Metal-coated particles and resin materials

Claims

1. Metal-coated particles comprising resin particles containing a polymerizable polymer and a metal coating layer disposed on the surface of the resin particles, The polymerizable component comprises divinylbenzene and a (meth)acrylate compound having four or more (meth)acryloyl groups. The compressive modulus of the aforementioned resin particles when compressed by 20% at 200°C is 1000 N / mm². ２ That's all. Metal-coated particles having a metal coating layer thickness of 0.1 μm or more and less than 1 μm.

2. The metal-coated particles according to claim 1, wherein the total content of the divinylbenzene and the (meth)acrylate compound having four or more (meth)acryloyl groups is 80% by weight or more of the polymerizable component.

3. The metal-coated particles according to claim 1 or 2, wherein the weight ratio of the content of divinylbenzene in the polymerizable component to the content of the (meth)acrylate compound having four or more (meth)acryloyl groups in the polymerizable component is 0.40 or more and 1.70 or less.

4. The metal-coated particles according to claim 1 or 2, wherein the amount of outgassing when the resin particles are heated at 250°C for 10 minutes is 1000 ppm or less.

5. The metal-coated particles according to claim 1 or 2, wherein the particle size of the resin particles is 1 μm or more and 100 μm or less.

6. The metal-coated particles according to claim 5, wherein the particle size of the resin particles is 5 μm or more and 100 μm or less.

7. The metal-coated particles according to claim 6, wherein the particle size of the resin particles is 20 μm or more and 100 μm or less.

8. The metal-coated particle according to claim 1 or 2, wherein the thickness of the metal coating layer is 0.2 μm or more.

9. The metal-coated particle according to claim 1 or 2, wherein the thickness of the metal coating layer is 0.3 μm or less.

10. A resin material comprising metal-coated particles according to claim 1 or 2 and a binder resin, A resin material in which the metal-coated particles are dispersed in the binder resin.

11. The resin material according to claim 10, wherein the resin material is a solder paste containing solder particles.

12. The metal-coated particles according to claim 1 or 2, For use in solder pastes containing solder particles and binder resin.