Galvano scanner and laser processing machine

Abstract

The galvanometer scanner (20) includes a galvanometer mirror (21) having a dome-shaped curved mirror surface, and a drive unit (22) having a flat surface (23) on which the galvanometer mirror (21) is placed and translating the galvanometer mirror (21) in a direction parallel to the flat surface (23). The drive unit (22) includes an α-axis direction drive unit (22α) that moves the galvanometer mirror (21) in an α-axis direction that is parallel to the flat surface (23), and a β-axis direction drive unit (22β) that moves the galvanometer mirror (21) in a β-axis direction that is parallel to the flat surface (23) and different from the α-axis direction.

Description

[Technical field]

[0001] The present disclosure relates to a galvanometer scanner and a laser processing machine equipped with a galvanometer scanner. [Background technology]

[0002] In recent years, the need for high speed and high accuracy in laser processing has been increasing, and there is a demand for high speed driving of galvanometer scanners and high accuracy in scanning positioning. In a galvanometer scanner that changes the reflection direction of laser light by rotating a shaft supporting a planar galvanometer mirror, as the driving speed of the galvanometer scanner increases, the galvanometer mirror generates a surface tilt vibration due to the vibration characteristics inherent to the galvanometer mirror, which increases the deviation of the scanning position of the laser light and tends to deteriorate the processing accuracy. In the galvanometer scanner described in Patent Document 1, one end of the planar galvanometer mirror is fastened to a motor and the other end is supported to form a double-end support structure, thereby suppressing the surface tilt vibration and achieving both high speed driving and improved scanning positioning accuracy. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6587603 Summary of the Invention [Problem to be solved by the invention]

[0004] When the driving speed of the galvanometer scanner increases, not only the surface tilt vibration of the galvanometer mirror but also the torsional vibration of the galvanometer mirror occurs. However, in the structure of the galvanometer scanner disclosed in the above Patent Document 1, it is difficult to suppress the torsional vibration of the galvanometer mirror, and therefore there is a problem that the deterioration of the machining accuracy due to the torsional vibration cannot be suppressed.

[0005] The present disclosure has been made in view of the above, and has an object to provide a galvano scanner that achieves both high-speed driving and improved scanning positioning accuracy. [Means for solving the problem]

[0006] In order to solve the above problems and achieve the object, the present disclosure The laser processing machine includes an oscillator that outputs a laser beam. is a galvano mirror with a dome-shaped curved mirror surface. - and The galvanometer mirror has a flat surface on which it is placed, and a drive that translates the galvanometer mirror in a direction parallel to the flat surface. Department, Equipped with The laser processing machine of the present disclosure further comprises a condenser lens that condenses the laser light reflected by the mirror surface and irradiates the workpiece with the laser light, and a control device that controls the galvano scanner so that the laser light reflected by the mirror surface is incident on a target irradiation position on the condenser lens that corresponds to a target scanning position on the workpiece. It is characterized by the fact that Effect of the Invention

[0007] The galvano scanner according to the present disclosure has an advantage in that it is possible to achieve both high-speed driving and improved scanning positioning accuracy. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a configuration of a laser processing machine according to a first embodiment. [Diagram 2] FIG. 1 is a perspective view of a galvanometer scanner according to a first embodiment; [Diagram 3] FIG. 1 is a diagram showing a configuration of a control device according to a first embodiment; [Figure 4] FIG. 1 is a diagram for explaining scanning of laser light in the Y-axis direction in the first embodiment; [Diagram 5] FIG. 1 is a diagram for explaining scanning of laser light in the X-axis direction in the first embodiment; [Figure 6] Schematic diagram of the state in Figure 4 as seen from the +X-axis direction [Figure 7] FIG. 1 is a diagram showing a configuration of a galvanometer position command generating unit according to a first embodiment; [Figure 8] FIG. 1 is a diagram for explaining a method for determining a target position of a galvanometer mirror according to the first embodiment; [Figure 9] 1 is a flowchart for explaining a laser beam scanning positioning process according to the first embodiment; [Figure 10]FIG. 1 is a diagram showing a configuration of a laser processing machine according to a second embodiment. [Figure 11] FIG. 11 is a diagram for explaining correction of the beam diameter of laser light by an optical component according to a second embodiment. [Figure 12] FIG. 1 is a diagram showing an example of a hardware configuration of a control device included in a laser processing machine according to first and second embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, a galvanometer scanner and a laser processing machine according to an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the embodiment.

[0010] Embodiment 1 FIG. 1 is a diagram showing the configuration of a laser processing machine 1 according to the first embodiment of the present disclosure. In FIG. 1, the X-axis, Y-axis, and Z-axis are three axes perpendicular to each other. The X-axis and Y-axis are horizontal axes. The Z-axis is a vertical axis. In FIG. 1, the X-axis and Y-axis are horizontal axes and the Z-axis is a vertical axis as an example. However, the X-axis, Y-axis, and Z-axis may be three axes perpendicular to each other, and the X-axis and Y-axis do not necessarily have to be horizontal axes, and the Z-axis does not necessarily have to be a vertical axis. For example, the Y-axis and Z-axis may be horizontal axes and the X-axis may be a vertical axis. The α-axis and β-axis are parallel to the plane 23 on which the galvano mirror 21 is placed, and are two axes perpendicular to each other. FIG. 1 shows a case in which the α-axis is parallel to the X-axis direction and the β-axis is parallel to the YZ plane.

[0011] The laser processing machine 1 processes a workpiece 90 by irradiating it with a laser beam. The laser processing machine 1 is, for example, a micro laser processing machine. The workpiece 90 is, for example, a printed wiring board mounted on an electronic device or the like. The laser processing machine 1 includes an oscillator 10, a galvano scanner 20, a focusing lens 30, an XY table 40, and a control device 50.

[0012] The oscillator 10 outputs a laser beam 60 a toward the galvano scanner 20 .

[0013] The galvanometer scanner 20 includes a galvanometer mirror 21 and a driving unit 22. The galvanometer mirror 21 has a dome-shaped curved mirror surface, and reflects the laser light 60a output from the oscillator 10 on the mirror surface. The dome-shaped curved mirror surface can be locally regarded as a planar mirror surface having a specific surface orientation depending on each position. Therefore, since the beam diameter of the laser light is very small, the reflection surface of the dome-shaped curved mirror surface on which the laser light 60a output from the oscillator 10 is incident can also be regarded as a planar mirror surface having a specific surface orientation. The "reflection surface" referred to here is a mirror surface on the galvanometer mirror 21 that is in the same range as the beam diameter on which the laser light 60a is incident.

