Laser processing apparatus and laser processing method

Abstract

This laser processing apparatus comprises a laser emission unit, a holding unit, and a control unit. The laser emission unit emits a laser beam in a first direction toward a workpiece. The holding unit is capable of holding a workpiece in a detachable manner in a state of maintaining the orientation of the workpiece, and of moving the workpiece in a direction along the first direction. The control unit controls the operation of the laser emission unit and the holding unit. The laser emission unit has a laser generator, an Fθ lens, and a galvano mirror. The Fθ lens is fixed in an orientation that allows the laser beam to be emitted in the first direction. The control unit alternately performs a laser beam emission step and a movement step for, in a state in which emission of the laser beam toward the workpiece is suspended, moving the holding unit, which is holding the workpiece, in a direction along the first direction.

Description

Laser processing device and laser processing method

[0001] The present disclosure relates to a laser processing apparatus and a laser processing method.

[0002] Japanese Patent Laid-Open Publication No. 2011-98390 (Patent Document 1) discloses a laser processing device having a laser, a redirection device, and a positioning device.

[0003] JP 2011-98390 A

[0004] The laser processing apparatus according to the present disclosure processes a workpiece containing sintered diamond or cubic boron nitride by irradiating the workpiece with laser light, and includes a laser irradiation unit, a gripping unit, and a control unit. The laser irradiation unit irradiates the workpiece with laser light in a first direction. The gripping unit detachably grips the workpiece while maintaining its orientation, and is capable of moving the workpiece in a direction along the first direction. The control unit controls the operation of the laser irradiation unit and the gripping unit. The laser irradiation unit includes a laser generator, an Fθ lens, and a galvanometer mirror. The laser generator is switchable between a state in which it generates laser light and a state in which it stops generating laser light. The Fθ lens is fixed in an orientation that allows it to irradiate the laser light in the first direction. The galvanometer mirror reflects the laser light generated by the laser generator and changes the position at which the laser light enters the F-theta lens, thereby moving the optical axis of the laser light that passes through the F-theta lens and is irradiated in a first direction in a second direction that is perpendicular to the first direction and a third direction that is perpendicular to both the first and second directions. The control unit alternately performs a laser light irradiation step and a moving step of moving the gripping unit that grips the workpiece in a direction along the first direction while stopping irradiation of the laser light on the workpiece. The laser light irradiation step includes a step of irradiating the workpiece with the laser light in the first direction while the workpiece is stationary, or a step of moving the optical axis of the laser light in at least one of the second direction and the third direction while irradiating the workpiece with the laser light in the first direction while the workpiece is stationary.

[0005] FIG. 1 is a schematic perspective view showing the configuration of a laser processing apparatus according to this embodiment. FIG. 2 is a functional block diagram showing the configuration of a laser processing apparatus according to this embodiment. FIG. 3 is a schematic plan view showing the configuration of an Fθ lens. FIG. 4 is a flow chart outlining a laser processing method according to the first embodiment. FIG. 5 is a schematic plan view showing a state in which a workpiece is attached to a gripping member. FIG. 6 is a schematic side view showing a laser light irradiation step in cylindrical R processing. FIG. 7 is a schematic perspective view showing a laser light irradiation step in cylindrical R processing. FIG. 8 is a schematic top view showing a laser light irradiation step in cylindrical R processing. FIG. 9 is a schematic plan view showing the positional relationship between an Fθ lens and a workpiece. FIG. 10 is a schematic side view showing a laser light irradiation step in conical R processing. FIG. 11 is a schematic perspective view showing a laser light irradiation step in conical R processing. FIG. 12 is a schematic top view showing a laser light irradiation step in conical R processing. FIG. 13 is a schematic partial cross-sectional view showing a method of supplying assist gas. Fig. 14 is a schematic side view showing the rough processing step, Fig. 15 is a schematic side view showing the finish processing step, and Fig. 16 is a schematic side view showing the configuration of the blade member after the finish processing step.

[0006] [Problem to be Solved by the Present Disclosure] In the manufacture of tools using sintered diamond as a cutting edge material, grinding using a diamond grinding wheel and electric discharge machining are common. In recent years, significant progress has been made in material development to meet the demand for higher strength workpieces, and the development of materials with low electrical conductivity and high hardness, such as binderless sintered bodies, has progressed. Electric discharge machining cannot be applied to tool machining of such materials. Furthermore, grinding is difficult due to the material's high hardness. As a result, processing heat is generated by the grinding load, which can cause thermal damage and microcracks, potentially reducing tool quality.

[0007] By applying laser processing to these difficult-to-cut materials, no-load processing is possible, and development of processing methods that eliminate processing damage due to processing stress is progressing. In recent years, laser processing technology has advanced at an accelerating pace, and laser processing equipment manufactured by machine tool manufacturers is equipped with oscillators that have high peak power, such as picoseconds and femtoseconds, and are aimed at ablation processing. In addition, in this laser processing equipment, technology is applied to synchronize control of multiple axes (5 or more) to create three-dimensional shapes, making advanced processing possible. However, because advanced technology is used, the unit price of this laser processing equipment is very high.

[0008] Although the use of laser processing equipment for tool machining can achieve processing quality similar to that of grinding, the high capital investment required significantly impacts manufacturing costs, hindering its application in production. Furthermore, conventional tool grinders reduce equipment deformation caused by drive heat and external disturbances by supplying coolant to the machining point during processing. However, laser processing is a dry process that does not use coolant, so the equipment drive shaft is directly affected by these factors. This makes it difficult to drive the equipment drive shaft at high speeds, making high-speed processing impossible with commercially available laser processing equipment.

[0009] An object of the present disclosure is to provide a laser processing apparatus and a laser processing method that are easy to control and capable of high-speed processing. [Effects of the Present Disclosure] According to the present disclosure, it is possible to provide a laser processing apparatus and a laser processing method that are easy to control and capable of high-speed processing. [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure (also referred to as present embodiments) will be listed and described.

