the laser irradiation device 50a receiving the above-mentioned laser output parameter 826d and the emission command E1 from the control device 8 emitting a laser having an output corresponding to the laser output parameter 826d toward the removal target region RT. In this way, the first coating layer 93 is removed from the removal target region RT.

[0155] The above-mentioned burring step (fourth step ST4) may include the control device 8 generating the above-mentioned second movement command S2 based on at least the above-mentioned second path data 826g stored in the memory 82.

[0156] The above-mentioned burring step (fourth step ST4) may include the rotation drive device 36 receiving the first rotation command R1 from the control device 8 rotating the burring tool 10 around the rotation axis AX, and the movement device 4 receiving the above-mentioned second movement command S2 moving the burring tool 10 along the second movement path. In this manner, the burring tool 10 in the rotating state moves across the first region RG1 from which the first coating layer 93 has been removed. As a result, the through hole 96 and the flange 97 are formed in the first region RG1 by the burring tool 10 in the rotating state.

[0157] The above-mentioned tapping step (fifth step ST5) may include the control device 8 generating the above-mentioned third movement command S3 based on at least the above-mentioned third path data 826h stored in the memory 82.

[0158] The above-mentioned tapping step (fifth step ST5) may include the rotation drive device 36 receiving the second rotation command R2 from the control device 8 rotating the tapping tool 18 around the rotation axis AX, and the movement device 4 receiving the above-mentioned third movement command S3 moving the burring tool 10 along the third movement path. In this way, the rotating tapping tool 18 moves across the through hole 96. As a result, the rotating tapping tool 18 forms a female thread 96s in the wall surface 96w that defines the through hole 96.

[0159] (Program 822) The program 822 in the embodiment is a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute at least the removal process (second step ST2) and the burring process (fifth step ST5) of the above-mentioned workpiece machining method.

[0160] More specifically, the program 822 in the embodiment is a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece machining method including: (1) a step of removing the first coating layer 93 from a first region RG1 of the plate portion 90, while the workpiece 9 has a plate portion 90 including a base material 91 and a first coating layer 93 covering at least a portion of the base material 91, while the workpiece 9 is supported by the workpiece support device 2 (removal step: second step ST2); and (2) a step of burring the plate portion 90 after the first coating layer 93 has been removed from the first region RG1 of the plate portion 90 (burring step: fourth step ST4).

[0161] As illustrated in FIG. 5, the step of burring the plate portion 90 (fourth step ST4) includes forming a through hole 96 and a flange 97 in the first region RG1 of the plate portion 90 by moving the rotating burring tool 10 in the above-mentioned first direction DR1.

[0162] The details of the removal process (second step ST2) and the burring process (fourth step ST4) have already been explained in the above-mentioned first embodiment or the above-mentioned second embodiment, so the detailed explanation of these processes will be omitted.

[0163] The program 822 in the embodiment may be a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece machining method including (1) the above-mentioned removing step (second step ST2), (2) a step of inverting the workpiece 9 (more specifically, a step of rotating the workpiece 9 180 degrees around an axis AT parallel to the longitudinal direction of the workpiece 9), and (3) the above-mentioned burring step (fourth step ST4). Note that the step of inverting the workpiece 9 is executed between the above-mentioned removing step (second step ST2) and the above-mentioned burring step (fourth step ST4).

[0164] The details of the step of turning over the workpiece 9 have already been explained in the above-mentioned first embodiment or the above-mentioned second embodiment, so the explanation of the details of this step will be omitted.

[0165] The program 822 in the embodiment may be a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece machining method including: (1) the above-mentioned removal process (second step ST2); (2) the above-mentioned burring process (fourth step ST4); and (3) a process of forming a female thread 96s in the wall surface 96w that defines the through hole 96 (tapping process: fifth step ST5).

[0166] In addition, between the above-mentioned burring step (fourth step ST4) and the above-mentioned tapping step (fifth step ST5), a step of replacing the burring tool 10 held by the processing head 30 with a tapping tool 18 may be performed.

[0167] The details of the process of replacing the burring tool 10 held by the machining head 30 with the tapping tool 18 and the tapping process (fifth step ST5) have already been explained in the above-mentioned first embodiment or the above-mentioned second embodiment, so a detailed explanation of these processes will be omitted.

[0168] The program 822 in the embodiment may be a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece machining method including: (1) the above-mentioned removal step (second step ST2); (2) a step of inverting the workpiece 9 (more specifically, a step of rotating the workpiece 9 180 degrees around an axis AT parallel to the longitudinal direction of the workpiece 9); (3) the above-mentioned burring step (fourth step ST4); (4) a step of replacing the burring tool 10 held by the machining head 30 with the tapping tool 18; and (5) the above-mentioned tapping step (fifth step ST5).