[0014] The driving unit 22 has a plane 23 on which the galvanometer mirror 21 is placed, and translates the galvanometer mirror 21 in a direction parallel to the plane 23 by control according to a position command. As shown in FIG. 1, the galvanometer scanner 20 is desirably arranged so that the plane 23 on which the galvanometer mirror 21 is placed is not parallel to the output direction of the laser light 60a output from the oscillator 10, but is moderately inclined. For example, when the laser processing machine 1 has a configuration as shown in FIG. 1, the inclination of the plane 23 with respect to the output direction of the laser light 60a output from the oscillator 10 can be defined in the direction of the β axis. In this case, an example of a moderate inclination is when the plane 23 is arranged so that the β axis is inclined 135 degrees counterclockwise with respect to the output direction of the laser light 60a (i.e., the +Y axis direction).

[0015] The reason why such an arrangement is desirable will be explained. For example, when the galvanometer scanner 20 is arranged so that the β-axis direction of the plane 23 on which the galvanometer mirror 21 is placed is parallel to the output direction of the laser light 60a, even if the galvanometer mirror 21 is translated in the β-axis direction, the position of the reflection surface on which the laser light 60a output from the oscillator 10 is incident does not change, and therefore the orientation of the reflection surface cannot be changed. Therefore, in order to perform laser light scanning on the workpiece 90 in the Y-axis direction without changing the orientation of the reflection surface, it is necessary to translate the galvanometer mirror 21 in the β-axis direction by the same distance as the distance by which the irradiation position of the laser light on the workpiece 90 is to be moved in the Y-axis direction.

[0016] 1, when the galvanometer scanner 20 is arranged so that the plane 23 on which the galvanometer mirror 21 is placed is appropriately inclined with respect to the output direction of the laser light 60a output from the oscillator 10, the change in the orientation of the reflecting surface can be controlled to perform laser light scanning, so the distance by which the galvanometer mirror 21 is translated in the β-axis direction is shorter than the distance by which the irradiation position of the laser light on the workpiece 90 is moved in the Y-axis direction. Therefore, when the galvanometer mirror 21 is translated at the same speed and the same distance is scanned with the laser light on the workpiece 90, the distance by which the galvanometer mirror 21 is translated is shorter when the galvanometer scanner 20 is arranged so that the plane 23 is inclined with respect to the output direction of the laser light than when the galvanometer scanner 20 is arranged so that the plane 23 is parallel to the output direction of the laser light, so that the time required for laser light scanning is shorter and it is possible to meet the requirement of high-speed driving.

[0017] Furthermore, when the galvanometer scanner 20 is arranged so that the plane 23 is parallel to the output direction of the laser light, it is necessary to secure a movable range in which the galvanometer mirror 21 can be translated without interfering with the surroundings, which is equal to the width of the processing area on the workpiece 90 to be scanned with the laser light, whereas when the galvanometer scanner 20 is arranged so that the plane 23 is inclined with respect to the output direction of the laser light, it is sufficient to secure a movable range narrower than the processing area on the workpiece 90 to be scanned with the laser light. Therefore, it is possible to design the mechanism of the laser processing machine without restrictions when the galvanometer scanner 20 is arranged so that the plane 23 is inclined with respect to the output direction of the laser light, rather than when the galvanometer scanner 20 is arranged so that the plane 23 is parallel to the output direction of the laser light.

[0018] Fig. 2 is a perspective view of the galvanometer scanner 20. As shown in Fig. 2, the driver 22 has an α-axis direction driver 22α that moves the galvanometer mirror 21 in an α-axis direction parallel to a plane 23 on which the galvanometer mirror 21 is placed, and a β-axis direction driver 22β that moves the galvanometer mirror 21 in a β-axis direction that is parallel to the plane 23 on which the galvanometer mirror 21 is placed and perpendicular to the α-axis direction.

[0019] 2, the galvanometer mirror 21 is placed on the plane 23 on the α-axis direction driver 22α, but the order of the α-axis direction driver 22α and the β-axis direction driver 22β may be reversed, and the galvanometer mirror 21 may be placed on the plane on the β-axis direction driver 22β. Also, instead of placing the galvanometer mirror 21 directly on the α-axis direction driver 22α or the plane on the β-axis direction driver 22β, the galvanometer mirror 21 may be placed on a top table having a plane including the α-axis direction and the β-axis direction, and the galvanometer mirror 21 may be translated by driving the top table with the α-axis direction driver 22α and the β-axis direction driver 22β.

[0020] By interlocking such α-axis direction driver 22α and β-axis direction driver 22β, it is possible to translate the galvanometer mirror 21 to any position in two-dimensional directions including the α-axis direction and the β-axis direction. Note that the α-axis and β-axis need not necessarily be perpendicular to each other, as long as they are in a coordinate system that can specify the two-dimensional position to which the galvanometer mirror 21 is translated. In other words, the α-axis and β-axis directions need only be parallel to the plane 23 on which the galvanometer mirror 21 is placed and different from each other.

[0021] The driving unit 22 can be configured, for example, by a motor-driven two-axis linear actuator. When the laser light 60c is scanned only in one dimension on the processing surface of the workpiece 90, the driving unit 22 does not necessarily have to include a two-axis driving unit, and may be configured with only a one-axis driving unit. In the following, the α-axis driving unit 22α and the β-axis driving unit 22β will be referred to as the driving unit 22 unless they are individually distinguished.

[0022] Returning to Fig. 1, the condenser lens 30 is an fθ lens that condenses the laser light 60b reflected by the dome-shaped curved mirror surface of the galvanometer mirror 21 and irradiates the laser light 60c perpendicularly onto the workpiece 90 placed on the XY table 40. The position where the laser light 60c is irradiated onto the workpiece 90 is determined according to the position where the laser light 60b is incident on the condenser lens 30. That is, there is a one-to-one correspondence between the position where the laser light 60b is incident on the condenser lens 30 and the position where the laser light 60c is irradiated onto the workpiece 90.