[0010] (1) A laser processing apparatus 100 according to the present disclosure processes a workpiece 7 including sintered diamond or cubic boron nitride by irradiating the workpiece 7 with laser light B, and includes a laser irradiation unit 50, a gripping unit 70, and a control unit 60. The laser irradiation unit 50 irradiates the workpiece 7 with laser light B in a first direction A1. The gripping unit 70 detachably grips the workpiece 7 while maintaining the orientation of the workpiece 7, and is capable of moving the workpiece 7 in a direction along the first direction A1. The control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70. The laser irradiation unit 50 includes a laser generator 13, an Fθ lens 30, and a galvanometer mirror 10. The laser generator 13 is capable of switching between a state in which it emits laser light B and a state in which it stops emitting laser light B. The Fθ lens 30 is fixed in a position that allows the laser beam B to be irradiated in a first direction A1. The galvanometer mirror 10 reflects the laser beam B generated by the laser generator 13 and changes the position at which the laser beam B is incident on the Fθ lens 30, thereby moving the optical axis of the laser beam B that passes through the Fθ lens 30 and is irradiated in the first direction A1 in a second direction A2 that is perpendicular to the first direction A1 and a third direction A3 that is perpendicular to both the first direction A1 and the second direction A2. The control unit 60 alternately performs a laser beam irradiation step and a moving step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while stopping the irradiation of the laser beam B on the workpiece 7. The laser light irradiation process includes a process of irradiating the workpiece 7 with laser light B in a first direction A1 while the workpiece 7 is stationary, or a process of irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary while moving the optical axis of the laser light B in at least one of the second direction A2 and the third direction A3.

[0011] According to the laser processing apparatus 100 according to the present disclosure, the laser irradiation unit 50 includes a laser generator 13, an Fθ lens 30, and a galvanometer mirror 10. The laser light B is scanned by the galvanometer mirror 10. Therefore, the laser processing apparatus 100 according to the present disclosure is capable of high-speed processing compared to laser processing apparatuses in which the laser light is fixed while the workpiece is moved.

[0012] Furthermore, according to the laser processing apparatus 100 according to the present disclosure, the control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70. The control unit 60 alternately performs a laser light irradiation step and a movement step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while stopping the irradiation of the laser light B onto the workpiece 7. Therefore, the laser processing apparatus 100 according to the present disclosure is easier to control than a laser processing apparatus that synchronously controls five or more axes.

[0013] (2) According to the laser processing apparatus 100 of (1) above, the maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may be 30 mm or more. This allows for uniform processing over a wide range.

[0014] (3) According to the laser processing apparatus 100 of (1) or (2) above, the wavelength of the laser light B may be 532 nm or more. By using a generally available laser, the cost of the apparatus can be prevented from increasing, and processing costs can be reduced.

[0015] (4) According to the laser processing apparatus 100 of any one of (1) to (3) above, the gripping unit 70 may have a moving mechanism 45 that moves the workpiece 7 between an attachment / detachment position where the gripping unit 70 attaches / detaches the workpiece 7 and a processing position where the workpiece 7 is processed by irradiating it with laser light B. This can reduce the total processing time.

[0016] (5) According to the laser processing apparatus 100 of (1) to (4) above, the gripping unit 70 may be capable of rotating the workpiece 7 around a processing rotation axis, which is an axis parallel to the first direction A1, while gripping the workpiece 7. The control unit 60 may control the operation of the laser irradiation unit 50 and the gripping unit 70 so that, in the laser light irradiation step, one of the following steps is performed: irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary; irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary while moving the optical axis of the laser light B in at least one of the second direction A2 and the third direction A3; or rotating the workpiece 7 around the processing rotation axis while irradiating the workpiece 7 with laser light B in the first direction A1. This allows cylindrical R processing to be performed on the workpiece 7.

[0017] (6) According to the laser processing apparatus 100 of (1) to (4), the gripping unit 70 may be capable of rotating the workpiece 7 around a processing rotation axis that is an axis inclined with respect to the first direction A1 while gripping the workpiece 7. The control unit 60 may control the operation of the laser irradiation unit 50 and the gripping unit 70 so that, in the laser light irradiation step, one of the following steps is performed: irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary; irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary while moving the optical axis of the laser light B in at least one of the second direction A2 and the third direction A3; or rotating the workpiece 7 around the processing rotation axis while irradiating the workpiece 7 with laser light B in the first direction A1. This allows conical R processing to be performed on the workpiece 7.

[0018] (7) According to the laser processing apparatus 100 according to (5) or (6) above, the gripping unit 70 may be capable of changing the distance from the Fθ lens 30 to the processing rotation axis as viewed from the first direction A1.

[0019] (8) According to the laser processing apparatus 100 relating to any of (5) to (7) above, the gripping portion 70 may be capable of tilting the workpiece 7 relative to a virtual plane perpendicular to the first direction A1 by rotating the workpiece 7 around a tilt axis that is an axis perpendicular to the first direction A1 while gripping the workpiece 7.

[0020] (9) The laser processing method according to the present disclosure is a laser processing method for processing a workpiece 7 including sintered diamond or cubic boron nitride by irradiating the workpiece 7 with laser light B, and includes a laser light irradiation step and a moving step of moving a holding portion 70 holding the workpiece 7 in a direction along a first direction A1 while irradiating the workpiece 7 with laser light B stopped. The laser light irradiation step includes a step of irradiating the workpiece 7 with laser light B in a first direction A1 while the workpiece 7 is stationary, or a step of irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary and moving the optical axis of the laser light B in at least one direction of a second direction A2 that is perpendicular to the first direction A1 and a third direction A3 that is perpendicular to both the first direction A1 and the second direction A2, and the laser light irradiation step and a moving step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while the irradiation of the laser light B to the workpiece 7 is stopped are performed alternately. This allows for simple control and high-speed machining.

[0021] (10) According to the laser processing method of (9) above, in the laser light irradiation step, the workpiece 7 may be irradiated with laser light B generated by the laser generator 13, reflected by the galvanometer mirror 10, and passed through the Fθ lens 30. In the moving step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while stopping the irradiation of the laser light B on the workpiece 7, the movement of the workpiece 7 in the direction along the first direction A1 may be performed by moving the gripping unit 70 gripping the workpiece 7 in the direction along the first direction A1, and the movement of the optical axis of the laser light B irradiated in the first direction A1 in the second direction A2 and the third direction A3 may be performed by the galvanometer mirror 10 reflecting the laser light B to change the position at which it is incident on the Fθ lens 30. This allows the laser light B to be scanned at high speed by the galvanometer mirror 10, enabling even higher-speed processing.

[0022] (11) According to the laser processing method of (10) above, the workpiece 7 may have a cutting edge 6. In the laser light irradiation step, when viewed in the irradiation direction of the laser light B, the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may surround the cutting edge 6. This allows the entire cutting edge 6 to be machined without moving the workpiece 7 in a direction perpendicular to the optical axis of the Fθ lens 30.