[0169] Additionally, the program 822 in the embodiment may include subprograms for causing the control device 8 of the machine tool 1 to execute the following subprograms: (1) a step of deriving the position of the region to be removed RT and the size of the region to be removed RT based on at least the work data 826a (more specifically, based on the shape data of the work 9, the data specifying the position of the through hole 96 to be formed by the burring process, and the data specifying the size of the through hole 96 to be formed by the burring process); (2) a step of deriving a first movement path along which the removal device 5, such as the laser head 51, should move based on data 826b indicating the position of the region to be removed RT and the size of the region to be removed RT; and (3) a step of transmitting a first movement command S1 to the movement device 4 so that the removal device 5, such as the laser head 51, moves along the first movement path.

[0170] Additionally, the program 822 in the embodiment may include subprograms for causing the control device 8 of the machine tool 1 to execute the following steps: (1) determining laser output parameters 826d based on at least the work data 826a; and (2) transmitting an emission command E1 and the laser output parameters 826d to the laser irradiation device 50a so that a laser having an output corresponding to the laser output parameters 826d is emitted toward the region to be removed RT.

[0171] Additionally, the program 822 in the embodiment may include subprograms for causing the control device 8 of the machine tool 1 to execute the following steps: (1) determining laser output parameters 826d based on at least characteristic data 826c of an obstacle (e.g., the above-mentioned second wall 99b) between the region to be removed RT and the laser head 51; and (2) transmitting an emission command E1 and the laser output parameters 826d to the laser irradiation device 50a so that a laser having an output corresponding to the laser output parameters 826d is emitted toward the region to be removed RT.

[0172] The memory 82 in the embodiment may be a non-volatile storage medium that records the above-mentioned program 822. The non-volatile storage medium that records the above-mentioned program 822 may be a portable storage medium 82M, as exemplified in FIG.

[0173] The present invention is not limited to the above-mentioned embodiments or modifications, and it is clear that each embodiment or modification can be appropriately modified or changed within the scope of the technical idea of ​​the present invention. In addition, various techniques used in each embodiment or modification can be applied to other embodiments or other modifications as long as no technical contradiction occurs. Furthermore, any additional configuration in each embodiment or modification can be omitted as appropriate. [Explanation of symbols]

[0174] 1, 1A, 1B...machine tool, 2...workpiece support device, 4...moving device, 5...removal device, 6...tool exchange device, 8...control device, 9...workpiece, 9a...pipe, 10...burring tool, 11...tip portion, 13...column portion, 15...shoulder portion, 18...tapping tool, 21...first chuck, 22...second rotating body, 23...second chuck, 24...third rotating body, 25...second rotation drive device, 25a...first motor, 25b...second motor, 30...machining head, 31...rotating body, 33...frame, 36...rotation drive device, 36m...motor, 40...first moving device, 41a...first moving body, 41b...first drive device, 4 3a...second moving body, 43b...second driving device, 45b...third driving device, 46...second moving device, 46m...motor, 50a...laser irradiation device, 50b...chemical application device, 50c...cutting device, 51...laser head, 52...laser emission port, 53...laser light source, 55...optical component, 61...tool exchange arm, 63...arm rotation device, 65...arm moving device, 80...hardware processor, 82...memory, 82M...storage medium, 84...communication circuit, 86...input device, 88...bus, 90...plate portion, 91...base material, 91s...exposed surface, 93...first coating layer, 93a...plating layer, 94...second Coating layer, 94a...plating layer, 96...through hole, 96s...female screw, 96w...wall surface, 97...flange, 99a...first wall, 99b...second wall, 99c...third wall, 99d...fourth wall, 211...gripping member, 231...guide roller, 822...program, 822a...first program, 822b...second program, 822c...third program, 822d...fourth program, 822e...fifth program, 826...data, 826a...work data, 826b...data indicating the position and size of the area to be removed, 826c...characteristic data of obstacle, 826d...laser output parameters, 82 6e...feed speed command value, 826f...first path data, 826g...second path data, 826h...third path data, 862...touch panel display, AT...axis parallel to the longitudinal direction of the workpiece, AX...rotation axis, AX1...first axis, AX2...second axis, B...laser, C1...tool change command, E1...injection command, G...assist gas, HD1...first tool holder, HD2...second tool holder, L...chemical solution, M1...removal mode, M2...reversal mode, M3...burring processing mode, M4...tool change mode, M5...tapping processing mode, OP...access opening, OP1...through hole type opening,OP2...slit type opening, P1...tool change position, R...rotation command, R1...first rotation command, R2...second rotation command, RB...removed area, RG1...first area, RT...area to be removed, RW...reversal command, S...movement command, S1...first movement command, S2...second movement command, S3...third movement command, S4...movement command, SP...internal area, SP1...internal space, T1...instrument for applying chemical liquid, T2...second tool,

Claims

1. Preparing a workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material; A step of flanging the plate portion; Comprising: The first coating layer is a plating layer of pure zinc or a zinc alloy; When defining the direction from the base material toward the first coating layer as the first direction, the step of flanging the plate portion includes moving a rotating flanging tool in the first direction to form a through hole and a flange in a first region of the plate portion; Before the step of flanging the plate portion, a step of removing the first coating layer from the first region of the plate portion is performed; Work processing method.