[0023] The XY table 40 has a workpiece 90 placed on a placement surface 41, and moves the workpiece 90 in two-dimensional directions including the X-axis direction and the Y-axis direction by control according to a position command. When the processing area for the workpiece 90 is narrow and the laser light 60c can be scanned on the processing area only by driving the galvano scanner 20, it is not necessary to use the XY table 40 to move the workpiece 90, and the workpiece 90 may be placed on a fixed base (not shown) with a fixed placement surface instead of the XY table 40. The XY table 40 and the fixed base are the same in that they both have a planar placement surface on which the workpiece 90 is placed, but differ in whether the placement surface is movable or not. That is, the XY table 40 and the fixed base are placement tables on which the workpiece 90 is placed on the placement surface.

[0024] From the viewpoint of the accuracy of the scanning positioning of the laser light, it is desirable to arrange the galvanometer scanner 20 so that the plane 23 on which the galvanometer mirror 21 is placed is not parallel to the direction perpendicular to the mounting surface 41 on which the workpiece 90 is placed (the Z-axis direction in FIG. 1), but is moderately inclined, as shown in FIG. 1. For example, when the laser processing machine 1 has the configuration shown in FIG. 1, the inclination of the plane 23 with respect to the direction perpendicular to the mounting surface 41 on which the workpiece 90 is placed can be defined as the direction of the β-axis. In this case, an example of a moderate inclination is when the plane 23 is arranged so that the β-axis is inclined 45 degrees counterclockwise with respect to the direction perpendicular to the mounting surface 41 on which the workpiece 90 is placed (i.e., the +Z-axis direction).

[0025] The reason why such an arrangement is desirable will be explained. For example, in Fig. 1, when the galvanometer scanner 20 is arranged so that the β-axis direction of the plane 23 on which the galvanometer mirror 21 is placed is parallel to the Z-axis direction, the rate of change in the orientation of the reflecting surface relative to the distance of translation of the galvanometer mirror in the β-axis direction is large compared to the case where the β-axis direction of the plane 23 is inclined with respect to the Z-axis direction. Therefore, even a small translation of the galvanometer mirror in the β-axis direction (i.e., the Z-axis direction) results in a large change in the orientation of the reflecting surface, and accordingly, the scanning position of the laser light also changes significantly. Therefore, the scanning positioning accuracy of the laser light is easily affected by the positioning error of the galvanometer mirror.

[0026] On the other hand, when the galvanometer scanner 20 is arranged so that the β-axis direction of the plane 23 on which the galvanometer mirror 21 is placed is moderately inclined with respect to the Z-axis direction, the rate of change in the orientation of the reflecting surface with respect to the translational movement distance of the galvanometer mirror in the β-axis direction is small compared to the case where the β-axis direction of the plane 23 is arranged parallel to the Z-axis direction, so the scanning positioning accuracy of the laser light is less susceptible to the influence of positioning errors of the galvanometer mirror. For this reason, it is easier to achieve high-precision laser light scanning when the galvanometer scanner 20 is arranged so that the plane 23 on which the galvanometer mirror 21 is placed is moderately inclined with respect to the direction perpendicular to the mounting surface 41 on which the workpiece 90 is placed.

[0027] The control device 50 controls the entire laser processing machine 1. That is, the control device 50 controls the operation of the oscillator 10, the galvano scanner 20, and the XY table 40. Specifically, the control device 50 moves the workpiece 90 by the XY table 40 so that the processing area on the workpiece 90 is within the scannable range of the laser light 60c, and then controls the galvano scanner 20 according to the setting of the target scanning position, which is the target position on the workpiece 90 to be irradiated with the laser light 60c, so that the laser light 60c is incident on the target scanning position. That is, the control device 50 controls the galvano scanner 20 so that the laser light 60b is incident on the target irradiation position, which is the irradiation position on the condenser lens 30 corresponding to the target scanning position. FIG. 3 is a diagram showing the configuration of the control device 50. The control device 50 has a command generation unit 51 that generates various commands, a laser control unit 55, a galvano control unit 56, and an XY table control unit 57.

[0028] The command generating unit 51 has an XY table position command generating unit 52 that generates a position command for the XY table 40, a galvanometer position command generating unit 53 that generates a position command for the galvanometer scanner 20, and a laser output command generating unit 54 that generates a laser output command. The laser control unit 55 controls the oscillator 10 according to the laser output command generated by the laser output command generating unit 54. The galvanometer control unit 56 controls the galvanometer scanner 20 according to the position command generated by the galvanometer position command generating unit 53. The galvanometer control unit 56 controls the translational movement of the galvanometer mirror 21 by the driving unit 22, and positions the galvanometer mirror 21. The XY table control unit 57 controls the movement of the XY table 40 according to the position command generated by the XY table position command generating unit 52, and positions the workpiece 90 placed on the XY table 40.

[0029] Next, the operation of the laser processing machine 1 will be described.

[0030] Since the mirror surface of the galvanometer mirror 21 has a dome-shaped curved surface, the direction of the reflecting surface with respect to the incident direction (the direction in which the reflecting surface faces) can be changed by translating the galvanometer mirror 21 to control the position of the reflecting surface on which the laser light 60a output from the oscillator 10 is incident, and the laser light 60a can be reflected in any direction. As an example, the operation of moving the irradiation position on the workpiece 90 in the Y-axis direction will be described.

[0031] Fig. 4 is a diagram for explaining scanning of the laser light in the Y-axis direction. Fig. 4 shows a schematic diagram of how the reflection direction of the laser light changes and the irradiation position on the workpiece 90 moves in the Y-axis direction according to the position to which the galvanometer mirror 21 is translated in the β-axis direction in the laser processing machine 1 shown in Fig. 1. Note that the XY table 40 is not driven, and the position of the workpiece 90 is fixed.

[0032] 4A shows the irradiation position of the laser light when the laser light 61a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is reflected in the vertical direction (-Z-axis direction) by the reflecting surface M1 on the galvanometer mirror 21. FIG. 4B shows the reflection direction and irradiation position of the laser light when the galvanometer mirror 21 is translated in the +β-axis direction from the state of FIG. 4A and the laser light 62a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is reflected by the reflecting surface M2 on the galvanometer mirror 21. FIG. 4C shows the reflection direction and irradiation position of the laser light when the galvanometer mirror 21 is translated in the -β-axis direction from the state of FIG. 4A and the laser light 63a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is reflected by the reflecting surface M3 on the galvanometer mirror 21.