[0023] (12) According to the laser processing method of (11) above, in the laser light irradiation step, when viewed in the irradiation direction of the laser light B, the area of ​​the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may surround the workpiece 7. This allows the entire workpiece 7 to be processed without moving the workpiece 7 in a direction perpendicular to the optical axis of the Fθ lens 30.

[0024] (13) According to the laser processing method of any one of (9) to (12) above, the wavelength of the laser light B may be 532 nm or more. By using a generally available laser, it is possible to prevent the cost of the device from increasing and reduce processing costs.

[0025] (14) According to any of the laser processing methods (10) to (12) above, during the laser light irradiation process, assist gas G may be supplied to the container 80 while the Fθ lens 30 and the workpiece 7 are each surrounded by the container 80.

[0026] (15) According to the laser processing method of any one of (9) to (14) above, the laser light irradiation step may include a step of performing rough processing on the work-piece 7 using a laser, and a step of performing finish processing on the work-piece 7 using a laser after the rough processing step. The wavelength of the laser used in the rough processing step is longer than the wavelength of the laser used in the finish processing step.

[0027] (16) According to the laser processing method of (15) above, the wavelength of the laser used in the rough processing step may be 1030 nm or more.

[0028] Hereinafter, details of embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0029] <Laser Processing Apparatus> Fig. 1 is a perspective schematic diagram showing the configuration of a laser processing apparatus 100 according to this embodiment. Fig. 2 is a functional block diagram showing the configuration of the laser processing apparatus 100 according to this embodiment. As shown in Figs. 1 and 2, the laser processing apparatus 100 according to this embodiment processes a workpiece 7 by irradiating the workpiece 7 with laser light B, and mainly includes a laser irradiation unit 50, a gripping unit 70, and a control unit 60. The workpiece 7 includes sintered diamond or cubic boron nitride.

[0030] The laser irradiation unit 50 is a part that irradiates the workpiece 7 with laser light B. The laser irradiation unit 50 mainly includes a laser generator 13, an Fθ lens 30, a galvanometer mirror 10, and a galvanometer scanner 20. The laser generator 13 can switch between a state in which it generates laser light B and a state in which it stops generating laser light B. The control unit 60 switches between a state in which it generates laser light B and a state in which it stops generating laser light B.

[0031] The laser generator 13 is, for example, a YAG (yttrium aluminum garnet) laser or a YVO ４ The laser generator 13 generates a laser beam B having a wavelength of, for example, 1064 nm. The wavelength of the laser beam B irradiated onto the workpiece 7 may be converted into a harmonic (for example, a second harmonic) using a harmonic converter (not shown). The wavelength of the laser beam B irradiated onto the workpiece 7 is, for example, 532 nm or longer.

[0032] The galvanometer mirror 10 has a first galvanometer mirror unit 11 and a second galvanometer mirror unit 12. The first galvanometer mirror unit 11 reflects the laser light B irradiated from the laser irradiation unit 50. The second galvanometer mirror unit 12 reflects the laser light B reflected by the first galvanometer mirror unit 11. The second galvanometer mirror unit 12 is disposed at a position facing the first galvanometer mirror unit 11.

[0033] The galvanometer scanner 20 has a first galvanometer scanner unit 21 and a second galvanometer scanner unit 22. The first galvanometer scanner unit 21 drives the first galvanometer mirror unit 11. The orientation of the first galvanometer mirror unit 11 changes with the rotation of the drive shaft of the first galvanometer scanner unit 21. The second galvanometer scanner unit 22 drives the second galvanometer mirror unit 12. The orientation of the second galvanometer mirror unit 12 changes with the rotation of the drive shaft of the second galvanometer scanner unit 22.

[0034] The Fθ lens 30 is disposed below the second galvanometer mirror unit 12. The laser light B reflected by the second galvanometer mirror unit 12 is incident on the Fθ lens 30. The Fθ lens 30 focuses the laser light B reflected by the galvanometer mirror 10. The Fθ lens 30 is fixed in a position that allows the laser light B to be irradiated in the first direction A1. The laser light B that passes through the Fθ lens 30 is irradiated onto the workpiece 7 in the first direction A1.

[0035] The galvanometer mirror 10 reflects the laser beam B generated by the laser generator 13 and changes the position at which the laser beam B enters the Fθ lens 30, thereby moving the optical axis of the laser beam B, which passes through the Fθ lens 30 and is irradiated in the first direction A1, in the second direction A2 and the third direction A3. The second direction A2 is perpendicular to the first direction A1. The third direction A3 is perpendicular to both the first direction A1 and the second direction A2.

[0036] The gripping unit 70 grips the workpiece 7. Specifically, the gripping unit 70 detachably grips the workpiece 7 while maintaining the posture of the workpiece 7. The gripping unit 70 is capable of moving the workpiece 7 in a direction along the first direction A1.

[0037] The control unit 60 controls the operations of the laser irradiation unit 50 and the gripping unit 70. Specifically, the control unit 60 controls the operations of the laser irradiation unit 50 and the gripping unit 70 so that a laser light irradiation step and a step of moving the gripping unit 70 are performed alternately. In the step of moving the gripping unit 70, the gripping unit 70 gripping the workpiece 7 is moved in a direction along the first direction A1 while the irradiation of the laser light B onto the workpiece 7 is stopped.

[0038] The laser light irradiation step includes a step of irradiating the workpiece 7 with laser light B in a first direction A1 while the workpiece 7 is stationary, or a step of irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary and moving the optical axis of the laser light B in at least one of the second direction A2 and the third direction A3. Details of the laser light irradiation step will be described later.

[0039] 2, the gripping unit 70 may have a gripping member 40 and a moving mechanism 45. The gripping member 40 grips the workpiece 7. The moving mechanism 45 moves the workpiece 7 gripped by the gripping member 40 between an attachment / detachment position where the gripping unit 70 attaches / detaches the workpiece 7 and a processing position where the workpiece 7 is irradiated with laser light B to perform processing (see FIG. 5).

[0040] 3 is a plan view schematic diagram showing the configuration of the Fθ lens 30. The Fθ lens 30 has a lens 31 and a holder 32. The holder 32 holds the lens 31. The holder 32 surrounds the lens 31. The maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 is, for example, 30 mm or more. As shown in FIG. 3 , when viewed along the central axis of the Fθ lens 30, the maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 is smaller than the width of the lens 31.