2. In the step of flanging the plate portion, the formation of the through hole and the formation of the flange are performed simultaneously; The work processing method according to claim 1.

3. The step of removing the first coating layer includes removing the first coating layer from the first region of the plate portion by irradiating the first coating layer with a laser; The work processing method according to claim 1.

4. Further comprising a step of forming a female thread on the wall surface defining the through hole; The work processing method according to claim 1.

5. The first coating layer faces the internal region of the workpiece; The work processing method according to any one of claims 1 to 4.

6. When defining the direction opposite to the first direction as the second direction, the plate portion is disposed on the second direction side of the base material and includes a second coating layer covering at least a part of the base material; The step of flanging the plate portion includes moving the rotating flanging tool in the first direction such that the rotating flanging tool sequentially crosses the second coating layer and the base material; The work processing method according to claim 5.

7. After the first coating layer is removed from the first region of the plate portion, before the step of flanging the plate portion, further comprising a step of inverting the workpiece; The work processing method according to claim 5.

8. The workpiece has a first wall on which the first region is disposed and a second wall disposed opposite to the first wall; An access opening is formed in the second wall opposite to the first region; The work processing method according to claim 5.

9. When defining the area formed by removing the first coating layer as the removed area, the size of the access opening is smaller than the size of the removed area. The workpiece processing method according to claim 8.

10. A workpiece support device for supporting a workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material; A processing head that rotatably supports a burring tool around a rotation axis; A rotation drive device that rotates the burring tool around the rotation axis; A moving device that relatively moves the processing head with respect to the workpiece support device; A removing device including a laser irradiation device having a laser head, for removing a part of the first coating layer from the workpiece; A control device that controls the rotation drive device, the moving device, and the removing device; Comprising: The control device: A removal mode including transmitting an emission command from the control device to the laser irradiation device so that the first coating layer is removed from the first region of the plate portion by the laser emitted from the laser head; A burring processing mode for burring the plate portion by transmitting control commands to at least the rotation drive device and the moving device; Is executable; When defining the direction from the base material toward the first coating layer as the first direction, the burring processing mode is a mode of forming a through hole and a flange in the first region from which the first coating layer has been removed, using the burring tool that moves in the first direction in a rotating state. Machine tool.

11. When defining the portion to be removed by the removing device among the areas occupied by the first coating layer as the removal target area, the control device determines at least one of the laser output parameters and the feed speed command value of the laser head based on at least the characteristic data of the obstacles between the removal target area and the laser head. The machine tool according to claim 10.

12. When defining the portion to be removed by the removing device among the areas occupied by the first coating layer as the removal target area, the control device derives the position and size of the removal target area based on at least workpiece data. The control device derives a first movement path along which the removal device should move based on data indicating the position of the removal target area and the size of the removal target area. The control device transmits a first movement command to the movement device so that the removal device moves along the first movement path. The machine tool according to claim 10.

13. When defining the portion to be removed by the removal device among the areas occupied by the first coating layer as the removal target area, the removal mode includes transmitting, from the control device to the movement device, a first movement command for relatively moving the laser head with respect to the work support device so that the laser emitted from the laser head scans the removal target area. The machine tool according to claim 10.

14. A step of removing the first coating layer, which is a plating layer of pure zinc or a zinc alloy and covers at least a part of the base material, from a first area of the plate portion in a state where a work having a plate portion including the base material and the first coating layer is supported by a work support device; After the first coating layer, which is the plating layer, is removed from the first area of the plate portion, a step of performing burring on the plate portion A program for causing a machine tool to execute a work processing method including: When defining the direction from the base material toward the first coating layer as the first direction, the step of performing burring on the plate portion includes forming a through hole and a flange in the first area of the plate portion by moving a rotating burring tool in the first direction. Program.

15. A step of removing the first coating layer from a first area of the plate portion by irradiating the first coating layer with a laser in a state where a work having a plate portion including a base material and the first coating layer covering at least a part of the base material is supported by a work support device; After the first coating layer is removed from the first area of the plate portion, a step of performing burring on the plate portion A program for causing a machine tool to execute a work processing method including: When defining the direction from the base material toward the first coating layer as the first direction, the step of performing burring on the plate portion includes forming a through hole and a flange in the first area of the plate portion by moving a rotating burring tool in the first direction. Program.

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