[0033] When the galvanometer mirror 21 is translated in the +β-axis direction from the position shown in Fig. 4(a) to the position shown in Fig. 4(b), the position of the reflecting surface on the galvanometer mirror 21 where the laser light is incident also moves relatively from reflecting surface M1 to reflecting surface M2, and the orientation of the reflecting surface is tilted more in the +Y-axis direction for reflecting surface M2 than for reflecting surface M1. Therefore, the direction of the reflected light is tilted more in the +Y-axis direction for laser light 62b than for laser light 61b, so that the position of irradiation on the focusing lens 30 moves from L1 to L2 in the +Y-axis direction. As a result, the irradiation position of the laser light 62c irradiated on the workpiece 90 also moves from W1 to W2 in the +Y-axis direction.

[0034] When the galvanometer mirror 21 is translated in the -β-axis direction, the above operation is reversed. That is, when the galvanometer mirror 21 is translated in the -β-axis direction from the position shown in (a) of FIG. 4 to the position shown in (c) of FIG. 4, the position of the reflection surface on the galvanometer mirror 21 on which the laser light is incident also moves relatively from the reflection surface M1 to the reflection surface M3, and the orientation of the reflection surface is tilted in the -Y-axis direction more than the reflection surface M1. Therefore, the direction of the reflected light is tilted more in the -Y-axis direction for the laser light 63b than for the laser light 61b, so that the position of irradiation on the focusing lens 30 moves from L1 to L3 in the -Y-axis direction. As a result, the irradiation position of the laser light 63c irradiated on the workpiece 90 also moves from W1 to W3 in the -Y-axis direction.

[0035] As a similar example, an operation in the case where the irradiation position on the workpiece 90 is moved in the X-axis direction will be described. Fig. 5 is a diagram for explaining the scanning of the laser light in the X-axis direction. Fig. 5 shows a schematic diagram of how the reflection direction of the laser light changes and the irradiation position on the workpiece 90 moves in the X-axis direction in accordance with the position to which the galvanometer mirror 21 is translated in the α-axis direction in the laser processing machine 1 shown in Fig. 1. Note that the XY table 40 is not driven, and the position of the workpiece 90 is fixed.

[0036] Fig. 5(a) shows the same state as Fig. 4(a). Fig. 5(b) shows the reflection direction and irradiation position of the laser light when the galvanometer mirror 21 is translated in the +α-axis direction (i.e., the +X-axis direction) from the state of Fig. 5(a) and the laser light 64a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is reflected by the reflection surface M4 on the galvanometer mirror 21. Fig. 5(c) shows the reflection direction and irradiation position of the laser light when the galvanometer mirror 21 is translated in the -α-axis direction (i.e., the -X-axis direction) from the state of Fig. 5(a) and the laser light 65a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is reflected by the reflection surface M5 on the galvanometer mirror 21.

[0037] When the galvanometer mirror 21 is translated in the +α-axis direction from the position shown in Fig. 5(a) to the position shown in Fig. 5(b), the position of the reflecting surface on the galvanometer mirror 21 where the laser light is incident also moves relatively from reflecting surface M1 to reflecting surface M4, and the orientation of the reflecting surface is tilted more in the -X-axis direction for reflecting surface M4 than for reflecting surface M1. Therefore, the direction of the reflected light is tilted more in the -X-axis direction for laser light 64b than for laser light 61b, so the position of irradiation on the focusing lens 30 moves from L1 to L4 in the -X-axis direction. As a result, the irradiation position of the laser light 64c irradiated on the workpiece 90 also moves from W1 to W4 in the -X-axis direction.

[0038] When the galvanometer mirror 21 is translated in the -α-axis direction, the operation is reversed. That is, when the galvanometer mirror 21 is translated in the -α-axis direction from the position shown in FIG. 5(a) to the position shown in FIG. 5(c), the position of the reflection surface on the galvanometer mirror 21 on which the laser light is incident also moves relatively from the reflection surface M1 to the reflection surface M5, and the orientation of the reflection surface is tilted in the +X-axis direction more than the reflection surface M1. Therefore, the direction of the reflected light is tilted more in the +X-axis direction for the laser light 65b than for the laser light 61b, so that the position of irradiation on the focusing lens 30 moves from L1 to L5 in the +X-axis direction. As a result, the irradiation position of the laser light 65c irradiated on the workpiece 90 also moves from W1 to W5 in the +X-axis direction.

[0039] Furthermore, by translating the galvanometer mirror 21 to an arbitrary position in two-dimensional directions including the α-axis direction and the β-axis direction by interlocking the α-axis direction driver 22α and the β-axis direction driver 22β, and making the laser light output from the oscillator 10 incident on a reflecting surface having a specific surface orientation among the dome-shaped curved mirror surfaces, the laser light can be reflected in an arbitrary direction, and as a result, the laser light can be irradiated to an arbitrary position on the condenser lens 30. As a result, the laser light can be irradiated to an arbitrary position on the workpiece 90.

[0040] In this way, the control device 50 controls the position of translational movement of the galvanometer mirror 21 and reflects the laser light output from the oscillator 10 on a reflecting surface having a surface orientation in a specific direction, thereby making it possible to adjust the position at which the laser light enters the focusing lens 30. Since the laser light is irradiated perpendicularly from the focusing lens 30 onto the workpiece 90, if the position at which the laser light enters the focusing lens 30 can be adjusted, the position at which the laser light enters the workpiece 90 can be adjusted.

[0041] Next, a method for controlling the position at which the galvanometer mirror is translated will be described. As an example, a case where the laser light is scanned in the Y-axis direction as shown in FIG. 4 will be described with reference to FIG. 6. FIG. 6(a) is a schematic diagram of the state of FIG. 4(a) seen from the +X-axis direction. FIG. 6(b) is a schematic diagram of the state of FIG. 4(b) seen from the +X-axis direction. To simplify the explanation, as an example, the galvanometer mirror 21a shown in FIG. 6 has a hemispherical mirror surface. Note that the galvanometer mirror 21a shown in FIG. 6 only shows the vicinity of where the laser light is incident. Furthermore, when the galvanometer mirror 21a has a hemispherical mirror surface, the position of the galvanometer mirror 21a can be represented, for example, by the position of the center point of the hemispherical mirror surface of the galvanometer mirror 21a. In the state shown in FIG. 6(a), the position of the center point of the hemispherical mirror surface of the galvanometer mirror 21a is at P1, and in the state shown in FIG. 6(b), the position of the center point of the hemispherical mirror surface of the galvanometer mirror 21a is at P2.