[0041] If the maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser beam B in the first direction A1 is large, the region that can be laser-processed on the workpiece 7 will be large. The maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser beam B in the first direction A1 may be, for example, 40 mm or more, 50 mm or more, or 60 mm or more. The upper limit of the maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser beam B in the first direction A1 is not particularly limited, and may be, for example, 150 mm or less, or 130 mm or less.

[0042] <Laser Processing Method> (First Embodiment) Next, a laser processing method according to the first embodiment will be described. Fig. 4 is a flow chart schematically showing the laser processing method according to the first embodiment. The laser processing method according to the first embodiment is a laser processing method in which the workpiece 7 is processed by irradiating the workpiece 7 with laser light B. As shown in Fig. 4, the laser processing method according to the first embodiment includes a step (S10) of attaching the workpiece 7 to a gripping member 40, a laser light irradiation step (S20), and a movement step (S30).

[0043] FIG. 5 is a schematic plan view showing a state in which the workpiece 7 is attached to the gripping member 40. First, a step (S10) of attaching the workpiece 7 to the gripping member 40 is performed. Specifically, the gripping member 40 is placed at a detachment position where the workpiece 7 is attached or detached. The gripping member 40 has, for example, a first gripping portion 41 and a second gripping portion 42. The second gripping portion 42 is continuous with the first gripping portion 41. The first gripping portion 41 is, for example, substantially cylindrical. The second gripping portion 42 has, for example, a V-shaped groove 43 formed in a plan view. A cutting insert, which is the workpiece 7, is placed in the V-shaped groove 43.

[0044] The cutting insert, which is the workpiece 7, has a blade member 4 and a base 5. The blade member 4 is attached to the base 5. The blade member 4 is a part involved in cutting. The shape of the base 5 in a plan view is not particularly limited, but may be, for example, a rhombus. The blade member 4 is joined to the corners of the base 5. The base 5 is made of, for example, cemented carbide or cermet. The cutting insert according to this embodiment is formed by joining the blade members 4 to the corners of the base 5, but the entire cutting insert may be formed of the blade members 4.

[0045] The blade member 4 as the workpiece 7 contains sintered diamond or cBN (cubic boron nitride). The blade member 4 may contain, for example, 50 volume % or more of sintered diamond. The blade member 4 may contain, for example, 50 volume % of cBN.

[0046] Next, the workpiece 7 is moved to a processing position where the workpiece 7 is irradiated with the laser light B to perform processing. The gripping member 40 gripping the workpiece 7 is moved to the processing position by the moving mechanism 45. Specifically, the workpiece 7 is positioned below the Fθ lens 30 of the laser irradiation unit 50 by the moving mechanism 45.

[0047] Next, a laser light irradiation step (S20) is carried out. FIG. 6 is a side schematic diagram showing the laser light irradiation step in cylindrical R machining. As shown in FIG. 6, in the laser light irradiation step, the workpiece 7 is irradiated with laser light B while the workpiece 7 is stationary. The irradiation direction of the laser light B is a first direction A1. The control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70 so that the laser light B is irradiated onto the workpiece 7 in the first direction A1 while the workpiece 7 is stationary.

[0048] Specifically, laser light B is generated by the laser generator 13 and reflected by the galvanometer mirror 10. Specifically, laser light B reflected by the second galvanometer mirror unit 12 is incident on the Fθ lens 30 (see FIG. 1). The Fθ lens 30 focuses the laser light B reflected by the galvanometer mirror 10. The laser light B passes through the Fθ lens 30 and is irradiated onto the workpiece 7. The wavelength of the laser light B is, for example, 532 nm or more. The output of the laser light B is, for example, 2 W or more.

[0049] FIG. 7 is a perspective schematic diagram showing the laser beam irradiation process in cylindrical R machining. In the laser beam irradiation process, the workpiece 7 is stationary, and the laser beam B is irradiated in a first direction A1 while the optical axis of the laser beam B is moved in at least one of a second direction A2 and a third direction A3. The second direction A2 is perpendicular to the first direction A1. The third direction A3 is perpendicular to both the first direction A1 and the second direction A2. The scanning speed of the laser beam B is, for example, 300 mm / sec or more and 1000 mm / sec or less. Increasing the scanning speed of the laser beam B can reduce the time the laser beam B remains at the same position. This improves the quality of the machined surface.

[0050] The control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70 so as to irradiate the workpiece 7 with the laser beam B in the first direction A1 while the workpiece 7 is stationary, and to move the optical axis of the laser beam B in at least one of the second direction A2 and the third direction A3. The movement of the optical axis of the laser beam B in the second direction A2 and the third direction A3 is performed, for example, by the galvanometer mirror 10 reflecting the laser beam B to change the position at which the laser beam enters the Fθ lens 30.

[0051] Fig. 8 is a schematic top view showing the laser light irradiation step in cylindrical R machining. As shown in Fig. 8, the workpiece 7 has a first arc-shaped portion 1 and a second arc-shaped portion 2. The first arc-shaped portion 1 is formed by a blade member 4. The first arc-shaped portion 1 is formed along a first imaginary circle C1. The second arc-shaped portion 2 is formed by a base 5. The second arc-shaped portion 2 is formed along a second imaginary circle C2. The radius of the first imaginary circle C1 (first radius R1) is substantially the same as the radius of the second imaginary circle C2 (second radius R2).

[0052] Next, a moving step (S30) is performed. In the moving step (S30), while irradiating the workpiece 7 with the laser light B is stopped, the gripping unit 70 gripping the workpiece 7 is moved in a direction along the first direction A1. The direction along the first direction A1 may be the same direction as the first direction A1 or the opposite direction to the first direction A1 (fourth direction A4). The movement of the workpiece 7 in the direction along the first direction A1 is performed by moving the gripping unit 70 gripping the workpiece 7 in the direction along the first direction A1. Specifically, the gripping unit 70 gripping the workpiece 7 moves in a direction approaching the Fθ lens 30 (fourth direction A4) so ​​that the focal position of the laser light B is at the processing position of the workpiece 7. As a result, the processing position of the workpiece 7 moves in the fourth direction A4 along the first direction A1.

[0053] The laser light irradiation step (S20) and the movement step (S30) are performed alternately. Specifically, after laser processing is performed on a portion of the workpiece 7, irradiation of the laser light B is stopped. With irradiation of the laser light B on the workpiece 7 stopped, the workpiece 7 is moved in a direction along the first direction A1. Next, irradiation of the laser processing is resumed, and laser processing is performed on a portion of the workpiece 7. As described above, the workpiece 7 is intermittently processed from the top end to the bottom end.