[0042] FIG. 6A shows a state in which the laser light 61a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is reflected in the vertical direction (-Z-axis direction) by the reflecting surface M1. In the case of FIG. 6A, according to the law of light reflection, the incident angle θ1 and the reflection angle θ1' are equal, so the incident angle θ1=reflection angle θ1'=45 degrees. The orientation of the reflecting surface is equal to the direction of the normal to the reflecting surface, so it can be expressed by the direction of the normal to the reflecting surface. In the case of FIG. 6A, if the orientation of the reflecting surface M1, that is, the direction of the normal h1 to the reflecting surface M1, is expressed by the illustrated direction θh1, θh1 is equal to the incident angle θ1, which is 45 degrees. Therefore, the orientation of the reflecting surface M1 is θh1=45 degrees.

[0043] In other words, by making the laser light 61a output from the oscillator 10 in the horizontal direction (+Y-axis direction) incident on the reflecting surface M1 having a normal h1 with a normal direction of θh1 = 45 degrees, the incident angle θ1 = normal direction θh1 = 45 degrees and the reflection angle θ1' = incident angle θ1 = 45 degrees, so that the laser light 61b can be reflected in the vertical direction (-Z-axis direction).

[0044] 6B shows that when the galvanometer mirror 21a is translated in the +β-axis direction from the position of the galvanometer mirror 21a shown in FIG. 6A, the position of the center point of the hemispherical mirror surface of the galvanometer mirror 21a moves from P1 to P2, and the position of the reflection surface on which the laser light 62a output from the oscillator 10 in the horizontal direction (+Y-axis direction) is incident moves from the reflection surface M1 having a normal line h1 in the direction of θh1 to the reflection surface M2 having a normal line h2 in the direction of θh2, so that the reflection direction of the laser light changes from the laser light 61b to the laser light 62b, and as a result, the position irradiated on the focusing lens 30 moves from L1 to L2 in the +Y-axis direction, and the irradiation position on the workpiece 90 also moves from W1 to W2 in the +Y-axis direction. At this time, the relationship is such that the incident angle θ2=normal direction θh2, and the reflection angle θ2'=the incident angle θ2.

[0045] In other words, by translating the galvanometer mirror 21a so that the position of the center point of the hemispherical mirror surface of the galvanometer mirror 21a becomes P2, the laser light 62a outputted from the oscillator 10 in the horizontal direction (+Y-axis direction) is incident on the reflecting surface M2 having a normal h2 in the direction of θh2, the incident light laser light 62a can be reflected in the direction of the laser light 62b which is the reflected light that satisfies the relationship of incident angle θ2 = normal direction θh2 and reflection angle θ2' = incident angle θ2. As a result, the laser light 62b can be irradiated to the position L2 which is the target irradiation position on the focusing lens 30, and the laser light 62c can be irradiated to the position W2 which is the target scanning position on the workpiece 90.

[0046] Therefore, in order to set the position W2 on the workpiece 90 as the target scanning position and irradiate the laser light to this target scanning position W2, the galvanometer mirror 21a is translated so that the position of the center point of the hemispherical mirror surface of the galvanometer mirror 21a becomes P2. Note that, although the case where the galvanometer mirror 21a has a hemispherical mirror surface has been described as an example in Fig. 6, the same explanation can be applied to the case where the galvanometer mirror 21a has a mirror surface shaped like a part of a sphere cut away.

[0047] In this way, by calculating the position on the galvanometer mirror of the reflecting surface having a surface orientation capable of reflecting the laser light output from the oscillator toward the target irradiation position on the condenser lens 30, which corresponds to the target scanning position on the workpiece 90, and calculating the position of the galvanometer mirror at which the laser light output from the oscillator can be incident on the reflecting surface, the position of the galvanometer mirror can be controlled to irradiate the laser light to the target irradiation position on the condenser lens 30. As a result, the laser light can be scanned to the target scanning position on the workpiece 90.

[0048] FIG. 7 is a diagram showing the configuration of the galvanometer position command generating unit 53. The galvanometer position command generating unit 53 has a reflecting surface position calculating unit 58 and a galvanometer mirror position calculating unit 59. The reflecting surface position calculating unit 58 acquires a target scanning position set from an input unit (not shown), calculates a target irradiation position on the condenser lens 30 corresponding to the target scanning position, and calculates the position on the galvanometer mirror 21a of the reflecting surface having a surface orientation that can reflect the laser light toward the target irradiation position. The galvanometer mirror position calculating unit 59 calculates the position of the galvanometer mirror 21a at which the laser light output from the oscillator 10 can be incident on the reflecting surface based on the reflecting surface position on the galvanometer mirror 21a calculated by the reflecting surface position calculating unit 58, and generates a corresponding position command based on the position. The galvanometer position command generating unit 53 generates a position command for the galvanometer scanner 20 with such a configuration.

[0049] As an example, a case in which the position of the center point P2 of the galvanometer mirror 21a shown in FIG. 6(b), which is the target position of the next galvanometer mirror 21a, is obtained when the current galvanometer mirror 21a is at the position of the center point P1 of the galvanometer mirror 21a shown in FIG. 6(a) will be described with reference to FIG. 8.

[0050] The position of the galvanometer mirror 21a with respect to the incident light in Fig. 8 shows the same state as that in Fig. 6(a). That is, the current position of the center point of the galvanometer mirror 21a is at P1, and when the oscillator 10 outputs a laser beam 61a in the horizontal direction (+Y-axis direction) in this state, the laser beam 61a is incident on the reflecting surface M1, and the laser beam 61b reflected by the reflecting surface M1 is irradiated at the position L1 on the focusing lens 30.

[0051] In such a case, the reflecting surface position calculation unit 58 first calculates the coordinate position information of the next target irradiation position L2 on the collecting lens 30 based on the set next target scanning position W2. From the coordinate position information of the reflecting surface M1 and the coordinate position information of the target irradiation position L2, the reflection direction of the laser light 62b, which is the next target reflected light, as shown in Fig. 8 is calculated. In other words, the target reflection direction, which is the direction to reflect the laser light toward the next target irradiation position L2 on the collecting lens 30, is calculated.

[0052] Next, the reflecting surface position calculation unit 58 obtains the orientation of the surface required to reflect the laser light 61a in the direction of the laser light 62b (i.e., the target reflection direction) when the laser light 61a is incident on the galvanometer mirror 21a, from the incident direction of the laser light 61a and the reflection direction of the laser light 62b. This is equivalent to obtaining the intermediate direction of the angle formed by the laser light 61a and the laser light 62b from the law of light reflection, and in FIG. 8, the direction of the straight line h2' is shown to be the intermediate direction of the angle formed by the laser light 61a and the laser light 62b. In other words, the direction of the straight line h2' is the orientation of the surface required to reflect the laser light 61a in the direction of the laser light 62b when the laser light 61a is incident on the galvanometer mirror 21a.