[0054] As shown in FIG. 6 , the gripping unit 70 may be capable of rotating the workpiece 7 around a processing rotation axis (first rotation axis D1) while gripping the workpiece 7. The first rotation axis D1 is an axis parallel to the first direction A1. In a direction perpendicular to the first direction A1, the distance between the laser beam B and the first rotation axis D1 corresponds to a first radius R1. In the laser beam irradiation step (S20), the control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70 so that the workpiece 7 rotates around the processing rotation axis while irradiating the laser beam B to the workpiece 7 in the first direction A1. This forms a first arc portion 1 along a first virtual circle C1 and a second arc portion 2 along a second virtual circle C2 (see FIG. 7 ). The first arc portion 1 constitutes a corner R cutting edge.

[0055] The operation of the gripping unit 70 to rotate the workpiece 7 around the processing rotation axis may be performed not only when processing the first arc portion 1, but also when transitioning from processing the linear cutting edge 6 to processing another adjacent cutting edge 6. The operation of the gripping unit 70 to rotate the workpiece 7 around the processing rotation axis may be performed during a transition period between the laser light irradiation step (S20) and the movement step (S30), or in a preparation step that precedes the processing step in which the laser light irradiation step (S20) and the movement step (S30) are performed alternately.

[0056] The gripping unit 70 may be capable of changing the distance from the Fθ lens 30 to the processing rotation axis as viewed from the first direction A1. The moving mechanism 45 may be capable of moving the gripping unit 70 along a direction perpendicular to the first direction A1.

[0057] The gripping unit 70 may be capable of rotating the workpiece 7 around an inclination axis that is an axis perpendicular to the first direction A1 while gripping the workpiece 7, thereby tilting the workpiece 7 with respect to an imaginary plane perpendicular to the first direction A1. The moving mechanism 45 may be capable of rotating the gripping unit 70 around the inclination axis that is an axis perpendicular to the first direction A1.

[0058] FIG. 9 is a plan view schematic diagram showing the positional relationship between the Fθ lens 30 and the workpiece 7. As shown in FIG. 9, in the laser light irradiation step (S20), when viewed in the irradiation direction of the laser light B, the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may surround the cutting edge 6 of the workpiece 7. The maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 is, for example, 30 mm or more. When viewed in the irradiation direction of the laser light B, the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may surround the workpiece 7. Note that when viewed in the irradiation direction of the laser light B, the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 surrounds the entire cutting edge 6 of the workpiece 7, but does not necessarily surround the entire workpiece 7.

[0059] Although the above description has been given with reference to the case where the gripping unit 70 includes the moving mechanism 45, the present disclosure is not limited to this. The gripping unit 70 may not include the moving mechanism 45. The workpiece 7 may be manually positioned at the processing position where the laser light B is irradiated onto the workpiece 7 to perform processing, without using the moving mechanism 45. Specifically, an operator may attach the workpiece 7 to the gripping member 40 at the attachment / detachment position and then manually position the workpiece 7 below the Fθ lens 30. The attitude of the workpiece 7 may be manually adjusted by the operator. (Second Embodiment) Next, a laser processing method according to a second embodiment will be described. The laser processing method according to the second embodiment differs from the laser processing method according to the first embodiment mainly in that the processing rotation axis is inclined with respect to the first direction A1. In other respects, the laser processing method according to the second embodiment is substantially the same as the laser processing method according to the first embodiment. The following description will focus on the differences from the laser processing method according to the first embodiment.

[0060] 10 is a schematic side view illustrating the laser light irradiation step in cone R machining. As shown in FIG. 10, the gripping unit 70 is capable of rotating the workpiece 7 around a processing rotation axis (second rotation axis D2) while gripping the workpiece 7. The second rotation axis D2 is inclined with respect to the first direction A1. In the laser light irradiation step (S20), the control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70 so that the workpiece 7 rotates around the second rotation axis D2 while irradiating the workpiece 7 with laser light B in the first direction A1.

[0061] 11 is a perspective schematic diagram showing a laser beam irradiation step in cone R machining. In the laser beam irradiation step, while the workpiece 7 remains stationary, the laser beam B is irradiated onto the workpiece 7 in a first direction A1 while the optical axis of the laser beam B is moved in at least one of the second direction A2 and the third direction A3. The control unit 60 controls the operations of the laser irradiation unit 50 and the gripping unit 70 so that while the workpiece 7 remains stationary, the laser beam B is irradiated onto the workpiece 7 in the first direction A1 while the optical axis of the laser beam B is moved in at least one of the second direction A2 and the third direction A3.

[0062] Fig. 12 is a schematic top view illustrating the laser light irradiation step in cone R machining. As shown in Fig. 12, the workpiece 7 has a first arc-shaped portion 1 and a second arc-shaped portion 2. The first arc-shaped portion 1 is formed by a blade member 4. The first arc-shaped portion 1 is formed along a first imaginary circle C1. The second arc-shaped portion 2 is formed by a base 5. The second arc-shaped portion 2 is formed along a second imaginary circle C2. The radius of the first imaginary circle C1 (first radius R1) is larger than the radius of the second imaginary circle C2 (second radius R2).

[0063] 10 to 12 , in the laser light irradiation step (S20), the control unit 60 controls the operations of the laser irradiation unit 50 and the gripping unit 70 so as to rotate the workpiece 7 around the second rotation axis D2 while irradiating the workpiece 7 with laser light B in the first direction A1. This forms a first arc portion 1 along the first virtual circle C1 and a second arc portion 2 along the second virtual circle C2 (see FIG. 11 ).

[0064] As shown in FIG. 10 , the second rotation axis D2 is inclined with respect to the first direction A1 so that the distance from the laser beam B in the direction perpendicular to the first direction A1 increases with increasing distance from the Fθ lens 30. At the uppermost processing position of the workpiece 7, the distance from the laser beam B to the second rotation axis D2 in the direction perpendicular to the first direction A1 corresponds to the second radius R2. At the lowermost processing position of the workpiece 7, the distance from the laser beam B to the second rotation axis D2 in the direction perpendicular to the first direction A1 corresponds to the first radius R1. (Third Embodiment) Next, a laser processing method according to the third embodiment will be described. The laser processing method according to the third embodiment differs from the laser processing methods according to the first and second embodiments mainly in that an assist gas is supplied. In other respects, the laser processing method according to the third embodiment is substantially the same as the laser processing methods according to the first and second embodiments. Below, the differences from the laser processing methods according to the first and second embodiments will be mainly described.