[0053] Next, the reflecting surface position calculation unit 58 obtains the position of the reflecting surface M2, which is a surface on the galvanometer mirror 21a and has a surface orientation required for reflecting the laser light 62b in the direction of the laser light 62b. As shown in Fig. 8, this can be obtained by translating the line h2' so that it passes through the center point P1 of the galvanometer mirror 21a, as a normal line h2", and by determining the point where this normal line h2" intersects with the surface of the galvanometer mirror 21a as the position of the reflecting surface M2.

[0054] Next, the galvanometer mirror position calculation unit 59 obtains the position of the center point P2, which is the target position to which the galvanometer mirror 21a is to be translated. This can be obtained as follows. As shown in Fig. 8, the position where a straight line extending in the +β-axis direction from the position of the center point of the reflecting surface M2 intersects with the extension line of the laser light 61a is defined as P3. When a vector having the center point of the reflecting surface M2 as its start point and P3 as its end point is defined as V1, the end point of vector V2 obtained by moving the start point of vector V1 to the center point P1 of the galvanometer mirror 21a is the position of the center point P2, which is the target position to which the galvanometer mirror 21a is to be translated.

[0055] By translating the galvanometer mirror 21a so that the position of the center point of the galvanometer mirror 21a coincides with the position of the center point P2 of the galvanometer mirror 21a obtained as described above, the reflecting surface M2 shown in Fig. 8 moves to the position P3, and the laser light 61a becomes incident on the reflecting surface M2 after the movement. Since the reflecting surface M2 has a surface orientation that allows it to reflect in the direction of the laser light 62b, the laser light 61a incident on the reflecting surface M2 is reflected in the direction of the laser light 62b, and the laser light 62b is irradiated to the target irradiation position L2 on the condenser lens 30. As a result, the laser light 62c can be scanned at the position W2 on the workpiece 90.

[0056] In this way, by controlling the position of the galvanometer mirror 21a in the β-axis direction, it is possible to irradiate the laser light to any position in the Y-axis direction on the condenser lens 30, and as a result, it is possible to scan the laser light to any position in the Y-axis direction on the workpiece 90. Similarly, when scanning the laser light in the X-axis direction, it is possible to irradiate the laser light to any position in the X-axis direction on the condenser lens 30 by controlling the position of the galvanometer mirror 21a in the α-axis direction, and as a result, it is possible to scan the laser light to any position in the X-axis direction on the workpiece 90. Furthermore, by combining such controls and controlling the positions of the galvanometer mirror 21a in the α-axis and β-axis directions, it is possible to irradiate the laser light to any position on the condenser lens 30, and as a result, it is possible to scan the laser light to any position on the workpiece 90.

[0057] 8, an example was described in which the position of the reflecting surface M2 and the target position to which the galvano mirror 21a is translated were calculated geometrically when the galvano mirror 21a has a hemispherical mirror surface, but this is not limited to this method. For example, the three-dimensional shape of the galvano mirror 21a used and the positional relationship between the galvano mirror 21a and the oscillator may be modeled and registered in a storage unit (not shown) in advance, including not only the case where the galvano mirror 21a has a hemispherical mirror surface, but also the case where the galvano mirror 21a has a mirror surface with a shape obtained by cutting out a part of a sphere or a mirror surface with a dome-like curved shape, and the model may be used so that the reflecting surface position calculation unit 58 calculates the position of the reflecting surface M2 on the galvano mirror 21a and the galvano mirror position calculation unit 59 calculates the target position to which the galvano mirror 21a is translated.

[0058] Next, the flow of the laser beam scanning positioning process will be described. Fig. 9 is a flow chart for explaining the laser beam scanning positioning process. First, the reflecting surface position calculation unit 58 acquires the target scanning position of the laser beam with respect to the workpiece 90 (step 1). Specifically, the reflecting surface position calculation unit 58 acquires the target scanning position set from an input unit (not shown). Note that a plurality of target scanning positions required for performing laser processing of the target processing shape on the workpiece 90 may be stored in advance in a storage unit (not shown), and the reflecting surface position calculation unit 58 may acquire the required target scanning position each time from the storage unit.

[0059] Next, the reflecting surface position calculation unit 58 calculates the next target irradiation position on the condenser lens 30 from the acquired target scanning position, and calculates the position of the reflecting surface on the galvanometer mirror 21 onto which the laser light is next incident (step 2). Specifically, the position of the reflecting surface having a surface orientation that allows reflection to the next target irradiation position on the condenser lens 30 is calculated by the method described in FIG. 8 or the like.

[0060] Next, the galvanometer mirror position calculation unit 59 calculates a target position of the galvanometer mirror 21 to be translated next (step 3). Specifically, the galvanometer mirror position calculation unit 59 calculates the position of the galvanometer mirror 21 at which the laser light can be incident on the position of the reflecting surface calculated in step 2, using the method described in Fig. 8 or the like. That is, the position of the galvanometer mirror 21 in the α-axis and β-axis directions is controlled to calculate the position of the galvanometer mirror 21 such that the position of the reflecting surface calculated in step 2 is on the trajectory of the laser light output from the oscillator 10.

[0061] Next, the galvanometer mirror position calculation unit 59 generates and outputs a position command for the galvanometer scanner 20 based on the target position of the galvanometer mirror 21 calculated in step 3 (step 4). Next, the galvanometer control unit 56 controls the galvanometer scanner 20 in accordance with the position command for the galvanometer scanner 20, and translates the galvanometer mirror 21 to the target position of the galvanometer mirror 21 (step 5). Then, the laser light output from the oscillator 10 is reflected by a reflecting surface located at the position calculated in step 2, and the laser light that passes through the target irradiation position on the condenser lens 30 is irradiated onto the target scanning position on the workpiece 90 (step 6).

[0062] Specifically, as a result of step 5, the position of the reflecting surface onto which the laser light output from the oscillator 10 is incident moves to the position of the reflecting surface calculated in step 2 in accordance with the translational movement of the galvanometer mirror 21, and the reflection direction of the laser light is adjusted by changing the orientation of the reflecting surface, and the irradiation position of the laser light on the focusing lens 30 moves to the target irradiation position. When the laser light is irradiated to the target irradiation position on the focusing lens 30, the laser light is condensed by the focusing lens 30, and the laser light is irradiated to the target scanning position on the workpiece 90.