[0065] Fig. 13 is a partial cross-sectional schematic diagram showing a method for supplying an assist gas. As shown in Fig. 13, the laser processing apparatus 100 has an Fθ lens 30, a gripping unit 70, and a container 80. The workpiece 7 is gripped by the gripping unit 70. The gripping unit 70 is movable in an upward and downward direction. The upward and downward directions are parallel to the first direction A1.

[0066] The container 80 has, for example, a first connecting member 81, a second connecting member 82, and a main body member 83. The main body member 83 is, for example, cylindrical. The main body member 83 surrounds each of the Fθ lens 30 and the workpiece 7. The main body member 83 is attached to the gripping portion 70 by the first connecting member 81. The main body member 83 is attached to the Fθ lens 30 by the second connecting member 82. A sealed space may be formed by the container 80, the Fθ lens 30, and the gripping portion 70.

[0067] The container 80 is provided with an assist gas supply hole 91. The assist gas G is supplied into the container 80 through the assist gas supply hole 91. The assist gas G is, for example, nitrogen gas. The assist gas G suppresses oxidation of the processed surface, for example. The container 80 may be provided with an assist gas exhaust hole 92. The assist gas G is exhausted to the outside of the container 80 through the assist gas exhaust hole 92. A gap 84 may be provided between the container 80 and the Fθ lens 30. The assist gas G may be exhausted to the outside of the container 80 through the gap 84. The container 80 may be provided with only either the assist gas exhaust hole 92 or the gap 84, or may be provided with both the assist gas exhaust hole 92 and the gap 84.

[0068] 13 , in the laser light irradiation step, the Fθ lens 30 and the workpiece 7 are each surrounded by a container 80, and an assist gas G is supplied into the container 80. The inside of the container 80 is filled with the assist gas G. The assist gas G may be supplied in a direction substantially perpendicular to the irradiation direction of the laser light B.

[0069] The container 80 and the workpiece 7 may move integrally. For example, the container 80 and the workpiece 7 may move integrally by moving the gripper 70 upward and downward. In this case, the container 80 may be spaced apart from the Fθ lens 30. As another aspect, the workpiece 7 may move upward and downward inside the container 80 while maintaining the same relative position with respect to the Fθ lens 30. (Fourth Embodiment) Next, a laser processing method according to a fourth embodiment will be described. The laser processing method according to the fourth embodiment differs from the laser processing methods according to the first to third embodiments mainly in that the laser processing is performed separately into rough processing and finish processing. In other respects, the laser processing method according to the fourth embodiment is substantially the same as the laser processing methods according to the first to third embodiments. The following description will focus on the differences from the laser processing methods according to the first to third embodiments.

[0070] According to the laser processing method of the fourth embodiment, the laser light irradiation step includes a rough processing step and a finish processing step. FIG. 14 is a side schematic view showing the rough processing step. As shown in FIG. 14, the blade member 4 is made of, for example, polycrystalline diamond (PCD). The blade member 4 includes a first region 71, a second region 72, and a third region 73. The first region 71 is continuous with the second region 72. The second region 72 is continuous with the third region 73. The second region 72 is located between the first region 71 and the third region 73.

[0071] In the rough processing step, a laser is used to perform rough processing on the workpiece. A fiber laser, for example, can be used for rough processing. Specifically, laser light B is irradiated onto the first region 71 of the blade member 4. The laser light B is a fiber laser. The first region 71 of the blade member 4 is removed using the fiber laser. In the rough processing step, a thermally altered layer is formed in the second region 72. The thermally altered layer is made of graphite, which has low thermal conductivity. The wavelength of the laser used in the rough processing step is longer than the wavelength of the laser used in the finish processing step. The wavelength of the laser used in the rough processing step is, for example, 1030 nm or longer.

[0072] Next, a finishing process is performed. Fig. 15 is a side view showing the finishing process. As shown in Fig. 15, in the finishing process, a laser is used to finish the workpiece. A green laser, for example, can be used for finishing. Specifically, laser light B is irradiated onto the second region 72 of the blade member 4. The laser light B is a green laser. The second region 72 of the blade member 4 is removed using the green laser.

[0073] Figure 16 is a side view schematic diagram showing the configuration of the blade member after the finishing process. As shown in Figure 16, in the finishing process, a thermally altered layer 74 is formed in a part of the third region 73. As described above, the second region 72 is made of graphite, which has low thermal conductivity. Therefore, in the finishing process, heat conduction from the second region 72 to the third region 73 is suppressed. As a result, the thickness of the thermally altered layer 74 formed in the finishing process is reduced.

[0074] Next, the effects of the laser processing apparatus 100 and the laser processing method according to the present disclosure will be described.

[0075] According to the laser processing apparatus 100 according to the present disclosure, the laser irradiation unit 50 includes a laser generator 13, an Fθ lens 30, and a galvanometer mirror 10. The laser light B is scanned by the galvanometer mirror 10. Therefore, the laser processing apparatus 100 according to the present disclosure is capable of high-speed processing compared to laser processing apparatuses in which the laser light is fixed while the workpiece is moved.

[0076] Furthermore, according to the laser processing apparatus 100 according to the present disclosure, the control unit 60 controls the operation of the laser irradiation unit 50 and the gripping unit 70. The control unit 60 alternately performs a laser light irradiation step and a movement step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while stopping the irradiation of the laser light B onto the workpiece 7. Therefore, the laser processing apparatus 100 according to the present disclosure is easier to control than a laser processing apparatus that synchronously controls five or more axes.

[0077] According to the laser processing apparatus 100 of the present disclosure, the maximum width W of the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may be 30 mm or more. This allows for uniform processing over a wide range.

[0078] According to the laser processing apparatus 100 of the present disclosure, the wavelength of the laser light B may be 532 nm or more. By using a generally available laser, it is possible to prevent the cost of the apparatus from increasing and reduce processing costs.

[0079] According to the laser processing apparatus 100 of the present disclosure, the gripping unit 70 may have a moving mechanism 45 that moves the workpiece 7 between an attachment / detachment position where the gripping unit 70 attaches / detaches the workpiece 7 and a processing position where the workpiece 7 is processed by irradiating it with laser light B. This can reduce the total processing time.

[0080] According to the laser processing apparatus 100 of the present disclosure, the gripping unit 70 may be capable of rotating the workpiece 7 around a processing rotation axis, which is an axis parallel to the first direction A1, while gripping the workpiece 7. The control unit 60 may control the operation of the laser irradiation unit 50 and the gripping unit 70 so that, in the laser light irradiation step, one of the following steps is performed: irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary; irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary while moving the optical axis of the laser light B in at least one of the second direction A2 and the third direction A3; or rotating the workpiece 7 around the processing rotation axis while irradiating the workpiece 7 with laser light B in the first direction A1. This allows cylindrical R processing to be performed on the workpiece 7.

[0081] According to the laser processing apparatus 100 of the present disclosure, the gripping unit 70 may be capable of rotating the workpiece 7 around a processing rotation axis, which is an axis inclined with respect to the first direction A1, while gripping the workpiece 7. The control unit 60 may control the operation of the laser irradiation unit 50 and the gripping unit 70 so that, in the laser light irradiation step, one of the following steps is performed: irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary; irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary while moving the optical axis of the laser light B in at least one of the second direction A2 and the third direction A3; or rotating the workpiece 7 around the processing rotation axis while irradiating the workpiece 7 with laser light B in the first direction A1. This allows conical R processing to be performed on the workpiece 7.

[0082] The laser processing method according to the present disclosure includes a laser light irradiation step and a moving step of moving a gripping unit 70 gripping the workpiece 7 in a direction along a first direction A1 while irradiation of the laser light B onto the workpiece 7 is stopped. The laser light irradiation step includes a step of irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary, or a step of irradiating the workpiece 7 with laser light B in the first direction A1 while the workpiece 7 is stationary while moving the optical axis of the laser light B in at least one direction selected from a second direction A2 perpendicular to the first direction A1 and a third direction A3 perpendicular to both the first direction A1 and the second direction A2. The laser light irradiation step and the moving step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while irradiation of the laser light B onto the workpiece 7 is stopped are alternately performed. This allows for simple control and high-speed processing.

[0083] According to the laser processing method disclosed herein, in the laser light irradiation step, the workpiece 7 may be irradiated with laser light B generated by the laser generator 13, reflected by the galvanometer mirror 10, and passed through the Fθ lens 30. In the moving step of moving the gripping unit 70 gripping the workpiece 7 in a direction along the first direction A1 while stopping the irradiation of the laser light B on the workpiece 7, the movement of the workpiece 7 in the direction along the first direction A1 may be performed by moving the gripping unit 70 gripping the workpiece 7 in the direction along the first direction A1, and the movement of the optical axis of the laser light B irradiated in the first direction A1 in the second direction A2 and the third direction A3 may be performed by the galvanometer mirror 10 reflecting the laser light B to change the position at which it is incident on the Fθ lens 30. This allows the laser light B to be scanned at high speed by the galvanometer mirror 10, enabling even higher-speed processing.

[0084] According to the laser processing method of the present disclosure, the workpiece 7 may have a cutting edge 6. In the laser light irradiation step, when viewed in the irradiation direction of the laser light B, the region of the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1 may surround the cutting edge 6. This allows the entire cutting edge 6 to be machined without moving the workpiece 7 in a direction perpendicular to the optical axis of the Fθ lens 30.

[0085] According to the laser processing method of the present disclosure, in the laser light irradiation step, the area of ​​the Fθ lens 30 that can be irradiated with the laser light B in the first direction A1, as viewed in the irradiation direction of the laser light B, may surround the workpiece 7. This allows the entire workpiece 7 to be processed without moving the workpiece 7 in a direction perpendicular to the optical axis of the Fθ lens 30.

[0086] According to the laser processing method according to the present disclosure, the wavelength of the laser light B may be 532 nm or more. By using a generally available laser, it is possible to prevent the cost of the device from increasing and reduce processing costs.

[0087] In the laser light irradiation step, the workpiece 7 is tilted in accordance with the clearance angle, so it is necessary to increase the distance between the Fθ lens 30 and the workpiece 7 to avoid interference with the gripper 70. Therefore, when the assist gas G is supplied to the workpiece 7, the supply nozzle for the assist gas G is positioned at a distance from the workpiece 7. In this case, it is necessary to supply the assist gas G at high pressure to the workpiece 7. However, increasing the pressure of the assist gas G distorts the laser light B, which may deteriorate the processing quality of the workpiece 7.

[0088] According to the laser processing method of the present disclosure, in the laser light irradiation step, the Fθ lens 30 and the workpiece 7 may each be surrounded by a container 80, and the assist gas G may be supplied to the container 80. This allows the container 80 to be filled with the assist gas G. In this case, since it is not necessary to supply the assist gas G at high pressure, distortion of the laser light B can be suppressed. As a result, deterioration of the processing quality of the workpiece 7 can be suppressed. Furthermore, by using nitrogen gas as the assist gas G, oxidation of the processing surface can be suppressed and the formation of a thermally altered layer can be suppressed. Furthermore, by using the container 80, the amount of assist gas G used can be reduced and exposure to the assist gas G can be suppressed.

[0089] According to the laser processing method of the present disclosure, the laser light irradiation step may include a step of performing rough processing on the workpiece 7 using a laser and a step of performing finish processing on the workpiece 7 using a laser. The wavelength of the laser used in the rough processing step is longer than the wavelength of the laser used in the finish processing step. After the rough processing step, the surface layer of the workpiece 7 is transformed into graphite, which has low thermal conductivity. This suppresses heat conduction in the finish processing step. As a result, the thickness of the thermally altered layer after the finish processing step is reduced.

[0090] The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The scope of the present invention is defined by the claims, not by the above-described embodiments, and is intended to include meanings equivalent to the claims and all modifications within the scope of the claims.

[0091] REFERENCE SIGNS LIST 1 First arc portion, 2 Second arc portion, 4 Blade member, 5 Base, 6 Cutting edge, 7 Workpiece, 10 Galvanometer mirror, 11 First galvanometer mirror portion, 12 Second galvanometer mirror portion, 13 Laser generator, 20 Galvanometer scanner, 21 First galvanometer scanner portion, 22 Second galvanometer scanner portion, 30 Fθ lens, 31 Lens, 32 Holder, 40 Grip member, 41 First gripping portion, 42 Second gripping portion, 43 Groove, 45 Moving mechanism, 50 Laser irradiation portion, 60 Control portion, 70 Grip portion, 71 First region, 72 Second region, 73 Third region, 74 Thermally altered layer, 80 Container, 81 First connecting member, 82 Second connecting member, 83 Main body member, 84 Gap, 91 Assist gas supply hole, 92 Assist gas discharge hole, 100 Laser processing device, A1 first direction, A2 second direction, A3 third direction, A4 fourth direction, B laser light, C1 first virtual circle, C2 second virtual circle, D1 first rotation axis, D2 second rotation axis, G assist gas, R1 first radius, R2 second radius, W maximum width