[0063] By repeatedly performing the processes from step 1 to step 6 while changing the target scanning position of the laser light on the workpiece 90, the desired laser processing can be performed on the workpiece 90.

[0064] As described above, the galvanometer scanner in this embodiment reflects laser light in any direction by translating a galvanometer mirror having a dome-shaped curved mirror surface. Therefore, unlike conventional galvanometer scanners, a planar galvanometer mirror is not rotated, and therefore no surface tilt vibration or torsional vibration is generated, making it possible to achieve both high-speed driving and improved scanning positioning accuracy.

[0065] Furthermore, in laser processing machines that use conventional galvanometer scanners, multiple planar galvanometer mirrors are required to scan laser light at any position, and the effects of manufacturing errors and thermal deformation, etc., resulting from each galvanometer mirror are added together to affect the scanning positioning accuracy, resulting in a problem of deterioration in processing accuracy. In contrast, the laser processing machine in this embodiment requires only one galvanometer mirror and can be realized with fewer galvanometer mirrors than conventional machines, so the effects on processing accuracy due to manufacturing errors and thermal deformation, etc. of the galvanometer mirrors can also be suppressed.

[0066] Embodiment 2 When a laser beam is reflected by a flat mirror surface as in the conventional galvanometer scanner, the reflected laser beam propagates into the space on the optical path without spreading, like the incident beam, whereas when a laser beam is reflected by a dome-shaped curved mirror surface as in the first embodiment, the reflected laser beam propagates into the space on the optical path with a spread angle according to the curvature of the reflecting surface. Therefore, the beam diameter of the laser beam when it reaches the collecting lens becomes larger than the beam diameter of the laser beam output from the oscillator in proportion to the size of this spread angle and the distance between the galvanometer mirror and the collecting lens.

[0067] Furthermore, when the galvanometer mirror has a hemispherical mirror surface, the curvature is the same regardless of the direction on the mirror surface, so the beam shape of the reflected laser light is the same as that of the incident light, but when the galvanometer mirror has a curved mirror surface with a different curvature depending on the direction on the mirror surface, the beam shape of the reflected laser light is deformed to a shape different from the beam shape of the laser light before reflection. Therefore, even if a laser light with a circular beam shape is output from an oscillator, if it is reflected by a galvanometer mirror having a curved mirror surface with a different curvature depending on the direction on the mirror surface, the beam shape of the reflected laser light is deformed to an ellipse.

[0068] In this way, the beam diameter and beam shape of the laser light change before and after reflection from the galvanometer mirror, which may reduce the focusing ability of the laser light passing through the focusing lens 30 and reduce the processing accuracy. Therefore, in the second embodiment, a laser processing machine that can correct the beam diameter and beam shape of the reflected laser light to suppress the reduction in the focusing ability of the laser light passing through the focusing lens 30 will be described. The same parts as in the first embodiment will be omitted, and the parts different from the first embodiment will be described.

[0069] Fig. 10 is a diagram showing the configuration of a laser processing machine 1A according to the second embodiment. The configurations of the galvanometer scanner and the control device according to the second embodiment are similar to those of the galvanometer scanner and the control device according to the first embodiment, so a description thereof will be omitted. Fig. 10 differs from the first embodiment in that an optical component 70 is provided between the mirror surface of the galvanometer mirror 21 and the optical path of the focusing lens 30. The optical component 70 corrects the laser light 60d reflected by the mirror surface of the galvanometer mirror 21, and irradiates the focusing lens 30 with the corrected laser light 60e.

[0070] 11 is a diagram for explaining, as an example, correction of the beam diameter of laser light by the optical component 70 when the galvanometer mirror 21a having a hemispherical mirror surface is used. As shown in FIG. 11, the laser light 60d reflected by the galvanometer mirror 21a having a hemispherical mirror surface propagates while spreading toward the optical component 70. Therefore, the beam diameter of the laser light 60d when it reaches the optical component 70 becomes larger than the beam diameter of the laser light 60a output from the oscillator 10.

[0071] The optical component 70 corrects the laser light 60d reflected by the galvanometer mirror 21a so that the beam diameter of the laser light 60e passing through the optical component 70 and entering the condenser lens 30 is the same as the beam diameter of the laser light 60a output from the oscillator 10. As a result, the laser light 60e having the same size as the beam diameter of the laser light 60a output from the oscillator 10 is incident on the condenser lens 30, and the decrease in the condensability of the laser light 60e passing through the condenser lens 30 can be suppressed. As a result, processing defects due to the decrease in the condensability of the laser light can be reduced. In addition, when such an optical component 70 is not used, the condensability of the laser light may be corrected by previously adjusting the refractive index of the condenser lens 30 in consideration of the expansion rate of the beam diameter of the laser light 60d reflected by the galvanometer mirror 21a.

[0072] 11, a case where the galvanometer mirror 21a having a hemispherical mirror surface is used as an example, but if the galvanometer mirror 21 has a curved mirror surface whose curvature varies depending on the direction on the mirror surface, not only the beam diameter but also the beam shape of the laser light changes before and after reflection by the galvanometer mirror 21. For this reason, even if a laser light having a circular beam shape is output from the oscillator 10, when it is reflected by the galvanometer mirror 21 having a curved mirror surface whose curvature varies depending on the direction on the mirror surface, the beam shape of the reflected laser light is deformed into an ellipse.

[0073] In such a case, the optical component 70 may correct not only the beam diameter of the laser beam but also the beam shape of the laser beam. In this case, in addition to correcting the beam diameter of the laser beam, the optical component 70 corrects the laser beam 60d reflected by the galvanometer mirror 21 so that the beam shape of the laser beam 60e incident on the collecting lens 30 becomes circular. As a result, the laser beam corrected to an appropriate beam diameter and beam shape is incident on the collecting lens 30, so that the decrease in the focusing ability of the laser beam passing through the collecting lens 30 can be further suppressed.

[0074] As described above, the laser processing machine 1A in this embodiment can suppress a decrease in the focusing ability of the laser light passing through the focusing lens 30 by correcting the beam diameter and beam shape of the laser light using the optical component 70 and directing appropriate laser light into the focusing lens 30, thereby reducing processing defects caused by a decrease in the focusing ability of the laser light.