Claims

1. A laser processing apparatus for processing a workpiece containing sintered diamond or cubic boron nitride by irradiating the workpiece with laser light, A laser irradiation unit that irradiates the workpiece with the laser light in a first direction, A gripping portion that detachably grips the workpiece while maintaining its orientation, and that can move the workpiece in a direction along the first direction, The system comprises a control unit that controls the operation of the laser irradiation unit and the gripping unit, The laser irradiation unit is A laser generator capable of switching between a state in which the laser light is being generated and a state in which the generation of the laser light is stopped, An Fθ lens fixed in a position that allows the laser light to be irradiated in the first direction, The device includes a galvanometer mirror capable of shifting the optical axis of the laser beam that passes through the Fθ lens and is irradiated in the first direction to a second direction perpendicular to the first direction and a third direction perpendicular to both the first and second directions, by reflecting the laser beam generated by the laser generator and changing the position at which it enters the Fθ lens. The control unit alternately performs a laser beam irradiation step and a moving step in which, with the irradiation of the laser beam onto the workpiece stopped, moves the gripping part that is gripping the workpiece in a direction along the first direction. The laser beam irradiation step includes a step of irradiating the workpiece with the laser beam in the first direction while the workpiece is stationary, or a step of moving the optical axis of the laser beam in at least one of the second and third directions while irradiating the workpiece with the laser beam in the first direction while the workpiece is stationary. A laser processing apparatus further comprising a container that surrounds the Fθ lens and the workpiece, and to which an assist gas is supplied.

2. The laser processing apparatus according to claim 1, wherein the maximum width of the region of the Fθ lens capable of irradiating the laser light in the first direction is 30 mm or more.

3. The laser processing apparatus according to claim 1 or claim 2, wherein the wavelength of the laser light is 532 nm or more.

4. The laser processing apparatus according to claim 1 or 2, wherein the gripping portion has a moving mechanism for moving the workpiece between a detachment position, which is the position in which the gripping portion attaches and detaches the workpiece, and a processing position, which is the position in which the laser beam is irradiated onto the workpiece to perform processing.

5. The gripping portion is capable of rotating the workpiece around a machining rotation axis which is an axis parallel to the first direction while gripping the workpiece. The control unit, The laser processing apparatus according to claim 1 or 2, wherein the operation of the laser irradiation unit and the gripping unit is controlled so that in the laser irradiation step, one of the following steps is performed: irradiating the workpiece with the laser beam in a first direction while the workpiece is stationary; moving the optical axis of the laser beam in at least one of the second and third directions while irradiating the workpiece with the laser beam in a first direction while the workpiece is stationary; or rotating the workpiece around the processing rotation axis while irradiating the workpiece with the laser beam in a first direction.

6. The gripping portion is capable of rotating the workpiece around a machining rotation axis, which is an axis inclined with respect to the first direction, while gripping the workpiece. The control unit, In the laser beam irradiation step, the process involves irradiating the workpiece with the laser beam in a first direction while the workpiece is stationary, moving the optical axis of the laser beam in at least one of the second and third directions while irradiating the workpiece with the laser beam in a first direction while the workpiece is stationary, or rotating the workpiece around the machining rotation axis while irradiating the workpiece with the laser beam in a first direction. A laser processing apparatus according to claim 1 or claim 2, wherein the operation of the laser irradiation unit and the gripping unit is controlled so that the process is carried out.

7. The laser processing apparatus according to claim 5, wherein the gripping portion is capable of changing the distance from the Fθ lens to the processing rotation axis as viewed from the first direction.

8. The gripping portion is, The laser processing apparatus according to claim 5, wherein the workpiece is held in place and rotated around an inclination axis which is an axis perpendicular to the first direction, thereby making it possible to incline the workpiece with respect to a virtual plane perpendicular to the first direction.

9. A laser processing method for processing a workpiece containing sintered diamond or cubic boron nitride by irradiating the workpiece with laser light, Laser light irradiation process, The process includes a movement step of moving the gripping portion that is gripping the workpiece in a direction along the first direction while the irradiation of the laser beam to the workpiece is stopped, The laser beam irradiation step includes a step of irradiating the workpiece with laser beam in a first direction while the workpiece is stationary, or a step of moving the optical axis of the laser beam in at least one of a second direction perpendicular to the first direction and a third direction perpendicular to both the first and second directions while irradiating the workpiece with laser beam in a first direction while the workpiece is stationary. The laser beam irradiation step and the moving step, in which the gripping portion holding the workpiece is moved in a direction along the first direction while the irradiation of the laser beam to the workpiece is stopped, are performed alternately. In the laser beam irradiation step, a laser generator generates laser light, which is reflected by a galvanometer mirror and passes through an Fθ lens, and then irradiates the workpiece with the laser beam. With the irradiation of the workpiece with the laser beam stopped, in the moving step of moving the gripping part that grips the workpiece in a direction along the first direction, the movement of the workpiece in the direction along the first direction is performed by the gripping part that grips the workpiece moving in a direction along the first direction, and the movement of the optical axis of the laser beam irradiated in the first direction in the second and third directions is performed by the galvanometer mirror changing the position in which the laser beam is reflected and incident on the Fθ lens. A laser processing method in which, during the laser light irradiation step, the Fθ lens and the workpiece are each surrounded by a container, and an assist gas is supplied to the container.

10. The workpiece has a cutting edge, The laser processing method according to claim 9, wherein, in the laser beam irradiation step, the region of the Fθ lens capable of irradiating the laser beam in the first direction, when viewed in the direction of irradiation of the laser beam, surrounds the cutting edge.

11. The laser processing method according to claim 10, wherein, in the laser beam irradiation step, the region of the Fθ lens capable of irradiating the laser beam in the first direction, when viewed in the direction of irradiation of the laser beam, surrounds the workpiece.

12. The laser processing method according to any one of claims 9 to 11, wherein the wavelength of the laser light is 532 nm or more.

13. The laser light irradiation step is, A step of rough machining the workpiece using a laser, The process includes, after the rough machining step, a finishing step of using a laser to finish the workpiece, The laser processing method according to any one of claims 9 to 11, wherein the wavelength of the laser used in the rough processing step is longer than the wavelength of the laser used in the finishing processing step.

14. The laser processing method according to claim 13, wherein the wavelength of the laser used in the process of rough processing is 1030 nm or more.