[0075] Next, a hardware configuration of the control device 50 according to the first and second embodiments will be described. Fig. 12 is a diagram showing an example of a hardware configuration of the control device 50 of the laser processing machine 1, 1A according to the first and second embodiments. Fig. 12 shows a hardware configuration in the case where the functions of the control device 50 are realized by using hardware that executes a program.

[0076] The processor 101 is a CPU (Central Processing Unit). The processor 101 may be a processing device, an arithmetic unit, a microprocessor, a microcomputer, or a DSP (Digital Signal Processor). The memory 102 is a RAM (Random Access Memory), a ROM (Read Only Memory), a flash memory, an EPROM (Erasable Programmable Read Only Memory), or an EEPROM (Electrically Erasable Programmable Read Only Memory).

[0077] The storage device 103 is a hard disk drive (HDD) or a solid state drive (SSD). A program that causes the computer to function as the control device 50 is stored in the storage device 103. The processor 101 reads the program stored in the storage device 103 into the memory 102 and executes it.

[0078] The program may be stored in a storage medium that can be read by the computer system. The control device 50 may store the program recorded in the storage medium in the memory 102. The storage medium may be a portable storage medium such as a flexible disk, or a flash memory which is a semiconductor memory. The program may be installed in the computer system from another computer or a server device via a communication network.

[0079] Each function of the command generating unit 51, the laser control unit 55, the galvanometer control unit 56, and the XY table control unit 57 is realized by a combination of the processor 101 and software. Each function may be realized by a combination of the processor 101 and firmware, or may be realized by a combination of the processor 101, the software, and firmware. The software or firmware is written as a program and stored in the storage device 103.

[0080] The interface circuit 104 transmits signals to the oscillator 10, the galvanometer scanner 20, and the XY table 40, which are devices connected to the hardware.

[0081] The configurations shown in the above embodiments are examples of the contents of the present disclosure. The configurations of each embodiment can be combined with other known technologies. The configurations of each embodiment can be appropriately combined. A part of the configuration of each embodiment can be omitted or modified without departing from the gist of the present disclosure. [Explanation of symbols]

[0082] 1,1A laser processing machine, 10 oscillator, 20 galvanometer scanner, 21,21a galvanometer mirror, 22 drive unit, 22α α-axis direction drive unit, 22β β-axis direction drive unit, 23 plane on which the galvanometer mirror is placed, 30 focusing lens, 40 XY table, 41 placement surface, 50 control device, 51 command generation unit, 52 XY table position command generation unit, 53 galvanometer position command generation unit, 54 laser output command generation unit, 55 laser control unit, 56 galvanometer control unit, 57 XY table control unit, 58 reflection surface position calculation unit, 59 Galvano mirror position calculation unit, 60a, 60b, 60c, 60d, 60e, 61a, 61b, 61c, 62a, 62b, 62c, 63a, 63b, 63c, 64a, 64b, 64c, 65a, 65b, 65c laser light, 70 optical components, 90 workpiece, 101 processor, 102 memory, 103 storage device, 104 interface circuit, h1, h2, h2” normal, h2’ straight line, L1, L2, L3, L4, L5 target irradiation position, M1, M2, M3, M4, M5 reflecting surface, P1, P2 position of the center point of the hemispherical mirror surface of the galvano mirror, P3 position of the end point of vector V1, V1, V2 vector, W1, W2, W3, W4, W5 target scanning position.

Claims

1. An oscillator that outputs a laser beam, a galvanometer mirror having a mirror surface with a dome-shaped curved surface, and a driving unit having a plane on which the galvanometer mirror is placed and translating the galvanometer mirror in a direction parallel to the plane, and being arranged such that the plane is inclined with respect to the output direction of the laser beam output from the oscillator, a galvanometer scanner that reflects the laser beam on the mirror surface, a condenser lens that condenses the laser beam reflected by the mirror surface and irradiates the workpiece with the laser beam, a control device that controls the galvanometer scanner so that the laser beam reflected by the mirror surface enters a target irradiation position on the condenser lens corresponding to a target scanning position on the workpiece, A laser processing machine comprising the above.

2. The driving unit an α-axis direction driving unit that moves the galvanometer mirror in the α-axis direction, which is a direction parallel to the plane, a β-axis direction driving unit that moves the galvanometer mirror in the β-axis direction, which is a direction parallel to the plane and different from the α-axis direction, The laser processing machine according to claim 1, comprising the above.

3. The galvanometer mirror has the mirror surface in a shape obtained by cutting off a part of a spherical surface. The laser processing machine according to claim 1.

4. The control device translates the galvanometer mirror so that the laser beam output from the oscillator enters a reflecting surface having an orientation of a surface of the mirror surface that can be reflected toward the target irradiation position on the condenser lens. The laser processing machine according to any one of claims 1 to 3, characterized by the above.

5. The control device a reflecting surface position calculation unit that calculates the position of the reflecting surface, a galvanometer mirror position calculation unit that calculates the position of the galvanometer mirror at which the laser beam output from the oscillator can enter the position of the reflecting surface calculated by the reflecting surface position calculation unit, and generates a position command for the galvanometer scanner based on the position, a galvanometer control unit that controls the galvanometer scanner based on the position command, The laser processing machine according to claim 4, comprising the above.

6. The reflecting surface position calculation unit Based on the target irradiation position, a target reflection direction, which is a direction for reflecting toward the target irradiation position, is obtained, and the position of the reflecting surface is calculated based on the target reflection direction and the output direction of the laser light output from the oscillator. The laser processing machine according to claim 5, characterized in that.

7. An optical component disposed between the optical paths of the mirror surface and the condenser lens for correcting the laser light reflected by the mirror surface; The laser processing machine according to claim 1, further comprising:

8. The optical component is correcting the laser light reflected by the galvanometer mirror so that the beam diameter of the laser light incident on the condenser lens is the same size as the beam diameter of the laser light output from the oscillator The laser processing machine according to claim 7, characterized in that.

9. The optical component is In addition to correcting the beam diameter of the laser light incident on the condenser lens, the laser light reflected by the galvanometer mirror is corrected so that the beam shape of the laser light incident on the condenser lens becomes circular. The laser processing machine according to claim 8, characterized in that.

10. A mounting table having a flat mounting surface for mounting the workpiece on the mounting surface; further comprising The galvanometer scanner is The laser processing machine according to claim 1, characterized in that it is arranged so that the plane is inclined with respect to the direction perpendicular to the mounting surface.

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